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WO2019021815A1 - Appareil vibrant et procédé permettant de commander ce dernier - Google Patents

Appareil vibrant et procédé permettant de commander ce dernier Download PDF

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Publication number
WO2019021815A1
WO2019021815A1 PCT/JP2018/026046 JP2018026046W WO2019021815A1 WO 2019021815 A1 WO2019021815 A1 WO 2019021815A1 JP 2018026046 W JP2018026046 W JP 2018026046W WO 2019021815 A1 WO2019021815 A1 WO 2019021815A1
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WO
WIPO (PCT)
Prior art keywords
elastic plate
vibration
flat plate
elastic
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/026046
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English (en)
Japanese (ja)
Inventor
健司 加賀山
隼人 市橋
野村 淳一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2019532492A priority Critical patent/JP6648862B2/ja
Publication of WO2019021815A1 publication Critical patent/WO2019021815A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/04Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with electromagnetism
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers

Definitions

  • the present invention relates to a vibration device in which a piezoelectric vibration element is fixed to an elastic plate such as a metal plate and a method of driving the same.
  • Patent Document 1 discloses an example of such a vibration device.
  • an elastic plate is used which is bent so as to have a U-shape when the metal plate is viewed from the side.
  • the elastic plate has a plate-shaped fixed portion on one side and a plate-shaped vibrating portion on the other side via the bending portion.
  • the vibrating device of Patent Document 1 operates as a vibrator.
  • Patent Document 2 discloses a piezoelectric vibration sounding device in which a piezoelectric diaphragm is supported by a cantilever. A weight is attached to the tip of the piezoelectric diaphragm.
  • This piezoelectric vibration sounding device generates bodily sensation vibration or a buzzer sound by the vibration of the piezoelectric diaphragm.
  • a drive voltage of 1 kHz to 10 kHz is applied, the front end of the piezoelectric diaphragm hardly vibrates due to the weight of the weight, and therefore, the state is almost the same as the state supported by the double support. In this state, the piezoelectric diaphragm resonates to generate a buzzer sound.
  • Patent Document 1 The vibration device of Patent Document 1 is described as a vibration device that can be miniaturized. However, Patent Document 1 does not describe at all a configuration for generating a sound.
  • An object of the present invention is to provide a vibrating device which can easily generate sounds of a plurality of desired frequencies and can be miniaturized.
  • Another object of the present invention is to provide a method of driving a vibration device which can easily generate sounds of a plurality of desired frequencies.
  • the vibration device is a first elastic member having a first flat plate portion including a tip portion, a connecting portion connected to the first flat plate portion, and a joint portion connected to the connecting portion.
  • a second elastic plate including a plate and a second flat plate portion joined to the joint portion of the first elastic plate and facing the first flat plate portion of the first elastic plate;
  • a piezoelectric vibrating element provided on a surface of the first flat plate portion of the first elastic plate on the second elastic plate side, and a piezoelectric vibration element attached to the tip end of the first elastic plate
  • the first elastic plate is configured to be able to generate sounds of a plurality of types of frequencies by the vibration of the bending mode, and only the first flat plate portion is generated by the bending mode.
  • the first elastic plate is at a frequency different from the frequency of the harmonics when vibrating. As it is possible to generate sound by vibrating the music mode, the first flat plate portion and the connecting portion is formed.
  • an input signal is externally inputted to the piezoelectric vibration element of the vibration device configured according to the present invention, and the first elasticity is changed by changing the frequency of the input signal.
  • the vibrations of the board simultaneously generate sounds of different heights.
  • the vibration device of the present invention it is possible to easily generate sounds of a plurality of types of desired frequencies, and to achieve size reduction.
  • the driving method of the vibration device of the present invention it is possible to easily generate sounds of a plurality of types of desired frequencies.
  • FIG. 1 is a perspective view showing the appearance of a vibration device according to a first embodiment of the present invention.
  • FIG. 2 is a side cross-sectional view of the vibration device according to the first embodiment of the present invention.
  • FIG. 3 is an exploded perspective view of the vibration device according to the first embodiment of the present invention.
  • Fig.4 (a) is a side view of the piezoelectric vibration element in the 1st Embodiment of this invention
  • FIG.4 (b) is a top view of the piezoelectric vibration element in 1st Embodiment.
  • FIG. 5 is a view showing the relationship between the frequency of vibration and the sound pressure in the first elastic plate of the vibration device according to the first embodiment of the present invention.
  • FIG. 1 is a perspective view showing the appearance of a vibration device according to a first embodiment of the present invention.
  • FIG. 2 is a side cross-sectional view of the vibration device according to the first embodiment of the present invention.
  • FIG. 3 is an exploded perspective view of the
  • FIG. 6 is a schematic view for explaining the first vibration mode in the present invention.
  • FIG. 7 is a schematic view for explaining a second vibration mode in the present invention.
  • FIG. 8 is a perspective view of a first elastic plate and a second elastic plate in a first modified example of the first embodiment of the present invention.
  • FIG. 9 is a perspective view of a first elastic plate and a second elastic plate in a second modification of the first embodiment of the present invention.
  • FIG. 1 is a perspective view showing the appearance of a vibration device according to a first embodiment of the present invention.
  • FIG. 2 is a side sectional view of the vibration device according to the first embodiment.
  • FIG. 3 is an exploded perspective view of the vibration device according to the first embodiment.
  • the vibration device 1 shown in FIGS. 1 to 3 can be used for a notification function by vibration of a portable electronic device, a notification function by sound, and the like.
  • the vibration device 1 has a first elastic plate 2 a.
  • the first elastic plate 2a has a first end 2a4 and a second end 2a5.
  • the first end 2a4 is a tip in the present invention.
  • the direction connecting the first end 2a4 and the second end 2a5 is the longitudinal direction of the first elastic plate 2a.
  • the vibration device 1 is configured such that the first elastic plate 2a vibrates in the first vibration mode and the second vibration mode in the bending mode. This makes it possible to easily generate sounds of a plurality of types of frequencies. The details will be described later.
  • the vibration device 1 has a second elastic plate 2b connected to the second end 2a5 side of the first elastic plate 2a. More specifically, the first elastic plate 2a has a first bonding portion 2a3 as a bonding portion in the present invention, which is located on the second end 2a5 side. In the first joint portion 2a3, the first elastic plate 2a is joined to the second elastic plate 2b.
  • the second elastic plate 2b has a third end 2b4 and a fourth end 2b5.
  • the second elastic plate 2b has a second bonding portion 2b3 located on the fourth end 2b5 side.
  • the second elastic plate 2b is joined to the first elastic plate 2a at the second joint portion 2b3.
  • the direction connecting the third end 2 b 4 and the fourth end 2 b 5 is the longitudinal direction of the second elastic plate 2 b.
  • the longitudinal direction of the first elastic plate 2a and the second elastic plate 2b is not limited to the above.
  • the first elastic plate 2a is made of SUS304
  • the second elastic plate 2b is made of SUS301.
  • the first elastic plate 2a and the second elastic plate 2b may be made of other elastic material such as metal or synthetic resin other than the above.
  • the first elastic plate 2a and the second elastic plate 2b are preferably made of metal such as stainless steel. Thereby, it is possible to further suppress the reduction in the strength of vibration in the first elastic plate 2a and the second elastic plate 2b.
  • the first elastic plate 2a has a first flat plate portion 2a1, a connecting portion 2a2 and the first joint portion 2a3 located between the first end 2a4 and the second end 2a5.
  • the first flat plate portion 2a1 is planar.
  • the tip of the first flat plate portion 2a1 is located at the first end 2a4.
  • the connecting portion 2a2 connects the first flat plate portion 2a1 and the first joint portion 2a3.
  • the tip of the first joint 2a3 is located at the second end 2a5.
  • the second elastic plate 2b has a second flat plate portion 2b1 located between the third end 2b4 and the fourth end 2b5, and the second bonding portion 2b3.
  • the second flat plate portion 2b1 is planar.
  • the first flat plate portion 2a1 of the first elastic plate 2a and the second flat plate portion 2b1 of the second elastic plate 2b are opposed to each other.
  • the first elastic plate 2a is bent toward the second elastic plate 2b in the connecting portion 2a2.
  • the connecting portion 2a2 extends from the first flat plate portion 2a1 toward the second elastic plate 2b.
  • the first bonding portion 2a3 extends from the connecting portion 2a2 in a direction away from the first end 2a4.
  • the first bonding portion 2a3 has a surface extending in parallel to the second flat plate portion 2b1 of the second elastic plate 2b. In the plane, the first joint portion 2a3 is joined to the second elastic plate 2b.
  • the first elastic plate 2a and the second elastic plate 2b are preferably joined by welding. Thereby, the bonding strength can be effectively enhanced.
  • the said welding can be performed by irradiation of a laser beam etc., for example.
  • joining of the 1st elastic board 2a and the 2nd elastic board 2b is not limited above, For example, you may be fulfilled by the metal for brazing materials, an adhesive agent, etc.
  • the connecting portion 2 a 2 is located between the dashed dotted line A and the dashed dotted line B. Both ends of the connecting portion 2a2 are curved. Note that at least one of both end portions of the connection portion 2a2 may be bent so as to have a corner portion.
  • the piezoelectric vibrating element 3 is provided on the first flat plate portion 2a1 of the first elastic plate 2a. More specifically, the piezoelectric vibration element 3 is provided on the surface of the first flat plate portion 2a1 on the side of the second elastic plate 2b.
  • the piezoelectric vibrating element 3 is fixed to the first elastic plate 2 a using a suitable adhesive such as a thermosetting resin-based adhesive.
  • the piezoelectric vibrating element 3 has a rectangular plate shape.
  • FIG. 4A is a side view of the piezoelectric vibration element in the first embodiment.
  • FIG. 4B is a plan view of the piezoelectric vibration element in the first embodiment.
  • the piezoelectric vibrating element 3 has a piezoelectric layer 4.
  • the piezoelectric layer 4 has a first main surface 4a and a second main surface 4b opposed to the first main surface 4a.
  • the piezoelectric vibrating element 3 is fixed to the first elastic plate from the side of the first main surface 4a.
  • the first electrode 5a and the second electrode 5b are provided on the second main surface 4b of the piezoelectric layer 4.
  • a third electrode 5c is provided on the first major surface 4a so as to face the first electrode 5a with the piezoelectric layer 4 interposed therebetween.
  • the third electrode 5 c is electrically connected to the second electrode 5 b by a via hole electrode or a connection electrode (not shown) via the side surface of the piezoelectric layer 4.
  • the piezoelectric layer 4 As a material for forming the piezoelectric layer 4, an appropriate piezoelectric ceramic such as PZT-based ceramic can be used.
  • the first electrode 5a, the second electrode 5b and the third electrode 5c are made of an appropriate metal or alloy.
  • the configuration of the piezoelectric vibration element 3 is not particularly limited in the present invention.
  • the piezoelectric vibrating element 3 expands and contracts in the in-plane direction.
  • the first elastic plate 2a shown in FIG. 2 vibrates in the bending mode.
  • the vibration of the first elastic plate 2a is transmitted to the second elastic plate 2b via the first bonding portion 2a3.
  • the vibration device 1 is mounted from the second elastic plate 2b side.
  • the vibration of the vibration device 1 propagates from the second elastic plate 2 b to the outside.
  • a mass addition member 8 is attached to the first end 2a4 side of the first elastic plate 2a.
  • the first elastic plate 2a is located near the first end 2a4 and has a mounting portion 2a6 to which the mass addition member 8 is attached.
  • the mass addition member 8 is welded to the mounting portion 2a6.
  • the mass addition member 8 may be joined to the attachment portion 2a6 by, for example, an adhesive.
  • the tip mass of the pendulum consisting of the first elastic plate 2a can be increased, and the vibration of the vibration device 1 can be increased.
  • the mass addition member 8 can also adjust the resonance frequency of the vibration device 1.
  • the mass addition member 8 is made of an appropriate metal, a synthetic material of metal and resin, a ceramic or the like.
  • the mass addition member 8 is preferably made of a dense metal such as tungsten because of its high mass addition action.
  • a circuit board 6 as a circuit unit is provided on the second flat plate portion 2 b 1 of the second elastic plate 2 b. More specifically, the circuit board 6 is provided on the surface of the second flat plate portion 2b1 on the side of the first elastic plate 2a.
  • an appropriate substrate material made of a glass epoxy substrate or a synthetic resin such as polyimide can be used for the circuit board 6.
  • the circuit board 6 is provided with at least a part of a drive circuit for supplying power to and driving the piezoelectric vibrating element 3.
  • the circuit board 6 is electrically connected to the piezoelectric vibrating element 3 by the flexible printed wiring board 7.
  • the flexible printed wiring board 7 is configured using a resin film having flexibility, such as thermosetting polyimide. A conductive adhesive, solder or the like can be used to connect the circuit board 6 and the piezoelectric vibrating element 3 to the flexible printed wiring board 7.
  • the flexible printed wiring board 7 has a wiring connecting portion 7 d which connects a portion connected to the circuit board 6 and a portion connected to the piezoelectric vibrating element 3.
  • the flexible printed wiring board 7 has external connection parts 7a1 and 7a2.
  • the flexible printed wiring board 7 includes a first wiring portion 7b to which the circuit board 6 is connected, a second wiring portion 7c to which the piezoelectric vibrating element 3 is connected, a first wiring portion 7b and a second wiring portion 7c. And the wiring connection portion 7d to be connected.
  • the flexible printed wiring board 7 is bent at the wiring connection portion 7 d such that the same main surfaces of the first wiring portion 7 b and the second wiring portion 7 c face each other.
  • the circuit portion is not limited to the circuit board 6.
  • the circuit portion may form at least a part of a circuit for driving the piezoelectric vibrating element 3.
  • the circuit unit may be formed of a wiring element or the like.
  • the configuration of connection between the circuit portion and the piezoelectric vibrating element 3 is not particularly limited.
  • the circuit portion and the piezoelectric vibrating element 3 may be connected by a lead wire or the like.
  • the vibration device 1 may not necessarily have a circuit unit. In this case, the piezoelectric vibration element 3 may be driven by an input signal from the outside.
  • the vibration device 1 has a cover member 9.
  • the cover member 9 is provided to accommodate the first elastic plate 2 a to which the piezoelectric vibration element 3 and the mass addition member 8 are attached.
  • the cover member 9 includes a top plate 9a and a first side surface 9b, a second side surface 9c, and a third side surface 9d, one end of which is connected to the top plate 9a. And a fourth side portion 9e.
  • the first side face 9 b and the third side face 9 d face each other.
  • the second side surface portion 9c and the fourth side surface portion 9e face each other.
  • the first side surface 9b is located on the first end 2a4 side of the first elastic plate 2a.
  • the third side surface 9d is located on the second end 2a5 side.
  • the cover material 9 does not need to have at least one of the 1st side part 9b and the 3rd side part 9d.
  • the cover material 9 is made of an appropriate metal or synthetic resin.
  • metal is desirable because of its excellent mechanical strength. More preferably, stainless steel is desirable because of its excellent corrosion resistance.
  • the features of this embodiment are as follows. 1)
  • the first elastic plate 2a is configured to be able to generate sounds of a plurality of types of frequencies by the vibration of the bending mode. 2) At a frequency different from the frequency of the harmonics when only the first flat plate portion 2a1 vibrates in the bending mode, the first elastic plate 2a can generate sound by vibrating in the bending mode.
  • the first flat plate portion 2a1 and the connecting portion 2a2 are configured. More specifically, the first elastic plate 2a is configured to vibrate in the first vibration mode and the second vibration mode in the bending mode. As a result, sounds of a plurality of desired frequencies can be easily generated, and miniaturization can be promoted. This is explained below.
  • FIG. 5 is a view showing the relationship between the frequency of vibration and the sound pressure in the first elastic plate of the vibration device according to the first embodiment.
  • the sound pressure is high at 2 kHz and 4 kHz.
  • the first elastic plate is configured to be able to adjust the resonance frequency in the first vibration mode and the resonance frequency in the second vibration mode.
  • the resonant frequency in the first vibration mode is 2 kHz.
  • the resonant frequency in the second vibration mode is 4 kHz.
  • FIG. 6 is a schematic view for explaining the first vibration mode.
  • FIG. 7 is a schematic view for explaining the second vibration mode. 6 and 7, the vibration mode is schematically shown by integrating the first elastic plate and the mass addition member.
  • the fundamental mode in this embodiment refers to the fundamental mode of the first elastic plate to which a mass addition member is added.
  • the first vibration mode is a vibration mode in which only the first flat plate portion 2a1 of the first elastic plate 2a bends and vibrates.
  • the first elastic plate 2a generates sound by harmonics by vibrating in the first vibration mode.
  • the connecting portion 2a2 hardly vibrates.
  • the first elastic plate 2a vibrates only in the first vibration mode, it is difficult to set both 2 kHz and its doubled 4 kHz as the resonance frequency, for example.
  • the first flat plate portion 2a1 and the connecting portion 2a2 of the first elastic plate 2a are configured so as to be able to vibrate also in the second vibration mode shown in FIG.
  • the second vibration mode is a vibration mode in which the connecting portion 2a2 is bent and vibrated in addition to the first flat plate portion 2a1.
  • the resonant frequency in the second vibration mode is different from the resonant frequency in the first vibration mode.
  • the first elastic plate 2a can generate a sound by vibrating in the second vibration mode even at a frequency different from the frequency at which the sound can be generated in the first vibration mode.
  • the dimension along the direction in which each portion of the first elastic plate 2a extends is taken as the length of each portion.
  • the resonance frequency of the second vibration mode can be lowered as the length of the connecting portion 2a2 is increased.
  • the resonance frequency of the second vibration mode can be lowered as the thickness of the connecting portion 2a2 is reduced.
  • the resonance frequency of the second vibration mode can be easily adjusted by the connecting portion 2a2.
  • the resonance frequency of the second vibration mode may be adjusted to a frequency other than an integral multiple of the resonance frequency of the first vibration mode. That is, in the present invention, the frequency different from the frequency of the harmonic in the case where only the first flat plate portion vibrates in the bending mode may be a frequency other than the multiple of the fundamental mode in the bending mode.
  • the length and thickness of the first flat plate portion 2a1 of the first elastic plate 2a and the connecting portion 2a2 may be adjusted. Therefore, it is possible to easily generate sounds of a plurality of types of desired frequencies. In addition, since it is not necessary to provide a resonance space in which sound resonates in order to perform frequency adjustment, miniaturization can be promoted.
  • frequencies other than 2 kHz and 4 kHz also cause the sound pressure to increase.
  • sound can be generated by vibration at a plurality of types of frequencies other than the frequency of the multiple of the fundamental mode. Therefore, various notification functions can be performed.
  • a notification function by vibration can also be performed.
  • a node of vibration be located at the attachment portion 2a6 in vibration of the first elastic plate 2a that generates sound.
  • the node of the vibration in the vibration of the first elastic plate 2a at 2 kHz in the first vibration mode, it is preferable that the node of the vibration be located at the attachment portion 2a6.
  • a node of the vibration in the vibration of the first elastic plate 2a at 4 kHz in the second vibration mode, it is preferable that a node of the vibration be located at the attachment portion 2a6.
  • the first flat plate portion 2a1 of the first elastic plate 2a and the second flat plate portion 2b1 of the second elastic plate 2b face each other. Thereby, the miniaturization of the vibration device 1 can be effectively promoted.
  • the vibration device 1 since the vibration device 1 includes the mass addition member 8 attached to the attachment portion 2a6 of the first elastic plate 2a, the vibration of the vibration device 1 can be increased. Therefore, the size of the vibration device 1 required for suitably performing the notification function can be reduced, and the miniaturization of the vibration device 1 can be further advanced.
  • the mass addition member 8 of the present embodiment has a first main surface 8A located on the first elastic plate 2a side and a second main surface located on the second elastic plate 2b side. And 8B.
  • the first major surface 8A of the mass addition member 8 has a step-like shape. More specifically, the first main surface 8A includes a third flat plate portion 8a, a fourth flat plate portion 8b, and a fifth flat plate portion 8c which are connected with each other via a step.
  • the mass addition member 8 is attached to the attachment portion 2a6 of the first elastic plate 2a in the fourth flat plate portion 8b. More specifically, in the first elastic plate 2a, the first end 2a4 is disposed near the step. The fourth flat plate portion 8b and the fifth flat plate portion 8c are also connected via another step. The tip of the piezoelectric vibrating element 3 is disposed near the other step. In the present embodiment, the flexible printed wiring board 7 is stacked on the piezoelectric vibrating element 3 so as to reach the above-described tip end of the piezoelectric vibrating element 3.
  • the height of the step between the third flat plate portion 8a and the fourth flat plate portion 8b is equal to the thickness of the first flat plate portion 2a1 of the first elastic plate 2a.
  • the height of the step between the fourth flat plate portion 8 b and the fifth flat plate portion 8 c is equal to the total thickness of the piezoelectric vibrating element 3 and the flexible printed wiring board 7.
  • the third flat plate portion 8a is an inclined surface. At least a part of the second main surface 8B is also an inclined surface. Thereby, as the distance from the first end 2a4 of the first elastic plate 2a is increased, the thickness of the mass addition member 8 (the first main surface 8A of the mass addition member 8 and the second main surface 8B of the mass addition member 8) Distance with) is getting thinner. As a result, when the first elastic plate 2 a vibrates, the mass addition member 8 hardly collides with the second elastic plate 2 b and the top plate portion 9 a of the cover member 9. Therefore, the miniaturization can be promoted and the vibration can be increased.
  • the shape of the mass addition member 8 is not limited to the above.
  • the flexible printed wiring board 7 has an external connection portion 7 a 1 and an external connection portion 7 a 2 electrically connected to the outside.
  • the external connection portion 7 a 1 and the external connection portion 7 a 2 protrude sideward than the second elastic plate 2 b and the cover member 9. Therefore, electrical connection with the outside can be easily performed.
  • the form of the electrical connection with the exterior in the vibration apparatus 1 is not limited above.
  • the piezoelectric vibration element 3 is driven by the circuit board 6 shown in FIG.
  • the circuit board 6 is configured to change the frequency of the input signal input to the piezoelectric vibrating element 3.
  • sounds of different heights can be generated simultaneously or continuously by the vibration of the first elastic plate 2a, and the notification function and the like can be diversified.
  • the vibration apparatus 1 can generate the sound of multiple types of frequency including 2 kHz and 4 kHz. Therefore, the combination of sounds of different heights can be diversified, and the notification function and the like can be further diversified. Note that the timing of generating a sound and the strength of the sound may be changed by the circuit board 6.
  • an input signal is inputted from the outside to the piezoelectric vibration element 3 and the frequency of the input signal is changed to generate sounds of different heights according to the vibration of the first elastic plate 2a. May be generated simultaneously.
  • a driving method of the vibration device of the present invention a driving method may be employed in which sounds of different heights are continuously generated by changing the frequency of an input signal from the outside. Note that the timing of generating a sound and the strength of the sound may be changed by inputting an input signal from the outside. According to this driving method, it is possible to easily generate sounds of a plurality of desired frequencies. Even when the vibration device 1 does not have the circuit board 6 or when the circuit substrate 6 does not input an input signal for the vibration device 1 to generate a sound to the piezoelectric vibration element 3, the notification function etc. are diversified. be able to.
  • the flexural rigidity of the second elastic plate 2b shown in FIG. 2 is preferably higher than the flexural rigidity of the first elastic plate 2a.
  • bending rigidity means the property which shows the difficulty of performing bending deformation of an object, when force is added to an object. High bending stiffness means that bending deformation is difficult.
  • the second elastic plate 2b since the second elastic plate 2b has higher bending rigidity than the first elastic plate 2a, the second elastic plate 2b is not easily bent by the vibration of the first elastic plate 2a. Therefore, the intensity of the vibration propagated to the second elastic plate 2b is not easily attenuated. Therefore, even if the thickness and size of the device are reduced, the reduction in vibration intensity is unlikely to occur, and the notification function by the vibration can be suitably performed.
  • the thickness of the second elastic plate 2b is thicker than the thickness of the first elastic plate 2a. Furthermore, the material of the second elastic plate 2b has higher bending rigidity than the material of the first elastic plate 2a. Thereby, the bending rigidity of the 2nd elastic board 2b is higher than the bending rigidity of the 1st elastic board 2a.
  • the first elastic plate 2a and the second elastic plate 2b may be made of the same material.
  • the bending rigidity of the second elastic plate 2b can be made higher than the bending rigidity of the first elastic plate 2a by making the thickness or the like different.
  • the thicknesses of the first elastic plate 2a and the second elastic plate 2b may be the same.
  • the bending rigidity of the second elastic plate 2b can be made higher than the bending rigidity of the first elastic plate 2a by changing the material or the like.
  • the portion where the first elastic plate 2a and the second elastic plate 2b are joined is the second end 2a5 of the first elastic plate 2a and the fourth end 2b5 of the second elastic plate 2b. It is preferable to include at least one of them. Thereby, miniaturization of the vibration device 1 can be promoted. However, as in the present embodiment, it is more preferable that the portion to which the first elastic plate 2a and the second elastic plate 2b are joined includes both the second end 2a5 and the fourth end 2b5. preferable. Thereby, the miniaturization of the vibration device 1 can be further advanced.
  • vibration devices according to first and second modified examples of the first embodiment are shown.
  • the vibration devices according to the first and second modifications similarly to the vibration device 1 of the first embodiment, sounds of a plurality of desired frequencies can be easily generated, and Miniaturization can be promoted.
  • FIG.8 and FIG.9 only the structure of the 1st elastic board of a vibrating device and a 2nd elastic board is shown.
  • FIG. 8 is a perspective view of a first elastic plate and a second elastic plate in a first modified example of the first embodiment.
  • the present modification differs from the first embodiment in that the thickness of the second flat plate portion 12b1 of the second elastic plate 12b is thinner than the thickness of the second bonding portion 12b3. Since the thickness of the second flat plate portion 12b1 is smaller than the thickness of the second bonding portion 12b3, the mass addition member hardly collides with the second elastic plate 12b during vibration. Therefore, it is hard to produce the fall of the intensity of vibration accompanying size reduction and thickness reduction.
  • FIG. 9 is a perspective view of a first elastic plate and a second elastic plate in a second modified example of the first embodiment.
  • the present modification differs from the first embodiment in that in the first elastic plate 22a, the first bonding portion 22a3 extends from the connecting portion 22a2 in a direction approaching the first end 22a4. More specifically, the first bonding portion 22a3 has a surface extending parallel to the second flat plate portion 2b1 of the second elastic plate 2b. The first bonding portion 22a3 is bonded to the second elastic plate 2b at the surface. The first bonding portion 22a3 has a portion overlapping the first flat plate portion 22a1 in plan view. Therefore, the miniaturization of the vibration device can be promoted.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)

Abstract

La présente invention concerne un appareil vibrant avec lequel des sons d'une pluralité de fréquences souhaitées peuvent être facilement produits, et un progrès apporté à une réduction de la taille peut être obtenu. Cet appareil vibrant (1) comprend : une première plaque élastique (2a) ayant une première partie de plaque plate (2a1), une première partie de liaison (2a2) et une partie de jonction (2a3) ; une seconde plaque élastique (2b) qui est jointe à la partie de jonction (2a3) et qui comporte une seconde partie de plaque plate (2b1) opposée à la première partie de plaque plate (2a1) ; un élément vibrant piézoélectrique (3) disposé sur la première partie de plaque plate (2a1) de la première plaque élastique (2a) ; et un élément d'ajout de masse (8) fixé à la première plaque élastique (2a). La première plaque élastique (2a) est configurée de sorte à pouvoir produire des sons d'une pluralité de fréquences par vibration dans un mode de flexion et la première partie de plaque plate (2a1) et la première partie de liaison (2a2) sont configurées de telle sorte qu'à des fréquences différentes de la fréquence harmonique qui se produit lorsque seule la première partie de plaque plate (2a1) est amenée à vibrer par le mode de flexion, un son puisse être produit par la première plaque élastique (2a) qui est amenée à vibrer par le mode de flexion.
PCT/JP2018/026046 2017-07-28 2018-07-10 Appareil vibrant et procédé permettant de commander ce dernier Ceased WO2019021815A1 (fr)

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JP2019532492A JP6648862B2 (ja) 2017-07-28 2018-07-10 振動装置及びその駆動方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020170938A1 (fr) * 2019-02-22 2020-08-27 株式会社村田製作所 Dispositif de vibration
JP2021040286A (ja) * 2019-09-05 2021-03-11 Tdk株式会社 振動デバイス

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127696A (ja) * 1988-11-08 1990-05-16 Murata Mfg Co Ltd 振動アラーム装置
WO2010023801A1 (fr) * 2008-08-27 2010-03-04 株式会社村田製作所 Dispositif vibranting device
JP2012119882A (ja) * 2010-11-30 2012-06-21 Murata Mfg Co Ltd 振動装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100729152B1 (ko) * 2006-01-04 2007-06-19 이병우 압전 평판 스피커용 압전 진동 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127696A (ja) * 1988-11-08 1990-05-16 Murata Mfg Co Ltd 振動アラーム装置
WO2010023801A1 (fr) * 2008-08-27 2010-03-04 株式会社村田製作所 Dispositif vibranting device
JP2012119882A (ja) * 2010-11-30 2012-06-21 Murata Mfg Co Ltd 振動装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020170938A1 (fr) * 2019-02-22 2020-08-27 株式会社村田製作所 Dispositif de vibration
JPWO2020170938A1 (ja) * 2019-02-22 2021-10-21 株式会社村田製作所 振動装置
US12017252B2 (en) 2019-02-22 2024-06-25 Murata Manufacturing Co., Ltd. Vibration device
JP2021040286A (ja) * 2019-09-05 2021-03-11 Tdk株式会社 振動デバイス
JP7294006B2 (ja) 2019-09-05 2023-06-20 Tdk株式会社 振動デバイス

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