[go: up one dir, main page]

WO2019033725A1 - White led consisting of three primary colors rgb and application thereof - Google Patents

White led consisting of three primary colors rgb and application thereof Download PDF

Info

Publication number
WO2019033725A1
WO2019033725A1 PCT/CN2018/076103 CN2018076103W WO2019033725A1 WO 2019033725 A1 WO2019033725 A1 WO 2019033725A1 CN 2018076103 W CN2018076103 W CN 2018076103W WO 2019033725 A1 WO2019033725 A1 WO 2019033725A1
Authority
WO
WIPO (PCT)
Prior art keywords
resistor
wafer
white led
rgb
primary colors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/076103
Other languages
French (fr)
Chinese (zh)
Inventor
兰兵
邹文聪
黄丹
侯斯文
沈思宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Chuangwei RGB Electronics Co Ltd
Original Assignee
Shenzhen Chuangwei RGB Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Chuangwei RGB Electronics Co Ltd filed Critical Shenzhen Chuangwei RGB Electronics Co Ltd
Publication of WO2019033725A1 publication Critical patent/WO2019033725A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H10W90/00—
    • H10W72/07554—
    • H10W72/547—

Definitions

  • the invention relates to the technical field of LEDs, in particular to a white LED composed of RGB three primary colors and an application thereof.
  • the first one is phosphor technology, the principle is to increase the display range of red field by nitride or fluoride; the second is quantum dot technology, the principle is The 3 nm and 7 nm quantum dot materials are excited by blue light to emit green and red light, respectively, thereby improving the purity of the green field and the red field.
  • the implementation of the above two high color gamuts has certain shortcomings: the first method has difficulty in controlling the adjustment ratio of the phosphor powder ratio, the CIE drop point of the LED output is discrete, and the nitride color gamut and brightness are low, and the fluoride resistance is resistant. The problem of poor high temperature and high humidity capability; the second method has the problems of expensive quantum dot materials, demanding transportation and storage conditions, and excitation to generate higher temperatures.
  • an object of the present invention is to provide a white LED composed of RGB three primary colors and an application thereof, aiming at solving the problem that the prior art has insufficient color gamut enhancement in the process of improving the LED color gamut and The problem of expensive and complicated process.
  • a white LED composed of three primary colors of RGB comprising a bracket, six metal pads disposed at the bottom of the bracket, three modules R, G, and B fixed at the bottom of the bracket, and located at the R, G, and B
  • the encapsulation layer on the three modules, the positive and negative poles of the three modules R, G, and B are electrically connected to the six metal pads one by one and the three modules R, G, and B are connected in parallel;
  • the three modules R, G, and B emit light of corresponding colors and are mixed to generate white light.
  • the white LED composed of RGB three primary colors, wherein the R module includes an R wafer, a first resistor and a second resistor, and the R wafer is connected in parallel with the first resistor, and then connected in series with the second resistor;
  • the G module includes a G chip, a third resistor and a fourth resistor, and the G chip is connected in parallel with the third resistor, and then connected in series with the fourth resistor;
  • the B module includes a B wafer, a fifth resistor, and a sixth And a resistor, the B wafer is connected in parallel with the fifth resistor, and then connected in series with the sixth resistor.
  • the white LED composed of RGB three primary colors, wherein the R-wafer, the G-wafer, and the B-wafer have different forward voltage values.
  • the white LED composed of RGB three primary colors, wherein the fourth resistor and the sixth resistor are equal in size.
  • the white LED composed of RGB three primary colors, wherein the ratio of the size of the second resistor to the fourth resistor is 3.3:2.5.
  • the white LED composed of RGB three primary colors, wherein the first resistor, the third resistor and the fifth resistor have a size ratio of 3:6:1.
  • the white LED composed of RGB three primary colors, wherein the R module comprises an R wafer, a seventh resistor and a first reverse diode, and the R wafer is respectively connected in parallel with the seventh resistor and the first reverse diode
  • the G module includes a G wafer, an eighth resistor, and a second reverse diode, the G wafer being respectively connected in parallel with the eighth resistor and the second reverse diode;
  • the B module including a B wafer, a ninth resistor, and a third reverse diode, the B wafer being in parallel with the ninth resistor and the third reverse diode, respectively.
  • the white LED composed of RGB three primary colors, wherein the seventh resistor, the eighth resistor, and the ninth resistor are respectively used for shunting an R wafer, a G wafer, and a B wafer, the first reverse diode, The second reverse diode and the third reverse diode are used to regulate the R wafer, the G wafer, and the B wafer, respectively.
  • the white LED composed of RGB three primary colors, wherein the seventh resistor, the eighth resistor and the ninth resistor have a size ratio of 3:6:1.
  • the white LED composed of RGB three primary colors, wherein the voltages of the second reverse diode and the third reverse diode are equal.
  • the white LED composed of RGB three primary colors, wherein the first reverse diode and the second reverse diode have a voltage ratio of 2.5:3.3.
  • the white LED composed of RGB three primary colors, wherein when the white LED is in a positive package structure, the R, G, and B wafers are fixed to the bottom of the bracket by a die bond.
  • the white LED composed of RGB three primary colors, wherein the positive and negative poles of the R, G, and B chips are electrically connected to the six metal pads one to one through a gold wire.
  • the white LED composed of RGB three primary colors, wherein when the white LED is an inverted package structure, the R, G, and B wafers are fixed to the bottom of the bracket by silver glue.
  • the white LED composed of RGB three primary colors, wherein the positive and negative electrodes of the R, G, and B wafers are electrically connected to the metal pads one-to-one through bumps on the wafer.
  • the present invention provides a white LED composed of three primary colors of RGB, and three modules of R, G, and B are disposed at the bottom of the bracket, and the positive and negative poles of the three modules R, G, and B and the six
  • the metal pads are electrically connected one-to-one and the three modules R, G, and B are connected in parallel; the three modules R, G, and B respectively emit red, green, and blue light having higher color purity, the red Light, green and blue light are mixed to produce pure white light.
  • the white light LED provided by the present invention as a backlight of a display screen, a display screen with a high color gamut can be obtained.
  • FIG. 1 is a schematic view of a conventional LED positive package structure
  • Figure 2 is a schematic diagram of a conventional LED electrical appliance
  • FIG. 3 is a schematic diagram showing a positive package structure of a white LED composed of RGB three primary colors according to the present invention
  • FIG. 4 is an electrical schematic diagram of a white LED composed of RGB three primary colors provided by the present invention.
  • FIG. 5 is another electrical schematic diagram of a white LED composed of RGB three primary colors provided by the present invention.
  • FIG. 6 is a schematic diagram of a white LED inverted package structure composed of RGB three primary colors provided by the present invention.
  • the present invention provides a white LED composed of RGB three primary colors and its application.
  • RGB three primary colors and its application.
  • the present invention will be further described in detail below. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
  • a conventional LED positive package structure is as shown in FIG. 1.
  • the conventional LED includes a bracket on which a blue light wafer is fixed by a die bond, and the blue light wafer is electrically connected to the metal pad through a gold wire. Then, inject a phosphor according to a certain ratio, and after the phosphor is dried and solidified, it is cut to form a monolithic package LED. Further, the electrical schematic diagram of the conventional LED is as shown in FIG. 2, and the positive and negative electrodes of the blue light chip are powered, and the yellow light emitted by the blue light chip is excited by the yellow light to generate white light.
  • the present invention provides a white LED composed of RGB three primary colors.
  • the white LED includes a bracket 10, six metal discs 20 disposed at the bottom of the bracket 10, and fixed to the bracket. 10 R module 31, G module 32, B module 33 and an encapsulant layer (not labeled) on the R module 31, the G module 32 and the B module 33, the R module 31, the G module 32, B
  • the positive and negative electrodes of the module 33 are electrically connected to the six metal pads 20 one-to-one and the R module 31, the G module 32, and the B module 33 are connected in parallel, and the R module 31, the G module 32, and the B module 33 are connected. Light of a corresponding color is emitted, and the three different colors of monochromatic light are mixed to generate white light.
  • the white LED provided by the invention removes the traditional core element of the phosphor, and only needs to provide three modules R, G and B at the bottom of the bracket, and the positive and negative poles of the three modules R, G and B.
  • One-to-one electrical connection with the six metal pads and the three modules R, G, and B are connected in parallel; the three modules R, G, and B respectively emit red light, green light, and In blue light, the red, green, and blue light are mixed to produce pure white light.
  • the white LED provided by the invention eliminates the processes of phosphor blending, powdering, drying and solidification in the production process, and can greatly improve the production efficiency of the LED.
  • the electrical schematic of the white LED is as shown in FIG. 4, and the R module 31 includes an R wafer 311, a first resistor 312, and a second resistor 313, and the R After the wafer 311 is connected in parallel with the first resistor 312, it is connected in series with the second resistor 313.
  • the G module 32 includes a G chip 321, a third resistor 322, and a fourth resistor 323.
  • the G chip 321 and the third resistor 322 are included.
  • the fourth resistor 323 is connected in series;
  • the B module 33 includes a B wafer 331, a fifth resistor 332 and a sixth resistor 333.
  • the B wafer 331 is connected in parallel with the fifth resistor 332, and then The sixth resistor 333 is connected in series.
  • the second resistor 313, the fourth resistor 323, and the sixth resistor 333 are respectively used for dividing the R wafer, the G wafer, and the B wafer; the first resistor 312, the third resistor 322, and the fifth resistor 332 are respectively used.
  • the R wafer, the G wafer, and the B wafer are shunted.
  • the R wafer Due to the difference in the forward voltage Vf of the R, G, and B wafers, the R wafer is about 2.5V, and the G and B wafers are about 3.3V.
  • the luminous intensities of the R, G, and B primary colors are inconsistent, according to experimental data.
  • the luminous intensity of the three primary colors of R, G, and B is more pure than that obtained at 3:6:1. Therefore, the three primary color chips need to be electrically connected as follows: the fourth resistor and the sixth resistor are equal in size, and the second resistor and the fourth resistor have a size ratio of 3.3:2.5; the first resistor, the third resistor, and The size ratio of the fifth resistor is 3:6:1.
  • the white LED provided by the present invention can also realize pure white light by another electrical connection.
  • the electrical schematic diagram is shown in FIG. 5.
  • the R module 31 includes an R wafer 311 and a seventh. a resistor 314 and a first reverse diode 315, the R chip 311 is respectively connected in parallel with the seventh resistor 314 and the first reverse diode 315;
  • the G module 32 includes a G chip 321, an eighth resistor 324, and a second reverse To the diode 325, the G chip 321 is connected in parallel with the eighth resistor 324 and the second reverse diode 325, respectively;
  • the B module 33 includes a B wafer 331, a ninth resistor 334 and a third reverse diode 335, The B wafer 331 is connected in parallel with the ninth resistor 334 and the third reverse diode 335, respectively.
  • the seventh resistor 314, the eighth resistor 324 and the ninth resistor 334 are respectively used for shunting the R wafer, the G wafer and the B wafer, the first reverse diode 315, the second reverse diode 325 and the first The three reverse diodes 335 are used to regulate the R wafer, the G wafer, and the B wafer, respectively.
  • the seventh resistor, the eighth resistor and the ninth resistor have a size ratio of 3:6:1, and the second reverse diode
  • the voltage of the third reverse diode is equal in magnitude, and the voltage ratio of the first reverse diode to the second reverse diode is 2.5:3.3.
  • the white LED provided by the present invention is a positive package structure, as shown in FIG. 3, the R, G, and B wafers are fixed on the bottom of the holder by a die bonding glue, and the positive and negative of the R, G, and B chips.
  • the poles are electrically connected to the six metal pads one to one through a gold wire.
  • the R, G, and B wafers are fixed on the bottom of the bracket by silver glue, and the positive and negative electrodes of the R, G, and B wafers pass through the wafer.
  • the upper bumps are electrically connected to the metal pads one-to-one; unlike the positive packaging method, the R, G, and B wafers do not need to be connected to the metal pads through the gold wires, but directly
  • the use of silver glue allows the bumps on the wafer to directly contact the metal pads over a large area, so that the flip chip has the advantage of driving more current and better heat dissipation.
  • the present invention provides a white LED composed of RGB three primary colors, and three R, G, and B modules are disposed at the bottom of the bracket, and the positive and negative poles of the three R, G, and B modules are The six metal pads are electrically connected one-to-one and the three modules R, G, and B are connected in parallel; the three modules R, G, and B respectively emit red, green, and blue light with high color purity. The red, green, and blue light are mixed to produce pure white light.
  • the white light LED provided by the present invention as a backlight of a display screen, a display screen with a high color gamut can be obtained.

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

A white LED consisting of three primary colors RGB. The white LED comprises a support (10), six metal pads (20) disposed at the bottom of the support (10), R, G and B modules (31, 32, 33) fixed at the bottom of the support (10), and packaging adhesive layers positioned on the R, G and B modules (31, 32, 33). The positive and negative electrodes of the R, G and B modules (31, 32, 33) are electrically connected to the six metal pads (20) one to one so that the R, G and B modules (31, 32, 33) are connected in parallel. The R, G and B modules (31, 32, 33) emit light of corresponding colors, and the light is mixed to generate white light. By using the white LED as a backlight source of a display screen, and a display screen with a wide color gamut can be obtained.

Description

一种由RGB三基色组成的白光LED及其应用White LED composed of RGB three primary colors and application thereof 技术领域Technical field

本发明涉及LED技术领域，尤其涉及一种由RGB三基色组成的白光LED及其应用。The invention relates to the technical field of LEDs, in particular to a white LED composed of RGB three primary colors and an application thereof.

背景技术Background technique

现如今，高色域、高亮度、高清晰度以及HDR成为了LED TV行业的主流趋势。高色域的实现，现阶段主要有两种方式：第一种是荧光粉技术，其原理是通过氮化物或氟化物来提高红色场的显示范围；第二种是量子点技术，其原理是通过蓝光激发3nm和7nm的量子点材料，分别发出绿光和红光，从而提高绿色场和红色场的纯净度。Today, high color gamut, high brightness, high definition and HDR have become the mainstream trends in the LED TV industry. There are two main ways to achieve high color gamut: the first one is phosphor technology, the principle is to increase the display range of red field by nitride or fluoride; the second is quantum dot technology, the principle is The 3 nm and 7 nm quantum dot materials are excited by blue light to emit green and red light, respectively, thereby improving the purity of the green field and the red field.

上述两种高色域的实现方式均存在一定的缺点：第一种方式存在荧光粉配比调节精度难控制、LED产出CIE落点较离散以及氮化物色域和亮度较低、氟化物耐高温高湿能力差的问题；第二种方式存在量子点材料价格昂贵、运输存储条件要求苛刻以及激发产生较高温度的问题。The implementation of the above two high color gamuts has certain shortcomings: the first method has difficulty in controlling the adjustment ratio of the phosphor powder ratio, the CIE drop point of the LED output is discrete, and the nitride color gamut and brightness are low, and the fluoride resistance is resistant. The problem of poor high temperature and high humidity capability; the second method has the problems of expensive quantum dot materials, demanding transportation and storage conditions, and excitation to generate higher temperatures.

因此，现有技术还有待于改进和发展。Therefore, the prior art has yet to be improved and developed.

发明内容Summary of the invention

鉴于上述现有技术的不足，本发明的目的在于提供一种由RGB三基色组成的白光LED及其应用，旨在解决现有技术在实现提高LED色域的过程中存在色域提升程度不够以及价格昂贵、工艺复杂的问题。In view of the above-mentioned deficiencies of the prior art, an object of the present invention is to provide a white LED composed of RGB three primary colors and an application thereof, aiming at solving the problem that the prior art has insufficient color gamut enhancement in the process of improving the LED color gamut and The problem of expensive and complicated process.

本发明的技术方案如下：The technical solution of the present invention is as follows:

一种由RGB三基色组成的白光LED，其中，包括一支架、设置在支架底部的六个金属焊盘、固定在支架底部的R、G、B三个模块以及位于所述R、G、B三个模块上的封装胶层，所述R、G、B三个模块的正负极与所述六个金属焊盘一对一电连接并使得所述R、G、B三个模块并联；所述R、G、B三个模块发出相应颜色的光经过混合后生成白光。A white LED composed of three primary colors of RGB, comprising a bracket, six metal pads disposed at the bottom of the bracket, three modules R, G, and B fixed at the bottom of the bracket, and located at the R, G, and B The encapsulation layer on the three modules, the positive and negative poles of the three modules R, G, and B are electrically connected to the six metal pads one by one and the three modules R, G, and B are connected in parallel; The three modules R, G, and B emit light of corresponding colors and are mixed to generate white light.

所述的由RGB三基色组成的白光LED，其中，所述R模块包括R晶片、第一电阻和第二电阻，所述R晶片与第一电阻并联后，再与所述第二电阻串联； 所述G模块包括G晶片、第三电阻和第四电阻，所述G晶片与第三电阻并联后，再与所述第四电阻串联；所述B模块包括B晶片、第五电阻和第六电阻，所述B晶片与所述第五电阻并联后，再与所述第六电阻串联。The white LED composed of RGB three primary colors, wherein the R module includes an R wafer, a first resistor and a second resistor, and the R wafer is connected in parallel with the first resistor, and then connected in series with the second resistor; The G module includes a G chip, a third resistor and a fourth resistor, and the G chip is connected in parallel with the third resistor, and then connected in series with the fourth resistor; the B module includes a B wafer, a fifth resistor, and a sixth And a resistor, the B wafer is connected in parallel with the fifth resistor, and then connected in series with the sixth resistor.

所述的由RGB三基色组成的白光LED，其中，所述R晶片、G晶片和B晶片的正向导通电压值有差异。The white LED composed of RGB three primary colors, wherein the R-wafer, the G-wafer, and the B-wafer have different forward voltage values.

所述的由RGB三基色组成的白光LED，其中，所述第四电阻与第六电阻大小相等。The white LED composed of RGB three primary colors, wherein the fourth resistor and the sixth resistor are equal in size.

所述的由RGB三基色组成的白光LED，其中，所述第二电阻与第四电阻的大小比例为3.3：2.5。The white LED composed of RGB three primary colors, wherein the ratio of the size of the second resistor to the fourth resistor is 3.3:2.5.

所述的由RGB三基色组成的白光LED，其中，所述第一电阻、第三电阻和第五电阻的大小比例为3:6:1。The white LED composed of RGB three primary colors, wherein the first resistor, the third resistor and the fifth resistor have a size ratio of 3:6:1.

所述的由RGB三基色组成的白光LED，其中，所述R模块包括R晶片、第七电阻和第一反向二极管，所述R晶片分别与所述第七电阻和第一反向二极管并联；所述G模块包括G晶片、第八电阻和第二反向二极管，所述G晶片分别与所述第八电阻和第二反向二极管并联；所述B模块包括B晶片、第九电阻和第三反向二极管，所述B晶片分别与所述第九电阻和第三反向二极管并联。The white LED composed of RGB three primary colors, wherein the R module comprises an R wafer, a seventh resistor and a first reverse diode, and the R wafer is respectively connected in parallel with the seventh resistor and the first reverse diode The G module includes a G wafer, an eighth resistor, and a second reverse diode, the G wafer being respectively connected in parallel with the eighth resistor and the second reverse diode; the B module including a B wafer, a ninth resistor, and a third reverse diode, the B wafer being in parallel with the ninth resistor and the third reverse diode, respectively.

所述的由RGB三基色组成的白光LED，其中，所述第七电阻、第八电阻和第九电阻分别用于对R晶片、G晶片和B晶片进行分流，所述第一反向二极管、第二反向二极管和第三反向二极管分别用于对R晶片、G晶片和B晶片进行稳压。The white LED composed of RGB three primary colors, wherein the seventh resistor, the eighth resistor, and the ninth resistor are respectively used for shunting an R wafer, a G wafer, and a B wafer, the first reverse diode, The second reverse diode and the third reverse diode are used to regulate the R wafer, the G wafer, and the B wafer, respectively.

所述的由RGB三基色组成的白光LED，其中，所述第七电阻、第八电阻与第九电阻的大小比例为3:6:1。The white LED composed of RGB three primary colors, wherein the seventh resistor, the eighth resistor and the ninth resistor have a size ratio of 3:6:1.

所述的由RGB三基色组成的白光LED，其中，所述第二反向二极管与第三反向二极管的电压大小相等。The white LED composed of RGB three primary colors, wherein the voltages of the second reverse diode and the third reverse diode are equal.

所述的由RGB三基色组成的白光LED，其中，所述第一反向二极管与第二反向二极管的电压大小比例为2.5:3.3。The white LED composed of RGB three primary colors, wherein the first reverse diode and the second reverse diode have a voltage ratio of 2.5:3.3.

所述的由RGB三基色组成的白光LED，其中，当所述白光LED为正封装结构时，所述R、G、B晶片通过固晶胶固定在支架底部。The white LED composed of RGB three primary colors, wherein when the white LED is in a positive package structure, the R, G, and B wafers are fixed to the bottom of the bracket by a die bond.

所述的由RGB三基色组成的白光LED，其中，所述R、G、B晶片的正负 极通过金线与所述六个金属焊盘一对一电连接。The white LED composed of RGB three primary colors, wherein the positive and negative poles of the R, G, and B chips are electrically connected to the six metal pads one to one through a gold wire.

所述的由RGB三基色组成的白光LED，其中，当所述白光LED为倒封装结构时，所述R、G、B晶片通过银胶固定在支架底部。The white LED composed of RGB three primary colors, wherein when the white LED is an inverted package structure, the R, G, and B wafers are fixed to the bottom of the bracket by silver glue.

所述的由RGB三基色组成的白光LED，其中，所述R、G、B晶片的正负极通过晶片上的凸点与所述金属焊盘一对一电连接。The white LED composed of RGB three primary colors, wherein the positive and negative electrodes of the R, G, and B wafers are electrically connected to the metal pads one-to-one through bumps on the wafer.

一种由RGB三基色组成的白光LED的应用，其中，将上述任意一种由RGB三基色组成的白光LED作为显示屏的背光源。An application of a white LED composed of RGB three primary colors, wherein any one of the above-mentioned white LEDs composed of RGB three primary colors is used as a backlight of the display screen.

有益效果：本发明提供一种由RGB三基色组成的白光LED，通过在支架底部设置R、G、B三个模块，所述R、G、B三个模块的正负极与所述六个金属焊盘一对一电连接并使得所述R、G、B三个模块并联；所述R、G、B三个模块分别发出色纯度较高的红光、绿光和蓝光，所述红光、绿光和蓝光经过混合后生成纯正白光。将本发明所提供的白光LED用作显示屏的背光源，可得到高色域的显示屏。Advantageous Effects: The present invention provides a white LED composed of three primary colors of RGB, and three modules of R, G, and B are disposed at the bottom of the bracket, and the positive and negative poles of the three modules R, G, and B and the six The metal pads are electrically connected one-to-one and the three modules R, G, and B are connected in parallel; the three modules R, G, and B respectively emit red, green, and blue light having higher color purity, the red Light, green and blue light are mixed to produce pure white light. By using the white light LED provided by the present invention as a backlight of a display screen, a display screen with a high color gamut can be obtained.

附图说明DRAWINGS

图1为传统LED正封装结构示意图；1 is a schematic view of a conventional LED positive package structure;

图2为传统LED电器原理图；Figure 2 is a schematic diagram of a conventional LED electrical appliance;

图3为本发明提供的一种由RGB三基色组成的白光LED正封装结构示意图；3 is a schematic diagram showing a positive package structure of a white LED composed of RGB three primary colors according to the present invention;

图4为本发明提供的一种由RGB三基色组成的白光LED的一种电气原理图；4 is an electrical schematic diagram of a white LED composed of RGB three primary colors provided by the present invention;

图5为本发明提供的一种由RGB三基色组成的白光LED的另一种电气原理图；FIG. 5 is another electrical schematic diagram of a white LED composed of RGB three primary colors provided by the present invention; FIG.

图6为本发明提供的一种由RGB三基色组成的白光LED倒封装结构示意图。FIG. 6 is a schematic diagram of a white LED inverted package structure composed of RGB three primary colors provided by the present invention.

具体实施方式Detailed ways

本发明提供一种由RGB三基色组成的白光LED及其应用，为使本发明的目的、技术方案及效果更加清楚、明确，以下对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。The present invention provides a white LED composed of RGB three primary colors and its application. In order to make the objects, technical solutions and effects of the present invention clearer and more clear, the present invention will be further described in detail below. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

具体来说，传统的LED正封装结构如图1所示，所述传统LED包括一支架，所述支架上通过固晶胶固定一蓝光晶片，所述蓝光晶片通过金线与金属焊盘电连接，然后注入按照一定比例调配的荧光粉，待荧光粉干燥固化后进行切割，形成单片封装LED。进一步，所述传统LED的电气原理图如图2所示，对所述蓝光 晶片的正负极供电，所述蓝光芯片发出的篮光混合荧光粉受激发后发出的黄光，生成白光。Specifically, a conventional LED positive package structure is as shown in FIG. 1. The conventional LED includes a bracket on which a blue light wafer is fixed by a die bond, and the blue light wafer is electrically connected to the metal pad through a gold wire. Then, inject a phosphor according to a certain ratio, and after the phosphor is dried and solidified, it is cut to form a monolithic package LED. Further, the electrical schematic diagram of the conventional LED is as shown in FIG. 2, and the positive and negative electrodes of the blue light chip are powered, and the yellow light emitted by the blue light chip is excited by the yellow light to generate white light.

自LED问世以来，各项技术的进步突破都离不开支架、晶片以及荧光粉三大要素。荧光粉作为LED行业的核心部件，其制备通常需要用到稀土材料，而稀土是非再生资源，其价格昂贵，资源稀少，并且通过高色域荧光粉制备的LED存在光衰以及不耐高温高湿的问题。Since the advent of LEDs, advances in various technologies have been inseparable from the three major elements of stents, wafers and phosphors. As the core component of the LED industry, phosphors usually require rare earth materials, and rare earths are non-renewable resources. They are expensive, resources are scarce, and LEDs prepared by high color gamut phosphors have light decay and are not resistant to high temperature and humidity. The problem.

为解决上述问题，本发明提供了一种由RGB三基色组成的白光LED，如图3所示，所述白光LED包括一支架10、设置在支架10底部的六个金属盘20、固定在支架10底部的R模块31、G模块32、B模块33以及位于所述R模块31、G模块32和B模块33上的封装胶层(未标注)，所述R模块31、G模块32、B模块33的正负极与所述六个金属焊盘20一对一电连接并使得所述R模块31、G模块32、B模块33并联，所述R模块31、G模块32、B模块33发出相应颜色的光，所述三种不同颜色的单色光经过混合后生成白光。In order to solve the above problems, the present invention provides a white LED composed of RGB three primary colors. As shown in FIG. 3, the white LED includes a bracket 10, six metal discs 20 disposed at the bottom of the bracket 10, and fixed to the bracket. 10 R module 31, G module 32, B module 33 and an encapsulant layer (not labeled) on the R module 31, the G module 32 and the B module 33, the R module 31, the G module 32, B The positive and negative electrodes of the module 33 are electrically connected to the six metal pads 20 one-to-one and the R module 31, the G module 32, and the B module 33 are connected in parallel, and the R module 31, the G module 32, and the B module 33 are connected. Light of a corresponding color is emitted, and the three different colors of monochromatic light are mixed to generate white light.

通过对比可以发现，本发明提供的白光LED去除了荧光粉这一传统核心要素，只需要在支架底部设置R、G、B三个模块，所述R、G、B三个模块的正负极与所述六个金属焊盘一对一电连接并使得所述R、G、B三个模块并联；所述R、G、B三个模块分别发出色纯度较高的红光、绿光和蓝光，所述红光、绿光和蓝光经过混合后生成纯正白光。进一步，本发明提供的白光LED在制作流程上省去了荧光粉调配、点粉、干燥固化等流程，可大幅提升LED的生产效率。By comparison, it can be found that the white LED provided by the invention removes the traditional core element of the phosphor, and only needs to provide three modules R, G and B at the bottom of the bracket, and the positive and negative poles of the three modules R, G and B. One-to-one electrical connection with the six metal pads and the three modules R, G, and B are connected in parallel; the three modules R, G, and B respectively emit red light, green light, and In blue light, the red, green, and blue light are mixed to produce pure white light. Further, the white LED provided by the invention eliminates the processes of phosphor blending, powdering, drying and solidification in the production process, and can greatly improve the production efficiency of the LED.

具体来说，在本发明提供的白光LED中，所述白光LED的电气原理图如图4所示，所述R模块31包括R晶片311、第一电阻312和第二电阻313，所述R晶片311与第一电阻312并联后，再与所述第二电阻313串联；所述G模块32包括G晶片321、第三电阻322和第四电阻323，所述G晶片321与第三电阻322并联后，再与所述第四电阻323串联；所述B模块33包括B晶片331、第五电阻332和第六电阻333，所述B晶片331与所述第五电阻332并联后，再与所述第六电阻333串联。所述第二电阻313、第四电阻323和第六电阻333分别用于对R晶片、G晶片和B晶片进行分压；所述第一电阻312、第三电阻322和第五电阻332分别用于对R晶片、G晶片和B晶片进行分流。Specifically, in the white LED provided by the present invention, the electrical schematic of the white LED is as shown in FIG. 4, and the R module 31 includes an R wafer 311, a first resistor 312, and a second resistor 313, and the R After the wafer 311 is connected in parallel with the first resistor 312, it is connected in series with the second resistor 313. The G module 32 includes a G chip 321, a third resistor 322, and a fourth resistor 323. The G chip 321 and the third resistor 322 are included. After being connected in parallel, the fourth resistor 323 is connected in series; the B module 33 includes a B wafer 331, a fifth resistor 332 and a sixth resistor 333. The B wafer 331 is connected in parallel with the fifth resistor 332, and then The sixth resistor 333 is connected in series. The second resistor 313, the fourth resistor 323, and the sixth resistor 333 are respectively used for dividing the R wafer, the G wafer, and the B wafer; the first resistor 312, the third resistor 322, and the fifth resistor 332 are respectively used. The R wafer, the G wafer, and the B wafer are shunted.

由于R、G、B三晶片的正向导通电压Vf值有差异，R晶片在2.5V左右， G、B晶片在3.3V左右；同时R、G、B三基色的发光强度不一致，根据实验数据，R、G、B三基色的发光强度比在3:6:1时获得的白光较纯正。因此需要对三基色晶片做如下电气连接：所述第四电阻与第六电阻大小相等，所述第二电阻与第四电阻的大小比例为3.3：2.5；所述第一电阻、第三电阻和第五电阻的大小比例为3:6:1。Due to the difference in the forward voltage Vf of the R, G, and B wafers, the R wafer is about 2.5V, and the G and B wafers are about 3.3V. The luminous intensities of the R, G, and B primary colors are inconsistent, according to experimental data. The luminous intensity of the three primary colors of R, G, and B is more pure than that obtained at 3:6:1. Therefore, the three primary color chips need to be electrically connected as follows: the fourth resistor and the sixth resistor are equal in size, and the second resistor and the fourth resistor have a size ratio of 3.3:2.5; the first resistor, the third resistor, and The size ratio of the fifth resistor is 3:6:1.

较佳地，本发明提供的白光LED还可通过另外一种电气连接方式来实现发出纯正白光，其电气原理图如图5所示，具体地，所述R模块31包括R晶片311、第七电阻314和第一反向二极管315，所述R晶片311分别与所述第七电阻314和第一反向二极管315并联；所述G模块32包括G晶片321、第八电阻324和第二反向二极管325，所述G晶片321分别与所述第八电阻324和第二反向二极管325并联；所述B模块33包括B晶片331、第九电阻334和第三反向二极管335，所述B晶片331分别与所述第九电阻334和第三反向二极管335并联。同样，所述第七电阻314、第八电阻324和第九电阻334分别用于对R晶片、G晶片和B晶片进行分流，所述第一反向二极管315、第二反向二极管325和第三反向二极管335分别用于对R晶片、G晶片和B晶片进行稳压。Preferably, the white LED provided by the present invention can also realize pure white light by another electrical connection. The electrical schematic diagram is shown in FIG. 5. Specifically, the R module 31 includes an R wafer 311 and a seventh. a resistor 314 and a first reverse diode 315, the R chip 311 is respectively connected in parallel with the seventh resistor 314 and the first reverse diode 315; the G module 32 includes a G chip 321, an eighth resistor 324, and a second reverse To the diode 325, the G chip 321 is connected in parallel with the eighth resistor 324 and the second reverse diode 325, respectively; the B module 33 includes a B wafer 331, a ninth resistor 334 and a third reverse diode 335, The B wafer 331 is connected in parallel with the ninth resistor 334 and the third reverse diode 335, respectively. Similarly, the seventh resistor 314, the eighth resistor 324 and the ninth resistor 334 are respectively used for shunting the R wafer, the G wafer and the B wafer, the first reverse diode 315, the second reverse diode 325 and the first The three reverse diodes 335 are used to regulate the R wafer, the G wafer, and the B wafer, respectively.

进一步，为保证LED能发出纯正白光，需要对三基色晶片做如下电气连接：所述第七电阻、第八电阻与第九电阻的大小比例为3:6:1，所述第二反向二极管与第三反向二极管的电压大小相等，所述第一反向二极管与第二反向二极管的电压大小比例为2.5:3.3。Further, in order to ensure that the LED can emit pure white light, the following three electrical connections are required: the seventh resistor, the eighth resistor and the ninth resistor have a size ratio of 3:6:1, and the second reverse diode The voltage of the third reverse diode is equal in magnitude, and the voltage ratio of the first reverse diode to the second reverse diode is 2.5:3.3.

更进一步，当本发明提供的白光LED为正封装结构时，如图3所示，所述R、G、B晶片通过固晶胶固定在支架底部，所述R、G、B晶片的正负极通过金线与所述六个金属焊盘一对一电连接。Further, when the white LED provided by the present invention is a positive package structure, as shown in FIG. 3, the R, G, and B wafers are fixed on the bottom of the holder by a die bonding glue, and the positive and negative of the R, G, and B chips. The poles are electrically connected to the six metal pads one to one through a gold wire.

当本发明提供的白光LED为倒封装结构时，则如图6所示，所述R、G、B晶片通过银胶固定在支架底部，所述R、G、B晶片的正负极通过晶片上的凸点与所述金属焊盘一对一电连接；与正封装方式不同的是，倒封装时，所述R、G、B晶片不需要通过金线与金属焊盘连接，而是直接采用银胶使晶片上的凸点直接与金属焊盘大面积接触，使得倒装晶片具有可驱动更大的电流以及更好的散热等优势。When the white LED provided by the present invention is an inverted package structure, as shown in FIG. 6, the R, G, and B wafers are fixed on the bottom of the bracket by silver glue, and the positive and negative electrodes of the R, G, and B wafers pass through the wafer. The upper bumps are electrically connected to the metal pads one-to-one; unlike the positive packaging method, the R, G, and B wafers do not need to be connected to the metal pads through the gold wires, but directly The use of silver glue allows the bumps on the wafer to directly contact the metal pads over a large area, so that the flip chip has the advantage of driving more current and better heat dissipation.

综上所述，本发明提供的一种由RGB三基色组成的白光LED，通过在支架 底部设置R、G、B三个模块，所述R、G、B三个模块的正负极与所述六个金属焊盘一对一电连接并使得所述R、G、B三个模块并联；所述R、G、B三个模块分别发出色纯度较高的红光、绿光和蓝光，所述红光、绿光和蓝光经过混合后生成纯正白光。将本发明所提供的白光LED用作显示屏的背光源，可得到高色域的显示屏。In summary, the present invention provides a white LED composed of RGB three primary colors, and three R, G, and B modules are disposed at the bottom of the bracket, and the positive and negative poles of the three R, G, and B modules are The six metal pads are electrically connected one-to-one and the three modules R, G, and B are connected in parallel; the three modules R, G, and B respectively emit red, green, and blue light with high color purity. The red, green, and blue light are mixed to produce pure white light. By using the white light LED provided by the present invention as a backlight of a display screen, a display screen with a high color gamut can be obtained.

应当理解的是，本发明的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本发明所附权利要求的保护范围。It is to be understood that the application of the present invention is not limited to the above-described examples, and those skilled in the art can make modifications and changes in accordance with the above description, all of which are within the scope of the appended claims.

Claims (16)

一种由RGB三基色组成的白光LED，其特征在于，包括一支架、设置在支架底部的六个金属焊盘、固定在支架底部的R、G、B三个模块以及位于所述R、G、B三个模块上的封装胶层，所述R、G、B三个模块的正负极与所述六个金属焊盘一对一电连接并使得所述R、G、B三个模块并联；所述R、G、B三个模块发出相应颜色的光经过混合后生成白光。A white LED composed of RGB three primary colors, comprising: a bracket, six metal pads disposed at the bottom of the bracket, three modules R, G, and B fixed at the bottom of the bracket, and located at the R, G And the three layers of the R, G, and B modules are electrically connected to the six metal pads one by one and the three R, G, and B modules are connected. Parallel; the three modules R, G, and B emit light of corresponding colors and generate white light after mixing. 根据权利要求1所述的由RGB三基色组成的白光LED，其特征在于，所述R模块包括R晶片、第一电阻和第二电阻，所述R晶片与第一电阻并联后，再与所述第二电阻串联；所述G模块包括G晶片、第三电阻和第四电阻，所述G晶片与第三电阻并联后，再与所述第四电阻串联；所述B模块包括B晶片、第五电阻和第六电阻，所述B晶片与所述第五电阻并联后，再与所述第六电阻串联。The white LED composed of RGB three primary colors according to claim 1, wherein the R module comprises an R wafer, a first resistor and a second resistor, and the R wafer is connected in parallel with the first resistor, and then The second resistor is connected in series; the G module includes a G chip, a third resistor and a fourth resistor, and the G chip is connected in parallel with the third resistor, and then connected in series with the fourth resistor; the B module includes a B wafer, And a fifth resistor and a sixth resistor, wherein the B wafer is connected in parallel with the fifth resistor, and then connected in series with the sixth resistor. 根据权利要求2所述的由RGB三基色组成的白光LED，其特征在于，所述R晶片、G晶片和B晶片的正向导通电压值有差异。The white light LED comprising the RGB three primary colors according to claim 2, wherein the R-wafer, the G-wafer, and the B-wafer have different forward voltage values. 根据权利要求2所述的由RGB三基色组成的白光LED，其特征在于，所述第四电阻与第六电阻大小相等。A white LED comprising RGB three primary colors according to claim 2, wherein said fourth resistor is equal in magnitude to said sixth resistor. 根据权利要求2所述的由RGB三基色组成的白光LED，其特征在于，所述第二电阻与第四电阻的大小比例为3.3：2.5。The white LED composed of RGB three primary colors according to claim 2, wherein the ratio of the size of the second resistor to the fourth resistor is 3.3:2.5. [根据细则91更正 21.03.2018]　
根据权利要求2所述的由RGB三基色组成的白光LED，其特征在于，所述第一电阻、第三电阻和第五电阻的大小比例为3:6:1。[Correct according to Rule 91 21.03.2018]
The white LED composed of RGB three primary colors according to claim 2, wherein the first resistor, the third resistor, and the fifth resistor have a size ratio of 3:6:1. [根据细则91更正 21.03.2018]　
根据权利要求1所述的由RGB三基色组成的白光LED，其特征在于，所述R模块包括R晶片、第七电阻和第一反向二极管，所述R晶片分别与所述第七电阻和第一反向二极管并联；所述G模块包括G晶片、第八电阻和第二反向二极管，所述G晶片分别与所述第八电阻和第二反向二极管并联；所述B模块包括B晶片、第九电阻和第三反向二极管，所述B晶片分别与所述第九电阻和第三反向二极管并联。[Correct according to Rule 91 21.03.2018]
A white LED comprising RGB three primary colors according to claim 1, wherein said R module comprises an R wafer, a seventh resistor and a first reverse diode, said R wafer and said seventh resistor and a first reverse diode connected in parallel; the G module includes a G wafer, an eighth resistor, and a second reverse diode, the G wafer being respectively connected in parallel with the eighth resistor and the second reverse diode; the B module including B A wafer, a ninth resistor, and a third reverse diode, the B wafer being in parallel with the ninth resistor and the third reverse diode, respectively. [根据细则91更正 21.03.2018]　
根据权利要求7所述的由RGB三基色组成的白光LED，其特征在于，所述第七电阻、第八电阻和第九电阻分别用于对R晶片、G晶片和B晶片进行分流，所述第一反向二极管、第二反向二极管和第三反向二极管分别用于对R晶片、G晶片和B晶片进行稳压。[Correct according to Rule 91 21.03.2018]
The white LED composed of RGB three primary colors according to claim 7, wherein the seventh resistor, the eighth resistor, and the ninth resistor are respectively used for shunting the R wafer, the G wafer, and the B wafer, The first reverse diode, the second reverse diode, and the third reverse diode are used to regulate the R wafer, the G wafer, and the B wafer, respectively. [根据细则91更正 21.03.2018]　
根据权利要求7所述的由RGB三基色组成的白光LED，其特征在于，所述第七电阻、第八电阻与第九电阻的大小比例为3:6:1。[Correct according to Rule 91 21.03.2018]
The white LED composed of RGB three primary colors according to claim 7, wherein the seventh resistor, the eighth resistor and the ninth resistor have a size ratio of 3:6:1. [根据细则91更正 21.03.2018]　
根据权利要求7所述的由RGB三基色组成的白光LED，其特征在于，所述第二反向二极管与第三反向二极管的电压大小相等。[Correct according to Rule 91 21.03.2018]
The white LED composed of RGB three primary colors according to claim 7, wherein the voltages of the second reverse diode and the third reverse diode are equal. [根据细则91更正 21.03.2018]　
根据权利要求7所述的由RGB三基色组成的白光LED，其特征在于，所述第一反向二极管与第二反向二极管的电压大小比例为2.5:3.3。[Correct according to Rule 91 21.03.2018]
The white LED composed of RGB three primary colors according to claim 7, wherein the voltage ratio of the first reverse diode to the second reverse diode is 2.5:3.3. [根据细则91更正 21.03.2018]　
根据权利要求2-11任一所述的由RGB三基色组成的白光LED，其特征在于，当所述白光LED为正封装结构时，所述R、G、B晶片通过固晶胶固定在支架底部。[Correct according to Rule 91 21.03.2018]
The white LED composed of RGB three primary colors according to any one of claims 2 to 11, wherein when the white LED is in a positive package structure, the R, G, and B wafers are fixed to the bracket by a die bonding adhesive. bottom. [根据细则91更正 21.03.2018]　
根据权利要求12所述的由RGB三基色组成的白光LED，其特征在于，所述R、G、B晶片的正负极通过金线与所述六个金属焊盘一对一电连接。[Correct according to Rule 91 21.03.2018]
The white LED composed of RGB three primary colors according to claim 12, wherein the positive and negative electrodes of the R, G, and B wafers are electrically connected to the six metal pads one to one through a gold wire. [根据细则91更正 21.03.2018]　
根据权利要求2-11任一所述的由RGB三基色组成的白光LED，其特征在于，当所述白光LED为倒封装结构时，所述R、G、B晶片通过银胶固定在支架底部。[Correct according to Rule 91 21.03.2018]
The white LED composed of RGB three primary colors according to any one of claims 2 to 11, wherein when the white LED is an inverted package structure, the R, G, and B wafers are fixed to the bottom of the bracket by silver glue. . [根据细则91更正 21.03.2018]　
根据权利要求14所述的由RGB三基色组成的白光LED，其特征在于，所述R、G、B晶片的正负极通过晶片上的凸点与所述金属焊盘一对一电连接。[Correct according to Rule 91 21.03.2018]
The white LED composed of RGB three primary colors according to claim 14, wherein the positive and negative electrodes of the R, G, and B wafers are electrically connected to the metal pads one-to-one through bumps on the wafer. [根据细则91更正 21.03.2018]　
一种由RGB三基色组成的白光LED的应用，其特征在于，将上述权利要求1-15任意一种由RGB三基色组成的白光LED作为显示屏的背光源。 [Correct according to Rule 91 21.03.2018]
An application of a white LED comprising three primary colors of RGB, characterized in that a white LED composed of RGB three primary colors according to any one of claims 1-15 is used as a backlight of a display screen.
PCT/CN2018/076103 2017-08-15 2018-02-10 White led consisting of three primary colors rgb and application thereof Ceased WO2019033725A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710695835.7A CN107564898A (en) 2017-08-15 2017-08-15 A kind of white light LEDs being made up of RGB three primary colours and its application
CN201710695835.7 2017-08-15

Publications (1)

Publication Number Publication Date
WO2019033725A1 true WO2019033725A1 (en) 2019-02-21

Family

ID=60975432

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/076103 Ceased WO2019033725A1 (en) 2017-08-15 2018-02-10 White led consisting of three primary colors rgb and application thereof

Country Status (2)

Country Link
CN (1) CN107564898A (en)
WO (1) WO2019033725A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107564898A (en) * 2017-08-15 2018-01-09 深圳创维－Rgb电子有限公司 A kind of white light LEDs being made up of RGB three primary colours and its application

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2852395Y (en) * 2005-06-28 2006-12-27 上海蓝宝光电材料有限公司 Red, green, blue chips integrated silicon chip
CN201053637Y (en) * 2007-06-26 2008-04-30 宁波升谱光电半导体有限公司 A RGB white light LED device for lighting
US20090080187A1 (en) * 2007-09-25 2009-03-26 Enertron, Inc. Method and Apparatus for Providing an Omni-Directional Lamp Having a Light Emitting Diode Light Engine
CN102376697A (en) * 2010-08-27 2012-03-14 苏州科医世凯半导体技术有限责任公司 High color rendering white light LED (Light Emitting Diode) module
CN204272422U (en) * 2014-10-09 2015-04-15 广东德豪润达电气股份有限公司 LED circuit and LED high voltage lamp belt adopting the LED circuit
CN107564898A (en) * 2017-08-15 2018-01-09 深圳创维－Rgb电子有限公司 A kind of white light LEDs being made up of RGB three primary colours and its application

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101819753B (en) * 2009-02-27 2013-11-20 北京京东方光电科技有限公司 Device and method for improving contrast ratio of thin film transistor liquid crystal display (TFT-LCD)
CN202004043U (en) * 2010-09-09 2011-10-05 张涛 Patch-type white light LED device
CN102479777A (en) * 2010-11-23 2012-05-30 昆山旭扬电子材料有限公司 Light emitting diode module for forming white light
CN102479780A (en) * 2010-11-23 2012-05-30 昆山旭扬电子材料有限公司 Light emitting diode module for forming white light
CN205336580U (en) * 2015-12-24 2016-06-22 Tcl家用电器（合肥）有限公司 Constant current LED lamp and constant -current drive circuit thereof
CN205793544U (en) * 2016-07-04 2016-12-07 广东欧曼科技股份有限公司 A kind of protection LED lamp strip circuit with external alternating current

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2852395Y (en) * 2005-06-28 2006-12-27 上海蓝宝光电材料有限公司 Red, green, blue chips integrated silicon chip
CN201053637Y (en) * 2007-06-26 2008-04-30 宁波升谱光电半导体有限公司 A RGB white light LED device for lighting
US20090080187A1 (en) * 2007-09-25 2009-03-26 Enertron, Inc. Method and Apparatus for Providing an Omni-Directional Lamp Having a Light Emitting Diode Light Engine
CN102376697A (en) * 2010-08-27 2012-03-14 苏州科医世凯半导体技术有限责任公司 High color rendering white light LED (Light Emitting Diode) module
CN204272422U (en) * 2014-10-09 2015-04-15 广东德豪润达电气股份有限公司 LED circuit and LED high voltage lamp belt adopting the LED circuit
CN107564898A (en) * 2017-08-15 2018-01-09 深圳创维－Rgb电子有限公司 A kind of white light LEDs being made up of RGB three primary colours and its application

Also Published As

Publication number Publication date
CN107564898A (en) 2018-01-09

Similar Documents

Publication Publication Date Title
US8598608B2 (en) Light emitting device
CN101839403B (en) Lighting device for AC drive
CN102214651B (en) LED (light emitting diode) pixel unit device structure and preparation method thereof
CN106783821B (en) A full-spectrum LED packaging structure without phosphor powder and packaging method thereof
CN111192868A (en) High-color rendering index and high-light efficiency packaging body
US20130015461A1 (en) Light-emitting Device Capable of Producing White Light And Light Mixing Method For Producing White Light With Same
TW201010125A (en) White light light-emitting diodes
CN203288644U (en) Distributed high-voltage LED (Light-Emitting Diode) module group
CN106252343A (en) A kind of optoelectronic integration COB light source and preparation method thereof
CN105047791A (en) High-power high-color-rendering-index white-light LED integrated light source module group and manufacturing method thereof
CN102779814A (en) Light emitting element capable of giving out white light and light mixing method of light emitting element
JP2011101040A (en) Light emitting device
CN105470247B (en) A kind of LED light source and its packaging method
TWM454630U (en) Mixed light emitting diode structure
TW201301570A (en) Multi-color light emitting diode and manufacturing method thereof
WO2019033725A1 (en) White led consisting of three primary colors rgb and application thereof
CN103996785A (en) Built-in drive full-angle light-emitting LED light source and packaging process
CN203787420U (en) Array COB light source capable of changing connection
CN206401317U (en) A full-spectrum LED packaging structure without phosphor
CN204946929U (en) A kind of high-power height is aobvious refers to white light LEDs integrated optical source module
CN205177835U (en) A Dimmable COB Light Source with Uniform Lighting
CN100481449C (en) Light emitting diode packaging structure
CN102127436A (en) Mixed fluorescent powder and preparation method of white light LED
CN101414604B (en) a light emitting diode
CN205752230U (en) A kind of light emitting package unit and display screen

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18846597

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 10/09/2020)

122 Ep: pct application non-entry in european phase

Ref document number: 18846597

Country of ref document: EP

Kind code of ref document: A1