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WO2019022026A1 - Module de source de lumière et appareil d'éclairage pour véhicules - Google Patents

Module de source de lumière et appareil d'éclairage pour véhicules Download PDF

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Publication number
WO2019022026A1
WO2019022026A1 PCT/JP2018/027560 JP2018027560W WO2019022026A1 WO 2019022026 A1 WO2019022026 A1 WO 2019022026A1 JP 2018027560 W JP2018027560 W JP 2018027560W WO 2019022026 A1 WO2019022026 A1 WO 2019022026A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
light
light source
emitting elements
source module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/027560
Other languages
English (en)
Japanese (ja)
Inventor
鈴木　哲也
主 時田
元弘 小松
大野　智之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017143552A external-priority patent/JP7053185B2/ja
Priority claimed from JP2017143551A external-priority patent/JP7053184B2/ja
Priority claimed from JP2017143550A external-priority patent/JP2019029057A/ja
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Publication of WO2019022026A1 publication Critical patent/WO2019022026A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Definitions

  • the present invention relates to a light source module and a vehicle lamp.
  • Vehicle lamps are generally capable of switching between low beam and high beam.
  • the low beam illuminates the near side with a predetermined illuminance, and a light distribution rule is defined so as not to give glare to oncoming vehicles and preceding vehicles, and is mainly used when traveling in a city area.
  • the high beam illuminates a wide range and a distance ahead with relatively high illuminance, and is mainly used when traveling at high speed on a road where there are few oncoming vehicles and preceding vehicles. Therefore, although the high beam is more excellent in visibility by the driver than the low beam, there is a problem that glare is given to the driver of the vehicle existing in front of the vehicle and the pedestrian.
  • ADB Adaptive Driving Beam
  • ADB technology reduces the glare to be given to a vehicle or pedestrian by detecting the presence or absence of a preceding vehicle in front of the vehicle, an oncoming vehicle or a pedestrian, and reducing the area corresponding to the vehicle or pedestrian. is there.
  • light emitting elements such as a plurality of LEDs (Light Emitting Diodes) are mounted in a row on a substrate to turn off the LEDs in the area corresponding to a vehicle or a pedestrian.
  • Patent Document 1 Patent Document 1
  • a large number of light emitting elements are two-dimensionally disposed on a substrate to selectively control turning off and lighting of the light emitting elements to control light distribution patterns of high beams in more detail.
  • a vehicle lamp having such a two-dimensional array of light emitting elements it is necessary to increase the mounting density of the light emitting elements and improve the accuracy of the mounting position in order to satisfactorily irradiate the two-dimensional light distribution pattern. is there.
  • LEDs are used as light emitting elements, a surface mount type package is adopted, and a structure in which individual LEDs are positioned and mounted on lands formed on a substrate is adopted and mounted with high density.
  • FIG. 10 is a schematic plan view showing the light source module 1 using the ADB technology.
  • a connector 3 for electrically connecting to the outside is mounted on a substrate 2, and a wiring pattern 4 is formed on the surface of the substrate 2 extending from the connector 3.
  • a plurality of LEDs 5 are mounted on the pattern 4.
  • the vicinity of the LED 5 mounting portion of the wiring pattern 4 is formed wide, and is used as a heat dissipation pattern for well dissipating heat generated by the light emission of the LED 5.
  • the surface of the substrate 2 is covered with a resist layer to suppress unintended light reflection in the wiring pattern 4, and an optical member is formed on the substrate 2 to reflect light from the LED 5 with desired light distribution characteristics. It is mounted.
  • the distance between the LEDs 5 is increased to secure the area of the heat radiation pattern, and high density mounting is difficult. Furthermore, since the LEDs 5 are surface mounted in individual packages, the surface mounting alignment accuracy There is also a problem that high density mounting is difficult also from the point of view. In order to solve this problem, mounting multiple LED chips in one package and making electrical connection with the wiring layer on the substrate by wire bonding enables surface mounting alignment accuracy and high density mounting of LED chips. Can be compatible.
  • An object of the present invention is to provide a light source module and a vehicular lamp capable of suppressing the occurrence of glare while mounting light emitting elements with high density.
  • Another object of the present invention is to provide a light source module and a vehicular lamp capable of preventing light leakage while mounting light emitting elements at high density to improve luminous intensity.
  • Another object of the present invention is to provide a light source module and a vehicular lamp capable of precisely aligning the relative positional relationship between the optical member and the LED while mounting the light emitting element at a high density.
  • a light source module includes a plurality of light emitting elements, a plurality of metal wires individually supplying power to the light emitting elements, and at least a part of side surfaces of the light emitting elements.
  • the light-reflective resin part currently sealed and the light absorptive resin part which has sealed the said metal wire are provided.
  • the periphery of the light emitting element is sealed with the light reflective resin portion to improve the light extraction efficiency, and the metal wire is sealed with the light absorbing resin portion to achieve high density. It becomes possible to suppress the occurrence of glare while mounting the light emitting element.
  • the light reflective resin portion is filled between the adjacent light emitting elements, and collectively seals side surfaces of the predetermined number of light emitting elements.
  • the light absorbing resin part collectively seals a predetermined number of the metal wires.
  • a submount having a submount wiring formed on one surface thereof is provided, and a plurality of the light emitting elements are mounted on the submount wiring along a first direction of the submount; A wire is connected to the submount wiring.
  • the plurality of submounts are arranged as a first row extending in the first direction.
  • a plurality of the submounts are further arranged adjacent to the first row as a second row extending in the first direction.
  • the vehicle lamp of this invention is provided with the light source module as described in any one of the said, and supplies electric power selectively with respect to several said metal wire and several said light emitting elements.
  • a submount having a submount wiring formed on one surface thereof, and a plurality of light emissions mounted along the first direction on the submount wiring And a light reflective resin portion filled between adjacent light emitting elements to seal the side surfaces of the light emitting elements, and the distance between the side surfaces of the adjacent light emitting elements is 0.1 mm to 0 The range is .6 mm.
  • the space between the adjacent light emitting elements is filled with the light reflective resin portion and sealed, and the distance between the side faces of the adjacent light emitting elements is in the range of 0.1 mm to 0.6 mm. Therefore, it is possible to prevent light leakage while mounting the light emitting elements at high density to improve the luminous intensity.
  • the plurality of submounts are arranged as a first row extending in the first direction.
  • a plurality of the submounts are further arranged adjacent to the first row as a second row extending in the first direction.
  • a metal wire corresponding to each light emitting element is connected to the submount wiring, and the light emitting elements in the first row and the second row are the submount wiring in the first row Are positioned between the metal wire connected to and the metal wire connected to the submount wiring of the second row.
  • the vehicle lamp of this invention is provided with the light source module as described in any one said, and supplies electric power selectively with respect to several said light emitting elements. In such a vehicle lamp of the present invention, it is possible to prevent light leakage while mounting the light emitting elements at high density to improve the luminous intensity.
  • a light source module includes a mounting substrate having a wiring pattern formed on one surface, and a plurality of the light source modules mounted on the one surface and electrically connected to the wiring pattern.
  • a light source unit having a light emitting element and an optical member reflecting light from the light source unit are provided, a resist layer is formed on the wiring pattern of the mounting substrate, and the resist layer is formed on the mounting substrate An optical member mounting area is formed, and the optical member is mounted on the optical member mounting area.
  • the resist layer is removed in the optical member mounting region of the mounting substrate, and the optical member may be fixed at a desired position even if the film thickness of the resist layer is different from the design value.
  • the relative positional relationship between the optical member and the LED can be precisely aligned while mounting the light emitting element with high density.
  • the mounting substrate is formed of a laminated structure of a metal plate and a glass epoxy resin layer, and the glass epoxy resin layer is exposed in the optical member mounting region.
  • the light source unit has the light emitting element mounted on the metal plate without the glass epoxy resin layer, and the height dimension of the light emitting element is the thickness of the glass epoxy resin layer Larger than dimensions
  • the optical member mounting area is provided in a pair on both sides of the light source unit, and in the light source unit, a plurality of light emitting elements are arrayed along a first direction.
  • the optical member is fixed on an extension of the light emission center line of the device.
  • the vehicle lamp of this invention is equipped with the light source module as described in any one of the said, and the electric power feeding connector electrically connected with the said wiring pattern is provided on the said one surface. And power is selectively supplied to the plurality of light emitting elements through the power supply connector.
  • the relative positional relationship between the optical member and the LED can be precisely aligned while mounting the light emitting element at a high density.
  • the present invention it is possible to provide a light source module and a vehicular lamp capable of suppressing the occurrence of glare while mounting light emitting elements at high density.
  • a light source module and a vehicular lamp capable of preventing light leakage while mounting light emitting elements at high density to improve the luminous intensity.
  • a light source module and a vehicular lamp capable of precisely aligning the relative positional relationship between the optical member and the LED while mounting the light emitting element at high density.
  • FIG. 6 is a schematic plan view showing the light source module 40 in a state in which each member is mounted on a mounting substrate 41.
  • FIG. 6 is an enlarged perspective view showing a submount 43 in an enlarged manner.
  • 16 is a partial enlarged cross-sectional view showing a state in which the submount 43 is mounted on the light emitting unit mounting region 49. It is an enlarged plan view which expands and shows the light emission part mounting area
  • FIG. 1 is an exploded perspective view showing a vehicular lamp 100 in the present embodiment.
  • the vehicular lamp 100 includes a lens 10, a lens holder 20, a reflector 30, a light source module 40, a heat sink 50, and a cooling fan 60.
  • the members are mutually positioned and fixed by fixing means (not shown). ing.
  • the lens 10 is a member which is made of a translucent material and irradiates the light from the light source module 40 forward so as to obtain a predetermined light distribution.
  • the lens holder 20 is a member for holding the lens 10 in a state where the relative positional relationship between the lens 10 and the light source module 40 and the reflector 30 is maintained.
  • the reflector 30 is a member disposed in front of the light source module 40 to reflect light from the light source module 40 forward, and corresponds to the optical member in the present invention.
  • the light source module 40 is a member that emits light according to the power and signal supplied from the outside of the vehicle lamp 100, and the details will be described later.
  • the heat sink 50 is a heat conductive good member disposed in contact with the light source module 40 on the back surface of the light source module 40, and a heat radiation fin is formed on the back surface side.
  • the cooling fan 60 is a member that is disposed on the back side of the heat sink 50 and generates an air flow when power is supplied.
  • the light source module 40 when power and a signal are supplied from the outside, the light source module 40 emits light according to the power and the signal, and the light reflected forward by the reflector 30 is in the lens holder 20 and through the lens 10. Irradiated forward. Further, the heat associated with the light emission of the light source module 40 is dissipated into the air via the heat sink 50 and is cooled by the air from the cooling fan 60.
  • FIG. 2 is a schematic perspective view showing the light source module 40 in the present embodiment.
  • the light source module 40 includes a mounting substrate 41, a wiring pattern 42, a submount 43, a feeding connector 44, a metal wire 45a, a light absorbing resin portion 45, and a resist layer 46.
  • An optical member mounting area 47 is formed, and an optical member fixing portion 48 is formed in the optical member mounting area 47.
  • the mounting substrate 41 is a substantially flat member formed of a material having good thermal conductivity, and the wiring pattern 42 is formed on one surface, and a plurality of submounts 43 and a feed connector 44 are mounted. There is. In addition, a resist layer 46 is formed to cover the wiring pattern 42.
  • the material which comprises the mounting substrate 41 is not limited, It is preferable to use metal with favorable heat conductivity, such as copper and aluminum.
  • a composite substrate in which an insulating substrate is bonded to a conductive substrate may be used as the mounting substrate 41, and for example, a glass epoxy resin layer may be bonded to a metal substrate.
  • the mounting substrate 41 is formed of a metal substrate, it is preferable to form an anti-oxidation film on the back surface side of the mounting substrate 41 in order to prevent the thermal conductivity from being lowered due to the oxidation of the metal material.
  • the pre-flux process and Au plating process are mentioned as a formation method of an antioxidant film
  • the wiring pattern 42 is a conductive pattern formed on the surface of the mounting substrate 41, and is for securing the electrical connection from the terminal of the power supply connector 44 to the submount 43.
  • a conductive material is used as the mounting substrate 41, an insulating layer is formed between the wiring pattern 42 and the mounting substrate 41.
  • the submount 43 is mounted on the surface of the mounting substrate 41 and electrically connected to the wiring pattern 42 by the metal wire 45a, and is a member that emits light according to the power by being supplied with power through the metal wire 45a. It is. The detailed structure of the submount 43 will be described later.
  • the feed connector 44 is a member mounted on the surface of the mounting substrate 41 for securing an electrical connection with the outside, and a plurality of terminals are electrically connected to the wiring pattern 42.
  • a substantially rectangular parallelepiped is shown in FIG. 2 as a shape of the electric power feeding connector 44, an external shape, a terminal shape, etc. will not be limited if it can connect according to a well-known cable harness.
  • the metal wire 45a is a member for connecting the terminal provided on the submount 43 and the wiring pattern 42 formed on the mounting substrate 41, and is a metal conductive member which can be realized by a known wire bonding technique. is there.
  • the material which comprises the metal wire 45a is not limited, Although gold, copper, aluminum etc. can be used, it is preferable to use gold.
  • the light absorbing resin portion 45 is a resin member in which an inorganic filler and a light absorbing material are mixed in a base resin, and covers and seals the metal wire 45a.
  • the metal wire 45a may be sealed individually by the light absorbing resin portion 45. However, it is preferable to collectively seal the plurality of metal wires 45a.
  • a base resin of the light absorbing resin portion 45 a curable resin composition having high heat resistance, light resistance, and good handleability which is light transmissive is preferable, and a known sealing material such as an epoxy resin or a silicone resin is mentioned.
  • a silicone resin having a low elastic modulus after curing may be used as a base resin.
  • a carbon filler etc. are mentioned as a light absorptive material mixed in base resin.
  • the light source module 40 of the present embodiment by covering and sealing the metal wire 45a with the light absorbing resin portion 45, it is possible to prevent the conductive foreign matter from adhering to the metal wire 45a and causing a short circuit. Further, since the light absorbing resin portion 45 mixes the light absorbing material, the light from the submount 43 reaches the metal wire 45 a and is reflected, and is irradiated to the outside of the vehicular lamp 100 as stray light. Can be prevented.
  • the light emitting element included in the submount 43 is selectively turned on using the ADB technology, it is possible to prevent stray light reflected by the metal wire 45a from reaching the non-irradiated area, and the light emitting element It is possible to suppress the occurrence of glare while implementing the
  • the base resin obtained by kneading the inorganic filler and the light absorbing material is supplied onto the metal wire 45a by a dispenser or the like and then cured.
  • the viscosity and thixotropy after kneading the light absorbing material can be arbitrarily adjusted by adjusting the material selection of the base resin and the addition amount of the inorganic filler in consideration of the moldability after application and the stress on the feeding wire. It is possible.
  • Thixotropy is determined by the injectability of the dispenser / the moldability after application, at a viscosity of 0.5 rpm at 23 ° C.
  • the viscosity is 2.0 or more and 3.5 or less.
  • the thixotropy is set in this range, the fluidity of the base resin is appropriately maintained, and even if the submount 43 is not surrounded by a dam member or the like, the resin flows out and the metal wire 45a is exposed, and the metal wire 45a It is possible to prevent the formation of a void in the gap between the two or in the lower part.
  • the resist layer 46 is an insulating film-like member formed on the surface side of the mounting substrate 41 so as to cover the wiring pattern 42.
  • the material which comprises the resist layer 46 is not limited, In order to suppress the stray light by the light reflection in the surface of the mounting substrate 41, and the wiring pattern 42 differing, the light reflectivity in the area
  • a light reflective material or a light absorbing material is used to
  • the optical member mounting area 47 is an area on the surface of the mounting substrate 41 for mounting the reflector 30, which is an optical member, and is an area where the resist layer 46 is not formed and the surface of the mounting substrate 41 is exposed.
  • the optical member mounting area 47 is located on both sides of the mounting substrate 41 across the area on which the submount 43 is mounted, and the reflector 30 is brought into contact with the optical member mounting area 47 to fix the submount.
  • the reflector 30 can be disposed across 43.
  • the optical member fixing portion 48 is a through hole provided in the optical member mounting area 47.
  • the reflector 30 is brought into contact with the optical member mounting area 47, and a fixing member such as a screw is inserted into the optical member fixing portion 48 from the surface side of the mounting substrate 41 to fix the mounting substrate 41 and the reflector 30 to the heat sink 50.
  • the details of the formation position of the optical member fixing portion 48 will be described later, but the submount 43 is arranged between the two optical member fixing portions 48.
  • FIG. 3 is a schematic plan view showing the mounting substrate 41 in the present embodiment.
  • the wiring pattern 42 is formed on the mounting substrate 41, and a resist layer 46 is formed to cover the wiring pattern 42.
  • an optical member mounting area 47, a light emitting section mounting area 49 for mounting the submount 43, a portion for bonding the metal wire 45a, a feeding connector mounting portion 44a for mounting the feeding connector 44, and feeding A resist layer 46 is formed in the region excluding the portion connecting the terminals of the connector 44.
  • the light emitting portion mounting area 49 is an area on which the plurality of sub mounts 43 are mounted as described above, and is formed so that the sub mounts 43 can be arranged in two rows with the horizontal direction in the drawing as the longitudinal direction. Further, a line L1 connecting the centers of the optical member fixing portions 48 has a positional relationship such that it crosses the approximate center of the light emitting portion mounting area 49 along the longitudinal direction.
  • FIG. 4A and 4B are diagrams for explaining the structure of the mounting substrate 41 in the present embodiment in detail, FIG. 4A is an exploded perspective view, and FIG. 4B is a schematic cross-sectional view.
  • the mounting substrate 41 is formed of a laminated structure of a metal plate 41a, an adhesive sheet 41b, and a glass epoxy resin layer 41c.
  • openings 49b and 49c having a shape corresponding to the light emitting unit mounting area 49 are respectively formed, and the positions of the openings 49b and 49c coincide with each other.
  • the openings 49b and 49c may be formed in advance in predetermined regions of the adhesive sheet 41b and the glass epoxy resin layer 41c and may be aligned and attached, and the metal plate 41a and the glass epoxy resin layer 41c may be adhered with the adhesive sheet 41b. After that, the openings 49b and 49c may be collectively formed by cutting or the like.
  • the adhesive sheet 41b and the glass epoxy resin layer 41c are laminated around the light emitting portion mounting area 49, and the wiring pattern 42 and the resist layer 46 are formed on the glass epoxy resin layer 41c.
  • the surface of the metal plate 41a is partially exposed in the regions corresponding to the openings 49b and 49c. Further, as described above, since the resist layer 46 is not formed in the optical member mounting region 47, the glass epoxy resin layer 41c is exposed in the optical member mounting region 47.
  • the resist layer 46 is not formed in the optical member mounting area 47, and the reflector 30, which is an optical member, is directly mounted on the glass epoxy resin layer 41c and fixed. Thereby, the positional deviation between the reflector 30 and the submount 43 caused by the variation of the film thickness of the resist layer 46 is suppressed, and the relative positional relationship between the optical member and the light emitting element 43c is precisely aligned to obtain good light distribution characteristics. It becomes possible to irradiate with light.
  • the glass epoxy resin layer 41c to the metal plate 41a using the adhesive sheet 41b, it is not necessary to form an insulating layer containing a high thermal conductivity filler on the metal plate 41a, and the manufacturing process and cost can be reduced. It becomes possible to aim at reduction.
  • FIG. 5 is a schematic plan view showing the light source module 40 in a state in which each member is mounted on the mounting substrate 41.
  • Solder is applied to the feed connector mounting portion 44a and the terminal connection portion of the mounting substrate 41 shown in FIGS. 4A and 4B, and the surface mount feed connector 44 is mounted by solder reflow.
  • metal wires are formed by wire bonding.
  • the submount 43 and the wiring pattern 42 are electrically connected.
  • the light absorbing resin portion 45 is applied to the plurality of metal wires 45a with a dispenser and cured.
  • the line L1 connecting the centers of the optical member fixing portions 48 is located approximately at the center along the longitudinal direction of the submounts 43 arranged in two rows.
  • FIG. 6 is an enlarged perspective view showing the submount 43 in an enlarged manner.
  • a plurality of submount wires 43b are formed on a submount substrate 43a
  • a plurality of light emitting elements 43c are mounted on the submount wire 43b
  • the side surfaces of the plurality of light emitting elements 43c are collectively light reflective.
  • the resin portion 43d is sealed. Further, the light reflective resin portion 43d is not formed on a part of the submount substrate 43a, and the surface of the submount substrate 43a and the submount wiring 43b are exposed.
  • the light emitting element 43c is flip chip mounted across the adjacent submount wires 43b inside the light reflective resin portion 43d.
  • the submount substrate 43a is a substantially rectangular flat plate member made of an insulating material having good thermal conductivity, and is made of, for example, Si or AlN.
  • the submount wiring 43b is a conductive pattern formed on one surface of the submount substrate 43a, and is electrically connected to the light emitting element 43c and wire-bonded to the metal wire 45a.
  • the light emitting element 43c is a member which is electrically connected to the two metal wires 45a and emits light when a voltage is applied between the metal wires 45a, and is formed of a combination of an LED chip and a phosphor material.
  • the LED chip a known compound semiconductor material such as blue or violet or a GaN-based that emits the wavelength of ultraviolet light as primary light can be used.
  • a phosphor material a known material which is excited by primary light and emits a desired secondary light can be used, and ones which obtain white by mixing with primary light from the LED chip, and a plurality of phosphor materials are used. What can be used to obtain white by mixing a plurality of secondary lights can be used.
  • the light reflective resin portion 43d is a member in which light reflective fine particles are mixed in a base resin, and for example, white resin in which fine particles such as titanium oxide are mixed is mentioned, and light emitted by the light emitting element 43c is favorably reflected.
  • the light reflective resin portion 43d is sealed so as to surround the light emitting element 43c at its side, and reflects light emitted from the side of the light emitting element 43c in the inside direction of the light emitting element 43c. As a result, light emitted from the light emitting element 43c does not leak laterally from the side surface of the light emitting element 43c, and the light is favorably emitted to the outside from the top surface of the light emitting element 43c.
  • a plurality of submounts 43 are arranged in upper and lower two rows to constitute a light source unit, and extended in the longitudinal direction to be arranged with a plurality of submount substrates 43a adjacent to each other to form a first row
  • the submount substrate 43a of the second row is disposed adjacent to the first row while constituting an example of the first row.
  • FIG. 7 is a partially enlarged cross-sectional view showing a state in which the submount 43 is mounted on the light emitting portion mounting region 49.
  • the submount substrate 43a is fixed with an adhesive on the metal plate 41a exposed in the light emitting portion mounting region 49, and the side surface of the light emitting element 43c on the submount substrate 43a is sealed by the light reflective resin portion 43d.
  • One end of the metal wire 45a is wire-bonded to the area on the submount substrate 43a where the light reflective resin portion 43d is not formed.
  • a plurality of light emitting elements 43c are mounted on the submount substrate 43a, and metal wires 45a are bonded to the submount wiring 43b formed on the surface of the submount substrate 43a to perform power. Supply.
  • a large current can be supplied by the metal wire 45a having a high melting point, and the light intensity of the light source module 40 can be increased.
  • the submount substrate 43a is mounted on the metal plate 41a exposed in the light emitting portion mounting region 49, and is fixed using an adhesive having a high heat resistance temperature, compared to mounting of the light emitting element 43c using solder.
  • the heat resistant temperature can be set high, and further, large current supply and high light intensity can be achieved.
  • the wiring pattern 42 formed on the glass epoxy resin layer 41c is covered with the resist layer 46, but the resist layer 46 is formed at the position where the other end of the metal wire 45a is wire bonded. Not.
  • the entire metal wire 45a is sealed by the light absorbing resin portion 45, and is filled in the wire bonding positions at both ends of the metal wire 45a and the upper and lower portions of the metal wire 45a.
  • the light absorbing resin portion 45 is formed adjacent to the light reflecting resin portion 43d at the wire bonding position of the submount substrate 43a.
  • the adhesive sheet 41b is not shown.
  • the submount 43 is mounted on the metal plate 41a without the glass epoxy resin layer 41c in the light emitting portion mounting region 49, and the height dimension of the light emitting element in the submount 43 is the glass epoxy resin layer 41c.
  • the height dimension of the light emitting element in the submount 43 is the distance from the bottom surface of the submount substrate 43a to the upper surface of the light emitting element 43c, and is, for example, about 1.3 mm.
  • the height of the submount 43 is larger than the thickness of the glass epoxy resin layer 41c, so the upper surface of the light emitting element 43c, which is the light extraction surface of the submount 43, is higher than the glass epoxy resin layer 41c. Located in Thus, it is possible to prevent the light emitted from the submount 43 from entering the side surface of the glass epoxy resin layer 41c and blocking it, and light can be extracted well and irradiated with a desired light distribution characteristic.
  • the metal plate 41a and the glass epoxy resin layer 41c are bonded together with the adhesive sheet 41b, and then the optical member fixing portion 48 is formed by punching from the back surface side of the mounting substrate 41.
  • the thickness dimension of the glass epoxy resin layer 41c is 0.05 mm to 0.2 mm, preferably 0.075 mm to 0.15 mm, burrs generated on the metal plate 41a at the time of punching are suppressed by the glass epoxy resin layer 41c, and optical It becomes possible to position and fix the reflector 30 which is a member precisely.
  • FIG. 8 is an enlarged plan view showing the area around the light emitting unit mounting area 49 in an enlarged manner.
  • the light absorbing resin portion 45 collectively seals the plurality of metal wires 45 a, covers from the wire bonding position of the wiring pattern 42 to the wire bonding position of the submount 43, and reflects light. It is formed to a position adjacent to the resin portion 43d.
  • a plurality of submounts 43 are arranged along the left-right direction, and two rows are arranged adjacent to each other in the up-down direction to constitute the light source unit of the present invention.
  • the light emitting elements 43c are also arranged in two lines, and a line L2 shown in FIG. 8 is a light emission center line indicating an intermediate position of the two lines of light emitting elements 43c.
  • the light emission center line L2 substantially coincides with the line L1 connecting the centers of the optical member fixing portion 48 shown in FIG. 5, and is an optical member on the extension of the light emission center line L2 of the plurality of light emitting elements 43c.
  • the reflector 30 is fixed.
  • the mounting substrate 41 is warped.
  • the warp can be reduced by fastening the reflector 30 on the light emission center line L2, and the positional relationship between the light source unit and the optical member can be appropriately set.
  • the mounting substrate 41 and the reflector 30 are fastened together including the heat sink 50, the back side of the light emitting portion mounting region 49 can be in close contact with the heat sink, and the heat dissipation characteristics similar to the mounting substrate 41 without warpage. It is possible to obtain
  • the wire bonding position of the wiring pattern 42 is provided along the upper and lower sides of the light emitting portion mounting region 49 in the drawing, and the upper row (an example of the first row) in the drawing is from above in the drawing.
  • the metal wire 45a is wire-bonded, and the metal wire 45a is wire-bonded from the lower side in the figure to the submount 43 in the lower row (an example of the second row) in the figure. Accordingly, the light emitting elements 43c in the first row and the second row are located between the metal wire 45a connected to the first row and the metal wire 45a connected to the second row.
  • the vehicle lamp 100 of the present invention power is selectively supplied from the outside to the light emitting element 43c via the power supply connector 44, the wiring pattern 42, the metal wire 45a, and the submount wiring 43b, and the light emitting element 43c is lit.
  • the light distribution distribution in the whole light source part is determined by lighting the selected light emitting element 43c among the plurality of submounts 43 which constitute the light source part, and the vehicle lamp according to ADB technology through the reflector 30 and the lens 10
  • a two-dimensional light distribution pattern is emitted forward of 100.
  • FIGS. 9A and 9B a second embodiment of the present invention will be described using FIGS. 9A and 9B.
  • the same contents as the first embodiment will not be described.
  • the present embodiment can also be applied to the case where ADB technology is not used.
  • the configuration of the vehicular lamp 100 and the configuration of the light source module 40 are the same as those of the first embodiment, and the description thereof will be omitted.
  • FIGS. 9A and 9B are graphs showing the synthetic light intensity from the adjacent light emitting elements 43c in the present embodiment
  • FIG. 9A shows an example in which the distance between the light emitting elements 43c is long and the synthetic light intensity is insufficient.
  • 9B shows an example in which the distance between the light emitting elements 43c is short and the synthetic light intensity is sufficient.
  • the horizontal axis indicates the position along the longitudinal direction of the submount 43
  • the vertical axis indicates the light intensity.
  • the broken line in the figure shows the luminous intensity of the light emitted from one light emitting element 43c
  • the solid line in the figure shows the synthetic luminous intensity of the lights emitted from the two adjacent light emitting elements 43c.
  • the peak of the synthetic light intensity is small as shown in FIG. 9A, and is greater than the light intensity irradiated from one light emitting element 43c. It only improves by a few percent.
  • the peak of the synthetic light intensity becomes large, and can be improved by 20% or more than the light intensity irradiated from one light emitting element 43c.
  • the light emitting element 43c is selectively turned on and off to precisely control the irradiated area and the non-irradiated area, so that the higher the synthetic light intensity of the irradiated area is the contrast with the non-irradiated area. Can be enhanced.
  • the thickness of the light reflective resin portion 43d filling the side surfaces of the light emitting element 43c is insufficient, and light leaks from the side surfaces to form one light emitting element 43c.
  • the light intensity of the light emitted from the light source itself is reduced.
  • the combined luminous intensity also decreases due to the light leaking from the side.
  • the light emitting element 43c is selectively turned on by applying the ADB technology, light leaked from the side face may be emitted similarly to the light emitted from the light emitting element 43c which is not turned on. It becomes difficult to irradiate a two-dimensional light distribution pattern.
  • CSP chip size package
  • the distance between light emitting elements is 0.6 mm
  • the synthetic light intensity is 100
  • the synthetic light intensity is 119 at 0.2 mm.
  • the distance d1 between the side surfaces of the light emitting elements 43c is 0.6 mm
  • the synthetic light intensity is 112
  • the synthetic light intensity is 140 at 0.2 mm
  • the synthetic light intensity is 147 at 0.1 mm. is there.
  • the distance d1 between the side surfaces of the light emitting elements 43c is preferably in the range of 0.1 mm to 0.6 mm.
  • the distance between the light emitting elements 43c in the plurality of submounts 43 is preferably in the range of 0.1 mm to 0.6 mm.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un module de source de lumière (40) comprenant : une pluralité d'éléments électroluminescents (43c); une pluralité de fils métalliques (45a) qui fournissent séparément de l'énergie électrique aux éléments électroluminescents (43c), respectivement; une partie de résine réfléchissant la lumière (43d) qui scelle au moins une partie de la surface latérale de chaque élément électroluminescent (43c); et une partie de résine absorbant la lumière (45) qui scelle les fils métalliques (45a).
PCT/JP2018/027560 2017-07-25 2018-07-23 Module de source de lumière et appareil d'éclairage pour véhicules Ceased WO2019022026A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2017-143551 2017-07-25
JP2017143552A JP7053185B2 (ja) 2017-07-25 2017-07-25 光源モジュール及び車両用灯具
JP2017143551A JP7053184B2 (ja) 2017-07-25 2017-07-25 車両用灯具
JP2017-143552 2017-07-25
JP2017-143550 2017-07-25
JP2017143550A JP2019029057A (ja) 2017-07-25 2017-07-25 光源モジュール及び車両用灯具

Publications (1)

Publication Number Publication Date
WO2019022026A1 true WO2019022026A1 (fr) 2019-01-31

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PCT/JP2018/027560 Ceased WO2019022026A1 (fr) 2017-07-25 2018-07-23 Module de source de lumière et appareil d'éclairage pour véhicules

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WO (1) WO2019022026A1 (fr)

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Publication number Priority date Publication date Assignee Title
JP2021168374A (ja) * 2020-04-08 2021-10-21 日亜化学工業株式会社 発光装置及び発光モジュール、並びに、発光モジュールの製造方法
US11655947B2 (en) 2020-04-08 2023-05-23 Nichia Corporation Light emitting device, light emitting module, and method of manufacturing light emitting module

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JP2005050838A (ja) * 2003-07-29 2005-02-24 Citizen Electronics Co Ltd 表面実装型ｌｅｄ及びそれを用いた発光装置
JP2007116109A (ja) * 2005-09-20 2007-05-10 Matsushita Electric Works Ltd Ｌｅｄ照明器具
US20140268851A1 (en) * 2013-03-15 2014-09-18 Red Hawk LLC Led light assemblies
JP2016066680A (ja) * 2014-09-24 2016-04-28 スタンレー電気株式会社 発光装置
WO2017086251A1 (fr) * 2015-11-20 2017-05-26 株式会社小糸製作所 Unité de luminaire
JP2017108092A (ja) * 2015-11-30 2017-06-15 日亜化学工業株式会社 発光装置の製造方法

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Publication number Priority date Publication date Assignee Title
JP2005050838A (ja) * 2003-07-29 2005-02-24 Citizen Electronics Co Ltd 表面実装型ｌｅｄ及びそれを用いた発光装置
JP2007116109A (ja) * 2005-09-20 2007-05-10 Matsushita Electric Works Ltd Ｌｅｄ照明器具
US20140268851A1 (en) * 2013-03-15 2014-09-18 Red Hawk LLC Led light assemblies
JP2016066680A (ja) * 2014-09-24 2016-04-28 スタンレー電気株式会社 発光装置
WO2017086251A1 (fr) * 2015-11-20 2017-05-26 株式会社小糸製作所 Unité de luminaire
JP2017108092A (ja) * 2015-11-30 2017-06-15 日亜化学工業株式会社 発光装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021168374A (ja) * 2020-04-08 2021-10-21 日亜化学工業株式会社 発光装置及び発光モジュール、並びに、発光モジュールの製造方法
JP7157345B2 (ja) 2020-04-08 2022-10-20 日亜化学工業株式会社 発光モジュール
US11655947B2 (en) 2020-04-08 2023-05-23 Nichia Corporation Light emitting device, light emitting module, and method of manufacturing light emitting module

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