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WO2019164209A1 - Dispositif électronique comprenant un module de capteur biométrique et son procédé de fabrication - Google Patents

Dispositif électronique comprenant un module de capteur biométrique et son procédé de fabrication Download PDF

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Publication number
WO2019164209A1
WO2019164209A1 PCT/KR2019/001954 KR2019001954W WO2019164209A1 WO 2019164209 A1 WO2019164209 A1 WO 2019164209A1 KR 2019001954 W KR2019001954 W KR 2019001954W WO 2019164209 A1 WO2019164209 A1 WO 2019164209A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
printed circuit
circuit board
plate
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/001954
Other languages
English (en)
Korean (ko)
Inventor
고보환
황병선
김종덕
김영주
한찬솔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2019164209A1 publication Critical patent/WO2019164209A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion

Definitions

  • a method of manufacturing an electronic device may include: preparing a sensor array; Separating the sensor array into individual sensor modules; Bonding the flexible printed circuit board and the sensor module to each other; And assembling the decor and the decor plate.
  • a molding part forming a first surface; A substrate forming a second surface facing away from the first surface; A biosensor disposed on the popular plate and including a sensor element covered by the molding portion and a plurality of conductive pads formed on the second surface; And a flexible printed circuit board (FPCB) having a surface facing the second surface, wherein the flexible printed circuit board includes a plurality of conductive patterns, and is electrically connected between the conductive pads and the conductive patterns.
  • FPCB flexible printed circuit board
  • the time required to manufacture the fingerprint sensor module can be shortened.
  • FIG. 6 is a diagram illustrating conductive patterns and conductive pads, in accordance with various embodiments disclosed herein.
  • FIG. 10 is a diagram illustrating a process of separating a sensor array into individual biosensor modules according to various embodiments of the present disclosure.
  • the electronic device 101 may include a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197. ) May be included.
  • a sensor module 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197.
  • the components for example, the display device 160 or the camera module 180
  • the sensor module 176 may be implemented embedded in the display device 160 (eg, display).
  • the power management module 188 may manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented, for example, as at least part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • peripheral devices eg, a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the one or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as it is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, or client-server computing technology may be used.
  • an electronic device 200 may include a first side (or front side) 210A, a second side (or rear side) 210B, and a first side 210A. And a side surface 210C surrounding a space between the second surface 210B.
  • the housing may refer to a structure that forms some of the first side 210A, the second side 210B, and the side surfaces 210C of FIG. 2A.
  • the first face 210A may be formed by a first plate 202 or front plate (eg, a glass plate comprising various coating layers, or a polymer plate) that is at least partially substantially transparent. have.
  • the second face 210B may be formed by a second opaque plate 211, or a back plate that is substantially opaque.
  • the second plate 211 may be, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be formed.
  • the side 210C may be formed by a side member (or “side bezel structure”) 218 that is coupled to the first plate 202 and the second plate 211 and comprises a metal and / or polymer. have.
  • second plate 211 and side member 218 may be integrally formed and include the same material (eg, a metal material such as aluminum).
  • an audio module 214 and a sensor are formed in a portion of the screen display area of the display 201 and are aligned with the recess or opening. It may include at least one of the module 204, the camera module 205, and the light emitting device 206. In another embodiment (not shown), an audio module 214, a sensor module 204, a camera module 205, a fingerprint sensor 216, and a light emitting element 206 are located behind the screen display area of the display 201. It may include at least one of).
  • the electronic device 200 may include a home key as a key input device not shown in the drawing, and the home key and the biometric sensor 310 may be integrated.
  • the home key may be mechanically actuated or electronically actuated.
  • the biometric sensor 310 integrated with a key input device (eg, a home key) may be formed to be mounted to the opening 221 as shown in FIG. 2.
  • FIG. 3 is a front perspective view of a biometric sensor module 300 (eg, 300 of FIGS. 2A and 2B) in accordance with various embodiments disclosed herein.
  • the first surface 311 may be an opening (eg 2B, the second surface 312 may be opposite the opening (eg 221 'of FIG. 2B), ie the first plate (eg 202 of FIG. 2A).
  • Can head eg 203 of the second plate (eg 211 in FIG. 2B)
  • the first surface 311 may be an opening (eg 2B
  • the second surface 312 may be opposite the opening (eg 221 'of FIG. 2B), ie the first plate (eg 202 of FIG. 2A).
  • the plurality of conductive pads 320 may be made of a conductive material, for example, at least one of aluminum alloy, magnesium alloy, zinc alloy, copper alloy, titanium alloy, stainless steel, or amorphous metal and a combination of at least two or more thereof. This may also be the case.
  • the planar portion 351 may include a periphery extending along the periphery of the biometric sensor 310 when viewed from the top surface of the second surface 312. May be side surfaces (eg, the third surface 351c, the fourth surface 351d, the fifth surface 351e, and the sixth surface 351f) that form the circumference of the plane portion 351.
  • conductive patterns 355 may be provided on at least one of the lateral sides of the planar portion 351. Referring to FIG. 6, a plurality of conductive patterns 355 may be provided on any one side of the side surfaces forming the circumference of the planar portion 351, for example, the fourth surface 351d. However, this is only an example, and conductive patterns 355 may be formed on a side other than the fourth side 351d, and conductive on two or more side surfaces including the fourth side 351d. Patterns 355 may be formed. According to various embodiments, the conductive patterns 355 may be formed at uniform intervals along the circumference of the planar portion 351. In addition, according to one embodiment, a plurality of conductive patterns 355 may be formed corresponding to the position where the conductive pads 320 are formed.
  • solder jetting using the nozzle 403 is performed.
  • the flexible printed circuit board 350 and the biometric sensor 310 may be bonded by using a solder jetting process.
  • the flexible printed circuit board 350 may include polyimide (PI) as a base 350a, and may be formed of an electrically conductive material (eg, a copper alloy) on the outside of the base. Copper alloy), 350b).
  • PI polyimide
  • an electrically conductive material eg, a copper alloy
  • the planar portion 351 includes a circumference extending along the circumference of the biometric sensor 310 when viewed from the top surface of the second surface 312, and the solder bumps 360 may include the perimeter. Side by side along the circumference of the plane portion 351.
  • the flexible printed circuit board (FPCB) 350 may include a black cover layer on at least one surface thereof.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

Selon divers modes de réalisation, l'invention concerne un dispositif électronique comprenant : un boîtier comprenant une première plaque, une seconde plaque faisant face dans une direction opposée à la première plaque, et un élément latéral entourant l'espace entre la première plaque et la seconde plaque ; et un capteur biométrique agencé dans l'espace et exposé à travers une ouverture formée dans la première plaque ou la seconde plaque. Le capteur biométrique comprend : une carte de circuit imprimé (PCB) principale comprenant une première surface faisant face à l'extérieur du boîtier, une seconde surface faisant face dans une direction opposée à la première surface, et de multiples pastilles conductrices formées sur la seconde surface, la carte de circuit imprimé principale étant agencée dans l'espace et comprenant au moins un processeur ; et une carte de circuit imprimé souple (FPCB) agencée dans l'espace et connectée électriquement au processeur et au capteur biométrique. La carte de circuit imprimé souple comprend de multiples motifs conducteurs, et comprend de multiples perles de soudure électriquement connectées entre les pastilles conductrices et les motifs conducteurs. Chaque perle de soudure comprend une surface fixée à chaque pastille conductrice, et chaque pastille conductrice comporte une extrémité incorporée dans chaque perle de soudure.
PCT/KR2019/001954 2018-02-22 2019-02-19 Dispositif électronique comprenant un module de capteur biométrique et son procédé de fabrication Ceased WO2019164209A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0021368 2018-02-22
KR1020180021368A KR20190101256A (ko) 2018-02-22 2018-02-22 생체 센서 모듈을 포함하는 전자 장치 및 이의 제조 방법

Publications (1)

Publication Number Publication Date
WO2019164209A1 true WO2019164209A1 (fr) 2019-08-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2019/001954 Ceased WO2019164209A1 (fr) 2018-02-22 2019-02-19 Dispositif électronique comprenant un module de capteur biométrique et son procédé de fabrication

Country Status (2)

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KR (1) KR20190101256A (fr)
WO (1) WO2019164209A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102860389B1 (ko) 2021-08-10 2025-09-16 삼성전자주식회사 동축 케이블을 포함하는 전자 장치
KR20240021413A (ko) 2022-08-10 2024-02-19 삼성전자주식회사 지문 센서 패키지 및 이를 포함하는 스마트 카드

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140287556A1 (en) * 2013-03-20 2014-09-25 Electronics And Telecommunications Research Institute Methods of forming bump and semiconductor device with the same
KR20150028580A (ko) * 2013-09-06 2015-03-16 삼성전자주식회사 지문인식장치를 포함하는 전자기기 및 그 제조방법
KR20170073040A (ko) * 2015-12-18 2017-06-28 (주)파트론 센서 어레이 패키지 및 그 제조 방법
KR20170087684A (ko) * 2016-01-21 2017-07-31 삼성전자주식회사 전자 장치의 키 모듈 및 그 제작방법
KR20170130675A (ko) * 2016-05-18 2017-11-29 삼성디스플레이 주식회사 표시장치, 표시장치 제조방법 및 전자기기 접착 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140287556A1 (en) * 2013-03-20 2014-09-25 Electronics And Telecommunications Research Institute Methods of forming bump and semiconductor device with the same
KR20150028580A (ko) * 2013-09-06 2015-03-16 삼성전자주식회사 지문인식장치를 포함하는 전자기기 및 그 제조방법
KR20170073040A (ko) * 2015-12-18 2017-06-28 (주)파트론 센서 어레이 패키지 및 그 제조 방법
KR20170087684A (ko) * 2016-01-21 2017-07-31 삼성전자주식회사 전자 장치의 키 모듈 및 그 제작방법
KR20170130675A (ko) * 2016-05-18 2017-11-29 삼성디스플레이 주식회사 표시장치, 표시장치 제조방법 및 전자기기 접착 방법

Also Published As

Publication number Publication date
KR20190101256A (ko) 2019-08-30

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