WO2019028322A1

WO2019028322A1 - Electrical component having electrically conductive dlc coating

Info

Publication number: WO2019028322A1
Application number: PCT/US2018/045120
Authority: WO
Inventors: Yasuo Sasaki
Original assignee: Samtec Inc
Current assignee: Samtec Inc
Priority date: 2017-08-03
Filing date: 2018-08-03
Publication date: 2019-02-07
Anticipated expiration: 2020-02-03
Also published as: TW201910538A

Abstract

The present disclosure describes components of an electrical communication system that can be coated with a layer that includes eDLC (electrically conductive DLC). For instance, the present disclosure describes electrical connectors, printed circuit boards, electrical cables, and other electrical components that can be coated with a layer of eDLC (electrically conductive DLC).

Description

ELECTRICAL COMPONENT HAVING

ELECTRICALLY CONDUCTIVCE DLC COATING

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This claims the benefit of U.S. Patent Application Serial No. 62/540,593 filed August 3, 2017, the disclosure of which is hereby incorporated by reference as if set forth in its entirety herein.

BACKGROUND

[0002] Electrical connectors include electrical contacts that are configured to be mounted to a respective electrical component at their mounting ends, and mated with a respective electrical component at their mating ends. In particular, electrical connectors can be configured to carry electrical signals between the electrical components, electrical power between the electrical components, or both. Thus, when the electrical contacts are mounted and mated to the respective electrical components, one or both of electrical signals and electrical power is communicated between the electrical components.

[0003] Electrical contacts are typically made of phosphor bronze alloys or beryllium copper alloys. However, bronze and copper tend to tarnish in the presence of oxygen over time, conventional electrical contacts. Therefore, conventional electrical contacts often include a barrier layer of an electrically conductive metal at their mating ends, such as nickel, tin, or the like. Such barrier layers can be very porous. The electrical contacts typically include an additional multi-layered coating on top of the barrier layer to plug porous of the barrier layers. The multi-layered coating can include a noble metal such as silver or gold or platinum. While silver is less expensive than gold and more electrically conducive than gold, it tends to tarnish more than gold. Thus, a layer of anti-tarnish is typically applied to the silver. Alternatively, while gold does not tarnish as readily as silver, it is soft and subject to abrasion over the course of many mating cycles, in addition to being more expensive than silver. Further, both gold and silver coatings are porous. As a result, a pore plugging lubricant can be added to the gold and silver. Platinum can be substantially more expensive than gold and silver.

[0004] Thus, the coatings at the mating ends of electrical contacts can be expensive and cumbersome to manufacture.

SUMMARY

[0005] The present inventors have recognized the electrically conductive diamond-like carbon (eDLC) can be coated onto electrical components in order to render the electrical conductor components suitably electrically conductive. The electrical components can be defined by one or both of electrical connector and electrical cables. Further, eDLC coatings are suitably resistant to wear and tarnishing, and can bond reliably to underlying materials. The underlying material can be an electrically conductive material or an electrically insulative material.

[0006] Thus, in accordance with one aspect of the present disclosure, an electrical component for an electrical communication system is configured to communicate one or both of electrical data and electrical power. The electrical component can include a component body. An outer surface of at least a portion of the component body can be coated with an electrically conductive layer that includes eDLC.

BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Fig. 1 A is a perspective view of a portion of an orthogonal electrical connector system constructed in accordance with one embodiment;

[0008] Fig. IB is another perspective view of a portion of the orthogonal electrical connector system illustrated in Fig. 1 A;

[0009] Fig. 1C is an enlarged perspective view of a portion of the orthogonal electrical connector system illustrated in Fig. 1 A;

[0010] Fig. ID is a side elevation view of a portion of the orthogonal electrical connector system illustrated in Fig. 1 A;

[0011] Fig. 2A is a side elevation view of a portion of a first electrical connector of the orthogonal electrical connector system illustrated in Fig. 1A;

[0012] Fig. 2B is a rear elevation view of the first electrical connector illustrated in Fig.

2A;

[0013] Fig. 2C is a front elevation view of a portion of a first electrical connector illustrated in Fig. 2A; [0014] Fig. 2D is a front perspective view of the first electrical connector illustrated in Fig. 2A;

[0015] Fig. 2E is a rear perspective view of the first electrical connector illustrated in Fig. 2A;

[0016] Fig. 2F is a perspective view of a leadframe assembly of the first electrical connector illustrated in Fig. 2A;

[0017] Fig. 3A is a sectional side elevation view of a portion of a second electrical connector of the orthogonal electrical connector system illustrated in Fig. 1 A;

[0018] Fig. 3B is a rear elevation view of the second electrical connector illustrated in Fig. 3A;

[0019] Fig. 3C is a front elevation view of a portion of the electrical connector illustrated in Fig. 3A;

[0020] Fig. 3D is a front perspective view of the second electrical connector illustrated in Fig. 3A;

[0021] Fig. 3E is a rear perspective view of the second electrical connector illustrated in Fig. 3A;

[0022] Fig. 3F is a perspective view of a leadframe assembly of the second electrical connector illustrated in Fig. 3 A;

[0023] Fig. 3G is another perspective view of the leadframe assembly of the second electrical connector illustrated in Fig. 3A;

[0024] Fig. 4A is a perspective view of a connector system illustrated in Fig. 1 C;

[0025] Fig. 4B is a perspective view of the connector system illustrated in Fig. 4A, but showing one of the electrical connectors mounted to a printed circuit board in accordance with an alternative embodiment;

[0026] Fig. 5A is a perspective view of an electrical connector system constructed in accordance with an alternative embodiment, including an edge card connector and a substrate configured to mate with the edge card connector;

[0027] Fig. 5B is a sectional elevation view of the edge card connector illustrated in Fig. 5A;

[0028] Fig. 5C is a perspective view of a first side of the substrate illustrated in Fig. 5A;

[0029] Fig. 5D is a perspective view of a second side of the substrate illustrated in Fig.

5A; [0030] Fig. 6A is a schematic elevation view of an electrical component coated with a layer of electrically conductive DLC;

[0031] Fig. 6B is a schematic elevation view of a mating end of an electrical contact coated with the layer of electrically conductive DLC;

[0032] Fig. 6C is a schematic elevation view of a mating end of an electrical contact coated with the layer of electrically conductive DLC in accordance with an alternative embodiment;

[0033] Fig. 6D is a schematic sectional view of a compressible mounting ball coated with electrically conductive DLC configured to establish an electrical connection between a mounting end of an electrical contact and an underlying substrate;

[0034] Fig. 6E is a schematic elevation view of the compressible mounting ball illustrated in Fig. 6D, but shown compressed between the mounting end and the underlying substrate;

[0035] Fig. 6F is a schematic sectional view of a printed circuit board having a through- hole plated with a layer of eDLC;

[0036] Fig. 6G is a perspective view of an electrical cable constructed in accordance with one embodiment;

[0037] Fig. 6H is a perspective view of an electrical cable constructed in accordance with another embodiment;

[0038] Fig. 61 is a perspective view of an electrical cable constructed in accordance with still another embodiment;

[0039] Fig. 7 A is a schematic illustration of a capacitively coupled plasma carbon process for applying an eDLC coating; and

[0040] Fig. 7B is a schematic illustration of an inductively coupled plasma carbon process for applying an eDLC coating..

DETAILED DESCRIPTION

[0041] With initial reference to Figs. 1A-3G, an electrical connector system 20 including first and second electrical connectors will be described by way of example only, it being appreciated that the present disclosure can be applicable to any suitable component in an electrical communication system. The present disclosure recognizes that components of the electrical connector system 20 can be coated with an electrically conductive diamond-like carbon (eDLC) coating so as to establish reliable electrical conductivity at least at the eDLC coating. In one example, electrical contacts can include an eDLC coating to provide reliable mating with complementary electrical contacts. Further, any suitable component of the electrical communication system can include the eDLC coating so as to establish reliable electrical conductivity at least at the eDLC coating. Further still, the present disclosure recognizes that other components of the electrical connector system 20 can include an eDLC coating, such as electrical cables, printed circuit boards, and mounting balls that establish an electrical connection between electrical contacts of an electrical connector and an underlying substrate such as a printed circuit board.

[0042] Referring to Figs. lA-lD, one example of an electrical connector system 20 includes at least one first electrical connector 22 and a complementary at least one second electrical connector 24. In one example, the electrical connector system 20 can be configured as an orthogonal connector system, though it will be appreciated that the eDLC coating can be applied to any suitable electrical connector in the manner described herein with respect to the electrical connectors 22 and 24. The electrical connector system 20 further includes at least one first substrate 26 such as a plurality of first substrates 26. The electrical connector system 20 further includes at least one second substrate 28 such as a plurality of second substrates 28. The first and second substrates 26 and 28 can be configured as printed circuit boards. The first electrical connectors 22 can be configured to attach to respective ones of the first substrates 26. The second electrical connectors 24 can be configured to attach to respective ones of the second substrates 28. When the first electrical connectors 22 are attached to the first substrates 26, and the second electrical connectors 24 are attached to the second substrates 28, the first and second electrical connectors 22 and 24 are configured to mate to each other such that the first substrates 26 are oriented along respective first planes, and the second substrates 28 are oriented along respective second planes that are substantially orthogonal to the first planes. Further, respective edges of the first substrates 26 can face respective edges of the second substrates along a longitudinal direction L. Unless otherwise indicated, the term "substantially" and

"approximately" and derivatives thereof recognizes tolerances that can be due, for instance, to manufacturing. In one example, the terms "substantially" and "approximately" and derivatives thereof can include plus or minus 10% of the stated value, shape, or direction, unless otherwise indicated.

[0043] Referring now to Figs. 2A-2F, the first electrical connector 22 includes a dielectric or electrically insulative first connector housing 30 and a plurality of first electrical contacts 32 that are supported by the first connector housing 30. The first connector housing 30 defines a front end that, in turn, defines a first mating interface 34. The first connector housing 30 further defines a rear end that, in turn, defines a first mounting interface 36 opposite the first mating interface 34 along the longitudinal direction L. Further, the first mating interface 34 can be aligned with the first mounting interface 36 along the longitudinal direction L. The first electrical contacts 32 can define respective first mating ends 32a at the first mating interface 34, and first mounting ends 32b at the first mounting interface 36. Thus, the first electrical contacts 32 can be configured as vertical contacts whose first mating ends 32a and first mounting ends 32b are opposite each other with respect to the longitudinal direction L. As will be appreciated from the description below, the first electrical connector 22, and thus the electrical connector system 20, can include a plurality of electrical cables that are mounted to the first electrical contacts 32 at the first mounting interface 36.

[0044] The longitudinal direction L defines the mating direction along which the first electrical connector 22 mates with the second electrical connector 24. The first connector housing 30 further defines first and second sides 38 that are opposite each other along a lateral direction A that is oriented substantially perpendicular to the longitudinal direction L. The first connector housing 30 further defines a bottom surface 40 and a top surface 42 opposite the bottom surface 40 along a transverse direction T that is oriented substantially perpendicular to each of the longitudinal direction L and the lateral direction A. The first electrical connector 22 is described herein with respect to the longitudinal direction L, the lateral direction A, and the transverse direction T in the orientation as if mated with the second electrical connector 24 or aligned to be mated with the second electrical connector 24.

[0045] Each of the first electrical connectors 22 can be configured to attach to a respective one of the first substrates 26. In one example, the first electrical connectors 22 can be configured to attach to the first substrates 26 adjacent an edge of the first substrate 26 that faces the second substrates 28. The first electrical connectors 22 can be configured to attach to the respective one of the first substrates 26 such that the bottom surface 40 faces the respective one of the first substrates 26. For instance, the first bottom surface 40 can define a first attachment surface that is configured to attach the first electrical connectors 22 to the respective ones of the first substrates 26. For instance, the first connector housing 30 can include an attachment member 31 (see Figs. 2A-2B) that is configured to attach the first electrical connector 22 to the respective one of the first substrates 26. The attachment m31 ember can extend out from the bottom surface 40. The attachment member 31 can be configured as a projection or an aperture that receives or is received by hardware so as to attach the first electrical connector 24 to a respective one of the first substrates 26. Alternatively or additionally, the attachment member 31 can include a bracket that, in turn, is secured to the respective one of the first substrates 26. Alternatively still, the attachment member 31 can be configured as the first outer housing 37 described above.

[0046] Alternatively or additionally, one or more of the first electrical connectors 22, up to all of the first electrical connectors 22, can float. That is, the first electrical connectors 22 can be free from attachment to any of the first and second substrates 26 and 28. An auxiliary attachment structure, if desired, can attach to the first and second substrates 26 and 28 so as to maintain the first and second substrates 26 and 28 in an orthogonal relationship to each other.

[0047] It should be appreciated that the attachment surface is different than the ends of the first connector housing 30 that define the first mating interface 34 and the first mounting interface 36. For instance, the attachment surface can extend between the first mating interface 34 and the first mounting interface 36. In one example, the first attachment surface can extend from the first mating interface 34 to the first mounting interface 36. The first mating interface 34 and the first mounting interface 36 can be oriented along respective planes that are substantially parallel to each other. In one example, the first mating interface 34 and the first mounting interface 36 are defined by respective planes that extend along the lateral direction A and the transverse direction T. The first attachment surface can be oriented along a respective plane that is orthogonal to the planes of the first mating interface and the first mounting interface. For instance, the first attachment surface can be oriented along a respective plane that extends along the longitudinal direction L and the lateral direction A. Thus, when the first electrical connector 22 is attached to the first substrate 26, the first substrate 26 is oriented along a plane that extends along the longitudinal direction L and the lateral direction A. It is thus appreciated that the first electrical connector 24 can be attached to the substrate 26 at a different location of the first connector housing 30 than the location of the first connector housing 30 that defines the first mounting interface 36. Further, as will be appreciated from the description below, the electrical cables can be placed in electrical communication with a respective electrical component mounted onto the respective one of the first substrates 26 to which the first electrical connector 22 is attached.

[0048] The first mounting ends 32b of the first electrical contacts 32 can be configured to electrically connect to any suitable electrical component. For instance, the first mounting ends 32b can be configured to electrically connect to respective first electrical cables 44. The first electrical cables 44 can be bundled as desired. The electrical cables 44 are further configured to be placed in electrical communication with the first substrate 26. Thus, the orthogonal electrical connector system can further include the electrical cables 44 that extend from the first electrical connector 22 to a complimentary component on the first substrate 26. For instance, the cables 44 can terminate at a respective first termination connector 46. Thus, the electrical cables 44 can define respective firsts end that are mechanically and electrically attached to respective ones of the electrical contacts of the first electrical connector 22, and respective second ends opposite the first ends that are mechanically and electrically attached to respective ones of electrical contacts of the first termination connector 46. The first termination connector 46 can be configured to mate with a first complementary electrical connector 49 that is mounted to the first substrate 26. Alternatively, the complementary electrical connector 49 can be mounted to an electrical component that is mounted onto the first substrate 26. For instance, the electrical component can be configured as an integrated circuit (IC) package 27 as described in more detail below. Thus, the second ends of the electrical cables 44 can be configured to be placed in electrical communication with the substrate 26, and in particular with one or more electrical components mounted onto the first substrate 26.

[0049] It should be appreciated that the first termination connectors 46 can be provided in an array of first termination electrical connectors 46 that includes an outer first termination housing, and the first termination connectors 46 supported in the outer first termination housing in the manner described above. Thus, the electrical connector assembly 20 can include a plurality of arrays of first termination connectors 46. Alternatively, the first termination connectors 46 can be provided individually and mated individually to respective ones of the first complementary electrical connectors 49.

[0050] In this regard, it should be appreciated that the first complementary electrical connectors 49 can be provided in an array of first complementary electrical connectors 49 that includes an outer first complementary housing, and the first complementary connectors 49 supported in the outer first complementary housing in the manner described above. Thus, the electrical connector assembly 20 can include a plurality of arrays of first complementary connectors 49. Alternatively, the first complementary connectors 49 can be provided individually and mated individually to respective ones of the first termination electrical connectors 46.

[0051] The first electrical connector 22, the respective electrical cables, and the corresponding first termination connector 46 can define an electrical cable assembly. The electrical cable assembly is configured to place the electrical component mounted on the first substrate 26 in electrical communication with the respective one of the second substrates 28 when the first and second electrical connectors 22 and 24 are mated with each other. In particular, the first termination connector 46 and the complimentary connector 49 can be mated with each other so as to place the electrical cables 44 in electrical communication with one or both of the first substrate 26 and the IC package 27. Alternatively, the cables 44 can be mounted directly to one of the first substrate 26 and the IC package 27. The first termination electrical connector 46 and the complementary electrical connector 49 are described in more detail below. In one example, the cables 44 can be configured as twin axial cables. Thus, the cables 44 can include a pair of signal conductors that is disposed within an outer insulative jacket, and at least one drain wire or alternatively configured ground. In one example, the cables 44 are devoid of drain wires, and instead includes an electrically conductive ground member that is attached at one end to the ground shields of the cables 44, and attached at another end to the ground mounting ends. It should be appreciated, however, that the cables 44 can be alternatively constructed as desired.

[0052] The first electrical contacts 32 can be arranged in respective first linear arrays 47. The linear arrays 47 can be oriented parallel to each other. The first electrical connector 22 can include any number of linear arrays as desired. For instance, the first electrical connector 22 can include two or more linear arrays 47. For instance, the first electrical connector 22 can include three or more linear arrays 47. For instance, the first electrical connector 22 can include four or more linear arrays 47. For instance, the first electrical connector 22 can include five or more linear arrays 47. For instance, the first electrical connector 22 can include six or more linear arrays 47. For instance, the first electrical connector 22 can include seven or more linear arrays 47. For instance, the first electrical connector 22 can include eight or more linear arrays 47. In this regard, it should be appreciated that the first electrical connector 22 can include any number of linear arrays as desired. As will be further appreciated from the description below, the first electrical connector 22 can include ground shields disposed between respective adjacent ones of the linear arrays 47.

[0053] The first linear arrays 47 can be oriented substantially along the transverse direction T. Thus, reference to the first linear array 47 and the transverse direction T herein can be used interchangeably unless otherwise indicated. The first linear arrays 47 can be oriented substantially along a direction that intersects the plane defined by the attachment surface of the first connector housing. Similarly, the first linear arrays 47 can be oriented substantially along a direction that intersects the first substrate 26 to which the first electrical connector 22 is attached. The term "substantially" recognizes that the electrical contacts 32 of each of the first linear arrays can define regions that are offset from each other. For instance, one or more of the mating ends 32a can be offset from each other along the lateral direction A as described in more detail below. Further, the first linear arrays 47 can be oriented in a direction that is substantially perpendicular to the plane of the first substrate 26 to which the first electrical connector 22 is attached.

[0054] The first linear arrays 47 can be spaced from each other along a direction that is substantially parallel to the plane defined by the first substrate 26 to which the first electrical connector 22 is attached. Thus, the first linear arrays 47 can be spaced from each other along the lateral direction A. Because the first electrical contacts 32 are vertical contacts and lie in the respective first linear arrays 47, respective entireties of the electrical contacts 32 lie in a respective one of the first linear arrays 47 that extends along the respective direction. The respective direction can be a substantially linear direction. Thus, the mating ends 32a of each first linear array 47 are spaced from the mating ends 32a of adjacent ones of the first linear arrays 47 along the lateral direction A. Further, the mounting ends 32b of each first linear array 47 is spaced from the mounting ends 32b of adj acent ones of the first linear arrays 47 along the lateral direction A.

[0055] The first electrical contacts 32 can include a plurality of first signal contacts 48 and a plurality of first electrical grounds 50 disposed between respective ones of the first signal contacts 48. For instance, the adjacent ones of the first signal contacts 48 that are adjacent each other along the first linear array 47 can define a differential signal pair. While the first signal contacts 48 and the first grounds 50 can be said to extend along a first linear array, it is recognized that at least a portion up to an entirety of the first signal contacts and the first grounds 50 can be offset with respect to each other along the lateral direction A. As described in more detail below, the first signal contacts 48 and the first grounds 50 can be said to extend along a first linear array, since they are defined by the same leadframe assembly 62 that is oriented along the first linear array. It should be appreciated, however, that each of the first signal contacts 48 and each of the first grounds 50 can also be said to extend along respective linear arrays that are offset with respect to each other along the lateral direction A.

[0056] It should be appreciated that the first signal contacts 48 are not defined by electrical contact pads of a printed circuit board or electrical contacts of a printed circuit board. Further, the first grounds are not defined by electrical contact pads of a printed circuit board or electrical contacts of a printed circuit board. Thus, it can be said that the first electrical contacts 32 can, in certain examples, not be defined by electrical contact pads of a printed circuit board or electrical contacts of a printed circuit board. Further, in the illustrated example, the first electrical connector 22 does not include any printed circuit boards.

[0057] In one example, the first signal contacts 48 of each differential pair can be edge coupled. That is, the edges of the contacts 48 that define differential pairs face each other.

Alternatively, the first electrical contacts 48 can be broadside coupled. That is, the broadsides of the first electrical contacts 48 of the differential pairs can face each other. The edges are shorter than the broadsides in a plane defined by the lateral direction A and the transverse direction T. The edges can face each other within each first linear array. The broadsides of the first electrical contacts 48 of adjacent first linear arrays can face each other. Each adjacent differential signal pair along a respective one of the first linear arrays 47 can be separated by at least one ground in a repeating pattern. Each of the first signal contacts 48 can define a respective first mating end 48a, a respective first mounting end 48b, and an intermediate region that extends between the first mating end 48a and the first mounting end 48b. For instance, the intermediate region can extend from the first mating end 48a to the first mounting end 48b.

[0058] The first mounting ends 48b can be placed in electrical communication with respective signal conductors of the electrical cables 44. Further, each of the first grounds 50 can include at least one first ground mating end 54a and at least one first ground mounting end 54b. The first ground mounting ends 54b can be placed in electrical communication with respective grounds or drain wires of the electrical cables 44. The first mating ends 32a of the first electrical contacts 32 can include the first mating ends 48a of the first signal contacts 48 and the first ground mating ends 54a. The first mounting ends 32b of the first electrical contacts 32 can include the first mounting ends 48b of the first signal contacts 48 and the first ground mounting ends 54b.

[0059] It should thus be appreciated that the electrical cables 44 can be electrically connected to the first mounting ends 32b. In particular, when the electrical cables 44 are configured as twin axial cables, each of the cables can be electrically connected to the mounting ends of adjacent electrical signal contacts that define a differential pair. The electrical cables 44 can each further be electrically connected to ground plates 66 disposed adjacent to the differential signal pair, as described in more detail below. For instance, the electrical cables 44 can each further be electrically connected to the ground mounting ends of the ground plates 66. The ground plates can be disposed immediately adjacent to the respective differential signal pair. That is, no electrical contacts are disposed between the ground mounting ends and the mounting ends of the differential signal pair of signal contacts along the respective linear array.

[0060] The mating ends 48a of adjacent differential signal pairs along the first linear array can be separated by at least one ground mating end 54a along the transverse direction T. In one example, the mating ends 48a of adjacent differential signal pairs can be separated by a plurality of ground mating ends 54a. For instance, the mating ends 48a of the signal contacts 48 can define a convex contact surface 56, and a concavity opposite the convex contact surface 56 with respect to the lateral direction A. The ground mating ends 54a can include at least one first type of ground mating end 54a having a convex contact surface 58 that faces a first same direction as the convex contact surfaces 56, and an opposed concavity that faces a second same direction as the concavities of the signal contacts 48. The first same direction can be oriented opposite the second same direction. The first and second same directions can be oriented along the lateral direction A.

[0061] In one example, the ground mating ends 54a can include a pair of first types of ground mating ends 54a disposed between adjacent differential signal pairs along the respective first linear array 47, and thus along the transverse direction T. The first types of ground mating ends 54a can be aligned with each other along the transverse direction T. The ground mating ends 54a can further include a second type of ground mating end 54a having a convex contact surface 60 that faces opposite the convex contact surfaces 56 and 58. The second types of ground mating ends 54a can be aligned with each other along the transverse direction T. The convex contact surface 60 can face the second same direction. The second type of ground mating end 54a can be disposed adjacent the at least one first type of ground mating end 54a along the respective first linear array 47, and thus between the mating ends of adjacent differential signal pairs of the respective first linear array 47. In one example, the second type of ground mating end 54a can be disposed between adjacent first and second ones of the first types of ground mating ends 54a that define the pair of the first type of ground mating ends 54a along the first linear array, and thus with respect to the transverse direction T. For instance, the second type of ground mating ends 54a can be equidistantly spaced between the first and second ones of the first types of ground mating ends 54a. Accordingly, three ground mating ends 54a (e.g., two of the first types of ground mating ends and one of the second types of ground mating ends can be disposed between the mating ends of first and second pairs of immediately adjacent differential signal pairs in a repeating pattern. The term "immediately adjacent" in this context means that no additional differential signal pairs are disposed between the two pairs of immediately adjacent differential signal pairs. The first types of ground mating ends 54a can be offset with respect to the mating ends 48a of the first electrical signal contacts 48 along the lateral direction A. The second types of ground mating ends 54a can be offset with respect to the first types of ground mating ends 54a along the lateral direction A, such that the first types of ground mating ends 54a are disposed between the mating ends 48a and the second types of ground mating ends 54a along the lateral direction A. The second type of ground mating ends 54a can define a respective concavity opposite the respective convex contact surface 60, and thus faces the first same direction. As will be appreciated from the description below, the first grounds are configured to receive a ground plate of the second electrical connector between the first types of ground mating ends 54a and the second types of ground mating ends 54a.

[0062] It should thus be appreciated that the mating ends 48a of the signal contacts of each first linear array 47 can be offset along the lateral direction A with respect to one or more of the ground mating ends 54a of the first linear arrays 47. Alternatively, the mating ends 48a of the signal contacts of each first linear array 47 can be aligned with one or more of the ground mating ends 54a of the first linear arrays 47 along the transverse direction T. The ground mating ends 54a and the mating ends 48a of the signal contacts 48 can be spaced from each other at the same pitch along the transverse direction T. Alternatively, the ground mating ends 54a and the mating ends 48a of the signal contacts 48 can be spaced from each other at different pitches along the transverse direction T.

[0063] The mounting ends 48b of adjacent differential signal pairs can be separated by at least one ground mounting end 54b along the transverse direction T. In one example, the mounting ends 48b of adjacent differential signal pairs can be separated by a plurality of ground mounting ends 54b. For instance, the mounting ends 48b of the signal contacts 48 can be separated by a pair of ground mounting ends 54b. The ground mounting ends 54b and the mounting ends 48b of the signal contacts 48 of each first linear array can further be aligned with each other along the transverse direction T. Alternatively, the ground mounting ends 54b and the mounting ends 48b of the signal contacts 48 of each first linear array can be offset from each other along the lateral direction A. The first mounting ends 48b and the first ground mounting ends 54b can be configured in any manner as desired, including but not limited to solder balls, compression balls, press-fit tails, and j -shaped leads. Alternatively, and as described above, the first mounting ends 48b and the first ground mounting ends 54b can be configured to attach to respective electrical conductors and electrical grounds of an electrical cable. [0064] As described above, the vertical contacts 32 of the first electrical connector define an overall length from their mating ends 32a to their mounting ends 32b. The overall length can be shorter with respect to electrical contacts of right-angle connectors of conventional orthogonal electrical connector systems. Further, the vertical contacts 32 do not suffer from skew that is produced from right-angle electrical contacts having different lengths that define differential signal pairs when the first and second electrical connectors 22 and 24 are mated to each other. Thus, as described below, the electrical contacts 32 can operate more reliably at faster data transfer rates in orthogonal applications compared to orthogonal right-angle electrical connectors.

[0065] In one example, the overall length of the first electrical contacts 32 can be in a range between and including substantially 1 mm and substantially 16 mm. For instance, the overall length of the first electrical contacts 32 can be in a range between and including substantially 2 mm and substantially 10 mm. For example, the overall length of the first electrical contacts 32 can be in a range between and including substantially 3 mm and substantially 5 mm. In particular, the overall length of the first electrical contacts 32 can be substantially 4.3 mm.

[0066] The first linear arrays 47 can include first, second, and third ones of the first linear arrays 47 that are adjacent to each other. The first linear arrays can be arranged such that the second first linear array is between the first and third first linear arrays and immediately adjacent the first and third first linear arrays. Each of the first, second, and third ones of the first linear arrays 47 can include respective arrangements of differential signal pairs separated from each other by at least one ground. One of the differential signal pairs of the second one of the first linear arrays can be defined as a victim differential signal pair, and differential signals with data transfer rates of substantially 40 Gigabits/sec in six differential signal pairs in the first, second, and third ones of the first linear arrays 47 that are closest to the victim differential signal pair produce no more than six percent of worst-case, multi-active cross talk on the victim differential signal pair at a rise time between 20-40, in one example. For instance, the worst- case, multi-active cross talk on the victim differential signal pair can be no more than five percent in one example. For instance, the worst-case, multi-active cross talk on the victim differential signal pair can be no more than four percent. For instance, the worst-case, multiactive cross talk on the victim differential signal pair can be no more than three percent. For instance, the worst-case, multi-active cross talk on the victim differential signal pair can be no more than two percent. For instance, the worst-case, multi-active cross talk on the victim differential signal pair can be no more than one percent. The data transfer rates can be between and including substantially 56 Gigabits/second and substantially 1 12 Gigabits/second.

[0067] It is recognized that the grounds 50 can be defined by respective discrete ground contacts. Alternatively, the grounds 50 can be defined by a respective one of a plurality of ground plates 66. With continuing reference to Figs. 2A-2F, in one example the first electrical connector 22 can include a plurality of first leadframe assemblies 62 that are supported by the first connector housing 30. Each of the first leadframe assemblies 62 can include a dielectric or electrically insulative first leadframe housing 64, and a respective first linear array 47 of the plurality of first electrical contacts 32. Thus, it can be said that each leadframe assembly 62 is oriented along one of the first linear arrays 47 of the first electrical connector 22. The leadframe housing 64 can be overmolded onto the respective signal contacts 48. Alternatively, the signal contacts 48 can be stitched into the leadframe housing 64. Further, the grounds of the respective first linear array 47 can be defined by a first ground plate 66 as described above. The ground plate 66 can include a plate body 68 that is supported by the leadframe housing 64, such that the ground mating ends 54a and the ground mounting ends 54b extend out from the plate body 68. Thus, the plate body 68, the ground mating ends 54a, and the ground mounting ends 54b can all be monolithic with each other. Respective ones of the ground plate bodies 68 can be disposed between respective adjacent linear arrays of the intermediate regions of the electrical signal contacts 48.

[0068] Each of the leadframe assemblies 62 can define at least one aperture 71 that extends through each of the leadframe housing 64 and the ground plate 66 along the lateral direction. The at least one aperture 71 can include a plurality of apertures 71. A perimeter of the at least one aperture 71 can be defined by a first portion 65a of the leadframe housing 64. The first portion 65a of the leadframe housing 64 can be aligned with the ground plate 66 along the lateral direction A. The leadframe housing 64 can further include a second portion 65b that cooperates with the first portion 65 a so as to capture the ground plate 66 therebetween along the lateral direction A. The quantity of electrically insulative material of the leadframe housing 64 can further control the impedance of the first electrical connector 22. Further, a region of each at least one aperture 71 can be aligned with the signal mating ends 48a of the electrical signal contacts along the longitudinal direction L.

[0069] The ground plate 66 can be configured to electrically shield the signal contacts 48 of the respective first linear array 47 from the signal contacts 48 of an adjacent one of the first linear array 47 along the lateral direction A. Thus, the ground plates 66 can also be referred to as electrical shields.

[0070] Further, it can be said that an electrical shield is disposed between, along the lateral direction A, adjacent ones of respective linear arrays of the electrical signal contacts 48. In one example, the ground plates 66, the first compression balls, the leadframe housings 64, and the first connector housing 30 can be made of any suitable metal. In another example, the ground plates 66 can include an electrically conductive lossy material. In still another example, the ground plates 66 can include an electrically nonconductive lossy material.

[0071] Referring now to Figs. 3A-G, the second electrical connector 24 includes a dielectric or electrically insulative second connector housing 70 and a plurality of second electrical contacts 72 that are supported by the second connector housing 70. The second connector housing 70 defines a front end that, in turn, defines a second mating interface 74. The second connector housing 70 further defines a rear end that, in turn, defines a second mounting interface 76 opposite the second mating interface 74 along the longitudinal direction L. Further, the second mating interface 74 can be aligned with the second mounting interface 76 along the longitudinal direction L. The second electrical contacts 72 can define respective second mating ends 72a at the second mating interface 74, and second mounting ends 72b at the second mounting interface 76. Thus, the second electrical contacts 72 can be configured as vertical contacts whose second mating ends 72a and second mounting ends 72b are opposite each other with respect to the longitudinal direction L.

[0072] The longitudinal direction L defines the mating direction along which the second electrical connector 24 mates with the first electrical connector 22. The second connector housing 70 further defines first and second sides 78 that are opposite each other along the transverse direction T. The second connector housing 70 further defines a bottom surface 80 and a top surface 82 opposite the bottom surface 80 along the lateral direction A. The second electrical connector 24 is described herein with respect to the longitudinal direction L, the lateral direction A, and the transverse direction T in the orientation as if mated with the second electrical connector 24 or aligned to be mated with the first electrical connector 22. The second electrical connector 24 can define a receptacle connector, and the first electrical connector 22 can define a plug that is received in the receptacle of the second electrical connector 24.

Alternatively, the first electrical connector 22 can define a receptacle connector, and the second electrical connector 24 can define a plug that is received in the receptacle of the first electrical connector 22. [0073] Each of the second electrical connectors 24 can be configured to attach to a respective one of the second substrates 28. In one example, the second electrical connectors 24 can be configured to attach to the second substrates 28 adjacent an edge of the second substrate 28 that faces the first substrates 26. The second electrical connectors 24 can be configured to attach to the respective one of the second substrates 28 such that the bottom surface 80 faces the respective one of the second substrates 28. For instance, the second bottom surface 80 can define a second attachment surface that is configured to attach the second electrical connectors 24 to the respective ones of the second substrates 28. For instance, the second connector housing 70 can include an attachment member 41 (see Fig. 3B) that is configured to attach to the respective one of the second substrates 28. The attachment member can extend out from the bottom surface 80. It is recognized that the bottom surface 80 of the second electrical connector 24 faces a direction perpendicular to the direction that the bottom surface 40 of the first electrical connector 22 faces. The attachment member of the second electrical connector 24 can be configured as a projection or an aperture that receives hardware that, in turn, attaches the second electrical connector 24 to the respective one of the second substrates 28. Alternatively or additionally, the attachment member can include a bracket that, in turn, is secured to the respective one of the second substrates 28. Alternatively still, the attachment member 31 can be configured as the second outer housing 39 described above.

[0074] Alternatively or additionally, one or more of the second electrical connectors 24, up to all of the second electrical connectors 24, can float. That is, the second electrical connectors 24 can be free from attachment to each of the first and second substrates 26 and 28. An auxiliary attachment structure, if desired, can attach to the first and second substrates 26 and 28 so as to maintain the first and second substrates 26 and 28 in an orthogonal relationship to each other.

[0075] It should be appreciated that the attachment surface of the second electrical connector 24 is different than the ends of the second connector housing 70 that define the second mating interface 74 and the second mounting interface 76. For instance, the second attachment surface of the second electrical connector 24 can extend between the second mating interface 74 and the second mounting interface 76. In one example, the second attachment surface can extend from the second mating interface 74 to the second mounting interface 76. The second mating interface 74 and the second mounting interface 76 can be oriented along respective planes that are substantially parallel to each other. In one example, the second mating interface 74 and the second mounting interface 76 are defined by respective planes that extend along the lateral direction A and the transverse direction T. The second attachment surface can be oriented along a respective plane that is orthogonal to the planes of the second mating interface and the second mounting interface. For instance, the second attachment surface can be oriented along a respective plane that extends along the longitudinal direction L and the transverse direction T. Thus, when the second electrical connector 24 is attached to the second substrate 28, the second substrate 28 is oriented along a plane that extends along the longitudinal direction L and the lateral direction T. Thus, the second substrates 28 are oriented orthogonal with respect to the first substrates 26.

[0076] The second mounting ends 72b of the second electrical contacts 72 can be configured to electrically connect to any suitable electrical component. For instance, the second mounting ends 72b can be configured to electrically connect to respective second electrical cables 84. The second electrical cables 84 can be bundled as desired. The electrical cables 84 are further configured to be placed in electrical communication with the second substrate 28. Thus, the orthogonal electrical connector system 20 can further include the second electrical cables 84 that extend from the second electrical connector 24 to a second complimentary electrical connector 83 that can be placed in electrical communication with the second substrate 28. For instance, the second electrical cables 84 can terminate at a respective second termination connector 83 that is configured to mate with a complementary connector 85 that is mounted to the second substrate 28. The second termination connector and the complimentary connector can be mated with each other so as to place the second electrical cables 84 in electrical

communication with the second substrate 28. Alternatively, the second electrical cables 84 can be mounted directly to the second substrate 28. In one example, the cables 84 can be configured as twin axial cables. Thus, the cables 84 can include a pair of signal conductors disposed within an outer insulative jacket. It should be appreciated, however, that the cables 84 can be alternatively constructed as desired.

[0077] In one example, it is recognized that the cable assembly can be devoid of the first and second electrical connectors 22 and 24. Rather, the cable assembly can include the electrical connectors 83 and 46, and a plurality of electrical cables of the type described herein that are mounted at a first end to respective electrical contacts of the electrical connector 46, and at a second end to respective electrical contacts of the electrical connector 83. The electrical cables can be selectively attached to and detached from the first substrate 26, for instance by mating the electrical connector 46 to, and unmating the electrical connector 46 from, the electrical connector 49. The electrical cables can be selectively attached to and detached from the second substrate 28, for instance by mating the electrical connector 83 to, and unmating the electrical connector 83 from, the electrical connector 85.

[0078] The second electrical contacts 72 can be arranged in respective second linear arrays 87. The linear arrays 87 can be oriented parallel to each other. The second electrical connector 24 can include any number of linear arrays 87 as desired. For instance, the second electrical connector 24 can include two or more linear arrays 87. For instance, the second electrical connector 24 can include three or more linear arrays 87. For instance, the second electrical connector 24 can include four or more linear arrays 87. For instance, the second electrical connector 24 can include five or more linear arrays 87. For instance, the second electrical connector 24 can include six or more linear arrays 87. For instance, the second electrical connector 24 can include seven or more linear arrays 87. For instance, the second electrical connector 24 can include eight or more linear arrays 87. In this regard, it should be appreciated that the second electrical connector 24 can include any number of linear arrays as desired. As will be further appreciated from the description below, the second electrical connector 24 can include ground shields disposed between respective adjacent ones of the linear arrays 87.

[0079] The second linear arrays can be oriented substantially along the transverse direction T. Thus, reference to the second linear array 87 and the transverse direction T herein can be used interchangeably unless otherwise indicated. The second linear arrays 87 can be oriented substantially along a direction that is substantially parallel to the plane defined by the second attachment surface of the second connector housing 70. Similarly, the second linear arrays 87 can be oriented substantially along a direction that is substantially parallel to the second substrate 28 to which the second electrical connector 24 is attached. The term

"substantially" recognizes that the second electrical contacts 72 of each of the second linear arrays 87 can define regions that are offset from each other. For instance, the direction of the second linear arrays 87 can be oriented substantially perpendicular to the plane of the second substrate 28 to which the second electrical connector 24 is attached. Further, one or more of the mating ends 72a can be offset from each other along the lateral direction A as described in more detail below.

[0080] The second linear arrays 87 can be spaced from each other along a direction that intersects the second attachment surface. Thus, the second linear arrays 87 can be spaced from each other along a direction that intersects the plane defined by the second substrate 28 to which the second electrical connector 24 is attached. For instance, the second linear arrays 87 can be spaced from each other along a direction that is substantially perpendicular to the second attachment surface. In one example, the second linear arrays 87 can be spaced from each other along a direction that is perpendicular to the plane defined by the second substrate 28 to which the second electrical connector 24 is attached. Thus, the second linear arrays 87 can be spaced from each other along the lateral direction A. Because the second electrical contacts 72 are vertical contacts and lie in the respective second linear arrays 87, respective entireties of the electrical contacts 72 lie in a respective one of the second linear arrays 87 that extends along the respective direction. The respective direction can be a substantially linear direction. Thus, the mating ends 72a of each second linear array 87 are spaced from the mating ends 72a of adjacent ones of the second linear arrays 87 along the lateral direction A. Further, the mounting ends 72b of each second linear array 87 are spaced from the mounting ends 72b of adjacent ones of the second linear arrays 87 along the lateral direction A.

[0081] The second electrical contacts 72 can include a plurality of second signal contacts 88 and a plurality of second grounds 90 disposed between respective ones of the second signal contacts 88. At least respective portions of the grounds 90 can be substantially planar, for instance along a plane defined by the longitudinal direction L and the transverse direction T. In this regard, the grounds 90 can be defined by ground plates 106 as described in more detail below. In one example, the adjacent ones of the second signal contacts 88 that are adjacent each other along the second linear array 87 can define a differential signal pair. While the second signal contacts 88 and the second grounds 90 can be said to extend along a second linear array 87, it is recognized that at least a portion up to an entirety of the second signal contacts 88 and the second grounds 90 can be offset with respect to each other along the lateral direction A. As described in more detail below, the second signal contacts 98 and the second grounds 90 can be said to extend along a second linear array, since they are defined by a single leadframe assembly 102 that is oriented along the second linear array. It should be appreciated, however, that each of the second signal contacts 88 and each of the second grounds 90 can also be said to extend along respective linear arrays that are offset with respect to each other along the lateral direction A.

[0082] It should be appreciated that the second signal contacts 88 are not defined by electrical contact pads of a printed circuit board or electrical contacts of a printed circuit board. Further, the second grounds 90 are not defined as electrical contact pads of a printed circuit board or electrical contacts of a printed circuit board. Thus, it can be said that the second electrical contacts 72 can, in certain examples, not be defined by electrical contact pads of a printed circuit board or electrical contacts of a printed circuit board. Further, in the illustrated example, the second electrical connector 24 does not include any printed circuit boards.

[0083] In one example, the second signal contacts 88 of each differential pair can be edge coupled. That is, the edges of the contacts 88 that define differential pairs face each other. Alternatively, the second electrical signal contacts 88 can be broadside coupled. That is, the broadsides of the second electrical contacts 88 of the differential pairs can face each other. The edges are shorter than the broadsides in a plane defined by the lateral direction A and the transverse direction T. The edges can face each other within each of the respective second linear arrays. The broadsides of the second electrical contacts 88 of adjacent second linear arrays 87 can face each other along the lateral direction A, though a ground plate 106 can be disposed between the broadsides of adjacent second linear arrays 87 with respect to the lateral direction A. Each adjacent differential signal pair along a respective one of the second linear arrays 87 can be separated by at least one ground in a repeating pattern. Each of the second signal contacts 88 can define a respective second mating end 88a, a respective second mounting end 88b, and an intermediate region that extends between the second mating end 88a and the second mounting end 88b. For instance, the intermediate region can extend from the second mating end 88a to the second mounting end 88b.

[0084] The second mounting ends 88b can be placed in electrical communication with respective electrical signal conductors of the electrical cables 84. Further, each of the second grounds 90 can include at least one second ground mating end 94a and at least one second ground mounting end 94b. The second ground mounting ends 94b can be placed in electrical communication with respective grounds or drain wires of the electrical cables 84. In one example, the cables 84 are devoid of drain wires, and instead includes an electrically conductive ground member that is attached at one end to the ground shields of the cables 84, and attached at another end to the ground mounting ends 94b. The second mating ends 72a of the second electrical contacts 72 can include the second mating ends 88a of the second signal contacts 88 and the second ground mating ends 94a. The second mounting ends 72b of the second electrical contacts 72 can include the second mounting ends 88b of the second signal contacts 88 and the second ground mounting ends 94b.

[0085] It should thus be appreciated that the electrical cables 84 can be electrically connected to the second mounting ends 72b of the second electrical contacts 72. In particular, when the electrical cables 84 are configured as twin axial cables, each of the cables can be electrically connected to the mounting ends of adjacent electrical signal contacts that define a differential pair. The electrical cables 84 can each further be electrically connected to the ground plates disposed adj acent the differential signal pair. For instance, the electrical cables 84 can each further be electrically connected to the ground mounting ends of ground plates 106, described in more detail below. The ground plates 106 can be disposed adjacent to the differential signal pair. For instance, the electrical cables 84 can each further be electrically connected to the ground mounting ends disposed immediately adj acent to the respective differential signal pair. That is, no electrical contacts are disposed between the ground mounting ends and the mounting ends of the differential signal pair of signal contacts along the respective linear array.

[0086] The second mating ends 88a of adjacent differential signal pairs along the second linear array 87 can be separated by at least one second ground mating end 94a along the transverse direction T. In one example, the second mating ends 88a of adj acent differential signal pairs can be separated by a second ground mating end 94a that has a length along the transverse direction T greater than the length of the second mating ends 88a along the transverse direction T. Further, the second ground mating ends 94a can be configured as substantially planar blades. The planar blades can extend along respective planes that are oriented along the longitudinal direction L and the transverse direction T. Thus, referring also to Figs. 2A-2F, when the first and second electrical connectors 22 and 24 are mated with each other, the second ground mating ends 94a are inserted between the first and second types of ground mating ends 54a and 54b of a respective one of the first linear arrays 47 of the first electrical connector 22. Otherwise stated, the ground plate 106 is inserted between the first and second types of ground mating ends 54a and 54b with respect to the lateral direction. Thus, the convex contact surfaces of the first types of ground mating ends 54a contact a first side of the second ground mating ends 94a, and the second types of ground mating ends 54a contact a second side of the ground mating ends 94a that is opposite the first side along the lateral direction A.

[0087] The second mating ends 88a of the signal contacts 88 can define a second convex contact surface 96, and a concavity opposite the second convex contact surface 56 with respect to the lateral direction A. When the first and second electrical connectors 22 and 24 are mated with each other, the second mating ends 88a of the second signal contacts 88 can mate with the first mating ends 48a of the first signal contacts 48 without contacting the respective grounds of either of the first and second electrical connectors 22 and 24. For instance, the convex contact surfaces of the first and second signal contacts 48 and 88 contact each other, and ride along each other to a final mated position as the first and second electrical connectors 22 and 24 are mated to each other.

[0088] Referring again to Figs. 3A-3G, it should be appreciated that the second ground mating ends 94a can be disposed between immediately adjacent differential signal pairs of the second mating ends 88a along the transverse direction T. The term "immediately adjacent" in this context means that no additional differential signal pairs are disposed between the two pairs of immediately adjacent differential signal pairs. While the ground mating ends 94a can defined substantially planar blades, it should be appreciated that each of the ground mating ends 94a can alternatively define a respective convex contact surface and an opposed concave surface of the type described above.

[0089] The mounting ends 88b of immediately adjacent pairs of differential signal pairs can be separated from each other along the transverse direction T by at least one ground mounting end 94b. In one example, the mounting ends 88b of immediately adjacent pairs of differential signal pairs can be separated along the transverse direction by a plurality of ground mounting ends 94b. For instance, the mounting ends 88b of the signal contacts 88 can be separated by a pair of ground mounting ends 94b. The ground mounting ends 94b and the mounting ends 88b of the signal contacts 88 of each second linear array 87 can further be aligned with each other along the transverse direction T. Alternatively, the ground mounting ends 94b and the mounting ends 88b of the signal contacts 88 of each second linear array 87 can be offset from each other along the lateral direction A. One or both of the second mounting ends 88b and the second ground mounting ends 94b can be configured in any manner as desired, including but not limited to solder balls, compression balls, press-fit tails, and j-shaped leads. Alternatively, and as described above, the first mounting ends 48b and the first ground mounting ends 54b can be configured to attach to respective electrical conductors and electrical grounds of an electrical cable.

[0090] As described above, the vertical contacts 72 of the second electrical connector 24 define an overall length from their mating ends 32a to their mounting ends 32b. The overall length can be shorter with respect to electrical contacts of right-angle connectors of conventional orthogonal electrical connector systems. Further, the vertical contacts 72 do not suffer from skew that is produced from right-angle electrical contacts having different lengths that define differential signal pairs when the first and second electrical connectors 22 and 24 are mated to each other. Thus, as described below, the electrical contacts 72 can operate more reliably at faster data transfer rates in orthogonal applications compared to orthogonal right-angle electrical connectors.

[0091] In one example, the overall length of the second electrical contacts 72 can be in a range between and including substantially 1 mm and substantially 16 mm. For instance, the overall length of the second electrical contacts 72 can be in a range between and including substantially 2 mm and substantially 10 mm. For example, the overall length of the second electrical contacts 72 can be in a range between and including substantially 3 mm and substantially 5 mm. In particular, the overall length of the second electrical contacts 72 can be substantially 4.3 mm.

[0092] When the first and second electrical connectors 22 and 24 are mated with each other, the respective first and second mated electrical contacts 32 and 72 can define an overall mated length along the longitudinal direction L. It is appreciated that respective wiping surfaces of the mating ends 32a and 72a can wipe along each other and overlap each other when the electrical contacts 32 and 72 are mated with each other under a normal force provided by the respective electrical contacts. The overall mated length can be measured from the mounting ends 32b of the first electrical contacts 32 to the mounting ends 72b of the second electrical contacts. In one example, the overall mated length of the second electrical contacts 72 can be in a range between and including substantially 3 mm and substantially 20 mm. For instance, the overall mated length of the second electrical contacts 72 can be in a range between and including substantially 5 mm and substantially 20 mm. For instance, the range can be between and include substantially 5 mm and substantially 15 mm.

[0093] The second linear arrays 87 can include first, second, and third ones of the second linear arrays 87 that are adjacent to each other. The second linear arrays can be arranged such that the second one of the second linear arrays 87 is between the first and third ones of the second linear arrays 87 and immediately adjacent the first and third ones of the second linear arrays 87. Each of the first, second, and third ones of the second linear arrays 87 can include respective arrangements of differential signal pairs separated from each other by at least one ground. One of the differential signal pairs of the second one of the second linear arrays can be defined as a victim differential signal pair, and differential signals with data transfer rates of substantially 40 Gigabits/sec in six differential signal pairs in the first, second, and third ones of the second linear arrays 87 that are closest to the victim differential signal pair produce no more than six percent of worst-case, multi-active cross talk on the victim differential signal pair at a rise time in a range between and including 5 and 40 picoseconds, in one example. For instance, the data transfer rates can be in a range between and including substantially 56 Gigabits/second and 112 Gigabits/second.

[0094] It is recognized that the grounds 90 can be defined by respective ground plates 106 having the ground mating ends 94a and the ground mounting ends 94b. Alternatively, the grounds 90 can be defined by discrete ground contacts that each include respective ground mating ends and ground mounting ends.

[0095] With continuing reference to Figs. 3A-3G, in one example the second electrical connector 24 can include a plurality of second leadframe assemblies 102 that are supported by the second connector housing 70. Each of the second leadframe assemblies 102 can include a dielectric or electrically insulative second leadframe housing 104, and a respective second linear array 87 of the plurality of second electrical contacts 72. Thus, it can be said that each leadframe assembly 102 is oriented along one of the second linear arrays 87 of the second electrical connector 24. The leadframe housing 104 can be overmolded onto the respective signal contacts 88. Alternatively, the signal contacts 88 can be stitched into the leadframe housing 104. Further, the grounds of the respective second linear array 87 can be defined by a second ground plate 106 as described above. The ground plate 106 can include a plate body 108 that is supported by the leadframe housing 104, such that the ground mounting ends 94b extend out from the plate body 108. The plate body 108 can define the ground mating ends 94a. Alternatively, the ground mating ends 94a can extend out from the plate body 108 along the longitudinal direction L. It should be appreciated that the plate body 108, the ground mating ends 94a, and the ground mounting ends 94b can all be monolithic with each other. Respective ones of the ground plate bodies 108 can be disposed between respective adjacent linear arrays of the intermediate regions of the electrical signal contacts 88.

[0096] Each of the leadframe assemblies 102 can define at least one aperture 111 that extends through each of the leadframe housing 104 and the ground plate 106 along the lateral direction A. The at least one aperture 111 can include a plurality of apertures 111. A perimeter of the at least one aperture 111 can be defined by a first portion 105a of the leadframe housing 104. The first portion 105 a of the leadframe housing 104 can be aligned with the ground plate 106 along the lateral direction A. The leadframe housing 104 can further include a second portion 105b that cooperates with the first portion 105a so as to capture the ground plate 106 therebetween along the lateral direction A. The quantity of electrically insulative material of the leadframe housing 104 can further control the impedance of the first electrical connector 24. Further, a region of each at least one aperture 11 1 can be aligned with the signal mating ends 88a of the electrical signal contacts 88 along the longitudinal direction L.

[0097] In one example, the ground plate body 108 can include embossed regions 109 disposed in an alternating manner with a contact region 101 along the transverse direction. The contact region 101 can define the ground mating ends 94a. Further, the contact region 101 can define the ground mounting end 94b. The embossed regions 109 can be offset along the lateral direction A in a direction away from the mating ends 88a of the electrical signal contacts 88. At least a portion of the mating ends 88a of the electrical signal contacts 88 of the respective leadframe assembly 102 can be aligned with a respective one of the embossed regions 109 along the lateral direction A. For instance, respective entireties of the of the mating ends 88a of the electrical signal contacts 88 of the respective leadframe assembly 102 can be aligned with a respective one of the embossed regions 109 along the lateral direction A. In one example, the mating ends 88a of a differential signal pair can face a common one of the embossed regions 109 so as to define a gap therebetwen along the lateral direction A. The mating ends of respective differential signal pairs can be aligned with respective different ones of the embossed regions 109. A dielectric can be disposed in the gap. In one example, an entirety of the gap is defined by air. In another example, at least a portion of the gap up to an entirety of the gap can include electrically nonconductive plastic or any suitable dielectiric.

[0098] The embossed regions 109 can extend beyond the mating ends 88a with respect to the longitudinal direction L. The embossed regions 109 can include an embossed body 117 and an outer lip 1 13 that is offset away from the embossed body along the lateral direction A away from the respective mating ends 88a. The outer lips 113 can be aligned with the tips of the mating ends 88a along the longitudinal direction L. The grounds of the first and second electrical connectors 22 and 24 can mate with each other before the signal contacts of the first and second electrical connectors mate with each other when the first and second electrical connectors 22 and 24 are mated with each other. Conversely, the grounds of the first and second electrical connectors 22 and 24 can unmate from each other before the signal contacts of the first and second electrical connectors 22 and 24 unmate with each other when the first and second electrical connectors 22 and 24 are separated from each other.

[0099] In one example, the embossed regions 109 can face the respective concavities of the mating ends 88a that are opposite the second convex contact surfaces 96. Further, the embossed regions 109 can be spaced from the respective concavities along the lateral direction A. Therefore, when the mating ends of the signal contacts of the first and second electrical connectors 22 and 24 mate with each other, the mating ends 88a can flex toward the ground plate 106 without contacting the ground plate 106. In particular, the mating ends 88a can flex toward the respective embossments 109 without contacting the embossments 109. Further, when the first and second electrical connectors 22 and 24 are mated with each other, each of the ground mating ends 94a can be received between the pair of first type of ground mating ends 54a of the first electrical connector 22 (see Fig. 2F) and the second type of ground mating end 54a with respect to the lateral direction A. Thus, each of the blades that define the ground mating ends 94a can contact three separate ground mating ends of the first electrical connector 22.

[0100] When it is desired to unmate one of the first substrates 26 from the second substrates 28, an unmating force can be applied to the first substrate 26 that urges the first substrate 26 to move along the longitudinal direction L away from the second substrates 28. In this regard, the mating ends of the electrical contacts of the first and second electrical connectors 22 and 24 can define a normal force that acts against each other to resist separation of the first and second substrates 26 and 28 absent the unmating force. Accordingly, the first and second electrical connectors 22 and 24 can be devoid of respective latches that engage each other to retain the first and second electrical connectors 22 and 24 in the mated configuration when the first and second electrical connectors 22 and 24 are mated with each other.

[0101] It is recognized that the first electrical connectors 22 extend out from the first substrates 26 along the transverse direction so as to define a first height. The second electrical connectors 22 extend out from the first substrates 26 along the transverse direction T so as to define a first height. The first height can be defined by the number of electrical contacts in each of the first leadframe assemblies 62. The second height can be defined by the number of leadframe assemblies 102 in the second electrical connector 24.

[0102] Thus, a first kit of electrical connectors can include a plurality of first electrical connectors 22. Ones of the first electrical connectors 22 of the kit can have different number of differential signal pairs defined by the respective first leadframe assemblies 62 than others of the first electrical connectors of the kit. Thus, the ones of the first electrical connectors 22 can define a different height from the first substrate 26 than the others of the electrical connectors 22 when the electrical connectors are attached to respective first substrates 26. A second kit of electrical connectors can include a plurality of second electrical connectors 24. Ones of the second electrical connectors 24 of the kit can have different number of leadframe assemblies 102 than others of the second electrical connectors 24 of the second kit. Thus, the ones of the second electrical connectors 24 can define a different height from the second substrate 28 than the others of the electrical connectors 24 when the second electrical connectors 24 are attached to respective second substrates 28. It should be appreciated that a single kit can include each of the first and second kits.

[0103] It should be appreciated that the ground plate 106 can be configured to electrically shield the signal contacts 88 of the respective second linear array 87 from the signal contacts 88 of an adjacent one of the second linear arrays 87 along the lateral direction A. Thus, the ground plates 106 can also be referred to as electrical shields. Further, it can be said that an electrical shield is disposed along the lateral direction A, between adjacent ones of respective linear arrays of the electrical signal contacts 88. In one example, the ground plates 106 can be made of any suitable metal. In another example, the ground plates 106 can include an electrically conductive lossy material. In still another example, the ground plates 106 can include an electrically nonconductive lossy material.

[0104] Referring again to Figs. 1A-1D, and as described above, the electrical contacts 32 and 72 of the first and second electrical connectors 22 and 24, respectively, can define shorter distances from their respective mating ends to their respective mounting ends compared to right- angle electrical connectors of conventional orthogonal electrical connector systems. Further, vertical contacts do not suffer from skew that is produced from right-angle electrical contacts having different lengths that define differential signal pairs. Thus, the orthogonal electrical connector system 20 can transfer data at higher speeds than conventional orthogonal electrical connector systems. For instance, the orthogonal electrical connector system 20 can be configured to transfer differential signals from the mounting ends of one of the first and second electrical connectors 22 and 24 to the mounting ends of the other of the first and second electrical connectors 22 and 24 at data transfer rates of substantially 40 Gigabits per second /sec while producing no more than six percent of worst-case, multi-active cross talk on any of the differential signal pairs of the first and second electrical connectors 22 and 24 at a rise time in a range between and including 5 and 40 picoseconds. For instance, the data transfer rates can be in a range between and including substantially 56 Gigabits per second /sec and substantially 1 12 Gigabits per second while producing no more than six percent of worst-case, multi-active cross talk on any of the differential signal pairs of the first and second electrical connectors 22 and 24 at a rise time that is in a range between 5 and 40 picoseconds.

[0105] While the second electrical contacts 72 have been described herein as including electrical signal contacts 88 and electrical grounds 90, it should be appreciated that at least one of the second electrical contacts 72, such as a plurality of the second electrical contacts 72 up to all of the second electrical contacts 72 can alternatively be configured as electrical power contacts that are configured to carry electrical power.

[0106] The first and second electrical connectors 22 and 24 can be configured to directly mate with each other. That is, the first mating ends 32a of the first electrical connectors 22 are configured to directly contact the second mating ends 72a of the second electrical connectors 24 without passing into or through any intermediate structure, such as a midplane, an orthogonal adapter, or the like, so as to mate the first electrical connectors 22 to the second electrical connectors 24. Further, in one example, the first and second electrical connectors 22 and 24 can only mate with each other when they are oriented in a single relative orientation, such that the respective electrical contacts mate with each other in the manner described herein. Further, in one example, each of the first and second electrical connectors 22 and 24 can include only electrical signal contacts. Thus, each of the first and second electrical connectors 22 and 24 can be devoid of optical fibers and waveguides that are configured to transmit optical signals, which are commonly present in optical connectors,

[0107] It should be appreciated that the plurality of first electrical connectors 22 can be arranged in groups of first electrical connectors 22. Each group of the first electrical connectors 22 can be configured to attach to a respective different one of the first substrates 26. Similarly, the plurality of second electrical connectors 24 can be arranged in groups of second electrical connectors 24. Each group of the second electrical connectors 24 can be configured to attach to a respective different one of the second substrates 28. Thus, when the first and second electrical connectors 22 are mated to each other, each of the first substrates 26 is placed in data communication with each of the second substrates 28. For instance, the first electrical connectors 22 of each group of first electrical connectors 22 can mate with a respective second electrical connector of each of the groups of second electrical connectors 24. Similarly, when the first and second electrical connectors 22 are mated to each other, each of the second substrates 28 can be placed in data communication with each of the first substrates 26. For instance, the second electrical connectors 24 of each group of second electrical connectors 24 can mate with a respective first electrical connector of each of the groups of first electrical connectors 22. The first substrates 26 can be configured as daughter cards, and the second substrates 28 can be configured as daughter cards. Thus, daughter cards defined by the first substrates 26 can be removed from data communication with the daughter cards defined by the second substrates 28 and replaced by other daughter cards as desired. [0108] Thus, the orthogonal electrical connector system 20 can include at least one power bus bar 121. The power bus bar can be placed in electrical communication with one or more of the first substrates 26, up to all of the first substrates 26 so as to deliver electrical power to the first substrates 26. The orthogonal electrical connector system 20 can further carry one or both of electrical power and low speed signals configured to be placed in electrical

communication with one or more of the first substrates 26 when the first and second electrical connectors 22 and 24 are mated with each other.

[0109] As described above, and referring to Fig. 1C, the electrical connector system 20 can include the first termination electrical connector 46 and the complementary electrical connector 49. Thus an electrical connector system 45 can include the first termination electrical connector 46, which can be referred to as a first electrical connector of the connector system 45. The connector system 45 can further include the complementary electrical connector 49, which can be referred to as a second electrical connector of the connector system 45. As described above, in one example the complementary electrical connector can be configured to be mounted to a substrate, such as the substrate 26. Thus, in one example, the connector system 45 can be referred to as a daughtercard connector system, because the complementary electrical connector 49 can be configured to be mounted onto one of the daughtercards defined by the substrates 26.

[0110] The electrical connector system 20 can further include one or more integrated circuit (IC) packages 27 supported by one or more up to all of the first substrates 26. Each IC package 27 can include a respective dedicated substrate 29 and a respective IC chip 33 mounted to the dedicated substrate 29. The IC package 27 can further include a heat sink 35 that is configured to remove heat from the IC chip 33 during operation. The dedicated substrate 29 can be configured as a printed circuit board. In some examples, the IC chip 33 can be wirebonded to the dedicated substrate 29. The dedicated substrate 29 can be supported by the first substrate 26. The complementary electrical connectors 49 can be placed in electrical communication with a respective at least one of the IC packages 27. For instance, in one example, at least one or more of the complementary electrical connectors 49 up to all of the complementary electrical connectors 49 can be mounted to the first substrate 26. The first substrate 26 can include electrical traces that are configured to place the IC package 27 in electrical communication with the electrical contacts of the complementary electrical connectors 49 that are mounted to the first substrate 26. One or more up to all of the complementary electrical connectors 49 can be configured as right angle electrical connectors and mounted to the first substrate 26 such that the mounting interface of the complementary electrical connector 49 is oriented perpendicular to the first substrate 26. Alternatively or additionally, at least one or more of the complementary electrical connectors 49 can be configured as vertical electrical connectors and mounted to the first substrate 26 such that the mounting interface of the complementary electrical connector 49 is oriented parallel to the first substrate 26.

[0111] Alternatively or additionally, one or more of the complementary electrical connectors 49 can be mounted directly to the IC package 27. For instance, the complementary electrical connectors 49 can be mounted to the dedicated substrate 29. In one example, at least one or more up to all of the complementary electrical connectors 49 can be configured as right angle electrical connectors and mounted to the respective IC packages 27 such that the mounting interface of the complementary electrical connector 49 is oriented perpendicular to one or both of the first substrate 26 and the dedicated substrate 29. Alternatively or additionally, at least one or more up to all of the complementary electrical connectors 49 can be configured as vertical electrical connectors and mounted to the IC packages 27 such that the mounting interface of the complementary electrical connector 49 is oriented parallel to one or both of the first substrate 26 and the dedicated substrate 29. Alternatively or additionally still, at least one or more up to all of the complementary electrical connectors 49 can be configured as edge card connectors and mounted to the IC packages 27 such that the edge-card connectors receive the dedicated substrate 29, thereby placing respective ones of the electrical contacts in electrical communication with the IC chip 33. The first termination electrical connectors 46 can be mated with a respective one of the complementary electrical connectors 49 so as to place the electrical cables 44 in electrical communication with the IC package 27, and in particular with the IC chip 33. It is appreciated that some of the cables 44 are not shown connected between the electrical connector 22 and the respective first termination connector 46 in Figs. 1A-1C for the purposes of clarity in the illustration.

[0112] In one example, the complementary electrical connectors 49 can be arranged in respective groups that are placed, either directly or through the first substrate 26, in electrical communication with a respective one of the IC packages 27. Thus, a corresponding respective group of the first termination connectors 46 can be mounted to respective one of the

complementary electrical connectors 49 so as to place the cables 44 in electrical communication with the respective one of the IC packages 27.

[0113] Referring also to Figs. 4A-4B, the complementary electrical connector 49 can be constructed as described above with reference to the second electrical connector 24.

Accordingly, the complementary electrical connector 49 can be constructed as illustrated in Figs. 3A-3F. Thus, the description of the second electrical connector 24 can apply equally to the complementary electrical connector 49, with the exception that the leadframe assemblies 102 can be split along the respective linear array 87 into first and second separate leadframe assemblies 102a and 102b. For instance, the leadframe assemblies 102 can be bifurcated along the respective linear array 87. Thus, the first and second leadframe assemblies 102a and 102b can be aligned with each other along the respective linear array, and can include an equal number of electrical contacts. Alternatively, each of the leadframe assemblies 102 can be constructed as described in Figs. 2A-2F. Thus, the leadframe assemblies 102 can extend along an entirety of the respective linear array 87. The complementary electrical connector 49 can include the ground plates 106 that are configured to electrically shield the signal contacts 88 of the respective second linear arrays 87 from the signal contacts 48 of an adjacent ones of the second linear arrays 87 along the lateral direction A. Otherwise stated, the first termination electrical connector 46 (and the first electrical connector 22) can include electrical shielding between adjacent signal contacts along the lateral direction A. The electrical shielding can be provided by the ground plate 66.

[0114] The first termination electrical connector 46 can be constructed as described above with reference to the first electrical connector 22. Accordingly, the first termination electrical connector 46 can be constructed as illustrated in Figs. 2A-2F. Thus, the description of the electrical connector 22 can apply equally to the first termination electrical connector 46, with the exception that the leadframe assemblies 62 can be split along the respective linear array 47 into two separate leadframe assemblies. For instance, the leadframe assemblies 62 can be bifurcated along the respective linear array 47. Thus, the first and second leadframe assemblies can be aligned with each other along the respective linear array, and can include an equal number of electrical contacts. Alternatively, each of the leadframe assemblies 62 can be constructed as described in Figs. 2A-2F. Thus, the leadframe assemblies 62 can extend along an entirety of the respective linear array 47. Referring also to Figs. 2A-2F, the first termination electrical connector 46 can include the ground plates 66 that are configured to electrically shield the signal contacts 48 of the respective first linear array 47 from the signal contacts 48 of an adjacent ones of the first linear arrays 47 along the lateral direction A. Otherwise stated, the first termination electrical connector 46 (and the first electrical connector 22) can include electrical shielding between adjacent signal contacts along the lateral direction A. The electrical shielding can be provided by the ground plate 66. [0115] Further, the at least one ground mating end 54a disposed between respective adjacent pairs of differential signal pairs can provide electrical isolation between the adjacent pairs of differential signal pairs. In one example, the at least one ground mating end 54a can include first and second ground mating ends 54a as described above. For instance, the at least one ground mating end 54a can include first, second, and third consecutively arranged mating ends 54a that are consecutively arranged along the transverse direction T. In this regard, it should be appreciated that the transverse direction T can define a linear array direction along which each of the first linear arrays can be oriented. In one example, the second one of the ground mating ends 54a can face opposite the first and third ones of the ground mating ends 54a with respect to the lateral direction A. Further, the first and third ones of the ground mating ends 54a can face the same direction as the mating ends 48a of the signal contacts 48 along the respective first linear array. The second ones of the ground mating ends 54a can further be spaced in their respective entireties from at least one or both of the first and third ones of the ground mating ends 54a along the lateral direction A.

[0116] As illustrated in Fig. 4A, the first electrical connector 46 of the connector system 45 can be configured as a cable connector. Thus, as described above, the mounting ends of the signal contacts and the ground mounting ends can be mechanically and electrically connected to respective ones of electrical cables 44. The first complementary electrical connector 49 of the connector system 45 can be configured as a board connector configured to be mounted to a substrate. In one example, the substrate can be one of the first substrates 26.

Alternatively, the substrate can be one of the dedicated substrates 29 of an IC package 27. Thus, in one example, the mounting ends of the signal contacts and the ground mounting ends of the first complementary electrical connector 49 can be mechanically and electrically connected to the substrate 26, which can be configured as a printed circuit board. In another example, the mounting ends of the signal contacts and the ground mounting ends of the first complementary electrical connector 49 can be mechanically and electrically connected to the dedicated substrate 29 of the IC package 27, which can be configured as a printed circuit board. It should be appreciated, of course, that the first electrical connector 46 of the connector system 45 can alternatively be mounted to one of the first substrate 26 and the dedicated substrate 29, and the second electrical connector 49 of the connector system 45 can be mounted to the cables 44.

[0117] It should be further appreciated that instead of the substrate 26, one or both of the electrical connectors 46 and 49 can be mounted to respective substrates as shown in Fig. 4B. The substrates can be oriented parallel to each other when the electrical connectors 46 and 49 are mounted to them and mated with each other. The substrates can be configured as printed circuit boards. Thus, the connector system 45 can be configured as a mezzanine connector system. It should be further appreciated that one or both of the first and second electrical connectors 46 and 49 of the connector system can alternatively be configured as right-angle connectors whereby the respective mating ends and mounting ends are oriented substantially perpendicular to each other.

[0118] It should be appreciated that while the first termination electrical connector 46 can be configured as described above with respect to the first electrical connector 22, and the complementary electrical connector 49 can be configured as described above with respect to the second electrical connector 24, the connector system 45 can alternatively be configured such that the first termination electrical connector 46 can be configured as described above with respect to the second electrical connector 24, and the complementary electrical connector 49 can be configured as described above with respect to the first electrical connector 22.

[0119] Similarly, the second termination electrical connector 83 can also be constructed as described above with respect to the first electrical connector 22. Thus, the description of the electrical connector 22 can also apply to the second termination electrical connector 83. Further, the complementary electrical connector 85 that is configured to mate with the second termination electrical connector can be constructed as described above with respect to the second electrical connector. Thus, the description of the second electrical connector can also apply to the complementary electrical connector 85. Alternatively, the second termination electrical connector 83 can also be constructed as described above with respect to the second electrical connector 24. Thus, the description of the second electrical connector 24 can also apply to the second termination electrical connector 83. Similarly, the complementary electrical connector 85 that is configured to mate with the second termination electrical connector 83 can

alternatively be constructed as described above with respect to the first electrical connector 22. Thus, the description of the first electrical connector 22 can also apply to the complementary electrical connector 85.

[0120] It should be appreciated that the second termination connectors 83 can be provided in an array of second termination electrical connectors 83 that includes an outer second termination housing, and the second termination connectors 83 supported in the outer second termination housing in the manner described above. Thus, the electrical connector assembly 20 can include a plurality of arrays of second termination connectors 83. Alternatively, the second termination connectors 83 can be provided individually and mated individually to respective ones of the second complementary electrical connectors 85. [0121] In this regard, it should be appreciated that the second complementary electrical connectors 85 can be provided in an array of second complementary electrical connectors 85 that includes an outer second complementary housing, and the second complementary connectors 85 supported in the outer second complementary housing in the manner described above. Thus, the electrical connector assembly 20 can include a plurality of arrays of second complementary connectors 85. Alternatively, the second complementary connectors 85 can be provided individually and mated individually to respective ones of the second termination electrical connectors 83.

[0122] Below, signal integrity and performance data is disclosed for one or more up to all of the electrical connectors described herein. As will be appreciated from the description below, the electrical connectors described have improved performance characteristics compared to conventional electrical connectors. It has been found that the electrical connectors can be configured to transmit data at data transfer speeds of at least 56 Gbits/sec. For instance, the connector system 45 can be configured to transmit at least 56 Gbits/sec while compliant with NRZ line code, 2) at least 1 12 Gbits/sec while compliant with PAM-4 line code, and 3) at least 56 Gbits/sec at a rise time between 5 and 20 picoseconds with 6% or less (or -40 dB or less) of cross talk. For example, NRZ compliance can mean differential insertion loss between 0 dB and -2 dB at operating frequencies up to 30 GHz. For instance, the differential insertion loss between 0 dB and -2 dB while transferring electrical signals at a frequency to 30 GHz. Alternatively or additionally, NRZ compliance can also mean having a differential return loss between 0 dB and - 20 dB at while transferring electrical signals at a frequency up to 30 GHz. Alternatively or additionally still, NRZ compliance can mean differential near end cross talk (NEXT) between - 40 and -100 while transferring electrical signals at a frequency up to 30 GHz. It should be appreciated that reference is made below to the connector system 45 in connection with performance data, the performance data can apply to any one up to all of the first electrical connector 22, the second electrical connector 24, the first termination electrical connector 46, the first complementary electrical connector 49, the second termination electrical connector 83, and the second complementary electrical connector 85, both individually and in combination with each other. The connector system 45 can be referenced herein for the purposes of clarity and convenience.

[0123] In one example, the connector system 45 can operate at low crosstalk levels for any given single contributor/aggressor. For instance, at a rise time between 5 picoseconds and 20 picoseconds, the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than -40db of crosstalk in a range of operating frequency up to 40 Ghz. In one example, the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than -40db of crosstalk in a range of operating frequency up to approximately 45 Ghz. Thus, it should be appreciated that the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than -40db of crosstalk in a range of operating frequency up to 30 Ghz. Similarly, it should be appreciated that the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than -40db of crosstalk in a range of operating frequency up to 20 Ghz.

[0124] Further, at a rise time between 5 picoseconds and 20 picoseconds, the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than -35db of crosstalk in a range of operating frequency up to 50 Ghz. In one example, the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than -35db of crosstalk in a range of operating frequency up to 40 Ghz. Thus, it should be appreciated that the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than -35db of crosstalk in a range of operating frequency up to 30 Ghz. Similarly, it should be appreciated that the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than - 35db of crosstalk in a range of operating frequency up to 20 Ghz.

[0125] In another example, at a rise time between 5 picoseconds and 20 picoseconds, the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than 5% crosstalk in a range of operating frequency up to 40 Ghz. For instance, the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than 4% crosstalk in a range of operating frequency up to 40 Ghz. For example, the connector system 45 can produce near- end multiactive crosstalk (NEXT) of no greater than 3% crosstalk in a range of operating frequency up to 40 Ghz. In particular, the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than 2.0% crosstalk in a range of operating frequency up to 40 Ghz. In one example, the connector system 45 can produce near-end multiactive crosstalk (NEXT) of no greater than 1.0% crosstalk in a range of operating frequency up to 40 Ghz.

[0126] In another example, at a rise time between 5 picoseconds and 20 picoseconds, the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than - 40db of crosstalk in a range of operating frequency up to 40 Ghz. In one example, the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than -40db of crosstalk in a range of operating frequency up to approximately 45 Ghz. Thus, it should be appreciated that the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than -40db of crosstalk in a range of operating frequency up to 35 Ghz. Further, it should be appreciated that the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than -40db of crosstalk in a range of operating frequency up to 30 Ghz. Similarly, it should be appreciated that the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than -40db of crosstalk in a range of operating frequency up to 20 Ghz.

[0127] Further, at a rise time between 5 picoseconds and 20 picoseconds, the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than -35db of crosstalk in a range of operating frequency up to 50 Ghz. In one example, the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than -35db of crosstalk in a range of operating frequency up to 40 Ghz. Thus, it should be appreciated that the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than -35db of crosstalk in a range of operating frequency up to 30 Ghz. Similarly, it should be appreciated that the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than - 35db of crosstalk in a range of operating frequency up to 20 Ghz.

[0128] In another example, at a rise time between 5 picoseconds and 20 picoseconds, the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than 5% crosstalk in a range of operating frequency up to 40 Ghz. For instance, the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than 4% crosstalk in a range of operating frequency up to 40 Ghz. For example, the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than 3% crosstalk in a range of operating frequency up to 40 Ghz. In particular, the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than 2.0% crosstalk in a range of operating frequency up to 40 Ghz. In one example, the connector system 45 can produce far-end multiactive crosstalk (FEXT) of no greater than 1.0% crosstalk in a range of operating frequency up to 40 Ghz.

[0129] Further, each of the electrical connectors 46 and 49 can have a high density of electrical contacts. For instance, one or each of electrical connectors 46 and 49 can include between 50 and 112 differential pairs of electrical signal contacts per square inch. In one example, one or each of electrical connectors 46 and 49 can include between 50 and 85 differential pairs of electrical signal contacts per square inch. For instance, one or each of electrical connectors 46 and 49 can include between 55 and 75 differential pairs of electrical signal contacts per square inch. In particular, one or each of electrical connectors 46 and 49 can include between 59 and 72 differential pairs of electrical signal contacts per square inch. Each of the mating ends, including ground mating ends and signal mating ends, can be spaced from each other at a pin-to-pin pitch of from approximately 0.6 mm to approximately 1.0 mm, such as from approximately 0.7 mm to approximately 0.9 mm, including approximately 0.8 mm.

[0130] Thus, the connector system 45 can define an aggregate data transfer rate from approximately 1 terabyte (TB) over a square inch area to approximately 4 TB over the square inch area, including from approximately 1.5 TB over the square inch area to approximately 3 TB over the square inch area, including from approximately 1.8 TB over the square inch area to approximately 2.3 TB over the square inch area, such as approximately 2.1 TB over the square inch area . The square inch area can be defined along a plane that is defined by a plane that is oriented normal to the respective electrical contacts.

[0131] The connector system 45 can define a mated stack height from approximately 7mm to approximately 50 mm, such as from approximately 10mm to approximately 40 mm, including approximately 15 mm to approximately 25 mm, including approximately 7mm, approximately 10mm, and approximately 20 mm.

[0132] The connector system 45 can further operate at a target impedance as desired. In one example, target impedance for the differential signal pairs can range from approximately 80 ohms to approximately 110 ohms, including from approximately 85 ohms to approximately 100 ohms, including from approximately 90 ohms to approximately 95 ohms, such as approximately 92.5 ohms.

[0133] In one example, any one or more up to all of the electrical connectors described herein can produce a differential insertion loss that is between 0 and -1 dB while transmitting electrical signals along the respective electrical signal contacts at all operating frequency op to 27 GHz. In another example, any one or more up to all of the electrical connectors described herein can produce a differential insertion loss that is between 0 and -2 dB while transmitting electrical signals along the respective electrical signal contacts at all operating frequencies op to 45 GHz.

[0134] Alternatively or additionally, any one or more up to all of the electrical connectors described herein can produce an insertion loss response that has a single pole RF response with a 3db cutoff frequency greater than 70 GHz. Further, the insertion loss can be less than -3db while transferring electrical signals along the electrical signal contacts at all frequencies up to 70 GHz with a flat linear phase response.

[0135] Alternatively or additionally, any one or more up to all of the electrical connectors described herein can produce a differential return loss between -15 dB and -45 dB while transferring data signals along the respective electrical signal contacts at all data transfer frequencies between 20 GHz and 45 GHz. For instance, the differential return loss can be between -30 dB and -45 dB. Further, the data transfer frequencies can be between 20 GHz and 25 GHz. For instance, the data transfer frequencies can be between 25 GHz and 30 GHz. In one example, the data transfer frequencies can be between 30 GHz and 35 GHz. For example, the data transfer frequencies can be between 35 GHz and 40 GHz. In one example, the data transfer frequencies can be between 40 GHz and 45 GHz.

[0136] Alternatively or additionally still, the differential TDR of any one or more up to all of the electrical connectors described herein at 17 picosecond rise time (10% to 90%) along the electrical signal contacts can have an impedance confined between 85 and 100 Ohms at all times from 0 picoseconds to 200 picoseconds.

[0137] Alternatively or additionally, any one or more up to all of the electrical connectors described herein can produce differential near end cross talk (NEXT) between -40 dB and -100 dB while transferring electrical signals along the respective electrical signal contacts at all frequencies up to 35 GHZ. In one example, the differential NEXT can be confined between - 30 dB and -100 dB while transferring electrical signals along the respective electrical signal contacts at all frequencies between 35 GHz and 45 GHZ.

[0138] Alternatively or additionally, any one or more up to all of the electrical connectors described herein can produce differential far end cross talk (FEXT) between -40 dB and -100 dB while transferring electrical signals along the respective electrical signal contacts at all frequencies up to 30 GHZ. In one example, the differential FEXT can be confined between - 30 dB and -100 dB while transferring electrical signals along the respective electrical signal contacts at all frequencies up to 45 GHZ. In another example, FEXT can be less than -40dB frequency domain cross talk up while transmitting electrical signals along the respective electrical signal contacts at all frequencies up to 40 GHz.

[0139] Alternatively or additionally, any one or more up to all of the electrical connectors described herein can produce less than -0.5 dB of resonance while transferring electrical signals along the respective electrical signal contacts at all frequencies up to 67 GHz without any magnetic or electrical absorbing surfaces in the electrical connector. Rather, the electrical connectors can define respective grounds of the type described herein. For example, the resonance can be less than -.4 dB. For example, the resonance can be less than -0.3 dB. For example, the resonance can be less than -0.2 dB. For example, the resonance can be less than - 0.1 dB. It should be appreciated that the frequencies can be up to 30 GHz in one example. The frequencies can be up to 35 GHz in another example. The frequencies can be up to 40 GHz in another example. The frequencies can be up to 45 GHz in another example. The frequencies can be up to 50 GHz in another example. The frequencies can be up to 55 GHz in another example. The frequencies can be up to 60 GHz in another example. The frequencies can be up to 65 GHz in another example.

[0140] Alternatively or additionally, any one or more up to all of the electrical connectors described herein can define an impedance between 90 Ohms and 96 Ohms while transmitting electrical signals along the respective electrical signal contacts at all frequencies up to 40 Gigahertz at a 8.5 picosecond rise time.

[0141] Electrical connectors of the type disclosed herein can be configured to transmit electrical signal contacts along the respective electrical signal contacts at 56 Gigabits/sec NRZ and 112 Gigabits/sec GBPS, with linear arrays of electrical signal contacts and ground shields disposed therebetwen. For instance, the electrical connectors can include two or more parallel linear arrays of signal contacts with ground shields disposed therebetween. For instance, the electrical connectors can include three or more parallel linear arrays of signal contacts with ground shields disposed therebetween. For instance, the electrical connectors can include four or more parallel linear arrays of signal contacts with ground shields disposed therebetween. For instance, the electrical connectors can include five or more parallel linear arrays of signal contacts with ground shields disposed therebetween. For instance, the electrical connectors can include six or more parallel linear arrays of signal contacts with ground shields disposed therebetween. For instance, the electrical connectors can include seven or more parallel linear arrays of signal contacts with ground shields disposed therebetween. For instance, the electrical connectors can include eight or more parallel linear arrays of signal contacts with ground shields disposed therebetween.

[0142] As described above, the electrical connector system 20 is one example of an electrical connector system having one or more components that can be coated with eDLC. Referring now to Figs. 5A-5D, an electrical connector system 162 constructed in accordance with another embodiment includes one or more components that can be coated with the eDLC. The electrical connector system 162 can include an edge card electrical connector 164 and a substrate 166 configured to be mated with the edge card connector 164. The substrate 166 can be configured as a printed circuit board.

[0143] The electrical connector 164 can include an electrically insulative electrical connector housing 165 and at least one electrical contact 168 that is supported by the connector housing 165. The at least one electrical contact 168 can be configured as a plurality of electrical contacts 168. The electrical contacts 168 can include signal contacts and ground contacts arranged in accordance with any example described above with respect to the electrical connector system 20. The connector housing 165 can define a receptacle 170 that is configured to receive a portion of the substrate 166. The receptacle 170 can define a mating interface of the electrical connector 164. The electrical contacts 168 can be arranged in at least one linear array 172. For instance, the electrical contacts 168 can be arranged in first and second linear arrays 172a and 172b, respectively, disposed on opposite sides of the receptacle 170. The electrical contacts 168 can have respective mating ends 173 that project into the receptacle 170. The mating ends 173 can be cantilevered. The electrical contacts 168 can have respective mounting ends 174 that are configured to be mounted to a complementary electrical component. The complementary electrical component can be configured as a printed circuit board 181 or as electrical cables. The electrical contacts 168 can each include an intermediate portion 176 that extends from the mating end 173 to the mounting end 174. The electrical contacts 168 of the first linear array 172a can be identical mirror images of the electrical contacts 168 of the second linear array 172b, or can be differently shaped as desired.

[0144] The substrate 166 is configured to be inserted into the receptacle 170 so as to mate the substrate 166 with the electrical connector 164. In particular, the substrate 166 can include at least one mounting location that is configured to establish mechanical and electrical contact the at least one electrical contact 168 when the substrate 166 is inserted into the receptacle 170. In one example, the mounting location can be configured as an electrical contact pad 178. For instance, the substrate 166 can include a plurality of electrical contact pads 178 that are supported by the dielectric substrate body which can be made from FR-4. The electrical contact pads 178 are configured to contact a complementary one of the plurality of electrical contacts 168 when the substrate 166 is inserted into the receptacle 170. The mating ends 173 of the electrical contacts 168 are configured to apply a normal force against the contact pads 178 when the substrate 166 is mated with the electrical connector 164. The substrate body, and thus the substrate 166, includes a first surface 180 and a second surface 182 opposite the first surface 180. The substrate 166 can further include an edge 186 that is configured to be inserted into the receptacle 170. Thus, the substrate 166 can be referred to as an edge card. The electrical contact pads 178 can be arranged in at least one linear array along the edge 186. The linear array of electrical contact pads 178 can be disposed on at least one of the surfaces 180 and 182. For instance, the substrate 166 can include first and second linear arrays 188a and 188b of electrical contact pads 178 disposed on the first and second surfaces 180 and 182, respectively, and arranged along the edge 186. In one example, the substrate 166 can include a substrate body that supports the contact pads 178 and electrical traces that are routed from the contact pads 178. The substrate body can be defined by FR-4 in one example.

[0145] When the substrate 166 is inserted into the receptacle 170, the electrical contacts pads 178 of the first linear array 188a can contact the mating ends 173 of respective ones of the electrical contacts 168 of the first linear array 172a. Similarly, the electrical contacts pads 178 of the second linear array 188b can contact the mating ends 173 of respective ones of the electrical contacts 168 of the second linear array 172b. In particular, the electrical contact pads 178 can wipe against the mating ends 173 of the electrical contacts 168 as the edge card is mated with the electrical connector 164. Similarly, the mating ends 173 can wipe against the electrical contact pads 178 as the edge card is mated with the electrical connector 164. The electrical contacts 168 and contact pads 178 can further wipe against each other when the edge card is removed from the receptacle 170 so as to unmate the edge card from the electrical connector 164. The electrical connector system 162 is further described in U. S. Patent No. 9, 130,313. U.S. Patent No. 9, 130,313 is hereby incorporated by reference as if set forth in its entirety herein.

[0146] As will be appreciated from the description below, the electrical contact pads 178 can include the eDLC coating. In particular, a wiping surface of the electrical contact pads 178 that are configured to wipe against the electrical contacts 168 can be defined by the eDLC coating. Alternatively or additionally, as described above with respect to the electrical connector system 20, at least a portion of the electrical contacts 168 can include the eDLC coating. For instance, at least the mating ends 173 can include the eDLC coating. In particular, a wiping surface of the electrical contacts 168 that are configured to wipe against the electrical contact pads 178 can be defined by the eDLC coating. In this regard, for any surface of any of the electrically conductive components described herein that is configured to contact another surface for the communication of electrical signals or electrical power, the surface can be coated with the eDLC.

[0147] Referring now to Fig. 6A generally, and as described above, at least one electrical component, or electrically conductive component, 1 10 of the electrical connector system 20 can include an electrically conductive layer 1 12 of eDLC so as to establish reliable electrical conductivity at least at the electrically conductive layer 112. For instance, the electrically conductive layer 1 12 can include eDLC. In one example, the electrically conductive layer 1 12 can be defined by eDLC. The electrical component 1 10 can include a component body 1 14 that can be made of an electrically conductive material or an electrically nonconductive material. The component body 1 14 can define an outer body surface 116, and at least a portion of the outer surface 116 can be coated with the electrically conductive layer 112. For instance, the electrically conductive layer 1 12 can be deposited directly onto the outer surface 116. In particular, carbon ions of the eDLC can be implanted and deposited directly onto the outer surface 1 16. Alternatively, if desired, the electrical component 1 10 can include one or more intermediate layers between the outer surface 1 16 and the electrically conductive layer 112 as desired. The carbon ions of the eDLC can thus be implanted and deposited onto the intermediate layer so as to coat the component body 114. Further, because the eDLC is a suitable electrical conductor that resists tarnishing and abrasion over time, the electrically conductive layer 112 can be devoid of additional layers applied to the outer surface of the eDLC, such as pore plugging lubricants and anti-tarnish layers. Thus, the eDLC can define the outer surface of the electrical component 1 10.

[0148] In one example, the component body 1 14 can be made from a metal, or metallic alloy. In certain embodiments, the outer surface 1 16 of the component body 1 14 can be defined by a metal or metallic alloy. In other examples, the component body 114 can be made from a non-metallic material. The non-metallic material can include a metal or metallic alloy layer disposed over the non-metallic material. Alternatively, the component body 1 14 can be free from metals and metallic alloys. Thus, the outer surface 1 16 of the component body 114 can be defined by an electrically non-conductive material.

[0149] For instance, referring now to Figs. 6B-6F, the electrical component can be configured as at least one electrical contact 118 of an electrical connector. The electrical connector can be of any suitable type described above, or any alternatively constructed electrical connector as desired. Thus, the at least one electrical contact 118 can be as described with respect to the first electrical contacts 32, the second electrical contacts 72, the electrical contacts 168, or any suitable alternatively constructed electrical contacts as desired. It should be appreciated that the at least one electrical contact 1 18 can include at least one electrical signal contact. Alternatively or additionally, the at least one electrical contact 1 18 can include at least one electrical ground contact. Alternatively or additionally, the at least one electrical contact 118 can include at least one electrical power contact. Thus, the at least one electrical contact 118 can include one or more, up to all of, a plurality of signal contacts, a plurality of ground contacts, and a plurality of electrical power contacts. The at least one electrical contact 118 can be a vertical contact or a right-angle contact. Further, the at least one electrical contact 1 18 can define a mating end 1 18a. The mating end 118a can be configured in any suitable manner as desired. In one example, the mating end can be configured as a receptacle contact that receives a plug contact when the receptacle and plug contacts are mated to each other. In another example, the mating end can be configured as a plug contact that is received by a receptacle contact when the receptacle and plug contacts are mated to each other, or a gender-neutral contact. In still another example, the mating end can be configured to contact and apply a normal force to an electrical contact pad of a substrate. In certain examples, the mating end of the receptacle contact (also referred to as a receptacle mating end) can be more resilient and deflectable than the mating end of the plug contact (also referred to as a plug mating end) when the receptacle mating end and the plug mating end are mated with each other. For instance, the plug mating end can be substantially rigid as the plug mating end and the receptacle mating end are mated with each other, while the receptacle mating end deflects as the plug mating end and the receptacle mating end are mated with each other. Both the receptacle mating end and the plug mating end can be cantilevered.

[0150] The substrate can be configured as a printed circuit board. In one example, the printed circuit board can be configured as an edge card. The electrical contact 1 18 can define a mounting end that is configured to be mounted onto an underlying substrate, such as a printed circuit board, in the manner described above. The mounting end can be configured as described above with respect to the mounting ends 32b, 72b, 174, or any suitable alternatively constructed mounting end as desired.

[0151] Accordingly, the component body 1 14 can be configured as an electrical contact body 120 of the electrical contact 1 18. The contact body 120 can define an outer surface 122. Thus, the outer surface 1 16 of the electrical component 1 10 can be defined by the outer surface 122 of the contact body 120. The contact body 120 can include a base layer 124. The base layer 124 can include an electrically conductive material, such as copper, a copper alloy, bronze, a bronze alloy, such as a phosphor bronze alloy or a beryllium copper alloy, or the like. The material of the base layer 124 can define the outer surface 122 of the contact body 120 in some examples (see Fig. 6C). However, in other examples, because copper and bronze can tarnish in the presence of oxygen over time, the contact body 120 can include a barrier layer 126 disposed on the base layer 124 as illustrated in Fig. 6B. Thus, the barrier layer 126 can define the outer surface 122 of the contact body 120. The barrier layer 126 can be made of any material suitable for deposition onto the base layer 124, so as to at least resist or prevent tarnishing at the outer surface 1 16 of the contact body 120. In one example, the barrier layer can be made from Nickel or any suitable alternative material, such as tin, aluminum, silver, gold, lead, Pd, an alloy of Pd such as PdNi, NiP, Cu3Sn, Cu6Sn5 , and Cu Be 2%. Thus, in one example, the eDLC can coat a copper plated with the barrier layer. In one example, the eDLC can coat nickel-plated copper. For instance, the eDLC can coat pdNi-plated copper. In other examples, the eDLC can coat the copper without a barrier layer. Thus, it should be appreciated that the contact body 120 can be at least substantially free of palladium. Alternatively or additionally, the contact body 120 can be at least substantially free of nickel. Alternatively or additionally still, the contact body 120 can be at least substantially free of PdNi.

[0152] In one example, the electrical contact body 120 can be at least substantially free of gold. Alternatively or additionally, the electrical contact body 120 can be at least substantially free of silver. Alternatively or additionally still, the electrical contact body 120 can be at least substantially free of platinum. Alternatively or additionally still, the electrical contact body 120 can be at least substantially free of tin. For instance, the electrical contact body 120 can be entirely free of one or more up to all of silver, gold, platinum, and tin in one example. The term "substantially free" with respect to a material means that the material is not present in sufficient quantity to provide sufficient electrical conductivity without the layer 112 of eDLC. In this regard, it should be appreciated that the outer surface 1 16 of the component body 1 14 can be made of a first material, and the layer 112 of eDLC can be coated onto at least a portion of the outer surface 116. The electrically conductive component 1 10 can be identical with respect to another electrically conductive component, with the exception that the another electrically conductive component lacks the layer of eDLC and has at least one of silver and gold in one example.

[0153] While the base layer 124 can be electrically conductive as described above, it should be appreciated that the base layer 124 can alternatively be defined by an electrically insulative material. For instance, the base layer 124 can be made from an electrically insulative rubber or plastic.

[0154] The eDLC can be resistive to tarnishing and corroding over time. Further, the eDLC can have a hardness suitable to withstand forces at the mating end of electrical contacts when, for instance, the electrical component is defined by the mating end of an electrical contact. Thus, in some examples, the electrical component does not include any additional layers, such as pore-plugging lubricants, anti-tarnish layers, or additional metals applied to the outer surface of the eDLC. Thus, the electrically conductive layer 1 12 can consist essentially of the eDLC. In one example, the electrically conductive layer can consist of the eDLC. Thus, the eDLC can define the outer surface of the electrical component 110. The eDLC can have an average thickness that ranges from approximately (e.g., within manufacturing tolerance) 50 nanometers to approximately 10 micrometers at the mating end of the electrical contact. For instance, the average thickness can range from approximately 100 nanometers to approximately 5

micrometers.

[0155] It is appreciated that the eDLC can be applied to the electrical contact body 120 along an entirety of the length of the electrical contact 1 18 from the mating end 118a to the mounting end 1 18. Thus, the eDLC can be coated onto the outer surface 122 from the mating end 1 18a to the mounting end 118. Alternatively, the eDLC can be localized at the mating end 1 18a of the electrical contact 118. Accordingly, the eDLC can extend along a length of the electrical contact 118 that is less than the entire length of the electrical contact 1 18.

[0156] As described above, it is recognized that when first and second electrical connectors mate with each other along a mating direction, outer wiping surfaces of the mating ends of the respective electrical contacts ride along each other or along contact pads of a substrate along a distance that is commonly referred to as a wiping distance. The electrical contacts also apply a normal force against each other along a direction substantially normal to the mating direction that keeps the mating ends in contact with each other. The eDLC coating can define the wiping surfaces. Thus, the electrically conductive component 110 is configured to mate with a complementary electrical component whereby the wiping surface is configured to wipe against a complementary electrically conductive surface so as to place the wiping surface and the complementary electrically conductive surface in electrical communication with each other for at least one of data transmission therebetween and electrical power transmission therebetween. Thus, at least one of electrical data and electrical power can be communicated between the wiping surface and the complementary electrically conductive surface. In this regard, it should be appreciated that the electrical contacts can be configured as electrical power contacts in certain examples.

[0157] In one example, the outer wiping surface can be configured to mate with and unmate from the complementary electrically conductive surface over at least one cycle as desired over at least one cycle without removing eDLC in sufficient quantity so as to expose the outer body surface 1 16. Each cycle can be completed when the outer wiping surface has mated with the complementary mating surface and subsequently unmated from the complementary mating surface. In one example, the at least one cycle can range from one to fifty cycles. In another example, the at least one cycle can range from 51 to 500 cycles. In another example, the at least one cycle can range from 501 to 1000 cycles. In another example, the at least one cycle can range from 1001 to 5000 cycles. In another example, the at least one cycle can range from 5001 to 10,000 cycles. In another example, the at least one cycle can range from 10,001 to 20,000 cycles. It should further be appreciated that the electrical component 1 10 that includes the outer wiping surface can be configured to mate with and unmate from the complementary electrically conductive component over the at least one cycle described above. Each cycle can be completed when the electrically conductive component has mated with the complementary electrically conductive component and subsequently unmated from the complementary electrically conductive component. In one example, the electrically component can include a plurality of outer wiping surfaces. Thus, it can be said that the plurality of wiping surfaces can be configured to mate with and unmate from respective ones of a plurality of wiping surfaces of the complementary electrical component over the at least one cycle described above. In one example, the electrically conductive component 1 10 can be configured as an electrical connector. In another example, the electrically conductive component 1 10 can be configured as a substrate. The substrate can be configured as a printed circuit board.

[0158] Conventional electrical contacts are mated along lengthy wiping distances in order to ensure that tarnished or oxidized layers are sufficiently penetrated to ensure a reliable metal-on-metal contact is established through the layers of anti-tarnish, lubricants, and the like. However, because the eDLC does not tarnish or oxidize, the wiping distance at the mating end 1 18a can be shorter than conventional electrical contacts. In one example, the wiping distance can be less than approximately (taking into account manufacturing tolerances) 1 millimeter, and greater than or equal to 0.25 mm when the electrical connector is configured as a backplane connector. For instance, the wiping distance can be within a range from approximately 0.25 mm to approximately 0.75 mm. Accordingly, the electrical contact 1 18 can have a length that is less than the length of conventional electrical contacts 1 18 for a similarly sized electrical connector.

[0159] As described above, and referring now to Figs. 6D-6E, the electrical contact 1 18 can include a mounting end 118b that is configured to be mounted to an underlying substrate 128 so as to establish an electrical connection between the electrical contact 1 18 and the substrate 128. The substrate 128 can be configured as a printed circuit board. In one example, the printed circuit board can be configured as a backplane or daughter card as described above. It should be appreciated that the substrate 128 can alternatively be configured as any suitable substrate as desired that is configured to establish an electrical connection with the electrical contact 1 18.

[0160] One method of mounting electrical contacts of conventional electrical connectors to underlying substrates is through the use of solder balls. In particular, in ball grid array (BGA) connectors, solder balls are placed between the mounting ends of electrical contacts and electrical contact pads of the underlying substrate. The substrate and the electrical connector are then subj ected to a solder reflow operation that causes the solder balls to melt and fuse the electrical contacts to the contact pads of the substrate. Unfortunately, the exposure of the electrical connector to high solder reflow temperatures can cause warping of the connector housing, also known as potato-chipping.

[0161] The present disclosure recognizes that the electrical component 1 10 can include mounting balls 130 that are coated with eDLC so as to establish an electrical connection between the mounting ends 118b of electrical contacts 1 18 and respective electrical mounting locations 132 of the substrate 128. For instance, the mounting locations 132 can be configured as electrical contact pads. Advantageously, the eDLC of the layer 112 can be sufficiently ductile so as to be compressible without compromising the electrically conductive properties of the layer 1 12. Thus, the mounting balls 130 can include a compressible body 134 of any suitable material that is compressible and configured to be coated with the layer 112 of eDLC. For instance, the compressible body 134 can be any suitable resin or elastomer. In one example, the compressible body 134 can be a Poly amide resin or Poly amide elastomer. In one specific example, the compressible body 134 can be made from rubber or silicone. Thus, it is recognized that the compressible body 134 can be electrically nonconductive. It is further recognized that the component body 1 14 of the electrical component 1 10 described above can be defined by the compressible body 134 of the mounting ball 130.

[0162] The mounting ball 130 can further include the layer 1 12 of eDLC coated onto the outer surface of the compressible body 134 in the manner described herein. The mounting ball 130 can be compressible in response to a compressive force applied by one or both of the substrate 128 and the electrical connector that includes the electrical contacts 1 18. For instance, the compressive force can be applied by one or both of the substrate 128 and the mounting ends 1 18b of the electrical contacts 118. In one example, the compressive force applied to each mounting ball 130 by the electrical connector can be in the range of approximately 2 gram-force (gf) to approximately 20 gf. For instance, the compressive force applied to each mounting ball 130 by the electrical connector can be in the range of approximately 4 gf to approximately 15 gf. In particular, the compressive force applied to each mounting ball 130 by the electrical connector can be in the range of approximately 5 gf to approximately 10 gf. When exposed to the compressive force, the mounting ball 130 can be compressed to achieve a reduction in height by an amount ranging from approximately 5% to approximately 40% of the height of the mounting ball 130 when the mounting ball is in a relaxed state (i.e., not compressed). For instance, the reduction in height can be an amount ranging from approximately 5% to approximately 20% of the height of the mounting ball 130 when the mounting ball is in the relaxed state.

[0163] The compressive force can maintain the mounting balls 130 in electrical communication with respective ones of the mounting ends 118b of the electrical contacts 118 and the corresponding respective mounting locations 132 of the substrate 128. Thus, after the mounting balls 130 are compressed in response to the compressive force, the corresponding electrical connector can be secured to the substrate 128 so as to maintain the mounting balls 130 compressed against the mounting ends 1 18b and the mounting locations 132. Because the layer 1 12 of eDLC can be sufficiently ductile to maintain its continuity about the outer surface of the compressible body 134 after the compression force has been applied, the mounting balls are configured to maintain electrical communication between the mounting ends 118b and the mounting locations 132. The mounting balls 130 can be substantially spherical prior to compression, or can be any suitable alternative shape as desired. It should be equally appreciated that the surface of the mounting ends 118b that contact the mounting balls 130 can be coated with eDLC.

[0164] As described above, and referring now to Figs. 2A and 3A, each of the first and second electrical connectors can include a connector housing that supports the plurality of electrical contacts. The present disclosure recognizes that the connector housing can be coated with eDLC, such that an outer surface of the connector housing is electrically conductive. As a result, the connector housing can provide electrical shielding with respect to one or more adjacent electrical connectors. While the connector housing is described with reference to the connector housing 30 illustrated in Fig. 2A, it being appreciated that the present disclosure is equally applicable to the second connector housing 70, all other connector housings described herein, and all other suitable alternatively constructed electrical connector housings.

[0165] It will thus be appreciated that the electrical component 1 10 described above with reference to Fig. 6 A can be defined by the connector housing 30, and the component body 1 14 can be defined by a housing body of the connector housing 30 that is made of the electrically insulative material of the connector housing 30. The outer surface 116 of the component body 1 14 can thus be defined by an outwardly facing surface, or outer surface, of the housing body. In particular, the outer surface of the housing body can be defined by the front end, the rear end, the first and second sides 38, the bottom surface 40, and the top surface 42. At least a portion of the outer surface of the housing body can be coated with the electrically conductive layer 1 12 of eDLC. For instance, one or more up to all of the front end, the rear end, the first and second sides 38, the bottom surface 40, and the top surface 42 can be coated with the electrically conductive layer 112 of eDLC.

[0166] Advantageously, the electrically conductive layer 112 of eDLC can be applied such that it does not contact the electrical signal contacts of the electrical connector. Thus, the electrically conductive layer 112 of eDLC can be said to be electrically isolated from the signal contacts. Similarly, where the electrical contacts include electrical power contacts, the electrically conductive layer 112 of eDLC can be applied such that it does not contact the electrical power contacts. Thus, the electrically conductive layer 112 of eDLC can be said to be electrically isolated from the power contacts. Similarly, the electrically conductive layer 112 of eDLC can be applied such that it does not contact the grounds of the electrical connector. Thus, the electrically conductive layer 112 of eDLC can be said to be electrically isolated from the grounds. Alternatively, the electrically conductive layer 112 of eDLC can be in electrical contact with the grounds. For instance, the electrically conductive layer 112 of eDLC can be in electrical contact with the ground mounting ends, the ground mating ends, or any alternatively location of the grounds. Alternatively, the electrically conductive layer 112 of eDLC of the connector housing 30 can be in electrical contact with the ground plates of the leadframe assemblies.

Alternatively still, the electrically conductive layer 112 of eDLC can be in electrical contact with respective electrically conductive portions of the leadframe housings that, in turn, are in electrical contact with the grounds. Thus, the electrically conductive layer 112 of eDLC can electrically common the grounds to each other. In this regard, it should be appreciated that the electrically conductive layer 112 of eDLC can be coated onto an outer surface of the housing body, or an inner surface of the housing body that is opposite the outer surface.

[0167] As described above, and referring now to Figs. 2Fand 3G, each of the first and second electrical connectors can include a plurality of ground plates that each defines respective ground mating ends and ground mounting ends. The present disclosure recognizes that the ground plates can include a coating of the layer 112 of eDLC. While the ground plates are described with reference to the ground plate 66 illustrated in Fig. 2F, it should be appreciated that the present disclosure is equally applicable to the ground plate 106 of the second electrical connector 24, as well as all other ground plates illustrated herein, described herein, and all other suitable alternatively constructed ground plates.

[0168] It will thus be appreciated that the electrical component 110 described above with reference to Fig. 6 A can be defined by the ground plate 66, and the component body 114 can be defined by the plate body 68. In this regard, because the eDLC is electrically conductive, the plate body 68 can be made of an electrically nonconductive material, such as a plastic. At least a portion of the plate body 68 can be coated with the electrically conductive layer 112 of eDLC so as to render the ground plate 66 electrically conductive. Further, the ground mating ends 54a and the ground mounting ends 54b can be made of the electrically nonconductive material. Thus, the component body 1 14 can further include the electrically nonconductive material of the ground mating ends 54a and the ground mounting end 54b. Thus, as described above, the ground plate 66 can define an electrical shield that electrically shields at least one signal contact of a first column from at least one signal contact of a second column. Thus, the plate body 68 can also be referred to as a shield body. It should be appreciated that the ground plate body 68 can alternatively be made from an electrically conductive material, and can also be coated with the electrically conductive layer 112 of eDLC.

[0169] As described above with reference to Figs. 2F and 3G, each of the first and second electrical connectors 22 and 24 can include a plurality of leadframe housings that support respective columns of electrical contacts. The present disclosure recognizes that the leadframe housings can include a coating of the layer 1 12 of eDLC. While the leadframe housings are described with reference to the leadframe housings 64 of the first electrical connector 22 as illustrated in Fig. 2F, it should be appreciated that the present disclosure is equally applicable to the leadframe housings 104 of the second electrical connector 24, as well as all other leadframe housings described herein, and all other suitable alternatively constructed leadframe housings.

[0170] It will thus be appreciated that the electrical component 110 described above with reference to Fig. 6A can be defined by the leadframe housing 64, and the component body 1 14 can be defined by a leadframe housing body that is made of an electrically insulative material. At least a surface of the leadframe housing body can be coated with the electrically conductive layer 112 of eDLC so as to render the surface of the leadfarme housing body electrically conductive. For instance, the leadframe housing defines opposed sides that define respective outer surfaces that face a column of electrical contacts adjacent the column of electrical contacts supported by the leadframe housing 64. One or both of the outer surfaces of the opposed sides can be coated with the electrically conductive layer 112 of eDLC. Thus, the one or both of the outer surfaces of the opposed sides can be electrically conductive, and can define an electrical shield between the column of electrical contacts supported by the leadframe housing and the electrical contacts of an adjacent column. The electrically conductive layer 1 12 of eDLC can be electrically isolated from the signal contacts supported by the leadframe housing 64.

[0171] Because the leadframe housing 64 can define an electrical shield, the grounds 50 can be defined by discrete ground contacts supported by the leadframe housing 64, as opposed to the ground plate 66. Alternatively, the grounds 50 can be defined by the ground plate 66 as described above, in addition to the at least one surface of the leadframe housing 64 being defined by the electrically conductive layer 112 of eDLC. Further, the ground plates 66 can be placed in electrical communication with each other. For instance, the \electrically conductive layer 112 of electrically conducive eDLC on the leadframe housings 64 can be placed in electrical communication with the ground plate 66. The electrically conductive layer 112 of electrically conducive eDLC on the leadframe housings 64 can further be placed in electrical contact with the electrically conductive layer 112 of electrically conducive eDLC of the connector housing. Thus, the electrically conductive layer 112 of electrically conducive eDLC of the connector housing can place the ground plates 66 in electrical communication with each other.

[0172] As described above with reference to Figs. 4A-4B, the electrical connector system 20 can include first and second substrates 26 and 28. The first and second electrical connectors can be mounted to the first and second substrates 26 and 28, respectively, so as to place the electrical connectors and the respective substrates in electrical communication with each other. The first and second substrates 26 and 28 can be configured as printed circuit boards. For instance, the first substrate 26 can be configured as a backplane, and the second substrate 28 can be configured as a daughtercard. The electrical connector system 20 can include a plurality of daughtercards. Further, the electrical communication system can include a plurality of backplanes. The present disclosure recognizes that at least one of the first substrate 26 can include a coating of the electrically conductive layer 112 of eDLC. Further, the present disclosure recognizes that at least one of the second substrate 28 can include a coating of the electrically conductive layer 112 (see Fig. 6A) of eDLC.

[0173] Each of the first and second substrates 26 and 28 can include a dielectric substrate body and electrical traces that are supported by the substrate body. The electrical traces can be configured to carry electrical signals or electrical power. Thus, it will be appreciated that the electrical component 110 described above with respect to Fig. 6A can be defined by the one or both of the substrates 26 and 28. The electrical component body 114 can be defined by the substrate body. In one example, the substrate body can be defined by FR-4. Thus, the electrically conductive layer 112 of eDLC can be applied to the FR-4 so as to define at least one electrical trace of the substrate. Alternatively, the electrical trace can include an electrically conductive trace material that is disposed on the substrate body. The electrically conductive layer 112 of eDLC can, in turn, be deposited on the electrically conductive trace material. The electrically conductive trace material can be a copper or any suitable alternative material. In some examples, for instance when the traces is disposed at an outer surface of the substrate, the trace can be coated with a metal such as gold, or can be coated with a flux material, such as solder flux. Thus, the metal or the flux material can define the outer surface of the trace body that is coated with the electrically conductive layer 112 of eDLC.

[0174] Alternatively or additionally still, the electrically conductive layer 112 of eDLC can be applied to the FR-4 so as to define at least one contact pad of the substrate. Thus, the component body 114 can be defined by the substrate body. Alternatively, the electrical contact pads can include a material that is disposed on the substrate body. The electrically conductive layer 112 of eDLC can, in turn, be deposited on the material. In one example, the material can be electrically conductive. For instance, the electrically conductive material can be a copper or any suitable alternative material. In some examples, the contact pads can be coated with a metal such as gold, or can be coated with a flux material, such as solder flux. Thus, the metal or the flux material can define the outer surface of the trace body that is coated with the electrically conductive layer 112 of eDLC.

[0175] Further, as described above, the substrates can define electrical mounting locations, such that mounting ends of the electrical contacts of the electrical connector can be mounted to respective ones of the electrical mounting locations. The electrical mounting locations can define electrical contact pads. The electrical contact pads can define wiping surfaces, for instance, when the substrate is configured as a card edge. The electrical contact pads can include the layer 112 of eDLC, such that the eDLC defines the wiping surface of the contact pads. Alternatively, referring to Fig. 6F, the electrical mounting locations can define plated vias or through-holes 140. The mounting ends of the electrical contacts can be configured as press-fit tails that are configured to be press-fit into the plated vias so as to establish an electrical connection between the electrical contacts and the substrate. Thus, the outer surface 116 of the component body 114 described above can be defined by an interior surface 142 of the substrate that defines the through hole. The electrically conductive layer 112 of eDLC can be deposited onto the interior surface 142 of the substrate so as to define the plated through hole 140. [0176] Referring again to Figs. 1A and 5A, while electrical contacts can be mounted to underlying substrates as described above, the electrical contacts of first and second electrical connectors can alternatively be mounted to electrical cables, such as electrical cables. Electrical cables 44 and 84 are shown in Fig. IB by way of illustration, but it should be appreciated that electrical contacts can be mounted to any suitable electrical cable. The electrical cables can further include the layer 1 12 of eDLC. In particular, referring now to Figs. 6G-6I, examples of electrical cables 150 including an electrically conductive layer 1 12 of eDLC are shown. It should be appreciated, of course, that the electrically conductive layer 1 12 of eDLC can be applied to any suitable alternative electrical cable as desired.

[0177] As illustrated in Figs. 6G-6I, the electrical cable 150 includes at least one electrical signal conductor 152, such as a pair of electrical signal conductors 152, and an inner electrically insulative layer 154 that surrounds each of the pair of signal conductors 152. The signal conductors 152 can extend through the inner electrically insulative layer 154. The electrical cable 150 can further include at least one electrically conductive shield that surrounds the inner electrically insulative layer 154. For instance, the electrical cable 150 can include a first electrically conductive shield 156 that surrounds the inner electrically insulative layer 154. In accordance with certain embodiments, the electrical cable 150 can further include a second electrically conductive shield 158 that surrounds the first electrically conductive shield 156.

[0178] The first conductive shield 156 can include a shield body constructed of any suitable electrically conductive material as desired. In one example, the shield body of the first electrically conductive shield 156 can be configured as a serve shield having at least one wire that is wound about the electrically insulative layer 154. Alternatively, the shield body of the the first electrically conductive shield 156 can be configured as any suitable electrically conductive foil. For instance, the foil can be a copper foil. Alternatively, the foil can include a polymer film with a metallic layer that is coated onto or otherwise surrounds the polymer film. The second electrically conductive shield 158 can likewise have a shield body that can be configured as any suitable electrically conductive foil. For instance, the foil can be a copper foil. Alternatively, the foil can include a polymer film with a metallic layer that is coated onto or otherwise surrounds the polymer film.

[0179] The electrical cable can further include an outer electrically insulative layer 160. The outer electrically insulative layer 160 can surround the second electrically conductive shield 158, or alternatively the ground jacket 156. The insulative layer 154 and the outer electrically insulative 160 can be constructed of any suitable dielectric material, such as plastic. The signal conductors 152 can be constructed of any suitable electrically conductive material, such as copper. Conventional signal conductors 152 can also include a precious metal coated onto the electrically conductive material. The electrically conductive shield 156 can be made of any suitable electrically conductive material, such as copper.

[0180] Referring now to Figs. 6A and 6G, the at least one electrically conductive shield of the electrical cable can include the layer 112 of eDLC coated onto the outer surface of the shield body. Thus, the shield body can define the component body 114. The shield body can define an outer surface that defines the outer surface 116 of the component body 114. In one example, the first electrical shield 156 can include the electrically conductive layer 112 of eDLC. For instance, the outer surface of the shield body of the first electrical shield 156 can be coated with the electrically conductive layer 112 of eDLC. The electrically conductive layer 112 of eDLC can be coated onto the outer surface of the shield body in the manner described herein. Alternatively, the shield body can define an inner surface that defines the inner electrically insulative layer 154 and defines the outer surface 116 of the component body 114. Thus, the electrically conductive layer 112 of eDLC can be coated onto the inner surface of the shield body of the first electrical shield 156 in the manner described herein

[0181] Alternatively, the component body 114 can be defined by the inner electrically insulative layer 154 that surrounds the at least one signal conductor 152. The outer surface 116 can thus be defined by an outer surface of the inner electrically insulative layer 154 that faces the at least one shield. The outer surface of the electrically insulative layer 154 can be coated with the electrically conductive layer 112 of eDLC as described above. Thus, the layer 112 of eDLC can define the electrically conductive shield 156.

[0182] Referring now to Figs. 6A and 6H, another example, the second electrical shield 158 can include the electrically conductive layer 112 of eDLC. For instance, the outer surface of the shield body of the second electrical shield 158 can be coated with the electrically conductive layer 112 of eDLC. The electrically conductive layer 112 of eDLC can be coated onto the outer surface of the shield body in the manner described herein. Alternatively, the shield body can define an inner surface that defines the first electrical shield 156 and defines the outer surface 116 of the component body 114. Thus, the electrically conductive layer 112 of eDLC can be coated onto the inner surface of the shield body of the second electrical shield 158 in the manner described herein. Alternatively still, each of the first electrical shield 156 and the second electrical shield 158 can include a respective electrically conductive layer 112 of eDLC in any manner described herein. [0183] Alternatively, the component body 1 14 can be defined by the electrically conductive shield 156. The outer surface 1 16 can thus be defined by an outer surface of the electrically conductive shield 156. The outer surface of the electrically conductive shield 156 can be coated with the electrically conductive layer 1 12 of eDLC as described above. Thus, the layer 1 12 of eDLC can define the electrically barrier layer 158.

[0184] Referring now to Figs. 6A and 61, the at least one signal conductor 152 can contain the electrically conductive layer 1 12 of eDLC. Thus, the electrical component 1 10 described above with reference to Fig. 6A, can include the at least one signal conductor 152. The component body 1 14 can be defined by a body of the signal conductor 152. Accordingly, the outer surface 1 16 can be defined by a copper body that defines the signal conductor body. Alternatively, as described above ,the body of the signal conductor 152 can include a precious metal, such as silver, that is coated onto the copper. Thus, the outer surface of the conductor body can be defined by silver. Thus, the outer of the conductor body can be coated with the electrically conductive layer 1 12 of eDLC in the manner described above.

[0185] Alternatively, the component body 1 14 can be defined by any suitable body that can be coated with the electrically conductive layer 1 12 of eDLC so as to define the at least one signal conductor 152. For instance, the conductor body can be any suitable electrically conductive material as described above. Alternatively, or additionally, the conductor body can include any suitable electrically insulative material. Thus, the electrically insulative material can define the outer surface of the conductor body. Accordingly, outer surface of the electrically insulative conductor body can be coated with the electrically conductive layer 112 of eDLC as described above, so as to define the signal conductor 152. The electrically conductive layer 1 12 of eDLC can thus define the outer surface of the signal conductors. It is appreciated, of course, that any suitable electrically conductive material can be applied to the outer surface of the electrically conductive layer 1 12 of eDLC as desired.

[0186] While the electrically conductive layer 112 of eDLC has been described as applied to the electrical conductor and the electrically conductive shield of a twinaxial cable, it is recognized that the electrically conductive layer 112 of eDLC can also be applied to the electrical conductor or barrier layer of a coaxial cable or any suitable alternatively constructed cable as desired. eDLC Deposition Processes [0187] According to embodiments of the present disclosure, processes for depositing the layer 112 of electrically conductive DLC coating (eDLC) are disclosed. In this regard, the terms eDLC film, eDLC coating, and eDLC layer can be used interchangeably with each other, and with the electrically conductive layer 112 described above. Generally, eDLC films are formed using well known techniques such as, for example, chemical vapor deposition (CVD), plasma-assisted CVD (PACVD), arc-ion plating and sputtering. According to one embodiment, a process for depositing an electrically conductive diamond-like carbon (eDLC) coating includes plasma-based ion implantation (PBII) with bipolar pulses.

[0188] According to one embodiment, the process of applying an eDLC coating can include 1) argon plasma sputter-cleaning of the component surface, 2) carbon ion implantation using CH4 plasma, and 3) eDLC deposition in a plasma. The plasma can be a C7H8 plasma.

[0189] According to further embodiments, the process can additionally include, varying positive and negative pulse voltages within the range of about +2 to +5 kV and -5 to -20 kV, wherein the respective pulse frequencies were in the range of about 3 to 5 kHz. According to additional embodiments, the operating pressure can be in the range of about 3x10-2 Pa. In still further embodiments, the operating temperature range can be up to about 1000°C, where the target temperature can be controlled by increasing the positive pulse voltage and pulse frequency. In a preferred embodiment the eDLC coating process can have an operating temperature range from about 200°C to 450°C. In still further embodiments, the eDLC coating process can be in the range of about 45 min to about 90 min, such as, for example, about 60 min.

[0190] Electrical conductivity of the eDLC film can be achieved according to certain embodiments, due io energetic ion bombardments from the PBII, the result of which can be an atomic redistribution of mobile hydrogen due to displacement of hydrogen from CH bonds, and a subsequent decrease of the resistivity of eDLC coating. This can allow the displaced hydrogen to diffuse toward the surface under the electron bombardment and thus recombine with other hydrogen to form H2 molecules, which would desorb from the eDLC film surface.

[0191] According to additional embodiments of the present disclosure, PBII coating processes can be used, wherein the eDLC coating can be doped with additional elements, such as, for example, Nitrogen or Boron, to provide an eDLC coating.

[0192] According to one embodiment, the process of applying an eDLC coating cam include 1) simultaneously applying RF and high pulsed voltage so as to ionize CH4 and C2H2 gas, and 2) depositing carbon ions on the outer surface of the connector component, wherein depositing B or N ions can simulataneously occur with the deposition of carbon ions, and where the process includes Capacitively Coupled Plasma (CCP) illustrated at Fig. 7 A and Inductively Coupled Plasma (ICP) illustrated at Fig. 7B. The conditions of the CCP and IPC processes are illustrated below at Table 1. According to further embodiments, the process can additionally include forming the eDLC film at a temperature under 350°C.

Table 1

[0193] It is recognized that the eDLC coating can be uniform along its length and through its thickness as desired. Alternatively, the eDLC coating can have properties that vary along its length or along its thickness. For instance, in one example, the eDLC coating can have a hydrogen content as desired. For instance, the eDLC can have a hydrogen content of zero or substantially zero, for instance, less than approximately 1 atomic percent, thereby providing a particularly hard eDLC layer. The hydrogen content of the tetrahedral amorphous eDLC can be raised to a higher amount, which provides a relatively soft eDLC layer. According to one embodiment, the hydrogen content can be at least about 25 atomic percent, and in another embodiment, the hydrogen content can be in the range of about 25 to about 35 atomic percent. Thus, the hardness of the eDLC layer decreases as the hydrogen content increases. Further, the eDLC layer can have a hydrogen content anywhere in a range of 0 to about 35 atomic percent and can have a variable content gradient of hydrogen along its thickness. Thus, the portions of the eDLC layer can be configured to have respective mechanical properties (e.g., hardness) that accommodate and take advantage of the mechanical properties of bodies onto which the eDLC is coated. [0194] Examples of electrically conductive DLC are described in Japanese patent application publication No. JP2012021223 published on February 2, 2012 and entitled (English translation) "Plasma Treatment Apparatus and Surface Modifying Method of Contact Probe." Methods of fabricating electrically conductive DLC are further described in an article entitled "Electrically Conductive Diamond-Like Carbon Coatings Prepared by Plasma-Based Ion Implantation with Bipolar Pulses" as published in New Diamond and Frontier Carbon

Technology, Vol. 16, No. 1 2006 (MYU Tokyo), and authored by Soji Miyagawa, Setsuo Nakao, Junho Choi, Masami Ikeyama and Yoshiko Miyagawa. Electrically conductive DLC coated stainless steel has also been published in an IPO Science article entitled "Development of electrically conductive DLC coated stainless steel separators for polymer electrolyte membrane fuel cell" authored by Yasho Suzuki, Masanori Watanabe, Tadao Toda, and Toshiaki Fujii. Moreover, as disclosed in U.S. Patent No. 6,663,753, when TMS (tetramethylsilane) is used in the deposition process of an underlying anchor layer, a Si (silicon) layer can help the overlying DLC inclusive layer to better bond and/or adhere to low-E arrangement layers via an anchor layer. Each of JP2012021223, U.S. Patent No. 6,663,753, the article entitled "Electrically Conductive Diamond-Like Carbon Coatings Prepared by Plasma-Based Ion Implantation with Bipolar Pulses," and the article entitled "Development of electrically conductive DLC coated stainless steel separators for polymer electrolyte membrane fuel cell" is hereby incorporated by reference in its entirety herein.

[0195] It should be appreciated that the illustrations and discussions of the

embodiments shown in the figures are for exemplary purposes only, and should not be construed limiting the disclosure. One skilled in the art will appreciate that the present disclosure contemplates various embodiments. Additionally, it should be understood that the concepts described above with the above-described embodiments may be employed alone or in combination with any of the other embodiments described above. It should be further appreciated that the various alternative embodiments described above with respect to one illustrated embodiment can apply to all embodiments as described herein, unless otherwise indicated.

Claims

What is Claimed:

1. An electrical component for an electrical communication system that is configured to communicate one or both of electrical data and electrical power, the electrical component comprising:

a component body, wherein an outer surface of at least a portion of the component body is coated with an electrically conductive layer of eDLC.

2. The electrical component as recited in claim 1, comprising at least one electrical contact, and the component body comprises a contact body of the at least one electrical contact.

3. The electrical component as recited in claim 1 , wherein the at least one electrical contact defines a mating end configured to removably mate with at least one complementary electrical contact, and the eDLC is disposed on the outer surface at the contact body at the mating end.

4. The electrical component as recited in claim 3, wherein the eDLC is coated onto less than entire length of the contact body.

5. The electrical component as recited in claim 3, wherein the eDLC is coated onto an entire length of the contact body.

6. The electrical component as recited in any one of claims 1 to 5, wherein the mating end has a wipe distance less than 1 millimeters and greater than or equal to approximately 0.25 millimeters.

7. The electrical component as recited in any one of claims 2 to 6, wherein the contact body comprises a copper or copper alloy, or a bronze or bronze alloy.

8. The electrical component as recited in claim 7, wherein the contact body further comprises a barrier layer that defines the outer surface of the contact body.

9. The electrical component as recited in claim 8, wherein the barrier layer comprises at least one of nickel, tin, and PdNi.

10. The electrical component as recited in any one of claims 2 to 6, wherein the contact body comprises an electrically insulative material.

1 1. The electrical component as recited in claim 10, wherein the electrically insulative material comprises a plastic.

12. The electrical component as recited in any one of claims 1 to 11, wherein the eDLC comprises carbon ions deposited directly onto the outer surface.

13. The electrical component as recited in any one of claims 2 to 12, wherein the electrically conductive layer consists essentially of the eDLC.

14. The electrical component as recited in any one of claims 2 to 12, wherein the electrically conductive layer consists of the eDLC.

15. The electrical component as recited in any one of claims 2 to 14, wherein the mounting end configured to be mounted onto a complementary electrical component, and the electrical component further comprises a compressible mounting ball that is configured to establish an electrical connection between the mounting end and the complementary electrical component.

16. The electrical component as recited in claim 15, wherein the mounting ball comprises a compressible body, and eDLC coated onto the compressible body.

17. The electrical component as recited in claim 16, wherein the compressible body comprises an elastomer or resin.

18. The electrical component as recited in claim 17, wherein the compressible ball comprises silicone, a Polyamide resin, or a Polyamide elastomer.

19. The electrical component is recited in any one of claims 16 to 18, wherein the compression ball is configured to be compressed between the mounting end and an electrical pad of a printed circuit board.

20. The electrical component as recited in any one of claims 2 to 19, wherein the at least one electrical contact comprises a signal contact.

21. The electrical component as recited in any one of claims 2 to 20, wherein the at least one electrical contact comprises a signal contact.

22. The electrical component as recited in any one of claims 2 to 21 , wherein the at least one electrical contact comprises an electrical power contact.

23. The electrical component as recited in any one of claims 2 to 22, wherein the at least one electrical contact comprises a plurality of electrical contacts.

24. An electrical connector comprising:

an electrically insulative connector housing, and

the plurality of electrical contacts recited in claim 23 supported by the connector housing.

25. The electrical component as recited in claim 1, comprising a connector housing of an electrical connector that supports a plurality of electrical contacts, wherein the connector hosing is configured to provide electrical shielding with respect to an adjacent electrical connector.

26. The electrical component as recited in claim 25, wherein the component body comprises an electrically insulative housing body.

27. The electrical component as recited in claim 26, wherein the component body comprises an electrically conductive housing body.

28. The electrical component as recited in any one of claims 25 to 27, wherein at least some of the electrical contacts comprise signal contacts, and the eDLC is electrically isolated from the signal contacts.

29. The electrical component as recited in any one of claims 25 to 28, wherein at least some of the electrical contacts comprise electrical power contacts, and the eDLC is electrically isolated from the electrical power contacts.

30. The electrical component as recited in any one of claims 25 to 29, wherein at least some of the electrical contacts comprise ground contacts, and the eDLC is electrically isolated from the ground contacts.

31. The electrical component as recited in any one of claims 25 to 29, wherein at least some of the electrical contacts comprise ground contacts, and the eDLC is in electrical contact with the ground contacts.

32. The electrical component as recited in claim 1, comprising an electrical shield of an electrical connector that shields at least one signal contact of a first column from at least one signal contact of a second column.

33. The electrical component as recited in claim 32, wherein the component body comprises an electrically conductive shield body, and the eDLC is coated onto an outer surface of the electrically conductive shield body.

34. The electrical component as recited in claim 32, wherein the component body comprises an electrically insulative shield body, and the eDLC is coated onto an outer surface of the electrically insulative shield body.

35. The electrical component as recited in any one of claims 32 to 34, wherein the electrical shield comprises a ground plate having a ground plate body, ground mating ends that extend out from the ground plate body, and ground mounting ends that extend out from the ground plate body.

36. The electrical component as recited in claim 1, comprising a leadframe housing for an electrical connector, the leadframe housing configured to support a plurality of electrical contacts, wherein a leadframe housing body of the leadframe housing defines the component body.

37. The electrical component as recited in claim 36, wherein the leadframe housing supports a plurality of signal contacts and ground contacts, and the eDLC is electrically isolated from the signal contacts.

38. The electrical component as recited in claim 37, wherein the eDLC is in electrical contact with at least some of the ground contacts.

39. The electrical component as recited in claim 37, wherein the eDLC is electrically isolated from the ground contacts.

40. The electrical component as recited in any one of claims 36 to 39, wherein the eDLC defines an electrical shield that electrically shields the electrical contacts from adjacent electrical contacts of the electrical connector.

41. The electrical component as recited in any one of claims 36 to 40, wherein the leadframe housing is overmolded onto the electrical contacts.

42. The electrical component as recited in any one of claims 36 to 40, wherein the electrical contacts are stitched into the leadframe housing.

43. The electrical component as recited in claim 1, comprising a leadframe assembly and a plurality of electrical contacts supported by the leadframe housing, wherein at least one of the leadframe housing and the electrical contacts defines the component body.

44. The electrical component as recited in claim 43, wherein the leadframe assembly further comprises a ground plate, and the ground plate body of the ground plate at least partially defines the component body.

45. An electrical connector comprising the electrical component of claim 1, wherein the electrical component is at least one of an electrical signal contact, an electrical ground contact, an electrical power contact, a connector housing, a leadframe housing, an electrical shield, and a ground plate.

46. The electrical component as recited in claim 1, comprising a compressible mounting ball configured to establish an electrical connection between a mounting end of an electrical contact of an electrical connector and an electrical mounting location of a substrate to which the electrical connector is configured to be mounted.

47. The electrical component as recited in claim 46, wherein the mounting ball comprises a silicone body, and the eDLC is coated onto an external surface of the silicone body.

48. The electrical component as recited in any one of claims 46 to 48, wherein the mounting ball is at least substantially spherical.

49. The electrical component as recited in any one of claims 46 to 48, wherein the substrate comprises a printed circuit board.

50. The electrical component as recited in any one of claims 46 to 49, wherein the electrical mounting location comprises a contact pad.

51. The electrical component as recited in claim 1 , comprising an electrical trace of a substrate, wherein the component body comprises a dielectric substrate body of the substrate.

52. The electrical component as recited in claim 51, wherein the electrical trace comprises an electrically conductive trace material.

53. The electrical component as recited in claim 52, wherein the outer surface is defined by an outer surface of the electrically conductive trace.

54. The electrical component as recited in claim 53, wherein the outer surface of the electrically conductive trace is metallic.

55. The electrical component as recited in claim 54, wherein the outer surface of the electrically conductive trace comprises one of copper, gold, and a flux material.

56. The electrical component as recited in any one of claims 51 to 55, wherein the dielectric substrate body comprises FR-4.

57. The electrical component as recited in claim 1, comprising an electrical contact pad of a substrate, wherein the component body comprises a dielectric substrate body of the substrate that supports the electrical contact pad.

58. The electrical component as recited in claim 57, wherein the electrical contact pad comprises an electrically conductive material.

59. The electrical component as recited in claim 58, wherein the outer surface is defined by an outer surface of the electrically conductive material of the electrical contact pad.

60. The electrical component as recited in claim 57, wherein the outer surface is defined by an outer surface of the substrate body.

61. The electrical component as recited in any one of claims 57 to 60, wherein the dielectric substrate body comprises FR-4.

62. The electrical component as recited in claim 1, comprising a plated through-hole of a printed circuit board, wherein the outer surface is defined by an interior surface of the substrate that defines a through-hole, and the electrically conductive layer is disposed on the interior surface so as to define the plated through-hole.

63. The electrical component as recited in claim 1 , comprising an electrical cable.

64. The electrical component as recited in claim 63, wherein the component body comprises at least one electrically conductive shield having a body that defines the outer surface that is coated with the electrically conductive layer of eDLC.

65. The electrical component as recited in claim 63, wherein the component body comprises an inner electrically insulative layer that surrounds at least one signal conductor, wherein an outer surface of the inner electrically insulative layer is coated with the electrically conductive layer so as to define an electrically conductive shield that surrounds the inner electrically insulative layer.

66. The electrical component as recited in claim 63, wherein the component body comprises one of 1) a copper foil, such that the copper foil defines the outer surface, and 2) a polymer film with a metallic layer, such that the metallic layer defines the outer surface.

67. The electrical component as recited in claim 66, wherein the body of the barrier layer comprises an electrically conductive material.

68. The electrical component as recited in claim 63, wherein the component body comprises an electrically conductive shield of the cable that surrounds an inner electrically insulative layer that, in turn, surrounds at least one signal conductor.

69. The electrical component as recited in claim 68, wherein an outer surface of the electrically conductive shield is coated with the electrically conductive layer so as to define an electrically conductive barrier layer that surrounds the electrically conductive shield.

70. The electrical component as recited in claim 63, wherein the body of the electrical component comprises a body of an electrical signal conductor of the electrical cable, the body of the electrical signal conductor having an outer surface that is coated with the electrically conductive layer.

71. The electrical component as recited in claim 70, wherein the body of the electrical signal conductor comprises copper, and the outer surface of the body of the electrical signal conductor is defined by copper.

72. The electrical component as recited in claim 70, wherein the outer surface of the body of the electrical signal conductor is defined by silver.

73. The electrical component as recited in claim 70, wherein the body of the electrical signal conductor is defined by an electrically insulative material.

74. The electrical component as recited in claim 70, wherein the electrically conductive layer consists essentially of the eDLC.

75. The electrical component as recited in claim 70, wherein the electrically conductive layer consists of the eDLC.

76. A method of fabricating the electrical component as recited in any one of claims 1 to 75, comprising the step of implanting and depositing carbon ions onto the component body using plasma based ion implantation so as to define the eDLC.

77. An electrical contact comprising:

an electrical contact body comprising a base layer of at least one of copper, an alloy thereof, bronze, and an alloy thereof, wherein the electrical contact body defines an outer surface; and

an eDLC coated onto the outer surface of the electrical contact body, such that the eDLC defines an outer surface of the electrical contact

78. The electrical contact as recited in claim 77, wherein the base layer defines the outer surface of the electrical contact body.

79. The electrical contact as recited in claim 77, further comprising a barrier layer disposed on the base layer, such that the barrier layer defines the outer surface of the electrical contact body.

80. The electrical contact as recited in claim 79, wherein the barrier layer at least resists tarnishing of the base layer.

81. The electrical contact as recited in any one of claims 79 to 80, wherein the barrier layer comprises at least one of Nickel, such as tin, aluminum, silver, gold, lead, Pd, an alloy of Pd such as PdNi, NiP, Cu3Sn, Cu6Sn5 , and Cu Be 2%.

82. The electrical contact as recited in any one of claims 77 to 81, wherein the electrical contact body comprises nickel-plated copper.

83. The electrical contact as recited in any one of claims 77 to 82, wherein the electrical contact body is at least substantially free of gold.

84. The electrical contact as recited in any one of claims 77 to 83, wherein the electrical contact body is at least substantially free of silver.

85. The electrical contact as recited in any one of claims 77 to 84, further comprising a mating end, a mounting end, and an intermediate region that extends from the mating end to the mounting end, wherein the eDLC is disposed at the mating end.

86. The electrical contact as recited in claim 85, wherein the eDLC is disposed at the mounting end.

87. The electrical contact as recited in any one of claims 85 to 86, wherein the eDLC is disposed at the intermediate region.

88. The electrical contact as recited in claim 85, wherein the eDLC is localized at the mating end.

89. The electrical contact as recited in any one of claims 85 to 88, wherein the mating end is cantilevered.

90. An electrical connector comprising:

an electrically insulative connector housing; and

at least one electrical contact as recited in any one of claims 77 to 89.

91. The electrical connector as recited in claim 90, wherein the at least one electrical contact comprises a plurality of electrical contacts.

92. An electrically conductive component comprising:

a component body that defines an outer body surface; and

a layer of eDLC that coats at least a portion of the outer body surface,

wherein the layer of eDLC defines an outer wiping surface of the component body that is configured to mate with a complementary component whereby the outer wiping surface wipes against a complementary electrically conductive surface of the complementary component so as to place the wiping surface in electrical communication with the complementary electrically conductive surface, thereby placing the outer wiping surface and the complementary electrically conductive surface for transmission of at least one of electrical data and electrical power therebetween.

93. The electrically conductive component as recited in claim 92, comprising an electrical contact.

94. The electrically conductive component as recited in claim 93, wherein the electrical contact comprises an electrical signal contact.

95. The electrically conductive component as recited in claim 93, wherein the electrical contact comprises an electrical power contact.

96. The electrically conductive component as recited in claim 92, comprising a printed circuit board.

97. The electrically conductive component as recited in claim 96, wherein the eDLC comprises a wiping surface of a contact pad.

98. The electrically conductive component as recited in any one of claims 92 to 97, wherein the outer body surface comprises copper.

99. The electrically conductive component as recited in any one of claims 92 to 98, wherein the outer body surface comprises nickel.

100. The electrically conductive component as recited in claim 99, wherein the component body comprises copper that is plated with the nickel.

101. The electrically conductive component as recited in any one of claims 92 the outer body surface comprises palladium-nickel.

102. The electrically conductive component as recited in claim 101 , wherein the component body comprises copper that is plated with the palladium-nickel.

103. The electrically conductive component as recited in any one of claims 92 to 102, wherein the outer wiping surface is configured to mate with and unmate from the complementary electrically conductive surface over at least one cycle without removing eDLC in sufficient quantity so as to expose the outer body surface.

104. The electrically conductive component as recited in claim 103, wherein the at least one cycle ranges from one to fifty cycles.

105. The electrically conductive component as recited in claim 103, wherein the at least one cycle ranges from 51 to 500 cycles.

106. The electrically conductive component as recited in claim 103, wherein the at least one cycle ranges from 501 to 1000 cycles.

107. The electrically conductive component as recited in claim 103, wherein the at least one cycle ranges from 1001 to 5000 cycles.

108. The electrically conductive component as recited in claim 103, wherein the at least one cycle ranges from 5001 to 10,000 cycles.

109. The electrically conductive component as recited in claim 103, wherein the at least one cycle ranges from 10,001 to 20,000 cycles.

1 10. A method of placing an electrically conductive component in electrical communication with a complementary electrically conductive surface, the method comprising the step of:

wiping a surface of the electrically conductive component against the complementary electrically conductive surface, wherein the surface of the electrically conductive component is defined by eDLC.

1 1 1. The method as recited in claim 1 10, wherein the electrically conductive component comprises an electrical contact.

1 12. The method as recited in claim 11 1, wherein the electrical contact comprises an electrical signal contact.

1 13. The method as recited in claim 1 11 , wherein the electrical contact comprises an electrical power contact.

1 14. The method as recited in claim 1 10, wherein the electrical contact comprises a printed circuit board.

1 15. The method as recited in any one of claims 110 to 114, wherein the complementary electrically conductive surface is defined by eDLC.

1 16. The method as recited in any one of claims 110 to 115, wherein the eDLC is coated onto a surface that is at least substantially free of silver and gold.

1 17. An electrically conductive component comprising:

a component body having a first material that defines an outer surface; and

a layer of eDLC that coats at least a portion of the outer surface,

wherein the electrically conductive component is identical with respect to another electrically conductive component, with the exception that the electrically conductive component lacks the layer of eDLC and includes at least one of silver and gold.

1 18. The electrically conductive component as recited in claim 1 17, comprising an electrical contact.

1 19. The electrically conductive component as recited in claim 1 17, comprising a mounting ball.

120. The electrically conductive component as recited in claim 1 17, comprising an electrical cable.

121. The electrically conductive component as recited in claim 1 17, comprising a contact pad of a substrate.

122. The electrically conductive component as recited in claim 1 17, wherein the first surface is at least substantially free of silver and gold.

123. A method of mating first electrical contacts of a first electrical connector with second electrical contacts of a second electrical connector to each other, one of the first and second electrical connectors mounted on a backplane, the method comprising the step of:

bringing respective first mating ends of the first electrical contacts into contact with respective second mating ends of the second electrical contacts along a mating direction, such that the first and second mating ends apply respective normal forces against each other along a direction perpendicular to the mating direction,

wherein the bringing step comprises wiping the first and second mating ends along each other a wiping distance of no more than 1 millimeter.

124. A method of mounting an electrical connector onto an underlying substrate, the method comprising the steps of: placing a mounting ball between a mounting end of an electrical contact of the electrical connector and an electrical mounting location of the underlying substrate, wherein the mounting ball includes a compressible body having an outer surface coated with eDLC; and

bringing the mounting end toward the electrical mounting location so as to compress the mounting ball therebetween, such that the mounting ball places the mounting location in electrical communication with the electrical contact.

125. The method as recited in claim 124, further comprising the step of securing the electrical connector to the underlying substrate after the bringing step.

126. The method as recited in any one of claims 124 to 125, wherein the mounting location comprises a contact pad.