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WO2019033856A1 - 一种掩膜版、oled显示基板、显示装置及制作方法 - Google Patents

一种掩膜版、oled显示基板、显示装置及制作方法 Download PDF

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Publication number
WO2019033856A1
WO2019033856A1 PCT/CN2018/093290 CN2018093290W WO2019033856A1 WO 2019033856 A1 WO2019033856 A1 WO 2019033856A1 CN 2018093290 W CN2018093290 W CN 2018093290W WO 2019033856 A1 WO2019033856 A1 WO 2019033856A1
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WIPO (PCT)
Prior art keywords
retaining wall
mask
substrate
disposed
oled display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/093290
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English (en)
French (fr)
Inventor
韩明昆
胡岩
袁洪光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US16/335,514 priority Critical patent/US10991884B2/en
Publication of WO2019033856A1 publication Critical patent/WO2019033856A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a mask, an OLED display substrate, a display device, and a method of fabricating the same.
  • OLED Organic Electroluminescent Diode
  • OLED display devices with their unique advantages, such as fast response, full curing, self-illumination, etc., have received much attention in the market.
  • the application of OLED display devices is also very diverse, and flexible display, transparent display and micro display have the appearance of OLED display devices.
  • an OLED display device generally uses an FMM (Fine Metal Mask) to vapor-deposit organic light of R (red), B (blue), and G (green) sub-pixels respectively in an opening region defined by a PDL (pixel defining layer).
  • the material is formed to form a light-emitting layer.
  • the vapor flow of the organic light-emitting material is likely to flow to other PDL open areas, thereby causing poor color mixing and affecting the display effect of the OLED display device.
  • the present disclosure provides a mask version comprising:
  • the mask version is provided with a plurality of openings, and the plurality of openings are arranged in a matrix manner;
  • first retaining wall disposed on the mask version body, the first retaining wall is disposed adjacent to the opening, and at least a portion of the first retaining wall is disposed in an adjacent row or an adjacent column of the opening between.
  • the first retaining wall is annular and surrounds at least one opening on the mask version.
  • the first retaining wall surrounds an opening on the mask version body, and the opening of the opening and the area surrounding the first retaining wall coincides with an orthographic projection on the mask version body.
  • the first retaining wall surrounds a plurality of openings on the mask version body, and the plurality of openings are located on an orthographic projection of the area surrounding the first retaining wall on the mask version body. within.
  • the first retaining wall is in the form of a strip, and the first retaining wall is disposed between the two adjacent rows or columns of the openings;
  • the length of the first retaining wall in the row direction is greater than or equal to the sum of the lengths of the rows of openings in the row direction;
  • the length of the first retaining wall in the column direction is greater than or equal to the sum of the lengths of the columns in the column direction.
  • the first retaining wall includes a plurality of first sub-retaining walls spaced apart from each other; wherein
  • first sub-retaining wall Two rows of the first sub-retaining wall are disposed between the adjacent two rows of openings, and each of the first sub-retaining walls has a length in a row direction greater than or equal to a length of a row corresponding thereto in a row direction; or
  • Two rows of the first sub-retaining walls are disposed between the two adjacent rows of openings, and the length of each of the first sub-retaining walls in the column direction is greater than or equal to the length of the corresponding opening in the column direction.
  • the material used for the first retaining wall is a photoresist.
  • the present disclosure also provides a method for fabricating a mask for fabricating a mask as described above, the method comprising:
  • the mask version body is provided with a plurality of openings, and the plurality of openings are arranged in a matrix;
  • first retaining wall Forming a first retaining wall on the mask version body, the first retaining wall is disposed adjacent to the opening, and at least a portion of the first retaining wall is disposed between adjacent rows or adjacent columns .
  • the step of forming the first retaining wall on the mask version body includes:
  • the photoresist layer is patterned to form the first barrier.
  • the present disclosure also provides a method for fabricating an organic electroluminescent diode OLED display substrate, including:
  • the first color, the second color, and the third color can be mixed into white light.
  • the present disclosure also provides an OLED display substrate fabricated by the method described above.
  • the present disclosure also provides an OLED display substrate, including:
  • a pixel defining layer disposed on the substrate substrate, the pixel defining layer defining a plurality of open regions, wherein the plurality of open regions are arranged in a matrix manner;
  • a second retaining wall disposed on the pixel defining layer, the second retaining wall is disposed adjacent to the open area, and at least a portion of the second retaining wall is disposed in the opening of an adjacent row or adjacent column Between the districts.
  • the second retaining wall is annular and defines at least one open area on the layer surrounding the pixel.
  • the second retaining wall surrounds an open area on the pixel defining layer, and an orthographic projection of the open area on the base substrate and an area surrounded by the second retaining wall are The orthographic projections on the base substrate coincide.
  • the second retaining wall defines a plurality of open areas on the pixel surrounding the pixel, and an orthographic projection of the plurality of open areas on the base substrate is located in an area surrounded by the second retaining wall Within the orthographic projection on the substrate.
  • the second retaining wall has an elongated strip shape, and two second retaining walls are disposed between the adjacent two or two rows of the open areas;
  • the length of the second retaining wall in the row direction is greater than or equal to the sum of the lengths of the open regions of each row in the row direction;
  • the length of the second retaining wall in the column direction is greater than or equal to the sum of the lengths of the open regions of each column in the column direction.
  • the second retaining wall includes a plurality of second sub-retaining walls spaced apart from each other; wherein
  • Two rows of the second sub-retaining wall are disposed between the adjacent two rows of the open areas, and the length of each of the second sub-retaining walls in the row direction is greater than or equal to the length of the corresponding open area in the row direction; or
  • Two rows of the second sub-retaining walls are disposed between the adjacent two rows of the open areas, and the length of each of the second sub-retaining walls in the column direction is greater than or equal to the length of the corresponding open area in the column direction.
  • the present disclosure also provides an OLED display device including the OLED display substrate as described above.
  • the present disclosure also provides a method for fabricating an OLED display substrate for fabricating the OLED display substrate as described above, including:
  • the pixel defining layer Forming a pixel defining layer on the base substrate, the pixel defining layer defining a plurality of open regions, the plurality of openings being arranged in a matrix manner;
  • the second retaining wall is disposed adjacent to the open area, and at least a portion of the second retaining wall is disposed in the open area of an adjacent row or adjacent column between.
  • FIG. 1 is a top plan view of a mask of some embodiments of the present disclosure.
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
  • FIG. 3 is a top plan view of a reticle of some embodiments of the present disclosure.
  • FIG. 4 is a top plan view of a reticle of some embodiments of the present disclosure.
  • Figure 5 is a top plan view of a mask of some embodiments of the present disclosure.
  • 6-8 are schematic views of a method of fabricating a mask according to some embodiments of the present disclosure.
  • 9-11 are schematic diagrams showing a method of fabricating an OLED display substrate according to some embodiments of the present disclosure.
  • FIG. 12 is a top plan view of an OLED display substrate according to some embodiments of the present disclosure.
  • FIG. 13 is a top plan view of an OLED display substrate according to some embodiments of the present disclosure.
  • FIG. 14 is a top plan view of an OLED display substrate in accordance with some embodiments of the present disclosure.
  • FIG. 15 is a top plan view of an OLED display substrate in accordance with some embodiments of the present disclosure.
  • Some embodiments of the present disclosure provide a mask, including:
  • the mask version is provided with a plurality of openings, and the plurality of openings are arranged in a matrix manner;
  • first retaining wall disposed on the mask version body, the first retaining wall being disposed adjacent to the opening and disposed at least between the two adjacent openings of adjacent rows or adjacent columns.
  • a first retaining wall is disposed in a peripheral region of the opening of the mask version body, and when the luminescent layer of the OLED display substrate is formed by vapor deposition using the mask, on the one hand, the first retaining wall can abut Between the mask version body and the OLED display substrate, the role of supporting the mask version body; on the other hand, the first retaining wall can also block the flow of the organic light material vapor to the other PDL opening areas of the OLED display substrate, avoiding Poor color mixing occurs, improving the display effect of the OLED display device; on the other hand, the OLED display substrate does not need to be provided with a similar retaining wall, which saves the material of the OLED display substrate and reduces the spacing layer between the light emitting layers.
  • the thickness improves the flatness of the OLED display substrate, so that when the cathode is subsequently formed, the cathode layer is prevented from being broken due to the too thick spacer layer. Meanwhile, when the OLED display substrate is packaged by the thin film encapsulation layer, the spacer layer can be prevented from being too thick. The risk of cracking the package film.
  • FIG. 1 is a plan view of a mask according to some embodiments of the present disclosure
  • FIG. 2 is a cross-sectional view taken along line A-A of FIG.
  • Masks in some embodiments of the present disclosure include:
  • the mask version body 10 is provided with a plurality of openings 11 arranged in a matrix manner;
  • first retaining wall 20 disposed on the mask version 10
  • the first retaining wall 20 is annular, and each annular first retaining wall 20 corresponds to an opening 11 in the mask version 10 And disposed around the corresponding opening 11.
  • the annular first barrier 20 when the luminescent layer of the OLED display substrate is formed by vapor deposition using the mask, the annular first barrier 20 can abut between the mask version 10 and the OLED display substrate. To support the role of the mask version body 10, at the same time, the annular first barrier wall 20 can also block the flow of the organic light-emitting material vapor to other PDL opening areas of the OLED display substrate in an all-round manner, thereby avoiding occurrence of poor color mixing and improving OLED. Display the display effect of the device.
  • the orthographic projection of the opening of the annular first retaining wall 20 on the mask version body 10 coincides with the corresponding opening 11 on the mask version body 10, that is, the ring
  • the edge of the opening of the first retaining wall 20 coincides with the edge of the corresponding opening 11 on the mask version 10 so that the flow of organic luminescent material vapor can be better defined within the corresponding opening 11.
  • the annular first retaining wall may also be disposed not adjacent to the corresponding opening on the mask version, but to a certain distance from the corresponding opening.
  • each annular first retaining wall 20 corresponds to an opening 11.
  • each annular first retaining wall may also correspond to at least a mask version. Two openings, that is, each annular first retaining wall is disposed around at least two openings on the mask version body, for example, each annular first retaining wall corresponds to a row or a row of openings on the mask version body, ie Each annular first retaining wall is disposed around a row or a row of openings on the mask version. Referring to FIG. 3, in the embodiment shown in FIG. 3, each annular first retaining wall 20 corresponds to the mask version 10 An upper row of openings 11 is provided around an array of openings 11.
  • the annular first retaining wall is a row or a row of openings, which is related to the arrangement of the light emitting layers on the OLED display substrate. If the colors of the different light emitting layers on the OLED display substrate are different, the annular first retaining wall 20 corresponds to a row of openings. If the colors of the different rows of the light-emitting layers on the OLED display substrate are different, the annular first retaining wall 20 corresponds to one row of openings. In some embodiments of the present disclosure, since it is not necessary to make a corresponding annular first retaining wall for each opening, the manufacturing difficulty of the annular first retaining wall 20 can be reduced.
  • FIG. 4 is a top view of a mask according to some embodiments of the present disclosure.
  • the mask in some embodiments of the present disclosure includes:
  • the mask version body 10 is provided with a plurality of openings 11 arranged in a matrix manner;
  • first retaining wall 20 disposed on the mask version 10
  • the first retaining wall 20 is elongated, disposed between the adjacent two rows of the openings 11, and the adjacent two columns are Two first retaining walls 20 are disposed between the openings 11, and each of the first retaining walls 20 is disposed adjacent to the opening 11 adjacent thereto.
  • the first barrier wall 20 having an elongated shape can abut between the mask version body 10 and the OLED display substrate.
  • the function of supporting the mask version body 10, at the same time, the elongated first wall 20 can also block the flow of the organic light-emitting material vapor to the PDL opening area of the adjacent column of the OLED display substrate, thereby avoiding the occurrence of poor color mixing. Improve the display effect of the OLED display device.
  • the length of the elongated first retaining wall is greater than or equal to the total length of the corresponding row of openings, so that one side of the row of openings can be completely blocked, and the illuminating of the OLED display substrate is evaporated.
  • the organic luminescent material is prevented from diffusing toward one side of the opening.
  • the elongated first wall 20 corresponds to a row of openings and is disposed between the adjacent two rows of the openings 11.
  • the first-shaped barrier wall of the strip shape is corresponding to one row of openings, and is disposed in two adjacent rows of the openings. Between the two adjacent rows of the openings, two first retaining walls are disposed, and each of the first retaining walls is disposed adjacent to the opening adjacent thereto.
  • the edges of the elongated first retaining wall adjacent the corresponding openings coincide with the edges of the corresponding openings to better define the flow of organic luminescent material vapor within the corresponding openings.
  • the elongated first retaining wall may also be disposed not adjacent to the corresponding opening on the mask version, but to a certain distance from the corresponding opening.
  • FIG. 5 is a top view of a mask according to some embodiments of the present disclosure.
  • the strip-shaped first retaining wall includes a plurality of spaced intervals.
  • a short strip of the first sub-retaining wall 201 That is, two opposite strips of the first sub-retaining wall 201 are disposed on opposite sides of each opening 11.
  • the first sub-retaining wall 20 is disposed adjacent to the opening 11 and is disposed in two adjacent columns. Between the openings 11.
  • the first sub-retaining walls 201 of the short strips are disposed between the two adjacent openings 11 of the adjacent columns.
  • the strip-shaped first sub-retaining walls 201 are disposed between the two adjacent openings of the adjacent rows.
  • the length of the short strip-shaped first sub-retaining wall is greater than or equal to the length of the corresponding opening in the extending direction of the short strip-shaped first sub-retaining wall, so that the corresponding opening can be One side is completely blocked, and when the luminescent layer of the OLED display substrate is vapor-deposited, the organic luminescent material is prevented from diffusing toward one side of the opening.
  • the material used for the first retaining wall may be a photoresist, so that patterning can be conveniently performed by an exposure process.
  • the first retaining wall is also not excluded from being made of other materials.
  • Some embodiments of the present disclosure further provide a method for fabricating a mask for fabricating the mask in any of the above embodiments, the method comprising:
  • Step 101 providing a mask version, the mask version is provided with a plurality of openings, and the plurality of openings are arranged in a matrix;
  • Step 102 Form a first retaining wall on the mask version body, the first retaining wall is disposed adjacent to the opening, and is disposed at least between two adjacent openings of adjacent rows or adjacent columns.
  • the first retaining wall can be formed by patterning on the existing fine metal mask version by an exposure process.
  • the step of forming a first retaining wall on the mask version body includes:
  • Step 1021 forming a photoresist layer on the mask version body
  • Step 1022 pattern the photoresist layer to form the first retaining wall.
  • the first retaining wall is made by using the photoresist commonly used in the exposure process, which can save materials and has a simple manufacturing process.
  • the method for fabricating the mask includes:
  • Step 201 After the mask version is finished, the cleaning is performed. Please refer to FIG. 6.
  • FIG. 6 is a mask version body 10 after the completion of the netting;
  • Step 202 uniformly apply a photoresist on the mask version body 10 to form a photoresist layer 200, please refer to FIG. 7;
  • the photoresist may be uniformly applied to the mask version 10 by using a slit or spin coating method
  • Step 203 Exposing and developing the photoresist layer 200 by using a mask, forming an annular first retaining wall 20, wherein each annular first retaining wall 20 corresponds to the mask version 10
  • An upper opening is provided around the corresponding opening, please refer to FIG. 8.
  • Step 204 Perform high temperature baking on the formed first retaining wall 20, so that the supportability of the first retaining wall 20 is ensured.
  • Some embodiments of the present disclosure also provide a method for fabricating an OLED display substrate, including:
  • Step 301 providing a substrate to be evaporated and a mask; the mask is a mask in any of the above embodiments;
  • Step 302 Adjusting the position of the mask to make the first retaining wall on the mask abut against the substrate to be evaporated, and the position of the opening on the mask and the waiting Corresponding to the position of the first color sub-pixel on the vapor-deposited substrate, and vapor-depositing to form the light-emitting layer of the first color sub-pixel;
  • Step 303 Adjusting the position of the mask to make the first retaining wall abut against the substrate to be vapor-deposited, and the position of the opening on the mask and the substrate to be vapor-deposited Corresponding to the position of the two color sub-pixels, and vapor-depositing to form the light-emitting layer of the second color sub-pixel;
  • Step 304 Adjusting the position of the mask to make the first retaining wall abut against the substrate to be vapor-deposited, the position of the opening on the mask and the third on the substrate to be vapor-deposited Corresponding to the position of the color sub-pixels, and evaporating the light-emitting layer forming the third color sub-pixel;
  • the first color, the second color, and the third color can be mixed into white light.
  • the first color, the second color, and the third color are respectively selected from one of red, blue, and green.
  • the organic light-emitting material does not easily flow to other PDL opening regions during vapor deposition, it is possible to avoid poor color mixing and have a good display effect.
  • FIG. 9 is a schematic diagram of a method for fabricating an OLED display substrate according to some embodiments of the present disclosure.
  • Step 401 Please refer to FIG. 9, providing a substrate to be evaporated and a mask;
  • the substrate to be evaporated includes a base substrate 31, and a thin film transistor array layer 32 disposed on the base substrate 31, a pixel defining layer 33 and an anode 34, wherein the pixel defining layer 33 defines a plurality of opening regions 35.
  • the mask version includes: a mask version body 10 having a plurality of openings 11 defined therein, the plurality of openings 11 being arranged in a matrix manner; and being disposed on the mask version body 10
  • the first retaining wall 20 is annular, and each annular first retaining wall 20 corresponds to an opening 11 in the mask version 10 and is disposed around the corresponding opening 11 .
  • Step 402 Referring to FIG. 9 , adjusting the position of the mask to make the first retaining wall 20 on the mask abut against the substrate to be evaporated, and the opening on the mask a position corresponding to the opening area 35 corresponding to the red sub-pixel on the substrate to be vapor-deposited, and evaporating a light-emitting layer forming a red sub-pixel;
  • Step 403 Referring to FIG. 10, adjusting the position of the mask to make the first retaining wall 20 on the mask abut against the substrate to be evaporated, and the opening on the mask The position of 11 corresponds to the opening area 35 corresponding to the green sub-pixel on the substrate to be vapor-deposited, and is evaporated to form a light-emitting layer of the green color sub-pixel;
  • Step 404 Referring to FIG. 11 , adjusting the position of the mask to make the first retaining wall 20 on the mask abut against the substrate to be evaporated, and the opening on the mask The position of 11 corresponds to the opening area 35 corresponding to the blue color sub-pixel on the substrate to be vapor-deposited, and the light-emitting layer of the blue color sub-pixel is vapor-deposited.
  • Some embodiments of the present disclosure also provide an OLED display substrate fabricated by the method for fabricating the above OLED display substrate.
  • a first retaining wall is disposed on the mask, and when the luminescent layer of the OLED display substrate is formed by vapor deposition using the mask, on the one hand, the first retaining wall can abut against the mask Between the body and the OLED display substrate, the function of supporting the mask version body; on the other hand, the first retaining wall can also block the vapor flow of the organic light-emitting material from flowing into other PDL opening areas of the OLED display substrate to avoid poor color mixing. Improve the display effect of the OLED display device.
  • the OLED display substrate in some embodiments of the present disclosure does not need to provide a similar retaining wall on the pixel defining layer, which saves the material of the OLED display substrate and reduces the thickness of the spacer layer between the light emitting layers, thereby improving the thickness of the spacer layer.
  • the OLED displays the flatness of the substrate, so that when the cathode is subsequently formed, the cathode layer is prevented from being broken due to the too thick spacer layer, and at the same time, when the OLED display substrate is packaged by the thin film encapsulation layer, the package caused by the spacer layer being too thick can be avoided. The risk of film rupture.
  • Some embodiments of the present disclosure further provide an OLED display device including an OLED display substrate fabricated by the above-described method for fabricating an OLED display substrate.
  • the OLED display device in some embodiments of the present disclosure further includes a thin film encapsulation layer for encapsulating the OLED display substrate. Since the OLED display substrate is not provided with a retaining wall, the flatness is better, and the inorganic encapsulation in the thin film encapsulation layer can be made. The layer has better ability to reduce the risk of film breakage, and the thickness of the organic encapsulation layer can also be reduced, saving product materials and reducing production costs.
  • the retaining wall may not be disposed on the mask, but the retaining wall may be disposed on the OLED display substrate, and may also support the mask version and block the flow of the organic light material vapor.
  • the OLED displays the role of the other PDL opening regions of the substrate.
  • OLED display substrate including:
  • a pixel defining layer disposed on the substrate substrate, the pixel defining layer defining a plurality of open regions, wherein the plurality of open regions are arranged in a matrix manner;
  • a second retaining wall disposed on the pixel defining layer, the second retaining wall being disposed adjacent to the open area, and disposed at least between the open areas of adjacent rows or adjacent columns.
  • a second retaining wall is disposed in a peripheral region of the opening region defined by the pixel defining layer of the OLED display substrate.
  • the second retaining wall can be placed against the mask.
  • the second retaining wall can also block the vapor flow of the organic luminescent material from flowing into other PDL openings, thereby avoiding poor color mixing and improving the OLED display. The display effect of the device.
  • the structure of the OLED display substrate in some embodiments of the present disclosure will be described below by way of example.
  • FIG. 12 is a top view of an OLED display substrate according to some embodiments of the present disclosure.
  • the OLED display substrate in some embodiments of the present disclosure includes:
  • a pixel disposed on the substrate substrate defines a layer 33, the pixel defining layer 33 defines a plurality of open regions 35, and the plurality of open regions 35 are arranged in a matrix manner;
  • a second retaining wall 36 disposed on the pixel defining layer 33, the second retaining wall 36 is annular, and each annular second retaining wall 36 corresponds to the open area 35 and surrounds the corresponding The opening area 35 is set.
  • the annular second retaining wall 36 when the luminescent layer of the OLED display substrate is formed by evaporation, the annular second retaining wall 36 can abut between the reticle and the OLED display substrate to support the mask. At the same time, the annular second retaining wall 36 can also block the flow of the organic luminescent material vapor to the other PDL opening regions of the OLED display substrate in an all-round manner, thereby avoiding the occurrence of poor color mixing and improving the display effect of the OLED display device.
  • the orthographic projection of the opening of the annular second retaining wall 36 on the substrate substrate and the orthographic projection of the corresponding open region 35 on the pixel defining layer on the substrate coincides with the edge of the corresponding open area 35, thereby enabling better distribution of the organic luminescent material vapor flow within the corresponding open area 35.
  • the annular second retaining wall may also be disposed not adjacent to the corresponding open area, but may be kept at a certain distance from the corresponding open area.
  • each annular second retaining wall 36 corresponds to an open area 35.
  • each annular second retaining wall may also correspond to at least Two open areas, that is, each annular second retaining wall is disposed around at least two open areas, for example, each annular second retaining wall corresponds to one row or a row of open areas, that is, each annular second retaining wall surrounds One row or one column of open area settings.
  • the ring-shaped second retaining wall is a row or a row of open areas, which is related to the arrangement of the light-emitting layers on the OLED display substrate.
  • the second annular wall corresponds to a column.
  • the annular second retaining wall corresponds to a row of open areas.
  • FIG. 13 is a top view of an OLED display substrate according to some embodiments of the present disclosure.
  • the OLED display substrate in some embodiments of the present disclosure includes:
  • a pixel disposed on the substrate substrate defines a layer 33, the pixel defining layer 33 defines a plurality of open regions 35, and the plurality of open regions 35 are arranged in a matrix manner;
  • the second retaining wall 36 is elongated and disposed between the adjacent two rows of the open regions 35, and the adjacent two columns are Two second retaining walls 36 are disposed between the open areas 35, and each of the second retaining walls 36 is disposed adjacent to the open area 35 adjacent thereto.
  • the second retaining wall 36 having an elongated shape can abut between the reticle and the OLED display substrate to support the reticle.
  • the second retaining wall 36 having a long strip shape can also block the vapor flow of the organic light emitting material from flowing into the PDL opening region of the adjacent column of the OLED display substrate, thereby avoiding the occurrence of poor color mixing and improving the display effect of the OLED display device.
  • the length of the elongated second retaining wall is greater than or equal to the total length of the corresponding one of the open areas, so that one side of the open area can be completely blocked, and the OLED display substrate is vapor-deposited.
  • the organic luminescent material is prevented from diffusing to one side of the open area.
  • the strip-shaped second retaining walls correspond to a row of open areas, and are disposed between the adjacent two rows of the open areas.
  • the second-shaped barrier wall of the strip shape corresponds to one row of open areas, and is disposed in the adjacent two rows of the open areas. Between the adjacent two rows of the open areas, two second retaining walls are disposed, and each of the second retaining walls is disposed adjacent to the open area adjacent thereto.
  • an edge of the elongated second retaining wall adjacent to the corresponding open area coincides with an edge of the corresponding open area, so that the organic light material vapor flow can be better defined in the corresponding open area.
  • the elongated second retaining wall may also be disposed not in the corresponding open area, but may be kept at a certain distance from the corresponding open area.
  • the elongated second retaining wall 36 includes a plurality of short strip-shaped second sub-retaining walls 361 spaced apart. That is, two opposite strips of the second sub-retaining wall 361 are disposed on opposite sides of each of the open areas 35, and the second sub-retaining wall 361 is disposed adjacent to the open area 35 and disposed in adjacent columns. Between the two open areas 35.
  • the second sub-retaining walls 361 of the short strips are disposed between the adjacent open regions 35 of the adjacent columns.
  • the strip-shaped second sub-retaining walls 361 are disposed between the adjacent row opening regions 35.
  • two rows of the second sub-retaining walls 361 are disposed between the adjacent two rows of the open areas 35, and the length of each of the second sub-retaining walls 361 in the row direction is greater than or equal to a length of the opening area 35 in the row direction; or between the two adjacent rows of the opening areas 35, two rows of the second sub-retaining walls 361 are disposed, and the length of each of the second sub-retaining walls 361 in the column direction is greater than It is equal to the length of the opening region 35 corresponding thereto in the column direction, so that one side of the corresponding opening can be completely blocked, and when the luminescent layer of the OLED display substrate is vapor-deposited, the organic luminescent material is prevented from diffusing toward the side of the opening.
  • the material used in the second retaining wall may be a photoresist, so that the patterning can be conveniently performed by an exposure process.
  • the second retaining wall is also not excluded from being made of other materials.
  • Some embodiments of the present disclosure also provide an OLED display device comprising the OLED display substrate of any of the above embodiments.
  • Some embodiments of the present disclosure further provide a method for fabricating an OLED display substrate, which is used to fabricate the OLED display substrate including the second barrier wall, and the manufacturing method includes:
  • Step 501 providing a substrate substrate
  • Step 502 forming a pixel defining layer on the base substrate, the pixel defining layer defining a plurality of open areas, wherein the plurality of openings are arranged in a matrix manner;
  • Step 503 Form a retaining wall on the pixel defining layer, the retaining wall is disposed adjacent to the open area, and is disposed at least between two adjacent open areas of adjacent rows or adjacent columns.

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Abstract

一种掩膜版，包括：掩膜版本体（10），掩膜版本体（10）上开设有多个开口（11），多个开口（11）呈矩阵方式排列；设置于掩膜版本体（10）上的第一挡墙（20），第一挡墙（20）靠近开口（11）设置，且第一挡墙（20）的至少一部分设置于相邻行或相邻列开口（11）之间。还公开了一种掩膜版的制作方法、一种有机电致发光二极管OLED显示基板的制作方法、一种OLED显示基板、一种OLED显示装置及一种OLED显示基板的制作方法。

Description

一种掩膜版、OLED显示基板、显示装置及制作方法
相关申请的交叉引用
本申请主张在2017年8月17日在中国提交的中国专利申请号No.201710707156.7的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，尤其涉及一种掩膜版、OLED显示基板、显示装置及制作方法。
背景技术
OLED(有机电致发光二极管)显示装置，以其独有的优势，如响应速度快，全固化，自发光等备受市场的关注。OLED显示装置的应用也非常多元化，柔性显示、透明显示及微显示等都有OLED显示装置的身影。
目前，OLED显示装置通常利用FMM(精细金属掩膜版)在PDL(像素界定层)限定的开口区内分别蒸镀R(红色)、B(蓝色)、G(绿色)子像素的有机发光材料，以形成发光层，在蒸镀过程中，有机发光材料蒸汽流很可能会流向其他PDL开口区，从而造成混色不良，影响OLED显示装置的显示效果。
发明内容
本公开提供一种掩膜版，包括：
掩膜版本体，所述掩膜版本体上开设有多个开口，所述多个开口呈矩阵方式排列；
设置于所述掩膜版本体上的第一挡墙，所述第一挡墙靠近所述开口设置，且所述第一挡墙的至少一部分设置于相邻行或相邻列所述开口之间。
可选的，所述第一挡墙呈环状，且围绕所述掩膜版本体上的至少一个开口。
可选的，所述第一挡墙围绕所述掩膜版本体上的一个开口，且所述开口与所述第一挡墙围绕的区域在所述掩膜版本体上的正投影重合。
可选的，所述第一挡墙围绕所述掩膜版本体上的多个开口，且所述多个开口位于所述第一挡墙围绕的区域在所述掩膜版本体上的正投影之内。
可选的，所述第一挡墙呈长条状，相邻的两行或两列所述开口之间设置有两道所述第一挡墙；其中，
所述第一挡墙在行方向上的长度大于等于每行开口在行方向的长度之和；或
所述第一挡墙在列方向的长度大于等于每列开口在列方向的长度之和。
可选的，所述第一挡墙包括彼此间隔设置的多个第一子挡墙；其中，
相邻两行所述开口之间设置有两行所述第一子挡墙，且每一第一子挡墙在行方向上的长度大于等于与其对应的开口在行方向上的长度；或
相邻两列所述开口之间设置有两列所述第一子挡墙，且每一第一子挡墙在列方向上的长度大于等于与其对应的开口在列方向上的长度。
可选的，所述第一挡墙采用的材料为光刻胶。
本公开还提供一种掩膜版的制作方法，用于制作如上所述掩膜版，所述方法包括：
提供掩膜版本体，所述掩膜版本体上开设有多个开口，所述多个开口呈矩阵排列；
在所述掩膜版本体上形成第一挡墙，所述第一挡墙靠近所述开口设置，且所述第一挡墙的至少一部分设置于相邻行或相邻列所述开口之间。
可选的，在所述掩膜版本体上形成第一挡墙的步骤包括：
在所述掩膜版本体上形成光刻胶层；
对所述光刻胶层进行构图，形成所述第一挡墙。
本公开还提供一种有机电致发光二极管OLED显示基板的制作方法，包括：
提供待蒸镀基板和如上所述的掩膜版；
调整所述掩膜版的位置，使所述第一挡墙抵靠在所述待蒸镀基板上，且所述掩膜版上的开口的位置与所述待蒸镀基板上第一颜色子像素的位置对应，并蒸镀形成第一颜色子像素的发光层；
调整所述掩膜版的位置，使所述第一挡墙抵靠在所述待蒸镀基板上，且所述掩膜版上的开口的位置与所述待蒸镀基板上第二颜色子像素的位置对应， 并蒸镀形成第二颜色子像素的发光层；
调整所述掩膜版的位置，使所述第一挡墙抵靠在所述待蒸镀基板上，所述掩膜版上的开口的位置与所述待蒸镀基板上第三颜色子像素的位置对应，并蒸镀形成第三颜色子像素的发光层；
其中，第一颜色、第二颜色和第三颜色能够混合成白光。
本公开还提供一种OLED显示基板，采用如上所述的方法制作而成。
本公开还提供一种OLED显示基板，包括：
衬底基板；
设置于所述衬底基板上的像素界定层，所述像素界定层界定出多个开口区，所述多个开口区呈矩阵方式排列；
设置于所述像素界定层上的第二挡墙，所述第二挡墙靠近所述开口区设置，且所述第二挡墙的至少一部分设置于相邻行或相邻列的所述开口区之间。
可选的，所述第二挡墙呈环状，且围绕所述像素界定层上的至少一个开口区。
可选的，所述第二挡墙围绕所述像素界定层上的一个开口区，且所述开口区在所述衬底基板上的正投影与所述第二挡墙围绕的区域在所述衬底基板上的正投影重合。
可选的，所述第二挡墙围绕所述像素界定层上的多个开口区，且所述多个开口区在所述衬底基板上的正投影位于所述第二挡墙围绕的区域在所述衬底基板上的正投影之内。
可选的，所述第二挡墙呈长条状，相邻的两行或两列所述开口区之间设置有两道所述第二挡墙；其中，
所述第二挡墙在行方向上的长度大于等于每行开口区在行方向的长度之和；或
所述第二挡墙在列方向上的长度大于等于每列开口区在列方向的长度之和。
可选的，所述第二挡墙包括彼此间隔设置的多个第二子挡墙；其中，
相邻两行所述开口区之间设置有两行所述第二子挡墙，且每一第二子挡墙在行方向上的长度大于等于与其对应的开口区在行方向上的长度；或
相邻两列所述开口区之间设置有两列所述第二子挡墙，且每一第二子挡墙在列方向上的长度大于等于与其对应的开口区在列方向上的长度。
本公开还提供一种OLED显示装置，包括如上所述的OLED显示基板。
本公开还提供一种OLED显示基板的制作方法，用于制作如上所述的OLED显示基板，包括：
提供衬底基板；
在所述衬底基板上形成像素界定层，所述像素界定层界定出多个开口区，所述多个开口呈矩阵方式排列；
在所述像素界定层上形成第二挡墙，所述第二挡墙靠近所述开口区设置，且所述第二挡墙的至少一部分设置于相邻行或相邻列的所述开口区之间。
附图说明
为了更清楚地说明本公开一些实施例的技术方案，下面将对本公开一些实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本公开一些实施例的掩膜版的俯视图；
图2为图1中的A-A剖视图；
图3为本公开一些实施例的掩膜版的俯视图；
图4为本公开一些实施例的掩膜版的俯视图；
图5为本公开一些实施例的掩膜版的俯视图；
图6-图8为本公开一些实施例的掩膜版的制作方法的示意图；
图9-图11为本公开一些实施例的OLED显示基板的制作方法的示意图；
图12为本公开一些实施例的OLED显示基板的俯视图；
图13为本公开一些实施例的OLED显示基板的俯视图；
图14为本公开一些实施例的OLED显示基板的俯视图；以及
图15为本公开一些实施例的OLED显示基板的俯视图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
本公开一些实施例提供一种掩膜版，包括：
掩膜版本体，所述掩膜版本体上开设有多个开口，所述多个开口呈矩阵方式排列；以及
设置于所述掩膜版本体上的第一挡墙，所述第一挡墙靠近所述开口设置，且至少设置于相邻行或相邻列的两所述开口之间。
本公开一些实施例中，在掩膜版本体的开口的周边区域设置第一挡墙，在采用该掩膜版蒸镀形成OLED显示基板的发光层时，一方面，第一挡墙能够抵靠在掩膜版本体与OLED显示基板之间，起到支撑掩膜版本体的作用；另一方面，第一挡墙还能够阻挡有机发光材料蒸汽流流向OLED显示基板的其他PDL开口区内，避免发生混色不良，提高OLED显示装置的显示效果；再一方面，OLED显示基板上则不需要再设置类似的挡墙，节省了OLED显示基板的用料，且降低了发光层之间的间隔层的厚度，提高了OLED显示基板的平坦性，使得在后续形成阴极时，避免因间隔层太厚造成阴极层断裂，同时，当OLED显示基板采用薄膜封装层封装时，还可以避免因间隔层太厚而造成的封装薄膜破裂的风险。
下面举例对本公开一些实施例中的掩膜版的结构进行说明。
请参考图1和图2，图1为本公开一些实施例的掩膜版的俯视图，图2为图1中的A-A剖视图。本公开一些实施例中的掩膜版包括：
掩膜版本体10，所述掩膜版本体10上开设有多个开口11，所述多个开口11呈矩阵方式排列；以及
设置于所述掩膜版本体10上的第一挡墙20，所述第一挡墙20呈环状，每一环状第一挡墙20对应所述掩膜版本体10上的一开口11，并环绕对应的所述开口11设置。
本公开一些实施例中，在采用该掩膜版蒸镀形成OLED显示基板的发光层时，呈环状的第一挡墙20能够抵靠在掩膜版本体10与OLED显示基板之间，起到支撑掩膜版本体10的作用，同时，呈环状的第一挡墙20还能够全方位的阻挡有机发光材料蒸汽流流向OLED显示基板的其他PDL开口区内，避免发生混色不良，提高OLED显示装置的显示效果。
本公开一些实施例中，环状的第一挡墙20的开口在所述掩膜版本体10上的正投影与所述掩膜版本体10上的对应的开口11重合，也就是说，环状的第一挡墙20的开口的边缘与所述掩膜版本体10上的对应的开口11的边缘重合，从而能够更好地将有机发光材料蒸汽流限定在对应的开口11内。
当然，在本公开的一些实施例中，环状的第一挡墙也可以不紧靠掩膜版本体上的对应的开口设置，而是与对应的开口之间保留一定的距离。
本公开一些实施例中，每一环形的第一挡墙20对应一开口11，当然，在本公开的一些实施例中，每一环形的第一挡墙也可以对应掩膜版本体上的至少两个开口，即，每一环形的第一挡墙环绕掩膜版本体上的至少两个开口设置，例如，每一环形的第一挡墙对应掩膜版本体上的一行或一列开口，即每一环形的第一挡墙环绕掩膜版本体上的一行或一列开口设置，请参考图3，图3所示的实施例中，每一环形的第一挡墙20对应掩膜版本体10上的一列开口11，环绕一列开口11设置。至于环形第一挡墙是对应一行或一列开口，与OLED显示基板上的发光层的排列有关，如果OLED显示基板上不同列的发光层的颜色不同，则环形的第一挡墙20对应一列开口，如果OLED显示基板上不同行的发光层的颜色不同，则环形的第一挡墙20则对应一行开口。本公开一些实施例中，由于不需要为每一开口制作对应的一环形第一挡墙，因而可以降低环形第一挡墙20的制作难度。
请参考图4，图4为本公开一些实施例的掩膜版的俯视图，本公开一些实施例中的掩膜版包括：
掩膜版本体10，所述掩膜版本体10上开设有多个开口11，所述多个开口11呈矩阵方式排列；以及
设置于所述掩膜版本体10上的第一挡墙20，所述第一挡墙20呈长条状，设置于相邻的两列所述开口11之间，相邻的两列所述开口11之间设置有两 道所述第一挡墙20，且每一所述第一挡墙20靠近与其相邻的所述开口11设置。
本公开一些实施例中，在采用该掩膜版蒸镀形成OLED显示基板的发光层时，呈长条形的第一挡墙20能够抵靠在掩膜版本体10与OLED显示基板之间，起到支撑掩膜版本体10的作用，同时，呈长条形的第一挡墙20还能够阻挡有机发光材料蒸汽流流向OLED显示基板的相邻列的PDL开口区内，避免发生混色不良，提高OLED显示装置的显示效果。
本公开一些实施例中，所述长条状的第一挡墙的长度大于或等于对应的一列开口的总长度，从而能够将一列开口的一侧完全遮挡住，在蒸镀OLED显示基板的发光层时，避免有机发光材料向开口的一侧扩散。
当OLED显示基板上不同列的发光层的颜色不同，长条状的所述第一挡墙20对应一列开口，设置于相邻的两列所述开口11之间。当然，在本公开的其他一些实施例中，当OLED显示基板上同行的发光层的颜色不同，则长条状的所述第一挡墙对应一行开口，设置于相邻的两行所述开口之间，相邻的两行所述开口之间设置有两道所述第一挡墙，且每一所述第一挡墙靠近与其相邻的所述开口设置。
本公开的一些实施例中，长条状的第一挡墙的靠近对应的开口的边缘与对应的开口的边缘重合，从而能够更好地将有机发光材料蒸汽流限定在对应的开口内。
当然，在本公开的一些实施例中，长条状的第一挡墙也可以不紧靠掩膜版本体上的对应的开口设置，而是与对应的开口之间保留一定的距离。
请参考图5，图5为本公开一些实施例的掩膜版的俯视图，本公开一些实施例与图4所示的实施例的区别在于：长条状的第一挡墙包括间隔设置的多个短条状的第一子挡墙201。即，每一开口11的相对的两侧设置有两道短条状的第一子挡墙201，所述第一子挡墙20靠近所述开口11设置，且设置于相邻列的两所述开口11之间。
当OLED显示基板上不同列的发光层的颜色不同，短条状的所述第一子挡墙201设置于相邻列两所述开口11之间。当然，在本公开的一些实施例中，当OLED显示基板上同行的发光层的颜色不同，则短条状的所述第一子挡墙201 设置于相邻行两所述开口之间。
本公开一些实施例中，所述短条状的第一子挡墙的长度大于或等于对应的开口在所述短条状的第一子挡墙延伸方向上的长度，从而能够将对应的开口的一侧完全遮挡住，在蒸镀OLED显示基板的发光层时，避免有机发光材料向开口的一侧扩散。
本公开的一些实施例中，所述第一挡墙采用的材料可以为光刻胶，从而可以采用曝光工艺方便地进行构图。当然，在本公开的一些实施例中，也不排除所述第一挡墙采用其他材料制成。
本公开一些实施例还提供一种掩膜版的制作方法，用于制作上述任一实施例中的掩膜版，所述方法包括：
步骤101：提供一掩膜版本体，所述掩膜版本体上开设有多个开口，所述多个开口呈矩阵排列；
步骤102：在所述掩膜版本体上形成第一挡墙，所述第一挡墙靠近所述开口设置，且至少设置于相邻行或相邻列的两所述开口之间。
由于精细金属掩膜版(FMM)所采用的材料受温度的影响较小，因而可以通过曝光工艺在现有的精细金属掩膜版本体上进行构图，形成所述第一挡墙。
本公开的一些实施例中，所述在所述掩膜版本体上形成第一挡墙的步骤包括：
步骤1021：在所述掩膜版本体上形成光刻胶层；
步骤1022：对所述光刻胶层进行构图，形成所述第一挡墙。
采用曝光工艺中常用的光刻胶制作第一挡墙，可以节省材料，制作工艺简单。
本公开的一些实施例中，所述掩膜版的制作方法包括：
步骤201：在掩膜版本体完成张网后，进行清洗，请参考图6，图6为完成张网后的掩膜版本体10；
步骤202：将光刻胶均匀涂覆于掩膜版本体10上，形成光刻胶层200，请参考图7；
本公开一些实施例中，可以采用狭缝式或者旋涂式的涂覆方式，将光刻胶均匀涂覆于掩膜版本体10上；
步骤203：采用一掩膜版，对所述光刻胶层200进行曝光，并显影，形成环形的第一挡墙20，其中每一环状第一挡墙20对应所述掩膜版本体10上的一开口，并环绕对应的所述开口设置，请参考图8。
步骤204：对形成的第一挡墙20进行高温烘烤，使得第一挡墙20的支撑性得到保证。
本公开一些实施例还提供一种OLED显示基板的制作方法，包括：
步骤301：提供一待蒸镀基板和一掩膜版；所述掩膜版为上述任一实施例中的掩膜版；
步骤302：调整所述掩膜版的位置，使所述掩膜版上的第一挡墙抵靠在所述待蒸镀基板上，且所述掩膜版上的开口的位置与所述待蒸镀基板上第一颜色子像素的位置对应，并蒸镀形成第一颜色子像素的发光层；
步骤303：调整所述掩膜版的位置，使所述第一挡墙抵靠在所述待蒸镀基板上，且所述掩膜版上的开口的位置与所述待蒸镀基板上第二颜色子像素的位置对应，并蒸镀形成第二颜色子像素的发光层；
步骤304：调整所述掩膜版的位置，使所述第一挡墙抵靠在所述待蒸镀基板上，所述掩膜版上的开口的位置与所述待蒸镀基板上第三颜色子像素的位置对应，并蒸镀形成第三颜色子像素的发光层；
其中，第一颜色、第二颜色和第三颜色能够混合成白光。
可选的，所述第一颜色、第二颜色和第三颜色分别选自红色、蓝色和绿色中的一种。
采用上述方法形成的OLED显示基板，由于在蒸镀时有机发光材料不容易流到其他的PDL开口区，因而可以避免混色不良，具有良好的显示效果。
请参考图9，图9为本公开一些实施例的OLED显示基板的制作方法的示意图，本公开一些实施例的制作方法包括：
步骤401：请参考图9，提供一待蒸镀基板和一掩膜版；
该待蒸镀基板包括：衬底基板31，以及设置于衬底基板31上的薄膜晶体管阵列层32，像素界定层33和阳极34，其中，像素界定层33界定出多个开口区35。
该掩膜版包括：掩膜版本体10，所述掩膜版本体10上开设有多个开口11， 所述多个开口11呈矩阵方式排列；以及，设置于所述掩膜版本体10上的第一挡墙20，所述第一挡墙20呈环状，每一环状第一挡墙20对应所述掩膜版本体10上的一开口11，并环绕对应的所述开口11设置。
步骤402：请参考图9，调整所述掩膜版的位置，使所述掩膜版上的第一挡墙20抵靠在所述待蒸镀基板上，且所述掩膜版上的开口11的位置与所述待蒸镀基板上红色子像素对应的开口区35对应，并蒸镀形成红色子像素的发光层；
步骤403：请参考图10，调整所述掩膜版的位置，使所述掩膜版上的第一挡墙20抵靠在所述待蒸镀基板上，且所述掩膜版上的开口11的位置与所述待蒸镀基板上绿色子像素对应的开口区35对应，并蒸镀形成绿色颜色子像素的发光层；
步骤404：请参考图11，调整所述掩膜版的位置，使所述掩膜版上的第一挡墙20抵靠在所述待蒸镀基板上，且所述掩膜版上的开口11的位置与所述待蒸镀基板上蓝色颜色子像素对应的开口区35对应，并蒸镀形成蓝色颜色子像素的发光层。
本公开一些实施例还提供一种OLED显示基板，采用上述OLED显示基板的制作方法制作而成。
本公开一些实施例中，是在掩膜版上设置第一挡墙，在采用该掩膜版蒸镀形成OLED显示基板的发光层时，一方面，第一挡墙能够抵靠在掩膜版本体与OLED显示基板之间，起到支撑掩膜版本体的作用；另一方面，第一挡墙还能够阻挡有机发光材料蒸汽流流向OLED显示基板的其他PDL开口区内，避免发生混色不良，提高OLED显示装置的显示效果。
同时，本公开一些实施例中的OLED显示基板上不需要在像素界定层上设置类似的挡墙，节省了OLED显示基板的用料，且降低了发光层之间的间隔层的厚度，提高了OLED显示基板的平坦性，使得在后续形成阴极时，避免因间隔层太厚造成阴极层断裂，同时，当OLED显示基板采用薄膜封装层封装时，还可以避免因间隔层太厚而造成的封装薄膜破裂的风险。
本公开一些实施例还提供一种OLED显示装置，包括采用上述OLED显示基板的制作方法制作而成的OLED显示基板。
本公开一些实施例中的OLED显示装置还包括薄膜封装层，用于封装所述OLED显示基板，由于OLED显示基板上不设置挡墙，平坦性更好，因而可以使得薄膜封装层中的无机封装层的能力更好，降低膜破风险，且有机封装层的厚度也可以减薄，节省产品用料，降低生产成本。
当然，本公开一些实施例中，也可以不在掩膜版上设置挡墙，而是将挡墙设置在OLED显示基板上，同样可以起到支撑掩膜版本体，以及阻挡有机发光材料蒸汽流流向OLED显示基板的其他PDL开口区内的作用。
本公开一些实施例提供一种OLED显示基板，包括：
衬底基板；
设置于所述衬底基板上的像素界定层，所述像素界定层界定出多个开口区，所述多个开口区呈矩阵方式排列；
设置于所述像素界定层上的第二挡墙，所述第二挡墙靠近所述开口区设置，且至少设置于相邻行或相邻列的两所述开口区之间。
本公开一些实施例中，在OLED显示基板的像素界定层界定的开口区周边区域设置第二挡墙，在蒸镀OLED显示基板的发光层时，一方面，第二挡墙能够抵靠在掩膜版与OLED显示基板之间，以起到支撑掩膜版的作用，另一方面，第二挡墙还能够阻挡有机发光材料蒸汽流流向其他的PDL开口内，避免发生混色不良，提高OLED显示装置的显示效果。
下面举例对本公开一些实施例中的OLED显示基板的结构进行说明。
请参考图12，图12为本公开一些实施例的OLED显示基板的俯视图，本公开一些实施例中的OLED显示基板包括：
衬底基板(图未示出)；
设置于所述衬底基板上的像素界定层33，所述像素界定层33界定出多个开口区35，所述多个开口区35呈矩阵方式排列；
设置于所述像素界定层33上的第二挡墙36，所述第二挡墙36呈环状，每一环状的第二挡墙36对应一所述开口区35，并环绕对应的所述开口区35设置。
本公开一些实施例中，在蒸镀形成OLED显示基板的发光层时，呈环状的第二挡墙36能够抵靠在掩膜版与OLED显示基板之间，起到支撑掩膜版的作 用，同时，呈环状的第二挡墙36还能够全方位的阻挡有机发光材料蒸汽流流向OLED显示基板的其他PDL开口区内，避免发生混色不良，提高OLED显示装置的显示效果。
本公开一些实施例中，环状的第二挡墙36的开口在所述衬底基板上的正投影与所述像素界定层上的对应的开口区35在所述衬底基板上的正投影重合，也就是说，环状的第二挡墙36的开口的边缘与对应的开口区35的边缘重合，从而能够更好地将有机发光材料蒸汽流限定在对应的开口区35内。
当然，本公开的一些实施例中，环状的第二挡墙也可以不紧靠对应的开口区设置，而是与对应的开口区之间保留一定的距离。
本公开一些实施例中，每一环形的第二挡墙36对应一开口区35，当然，本公开的一些实施例中，如图14所示，每一环形的第二挡墙也可以对应至少两个开口区，即，每一环形的第二挡墙环绕至少两个开口区设置，例如，每一环形的第二挡墙对应一行或一列开口区，即每一环形的第二挡墙环绕一行或一列开口区设置。至于环形的第二挡墙是对应一行或一列开口区，与OLED显示基板上的发光层的排列有关，如果OLED显示基板上不同列的发光层的颜色不同，则环形的第二挡墙对应一列开口区，如果OLED显示基板上不同行的发光层的颜色不同，则环形的第二挡墙则对应一行开口区。本公开一些实施例中，由于不需要为每一开口区制作对应的一环形第二挡墙，因而可以降低环形的第二挡墙的制作难度。
请参考图13，图13为本公开一些实施例的OLED显示基板的俯视图，本公开一些实施例中的OLED显示基板包括：
衬底基板(图未示出)；
设置于所述衬底基板上的像素界定层33，所述像素界定层33界定出多个开口区35，所述多个开口区35呈矩阵方式排列；
设置于所述像素界定层33上的第二挡墙36，所述第二挡墙36呈长条状，设置于相邻的两列所述开口区35之间，相邻的两列所述开口区35之间设置有两道所述第二挡墙36，且每一所述第二挡墙36靠近与其相邻的所述开口区35设置。
本公开一些实施例中，在蒸镀形成OLED显示基板的发光层时，呈长条形 的第二挡墙36能够抵靠在掩膜版与OLED显示基板之间，起到支撑掩膜版的作用，同时，呈长条形的第二挡墙36还能够阻挡有机发光材料蒸汽流流向OLED显示基板的相邻列的PDL开口区内，避免发生混色不良，提高OLED显示装置的显示效果。
本公开一些实施例中，所述长条状的第二挡墙的长度大于或等于对应的一列开口区的总长度，从而能够将一列开口区的一侧完全遮挡住，在蒸镀OLED显示基板的发光层时，避免有机发光材料向开口区的一侧扩散。
当OLED显示基板上不同列的发光层的颜色不同，长条状的所述第二挡墙对应一列开口区，设置于相邻的两列所述开口区之间。当然，在本公开一些实施例中，当OLED显示基板上同行的发光层的颜色不同，则长条状的所述第二挡墙对应一行开口区，设置于相邻的两行所述开口区之间，相邻的两行所述开口区之间设置有两道所述第二挡墙，且每一所述第二挡墙靠近与其相邻的所述开口区设置。
本公开的一些实施例中，长条状的第二挡墙的靠近对应的开口区的边缘与对应的开口区的边缘重合，从而能够更好地将有机发光材料蒸汽流限定在对应的开口区内。
当然，本公开的一些实施例中，长条状的第二挡墙也可以不紧对应的开口区设置，而是与对应的开口区之间保留一定的距离。
请参考图15，长条状的第二挡墙36包括间隔设置的多个短条状的第二子挡墙361。即，每一开口区35的相对的两侧设置有两道短条状的第二子挡墙361，所述第二子挡墙361靠近所述开口区35设置，且设置于相邻列的两所述开口区35之间。
当OLED显示基板上不同列的发光层的颜色不同，短条状的所述第二子挡墙361设置于相邻列两开口区35之间。当然，在本公开的一些实施例中，当OLED显示基板上同行的发光层的颜色不同，则短条状的第二子挡墙361设置于相邻行开口区35之间。
本公开一些实施例中，相邻两行所述开口区35之间设置有两行所述第二子挡墙361，且每一第二子挡墙361在行方向上的长度大于等于与其对应的开口区35在行方向上的长度；或相邻两列所述开口区35之间设置有两列所 述第二子挡墙361，且每一第二子挡墙361在列方向上的长度大于等于与其对应的开口区35在列方向上的长度，从而能够将对应的开口的一侧完全遮挡住，在蒸镀OLED显示基板的发光层时，避免有机发光材料向开口的一侧扩散。
本公开的一些实施例中，所述第二挡墙采用的材料可以为光刻胶，从而可以采用曝光工艺方便地进行构图。当然，在本公开的一些实施例中，也不排除所述第二挡墙采用其他材料制成。
本公开一些实施例还提供一种OLED显示装置，包括上述任一实施例中的OLED显示基板。
本公开一些实施例还提供一种OLED显示基板的制作方法，用于制作上述包括第二挡墙的OLED显示基板，所述制作方法包括：
步骤501：提供一衬底基板；
步骤502：在所述衬底基板上形成像素界定层，所述像素界定层界定出多个开口区，所述多个开口呈矩阵方式排列；
步骤503：在所述像素界定层上形成挡墙，所述挡墙靠近所述开口区设置，且至少设置于相邻行或相邻列的两所述开口区之间。
除非另作界定，本公开中使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也相应地改变。
以上所述是本公开的一些实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (19)

  1. 一种掩膜版，包括：
    掩膜版本体，所述掩膜版本体上开设有多个开口，所述多个开口呈矩阵方式排列；
    设置于所述掩膜版本体上的第一挡墙，所述第一挡墙靠近所述开口设置，且所述第一挡墙的至少一部分设置于相邻行或相邻列所述开口之间。
  2. 根据权利要求1所述的掩膜版，其中，所述第一挡墙呈环状，且围绕所述掩膜版本体上的至少一个开口。
  3. 根据权利要求2所述的掩膜版，其中，所述第一挡墙围绕所述掩膜版本体上的一个开口，且所述开口与所述第一挡墙围绕的区域在所述掩膜版本体上的正投影重合。
  4. 根据权利要求2所述的掩膜版，其中，所述第一挡墙围绕所述掩膜版本体上的多个开口，且所述多个开口位于所述第一挡墙围绕的区域在所述掩膜版本体上的正投影之内。
  5. 根据权利要求1所述的掩膜版，其中，所述第一挡墙呈长条状，相邻的两行或两列所述开口之间设置有两道所述第一挡墙；其中，
    所述第一挡墙在行方向上的长度大于等于每行开口在行方向的长度之和；或
    所述第一挡墙在列方向的长度大于等于每列开口在列方向的长度之和。
  6. 根据权利要求1所述的掩膜版，其中，所述第一挡墙包括彼此间隔设置的多个第一子挡墙；其中，
    相邻两行所述开口之间设置有两行所述第一子挡墙，且每一第一子挡墙在行方向上的长度大于等于与其对应的开口在行方向上的长度；或
    相邻两列所述开口之间设置有两列所述第一子挡墙，且每一第一子挡墙在列方向上的长度大于等于与其对应的开口在列方向上的长度。
  7. 根据权利要求1-6任一项所述的掩膜版，其中，所述第一挡墙采用的材料为光刻胶。
  8. 一种掩膜版的制作方法，用于制作如权利要求1-7任一项所述的掩膜 版，所述方法包括：
    提供掩膜版本体，所述掩膜版本体上开设有多个开口，所述多个开口呈矩阵排列；
    在所述掩膜版本体上形成第一挡墙，所述第一挡墙靠近所述开口设置，且所述第一挡墙的至少一部分设置于相邻行或相邻列所述开口之间。
  9. 根据权利要求8所述的掩膜版的制作方法，其中，在所述掩膜版本体上形成第一挡墙的步骤包括：
    在所述掩膜版本体上形成光刻胶层；
    对所述光刻胶层进行构图，形成所述第一挡墙。
  10. 一种有机电致发光二极管OLED显示基板的制作方法，包括：
    提供待蒸镀基板和如权利要求1-7任一项所述的掩膜版；
    调整所述掩膜版的位置，使所述第一挡墙抵靠在所述待蒸镀基板上，且所述掩膜版上的开口的位置与所述待蒸镀基板上第一颜色子像素的位置对应，并蒸镀形成第一颜色子像素的发光层；
    调整所述掩膜版的位置，使所述第一挡墙抵靠在所述待蒸镀基板上，且所述掩膜版上的开口的位置与所述待蒸镀基板上第二颜色子像素的位置对应，并蒸镀形成第二颜色子像素的发光层；
    调整所述掩膜版的位置，使所述第一挡墙抵靠在所述待蒸镀基板上，所述掩膜版上的开口的位置与所述待蒸镀基板上第三颜色子像素的位置对应，并蒸镀形成第三颜色子像素的发光层；
    其中，第一颜色、第二颜色和第三颜色能够混合成白光。
  11. 一种OLED显示基板，采用如权利要求10所述的方法制作而成。
  12. 一种OLED显示基板，包括：
    衬底基板；
    设置于所述衬底基板上的像素界定层，所述像素界定层界定出多个开口区，所述多个开口区呈矩阵方式排列；
    设置于所述像素界定层上的第二挡墙，所述第二挡墙靠近所述开口区设置，且所述第二挡墙的至少一部分设置于相邻行或相邻列的所述开口区之间。
  13. 根据权利要求12所述的OLED显示基板，其中，所述第二挡墙呈环 状，且围绕所述像素界定层上的至少一个开口区。
  14. 根据权利要求13所述的OLED显示基板，其中，所述第二挡墙围绕所述像素界定层上的一个开口区，且所述开口区在所述衬底基板上的正投影与所述第二挡墙围绕的区域在所述衬底基板上的正投影重合。
  15. 根据权利要求13所述的OLED显示基板，其中，所述第二挡墙围绕所述像素界定层上的多个开口区，且所述多个开口区在所述衬底基板上的正投影位于所述第二挡墙围绕的区域在所述衬底基板上的正投影之内。
  16. 根据权利要求12所述的OLED显示基板，其中，所述第二挡墙呈长条状，相邻的两行或两列所述开口区之间设置有两道所述第二挡墙；其中，
    所述第二挡墙在行方向上的长度大于等于每行开口区在行方向的长度之和；或
    所述第二挡墙在列方向上的长度大于等于每列开口区在列方向的长度之和。
  17. 根据权利要求12所述的OLED显示基板，其中，其中，所述第二挡墙包括彼此间隔设置的多个第二子挡墙；其中，
    相邻两行所述开口区之间设置有两行所述第二子挡墙，且每一第二子挡墙在行方向上的长度大于等于与其对应的开口区在行方向上的长度；或
    相邻两列所述开口区之间设置有两列所述第二子挡墙，且每一第二子挡墙在列方向上的长度大于等于与其对应的开口区在列方向上的长度。
  18. 一种OLED显示装置，包括如权利要求11-17任一项所述的OLED显示基板。
  19. 一种OLED显示基板的制作方法，用于制作如权利要求12-17任一项所述的OLED显示基板，包括：
    提供衬底基板；
    在所述衬底基板上形成像素界定层，所述像素界定层界定出多个开口区，所述多个开口呈矩阵方式排列；
    在所述像素界定层上形成第二挡墙，所述第二挡墙靠近所述开口区设置，且所述第二挡墙的至少一部分设置于相邻行或相邻列的所述开口区之间。
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