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WO2019185403A1 - Connexions électroniques flexibles - Google Patents

Connexions électroniques flexibles Download PDF

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Publication number
WO2019185403A1
WO2019185403A1 PCT/EP2019/056865 EP2019056865W WO2019185403A1 WO 2019185403 A1 WO2019185403 A1 WO 2019185403A1 EP 2019056865 W EP2019056865 W EP 2019056865W WO 2019185403 A1 WO2019185403 A1 WO 2019185403A1
Authority
WO
WIPO (PCT)
Prior art keywords
elastic
contact
contact pad
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2019/056865
Other languages
English (en)
Inventor
Frank Singer
Siegfried Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of WO2019185403A1 publication Critical patent/WO2019185403A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H10W72/30—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10W70/63—
    • H10W72/01204—
    • H10W72/072—
    • H10W72/07204—
    • H10W72/073—
    • H10W72/20—
    • H10W72/241—
    • H10W72/29—
    • H10W74/00—
    • H10W74/15—
    • H10W90/724—

Definitions

  • the present invention relates to a method of forming an elastic electrical connection and to an arrangement comprising an optoelectronic device.
  • the present in vention provides a solution that can be used in applications that places high demands on the mechanical flexibility of the assembly technology and where known planar flexible structures cannot be used to satisfaction.
  • the technology described herein provides a spatially flexible contact arrangement during assembly as well as in use.
  • an elastic polymer is provided with a me tallic layer and with an additional contact surface.
  • ductile metal structures that can ab sorb strong mechanical deformations and rotations are provided.
  • a method of forming an elastic electrical connection in accordance with the invention may include forming a conductive elastic structure on a conductive part of a substrate, apply ing an elastic layer on the substrate such that the elastic structure is substantially embedded in said elastic layer, but with at least one surface extending out of the elastic layer, and attach ing a first contact pad on the one surface extending out of the elastic layer.
  • Substantially embedded is here intended to mean that at the very least the top sur face of the elastic structure is not covered by the elastic layer, and that if more of the elastic structure protrudes or extends out of the elastic layer the part that is embedded in the elastic layer should be sufficiently large to prevent forces and impacts that can reasonably be ex pected to be applied to the extending part during assembly from causing damage.
  • the extend ing portion of the elastic structure could, for example, be anywhere in the range from 0% to 10% of the total length of the elastic structure.
  • the step of forming a conductive elastic struc ture includes providing an elastic material on the conducting part of the substrate, and provid ing a metallic layer on the outside of the elastic structure such that the metallic layer is electri cally connected to the conductive part of the substrate. This may increase the elasticity and/or flexibility of the elastic structure compared with the alternative, which is to make the elastic structure from massive metal, which is also consistent with the principles of the invention.
  • the conductive elastic structure may include an elastic material on the conducting part of the substrate, and a metallic layer on the outside of the elastic structure, but in some embodiments it may be of massive metal. It may contain different metal portion attached to gether to form a shape capable of compensate for certain tension or stress exerted onto the connection.
  • the method further comprises providing an electrical component with a second contact pad, positioning the electrical component such that an exposed surface of the second contact pad is brought into contact with an exposed surface of the first contact pad, and removing the elastic layer.
  • the component and the sub strate may be may be bonded, soldered or welded together by their respective contact pads.
  • the method further comprises providing an electrical component with a second contact pad, positioning the electrical component such that an ex posed surface of the second contact pad is brought into contact with an exposed surface of the first contact pad, and removing the elastic layer.
  • the component and the substrate may be held together mechanically in the correct position, or the surfaces of the contact pads may be bonded together.
  • the first contact pad may be eccentrically positioned on the one surface of the elastic structure extending out of the elastic layer.
  • the method may then further comprise bonding the first contact pad to the second contact pad using a metallic bond.
  • the metallic bond may be provided using a method selected from the group consisting of: stub bumping, wedge bumping, and ball bumping.
  • the attachment/bonding of the component to the substrate using an elastic connection provided by the invention may be removed before an electrical component is provided.
  • An electrical component with a contact pad may then be provided and positioned such that an exposed surface of the contact pad on the electrical component is brought into contact with an edge of the contact pad. This will enable the electrical component to be positioned substantially perpendicular to the substrate.
  • the electrical component may be a flip chip.
  • the electrical component may be a LED flip chip
  • the method may further comprise applying a reflective elastic layer containing a highly reflective material, such that the elastic structure and the contact pads are at least partly embedded in the reflective elastic layer while the LED flip chip extends out of the reflective elastic layer.
  • the reflective elastic layer may be titanium oxide in a silicone ma trix.
  • the method may further comprise applying a converting elastic layer containing a light converting material, such that the elastic structure, the contact pads and the LED flip chip are embedded in the reflective elastic layer.
  • the converting elastic layer may be a phosphorous material in a sili cone matrix.
  • the converting elastic layer is a combination of two sublayers, a first sublayer containing a first phosphorous material and applied on the substrate such that the elastic structure and at least part of the contact pads are embedded in the first sublayer, and a second sublayer containing a second phosphorous material and applied on the first sub layer such that the LED flip chip is embedded in the second sublayer.
  • a substrate having at least two elastic contact stubs protruding from the surface of the substrate is provided.
  • Each elastic contact stub comprises a conductive elastic structure and a contact pad and an optoelectronic device having a light emitting sur face at least two contact pads, wherein the light emitting surface is substantially perpendicular to the surface of the substrate and the contacts pads are electrically contacted to the contacts pads of the elastic contact stubs.
  • FIG. la-d show embodiments of a connection element according to the invention.
  • FIG. 2a-f show a number of stages in a method of providing an elastic connection el ement and connecting a component
  • FIG. 3 is a flowchart illustrating a method according to an embodiment of the inven tion
  • FIG. 4a-b show assembly stages of another embodiment of the invention.
  • FIG. 5a-b show assembly stages according to yet another embodiment of the inven tion;
  • FIG. 6 shows an embodiment of the invention including a reflective layer
  • FIG. 7 shows an embodiment of the invention including a converting layer
  • FIG. 8 shows an embodiment of the invention including two different converting lay ers
  • FIG. 9 shows an embodiment of the invention where a component is positioned per pendicularly to the substrate.
  • connections that are provided between different layers of a substrate, between contact pads on adjacent compo nents that are in close proximity to each other, for example between a printed circuit board and a flip chip, and between contact pads on a substrate and corresponding contact pads on surface mounted components provided on that substrate.
  • Terminology used in the art include terms like “connections”, “stubs”, “balls”, “bumps”, “wires”, etc. These terms are sometimes used in combination and sometimes alone, or in combination with terms describing material or process steps used to form them or bond them to each other. In the present disclosure the terms are not intended to be interpreted as implying limitations that have not been explicitly included in the attached patent claims.
  • the expressions "flexible” and “elas tic” might be used in relation to contacts, stubs, FCB's, circuits boards or other elements.
  • the expression refer to an element, which can absorb certain tension and stress without breaking or losing its intended purpose.
  • a flexible or elastic element for example can bend in a certain direction without losing its electrical property. All the disclosed elements will exhibit a certain elasticity as well as a certain flexibility, and use of one term should not be interpreted as im plying an exclusion of the property described by the other term.
  • terminol- ogy is not intended to be interpreted as implying limitations that have not been explicitly in cluded in the attached patent claims.
  • connections provided by the present invention provides a number of technical results that may be utilized in design of flexible electronic circuits.
  • the elastic nature of the connections reduces mechanical stress on the chip contacts. They also allow the chips to be embedded in highly reflective or light converting polymer matrix systems. This may be utilized with SMT-mountable LED chips such as sapphire flip chips in flexible applications.
  • the invention also provides a new assembly processes due to the elastic/flexible contact con nections with these properties.
  • FIG. la shows a view of two connection elements according to an embodiment of the invention.
  • the connection elements are mounted on a substrate 10 which may, for example, be a printed circuit board (PCB), a flexible circuit board and the like.
  • the board may contain all kinds of circuitry (not shown), like for instance, control circuits, driver circuits and the like.
  • the connection elements are provided on a conductive part of the substrate, for example on contact pads 12 provided on the surface of the PCB.
  • the substrate contact pads 12 may be part of a conducting pattern on the PCB.
  • connection elements include an elastic material 14, for example a polymer, extending upward from the substrate contact pad 12 and covered by a metallic, electrically conducting layer 16. This part of the connection element is shown in a cross sectional view in order to show the elastic material 14 which otherwise would not be visible since it is covered by the metallic layer 16.
  • the elastic material 14 covered by the me tallic layer 16 makes up an electrically conducting elastic structure 18.
  • a first contact pad 22 which may be a metallic disc.
  • Metallic lay er 16 electrically conducts pad 22 as seen in Figure 1.
  • First contact pad 22 is attached to elastic structure 18 in a non-detachable way. As explained later various option are available to at tached pad 22 to structure 18.
  • First contact pad 22 is arranged centrally on structure 18 and has a contact surface 24, i.e. a surface which is substantially parallel with the substrate 10, and which is able to provide electrical contact with further electrical components resting on top of or attached to the connection element.
  • FIG. lb shows a similar view, but in this embodiment the contact pad 22 is positioned eccentrically on top of the elastic structure 18 (which in this now shown in side view, not in a cross sectional view).
  • FIG. lb can be interpreted as an alternative to the embodiment in FIG. la (with the second part centrally and eccentrically positioned on top of the first part, respectively), the two figures may also be interpreted as views of connec tion elements with eccentrically positioned second parts, viewed from the front and the side, respectively.
  • the increased momentum on the elastic structure 18 means that for some embodiments the elas tic structure may be massive metal rather than a core of elastic material covered in a metallic layer. This will be discussed in further detail below.
  • FIG. lc shows a perspective view of an embodiment where the contact pad 22 is cen tered on the elastic structure 18.
  • FIG. Id shows a perspective view of an embodiment where the contact pad 22 is eccentrically positioned on the elastic structure 18.
  • the contact pad 22 in both cases is shaped as a cylindrical disk.
  • Other embodiments for element 22 may provide different shapes, like for instance a half sphere, cone like structure, round top surface and the like.
  • FIG. 2 shows in a series of steps how connection elements according to the embodi ment in FIG. 1 can be made and brought in contact with an additional component, for example an LED flip chip.
  • an additional component for example an LED flip chip.
  • the elastic material 14 is provided on or directly adja cent to a conductive part of the substrate 10, for example a contact pad 12.
  • Elastic material is a stub and protrudes above the surface.
  • the stub of material 14 can be between several pm up to one or more mm.
  • the substrate contact pad 12 may, for example, be part of a conduc tive pattern on a PCB, as described with reference to FIG. 1.
  • the elastic material 14 is covered with a metallic layer 16.
  • the elastic material 14 may be a suitable polymer, for example a polyamide or polyethylene, and the metallic layer may be copper, gold, silver, titanium or alloys thereof.
  • the metallic layer 16 should be in electrical contact with the substrate contact pad 12.
  • the application of the metallic layer may be done by evaporation or some other deposition method known in the art, such as chemical vapor deposition (CVD), sputtering, etc.
  • Photo masks and etching techniques may be used in an in termediate step in order to prevent deposition of the metallic layer at undesired location.
  • the elastic material may be arranged on the substrate prior to actually creating the metal layer on the elastic material and the substrate. In such ap proach the metal layer and the contact pads and/or other electric connection on the surface may be generated in a single step.
  • the substrate 10 may be covered with a layer of elastic polymer 20.
  • This layer 20 is substantially flush with the top level of the first part of the connection element, but with at least the end surface of the metallic layer 16 extending out of the elastic layer 20.
  • the elastic layer 20 serves to provide stability when in a next step, shown in FIG. 2d, a contact pad 22 is provided on top of the elas tic structure 18.
  • the contact pad 22 has an exposed contact surface 24 which constitutes the contact surface of the contact pad 22.
  • Contact pad 22 can have a size with is significantly larg er than the top are of stub 18. This provides larger tolerances in subsequent manufacturing steps. Its thickness is sufficiently large to provide certain mechanical stability when a chip is placed on the contact pad. It may be in the range of several lOOpm.
  • the elastic layer 20 may, for example, be silicone or polysiloxane. It should be noted that since this elastic layer is intended to provide support during assembly and will be re- moved, its desired properties may vary from one embodiment or situation to another, and it may not be necessary for this layer to be elastic in all embodiments of the invention.
  • FIG. 2e shows how a component 25, which may for example be an LED flip chip, can be positioned or mounted on top of the connection element.
  • the component 25 has its own contact pads 26 with contact surfaces matching those of the connection element mounted on the substrate 10.
  • the presence of the layer of elastic polymer 20 serves to prevent damage to the connection elements during assembly.
  • the contact surfaces of the contact pads 22, 26 may be bonded together using any suitable bonding technique, or attached together using soldering techniques, such as solder bump bonding. This will be discussed in further detail below.
  • the elastic poly mer 20 may be removed, for example by using a suitable solvent such as acetone.
  • a suitable solvent such as acetone.
  • FIG. 2f illustrates how electrical contact is provided between the sub strate contact pad 12 and the component 25 through the metallic layer 16 covering the elastic material 14, and the metallic contact pads 22, 26.
  • the metallized elastic material stub 14 al lows substrate 10 to bend into one or more directions without breaking the connection be tween the contact pads 22 and pads 26 of the component. It also provides some compensa tion in case of different thermal behavior between the substrate and the component.
  • a first step S301 the elastic material 14 is formed on the conducting part 12 of the substrate 10.
  • a metallic layer 16 is provided on the outside of the elastic material 14, providing an elastic structure 18, and in contact with the conducting part 12 of the substrate 10.
  • the elastic material 14 may be unnecessary and the elastic structure 18 may be of metal only.
  • step S303 the elastic layer 20 is provided on the substrate 10 such that the elastic structure 18 is substantially embedded, but with at least an end surface extending out side the elastic layer 20.
  • a contact pad 22 can now be attached to the exposed surface of the elastic structure 18. This attachment can be done in any suitable metallic bonding technique known in the art. In some embodiments of the invention the contact pad 22 is eccentrically positioned on the elastic structure, as will be described in further detail below.
  • the process may halt at this point, or subse quent to removal of the elastic layer 20.
  • a substrate 10 for example a PCB with exposed connection elements that can be used later when the PCB receives additional com ponents.
  • This may be the case when the connection elements along with other components are mounted on a PCB in a production facility, but where the PCB is later sold or distributed in order to be mounted in a product such as a piece of clothing, an automobile, or a curtain at a later date.
  • step S305 a component with a corresponding contact pad is attached such that the corresponding contact pads are brought in contact with each other.
  • step of attaching the component 25 (for example a flip chip) will be described below in further detail, and it may be performed in a number of different ways that are all consistent with the invention.
  • the elastic layer may be removed from the substrate. In some embodiment this step may be performed before the component 25 is attached, for example, as already described, because the step of attaching the component 25 will commence later at a different facility, where it may be difficult to remove the elastic layer 20, or because the component 25 (or other components or parts) are to be mounted such that they are brought in contact with the surface of the substrate 10 itself.
  • FIG. 4a there is illustrated an embodiment where an elastic structure 18 with a metallic outer layer, or alternatively an elastic structure 18 made only of metal, is provided on a substrate contact pad 12, embedded in an elastic layer 20 and provided with an eccentrically positioned first contact pad 22.
  • An electric component 25, which may for exam ple be a flip chip with a corresponding second contact pad 26 is shown as it is about to be brought into contact with the exposed contact surface 24 of the contact pad 22.
  • a metallic bond 27 is provided on the surface of the second contact pad 26.
  • FIG. 4b shows the same components after they have been fully assembled and the elastic layer 20 has been removed. As can be seen from the drawing the center axis of the elastic structure 18 does not pass through the metallic bond 27.
  • the elastic structure 18 and the metallic bond 27 are attached to the first contact pad 22 on or towards opposing edges or sides such that if the component 25 is subject to a physical force causing it to move relative to the substrate 10, this motion will be absorbed by the elastic structure 18, which may bend or twist depending on the direction of the force.
  • the offset between the elastic structure 18 and the metallic bond 27 allows the forces that work to move the component 25 relative to the substrate 10 to be absorbed to a larger degree than when the contact pads are centered as in the embodiment illustrated in FIG. 2.
  • FIG. 5 shows an embodiment which largely corresponds to the embodiment shown in FIG. 4.
  • the metallic bond 28 is a solder ball, or another suitable ball bump ing material such as gold, conductive epoxy (i.e. an epoxy filled with a metallic material such as silver), or copper.
  • the contact pads may then be bonded together using bumping.
  • the metallic bond 27, 28 can be a small solder or bonding bump, a small pellet or solder ball, or a metallic disc made from the same material as the contact pad 26, but with a different diameter. The pellet is attached and bonded to the component con tact pad 26. When the component 25 is correctly positioned the metallic bond 27, 28 can be connected/bonded to the surface 24 of the first contact pad 22.
  • FIG. 6 shows an embodiment wherein, subsequent to the assembly steps described with reference to FIG. 3, a layer of elastic, highly reflective material 30 such as for example a titanium oxide in a silicone matrix is deposited on the substrate 10 subsequent to the removal of the elastic layer.
  • a layer of elastic, highly reflective material 30 such as for example a titanium oxide in a silicone matrix is deposited on the substrate 10 subsequent to the removal of the elastic layer.
  • the connection element can be embedded in an elastic layer which at the same time provides reflection of light generated by a LED flip chip component 25.
  • connection element and a LED flip chip component 25 mount ed on top of the connection elements are embedded in an elastic converter material 32, which may be a converter in a silicone matrix.
  • the converter may, for example, be phosphor which is well known in the art for converting the color of light emitted from LED's.
  • the elastic contact element 18 with their contacts pads are bonded or soldered to the contact pads 26 of the chip.
  • the overall arrangement can be bend ed up to a certain degree without the contact pads 26 being ripped away from the respective pads 22.
  • the stubs can have an overall length of one or more mm.
  • FIG. 8 shows yet another embodiment where a flexible substrate 10, for example pol- yimide, is provided with a flexible conductive pattern 12 such as a copper foil circuit connect ed to connection elements which again are connected to a plurality of LED flip chips 25.
  • the connection elements are embedded in a first flexible layer 32.1 with a first phosphorous mate rial, while a second flexible layer 32.2 with a second phosphorus material is provided on top of the first flexible layer 32.1, embedding the LED flip chips 25.
  • a reflective material 30 may be used instead of the first flexible layer 32.1.
  • a connec tion element includes an stub elastic structure 18 constructed in accordance with the above description, i.e. either with an elastic material 14 covered by a metallic layer 16 or with a mas sive metallic structure.
  • the selected method along with choice of materials and dimensions may depend on the size and weight of the component 25 and the extent to which the compo nent 25 is expected to be exposed to forces, as a matter of design choice.
  • the component can be an optoelectronic device such as a LED and the like. Arrangement in the form as illustrated in Fig. 9 enable the optoelectronic device to emit light substantially parallel to the substrate.
  • the contact with the component contact pad 26 is made not with the top surface of the first connecting pad, but with the side surface 24. Again, the contact pads are bonded or soldered together or otherwise rigidly attached to each other.
  • the arrangement is still flexible when being bended as the flexible stubs allow to be bended. Hence, such side emitter can be ar ranged on a flexible circuit board.
  • the compo nent 25 is held as a result of connections according to the invention being provided on both sides of the component. This may be supplemented by bonding as well as adhesives.
  • the flexible contact connection is not restricted to this purpose.
  • circuitry can be included in a chip and then arranged as a functional module on a flexible substrate.
  • the flexible connection provide the electrical contact and maintain a certain flexibility for bending and absorb tensions to a higher level compared to rigid contacts.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention porte sur un procédé de formation d'une connexion électrique élastique consistant à former une structure élastique conductrice (18) sur une partie conductrice d'un substrat (10), à appliquer une couche élastique (20) sur le substrat (10) de telle sorte que la structure élastique (18) est sensiblement incorporée dans ladite couche élastique (20) tout en présentant au moins une surface qui s'étend hors de la couche élastique, et à fixer un premier plot de contact (22) sur la surface s'étendant hors de la couche élastique (20).
PCT/EP2019/056865 2018-03-28 2019-03-19 Connexions électroniques flexibles Ceased WO2019185403A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DKPA201870193 2018-03-28
DKPA201870193 2018-03-28

Publications (1)

Publication Number Publication Date
WO2019185403A1 true WO2019185403A1 (fr) 2019-10-03

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US20120252168A1 (en) * 2011-04-01 2012-10-04 International Business Machines Corporation Copper Post Solder Bumps on Substrate
US20120280386A1 (en) * 2011-05-03 2012-11-08 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US20120313239A1 (en) * 2011-06-13 2012-12-13 Tessera, Inc. Flip chip assembly and process with sintering material on metal bumps
US20170365760A1 (en) * 2013-03-15 2017-12-21 Grote Industries, Llc Flexible lighting device including a nano-particle heat spreading layer

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