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WO2019179008A1 - 一种加热组件 - Google Patents

一种加热组件 Download PDF

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Publication number
WO2019179008A1
WO2019179008A1 PCT/CN2018/100499 CN2018100499W WO2019179008A1 WO 2019179008 A1 WO2019179008 A1 WO 2019179008A1 CN 2018100499 W CN2018100499 W CN 2018100499W WO 2019179008 A1 WO2019179008 A1 WO 2019179008A1
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WIPO (PCT)
Prior art keywords
heating
tube
carrier
assembly
elements
Prior art date
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Ceased
Application number
PCT/CN2018/100499
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English (en)
French (fr)
Inventor
管长乐
南建辉
张金斌
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Beijing Chuangyu Technology Co Ltd
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Beijing Chuangyu Technology Co Ltd
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Publication date
Application filed by Beijing Chuangyu Technology Co Ltd filed Critical Beijing Chuangyu Technology Co Ltd
Publication of WO2019179008A1 publication Critical patent/WO2019179008A1/zh
Anticipated expiration legal-status Critical
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    • H10P72/0436—
    • H10P72/0432—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation by radiant heating of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H10P72/0612—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/032—Heaters specially adapted for heating by radiation heating

Definitions

  • the present invention relates to the field of semiconductor device processing technologies, and in particular, to a heating assembly.
  • Epitaxial films or materials are widely used by methods of growth or deposition on a substrate by a chemical vapor deposition (CVD) process or a metal organic CVD (MOCVD) process. Epitaxial films or materials are typically used for specific devices, such as optoelectronic devices, solar devices. Etc. will include multiple layers of different components.
  • CVD chemical vapor deposition
  • MOCVD metal organic CVD
  • CVD techniques are often classified by reaction type or pressure, including low pressure CVD (LPCVD), atmospheric pressure CVD (APCVD), plasma enhanced CVD (PECVD), and metal organic compound CVD (MOCVD).
  • LPCVD low pressure CVD
  • APCVD atmospheric pressure CVD
  • PECVD plasma enhanced CVD
  • MOCVD metal organic compound CVD
  • a common feature is that the chamber for process deposition is isolated from the atmosphere, and the wafer substrate used for the deposition of the thin film process needs to be heated to a certain process temperature, such as APCVD for silicon epitaxy and MOCVD for depositing GaN, and its epitaxial process.
  • the temperature exceeds 1000 °C.
  • How to maintain temperature uniformity at high temperatures has a huge impact on the process results. For example, the temperature uniformity of MOCVD equipment in the LED industry is required to reach 1 °C.
  • the wafer carrier is transferred to the process deposition chamber along the wafer carrier track for support by the wafer carrier.
  • the lower surface of the wafer susceptor of the wafer substrate is exposed to energy radiated from the heat lamp assembly while the wafer substrate is heated by the wafer susceptor to the process temperature.
  • the infrared heating lamp assembly is disposed below the wafer carrier track, and includes a plurality of infrared heating lamps 624 having the same mounting height, and the plurality of infrared heating lamps 624 are arranged in parallel to form a heating zone.
  • the above-mentioned infrared heating lamps are arranged in parallel, although the electric quantity of each of the lamps can be independently adjusted to control the energy of the tube radiation, but only the temperature distribution of the tubes in the parallel arrangement direction can be adjusted, and the lamps are
  • the temperature distribution in the vertical direction of the tube arrangement cannot be adjusted, that is, the power cannot be adjusted in the longitudinal direction of each tube, and the temperature distribution in the direction cannot be adjusted. This defect causes the temperature distribution in the existing control technology to not be higher. Uniformity requirements.
  • the object of the present invention is to provide a heating assembly with simple structure, reasonable design and uniform control of the temperature distribution in the circumferential direction of the entire heating zone of the carrier plate, so as to solve the existing heating mode and only adjust the temperature distribution in one direction, and then Causes problems that cannot meet higher temperature uniformity.
  • the present invention provides a heating assembly disposed under the carrier for heating the heating surface of the carrier, including a first heating unit and a second heating unit disposed above and below.
  • the first heating unit includes a plurality of first heating elements arranged in parallel
  • the second heating unit includes a plurality of second heating elements arranged in parallel; the arrangement direction of the first heating elements is perpendicular to the second heating
  • the arrangement direction of the elements is set, and the projection of the first heating element and the second heating element on the heating surface of the carrier forms a plurality of annular heating regions.
  • the first heating element and the second heating element each include a heating section and a non-heating section, and the heating sections of the first heating element and the second heating element are on the heating surface of the carrier.
  • the projection constitutes a "back" font.
  • the first heating element and the second heating element are independently controlled heating lamps
  • the heating lamp tube comprises a quartz glass tube and a filament disposed in the quartz glass tube.
  • the heating lamp tube is provided with a reflective layer corresponding to a lower surface of the tube wall of the filament heating section.
  • the heating lamp tube comprises an infrared heating lamp tube.
  • the first heating unit and the second heating unit each further include a lamp housing, and the plurality of the first heating elements and the plurality of the second heating elements are spaced apart from each other in the corresponding lamp housing. And a plurality of the first heating element and the plurality of second heating elements each comprise a resistance wire of at least two resistance values.
  • a controller for independently controlling power of the first heating unit and the second heating unit is further included.
  • the lamp housing is provided with a reflective layer corresponding to a lower surface of the tube wall of the heating section of the electric resistance wire.
  • the reflective layer includes one or more of an Ag layer, an Al layer, an AlNd layer, a quartz layer, and a ceramic layer.
  • the invention provides a heating assembly, which is arranged under the carrier plate for heating the heating surface of the carrier board, comprising a first heating unit and a second heating unit arranged up and down, the first heating unit comprising a plurality of parallel arrangements a first heating element, the second heating unit comprises a plurality of second heating elements arranged in parallel; the arrangement direction of the first heating elements is perpendicular to the arrangement direction of the second heating elements, and the first heating element and the second heating
  • the projection of the component on the heating surface of the carrier forms a plurality of annular heating zones.
  • the heating assembly for heating the carrier plate provided by the application has the advantages of simple structure and reasonable design, and is provided with heating units of two upper and lower layers, each heating unit includes a plurality of heating elements, and the heating elements of the two heating units are
  • the projections on the heating surface of the carrier plate form a plurality of annular heating regions, so that the heating surface of the carrier plate can be divided into a plurality of annular regions, thereby effectively improving the uniformity of the heating temperature distribution and solving the single direction.
  • the uneven temperature caused by the heating method is beneficial to the improvement of the process result.
  • FIG. 1 is a schematic structural view of an arrangement of infrared heating lamps in the prior art
  • FIG. 2 is a schematic view showing the arrangement of the heated carrier plate and the heating assembly in the heating unit of the first embodiment of the present invention
  • FIG. 3 is a schematic view showing the arrangement of the heating assembly in the heating unit of the first embodiment of the present invention.
  • 624 infrared heating lamp; 1: carrier plate; 2: heating section; 3: non-heating section; 4: first heating element; 5: second heating element.
  • an embodiment of the present invention provides a heating assembly disposed under the carrier 1 for heating the heating surface of the carrier 1 , including a first heating unit disposed above and below a heating unit comprising a plurality of first heating elements 4 arranged in parallel, the second heating unit comprising a plurality of second heating elements 5 arranged in parallel; the arrangement direction of the first heating elements 4 being perpendicular to the second heating The arrangement direction of the elements 5 is arranged, and the projection of the first heating element 4 and the second heating element 5 on the heating surface of the carrier 1 constitutes an annular heating zone.
  • the heating assembly includes a first heating unit and a second heating unit disposed above and below, that is, including two heating units; the first heating unit may be disposed above the second heating unit, or may be disposed at the second
  • the lower part of the heating unit can be reasonably set according to the actual implementation conditions.
  • the first heating unit comprises a plurality of vertically disposed first heating elements 4 (ie parallel to the Y axis in FIG. 1)
  • the second heating unit comprises a plurality of horizontally disposed second heating elements 5 (ie parallel to the figure) X axis in 1).
  • the first heating element 4 and the second heating element 5 together form a heating zone for heating the carrier plate 1, and the projection of the first heating element 4 and the second heating element 5 on the heating surface of the carrier plate 1 constitutes an annular heating zone,
  • the heating surface of the carrier plate 1 can be divided into a plurality of annular regions, thereby effectively improving the uniformity of the heating temperature distribution, solving the problem of temperature unevenness caused by the heating method in a single direction, and facilitating the improvement of the process result.
  • the heated square carrier 1 is placed above the upper heating unit and placed in parallel with the heating element, and the size of the carrier 1 is generally smaller than the area of the heating area to ensure Temperature uniformity.
  • the heating assembly provided by the present application has a simple structure, reasonable design, uniform heating temperature and strong practicability, and is favorable for standard production and promotion.
  • the first heating element 4 and the second heating element 5 each comprise a heating section 2 and a non-heating section 3, and the heating section 2 of the first heating element 4 and the second heating element 5 is on the heating surface of the carrier 1
  • the projection on the top constitutes the "back" font.
  • the thick lines in FIGS. 2 and 3 refer to the heating section 2, and the remaining connected thin wires are the non-heating sections 3. In part, in theory this part does not heat up.
  • the projections of the first heating element 4 and the non-heating section 3 of the second heating element 5 on the carrier 1 overlap, but the first heating element 4
  • the projection of the heating section 2 of the second heating element 5 on the carrier 1 is terminated to form a plurality of annular heating zones of the "back" shape, which is advantageous for further improving the uniformity of the heating temperature distribution of the carrier 1.
  • the first heating element 4 and the second heating element 5 are independently controlled heating lamps, and the heating lamp tube comprises a quartz glass tube and a filament disposed in the quartz glass tube.
  • the first heating element 4 and the second heating element 5 are independently controlled heating lamps, and the heating tube is composed of a quartz glass tube and a filament.
  • the thick lines in FIGS. 2 and 3 refer to the filament heating region, and the remaining thin wires are the conductive portions of the filament, which theoretically does not generate heat.
  • the heating segments 2 of the first heating element 4 and the second heating element 5 form a concentric square, and each side (filament) of each square is individually controllable.
  • the heated carrier 1 will exhibit a central heat and a surrounding temperature distribution.
  • the carrier 1 can be divided into a plurality of rings. In the area, the heating power of each area can be controlled separately, and the heating power of the four sides can also be individually controllable in each annular area to compensate for the thermal field asymmetry caused by other factors of the system.
  • the heating assembly provided by the present application further includes a controller that can control the current of the filaments in each of the heating lamps in real time according to the temperature change of the carrier 1 during heating, thereby enabling a plurality of annular heating.
  • the temperature distribution of the area is uniform.
  • the heating lamp tube is provided with a reflective layer corresponding to the lower surface of the tube wall of the filament heating section.
  • the lower surface of the tube wall of the heating lamp tube is provided with a reflective layer for ensuring upward heating of the heating power of the filament to improve heating efficiency.
  • the wall of the lamp is transparent, the high temperature zone of the lower filament is blocked by the upper lamp, but it does not affect the infrared radiation efficiency, and the upper lamp is not heated by the lower lamp.
  • the carrier 1 is parallel to the plane formed by the tube, the heating distance has no effect on the heat radiation efficiency. Therefore, the arrangement of the two-layer lamps, although the distance between the filament and the carrier 1 is different, has little effect on the heating uniformity.
  • the reflective layer includes one or more of an Ag layer, an Al layer, an AlNd layer, a quartz layer, and a ceramic layer.
  • the reflective layer may be a combination of one or more alloys of gold, silver, copper, aluminum, nickel, and chromium, or a non-metal material such as quartz or ceramic.
  • the reflective layer adopts an Ag (silver) layer, an Al (aluminum) layer, an AlNd (aluminum-niobium alloy) layer, a quartz layer or a ceramic layer, wherein Select a reasonable type of reflective layer material based on actual implementation conditions.
  • the heating lamp tube comprises an infrared heating lamp tube.
  • the heating lamp tube adopts an infrared heating lamp tube, the infrared heating speed is fast, the heating effect is good, the heating efficiency of the carrier plate 1 is improved, and the infrared heating lamp tube can change the shape according to the heating demand. , size, power, wavelength, can achieve the required time, the required location, the required temperature, and flexibility.
  • the first heating unit and the second heating unit further include a lamp housing, and the plurality of first heating elements and the plurality of second heating elements are disposed in the corresponding lamp housings at intervals, and the plurality of first heatings are
  • the component and the plurality of second heating elements each comprise a resistance wire of at least two resistance values.
  • the first heating unit includes a first lamp housing and a plurality of first heating elements disposed in the first lamp housing, and the plurality of first heating elements are disposed in the first lamp housing at intervals in a parallel arrangement
  • the second heating unit comprises a second lamp housing and a plurality of second heating elements disposed in the second lamp housing, and the plurality of second heating elements are disposed in the second lamp housing at intervals in a parallel arrangement.
  • the heating sections of the first heating element and the second heating element form a concentric square.
  • the heated carrier will exhibit central heat and ambient cold temperatures. Distribution, wherein the present invention sets a plurality of first heating elements and a plurality of second heating elements to a resistance wire each including at least two resistance values, under the access current, to compensate for the thermal field caused by other factors of the system Symmetrical situation.
  • a controller for independently controlling the power of the first heating unit and the second heating unit is further included.
  • the heating assembly provided by the present application further includes a controller, and the controller can control the currents of the first heating unit and the second heating unit in real time according to the temperature change of the carrier during the heating process, thereby making the plurality of rings
  • the temperature distribution in the heating zone is uniform.
  • the lamp housing is provided with a reflective layer corresponding to the lower surface of the tube wall of the heating section of the electric resistance wire.
  • the lamp housing is made of transparent quartz glass.
  • the lower surface of the tube wall of the lamp housing is provided with a reflective layer for ensuring upward heating of the heating power of the filament to improve heating efficiency.
  • the reflective layer may be made of one or more alloys of gold, silver, copper, aluminum, nickel, and chromium, or may be made of a non-metal material such as quartz or ceramic.
  • the present invention provides a heating assembly disposed under the carrier for heating the heating surface of the carrier, including a first heating unit and a second heating unit disposed above and below, the first heating unit Comprising a plurality of first heating elements arranged in parallel, the second heating unit comprising a plurality of second heating elements arranged in parallel; the arrangement direction of the first heating elements is arranged perpendicular to the arrangement direction of the second heating elements, and the first heating The projection of the element and the second heating element on the heating surface of the carrier forms a plurality of annular heating zones.
  • the heating assembly for heating the carrier plate provided by the application has the advantages of simple structure and reasonable design, and is provided with heating units of two upper and lower layers, each heating unit includes a plurality of heating elements, and the heating elements of the two heating units are
  • the projections on the heating surface of the carrier plate form a plurality of annular heating regions, so that the heating surface of the carrier plate can be divided into a plurality of annular regions, thereby effectively improving the uniformity of the heating temperature distribution and solving the single direction.
  • the uneven temperature caused by the heating method is beneficial to the improvement of the process result.

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Abstract

加热组件，设于载板下方，包括呈上下设置的第一加热单元及第二加热单元，第一加热单元包括多根平行布置的第一加热元件，第二加热单元包括多根平行布置的第二加热元件；第一加热元件的排布方向垂直于第二加热元件的排布方向设置，且第一加热元件与第二加热元件在载板加热面上的投影构成多个环形加热区域。

Description

一种加热组件
交叉引用
本申请引用于2018年03月23日提交的专利名称为“一种加热组件”的第2018102463491号中国专利申请，其通过引用被全部并入本申请。
技术领域
本发明涉及半导体设备加工技术领域，尤其涉及一种加热组件。
背景技术
目前，光电器件、太阳能器件、半导体器件通常利用多种制造工艺处理衬底表面而被制造。外延膜或材料通过化学气相沉积(CVD)工艺或金属有机物CVD(MOCVD)工艺被生长或沉积在衬底上的方法被广泛应用，外延膜或材料通常对于特定的器件，例如光电器件、太阳能器件等都会包括多个不同组分的层。
CVD技术常常通过反应类型或者压力来分类，包括低压CVD(LPCVD)、常压CVD(APCVD)、等离子体增强CVD(PECVD)及金属有机化合物CVD(MOCVD)等。共同特征是用于工艺沉积的腔室与大气隔绝，内部用于沉积薄膜工艺的晶片衬底需要加热到一定的工艺温度，例如用于硅外延的APCVD和用于沉积GaN的MOCVD，其外延工艺温度超过1000℃。高温下如何保持温度均匀性，对工艺的结果会产生巨大的影响，如LED行业中的MOCVD设备的温度均匀性被要求达到1℃。
特别的，对于平板式反应腔室，例如公开专利CN102422392加热灯系统及其方法的实施方案中，通过使晶片承载器沿着晶片承载器轨道将晶片衬底移送至工艺沉积腔室内，用于支撑晶片衬底的晶片衬托器下表面暴露于从加热灯组件辐射的能量下，同时晶片衬底被晶片衬托器加热至工艺温度。具体如图1所示，红外加热灯组件被布置在晶片承载器轨道的下方，其中包括多个安装高度一样的红外加热灯管624，多个红外加热灯管624平行排布，构成加热区。但是，采用上述红外加热灯管平行排布的方式，虽说可以独立调节每个灯管的电量用以控制灯管辐射的能量，但是只能调 节灯管平行排布方向的温度分布，而与灯管排布垂直方向的温度分布则无法调节，即每只灯管的长度方向无法调节功率，也就不能调节该方向上的温度分布，这个缺陷造成在现有控制技术上温度分布不能满足更高的均匀性要求。
发明内容
(一)要解决的技术问题
本发明的目的是：提供一种结构简单、设计合理且能实现对整个载板加热区域周向的温度分布均匀控制的加热组件，以解决现有的加热方式只能单向调节温度分布，进而造成不能满足更高的温度均匀性的问题。
(二)技术方案
为了解决上述技术问题，本发明提供了一种加热组件，设于载板下方，用于对所述载板的加热面进行加热，包括呈上下设置的第一加热单元及第二加热单元，所述第一加热单元包括多根平行布置的第一加热元件，所述第二加热单元包括多根平行布置的第二加热元件；所述第一加热元件的排布方向垂直于所述第二加热元件的排布方向设置，且所述第一加热元件与第二加热元件在所述载板加热面上的投影构成多个环形加热区域。
根据上述技术方案的优选，所述第一加热元件及第二加热元件均包括加热段和非加热段，所述第一加热元件与第二加热元件的加热段在所述载板加热面上的投影构成类“回”字型。
根据上述技术方案的优选，所述第一加热元件及第二加热元件均为独立控制的加热灯管，所述加热灯管包括石英玻璃管及设于所述石英玻璃管内的灯丝。
根据上述技术方案的优选，进一步地，还包括用于控制各个所述加热灯管中灯丝的功率的控制器。
根据上述技术方案的优选，所述加热灯管对应于所述灯丝发热段的管壁下表面设有反射层。
根据上述技术方案的优选，所述加热灯管包括红外加热灯管。
根据上述技术方案的优选，所述第一加热单元及第二加热单元均还包括灯外壳，多根所述第一加热元件及多根所述第二加热元件间隔设置在对应的所述灯外壳内，且多根所述第一加热元件及多根第二加热元件均包括 至少两种电阻值的电阻丝。
根据上述技术方案的优选，还包括用于独立地控制所述第一加热单元及第二加热单元的功率的控制器。
根据上述技术方案的优选，所述灯外壳对应于所述电阻丝的加热段的管壁下表面设有反射层。
根据上述技术方案的优选，所述反射层包括Ag层、Al层、AlNd层、石英层及陶瓷层中的一种或多种。
(三)有益效果
本发明的上述技术方案具有如下优点：
本发明提供了一种加热组件，设于载板下方，用于对载板的加热面进行加热，包括呈上下设置的第一加热单元及第二加热单元，第一加热单元包括多根平行布置的第一加热元件，第二加热单元包括多根平行布置的第二加热元件；第一加热元件的排布方向垂直于第二加热元件的排布方向设置，且第一加热元件与第二加热元件在载板加热面上的投影构成多个环形加热区域。本申请提供的用于加热载板的加热组件，结构简单，设计合理，并通过设有上下两层的加热单元，每个加热单元均包括多根加热元件，且两个加热单元的加热元件在载板加热面上的投影共同构成了多个环形加热区域，如此，可以实现把载板的加热面分为多个环形的区域，有效提高了加热温度分布的均匀性，解决了因单一方向的加热方式造成的温度不均问题，利于工艺结果的提升。
附图说明
图1是现有技术中红外加热灯管排布的结构示意图；
图2是本发明一种加热组件实施例一中被加热载板与加热组件的排布方式示意图；
图3是本发明一种加热组件实施例一中加热组件的排布方式示意图。
图中：624：红外加热灯管；1：载板；2：加热段；3：非加热段；4：第一加热元件；5：第二加热元件。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本 发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例一
如图2至图3所示，本发明实施例提供了一种加热组件，设于载板1下方，用于对载板1的加热面进行加热，包括呈上下设置的第一加热单元及第二加热单元，第一加热单元包括多根平行布置的第一加热元件4，第二加热单元包括多根平行布置的第二加热元件5；第一加热元件4的排布方向垂直于第二加热元件5的排布方向设置，且第一加热元件4与第二加热元件5在载板1加热面上的投影构成环形加热区域。
在本实施例中，加热组件包括呈上下设置的第一加热单元及第二加热单元，即包括两层加热单元；第一加热单元可设于第二加热单元的上方，也可设于第二加热单元的下方，具体可根据实际实施条件进行合理的设置。其中，第一加热单元包括多根竖直设置的第一加热元件4(即平行于图1中的Y轴)，第二加热单元包括多根水平设置的第二加热元件5(即平行于图1中的X轴)。第一加热元件4与第二加热元件5共同构成用于加热载板1的加热区域，且第一加热元件4与第二加热元件5在载板1加热面上的投影构成环形加热区域，如此，可以实现把载板1的加热面分为多个环形的区域，有效提高了加热温度分布的均匀性，解决了因单一方向的加热方式造成的温度不均问题，利于工艺结果的提升。
特别的，在本实施例中，被加热的方形载板1放在上层加热单元的上方，与加热元件呈平面平行放置，且载板1的尺寸一般都要比加热区域的面积小，以保证温度均匀性。另外，本申请提供的加热组件，结构简单，设计合理，且加热温度均匀，实用性强，利于进行标准化生产及推广。
根据上述技术方案的优选，第一加热元件4及第二加热元件5均包括加热段2和非加热段3，第一加热元件4与第二加热元件5的加热段2在载板1加热面上的投影构成类“回”字型。
第一加热元件4及第二加热元件5排布后，如图2至图3所示，图2及图3中的粗线指代的是加热段2，其余连接的细线是非加热段3部分， 理论上这部分不发热。如此，当第一加热单元与第二加热单元呈上下设置时，第一加热元件4与第二加热元件5的非加热段3虽在载板1上的投影有重合，但是第一加热元件4与第二加热元件5的加热段2在载板1上的投影收尾接合，以形成类“回”字型的多个环形加热区域，利于进一步提高载板1加热温度分布的均匀性。
根据上述技术方案的优选，第一加热元件4及第二加热元件5均为独立控制的加热灯管，加热灯管包括石英玻璃管及设于石英玻璃管内的灯丝。
在本实施例中，第一加热元件4及第二加热元件5均为独立控制的加热灯管，且加热灯管由石英玻璃管及灯丝组成。其中，图2及图3中的粗线指代的是灯丝发热区域，其余连接的细线是灯丝导电部分，理论上这部分不发热。
从俯视图上看，第一加热元件4及第二加热元件5的加热段2组成了一个个同心正方形，并且每个正方形的每一条边(灯丝)都是可单独控制功率的。在所有加热灯管等功率加热的情况下，被加热的载板1会呈现中心热，四周冷的温度分布，在本发明的排布方式下，正好可以实现把载板1分为多个环形的区域，每个区域的加热功率可以单独控制，并且，每个环形区域也可以实现四个边的加热功率单独可控，以弥补由于系统其它因素造成的热场非对称情况。
因此通过对各个灯丝的功率调节，就可以实现对整个载板1加热区域周向的温度分布均匀控制。
根据上述技术方案的优选，进一步地，还包括用于控制各个加热灯管中灯丝的功率的控制器。
进一步地，本申请提供的加热组件还包括控制器，控制器可根据对载板1在加热过程中的温度变化来实时控制各个加热灯管中的灯丝的电流大小，进而使得多个环形的加热区域的温度分布均匀。
根据上述技术方案的优选，加热灯管对应于灯丝发热段的管壁下表面设有反射层。
优选的，在本实施例中，加热灯管的管壁下表面设有反射层，用于以保证灯丝加热功率都向上辐射，提高加热效率。由于灯管壁是透明的，下 层灯丝高温区虽然有被上层灯管遮挡的情况，但是不会影响其红外辐射效率，并且上层灯管不会被下层灯管加热。由于载板1平行于灯管组成的平面，因加热距离对热辐射效率是没有影响的。所以，两层灯管排布方式，虽然灯丝与载板1距离不同，但对加热均匀性几乎没有影响。
根据上述技术方案的优选，反射层包括Ag层、Al层、AlNd层、石英层及陶瓷层中的一种或多种。
具体地，反射层可以采用金、银、铜、铝、镍、铬中的一种或多种合金组合，也可以采用石英或陶瓷等非金属材质。优选的，在本实施例中，为保证具有较优的反射效果，反射层采用Ag(银)层、Al(铝)层、AlNd(铝钕合金)层、石英层或陶瓷层，其中，可根据实际实施条件来选择合理的反射层材料类型。
根据上述技术方案的优选，加热灯管包括红外加热灯管。
优选的，在本实施例中，加热灯管采用红外加热灯管，红外加热的速度快、加热效果好，利于提高载板1的加热效率，且红外加热灯管可以根据加热的需求来改变形状、大小、功率、波长，既而可以实现在需要的时间、需要的地点，达到需要的温度，灵活性强。
实施例二
与实施例一的区别仅在于：
根据上述技术方案的优选，第一加热单元及第二加热单元均还包括灯外壳，多根第一加热元件及多根第二加热元件间隔设置在对应的灯外壳内，且多根第一加热元件及多根第二加热元件均包括至少两种电阻值的电阻丝。
在本实施例中，第一加热单元包括第一灯外壳及设于第一灯外壳内的多根第一加热元件，多根第一加热元件以平行布置的方式间隔设置在第一灯外壳内；相对应的，第二加热单元包括第二灯外壳及设于第二灯外壳内的多根第二加热元件，多根第二加热元件以平行布置的方式间隔设置在第二灯外壳内。从俯视图上看，第一加热元件及第二加热元件的加热段组成了一个个同心正方形，在所有加热灯管等功率加热的情况下，被加热的载板会呈现中心热，四周冷的温度分布，其中，本发明将多根第一加热元件及多根第二加热元件设置为均包括至少两种电阻值的电阻丝，在接入电流 下，以弥补由于系统其它因素造成的热场非对称情况。
因此通过对不同加热灯分组后的功率调节，就可以实现对整个载板加热区域周向的温度分布均匀控制。
根据上述技术方案的优选，还包括用于独立地控制第一加热单元及第二加热单元的功率的控制器。
进一步地，本申请提供的加热组件还包括控制器，控制器可根据对载板在加热过程中的温度变化来实时控制第一加热单元及第二加热单元的电流大小，进而使得多个环形的加热区域的温度分布均匀。
根据上述技术方案的优选，灯外壳对应于电阻丝的加热段的管壁下表面设有反射层。其中，灯外壳采用透明石英玻璃制成。
与实施例一的类似，在本实施例中，灯外壳的管壁下表面设有反射层，用于以保证灯丝加热功率都向上辐射，提高加热效率。优选的，反射层可以采用金、银、铜、铝、镍、铬的一种或多种合金组合，也可以采用石英或陶瓷等非金属材质制成。
其他技术方案与实施例一的相同，为避免赘述，不再重复。
综上所述，本发明提供了一种加热组件，设于载板下方，用于对载板的加热面进行加热，包括呈上下设置的第一加热单元及第二加热单元，第一加热单元包括多根平行布置的第一加热元件，第二加热单元包括多根平行布置的第二加热元件；第一加热元件的排布方向垂直于第二加热元件的排布方向设置，且第一加热元件与第二加热元件在载板加热面上的投影构成多个环形加热区域。本申请提供的用于加热载板的加热组件，结构简单，设计合理，并通过设有上下两层的加热单元，每个加热单元均包括多根加热元件，且两个加热单元的加热元件在载板加热面上的投影共同构成了多个环形加热区域，如此，可以实现把载板的加热面分为多个环形的区域，有效提高了加热温度分布的均匀性，解决了因单一方向的加热方式造成的温度不均问题，利于工艺结果的提升。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不 使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (10)

  1. 一种加热组件，设于载板下方，用于对所述载板的加热面进行加热，其特征在于：包括呈上下设置的第一加热单元及第二加热单元，所述第一加热单元包括多根平行布置的第一加热元件，所述第二加热单元包括多根平行布置的第二加热元件；所述第一加热元件的排布方向垂直于所述第二加热元件的排布方向设置，且所述第一加热元件与第二加热元件在所述载板加热面上的投影构成多个环形加热区域。
  2. 根据权利要求1所述的加热组件，其特征在于：所述第一加热元件及第二加热元件均包括加热段和非加热段，所述第一加热元件与第二加热元件的加热段在所述载板加热面上的投影构成类“回”字型。
  3. 根据权利要求1所述的加热组件，其特征在于：所述第一加热元件及第二加热元件均为独立控制的加热灯管，所述加热灯管包括石英玻璃管及设于所述石英玻璃管内的灯丝。
  4. 根据权利要求3所述的加热组件，其特征在于：还包括用于控制各个所述加热灯管中灯丝的功率的控制器。
  5. 根据权利要求3所述的加热组件，其特征在于：所述加热灯管对应于所述灯丝发热段的管壁下表面设有反射层。
  6. 根据权利要求3所述的加热组件，其特征在于：所述加热灯管包括红外加热灯管。
  7. 根据权利要求1所述的加热组件，其特征在于：所述第一加热单元及第二加热单元均还包括灯外壳，多根所述第一加热元件及多根所述第二加热元件间隔设置在对应的所述灯外壳内，且多根所述第一加热元件及多根第二加热元件均包括至少两种电阻值的电阻丝。
  8. 根据权利要求7所述的加热组件，其特征在于：还包括用于独立地控制所述第一加热单元及第二加热单元的功率的控制器。
  9. 根据权利要求7所述的加热组件，其特征在于：所述灯外壳对应于所述电阻丝的加热段的管壁下表面设有反射层。
  10. 根据权利要求5或9所述的加热组件，其特征在于：所述反射层包括Ag层、Al层、AlNd层、石英层及陶瓷层中的一种或多种。
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