WO2019186893A1 - Display device production method - Google Patents

Abstract

The invention comprises: a layering step of layering a display function layer (2, 3) on a support substrate (1); a dicing step of dicing the display function layer, together with the support substrate, into a plurality of individual pieces; an irradiating step of irradiating with light from the support substrate side; and a separation step of separating the support substrate and the display function layer from each other. The invention further comprises a removal step of removing the display function layer partially, after the layering step and before the irradiation step, in such a manner that the support substrate is exposed at a peripheral edge portion in each of the individual pieces or in such a manner that the support substrate is exposed inwardly of the priority portion along the peripheral edge portion in each of the individual pieces.

Description

Display device manufacturing method

The present invention relates to a method for manufacturing a display device.

In a method for producing a flexible display device, for example, a display functional layer (for example, a resin layer made of polyimide or the like, a barrier layer, a thin film transistor layer, a light emitting element layer, on a supporting substrate such as glass, etc., through a release layer that is altered by light. And a sealing layer, and a laminated structure including a top film and the like as required) are laminated to form a mother laminate. Next, the display layer is separated into a plurality of pieces after separating the support substrate and the display function layer by irradiating light to alter the peeling layer. Alternatively, the mother laminate is cut and divided into a plurality of pieces, and then the support substrate and the display functional layer are separated by light irradiation. Thereby, a foldable flexible display device in which circuits such as various elements and wirings are mounted on a flexible resin layer such as polyimide can be obtained (for example, see Patent Document 1).

Japanese Patent Publication “Japanese Patent Laid-Open No. 2017-208254” (published on November 24, 2017)

Among the above manufacturing methods, after separating the support substrate and the display functional layer, when the display functional layer is divided into a plurality of pieces, when mounting on the flexible resin film, the resin film There is a problem that precise alignment becomes difficult due to expansion and contraction.

On the other hand, when the mother laminated body is cut and divided into a plurality of pieces, and then the support substrate and the display functional layer are separated, there is an advantage in that accurate alignment is easy. However, when the support substrate and the display functional layer are separated from each other by irradiating light from the support substrate side, the light is reflected and scattered by the glass end surface of the support substrate. It has been found that a problem may occur that the support substrate and the display functional layer cannot be separated while being bonded.

Therefore, one embodiment of the present invention has been made in view of the above problems, and an object thereof is to provide a method for manufacturing a display device that facilitates separation of a support substrate and a display functional layer and improves yield. And

A method for manufacturing a display device according to one embodiment of the present invention includes a stacking step of stacking a display functional layer on a support substrate, and a cutting step of cutting the display functional layer together with the support substrate into a plurality of pieces. A method for manufacturing a display device, comprising: an irradiation step of irradiating light from the support substrate side; and a separation step of separating the support substrate and the display functional layer, wherein the support substrate is provided at a peripheral portion of the individual piece. The display function after the laminating step and before the irradiating step so as to be exposed or so that the supporting substrate is exposed inside the priority portion along the peripheral edge of the piece. The method further includes a removing step of partially removing the layer.

According to one embodiment of the present invention, the support substrate and the display functional layer can be easily separated, and the yield can be improved.

It is a flowchart which shows an example of the manufacturing method of a display device. It is a figure explaining an example of the manufacturing method of a display device, (a) is sectional drawing after a lamination process and a removal process, (b) is sectional drawing after a division | segmentation process, (c) is after a mounting process. (D) is sectional drawing of an irradiation process, (e) is sectional drawing after a isolation | separation process. (A) is a top view which shows an example of the display device before a separation process, (b) is sectional drawing of the cross section A, (c) is sectional drawing of the cross section B. FIG. It is a figure explaining an example of the manufacturing method of a display device, (a) is sectional drawing after a lamination process, (b) is sectional drawing after a division | segmentation process, (c) is sectional drawing after a removal process (D) is a cross-sectional view after the mounting step, (e) is a cross-sectional view after the irradiation step, and (f) is a cross-sectional view after the separation step. (A) is a top view which shows an example of the display device before a separation process, (b) is sectional drawing of the cross section A, (c) is sectional drawing of the cross section B. FIG. It is sectional drawing which shows the structural example of the display area of a display device.

In the following, “lower layer” means that it is formed in a process prior to the layer to be compared, and “upper layer” means that it is formed in a process after the layer to be compared. means.

The embodiment of the present disclosure will be described with reference to FIGS. 1 to 6 as follows. Hereinafter, for convenience of explanation, components having the same functions as those described in the specific embodiment may be denoted by the same reference numerals and description thereof may be omitted.

Embodiment 1
The display device manufacturing method according to the present invention includes a stacking step of stacking a display function layer on a support substrate, a cutting step of cutting the display function layer together with the support substrate to divide the display function layer into a plurality of pieces, and a support substrate side. Including an irradiation step of irradiating light and a separation step of separating the support substrate and the display functional layer, and after the lamination step and the irradiation step so that the support substrate is exposed along the peripheral edge of the piece. Before the step, a removal step of partially removing the display function layer is further included.

At any stage after the lamination process and before the irradiation process, for example, the display function layer in a portion corresponding to the peripheral edge of the piece is partially removed before the separation process, thereby allowing a subsequent separation process. In this case, the support substrate and the display functional layer can be easily and reliably separated. That is, by removing in advance the display function layer corresponding to the entire peripheral edge of the piece, it is possible to prevent the occurrence of separation failure near the end of the piece.

Hereinafter, an embodiment (Embodiment 1) of the present invention will be described with reference to FIGS. 1 to 3 and FIG. In Embodiment 1, in the piece obtained after the dividing step, the display function layer is formed over the entire periphery of the end of the piece so that the side end of the display function layer is located inside the side end of the support substrate. Has been removed.

For example, in the removal step, the individual pieces in such a state are formed by forming slits having a predetermined width in the display function layer along the dividing line of the mother laminated body, and then cutting the mother laminated body along the dividing line. And can be manufactured by dividing into a plurality of pieces. Alternatively, the mother laminated body is cut along a dividing line and divided into a plurality of pieces, and then the display functional layer is removed and the support substrate is exposed over the entire circumference of the end of each piece. be able to.

FIG. 1 is a flowchart showing an example of a display device manufacturing method according to the present embodiment. FIG. 2 is a diagram for explaining an example of a method for manufacturing a display device according to the present embodiment. 3A is a plan view showing an example of a display device before the separation step according to the present embodiment, FIG. 3B is a cross-sectional view of the cross section A, and FIG. 3C is a cross-sectional view of the cross section B. . FIG. 6 is a cross-sectional view illustrating a configuration example of the display area of the display device.

When manufacturing the display device according to this embodiment, as shown in FIGS. 1 to 3 and 6, first, the display functional layer 13 is laminated on the translucent support substrate 1 to form the mother laminate 6. (Step S1, lamination process). Next, a slit 4 having a predetermined width is formed in the display function layer 13 along the dividing line 7 of the mother laminated body 6 so that the support substrate 1 at the peripheral edge of the divided piece is exposed (step S2). , Removal step). Next, the mother laminate 6 is cut along the dividing line 7 and divided into a plurality of pieces (step S3, a dividing step). At this time, since it is divided so that the outer wall of the slit 4 (the outer wall of the piece) is removed, the support substrate 1 is exposed at the peripheral edge of the piece. Next, the mounting member 10 is mounted on the mounting area 8 of the display function layer (step S4, mounting process). Next, light is irradiated from the support substrate 1 side (step S5, irradiation step). Next, the support substrate 1 and the display function layer 13 are separated to obtain the display device 11 (Step S6, separation step). These steps S1 to S6 can be performed using a display device manufacturing apparatus (including a film forming apparatus that performs each step of steps S1 to S5). In addition, you may implement step S2 (removal process) and step S3 (parting process) by changing order. That is, after dividing the mother laminated body 6, the display function layer 13 may be removed over the entire circumference of the end of each piece.

(Lamination process)
The lamination step is a step of forming the mother laminated body 6 by laminating the display function layer 13 on one surface of the support substrate 1 that is mother glass via a release layer (not shown).

The support substrate 1 is a support body that tentatively supports the display function layer 13 and may have a strength necessary for preventing the display function layer from being damaged or deformed. As the support substrate 1, a substrate having optical transparency is used. Thereby, when light is irradiated from the support substrate 1 side in the subsequent irradiation step, this light passes through the support substrate 1 and reaches the resin layer. As the support substrate 1, for example, a glass substrate and a plastic substrate made of an acrylic resin or the like can be used.

The release layer may be made of a conventional material that changes in quality by absorbing light irradiated through the support substrate 1. By sufficiently absorbing and changing the light, the peeling layer loses its strength or adhesiveness before light irradiation, and is easily destroyed by applying a slight external force, so that the support substrate 1 and the display function layer 13 can be easily formed. Can be separated. Note that although a mode in which a release layer is provided is described in this embodiment, the present invention is not limited to such a mode, and a release layer may not be provided. For example, if the supporting substrate is a plastic substrate, laser separation can be performed together with the laminate, so that a release layer is not necessary.

The display function layer 13 is a layer including the laminated structure 2 that exhibits a function of displaying an image. More specifically, a laminated structure 2 including a resin layer 112, a barrier layer 103, a thin film transistor (TFT) layer 104, a light emitting element layer 105, and a sealing layer 106 laminated on the support substrate 1, and if necessary, This is a layer including the upper film 3 that protects the laminated structure 2. The top film 3 may be in a range that can cover at least a part of the laminated structure 2. In the stacking step, the resin layer 112 adjacent to the support substrate 1, the barrier layer 103, the thin film transistor layer 104, the light emitting element layer 105, the sealing layer 106, and the top film 3 are stacked in this order. Further, the side end portions of the resin layer 112 are laminated so as to be positioned outside the side end portions of the TFT layer 104, the light emitting element layer 105, the sealing layer 106, and the top film 3. The barrier layer 103 may be outside the side end portion of the resin layer 112, and the side end portion of the resin layer 112 may be located outside the barrier layer 103. For example, the barrier layer 103 may be formed so as to cover the entire resin layer. Thereby, it is possible to prevent the resin from absorbing moisture in a wet process of TFT formation.

(Removal process)
In the present embodiment, the removing step is a step of removing the display functional layer 13 so that the support substrate 1 is exposed over the entire periphery of the end portion of the piece obtained by dividing the mother laminate 6.

More specifically, for example, as shown in FIG. 2A, a slit 4 having a predetermined width is formed in the display function layer 13 along the dividing line 7 of the mother laminate 6. Alternatively, the display function layer 13 may be removed over the entire periphery of the end portion of the obtained piece after the mother laminate 6 is divided in the dividing step described later.

As a result of the support substrate 1 being exposed by removing the display functional layer 13 in the removing step, as shown in FIGS. 2B and 3A to 3C, the side edges of the individual display functional layer 13 are obtained. The portion is located inside the side end portion of the support substrate 1. Thereby, the separation failure of the support substrate 1 and the display functional layer 13 in the vicinity of the end of the piece can be prevented.

The separation distance 9 between the side edge of the individual display function layer 13 and the side edge of the support substrate 1 reduces the distance between the panels in order to increase the number of panels obtained from one support substrate. From the viewpoint, it is preferably 1 mm or less. Further, the separation distance 9 between the side end portion of the individual display function layer 13 and the side end portion of the support substrate 1 is 0.2 mm or more from the viewpoint of avoiding the influence of laser light scattering at the glass end portion. It is preferable that

The display functional layer 13 can be removed by irradiating a portion to be removed with laser light. As the laser, a conventional laser such as a CO ₂ laser, a UV laser, and a YAG laser can be used. From the viewpoint of cost and accuracy, a CO ₂ laser and a UV laser can be particularly preferably used.

(Partition process)
The dividing step is a step of cutting the mother laminated body 6 along the dividing line 7 and dividing it into a plurality of pieces. For cutting the mother laminated body 6, for example, mechanical cutting using a diamond wheel or laser cutting is used. As the laser, a CO ₂ laser can be used.

(Mounting process)
As shown in FIGS. 2B and 2C, the mounting process is performed in the mounting area 8 (for example, the terminal portion) of the display function layer 13 on the mounting member 10 (for example, the IC chip and the FPC) as necessary. Electronic circuit board).

In addition, before mounting the mounting member 10 in the mounting process, the display function layer 13 is previously removed in the above-described removing process so that the support substrate 1 is exposed over the entire periphery of the end of each piece. Thereby, in the subsequent separation process, it is possible to prevent separation failure between the support substrate 1 and the display function layer 13 at the individual end portion located below the mounting member 10 and to separate them easily and reliably.

(Irradiation process)
The irradiation process is a process of irradiating light from the support substrate 1 side as shown in FIG. As the light irradiated in this step, laser light absorbed by the resin layer, that is, excimer laser, Nd: YVO ₄ laser, Yb: YAG laser, or the like can be used. Further, in the case where a release layer is provided between the support substrate and the resin layer, laser light having a wavelength that causes alteration of the release layer, flash lamp light, or the like can be used depending on the type of the release layer. .

Since these lights are reflected and scattered by the end face of the individual support substrate 1, it is difficult for a sufficient amount of light to reach the resin layer and the release layer on the end of the support substrate 1. As a result, the alteration of the resin layer and the release layer may be insufficient. However, in the present embodiment, the display function layer 13 at the individual piece end has already been removed before the irradiation step, so even if the resin layer and the release layer at the end of the individual piece are not sufficiently altered. In the subsequent separation step, the support substrate 1 and the display function layer 13 can be easily and reliably separated.

(Separation process)
The separation step is a step of obtaining the display device 11 by separating the support substrate 1 and the display functional layer 13 as shown in FIG.

After peeling off the support substrate 1 from the display function layer 13, a lower film 100 such as a polyethylene terephthalate (PET) film may be attached to the lower surface of the laminated structure 2 of the display function layer 13 as shown in FIG. . Thereby, the display device excellent in flexibility can be realized. Moreover, after peeling off the upper surface film 3 which protects the laminated structure 2, you may affix the functional film 139 which has an optical compensation function, a touch sensor function, a protection function, etc.

(Other processes)
As shown in FIG. 2 (a), the manufacturing method according to this embodiment is performed after the lamination process and before the irradiation process, for example, before the removal process. It may further include a cutting step of making a cut 5 at a predetermined position. Further, after the cutting step and before the mounting step, a peeling step of peeling the upper surface film 3 covering the mounting region 8 along the notch 5 may be further included. In the mounting region 8 exposed after the peeling process, for example, the mounting member 10 such as an electronic circuit board can be mounted on a terminal formed by any metal layer at an end portion of the TFT layer 104 described later.

The cutting step can be performed by irradiating a laser beam to a portion where the cut 5 is to be made. As the laser, a conventional laser such as a CO ₂ laser, a UV laser, or a YAG laser can be used.

As a more specific operation, for example, a cut 5 is formed in the upper film 3 by irradiating a predetermined position with laser light from the upper film 3 side of the mother laminate 6 with a weak output (cut process). Subsequently, the slit 4 is formed in the upper surface film 3 and the laminated structure 2 therebelow by irradiating the position of the dividing line 7 with a stronger output with laser light (removal step). After the formation of the cut 5 and the slit 4, the mother laminated body 6 is cut along the cutting line 7 to be divided into a plurality of pieces (cutting process), and the top film 3 covering the mounting region 8 is peeled from the cut 5. (Peeling process). Next, the mounting member 10 is mounted on the exposed mounting region 8 (mounting process). In regions other than the mounting region 8, it is preferable to leave the top film 3 until the separation step is completed. Thereby, the handleability in the subsequent steps can be improved, and adhesion of dust and the like can be prevented.

(Configuration of display area of display device 11)
As shown in FIG. 6, the display device 11 manufactured by the manufacturing method according to this embodiment includes a resin layer 112, a barrier layer 103, a thin film transistor (TFT) layer 104, a light emitting element layer 105, and a sealing layer 106. It has a structure.

Examples of the material of the resin layer 112 include polyimide. The resin layer portion can be replaced with a two-layer resin film (for example, a polyimide film) and an inorganic insulating film sandwiched between them.

The barrier layer 103 is a layer that prevents foreign substances such as water and oxygen from entering the TFT layer 104 and the light emitting element layer 105. For example, the barrier layer 103 is formed by a CVD method, such as a silicon oxide film, a silicon nitride film, or an oxynitride. A silicon film or a laminated film thereof can be used.

The TFT layer 104 includes a semiconductor film 115, an inorganic insulating film 116 (gate insulating film) above the semiconductor film 115, a gate electrode GE and a gate wiring GH above the inorganic insulating film 116, a gate electrode GE, An inorganic insulating film 118 above the gate wiring GH, a capacitive electrode CE above the inorganic insulating film 118, an inorganic insulating film 120 above the capacitive electrode CE, and a source wiring SH above the inorganic insulating film 120 And a planarizing film 121 (interlayer insulating film), which is an upper layer than the source wiring SH.

The semiconductor film 115 is made of, for example, low-temperature polysilicon (LTPS) or an oxide semiconductor (eg, an In—Ga—Zn—O-based semiconductor), and a transistor (TFT) is formed so as to include the semiconductor film 115 and the gate electrode GE. Is done. In FIG. 6, the transistor is shown with a top gate structure, but may have a bottom gate structure.

The gate electrode GE, the gate wiring GH, the capacitor electrode CE, and the source wiring SH are configured by, for example, a metal single layer film or a stacked film including at least one of aluminum, tungsten, molybdenum, tantalum, chromium, titanium, and copper. The The TFT layer 104 in FIG. 6 includes one semiconductor layer and three metal layers.

The inorganic insulating films 116, 118, and 120 can be formed of, for example, a silicon oxide (SiOx) film, a silicon nitride (SiNx) film, or a stacked film thereof formed by a CVD method. The planarization film 121 can be made of an applicable organic material such as polyimide or acrylic.

The light emitting element layer 105 includes an anode 122 that is an upper layer than the planarizing film 121, an insulating edge cover 123 that covers the edge of the anode 122, an EL (electroluminescence) layer 124 that is an upper layer than the edge cover 123, and an EL layer And a cathode 125 higher than 124. The edge cover 123 is formed, for example, by applying an organic material such as polyimide or acrylic and then patterning by photolithography.

For each subpixel, a light-emitting element ES (for example, OLED: organic light-emitting diode, QLED: quantum dot light-emitting diode) including an island-shaped anode 122, EL layer 124, and cathode 125 is formed in the light-emitting element layer 105. A sub-pixel circuit for controlling ES is formed in the TFT layer 104.

The EL layer 124 is configured, for example, by laminating a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in order from the lower layer side. The light emitting layer is formed in an island shape in the opening (for each subpixel) of the edge cover 123 by an evaporation method or an ink jet method. The other layers are formed in an island shape or a solid shape (common layer). Moreover, the structure which does not form one or more layers among a positive hole injection layer, a positive hole transport layer, an electron carrying layer, and an electron injection layer is also possible.

FMM (fine metal mask) is used when the light emitting layer of OLED is formed by vapor deposition. The FMM is a sheet having a large number of openings (for example, made of Invar), and an island-shaped light emitting layer (corresponding to one subpixel) is formed by an organic material that has passed through one opening.

The light emitting layer of the QLED can form an island-shaped light emitting layer (corresponding to one subpixel) by, for example, applying a solvent in which quantum dots are diffused by inkjet.

The anode 122 is composed of, for example, a laminate of ITO (IndiumＩＴＯTin Oxide) and Ag (silver) or an alloy containing Ag, and has light reflectivity. The cathode (cathode) 125 can be made of a light-transmitting conductive material such as MgAg alloy (ultra-thin film), ITO, or IZO (Indium zinc Oxide).

When the light-emitting element ES is an OLED, holes and electrons are recombined in the light-emitting layer by a driving current between the anode 122 and the cathode 125, and light is emitted in the process in which the excitons generated thereby transition to the ground state. . Since the cathode 125 is light-transmitting and the anode 122 is light-reflective, the light emitted from the EL layer 124 is directed upward and becomes top emission.

When the light-emitting element ES is a QLED, holes and electrons are recombined in the light-emitting layer due to the driving current between the anode 122 and the cathode 125, and the excitons generated thereby are conduction band levels of the quantum dots. Light (fluorescence) is emitted in the process of transition from valence band level to valence band.

In the light emitting element layer 105, a light emitting element (inorganic light emitting diode or the like) other than the OLED and QLED may be formed.

The sealing layer 106 is translucent, and includes an inorganic sealing film 126 that covers the cathode 125, an organic buffer film 127 that is above the inorganic sealing film 126, and an inorganic sealing film 128 that is above the organic buffer film 127. Including. The sealing layer 106 covering the light emitting element layer 105 prevents penetration of foreign matters such as water and oxygen into the light emitting element layer 105.

Each of the inorganic sealing film 126 and the inorganic sealing film 128 is an inorganic insulating film, and is formed of, for example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a stacked film thereof formed by a CVD method. be able to. The organic buffer film 127 is a light-transmitting organic film having a flattening effect, and can be formed of a coatable organic material such as acrylic. The organic buffer film 127 can be formed by, for example, inkjet coating, but a bank for stopping the liquid droplets may be provided in the non-display area.

A bottom film 110 shown in FIG. 6 is, for example, a PET film for realizing a display device with excellent flexibility by being attached to the bottom surface of the resin layer 112 after peeling the support substrate 1. 6 has at least one of an optical compensation function, a touch sensor function, and a protection function, for example.

[Embodiment 2]
Next, Embodiment 2 of the present invention will be described based on FIGS.

This embodiment (Embodiment 2) is carried out in the positional relationship between the portion of the display function layer 13 to be removed in the removal step and the dividing line 7 of the mother laminated body 6 (that is, the end portion of the piece obtained after dividing). Unlike the first embodiment, the other points are as described in the first embodiment.

4, the support substrate 1, the laminated structure 2 in the display functional layer, the top film 3, the slit 4, the mother laminated body 6, the dividing line 7, the mounting member 10, and the display device 11 are illustrated in FIG. The same reference numerals as in FIG. Since each member has the same configuration as that of the first embodiment, description thereof is omitted.

Further, in FIG. 4, after the dividing step (FIG. 4B) for cutting the mother laminated body 6 into individual pieces (FIG. 4B), the removing step for forming the slit 4 having a predetermined width in the display function layer 13 (FIG. 4 (FIG. 4B). Although c)) is performed, as described in the first embodiment, these may be performed by changing the order.

In the present embodiment, as shown in FIG. 4C and FIGS. 5A to 5C, the removing step is performed along the peripheral edge of the piece obtained by dividing the mother laminate 6. This is a slit forming step of forming a slit in the display function layer 13 so that the slit 4 is located inside (so that the outer wall of the slit 4 is maintained and the slit shape remains, unlike the first embodiment).

By forming the slit 4 at this position, unlike the first embodiment, the side end of the individual display function layer 13 and the side end of the individual support substrate 1 are at the same position, that is, the dividing line 7. Will be located on top. However, since the slit 4 in which the support substrate 1 is exposed is present on the inner side, it is possible to prevent the occurrence of separation failure in the vicinity of the end portions of the individual pieces in the subsequent separation step.

Further, by forming the slit 4 at this position, as shown in FIGS. 4 (c) to (f) and FIG. 5, the guide 12 on the frame made of the display function layer 13 is formed at the peripheral portion of the piece. The Due to the presence of such a guide 12, when the display device 11 is peeled from the support substrate 1 in the subsequent irradiation process and separation process, it is possible to prevent the display device 11 from slipping, shifting, dropping, and the like. The display device 11 may be peeled off by adsorption after the irradiation process. After being singulated as in this embodiment, peeling by adsorption is easier to perform.

Alternatively, before the separation step, the display function layer 13 between the guide 12 portion, that is, the end of the piece and the slit 4 is removed, and the entire end of the piece is the same as in the first embodiment. The display functional layer 13 may be removed over the circumference.

The separation distance between the side edges of the support substrate 1 and the display function layer 13 and the inner edge of the slit 4 (that is, the separation distance between the dividing line 7 and the inner edge of the slit 4) is determined by the laser. From the viewpoint of reliable irradiation, the width should be small. For example, it is preferably 1 mm or less, and may be set as appropriate depending on the type of laser. For example, it is about 100 μm for a CO ₂ laser and about 50 μm for a UV picosecond laser.

[Summary]
[Aspect 1]
A laminating step of laminating a display functional layer on a support substrate, a dividing step of cutting the display functional layer together with the support substrate and dividing it into a plurality of pieces, an irradiation step of irradiating light from the support substrate side, A method for manufacturing a display device, comprising a separation step of separating the support substrate and the display functional layer,
After the laminating step, the irradiation is performed so that the support substrate is exposed at the peripheral portion of the piece or the support substrate is exposed inside the priority portion along the peripheral portion. A method for manufacturing a display device, further comprising a removing step of partially removing the display functional layer before the step.

[Aspect 2]
The display device manufacturing method according to, for example, aspect 1, wherein the removing step is performed before the dividing step.

[Aspect 3]
The display function layer is partially removed in the removing step so that the side end portion of the display function layer of the piece is positioned inside the side end portion of the support substrate of the piece, for example, the aspect 1 or 3. A method for producing a display device according to 2.

[Aspect 4]
The manufacturing method of the display device of the aspect 3, for example, wherein the separation distance between the side end portion of the display functional layer of the piece and the side end portion of the support substrate of the piece is 1 mm or less.

[Aspect 5]
The removing step is a slit forming step of forming a slit having a predetermined width in the display function layer,
The slits are formed so that the side end portions of the display functional layer of the individual pieces and the side end portions of the support substrate of the individual pieces are at the same position, and the slits are positioned inside these side end portions. For example, the manufacturing method of the display device of aspect 1 or 2.

[Aspect 6]
The method for manufacturing a display device according to aspect 5, for example, wherein a separation distance between a side end portion of the individual display function layer and an inner edge portion of the slit is 1 mm or less.

[Aspect 7]
After the slit forming step and before the separating step, the method further includes a step of removing the display functional layer between the side end portion of the individual display functional layer and the slit, for example, the aspect 5 or 7. A method for producing a display device according to 6.

[Aspect 8]
The laminating step includes laminating a resin layer, a barrier layer, a thin film transistor layer, a light emitting element layer, a sealing layer, and a top film adjacent to the support substrate in this order, and a side end portion of the resin layer is formed of the thin film transistor. The method for producing a display device according to any one of aspects 1 to 7, for example, wherein the layers are laminated so as to be located outside the side end portions of the layer, the light emitting element layer, the sealing layer, and the top film.

[Aspect 9]
The said resin layer is a manufacturing method of the display device of the aspect 8, for example which is a layer which consists of polyimides.

[Aspect 10]
After the lamination step and before the irradiation step, a cutting step for cutting the upper surface film, a peeling step for peeling the upper surface film covering the mounting region, and a mounting member on the exposed mounting region Further includes a mounting step of mounting
The display device manufacturing method according to, for example, the aspect 8 or 9, wherein the mounting step is performed after the removing step.

[Aspect 11]
The method for manufacturing a display device according to any one of aspects 1 to 10, for example, wherein the display functional layer is partially removed using a CO ₂ laser or a UV laser in the removing step.

DESCRIPTION OF SYMBOLS 1 Support substrate 2 Laminated structure 3 Top film 4 Slit 5 Notch 6 Mother laminated body 7 Dividing line 8 Mounting area 10 Mounting member 11 Display device 12 Guide 13 Display functional layer

Claims (11)

A laminating step of laminating a display functional layer on a support substrate, a dividing step of cutting the display functional layer together with the support substrate and dividing it into a plurality of pieces, an irradiation step of irradiating light from the support substrate side, A method for manufacturing a display device, comprising a separation step of separating the support substrate and the display functional layer,
After the laminating step, so that the support substrate is exposed at the peripheral edge of the individual pieces, or so that the support substrate is exposed inside the peripheral edge along the peripheral edge of the individual pieces, and A method for manufacturing a display device, further comprising a removing step of partially removing the display functional layer before the irradiation step. The method for manufacturing a display device according to claim 1, wherein the removing step is performed before the dividing step. The display function layer is partially removed in the removing step so that a side end portion of the display function layer of the individual piece is positioned inside a side end portion of a support substrate of the individual piece. 3. A method for producing a display device according to 2. The method for manufacturing a display device according to claim 3, wherein a distance between a side end portion of the display functional layer of the piece and a side end portion of the support substrate of the piece is 1 mm or less. The removing step is a slit forming step of forming a slit having a predetermined width in the display function layer,
The slits are formed so that the side end portions of the display functional layer of the individual pieces and the side end portions of the support substrate of the individual pieces are at the same position, and the slits are positioned inside these side end portions. The manufacturing method of the display device of Claim 1 or 2. The method for manufacturing a display device according to claim 5, wherein a distance between a side end portion of the display function layer of the individual piece and an inner edge portion of the slit is 1 mm or less. 6. The method further comprising the step of removing the display function layer between the slit and the side end of the display function layer of the individual piece and after the slit formation step and before the separation step. 7. A method for producing a display device according to 6. The laminating step includes laminating a resin layer, a barrier layer, a thin film transistor layer, a light emitting element layer, a sealing layer, and a top film adjacent to the support substrate in this order, and a side end portion of the resin layer is formed of the thin film transistor. The method for manufacturing a display device according to any one of claims 1 to 7, wherein the layer is laminated so as to be located outside a side end portion of the layer, the light emitting element layer, the sealing layer, and the top film. The method for manufacturing a display device according to claim 8, wherein the resin layer is a layer made of polyimide. After the lamination step and before the irradiation step, a cutting step for cutting the upper surface film, a peeling step for peeling the upper surface film covering the mounting region, and a mounting member on the exposed mounting region Further includes a mounting step of mounting
The method for manufacturing a display device according to claim 8, wherein the mounting step is performed after the removing step. The method for manufacturing a display device according to any one of claims 1 to 10, wherein in the removing step, the display function layer is partially removed using a CO ₂ laser or a UV laser.

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