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WO2019160058A1 - Procédé de formation de moule, et moule - Google Patents

Procédé de formation de moule, et moule Download PDF

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Publication number
WO2019160058A1
WO2019160058A1 PCT/JP2019/005420 JP2019005420W WO2019160058A1 WO 2019160058 A1 WO2019160058 A1 WO 2019160058A1 JP 2019005420 W JP2019005420 W JP 2019005420W WO 2019160058 A1 WO2019160058 A1 WO 2019160058A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
adhesive layer
unit
base material
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/005420
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English (en)
Japanese (ja)
Inventor
田邊大二
田中覚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Scivax Corp
Original Assignee
Scivax Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Scivax Corp filed Critical Scivax Corp
Publication of WO2019160058A1 publication Critical patent/WO2019160058A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • H10P76/00—

Definitions

  • the present invention relates to a mold forming method and a mold.
  • An optical member having a fine concavo-convex structure on its surface is used for the purpose of controlling optical properties, such as a lens for condensing, a moth eye for preventing reflection, and a wire grid for adjusting polarization.
  • a method for forming this fine concavo-convex structure a mold (mold) having an inverted structure of the concavo-convex structure is formed on the surface, the mold is pressed against the object, and heat or light is used. Attention has been focused on nanoimprints that transfer the pattern onto the surface of the molding. (For example, refer to Patent Document 1).
  • a master mold is first created by laser processing, and then a mold is produced by imprinting directly from the master mold onto a resin. Moreover, the mold is produced by electroforming from the master mold, and imprinted on the resin from the electroformed mold to produce the mold.
  • an object of the present invention is to provide a mold forming method capable of accurately manufacturing a large-area mold at low cost and a mold manufactured using the method.
  • the mold forming method of the present invention includes an adhesive layer forming step of forming an adhesive layer on the surface of a base material or the back surface of a unit mold on which a predetermined pattern is formed, It has an arrangement process of arranging a plurality of unit molds via an adhesive layer, and a fixing process of fixing the unit mold to the adhesive layer by curing the adhesive layer.
  • the adhesive layer forming step forms an adhesive layer made of a photocurable resin on the substrate, and the fixing step is performed by irradiating the adhesive layer with light to cure the adhesive layer. What is necessary is just to fix the unit mold to the layer.
  • the unit mold and the base material are made of the same photocurable resin as the adhesive layer.
  • the base material, the adhesive layer, and the unit mold need to be transparent to ultraviolet rays having a predetermined wavelength used for the optical imprint.
  • Another mold forming method of the present invention is characterized in that a mold formed by the above-described mold forming method is used to transfer a pattern of the mold to a resin to form a new mold.
  • the mold of the present invention comprises a base material, a plurality of unit molds on which a predetermined pattern is formed, and an adhesive layer that is formed on the base material and fixes the unit mold.
  • the adhesive layer may be made of a photocurable resin.
  • the unit mold and the base material are made of the same photocurable resin as the adhesive layer.
  • the base material, the adhesive layer, and the unit mold need to be transparent to ultraviolet rays having a predetermined wavelength used for the optical imprint.
  • the mold forming method of the present invention and the mold produced by the method are produced by arranging a plurality of unit molds produced from a small-area master mold, and thus can be produced with high precision and large area and at low cost.
  • the mold forming method of the present invention mainly includes an adhesive layer forming step, an arranging step, and a fixing step.
  • the adhesive layer forming step is a step of forming the adhesive layer 3 on the front surface 11 of the substrate 1 or the back surface 22 of the unit mold 2.
  • the adhesive layer 3 is formed on the entire surface 11 of the substrate 1.
  • the adhesive layer 3 may be formed by rotating the substrate 1 using a coater or the like and coating the entire surface 11 of the substrate 1.
  • the adhesive layer 3 may be formed only on a portion of the surface 11 of the substrate 1 where the unit mold 2 is disposed as shown in FIG. 2, or the back surface 22 of the unit mold 2 as shown in FIG. You may form in.
  • the base material 1 functions as a base for supporting the unit mold 2. Therefore, the surface of the substrate 1 has an area enough to dispose a plurality of unit molds.
  • the material of the base material 1 is selected to be transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting. Such materials include transparent resins such as COP and transparent inorganic materials such as glass.
  • the material of the substrate 1 is better to be the same type of resin as that of the adhesive layer 3 in that the optical properties of the substrate 1 and the adhesive layer 3 can be made the same or approximate, and more preferably the same resin. Better to do.
  • a material having heat resistance with respect to the temperature used for thermal imprinting is selected.
  • a material having heat resistance with respect to the temperature used for thermal imprinting include a resin such as COP having a glass transition point and a melting point higher than the temperature used, an inorganic material such as glass and silicon, and a metal such as nickel.
  • the unit mold 2 is formed with a predetermined pattern having a fine concavo-convex structure.
  • This fine concavo-convex structure is for imparting a desired function to the target product.
  • a lens shape, a structure that suppresses reflection like a moth eye, a structure that polarizes light like a wire grid, Or the structure for forming these corresponds.
  • the pattern having the fine concavo-convex structure may be formed in any way, but can be formed by, for example, an imprint method. Specifically, first, a master mold is manufactured by laser processing. Next, the unit mold 2 may be produced by directly imprinting the resin from the master mold. Alternatively, a mold may be manufactured by electroforming from a master mold and imprinted on the resin from the electroformed mold.
  • the unit mold 2 when using the produced mold for optical imprinting, can use the same photocurable resin as the adhesive layer 3, and the unit mold 2 and the adhesive layer 3 can have the same optical characteristics. This is preferable.
  • Another method for forming a pattern having a fine concavo-convex structure is to transfer a pattern to a resist formed on the surface of an inorganic material or metal using a master mold or an electroformed mold, and then etch the pattern. May be.
  • the size of the pattern of the unit mold 2 is arbitrary and may be determined in view of cost, throughput, pattern accuracy, and the like. For example, a thing of about several m square can be used. Since the said pattern may be smaller than the pattern area of the mold formed, the pattern of the master mold required for the manufacture can also be made small. Therefore, the master mold can be manufactured at a low cost and in a short time.
  • the shape of the unit mold 2 is preferably a shape in which there is no gap between the patterns of the unit mold 2 when the unit molds 2 are arranged side by side.
  • the pattern of the unit mold 2 may be a rectangle, and the unit mold 2 may be a rectangle as large as the pattern as much as possible.
  • a material transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected.
  • materials include transparent resins such as COP and transparent inorganic materials such as glass.
  • a material having heat resistance with respect to the temperature used for thermal imprinting is selected. Examples of such a material include a resin such as COP having a glass transition point and a melting point higher than the temperature used, an inorganic material such as glass and silicon, and a metal such as nickel.
  • the adhesive layer 3 is for bonding the substrate 1 and the unit mold 2 together.
  • the material of the adhesive layer 3 may be any material as long as the base material 1 and the unit mold 2 can be adhered to each other.
  • a photocurable resin that is cured by irradiation with light can be used.
  • a material that is transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected. Examples of such a material include a transparent resin such as an acrylic adhesive.
  • the optical characteristics of the unit mold 2 or the base material 1 and the adhesive layer 3 can be made the same or approximated.
  • the adhesive layer 3 is preferably made of the same type of resin as that of the unit mold 2 or the substrate 1, and more preferably the same resin.
  • a material having heat resistance with respect to the temperature used for thermal imprinting is selected.
  • a resin having a glass transition point and a melting point higher than the temperature to be used there is a resin having a glass transition point and a melting point higher than the temperature to be used.
  • the placement step is a step of placing a plurality of unit molds 2 on the base material 1 via the adhesive layer 3.
  • the arrangement interval may be any, but a narrower one is preferable in order to make the patterns dense.
  • a known chip mounter 4 may be used for the arrangement of the unit mold 2.
  • the fixing step is a step of curing the adhesive layer 3 and fixing the unit mold 2 to the adhesive layer 3.
  • the adhesive layer 3 is cured by irradiating light 5, and the unit mold 2 is fixed to the surface 11 of the substrate 1.
  • the adhesive layer 3 is cured by leaving it for a predetermined time until it is sufficiently cured, and the unit mold 2 is fixed to the surface of the substrate 1. Thereby, a plurality of unit molds 2 can be fixed on the substrate 1.
  • the mold of the present invention thus formed is composed of a base material 1, a plurality of unit molds 2 arranged on the base material 1, and an adhesive layer 3 formed between the base material 1 and the unit mold 2. Mainly composed.
  • the base material 1 functions as a base for supporting the unit mold 2 as described above.
  • the substrate 1 is transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting.
  • the material of the base material 1 is preferably the same type of resin as that of the adhesive layer 3 and more preferably the same resin because the optical properties of the base material 1 and the adhesive layer 3 can be made the same or approximate. Is good.
  • the said base material 1 is heat resistant with respect to the temperature used by a thermal imprint.
  • the unit mold 2 is formed with a predetermined pattern having a fine concavo-convex structure as described above.
  • the size of the pattern of the unit mold 2 is arbitrary and may be determined in view of cost, throughput, pattern accuracy, and the like. For example, a thing about several mm square can be used. Since the said pattern may be smaller than the pattern area of the mold formed, the pattern of the master mold required for the manufacture can also be made small. Therefore, the master mold can be manufactured at a low cost and in a short time.
  • the shape and arrangement of the unit mold 2 is preferably a shape in which there is no gap between the patterns of the unit mold 2 when the unit molds 2 are arranged side by side.
  • the pattern of the unit mold 2 may be a rectangle, and the unit mold 2 may be a rectangle as large as the pattern as much as possible.
  • the material of the unit mold 2 when the formed mold is used for optical imprinting, a material transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected.
  • the material of the unit mold 2 is preferably made of the same resin as that of the adhesive layer 3 in that the optical characteristics of the substrate 1 and the unit mold 2 can be made the same.
  • a material having heat resistance with respect to the temperature used for thermal imprinting is selected.
  • the adhesive layer 3 is for bonding the substrate 1 and the unit mold 2 together.
  • the material of the adhesive layer 3 may be any material as long as the base material 1 and the unit mold 2 can be adhered to each other.
  • a photocurable resin that is cured by irradiation with light can be used.
  • the optical characteristics of the unit mold 2 or the base material 1 and the adhesive layer 3 can be made the same or approximated.
  • the adhesive layer 3 is preferably made of the same type of resin as that of the unit mold 2 or the substrate 1, and more preferably the same resin.
  • the formed mold When the formed mold is used for optical imprinting, a material that is transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected. In addition, when the formed mold is used for thermal imprinting, a material having heat resistance with respect to the temperature used for thermal imprinting is selected. As such a material, there is a resin having a glass transition point and a melting point higher than the temperature to be used.
  • another mold forming method of the present invention is to form a mold by transferring the pattern of the mold to a resin using the mold of the present invention described above.
  • optical imprinting or thermal imprinting may be used.
  • a large-area mold can be easily and accurately manufactured at a low price.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

L'objectif de la présente invention est de fournir un procédé de formation de moule et un moule préparé à l'aide du procédé, avec lesquels il est possible de préparer un moule à grande surface à un faible coût et avec une bonne précision. Le moule est formé avec : une étape de formation de couche adhésive dans laquelle une couche adhésive 3 est formée sur la surface 11 d'un matériau de base 1, ou sur la surface arrière d'un moule unitaire 2 sur lequel est formé un motif prescrit ; une étape de disposition dans laquelle une pluralité de moules unitaires 2 sont disposés sur le matériau de base 1 avec la couche adhésive 3 interposée entre ceux-ci ; et une étape de fixation dans laquelle la couche adhésive 3 est durcie et les moules unitaires 2 sont fixés à la couche adhésive 3.
PCT/JP2019/005420 2018-02-19 2019-02-14 Procédé de formation de moule, et moule Ceased WO2019160058A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018027081 2018-02-19
JP2018-027081 2018-02-19

Publications (1)

Publication Number Publication Date
WO2019160058A1 true WO2019160058A1 (fr) 2019-08-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/005420 Ceased WO2019160058A1 (fr) 2018-02-19 2019-02-14 Procédé de formation de moule, et moule

Country Status (2)

Country Link
TW (1) TW201936352A (fr)
WO (1) WO2019160058A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009078521A (ja) * 2007-09-27 2009-04-16 Hitachi Ltd ベルト状金型およびそれを用いたナノインプリント装置
WO2011049097A1 (fr) * 2009-10-21 2011-04-28 旭硝子株式会社 Moule pour empreinte, procédé de production du moule, dispositif pour empreinte et procédé de réalisation d'empreinte
JP2011176321A (ja) * 2000-07-17 2011-09-08 Board Of Regents The Univ Of Texas System 転写リソグラフィ・プロセスのための自動液体ディスペンス方法およびシステム
JP2012148481A (ja) * 2011-01-19 2012-08-09 Mitsubishi Rayon Co Ltd レプリカモールド、および微細凹凸構造を表面に有する成形体とその製造方法
JP2012253236A (ja) * 2011-06-03 2012-12-20 Sumitomo Electric Ind Ltd ナノインプリント用モールド
JP2012253303A (ja) * 2011-06-07 2012-12-20 Hitachi High-Technologies Corp 微細構造転写用スタンパ及びこれを搭載した微細構造転写装置
WO2013031460A1 (fr) * 2011-08-30 2013-03-07 綜研化学株式会社 Procédé de liaison de moule en résine et composition de moule continue de rouleau à rouleau utilisant celui-ci
JP2014162111A (ja) * 2013-02-26 2014-09-08 Hitachi Industrial Equipment Systems Co Ltd パターン転写用金型とこれを用いたパターン転写装置
JP2016072403A (ja) * 2014-09-30 2016-05-09 旭硝子株式会社 モールド製造用構造体の製造方法、モールドの製造方法、モールド製造用構造体、およびモールド

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011176321A (ja) * 2000-07-17 2011-09-08 Board Of Regents The Univ Of Texas System 転写リソグラフィ・プロセスのための自動液体ディスペンス方法およびシステム
JP2009078521A (ja) * 2007-09-27 2009-04-16 Hitachi Ltd ベルト状金型およびそれを用いたナノインプリント装置
WO2011049097A1 (fr) * 2009-10-21 2011-04-28 旭硝子株式会社 Moule pour empreinte, procédé de production du moule, dispositif pour empreinte et procédé de réalisation d'empreinte
JP2012148481A (ja) * 2011-01-19 2012-08-09 Mitsubishi Rayon Co Ltd レプリカモールド、および微細凹凸構造を表面に有する成形体とその製造方法
JP2012253236A (ja) * 2011-06-03 2012-12-20 Sumitomo Electric Ind Ltd ナノインプリント用モールド
JP2012253303A (ja) * 2011-06-07 2012-12-20 Hitachi High-Technologies Corp 微細構造転写用スタンパ及びこれを搭載した微細構造転写装置
WO2013031460A1 (fr) * 2011-08-30 2013-03-07 綜研化学株式会社 Procédé de liaison de moule en résine et composition de moule continue de rouleau à rouleau utilisant celui-ci
JP2014162111A (ja) * 2013-02-26 2014-09-08 Hitachi Industrial Equipment Systems Co Ltd パターン転写用金型とこれを用いたパターン転写装置
JP2016072403A (ja) * 2014-09-30 2016-05-09 旭硝子株式会社 モールド製造用構造体の製造方法、モールドの製造方法、モールド製造用構造体、およびモールド

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