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WO2019163960A1 - Procédé de mesure à rayons x, dispositif à rayons x et procédé de fabrication de structure - Google Patents

Procédé de mesure à rayons x, dispositif à rayons x et procédé de fabrication de structure Download PDF

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Publication number
WO2019163960A1
WO2019163960A1 PCT/JP2019/006872 JP2019006872W WO2019163960A1 WO 2019163960 A1 WO2019163960 A1 WO 2019163960A1 JP 2019006872 W JP2019006872 W JP 2019006872W WO 2019163960 A1 WO2019163960 A1 WO 2019163960A1
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Prior art keywords
ray
measured
intensity distribution
detector
scattering
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English (en)
Japanese (ja)
Inventor
教仁 松永
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/041—Phase-contrast imaging, e.g. using grating interferometers

Definitions

  • the present invention relates to an X-ray measurement method, an X-ray apparatus, and a structure manufacturing method.
  • the X-ray measurement method includes an irradiation step of irradiating the object to be measured with X-rays emitted from the X-ray source, and an X-ray intensity distribution of the X-rays transmitted through the object to be measured. And a detection step of acquiring the X-ray scattering intensity based on the X-ray intensity distribution detected in each of at least three different measurement conditions.
  • the X-ray measurement method includes an irradiation stage for irradiating the object to be measured with X-rays emitted from the X-ray source, and an X-ray intensity distribution of the X-rays transmitted through the object to be measured.
  • the X-ray apparatus includes: an X-ray source that emits X-rays; and a detector that detects an X-ray intensity distribution emitted from the X-ray source and transmitted through the object to be measured And an acquisition unit that acquires the scattered intensity of the X-ray based on the X-ray intensity distribution detected under each of at least three different measurement conditions.
  • the X-ray apparatus is detected with an X-ray source that emits X-rays, a detector that detects an X-ray intensity distribution emitted from the X-ray source and transmitted through the object to be measured. And an acquisition unit that acquires the X-ray scattering intensity using an intensity transport equation including a function representing the X-ray scattering in the object to be measured based on the X-ray intensity distribution.
  • the structure manufacturing method creates design information related to the shape of the structure, creates the structure based on the design information, and sets the shape of the created structure to Shape information is obtained by measurement using the X-ray apparatus of the third or fourth aspect, and the obtained shape information is compared with the design information.
  • the X-ray apparatus irradiates the object to be measured with X-rays and detects the X-ray transmitted through the object to be measured, thereby destroying the object to be measured such as internal information (for example, internal structure) of the object to be measured. Get without.
  • An X-ray apparatus can be used for biochemistry, medical treatment, etc., using a living body as an object to be measured, for example.
  • FIG. 1 is a diagram showing an example of the configuration of an X-ray apparatus 100 according to the present embodiment.
  • the X-ray apparatus 100 includes a housing 1, an X-ray source 2, a placement unit 3, a detector 4, and a control device 5.
  • An X-ray source 2, a placement unit 3, and a detector 4 are accommodated in the housing 1.
  • the housing 1 includes an X-ray shielding material so that X-rays do not leak outside the housing 1. Note that lead is included as an X-ray shielding material.
  • the X-ray source 2 emits X-rays in the positive direction of the Z axis along the optical axis Zr parallel to the Z axis with the emission point P shown in FIG.
  • This emission point P coincides with the focal position of an electron beam propagating through the inside of an X-ray source 2 described later.
  • the optical axis Zr is an axis that connects the emission point P, which is the focal position of the electron beam of the X-ray source 2, and the center of the imaging region of the detector 4 described later.
  • the X-rays radiated from the X-ray source 2 are any of X-rays that expand in a conical shape (so-called cone beams), fan-shaped X-rays (so-called fan beams), and linear X-rays (so-called pencil beams). But you can. When using a fan beam and a pencil beam, in order to inspect the entire object to be measured S, it is necessary to perform a scanning operation for relatively moving the beam and the object to be measured S.
  • the X-ray source 2 emits at least one of, for example, an ultra soft X-ray of about 50 eV, a soft X-ray of about 0.1 to 2 keV, an X-ray of about 2 to 20 keV, and a hard X-ray of about 20 to several MeV. .
  • the mounting unit 3 includes a mounting table 31 on which the object to be measured S is mounted, and a manipulator unit 35 including an X-axis moving unit 32, a Y-axis moving unit 33, and a Z-axis moving unit 34, and the X-ray source 2. Rather than the Z axis + side.
  • the X-axis moving unit 32, the Y-axis moving unit 33, and the Z-axis moving unit 34 are controlled by the control device 5 to move the mounting table 31 in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.
  • the Z-axis moving unit 34 is controlled by the control device 5 so that the distance from the X-ray source 2 to the measured object S is a distance corresponding to the magnification of the measured object S in the captured image.
  • the stage 31 is moved in the Z-axis direction.
  • the detector 4 includes a scintillator unit containing a known scintillation substance, a photomultiplier tube, a light receiving unit such as a CCD, and the like, and the object to be measured S emitted from the X-ray source 2 and mounted on the mounting table 31. X-rays including transmitted X-rays that have passed through are received. The detector 4 converts the received X-ray energy into light energy, then converts the light energy into electric energy, and outputs it as an electric signal. The detector 4 may convert the incident X-ray energy into an electric signal without converting it into light energy, and output it.
  • the detector 4 has a plurality of pixels, and these pixels are two-dimensionally arranged.
  • the two-dimensional intensity distribution data of the X-rays radiated from the X-ray source 2 and passed through the measurement object S can be acquired collectively. Accordingly, it is possible to obtain the entire projected image of the object S to be measured by one shooting.
  • the control device 5 includes a microprocessor, peripheral circuits, and the like.
  • the control device 5 reads and executes a control program stored in advance in a storage medium (not shown) (for example, a flash memory), thereby executing the control of the X-ray device 100.
  • the control device 5 includes an X-ray control unit 51 that controls the operation of the X-ray source 2, a mounting table control unit 52 that controls the driving operation of the manipulator unit 35, and an object to be measured based on the electrical signal output from the detector 4. It has the acquisition part 54 which acquires the X-ray intensity distribution data which permeate
  • the acquisition unit 54 acquires an absorption image, a phase image, and a scattered image of the measurement object based on the intensity distribution obtained by irradiating the measurement object S at at least three different positions in different Z-axis directions.
  • the absorption image is an amount (attenuation coefficient) that causes a change in X-ray intensity caused by absorption of X-rays by the measurement object S when it passes through the measurement object S, that is, X-ray absorption in the measurement object S. ⁇ ) is imaged.
  • the phase image is a change in X-ray intensity caused by a change in the X-ray phase when X-rays pass through the DUT S, that is, an amount that causes X-ray refraction in the DUT (phase change amount).
  • the scattered image is a change (a mutual coherence function) that causes a change in X-ray intensity caused by scattering by the measurement object S when X-rays pass through the measurement object S, that is, X-ray scattering by the measurement object S.
  • ⁇ is imaged.
  • a part of the light emitted from the X-ray source 2 and irradiating the object to be measured S is refracted or scattered around the object to be measured S or the boundary of the internal structure.
  • X-rays that have passed through the measurement object S and entered the detector 4 include the effects of refraction and scattering described above. That is, the X-ray including the influence due to refraction and scattering includes information on the fine structure of the object S to be measured.
  • the X-rays incident on the detector 4 are blurred.
  • the X-ray apparatus 100 according to the present embodiment performs processing for generating a scattered image (dark field image) of X-rays scattered by the measurement object S based on the degree of scattering (blur).
  • the X-ray apparatus 100 irradiates the measurement object S with X-rays under each of three different measurement conditions, and acquires X-ray intensity distribution data with the detector 4.
  • X-ray intensity distribution data may be acquired by irradiating X-rays under measurement conditions exceeding 3.
  • the X-ray apparatus 100 varies the positional relationship among the X-ray source 2, the object S to be measured, and the detector 4 as measurement conditions, and irradiates the X-rays for each positional relationship.
  • X-ray intensity distribution data is acquired.
  • the degree of scattering included in the X-ray intensity distribution in the detector 4 varies depending on the difference in detection distance, which is the distance between the object to be measured S and the detector 4. That is, in the intensity distribution acquired at each of three positions (irradiation positions) having different detection distances in the Z direction from the object to be measured S to the detector 4, the degree of scattering differs depending on the detection distance. As the distance increases, the scattering increases (that is, the degree of blur in the detector 4 increases).
  • the object to be measured S may be moved in the Z direction, the detector 4 may be moved in the Z direction, or both the object to be measured S and the detector 4 may be moved. May be moved in the Z direction.
  • the X-ray source 2 may be moved together.
  • the positional relationship is made different by making the distance between the measured object S and the X-ray source 2 different. It may be allowed.
  • the measurement object S may be moved in the Z direction
  • the X-ray source 2 may be moved in the Z direction
  • the measurement object S and the X-ray source 2 may be moved in the Z direction.
  • the detector 4 may be moved together.
  • the X-ray apparatus 100 is not limited to what makes a positional relationship differ as measurement conditions.
  • the X-ray apparatus 100 may vary conditions regarding the output of the X-ray source 2 that emits X-rays as measurement conditions.
  • the X-ray control unit 51 may vary the acceleration voltage of the electron beam propagating inside the X-ray source 2, the power of the X-ray source 2, and the spot diameter of the electron beam at the emission point P. it can.
  • the X-ray apparatus 100 can set at least three conditions regarding the output of the X-ray source 2 and can acquire X-ray intensity distribution data under each condition.
  • the first irradiation position, the second irradiation position, and the third irradiation position are referred to in order from the irradiation position with a relatively small detection distance to the detection distance with a relatively large distance.
  • the positional relationship and interval between the first irradiation position, the second irradiation position, and the third irradiation position may be constant values regardless of the measurement object S, or may be different values based on the material and size of the measurement object S. Good.
  • the X-ray intensity distribution data at the first irradiation position, the second irradiation position, and the third irradiation position are referred to as first intensity distribution data, second intensity distribution data, and third intensity distribution data, respectively.
  • the degree of blur (scattering) included in the second intensity distribution data is greater than the degree of blur (scattering) included in the first intensity distribution data, and the degree of blur (scattering) included in the third intensity distribution data is the second.
  • the acquisition unit 54 acquires a scattered image in addition to the X-ray absorption image and the phase image based on the first intensity distribution data, the second intensity distribution data, and the third intensity distribution data.
  • the acquisition unit 54 acquires a scattered image using the following equation (1) as an example.
  • M is the projection magnification (geometric magnification) of the object S to be measured
  • I img is the intensity distribution on the detection surface
  • I obj is the intensity distribution on the object surface
  • ⁇ is the mutual coherence including the influence of scattering on the object S to be measured.
  • the function, ⁇ is the amount of phase modulation in the device under test S
  • z is the detection distance in the Z direction from the detector 4 to the device under test S.
  • ( ⁇ , ⁇ ) are coordinates on the surface of the object to be measured.
  • Equation (1) is a geometrical representation of the complex amplitude U img (x, y, z) (where x and y are the coordinates of the detection surface) of the X-ray beam on the incident surface of the detector 4 using the stationary phase method.
  • ⁇ in the equation (2) is a complex amplitude representing the influence of scattering on the device under test S
  • U obj is a complex amplitude of the X-ray beam on the surface of the device under test.
  • ( ⁇ 0, ⁇ 0) is a stationary point of the stationary phase method on the surface of the object to be measured.
  • a, b, and c are terms including the second-order derivative of the phase modulation amount ⁇ in the measured object S, ⁇ represents the wavelength of the incident X-ray, and S is the distance from the measured object surface to the detection surface. Represents the determined geometric path length. i is an imaginary unit.
  • the symbol ⁇ > represents the average processing of the functions in ⁇ >, and the average is taken because the phase in the complex amplitude ⁇ fluctuates spatially due to the influence of the scattering medium in the device under test S.
  • the fine structure of the object to be measured S that cannot be seen in the absorption image or the phase image is obtained by averaging the phase fluctuations included in the function ⁇ that are finer than the spatial resolution determined by the X-ray spot diameter and the pixel size.
  • the symbol * represents the complex conjugate of the complex amplitude.
  • the acquisition unit 54 acquires the X-ray absorption image, phase image, and scattering image by using the first, second, and third intensity distribution data in Expression (1).
  • the acquisition unit 54 obtains an absorption image, a phase image, and a scattering image after transforming the equation (1) into a Poisson equation.
  • F i F ( ⁇ , ⁇ , z i ).
  • i is an integer from 1 to 3
  • F 1 is the first intensity distribution detected by the detector 4 at the first irradiation position
  • F 2 is the second intensity detected by the detector 4 at the second irradiation position.
  • intensity distribution, F 3 is the third intensity distribution detected by the detector 4 in a third irradiation position.
  • ⁇ representing a phase image is expressed by the following equation (5) using the above initial condition and the auxiliary function G defined by the following equation (4). Further, ⁇ indicating a scattered image is expressed by the following equation (7) using the above initial condition and the auxiliary function H defined by the following equation (6).
  • the obtaining unit 54 calculates ⁇ and ⁇ by applying boundary conditions to the above equations (4) to (7) as appropriate, and repeatedly performing operations until the values converge.
  • the boundary condition may be determined by, for example, the size of the object S to be measured, or may be such that ⁇ and ⁇ are zero in the region of the object S to be measured.
  • the acquisition unit 54 acquires the calculated ⁇ as a phase image and acquires the calculated ⁇ as a scattered image.
  • the image generation unit 53 generates a display image that can be displayed on, for example, a display monitor (not shown) from the scattered image acquired by the acquisition unit 54.
  • step S1 the mounting table control unit 52 controls the manipulator unit 35 to move the mounting table 31, sets the position of the measurement object S to the first irradiation position, and the X-ray control unit 51 receives the X-rays.
  • the light is emitted toward the measurement object S, the detection signal based on the first intensity distribution is output from the detector 4, and the process proceeds to step S2.
  • step S2 the mounting table control unit 52 controls the manipulator unit 35 to move the mounting table 31, sets the position of the measurement object S to the second irradiation position, and the X-ray control unit 51 measures the X-rays.
  • the light is emitted toward the object S, the detection signal based on the second intensity distribution is output from the detector 4, and the process proceeds to step S3.
  • step S3 the mounting table control unit 52 controls the manipulator unit 35 to move the mounting table 31, sets the position of the measurement object S to the third irradiation position, and the X-ray control unit 51 measures the X-rays.
  • the light is emitted toward the object S, a detection signal based on the third intensity distribution is output from the detector 4, and the process proceeds to step S4.
  • steps S1 to S3 are not limited to the processes performed in this order, and the processes may be performed in any order. That is, it is only necessary to obtain detection signals from the detector 4 at three irradiation positions, and the order in which Steps S1 to S3 are performed is not limited.
  • step S4 the acquisition unit 54 uses the respective detection signals based on the first, second, and third intensity distributions to obtain each of the absorption ⁇ , phase ⁇ , and scattering ⁇ from the above equations (3) to (7).
  • the distribution is calculated and the process proceeds to step S5. That is, in step S4, absorption ⁇ , phase ⁇ , and scattering ⁇ (X-ray scattering intensity) are acquired based on the intensity transport equation.
  • step S5 based on the distributions of absorption ⁇ , phase ⁇ , and scattering ⁇ calculated in step S4, image signals of the absorption image, phase image, and scattering image are generated and output, respectively, and the process ends.
  • the structure manufacturing system of the present embodiment creates a molded product such as an electronic component including, for example, an automobile door portion, an engine portion, a gear portion, and a circuit board.
  • FIG. 3 is a block diagram showing an example of the configuration of the structure manufacturing system 400 according to the present embodiment.
  • the structure manufacturing system 400 includes the X-ray apparatus 100, the design apparatus 410, the molding apparatus 420, the control system 430, and the repair apparatus 440 described in the first embodiment.
  • the design device 410 is a device used by a user when creating design information related to the shape of a structure, and performs a design process for creating and storing design information.
  • the design information is information indicating the coordinates of each position of the structure.
  • the design information is output to the molding apparatus 420 and a control system 430 described later.
  • the molding apparatus 420 performs a molding process for creating and molding a structure using the design information created by the design apparatus 410.
  • the molding apparatus 420 includes an apparatus that performs at least one of laminating, casting, forging, and cutting represented by 3D printer technology.
  • the X-ray apparatus 100 performs a measurement process for measuring the shape of the structure molded by the molding apparatus 420.
  • the X-ray apparatus 100 outputs information (hereinafter referred to as shape information) indicating the coordinates of the structure, which is a measurement result of the structure, to the control system 430.
  • the control system 430 includes a coordinate storage unit 431 and an inspection unit 432.
  • the coordinate storage unit 431 stores design information created by the design apparatus 410 described above.
  • the inspection unit 432 determines whether the structure molded by the molding device 420 is molded according to the design information created by the design device 410. In other words, the inspection unit 432 determines whether or not the molded structure is a good product. In this case, the inspection unit 432 reads the design information stored in the coordinate storage unit 431 and performs an inspection process for comparing the design information with the shape information input from the X-ray apparatus 100. The inspection unit 432 compares, for example, the coordinates indicated by the design information with the coordinates indicated by the corresponding shape information as the inspection processing, and if the coordinates of the design information and the coordinates of the shape information match as a result of the inspection processing. It is determined that the product is a non-defective product molded according to the design information.
  • the inspection unit 432 determines whether or not the coordinate difference is within a predetermined range, and if it is within the predetermined range, it can be restored. Judged as a defective product.
  • the inspection unit 432 outputs repair information indicating the defective portion and the repair amount to the repair device 440.
  • the defective part is a part having the coordinates of the shape information that does not match the coordinates of the design information, and the repair amount is the difference between the coordinates of the design information and the coordinates of the shape information in the defective part.
  • the repair device 440 performs a repair process for reworking a defective portion of the structure based on the input repair information. The repair device 440 performs again the same process as the molding process performed by the molding apparatus 420 in the repair process.
  • step S31 the design device 410 is used when the structure is designed by the user.
  • the design apparatus 410 creates and stores design information related to the shape of the structure by the design process, and the process proceeds to step S32.
  • the present invention is not limited to only the design information created by the design apparatus 410, and when design information already exists, the design information is acquired by inputting the design information and is included in one aspect of the present invention. It is.
  • step S32 the forming apparatus 420 creates and forms a structure based on the design information by the forming process, and proceeds to step S33.
  • step S33 the X-ray apparatus 100 performs measurement processing, measures the shape of the structure, outputs shape information, and proceeds to step S34.
  • step S34 the inspection unit 432 performs an inspection process for comparing the design information created by the design apparatus 410 with the shape information measured and output by the X-ray apparatus 100, and the process proceeds to step S35.
  • step S35 based on the result of the inspection process, the inspection unit 432 determines whether or not the structure formed by the forming apparatus 420 is a non-defective product. If the structure is a non-defective product, that is, if the difference between the coordinates of the design information and the coordinates of the shape information is within a predetermined range, an affirmative determination is made in step S35 and the process ends.
  • step S35 If the structure is not a non-defective product, that is, if the coordinates of the design information do not match the coordinates of the shape information, or if coordinates that are not in the design information are detected, a negative determination is made in step S35 and the process proceeds to step S36.
  • step S36 the inspection unit 432 determines whether or not the defective portion of the structure can be repaired. If the defective part is not repairable, that is, if the difference between the coordinates of the design information and the shape information in the defective part exceeds the predetermined range, a negative determination is made in step S36 and the process ends. If the defective part can be repaired, that is, if the difference between the coordinates of the design information and the shape information in the defective part is within a predetermined range, an affirmative determination is made in step S36 and the process proceeds to step S37. In this case, the inspection unit 432 outputs repair information to the repair device 440. In step S37, the repair device 440 performs a repair process on the structure based on the input repair information, and returns to step S33. As described above, the repair device 440 performs again the same processing as the molding processing performed by the molding device 420 in the repair processing.
  • the acquisition unit 54 acquires a scattered image based on the X-ray intensity distribution data detected by the detector 4 under each of at least three different measurement conditions.
  • the well-known Talbot interferometry and Hard X-ray dark-field imaging with incoherent sample disclosed in Hard-X-ray dark-field imaging using a grating interferometer (2008 Nature Publishing Group, p.134-p.137)
  • the well-known coded aperture method disclosed in illumination APPLIED PHYSICS LETTERS 104, 024106 (2014)
  • the scattered image can be acquired without providing a diffraction grating or the like in the X-ray apparatus 100, so that the apparatus configuration becomes complicated. Can be prevented. In addition, since a diffraction grating or the like is not required, an increase in cost can be suppressed.
  • the mounting table control unit 52 changes the detection distance from the object to be measured S to the detector 4, sets the irradiation position where the object to be measured S is irradiated by X-rays, and the acquisition unit 54 has at least 3 A scattered image is acquired based on the X-ray intensity distribution data detected by the detector 4 for each of the two different irradiation positions. Thereby, since a scattered image can be acquired without providing a diffraction grating or the like, the apparatus configuration can be prevented from becoming complicated, and an increase in cost can also be suppressed.
  • the acquisition unit 54 acquires a scattered image based on the mutual coherence function of the X-ray intensity distribution data detected for each of the first irradiation position, the second irradiation position, and the third irradiation position. Thereby, a scattered image can be generated without using a diffraction grating or the like.
  • the mounting table controller 52 sets the detection distance so that the X-ray intensity distribution data detected at the first irradiation position does not substantially include scattering by the measurement object S. As a result, it becomes easier to obtain the scattered ⁇ from the X-ray intensity distribution data detected at the second and third irradiation positions, and a scattered image can be generated.
  • the X-ray apparatus 100 of the structure manufacturing system 400 performs a measurement process for acquiring shape information of the structure created by the molding apparatus 420 based on the design process of the design apparatus 410, and performs an inspection unit of the control system 430.
  • Reference numeral 432 performs an inspection process for comparing the shape information acquired in the measurement process with the design information created in the design process. Therefore, it is possible to determine whether or not a structure is a non-defective product created according to design information by inspecting the defect of the structure and information inside the structure by nondestructive inspection. Contribute to.
  • the repair device 440 performs the repair process for performing the molding process again on the structure based on the comparison result of the inspection process. Therefore, when the defective portion of the structure can be repaired, the same processing as the molding process can be performed again on the structure, which contributes to the manufacture of a high-quality structure close to design information.
  • control device 5 has been described as including the image generation unit 53, but the control device 5 may not include the image generation unit 53.
  • the image generation unit 53 is provided in a processing device or the like separate from the X-ray apparatus 100, acquires the scattered image acquired by the acquisition unit 54 via, for example, a network or a storage medium, and displays an image for display. May be generated.
  • the mounting table 31 on which the object S to be measured is placed by the X-axis moving unit 32, the Y-axis moving unit 33, and the Z-axis moving unit 34. It is not limited to what is moved in the axial direction.
  • the mounting table 31 does not move in the X-axis, Y-axis, and Z-axis directions, and the X-ray source 2 and the detector 4 are moved in the X-axis, Y-axis, and Z-axis directions, so that
  • the X-ray apparatus 100 may have a configuration in which the radiation source 2 and the detector 4 are relatively moved.
  • the present invention is not limited to the above-described embodiments, and other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention. .

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Abstract

L'invention concerne un procédé de mesure à rayons X comprenant : l'irradiation d'un objet mesuré avec des rayons X émis par une source de rayons X ; la détection par un détecteur d'une distribution d'intensité de rayons X de rayons X émis à travers l'objet mesuré ; et l'acquisition d'une intensité de diffusion de rayons X en fonction des distributions d'intensité de rayons X détectées dans chaque condition d'au moins trois conditions de mesure différentes.
PCT/JP2019/006872 2018-02-22 2019-02-22 Procédé de mesure à rayons x, dispositif à rayons x et procédé de fabrication de structure Ceased WO2019163960A1 (fr)

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JP2018-029826 2018-02-22
JP2018029826A JP2021067456A (ja) 2018-02-22 2018-02-22 Ｘ線画像生成方法、ｘ線装置および構造物の製造方法

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