WO2019151487A1 - Surface treatment device and surface treatment method - Google Patents

Abstract

The present invention relates to a surface treatment device and a surface treatment method. Electrodes (30) of a surface treatment device (10) comprise a first electrode (36) and a second electrode (38). The first electrode (36) is inserted from one opening (18) of a treatment hole (12) having a bent section (16). The second electrode (38) is inserted from another opening (22) of the treatment hole (12). The first electrode (36) and the second electrode (38) are integrated in an electrically isolated state as a result of a first leading end section (40) of the first electrode (36) and a second leading end section (46) of the second electrode (38) abutting inside the bent section (16) via an insulation member (52).

Description

Surface treatment apparatus and surface treatment method

The present invention relates to a surface treatment apparatus and a surface treatment method for performing a surface treatment on an inner wall surface of a treatment hole.

For example, as described in Japanese Patent Application Laid-Open No. 2013-159832, by passing an electrolytic treatment liquid through a processing hole in which a tubular electrode is inserted, current is passed between the electrode and the inner wall surface of the processing hole. The inner wall surface is subjected to surface treatment such as electroplating or anodic oxide film formation.

The present invention has been made in connection with this type of technology, and the main object of the present invention is to treat the inner surface of a processing hole having a plurality of linear portions with different extending directions. An object of the present invention is to provide a surface treatment apparatus capable of performing surface treatment efficiently and with high quality without going through complicated steps such as masking.

Further, another object of the present invention is to provide a processing hole having a plurality of linear portions with different extending directions in an efficient and high manner without undergoing complicated processes such as masking on the inner wall surface. An object of the present invention is to provide a surface treatment method capable of performing surface treatment on quality.

According to an embodiment of the present invention, an electrode is provided, and an electrolytic treatment solution is circulated through a processing hole in which the electrode is inserted, and electricity is passed between the electrode and the inner wall surface of the processing hole. A surface treatment apparatus for performing a surface treatment on the inner wall surface, wherein the electrode includes a first electrode and a second electrode integrated in an electrically insulated state via an insulating member, and the first electrode The electrode is inserted from one opening of the processing hole having a refracting portion, the second electrode is inserted from the other opening of the processing hole, the first tip of the first electrode, and the second electrode A surface treatment apparatus is provided in which the first electrode and the second electrode are integrated by abutting the second tip portion of the first electrode portion and the second tip portion via the insulating member inside the refracting portion.

Here, for example, the processing hole having the refracting part in the extending direction is between the linear part (first linear part) between one opening and the refracting part and between the other opening and the refracting part. The linear extending portion (second linear portion) differs in the extending direction. For example, when surface treatment is performed on the inner wall surface of such a processing hole using a general electrode having a linear appearance, first, the electrolytic treatment solution contacts the inner wall surface of the first linear portion. Do not mask. Next, an electrode is inserted from the other opening of the processing hole, and the electrode is opposed to the inner wall surface of the second linear portion.

Next, an energization process is performed to energize the inner wall surface between the electrode and the inner wall surface of the second linear portion while flowing the electrolytic treatment solution through the treatment hole. Next, the masking applied to the inner wall surface of the first linear portion is removed, and the inner wall surface of the second linear portion subjected to the surface treatment is masked. Next, in the same manner as the surface treatment for the inner wall surface of the second linear portion, the inner wall surface of the first linear portion is also subjected to a surface treatment by performing an energization process. That is, a plurality of masking steps and a plurality of energization steps are required in order to perform surface treatment on a treatment hole having a refracting portion using a general electrode having a linear appearance.

However, in the surface treatment apparatus according to the present invention including the first electrode and the second electrode integrated as described above, the first electrode is opposed to the inner wall surface of the first linear portion of the treatment hole, and the second electrode The energization process can be performed with the second electrode facing the inner wall surface of the linear portion. Thus, the surface treatment can be performed on both the inner wall surface of the first straight portion and the inner wall surface of the second straight portion of the processing hole by a common energization step without going through complicated steps such as masking.

In addition, since the first electrode and the second electrode are insulated, it is possible to supply current independently to the first electrode and the second electrode. Accordingly, for example, current is supplied from the proximal end side of the first electrode to the proximal end side of the second electrode through the first distal end portion and the second distal end portion without insulating the first electrode and the second electrode. Compared to such a case, it is possible to suppress a difference in current distribution between the inner wall surface of the first linear portion and the inner wall surface of the second linear portion of the processing hole. As a result, it is possible to perform surface treatment substantially uniformly on the inner wall surfaces of both the first linear portion and the second linear portion of the processing hole.

As described above, according to this surface treatment apparatus, even when the treatment hole has a shape having a refracting portion, the surface treatment can be performed efficiently and with high quality on the inner wall surface of the treatment hole. .

In the above surface treatment apparatus, each of the first electrode and the second electrode is a hollow body having a tubular portion, and a first closing portion for closing the tip of the first electrode is provided at the first tip portion. The second tip portion is provided with a second closing portion that closes the tip of the second electrode, and the first electrode extends in the axial direction to the first closing portion. A first inner electrode that is electrically connected is provided, and the second electrode is provided with a second inner electrode that extends in the axial direction and is electrically connected to the second closing portion. It is preferable.

In this case, by supplying a current to the first electrode via the first inner electrode, it is possible to cause a current to flow from the first distal end side where the first closing portion is provided toward the proximal end side. Similarly, by supplying a current to the second electrode via the second inner electrode, the second electrode can cause a current to flow from the second distal end side where the second blocking portion is provided toward the proximal end side. it can. As a result, it is possible to satisfactorily energize between the first and second closed portions and the inner wall surface of the refracted portion of the processing hole. Surface treatment can be effectively performed.

According to another embodiment of the present invention, an electrode is provided, and an electric current is passed between the electrode and the inner wall surface of the processing hole while flowing an electrolytic processing solution through the processing hole into which the electrode is inserted. Thus, in the surface treatment apparatus for performing a surface treatment on the inner wall surface, the electrode includes a first electrode and a second electrode integrated in an electrically insulated state via an insulating member, The processing hole includes a first processing hole and a second processing hole having an opening provided on an inner wall surface of the first processing hole, and the second electrode of the first electrode inserted into the first processing hole. An insertion portion is provided at a portion facing the opening of the processing hole, and the first electrode and the second electrode are integrated by inserting a distal end portion of the second electrode into the insertion portion, Provided is a surface treatment apparatus in which the insulating member is interposed between the inserted portion and the tip portion of the second electrode. That.

The processing hole consisting of the first processing hole and the second processing hole having an opening on the inner wall surface of the first processing hole, in other words, the second processing hole branched from the first processing hole also has an extending direction. It has a plurality of different linear portions. Even when the surface treatment is performed on the inner wall surface of such a treatment hole using a general electrode having a linear appearance, it is necessary to perform masking or energization process for each of the first treatment hole and the second treatment hole. is there.

In contrast, in the surface treatment apparatus according to the present invention including the first electrode and the second electrode integrated as described above, the first electrode is opposed to the inner wall surface of the first treatment hole, and the second treatment is performed. The energization process can be performed with the second electrode facing the inner wall surface of the hole. Thus, the surface treatment can be performed on the inner wall surfaces of both the first treatment hole and the second treatment hole by a common energization step without going through complicated steps such as masking. In addition, since the first electrode and the second electrode are insulated, it is possible to supply current independently to the first electrode and the second electrode. Thereby, the surface treatment can be performed substantially uniformly on the inner wall surfaces of both the first treatment hole and the second treatment hole.

As mentioned above, according to this surface treatment apparatus, even if it is a case where a treatment hole consists of a shape which has a branched part, surface treatment can be performed efficiently and with high quality to the inner wall surface of this treatment hole. .

In the surface treatment apparatus, the first electrode is a hollow body having a tubular portion, and the inserted portion includes a hole penetrating a peripheral wall of the first electrode, and the insulating portion is formed inside the inserted portion. A member is provided, a female screw is formed on the insulating member, a male screw is formed on the tip of the second electrode, and the first electrode and the second electrode are connected by screwing the female screw and the male screw. It is preferable that the positioning is fixed. In this case, since the energization process can be performed in a state where the positional relationship between the inner wall surfaces of the first processing hole and the second processing hole and the outer peripheral surfaces of the first electrode and the second electrode is favorably maintained, It becomes possible to perform surface treatment with high quality.

In the above surface treatment apparatus, a tip portion of the first electrode is provided with a closing portion that closes the tip of the first electrode and faces the bottom surface of the bottomed first processing hole. It is preferable that an inner electrode that extends in the axial direction of the first electrode and is electrically connected to the closed portion is provided inside the first electrode. In this case, by supplying current from the inner electrode, the current can flow from the distal end side to the proximal end side of the first electrode provided with the blocking portion. Accordingly, it becomes possible to satisfactorily energize between the closed portion and the bottom surface of the first processing hole, and thus the surface treatment can be effectively performed on the bottom surface.

According to another embodiment of the present invention, an electrode is provided, and an electric current is passed between the electrode and the inner wall surface of the processing hole while flowing an electrolytic processing solution through the processing hole into which the electrode is inserted. Thus, in the surface treatment apparatus for performing a surface treatment on the inner wall surface, the electrode includes a first electrode and a second electrode integrated in an electrically insulated state via an insulating member, The first electrode and the second electrode are hollow bodies having a tubular portion, the outer diameter of the first electrode is larger than the outer diameter of the second electrode, and the treatment hole has a bottomed first treatment. An intersection of the first processing hole and the second processing hole of the first electrode, which is composed of a hole and a bottomed second processing hole intersecting the first processing hole, and is inserted into the first processing hole An insertion hole is formed in the portion arranged in the section along the extending direction of the second processing hole, and is inserted into the second processing hole The second electrode thus formed is integrated with the first electrode by being inserted into the insertion hole, and the insulating member is interposed between the insertion hole and the second electrode. Is provided.

The processing hole composed of the first processing hole and the second processing hole intersecting with the first processing hole also has a plurality of linear portions with different extending directions. Even when the surface treatment is performed on the inner wall surface of such a treatment hole using a general electrode having a linear appearance, it is necessary to perform masking or energization process for each of the first treatment hole and the second treatment hole. is there.

In contrast, in the surface treatment apparatus according to the present invention including the first electrode and the second electrode integrated as described above, the first electrode is opposed to the inner wall surface of the first treatment hole, and the second treatment is performed. The energization process can be performed with the second electrode facing the inner wall surface of the hole. Thus, the surface treatment can be performed on the inner wall surfaces of both the first treatment hole and the second treatment hole by a common energization step without going through complicated steps such as masking. In addition, since the first electrode and the second electrode are insulated, it is possible to supply current independently to the first electrode and the second electrode. Thereby, the surface treatment can be performed substantially uniformly on the inner wall surfaces of both the first treatment hole and the second treatment hole.

As mentioned above, according to this surface treatment apparatus, even if it is a case where a treatment hole consists of a shape which has a crossing part, surface treatment can be performed efficiently and with high quality to the inner wall surface of this treatment hole. .

In the surface treatment apparatus, the second electrode is preferably inserted into a second treatment hole having a smaller diameter than the first treatment hole. In this manner, the outer peripheral surface of the second electrode is opposed to the inner wall surface of the second processing hole having a smaller diameter than the first processing hole in accordance with the outer diameter of the second electrode that is smaller than the outer diameter of the first electrode. Thereby, it becomes easy to perform surface treatment substantially uniformly by suppressing the difference in current density from occurring on the inner wall surfaces of both the first processing hole and the second processing hole.

In the above surface treatment apparatus, a tip portion of the first electrode is provided with a closing portion that closes the tip of the first electrode and faces the bottom surface of the first processing hole, and the inner diameter of the first electrode is A diameter of the first electrode is larger than an outer diameter of the second electrode, and passes between the inner peripheral surface of the first electrode and the outer peripheral surface of the second electrode. It is preferable that an inner electrode extending in a direction and electrically connected to the closed portion of the first electrode is provided.

In this case, by supplying current from the inner electrode, current can flow from the distal end side to the proximal end side of the first electrode provided with the blocking portion, so that the first processing hole facing the blocking portion Surface treatment can be effectively applied to the bottom surface.

In the above surface treatment apparatus, the distal end portion of the second electrode is provided with a closing portion that is disposed so as to close the distal end of the second electrode and face the bottom surface of the second processing hole. The two electrodes are preferably provided with an inner electrode that extends in the axial direction and is electrically connected to the closed portion of the second electrode. In this case, the surface treatment can be effectively performed also on the bottom surface of the second treatment hole facing the closed portion of the second electrode.

According to another embodiment of the present invention, there is provided a surface treatment method for performing a surface treatment on an inner wall surface of a treatment hole using an electrode composed of a first electrode and a second electrode, An integration step of integrating the first electrode and the second electrode in an electrically insulated state via an insulating member, and the first electrode and the second electrode while circulating an electrolytic treatment solution inside the processing hole An energization step of energizing between the second electrode and the inner wall surface of the processing hole, and in the integration step, the first tip of the first electrode and the second tip of the second electrode At least one of the insulating members is provided, the first electrode is inserted from one opening of the processing hole having a refracting portion, and the second electrode is inserted from the other opening of the processing hole, The first tip portion and the second tip portion through the insulating member inside the refracting portion Surface treatment method of contact is provided.

By the integration process of integrating the first electrode and the second electrode as described above inside the processing hole, the linear portion (first linear portion) between one opening of the processing hole and the refracting portion is formed. The energization step is performed with the first electrode facing the inner wall surface and the second electrode facing the inner wall surface of the linear portion (second linear portion) between the other opening and the refracting portion. Can do. Accordingly, the surface treatment can be performed on the inner wall surfaces of both the first linear portion and the second linear portion by a common energization step without going through complicated steps such as masking. In addition, since the first electrode and the second electrode are insulated, it is possible to supply current independently to the first electrode and the second electrode. Thereby, the surface treatment can be performed substantially uniformly on the inner wall surfaces of both the first linear portion and the second linear portion of the processing hole.

As described above, according to this surface treatment method, even if the treatment hole has a shape having a refracting portion, the surface treatment can be performed efficiently and with high quality on the inner wall surface of the treatment hole. .

In the surface treatment method described above, in the energization step, the first closing portion that extends in the axial direction inside the first electrode made of a hollow body having a tubular portion and closes the tip of the first electrode is electrically connected. The first electrode is energized via a first inner electrode that is connected electrically, and the inside of the second electrode that is a hollow body having a tubular portion extends in the axial direction, and the second electrode It is preferable to energize the second electrode through a second inner electrode electrically connected to a second closing portion that closes the tip.

In this case, it is possible to satisfactorily energize between the first closed portion and the second closed portion, and the inner wall surface of the refracted portion of the processing hole. Surface treatment can be effectively performed.

According to another embodiment of the present invention, there is provided a surface treatment method for performing a surface treatment on an inner wall surface of a treatment hole using an electrode composed of a first electrode and a second electrode, An integration step of integrating the first electrode and the second electrode in an electrically insulated state via an insulating member, and the first electrode and the second electrode while circulating an electrolytic treatment solution inside the processing hole An energization step of energizing between the second electrode and the inner wall surface of the processing hole. In the integration step, an opening is formed in the bottomed first processing hole and the inner wall surface of the first processing hole. The first electrode is inserted into the first processing hole, and the second electrode is inserted into the second processing hole, and the second electrode is inserted into the first processing hole. The tip of the second electrode is inserted into the insertion portion provided at the portion of the second processing hole facing the opening through the insulating member. Surface treatment method to be inserted is provided.

In the processing hole, the first electrode is opposed to the inner wall surface of the first processing hole and the inner wall surface of the second processing hole by the integration step of integrating the first electrode and the second electrode as described above. The energization process can be performed with the second electrodes facing each other. Thus, the surface treatment can be performed on the inner wall surfaces of both the first treatment hole and the second treatment hole by a common energization step without going through complicated steps such as masking. In addition, since the first electrode and the second electrode are insulated, in the energization process, it is possible to supply current independently to the first electrode and the second electrode. Thereby, the surface treatment can be performed substantially uniformly on the inner wall surfaces of both the first treatment hole and the second treatment hole.

As described above, according to this surface treatment method, even when the treatment hole has a shape having a branching portion, the surface treatment can be performed efficiently and with high quality on the inner wall surface of the treatment hole. .

In the surface treatment method, the first electrode is formed of a hollow body having a tubular portion, and the inserted portion is formed of a hole that penetrates a peripheral wall of the first electrode. Positioning and fixing the first electrode and the second electrode by screwing a female screw formed on the insulating member provided inside the part and a male screw formed on the tip of the second electrode It is preferable to do. In this case, since the energization process can be performed in a state where the positional relationship between the inner wall surfaces of the first processing hole and the second processing hole and the outer peripheral surfaces of the first electrode and the second electrode is favorably maintained, It becomes possible to perform surface treatment with high quality.

In the surface treatment method described above, in the energization step, the first electrode is closed in a state where the first closing portion that closes the tip of the first electrode faces the bottom surface of the first processing hole. Preferably, the first electrode is energized via a first inner electrode that extends and is electrically connected to the first closing portion. In this case, it is possible to satisfactorily energize between the closed portion of the first electrode and the bottom surface of the first processing hole, and thus the surface treatment can be effectively performed on the bottom surface.

According to another embodiment of the present invention, there is provided a surface treatment method for performing a surface treatment on an inner wall surface of a treatment hole using an electrode composed of a first electrode and a second electrode, An integration step of integrating the first electrode and the second electrode in an electrically insulated state via an insulating member, and the first electrode and the second electrode while circulating an electrolytic treatment solution inside the processing hole An energization step of energizing between the second electrode and the inner wall surface of the processing hole, the first electrode and the second electrode are hollow bodies having a tubular portion, and in the integration step, The outer diameter of the first processing hole is smaller than the outer diameter of the second electrode of the processing hole including the first processing hole with a bottom and the second processing hole with the bottom intersecting the first processing hole. After inserting the large first electrode, the second electrode is inserted into the second processing hole, and the first electrode of the first electrode The surface treatment method for inserting the second electrode via the insulating member into the insertion hole formed in a portion arranged at the intersection of the processed bore second processing hole is provided.

In the processing hole, the first electrode is opposed to the inner wall surface of the first processing hole and the inner wall surface of the second processing hole by the integration step of integrating the first electrode and the second electrode as described above. The energization process can be performed with the second electrodes facing each other. Thus, the surface treatment can be performed on the inner wall surfaces of both the first treatment hole and the second treatment hole by a common energization step without going through complicated steps such as masking. In addition, since the first electrode and the second electrode are insulated, in the energization process, it is possible to supply current independently to the first electrode and the second electrode. Thereby, the surface treatment can be performed substantially uniformly on the inner wall surfaces of both the first treatment hole and the second treatment hole.

As described above, according to this surface treatment method, even if the treatment hole has a shape having an intersection, the surface treatment can be performed efficiently and with high quality on the inner wall surface of the treatment hole. .

In the surface treatment method described above, it is preferable that the second electrode is inserted into the second treatment hole having a smaller diameter than the first treatment hole in the integration step. In this case, it is possible to suppress the occurrence of a difference in current density on the inner wall surfaces of both the first processing hole and the second processing hole, and to perform surface treatment substantially uniformly.

In the surface treatment method described above, the inner diameter of the first electrode is larger than the outer diameter of the second electrode, and in the energization step, a blocking portion that closes the tip of the first electrode is used as a bottom surface of the first processing hole. And extending between the inner peripheral surface of the first electrode and the outer peripheral surface of the second electrode and extending in the axial direction of the first electrode, the closed portion of the first electrode Preferably, the first electrode is energized through an inner electrode electrically connected to the first electrode. In this case, by supplying current from the inner electrode of the first electrode, current can flow from the distal end side to the proximal end side of the first electrode, so the first treatment facing the closed portion of the first electrode. Surface treatment can be effectively applied to the bottom surface of the hole.

In the surface treatment method described above, in the energization step, the inside of the second electrode extends in the axial direction in a state where the closing portion that closes the tip of the second electrode faces the bottom surface of the second processing hole. Then, it is preferable that the second electrode is energized through an inner electrode electrically connected to the closed portion of the second electrode. In this case, by supplying current from the inner electrode of the second electrode, the current can flow from the distal end side to the proximal end side of the second electrode, so the second process facing the closed portion of the second electrode. Surface treatment can be effectively applied to the bottom surface of the hole.

It is a principal part schematic block diagram of the surface treatment apparatus which concerns on 1st Embodiment of this invention, and the processing hole which performs the surface treatment of an inner wall by this surface treatment apparatus. It is a principal part enlarged view of FIG. It is the principal part enlarged view of the electrode and process hole which concern on the modification of the surface treatment apparatus of FIG. It is a principal part schematic block diagram of the surface treatment apparatus which concerns on 2nd Embodiment of this invention, and the processing hole which performs the surface treatment of an inner wall with this surface treatment apparatus. It is a principal part enlarged view of FIG. It is a principal part schematic block diagram of the surface treatment apparatus which concerns on 3rd Embodiment of this invention, and the processing hole which performs the surface treatment of an inner wall with this surface treatment apparatus. It is a principal part enlarged view of FIG. FIG. 8 is a cross-sectional view of the electrode of FIG. 7 taken along line VIII-VIII.

Preferred embodiments of the surface treatment apparatus and the surface treatment method according to the present invention will be described in detail with reference to the accompanying drawings. In the following drawings, components having the same or similar functions and effects are denoted by the same reference numerals, and repeated description may be omitted.

The surface treatment apparatus and the surface treatment method according to the present invention include a surface to be treated such as electroplating, electrolytic etching, electrolytic degreasing, electrodeposition coating, anodization, cathodic oxidation, electropolishing, or pretreatment or posttreatment thereof. It can be suitably applied to the case where the surface treatment is performed electrically. Hereinafter, an example in which the surface treatment apparatus and the surface treatment method perform electroplating will be described, but the present invention is not limited thereto.

As shown in FIG. 1, the surface treatment apparatus 10 according to the first embodiment forms a plating film (not shown) on the inner wall surface of the treatment hole 12. An example of the plating film is a film made of a zinc alloy such as a zinc-nickel composite plating film. In this case, the plating film can be formed using an electrolytic treatment solution comprising a plating bath prepared by mixing zinc chloride, nickel chloride, ammonium chloride and the like.

The treatment hole 12 is, for example, a cooling passage formed in the casting mold 14 and supplied with cooling water for cooling the casting mold 14 and has a refracting portion 16 in the extending direction. That is, the processing hole 12 includes a first linear portion 20 between one opening 18 and the refracting portion 16 and a second linear portion 24 between the other opening 22 and the refracting portion 16. The extending direction is different.

The casting mold 14 is formed of an alloy steel material or the like, and cooling water is supplied into the processing hole 12. Thus, temperature control is performed to maintain an optimum temperature during molding of the casting mold 14 or to cool the casting mold 14 efficiently after molding. Corrosion products generated by contact with cooling water, deposits derived from calcium, etc. in the cooling water (hereinafter collectively referred to as deposits) adhere to the inner wall surface of the treatment hole 12. If the heat exchange between the cooling water and the casting mold 14 and the circulation of the cooling water are hindered, there is a concern that it is difficult to stably control the temperature of the casting mold 14. Therefore, by using the surface treatment apparatus 10 to form a plating film on the inner wall surface of the treatment hole 12, it is possible to suppress deposits from adhering to the inner wall surface. As a result, the temperature of the casting mold 14 can be maintained optimally.

The surface treatment apparatus 10 mainly includes an electrode 30, a liquid supply unit 31, a drainage unit 32, a pump 33, a treatment liquid tank 34, and an external power source (not shown).

The electrode 30 includes a hollow first electrode 36 and a second electrode 38 having a tubular portion formed of, for example, platinum-coated titanium or the like. Further, the portion of the first electrode 36 protruding from the liquid supply portion 31 is inserted into the first linear portion 20 of the processing hole 12, and the portion of the second electrode 38 protruding from the drainage portion 32 is the second of the processing hole 12. The straight portion 24 is inserted. In the first embodiment, each of the first electrode 36 and the second electrode 38 inserted into the processing hole 12 is described with the openings 18 and 22 side of the processing hole 12 as the base end side and the refracting portion 16 side as the front end side. To do.

As shown in FIG. 2, the first tip portion 40 that is the tip portion of the first electrode 36 is provided with a first closing portion 42 that closes the tip of the tubular portion of the first electrode 36. A first inner electrode 44 extending in the axial direction of the first electrode 36 and having one end side electrically connected to the first closing portion 42 is provided inside the first electrode 36. The other end side of the first inner electrode 44 extends to the outside of the processing hole 12 via the liquid supply part 31 and is connected to an external power source.

The second electrode 38 is configured in the same manner as the first electrode 36. That is, a second closing portion 48 is provided at the second tip portion 46 that is the tip portion of the second electrode 38, and one end side is electrically connected to the second closing portion 48 inside the second electrode 38. An electrode 50 is provided. The other end side of the second inner electrode 50 extends to the outside of the processing hole 12 through the drainage part 32 and is connected to an external power source.

The first electrode 36 and the second electrode 38 are electrically insulated by mutual contact between the first tip portion 40 and the second tip portion 46 via the insulating member 52 inside the refracting portion 16. It is integrated in the state. That is, the insulating member 52 is provided in each of the first tip portion 40 and the second tip portion 46 that are in contact with each other inside the refracting portion 16.

The positions where the insulating members 52 of the first tip portion 40 and the second tip portion 46 are provided are adjusted according to an angle θ formed by the first linear portion 20 and the second linear portion 24 of the processing hole 12. . For example, when the angle θ is relatively large as in the processing hole 12 shown in FIG. 2, the front end side of each of the first front end portion 40 and the second front end portion 46 (the first closing portion 42 and the second closing portion). The insulating member 52 may be provided in the portion 48).

Further, for example, when the angle θ is relatively small as in the processing hole 12 shown in FIG. 3, the first closing portion 42 is disposed so as to face the inner wall surface of the second linear portion 24, and the first The insulating member 52 may be provided on the outer peripheral surface of the distal end portion 40 and the insulating member 52 may be provided on the distal end surface side of the second closing portion 48.

Note that the insulating member 52 only needs to be provided so as to be able to electrically insulate the first electrode 36 and the second electrode 38. For example, only one of the first tip portion 40 and the second tip portion 46 is provided. May be provided.

The liquid supply part 31 is detachably attached to one opening 18 of the processing hole 12, and the drainage part 32 is detachably attached to the other opening 22 of the processing hole 12. The pump 33 supplies the electrolytic treatment liquid between the inner wall surface of the first linear portion 20 and the outer peripheral surface of the first electrode 36 via the supply pipe 54 and the liquid supply unit 31. As a result, the electrolytic treatment liquid flows from one opening 18 of the processing hole 12 toward the other opening 22 between the outer peripheral surface of the first electrode 36 and the inner wall surface of the first linear portion 20, and the second electrode. After flowing between the outer peripheral surface of 38 and the inner wall surface of the second linear portion 24, it is discharged from the processing hole 12 to the recovery pipe 56 via the drainage portion 32.

The treatment liquid tank 34 collects the electrolytic treatment liquid discharged from the treatment hole 12 to the collection pipe 56 via the drainage part 32 as described above. The recovered electrolytic treatment liquid is supplied again to the liquid supply unit 31 via the pump 33, and thus circulates between the surface treatment apparatus 10 and the treatment hole 12.

In addition, in place of the electrolytic treatment liquid composed of a plating bath, for example, when a degreasing cleaning liquid, an etching liquid, a smut removing liquid, water, or the like is circulated in the treatment hole, the treatment liquid composed of the above liquid by the pump 33 What is necessary is just to supply to the processing hole 12 through the liquid supply part 31. FIG. In addition, the liquid discharged from the processing hole 12 via the drainage part 32 may be collected in the processing liquid tank 34.

The external power supply supplies current to the first electrode 36 and the second electrode 38 via the first inner electrode 44 and the second inner electrode 50. That is, as indicated by an arrow E in FIG. 2, the current from the external power source flows to the first closing portion 42 and the second closing portion 48 via the first inner electrode 44 and the second inner electrode 50. Then, it flows in a direction from the first closing portion 42 and the second closing portion 48 toward the proximal ends of the first electrode 36 and the second electrode 38. Thereby, a potential difference can be generated between the first electrode 36 and the inner wall surface of the first linear portion 20 and between the second electrode 38 and the inner wall surface of the second linear portion 24.

The surface treatment apparatus 10 according to the first embodiment is basically configured as described above. Hereinafter, the surface treatment method according to the first embodiment will be described using an example in which a plating treatment is performed as a surface treatment on the inner wall surface of the treatment hole 12 using the surface treatment apparatus 10.

In this surface treatment method, first, an integration step is performed in which the first electrode 36 and the second electrode 38 are integrated in an electrically insulated state via the insulating member 52 inside the treatment hole 12. Specifically, the first electrode 36 is inserted into the first linear portion 20 of the processing hole 12, and the liquid supply unit 31 is attached to one opening 18 of the processing hole 12. Similarly, the second electrode 38 is inserted into the second linear portion 24 of the processing hole 12, and the drainage portion 32 is attached to the other opening 22 of the processing hole 12. As a result, the first tip portion 40 and the second tip portion 46 are brought into contact with each other through the insulating member 52 inside the refracting portion 16 so that the first electrode 36 and the second electrode 38 are integrated.

Next, degreasing that removes oil from the inner wall surface of the processing hole 12 by circulating a degreasing cleaning liquid (for example, a water-soluble alkaline cleaning agent) through the processing hole 12 through the liquid supply unit 31 and the drainage unit 32. Perform the process.

Next, an etching solution (for example, 10% by weight hydrochloric acid aqueous solution or 10% by weight sulfuric acid aqueous solution) is circulated through the processing hole 12 through the liquid supply unit 31 and the drainage unit 32, so that the inside of the processing hole 12 An etching process for removing the oxide film from the wall surface is performed. This etching process may be performed by electrolytic etching (anodic electrolysis) by supplying current from the external power source to the first electrode 36 and the second electrode 38 via the first inner electrode 44 and the second inner electrode 50.

Next, a smut removing step is performed by circulating a smut removing liquid (for example, a mixed solution of sodium hydroxide and sodium citrate) through the treatment hole 12 through the liquid supply unit 31 and the drainage unit 32. By performing the smut removing step, for example, even when the metal component insoluble in water (smut) is exposed on the inner wall surface of the processing hole 12 by removing the oxide film in the above etching processing step, The smut can be removed from the processing hole 12.

Note that the smut removing step may be performed by electrolytic treatment (cathodic electrolysis or anodic electrolysis) as in the etching treatment step. In this case, since the smut removing liquid is electrolyzed in the treatment hole 12 and oxygen is generated, the smut can be more effectively removed.

Next, the electrolytic processing solution is circulated through the processing hole 12 through the liquid supply unit 31 and the drainage unit 32, and current is supplied from the external power source to the first inner electrode 44 and the second inner electrode 50, so that the first An energization process of energizing between the electrode 36 and the second electrode 38 and the inner wall surface of the processing hole 12 is performed. Thereby, a plating film can be formed on the inner wall surface of the treatment hole 12.

Therefore, in the first embodiment, by using the first electrode 36 and the second electrode 38 integrated as described above, the outer peripheral surface of the first electrode 36 is opposed to the inner wall surface of the first linear portion 20. In addition, the energization process can be performed in a state where the outer peripheral surface of the second electrode 38 is opposed to the inner wall surface of the second linear portion 24. Accordingly, the surface treatment can be performed on the inner wall surfaces of both the first linear portion 20 and the second linear portion 24 of the processing hole 12 through a common energization step without going through complicated steps such as masking.

In addition, since the first electrode 36 and the second electrode 38 are insulated, it is possible to supply current to each of the first electrode 36 and the second electrode 38 independently. Thereby, for example, the first electrode 36 and the second electrode 38 are not insulated from each other, and the base of the second electrode 38 is connected from the base end side of the first electrode 36 via the first tip portion 40 and the second tip portion 46. In comparison with a case where current flows to the end side, the difference in current distribution between the inner wall surface of the first linear portion 20 and the inner wall surface of the second linear portion 24 of the processing hole 12 is suppressed. it can. As a result, the inner wall surface of the treatment hole 12 can be subjected to surface treatment substantially uniformly, so that a high-quality plating film having a substantially uniform thickness can be formed.

As described above, according to the surface treatment apparatus 10 and the surface treatment method according to the first embodiment, the inner wall surface of the treatment hole 12 can be efficiently and high-quality surface treated even for the treatment hole 12 having the refracting portion 16. It can be performed. In this way, by forming a plating film having a substantially uniform thickness on the inner wall surface of the treatment hole 12, it is possible to effectively suppress adhesion of deposits on the inner wall surface. In the treatment hole 12 in which the adhesion of the deposits to the inner wall surface and the generation of the products are suppressed, the cooling water can be circulated well, and the cooling water and the casting mold 14 can be exchanged heat. Therefore, the temperature control of the casting mold 14 can be performed stably. As a result, the temperature of the casting mold 14 can be maintained optimally.

Further, as described above, in the surface treatment apparatus 10, the first closing portion 42 and the first inner electrode 44 are provided on the first electrode 36, and the second closing portion 48 and the second inner electrode 50 are provided on the second electrode 38. It was. In the energization step, by supplying current to the first electrode 36 via the first inner electrode 44, current is supplied from the first distal end portion 40 side where the first closing portion 42 is provided toward the proximal end side. I decided to shed. Similarly, the second electrode 38 supplies current to the second electrode 38 via the second inner electrode 50, so that the second distal end portion 46 side where the second blocking portion 48 is provided is moved from the proximal end side to the proximal end side. The current was made to flow in the direction. As a result, it is possible to satisfactorily energize between the first closing portion 42 and the second closing portion 48 and the inner wall surface of the refracting portion 16, so that the inner wall surface of the refracting portion 16 is also effective. Can be surface treated.

Therefore, since a plating film having a sufficient film thickness can be formed on the inner wall surface of the refracting portion 16, it is possible to effectively suppress adherence to the inner wall surface of the refracting portion 16 and production of the product. By the way, in the casting mold 14, the refracting portion 16 may be disposed near the cavity forming surface (not shown) in the processing hole 12. In the vicinity of the cavity forming surface, it is preferable to control the temperature of the casting mold 14 in a particularly stable manner. As described above, in the refracting portion 16 in which the adhesion of deposits and products on the inner wall surface is suppressed, cooling water can be circulated favorably inside the cooling wall and the casting mold 14 can be heated well. Can be exchanged. For this reason, for example, even in the case where the refracting portion 16 is disposed near the cavity forming surface in the processing hole 12, temperature control in the vicinity of the cavity forming surface of the casting mold 14 is stably performed. Is possible.

Next, the surface treatment apparatus 60 according to the second embodiment will be described with reference to FIGS. 4 and 5. The surface treatment device 60 forms a plating film (not shown) on the inner wall surface of the treatment hole 62.

As shown in FIG. 4, the processing hole 62 is also formed in the casting mold 14 in the same manner as the processing hole 12, and is a cooling passage through which cooling water for cooling the casting mold 14 is supplied. is there. The processing hole 62 includes a bottomed first processing hole 64 and a second processing hole 66 having a smaller diameter than the first processing hole 64. In the second processing hole 66, an opening 68 opposite to the opening 67 that opens toward the outside of the casting mold 14 is provided on the inner wall surface of the first processing hole 64. That is, the processing hole 62 has a branch portion 70 formed by the first processing hole 64 and the second processing hole 66 branched from the first processing hole 64. Accordingly, the processing hole 62 also has linear portions (the first processing hole 64 and the second processing hole 66) whose extending directions are different from each other.

The surface treatment apparatus 60 is configured in the same manner as the surface treatment apparatus 10 according to the first embodiment except that an electrode 72 is provided instead of the electrode 30. The electrode 72 includes a hollow first electrode 74 and a second electrode 76 having a tubular portion made of, for example, platinum-coated titanium or the like. The first electrode 74 is inserted into the first processing hole 64, and the second electrode 76 having an outer diameter smaller than the outer diameter of the first electrode 74 is inserted into the second processing hole 66.

In the second embodiment, for the first electrode 74 inserted into the first processing hole 64, the opening 77 side of the first processing hole 64 is the base end side, and the bottom surface 78 side of the first processing hole 64 is the front end side. explain. The second electrode 76 inserted into the second processing hole 66 will be described with the opening 67 side of the second processing hole 66 as the base end side and the other opening 68 side as the tip side.

As shown in FIG. 5, the first electrode 74 is configured in the same manner as the first electrode 36 except that the inserted portion 80 is provided on the peripheral wall facing the opening 68 of the second processing hole 66. ing. That is, the first closing portion 42 is provided at the first tip portion 40 that is the tip portion of the first electrode 74, and the first inner electrode 44 is provided inside the first electrode 74. The inserted portion 80 is a hole that penetrates the peripheral wall facing the opening 68 of the second processing hole 66 of the first electrode 74, and an annular insulating member 82 is provided inside. A female screw 82 a is formed on the inner periphery of the insulating member 82.

The second electrode 76 is formed of a tubular body, and a male screw 84 a that can be screwed with the female screw 82 a of the insulating member 82 is formed on the outer peripheral surface of the second tip portion 84 that is the tip portion of the second electrode 76. The proximal end side of the second electrode 76 extends outside the processing hole 62 via the drainage part 32 and is connected to an external power source.

The first electrode 74 and the second electrode 76 are integrated by inserting the second tip portion 84 of the second electrode 76 into the inserted portion 80 of the first electrode 74. At this time, the first electrode 74 and the second electrode 76 are positioned and fixed by screwing the female screw 82a of the insulating member 82 disposed in the inserted portion 80 and the male screw 84a of the second tip 84. Has been.

Hereinafter, the surface treatment method according to the second embodiment will be described using an example in which the surface treatment apparatus 60 is used to perform a plating treatment on the inner wall surface of the treatment hole 62 as a surface treatment.

In this surface treatment method, first, an integration process is performed in which the first electrode 74 and the second electrode 76 are integrated in an electrically insulated state through the insulating member 82 inside the treatment hole 62. Specifically, the first electrode 74 is inserted into the first processing hole 64 so that the first blocking portion 42 faces the bottom surface 78 of the first processing hole 64, and the liquid is supplied to the opening 77 of the first processing hole 64. The part 31 is attached. Next, the second electrode 76 is inserted into the second processing hole 66, and the male screw 84 a of the second tip 84 is screwed into the female screw 82 a of the insulating member 82. Thus, after the first electrode 74 and the second electrode 76 are integrated, the drainage part 32 is attached to the opening 67 of the second processing hole 66.

Next, in the same manner as the surface treatment method according to the first embodiment, after performing a degreasing step, an etching treatment step, and a smut removal step, energization for forming a plating film on the inner wall surface of the treatment hole 62 is performed. Perform the process. In the energization process, the electrolytic treatment liquid is circulated through the treatment hole 62 via the liquid supply part 31 and the drainage part 32, and the first closing part 42 is exposed to the bottom surface 78 of the first treatment hole 64. A current is supplied from the power source to the first electrode 74 and the second electrode 76 via the first inner electrode 44. In this way, a plating film can be formed on the inner wall surface of the processing hole 62 by energizing between the first electrode 74 and the second electrode 76 and the inner wall surface of the processing hole 62.

Therefore, in the second embodiment, by using the first electrode 74 and the second electrode 76 integrated as described above, the outer peripheral surface of the first electrode 74 is opposed to the inner wall surface of the first processing hole 64. The energization process can be performed with the outer peripheral surface of the second electrode 76 facing the inner wall surface of the second processing hole 66. Thus, the surface treatment can be performed on the inner wall surfaces of both the first processing hole 64 and the second processing hole 66 by a common energization process without going through a complicated process such as masking.

In addition, since the first electrode 74 and the second electrode 76 are insulated, the inner wall surface of the processing hole 62 is subjected to a substantially uniform surface treatment to form a high-quality plating film having a substantially uniform thickness. can do.

From the above, according to the surface treatment apparatus 60 and the surface treatment method according to the second embodiment, the inner wall surface of the treatment hole 62 can be efficiently and high-quality surface treated even for the treatment hole 62 having the branching portion 70. It can be performed. In this manner, by forming a plating film having a substantially uniform thickness on the inner wall surface of the processing hole 62, it is possible to effectively suppress adhesion of deposits on the inner wall surface.

As described above, in the integration step, the first electrode 74 and the second electrode 76 are positioned and fixed by screwing the female screw 82a and the male screw 84a. Thus, the energization process can be performed in a state in which the positional relationship between the inner wall surfaces of the first processing hole 64 and the second processing hole 66 and the outer peripheral surfaces of the first electrode 74 and the second electrode 76 is favorably maintained. Therefore, the surface treatment can be performed with higher quality.

Note that, in the surface treatment apparatus 60 according to the second embodiment, the outer diameter of the first electrode 74 is larger than the outer diameter of the second electrode 76, and the inserted portion 80 is from a hole penetrating the peripheral wall of the first electrode 74. It was decided to become. Then, a female screw 82 a is formed on the insulating member 82 provided in the inserted portion 80, and a male screw 84 a is formed on the tip of the second electrode 76. However, it is not particularly limited to these. For example, the inserted portion 80 may be configured to be able to insert the second tip portion 84 so as to integrate the first electrode 74 and the second electrode 76. In addition, the first electrode 74 and the second electrode 76 may be positioned and fixed by fitting or the like through the insulating member 82 between the inserted portion 80 and the second tip portion 84.

As described above, in the second embodiment, the first blocking portion 42 and the first inner electrode 44 are provided in the first electrode 74, and the first blocking portion 42 faces the bottom surface 78 of the first processing hole 64. Thus, a current was supplied to the first electrode 74 via the first inner electrode 44. Accordingly, it is possible to satisfactorily energize between the first closing portion 42 and the bottom surface 78 of the first processing hole 64, so that the surface treatment can be effectively performed on the bottom surface 78. it can.

Therefore, a plating film having a sufficient film thickness can be formed on the bottom surface 78 of the first processing hole 64 to effectively prevent deposits from adhering to the bottom surface 78. For example, the bottom surface of the first processing hole 64 Even when 78 is disposed near the cavity forming surface of the casting mold 14, temperature control in the vicinity of the cavity forming surface can be stably performed.

Next, a surface treatment apparatus 90 according to the third embodiment will be described with reference to FIGS. The surface treatment apparatus 90 forms a plating film (not shown) on the inner wall surface of the treatment hole 92.

As shown in FIG. 6, the processing hole 92 is also formed in the casting mold 14 in the same manner as the processing hole 12, and is a cooling passage to which cooling water for cooling the casting mold 14 is supplied. is there. The processing holes 92 include a plurality (five in the present embodiment) of first processing holes 94 and a plurality (two in the present embodiment) of second processing holes 96 that intersect the first processing hole 94. . That is, the processing hole 92 has an intersection 98 between the first processing hole 94 and the second processing hole 96. Therefore, the processing hole 92 also has linear portions (first processing hole 94 and second processing hole 96) having different extending directions.

Each first processing hole 94 is a bottomed hole extending along the arrow X1X2 direction of FIG. 6 and having a bottom surface 100 provided at one end side (arrow X1 side). Each second processing hole 96 is a bottomed hole extending along the direction of arrow Y1Y2 in FIG. 6 and having a bottom surface 102 provided on one end side (arrow Y1 side). The second processing hole 96 has a smaller diameter than the first processing hole 94 and is disposed so as to intersect the first processing hole 94 at a position close to the bottom surface 100 of the first processing hole 94. In this embodiment, the diameter of the second processing hole 96 is smaller than that of the first processing hole 94. However, the present invention is not limited to this, and the second processing hole 96 has the same diameter as the first processing hole 94. Also good.

The surface treatment apparatus 90 includes an electrode 104 instead of the electrode 30 described above, and replaces the liquid supply unit 31 and the liquid discharge unit 32 with the same number of first supply / discharge units 106 and second process holes 96 as the first process holes 94. The same number of second supply / discharge portions 108 as that of the surface treatment apparatus 10 according to the first embodiment, except that the pump 33 and the treatment liquid tank 34 are replaced by a treatment liquid supply / discharge means (not shown). It is configured.

The electrode 104 includes the same number of first electrodes 110 as the first processing holes 94 and the same number of second electrodes 112 as the second processing holes 96. Each of the first electrode 110 and the second electrode 112 is a hollow body having a tubular portion formed of, for example, platinum-coated titanium or the like. The first electrode 110 is inserted into the first processing hole 94, and the second electrode 112 having an outer diameter smaller than the inner diameter of the first electrode 110 is inserted into the second processing hole 96.

In the third embodiment, for the first electrode 110 and the second electrode 112 inserted into the first processing hole 94 and the second processing hole 96, respectively, the openings 114 and 116 of the first processing hole 94 and the second processing hole 96 are provided. The side is referred to as the proximal end side, and the bottom surface 100, 102 side is referred to as the distal end side.

As shown in FIGS. 6 to 8, the first electrode 110 is configured in the same manner as the first electrode 36 except that the treatment liquid inlet 118 and the insertion hole 120 are provided. . That is, the first closing portion 42 is provided at the first tip portion 40 that is the tip portion of the first electrode 110, and the first inner electrode 44 is provided inside the first electrode 110.

The treatment liquid inlet 118 is formed to penetrate the peripheral wall of the first electrode 110 slightly proximal to the first closing portion 42, and a plurality of treatment liquid inlets 118 are provided at intervals in the circumferential direction. The insertion hole 120 is provided so as to penetrate the portion of the first electrode 110 inserted into the first processing hole 94 at the intersection 98 along the extending direction of the second processing hole 96. .

The second electrode 112 is configured in the same manner as the second electrode 38 except that the processing liquid inlet 122 is provided. That is, the second closing portion 48 is provided at the second tip portion 46 that is the tip portion of the second electrode 112, and the second inner electrode 50 is provided inside the second electrode 112. The treatment liquid inlet 122 is formed so as to penetrate through the peripheral wall of the second electrode 112 slightly proximal to the second closing portion 48, and a plurality of treatment liquid inlets 122 are provided at intervals in the circumferential direction.

The first electrode 110 and the second electrode 112 are integrated by inserting the second electrode 112 through the insertion hole 120 of the first electrode 110. At this time, the outer peripheral surface of the portion inserted through the insertion hole 120 of the second electrode 112 is covered with the insulating member 124. In other words, the cylindrical insulating member 124 is interposed between the inner peripheral surface of the insertion hole 120 and the outer peripheral surface of the second electrode 112, so that the first electrode 110 and the second electrode 112 are electrically insulated. Yes.

Further, as shown in FIG. 8, the first inner electrode 44 of the first electrode 110 has the first electrode 110 so as to avoid the second electrode 112 and the insulating member 124 inserted through the first electrode 110 through the insertion hole 120. The first electrode 110 is disposed between the inner peripheral surface of the first electrode 110 and the outer peripheral surface of the second electrode 112.

The first supply / discharge portion 106 is detachably attached to the opening 114 of the first processing hole 94, and the second supply / discharge portion 108 is detachably attached to the opening 116 of the second processing hole 96. The processing liquid supply / discharge means supplies the electrolytic processing liquid between the inner wall surface of the first processing hole 94 and the outer peripheral surface of the first electrode 110 via the first supply / discharge section 106. Similarly, an electrolytic processing solution is supplied between the inner wall surface of the second processing hole 96 and the outer peripheral surface of the second electrode 112 via the second supply / discharge portion 108. The processing liquid supply / discharge means, the first supply / discharge section 106, and the second supply / discharge section 108 can use, for example, the configuration described in Japanese Patent Application Laid-Open No. 2015-30897, and thus detailed description thereof is omitted. .

In this way, the electrolytic processing solution supplied to the first processing hole 94 and the second processing hole 96 is between the outer peripheral surface of each of the first electrode 110 and the second electrode 112 and the inner peripheral surface of the processing hole 92. The first electrode 110 and the second electrode 112 are directed toward the distal end side. Then, as indicated by an arrow F in FIG. 7, the liquid flows into the inside of each of the first electrode 110 and the second electrode 112 from the processing liquid inlets 118 and 122, and the inside of the first electrode 110 and the second electrode 112. Is then discharged from the processing hole 92 via the first supply / discharge section 106 and the second supply / discharge section 108.

The electrolytic treatment liquid is supplied from the first supply / exhaust unit 106 and the second supply / exhaust unit 108 to the inside of the first electrode 110 and the second electrode 112, and passes through the treatment solution inlets 118 and 122, so In addition, it may be configured to flow out to the first processing hole 94 and the second processing hole 96 outside the second electrode 112.

Hereinafter, the surface treatment method according to the third embodiment will be described with reference to an example in which the surface treatment apparatus 90 is used to perform a plating treatment on the inner wall surface of the treatment hole 92 as a surface treatment.

In this surface treatment method, first, in the treatment hole 92, an integration step is performed in which the first electrode 110 and the second electrode 112 are integrated in a state of being electrically insulated via the insulating member 124. Specifically, the first electrode 110 is inserted into each of the plurality of first processing holes 94 so that the first blocking portion 42 faces the bottom surface 100 of the first processing hole 94, and the first processing hole The first supply / exhaust portion 106 is attached to the opening 114 of 94. At this time, the plurality of insertion holes 120 respectively provided in the plurality of first electrodes 110 are arranged inside the intersecting portion 98 so as to be coaxial along the extending direction of the second processing hole 96.

Next, the second electrode 112 is inserted into the insertion hole 120 of the first electrode 110 by inserting the second electrode 112 into each of the second processing holes 96. At this time, an insulating member 124 is provided in the insertion hole 120 of the first electrode 110 or a portion inserted into the insertion hole 120 on the outer peripheral surface of the second electrode 112. As a result, the second electrodes 112 and the plurality of first electrodes 110 are integrated with each other in an electrically insulated state via the insulating member 124, and then the second supply / discharge portion is formed in the opening 116 of the second processing hole 96. 108 is attached.

Next, in the same manner as the surface treatment method according to the first embodiment, after performing a degreasing step, an etching treatment step, and a smut removal step, energization for forming a plating film on the inner wall surface of the treatment hole 92 is performed. Perform the process. In the energization process, the electrolytic solution is circulated through the first processing hole 94 and the second processing hole 96 through the first supply / discharge unit 106 and the second supply / discharge unit 108. At the same time, with the first closing portion 42 and the second closing portion 48 facing the bottom surfaces 100 and 102 of the first processing hole 94 and the second processing hole 96, respectively, the first inner electrode 44 and the second inner electrode 44 and second A current is supplied to the inner electrode 50. In this way, a plating film is formed on the inner wall surface of the processing hole 92 by energizing the first electrode 110 and the second electrode 112 and the inner wall surfaces of the first processing hole 94 and the second processing hole 96, respectively. can do.

Therefore, in the third embodiment, by using the first electrode 110 and the second electrode 112 integrated as described above, the outer peripheral surface of the first electrode 110 is opposed to the inner wall surface of the first processing hole 94. The energization process can be performed in a state where the outer peripheral surface of the second electrode 112 is opposed to the inner wall surface of the second processing hole 96. Accordingly, the surface treatment can be performed on the inner wall surfaces of both the first processing hole 94 and the second processing hole 96 by a common energization process without going through a complicated process such as masking.

In addition, since the first electrode 110 and the second electrode 112 are insulated, the inner wall surface of the treatment hole 92 is subjected to a substantially uniform surface treatment to form a high-quality plating film having a substantially uniform thickness. can do.

From the above, according to the surface treatment apparatus 90 and the surface treatment method according to the third embodiment, the inner wall surface of the treatment hole 92 can be efficiently and high-quality surface treated even for the treatment hole 92 having the intersection 98. It can be performed. In this way, by forming a plating film having a substantially uniform thickness on the inner wall surface of the treatment hole 92, it is possible to effectively suppress adhesion of deposits on the inner wall surface.

As described above, in the third embodiment, the second inner surface of the second processing hole 96 having a smaller diameter than the first processing hole 94 is formed on the inner wall surface of the second processing hole 96 according to the outer diameter of the second electrode 112 smaller than the outer diameter of the first electrode 110. The outer peripheral surfaces of the two electrodes 112 are made to face each other. Accordingly, the distance between the inner wall surface of the first processing hole 94 and the outer peripheral surface of the first electrode 110 and the distance between the inner wall surface of the second processing hole 96 and the outer peripheral surface of the second electrode 112 can be made substantially constant. it can. For this reason, it becomes easy to perform surface treatment substantially uniformly by suppressing the difference in current density from occurring on the inner wall surfaces of both the first processing hole 94 and the second processing hole 96.

As described above, in the third embodiment, the first closing portion 42 and the first inner electrode 44 are provided on the first electrode 110, and the first closing portion 42 faces the bottom surface 100 of the first processing hole 94. A current was supplied to the first electrode 110 via the first inner electrode 44. As a result, it is possible to satisfactorily energize between the first blocking portion 42 and the bottom surface 100 of the first processing hole 94, so that the surface treatment can be effectively performed on the bottom surface 100. it can.

Further, since the second electrode 112 is configured in the same manner, it is possible to satisfactorily energize between the second blocking portion 48 and the bottom surface 102 of the second processing hole 96, so that the bottom surface 102 can be energized. Can also be effectively surface treated.

Therefore, a plating film having a sufficient film thickness can be formed on the bottom surfaces 100 and 102 of the first processing hole 94 and the second processing hole 96, and adhesion of deposits to the bottom surfaces 100 and 102 can be effectively suppressed. For this reason, for example, by arranging the bottom surface 100 of the first processing hole 94 near the cavity forming surface of the casting mold 14, temperature control in the vicinity of the cavity forming surface can be stably performed. .

The present invention is not particularly limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

For example, in the above embodiment, the first inner electrode 44 is provided on the first electrodes 36, 74, and 110, and the second inner electrode 50 is provided on the second electrodes 38 and 112. The first electrode 36, 74, 110 and the second electrode 38, 112 may not include the first inner electrode 44 and the second inner electrode 50. In this case, the first electrodes 74 and 110 may not include the first closing portion 42, and the second electrode 112 may not include the second closing portion 48.

DESCRIPTION OF SYMBOLS 10, 60, 90 ... Surface treatment apparatus 12, 62, 92 ... Processing hole 14 ... Mold for casting 16 ... Refraction part 18, 22, 67, 68, 77, 114, 116 ... Opening 20 ... 1st linear part 24 ... 2nd linear part 30, 72, 104 ... Electrode 31 ... Liquid supply part 32 ... Drainage part 36, 74, 110 ... 1st electrode 38, 76, 112 ... 2nd electrode 40 ... 1st front-end | tip part 42 ... 1st DESCRIPTION OF SYMBOLS 1 Closure part 44 ... 1st inner side electrode 46, 84 ... 2nd front-end | tip part 48 ... 2nd obstruction | occlusion part 50 ... 2nd inner side electrode 52, 82, 124 ... Insulation member 64, 94 ... 1st process hole 66, 96 ... 1st 2 treatment hole 70 ... branching part 78, 100, 102 ... bottom face 80 ... inserted part 82a ... female screw 84a ... male screw 98 ... crossing part 106 ... first supply / discharge part 108 ... Second supply / discharge section 118, 122 ... treatment liquid inlet 120 ... insertion hole

Claims (18)

Between the electrode (30) and the inner wall surface of the processing hole (12), the electrolytic processing solution is circulated in the processing hole (12) having the electrode (30) and the electrode (30) is inserted. A surface treatment device (10) for applying a surface treatment to the inner wall surface by energizing
The electrode (30) comprises a first electrode (36) and a second electrode (38) integrated in an electrically insulated state through an insulating member (52),
The first electrode (36) is inserted from one opening (18) of the processing hole (12) having a refracting portion (16),
The second electrode (38) is inserted from the other opening (22) of the processing hole (12),
The first tip portion (40) of the first electrode (36) and the second tip portion (46) of the second electrode (38) are disposed inside the refracting portion (16) and the insulating member (52). The surface treatment apparatus (10), wherein the first electrode (36) and the second electrode (38) are integrated by contacting with each other through the surface. In the surface treatment apparatus (10) according to claim 1,
The first electrode (36) and the second electrode (38) are hollow bodies having a tubular portion,
The first tip (40) is provided with a first closing portion (42) for closing the tip of the first electrode (36),
The second tip (46) is provided with a second closing portion (48) for closing the tip of the second electrode (38),
The first electrode (36) is provided with a first inner electrode (44) extending in the axial direction thereof and electrically connected to the first closing portion (42),
The second electrode (38) is provided with a second inner electrode (50) extending in the axial direction and electrically connected to the second closing part (48). A surface treatment apparatus (10). Between the electrode (72) and the inner wall surface of the processing hole (62), the electrolytic processing solution is circulated in the processing hole (62) into which the electrode (72) is inserted. A surface treatment device (60) for applying a surface treatment to the inner wall surface by energizing
The electrode (72) comprises a first electrode (74) and a second electrode (76) integrated in an electrically insulated state via an insulating member (82),
The processing hole (62) includes a first processing hole (64) and a second processing hole (66) provided with an opening (68) on the inner wall surface of the first processing hole (64).
A portion to be inserted (80) is provided in a portion of the first electrode (74) inserted into the first processing hole (64) facing the opening (68) of the second processing hole (66),
The first electrode (74) and the second electrode (76) are integrated by inserting the distal end portion (84) of the second electrode (76) into the inserted portion (80),
The surface treatment apparatus (60), wherein the insulating member (82) is interposed between the inserted portion (80) and the tip end portion (84) of the second electrode (76). In the surface treatment apparatus (60) according to claim 3,
The first electrode (74) is a hollow body having a tubular portion,
The inserted portion (80) comprises a hole penetrating the peripheral wall of the first electrode (74),
The insulating member (82) is provided inside the inserted portion (80),
A female screw (82a) is formed on the insulating member (82),
A male screw (84a) is formed at the tip (84) of the second electrode (76),
The surface treatment apparatus (60), wherein the first electrode (74) and the second electrode (76) are positioned and fixed by screwing the female screw (82a) and the male screw (84a). . The surface treatment apparatus (60) according to claim 4,
The front end portion (40) of the first electrode (74) closes the front end of the first electrode (74) and faces the bottom surface (78) of the bottomed first processing hole (64). (42) is provided,
An inner electrode (44) extending in the axial direction of the first electrode (74) and electrically connected to the closing portion (42) is provided inside the first electrode (74). A surface treatment apparatus (60) characterized by comprising: Between the electrode (104) and the inner wall surface of the processing hole (92), the electrolytic processing solution is circulated in the processing hole (92) having the electrode (104) and inserted into the electrode (104). A surface treatment device (90) for applying a surface treatment to the inner wall surface by energizing
The electrode (104) comprises a first electrode (110) and a second electrode (112) integrated in an electrically insulated state through an insulating member (124),
The first electrode (110) and the second electrode (112) are hollow bodies having a tubular portion,
The outer diameter of the first electrode (110) is larger than the outer diameter of the second electrode (112),
The processing hole (92) includes a bottomed first processing hole (94) and a bottomed second processing hole (96) intersecting the first processing hole (94).
A portion of the first electrode (110) inserted into the first processing hole (94) is arranged at an intersection (98) of the first processing hole (94) and the second processing hole (96). Is formed with an insertion hole (120) along the extending direction of the second processing hole (96),
The second electrode (112) inserted into the second processing hole (96) is integrated with the first electrode (110) by being inserted into the insertion hole (120),
The surface treatment apparatus (90), wherein the insulating member (124) is interposed between the insertion hole (120) and the second electrode (112). The surface treatment apparatus (90) according to claim 6,
The surface treatment apparatus (90), wherein the second electrode (112) is inserted into the second treatment hole (96) having a smaller diameter than the first treatment hole (94). The surface treatment apparatus (90) according to claim 6 or 7,
The distal end portion (40) of the first electrode (110) has a closed portion (42) that closes the distal end of the first electrode (110) and faces the bottom surface (100) of the first processing hole (94). Is provided,
The inner diameter of the first electrode (110) is larger than the outer diameter of the second electrode (112),
The shaft of the first electrode (110) passes between the inner peripheral surface of the first electrode (110) and the outer peripheral surface of the second electrode (112) inside the first electrode (110). A surface treatment apparatus (90), characterized in that an inner electrode (44) extending in a direction and electrically connected to the closing part (42) of the first electrode (110) is provided. The surface treatment apparatus (90) according to any one of claims 6 to 8,
The tip (46) of the second electrode (112) is disposed so as to close the tip of the second electrode (112) and face the bottom surface (102) of the second processing hole (96). A closure (48) is provided,
The second electrode (112) is provided with an inner electrode (50) extending in the axial direction and electrically connected to the closing portion (48) of the second electrode (112). A surface treatment apparatus (90) characterized by comprising: A surface treatment method for performing a surface treatment on an inner wall surface of a treatment hole (12) using an electrode (30) comprising a first electrode (36) and a second electrode (38),
An integration step of integrating the first electrode (36) and the second electrode (38) in an electrically insulated state via an insulating member (52) inside the processing hole (12);
An energization step of energizing between the first electrode (36) and the second electrode (38) and the inner wall surface of the processing hole (12) while allowing an electrolytic processing solution to flow through the processing hole (12). When,
Have
In the integration step, the insulating member (52) is attached to at least one of the first tip (40) of the first electrode (36) and the second tip (46) of the second electrode (38). The first electrode (36) is inserted from one opening (18) of the processing hole (12) having a refracting portion (16) and from the other opening (22) of the processing hole (12). The second electrode (38) is inserted, and the first tip portion (40) and the second tip portion (46) are brought into contact with each other through the insulating member (52) inside the refracting portion (16). A surface treatment method characterized by contact. The surface treatment method according to claim 10.
In the energization step, a first closing portion (42) that extends in the axial direction inside the first electrode (36) made of a hollow body having a tubular portion and closes the tip of the first electrode (36). The first electrode (36) is energized through a first inner electrode (44) electrically connected to the inner electrode, and the inside of the second electrode (38) made of a hollow body having a tubular portion is axially directed. The second electrode (38) via a second inner electrode (50) extending to the second electrode (38) and electrically connected to a second closing portion (48) closing the tip of the second electrode (38). The surface treatment method characterized by energizing. A surface treatment method of performing a surface treatment on an inner wall surface of a treatment hole (62) using an electrode (72) composed of a first electrode (74) and a second electrode (76),
An integration step of integrating the first electrode (74) and the second electrode (76) in an electrically insulated state through an insulating member (82) inside the processing hole (62);
An energization step of energizing between the first electrode (74) and the second electrode (76) and the inner wall surface of the processing hole (62) while allowing an electrolytic processing solution to flow through the processing hole (62). When,
Have
In the integration step, the processing includes a bottomed first processing hole (64) and a second processing hole (66) provided with an opening (68) on the inner wall surface of the first processing hole (64). The first electrode (74) is inserted into the first processing hole (64) of the hole (62), and the second electrode (76) is inserted into the second processing hole (66). The insertion portion (80) provided in the portion facing the opening (68) of the second processing hole (66) of (74) is connected to the second electrode (76) via the insulating member (82). A surface treatment method comprising inserting a tip (84). In the surface treatment method of Claim 12,
The first electrode (74) comprises a hollow body having a tubular portion,
The inserted portion (80) comprises a hole penetrating the peripheral wall of the first electrode (74),
In the integration step, the internal thread (82a) formed in the insulating member (82) provided inside the insertion portion (80) and the tip end portion (84) of the second electrode (76). A surface treatment method comprising positioning and fixing the first electrode (74) and the second electrode (76) by screwing a formed male screw (84a). The surface treatment method according to claim 12 or 13,
In the energization step, the first electrode (74) is closed with the first closing portion (42) closing the bottom surface (78) of the first processing hole (64). Energizing the first electrode (74) through a first inner electrode (44) extending in the axial direction inside (74) and electrically connected to the first closing portion (42). A characteristic surface treatment method. A surface treatment method for performing a surface treatment on an inner wall surface of a treatment hole (92) using an electrode (104) comprising a first electrode (110) and a second electrode (112),
An integration step of integrating the first electrode (110) and the second electrode (112) in an electrically insulated state through an insulating member (124) inside the processing hole (92);
An energization step of energizing between the first electrode (110) and the second electrode (112) and the inner wall surface of the processing hole (92) while allowing an electrolytic processing solution to flow through the processing hole (92). When,
Have
The first electrode (110) and the second electrode (112) are hollow bodies having a tubular portion,
In the integration step, the processing hole (92) comprising the bottomed first processing hole (94) and the bottomed second processing hole (96) intersecting the first processing hole (94), After inserting the first electrode (110) having an outer diameter larger than the outer diameter of the second electrode (112) into the first processing hole (94), the second electrode (96) is inserted into the second processing hole (96). 112) and an insertion hole formed in a portion of the first electrode (110) disposed at the intersection (98) of the first processing hole (94) and the second processing hole (96). (120) The surface treatment method, wherein the second electrode (112) is inserted through the insulating member (124). The surface treatment method according to claim 15,
In the integration step, the second electrode (112) is inserted into the second processing hole (96) having a smaller diameter than the first processing hole (94). The surface treatment method according to claim 15 or 16,
The inner diameter of the first electrode (110) is larger than the outer diameter of the second electrode (112),
In the energization step, the first electrode (110) is placed in a state where the closing portion (42) closing the tip of the first electrode (110) faces the bottom surface (100) of the first processing hole (94). Between the inner peripheral surface of the first electrode (112) and the outer peripheral surface of the second electrode (112), extending in the axial direction of the first electrode (110), and the blocking portion (42) of the first electrode (110). The first electrode (110) is energized through an inner electrode (44) that is electrically connected to the surface treatment method. The surface treatment method according to any one of claims 15 to 17,
In the energization step, the second electrode (112) is placed in a state where the closing portion (48) closing the tip of the second electrode (112) faces the bottom surface (102) of the second processing hole (96). The second electrode (112) is energized via an inner electrode (50) that extends in the axial direction and is electrically connected to the closing portion (48) of the second electrode (112). A surface treatment method characterized by the above.

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