WO2019168484A2 - Structure of a tile receiver/transmitter module with high power output - Google Patents
Structure of a tile receiver/transmitter module with high power output Download PDFInfo
- Publication number
- WO2019168484A2 WO2019168484A2 PCT/TR2018/050640 TR2018050640W WO2019168484A2 WO 2019168484 A2 WO2019168484 A2 WO 2019168484A2 TR 2018050640 W TR2018050640 W TR 2018050640W WO 2019168484 A2 WO2019168484 A2 WO 2019168484A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- module
- ltcc module
- ltcc
- structure according
- interposer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
Definitions
- the invention relates to the construction of multi-channel, hermetic, high power output and compact tile receiver / transmitter modules which forms part of the phased array structures used in radar and communication systems.
- the invention is inspired by the existing circumstances and aims to solve the above- mentioned drawbacks.
- the main purpose of the invention is to introduce a multi-channel and high output T/R module through microwave elements.
- Another purpose of the invention is to introduce a compact T/R module structure.
- Another purpose of the invention is to introduce a T/R module structure that meets system requirements such as operating frequency and scanning angle.
- the invention is a multi- channel, hermetic, high power output and compact tile receiver/ transmitter module structure which forms part of the phased array structures used in radar and communication systems, that comprises,
- the first interposer located at the bottom of the first LTCC module and providing radio frequency, DC power and control connections between the first LTCC module and the second LTCC module,
- a second interposer located between the second LTCC module and the PCB board for transmitting the DC power and the control signals received from the PCB board to the first LTCC module and the second LTCC module.
- Figure 1 Is the side-section view of T/R module structure of the invention.
- Figure 2 Is the top perspective view of the first LTCC module.
- Figure 3 Is a view of the interposer and the frame on the first LTCC module.
- Figure 4 Is the top perspective view of the second LTCC module.
- FIG. 5 Is the top view of T/R module structure of the invention.
- Figure 6 Is a view of T/R module structure of the invention inside the box.
- the architecture of the invention comprises a combination of microwave elements (1 .1 ), mechanical parts and spacers on low temperature co-fired ceramic (LTCC).
- This architecture includes multiple dielectric layers formed by LTCC technology, multiple cavities in these layers, multiple microwave elements in these cavities (1 .1 ) and multiple RF transitions (1 .7) , DC power and control signals extending to these elements.
- the invention as seen in Figure 1 , is a multi-channel, hermetic, high power output and compact tile receiver/ transmitter module structure which forms the part of the phased array structures used in radar and communication systems, that comprises,
- the first interposer (1 .3) located at the bottom of the first LTCC module (1 ) and providing radio frequency, DC power and control connections between the first LTCC module (1 ) and the second LTCC module (2),
- a second interposer (1 .3) located between the second LTCC module (2) and the PCB board (4) for transmitting the DC power and the control signals received from the PCB board (4) to the first LTCC module (1 ) and the second LTCC module (2).
- Figure 1 shows a side section view of the receiver/transmitter module.
- the microwave elements (1 .1 ) in the T/R module are placed in the first LTCC module (1 ) and the second LTCC module (2).
- Antenna and manifold connections can be made via the RF connectors (1 .2) through the first LTCC module (1 ).
- RF (Radio Frequency), DC power and control connections between the first LTCC module (1 ) and the second LTCC module (2) can be provided with the non-soldered spring“fuzz button” connectors in the first interposer (1 .3).
- the DC power and control signals required for the devices located in and on the first LTCC module (1 ) and the second LTCC module (2) can be provided by the PCB board (4) via the non- soldered spring connectors within the second interposer (2.2)..
- the alignment of the entire structure is provided by the pins (3).
- the first LTCC module (1 ) may be provided with microwave elements (1 .1 ) which dissipate high heat. Microwave elements (1 .1 ) can be placed on the first LTCC module (1 ), or they can be placed on the carriers (1 .4).
- the carriers (1 .4) can be mounted to the middle of the base of the first LTCC module (1 ) by brazing. This carrier (1 .4) can transmit high heat to the cooler (heat sink).
- the first LTCC module near the antenna (1 ) may contain low-noise microwave elements (1 .1 ).
- MMIC microwave elements (1 .1 ) on the first LTCC module (1 ) and the second LTCC module (2) can be enclosed in the hermetic box with the kovar frame (5).
- the first LTCC module (1 ) shown in Figure 2 comprises, in its most basic form, more than one dielectric layer providing miniaturization, more than one window providing isolation, cavity, and multiple microwave elements (1 .1 ) positioned within the cavity.
- High thermal conductivity is achieved by placing high heat dissipating microwave elements (1 .1 ) on the lowest ceramic layer (the first LTCC module (1 )) or preferably on the carrier (1 .4).
- Other microwave elements (1 .1 ) can be placed on a higher ceramic layer.
- the connection of the microwave elements (1 .1 ) with the peripheral elements (1 .6) such as capacitor, coil and resistor are made.
- the transition design of the RF microwave elements (1 .1 ) on the first LTCC module (1 ) are made and connections are made with the gold wire on the microwave elements (1 .1 ) from these transitions (1 .7).
- the pin space (3.1 ) may be formed on the first LTCC module (1 ).
- first LTCC module (1 ) shown in Figure 3 preferably the CTE-compliant kovar frame (1 .5) with ceramic materials is soldered onto the middle of the LTCC module (1 ) , .
- This frame (1 .5) can be covered by a lid to protect the MMIC- based microwave elements (1 .1 ) from external influences.
- a first interposer (1 .3) preferably selected from the material with low coefficient of expansion, formally compatible with the kovar frame (1 .5) so as not to exceed the T/R module dimensions.
- Non-soldered connectors which is suitable for reprocessing are inserted into the holes (1 .3.1 ) provided on the first interposer (1 .3).
- the second LTCC module (2) shown in Figure 4 comprises, in its most basic form, more than one dielectric layers providing miniaturization, and multiple microwave elements (1.1 ) positioned within these layers.
- Packaged microwave elements (1.1 ) such as MMIC devices, and peripheral elements (1.6) such as resistor and capacitor can also be positioned on the second LTCC module (2).
- the pads (2.1 ) which are to be pressed by the non-soldered connectors are provided in areas near the edges of the second LTCC module (2).
- the pin space (3.1 ) may be formed on the second LTCC module (2).
- Mini-SMP RF connectors (1.2) at the base of the first LTCC-based module (1 ).
- This architecture has a 4-Channel T/R module structure.
- the carriers (1.4), that can bear high power output microwave elements, are connected to the cooler from this side.
- the PCB board (4), the second interposer (2.2), the second LTCC module (2), the first interposer (1.3), the first LTCC module (1 ) are aligned as in Figure 5, and placed in the mechanical box (5) shown in Figure 6.
- the T/R module in the mechanical box (5) shown in Figure 6 is attached to the motherboard through the PCB connectors (4.1 ).
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Radar Systems Or Details Thereof (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention is a multi-channel, hermetic, compact tile receiver / transmitter module with high power output, which forms part of the phased array structures used in radar and communication systems; comprising the first LTCC module (1) on which high heat dissipating microwave element (1.1) is placed, the second LTCC module (2) on which microwave element (1.1) is placed, the first interposer (1.3) located at the bottom of the first LTCC module (1) and providing radio frequency, DC power and control connections between the first LTCC module (1) and the second LTCC module (2), a PCB board (4) providing the necessary DC power and control signals for the elements in and on the first LTCC module (1) and the second LTCC module (2), and a second interposer (1.3) located between the second LTCC module (2) and the PCB board (4) for transmitting the DC power and the control signals received from the PCB board (4) to the first LTCC module (1) and the second LTCC module (2).
Description
STRUCTURE OF A TILE RECEIVER/TRANSMITTER MODULE WITH HIGH POWER
OUTPUT
Technical Field
The invention relates to the construction of multi-channel, hermetic, high power output and compact tile receiver / transmitter modules which forms part of the phased array structures used in radar and communication systems.
Prior Art
Nowadays, in phased array systems, the number of T/R- transmitter / receiver modules per system reaches to thousands. Therefore, the weight, size and cost of the receiver/ transmitter modules constitute an important part of the systems.
In the prior art, system requirements, such as operating frequency, scanning angle etc., affect the design and layout of the modules. The distances between the antennas required in order to achieve the desired scanning angles at frequencies of X band and above limit the module dimensions. This requires high density module architecture designs. But high density modules also bring high operating temperature and isolation problems. All these factors should be considered in the module design.
As a result of the literature search, the patent application no US2010259913, titled as “LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) TRANSMIT/ RECEIVE (T/R) ASSEMBLY UTILIZING BALL GRID ARRAY (BGA) TECHNOLOGY” is found. The system mentioned in the application is provided by combining the microwave components in a low temperature ceramic. However, this system has low power output and is not a compact structure.
A document found in the literature search on the subject is the patent application no US2007210959 (A1 ) titled as "Multi-beam array module for phased array systems." In this application, the control module communicates with each array element to control phase shift and attenuation. This system is advantageous for phased array systems, yet has a low power output and a non-compact structure.
As a result, due to the above-mentioned drawbacks and the inadequacy of the existing solutions, an improvement in the technical field has been required.
The Purpose of Invention
The invention is inspired by the existing circumstances and aims to solve the above- mentioned drawbacks.
The main purpose of the invention is to introduce a multi-channel and high output T/R module through microwave elements.
Another purpose of the invention is to introduce a compact T/R module structure.
Another purpose of the invention is to introduce a T/R module structure that meets system requirements such as operating frequency and scanning angle.
In order to fulfill the above mentioned purposes, the invention is a multi- channel, hermetic, high power output and compact tile receiver/ transmitter module structure which forms part of the phased array structures used in radar and communication systems, that comprises,
- the first LTCC module on which high heat rejecting microwave element is placed,
- a second LTCC module on which microwave element is placed,
- the first interposer located at the bottom of the first LTCC module and providing radio frequency, DC power and control connections between the first LTCC module and the second LTCC module,
- a PCB board providing the necessary DC power and control signals for the elements in and on the first LTCC module and the second LTCC module,
- a second interposer located between the second LTCC module and the PCB board for transmitting the DC power and the control signals received from the PCB board to the first LTCC module and the second LTCC module.
The structural and characteristic features and all advantages of the invention outlined in the drawings below and in the detailed description made by referring these figures will be understood clearly, therefore the evaluation should be made by taking these figures and detailed explanation into consideration.
Brief Description of the Figures
Figure 1 Is the side-section view of T/R module structure of the invention. Figure 2 Is the top perspective view of the first LTCC module.
Figure 3 Is a view of the interposer and the frame on the first LTCC module. Figure 4 Is the top perspective view of the second LTCC module.
Figure 5 Is the top view of T/R module structure of the invention.
Figure 6 Is a view of T/R module structure of the invention inside the box.
Reference Numbers
1. The first LTCC module
1.1. Microwave element
1.2. RF connector
1.3. The first interposer
1.3.1. Hole
1.4. Carrier
1.5. Frame
1.6. Peripheral element
1.7. Transition
2. Second LTCC module
2.1. Pad
2.2. The second interposer
3. Pin
3.1. Pin space
4. PCB board
4.1. PCB connector
5. Box
LTCC: Low Temperature Co-fired-Ceramics
Detailed Description of the Invention
In this detailed description, the preferred embodiments of the T/R- receiver / transmitter module with high power output of the invention is explained only for a better understanding of the subject.
The architecture of the invention comprises a combination of microwave elements (1 .1 ), mechanical parts and spacers on low temperature co-fired ceramic (LTCC). This architecture includes multiple dielectric layers formed by LTCC technology, multiple cavities in these layers, multiple microwave elements in these cavities (1 .1 ) and multiple RF transitions (1 .7) , DC power and control signals extending to these elements.
The invention, as seen in Figure 1 , is a multi-channel, hermetic, high power output and compact tile receiver/ transmitter module structure which forms the part of the phased array structures used in radar and communication systems, that comprises,
- the first LTCC module (1 ) on which high heat rejecting microwave element (1 .1 ) is placed,
- a second LTCC module (2) on which microwave element (1 .1 ) is placed,
- the first interposer (1 .3) located at the bottom of the first LTCC module (1 ) and providing radio frequency, DC power and control connections between the first LTCC module (1 ) and the second LTCC module (2),
- a PCB board (4) providing the necessary DC power and control signals for the elements in and on the first LTCC module (1 ) and the second LTCC module (2),
- a second interposer (1 .3) located between the second LTCC module (2) and the PCB board (4) for transmitting the DC power and the control signals received from the PCB board (4) to the first LTCC module (1 ) and the second LTCC module (2).
Figure 1 shows a side section view of the receiver/transmitter module. The microwave elements (1 .1 ) in the T/R module are placed in the first LTCC module (1 ) and the second LTCC module (2). Antenna and manifold connections can be made via the RF connectors (1 .2) through the first LTCC module (1 ). RF (Radio Frequency), DC power and control connections between the first LTCC module (1 ) and the second LTCC module (2) can be provided with the non-soldered spring“fuzz button” connectors in the first interposer (1 .3). The DC power and control signals required for the devices located in and on the first LTCC module (1 ) and the second LTCC module (2) can be provided by the PCB board (4) via the non- soldered spring connectors within the second interposer (2.2).. The alignment of the entire structure is provided by the pins (3).
The first LTCC module (1 ) may be provided with microwave elements (1 .1 ) which dissipate high heat. Microwave elements (1 .1 ) can be placed on the first LTCC module (1 ), or they can be placed on the carriers (1 .4). For this purpose, the carriers (1 .4) can be mounted to the middle of the base of the first LTCC module (1 ) by brazing. This carrier (1 .4) can transmit high heat to the cooler (heat sink). In addition, in order to reduce the possible noise figure, the first LTCC module near the antenna (1 ) may contain low-noise microwave elements (1 .1 ).
MMIC microwave elements (1 .1 ) on the first LTCC module (1 ) and the second LTCC module (2) can be enclosed in the hermetic box with the kovar frame (5).
The first LTCC module (1 ) shown in Figure 2 comprises, in its most basic form, more than one dielectric layer providing miniaturization, more than one window providing isolation, cavity, and multiple microwave elements (1 .1 ) positioned within the cavity. High thermal conductivity is achieved by placing high heat dissipating microwave elements (1 .1 ) on the lowest ceramic layer (the first LTCC module (1 )) or preferably on the carrier (1 .4). Other microwave elements (1 .1 ) can be placed on a higher ceramic layer. The connection of the microwave elements (1 .1 ) with the peripheral elements (1 .6) such as capacitor, coil and resistor are made. The transition design of the RF microwave elements (1 .1 ) on the first LTCC module (1 ) are made and connections are made with the gold wire on the microwave elements (1 .1 ) from these transitions (1 .7). For alignment, the pin space (3.1 ) may be formed on the first LTCC module (1 ).
On the first LTCC module (1 ) shown in Figure 3, preferably the CTE-compliant kovar frame (1 .5) with ceramic materials is soldered onto the middle of the LTCC module (1 ) , . This frame (1 .5) can be covered by a lid to protect the MMIC- based microwave elements (1 .1 ) from external influences. On the bottom part and the edges of the first LTCC module (1 ), there is a first interposer (1 .3) preferably selected from the material with low coefficient of expansion, formally compatible with the kovar frame (1 .5) so as not to exceed the T/R module dimensions. Non-soldered connectors which is suitable for reprocessing are inserted into the holes (1 .3.1 ) provided on the first interposer (1 .3).. These connectors provide the power and control signals of the microwave elements (1 .1 ) and the vertical RF transitions between the first LTCC module (1 ) and the second LTCC module (2). To ensure effective connection, the height of the kovar frame (1 .5) is produced to be slightly less than the height of the first interposer (1 .3). For alignment, the pin spaces (3.1 ) may be formed on the first interposer (1 ).
The second LTCC module (2) shown in Figure 4 comprises, in its most basic form, more than one dielectric layers providing miniaturization, and multiple microwave elements (1.1 ) positioned within these layers. Packaged microwave elements (1.1 ) such as MMIC devices, and peripheral elements (1.6) such as resistor and capacitor can also be positioned on the second LTCC module (2). There are signal transition lines between the microwave elements (1.1 ). The pads (2.1 ) which are to be pressed by the non-soldered connectors are provided in areas near the edges of the second LTCC module (2). For alignment, the pin space (3.1 ) may be formed on the second LTCC module (2).
For the RF connections of the T/R module shown in Figure 5 to the possible antenna and manifold card, there are multiple Mini-SMP RF connectors (1.2) at the base of the first LTCC-based module (1 ). This architecture has a 4-Channel T/R module structure. The carriers (1.4), that can bear high power output microwave elements, are connected to the cooler from this side. The PCB board (4), the second interposer (2.2), the second LTCC module (2), the first interposer (1.3), the first LTCC module (1 ) are aligned as in Figure 5, and placed in the mechanical box (5) shown in Figure 6.
The T/R module in the mechanical box (5) shown in Figure 6 is attached to the motherboard through the PCB connectors (4.1 ).
Claims
1. The invention is a multi-channel, hermetic, compact tile receiver/transmitter module with high power output, which forms part of the phased array structures used in radar and communication systems, characterized in that; it comprises,
- the first LTCC module (1 ) on which high heat dissipating microwave element (1.1 ) is placed,
- a second LTCC module (2) on which microwave element (1.1 ) is placed,
- the first interposer (1.3) located at the bottom of the first LTCC module (1 ) and providing radio frequency, DC power and control connections between the first LTCC module (1 ) and the second LTCC module (2),
- a PCB board (4) providing the necessary DC power and control signals for the elements in and on the first LTCC module (1 ) and the second LTCC module (2),
- a second interposer (1.3) located between the second LTCC module (2) and the PCB board (4) for transmitting the DC power and the control signals received from the PCB board (4) to the first LTCC module (1 ) and the second LTCC module (2).
2. The invention is a structure according to Claim 1 , characterized in that; it comprises a microwave element (1.1 ) positioned on the first LTCC module (1 ) that provides noise reduction.
3. The invention is a structure according to Claim 1 , characterized in that; it comprises a carrier (1.4) arranged on the first LTCC module (1 ) on which the microwave elements (1.1 ) can be placed.
4. The invention is a structure according to Claim 1 or Claim 3, characterized in that; it comprises a carrier (1.4) that allows the high heat to be transmitted to the cooler.
5. The invention is a structure according to Claim 1 , characterized in that; it comprises a frame (1.5) on the first LTCC module (1 ) to provide protection to the microwave elements from external influences via closing the lid on it.
6. The invention is a structure according to Claim 1 or Claim 5, characterized in that; the height of the kovar frame (1.5) is produced to be slightly less than the
height of the first interposer (1.3) to provide vertical RF transitions between the first LTCC module (1 ) and the second LTCC module (2).
7. The invention is a structure according to Claim 1 , characterized in that; it comprises an RF connector (1.5) positioned on the first LTCC module (1 ) that provides antenna and manifold connections.
8. The invention is a structure according to Claim 1 , characterized in that; it comprises a hole (1.3.1 ) on the first interposer (1.3) in which the non-soldered connectors are to be placed.
9. The invention is a structure according to Claim 1 , characterized in that; it comprises a pad (2.1 ) on the first LTCC module (1 ) and the second LTCC module (2) in which the non-soldered connectors are to be placed.
10. The invention is a structure according to Claim 1 , characterized in that; it comprises peripheral elements (1.6) placed on the first LTCC module (1 ) and the second LTCC module (2).
11. The invention is a structure according to Claim 1 or Claim 10, characterized in that; the peripheral elements (1.6) are resistor and capacitor.
12. The invention is a structure according to Claim 1 , characterized in that; it comprises a pin (3) to provide alignment.
13. The invention is a structure according to Claim 1 or Claim 12, characterized in that; it comprises a pin space (3.1 ) placed on the first LTCC module (1 ), the second LTCC module (2), the first interposer (1.3), the second interposer (2.2) and PCB board (4), in which the pin (3) passes through to provide alignment.
14. The invention is a structure according to Claim 1 , characterized in that; it comprises a transition (1.7) on the first LTCC module (1 ) that provides connection with microwave elements (1.1 ).
15. The invention is a structure according to Claim 1 , characterized in that; it comprises a PCB connector (4.1 ) that allows the tile receiver/transmitter module to be installed on the motherboard.
16. The invention is a structure according to any of the above claims, characterized in that; it comprises a box (5) in which the tile receiver/transmitter module is placed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201890000967.1U CN211295345U (en) | 2017-12-15 | 2018-10-31 | Tiled receiver/transmitter module with high power output |
| DE212018000237.1U DE212018000237U1 (en) | 2017-12-15 | 2018-10-31 | Structure of a panel receiver / transmitter module with high output power |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TR2017/20500 | 2017-12-15 | ||
| TR201720500 | 2017-12-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2019168484A2 true WO2019168484A2 (en) | 2019-09-06 |
| WO2019168484A3 WO2019168484A3 (en) | 2019-11-14 |
Family
ID=67805483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/TR2018/050640 Ceased WO2019168484A2 (en) | 2017-12-15 | 2018-10-31 | Structure of a tile receiver/transmitter module with high power output |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN211295345U (en) |
| DE (1) | DE212018000237U1 (en) |
| WO (1) | WO2019168484A2 (en) |
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| CN111025235A (en) * | 2019-12-16 | 2020-04-17 | 南京吉凯微波技术有限公司 | Microwave TR assembly with ultra-wide working bandwidth |
| CN111525284A (en) * | 2020-07-03 | 2020-08-11 | 成都雷电微力科技股份有限公司 | Multi-frequency composite high-power tile type active phased array antenna |
| CN111835376A (en) * | 2020-08-10 | 2020-10-27 | 航天科工通信技术研究院有限责任公司 | A kind of highly integrated multi-channel tile type T/R component and arrangement method |
| CN112114290A (en) * | 2020-09-25 | 2020-12-22 | 中国电子科技集团公司第四十三研究所 | Miniaturized four passageway TR subassemblies in X wave band |
| CN116545466A (en) * | 2023-07-04 | 2023-08-04 | 成都锐芯盛通电子科技有限公司 | High-power tile type TR component |
| CN116583096A (en) * | 2023-07-14 | 2023-08-11 | 四川天中星航空科技有限公司 | A fully enclosed radio frequency comprehensive test equipment |
| US12230857B2 (en) | 2021-11-30 | 2025-02-18 | Navico, Inc. | Radar waveguide and choke assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114421111A (en) * | 2021-12-14 | 2022-04-29 | 中国电子科技集团公司第二十九研究所 | A three-layer tile-type TR module using wool buttons |
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| US6580402B2 (en) * | 2001-07-26 | 2003-06-17 | The Boeing Company | Antenna integrated ceramic chip carrier for a phased array antenna |
| US7046195B2 (en) * | 2001-12-14 | 2006-05-16 | Itt Manufacturing Enterprises, Inc. | Single Ku-band multi-polarization gallium arsenide transmit chip |
| US6975267B2 (en) * | 2003-02-05 | 2005-12-13 | Northrop Grumman Corporation | Low profile active electronically scanned antenna (AESA) for Ka-band radar systems |
| US7671696B1 (en) * | 2006-09-21 | 2010-03-02 | Raytheon Company | Radio frequency interconnect circuits and techniques |
| US9172145B2 (en) * | 2006-09-21 | 2015-10-27 | Raytheon Company | Transmit/receive daughter card with integral circulator |
| EP2642587B1 (en) * | 2012-03-21 | 2020-04-29 | LEONARDO S.p.A. | Modular active radiating device for electronically scanned array aerials |
| CN105356051B (en) * | 2015-11-16 | 2018-02-23 | 中国电子科技集团公司第十研究所 | High-power target seeker tile style active phase array antenna |
| CN105958214B (en) * | 2016-05-09 | 2018-08-10 | 中国电子科技集团公司第三十八研究所 | A kind of expansible highly integrated active phase array antenna |
| CN105914476A (en) * | 2016-05-20 | 2016-08-31 | 中国电子科技集团公司第十研究所 | Ka-band tilt-structure active phased array antenna |
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2018
- 2018-10-31 WO PCT/TR2018/050640 patent/WO2019168484A2/en not_active Ceased
- 2018-10-31 CN CN201890000967.1U patent/CN211295345U/en not_active Expired - Fee Related
- 2018-10-31 DE DE212018000237.1U patent/DE212018000237U1/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111025235A (en) * | 2019-12-16 | 2020-04-17 | 南京吉凯微波技术有限公司 | Microwave TR assembly with ultra-wide working bandwidth |
| CN111525284A (en) * | 2020-07-03 | 2020-08-11 | 成都雷电微力科技股份有限公司 | Multi-frequency composite high-power tile type active phased array antenna |
| CN111525284B (en) * | 2020-07-03 | 2020-09-22 | 成都雷电微力科技股份有限公司 | Multi-frequency composite high-power tile type active phased array antenna |
| CN111835376A (en) * | 2020-08-10 | 2020-10-27 | 航天科工通信技术研究院有限责任公司 | A kind of highly integrated multi-channel tile type T/R component and arrangement method |
| CN112114290A (en) * | 2020-09-25 | 2020-12-22 | 中国电子科技集团公司第四十三研究所 | Miniaturized four passageway TR subassemblies in X wave band |
| US12230857B2 (en) | 2021-11-30 | 2025-02-18 | Navico, Inc. | Radar waveguide and choke assembly |
| CN116545466A (en) * | 2023-07-04 | 2023-08-04 | 成都锐芯盛通电子科技有限公司 | High-power tile type TR component |
| CN116545466B (en) * | 2023-07-04 | 2023-08-29 | 成都锐芯盛通电子科技有限公司 | High-power tile type TR component |
| CN116583096A (en) * | 2023-07-14 | 2023-08-11 | 四川天中星航空科技有限公司 | A fully enclosed radio frequency comprehensive test equipment |
| CN116583096B (en) * | 2023-07-14 | 2023-09-12 | 四川天中星航空科技有限公司 | Totally-enclosed radio frequency comprehensive test equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019168484A3 (en) | 2019-11-14 |
| DE212018000237U1 (en) | 2020-01-21 |
| CN211295345U (en) | 2020-08-18 |
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