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WO2019199078A1 - Multiple input and multiple output antenna apparatus - Google Patents

Multiple input and multiple output antenna apparatus Download PDF

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Publication number
WO2019199078A1
WO2019199078A1 PCT/KR2019/004357 KR2019004357W WO2019199078A1 WO 2019199078 A1 WO2019199078 A1 WO 2019199078A1 KR 2019004357 W KR2019004357 W KR 2019004357W WO 2019199078 A1 WO2019199078 A1 WO 2019199078A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
heat
unit
main body
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/004357
Other languages
French (fr)
Korean (ko)
Inventor
유창우
박민식
여진수
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KMW Inc
Original Assignee
KMW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KMW Inc filed Critical KMW Inc
Priority to FIEP19785289.0T priority Critical patent/FI3780260T3/en
Priority to EP19785289.0A priority patent/EP3780260B1/en
Priority to CN201980025429.7A priority patent/CN112352348B/en
Priority to JP2020555219A priority patent/JP7009649B2/en
Priority claimed from KR1020190042379A external-priority patent/KR102131417B1/en
Publication of WO2019199078A1 publication Critical patent/WO2019199078A1/en
Priority to US17/065,739 priority patent/US11147154B2/en
Anticipated expiration legal-status Critical
Priority to JP2022003030A priority patent/JP7285348B2/en
Ceased legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/02Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/42Housings not intimately mechanically associated with radiating elements, e.g. radome

Definitions

  • the present invention relates to a multiple input and output antenna device (MULTI INPUT AND MULTI OUTPUT ANTENNA APPARATUS), and more particularly to a multiple input and output antenna device for wireless communication.
  • MULTI INPUT AND MULTI OUTPUT ANTENNA APPARATUS MULTI INPUT AND MULTI OUTPUT ANTENNA APPARATUS
  • Wireless communication technology for example, multiple input multiple output (MIMO) technology is a technology that significantly increases the data transmission capacity by using a plurality of antennas, the transmitter transmits different data through each transmission antenna, and the receiver Is a spatial multiplexing technique that separates transmission data through proper signal processing.
  • MIMO multiple input multiple output
  • the channel capacity increases to allow more data to be transmitted. For example, if you increase the number of antennas to 10, you get about 10 times the channel capacity using the same frequency band compared to the current single antenna system.
  • 4G LTE-advanced uses up to 8 antennas.
  • products with 64 or 128 antennas are being developed in the pre-5G phase, and base station equipment with a much larger number of antennas is expected to be used in 5G.
  • This is called Massive MIMO technology.
  • the current cell operation is 2-Dimension, 3D-Beamforming is possible when Massive MIMO technology is introduced, so it is also called FD-MIMO (Full Dimension).
  • Massive MIMO In Massive MIMO technology, as the number of ANTs increases, so does the number of transmitters and filters. Nevertheless, due to the lease cost or space constraints of the installation site, making RF components (Antenna / Filter / Power Amplifier / Transceiver etc.) small, light and inexpensive makes Massive MIMO require high power for coverage expansion. Power consumption and heat generation due to this negatively affects the weight and size reduction.
  • An object of the present invention is to provide a multiple input / output antenna device capable of realizing high output and excellent heat dissipation characteristics.
  • a multiple input / output antenna apparatus including: an antenna substrate having a plurality of antenna elements arranged on a front surface thereof, and a plurality of first heat generating elements generated by electric driving on a front surface thereof, and a rear surface thereof.
  • a plurality of second heat generating elements are generated by electrical driving, and includes a transceiver module substrate disposed to have a spaced space with respect to the antenna substrate, wherein the heat generated from the plurality of first heat generating elements is The heat is radiated to the front of the substrate, and heat generated from the plurality of second heat generating elements is radiated to the rear of the transmission / reception module substrate.
  • FIG. 1 and 2 are perspective views illustrating a front part and a rear part of a multiple input / output antenna device according to an embodiment of the present invention
  • FIGS. 3 and 4 are exploded front and rear exploded perspective views of the multi-input and output antenna device of Figures 1 and 2,
  • 5A and 5B are front exploded perspective views and rear exploded perspective views illustrating one heat dissipation part and the other heat dissipation part of a multi-input / output antenna device according to the present invention
  • 6 to 8 are cross-sectional views of various parts for explaining the heat radiation to the front and rear of the multiple input and output antenna device according to the present invention.
  • 9A and 9B are exploded perspective views of the front and rear parts of the BB board and its heat dissipation structure among the multiple input / output antenna devices according to the present invention.
  • FIG. 10 is a cross-sectional view taken along line D-D in the coupled state of FIG. 9A and a partial enlarged view thereof;
  • FIG. 11 is an exploded perspective view showing a coupling state of the installation bracket of the configuration of Figure 1,
  • 12A and 12B are a plan view and a side view showing a rotating and tilting state by a horizontal rotating bracket and a vertical rotating bracket of the installation bracket.
  • antenna housing 11 antenna substrate
  • antenna element 20 front heat dissipation unit
  • Front heat dissipation body 23 Front main heat dissipation fin
  • fixing portion 64 residual heat radiating fin
  • transceiver module board 115 FPGA
  • FIG. 1 and 2 are perspective views showing the front and rear portions of the multi-input and output antenna device according to an embodiment of the present invention
  • Figures 3 and 4 are an exploded perspective view and a rear portion of the front portion of the antenna device of Figures 1 and 2 Exploded perspective view.
  • An embodiment of the multi-input / output antenna apparatus 1 according to the present invention may be supplied with power from a power supply module (not shown), and may wirelessly communicate with an external terminal or base stations through a built-in wireless transmission / reception module.
  • the antenna device 1 according to an embodiment of the present invention is related to a MIMO (Multi Input Multi Output) wireless communication antenna system.
  • the antenna substrate 11 having a plurality of antenna elements 13 arranged on the front surface, and a plurality of heat generated by electrical driving on the front surface
  • a first heating element and a plurality of second heating elements are generated on the rear surface by electrical driving, and includes a transmission and reception module substrate 110 disposed to have a spaced space with respect to the antenna substrate (11).
  • the direction in which the antenna mounting posts to be described later is defined as 'rear'
  • the direction in which the radome 5 to be described below is defined as 'forward'.
  • the antenna substrate 11 is accommodated in the antenna housing 10, and accommodated so that the antenna element 13 accommodated in the antenna substrate 11 is exposed to the front.
  • the communication component mounted on the antenna substrate 11 may include not only the plurality of antenna elements 13 but also a multi-band filter (MBF).
  • the radome 5 may be arranged to cover.
  • a radome 5 is a radio signal propagated from the antenna elements 13 or to the antenna element 13 is transmitted. It may be made of a material, for example, may be made of an electrically insulating plastic.
  • the radome 5 will be defined as being provided at the forefront.
  • the size of the radome 5 and the antenna housing 10 is formed almost the same, it may be formed in a ratio compared to the antenna substrate 11 accommodated in the antenna housing 10.
  • another antenna device 1 which is to be installed by the vertical length or to be installed later when installed in the antenna installation support further described later in 5G.
  • the antenna substrate 11 may be formed in a rectangular shape in which the length of the left and right widths is larger than the length of the upper and lower widths so as to reduce installation interference with the antenna.
  • an embodiment of the multiple input / output antenna device 1 according to the present invention has a form in which an antenna assembly is a combination of RF elements and modules in which digital elements are implemented in a stacked structure. Take it.
  • the main modules of the illustrated antenna assembly can be divided into three layers.
  • the first substrate is a printed circuit board (PCB) in which a calibration network is implemented, and a plurality of antenna elements 13 are disposed on a front surface of the antenna substrate 11 and a plurality of multiband filters on a rear surface of the antenna substrate 11.
  • PCB printed circuit board
  • MPF Band Filter
  • the transmission / reception module substrate 110 which is the second layer, may be signal-coupled to have the above-described predetermined separation space between the first layer and the transmission / reception module substrate 110.
  • a plurality of RFICs 125 connected to the plurality of antenna elements 13 may be mounted on the front surface of the transmission / reception module substrate 110.
  • the plurality of communication components including the plurality of RFICs 125 may be defined as 'a plurality of first heating elements' as heat generating elements that generate predetermined heat when electrically operated.
  • a plurality of FPGAs 115 that perform digital signal processing operations, such as receiving a digital signal converted from an analog / digital converter and converting it into a baseband signal, may be mounted on the rear surface of the transmission / reception module substrate 110.
  • an analog processing circuit such as a power amplifier (PA) is implemented on the back of the transmission / reception module substrate 110, and each power amplifier included in the analog processing circuit may be electrically connected to the aforementioned MBFs through an RF interface. Can be.
  • a digital processing circuit may be implemented on the rear surface of the transmission / reception module substrate 110 and a power supply unit PSU may be mounted. The digital processing circuit converts a digital signal received from a base station base band unit (BBU) into an analog RF signal, converts an analog RF signal received from an antenna into a digital signal, and transmits the digital signal to the base station BBU.
  • BBU base station base band unit
  • the plurality of FPGAs 115 and the power supply unit may be defined as 'a plurality of second heating elements' as heat generating elements that generate predetermined heat when they are electrically operated. have.
  • the multi-input / output antenna device 1 is designed to reduce the top and bottom widths in the overall shape of the antenna substrate 11, thereby facilitating the installation of the additional antenna device 1 in 5G. to provide.
  • various communication components integrated in the transmit / receive module substrate 110 are distributedly disposed on the front and rear surfaces of the transmit / receive module substrate 110 to facilitate heat dissipation.
  • the heat generated from the first heat generating element provided on the front side of the transmit / receive module substrate 110 radiates heat toward the front of the transmit / receive module substrate 110, and generates heat from the second heat generating element provided on the back side of the transmit / receive module substrate 110.
  • the heat is configured to dissipate to the rear of the transmission / reception module substrate 110.
  • the antenna substrate 11 and the transmit / receive module substrate 110 may minimize the influence of heat generated from the first heat generating element on the front surface of the transmit / receive module substrate 110 with the antenna element 13 disposed at the front thereof. As described above, it may be arranged to have a predetermined space, and may radiate heat generated from the first heat generating element to the space.
  • FIG. 5A and 5B are front exploded perspective views and rear exploded perspective views showing one side heat dissipation part and the other side heat dissipation part in the configuration of the multi-input / output antenna device according to the present invention
  • FIG. 6 is a cross-sectional view taken along line AA of FIG. 7 is a cross-sectional view taken along line BB of FIG. 1
  • FIG. 8 is a cross-sectional view taken along line CC of FIG. 1.
  • the antenna substrate 11 and the transmission / reception module substrate 110 may include a front heat dissipation unit disposed in a space. 20) can be partitioned.
  • the front heat dissipation unit 20 may be provided with a metal material.
  • a plurality of communication components provided on the transmission / reception module substrate 110 and a plurality of antenna elements 13 disposed on the front antenna substrate 11 may be used. The effects from propagation can be minimized.
  • the rear heat dissipation unit 30 may be disposed outside the transmission / reception module substrate 110 to cover the same. Can be. Therefore, the front and rear heat dissipation unit 20 is disposed in contact with the first heat generating element provided at the front side, and the rear heat dissipation unit 30 is in contact with the second heat generating element provided at the rear side. Can be arranged.
  • the front heat dissipation unit 20 may be disposed in the separation space.
  • the front heat dissipation unit 20 may be disposed in a spaced space, and may be provided to fill the spaced space itself, which is a spaced space between the antenna substrate 11 and the transceiver module substrate 110.
  • filling all of the separation space substantially blocks the inflow of external air that may be involved in the heat radiation of the front heat dissipation unit 20, and thus the heat dissipation performance may be deteriorated.
  • the antenna housing 10 in which the 11 is accommodated is spaced to some extent.
  • the rear heat dissipation unit 30 may be disposed in an outer space facing the above-described spaced space with respect to the transmission / reception module substrate 110. That is, the rear heat dissipation unit 30 may be disposed to completely cover the other surface of the transmission / reception module substrate 110.
  • the front heat dissipation unit 20 is disposed so that the front surface of the transmission / reception module substrate 110 is in close contact, and the front heat dissipation provided with a plurality of main heat dissipation fins 23 protruding forward. It is disposed to penetrate through the main body 21 and the front heat dissipation main body 21, one end is in close contact with at least a portion of the first heat generating element of the transmission and reception module substrate 110, and the other end of the heat conducted from the first heat generating element It may include a plurality of front unit radiator 40 provided with a plurality of sub-radiation fins 43 for radiating to the outside.
  • the main heat dissipation fins provided in the front heat dissipation main body 21 are referred to as the front main heat dissipation fins 23 for the purpose of distinguishing the respective components of the rear heat dissipation unit 30 to be described later.
  • the 'sub heat dissipation fin' provided in the unit heat dissipator 40 is referred to as a 'front sub heat dissipation fin 43'.
  • the plurality of front main heat dissipation fins 23 serves to heat-dissipate heat transferred from the first heat generating elements to the front heat dissipation main body 21 by heat exchange with the incoming outside air. Therefore, the front heat dissipation main body 21 may be provided with a metal material that is easy to conduct heat, and the plurality of front main heat dissipation fins 23 may also be provided with a metal material that is easy to conduct heat.
  • the plurality of front main heat dissipation fins 23 may be formed on the front surface of the front heat dissipation main body 21, and may be integrally formed with the front heat dissipation main body 21, for example.
  • the present invention is not limited thereto, and the plurality of front main heat dissipation fins 23 are manufactured as a separate member and adhered to the front surface of the front heat dissipation main body 21 with a thermally conductive adhesive, or separately fastened such as bolts. It can be fixed by a member.
  • the plurality of front unit radiators 40, the front heat dissipation main body 21 that generates heat from a plurality of first heat generating elements, in particular, the RFIC 125 connected to the plurality of antenna elements 13, as will be described later Apart from and serves to dissipate heat to the above-described separation space.
  • the multi-input / output antenna device 1 particularly adopts a structure for individually radiating heat generated from the RFIC 125 among the communication components having a large amount of heat generation among the first heating elements. As a result, regardless of the heat dissipation performance of the front heat dissipation main body 21, heat generated from the plurality of RFICs 125 can be quickly dissipated.
  • the plurality of front main heat dissipation fins 23 formed on the front surface of the front heat dissipation main body 21 may be disposed to be inclined upward. That is, in the drawings of FIGS. 5A and 5B, one embodiment of the multi-input / output antenna device 1 according to the present invention is disposed in the vertical direction, and the plurality of front main heat dissipation fins 23 so that external air is easily introduced into the space. ) Is preferably formed to have an air flow path in the vertical direction. Furthermore, in an embodiment of the multiple input / output antenna device 1 according to the present invention, the front main heat dissipation fins 23 are disposed to be inclined upward so that the external air inflow into the separation space is further increased. It is easy to inflow of outside air from the side as well as the bottom of 21).
  • Such a plurality of front main heat dissipation fins 23 are upwardly directed toward the upper and lower center lines of the front heat dissipation main body 21 from the left side and the right side of the heat dissipation fin portion disposed inclined upward toward the vertical center line of the front heat dissipation main body 21 on the left side of the drawing. It may include a right heat radiation fin portion disposed inclined.
  • the plurality of front main heat dissipation fins 23 is formed of two groups of the left heat dissipation fin part and the right heat dissipation fin part, and outside air flows through the left heat dissipation fin part from the left side of the front heat dissipation main body 21 and flows to the front heat dissipation main body.
  • the air flows upward toward the front center of the front surface 21, and outside air flows in from the right side of the front heat dissipation main body 21 through the right heat dissipation fin, and flows upward toward the front center of the front heat dissipation main body 21.
  • the heat exchange air of both sides gathered in the front center direction of the front heat dissipation main body 21 may be discharged to an upper side which is a space between the left heat dissipation fin part and the right heat dissipation fin part.
  • the plurality of front unit heat sinks 40 have one end fixed to the front heat dissipation main body 21 and the other end of the antenna housing 10 in which the antenna substrate 11 is accommodated. Can be fixed to the back.
  • the plurality of front unit heat sinks 40 include a coupling portion 41 for coupling to the front heat dissipation main body 21 to be in contact with any one of the first heat generating elements as the one end portion, and the coupling portion 41. It may include a conductive portion 42 for transferring the conductive heat through the spaced through) and a plurality of sub heat dissipation fins 43 stacked on the outer circumference of the conductive portion 42 in a stacked manner. The front end of the conductive part 42 may be fixed to the rear surface of the antenna housing 10 as the other end.
  • the plurality of front sub heat dissipation fins 43 may have the same heat dissipation area. This is because when the heat dissipation areas of the plurality of front sub heat dissipation fins 43 are different, some of the front sub heat dissipation fins 43 may be disposed to cover or overlap the plurality of front main heat dissipation fins 23. This is because the increase is not large.
  • the plurality of front sub heat dissipation fins 43 may be exposed to a space. That is, the front and rear lengths of the plurality of front unit heat sinks 40 are one end coupled to the front heat dissipation main body 21, and the other end is spaced apart from the plurality of front main heat dissipation fins 23 formed at the front heat dissipation main body 21. It may be formed to a size that protrudes further into space. As described above, the plurality of front unit heat sinks 40 may be exposed to a space between the end portions of the plurality of front main heat dissipation fins 23 and the antenna housing 10 so that the heat dissipation may be faster.
  • the front heat dissipation main body 21 may have a coupling hole (not shown) to which the coupling portions 41 of the plurality of front unit heat dissipation bodies 40 are coupled. Coupling portions 41 of the plurality of front unit heat sinks 40 may be disposed in close contact with at least one heat generating surface of the first heating elements by passing through the coupling hole 37 of the front heat dissipating body 21. have. At this time, the coupling part 41 may be coupled to the coupling hole by screwing.
  • the coupling manner of the front unit heat sink 40 to the front heat dissipation main body 21 is not limited by the screw fastening method. That is, although the plurality of front unit heat sinks 40 are not shown in close contact with the heat generating surfaces of the first heat generating elements, the plurality of front unit heat sinks 40 may be disposed on the outer circumferential surface of the coupling portion 41 of the plurality of front unit heat sinks 40. A male thread is formed, and a female thread is formed on the inner circumferential surface of the coupling hole 37 of the front heat dissipation main body 21, and it is natural that the coupling can be performed by a simple rotation coupling method.
  • FIGS. 9A and 9B are exploded perspective views of front and rear parts illustrating a BB board and a heat dissipation structure of a multi-input / output antenna device according to the present invention, and FIG. 10 is taken along the DD line in the combined state of FIG. 9A. It is sectional drawing and the partial enlarged view.
  • the rear surface of the transmit / receive module substrate 110 may be covered by the rear radiator 30. That is, the rear heat dissipation unit 30 serves to protect the transceiver module substrate 110 from external pollutants by shielding the rear surface of the transceiver module substrate 110.
  • the rear heat dissipation unit 30 may be provided with a metal material having excellent thermal conductivity.
  • the material having excellent thermal conductivity may be provided with any material, the material of the rear heat dissipation part 30 is not limited thereto.
  • the transmitting / receiving module substrate 110 heats heat generated from the first heat generating element provided at the front side to be radiated to the space separated by the front heat dissipating unit 20, and the second heat generating element provided at the rear side. Heat generated from the heat may be provided to radiate heat to the outer space by the rear radiator 30.
  • the front heat dissipation unit 20 is disposed such that the rear surface of the transmission / reception module substrate 110 is in close contact, and a plurality of main heat dissipation fins (hereinafter, referred to as the front heat dissipation unit 20) is provided.
  • the rear main heat dissipation fin (referred to as 'rear main heat dissipation fin 33') is provided to protrude through the rear heat dissipation main body 31 and the rear heat dissipation main body 31, and one end is transmitted and received.
  • a plurality of sub heat dissipation fins (hereinafter, referred to as “front side” of the front heat dissipation unit 20) in close contact with at least a portion of the second heat dissipation element of the module substrate 110 and dissipating heat conducted from the second heat dissipation element to the other end.
  • a plurality of rear unit heat sinks 50 provided with a 'rear sub heat dissipation fin 53' may be provided to distinguish the sub heat dissipation fin 43 '.
  • the plurality of rear main heat dissipation fins 33 serves to dissipate heat transferred from the second heating elements to the rear heat dissipation main body 31 by exchanging heat with external air. Therefore, like the front heat dissipation main body 21, the rear heat dissipation main body 31 may be provided with a metal material having easy thermal conductivity, and the plurality of rear main heat dissipation fins 33 may also be provided with a metal material having easy thermal conductivity.
  • the plurality of rear main heat dissipation fins 33 may be formed on the rear surface of the rear heat dissipation main body 31 and, for example, may be integrally formed with the rear heat dissipation main body 31, and a plurality of rear mains may be formed.
  • the heat dissipation fin 33 may be manufactured as a separate member and adhered to the rear surface of the rear heat dissipation main body 31 with a heat conductive adhesive, or fixed with a separate fastening member such as a bolt.
  • the plurality of rear unit heat sinks 50 radiate heat generated from the plurality of second heat generating elements to the outer space separately from the plurality of second heat generating elements, in particular, as described later. It plays a role.
  • the multi-input / output antenna device 1 adopts a structure for individually dissipating heat generated from a plurality of FPGAs 115 among communication components having a large amount of heat generation among the second heating elements. do.
  • the plurality of FPGAs 115 are components that perform digital signal processing operations such as receiving digital signals converted from analog / digital converters and converting them into baseband signals. Thereby, regardless of the heat dissipation performance of the rear heat dissipation main body 31, it is possible to more quickly dissipate heat generated from the FPGA 115 having a larger heat generation amount.
  • the plurality of rear main heat dissipation fins 33 formed on the rear surface of the rear heat dissipation main body 31 may be disposed to be inclined upwardly, similarly to the plurality of front main heat dissipation fins 23.
  • the plurality of rear main heat dissipation fins 33 is upward so that the inflow of external air into the plurality of rear main heat dissipation fins 33 is further increased. It may be arranged to be inclined. Therefore, the inflow of the outside air is easy not only in the lower side but also in the side of the rear heat dissipation main body 31.
  • Such a plurality of rear main heat dissipation fins 33 have a left heat dissipation fin part 34 disposed to be inclined upward toward an upper and lower center line of the rear heat dissipation main body 31 on the left side in FIG. 5B, and a rear heat dissipation main body 31 on the right side. It may include a right heat radiation fin portion 35 is disposed to be inclined upward toward the vertical line of the.
  • the plurality of rear main heat dissipation fins 33 is formed of two groups of the left heat dissipation fin portion 34 and the right heat dissipation fin portion 35, and the left heat dissipation fin portion 34 is formed from the left side of the rear heat dissipation fin portion 31.
  • Outside air flows through and flows, but is upwardly flowed toward the front center of the rear heat dissipation main body 31, and outside air flows through the right heat dissipation fin unit 35 from the right side of the rear heat dissipation main body 31 and flows backward. It flows upward toward the front center of the main body 31.
  • the heat exchange air of both sides gathered toward the front center of the rear heat dissipation main body 31 is discharged to the outer space from the heat dissipation exhaust rib 36 which will be described later where the left heat dissipation fin 34 and the right heat dissipation fin 35 meet each other. Can be.
  • one end of the plurality of rear unit heat sinks 50 may be fixed to the rear heat dissipation main body 31, and the other end thereof may be coupled to an antenna mounting bracket to be described later. .
  • the plurality of rear unit heat sinks 50, the coupling portion 51 for coupling to the rear surface of the rear heat dissipation main body 31 to be in contact with any one of the second heating element as the one end, the coupling portion Conductive portion 52 for transferring the heat conducted through the 51 to the outer space, and a plurality of rear sub-heat radiating fins 53 stacked on the outer periphery of the conductive portion 52 may be included.
  • the tip of the conducting portion 52 may be fixed to the antenna mounting bracket as the other end.
  • the plurality of rear sub heat dissipation fins 53 may be formed such that its heat dissipation area gradually decreases toward the outer space. This makes the rear heat dissipation main body 31, i.e., the area of the rear sub heat dissipation fin 53 closer to the second heat generating element larger than the area of the rear sub heat dissipation fin 53 provided at a far distance, thereby providing a more rapid 2 This is to dissipate heat conducted from the heating element.
  • the plurality of rear unit heat sinks 50 may be formed to protrude to an outer space more than the plurality of rear main heat dissipation fins 33 formed on the rear heat dissipation body 31. This is to prevent the occurrence of installation interference when coupling with the antenna mounting bracket to be described later by the rear main heat dissipation pin 33.
  • the rear heat dissipation main body 31 may be provided with a coupling hole 37 to which the coupling portions 51 of the plurality of rear unit heat dissipators 50 described above are coupled.
  • the coupling part 51 of the plurality of rear unit heat sinks 50 may be disposed to closely contact the heating surface of at least one of the second heating elements through the coupling hole 37 of the rear heat dissipation main body 31. have. At this time, the coupling part 51 may be coupled to the coupling hole 37 by a screw coupling method.
  • the transceiving module substrate 110 may include a part of a plurality of second heating elements,
  • the first transmitting and receiving substrate 111 and the plurality of second heat generating elements are disposed on the left side of the rear heat dissipation unit 30 in the vertical direction and are mounted in a vertical direction on the right side of the rear heat dissipation unit 30.
  • a third transmission receiver configured to be mounted in the vertical direction between the second transmitter / receive substrate 112 and the plurality of second heat generating elements, and the first transmitter / receiver substrate 111 and the second transmitter / receiver substrate 112 disposed long, It may include a substrate 113.
  • a plurality of FPGAs 115 may be provided in the first transmission / reception board 111 and the second transmission / reception board 112 to be spaced apart by a predetermined distance in the vertical direction. Therefore, the number of the plurality of rear unit heat sinks 50 coupled to the outside of the rear heat dissipation main body 31 may also be provided to correspond to the number of the FPGA 115 described above.
  • the third transmission and reception board 113 may be mounted with a communication component 116 except for a communication component having a relatively high heat generation, such as the FPGA 115.
  • the first and second transmission and reception boards 111 and 112 are not necessarily provided with only the FPGA 115 or the third and reception boards 113 and the FPGA 115. That is, the FPGA 115 and the remaining communication components 116 except for this may be disposed in a balanced manner on all of the first transmission and reception substrate 111 to the third transmission and reception substrate 113 in consideration of heat dissipation.
  • the FPGA 115 in the case of the FPGA 115 having a relatively high heat generation, the FPGA 115 may be individually radiated by the rear unit radiator 50 described above.
  • the other communication parts 116 except for it is not easy to directly contact the rear heat dissipation main body 31 due to various heights and shapes from the substrate surface.
  • the heat dissipation structure is provided, and the communication grooves 116 other than the FPGA 115 are accommodated as the accommodating grooves 39 formed in the rear heat dissipation main body 31.
  • the rear heat dissipating main body 31 may include an accommodating groove 39 in which a plurality of second heat generating elements of the third transmitting and receiving substrate 113 are accommodated, extending in the vertical direction. Can be.
  • the accommodation groove 39 may be formed to be recessed from the front side of the rear heat dissipation main body 31 to the rear side. Therefore, as shown in FIGS. 9A and 9B, the receiving groove 39 has a rear heat dissipation body 31 on the outer side (rear surface) of the rear heat dissipation body 31 on which the plurality of rear main heat dissipation fins 33 are formed.
  • a heat dissipation exhaust rib 36 recessed to protrude from the inner side toward the outer side may be provided. The shape and specific function of the heat radiation exhaust rib 36 will be described later in detail.
  • heat generated from some of the plurality of second heat generating elements accommodated in the accommodating groove 39 is collected inside the accommodating groove 39 so that the heat dissipating exhaust ribs 36 or the heat dissipating exhaust of the rear heat dissipating main body 31 are collected.
  • the heat may be radiated to the outside through a plurality of rear main heat radiating fins 33 connected to the rib 36.
  • the heat dissipation exhaust ribs 36 may be formed to have a horizontal cross section having a triangle vertex.
  • the plurality of rear main heat dissipation fins 33 may extend to vertices of the heat dissipation exhaust ribs 36.
  • the left heat dissipation fin part 34 of the rear main heat dissipation fin 33 has an upper end extended to the heat dissipation exhaust rib 36
  • the right heat dissipation fin part 35 of the rear main heat dissipation fin 33 has an upper end thereof. It extends to this heat dissipation exhaust rib 36.
  • the heat dissipation air flowing between the rear main heat dissipation fin 33 portions Is moved upward and meets the heat radiation exhaust rib 36, the heat radiation air meeting the heat radiation exhaust rib 36 can be easily exhausted to the outer space while flowing toward the vertex of the triangle.
  • the plurality of antenna elements 13 and the transmit / receive module substrate 110 of the antenna substrate 11 are provided.
  • the apparatus may further include a plurality of RF air lines 100 for signal connecting communication components including a first heating element.
  • the plurality of RF air lines 100 one end may be connected to the rear of the antenna housing 10, the other end may be connected to the front of the front heat dissipation body 21.
  • the communication component including the antenna element 13 of the antenna substrate 11 and the communication component including the RFIC 125 and FPGA 115 of the transmission and reception module substrate 110 Feeding lines can be established between them.
  • Figure 11 is an exploded perspective view showing a coupling state of the mounting bracket of the configuration of Figure 1 and Figures 12a and 12b is a plan view and a side view showing a rotating and tilting state by the horizontal rotating bracket and the vertical rotating bracket of the installation bracket.
  • An embodiment of the multi-input / output antenna apparatus 1 according to the present invention may further include an installation bracket for mediating the installation to the existing antenna mounting support, as shown in FIGS. 1 to 4 and 11. .
  • the mounting bracket includes a heat dissipation bracket 60 coupled to each of the plurality of rear unit heat sinks 50 and a fixed point of the antenna mounting support coupled to the heat dissipation bracket 60.
  • An up and down pivot bracket 70 provided to be rotatable in the up and down direction, a horizontal pivot bracket 80 coupled to the up and down pivot bracket 70 and pivoted in a horizontal direction with respect to a fixed point of the antenna mounting support, Is coupled to the horizontal rotation bracket 80, the other end includes a support fixing bracket 90 is coupled to the antenna installation support.
  • an antenna device 1 compared with an embodiment of the present invention, when the antenna device 1 formed in the vertical direction is provided in the vertical longitudinal direction, the length of the vertical direction is formed long Due to the overall product shape, balanced fixing with only one mounting bracket is virtually impossible.
  • the angle adjustment is required to adjust the wavelength direction irradiated to / from the antenna element 13.
  • the mounting bracket applied to the multiple input / output antenna device 1 has a cantilever shape with respect to the antenna mounting support not shown as shown in FIGS. 1 to 4 and 11.
  • one embodiment of the antenna device 1 can be fixed.
  • the angle adjustment of the above-described antenna device 1 is possible by rotating the upper and lower rotating brackets 70, the horizontal rotating brackets 80, and the support fixing brackets 90, respectively, of the mounting brackets.
  • the horizontal pivot bracket 80 is horizontally rotated in the horizontal direction.
  • the horizontal angle can be adjusted.
  • the vertical tilt bracket 70 can be vertically rotated in the vertical direction with respect to the horizontal pivot bracket 80.
  • the heat dissipation bracket 60 is formed in a ring shape, as shown in Figure 11, on the outer surface of the mounting ring 61 and the mounting ring 61 for providing an installation surface of the vertical pivot bracket 70.
  • the mounting ring portion 61 is located at the rear center portion of the rear heat dissipation main body 31 for the overall weight balance of the antenna device 1. Can be located.
  • a plurality of residual heat radiation fins 64 are formed on the outer surface of the fixing portion 63 to dissipate heat transferred from the plurality of rear unit heat sinks 50, as referred to the enlarged view of FIG. 11. Can be.
  • the plurality of residual heat radiating fins 64 may effectively radiate heat from the rear unit radiator 50 transferred to the second heat generating element by increasing the surface areas of the plurality of fixing parts 63.
  • the vertical rotation bracket 70 may be formed with a vertical guide slot 71 for guiding the vertical rotation.
  • the upper and lower guide slots 71 are connected to each other so that the front end portions of the horizontal rotation brackets 80 are combined with each other, and the upper and lower guide slots 71 allow the vertical movement of the vertical rotation brackets 70 with respect to the horizontal rotation brackets 80. It serves as a guide.
  • the holding fixing bracket 90 may be formed with a horizontal guide slot 91 for guiding the horizontal rotation.
  • the rear end portions of the horizontal rotation brackets 80 are connected to the horizontal guide slots 91 so that the rear ends thereof are combined with each other, and the horizontal guide slots 91 horizontally move the horizontal rotation brackets 80 with respect to the prop fixing bracket 90. It serves as a guide.
  • the present invention includes an antenna substrate having a plurality of antenna elements arranged on a front surface thereof, a plurality of first heat generating elements generated by electric driving on a front surface thereof, and a plurality of second heat generating elements generated by electric driving on a rear surface of the antenna board.
  • a multiple input / output antenna device including a transmission / reception module substrate disposed to have a spaced distance from the substrate.

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Abstract

The present invention relates to a multiple input and multiple output antenna apparatus, and more particularly to a multiple input and multiple output antenna apparatus which includes: an antenna substrate in which a plurality of antenna elements are arrayed on the front face; and a transmission/reception module substrate arranged to have a separation space with respect to the antenna substrate, and provided with a plurality of first heating elements, which are heated by being electrically driven, on the front face and a plurality of second heating elements, which are heated by being electrically driven, on the rear face, wherein the heat given off by the plurality of first heating elements is dissipated toward the front of the transmission/reception module substrate, and the heat given off by the plurality of second heating elements is dissipated toward the rear of the transmission/reception module substrate. Accordingly, the present invention provides the advantage of maximizing heat dissipation performance.

Description

다중 입출력 안테나 장치Multiple input and output antenna device

본 발명은 다중 입출력 안테나 장치(MULTI INPUT AND MULTI OUTPUT ANTENNA APPARATUS)에 관한 것으로서, 보다 상세하게는 무선 통신용 다중 입출력 안테나 장치에 관한 것이다.The present invention relates to a multiple input and output antenna device (MULTI INPUT AND MULTI OUTPUT ANTENNA APPARATUS), and more particularly to a multiple input and output antenna device for wireless communication.

무선 통신 기술, 예를 들어, MIMO(Multiple Input Multiple Output) 기술은, 다수의 안테나를 사용하여 데이터 전송용량을 획기적으로 늘리는 기술로서, 송신기에서는 각각의 송신 안테나를 통해 서로 다른 데이터를 전송하고, 수신기에서는 적절한 신호처리를 통해 송신 데이터들을 구분해 내는 Spatial multiplexing 기법이다.Wireless communication technology, for example, multiple input multiple output (MIMO) technology is a technology that significantly increases the data transmission capacity by using a plurality of antennas, the transmitter transmits different data through each transmission antenna, and the receiver Is a spatial multiplexing technique that separates transmission data through proper signal processing.

따라서, 송수신 안테나의 개수를 동시에 증가시킴에 따라 채널 용량이 증가하여 보다 많은 데이터를 전송할 수 있게 한다. 예를 들어 안테나 수를 10개로 증가시키면 현재의 단일 안테나 시스템에 비해 같은 주파수 대역을 사용하여 약 10배의 채널 용량을 확보하게 된다.Therefore, as the number of transmit / receive antennas is increased at the same time, the channel capacity increases to allow more data to be transmitted. For example, if you increase the number of antennas to 10, you get about 10 times the channel capacity using the same frequency band compared to the current single antenna system.

4G LTE-advanced에서는 8개의 안테나까지 사용하고 있으며, 현재 pre-5G 단계에서 64 또는 128개의 안테나를 장착한 제품이 개발되고 있고, 5G에서는 훨씬 더 많은 수의 안테나를 갖는 기지국 장비가 사용될 것으로 예상되며, 이를 Massive MIMO 기술이라고 한다. 현재의 Cell 운영이 2-Dimension인데 반해 Massive MIMO 기술이 도입되면 3D-Beamforming이 가능해지므로 FD-MIMO(Full Dimension)라고도 부른다.4G LTE-advanced uses up to 8 antennas. Currently, products with 64 or 128 antennas are being developed in the pre-5G phase, and base station equipment with a much larger number of antennas is expected to be used in 5G. This is called Massive MIMO technology. Although the current cell operation is 2-Dimension, 3D-Beamforming is possible when Massive MIMO technology is introduced, so it is also called FD-MIMO (Full Dimension).

Massive MIMO 기술에서는 ANT의 숫자가 늘어나면서 이에 따른 transmitter와 Filter의 숫자도 함께 증가한다. 그럼에도 설치장소의 리스비용이나 공간적인 제약으로 인해, RF 부품(Antenna/Filter/Power Amplifier/Transceiver etc.)을 작고 가벼우며, 값싸게 만드는 것이 Massive MIMO는 Coverage 확장을 위해서는 고출력이 필요한데, 이러한 고출력으로 인한 소모전력과 발열량은 무게 및 사이즈를 줄이는데 부정적인 요인으로 작용한다.In Massive MIMO technology, as the number of ANTs increases, so does the number of transmitters and filters. Nevertheless, due to the lease cost or space constraints of the installation site, making RF components (Antenna / Filter / Power Amplifier / Transceiver etc.) small, light and inexpensive makes Massive MIMO require high power for coverage expansion. Power consumption and heat generation due to this negatively affects the weight and size reduction.

특히, RF 소자들과 디지털 소자들이 구현된 모듈들이 적층 구조로 결합된 MIMO 안테나를 한정된 공간에 설치시, 설치용이성이나 공간 활용성을 극대화하기 위해 MIMO 안테나를 구성하는 복수의 레이어에 대한 컴팩트화 및 소형화 설계의 필요성이 대두되고, 이 경우 복수의 레이어에 실장된 통신부품에서 발생하는 열에 대한 새로운 방열 구조에 관한 설계가 요구된다.In particular, when installing a MIMO antenna combined with a multilayer structure in which RF elements and digital elements are implemented in a limited space, the compactness of a plurality of layers constituting the MIMO antenna for maximizing installation ease and space utilization and There is a need for a miniaturized design, and in this case, a design regarding a new heat dissipation structure for heat generated from a communication component mounted in a plurality of layers is required.

본 발명의 목적은, 고출력을 실현할 수 있고 방열 특성이 우수한 다중 입출력 안테나 장치를 제공함에 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a multiple input / output antenna device capable of realizing high output and excellent heat dissipation characteristics.

상기의 목적을 달성하기 위한 본 발명의 일 실시예에 따른 다중 입출력 안테나 장치는, 전면에 다수의 안테나 소자가 배열된 안테나 기판 및 전면에 전기적 구동에 의하여 발열되는 다수의 제1 발열소자 및 후면에 전기적 구동에 의하여 발열되는 다수의 제2 발열소자가 구비되고, 상기 안테나 기판에 대하여 이격 공간을 가지도록 배치된 송수신 모듈 기판을 포함하고, 상기 다수의 제1 발열소자로부터 발열된 열은 상기 송수신 모듈 기판의 전방으로 방열되고, 상기 다수의 제2발열소자로부터 발열된 열은 상기 송수신 모듈 기판의 후방으로 방열된다.According to an embodiment of the present invention, there is provided a multiple input / output antenna apparatus including: an antenna substrate having a plurality of antenna elements arranged on a front surface thereof, and a plurality of first heat generating elements generated by electric driving on a front surface thereof, and a rear surface thereof. A plurality of second heat generating elements are generated by electrical driving, and includes a transceiver module substrate disposed to have a spaced space with respect to the antenna substrate, wherein the heat generated from the plurality of first heat generating elements is The heat is radiated to the front of the substrate, and heat generated from the plurality of second heat generating elements is radiated to the rear of the transmission / reception module substrate.

본 발명에 따르면, 발열량이 많은 발열소자를 선택적으로 집중하여 외부로 보다 효율적인 방열 성능을 가지도록 방열할 수 있는 효과를 가짐은 물론, 제품을 소형화함으로써 5G 다중 입출력 안테나 장치의 추가 설치가 용이한 효과를 가진다.According to the present invention, by selectively concentrating the heat generating element with a large amount of heat generation has the effect of heat dissipation to have a more efficient heat dissipation performance to the outside, as well as the miniaturization of the product, it is easy to install additional 5G multiple input and output antenna device Has

도 1 및 도 2는 본 발명의 일 실시예에 따른 다중 입출력 안테나 장치의 전방부 및 후방부를 나타낸 사시도이고,1 and 2 are perspective views illustrating a front part and a rear part of a multiple input / output antenna device according to an embodiment of the present invention;

도 3 및 도 4는 도 1 및 도 2의 다중 입출력 안테나 장치의 전방부 분해 사시도 및 후방부 분해 사시도이며,3 and 4 are exploded front and rear exploded perspective views of the multi-input and output antenna device of Figures 1 and 2,

도 5a 및 도 5b는 본 발명에 따른 다중 입출력 안테나 장치의 구성 중 일측 방열부 및 타측 방열부를 나타낸 전방부 분해 사시도 및 후방부 분해 사시도이고,5A and 5B are front exploded perspective views and rear exploded perspective views illustrating one heat dissipation part and the other heat dissipation part of a multi-input / output antenna device according to the present invention;

도 6 내지 도 8은 본 발명에 따른 다중 입출력 안테나 장치의 전방 및 후방으로의 방열 모습을 설명하기 위한 다양한 부위의 단면도를 나타낸 것이며,6 to 8 are cross-sectional views of various parts for explaining the heat radiation to the front and rear of the multiple input and output antenna device according to the present invention,

도 9a 및 도 9b는 본 발명에 따른 다중 입출력 안테나 장치의 구성 중 BB board 및 그 방열구조를 나타낸 전방부 및 후방부 분해 사시도이며,9A and 9B are exploded perspective views of the front and rear parts of the BB board and its heat dissipation structure among the multiple input / output antenna devices according to the present invention;

도 10은 도 9a의 결합된 상태에서의 D-D선을 따라 취한 단면도 및 그 부분 확대도이고,10 is a cross-sectional view taken along line D-D in the coupled state of FIG. 9A and a partial enlarged view thereof;

도 11은 도 1의 구성 중 설치 브라켓의 결합 모습을 나타낸 분해 사시도이며,11 is an exploded perspective view showing a coupling state of the installation bracket of the configuration of Figure 1,

도 12a 및 도 12b는 설치 브라켓의 구성 중 수평 회동 브라켓과 상하 회동 브라켓에 의한 로테이팅 및 틸팅 모습을 나타낸 평면도 및 측면도이다.12A and 12B are a plan view and a side view showing a rotating and tilting state by a horizontal rotating bracket and a vertical rotating bracket of the installation bracket.

<부호의 설명> <Description of the code>

1: 다중 입출력 안테나 장치 5: 레이돔1: multiple input / output antenna device 5: radome

10: 안테나 하우징 11: 안테나 기판10: antenna housing 11: antenna substrate

13: 안테나 소자 20: 전방 방열부13: antenna element 20: front heat dissipation unit

21: 전방 방열 본체 23: 전방 메인 방열 핀21: Front heat dissipation body 23: Front main heat dissipation fin

30: 후방 방열부 31: 후방 방열 본체30: rear heat dissipation unit 31: rear heat dissipation main body

33: 후방 메인 방열 핀 36: 방열 배기 리브33: rear main heat dissipation fin 36: heat dissipation exhaust rib

37: 결합홀 39: 수용 홈부37: coupling hole 39: receiving groove

40: 전방 단위 방열체 50: 후방 단위 방열체40: front unit radiator 50: rear unit radiator

60: 방열 브라켓 61: 설치링부60: heat dissipation bracket 61: mounting ring

63: 고정부 64: 잔여열 방열핀63: fixing portion 64: residual heat radiating fin

70: 상하 회동 브라켓 80: 수평 회동 브라켓70: vertical rotating bracket 80: horizontal rotating bracket

90: 지주 고정 브라켓 100: RF 에어 라인90: holding fixing bracket 100: RF air line

110: 송수신 모듈 기판 115: FPGA110: transceiver module board 115: FPGA

116: 나머지 통신부품116: remaining communication parts

이하, 본 발명의 다중 입출력 안테나 장치의 일 실시예를 첨부된 도면을 참조하여 상세하게 설명한다.Hereinafter, an embodiment of a multiple input / output antenna device of the present invention will be described in detail with reference to the accompanying drawings.

도 1 및 도 2는 본 발명의 일 실시예에 따른 다중 입출력 안테나 장치의 전방부 및 후방부를 나타낸 사시도이고, 도 3 및 도 4는 도 1 및 도 2의 안테나 장치의 전방부 분해 사시도 및 후방부 분해 사시도이다.1 and 2 are perspective views showing the front and rear portions of the multi-input and output antenna device according to an embodiment of the present invention, Figures 3 and 4 are an exploded perspective view and a rear portion of the front portion of the antenna device of Figures 1 and 2 Exploded perspective view.

본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예는 미도시의 전원 공급 모듈로부터 전원을 공급받을 수 있고, 내장된 무선 송수신 모듈을 통해 외부 단말 또는 기지국들과 무선 통신할 수 있다. 본 발명의 일 실시예에 따른 안테나 장치(1)는 MIMO(Multi Input Multi Output) 무선 통신 안테나 시스템과 관련된다.An embodiment of the multi-input / output antenna apparatus 1 according to the present invention may be supplied with power from a power supply module (not shown), and may wirelessly communicate with an external terminal or base stations through a built-in wireless transmission / reception module. The antenna device 1 according to an embodiment of the present invention is related to a MIMO (Multi Input Multi Output) wireless communication antenna system.

보다 상세하게는, 본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예는, 전면에 다수의 안테나 소자(13)가 배열된 안테나 기판(11)과, 전면에 전기적 구동에 의하여 발열되는 다수의 제1 발열소자 및 후면에 전기적 구동에 의하여 발열되는 다수의 제2 발열소자가 구비되고, 안테나 기판(11)에 대하여 이격 공간을 가지도록 배치된 송수신 모듈 기판(110)을 포함한다.More specifically, one embodiment of the multi-input and output antenna device 1 according to the present invention, the antenna substrate 11 having a plurality of antenna elements 13 arranged on the front surface, and a plurality of heat generated by electrical driving on the front surface A first heating element and a plurality of second heating elements are generated on the rear surface by electrical driving, and includes a transmission and reception module substrate 110 disposed to have a spaced space with respect to the antenna substrate (11).

이하에서는, 본 발명을 이해함에 있어서 혼선을 방지하기 위해, 후술하는 안테나 설치 지주가 구비된 방향은 '후방'이라 정의하고, 반대로 후술하는 레이돔(5)이 구비된 방향을 '전방'이라 정의하며, 안테나 설치 지주에 실질적으로 본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예가 고정된 것으로 가정하여 각 방향을 정의하여 설명하기로 한다. 다만, 이는 설명의 편의 및 이해의 혼선을 방지하기 위함일 뿐 이로 인해 본 발명의 권리범위가 제한되어서는 아니 될 것이다.Hereinafter, in order to prevent crosstalk in understanding the present invention, the direction in which the antenna mounting posts to be described later is defined as 'rear', and the direction in which the radome 5 to be described below is defined as 'forward'. On the assumption that an embodiment of the multi-input / output antenna device 1 according to the present invention is fixed to the antenna mounting support, each direction will be defined and described. However, this is only to prevent the confusion of convenience and understanding of the description, and thus the scope of the present invention should not be limited.

안테나 기판(11)은, 도 1 내지 도 4에 참조된 바와 같이, 안테나 하우징(10) 내부에 수용되되, 안테나 기판(11)에 수용된 안테나 소자(13)가 전방으로 노출되게 수용 배치된다. 안테나 기판(11)에 실장되는 통신부품은 상기 다수의 안테나 소자(13) 뿐만 아니라 멀티밴드필터(Multi-Band Filter : MBF)도 실장될 수 있다.As shown in FIGS. 1 to 4, the antenna substrate 11 is accommodated in the antenna housing 10, and accommodated so that the antenna element 13 accommodated in the antenna substrate 11 is exposed to the front. The communication component mounted on the antenna substrate 11 may include not only the plurality of antenna elements 13 but also a multi-band filter (MBF).

안테나 기판(11)의 전방부에는, 레이돔(5)이 커버링하도록 배치될 수 있다.이와 같은 레이돔(5)은 안테나 소자(13)들로부터 또는 안테나 소자(13)로 전파되는 무선 신호가 투과되는 재질로 이루어질 수 있고, 예를 들어, 전기 절연성 플라스틱으로 이루어질 수 있다.In the front portion of the antenna substrate 11, the radome 5 may be arranged to cover. Such a radome 5 is a radio signal propagated from the antenna elements 13 or to the antenna element 13 is transmitted. It may be made of a material, for example, may be made of an electrically insulating plastic.

본 발명의 일 실시예에 따른 다중 입출력 안테나 장치(1)에서는, 레이돔(5)이 최전방에 구비되는 것으로 정의하여 설명하기로 한다.In the multiple input / output antenna device 1 according to an embodiment of the present invention, the radome 5 will be defined as being provided at the forefront.

한편, 레이돔(5)과 안테나 하우징(10)의 사이즈는 거의 동일하게 형성되되, 안테나 하우징(10)에 수용되는 안테나 기판(11)에 대비되는 비율로 형성될 수 있다. 바람직하게는, 본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예에서는, 5G에서 추가로 후술하는 안테나 설치 지주에 설치될 때 상하 길이에 의한 기 설치된 또는 추후 설치되어야 할 다른 안테나 장치(1)와의 설치 간섭이 줄어들도록 안테나 기판(11)은 상하 폭의 길이보다 좌우 폭의 길이가 더 큰 장방형으로 형성될 수 있다.On the other hand, the size of the radome 5 and the antenna housing 10 is formed almost the same, it may be formed in a ratio compared to the antenna substrate 11 accommodated in the antenna housing 10. Preferably, in one embodiment of the multi-input / output antenna device 1 according to the present invention, another antenna device 1 which is to be installed by the vertical length or to be installed later when installed in the antenna installation support further described later in 5G. The antenna substrate 11 may be formed in a rectangular shape in which the length of the left and right widths is larger than the length of the upper and lower widths so as to reduce installation interference with the antenna.

도 1 내지 도 4에 참조된 바와 같이, 본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예는, 안테나 어셈블리가 RF 소자들과 디지털 소자들이 구현된 모듈들이 각각 적층 구조로 결합된 형태를 취한다. 예시된 안테나 어셈블리의 주요 모듈들은 3개의 레이어(Layer)로 구분될 수 있다.1 to 4, an embodiment of the multiple input / output antenna device 1 according to the present invention has a form in which an antenna assembly is a combination of RF elements and modules in which digital elements are implemented in a stacked structure. Take it. The main modules of the illustrated antenna assembly can be divided into three layers.

제1레이어인 상기 안테나 기판(11)에는 캘리브레이션 네트워크가 구현된 인쇄회로기판(Printed Circuit Board: PCB)로서, 전면에 다수의 안테나 소자(13)가 배치되고, 후면에 다수의 멀티밴드 필터(Multi-Band Filter:MBF)가 실장될 수 있다.The first substrate is a printed circuit board (PCB) in which a calibration network is implemented, and a plurality of antenna elements 13 are disposed on a front surface of the antenna substrate 11 and a plurality of multiband filters on a rear surface of the antenna substrate 11. Band Filter (MBF) can be implemented.

한편, 제2레이어인 송수신 모듈 기판(110)은, 제1레이어와의 사이에 상술한 소정의 이격 공간을 가지도록 신호 결합될 수 있다. 송수신 모듈 기판(110)의 전면에는 상술한 다수의 안테나 소자(13)와 신호 연결된 다수의 RFIC(125)가 실장될 수 있다. 여기서, 다수의 RFIC(125)를 포함하는 다수의 통신부품들은 전기적으로 작동될 때 소정의 열을 발생시키는 발열소자로서 여기서는 '다수의 제1 발열소자'로 정의할 수 있다.Meanwhile, the transmission / reception module substrate 110, which is the second layer, may be signal-coupled to have the above-described predetermined separation space between the first layer and the transmission / reception module substrate 110. A plurality of RFICs 125 connected to the plurality of antenna elements 13 may be mounted on the front surface of the transmission / reception module substrate 110. Here, the plurality of communication components including the plurality of RFICs 125 may be defined as 'a plurality of first heating elements' as heat generating elements that generate predetermined heat when electrically operated.

아울러, 송수신 모듈 기판(110)의 후면에는 아날로그/디지털 변환기로부터 변환된 디지털 신호를 제공받아 기저대역 신호로 변환하는 등 디지털 신호 처리 동작을 수행하는 다수의 FPGA(115)가 실장될 수 있다. 또한, 송수신 모듈 기판(110)의 후면에는 파워 증폭기(Power Amplifier: PA) 등의 아날로그 프로세싱 회로가 구현되고, 아날로그 프로세싱 회로에 포함된 각 파워 증폭기는 상술한 MBF들과 RF 인터페이스를 통해 전기적으로 연결될 수 있다. 그리고, 송수신 모듈 기판(110)의 후면에는 디지털 프로세싱 회로가 구현될 수 있고, 파워 서플라이 유닛(PSU)이 실장될 수 있다. 디지털 프로세싱 회로는, 기지국 BBU(Base Band Unit)로부터 수신되는 디지털 신호를 아날로그 RF 신호로 변환하고 안테나에서 수신되는 아날로그 RF 신호를 디지털 신호로 변환하여 기지국 BBU에 전송하는 기능을 수행한다.In addition, a plurality of FPGAs 115 that perform digital signal processing operations, such as receiving a digital signal converted from an analog / digital converter and converting it into a baseband signal, may be mounted on the rear surface of the transmission / reception module substrate 110. In addition, an analog processing circuit such as a power amplifier (PA) is implemented on the back of the transmission / reception module substrate 110, and each power amplifier included in the analog processing circuit may be electrically connected to the aforementioned MBFs through an RF interface. Can be. In addition, a digital processing circuit may be implemented on the rear surface of the transmission / reception module substrate 110 and a power supply unit PSU may be mounted. The digital processing circuit converts a digital signal received from a base station base band unit (BBU) into an analog RF signal, converts an analog RF signal received from an antenna into a digital signal, and transmits the digital signal to the base station BBU.

여기서, 다수의 FPGA(115) 및 파워 서플라이 유닛은 상기한 다수의 제1 발열소자와 마찬가지로 전기적으로 작동될 때 소정의 열을 발생시키는 발열소자로서 이하 '다수의 제2 발열소자'로 정의할 수 있다.Here, the plurality of FPGAs 115 and the power supply unit, like the plurality of first heating elements described above, may be defined as 'a plurality of second heating elements' as heat generating elements that generate predetermined heat when they are electrically operated. have.

본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예에서는, 안테나 기판(11)의 전체 형상에서 상하 폭을 줄이도록 설계함으로써 5G에서의 추가적인 안테나 장치(1)의 설치가 용이하게 하는 이점을 제공한다.In one embodiment of the multi-input / output antenna device 1 according to the present invention, it is designed to reduce the top and bottom widths in the overall shape of the antenna substrate 11, thereby facilitating the installation of the additional antenna device 1 in 5G. to provide.

또한, 본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예에서는, 송수신 모듈 기판(110)에 집적된 각종 통신부품들을 방열이 용이하도록 송수신 모듈 기판(110)의 전면 및 후면에 분산 배치하되, 송수신 모듈 기판(110)의 전면에 구비된 제1 발열소자로부터 발열된 열은 송수신 모듈 기판(110)의 전방으로 방열시키고, 송수신 모듈 기판(110)의 후면에 구비된 제2 발열소자로부터 발열된 열은 송수신 모듈 기판(110)의 후방으로 방열시키도록 구성된다.In addition, in an embodiment of the multi-input / output antenna device 1 according to the present invention, various communication components integrated in the transmit / receive module substrate 110 are distributedly disposed on the front and rear surfaces of the transmit / receive module substrate 110 to facilitate heat dissipation. The heat generated from the first heat generating element provided on the front side of the transmit / receive module substrate 110 radiates heat toward the front of the transmit / receive module substrate 110, and generates heat from the second heat generating element provided on the back side of the transmit / receive module substrate 110. The heat is configured to dissipate to the rear of the transmission / reception module substrate 110.

특히, 송수신 모듈 기판(110)의 전면의 제1 발열소자로부터 발열된 열을 그 전방부에 배치된 안테나 소자(13)와의 영향을 최소화할 수 있도록 안테나 기판(11)과 송수신 모듈 기판(110)은 상술한 바와 같이 소정의 이격 공간을 가지도록 배치하고, 상기 이격 공간으로 제1 발열소자로부터 발열된 열을 방열시킬 수 있다.In particular, the antenna substrate 11 and the transmit / receive module substrate 110 may minimize the influence of heat generated from the first heat generating element on the front surface of the transmit / receive module substrate 110 with the antenna element 13 disposed at the front thereof. As described above, it may be arranged to have a predetermined space, and may radiate heat generated from the first heat generating element to the space.

도 5a 및 도 5b는 본 발명에 따른 다중 입출력 안테나 장치의 구성 중 일측 방열부 및 타측 방열부를 나타낸 전방부 분해 사시도 및 후방부 분해 사시도이고, 도 6은도 1의 A-A선을 따라 취한 단면도이며, 도 7은 도 1의 B-B선을 따라 취한 단면도이고, 도 8은 도 1의 C-C선을 따라 취한 단면도이다. 5A and 5B are front exploded perspective views and rear exploded perspective views showing one side heat dissipation part and the other side heat dissipation part in the configuration of the multi-input / output antenna device according to the present invention, and FIG. 6 is a cross-sectional view taken along line AA of FIG. 7 is a cross-sectional view taken along line BB of FIG. 1, and FIG. 8 is a cross-sectional view taken along line CC of FIG. 1.

본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예는, 도 5a 및 도 5b에 참조된 바와 같이, 안테나 기판(11)과 송수신 모듈 기판(110)은 이격 공간에 배치된 전방 방열부(20)에 의하여 구획될 수 있다. 여기서, 전방 방열부(20)는, 금속 재질로 구비될 수 있다. 이와 같이 전방 방열부(20)가 금속 재질로 구비되는 경우, 송수신 모듈 기판(110)에 구비된 다수의 통신부품들과 전방의 안테나 기판(11)에 배치된 다수의 안테나 소자(13) 사이의 전파로부터의 영향을 최소화할 수 있다.In an embodiment of the multiple input / output antenna device 1 according to the present invention, as shown in FIGS. 5A and 5B, the antenna substrate 11 and the transmission / reception module substrate 110 may include a front heat dissipation unit disposed in a space. 20) can be partitioned. Here, the front heat dissipation unit 20 may be provided with a metal material. As described above, when the front heat dissipation unit 20 is made of a metal material, a plurality of communication components provided on the transmission / reception module substrate 110 and a plurality of antenna elements 13 disposed on the front antenna substrate 11 may be used. The effects from propagation can be minimized.

한편, 본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예는, 도 5a 및 도 5b에 참조된 바와 같이, 송수신 모듈 기판(110)의 외측에는 후방 방열부(30)가 커버링하도록 배치될 수 있다. 따라서, 송수신 모듈 기판(110)은, 전면 측에 구비된 제1 발열소자와 접촉되도록 전방 방열부(20)가 배치되고, 후면 측에 구비된 제2 발열소자와 접촉되도록 후방 방열부(30)가 배치될 수 있다.Meanwhile, in an embodiment of the multi-input / output antenna device 1 according to the present invention, as shown in FIGS. 5A and 5B, the rear heat dissipation unit 30 may be disposed outside the transmission / reception module substrate 110 to cover the same. Can be. Therefore, the front and rear heat dissipation unit 20 is disposed in contact with the first heat generating element provided at the front side, and the rear heat dissipation unit 30 is in contact with the second heat generating element provided at the rear side. Can be arranged.

여기서, 전방 방열부(20)는, 이격 공간에 배치될 수 있다. 이와 같이 전방 방열부(20)는 이격 공간에 배치됨으로써, 안테나 기판(11)과 송수신 모듈 기판(110) 사이의 이격된 공간인 이격 공간 그 자체를 채우도록 구비될 수 있다. 그러나, 이격 공간 전부를 채우는 것은 실질적으로 전방 방열부(20)의 방열에 관여할 수 있는 외부 공기의 유입을 차단하게 되어 방열 성능이 저하될 수 있으므로, 전방 방열부(20)의 전단과 안테나 기판(11)이 수용된 안테나 하우징(10) 사이가 어느 정도 이격되도록 구비됨이 바람직하다.Here, the front heat dissipation unit 20 may be disposed in the separation space. As described above, the front heat dissipation unit 20 may be disposed in a spaced space, and may be provided to fill the spaced space itself, which is a spaced space between the antenna substrate 11 and the transceiver module substrate 110. However, filling all of the separation space substantially blocks the inflow of external air that may be involved in the heat radiation of the front heat dissipation unit 20, and thus the heat dissipation performance may be deteriorated. It is preferable that the antenna housing 10 in which the 11 is accommodated is spaced to some extent.

후방 방열부(30)는, 송수신 모듈 기판(110)을 중심으로 상술한 이격 공간과 대향되는 외측 공간에 배치될 수 있다. 즉, 후방 방열부(30)는, 송수신 모듈 기판(110)의 타면을 완전 커버링하도록 배치될 수 있다.The rear heat dissipation unit 30 may be disposed in an outer space facing the above-described spaced space with respect to the transmission / reception module substrate 110. That is, the rear heat dissipation unit 30 may be disposed to completely cover the other surface of the transmission / reception module substrate 110.

전방 방열부(20)는, 도 5a 및 도 7에 참조된 바와 같이, 송수신 모듈 기판(110)의 전면이 밀착되도록 배치되고, 전방으로 다수의 메인 방열 핀(23)이 돌출되게 구비된 전방 방열 본체(21)와, 전방 방열 본체(21)를 관통하도록 배치되고, 일단부가 송수신 모듈 기판(110)의 제1 발열소자 중 적어도 일부와 밀착되며, 타단부에 제1 발열소자로부터 전도된 열을 외부로 방열시키는 다수의 서브 방열 핀(43)이 구비된 다수의 전방 단위 방열체(40)를 포함할 수 있다.5A and 7, the front heat dissipation unit 20 is disposed so that the front surface of the transmission / reception module substrate 110 is in close contact, and the front heat dissipation provided with a plurality of main heat dissipation fins 23 protruding forward. It is disposed to penetrate through the main body 21 and the front heat dissipation main body 21, one end is in close contact with at least a portion of the first heat generating element of the transmission and reception module substrate 110, and the other end of the heat conducted from the first heat generating element It may include a plurality of front unit radiator 40 provided with a plurality of sub-radiation fins 43 for radiating to the outside.

이하에서는, 후술하는 후방 방열부(30)의 각 구성과의 구별을 위하여, 전방 방열 본체(21)에 구비된 '메인 방열 핀'은 '전방 메인 방열 핀(23)'으로 구분하여 칭하고, 전방 단위 방열체(40)에 구비된 '서브 방열 핀'은 '전방 서브 방열 핀(43)'으로 구분하여 칭한다.In the following description, the main heat dissipation fins provided in the front heat dissipation main body 21 are referred to as the front main heat dissipation fins 23 for the purpose of distinguishing the respective components of the rear heat dissipation unit 30 to be described later. The 'sub heat dissipation fin' provided in the unit heat dissipator 40 is referred to as a 'front sub heat dissipation fin 43'.

다수의 전방 메인 방열 핀(23)은, 제1 발열소자들로부터 전방 방열 본체(21)로 전달된 열을 유입되는 외부 공기와 열교환하여 방열시키는 역할을 한다. 따라서, 전방 방열 본체(21)는 열전도가 용이한 금속 재질로 구비됨과 아울러, 다수의 전방 메인 방열 핀(23) 또한 열전도가 용이한 금속 재질로 구비될 수 있다.The plurality of front main heat dissipation fins 23 serves to heat-dissipate heat transferred from the first heat generating elements to the front heat dissipation main body 21 by heat exchange with the incoming outside air. Therefore, the front heat dissipation main body 21 may be provided with a metal material that is easy to conduct heat, and the plurality of front main heat dissipation fins 23 may also be provided with a metal material that is easy to conduct heat.

여기서의 다수의 전방 메인 방열 핀(23)은, 전방 방열 본체(21)의 전면에 형성될 수 있고, 예를 들어 전방 방열 본체(21)와 일체로 성형될 수 있다. 그러나, 본 발명은 이에 한정되지 않으며, 다수의 전방 메인 방열 핀(23)은, 별도의 부재로서 제작되어 전방 방열 본체(21)의 전면 상에 열전도성 접착제로 접착되거나, 또는 볼트와 같은 별도 체결부재로 고정될 수 있다.The plurality of front main heat dissipation fins 23 may be formed on the front surface of the front heat dissipation main body 21, and may be integrally formed with the front heat dissipation main body 21, for example. However, the present invention is not limited thereto, and the plurality of front main heat dissipation fins 23 are manufactured as a separate member and adhered to the front surface of the front heat dissipation main body 21 with a thermally conductive adhesive, or separately fastened such as bolts. It can be fixed by a member.

한편, 다수의 전방 단위 방열체(40)는, 다수의 제1 발열소자, 특히 후술하는 바와 같이, 다수의 안테나 소자(13)들과 신호 연결된 RFIC(125)로부터 발열되는 전방 방열 본체(21)와는 별개로 상술한 이격 공간으로 방열시키는 역할을 한다.On the other hand, the plurality of front unit radiators 40, the front heat dissipation main body 21 that generates heat from a plurality of first heat generating elements, in particular, the RFIC 125 connected to the plurality of antenna elements 13, as will be described later Apart from and serves to dissipate heat to the above-described separation space.

본 발명의 일 실시예에 따른 다중 입출력 안테나 장치(1)는, 특히 제1 발열소자들 중 발열량이 많은 통신부품 중 RFIC(125)로부터 발열된 열을 개별적으로 방열시키는 구조를 채택한다. 이로써, 전방 방열 본체(21)의 방열 성능과는 무관하게 다수의 RFIC(125)로부터 발열된 열을 보다 신속하게 방열할 수 있다.The multi-input / output antenna device 1 according to the embodiment of the present invention particularly adopts a structure for individually radiating heat generated from the RFIC 125 among the communication components having a large amount of heat generation among the first heating elements. As a result, regardless of the heat dissipation performance of the front heat dissipation main body 21, heat generated from the plurality of RFICs 125 can be quickly dissipated.

한편, 전방 방열 본체(21)의 전면에 형성된 다수의 전방 메인 방열 핀(23)은, 상측을 향하여 경사지게 배치될 수 있다. 즉, 도 5a 및 도 5b의 도면상 본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예는 상하방향으로 배치되는데, 이격 공간으로 외부 공기가 용이하게 유입되도록 다수의 전방 메인 방열 핀(23)은 상하 방향으로의 공기 유로를 가지도록 형성되는 것이 선호된다. 나아가, 본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예는, 상기 이격 공간으로의 외부 공기 유입량이 더 증가하도록 다수의 전방 메인 방열 핀(23)이 상향 경사지게 배치되어, 전방 방열 본체(21)의 하측 뿐만 아니라 측부에서도 외부 공기의 유입이 용이하다.Meanwhile, the plurality of front main heat dissipation fins 23 formed on the front surface of the front heat dissipation main body 21 may be disposed to be inclined upward. That is, in the drawings of FIGS. 5A and 5B, one embodiment of the multi-input / output antenna device 1 according to the present invention is disposed in the vertical direction, and the plurality of front main heat dissipation fins 23 so that external air is easily introduced into the space. ) Is preferably formed to have an air flow path in the vertical direction. Furthermore, in an embodiment of the multiple input / output antenna device 1 according to the present invention, the front main heat dissipation fins 23 are disposed to be inclined upward so that the external air inflow into the separation space is further increased. It is easy to inflow of outside air from the side as well as the bottom of 21).

이와 같은 다수의 전방 메인 방열 핀(23)은, 도면상 좌측에서 전방 방열 본체(21)의 상하 중심선을 향하여 상향 경사지게 배치된 좌측 방열핀부 및 우측에서 전방 방열 본체(21)의 상하 중심선을 향하여 상향 경사지게 배치된 우측 방열핀부를 포함할 수 있다.Such a plurality of front main heat dissipation fins 23 are upwardly directed toward the upper and lower center lines of the front heat dissipation main body 21 from the left side and the right side of the heat dissipation fin portion disposed inclined upward toward the vertical center line of the front heat dissipation main body 21 on the left side of the drawing. It may include a right heat radiation fin portion disposed inclined.

즉, 다수의 전방 메인 방열 핀(23)은, 좌측 방열핀부 및 우측 방열핀부의 2그룹으로 형성되되, 전방 방열 본체(21)의 좌측부로부터는 좌측 방열핀부를 통하여 외부 공기가 유입되어 유동되되 전방 방열 본체(21)의 전면 가운데 방향으로 상향 유동되고, 전방 방열 본체(21)의 우측부로부터는 우측 방열핀부를 통하여 외부 공기가 유입되어 유동되되 전방 방열 본체(21)의 전면 가운데 방향으로 상향 유동된다.That is, the plurality of front main heat dissipation fins 23 is formed of two groups of the left heat dissipation fin part and the right heat dissipation fin part, and outside air flows through the left heat dissipation fin part from the left side of the front heat dissipation main body 21 and flows to the front heat dissipation main body. The air flows upward toward the front center of the front surface 21, and outside air flows in from the right side of the front heat dissipation main body 21 through the right heat dissipation fin, and flows upward toward the front center of the front heat dissipation main body 21.

여기서, 전방 방열 본체(21)의 전면 가운데 방향으로 모인 양측의 열교환 공기는 좌측 방열핀부 및 우측 방열핀부의 사이 공간인 상측으로 토출될 수 있다.Here, the heat exchange air of both sides gathered in the front center direction of the front heat dissipation main body 21 may be discharged to an upper side which is a space between the left heat dissipation fin part and the right heat dissipation fin part.

한편, 다수의 전방 단위 방열체(40)는, 도 7에 참조된 바와 같이, 일단부는, 전방 방열 본체(21)에 고정되고, 타단부는 안테나 기판(11)이 수용된 안테나 하우징(10)의 후면에 고정될 수 있다.Meanwhile, as illustrated in FIG. 7, the plurality of front unit heat sinks 40 have one end fixed to the front heat dissipation main body 21 and the other end of the antenna housing 10 in which the antenna substrate 11 is accommodated. Can be fixed to the back.

보다 상세하게는, 다수의 전방 단위 방열체(40)는, 상기 일단부로서 제1 발열소자 중 어느 하나에 접촉되게 전방 방열 본체(21)에 결합시키는 결합부(41)와, 결합부(41)를 통해 전도된 열을 이격 공간으로 전달시키는 전도부(42)와, 전도부(42)의 외주에 적층식으로 이격 구비된 다수의 서브 방열 핀(43)을 포함할 수 있다. 전도부(42)의 선단은, 상기 타단부로서 안테나 하우징(10)의 후면에 고정될 수 있다.More specifically, the plurality of front unit heat sinks 40 include a coupling portion 41 for coupling to the front heat dissipation main body 21 to be in contact with any one of the first heat generating elements as the one end portion, and the coupling portion 41. It may include a conductive portion 42 for transferring the conductive heat through the spaced through) and a plurality of sub heat dissipation fins 43 stacked on the outer circumference of the conductive portion 42 in a stacked manner. The front end of the conductive part 42 may be fixed to the rear surface of the antenna housing 10 as the other end.

한편, 다수의 전방 서브 방열 핀(43)은 방열 면적이 전부 동일하게 형성될 수 있다. 이는, 다수의 전방 서브 방열 핀(43)의 방열 면적이 상이하게 되면 일부의 전방 서브 방열 핀(43)이 다수의 전방 메인 방열 핀(23)을 덮거나 오버랩되게 배치될 수 있으므로, 방열 성능의 증가치가 크지 않기 때문이다.Meanwhile, the plurality of front sub heat dissipation fins 43 may have the same heat dissipation area. This is because when the heat dissipation areas of the plurality of front sub heat dissipation fins 43 are different, some of the front sub heat dissipation fins 43 may be disposed to cover or overlap the plurality of front main heat dissipation fins 23. This is because the increase is not large.

아울러, 다수의 전방 단위 방열체(40)는, 다수의 전방 서브 방열 핀(43)이 이격 공간에 노출될 수 있다. 즉, 다수의 전방 단위 방열체(40)의 전후 길이는, 전방 방열 본체(21)에 일단부가 결합되되 타단부가 전방 방열 본체(21)에 형성된 상기 다수의 전방 메인 방열 핀(23)보다 이격 공간으로 더 돌출되는 크기로 형성될 수 있다. 이와 같이, 다수의 전방 단위 방열체(40)는, 그 일부가 다수의 전방 메인 방열 핀(23)의 끝 부분과 안테나 하우징(10) 사이의 이격 공간으로 노출됨으로써 보다 신속한 방열이 이루어질 수 있다.In addition, in the plurality of front unit heat sinks 40, the plurality of front sub heat dissipation fins 43 may be exposed to a space. That is, the front and rear lengths of the plurality of front unit heat sinks 40 are one end coupled to the front heat dissipation main body 21, and the other end is spaced apart from the plurality of front main heat dissipation fins 23 formed at the front heat dissipation main body 21. It may be formed to a size that protrudes further into space. As described above, the plurality of front unit heat sinks 40 may be exposed to a space between the end portions of the plurality of front main heat dissipation fins 23 and the antenna housing 10 so that the heat dissipation may be faster.

전방 방열 본체(21)에는 상술한 다수의 전방 단위 방열체(40)의 결합부(41)가 결합되는 결합 홀(미도시)이 형성될 수 있다. 다수의 전방 단위 방열체(40)의 결합부(41)는, 전방 방열 본체(21)의 결합홀(37)을 관통하여 제1 발열소자들 중 적어도 어느 하나의 발열면에 밀착되게 배치될 수 있다. 이때, 결합부(41)는, 결합 홀에 나사 체결방식으로 결합될 수 있다.The front heat dissipation main body 21 may have a coupling hole (not shown) to which the coupling portions 41 of the plurality of front unit heat dissipation bodies 40 are coupled. Coupling portions 41 of the plurality of front unit heat sinks 40 may be disposed in close contact with at least one heat generating surface of the first heating elements by passing through the coupling hole 37 of the front heat dissipating body 21. have. At this time, the coupling part 41 may be coupled to the coupling hole by screwing.

그러나, 전방 방열 본체(21)에 대한 전방 단위 방열체(40)의 결합 방식이 나사 체결방식에 의하여 한정되는 것은 아니다. 즉, 다수의 전방 단위 방열체(40)는, 제1 발열소자들의 발열면에 밀착되게 결합되는 한도에서, 미도시 되었으나, 다수의 전방 단위 방열체(40)의 결합부(41)의 외주면에 숫나사산이 형성되고, 전방 방열 본체(21)의 결합홀(37) 내주면에 암나사산이 형성되어 단순한 회전 결합 방식에 의한 결합도 가능함은 당연하다고 할 것이다.However, the coupling manner of the front unit heat sink 40 to the front heat dissipation main body 21 is not limited by the screw fastening method. That is, although the plurality of front unit heat sinks 40 are not shown in close contact with the heat generating surfaces of the first heat generating elements, the plurality of front unit heat sinks 40 may be disposed on the outer circumferential surface of the coupling portion 41 of the plurality of front unit heat sinks 40. A male thread is formed, and a female thread is formed on the inner circumferential surface of the coupling hole 37 of the front heat dissipation main body 21, and it is natural that the coupling can be performed by a simple rotation coupling method.

도 9a 및 도 9b는 본 발명에 따른 다중 입출력 안테나 장치의 구성 중 BB board 및 그 방열구조를 나타낸 전방부 및 후방부 분해 사시도이고, 도 10은 도 9a의 결합된 상태에서의 D-D선을 따라 취한 단면도 및 그 부분 확대도이다.9A and 9B are exploded perspective views of front and rear parts illustrating a BB board and a heat dissipation structure of a multi-input / output antenna device according to the present invention, and FIG. 10 is taken along the DD line in the combined state of FIG. 9A. It is sectional drawing and the partial enlarged view.

본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예는, 도 5a 및 도 5b에 참조된 바와 같이, 송수신 모듈 기판(110)의 후면은 후방 방열부(30)에 의하여 커버링될 수 있다. 즉, 후방 방열부(30)는, 송수신 모듈 기판(110)의 후면을 차폐함으로써 외부의 오염물질 등으로부터 송수신 모듈 기판(110)을 보호하는 역할을 한다.In an embodiment of the multi-input / output antenna device 1 according to the present invention, as shown in FIGS. 5A and 5B, the rear surface of the transmit / receive module substrate 110 may be covered by the rear radiator 30. That is, the rear heat dissipation unit 30 serves to protect the transceiver module substrate 110 from external pollutants by shielding the rear surface of the transceiver module substrate 110.

여기서, 후방 방열부(30)는, 열전도성이 우수한 금속 재질로 구비될 수 있다. 다만, 열전도성이 우수한 재질이라면 여하한 재질로 구비되어도 무방한 바, 후방 방열부(30)의 재질이 이로써 한정되는 것은 아니다.Here, the rear heat dissipation unit 30 may be provided with a metal material having excellent thermal conductivity. However, if the material having excellent thermal conductivity may be provided with any material, the material of the rear heat dissipation part 30 is not limited thereto.

송수신 모듈 기판(110)은, 상술한 바와 같이, 전면 측에 구비된 제1 발열소자로부터 발열된 열은 전방 방열부(20)에 의하여 이격 공간으로 방열되고, 후면 측에 구비된 제2 발열소자로부터 발열된 열은 후방 방열부(30)에 의하여 외측 공간으로 방열되도록 구비될 수 있다.As described above, the transmitting / receiving module substrate 110 heats heat generated from the first heat generating element provided at the front side to be radiated to the space separated by the front heat dissipating unit 20, and the second heat generating element provided at the rear side. Heat generated from the heat may be provided to radiate heat to the outer space by the rear radiator 30.

전방 방열부(20)는, 도 5b 및 도 8에 참조된 바와 같이, 송수신 모듈 기판(110)의 후면이 밀착되도록 배치되고, 후방으로 다수의 메인 방열 핀(이하, 전방 방열부(20)의 '전방 메인 방열핀'과의 구분을 위하여 '후방 메인 방열 핀(33)'이라 칭한다)이 돌출되게 구비된 후방 방열 본체(31)와, 후방 방열 본체(31)를 관통하도록 배치되고, 일단부가 송수신 모듈 기판(110)의 제2 발열소자 중 적어도 일부와 밀착되며, 타단부에 제2 발열소자로부터 전도된 열을 외부로 방열시키는 다수의 서브 방열 핀(이하, 전방 방열부(20)의 '전방 서브 방열 핀(43)'과의 구분을 위하여 '후방 서브 방열 핀(53)'이라 칭한다)이 구비된 다수의 후방 단위 방열체(50)를 포함할 수 있다.As shown in FIGS. 5B and 8, the front heat dissipation unit 20 is disposed such that the rear surface of the transmission / reception module substrate 110 is in close contact, and a plurality of main heat dissipation fins (hereinafter, referred to as the front heat dissipation unit 20) is provided. The rear main heat dissipation fin (referred to as 'rear main heat dissipation fin 33') is provided to protrude through the rear heat dissipation main body 31 and the rear heat dissipation main body 31, and one end is transmitted and received. A plurality of sub heat dissipation fins (hereinafter, referred to as “front side” of the front heat dissipation unit 20) in close contact with at least a portion of the second heat dissipation element of the module substrate 110 and dissipating heat conducted from the second heat dissipation element to the other end. A plurality of rear unit heat sinks 50 provided with a 'rear sub heat dissipation fin 53' may be provided to distinguish the sub heat dissipation fin 43 '.

다수의 후방 메인 방열 핀(33)은, 제2 발열소자들로부터 후방 방열 본체(31)로 전달된 열을 외부 공기와 열교환하여 방열시키는 역할을 한다. 따라서, 전방 방열 본체(21)와 마찬가지로 후방 방열 본체(31)는 열전도가 용이한 금속 재질로 구비됨과 아울러, 다수의 후방 메인 방열 핀(33) 또한 열전도가 용이한 금속 재질로 구비될 수 있다.The plurality of rear main heat dissipation fins 33 serves to dissipate heat transferred from the second heating elements to the rear heat dissipation main body 31 by exchanging heat with external air. Therefore, like the front heat dissipation main body 21, the rear heat dissipation main body 31 may be provided with a metal material having easy thermal conductivity, and the plurality of rear main heat dissipation fins 33 may also be provided with a metal material having easy thermal conductivity.

여기서의 다수의 후방 메인 방열 핀(33)은, 후방 방열 본체(31)의 후면에 형성될 수 있고, 예를 들어 후방 방열 본체(31)와 일체로 성형될 수 있음은 물론, 다수의 후방 메인 방열 핀(33)은, 별도의 부재로서 제작되어 후방 방열 본체(31)의 후면 상에 열전도성 접착제로 접착되거나, 또는 볼트와 같은 별도 체결부재로 고정될 수 있다.Here, the plurality of rear main heat dissipation fins 33 may be formed on the rear surface of the rear heat dissipation main body 31 and, for example, may be integrally formed with the rear heat dissipation main body 31, and a plurality of rear mains may be formed. The heat dissipation fin 33 may be manufactured as a separate member and adhered to the rear surface of the rear heat dissipation main body 31 with a heat conductive adhesive, or fixed with a separate fastening member such as a bolt.

한편, 다수의 후방 단위 방열체(50)는, 다수의 제2 발열소자, 특히 후술하는 바와 같이, 후방 방열 본체(31)와는 별개로 다수의 제2 발열소자로부터 발열된 열을 외측 공간으로 방열시키는 역할을 한다.On the other hand, the plurality of rear unit heat sinks 50 radiate heat generated from the plurality of second heat generating elements to the outer space separately from the plurality of second heat generating elements, in particular, as described later. It plays a role.

특히, 본 발명의 일 실시예에 따른 다중 입출력 안테나 장치(1)는, 특히 제2 발열소자들 중 발열량이 많은 통신부품 중 다수의 FPGA(115)부터 발열된 열을 개별적으로 방열시키는 구조를 채택한다. 여기서, 다수의 FPGA(115)는 아날로그/디지털 변환기로부터 변환된 디지털 신호를 제공받아 기저대역 신호로 변환하는 등 디지털 신호 처리 동작을 수행하는 부품이다. 이로써, 후방 방열 본체(31)의 방열 성능과는 무관하게 발열량이 비교적 많은 FPGA(115)로부터 발열된 열을 보다 신속하게 방열할 수 있다.In particular, the multi-input / output antenna device 1 according to an embodiment of the present invention adopts a structure for individually dissipating heat generated from a plurality of FPGAs 115 among communication components having a large amount of heat generation among the second heating elements. do. Here, the plurality of FPGAs 115 are components that perform digital signal processing operations such as receiving digital signals converted from analog / digital converters and converting them into baseband signals. Thereby, regardless of the heat dissipation performance of the rear heat dissipation main body 31, it is possible to more quickly dissipate heat generated from the FPGA 115 having a larger heat generation amount.

한편, 후방 방열 본체(31)의 후면에 형성된 다수의 후방 메인 방열 핀(33)은, 다수의 전방 메인 방열 핀(23)과 마찬가지로, 상측을 향하여 경사지게 배치될 수 있다. 또한, 본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예는, 다수의 후방 메인 방열 핀(33)은 상기 다수의 후방 메인 방열 핀(33) 내부로의 외부 공기 유입량이 더 증가하도록 상향 경사지게 배치될 수 있다. 따라서, 후방 방열 본체(31)의 하측 뿐만 아니라 측부에서도 외부 공기의 유입이 용이한 이점을 가진다.Meanwhile, the plurality of rear main heat dissipation fins 33 formed on the rear surface of the rear heat dissipation main body 31 may be disposed to be inclined upwardly, similarly to the plurality of front main heat dissipation fins 23. In addition, according to an embodiment of the multiple input / output antenna device 1 according to the present invention, the plurality of rear main heat dissipation fins 33 is upward so that the inflow of external air into the plurality of rear main heat dissipation fins 33 is further increased. It may be arranged to be inclined. Therefore, the inflow of the outside air is easy not only in the lower side but also in the side of the rear heat dissipation main body 31.

이와 같은 다수의 후방 메인 방열 핀(33)은, 도 5b의 도면상 좌측에서 후방 방열 본체(31)의 상하 중심선을 향하여 상향 경사지게 배치된 좌측 방열핀부(34) 및 우측에서 후방 방열 본체(31)의 상하 중심선을 향하여 상향 경사지게 배치된 우측 방열핀부(35)를 포함할 수 있다.Such a plurality of rear main heat dissipation fins 33 have a left heat dissipation fin part 34 disposed to be inclined upward toward an upper and lower center line of the rear heat dissipation main body 31 on the left side in FIG. 5B, and a rear heat dissipation main body 31 on the right side. It may include a right heat radiation fin portion 35 is disposed to be inclined upward toward the vertical line of the.

즉, 다수의 후방 메인 방열 핀(33)은, 좌측 방열핀부(34) 및 우측 방열핀부(35)의 2그룹으로 형성되되, 후방 방열 본체(31)의 좌측부로부터는 좌측 방열핀부(34)를 통하여 외부 공기가 유입되어 유동되되 후방 방열 본체(31)의 전면 가운데 방향으로 상향 유동되고, 후방 방열 본체(31)의 우측부로부터는 우측 방열핀부(35)를 통하여 외부 공기가 유입되어 유동되되 후방 방열 본체(31)의 전면 가운데 방향으로 상향 유동된다.That is, the plurality of rear main heat dissipation fins 33 is formed of two groups of the left heat dissipation fin portion 34 and the right heat dissipation fin portion 35, and the left heat dissipation fin portion 34 is formed from the left side of the rear heat dissipation fin portion 31. Outside air flows through and flows, but is upwardly flowed toward the front center of the rear heat dissipation main body 31, and outside air flows through the right heat dissipation fin unit 35 from the right side of the rear heat dissipation main body 31 and flows backward. It flows upward toward the front center of the main body 31.

여기서, 후방 방열 본체(31)의 전면 가운데 방향으로 모인 양측의 열교환 공기는 좌측 방열핀부(34) 및 우측 방열핀부(35)가 상호 만나는 지점인 후술하는 방열 배기 리브(36)에서 외측 공간으로 토출될 수 있다.Here, the heat exchange air of both sides gathered toward the front center of the rear heat dissipation main body 31 is discharged to the outer space from the heat dissipation exhaust rib 36 which will be described later where the left heat dissipation fin 34 and the right heat dissipation fin 35 meet each other. Can be.

한편, 다수의 후방 단위 방열체(50)는, 도 5b 및 도 8에 참조된 바와 같이, 일단부는, 후방 방열 본체(31)에 고정되고, 타단부는 후술하는 안테나 설치 브라켓과 결합될 수 있다.Meanwhile, as illustrated in FIGS. 5B and 8, one end of the plurality of rear unit heat sinks 50 may be fixed to the rear heat dissipation main body 31, and the other end thereof may be coupled to an antenna mounting bracket to be described later. .

보다 상세하게는, 다수의 후방 단위 방열체(50)는, 상기 일단부로서 제2 발열소자 중 어느 하나에 접촉되게 후방 방열 본체(31)의 후면에 결합시키는 결합부(51)와, 결합부(51)를 통해 전도된 열을 외측 공간으로 전달시키는 전도부(52)와, 전도부(52)의 외주에 적층식으로 이격 구비된 다수의 후방 서브 방열 핀(53)을 포함할 수 있다. 전도부(52)의 선단은, 상기 타단부로서 안테나 설치 브라켓에 고정될 수 있다.More specifically, the plurality of rear unit heat sinks 50, the coupling portion 51 for coupling to the rear surface of the rear heat dissipation main body 31 to be in contact with any one of the second heating element as the one end, the coupling portion Conductive portion 52 for transferring the heat conducted through the 51 to the outer space, and a plurality of rear sub-heat radiating fins 53 stacked on the outer periphery of the conductive portion 52 may be included. The tip of the conducting portion 52 may be fixed to the antenna mounting bracket as the other end.

한편, 다수의 후방 서브 방열 핀(53)은 그 방열 면적이 외부 공간으로 갈수록 점점 줄어들도록 형성될 수 있다. 이는, 후방 방열 본체(31), 즉 제2 발열소자로부터 가까운 후방 서브 방열 핀(53)의 면적을 더 원거리에 구비된 후방 서브 방열 핀(53)의 면적보다 더 크게 설계해줌으로써 보다 신속하게 제2 발열소자로부터 전도된 열을 방열시키기 위함이다.On the other hand, the plurality of rear sub heat dissipation fins 53 may be formed such that its heat dissipation area gradually decreases toward the outer space. This makes the rear heat dissipation main body 31, i.e., the area of the rear sub heat dissipation fin 53 closer to the second heat generating element larger than the area of the rear sub heat dissipation fin 53 provided at a far distance, thereby providing a more rapid 2 This is to dissipate heat conducted from the heating element.

아울러, 다수의 후방 단위 방열체(50)는, 후방 방열 본체(31)에 형성된 상기 다수의 후방 메인 방열 핀(33)보다 외측 공간으로 더 돌출되는 크기로 형성될 수 있다. 이는, 후방 메인 방열 핀(33)에 의하여 후술하는 안테나 설치 브라켓과의 결합 시 설치 간섭이 발생하는 것을 방지하고자 함이다.In addition, the plurality of rear unit heat sinks 50 may be formed to protrude to an outer space more than the plurality of rear main heat dissipation fins 33 formed on the rear heat dissipation body 31. This is to prevent the occurrence of installation interference when coupling with the antenna mounting bracket to be described later by the rear main heat dissipation pin 33.

후방 방열 본체(31)에는 상술한 다수의 후방 단위 방열체(50)의 결합부(51)가 결합되는 결합홀(37)이 형성될 수 있다. 다수의 후방 단위 방열체(50)의 결합부(51)는, 후방 방열 본체(31)의 결합홀(37)을 관통하여 제2 발열소자들 중 적어도 어느 하나의 발열면에 밀착되게 배치될 수 있다. 이때, 결합부(51)는, 결합홀(37)에 나사 체결방식으로 결합될 수 있다.The rear heat dissipation main body 31 may be provided with a coupling hole 37 to which the coupling portions 51 of the plurality of rear unit heat dissipators 50 described above are coupled. The coupling part 51 of the plurality of rear unit heat sinks 50 may be disposed to closely contact the heating surface of at least one of the second heating elements through the coupling hole 37 of the rear heat dissipation main body 31. have. At this time, the coupling part 51 may be coupled to the coupling hole 37 by a screw coupling method.

한편, 본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예에서, 송수신 모듈 기판(110)은, 도 9a 내지 도 10에 참조된 바와 같이, 다수의 제2 발열소자 중 일부가 실장되고, 후방 방열부(30)의 좌측 부위에 상하방향으로 길게 배치된 제1송수신 기판(111)과, 다수의 제2 발열소자 중 일부가 실장되고, 후방 방열부(30)의 우측 부위에 상하방향으로 길게 배치된 제2송수신 기판(112) 및 다수의 제2 발열소자 중 나머지 일부가 실장되고, 제1송수신 기판(111) 및 제2송수신 기판(112) 사이에 상하방향으로 길게 배치된 제3송수신 기판(113)을 포함할 수 있다.Meanwhile, in one embodiment of the multi-input / output antenna device 1 according to the present invention, as shown in FIGS. 9A to 10, the transceiving module substrate 110 may include a part of a plurality of second heating elements, The first transmitting and receiving substrate 111 and the plurality of second heat generating elements are disposed on the left side of the rear heat dissipation unit 30 in the vertical direction and are mounted in a vertical direction on the right side of the rear heat dissipation unit 30. A third transmission receiver configured to be mounted in the vertical direction between the second transmitter / receive substrate 112 and the plurality of second heat generating elements, and the first transmitter / receiver substrate 111 and the second transmitter / receiver substrate 112 disposed long, It may include a substrate 113.

제1송수신 기판(111)과 제2송수신 기판(112)에는 각각 FPGA(115)가 상하방향으로 소정거리 이격되게 다수개 구비될 수 있다. 따라서, 후방 방열 본체(31)의 외측에 결합되는 다수의 후방 단위 방열체(50)의 개수도 상술한 FPGA(115)의 개수에 대응되게 구비될 수 있다.A plurality of FPGAs 115 may be provided in the first transmission / reception board 111 and the second transmission / reception board 112 to be spaced apart by a predetermined distance in the vertical direction. Therefore, the number of the plurality of rear unit heat sinks 50 coupled to the outside of the rear heat dissipation main body 31 may also be provided to correspond to the number of the FPGA 115 described above.

제3송수신 기판(113)에는 FPGA(115)와 같이 비교적 발열량이 많은 통신부품을 제외한 나머지 통신부품(116)이 실장될 수 있다. 그러나, 반드시, 제1송수신 기판(111) 및 제2송수신 기판(112)에는 FPGA(115)만이 구비되거나 제3송수신 기판(113)에는 FPGA(115)가 구비되지 않아야 하는 것은 아니다. 즉, FPGA(115)와 이를 제외한 나머지 통신부품(116)은 방열을 고려하여 제1송수신 기판(111) 내지 제3송수신 기판(113) 전부에 균형 있게 배치될 수 있다.The third transmission and reception board 113 may be mounted with a communication component 116 except for a communication component having a relatively high heat generation, such as the FPGA 115. However, the first and second transmission and reception boards 111 and 112 are not necessarily provided with only the FPGA 115 or the third and reception boards 113 and the FPGA 115. That is, the FPGA 115 and the remaining communication components 116 except for this may be disposed in a balanced manner on all of the first transmission and reception substrate 111 to the third transmission and reception substrate 113 in consideration of heat dissipation.

본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예에서는, 비교적 발열량이 많은 FPGA(115)의 경우에는 상술한 후방 단위 방열체(50)에 의하여 개별적으로 방열되도록 함과 아울러, FPGA(115)를 제외한 나머지 통신부품(116)의 경우 그 기판면으로부터의 높이 및 형태가 다양한 이유로 후방 방열 본체(31)에 직접 접촉되는 것이 용이하지 않는 바, 제3송수신 기판(113)의 후면에 집중하여 배치하고, 후방 방열 본체(31)에 형성된 후술하는 수용 홈부(39)로 FPGA(115)를 제외한 나머지 통신부품(116)이 수용되게 구비된 방열 구조를 제안한다.In an embodiment of the multiple input / output antenna device 1 according to the present invention, in the case of the FPGA 115 having a relatively high heat generation, the FPGA 115 may be individually radiated by the rear unit radiator 50 described above. For the other communication parts 116 except for), it is not easy to directly contact the rear heat dissipation main body 31 due to various heights and shapes from the substrate surface. The heat dissipation structure is provided, and the communication grooves 116 other than the FPGA 115 are accommodated as the accommodating grooves 39 formed in the rear heat dissipation main body 31.

보다 상세하게는, 후방 방열 본체(31)에는, 도 9a에 참조된 바와 같이, 제3송수신 기판(113)의 다수의 제2 발열소자가 수용되는 수용 홈부(39)가 상하방향으로 길게 형성될 수 있다.In more detail, as shown in FIG. 9A, the rear heat dissipating main body 31 may include an accommodating groove 39 in which a plurality of second heat generating elements of the third transmitting and receiving substrate 113 are accommodated, extending in the vertical direction. Can be.

수용 홈부(39)는 후방 방열 본체(31)의 전면에서 후면 측으로 함몰되게 형성될 수 있다. 따라서, 다수의 후방 메인 방열 핀(33)이 형성된 후방 방열 본체(31)의 외측면(후면)에는, 도 9a 및 도 9b에 참조된 바와 같이, 수용 홈부(39)가 후방 방열 본체(31)의 내측면으로부터 외측면을 향하여 돌출되게 함몰 형성된 방열 배기 리브(36)가 구비될 수 있다. 방열 배기 리브(36)의 형상 및 그 구체적인 기능에 대해서는 뒤에 상세히 설명하기로 한다.The accommodation groove 39 may be formed to be recessed from the front side of the rear heat dissipation main body 31 to the rear side. Therefore, as shown in FIGS. 9A and 9B, the receiving groove 39 has a rear heat dissipation body 31 on the outer side (rear surface) of the rear heat dissipation body 31 on which the plurality of rear main heat dissipation fins 33 are formed. A heat dissipation exhaust rib 36 recessed to protrude from the inner side toward the outer side may be provided. The shape and specific function of the heat radiation exhaust rib 36 will be described later in detail.

상술한 바와 같이, 수용 홈부(39)에 수용된 다수의 제2 발열소자 중 일부로부터 발열된 열은 수용 홈부(39) 내측에 집열되어 후방 방열 본체(31)의 방열 배기 리브(36) 또는 방열 배기 리브(36)에 연결된 다수의 후방 메인 방열 핀(33)을 통해 외부로 방열될 수 있다.As described above, heat generated from some of the plurality of second heat generating elements accommodated in the accommodating groove 39 is collected inside the accommodating groove 39 so that the heat dissipating exhaust ribs 36 or the heat dissipating exhaust of the rear heat dissipating main body 31 are collected. The heat may be radiated to the outside through a plurality of rear main heat radiating fins 33 connected to the rib 36.

한편, 방열 배기 리브(36)는, 삼각형의 꼭지점을 가지는 수평 단면을 가지도록 형성될 수 있다. 여기서, 다수의 후방 메인 방열 핀(33)은, 방열 배기 리브(36)의 꼭지점까지 연장 형성될 수 있다. 보다 상세하게는, 후방 메인 방열 핀(33) 중 좌측 방열핀부(34)는 그 상단이 방열 배기 리브(36)까지 연장되고, 후방 메인 방열 핀(33) 중 우측 방열핀부(35)는 그 상단이 방열 배기 리브(36)까지 연장된다.On the other hand, the heat dissipation exhaust ribs 36 may be formed to have a horizontal cross section having a triangle vertex. Here, the plurality of rear main heat dissipation fins 33 may extend to vertices of the heat dissipation exhaust ribs 36. In more detail, the left heat dissipation fin part 34 of the rear main heat dissipation fin 33 has an upper end extended to the heat dissipation exhaust rib 36, and the right heat dissipation fin part 35 of the rear main heat dissipation fin 33 has an upper end thereof. It extends to this heat dissipation exhaust rib 36.

방열 배기 리브(36)의 후방 방열 본체(31)의 외측으로 돌출된 높이가 후방 메인 방열 핀(33)부의 높이와 동일하다고 가정할 경우, 후방 메인 방열 핀(33)부 사이를 유동하는 방열 공기는 상측으로 이동되면서 방열 배기 리브(36)를 만나게 되고, 방열 배기 리브(36)를 만난 방열 공기는 삼각형의 꼭지점을 향하도록 유동되면서 외측 공간으로 용이하게 배기될 수 있다.Assuming that the height of the heat dissipation exhaust ribs 36 protruding outward from the rear heat dissipation main body 31 is the same as the height of the rear main heat dissipation fin 33, the heat dissipation air flowing between the rear main heat dissipation fin 33 portions. Is moved upward and meets the heat radiation exhaust rib 36, the heat radiation air meeting the heat radiation exhaust rib 36 can be easily exhausted to the outer space while flowing toward the vertex of the triangle.

한편, 본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예는, 도 5a 및 도 5b에 참조된 바와 같이, 안테나 기판(11)의 다수의 안테나 소자(13) 및 송수신 모듈 기판(110)의 제1 발열소자를 포함하는 통신부품들을 신호 연결하는 다수의 RF 에어 라인(100)을 더 포함할 수 있다.Meanwhile, according to an embodiment of the multi-input / output antenna apparatus 1 according to the present invention, as shown in FIGS. 5A and 5B, the plurality of antenna elements 13 and the transmit / receive module substrate 110 of the antenna substrate 11 are provided. The apparatus may further include a plurality of RF air lines 100 for signal connecting communication components including a first heating element.

다수의 RF 에어 라인(100)은, 일단이 안테나 하우징(10)의 후면에 연결되고, 타단이 전방 방열 본체(21)의 전면에 연결될 수 있다. 이와 같은 다수의 RF 에어 라인(100)을 통하여, 안테나 기판(11)의 안테나 소자(13)를 포함하는 통신부품과 송수신 모듈 기판(110)의 RFIC(125) 및 FPGA(115)를 포함한 통신부품들 간 급전 라인이 구축될 수 있다.The plurality of RF air lines 100, one end may be connected to the rear of the antenna housing 10, the other end may be connected to the front of the front heat dissipation body 21. Through such a plurality of RF air lines 100, the communication component including the antenna element 13 of the antenna substrate 11 and the communication component including the RFIC 125 and FPGA 115 of the transmission and reception module substrate 110 Feeding lines can be established between them.

도 11은 도 1의 구성 중 설치 브라켓의 결합 모습을 나타낸 분해 사시도이고 도 12a 및 도 12b는 설치 브라켓의 구성 중 수평 회동 브라켓과 상하 회동 브라켓에 의한 로테이팅 및 틸팅 모습을 나타낸 평면도 및 측면도이다.Figure 11 is an exploded perspective view showing a coupling state of the mounting bracket of the configuration of Figure 1 and Figures 12a and 12b is a plan view and a side view showing a rotating and tilting state by the horizontal rotating bracket and the vertical rotating bracket of the installation bracket.

본 발명에 따른 다중 입출력 안테나 장치(1)의 일 실시예는, 도 1 내지 도 4 및 도 11에 참조된 바와 같이, 기존의 안테나 설치 지주에의 설치를 매개하는 설치 브라켓을 더 포함할 수 있다.An embodiment of the multi-input / output antenna apparatus 1 according to the present invention may further include an installation bracket for mediating the installation to the existing antenna mounting support, as shown in FIGS. 1 to 4 and 11. .

설치 브라켓은, 도 1 및 도 14에 참조된 바와 같이, 다수의 후방 단위 방열체(50) 각각에 결합되는 방열 브라켓(60)과, 방열 브라켓(60)에 결합되고 안테나 설치 지주의 고정점에 대하여 상하방향으로 회동 가능하게 구비된 상하 회동 브라켓(70)과, 상하 회동 브라켓(70)에 결합되고 안테나 설치 지주의 고정점에 대하여 수평방향으로 회동되게 구비된 수평 회동 브라켓(80)과, 일단은 수평 회동 브라켓(80)에 결합되고, 타단은 안테나 설치 지주에 결합되는 지주 고정 브라켓(90)을 포함한다.As shown in FIGS. 1 and 14, the mounting bracket includes a heat dissipation bracket 60 coupled to each of the plurality of rear unit heat sinks 50 and a fixed point of the antenna mounting support coupled to the heat dissipation bracket 60. An up and down pivot bracket 70 provided to be rotatable in the up and down direction, a horizontal pivot bracket 80 coupled to the up and down pivot bracket 70 and pivoted in a horizontal direction with respect to a fixed point of the antenna mounting support, Is coupled to the horizontal rotation bracket 80, the other end includes a support fixing bracket 90 is coupled to the antenna installation support.

일반적으로, 본 발명의 일 실시예와 비교되는 안테나 장치(1)로서, 상하 방향으로 길게 형성된 안테나 장치(1)를 안테나 설치 지주에 상하 길이방향으로 설치하는 경우, 상하 방향의 길이가 길게 형성되는 전체적인 제품 형상 때문에 하나의 설치 브라켓만으로의 균형적인 고정은 사실상 불가능하다.In general, as an antenna device 1 compared with an embodiment of the present invention, when the antenna device 1 formed in the vertical direction is provided in the vertical longitudinal direction, the length of the vertical direction is formed long Due to the overall product shape, balanced fixing with only one mounting bracket is virtually impossible.

아울러, 안테나 장치(1)는 안테나 설치 지주에 설치된 후, 안테나 소자(13)로/부터 조사되는 파장 방향을 조절하기 위해 각도 조절이 필요한 실정이다. 그런데, 상하 방향으로 길게 형성된 안테나 장치(1)의 경우에는 하나의 설치 브라켓만으로 고정할 경우, 외부의 바람과 같은 풍압에 의한 상단부 또는 하단부의 물리적인 요동을 방지할 수 없게 된다. 따라서, 일반적으로, 안테나 장치(1)의 안테나 설치 지주에 대한 고정은 복잡한 설치 브라켓이 동원되어야 한다.In addition, after the antenna device 1 is installed on the antenna mounting post, the angle adjustment is required to adjust the wavelength direction irradiated to / from the antenna element 13. By the way, in the case of the antenna device (1) formed long in the vertical direction, when fixed with only one mounting bracket, it is impossible to prevent the physical fluctuation of the upper end or the lower end due to wind pressure such as the outside wind. Therefore, in general, the fixing to the antenna mounting post of the antenna device 1 requires the use of a complicated mounting bracket.

이에 비하여, 본 발명의 일 실시예에 따른 다중 입출력 안테나 장치(1)에 적용된 설치 브라켓은, 도 1 내지 도 4 및 도 11에 참조된 바와 같이, 미도시의 안테나 설치 지주에 대하여 외팔보 형상으로 구비되어 안테나 장치(1)의 일 실시예를 고정시킬 수 있다.In contrast, the mounting bracket applied to the multiple input / output antenna device 1 according to an embodiment of the present invention has a cantilever shape with respect to the antenna mounting support not shown as shown in FIGS. 1 to 4 and 11. Thus, one embodiment of the antenna device 1 can be fixed.

아울러, 설치 브라켓의 상하 회동 브라켓(70), 수평 회동 브라켓(80) 및 지주 고정 브라켓(90)을 각각에 대하여 회동 가능하게 구비함으로써 상술한 안테나 장치(1)의 각도 조정이 가능하다.In addition, the angle adjustment of the above-described antenna device 1 is possible by rotating the upper and lower rotating brackets 70, the horizontal rotating brackets 80, and the support fixing brackets 90, respectively, of the mounting brackets.

가령, 도 12a에 참조된 바와 같이, 안테나 장치(1)가 방열 브라켓(60)을 매개로 상하 회동 브라켓(70)의 선단에 설치된 후, 수평 회동 브라켓(80)이 좌우 방향으로 수평 회동되는 동작으로 수평 방향의 각도 조정이 가능하고, 도 12b에 참조된 바와 같이, 상하 회동 브라켓(70)이 수평 회동 브라켓(80)에 대하여 상하 방향으로 수직 회동되는 동작으로 상하 방향의 각도 조정이 가능하다.For example, as shown in FIG. 12A, after the antenna device 1 is installed at the distal end of the up and down pivot bracket 70 via the heat dissipation bracket 60, the horizontal pivot bracket 80 is horizontally rotated in the horizontal direction. The horizontal angle can be adjusted. As shown in FIG. 12B, the vertical tilt bracket 70 can be vertically rotated in the vertical direction with respect to the horizontal pivot bracket 80.

한편, 방열 브라켓(60)은, 도 11에 참조된 바와 같이, 링 형상으로 형성되고, 상하 회동 브라켓(70)의 설치면을 제공하는 설치링부(61) 및 설치링부(61)의 외측면에 방사상으로 연장되되, 상기 다수의 후방 단위 방열체(50)를 향하여 연장된 다수의 고정부(63)를 포함할 수 있다.On the other hand, the heat dissipation bracket 60 is formed in a ring shape, as shown in Figure 11, on the outer surface of the mounting ring 61 and the mounting ring 61 for providing an installation surface of the vertical pivot bracket 70. A radially extending, but may include a plurality of fixing parts 63 extending toward the plurality of rear unit heat sink (50).

여기서, 설치링부(61)는, 다수의 고정부(63)가 후방 방열 본체(31)와 결합될 경우, 안테나 장치(1)의 전체적인 무게 균형을 위하여 후방 방열 본체(31)의 후면 가운데 부분에 위치될 수 있다.Here, when the plurality of fixing parts 63 are coupled to the rear heat dissipation main body 31, the mounting ring portion 61 is located at the rear center portion of the rear heat dissipation main body 31 for the overall weight balance of the antenna device 1. Can be located.

아울러, 고정부(63)의 외측면에는, 도 11의 확대도에 참조된 바와 같이, 다수의 후방 단위 방열체(50)로부터 전달된 열을 방열시키도록 다수의 잔여열 방열핀(64)이 형성될 수 있다.In addition, a plurality of residual heat radiation fins 64 are formed on the outer surface of the fixing portion 63 to dissipate heat transferred from the plurality of rear unit heat sinks 50, as referred to the enlarged view of FIG. 11. Can be.

다수의 잔여열 방열핀(64)은, 다수의 고정부(63)의 표면적을 증가시킴으로써, 제2 발열소자로 전달된 후방 단위 방열체(50)의 열을 효과적으로 방열시킬 수 있다. The plurality of residual heat radiating fins 64 may effectively radiate heat from the rear unit radiator 50 transferred to the second heat generating element by increasing the surface areas of the plurality of fixing parts 63.

한편, 상하 회동 브라켓(70)에는 상하방향 회동을 가이드하는 상하 가이드 슬롯(71)이 형성될 수 있다. 상하 가이드 슬롯(71)에는, 수평 회동 브라켓(80)의 전단부가 상호 조합되도록 연결되고, 상하 가이드 슬롯(71)은, 수평 회동 브라켓(80)에 대한 상하 회동 브라켓(70)의 상하 수평 이동을 가이드하는 역할을 한다.On the other hand, the vertical rotation bracket 70 may be formed with a vertical guide slot 71 for guiding the vertical rotation. The upper and lower guide slots 71 are connected to each other so that the front end portions of the horizontal rotation brackets 80 are combined with each other, and the upper and lower guide slots 71 allow the vertical movement of the vertical rotation brackets 70 with respect to the horizontal rotation brackets 80. It serves as a guide.

또한, 지주 고정 브라켓(90)에는 수평방향 회동을 가이드하는 수평 가이드 슬롯(91)이 형성될 수 있다. 수평 가이드 슬롯(91)에는, 수평 회동 브라켓(80)의 후단부가 상호 조합되도록 연결되고, 수평 가이드 슬롯(91)은, 지주 고정 브라켓(90)에 대한 수평 회동 브라켓(80)의 좌우 수평 이동을 가이드하는 역할을 한다.In addition, the holding fixing bracket 90 may be formed with a horizontal guide slot 91 for guiding the horizontal rotation. The rear end portions of the horizontal rotation brackets 80 are connected to the horizontal guide slots 91 so that the rear ends thereof are combined with each other, and the horizontal guide slots 91 horizontally move the horizontal rotation brackets 80 with respect to the prop fixing bracket 90. It serves as a guide.

이상의 설명은 본 발명의 기술 사상을 예시적으로 설명한 것에 불과한 것으로서, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 본 발명의 본질적인 특성에서 벗어나지 않는 범위에서 다양한 수정 및 변형이 가능할 것이다.The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention.

따라서, 본 발명에 개시된 실시예들은 본 발명의 기술 사상을 한정하기 위한 것이 아니라 설명하기 위한 것이고, 이러한 실시예에 의하여 본 발명의 기술 사상의 범위가 한정되는 것은 아니다. 본 발명의 보호 범위는 아래의 청구범위에 의하여 해석되어야 하며, 그와 동등한 범위 내에 있는 모든 기술 사상은 본 발명의 권리범위에 포함되는 것으로 해석되어야 할 것이다.Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

본 발명은 전면에 다수의 안테나 소자가 배열된 안테나 기판 및 전면에 전기적 구동에 의하여 발열되는 다수의 제1 발열소자 및 후면에 전기적 구동에 의하여 발열되는 다수의 제2 발열소자가 구비되고, 상기 안테나 기판에 대하여 이격 공간을 가지도록 배치된 송수신 모듈 기판을 포함하는 다중 입출력 안테나 장치를 제공한다.The present invention includes an antenna substrate having a plurality of antenna elements arranged on a front surface thereof, a plurality of first heat generating elements generated by electric driving on a front surface thereof, and a plurality of second heat generating elements generated by electric driving on a rear surface of the antenna board. Provided is a multiple input / output antenna device including a transmission / reception module substrate disposed to have a spaced distance from the substrate.

Claims (16)

전면에 다수의 안테나 소자가 배열된 안테나 기판; 및An antenna substrate having a plurality of antenna elements arranged on a front surface thereof; And 전면에 전기적 구동에 의하여 발열되는 다수의 제1 발열소자 및 후면에 전기적 구동에 의하여 발열되는 다수의 제2 발열소자가 구비되고, 상기 안테나 기판에 대하여 이격 공간을 가지도록 배치된 송수신 모듈 기판; 을 포함하고,A transceiving module substrate having a plurality of first heating elements generated by electric driving on a front surface thereof and a plurality of second heating elements generated by electric driving on a rear surface thereof, the transceiving module substrate disposed to have a spaced space with respect to the antenna substrate; Including, 상기 다수의 제1 발열소자로부터 발열된 열은 상기 송수신 모듈 기판의 전방으로 방열되고, 상기 다수의 제2발열소자로부터 발열된 열은 상기 송수신 모듈 기판의 후방으로 방열되는 다중 입출력 안테나 장치.And heat generated from the plurality of first heat generating elements is radiated to the front of the transmission / reception module substrate, and heat generated from the plurality of second heat generating elements is radiated to the rear of the transmission / reception module substrate. 청구항 1에 있어서,The method according to claim 1, 상기 이격 공간에 배치되고, 상기 안테나 기판의 안테나 소자 및 상기 송수신 모듈 기판의 상기 제1 발열소자를 신호 연결하는 다수의 RF 에어 라인; 을 더 포함하는 다중 입출력 안테나 장치.A plurality of RF air lines disposed in the separation space and configured to signal-connect the antenna elements of the antenna substrate and the first heating element of the transmission / reception module substrate; Multiple input and output antenna device further comprising. 청구항 1에 있어서,The method according to claim 1, 상기 다수의 제1 발열소자로부터 발생된 열을 방열시키기 위한 전방 방열부; 및A front heat dissipation unit for dissipating heat generated from the plurality of first heat generating elements; And 상기 다수의 제2 발열소자로부터 발생된 열을 방열시키기 위한 후방 방열부; 를 더 포함하는 다중 입출력 안테나 장치.A rear heat dissipation unit for dissipating heat generated from the plurality of second heat generating elements; Multiple input and output antenna device further comprising. 청구항 3에 있어서,The method according to claim 3, 상기 전방 방열부는,The front heat dissipation unit, 상기 송수신 모듈 기판의 전면이 밀착되도록 배치되고, 전방으로 다수의 메인 방열 핀이 돌출되게 구비된 전방 방열 본체; 및A front heat dissipation body disposed in close contact with the front surface of the transmission / reception module substrate and provided with a plurality of main heat dissipation fins protruding forward; And 상기 전방 방열 본체를 관통하도록 배치되고, 일단부가 상기 송수신 모듈 기판의 상기 제1 발열소자 중 적어도 일부와 밀착되며, 타단부에 상기 제1 발열소자로부터 전도된 열을 외부로 방열시키는 다수의 서브 방열 핀이 구비된 다수의 전방 단위 방열체; 를 포함하는 다중 입출력 안테나 장치.A plurality of sub heat dissipations disposed to penetrate the front heat dissipation main body, one end of which is in close contact with at least a portion of the first heat generating elements of the transceiving module substrate, and the other end dissipates heat conducted from the first heat generating elements to the outside; A plurality of front unit heat sinks provided with fins; Multiple input and output antenna device comprising a. 청구항 4에 있어서,The method according to claim 4, 상기 다수의 전방 단위 방열체는, 상기 다수의 서브 방열 핀이 상기 이격 공간에 노출되는 다중 입출력 안테나 장치.The plurality of front unit heat sinks, the multiple input and output antenna apparatus in which the plurality of sub heat dissipation fins are exposed to the separation space. 청구항 4에 있어서,The method according to claim 4, 상기 다수의 전방 단위 방열체는,The plurality of front unit heat sinks, 상기 제1 발열소자 중 어느 하나에 접촉되게 상기 전방 방열 본체에 결합시키는 결합부;A coupling part coupled to the front heat dissipation body to be in contact with any one of the first heat generating elements; 상기 결합부를 통해 전도된 열을 상기 이격 공간으로 전달시키는 전도부; 및A conducting unit transferring heat conducted through the coupling unit to the separation space; And 상기 전도부의 외주에 적층식으로 이격 구비된 상기 다수의 서브 방열 핀; 을 포함하는 다중 입출력 안테나 장치.The plurality of sub heat dissipation fins provided on the outer circumference of the conductive part in a stacked manner; Multiple input and output antenna device comprising a. 청구항 3에 있어서,The method according to claim 3, 상기 후방 방열부는,The rear heat dissipation unit, 상기 송수신 모듈 기판의 후면이 밀착되도록 배치되고, 후방으로 다수의 메인 방열 핀이 돌출되게 구비된 후방 방열 본체; 및A rear heat dissipation body disposed to closely contact a rear surface of the transmission / reception module substrate and having a plurality of main heat dissipation fins protruded to the rear; And 상기 후방 방열 본체를 관통하도록 배치되고, 일단부가 상기 송수신 모듈 기판의 상기 제2 발열소자 중 적어도 일부와 밀착되며, 타단부에 상기 제2 발열소자로부터 전도된 열을 외부로 방열시키는 다수의 서브 방열 핀이 구비된 다수의 후방 단위 방열체; 를 포함하는 다중 입출력 안테나 장치.A plurality of sub heat dissipations disposed to penetrate the rear heat dissipation main body, one end of which is in close contact with at least a portion of the second heat generating elements of the transmission / reception module substrate, and the other end dissipates heat conducted from the second heat generating elements to the outside; A plurality of rear unit heat sinks having fins; Multiple input and output antenna device comprising a. 청구항 7에 있어서,The method according to claim 7, 상기 다수의 메인 방열 핀은,The plurality of main heat dissipation fins, 좌측에서 상기 후방 방열 본체의 상하 중심선을 향하여 상향 경사지게 배치된 좌측 방열핀부; 및A left heat dissipation fin part disposed to be inclined upward toward a vertical center line of the rear heat dissipation main body from a left side; And 우측에서 상기 후방 방열 본체의 상하 중심선을 향하여 상향 경사지게 배치된 우측 방열핀부; 를 포함하는 다중 입출력 안테나 장치.A right heat dissipation fin part disposed to be inclined upward toward a vertical center line of the rear heat dissipation main body from a right side; Multiple input and output antenna device comprising a. 청구항 7에 있어서,The method according to claim 7, 상기 다수의 후방 단위 방열체는,The plurality of rear unit heat sinks, 상기 제2 발열소자 중 어느 하나에 접촉되게 상기 후방 방열 본체에 결합시키는 결합부;A coupling part coupled to the rear heat dissipation main body to be in contact with any one of the second heat generating elements; 상기 결합부를 통해 전도된 열을 상기 후방 방열 본체의 외부에 해당하는 외부 공간으로 전달시키는 전도부; 및A conducting unit configured to transfer heat conducted through the coupling unit to an external space corresponding to the outside of the rear heat dissipation main body; And 상기 전도부의 외주에 적층식으로 이격 구비된 상기 다수의 서브 방열 핀; 을 포함하는 다중 입출력 안테나 장치.The plurality of sub heat dissipation fins provided on the outer circumference of the conductive part in a stacked manner; Multiple input and output antenna device comprising a. 청구항 9에 있어서,The method according to claim 9, 상기 다수의 서브 방열 핀은 상기 외부 공간으로 갈수록 방열 면적이 줄어들게 형성된 다중 입출력 안테나 장치.The plurality of sub heat dissipation fins are formed to reduce the heat dissipation area toward the outside space multiple input and output antenna device. 청구항 9에 있어서,The method according to claim 9, 상기 후방 방열 본체에는 상기 결합부가 결합되는 결합 홀이 형성된 다중 입출력 안테나 장치.And a coupling hole in which the coupling part is coupled to the rear heat dissipation body. 청구항 7에 있어서,The method according to claim 7, 상기 송수신 모듈 기판은,The transceiver module substrate, 상기 다수의 제2 발열소자 중 일부가 실장되고, 상기 후방 방열부의 좌측 부위에 상하방향으로 길게 배치된 제1송수신 기판;A first transmitting / receiving substrate on which some of the plurality of second heat generating elements are mounted, the first transmitting / receiving substrate being elongated in a vertical direction on a left portion of the rear radiating unit; 상기 다수의 제2 발열소자 중 일부가 실장되고, 상기 후방 방열부의 우측 부위에 상하방향으로 길게 배치된 제2송수신 기판; 및A second transmitting / receiving substrate on which some of the plurality of second heat generating elements are mounted, the second transmitting / receiving substrate being elongated in a vertical direction on a right portion of the rear heat dissipation unit; And 상기 다수의 제2 발열소자 중 나머지 일부가 실장되고, 상기 제1송수신 기판 및 상기 제2송수신 기판 사이에 상하방향으로 길게 배치된 제3송수신 기판; 을 포함하는 다중 입출력 안테나 장치.A third transmitting / receiving substrate on which a part of the plurality of second heat generating elements is mounted, and disposed to be long in the vertical direction between the first transmitting and receiving substrate and the second transmitting and receiving substrate; Multiple input and output antenna device comprising a. 청구항 12에 있어서,The method according to claim 12, 상기 후방 방열 본체에는 상기 제3송수신 기판의 상기 다수의 제2 발열소자가 수용되는 수용 홈부가 상하방향으로 길게 형성된 다중 입출력 안테나 장치.And a plurality of accommodating recesses in which the plurality of second heat generating elements of the third transmitting and receiving substrate are accommodated in the rear heat dissipation main body in a vertical direction. 청구항 13에 있어서,The method according to claim 13, 상기 다수의 메인 방열 핀이 형성된 상기 후방 방열 본체의 외측면에는 상기 수용 홈부가 상기 후방 방열 본체의 내측면으로부터 외측면을 향하여 돌출되게 함몰 형성된 방열 배기 리브가 구비된 다중 입출력 안테나 장치.And a heat dissipation exhaust rib formed on the outer surface of the rear heat dissipation main body in which the plurality of main heat dissipation fins are formed, the recessed grooves being protruded from the inner surface of the rear heat dissipation main body toward the outer surface. 청구항 14에 있어서,The method according to claim 14, 상기 방열 배기 리브는, 삼각형의 꼭지점을 가지는 수평 단면을 가지도록 형성되고,The heat dissipation exhaust ribs are formed to have a horizontal cross section having a triangle vertex, 상기 다수의 메인 방열 핀은, 상기 방열 배기 리브의 꼭지점까지 연장 형성된 다중 입출력 안테나 장치.The plurality of main heat dissipation fins, the multiple input and output antenna device formed to extend to the vertex of the heat radiation exhaust rib. 청구항 15에 있어서,The method according to claim 15, 상기 다수의 메인 방열 핀은,The plurality of main heat dissipation fins, 좌측에서 상기 방열 배기 리브의 꼭지점을 향하여 상향 경사지게 배치된 좌측 방열핀부; 및A left heat radiation fin part disposed to be inclined upwardly toward a vertex of the heat radiation exhaust rib from the left side; And 우측에서 상기 방열 배기 리브의 꼭지점을 향하여 상향 경사지게 배치된 우측 방열핀부; 를 포함하고,A right heat dissipation fin part disposed to be inclined upward toward a vertex of the heat dissipation exhaust rib at a right side; Including, 상기 좌측 방열핀부와 상기 우측 방열핀부를 유동하는 열은 상기 방열 배기 리브를 통하여 외부로 배기되는 다중 입출력 안테나 장치.The heat flowing through the left heat dissipation fin portion and the right heat dissipation fin portion is exhausted to the outside through the heat dissipation exhaust ribs.
PCT/KR2019/004357 2018-04-11 2019-04-11 Multiple input and multiple output antenna apparatus Ceased WO2019199078A1 (en)

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WO2017086377A1 (en) * 2015-11-19 2017-05-26 日本電気株式会社 Wireless communication device
KR20180024674A (en) * 2016-08-31 2018-03-08 삼성전자주식회사 Antenna device and electronic device comprising the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4191783A4 (en) * 2020-07-27 2024-10-23 KMW Inc. ANTENNA DEVICE
US12381306B2 (en) 2020-07-27 2025-08-05 Kmw Inc. Antenna device
US12537290B2 (en) * 2020-12-02 2026-01-27 Kmw Inc. Antenna apparatus
WO2022257621A1 (en) * 2021-06-10 2022-12-15 中兴通讯股份有限公司 Base station heat dissipation architecture and base station

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