WO2019104461A1 - Workpiece hole imaging detection system - Google Patents

Abstract

A workpiece hole imaging detection system, comprising: a light source module (11) for illuminating a workpiece hole; a first imaging module (12) for focusing and imaging the illuminated hole; a second imaging module (13) for imaging and focusing the imaging light of said hole; and an image acquisition module (14) for acquiring the imaging light from the second imaging module (13). Said system can detect the workpiece hole more intuitively and accurately, enabling simple operation, accurate and efficient detection, wide adaptability and easy automation.

Description

Workpiece hole imaging test system [Technical Field]

The present application relates to the field of optical automatic detection, and in particular to a workpiece hole imaging detection system.

【Background technique】

All aspects of human life are inseparable from electronic products. Printed Circuit Board (PCB) is the carrier and support for electronic components. The quality of its products determines the reliability and stability of electronic components. How to accurately quantify the quality of PCB products has become an urgent problem for the current technology. Although the detection technology of PCB printed board missing parts and solder joint defects has matured, the accurate detection of PCB through-hole and blind-hole copper plating has become a bottleneck in current technology development.

In order to detect the copper plating of PCB through holes, the four-wire test method is commonly used in the industry. The method can detect the conductivity of the via hole, thereby judging the uniformity of copper plating. However, the four-wire test method is complicated in operation, and the specific shape of the through hole cannot be obtained, and only the copper deficiency and copper breakage can be detected in the detection process, and the detection rate is very low.

[Summary of the Invention]

The application provides a workpiece hole imaging detection system, which can more accurately and accurately detect the copper plating of the workpiece hole position, and has the advantages of simple operation, accurate and high detection, wide adaptability and easy automation.

A technical solution adopted by the present application is to provide a workpiece hole imaging detection system, the system comprising: a light source module for illuminating the workpiece hole position; and a first imaging module for using the hole position The reflected illumination light is subjected to in-focus imaging; the second imaging module is configured to perform imaging focusing on the imaging light of the hole position; and the image acquisition module is configured to collect the imaging light from the second imaging module.

The utility model has the beneficial effects of providing a workpiece hole imaging detection system, which can be more intuitively and accurately detected by using the first imaging module to perform focusing imaging on the illuminated hole position and combining the image acquisition module for analysis and processing. In the case of the hole position of the workpiece, the operation is simple, the detection is accurate and efficient, the scope of adaptation is wide, and automation is easy.

[Description of the Drawings]

1 is a schematic structural view of a first embodiment of a workpiece hole imaging detection system of the present application;

2 is a schematic structural view of a second embodiment of a workpiece hole imaging detection system of the present application;

3 is a schematic structural view of a third embodiment of a workpiece hole imaging detection system of the present application;

4 is a schematic structural view of a fourth embodiment of a workpiece hole imaging detecting system of the present application;

5 is a schematic structural view of a fifth embodiment of a workpiece hole imaging detection system of the present application;

6 is a schematic structural view of a sixth embodiment of a workpiece hole imaging detection system of the present application;

7 is a schematic structural view of a seventh embodiment of a workpiece hole imaging detection system of the present application;

8 is a schematic structural view of an eighth embodiment of a workpiece hole imaging detecting system of the present application;

9 is a schematic structural view of a ninth embodiment of a workpiece hole imaging detection system of the present application;

FIG. 10 is a schematic structural view of a tenth embodiment of a workpiece hole imaging detecting system of the present application.

【Detailed ways】

The technical solutions in the embodiments of the present application are clearly and completely described in the following with reference to the drawings in the embodiments of the present application. It is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without departing from the inventive scope are the scope of the present application.

The workpiece mentioned in the present application may be, but not limited to, a printed circuit board, a display panel, a display screen, a semiconductor circuit chip, etc., and the hole position in the present application may be a minute through hole or a blind hole existing in the workpiece. The hole position imaging detection system in the present application can realize accurate imaging and quality inspection of workpiece hole defects of millimeter and sub-millimeter diameter, and can also perform imaging detection on the workpiece hole surface and its accessories (copper ring, green paint). Specifically, the size of the hole position can be detected to determine whether it is within a fixed aperture range and the copper plating size of the hole position is detected, or the copper ring and the green paint of the hole position can be imaged and detected, and corresponding features are extracted. To determine if it is defective.

Referring to FIG. 1 , FIG. 1 is a schematic structural diagram of a first embodiment of a workpiece hole imaging detection system according to the present application. As shown in FIG. 1 , the workpiece hole imaging detection system 10 of the present application includes a light source module 11 , a first imaging module 12 , and a first embodiment. The second imaging module 13, the image acquisition module 14, and the microscopic module 15.

The light source module 11 emits illumination light for illuminating the hole position. The light source in the light source module 11 in the present application may use a point light source and a fiber bundle. Of course, in other embodiments, the light source may also be used. Other types of light sources. The light source in this embodiment may be a light emitting diode (LED).

且自聚焦透镜的几何长度Z和工作距离l1(即自聚焦透镜成像的物距)。由上述参数可以计算出成像的像距l₂和自聚焦透镜成像的横向放大倍率M，具体公式如下：The first imaging module 12 is configured to focus image the illumination light reflected back from the aperture. The first imaging module 12 employed in the present application is a self-focusing lens. Alternatively, the self-focusing lens, also referred to as a gradient-index lens, refers to a cylindrical optical lens whose refractive index distribution is radially graded, with focusing and imaging functions. In this embodiment, the self-focusing lens may have a cylindrical shape with high central symmetry, and the parameter information of the self-focusing lens can be obtained by rational design. Wherein, the central refractive index of the autofocus lens may be n ₀ , and the gradient constant may be

And the geometric length Z of the self-focusing lens and the working distance l1 (ie, the object distance imaged by the self-focusing lens). From the above parameters, the imaged image distance l ₂ and the lateral magnification M of the autofocus lens imaging can be calculated. The specific formula is as follows:

Wherein, the positive or negative of the lateral magnification M can indicate whether the image formed by the self-focusing lens is inverted or erect.

The second imaging module 13 is configured to image and concentrate the imaging light of the hole position, that is, the second imaging module 13 further re-images the imaging light and focuses the imaging light to the image acquisition module 14 . In the present application, the second imaging module 13 uses an imaging lens. In other embodiments, other optical components that can converge the imaging light reflected back from the workpiece hole position may be used, which is not further limited herein.

The image acquisition module 14 is configured to acquire imaging light from the second imaging module 13. The image acquisition module 14 may further include an image sensor (not shown) and an image chip (not shown). The image sensor is used to convert the collected imaging light from the hole position of the workpiece into an electrical signal, and further processed by the image chip and transmitted to the upper computer.

In addition, the detection system 10 of the present application further includes a microscopic module 15. The micro-module 15 is located in the optical path between the first imaging module 12 and the second imaging module 13. Optionally, the micro-module 15 in the present application employs a microscope objective lens having a higher magnification for amplifying the image formed by the first imaging module 12 on the hole position of the workpiece.

In this embodiment, by combining the first imaging module 12 (self-focusing lens) and the micro-module 15 (microscopic objective lens), the magnification of the imaging of the hole position of the workpiece can be ensured, and the depth of field of the system can be increased. . And when the workpiece hole depth is large, the workpiece hole position can be made twice or even multiple times by adjusting the distance between the workpiece and the self-focusing lens.

Further, the detection system 10 of the present application further includes a polarizer A, a polarization beam splitter B, and a phase extension. Late film C. Wherein, the polarization beam splitter B is located in the optical path between the image acquisition module 14 and the hole position, and is inclined by 45 degrees with respect to the optical path. The polarizer A is located in the optical path between the light source module 11 and the polarization beam splitter B. The phase retarder C is located in the optical path between the polarization beam splitter B and the aperture. The polarizer A is configured to polarize the light emitted by the light source module 11 to obtain the first linearly polarized light, and further eliminate the polarized light in the vertical direction, and prevent the polarized light in the vertical direction from passing through the polarizing beam splitter B. Forming stray light. The first linearly polarized light is reflected by the polarization beam splitter B, and after the phase retarder C is formed, circularly polarized light is formed and finally irradiated to the hole position, and the circularly polarized light reflected back from the hole position passes through the phase retarder C to form the second linearly polarized light. The second linearly polarized light passes through the polarization beam splitter B and finally enters the image acquisition module 14. The phase retarder C in the present application may be a 1/4 wave plate. In other embodiments, other wave plates may be used. The polarization beam splitter B in the present application may be a prism, and specifically may be a polarization beam splitting prism. , Gran prisms and Nicol prisms, etc., the use thereof can be selected according to the actual situation, and is not further limited herein.

Optionally, in this embodiment, the phase retarder C is located in the optical path between the microscopic module 15 and the image acquisition module 14, and the polarization beam splitter B is located in the optical path between the phase retarder C and the image acquisition module 14. The polarizer A is located in the optical path of the light source module and the polarization beam splitter B. Here, the optical axis of the polarizer A and the optical axis of the polarization beam splitter B are perpendicular to each other, and the angle between the optical axis angle of the phase retarder C and the polarization direction of the illumination light is set to 45°.

Referring to Figure 1, a detailed description of the specific working principle of the workpiece hole imaging detection system is made:

In this embodiment, the illumination light emitted by the light source module 11 passes through the polarizer A and becomes the first linearly polarized light whose polarization direction and the optical axis of the polarization beam splitter B are perpendicular to each other, and the polarization beam splitter B further the first line. The polarized light is all vertically reflected downward to the phase retarder C (1/4 wave plate), converted into circularly polarized light by the phase retarder C, and then enters the first imaging module 12 (self-focusing lens) for focusing, and the autofocus lens further The circularly polarized light is focused and incident perpendicularly to the workpiece hole. Of course, the illumination of the workpiece hole position by the illumination light here may not be limited to the normal incidence, or may be a fixed angle of incidence with the central axis of the hole position, thereby ensuring full coverage illumination of the hole position of the workpiece. Optionally, the self-focusing lens performs focusing imaging on the light reflected from the hole position. In this embodiment, by properly calculating the parameters of the self-focusing lens, the workpiece hole position is inverted and reduced by the self-focusing lens. The inverted inverted image is further enlarged by a microscopic module 15 (microscopic objective).

Further, the imaging light emitted through the microscope objective lens is still circularly polarized light, and the circularly polarized light passes through the phase retarder C again to become the second linearly polarized light, wherein the polarization direction of the second linearly polarized light and the polarization direction of the illumination light Vertical to each other. The second linearly polarized light passes through the polarizing beam splitter B and enters the second imaging module 13 (imaging lens), wherein the polarizing beam splitter B transmits and reflects only the second linearly polarized light, and is The second imaging module 13 further focuses the second linearly polarized light onto the image sensor in the image acquisition module 14. The image sensor converts the imaging light of the workpiece hole into an electrical signal, and further processes the image chip and transmits the image to the upper computer. The host computer further determines the type of defect existing in the hole position of the workpiece according to the imaging result, the size of the defect, and whether the workpiece is a defective product. Of course, in this embodiment, the imaging detection is performed only by the hole position of the workpiece. In other embodiments, the surface of the workpiece hole, the copper ring, the green paint, and the like can also be imaged and detected.

In the above embodiment, the imaging position of the workpiece is detected by combining the first imaging module and the microscopic module, and the first imaging module, the second imaging module, and the image acquisition module in the detection system share the optical path, which may be further The specific situation of the workpiece hole position is detected intuitively and accurately, and the operation is simple, the detection is accurate and efficient, the scope is wide, and the automation is easy.

Referring to FIG. 2, FIG. 2 is a schematic structural view of a second embodiment of a workpiece hole imaging detection system according to the present application. This embodiment is a further extension of the first embodiment of the workpiece hole imaging detection system, and is substantially the same as the first embodiment, except that the position of the light source module and the polarizer are the same as the second imaging module in the present application. The positions of the image acquisition module are interchanged, and the same points as those of the first embodiment are not described again. The detailed description is as follows:

The workpiece hole imaging detection system 20 in this embodiment includes a light source module 21, a first imaging module 22, a second imaging module 23, an image acquisition module 24, and a microscopic module 25.

The light source module 21 emits illumination light for illuminating the hole position.

The first imaging module 22 performs in-focus imaging of the illumination light reflected back from the aperture.

The second imaging module 23 is configured to image the imaging light of the hole position and further focus to the image acquisition module 24.

The image acquisition module 24 is configured to collect imaging light from the second imaging module 23.

The micro-module 25 is disposed in the optical path between the first imaging module 22 and the light source module 21.

For a detailed description of the light source module 21, the first imaging module 22, the second imaging module 23, the image acquisition module 24, and the microscopic module 25, refer to the detailed description in the first embodiment, and details are not described herein again.

Further, the detecting system 20 in this embodiment further includes a polarizer A1, a polarization beam splitter B1, and a phase retarder C1 which are sequentially disposed between the light source module 21 and the microscopic module 25.

Referring to Figure 2, a brief description will be given of the specific working principle of the workpiece hole imaging detection system:

The illumination light emitted by the light source module 21 passes through the polarizer A1 and becomes a first linearly polarized light whose polarization direction and the optical axis of the polarization beam splitter B1 are perpendicular to each other, and the polarization beam splitter B1 further transmits the first linearly polarized light to The phase retarder C1, the phase retarder C1 used in this embodiment is a quarter-wave plate, which is converted into circularly polarized light by the phase retarder C1 and then enters the first imaging module 22 (self-focusing lens) for focusing, the self-focusing lens. Further, the circularly polarized light is focused and vertically incident on the hole position of the workpiece, and the light reflected back from the hole position is subjected to in-focus imaging. Similar to the first embodiment, the hole of the workpiece is bored through the self-focusing lens by reasonably calculating the parameters of the self-focusing lens. The image is inverted and reduced. In this embodiment, after imaging by the autofocus lens, the imaging light enters the microscopic module 25 (microscopic objective lens) for amplification processing, and further becomes the second linearly polarized light through the phase retarder C1. The second linearly polarized light is reflected by the polarization beam splitter B1 to the second imaging module 23, and finally concentrated to the image acquisition module 24 for processing and then transmitted to the upper computer. The upper computer further determines the defect of the workpiece hole position according to the imaging result. The type, the size of the defect, and whether the workpiece is defective. In this embodiment, the imaging inspection of the workpiece hole position may include imaging the inner wall of the workpiece hole position, the surface of the hole position, and the attachment of the hole position, such as a copper ring or a green paint.

In the above embodiment, by imaging the workpiece hole position by combining the first imaging module and the microscopic module, and detecting the common optical path in the system, the copper plating of the workpiece hole position can be detected more intuitively and accurately. The operation is simple, the detection is accurate and efficient, the scope is wide, and the automation is easy.

Referring to FIG. 3, FIG. 3 is a schematic structural diagram of a third embodiment of a workpiece hole imaging detection system according to the present application. This embodiment is a further extension of the first embodiment of the workpiece hole imaging detection system, and is substantially the same as the first embodiment, except that the half-reverse half lens is used in the present application instead of the polarization component in the first embodiment. The beam splitter and the polarizer and the phase retarder can be omitted at the same time, and the same points as those of the first embodiment will not be described again, and the details are as follows:

The workpiece hole imaging detection system 30 in this embodiment includes a light source module 31, a first imaging module 32, a second imaging module 33, an image acquisition module 34, and a microscopic module 35.

The light source module 31 emits illumination light for illuminating the hole position.

The first imaging module 32 performs in-focus imaging of the illumination light reflected back from the aperture.

The second imaging module 33 is configured to image the imaging light of the hole position and further focus to the image acquisition module 34.

The image acquisition module 34 is configured to collect imaging light from the second imaging module 33.

The microscopic module 35 is disposed in an optical path between the first imaging module 32 and the second imaging module 33.

For detailed descriptions of the light source module 31, the first imaging module 32, the second imaging module 33, the image acquisition module 34, and the microscopic module 35, refer to the detailed description in the first embodiment, and details are not described herein again.

Further, the detection system 30 in this embodiment further includes a beam splitter M, and the beam splitter M is located at the light source. In the optical path between the module 31 and the microscopic module 35. The beam splitter M used in the present application may be a half mirror, although in other embodiments, other beamsplitters may be used.

Referring to Figure 3, a brief description will be given of the specific working principle of the workpiece hole imaging detection system:

The illumination light emitted by the light source module 31 directly passes through the beam splitter M (half-reverse half lens) and directly becomes circularly polarized light into the first imaging module 32 (self-focusing lens) for focusing, and the self-focusing lens further focuses the circularly polarized light and Normally incident on the workpiece hole position and focusing the light reflected from the hole position, similar to the first embodiment, by properly calculating the parameters of the autofocus lens, the workpiece hole position is imaged by the self-focusing lens to form an inverted and reduced real image. The difference is that, in this embodiment, after imaging by the autofocus lens, the imaging light directly enters the micro-module 35 (microscopic objective lens) for amplification processing, and is transmitted through the spectroscope M to the second imaging module 33, and finally aggregates to The image acquisition module 34 processes and transmits to the upper computer, and the upper computer further determines the defect type of the workpiece hole position according to the imaging result, the size of the defect, and whether the workpiece is a defective product. In this embodiment, the imaging inspection of the workpiece hole position may include imaging the inner wall of the workpiece hole position, the surface of the hole position, and the attachment of the hole position, such as a copper ring or a green paint.

In the above embodiment, the imaging position of the workpiece is detected by combining the first imaging module and the microscopic module, and the first imaging module, the second imaging module, and the image acquisition module in the detection system share the optical path, which may be further The specific situation of the workpiece hole position is detected intuitively and accurately, and the operation is simple, the detection is accurate and efficient, the scope is wide, and the automation is easy.

Referring to FIG. 4, FIG. 4 is a schematic structural view of a fourth embodiment of a workpiece hole imaging detection system according to the present application. This embodiment is a further extension of the first embodiment of the workpiece hole imaging detection system, and is substantially the same as the first embodiment, except that in this embodiment, the light source module, the polarizer, and the polarization beam splitter The specific setting positions of the phase retarder are different, and the same points as those of the first embodiment are not described again. The specific description is as follows:

The workpiece hole imaging detection system 40 in this embodiment includes a light source module 41, a first imaging module 42, a second imaging module 43, an image acquisition module 44, and a microscopic module 45.

The light source module 41 emits illumination light for illuminating the hole position.

The first imaging module 42 is configured to perform in-focus imaging of illumination light reflected back from the aperture.

The second imaging module 43 is configured to image the imaging light of the hole position and further focus the imaging light to the image acquisition module 44.

The image acquisition module 44 is configured to collect imaging light from the second imaging module 43.

The microscopic module 45 is disposed in an optical path between the first imaging module 42 and the second imaging module 43.

The light source module 41, the first imaging module 42, the second imaging module 43, and the image acquisition module For a detailed description of the 44 and the micro-module 45, refer to the detailed description in the first embodiment, and details are not described herein again.

Further, the detection system 40 in this embodiment further includes a polarizer A2, a polarization beam splitter B2, and a phase retarder C2. Wherein, the phase retarder C2 is located in the optical path between the micro-module 45 and the first imaging module 42, the polarizing beam splitter B2 is located in the optical path between the phase retarder C2 and the micro-module 45, and the polarizer A2 is located at the light source. The optical path of the module 41 and the polarization beam splitter B2.

Referring to Figure 4, a brief description will be given of the specific working principle of the workpiece hole imaging detection system:

The light source used by the light source module 41 is a point light source, and specifically may be an LED. The illumination light emitted by the light source module 41 passes through the polarizer A2 and becomes the first linearly polarized light whose polarization direction and the optical axis of the polarization beam splitter B1 are perpendicular to each other, and the polarization beam splitter B2 further vertically polarizes the first linearly polarized light. Reflecting downward to the phase retarder C2 (1/4 wave plate), after being converted into circularly polarized light by the phase retarder C2, it enters the first imaging module 42 (self-focusing lens) for focusing, and the self-focusing lens further converts the circularly polarized light. Focusing and vertically incident on the workpiece hole position and focusing the light reflected from the hole position, similar to the first embodiment, by properly calculating the parameters of the autofocus lens, the workpiece hole position is imaged by the self-focusing lens to form an inverted and reduced real image. The difference is that, in this embodiment, after imaging by the autofocus lens, the imaging light directly enters the phase retarder C2 to become the second linearly polarized light, and then further transmits through the polarizing beam splitter B2 into the microscopic module 45 (microscopic The objective lens is enlarged and transmitted to the second imaging module 43 and finally concentrated to the image acquisition module 44 for processing and then transmitted to the upper computer. The upper computer further determines the defect type of the workpiece hole position according to the imaging result, and the defect The size and whether the workpiece is defective. In this embodiment, the imaging inspection of the workpiece hole position may include imaging the inner wall of the workpiece hole position, the surface of the hole position, and the attachment of the hole position, such as a copper ring or a green paint.

In the above embodiment, the imaging position of the workpiece is detected by combining the first imaging module and the microscopic module, and the first imaging module, the second imaging module, and the image acquisition module in the detection system share the optical path, which may be further The copper plating of the workpiece hole position is detected intuitively and accurately, and the operation is simple, the detection is accurate and efficient, the scope is wide, and the automation is easy.

Referring to FIG. 5, FIG. 5 is a schematic structural view of a fifth embodiment of a workpiece hole imaging detection system according to the present application. This embodiment is a further extension of the first embodiment of the workpiece hole imaging detection system, and is substantially the same as the first embodiment, except that in this embodiment, the light source module, the polarizer, and the polarization beam splitter The specific setting positions of the phase retarder are different, and the same points as those of the first embodiment are not described again. The specific description is as follows:

The workpiece hole imaging detection system 50 in this embodiment includes a light source module 51 and a first imaging module. 52. A second imaging module 53, an image acquisition module 54, and a microscopic module 55.

The light source module 51 emits illumination light for illuminating the hole position.

The first imaging module 52 is configured to focus image the illuminated aperture.

The second imaging module 53 is configured to reflect the workpiece hole position back to the imaging light for further focusing to the image acquisition module 54.

The image acquisition module 54 is configured to collect imaging light from the second imaging module 53.

The microscopic module 55 is disposed in an optical path between the first imaging module 52 and the second imaging module 53.

For a detailed description of the light source module 51, the first imaging module 52, the second imaging module 53, the image acquisition module 54, and the microscopic module 55, refer to the detailed description in the first embodiment, and details are not described herein again.

Further, the detecting system 50 in this embodiment further includes a polarizer A3, a polarization beam splitter B3, and a phase retarder C3. The phase retarder C3 is located in the optical path between the hole position and the first imaging module 52, the polarization beam splitter B2 is located in the optical path between the phase retarder C3 and the first imaging module 52, and the polarizer A3 is located in the light source module. 51 and the optical path of the polarization beam splitter B3.

Referring to Figure 5, a brief description will be given of the specific working principle of the workpiece hole imaging detection system:

The light source used by the light source module 51 is a point light source, and specifically may be an LED. The illumination light emitted by the light source module 51 passes through the polarizer A3 and becomes the first linearly polarized light whose polarization direction and the optical axis of the polarization beam splitter B3 are perpendicular to each other, and the polarization beam splitter B3 further vertically polarizes the first linearly polarized light. It is reflected downward to the phase retarder C3 (1/4 wave plate), which is different from the first embodiment in that, in this embodiment, after the phase retarder C3 is converted into circularly polarized light, it directly enters the hole of the workpiece for illumination. The light reflected back from the workpiece hole directly enters the phase retarder C3 to become the second linearly polarized light, and is further transmitted through the polarization beam splitter B3 into the first imaging module 52 (self-focusing lens) for imaging, similar to the first embodiment. By reasonably calculating the parameters of the self-focusing lens, the workpiece hole position can be imaged by the self-focusing lens to form an inverted image. After imaging by the autofocus lens, the imaging light microscopy module 55 (microscopic objective lens) is amplified and transmitted to the second imaging module 53, and finally aggregated into the image acquisition module 54 for processing and then transmitted to the upper computer, and the upper computer is The imaging result further determines the type of defect existing in the hole position of the workpiece, the size of the defect, and whether the workpiece is a defective product. In this embodiment, the imaging inspection of the workpiece hole position may include imaging the inner wall of the workpiece hole position, the surface of the hole position, and the attachment of the hole position, such as a copper ring or a green paint.

In the above embodiment, the imaging position of the workpiece is detected by combining the first imaging module and the microscopic module, and the first imaging module, the second imaging module, and the image acquisition module in the detection system share the optical path, which may be further Intuitive and accurate detection of copper plating in the workpiece hole position, and simple operation Single, accurate and efficient detection, wide adaptability, and easy automation.

Referring to FIG. 6, FIG. 6 is a schematic structural diagram of a sixth embodiment of a workpiece hole imaging detection system according to the present application. The embodiment is further extended on the first embodiment of the workpiece hole imaging detection system, and is substantially the same as the first embodiment, except that in this embodiment, the light source module is disposed adjacent to the first imaging module, and The polarizer, the polarization beam splitter, and the phase retarder are omitted in the embodiment, and the details are as follows:

The workpiece hole imaging detection system 60 in this embodiment includes a light source module 61, a first imaging module 62, a second imaging module 63, an image acquisition module 64, and a microscopic module 65.

For a detailed description of the light source module 61, the first imaging module 62, the second imaging module 63, the image acquisition module 64, and the microscopic module 65, refer to the detailed description in the first embodiment, and details are not described herein again.

In this embodiment, the light source module 61 is disposed adjacent to the first imaging module 62, and the light source module 61 includes an annular bracket 611 and a light source 612. The annular bracket 611 is surrounded and fixed to the first imaging module 62, and the number of the light sources 612 is at least two. And evenly distributed on the annular bracket 611.

Optionally, in this embodiment, the light source 612 may include a point light source E and a fiber bundle F. Referring to FIG. 6, the fiber bundle F is evenly distributed on the annular bracket 611, and the light incident end a is coupled with the point light source E, and the light emitting end b toward the hole. Further, the annular bracket 611 can be disposed at a predetermined angle with the central axis of the workpiece hole position. Of course, the preset angle can be any angle value. In other embodiments, the annular bracket 611 can also be a workpiece. The hole positions are vertically arranged so that the illumination light is incident at a small angle value or perpendicularly to the workpiece hole position, ensuring full coverage illumination of the hole position.

Referring to Figure 6, a brief description of the specific working principle of the workpiece hole imaging detection system is given:

The illumination light emitted by the light source 612 in the light source module 61 is directly incident perpendicular to the central axis of the workpiece hole at a predetermined angle to the workpiece hole position, and the light reflected back from the workpiece hole position directly enters the first imaging module 62 (self-focusing lens) Focus imaging is performed, and similarly to the first embodiment, by reasonably calculating the parameters of the autofocus lens, the workpiece hole position can be imaged by the self-focusing lens to an inverted and reduced image. After imaging by the self-focusing lens, the imaging light enters the micro-module 65 (microscopic objective lens) for amplification processing, and is transmitted to the second imaging module 63, and finally aggregated into the image acquisition module 64 for processing and then transmitted to the upper computer, and the upper computer is The imaging result further determines the type of defect existing in the hole position of the workpiece, the size of the defect, and whether the workpiece is a defective product. In this embodiment, the imaging inspection of the workpiece hole position may include imaging the inner wall of the workpiece hole position, the surface of the hole position, and the attachment of the hole position, such as a copper ring or a green paint.

In the above embodiment, the workpiece hole position is directly irradiated by using an external annular light source, and the workpiece hole position is reflected. The returned light passes through the first imaging module and the microscopic module for focusing imaging processing, which can more accurately and accurately detect the copper plating of the workpiece hole position, and is simple in operation, accurate and efficient in detection, wide in adaptability, and easy to realize automation.

Referring to FIG. 7, FIG. 7 is a schematic structural diagram of a seventh embodiment of a workpiece hole imaging detection system according to the present application. The embodiment is a further extension of the fifth embodiment of the workpiece hole imaging detection system, and is substantially the same as the fifth embodiment, except that in this embodiment, the light source module is integrated in the image acquisition module, and the specific description is as follows. :

The workpiece hole imaging detection system 70 in this embodiment includes a light source module 71, a first imaging module 72, a second imaging module 73, an image acquisition module 74, and a microscopic module 75. The light source module 71 is integrated in the image acquisition module 74. For a detailed description of each module in this embodiment, refer to the detailed description in the fourth embodiment, and details are not described herein again.

Referring to FIG. 8, FIG. 8 is a schematic structural diagram of an eighth embodiment of a workpiece hole imaging detection system according to the present application. The embodiment is a further extension of the sixth embodiment of the workpiece hole imaging detection system, and is substantially the same as the seventh embodiment, except that in this embodiment, the light source module is integrated in the second imaging module, and the specific description is provided. as follows:

The workpiece hole imaging detection system 80 in this embodiment includes a light source module 81, a first imaging module 82, a second imaging module 83, an image acquisition module 84, and a microscopic module 85. The light source module 81 is integrated in the image second imaging module 83. For a detailed description of each module in this embodiment, refer to the detailed description in the fourth embodiment, and details are not described herein again.

Referring to FIG. 9, FIG. 9 is a schematic structural diagram of a ninth embodiment of a workpiece hole imaging detecting system according to the present application. This embodiment is a further extension of the seventh embodiment of the workpiece hole imaging detection system, and is substantially the same as the seventh embodiment, except that in this embodiment, the light source module is integrated into the microscopic module, and the specific description is as follows. :

The workpiece hole imaging detection system 90 in this embodiment includes a light source module 91, a first imaging module 92, a second imaging module 93, an image acquisition module 94, and a microscopic module 95. The light source module 91 is integrated in the image microscopy module 95. For a detailed description of each module in this embodiment, refer to the detailed description in the fourth embodiment, and details are not described herein again.

Referring to FIG. 10, FIG. 10 is a schematic structural diagram of a tenth embodiment of a workpiece hole imaging detection system according to the present application. This embodiment is a further extension of the seventh embodiment of the workpiece hole imaging detection system, and is substantially the same as the sixth embodiment, except that in this embodiment, the light source module is integrated in the first imaging module, and the specific description is as follows:

The workpiece hole imaging detection system 100 in this embodiment includes a light source module 101, a first imaging module 102, a second imaging module 103, an image acquisition module 104, and a microscopic module 105. The light source module 101 is integrated in the image first imaging module 102. For a detailed description of each module in this embodiment, refer to the detailed description in the fourth embodiment, and details are not described herein again.

In summary, those skilled in the art will readily understand that the present application provides a workpiece hole imaging detection system that performs imaging detection on a workpiece hole position by combining a first imaging module and a microscopic module, and in the detection system. The first imaging module, the second imaging module and the image acquisition module share the optical path, which can more accurately and accurately detect the specific situation of the workpiece hole position, and has the advantages of simple operation, accurate and efficient detection, wide adaptability and easy automation.

The above description is only the embodiment of the present application, and thus does not limit the scope of the patent application, and the equivalent structure or equivalent process transformation of the specification and the drawings of the present application, or directly or indirectly applied to other related technologies. The fields are all included in the scope of patent protection of this application.

Claims (14)

A workpiece hole imaging detection system, characterized in that the system comprises: a light source module for illuminating the hole position of the workpiece; a first imaging module, configured to perform focusing imaging on illumination light reflected back by the hole position; a second imaging module, configured to image and focus the imaging light of the hole position; An image acquisition module is configured to collect the imaging light from the second imaging module. The system of claim 1 further comprising a microscopy module positioned in an optical path between the first imaging module and the second imaging module. The system according to claim 2, further comprising a polarizer, a polarization beam splitter, and a phase retarder, said polarization beam splitter being located in an optical path between said image acquisition module and said aperture The polarizer is located in an optical path between the light source module and the polarization beam splitter, and the phase retarder is located in an optical path between the polarization beam splitter and the hole position. The system according to claim 3, wherein said phase retarder is located in an optical path between said microscopic module and said image acquisition module, said polarization beam splitter being located in said phase retarder and said In the optical path between the image acquisition modules. The system according to claim 3, wherein said phase retarder is located in an optical path between said microscopic module and said first imaging module, said polarizing beam splitter being located in said phase retarder and In the light path between the microscopic modules. The system of claim 3 wherein said phase retarder is located in an optical path between said aperture and said first imaging module, said polarization beam splitter being located in said phase retarder and said In the optical path between the first imaging modules. The system of claim 2 wherein said system further comprises a beam splitter, said beam splitter being located in an optical path between said light source module and said microscope module. The system of claim 7 wherein said beam splitter is a half mirror. The system of claim 2 wherein said light source module is disposed adjacent said first imaging module. The system according to claim 9, wherein the light source module comprises an annular support and a light source, the annular support is surrounded and fixed to the first imaging module, the number of the light sources is at least two, and uniform Distributed in the annular stent. The system of claim 10 wherein said light source comprises a point source and The fiber bundle is evenly distributed on the annular support, and the light incident end is coupled to the point light source, and the light exit end faces the hole position. The system of claim 2, wherein the light source module is integrated with the image acquisition module, the second imaging module, the microscopic module, or the first imaging module. The system of any of claims 1 to 12, wherein the first imaging module is a self-focusing lens. The system according to any one of claims 1 to 12, wherein the image acquisition module comprises an image sensor and an image chip, the image sensor for converting the imaged light from the second imaging module For an electrical signal, the image chip receives the electrical signal and performs an imaging process.

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