WO2019171593A1 - バルブ装置 - Google Patents
バルブ装置 Download PDFInfo
- Publication number
- WO2019171593A1 WO2019171593A1 PCT/JP2018/009297 JP2018009297W WO2019171593A1 WO 2019171593 A1 WO2019171593 A1 WO 2019171593A1 JP 2018009297 W JP2018009297 W JP 2018009297W WO 2019171593 A1 WO2019171593 A1 WO 2019171593A1
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- WO
- WIPO (PCT)
- Prior art keywords
- actuator
- pressure
- valve device
- adjustment
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K7/00—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
- F16K7/12—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
- F16K7/14—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
- F16K7/17—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat the diaphragm being actuated by fluid pressure
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K17/00—Safety valves; Equalising valves, e.g. pressure relief valves
- F16K17/02—Safety valves; Equalising valves, e.g. pressure relief valves opening on surplus pressure on one side; closing on insufficient pressure on one side
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
- F16K31/007—Piezoelectric stacks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
- F16K31/126—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a diaphragm, bellows, or the like
- F16K31/1266—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a diaphragm, bellows, or the like one side of the diaphragm being acted upon by the circulating fluid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H10P72/0402—
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
- F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
- F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
- F16K31/124—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston servo actuated
Definitions
- the present invention relates to a valve device.
- a fluid control device called an integrated gas system in which various fluid control devices such as an open / close valve, a regulator, and a mass flow controller are integrated is used to supply a precisely measured processing gas to a processing chamber. It has been. Normally, the processing gas output from the fluid control device is directly supplied to the processing chamber. However, in the processing process of depositing a film on the substrate by the atomic layer deposition method (ALD), the processing gas is stable. The processing gas supplied from the fluid control device is temporarily stored in a tank serving as a buffer for the purpose of supply, and the valve provided in the immediate vicinity of the processing chamber is frequently opened and closed to vacuum the processing gas from the tank. Supplying to an atmosphere processing chamber is performed.
- various fluid control devices such as an open / close valve, a regulator, and a mass flow controller are integrated
- ALD atomic layer deposition method
- the ALD method is one of chemical vapor deposition methods, and two or more kinds of processing gases are alternately flowed on the substrate surface one by one under film forming conditions such as temperature and time, and atoms on the substrate surface. It is a method of depositing a film by a single layer by reacting, and since it can be controlled by a single atomic layer, a uniform film thickness can be formed and a film can be grown very densely as a film quality. . In the semiconductor manufacturing process by the ALD method, it is necessary to precisely adjust the flow rate of the processing gas, and it is also necessary to secure the flow rate of the processing gas to some extent by increasing the diameter of the substrate.
- a valve device includes a valve body that defines a flow path, A valve body provided to be able to open and close the flow path of the valve body; An operating member for operating the valve body movably provided between a preset closed position for closing the flow path to the valve body and an open position for opening the flow path to the preset valve body; , A main actuator that receives the pressure of the supplied driving fluid and moves the operating member to the open position or the closed position; An adjustment actuator that is arranged so that at least a part of the force generated by the main actuator acts, and adjusts the position of the operation member positioned at the open position; A pressure stabilization mechanism that is provided in a supply path of the driving fluid to the main actuator and suppresses fluctuations in the pressure of the driving fluid supplied to the main actuator.
- the pressure stabilization mechanism includes a pressure regulator that regulates the pressure of the supplied driving fluid.
- the main actuator moves the operating member to the open position
- the adjustment actuator receives the force acting on the operation member positioned at the open position by the main actuator at the distal end of the adjustment actuator and restricts the movement of the operation member, and controls the position of the operation member.
- Adjusting the configuration can be adopted. More preferably, it has a casing containing the main actuator and the adjustment actuator, A flow path for supplying the driving fluid to the main actuator through the pressure stabilization mechanism is formed in the casing.
- the flow path can be configured to be formed separately so that the pressure of the driving fluid flowing through the flow path does not act on the adjustment actuator.
- the adjustment actuator may have a drive source that expands and contracts in response to energization.
- the adjustment actuator includes an actuator using expansion and contraction of a piezoelectric element.
- the adjustment actuator may include an actuator including an electrically driven polymer as a drive source.
- the adjustment actuator is provided in addition to the main actuator, the flow rate can be precisely adjusted and the flow rate adjustment man-hour can be greatly reduced.
- the pressure stabilization mechanism it is possible to suppress the influence of the pressure fluctuation of the driving fluid received by the adjustment actuator, and to realize flow control with higher accuracy.
- FIG. 1 is a longitudinal sectional view of a valve device according to an embodiment of the present invention, taken along line 1A-1A in FIG. 1B.
- 1B is a top view of the valve device of FIG. 1A.
- FIG. 1B is an enlarged cross-sectional view of an actuator unit taken along line 1D-1D in FIG. 1B.
- Explanatory drawing which shows operation
- the expanded sectional view of the principal part for demonstrating the full open state of the valve apparatus of FIG. 1A The expanded sectional view of the principal part for demonstrating the state at the time of flow volume adjustment (at the time of flow volume reduction
- FIG. 1A is a cross-sectional view showing a configuration of a valve device 1 according to an embodiment of the present invention, and shows a state in which the valve is fully closed.
- FIG. 1B is a top view of the valve device 1
- FIG. 1C is an enlarged longitudinal sectional view of the actuator portion of the valve device 1
- FIG. 1D is an enlarged longitudinal sectional view of the actuator portion in a direction 90 degrees different from FIG.
- A1 in FIG. 1A is an upward direction
- A2 is a downward direction.
- the valve device 1 includes a storage box 301 provided on a support plate 302, a valve body 2 installed in the storage box 301, a pressure regulator 200 installed on the ceiling of the storage box 301, a pressure sensor 400,
- 10 is a valve body
- 15 is a valve seat
- 20 is a diaphragm
- 25 is a press adapter
- 27 is an actuator receiver
- 30 is a bonnet
- 40 is an operating member
- 48 is a diaphragm presser
- 50 is a casing
- 70 is an adjustment body
- 80 is an actuator presser
- 90 is a coil spring
- 100 is a piezoelectric actuator as an adjustment actuator
- 120 is a disc spring
- 130 is a partition member
- 150 is a supply pipe
- 160 is a limit switch
- OR Indicates an O-ring as a seal member
- G indicates compressed air as a driving fluid.
- the driving fluid is not limited to compressed air, and other fluids
- the valve body 10 is made of a metal such as stainless steel and defines flow paths 12 and 13.
- the flow path 12 has an opening 12a that opens on one side of the valve body 10 at one end, and a pipe joint 501 is connected to the opening 12a by welding.
- the other end 12 b of the flow path 12 is connected to a flow path 12 c extending in the vertical direction A 1, A 2 of the valve body 10.
- the upper end portion of the flow path 12c opens at the upper surface side of the valve body 10, the upper end portion opens at the bottom surface of the recess 11 formed on the upper surface side of the valve body 10, and the lower end portion is at the lower surface side of the valve body 10. It is open.
- the pressure sensor 400 is provided in the opening on the lower end side of the flow path 12c, and closes the opening on the lower end side of the flow path 12c.
- the pressure sensor 400 functions as a feedback sensor when the adjustment actuator 100 (piezo) is operated.
- the adjustment actuator 100 piezo
- the pressure sensor 400 is applied to the valve body 10
- the distance from the pressure sensor 400 to the valve body and the internal volume are reduced. Therefore, the feedback response to the adjustment actuator 100 is quickened, and the accuracy and speed of stroke amount adjustment are increased. improves.
- the installation location of the pressure sensor 400 is not limited to this, and the pressure sensor 400 may be installed outside the valve body 10.
- the structure which does not use the pressure sensor 400 is also possible.
- the openings of the flow paths 12 and 13 are not limited to the side surfaces of the valve body 10 and can be provided on a desired surface such as a bottom surface or an upper surface.
- a valve seat 15 is provided around the opening at the upper end of the flow path 12c.
- the valve seat 15 is made of synthetic resin (PFA, PA, PI, PCTFE, etc.), and is fitted and fixed in a mounting groove provided at the opening periphery of the upper end side of the flow path 12c. In the present embodiment, the valve seat 15 is fixed in the mounting groove by caulking.
- the flow path 13 has an opening 13 a that opens at one end at the bottom surface of the recess 11 of the valve body 10 and opens at the other side opposite to the flow path 12 of the valve body 10 at the other end.
- a pipe joint 502 is connected to 13a by welding.
- the diaphragm 20 is disposed above the valve seat 15, defines a flow path that communicates the flow path 12 c and the flow path 13, and the central portion thereof moves up and down to make contact with the valve seat 15. As a result, the channels 12 and 13 are opened and closed.
- the diaphragm 20 is formed into a spherical shell shape in which a convex arc shape is in a natural state by causing the central portion of a metal thin plate such as special stainless steel and a nickel-cobalt alloy thin plate to bulge upward. ing.
- a diaphragm 20 is formed by laminating three sheets of the special stainless steel sheet and one sheet of the nickel / cobalt alloy sheet.
- the outer peripheral edge of the diaphragm 20 is placed on a protrusion formed on the bottom of the recess 11 of the valve body 10, and the lower end of the bonnet 30 inserted into the recess 11 is screwed into the threaded portion of the valve body 10.
- the presser adapter 25 made of stainless alloy, and is clamped and fixed in an airtight state.
- the nickel-cobalt alloy thin film may have another configuration as the diaphragm disposed on the gas contact side.
- the operation member 40 is a member for operating the diaphragm 20 so that the diaphragm 20 opens and closes between the flow path 12 and the flow path 13, and is formed in a substantially cylindrical shape, and the upper end side is opened.
- the operation member 40 is fitted to the inner peripheral surface of the bonnet 30 via an O-ring OR (see FIGS. 1C and 1D), and is supported so as to be movable in the vertical directions A1 and A2.
- a diaphragm presser 48 made of a synthetic resin such as polyimide that contacts the upper surface of the central portion of the diaphragm 20 is attached to the lower end surface of the operation member 40.
- a coil spring 90 is provided between the upper surface of the flange portion 48a formed on the outer periphery of the diaphragm retainer 48 and the ceiling surface of the bonnet 30, and the operation member 40 is always directed downward A2 by the coil spring 90. It is energized. For this reason, in a state where the main actuator 60 is not operated, the diaphragm 20 is pressed against the valve seat 15 and the space between the flow path 12 and the flow path 13 is closed.
- a disc spring 120 as an elastic member is provided between the lower surface of the actuator receiver 27 and the upper surface of the diaphragm retainer 48.
- the casing 50 includes an upper casing member 51 and a lower casing member 52, and a screw on the inner periphery of the lower end portion of the lower casing member 52 is screwed to a screw on the outer periphery of the upper end portion of the bonnet 30. Further, the screw on the inner periphery of the lower end portion of the upper casing member 51 is screwed with the screw on the outer periphery of the upper end portion of the lower casing member 52.
- An annular bulkhead 65 is fixed between the upper end portion of the lower casing member 52 and the facing surface 51f of the upper casing member 51 facing the upper casing portion.
- the space between the inner peripheral surface of the bulkhead 65 and the outer peripheral surface of the operation member 40 and the space between the outer peripheral surface of the bulkhead 65 and the inner peripheral surface of the upper casing member 51 are sealed by O-rings OR.
- the main actuator 60 has annular first to third pistons 61, 62, 63.
- the first to third pistons 61, 62, 63 are fitted to the outer peripheral surface of the operation member 40, and can move together with the operation member 40 in the vertical directions A 1, A 2.
- the lower casing member 52 and the inner peripheral surface of the bonnet 30 are sealed with a plurality of O-rings OR. As shown in FIGS.
- a cylindrical partition member 130 is fixed to the inner peripheral surface of the operation member 40 so as to have a gap GP ⁇ b> 1 with the inner peripheral surface of the operation member 40.
- the gap GP1 is sealed by a plurality of O-rings OR1 to OR3 provided between the outer peripheral surface of the upper end side and the lower end side of the partition wall member 130 and the inner peripheral surface of the operation member 40, and the compressed air G as a driving fluid is sealed. It is a flow passage.
- the flow path formed by the gap GP ⁇ b> 1 is disposed concentrically with the piezoelectric actuator 100.
- a gap GP ⁇ b> 2 is formed between a casing 101 of the piezoelectric actuator 100 described later and a partition member 130.
- pressure chambers C1 to C3 are formed on the lower surfaces of the first to third pistons 61, 62, and 63, respectively.
- the operation member 40 is formed with flow passages 40h1, 40h2, and 40h3 penetrating in the radial direction at positions communicating with the pressure chambers C1, C2, and C3.
- a plurality of flow passages 40h1, 40h2, and 40h3 are formed at equal intervals in the circumferential direction of the operation member 40.
- the flow passages 40h1, 40h2, and 40h3 are respectively connected to the flow passages formed by the gap GP1 described above.
- the upper casing member 51 of the casing 50 is formed with a flow passage 50h that opens on the upper surface, extends in the vertical directions A1 and A2, and communicates with the pressure chamber C1.
- a supply pipe 150 is connected to the opening of the flow passage 50 h via a pipe joint 152.
- the compressed air G supplied from the supply pipe 150 is supplied to the pressure chambers C1, C2, and C3 through the flow passages described above.
- the space SP above the first piston 61 in the casing 50 is connected to the atmosphere through the through hole of the adjustment body 70.
- the limit switch 160 is installed on the casing 50, and the movable pin 161 passes through the casing 50 and is in contact with the upper surface of the first piston 61.
- the limit switch 160 detects the movement of the first piston 61 (operation member 40) in the vertical directions A1 and A2 according to the movement of the movable pin 161.
- the piezoelectric actuator 100 incorporates laminated piezoelectric elements (not shown) in the cylindrical casing 101 shown in FIG.
- the casing 101 is made of a metal such as a stainless alloy, and the end surface on the hemispherical tip portion 102 side and the end surface on the base end portion 103 side are closed.
- the end surface of the casing 101 on the distal end portion 102 side is elastically deformed, and the hemispherical distal end portion 102 is displaced in the longitudinal direction.
- the total length of the piezoelectric actuator 100 is L0 by applying a predetermined voltage V0 at which the elongation of the piezoelectric actuator 100 becomes d.
- V0 a voltage higher than the predetermined voltage V0
- the total length of the piezoelectric actuator 100 is L0 + d at the maximum
- a voltage (including no voltage) lower than the predetermined voltage V0 is applied, the total length of the piezoelectric actuator 100 is the minimum L0. -D. Therefore, the entire length from the distal end portion 102 to the proximal end portion 103 can be expanded and contracted in the vertical directions A1 and A2.
- the tip 102 of the piezoelectric actuator 100 is hemispherical, but the present invention is not limited to this, and the tip may be a flat surface.
- power supply to the piezoelectric actuator 100 is performed by the wiring 105.
- the wiring 105 is led out through the through hole 70 a of the adjustment body 70.
- the vertical position of the base end portion 103 of the piezoelectric actuator 100 is defined by the lower end surface of the adjustment body 70 via the actuator presser 80 as shown in FIGS. 1C and 1D.
- the adjustment body 70 has a threaded portion formed on the outer peripheral surface of the adjustment body 70 screwed into a screw hole formed in the upper portion of the casing 50, and adjusts the position of the adjustment body 70 in the vertical directions A1 and A2.
- the tip portion 102 of the piezoelectric actuator 100 is in contact with a conical receiving surface formed on the upper surface of a disk-shaped actuator receiver 27 as shown in FIG.
- the actuator receiver 27 is movable in the vertical directions A1 and A2.
- a supply pipe 203 is connected to the primary side via a pipe joint 201, and a pipe joint 151 provided at the tip of the supply pipe 150 is connected to the secondary side.
- the pressure regulator 200 is a well-known poppet valve type pressure regulator, and detailed description thereof is omitted.
- the high-pressure compressed air G supplied through the supply pipe 203 is lowered to a desired pressure, and the secondary pressure is preset. It is controlled so that it becomes the set pressure.
- a poppet valve pressure regulator is used, but other types of pressure regulators can be used.
- any mechanism that suppresses the pressure fluctuation of the compressed air G supplied to the supply pipe 150 such as a damping filter can be used.
- FIG. 3 shows an example in which the valve device 1 according to this embodiment is applied to a process gas control system of a semiconductor manufacturing apparatus.
- a semiconductor manufacturing apparatus 1000 in FIG. 3 is an apparatus for performing a semiconductor manufacturing process by an ALD method, for example, 800 is a supply source of compressed air G, 810 is a supply source of process gas PG, and 900A to 900C fluid control apparatus , VA to VC are open / close valves, 1A to 1C are valve devices according to this embodiment, and CHA to CHC are processing chambers.
- ALD method it is necessary to precisely adjust the flow rate of the process gas, and it is also necessary to ensure the flow rate of the processing gas by increasing the diameter of the substrate.
- the fluid control devices 900A to 900C are integrated gas systems in which various fluid devices such as open / close valves, regulators, and mass flow controllers are integrated in order to supply the accurately measured process gas PG to the processing chambers CHA to CHC, respectively. is there.
- the valve devices 1A to 1C precisely control the flow rate of the process gas PG from the fluid control devices 900A to 900C and supply them to the processing chambers CHA to CHC, respectively, by opening and closing the diaphragm 20.
- the open / close valves VA to VC execute supply and cut-off of the compressed air G in accordance with a control command in order to cause the valve devices 1A to 1C to open and close.
- compressed air G is supplied from a common supply source 800, but the on-off valves VA to VC are driven independently. Compressed air G with a substantially constant pressure is always output from the common supply source 800. However, when the on-off valves VA to VC are opened and closed independently, the valves are affected by pressure loss when the valves are opened and closed.
- the pressure of the compressed air G supplied to each of the devices 1A to 1C fluctuates and is not constant.
- the pressure of the compressed air G supplied to the valve devices 1A to 1C fluctuates, the flow rate adjustment amount by the piezoelectric actuator 100 may fluctuate.
- the pressure regulator 200 described above is provided.
- FIG. FIG. 4 shows the valve fully closed state of the valve device 1.
- the compressed air G is not supplied.
- the disc spring 120 is already compressed and elastically deformed to some extent, and the actuator receiver 27 is constantly urged in the upward direction A1 by the restoring force of the disc spring 120. Accordingly, the piezoelectric actuator 100 is also always urged in the upward direction A1, and the upper surface of the base end portion 103 is pressed against the actuator presser 80.
- the piezoelectric actuator 100 receives the compressive force in the vertical directions A1 and A2, and is disposed at a predetermined position with respect to the valve body 10. Since the piezoelectric actuator 100 is not connected to any member, the piezoelectric actuator 100 can move relative to the operation member 40 in the vertical directions A1 and A2.
- the number and direction of the disc springs 120 can be appropriately changed according to conditions.
- other elastic members such as a coil spring and a leaf spring can be used.
- using a disc spring has an advantage that the spring rigidity, stroke, and the like can be easily adjusted.
- the lower surface side regulating surface 27 b of the actuator receiver 27 and the upper surface side contact surface of the diaphragm presser 48 of the operation member 40 As shown in FIG. 4, when the diaphragm 20 is in contact with the valve seat 15 and the valve is closed, the lower surface side regulating surface 27 b of the actuator receiver 27 and the upper surface side contact surface of the diaphragm presser 48 of the operation member 40. A gap is formed between 48t.
- the positions in the up and down directions A1 and A2 of the regulating surface 27b become the open position OP in a state where the opening degree is not adjusted.
- the distance between the restriction surface 27 b and the contact surface 48 t corresponds to the lift amount Lf of the diaphragm 20.
- the lift amount Lf defines the valve opening, that is, the flow rate.
- the lift amount Lf can be changed by adjusting the positions of the adjustment body 70 in the vertical direction A1, A2.
- the diaphragm presser 48 (operation member 40) in the state shown in FIG. 4 is located at the closed position CP with reference to the contact surface 48t.
- the contact surface 48t moves to a position where the contact surface 48t contacts the regulating surface 27b of the actuator receiver 27, that is, the open position OP, the diaphragm 20 is separated from the valve seat 15 by the lift amount Lf.
- the contact surface 48t comes into contact, and the actuator receiver 27 receives a force from the operation member 40 in the upward direction A1.
- This force acts as a force for compressing the piezoelectric actuator 100 in the vertical directions A1 and A2 through the tip portion 102 of the piezoelectric actuator 100. Therefore, the upward force A1 acting on the operation member 40 is received by the tip portion 102 of the piezoelectric actuator 100, and the movement of the operation member 40 in the A1 direction is restricted at the open position OP. In this state, the diaphragm 20 is separated from the valve seat 15 by the lift amount Lf described above.
- the pressure regulator 200 acts to suppress fluctuations in the pressure of the driving air G so that the deformation of the piezoelectric actuator 100 in the vertical directions A1 and A2 falls within an allowable value.
- the piezoelectric actuator 100 When the flow rate of the fluid output from the valve device 1 in the state shown in FIG. 5 is to be adjusted, the piezoelectric actuator 100 is operated.
- the left side of the center line Ct in FIGS. 6A and 6B shows the state shown in FIG. 5, and the right side of the center line Ct shows the state after adjusting the positions of the operating members 40 in the vertical directions A1 and A2. .
- the piezoelectric actuator 100 is extended and the operation member 40 is moved in the downward direction A2.
- the lift amount Lf ⁇ after adjustment which is the distance between the diaphragm 20 and the valve seat 15, becomes smaller than the lift amount Lf before adjustment.
- the piezoelectric actuator 100 When adjusting in the direction in which the flow rate of the fluid is increased, as shown in FIG. 6B, the piezoelectric actuator 100 is shortened and the operation member 40 is moved in the upward direction A1. Thereby, the lift amount Lf + after adjustment which is the distance between the diaphragm 20 and the valve seat 15 becomes larger than the lift amount Lf before adjustment.
- the fluctuation in the pressure of the driving air G supplied through the supply pipe 150 also affects the adjustment amount of the piezoelectric actuator 100.
- the pressure regulator 200 acts to suppress fluctuations in the pressure of the drive air G so that the adjustment amount error of the piezoelectric actuator 100 falls within a desired range.
- the maximum lift amount of the diaphragm 20 is about 100 to 200 ⁇ m
- the adjustment amount by the piezoelectric actuator 100 is about ⁇ 20 ⁇ m. That is, the stroke of the piezoelectric actuator 100 cannot cover the lift amount of the diaphragm 20, but the main actuator 60 that operates with the driving air G and the piezoelectric actuator 100 are used together, so that the main actuator 60 with a relatively long stroke is used. Therefore, the flow rate can be precisely adjusted by the piezoelectric actuator 100 having a relatively short stroke while the flow rate supplied by the valve device 1 is secured, and it is not necessary to manually adjust the flow rate by the adjustment body 70 or the like. Man-hours are greatly reduced.
- precise flow rate adjustment is possible only by changing the voltage applied to the piezoelectric actuator 100. Therefore, the flow rate adjustment can be performed immediately and the flow rate can be controlled in real time.
- by providing the pressure regulator 200 it is possible to suppress the occurrence of flow rate fluctuations with respect to pressure fluctuations, thereby realizing more precise flow rate control.
- the pressure regulator 200 since the pressure regulator 200 is fixed at a predetermined location in the storage box 301, the distance from the pressure regulator 200 to the pressure chamber and the internal volume can be made constant for each valve. Precise flow rate adjustment is possible.
- the “flow rate” can be adjusted by the adjusting actuator 100, but if the distance from the pressure regulator 200 to the pressure chamber and the internal volume between them differ for each valve, the “opening / closing speed” of the diaphragm 20 varies. Thus, the supply amount of the processing gas supplied to the processing chamber cannot be accurately controlled.
- the pressure regulator 200 is provided in the storage box 301, but it can be installed outside the storage box 301 as long as it is on the supply path to the main actuator 60.
- the flow rate can be adjusted by the adjusting actuator.
- the piezoelectric actuator is used as the adjustment actuator, but the adjustment actuator is not limited to this.
- an electric drive material made of a compound that deforms in response to a change in electric field can be used as an actuator.
- an electric drive material may be a piezoelectric material or an electric drive material other than the piezoelectric material.
- an electrically driven polymer material can be used.
- An electrically driven polymer material is also called an electroactive polymer material (Electro Active Polymer: EAP).
- EAP Electro Active Polymer
- an electric EAP driven by an external electric field or Coulomb force, and a solvent in which a polymer is swollen are flowed by an electric field.
- EAP Electro Active Polymer
- a so-called normally closed type valve has been described as an example, but the present invention is not limited to this, and can be applied to a normally open type valve. Also in this case, the opening degree of the valve body may be adjusted by the adjusting actuator.
- valve device 1 is used in a semiconductor manufacturing process by the ALD method.
- present invention is not limited to this, and the present invention is, for example, an atomic layer etching method (ALE: Atomic Layer Etching method) It can be applied to any object that requires precise flow rate adjustment.
- ALE Atomic Layer Etching method
- the piston built in the cylinder chamber operated by gas pressure is used as the main actuator.
- the present invention is not limited to this, and various optimum actuators can be selected according to the object to be controlled. It is.
- Valve apparatus 10 Valve body 11 Concave part 12 and 13 Flow path 15 Valve seat 20 Diaphragm (valve body) 25 Presser adapter 27 Actuator receptacle 30 Bonnet 40 Operation member 48 Diaphragm presser (operation member) 50 Casing 51 Upper casing member 52 Lower casing member 60 Main actuator 70 Adjustment body 80 Actuator presser 90 Coil spring 100 Piezoelectric actuator (Adjustment actuator) 101 casing 102 distal end 103 proximal end 120 disc spring 150 supply pipe 160 limit switch 200 Pressure regulator OR O-ring G Compressed air (driving fluid) Lf Lift amount before adjustment Lf +, Lf- Lift amount after adjustment
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Abstract
Description
通常、上記の流体制御装置から出力される処理ガスを処理チャンバに直接供給するが、原子層堆積法(ALD:Atomic Layer Deposition 法)により基板に膜を堆積させる処理プロセスにおいては、処理ガスを安定的に供給するために流体制御装置から供給される処理ガスをバッファとしてのタンクに一時的に貯留し、処理チャンバの直近に設けられたバルブを高頻度で開閉させてタンクからの処理ガスを真空雰囲気の処理チャンバへ供給することが行われている。なお、処理チャンバの直近に設けられるバルブとしては、例えば、特許文献1,2を参照。
ALD法は、化学気相成長法の1つであり、温度や時間等の成膜条件の下で、2種類以上の処理ガスを1種類ずつ基板表面上に交互に流し、基板表面上原子と反応させて単層ずつ膜を堆積させる方法であり、単原子層ずつ制御が可能である為、均一な膜厚を形成させることができ、膜質としても非常に緻密に膜を成長させることができる。
ALD法による半導体製造プロセスでは、処理ガスの流量を精密に調整する必要があるとともに、基板の大口径化等により、処理ガスの流量をある程度確保する必要もある。
本発明の他の目的は、流量調整工数を大幅に削減できるバルブ装置を提供することにある。
本発明のさらに他の目的は、流量調整を即座に実行できるバルブ装置を提供することにある。
前記バルブボディの流路を開閉可能に設けられた弁体と、
予め設定された前記弁体に流路を閉鎖させる閉位置と予め設定された前記弁体に流路を開放させる開位置との間で移動可能に設けられた前記弁体を操作する操作部材と、
供給される駆動流体の圧力を受けて、前記操作部材を前記開位置又は閉位置に移動させる主アクチュエータと、
前記主アクチュエータが発生する力の少なくとも一部が作用するように配置され、前記開位置に位置付けられた前記操作部材の位置を調整するための調整用アクチュエータと、
前記駆動流体の前記主アクチュエータへの供給経路に設けられ、前記主アクチュエータへ供給される前記駆動流体の圧力の変動を抑制するための圧力安定化機構と、を有する。
前記調整用アクチュエータは、前記主アクチュエータにより前記開位置に位置付けられた前記操作部材に作用する力を当該調整用アクチュエータの先端部で受け止めて当該操作部材の移動を規制しつつ、当該操作部材の位置を調整する、構成を採用できる。
さらに好適には、前記主アクチュエータおよび前記調整用アクチュエータを内蔵するケーシングを有し、
前記ケーシング内には、前記圧力安定化機構を通じた前記駆動流体を前記主アクチュエータへ供給する流通路が形成され、
前記流通路は、当該流通路を流通する駆動流体の圧力が前記調整用アクチュエータに作用しないように分離して形成されている、構成を採用できる。
好適には、前記調整用アクチュエータは、圧電素子の伸縮を利用したアクチュエータを含む。
代替的には、前記調整用アクチュエータは、電気駆動型ポリマーを駆動源として有するアクチュエータを含む、構成を採用できる。
図1Aは、本発明の一実施形態に係るバルブ装置1の構成を示す断面図であって、バルブが全閉時の状態を示している。図1Bはバルブ装置1の上面図、図1Cはバルブ装置1のアクチュエータ部の拡大縦断面図、図1Dは図1Cと90度異なる方向のアクチュエータ部の拡大縦断面図である。なお、以下の説明において図1AのA1を上方向、A2を下方向とする。
図1A~図1Dにおいて、10はバルブボディ、15はバルブシート、20はダイヤフラム、25は押えアダプタ、27はアクチュエータ受け、30はボンネット、40は操作部材、48はダイヤフラム押え、50はケーシング、60は主アクチュエータ、70は調整ボディ、80はアクチュエータ押え、90はコイルばね、100は調整用アクチュエータとしての圧電アクチュエータ、120は皿ばね、130は隔壁部材、150は供給管、160はリミットスイッチ、ORはシール部材としてのOリング、Gは駆動流体としての圧縮エアを示す。なお、駆動流体は、圧縮エアに限定されるわけではなく他の流体を用いることも可能である。
圧力センサ400は、流路12cの下端側の開口に設けられ、流路12cの下端側の開口を閉塞している。圧力センサ400は調整用アクチュエータ100(ピエゾ)動作時に、フィードバック用のセンサとして機能する。圧力センサ400をバルブボディ10に適用すると、圧力センサ400から弁体までの距離、及び内容積が縮小されるので、調整用アクチュエータ100へのフィードバックのレスポンスが早くなりストローク量調整の精度と速度が向上する。なお、圧力センサ400の設置場所はこれに限定されるわけではなく、バルブボディ10の外部に設置することも可能である。また、圧力センサ400を使用しない構成も可能である。
流路12,13の開口部はバルブボディ10の側面に限られず、底面や上面等、所望の面に設けることも可能である。
流路12cの上端部の開口の周囲にバルブシート15が設けられている。バルブシート15は、合成樹脂(PFA、PA、PI、PCTFE等)製であり、流路12cの上端側の開口周縁に設けられた装着溝に嵌合固定されている。なお、本実施形態では、かしめ加工によりバルブシート15が装着溝内に固定されている。
流路13は、一端がバルブボディ10の凹部11の底面で開口し、かつ、他端にバルブボディ10の流路12とは反対側の他側面で開口する開口部13aを有し、開口部13aに管継手502が溶接により接続されている。
ダイヤフラム20は、その外周縁部がバルブボディ10の凹部11の底部に形成された突出部上に載置され、凹部11内へ挿入したボンネット30の下端部をバルブボディ10のねじ部へねじ込むことにより、ステンレス合金製の押えアダプタ25を介してバルブボディ10の前記突出部側へ押圧され、気密状態で挾持固定されている。尚、ニッケル・コバルト合金薄膜は、接ガス側に配置されているダイヤフラムとしては、他の構成のものも使用可能である。
操作部材40の下端面にはダイヤフラム20の中央部上面に当接するポリイミド等の合成樹脂製のダイヤフラム押え48が装着されている。
ダイヤフラム押え48の外周部に形成された鍔部48aの上面と、ボンネット30の天井面との間には、コイルばね90が設けられ、操作部材40はコイルばね90により下方向A2に向けて常時付勢されている。このため、主アクチュエータ60が作動していない状態では、ダイヤフラム20はバルブシート15に押し付けられ、流路12と流路13の間は閉じられた状態となる。
ケーシング50は、上側ケーシング部材51と下側ケーシング部材52からなり、下側ケーシング部材52の下端部内周のねじがボンネット30の上端部外周のねじに螺合している。また、下側ケーシング部材52の上端部外周のねじに上側ケーシング部材51の下端部内周のねじが螺合している。
下側ケーシング部材52の上端部とこれに対向する上側ケーシング部材51の対向面51fとの間には、環状のバルクヘッド65が固定されている。バルクヘッド65の内周面と操作部材40の外周面との間およびバルクヘッド65の外周面と上側ケーシング部材51の内周面との間は、OリングORによりそれぞれシールされている。
図1Cおよび1Dに示すように、操作部材40の内周面には、円筒状の隔壁部材130が当該操作部材40の内周面との間に間隙GP1を持つように固定されている。間隙GP1は、隔壁部材130の上端側および下端側の外周面と操作部材40の内周面との間に設けられた複数のOリングOR1~OR3によりシールされ、駆動流体としての圧縮エアGの流通路となっている。この間隙GP1で形成される流通路は、圧電アクチュエータ100と同心状に配置されている。後述する圧電アクチュエータ100のケーシング101と隔壁部材130との間には、間隙GP2が形成されている。
操作部材40には、圧力室C1,C2,C3に連通する位置において半径方向に貫通する流通路40h1,40h2,40h3が形成されている。流通路40h1,40h2,40h3は、操作部材40の周方向に等間隔に複数形成されている。流通路40h1,40h2,40h3は、上記した間隙GP1で形成される流通路とそれぞれ接続されている。
ケーシング50の上側ケーシング部材51には、上面で開口し上下方向A1,A2に延びかつ圧力室C1に連通する流通路50hが形成されている。流通路50hの開口部には、管継手152を介して供給管150が接続されている。これにより、供給管150から供給される圧縮エアGは、上記した各流通路を通じて圧力室C1,C2,C3に供給される。
ケーシング50内の第1のピストン61の上方の空間SPは、調整ボディ70の貫通孔を通じて大気につながっている。
圧電アクチュエータ100は、図2に示す円筒状のケーシング101に図示しない積層された圧電素子を内蔵している。ケーシング101は、ステンレス合金等の金属製で、半球状の先端部102側の端面および基端部103側の端面が閉塞している。積層された圧電素子に電圧を印可して伸長させることで、ケーシング101の先端部102側の端面が弾性変形し、半球状の先端部102が長手方向において変位する。積層された圧電素子の最大ストロークを2dとすると、圧電アクチュエータ100の伸びがdとなる所定電圧V0を予めかけておくことで、圧電アクチュエータ100の全長はL0となる。そして、所定電圧V0よりも高い電圧をかけると、圧電アクチュエータ100の全長は最大でL0+dとなり、所定電圧V0よりも低い電圧(無電圧を含む)をかけると、圧電アクチュエータ100の全長は最小でL0-dとなる。したがって、上下方向A1,A2において先端部102から基端部103までの全長を伸縮させることができる。なお、本実施形態では、圧電アクチュエータ100の先端部102を半球状としたが、これに限定されるわけではなく、先端部が平坦面であってもよい。
図1Cや図1Dに示すように、圧電アクチュエータ100への給電は、配線105により行われる。配線105は、調整ボディ70の貫通孔70aを通じて外部に導出されている。
圧電アクチュエータ100の先端部102は、図1に示すように円盤状のアクチュエータ受け27の上面に形成された円錐面状の受け面に当接している。アクチュエータ受け27は、上下方向A1,A2に移動可能となっている。
圧力レギュレータ200は、周知のポペットバルブ式の圧力レギュレータであり、詳細説明を省略するが、供給管203を通じて供給される高圧の圧縮エアGを所望の圧力へ下げて二次側の圧力が予め設定された圧力になるように制御される。供給管203を通じて供給される圧縮エアGの圧力に脈動や外乱による変動が存在する場合に、この変動を抑制して二次側へ出力する。
本実施形態では、ポペットバルブ式の圧力レギュレータを用いているが、他のタイプの圧力レギュレータを用いることができる。また、圧力レギュレータに限らず、ダンピングフィルタのような供給管150に供給される圧縮エアGの圧力変動を抑制する機構であれば採用可能である。
図3の半導体製造装置1000は、例えば、ALD法による半導体製造プロセスを実行するための装置であり、800は圧縮エアGの供給源、810はプロセスガスPGの供給源、900A~900C流体制御装置、VA~VCは開閉バルブ、1A~1Cは本実施形態に係るバルブ装置、CHA~CHCは処理チャンバである。
ALD法による半導体製造プロセスでは、プロセスガスの流量を精密に調整する必要があるとともに、基板の大口径化により、処理ガスの流量を確保する必要もある。
流体制御装置900A~900Cは、正確に計量したプロセスガスPGを処理チャンバCHA~CHCにそれぞれ供給するために、開閉バルブ、レギュレータ、マスフローコントローラ等の各種の流体機器を集積化した集積化ガスシステムである。
バルブ装置1A~1Cは、上記したダイヤフラム20の開閉により、流体制御装置900A~900CからのプロセスガスPGの流量を精密に制御して処理チャンバCHA~CHCにそれぞれ供給する。
開閉バルブVA~VCは、バルブ装置1A~1Cに開閉動作させるために、制御指令に応じて圧縮エアGの供給遮断を実行する。
共通の供給源800からは、ほぼ一定の圧力の圧縮エアGが常時出力されるが、開閉バルブVA~VCがそれぞれ独立に開閉されると、バルブ開閉時の圧力損失等の影響を受けてバルブ装置1A~1Cにそれぞれ供給される圧縮エアGの圧力が変動を起こし、一定ではなくなる。
バルブ装置1A~1Cに供給される圧縮エアGの圧力が変動すると、上記した圧電アクチュエータ100による流量調整量が変動してしまう可能性がある。この問題を解決するために、上記した圧力レギュレータ200が設けられている。
図4は、バルブ装置1のバルブ全閉状態を示している。図4に示す状態では、圧縮エアGは供給されていない。この状態において、皿ばね120は既にある程度圧縮されて弾性変形しており、この皿ばね120の復元力により、アクチュエータ受け27は上方向A1に向けて常時付勢されている。これにより、圧電アクチュエータ100も上方向A1に向けて常時付勢され、基端部103の上面がアクチュエータ押え80に押し付けられた状態となっている。これにより、圧電アクチュエータ100は、上下方向A1,A2の圧縮力を受け、バルブボディ10に対して所定の位置に配置される。圧電アクチュエータ100は、いずれの部材にも連結されていないので、操作部材40に対して上下方向A1,A2において相対的に移動可能である。
皿ばね120の個数や向きは条件に応じて適宜変更できる。また、皿ばね120以外にもコイルばね、板ばね等の他の弾性部材を使用できるが、皿ばねを使用すると、ばね剛性やストローク等を調整しやすいという利点がある。
この状態において、供給管150を通じて供給される駆動エアGの圧力に変動が大きいと、操作部材40に作用する上方向A1の力も変動し、圧電アクチュエータ100が上下方向A1,A2において変形する。圧電アクチュエータ100が上下方向A1,A2において変形すると、リフト量Lfが変化して流量が変化してしまう。
圧力レギュレータ200は、圧電アクチュエータ100の上下方向A1,A2における変形を許容値に収めるように、駆動エアGの圧力の変動を抑制するように作用する。
図6Aおよび図6Bの中心線Ctの左側は、図5に示す状態を示しており、中心線Ctの右側は操作部材40の上下方向A1,A2の位置を調整した後の状態を示している。
流体の流量を減少させる方向に調整する場合には、図6Aに示すように、圧電アクチュエータ100を伸長させて、操作部材40を下方向A2に移動させる。これにより、ダイヤフラム20とバルブシート15との距離である調整後のリフト量Lf-は、調整前のリフト量Lfよりも小さくなる。
流体の流量を増加させる方向に調整する場合には、図6Bに示すように、圧電アクチュエータ100を短縮させて、操作部材40を上方向A1に移動させる。これにより、ダイヤフラム20とバルブシート15との距離である調整後のリフト量Lf+は、調整前のリフト量Lfよりも大きくなる。
供給管150を通じて供給される駆動エアGの圧力の変動は、圧電アクチュエータ100の調整量にも影響を与える。
圧力レギュレータ200は、圧電アクチュエータ100の調整量の誤差が所望の範囲に収まるように、駆動エアGの圧力の変動を抑制するように作用する。
すなわち、圧電アクチュエータ100のストロークでは、ダイヤフラム20のリフト量をカバーすることができないが、駆動エアGで動作する主アクチュエータ60と圧電アクチュエータ100を併用することで、相対的にストロークの長い主アクチュエータ60でバルブ装置1の供給する流量を確保しつつ、相対的にストロークの短い圧電アクチュエータ100で精密に流量調整することができ、調整ボディ70等により手動で流量調整をする必要がなくなるので、流量調整工数が大幅に削減される。
本実施形態によれば、圧電アクチュエータ100に印可する電圧を変化させるだけで精密な流量調整が可能であるので、流量調整を即座に実行できるとともに、リアルタイムに流量制御をすることも可能となる。
本実施形態によれば、圧力レギュレータ200を設けたことにより、圧力変動に対する流量変動の発生を抑制でき、より高精密な流量制御が実現される。
本実施形態によれば、圧力レギュレータ200を収容ボックス301内の所定の場所に固定しているので、圧力レギュレータ200から圧力室までの距離および内容積をバルブ毎に一定にすることができ、より精密な流量調整が可能になる。すなわち、調整用アクチュエータ100によって「流量」は調整可能になるが、圧力レギュレータ200から圧力室までの距離およびその間の内容積がバルブ毎に異なると、ダイヤフラム20の「開閉速度」にばらつきが出るため、処理チャンバに供給する処理ガスの供給量を正確に制御できなくなる。
(調整用アクチュエータによって「流量」は調整可能になるが、
レギュレータから圧力室の距離、内容積がバルブ毎に異なると「開閉速度」にばらつきが出るため、処理チャンバに供給する処理ガスの供給量を正確に制御できなくなる)※請求項4の効果
上記実施形態では、調整用アクチュエータとして、圧電アクチュエータを用いたが、これに限定されるわけではない。たとえば、電界の変化に応じて変形する化合物からなる電気駆動材料をアクチュエータとして用いることができる。電流又は電圧により電気駆動材料の形状や大きさを変化させ、規定される操作部材40の開位置を変化させることができる。このような電気駆動材料は、圧電材料であってもよいし、圧電材料以外の電気駆動材料であってもよい。圧電材料以外の電気駆動材料とする場合には電気駆動型高分子材料とすることができる。
電気駆動型高分子材料は、電気活性高分子材料(Electro Active Polymer:EAP)ともよばれ、例えば外部電場やクーロン力により駆動する電気性EAP、およびポリマーを膨潤させている溶媒を電場により流動させて変形させる非イオン性EAP、電場によるイオンや分子の移動により駆動するイオン性EAP等があり、これらのいずれか又は組合せを用いることができる。
10 バルブボディ
11 凹部
12,13 流路
15 バルブシート
20 ダイヤフラム(弁体)
25 押えアダプタ
27 アクチュエータ受け
30 ボンネット
40 操作部材
48 ダイヤフラム押え(操作部材)
50 ケーシング
51 上側ケーシング部材
52 下側ケーシング部材
60 主アクチュエータ
70 調整ボディ
80 アクチュエータ押え
90 コイルばね
100 圧電アクチュエータ(調整用アクチュエータ)
101 ケーシング
102 先端部
103 基端部
120 皿ばね
150 供給管
160 リミットスイッチ
200 圧力レギュレータ
OR Oリング
G 圧縮エア(駆動流体)
Lf 調整前のリフト量
Lf+,Lf- 調整後のリフト量
Claims (9)
- 流路を画定するバルブボディと、
前記バルブボディの流路を開閉可能に設けられた弁体と、
予め設定された前記弁体に流路を閉鎖させる閉位置と予め設定された前記弁体に流路を開放させる開位置との間で移動可能に設けられた前記弁体を操作する操作部材と、
供給される駆動流体の圧力を受けて、前記操作部材を前記開位置又は閉位置に移動させる主アクチュエータと、
前記主アクチュエータが発生する力の少なくとも一部が作用するように配置され、前記開位置に位置付けられた前記操作部材の位置を調整するための調整用アクチュエータと、
前記駆動流体の前記主アクチュエータへの供給経路に設けられ、前記主アクチュエータへ供給される前記駆動流体の圧力の変動を抑制するための圧力安定化機構と、を有するバルブ装置。 - 前記圧力安定化機構は、供給される前記駆動流体の圧力を調圧する圧力レギュレータを含む、請求項1のバルブ装置。
- 前記主アクチュエータは、前記操作部材を前記開位置に移動させ、
前記調整用アクチュエータは、前記主アクチュエータにより前記開位置に位置付けられた前記操作部材に作用する力を当該調整用アクチュエータの先端部で受け止めて当該操作部材の移動を規制しつつ、当該操作部材の位置を調整する、請求項1または2に記載のバルブ装置。 - 前記主アクチュエータおよび前記調整用アクチュエータを内蔵するケーシングを有し、
前記ケーシング内には、前記圧力安定化機構を通じた前記駆動流体を前記主アクチュエータへ供給する流通路が形成され、
前記流通路は、当該流通路を流通する駆動流体の圧力が前記調整用アクチュエータに作用しないように分離して形成されている、請求項1~3のいずれかに記載のバルブ装置。 - 前記主アクチュエータは、環状のピストンを有し、
前記調整用アクチュエータおよび操作部材は、前記環状のピストンと同心状に配置されており、
前記流通路は、前記調整用アクチュエータと同心状に配置された流通路を有する、請求項4に記載のバルブ装置。 - 前記調整用アクチュエータは、給電に応じて伸縮する駆動源を有する、請求項1~5のいずれかに記載のバルブ装置。
- 前記調整用アクチュエータは、圧電素子の伸縮を利用したアクチュエータを含む、請求項1~6のいずれかに記載のバルブ装置。
- 前記調整用アクチュエータは、基端部と先端部とを有するケーシングと、当該ケーシング内に収容され前記基端部と前記先端部との間で積層された圧電素子と、を有し、前記圧電素子の伸縮を利用して当該ケーシングの前記基端部と前記先端部との間の全長を伸縮させる、請求項7に記載のバルブ装置。
- 前記調整用アクチュエータは、電気駆動型ポリマーを駆動源として有するアクチュエータを含む、請求項1~6のいずれかに記載のバルブ装置。
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| Application Number | Priority Date | Filing Date | Title |
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| PCT/JP2018/009297 WO2019171593A1 (ja) | 2018-03-09 | 2018-03-09 | バルブ装置 |
| JP2020504636A JP7030359B2 (ja) | 2018-03-09 | 2018-03-09 | バルブ装置 |
| US16/971,371 US11242934B2 (en) | 2018-03-09 | 2018-03-09 | Valve device |
| CN201880091025.3A CN111819383A (zh) | 2018-03-09 | 2018-03-09 | 阀装置 |
| KR1020207026134A KR102398907B1 (ko) | 2018-03-09 | 2018-03-09 | 밸브 장치 |
| TW107110467A TWI695945B (zh) | 2018-03-09 | 2018-03-27 | 閥裝置 |
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| US (1) | US11242934B2 (ja) |
| JP (1) | JP7030359B2 (ja) |
| KR (1) | KR102398907B1 (ja) |
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| JP7102418B2 (ja) * | 2018-04-18 | 2022-07-19 | アプライド マテリアルズ インコーポレイテッド | 蒸発した材料を基板の上に堆積するための蒸発源、堆積装置、蒸発した材料の蒸気圧を測定するための方法、及び蒸発した材料の蒸発速度を決定するための方法 |
| WO2020158459A1 (ja) * | 2019-01-31 | 2020-08-06 | 株式会社フジキン | バルブ装置、このバルブ装置を用いた流量制御方法、流体制御装置、半導体製造方法、および半導体製造装置 |
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Also Published As
| Publication number | Publication date |
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| US11242934B2 (en) | 2022-02-08 |
| CN111819383A (zh) | 2020-10-23 |
| TWI695945B (zh) | 2020-06-11 |
| TW201938932A (zh) | 2019-10-01 |
| US20200393051A1 (en) | 2020-12-17 |
| KR102398907B1 (ko) | 2022-05-17 |
| JPWO2019171593A1 (ja) | 2021-02-18 |
| JP7030359B2 (ja) | 2022-03-07 |
| KR20200118855A (ko) | 2020-10-16 |
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