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WO2019146004A1 - Dispositif de génération de relation de correspondance - Google Patents

Dispositif de génération de relation de correspondance Download PDF

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Publication number
WO2019146004A1
WO2019146004A1 PCT/JP2018/002026 JP2018002026W WO2019146004A1 WO 2019146004 A1 WO2019146004 A1 WO 2019146004A1 JP 2018002026 W JP2018002026 W JP 2018002026W WO 2019146004 A1 WO2019146004 A1 WO 2019146004A1
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WO
WIPO (PCT)
Prior art keywords
coordinate
substrate
machine
coordinate system
correspondence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/002026
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English (en)
Japanese (ja)
Inventor
郁夫 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Priority to PCT/JP2018/002026 priority Critical patent/WO2019146004A1/fr
Priority to JP2019567434A priority patent/JP7050821B2/ja
Publication of WO2019146004A1 publication Critical patent/WO2019146004A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present specification discloses a technology related to a correspondence generation device.
  • Patent Document 1 discloses a method of creating inspection data of a mounting substrate. Specifically, the method described in Patent Document 1 acquires upstream production data including a part name of a part mounted on a substrate and mounting position data indicating a position where the part should be mounted. And the method of patent document 1 acquires the components data matched with the components name from the components database, and produces the data for a test
  • Patent Document 1 creates inspection data using component data associated with a component name. Therefore, for example, when manufacturers are different in the mounting machine and the inspection machine, and different part names are assigned to the same part, there is a possibility that the correspondence between the part names and the part data becomes difficult.
  • the present specification discloses a correspondence generation device capable of associating position specifying information for specifying a position on a substrate with respect to a target machine on a substrate work line.
  • the present specification discloses a correspondence generation device including a correspondence specifying unit.
  • the correspondence specifying unit performs at least two of the plurality of work machines constituting the board operation line to perform a predetermined operation on the substrate.
  • the position specification information of each of the target machines is associated based on the position coordinates of the substrate.
  • the correspondence definition unit is provided.
  • the correspondence relationship generation device can associate the position specifying information of each of the target machines based on the position coordinates of the substrate.
  • FIG. 6 is a configuration diagram showing an example of the configuration of a work-to-substrate operation line 10L and a management device 20. It is a schematic diagram which shows the example of provision of circuit number R11, C13, S13 in the component mounting machine 10c. It is a schematic diagram which shows the example of provision of circuit number R11-1, C13-1, and S13-1 in the external appearance inspection machine 10d. It is a schematic diagram which shows the example of provision of board numbers B1-B4 of split board MB1 in the component mounting machine 10c. It is a schematic diagram which shows the example of provision of board numbers B1-B4 of split board MB1 in appearance inspection machine 10d. FIG.
  • 16 is a schematic view showing an example of application of circuit numbers R11-1 to R11-4, C13-1 to C13-4, and S13-1 to S13-4 when board numbers B1 to B4 are not applied in the appearance inspection machine 10d.
  • 5 is a flowchart showing an example of a control procedure by the correspondence relationship generation device 30. It is a schematic diagram which shows the example of arrangement
  • FIG. 7 is a schematic view showing an example of an overlapping state of pad areas indicated by pad information PA1 to PC6 and circumscribed rectangles circumscribing each of parts P1 to P3. It is a schematic diagram which shows an example of correspondence CP4 of board number B1.
  • Embodiment 1-1 To board operation line 10L
  • the substrate work line 10L performs a predetermined work on the substrate 90.
  • the type and number of the work machines 10 constituting the substrate work line 10L are not limited.
  • the work-to-substrate operation line 10L includes a plurality of (four) working machines 10 including a printing machine 10a, a printing inspection machine 10b, a component mounting machine 10c and an appearance inspection machine 10d. There is.
  • the plurality of (four) working machines 10 are arranged in order of the printing machine 10a, the printing inspection machine 10b, the component mounting machine 10c, and the appearance inspection machine 10d from the upstream side.
  • the substrate 90 is carried into the printing machine 10a positioned at the top of the substrate work line 10L. Then, the substrate 90 is transported downstream by a substrate transfer device (not shown) of the substrate work line 10L, and carried out of the appearance inspection machine 10d located at the end of the substrate work line 10L.
  • the printing machine 10a prints solder at the mounting positions of the parts P1 to P3 on the substrate 90.
  • the solder printed on the substrate 90 is paste-like and has a predetermined viscosity.
  • the solder functions as a bonding material for bonding the substrate 90 and the components P1 to P3 mounted on the substrate 90.
  • the printing inspection machine 10b inspects the printing condition of the solder printed by the printing machine 10a.
  • the component placement machine 10c places the components P1 to P3 on the solder printed by the printing machine 10a.
  • the number of component placement machines 10c may be one or more. When a plurality of component placement machines 10c are provided, the plurality of component placement machines 10c can share the components P1 to P3.
  • the appearance inspection machine 10d inspects the mounting state of the parts P1 to P3 mounted by the part mounting machine 10c. Specifically, the appearance inspection machine 10d recognizes and manages the mounting state of the components P1 to P3 on the substrate 90, such as the suitability of the components P1 to P3 mounted on the substrate 90 and the mounting position and posture of the components P1 to P3. Send to device 20. As described above, the substrate work line 10L sequentially transports the substrate 90 using a plurality of (four) work machines 10, and executes a production process including an inspection process to produce a substrate product.
  • the substrate work line 10 ⁇ / b> L can include a reflow furnace which is the work machine 10 and a functional inspection machine.
  • the reflow furnace heats the substrate 90 on which the components P1 to P3 are mounted by the component mounting machine 10c, melts the solder, and performs soldering.
  • the functional inspection machine performs functional inspection of the soldered substrate 90 by a reflow furnace.
  • the configuration of the work-to-substrate work line 10L can be appropriately changed depending on, for example, the type of the substrate product to be produced, and the like.
  • the work-to-substrate work line 10L can also include, for example, a work machine 10 such as a buffer device, a substrate supply device, a substrate reversing device, a shield attachment device, an adhesive application device, and an ultraviolet irradiation device.
  • a work machine 10 such as a buffer device, a substrate supply device, a substrate reversing device, a shield attachment device, an adhesive application device, and an ultraviolet irradiation device.
  • the plurality of (four) work machines 10 and the management device 20 which constitute the substrate work line 10L are communicably connected.
  • the management device 20 controls a plurality of (four) work machines 10 constituting the substrate work line 10L, and monitors the operation status of the substrate work line 10L.
  • the management device 20 stores various data for controlling a plurality of (four) work machines 10.
  • the management device 20 transmits the data to a plurality of (four) work machines 10.
  • the plurality (four) of work machines 10 configuring the substrate work line 10L transmit the operation status and the production status to the management device 20.
  • the management device 20 creates a control program and printing conditions of the printing machine 10a.
  • the management device 20 creates a control program and inspection conditions of the printing inspection machine 10b.
  • the management device 20 creates a control program of the component placement machine 10c and attachment conditions of the components P1 to P3.
  • the management device 20 creates a control program and inspection conditions of the appearance inspection machine 10d.
  • the control program, the mounting condition, the inspection condition, and the like include position specifying information for specifying the position on the substrate 90.
  • the position specifying information includes, for example, circuit numbers R11, C13, and S13 of circuits formed on the substrate 90.
  • FIG. 2A shows an example of assignment of circuit numbers R11, C13, and S13 in the component placement machine 10c.
  • a plurality of (three) components P1 to P3 are mounted on the substrate 90.
  • the component P1 is mounted at the position specified by the circuit number R11.
  • the component P2 is mounted at the position specified by the circuit number C13.
  • the component P3 is mounted at the position specified by the circuit number S13.
  • an orthogonal coordinate system CS11 is adopted as the coordinate system CS1 of the substrate 90.
  • the positive direction of one coordinate axis (X axis) of the orthogonal coordinate axes is set in the right direction on the sheet, and the positive direction of the other coordinate axis (Y axis) in the orthogonal coordinate axes is set in the upper direction There is.
  • FIG. 2B shows an example of assigning circuit numbers R11-1, C13-1, and S13-1 in the appearance inspection machine 10d.
  • a plurality of (three) components P1 to P3 are attached to the substrate 90.
  • the component P1 is mounted at the position specified by the circuit number R11-1.
  • the component P2 is mounted at the position specified by the circuit number C13-1.
  • the component P3 is mounted at the position specified by the circuit number S13-1.
  • an orthogonal coordinate system CS12 is adopted as the coordinate system CS1 of the substrate 90.
  • the positive direction of one coordinate axis (X axis) of the orthogonal coordinate axes is set in the left direction of the drawing, and the positive direction of the other coordinate axis (Y axis) of the orthogonal coordinate axes is set in the upper direction of the drawing There is.
  • the circuit numbers R11 and R11 between the component placement machine 10c and the appearance inspection machine 10d are different. It is difficult to associate the position on the substrate 90 of the part P1 based on -1. Further, for example, when the coordinate system CS1 is different between the component placement machine 10c and the appearance inspection machine 10d, the position of the component P1 on the substrate 90 is determined based on the position coordinates between the component placement machine 10c and the appearance inspection machine 10d. It is difficult to correspond. What has been described above for the part P1 applies to the parts P2 and P3 as well.
  • FIG. 2C shows an example of giving the board numbers B1 to B4 of the split board MB1 in the component placement machine 10c.
  • a substrate 90 shown in the figure is a split substrate MB1 in which a plurality of (four) unit substrates 91 are connected in a dividable manner.
  • the position specifying information can include, for example, board numbers B1 to B4 specifying each of a plurality (four) of unit substrates 91 in the split substrate MB1.
  • the board number B1 indicates the unit substrate 91 at the upper left of the drawing.
  • the board number B2 indicates the unit substrate 91 at the upper right of the drawing.
  • the board number B3 indicates the unit substrate 91 at the lower left of the drawing.
  • the board number B4 indicates the unit substrate 91 at the lower right of the drawing.
  • Parts P1 to P3 shown in FIG. 2A are attached to each of the plurality (four) of unit substrates 91.
  • FIG. 2D shows an example of giving board numbers B1 to B4 of the split board MB1 in the appearance inspection machine 10d.
  • the substrate 90 is a split substrate MB1 in which a plurality of (four) unit substrates 91 are coupled in a dividable manner.
  • the board number B2 indicates the unit substrate 91 at the lower left of the drawing.
  • the board number B3 indicates the unit substrate 91 at the upper right of the drawing.
  • the arrangement of the unit boards 91 of the board number B1 and the board number B4 is the same as that of FIG. 2C. Parts P1 to P3 shown in FIG. 2A are attached to each of the plurality (four) of unit substrates 91.
  • the position of the unit substrate 91 of the board number B2 in the component mounting machine 10c and the appearance inspection machine is different.
  • the above can be similarly applied to the unit substrate 91 of the board number B3. Therefore, it is difficult to identify the unit substrate 91 between the component placement machine 10c and the appearance inspection machine 10d based on the board numbers B1 to B4 and to associate the positions of the components P1 to P3 in the split substrate MB1. .
  • FIG. 2E shows an example of applying circuit numbers R11-1 to R11-4, C13-1 to C13-4, and S13-1 to S13-4 when the board numbers B1 to B4 are not assigned in the appearance inspection machine 10d.
  • the substrate 90 is a split substrate MB1 in which a plurality of (four) unit substrates 91 are coupled in a dividable manner. Further, components P1 to P3 shown in FIG. 2A are attached to each of the plurality (four) of unit substrates 91. However, board numbers B1 to B4 are not assigned to the split board MB1 shown in FIG. 2E.
  • the component P1 is mounted at the position specified by the circuit number R11-1. In the unit substrate 91 at the upper right of the drawing, the component P1 is mounted at the position specified by the circuit number R11-2. In the unit substrate 91 at the lower left of the drawing, the component P1 is mounted at the position specified by the circuit number R11-3. In the unit substrate 91 at the lower right of the drawing, the component P1 is mounted at the position specified by the circuit number R11-4. What has been described above for the part P1 applies to the parts P2 and P3 as well.
  • board numbers B1 to B4 are given in the component placement machine 10c, but board numbers B1 to B4 are not given in the appearance inspection machine 10d. In this case, it is difficult to identify the unit substrate 91 between the component placement machine 10c and the appearance inspection machine 10d based on the board numbers B1 to B4 and to associate the positions of the components P1 to P3 in the split substrate MB1. is there.
  • the method of providing the position specifying information such as the circuit number described above and the board number of the split board MB1 It is easy to match in 10.
  • the method of providing the position specifying information is different. There is a possibility that they may not match.
  • the correspondence relationship generation device 30 makes it possible to associate the position specifying information for specifying the position on the substrate 90 with respect to the target machine 10TG of the substrate work line 10L.
  • the correspondence relationship generation device 30 includes a correspondence relationship defining unit 32 when considered as a control block.
  • the correspondence relationship generation device 30 further includes a coordinate system setting unit 31.
  • the correspondence relationship generation device 30 of the present embodiment includes a coordinate system setting unit 31 and a correspondence relationship definition unit 32.
  • the coordinate system setting unit 31 and the correspondence relationship defining unit 32 are provided in a control device (not shown) of the management device 20.
  • the correspondence relationship generation device 30 executes control according to the flowchart shown in FIG.
  • the coordinate system setting unit 31 performs the determination shown in step S1. Further, the coordinate system setting unit 31 performs the process shown in step S2.
  • the correspondence definition unit 32 performs the process shown in step S3. When the coordinate system CS1 of the substrate 90 is aligned for each of the target devices 10TG, the coordinate system setting unit 31 can be omitted.
  • Coordinate system setting unit 31 The coordinate system setting unit 31 aligns the coordinate system CS1 of the substrate 90 for each of the target machines 10TG.
  • the target machine 10TG is not limited as long as it is at least two of the plurality of (four) work machines 10 constituting the substrate work line 10L.
  • the target machine 10TG is, for example, a printing inspection machine 10b, a component mounting machine 10c, and an appearance inspection machine 10d.
  • the correspondence relationship generation device 30 is described for two work machines 10, but the correspondence relationship generation device 30 is similarly applied to three or more work machines 10 be able to.
  • the coordinate system CS1 is preferably an orthogonal coordinate system.
  • the coordinate system setting unit 31 is an orthogonal coordinate system in which at least one of the positive direction of one coordinate axis (X axis) of the orthogonal coordinate axes and the positive direction of the other coordinate axis (Y axis) of the orthogonal coordinate axes are different. It is preferable to select one orthogonal coordinate system CS11 from among the above to correct the coordinate system CS1 for at least one work machine 10 having a different coordinate system CS1.
  • an orthogonal coordinate system CS11 is adopted as the coordinate system CS1 of the substrate 90.
  • an orthogonal coordinate system CS12 is adopted as the coordinate system CS1 of the substrate 90.
  • FIG. 4A shows an arrangement example of the orthogonal coordinate system CS11
  • FIG. 4B shows an arrangement example of the orthogonal coordinate system CS12.
  • the coordinate system setting unit 31 aligns the coordinate system CS1 of the substrate 90 with the orthogonal coordinate system CS11.
  • the orthogonal coordinate axes are set such that parts P1 to P3 are included in one quadrant (for example, the first quadrant) of four quadrants formed by the X axis and the Y axis.
  • the coordinate system setting unit 31 determines whether or not the coordinate system CS1 matches (step S1 shown in FIG. 3). For example, a set of coordinate data (X coordinate and Y coordinate) of the parts P1 to P3 in the orthogonal coordinate system CS11 is taken as a first coordinate data group.
  • X coordinate X11 and Y coordinate Y11 shown in FIG. 4A indicate coordinate data of the component P1 (for example, coordinate data of the center of the component P1) in the orthogonal coordinate system CS11.
  • the coordinate system setting unit 31 sets position coordinates specified by coordinate data with the smallest X coordinate among coordinate data of the first coordinate data group as an origin (X coordinate is zero) in the X-axis direction in the orthogonal coordinate system CS11. Temporarily set.
  • the coordinate system setting unit 31 sets position coordinates specified by coordinate data having the smallest Y coordinate among coordinate data of the first coordinate data group as an origin in the Y-axis direction in the orthogonal coordinate system CS11 (Y coordinate is zero). Temporarily set. Thus, the orthogonal coordinate system CS11 shown in FIG. 4A is set.
  • a set of coordinate data (X coordinate and Y coordinate) of the parts P1 to P3 in the orthogonal coordinate system CS12 is taken as a second coordinate data group.
  • X coordinate X12 and Y coordinate Y12 shown in FIG. 4B indicate coordinate data of the part P1 (for example, coordinate data of the center of the part P1) in the orthogonal coordinate system CS12.
  • the coordinate system setting unit 31 sets position coordinates specified by coordinate data with the smallest X coordinate among coordinate data of the second coordinate data group as an origin (X coordinate is zero) in the X-axis direction in the orthogonal coordinate system CS12. Temporarily set.
  • the coordinate system setting unit 31 sets position coordinates specified by coordinate data having the smallest Y coordinate among coordinate data of the second coordinate data group as an origin (Y coordinate is zero) in the Y-axis direction in the orthogonal coordinate system CS12. Temporarily set. Thus, the orthogonal coordinate system CS12 shown in FIG. 4B is set.
  • the coordinate system setting unit 31 calculates an average value (first X coordinate average value) of X coordinates of coordinate data of the parts P1 to P3 included in the first coordinate data group, and is included in the second coordinate data group The average value (second X coordinate average value) of the X coordinates of the coordinate data of the parts P1 to P3 is calculated.
  • the coordinate system setting unit 31 sets the component mounting machine 10c as the target machine 10TG and the appearance inspection machine It is determined that the coordinate system CS1 of the substrate 90 does not match with 10d.
  • the coordinate system setting unit 31 calculates an average value of Y coordinates (first Y coordinate average value) of the coordinate data of the parts P1 to P3 included in the first coordinate data group, and is included in the second coordinate data group.
  • An average value (second Y coordinate average value) of Y coordinates of coordinate data of the components P1 to P3 to be calculated is calculated.
  • the coordinate system setting unit 31 sets the component mounting machine 10c that is the target machine 10TG and the appearance inspection machine It is determined that the coordinate system CS1 of the substrate 90 does not match with 10d.
  • the predetermined value can be, for example, zero.
  • the predetermined value may be, for example, an offset value at the center of the components P1 to P3.
  • the positive direction (right direction in the drawing) of the X axis of the orthogonal coordinate system CS11 and the positive direction (left direction in the drawing) of the X axis of the orthogonal coordinate system CS12 are different.
  • the positive direction of the Y axis of the orthogonal coordinate system CS11 (upward in the plane of the drawing) and the positive direction of the Y axis of the orthogonal coordinate system CS12 coincide with each other.
  • the coordinate system setting unit 31 performs an appearance inspection with the component mounting machine 10c which is the target machine 10TG. It is determined that the coordinate system CS1 of the substrate 90 does not match with the machine 10d.
  • the coordinate system setting unit 31 corrects the coordinate system CS1 (step S2). Then, the control proceeds to step S3.
  • the coordinate system CS1 matches No in step S1
  • the control proceeds to step S3.
  • the coordinate system setting unit 31 differs in at least one of the positive direction of one coordinate axis (X axis) of the orthogonal coordinate axes and the positive direction of the other coordinate axis (Y axis) of the orthogonal coordinate axes.
  • One orthogonal coordinate system CS11 is selected from the orthogonal coordinate systems, and the coordinate system CS1 is corrected for the appearance inspection machine 10d having a different coordinate system CS1.
  • the orthogonal coordinate system includes the orthogonal coordinate system CS11 and the orthogonal coordinate system CS12 described above.
  • the positive direction of one coordinate axis (X axis) of the orthogonal coordinate axes is set to the right direction on the drawing, and the positive direction of the other coordinate axis (Y axis) of the orthogonal coordinate axes is set downward on the drawing Coordinate system is included.
  • the positive direction of one coordinate axis (X axis) of the orthogonal coordinate axes is set to the left in the drawing, and the positive direction of the other coordinate axis (Y axis) of the orthogonal coordinate axes is set in the lower on the drawing Coordinate system is included. That is, the orthogonal coordinate system includes four types of orthogonal coordinate systems. Further, assuming orthogonal coordinate axes in which the names (labeling) of the X axis and the Y axis are interchanged, eight orthogonal coordinate systems are included in the orthogonal coordinate system.
  • the coordinate system setting unit 31 sets an arbitrary orthogonal coordinate system (except for the orthogonal coordinate system currently set) out of four types of orthogonal coordinate systems or eight types of orthogonal coordinate systems for the appearance inspection machine 10d. select. Similarly, the coordinate system setting unit 31 temporarily sets an origin (X coordinate is zero) in the X axis direction and provisionally sets an origin (Y coordinate is zero) in the Y axis direction for the selected orthogonal coordinate system. Further, the coordinate system setting unit 31 determines, for the selected orthogonal coordinate system, the difference (absolute value) between the first X coordinate average value and the second X coordinate average value, the first Y coordinate average value, and the second Y coordinate average value. Calculate the difference (absolute value) with.
  • the coordinate system setting unit 31 determines that the difference (absolute value) between the first X coordinate average value and the second X coordinate average value is less than or equal to a predetermined value, and the first Y coordinate average value and the second Y coordinate average value. The selection of the Cartesian coordinate system is repeated until the difference (absolute value) of s. The coordinate system setting unit 31 determines that the difference (absolute value) between the first X coordinate average value and the second X coordinate average value is equal to or less than a predetermined value, and the first Y coordinate average value and the second Y coordinate average value. It can be determined that the coordinate system CS1 is corrected to the Cartesian coordinate system CS11 when the difference (absolute value) of is smaller than a predetermined value.
  • the coordinate system setting unit 31 determines the temporary origin in the X-axis direction (X coordinate is zero) at this time as the origin in the X-axis direction (X coordinate is zero), and the temporary in this Y-axis direction.
  • the origin (Y coordinate is zero) is determined as the origin in the Y axis direction (Y coordinate is zero).
  • the correspondence relationship generation device 30 includes the coordinate system setting unit 31. Accordingly, when the work machine 10 having a different coordinate system CS1 is included in the target machine 10TG, the correspondence relationship generation device 30 can align the coordinate system CS1 of the substrate 90 for each of the target machines 10TG.
  • the coordinate system setting unit 31 is an orthogonal coordinate system in which at least one of the positive direction of one coordinate axis (X axis) of the orthogonal coordinate axes and the positive direction of the other coordinate axis (Y axis) of the orthogonal coordinate axes are different.
  • the coordinate system CS1 of at least one work machine 10 having a different coordinate system CS1 is corrected.
  • the correspondence relationship generation device 30 can easily align the coordinate system CS1 of the substrate 90.
  • the coordinate system setting unit 31 can derive, for example, a first number sequence in which coordinate data of the parts P1 to P3 included in the first coordinate data group are arranged in ascending order or descending order of X coordinates. When coordinate data having the same X-coordinate value exists, the coordinate system setting unit 31 arranges the coordinate data having the same X-coordinate in the ascending order or the descending order of the Y coordinate. Similarly, the coordinate system setting unit 31 can derive, for example, a second number sequence in which coordinate data of the parts P1 to P3 included in the second coordinate data group are arranged in the ascending order or the descending order of the X coordinate.
  • the coordinate system setting unit 31 arranges the coordinate data having the same X-coordinate in the ascending order or the descending order of the Y coordinate. However, when arranging coordinate data in the ascending order of X coordinates in the first number sequence, the coordinate system setting unit 31 arranges coordinate data in the ascending order of X coordinates in the second number sequence. When arranging coordinate data in the descending order of X coordinates in the first number sequence, the coordinate system setting unit 31 arranges the coordinate data in the descending order of X coordinates in the second number sequence. The same applies to the case where the coordinate data having the same X coordinate is arranged in the ascending order or the descending order of the Y coordinate.
  • the coordinate system setting unit 31 determines, for example, the difference between the X coordinate of the coordinate data of the first term (first term) of the first sequence and the X coordinate of the coordinate data of the first term (first term) of the second sequence When the value) exceeds the predetermined value, it is determined that the coordinate system CS1 of the substrate 90 does not match between the component placement machine 10c which is the target machine 10TG and the appearance inspection machine 10d. Similarly, the coordinate system setting unit 31 determines that the difference (absolute value) between the Y coordinate of the coordinate data of the first term of the first number sequence and the Y coordinate of the coordinate data of the first term of the second number sequence exceeds a predetermined value.
  • the coordinate system setting unit 31 can similarly determine the incoincidence of the coordinate system CS1 with respect to coordinate data of the second term and thereafter of the first number sequence and the second number sequence.
  • the predetermined value can be, for example, zero. Also, the predetermined value may be, for example, an offset value at the center of the components P1 to P3.
  • the coordinate system setting unit 31 selects one of four orthogonal coordinate systems or eight orthogonal coordinate systems in the same manner as the example described above. An arbitrary orthogonal coordinate system (excluding the currently set orthogonal coordinate system) is selected, and the above-described processing and determination are performed.
  • the coordinate system setting unit 31 sets the coordinate system CS1 to the orthogonal coordinate system CS11 when predetermined conditions are satisfied for all coordinate data (all natural numbers K from 1 to the number of elements in the first number sequence and the second number sequence). It can be judged that it was corrected.
  • the predetermined condition is that the difference (absolute value) between the X coordinate of the coordinate data of the K th term of the first number sequence and the X coordinate of the coordinate data of the K th term of the second number sequence is a predetermined value or less
  • the difference (absolute value) between the Y-coordinate of the coordinate data of the K-th term of the number sequence and the Y-coordinate of the coordinate data of the K-th term of the second number sequence is less than a predetermined value.
  • Correspondence setting part 32 The correspondence defining unit 32 associates each piece of position specifying information of the target machine 10TG with each other based on the position coordinate of the substrate 90 (step S3 shown in FIG. 3). The correspondence defining unit 32 determines the position of the component placement machine 10c when the position coordinates of the component placement machine 10c and the position coordinates of the appearance inspection machine 10d are included in the predetermined coordinate range CR1 at the predetermined position Q1 of the substrate 90. It is preferable to associate specific information with position specification information in the appearance inspection machine 10d.
  • the coordinate range CR1 can be set, for example, slightly larger than the outer shape of the part P1. Further, the coordinate range CR1 can be set to overlap, for example, at least a part of the solder print area (pad area) of the component P1. As shown in FIG. 4A, for example, the predetermined position Q1 is set as the center of the component P1 (X coordinate X11 and Y coordinate Y11). At this time, position coordinates (X coordinate X11 and Y coordinate Y11) in the component mounting machine 10c and position coordinates (X coordinate X11 and Y coordinate Y11) in the appearance inspection machine 10d are included in the coordinate range CR1.
  • the correspondence specifying unit 32 associates the position specifying information (for example, circuit number R11) in the component placement machine 10c with the position specifying information (for example, circuit number R11-1) in the appearance inspection machine 10d.
  • the position coordinates of the appearance inspection machine 10d are corrected from the X coordinate X12 to the X coordinate X11 shown in FIG. 4B as the coordinate system CS1 is corrected from the orthogonal coordinate system CS12 to the orthogonal coordinate system CS11, to FIG. 4B.
  • the Y coordinate Y12 shown is corrected to the Y coordinate Y11.
  • the correspondence defining unit 32 determines the position of the component placement machine 10c when the position coordinates of the component placement machine 10c and the position coordinates of the appearance inspection machine 10d are included in the predetermined coordinate range CR3 with respect to the predetermined position Q3 of the substrate 90.
  • the specific information (for example, circuit number S13) is associated with the position specifying information (for example, circuit number S13-1) in the appearance inspection machine 10d.
  • the coordinate range CR2 and the coordinate range CR3 can be set in the same manner as the coordinate range CR1.
  • the correspondence defining unit 32 determines, for the predetermined position Q1 of the substrate 90, the position coordinates of one of the target machine 10TG in the work machine 10 and the position coordinates of the other work machine 10 in the target machine 10TG. Is included in the predetermined coordinate range CR1, the position specifying information of one work machine 10 can be associated with the position specifying information of another work machine 10. The correspondence specifying unit 32 can associate the position specifying information with the predetermined position Q2 and the predetermined position Q3 in the same manner.
  • the position specifying information preferably includes circuit numbers R11, C13, S13, R11-1, C13-1, and S13-1 of circuits formed on the substrate 90.
  • FIG. 5 shows an example of the correspondence relationship CP1.
  • the correspondence CP1 associates the circuit numbers R11, C13, and S13 in the component placement machine 10c with the circuit numbers R11-1, C13-1, and S13-1 in the appearance inspection machine 10d.
  • the circuit number R11 in the component placement machine 10c is associated with the circuit number R11-1 in the appearance inspection machine 10d by the correspondence CP1.
  • the circuit number C13 in the component placement machine 10c is associated with the circuit number C13-1 in the appearance inspection machine 10d by the correspondence CP1.
  • the circuit number S13 in the component placement machine 10c is associated with the circuit number S13-1 in the appearance inspection machine 10d by the correspondence relationship CP1.
  • the position specifying information is a board number B1 to B4 for specifying each of the plurality (four) of unit substrates 91 in the split substrate MB1, and a circuit formed on each of the plurality (four) of unit substrates 91. It is preferable that at least the circuit numbers R11, C13, and S13 among the circuit numbers R11, C13, and S13 be included.
  • FIG. 6A shows an example of the correspondence CP2 in the split board MB1.
  • Correspondence CP2 in the same figure associates the board numbers B1 to B4 and the circuit numbers R11, C13, and S13 in the component mounting machine 10c with the board numbers B1 to B4 and the circuit numbers R11, C13, and S13 in the appearance inspection machine 10d. ing.
  • the board number B1 and the circuit number R11 in the component placement machine 10c are associated with the board number B1 and the circuit number R11 in the appearance inspection machine 10d by the correspondence CP2.
  • the board number B1 and the circuit number C13 in the component placement machine 10c are associated with the board number B1 and the circuit number C13 in the appearance inspection machine 10d by the correspondence CP2.
  • the board number B1 and the circuit number S13 in the component placement machine 10c are associated with the board number B1 and the circuit number S13 in the appearance inspection machine 10d by the correspondence CP2. What has been described above for the board number B1 is also applicable to the board numbers B2 to B4.
  • FIG. 6B illustrates an example of the correspondence relationship CP3 in the split board MB1.
  • the correspondence CP3 in the figure is the board numbers B1 to B4 and the circuit numbers R11, C13, and S13 in the component placement machine 10c, and the circuit numbers R11-1 to R11-4, C13-1 to C13-4 in the appearance inspection machine 10d. , S13-1 to S13-4.
  • the board number B1 and the circuit number R11 in the component placement machine 10c are associated with the circuit number R11-1 in the appearance inspection machine 10d by the correspondence CP3.
  • the board number B1 and the circuit number C13 in the component placement machine 10c are associated with the circuit number C13-1 in the appearance inspection machine 10d by the correspondence CP3.
  • the board number B1 and the circuit number S13 in the component placement machine 10c are associated with the circuit number S13-1 in the appearance inspection machine 10d by the correspondence CP3. What has been described above for the board number B1 is also applicable to the board numbers B2 to B4.
  • the position specifying information includes pad information PA1 to PL6 specifying the printed area of the solder on the substrate 90.
  • FIG. 7A shows an example of provision of pad information PA1 to PL6 in the printing inspection machine 10b.
  • FIG. 7B shows planar shapes of the components P1 to P3 and application examples of the circuit numbers R11, C13, and S13 in the component mounting machine 10c.
  • FIG. 7C shows an example of an overlapping state of the pad area indicated by the pad information PA1 to PC6 and the circumscribed rectangle circumscribing each of the parts P1 to P3.
  • the substrate 90 shown in FIGS. 7A and 7B is a split substrate MB1 in which a plurality (four) of unit substrates 91 are splitably coupled. Parts P1 to P3 shown in FIG. 4A are attached to each of the plurality (four) of unit substrates 91.
  • the component P1 of the circuit number R11 of the board number B1 is attached to the position specified by the pad information PA1 and the pad information PA2.
  • the component P2 of the circuit number C13 of the board number B1 is attached to the position specified by the pad information PB1 and the pad information PB2.
  • the component P3 of the circuit number S13 of the board number B1 is attached to the position specified by the pad information PC1 to the pad information PC6. What has been described above for the board number B1 is also applicable to the board numbers B2 to B4.
  • a part of the pad area indicated by the pad information PA1 and the pad information PA2 overlaps the circumscribed rectangle SH1 circumscribing the part P1. Therefore, the position where the component P1 is mounted on the substrate 90 can be specified by the pad information PA1 and the pad information PA2.
  • the coordinate range CR1 shown in FIG. 4A can be set to overlap at least a part of the pad area indicated by the pad information PA1 and the pad information PA2.
  • a part of the pad area indicated by the pad information PB1 and the pad information PB2 overlaps the circumscribed rectangle SH2 circumscribing the part P2.
  • a part of the pad area indicated by the pad information PC1 to pad information PC6 overlaps the circumscribed rectangle SH3 circumscribing the part P3.
  • FIG. 8 shows an example of the correspondence CP4 of the board number B1.
  • the correspondence CP4 in FIG. 6 associates the pad information PA1 to the pad information PC6 in the printing inspection machine 10b with the board number B1 and the circuit numbers R11, C13, and S13 in the component mounting machine 10c.
  • the pad information PA1 and the pad information PA2 in the printing inspection machine 10b are associated with the board number B1 and the circuit number R11 in the component mounting machine 10c by the correspondence CP4.
  • the pad information PB1 and the pad information PB2 in the printing inspection machine 10b are associated with the board number B1 and the circuit number C13 in the component mounting machine 10c by the correspondence CP4.
  • the pad information PC1 to pad information PC6 in the printing inspection machine 10b are associated with the board number B1 and the circuit number S13 in the component mounting machine 10c by the correspondence CP4. What has been described above for the board number B1 is also applicable to the board numbers B2 to B4.
  • the correspondence defining unit 32 can associate the pad information of one work machine 10 with the board number and the circuit number of another work machine 10.
  • the correspondence defining unit 32 can also associate the pad information of one work machine 10 with the pad information of another work machine 10.
  • the correspondence defining unit 32 can also associate the pad information in one work machine 10 with the circuit number in the other work machine 10.
  • the correspondence defining unit 32 can associate the pad information in one work machine 10 with the circuit number in the other work machine 10.
  • the correspondence relationship creation device 30 can be used, for example, when tracing (tracking) at least one of the operation status and the production status of the target machine 10TG on the board work line 10L.
  • tracing tilting
  • the method of giving circuit numbers for example, circuit number R11 and circuit number R11-1
  • the operator performing tracing performs tracing by correlating the circuit number R11 in the component mounting machine 10c with the circuit number R11-1 in the appearance inspection machine 10d using the correspondence CP1 shown in FIG. be able to.
  • the control performed by the coordinate system setting unit 31 corresponds to a coordinate system setting process. That is, the coordinate system setting step is a step of aligning the coordinate system CS1 of the substrate 90 for each of the target machines 10TG.
  • the coordinate system setting step at least one of the positive direction of one coordinate axis (X axis) of the orthogonal coordinate axes and the positive direction of the other coordinate axis (Y axis) of the orthogonal coordinate axes is different from among orthogonal coordinate systems It is preferable to select one orthogonal coordinate system CS11 and correct the coordinate system CS1 for at least one work machine 10 having a different coordinate system CS1.
  • the control performed by the correspondence relation defining unit 32 corresponds to a correspondence relation defining step. That is, the correspondence relationship defining step is a step of associating the position specifying information of each of the target machine 10 TG based on the position coordinates of the substrate 90.
  • the correspondence relationship defining step for the predetermined position Q1 of the substrate 90, the position coordinate of one of the target machine 10TG in the work machine 10 and the position coordinate of another work machine 10 in the target machine 10TG are within a predetermined coordinate range It is preferable that, when included in the CR 1, the process of associating the position specifying information of one work machine 10 with the position specifying information of another work machine 10.
  • the correspondence defining step is preferably a step of associating the position specifying information in the same manner for the predetermined position Q2 and the predetermined position Q3. Also in the correspondence relationship generating method, the same action and effect as the action and effect of the correspondence relationship generating device 30 can be obtained.
  • the correspondence relationship generation device 30 of the present embodiment the correspondence relationship defining unit 32 is provided. As a result, the correspondence relationship generation device 30 can associate the position specifying information of each of the target machines 10TG with each other based on the position coordinates of the substrate 90.
  • 10 Work machine, 10 L: Board to substrate work line, 10 TG: Target machine, 10a: printing machine, 10b: printing inspection machine, 10c: component mounting machine, 10d: appearance inspection machine, 30: Correspondence relationship generation device, 31: coordinate system setting unit, 32: correspondence relationship defining unit, 90: Substrate, 91: Unit substrate, MB 1: Split substrate, R11, C13, S13: Circuit number, R11-1, C13-1, S13-1: Circuit number, B1 to B4: board number, PA1 to PL6: pad information, CS1: coordinate system, CS11: orthogonal coordinate system, CR1 to CR3: Coordinate range, P1 to P3: parts, Q1 to Q3: predetermined positions.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention concerne un dispositif de génération de relation de correspondance, qui comprend une unité d'établissement de relation de correspondance. Lorsque des informations spécifiant une position sur une plaque de support doivent être adoptées en tant qu'informations de spécification de position, l'unité d'établissement de relation de correspondance établit, sur la base des coordonnées de la position sur la plaque de base, une correspondance entre des informations respectives de spécification de position provenant de machines d'intérêt, qui représentent au moins deux machines de traitement parmi une pluralité de machines de traitement constituant une chaîne de traitement de plaques de support servant à effectuer un traitement prédéfini sur la plaque de support.
PCT/JP2018/002026 2018-01-23 2018-01-23 Dispositif de génération de relation de correspondance Ceased WO2019146004A1 (fr)

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PCT/JP2018/002026 WO2019146004A1 (fr) 2018-01-23 2018-01-23 Dispositif de génération de relation de correspondance
JP2019567434A JP7050821B2 (ja) 2018-01-23 2018-01-23 対応関係生成装置

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JP2021150495A (ja) * 2020-03-19 2021-09-27 Juki株式会社 生産システム
CN116242288A (zh) * 2022-12-28 2023-06-09 广东辰奕智能科技股份有限公司 一种机械设备之间衔接快速定位方法

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JPH05226895A (ja) * 1992-02-14 1993-09-03 Citizen Watch Co Ltd 電子部品装着装置の部品装着位置指定方法
JP2001244695A (ja) * 2000-03-01 2001-09-07 Matsushita Electric Ind Co Ltd 基板加工装置
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JPWO2021144981A1 (fr) * 2020-01-17 2021-07-22
WO2021144981A1 (fr) * 2020-01-17 2021-07-22 株式会社Ｆｕｊｉ Dispositif et procédé d'inspection
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