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WO2019031379A1 - Carte de câblage connectée et dispositif d'affichage - Google Patents

Carte de câblage connectée et dispositif d'affichage Download PDF

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Publication number
WO2019031379A1
WO2019031379A1 PCT/JP2018/029020 JP2018029020W WO2019031379A1 WO 2019031379 A1 WO2019031379 A1 WO 2019031379A1 JP 2018029020 W JP2018029020 W JP 2018029020W WO 2019031379 A1 WO2019031379 A1 WO 2019031379A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
connection
engagement
solder
end edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/029020
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English (en)
Japanese (ja)
Inventor
菊地　勝敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of WO2019031379A1 publication Critical patent/WO2019031379A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • connection wiring board and a display device.
  • the display device in addition to a display panel having a display surface for displaying an image, is provided with a plurality of functional units such as a backlight unit and a touch panel unit attached to the display panel.
  • a plurality of functional units such as a backlight unit and a touch panel unit attached to the display panel.
  • the plurality of wiring boards connected to the respective functional units are mutually connected to form a connection wiring board.
  • solder is applied after stacking a plurality of wiring substrates, and there is a limit in achieving thinning.
  • the terminals of the wiring extending substantially on a straight line are conductively connected by solder in a state in which the main flexible substrate and the light driving flexible substrate abut on the end faces without overlapping.
  • a solder connection structure is disclosed.
  • the thickness of the substrate connection portion becomes substantially equal to the thickness of the thicker one of the two wiring substrates, and can be reduced by the thickness of one of the wiring substrates, thereby achieving a reduction in thickness.
  • solder connection is a light also in which structure. It is formed along the extending direction of the drive flexible substrate.
  • tensile stress hereinafter referred to as In consideration of the case where separation stress is applied, such stress mainly acts along the extending direction of the light drive flexible substrate, and the solder is formed to extend in the same direction. At the connection portion, the solder acts easily along the connection direction since it works.
  • the present technology is completed based on the above circumstances, and it is an object of the present invention to provide a connection wiring board having excellent connection reliability while achieving thinning of a substrate connection portion. Further, the present technology provides a display device provided with such a connection wiring board.
  • connection wiring board is disposed at a connection portion between a first wiring board, a second wiring board connected to the first wiring board, the first wiring board, and the second wiring board. And a solder for electrically connecting the two wiring substrates, wherein the first wiring substrate includes a first substrate body portion and a first engaging portion extending from the first substrate body portion. And the second wiring board has a second engaging portion that engages with the first engaging portion of the first wiring board to form the connecting portion together with the first engaging portion.
  • the first engagement portion and the second engagement portion are disposed with their end faces facing each other without overlapping in a plan view, and the solder is a portion of the first engagement portion. It extends in a cross direction intersecting with the extension direction of the joint portion to connect between the end edge of the first engagement portion and the end edge of the second engagement portion.
  • the connecting portion can be thinned.
  • the separation stress that tends to separate the two wiring boards acts mainly along the extending direction of the first engaging portion.
  • the solder connection is provided so as to extend in the cross direction intersecting with the extending direction, thereby increasing resistance to the separation stress which tends to separate the two substrates 30 and 50 and breaking the connection portion. It can be made hard to happen. As a result, the connection reliability of the electrical connection in the connection portion 75 can be improved.
  • the separation stress can be dispersed to further improve the connection reliability.
  • at least one of the first wiring substrate and the second wiring substrate can be a flexible printed circuit (FPC) having flexibility.
  • FPC flexible printed circuit
  • the crossing direction in which the solder extends be a direction orthogonal to the extending direction.
  • a connection wiring board according to the present technology is a display device provided with the connection wiring board of the above configuration. According to such a configuration, by using a thin connection wiring board with high connection reliability, it is possible to secure the operation reliability of the device while achieving the thinning of the entire display device.
  • FIG. 3 An exploded perspective view of a liquid crystal display device according to an embodiment Plan view of a connection wiring board connected to a liquid crystal panel or the like A partial enlarged view of the connecting portion of FIG. 3 Enlarged view of the connection portion in the first modification (circle) Enlarged view of the connection part in the second modification (whip shape) Enlarged view of the connection part in the third modification (whip shape)
  • Embodiment Embodiments are described by means of FIGS. 1 to 3.
  • the liquid crystal display device (display device) 1 is illustrated.
  • X-axis, Y-axis, and Z-axis are shown in part of each drawing, and the directions of the respective axes are drawn in the same direction in each drawing.
  • the upper side in FIG. 1 is the front (lower side is the back)
  • the left side in FIGS. 2 and 3 is the left (right side is the right)
  • the upper side is the upper side (lower side is the lower).
  • the liquid crystal display device 1 is generally in the form of a vertically elongated rectangular shallow box, and roughly, as shown in FIG. 1, a liquid crystal panel (display panel) 10 for displaying an image; And a backlight unit 20, which is an external light source disposed on the back side of the liquid crystal panel to irradiate the liquid crystal panel 10 with light for display.
  • the liquid crystal display device is not limited to such a configuration.
  • a frame member (bezel) not shown
  • a touch panel unit, or the like may be disposed on the front side of the liquid crystal panel 10.
  • the liquid crystal display device 1 includes a mobile phone terminal (including a smartphone and the like), a notebook computer (including a tablet notebook computer and the like), a wearable terminal (including a smart watch and the like), a portable information terminal (electronic book And PDAs), portable game machines, digital photo frames, and other various electronic devices (not shown).
  • a mobile phone terminal including a smartphone and the like
  • a notebook computer including a tablet notebook computer and the like
  • a wearable terminal including a smart watch and the like
  • portable information terminal electronic book And PDAs
  • portable game machines digital photo frames, and other various electronic devices (not shown).
  • the screen size of the liquid crystal panel 10 is about several inches to several tens of inches, and is generally classified into small or medium size.
  • liquid crystal display device to which the present technology can be applied is not limited to such a configuration, and a display device including a liquid crystal panel of a screen size classified into medium size or large size (super large size) of several tens of inches or more Also, the present technology is applicable.
  • the liquid crystal panel 10 will be described.
  • the liquid crystal panel 10 may have a known configuration.
  • the liquid crystal panel 10 according to the present embodiment has a generally rectangular shape in a plan view as a whole, and the short side direction coincides with the X axis direction, and the long side direction corresponds to the Y axis direction. It is assumed that they coincide with each other and that the thickness direction coincides with the Z-axis direction.
  • the surface on the front side of the liquid crystal panel 10 is a display surface, and a display area (active area) in which an image is displayed is defined at the central portion thereof.
  • a frame-like (frame-like, annular) outer peripheral portion surrounding the display area is a non-display area (non-active area) in which an image is not displayed.
  • the liquid crystal panel 10 is formed by bonding a pair of substrates 11 and 12 made of a glass substrate or the like with a liquid crystal layer (not shown) interposed therebetween.
  • the liquid crystal layer contains liquid crystal molecules, which are substances whose optical characteristics change with voltage application, and changes the alignment of the liquid crystal molecules by controlling the voltage applied to the liquid crystal layer to display an image in the display region.
  • the polarizing plate 13 is affixed on the outer surface side of both the substrates 11 and 12, respectively.
  • the substrates 11 and 12 are provided with electrodes for applying a voltage to the liquid crystal layer.
  • the one disposed on the back side is the array substrate (active matrix substrate, element substrate) 12 and the one disposed on the front side is the CF substrate (color filter substrate, counter substrate) 11).
  • the array substrate 12 is provided with switching elements (for example, TFTs) connected to source wiring and gate wiring which are orthogonal to each other, and pixel electrodes and the like connected to the switching elements.
  • the CF substrate 11 is provided with a color filter or the like in which colored portions such as R (red), G (green), B (blue), etc. are arranged in a predetermined array.
  • the liquid crystal panel 10 is not limited to such a configuration.
  • the array substrate 12 may have a configuration in which a pixel electrode and a common electrode are provided.
  • the CF substrate 11 has a length dimension in the short side direction (X-axis direction) substantially equal to that of the array substrate 12, the length dimension in the long side direction (Y-axis direction) is the array substrate
  • the substrates 11 and 12 are formed to be smaller than 12, and both substrates 11 and 12 have the same upper edge, and the CF substrate 11 does not overlap over a predetermined range at the lower edge of the array substrate 12 Are placed opposite each other so that
  • the display area described above is defined by the overlapping portion of the CF substrate 11 and the array substrate 12, and the entire area of the CF substrate non-overlapping portion 12A is a non-display area.
  • a driver (drive component) 41 and a flexible substrate (second wiring substrate) 30 for an LCD (Liquid Crystal Display: liquid crystal display panel) 30 are connected to the CF substrate non-overlapping portion 12A.
  • the driver 41 is formed of an LSI chip having a drive circuit inside, processes an input signal supplied from an external signal supply source (not shown) through the LCD flexible substrate 30, generates an output signal, and outputs the output signal. Is output to the display region of the liquid crystal panel 10 to apply a voltage to drive liquid crystal molecules which are display elements.
  • the driver 41 according to the present embodiment has a long rectangular shape, with the longitudinal direction thereof aligned with the short side direction (X axis direction) of the array substrate 12, and the CF along the lower edge of the array substrate 12. It is attached to the board
  • the flexible substrate 30 for LCD will be described later.
  • the backlight unit 20 can have a known configuration.
  • the backlight unit 20 according to the present embodiment is, as shown in FIG. 1, a rectangular shallow box-shaped metal chassis (supporting member: casing, housing) 21 opened toward the liquid crystal panel 10 (front side) 21.
  • a reflection sheet 22 made of a synthetic resin sheet material exhibiting silver color or white excellent in light reflectivity and light emitted from a light source are introduced and propagated inside
  • a plurality of LED substrate holders 24A are formed on the lower edge side of the frame 24, and a plurality of LED substrates are mounted on the LED mounting portion (first substrate body portion) 51 of the LED flexible substrate (first wiring substrate) 50 thereon.
  • the rectangular frame-shaped (frame-like, annular) fixing member 27 following the frame 24 has a plate surface on the back side of the liquid crystal panel 10 and the LED flexible substrate of the backlight unit 20.
  • the liquid crystal panel 10 and the backlight unit 20 are fixed by being fixedly held between the surface 50 and the front surface of the optical sheet 26.
  • the fixation between the liquid crystal panel 10 and the backlight unit 20 is not limited to this.
  • the outer peripheral portion of the liquid crystal panel 10 is sandwiched between the backlight unit 20 and the bezel disposed on the holding surface of the liquid crystal panel 10 It is good also as composition held by.
  • connection wiring board 70 will be described mainly with reference to FIG.
  • the LCD flexible substrate 30 connected to the liquid crystal panel 10 and the LED flexible substrate 50 connected to the backlight unit 20 are mutually connected and electrically connected by the solder 60. 6 show a plan configuration of the connection wiring board 70.
  • Each of the flexible substrate 30 for LCD and the flexible substrate 50 for LED is provided with a base 39, 59 in which a synthetic resin material such as polyimide or PET having an insulating property and flexibility is formed in a sheet shape.
  • a large number of wiring (conductive path) patterns are formed on the surface 59.
  • the substrates 30 and 50 are not limited to such a configuration.
  • the wiring patterns may be formed while forming an insulating layer appropriately on a thin film made of metal.
  • the wiring pattern can be formed by a known method using various conductive materials. For example, a wiring pattern formed by photolithography using copper can be used.
  • the flexible substrate 30 for LCD and the flexible substrate 50 for LED are both single-sided flexible substrates in which the wiring pattern is formed on one main surface of the base materials 39 and 59, the wiring patterns are on both main surfaces. It may be a double-sided flexible substrate formed.
  • the LCD flexible substrate 30 is a wiring substrate for transmitting various input signals for controlling the driving of the liquid crystal panel 10 emitted from an external signal supply source (not shown) to the driver 41 described above.
  • the LCD flexible substrate 30 according to the present embodiment is formed to have a substantially L-shaped outer shape in a plan view, and the short side direction along the lower edge of the liquid crystal panel 10
  • One of the LCD connection portion 31 which extends in the X-axis direction and is connected to a position closer to the lower edge than the driver 41 in the CF substrate non-overlapping portion 12A, and one of the LCD connection portions 31 (right side in FIG. 2)
  • an extending portion 32 extending from the end of the head along the Y axis to the opposite side to the liquid crystal panel 10.
  • connection of the flexible substrate 30 for LCD to the array substrate 12 can be performed by a known method, and for example, electrically and mechanically connected using an anisotropic conductive film (ACF) or the like. can do. Further, as also shown in FIG. 2, various circuit elements are mounted on the base material 39.
  • ACF anisotropic conductive film
  • the LED flexible substrate 50 is a wiring substrate that transmits various input signals emitted from an external signal supply source (not shown) to control the driving of the LED 25.
  • the LED flexible substrate 50 extends in the short side direction (X-axis direction) of the backlight unit 20 to mount the LED 25 (LED mounting portion (first substrate main body)
  • An extension engaging portion (a second portion) extending from the position closer to one end of the LED mounting portion 51 (rightward) to the opposite side (the lower side) to the light guide plate 23 and the like along the Y axis direction; 1 engaging portion) 55.
  • the extension end of the extension engagement portion 55 of the LED flexible substrate 50 is an engagement head 56.
  • the extension end portion of the extension engagement portion 55 extending in the Y-axis direction protrudes to both sides in the X-axis direction and becomes wider than the other portions of the extension engagement portion 55, and the short side direction Are formed in a rectangular shape in which the long side direction coincides with the Y axis direction.
  • the outer corner between the LCD connection portion 31 and the extension portion 32 of the LCD flexible substrate 30 overlaps the base end portion of the extension engagement portion 55 of the LED flexible substrate 50.
  • An engagement receiving portion (second engagement portion) 35 for receiving the extension end portion of the extension engagement portion 55 is formed on the lower side of the cut-out portion. ing.
  • an engagement hole portion 36 and a pair of projecting portions (regulating portions) 37, 37 are formed in the engagement receiving portion 35.
  • the engagement hole portion 36 is formed in a rectangular shape that is a large circle that follows the engagement head 56, and does not overlap with the engagement head 56 in plan view. It is accepted internally.
  • the protrusions 37 and 37 are formed so as to protrude from the left and right edges of the opening provided on the upper side of the engagement hole 36 in the direction opposite to each other.
  • the distance between the protrusions 37 and 37 is formed to be slightly larger than the width of the proximal end of the extension engagement portion 55, and the extension engagement portion 55 is formed between the pair of protrusions 37 and 37.
  • the engagement head 56 is fitted and held in an engagement hole 36 formed on the back side (lower side) than this.
  • the outer peripheral end face of the engagement head 56 and the inner peripheral end face of the engagement hole 36 face each other without overlapping the extension engagement portion 55 and the engagement receiving portion 35 in a plan view. It is distributed in the state.
  • the solder 60 is applied between the end edge of the engagement hole 36 and the end edge of the engagement head 56
  • the LCD flexible substrate 30 and the LED flexible substrate 50 are electrically connected.
  • a first solder connection portion 61 extending in the X-axis direction is formed to connect with the left edge 36 (first edge of the second engagement portion) 36A of 36.
  • solder connection portion 62 extending in the X-axis direction is formed to connect the two.
  • a third solder connection 63 extending in the Y-axis direction is formed to connect the lower end edge 56C of the engagement head 56 and the lower edge 36C of the engagement hole 36.
  • solder connection parts 61, 62, 63 can also be formed according to a known method.
  • the space is formed by applying the solder 60 in a flowable state. It is possible to embed and connect the flexible substrate 30 for LCD and the flexible substrate 50 for LED electrically.
  • the application amount of the solder 60 can be appropriately adjusted. For example, it is preferable that the interface between the engagement head 56 and the engagement hole 36 be closed without any gap and be slightly raised.
  • connection wiring board 70 includes the LED flexible board (first wiring board) 50 and the LCD flexible board (second wiring) connected to the LED flexible board 50.
  • a solder 60 disposed at the connecting portion between the flexible substrate 50 for LED and the flexible substrate 30 for LCD to electrically connect the two wiring substrates, and the flexible substrate 50 for LED is mounted on the LED Portion (first substrate body portion) 51, and an extension engagement portion (first engagement portion) 55 extending in the Y-axis direction from the LED mounting portion 51, and the flexible substrate 50 for LED is extended.
  • the receiving part 35 is a plane
  • the solder 60 is disposed with the end faces facing each other without overlapping, and in the first solder connection portion 61 and the second solder connection portion 62, the extending direction of the extension engaging portion 55 (Y axis Extending in a cross direction (X-axis direction) intersecting with the direction) to connect the end edge of the extension engaging portion 55 and the end edge of the engagement receiving portion 35.
  • connection wiring board 70 configured as described above, the extending engaging portion 55 of the LED flexible substrate 50 and the engagement receiving portion 35 of the LCD flexible substrate 30 are disposed so as not to overlap with each other.
  • the connecting portion 75 can be made thinner.
  • a separation stress that tends to separate the extension engagement portion 55 from the engagement receiving portion 35 acts along the extension direction of the extension engagement portion 55, that is, the Y-axis direction.
  • solder connection is formed along the extending direction of one substrate Compared with the conventional structure, the resistance to the separation stress that tends to separate the extended engagement portion 55 from the engagement receiving portion 35 is increased, and the breakage of the solder connection portion is less likely to occur. As a result, the connection reliability of the electrical connection in the connection portion 75 can be improved. Furthermore, if solder connections are provided at a plurality of locations and extended in a plurality of directions, the separation stress can be dispersed to further improve the connection reliability.
  • connection wiring substrate 70 the LED flexible substrate 50 and the LCD flexible substrate 30 are both flexible substrates having a sheet-like thin film having flexibility.
  • the present technology is useful in further reducing the thickness of such a connection wiring board 70.
  • the extending direction (X-axis direction) of the first solder connection portion 61 and the second solder connection portion 62 is orthogonal to the extending direction (Y-axis direction) of the extending engagement portion 55, It is possible to effectively increase the resistance to pull-off stress.
  • connection wiring board 70 the first solder connection portion 61 and the second solder connection portion 62 are formed on the left and right sides of the extending engagement portion 55.
  • the separation stress of both substrates 30 and 50 is effectively dispersed to the left and right.
  • the connection portion since the separation stress is dispersed in opposite directions on the same straight line extending in the direction (X-axis direction) orthogonal to the extending direction of the extending engaging portion 55, the connection portion The power transmitted to is reduced, making it particularly difficult for the solder to break.
  • connection portions by the solder 60 are provided at a total of three places of the first solder connection portion 61, the second solder connection portion 62, and the third solder connection portion 63.
  • connection wiring board 70 the engagement head 56 is held in the engagement hole portion 36 by the engagement head 56 of the extension engagement portion 55 in the engagement receiving portion 35.
  • a pair of protrusions 37, 37 are formed on the upper side of. Even when the separation stress between the two substrates 30, 50 is generated, the upward movement of the engagement head 56 by the pair of projections 37, 37, that is, the flexible substrate 50 for LED from the flexible substrate 30 for LCD The movement in the separation direction is restricted, and the separation between the extension engaging portion 55 and the engagement receiving portion 35 is suppressed. As a result, solder breakage in the connection portion is less likely to occur.
  • the engagement head 56 is structured to be substantially fitted into the engagement hole portion 36, relative movement in other directions is also less likely to occur. Furthermore, prior to the connection by the solder 60, since the extension engaging portion 55 can be positioned in the engagement receiving portion 35 without requiring any other positioning structure, the positioning by the pin-hole engagement usually provided Since the structure is unnecessary, it is possible to miniaturize the two substrates 30 and 50.
  • the liquid crystal display device 1 includes the thin connection wiring board 70 having the above-described configuration and high connection reliability, so that high operation reliability can be realized while achieving thinning of the entire device. It is done.
  • connection wiring board 170 according to the present modification 1 the connecting wiring board 70 according to the embodiment is different from the connection wiring board 70 according to the embodiment in that the engaging head 56 which is formed in a rectangular shape in the embodiment is formed in a circular shape. It is different.
  • symbol is attached
  • the engagement head 156 provided at the tip of the extension engagement portion (first engagement portion) 155 that constitutes the connection portion 175 has a circular shape, and
  • the joint receiving portion (second engaging portion) 135 protrudes in the direction opposite to each other from the left and right edges of the opening of the circular engaging hole portion 136 which can receive the same and the extending engaging portion 155 upper side.
  • the solder 60 extends to the left and right along the diameter parallel to the X-axis. It is arranged to form a solder connection 162.
  • the separation stress for relatively moving the extension engagement portion 155 upward (opposite to the extension direction of the extension engagement portion 155) relative to the engagement receiving portion 135 are distributed to the upper curved end surface of the circular engagement head 156 and received by the lower curved end surface of the protrusion 137 (the upper end surface of the engagement hole 136).
  • separation stress can be dispersed in a wide range while avoiding stress concentration, and the separation between both substrates 30 and 50 can be regulated.
  • the first solder connection portion 161 and the second solder connection portion 162 are provided on the diameter along the X-axis direction orthogonal to the Y-axis direction which is the extension direction of the extension engagement portion 155. The resistance to the separation stress can be increased to suppress the breakage of the solder connection portion.
  • connection wiring board 270 A second modification will be described with reference to FIG.
  • the extended engaging portion 55 having the rectangular engaging head 56 in the embodiment and formed in a hammer shape as a whole is formed in an L shape as a whole. This point is different from the connection wiring board 70 described in the embodiment in the points etc.
  • the extended engagement portion (first engagement portion) 255 constituting the connecting portion 275 has an L shape as a whole, and the extended end portion is at right angles An engagement head 256 bent in the left direction is formed.
  • the engagement receiving portion (second engagement portion) 235 is formed with an L-shaped engagement hole portion 236 capable of receiving an end of the extension engagement portion 255 including the engagement head 256,
  • a protrusion (regulating portion) 237 disposed on the upper side of the engaging head 256 is formed.
  • the first solder connection portion 261 is formed to extend in the X-axis direction at the side edge of the extension engagement portion 255 on the opposite side (right side) from the engagement head 256.
  • the first solder connection portion 261 is provided so as to extend in the X axis direction orthogonal to the Y axis direction which is the extension direction of the extension engagement portion 155,
  • the resistance to pull-off stress can be relatively large.
  • a separation stress for moving the extension engagement portion 255 relative to the engagement receiving portion 235 upward causes the engagement head 256 to move. It can be received by the protruding portion 237 located on the upper side, and breakage of the solder connection portion can be suppressed.
  • connection wiring board 370 is the same as the connection wiring board 70 according to the embodiment in that the engagement head 56 which is formed in a rectangular shape in the embodiment is trapezoidal. It is different.
  • the engagement head 356 of the extension engagement portion (first engagement portion) 355 forming the connection portion 375 is formed in a trapezoidal shape, and the long side thereof is It is disposed so as to be located on the upper side on the base end side of the extension engagement portion 355.
  • the engagement receiving portion (second engagement portion) 335 is formed with a trapezoidal engagement hole 336 capable of receiving the engagement head 356, and an opening provided on the upper side of the engagement hole 336.
  • a pair of projecting portions (regulating portions) 337 and 337 protruding in the direction opposite to each other are formed.
  • a first solder connection portion 361 and a second solder connection portion 362 are formed to extend in the X-axis direction in the middle of the left and right oblique sides.
  • the first solder connection portion 361 and the second solder connection portion 362 are provided to extend in the X-axis direction orthogonal to the Y-axis direction which is the extension direction of the extension engagement portion 155. By this, it is possible to increase the resistance to the separation stress and to suppress the breakage of the solder connection portion.
  • the present technology is not limited to the embodiments described above with reference to the drawings, and, for example, the following embodiments are also included in the technical scope.
  • the shapes of the first engagement portion and the second engagement portion are not limited to those described in the above-described embodiment, and various modifications are possible. Of course, the external shapes of the first wiring board and the second wiring board can be changed variously.
  • the first wiring substrate and the second wiring substrate are not limited to the flexible substrate, and either one or both may be a rigid substrate provided with a glass substrate or the like.
  • the driver is COG (Chip on Glass) mounted on the glass substrate of the display panel.
  • TCP Tepe career Package
  • connection wiring substrate in which the wiring substrate for the LCD and the wiring substrate for the LED are electrically connected by solder is exemplified, but the present invention is not limited to this.
  • the present invention may be applied to a connection wiring board in which a touch panel substrate for controlling the touch panel unit and a main substrate are soldered.
  • the present invention may be applied to a connection wiring substrate to which a separate wiring substrate for controlling a navigation unit is soldered.
  • connection wiring board in which two wiring boards are connected is illustrated.
  • the present invention is not limited to this, and three or more wiring boards may be connected.
  • the present technology can be applied to each connecting portion in a connection wiring board in which a wiring board for LED and a wiring board for touch panel are connected to a wiring board for LCD.
  • the liquid crystal display device including a liquid crystal panel as a display panel is exemplified, but other types of display panels, such as organic EL panels, PDPs (plasma display panels), EPDs (electrophoretic display panels)
  • the present technology is also applicable to various connection wiring substrates used in a display device provided with a MEMS (Micro Electro Mechanical Systems) display panel.
  • MEMS Micro Electro Mechanical Systems

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

La présente invention concerne une carte de câblage connectée (70) qui est pourvue : d'une première carte de câblage (50) qui possède une première partie de mise en prise (55) qui s'étend dans la direction de l'axe Y vers une seconde carte de câblage (30) ; d'une FPC (30) pour un LCD, qui possède une seconde partie de mise en prise (35) qui vient en prise avec la partie de mise en prise d'extension (55) de manière à constituer une partie de connexion (75) conjointement avec la partie de mise en prise d'extension (55) ; une soudure (60) qui connecte électriquement la première carte de câblage (50) et la FPC (30) pour un LCD l'une avec l'autre. Dans la partie de connexion (75) des deux FPC (30, 50), la partie de mise en prise d'extension (55) et la partie de réception de mise en prise (35) sont agencées de telle sorte que leurs faces d'extrémité respectives se font face sans se chevaucher l'une avec l'autre lorsqu'elles sont visualisées en plan ; la soudure (60) est disposée dans une première partie de connexion de soudure (61) et une seconde partie de connexion de soudure (62) ou autre de manière à s'étendre dans la direction de l'axe X, qui croise la direction de l'axe Y, reliant ainsi l'un à l'autre le bord de la partie de mise en prise d'extension (55) et le bord de la partie de réception de mise en prise (35), qui est agencé de sorte à faire face au bord de la partie de mise en prise d'extension (55).
PCT/JP2018/029020 2017-08-09 2018-08-02 Carte de câblage connectée et dispositif d'affichage Ceased WO2019031379A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-153976 2017-08-09
JP2017153976 2017-08-09

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003017739A1 (fr) * 2001-08-20 2003-02-27 Record Audio Co., Ltd. Ensemble carte imprimee, carte imprimee formee par liaison de tels ensembles, et ensemble d'affichage a del
JP2007134419A (ja) * 2005-11-09 2007-05-31 Nec Access Technica Ltd 基板実装装置およびその実装方法ならびに基板連結部材およびプリント基板
US7608919B1 (en) * 2003-09-04 2009-10-27 University Of Notre Dame Du Lac Interconnect packaging systems

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003017739A1 (fr) * 2001-08-20 2003-02-27 Record Audio Co., Ltd. Ensemble carte imprimee, carte imprimee formee par liaison de tels ensembles, et ensemble d'affichage a del
US7608919B1 (en) * 2003-09-04 2009-10-27 University Of Notre Dame Du Lac Interconnect packaging systems
JP2007134419A (ja) * 2005-11-09 2007-05-31 Nec Access Technica Ltd 基板実装装置およびその実装方法ならびに基板連結部材およびプリント基板

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