WO2019021370A1 - Coating device, el device manufacturing apparatus, and el device - Google Patents

Abstract

A coating device (101) comprises a head (104) for discharging ink containing an organic material on a coating region forming a rectangle on a bottom layer film, and a discharge control unit (108) for controlling discharging of the ink by the head. The discharge control unit (108) controls discharging of the ink according to the conditions under which the head (104) coats the ink, which have been set for each of a plurality of divided regions into which the coating region is divided. The divided regions are provided at least at the four corners of the coating region.

Description

Coating device, EL device manufacturing apparatus and EL device

The present invention relates to a coating apparatus for coating a resin for sealing an EL light emitting element layer.

An EL device including an EL element (electroluminescence element) has a structure in which a TFT (Thin Film Transistor) layer, a light emitting element layer, a sealing layer, and the like are stacked on a base material.

In the manufacturing of such an EL device, in the step of forming the sealing layer, for example, an inorganic sealing film made of an inorganic material is formed, and an organic sealing film made of an organic material for planarization is formed thereon. After formation, an inorganic sealing film is further formed thereon. For example, as disclosed in Patent Document 1, the formation of the organic sealing film is performed by applying an ink containing an organic material by an inkjet device.

Japanese Patent Publication "Japanese Patent Application Laid-Open No. 2016-192407 (released on November 10, 2016)"

For example, when forming an organic sealing film using the above-mentioned inkjet apparatus, as shown in FIG. 8, an ink is apply | coated to application | coating area | region D0 which covers active area DA in which the light emitting element was formed. Usually, the application conditions of the ink in the application area D0 (the amount of ink droplets ejected from the nozzles of the head, the ejection density of the ink, etc.) are uniform throughout the application area D0.

As shown in FIG. 9, in the organic sealing film 271 formed by applying the ink to the application region D0, the ink is applied to the four corners 271a (only one corner 271a is shown in FIG. 9). Because it does not spread well, it is formed in a curvilinear shape, not an angular shape.

Therefore, the distance L11 from the outer end of the corner 271a to the outer end of the active area DA is equal to the distance L12 from the outer end of the side 271b of the organic sealing film 271 to the outer end of the active area DA. Also become shorter. The distance L12 is set to the shortest length at which the organic sealing film 271 can prevent the penetration of water. Therefore, when the distance L11 is shorter than the distance L12, it is difficult to sufficiently prevent the penetration of water from the corner 271a. As a result, the light emitting element close to the corner 271 a is damaged by the infiltrated water, which causes a problem that a defective product is generated.

One aspect of the present invention is to improve the sealing property of an organic sealing film.

In order to solve the above-mentioned subject, the application device concerning one mode of the present invention controls the discharge of the ink by the head which discharges the ink containing an organic material to the application field which forms the rectangle on a lower layer film which makes a rectangle. A discharge control unit, wherein the discharge control unit controls the discharge of the ink according to the ink application amount per unit area by the head, which is set for each of the plurality of divided regions into which the application region is divided; The divided areas are provided at least at four corners of the application area.

According to one aspect of the present invention, an effect is obtained that the sealing property of the organic sealing film can be improved.

(A) And (b) is process drawing which shows an example of the manufacturing process of EL device. (A) And (b) is sectional drawing which shows the structural example of EL device. It is a top view which shows the process of division in the said manufacturing process. (A) is a figure which shows the structure of the coating device used for formation of the organic sealing film in the said manufacturing process, (b) is a top view which shows the ink discharge surface of the head provided in the said coating device. It is a figure which shows the division which concerns on Embodiment 1 to which an ink is apply | coated by the said application apparatus. (A) is a figure which expands and shows a part of organic sealing film formed by application of the ink by the said coating device. (B) is a cross-sectional view taken along line AA of (a) showing a cross-sectional structure of the organic sealing film 27. It is a figure which shows the division which concerns on Embodiment 2 to which an ink is apply | coated by the said application apparatus. It is a figure which shows the division which concerns on Embodiment 2 to which an ink is apply | coated by the conventional coating device. It is a figure which expands and shows a part of organic sealing film formed by application of the ink by the conventional application device.

Embodiment 1
The following description will explain Embodiment 1 of the present invention with reference to FIGS. 1 to 6.

FIG. 1 is a process chart showing an example of a manufacturing process of an EL device. FIG. 2A is a cross-sectional view showing a configuration example of the EL device. FIG. 3 is a plan view showing the process of division in the above manufacturing process.

First, manufacturing of the EL device will be described.

As shown in (a) of FIG. 1 and (a) of FIG. 2, first, the resin layer 12 is formed on the base material 10 (supporting material) common to a plurality of EL devices (step S1). Next, the barrier layer 3 is formed (step S2). The TFT layer 4 including the gate insulating film 16, the passivation films 18 and 20, and the organic interlayer film 21 is formed on the barrier layer 3 (step S3).

A light emitting element layer (for example, an OLED (Organic Light Emitting Diode) element layer) 5 is formed on the TFT layer 4 (step S4). Next, the sealing layer 6 including the first inorganic sealing film 26 (lower layer film, first inorganic film), the second inorganic sealing film 28 (second inorganic film), and the organic sealing film 27 (organic film) is formed. To obtain the laminate 7 (step S5).

The laminate 7 is divided together with the base material 10 and separated into pieces (step S7). Then, the functional film 39 is attached via the adhesive layer 38 (step S8). Further, the electronic circuit board is mounted on the end of the TFT layer 4 (step S9).

Thereby, the EL device 2 shown in FIG. 2A is obtained. The above steps are performed by an EL device manufacturing apparatus 100 (see FIG. 4) described later.

In the case of producing a flexible EL device, as shown in (b) of FIG. 1 and (b) of FIG. 2, for example, a laminate 7 (resin layer 12 and barrier layer 3) is formed on a glass substrate 50 (supporting material). The TFT layer 4, the light emitting element layer 5 and the sealing layer 6) are formed, and the top film 9 is pasted on the laminated body 7 through the adhesive layer 8 (step S6a). In this state, the lower surface of the resin layer 12 is irradiated with laser light through the glass substrate 50 (step S6b). By the irradiation of the laser beam, the lower surface (the interface with the glass substrate 50) of the resin layer 12 is degraded by ablation, and the bonding force between the resin layer 12 and the glass substrate 50 is reduced.

Next, the glass substrate 50 is peeled off from the resin layer 12 (step S6c). Next, the base material 10 (for example, a lower surface film made of PET or the like) is attached to the lower surface of the resin layer 12 through the adhesive layer (step S6d). Thereafter, the process proceeds to step S7.

Examples of the material of the resin layer 12 include polyimide, epoxy, polyamide and the like. Examples of the material of the lower film include polyethylene terephthalate (PET).

The barrier layer 3 is a layer that prevents moisture and impurities from reaching the TFT layer 4 and the light emitting element layer 5 when the EL device is used. The barrier layer 3 can be formed of, for example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a laminated film thereof formed by CVD.

The TFT layer 4 includes the semiconductor film 15, the gate insulating film 16, the gate electrode G, the passivation films 18 and 20, the capacitance electrode C and terminals, the source wiring S and the drain wiring D, and the organic interlayer film (planarization And 21).

The gate insulating film 16 is formed above the semiconductor film 15. The gate electrode G is formed above the gate insulating film 16. The passivation films 18 and 20 are formed in the upper layer than the gate electrode G. The capacitance electrode C and a terminal (not shown) are formed above the passivation film 18. The source wiring S and the drain wiring D are formed above the passivation film 20. The organic interlayer film 21 is formed above the source line S and the drain line D.

The thin film transistor (TFT) is configured to include the semiconductor film 15, the gate insulating film 16, and the gate electrode G. In the non-active area of the TFT layer 4, a plurality of the above-mentioned terminals used for connection with the electronic circuit substrate are formed.

The semiconductor film 15 is made of, for example, low temperature polysilicon (LTPS) or an oxide semiconductor. The gate insulating film 16 can be formed of, for example, a silicon oxide (SiOx) film or a silicon nitride (SiNx) film formed by a CVD method, or a laminated film of these. The gate electrode G, the source electrode S, the drain electrode D, and the terminals are made of, for example, aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), copper It is comprised by the single layer film or laminated film of the metal containing at least one of Cu).

The TFT having the semiconductor film 15 as a channel has a top gate structure in (a) and (b) of FIG. However, the TFT may have a bottom gate structure (eg, in the case where the channel of the TFT is an oxide semiconductor).

The gate insulating film 16 and the passivation films 18 and 20 can be formed of, for example, a silicon oxide (SiOx) film or a silicon nitride (SiNx) film formed by a CVD method, or a laminated film of these. The organic interlayer film 21 can be made of, for example, a coatable photosensitive organic material such as polyimide or acrylic. The edge of the terminal is covered with the organic interlayer film 21.

The light emitting element layer 5 (for example, an organic light emitting diode layer) includes a first electrode 22 (for example, an anode electrode), an organic insulating film 23, an EL (electroluminescence) layer 24, and a second electrode 25. Further, the first electrode 22, the EL layer 24, and the second electrode 25 constitute a light emitting element (for example, an organic light emitting diode).

The first electrode 22 is formed above the organic interlayer film 21. The organic insulating film 23 covers the edge of the first electrode 22. The EL layer 24 is formed in the upper layer than the first electrode 22. The second electrode 25 is formed above the EL layer 24. In the active area DA in which the light emitting element layer 5 is formed, the organic insulating film 23 functions as a bank (pixel partition wall) which defines a sub pixel.

The organic insulating film 23 can be made of, for example, a coatable photosensitive organic material such as polyimide or acrylic. The organic insulating film 23 can be applied by, for example, an inkjet method to the non-active area where the active area DA and the light emitting element layer 5 are not formed.

In the non-active area, a bank-like convex body TK surrounding the active area is provided. The convex body TK defines an edge of the organic sealing film 27 (for example, a film formed by an inkjet method). The convex body TK is configured to include, for example, at least one of the organic interlayer film 21 and the organic insulating film 23.

The EL layer 24 is formed by an evaporation method or an inkjet method in a region (sub-pixel region) surrounded by the partition wall 23c. When the light emitting element layer 5 is an organic light emitting diode (OLED) layer, for example, the EL layer 24 is formed by sequentially laminating a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer from the lower layer side. It is constituted by doing. Note that one or more layers of the EL layer 24 can be a common layer (shared by a plurality of pixels).

The first electrode 22 (anode) is formed of, for example, a laminate of ITO (Indium Tin Oxide) and an alloy containing Ag, and has light reflectivity. The second electrode 25 (for example, a cathode electrode) is a common electrode and can be made of a transparent metal such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide).

When the light emitting element layer 5 is an OLED layer, the driving current between the first electrode 22 and the second electrode 25 recombines holes and electrons in the EL layer 24, and the exciton generated thereby falls to the ground state. Light is emitted.

The light emitting element layer 5 is not limited to forming an OLED element, and may form an inorganic light emitting diode or a quantum dot light emitting diode.

The sealing layer 6 is sealed by covering the light emitting element layer 5 to prevent permeation of foreign matter such as water and oxygen into the light emitting element layer 5. The sealing layer 6 includes a first inorganic sealing film 26, an organic sealing film 27, and a second inorganic sealing film 28. The first inorganic sealing film 26 covers the organic insulating film 23 and the second electrode 25. The organic sealing film 27 is formed above the first inorganic sealing film 26 and functions as a buffer film. The second inorganic sealing film 28 covers the first inorganic sealing film 26 and the organic sealing film 27. Further, the end portion of the organic sealing film 27 is covered with the first inorganic sealing film 26 and the second inorganic sealing film 28.

Each of the first inorganic sealing film 26 and the second inorganic sealing film 28 is, for example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a laminated film thereof formed by CVD using a mask. Can be composed of The organic sealing film 27 is a translucent organic insulating film thicker than the first inorganic sealing film 26 and the second inorganic sealing film 28, and is made of a photosensitive organic material that can be coated, such as polyimide or acrylic. can do. For example, after an ink containing such an organic material is inkjet-coated on the first inorganic sealing film 26, the organic sealing film 27 is formed by curing by UV irradiation.

The functional film 39 has, for example, an optical compensation function, a touch sensor function, a protection function, and the like. In the case where the layer having one or more of these functions is stacked on the light emitting element layer 5, the functional film 39 can be formed thin or removed. The electronic circuit board is, for example, an IC chip or a flexible printed circuit (FPC) mounted on a plurality of terminals.

In solidifying by division in the above-mentioned step S7, as shown in FIG. 3, the terminal TM and the terminal wiring TW formed in the non-active region of the laminate formed on the base 10 and the TFT layer 4 And are cut by irradiation of a laser onto the dividing line DL to cut out pieces of the EL device. Here, the dividing line DL is provided at a position wider than the outer end of the second inorganic sealing film 28 and at a distance from the outer end.

The organic sealing film 27 covers the active area DA and is entirely covered by the second inorganic sealing film 28. Further, the terminal wire TW is connected to the terminal TM, and is located closer to the active area DA than the terminal TM.

Subsequently, a coating apparatus for forming the organic sealing film 27 will be described.

(A) of FIG. 4 is a figure which shows the structure of the coating device 101 used for formation of the organic sealing film 27 of a sealing layer. FIG. 4B is a plan view showing the ink ejection surface 104 a of the head 104 provided in the coating apparatus 101. FIG. 5 is a view showing a section to which the ink is applied by the applying device 101. As shown in FIG.

As shown in (a) of FIG. 4, the coating apparatus 101 is included in the EL device manufacturing apparatus 100, and includes a stage 102, a gantry 103, a head 104, and a control unit 105. The coating device 101 is an inkjet type device, and applies the ink to the coated laminate 201.

The stage 102 is a stage on which the coated laminate 201 is placed. The to-be-coated laminate 201 includes a plurality of laminates before being cut into pieces, in which up to the first inorganic sealing film 26 is formed on the light emitting element layer 5 shown in FIG. It has a rectangular shape.

The gantry 103 is driven to move on the stage 102 in the Y1 direction and the Y2 direction. The gantry 103 also has two legs 103a and a beam 103b. The legs 103 a are disposed to face each other on both sides of the coated laminate 201 along the X1 direction and the X2 direction. Both ends of the beam portion 103 b are connected to the upper end of the leg portion 103 a. A drive mechanism (not shown) for driving the gantry 103 is provided on the stage 102.

The head 104 is a device that discharges (drops) an ink containing an organic material to the coated laminate 201. Further, as shown in (b) of FIG. 4, a plurality of nozzles 104 b are formed on the ink discharge surface 104 a of the head 104. The nozzles 104 b are ink discharge ports, and are arranged in a plurality of columns and a plurality of rows. The nozzles 104 b in each row aligned in the X1 direction and the X2 direction are misaligned in the column direction (the Y1 direction and the Y2 direction). Thus, by matching the nozzle resolution of each row, it is possible to eject ink with high resolution. For example, if the resolution of the nozzles 104 b in one row is 140 DPI, ink can be ejected at a resolution of n × 140 DPI if n rows of nozzles 104 b are provided.

The head 104 is attached to the beam portion 103b of the gantry 103 with the ink discharge surface 104a facing the stage 102, and along the guide rails (not shown) provided on the lower surface of the beam portion 103b, in the X1 direction and the X2 direction. Drive to move to A drive mechanism (not shown) for driving the head 104 is provided to the beam portion 103 b of the gantry 103.

The control unit 105 includes a gantry drive control unit 106, a head drive control unit 107, a discharge control unit 108, and a storage unit 109.

The gantry drive control unit 106 controls the drive of the gantry 103 in the Y1 direction and the Y2 direction. The head drive control unit 107 controls the driving of the head 104 in the X1 direction and the X2 direction. The discharge control unit 108 controls the discharge of the ink by the nozzle 104 b based on the preset application conditions. Here, the application conditions include the amount of ink droplets ejected from the nozzles 104 b (ink ejection amount), the ejection density of ink (ink ejection density), and the like. The ink ejection density (ink ejection amount per drop [pl]) is the ink ejection amount per unit area [pl / um ² ].

The storage unit 109 stores data and the like for the control unit 105 to perform various controls. For example, the storage unit 109 stores a pattern for controlling the drive of the gantry 103 by the gantry drive control unit 106. In addition, the storage unit 109 stores a pattern for the head drive control unit 107 to control the drive of the head 104. The storage unit 109 also stores application conditions used by the discharge control unit 108 to control the ink discharge of the head 104.

The gantry drive control unit 106, the head drive control unit 107, and the discharge control unit 108 in the control unit 105 may be realized by a logic circuit (hardware) formed in an integrated circuit (IC chip) or the like, or a CPU (Central Processing Unit). It may be realized by software using Processing Unit).

In the latter case, the coating apparatus 101 is a CPU that executes instructions of a program that is software that implements each function, a ROM (Read Only Memory) in which the program and various data are recorded readable by a computer (or CPU) or A storage device (these are referred to as a "recording medium"), a RAM (Random Access Memory) for developing the program, and the like are provided. The object of the present invention is achieved by the computer (or CPU) reading the program from the recording medium and executing the program.

As the recording medium, a “non-transitory tangible medium”, for example, a tape, a disk, a card, a semiconductor memory, a programmable logic circuit or the like can be used. The program may be supplied to the computer via any transmission medium (communication network, broadcast wave, etc.) capable of transmitting the program.

Note that one aspect of the present invention can also be realized in the form of a data signal embedded in a carrier wave in which the program is embodied by electronic transmission.

Next, setting of application conditions will be described.

FIG. 5 is a view showing a section to which the ink is applied by the applying device 101. As shown in FIG. FIG. 5 shows the laminated body in a solidified state for convenience. Also, the active area DA here is the active area DA in the laminate in which the first inorganic sealing film 26 is formed.

As shown in FIG. 5, the application area D0 to which the ink is applied is provided in a wide range including the active area DA. The aforementioned convex body TK is provided around the application area D0. The application area D0 is divided into nine divided areas D1 to D9, and application conditions corresponding to the divided areas D1 to D9 are set.

The divided area D1 (second divided area) is a rectangular area which covers the rectangular active area DA and extends to a predetermined distance from the outer end of the active area DA. The divided area D2 (second divided area, third divided area) is a narrow area provided along one long side of the divided area D1. The divided area D3 (second divided area, third divided area) is a narrow area provided along the other long side of the divided area D1. The divided area D4 (second divided area, third divided area) is a narrow area provided along one short side of the divided area D1. The divided area D5 (second divided area, third divided area) is a narrow area provided along the other short side of the divided area D1.

The divided area D6 (first divided area) is a rectangular area adjacent to the divided area D2 and the divided area D4. The divided area D7 (first divided area) is a rectangular area adjacent to the divided area D3 and the divided area D4. The divided area D8 (first divided area) is a rectangular area adjacent to the divided area D2 and the divided area D5. The divided area D9 (first divided area) is a rectangular area adjacent to the divided area D3 and the divided area D5. The divided areas D6 to D8 are provided at four corners of the application area D0.

The application conditions for the divided regions D1 to D5 are set to normal application conditions. On the other hand, the coating conditions for the divided regions D1 to D5 are set to coating conditions different from normal. For example, as the application conditions for the divided regions D6 to D9, the ink ejection amount is set larger than usual so that the ink application amount per unit area (the application amount of the organic material) is increased, or the ink ejection density is usually It may be set higher. In order to increase the ink application amount, for example, the ink ejection density may be increased. As a method of increasing the ink discharge density, there are a method of changing the drive waveform of the head 104 to increase the ink discharge amount per droplet, a method of increasing the discharge frequency, and the like. Here, the normal application conditions refer to application conditions for performing one application by the head 104 in order to obtain a desired film thickness of the organic sealing film 27.

Subsequently, the operation of the coating apparatus 101 configured as described above will be described.

FIG. 6A is an enlarged view of a part of the organic sealing film 27 formed by the application of the ink by the coating device 101. FIG. FIG. 6B is a cross-sectional view taken along line AA of FIG. 6A showing the cross-sectional structure of the organic sealing film 27. As shown in FIG.

With the gantry 103 at the initial position, the head 104 ejects ink droplets to the application laminate 201 on the stage 102 while moving in the X1 direction or the X2 direction. When the application of the ink in the short side direction of the coated laminate 201 is completed, the gantry 103 moves in the Y1 direction by a predetermined distance. At this position, the head 104 ejects an ink droplet to the coated laminate 201 while moving in the opposite direction to the previous application. By repeating such an operation, the ink is applied to the application region D0 of the application laminate 201.

The application as described above is repeated until the organic sealing film 27 having the required thickness (5 to 10 μm) is formed. The second application is performed by moving the gantry 103 in the Y2 direction.

The ejection control unit 108 controls the ink ejection of the head 104 under normal application conditions when the head 104 ejects the ink on the divided regions D1 to D5. On the other hand, when the head 104 ejects the ink on the divided regions D6 to D9, the ink ejection of the head 104 is controlled under the application condition different from the normal as described above.

In the organic sealing film 27 formed as a result, as shown in FIG. 6A, four corners 27a (one corner 27a in FIG. 6A) corresponding to the divided regions D6 to D9. (Shown only) is formed so as to bulge with respect to the side 27b. Further, the organic sealing film 27 is formed between the corner 27a, the inner part 27c formed in the active area DA, and the corner 27a and the inner part 27c in the cross section shown in FIG. 6B. And an intermediate portion 27d. The film thickness of the corner 27a is the largest, the film thickness of the inner part 27c is the smallest, and the film thickness of the middle part 27d is an intermediate size between the film thickness of the corner 27a and the film thickness of the inner part 27c. The film thickness of the side portion 27b is the same as the film thickness of the middle portion 27d.

Thereby, in the organic sealing film 27, the distance L1 from the corner 27a to the outer end of the active area DA can be secured to be equal to or larger than the distance L2 from the side 27b to the outer end of the active area DA. The distance L2 is set to the shortest length at which the organic sealing film 27 can prevent the penetration of water. In addition, the film thickness of the corner 27 a is the largest in the organic sealing film 27. Therefore, it is possible to prevent the penetration of water in the corner 27a. Therefore, the sealing property of the organic sealing film 27 can be improved. Then, the reliability of the organic sealing film 27 can be improved.

In the present embodiment, since the width of the head 104 is smaller than the width (short side) of the coated laminate 201, it is necessary to move the head in the X1 direction or the X2 direction. On the other hand, the head 104 may have a width capable of having the number of nozzles 104 b capable of discharging the ink to the entire application range in the width direction of the coated laminate 201. The head 104 configured in this way does not need to be moved and is fixed to the gantry 103.

When making the pitch of application more dense using the above-mentioned wide head 104, it is possible to perform movement (scanning) of Y1 direction or Y2 direction in multiple times. Specifically, assuming that the application pitch in one scan is 70.5 um, when one reciprocation (two times) scan is performed, the head 104 is scanned from the position in the forward scan in the backward scan. By slightly moving in the X1 direction or the X2 direction, the application pitch can be halved to 35.25 um. The coating pitch can be 17.625 μm by performing two reciprocations (four times) in the same manner as described above.

Further, in the present embodiment, by fixing the stage 102 and moving the gantry 103, the head 104 is moved in the Y1 direction or the Y2 direction. On the other hand, with the head 104 fixed, the stage 102 may be moved in the X1 direction or the X2 direction and in the Y1 direction or the Y2 direction.

In the present embodiment, the organic interlayer film 21 may be provided at the end of the organic sealing film 27. Thereby, the organic interlayer film 21 can enhance the sealing effect of the organic sealing film 27. Alternatively, the passivation film 20 may be raised on the end side of the organic sealing film 27. Also by this, the sealing effect of the organic sealing film 27 can be enhanced.

Further, in the present embodiment, an example in which the application area D0 is divided into nine divided areas D1 to D9 has been described. However, the present invention is not limited to this, and the application area D0 may be divided by more than nine.

Second Embodiment
The second embodiment of the present invention is described below with reference to FIGS. 4 and 5. In the present embodiment, the components having the same functions as the components in the first embodiment described above will be denoted by the same reference numerals, and the description thereof will be appropriately omitted.

In the present embodiment, in addition to the setting of the coating condition in the first embodiment, the coating condition of the edge portion (outer edge portion) of the divided regions D2 to D5 shown in FIG. 5 is also different from the normal coating condition. Specifically, in the divided regions D2 to D5, the coating conditions for the portions other than the edge portion are set to be the same as the normal coating conditions, and the coating conditions for the edge portion are different from the normal coating conditions (for example, The ink discharge amount is reduced, the ink discharge density is reduced, and the like.

When ink is applied to the divided regions D2 to D5 under such application conditions, the edge portion of the formed organic sealing film 27 has the same thickness as that of the portion other than the edge portion even if it is raised by the surface tension of the ink. Is formed.

On the other hand, when the application conditions for the divided regions D2 to D5 are set to be uniform, the edge portion of the formed organic sealing film 27 swells due to the surface tension of the ink, and therefore, is formed thicker than the portions other than the edge portion. Ru. The rise of the edge portion causes a crack in the second inorganic sealing film 28 formed on the organic sealing film 27. For this reason, there arises a disadvantage that water easily enters from the crack.

Therefore, by setting the coating conditions for the divided regions D2 to D5 as in the present embodiment, it is possible to suppress the rise of the edge portion in the divided regions D2 to D5 of the organic sealing film 27. Thus, the possibility of the occurrence of cracks in the second inorganic sealing film 28 can be significantly reduced. As a result, the reliability of the organic sealing film 27 can be further improved.

In addition, since rising occurs due to the surface tension of the ink even at the start and end of ink discharge, the edges of the division areas D2 to D5 as described above are also generated at the start and end points of the ink discharge in the division areas D1 to D9. It is preferable to set application conditions in the part.

Third Embodiment
The third embodiment of the present invention is described below with reference to FIGS. 6 and 7. In the present embodiment, the components having the same functions as the components in the first embodiment described above will be denoted by the same reference numerals, and the description thereof will be appropriately omitted.

FIG. 7 is a view showing sections according to Embodiment 2 to which the application device 101 applies the ink.

In this embodiment, unlike the application region D0 in the first embodiment, as shown in FIG. 7, the application region D0 is divided into division regions D1 to D5, D61, D71, D81, and D91. The aforementioned convex body TK is provided around the application area D0.

The divided area D61 (first divided area) is a rectangular area in contact with the divided area D2 and the divided area D4, and protrudes outward beyond the divided area D2 and the divided area D4. The divided area D71 (first divided area) is a rectangular area in contact with the divided area D3 and the divided area D4, and protrudes outward beyond the divided area D3 and the divided area D4. The divided area D81 (first divided area) is a rectangular area in contact with the divided area D2 and the divided area D5, and protrudes outward beyond the divided area D2 and the divided area D5. The divided area D91 (first divided area) is a rectangular area in contact with the divided area D3 and the divided area D5, and protrudes outward beyond the divided area D3 and the divided area D5. The divided areas D61, D71, D81 and D91 respectively correspond to the four corners of the application area D0. Further, the divided regions D61, D71, D81, and D91 are formed larger than the divided regions D6 to D9 (see FIG. 5) in the first embodiment.

The coating conditions for the divided areas D1 to D5, D61, D71, D81, and D91 are normally set as in the first embodiment. When ink is applied to the divided regions D61, D71, D81 and D91 under such application conditions, the corner 27a of the formed organic sealing film 27 is as shown in (a) and (b) of FIG. Similar to the corner 27 a of the organic sealing film 27 in the first embodiment, it is formed in a wide range.

[Summary]
The coating apparatus according to aspect 1 of the present invention includes a head 104 that discharges an ink containing an organic material to a square application region on the lower layer film, and a discharge control unit 108 that controls the discharge of the ink by the head 104. Prepare. The ejection control unit 108 controls the ejection of the ink according to the ink application amount per unit area by the head 104 set for each of the divided areas where the application area is divided into a plurality. The divided areas are provided at least at four corners of the application area.

According to the above configuration, since the divided areas are provided at the four corners of the application area, the application condition of the divided area can be made different from the ink application amount of the other divided areas. Thus, the corner portions of the formed organic film can be formed large by optimally setting the ink application amounts of the divided regions provided at the four corners of the application region. Therefore, a long distance from the outer end of the organic film at the corner to the outer end of the lower layer can be secured. Therefore, the penetration of water from the organic film to the lower layer film can be suppressed.

In the coating apparatus according to aspect 2 of the present invention, in the aspect 1, the divided areas are configured by first divided areas provided at the four corners of the application area, and second divided areas other than the first divided area. The ink application amount per unit area to the first divided area may be set larger than that of the second divided area.

According to the above configuration, a larger amount of ink is applied to the first divided area, so that the corner of the organic film can be formed larger. Thereby, a long distance from the outer end of the corner of the organic film to the outer end of the lower layer film can be secured.

In the coating device according to aspect 3 of the present invention, in the aspect 2, the second divided area includes a third divided area provided between the first divided areas of two adjacent corners of the application area. It may be.

According to the above configuration, since the third divided area as described above is provided, the ink application amount of the third divided area can be set optimally. The edge portion of the organic film formed by applying the ink to the third divided region tends to swell due to the surface tension of the ink. Therefore, if the ink application amount in the third divided region is set to be smaller, it is possible to suppress the rise of the edge portion of the organic film.

In the coating apparatus according to aspect 4 of the present invention, in the above aspect 3, the first divided area may protrude outward beyond the third divided area.

According to the above configuration, since the ink is applied to the first divided area that protrudes outside the third section, the corner of the organic film can be formed large. Thereby, a long distance from the outer end of the corner of the organic film to the outer end of the lower layer film can be secured.

In the coating apparatus according to aspect 5 of the present invention, in any one of the above aspects 1 to 4, nine or more divided areas may be provided.

According to the above configuration, the ink application amount can be set in accordance with the more finely divided divided areas.

A coating apparatus according to a sixth aspect of the present invention is a coating apparatus for applying an organic material to a square application area on a support material common to a plurality of EL devices, wherein the application area is provided for each of the EL devices. In the above, the application amount of the organic material is made different between the four corners and the area other than the four corners.

According to the above configuration, in the application region of each EL device, the application amount of the organic material with respect to the four corners is made different from that in the regions other than the four corners. It can be formed large. Therefore, it is possible to secure a long distance from the outer end at the corner of the organic film to the outer end of the lower film of the organic film. Therefore, the penetration of water from the organic film to the lower layer film can be suppressed.

An EL device manufacturing apparatus according to aspect 7 of the present invention comprises the coating apparatus according to any one of aspects 1 to 6, wherein the coating apparatus is included in the sealing layer for sealing the light emitting element layer of the EL device. Form a film.

According to the above configuration, permeation of moisture from the organic film to the light emitting element layer can be suppressed.

In the EL device manufacturing apparatus according to aspect 8 of the present invention, in the aspect 7, the application region is provided to the application region provided so as to surround the active region where the light emitting element layer is formed. The organic film may be formed to seal the light emitting element layer by applying the organic material so that the four corners of the active region correspond to the four corners of the active region.

In the EL device according to aspect 9 of the present invention, a square is formed on the light emitting element layer so as to seal the light emitting element layer and an active region in which a light emitting element layer including a plurality of light emitting elements is formed. And an organic film formed by applying an organic material to the application region so as to surround the active region, wherein four corners of the organic film correspond to four corners of the active region, respectively. In the organic film, the application amount of the organic material is different between the four corners and the area other than the four corners.

According to the above configuration, in the organic film, the application amount of the organic material is different between the four corners and the other region, so the application amount of the four corners is increased, so that the corners are It can be formed large. Therefore, it is possible to secure a long distance from the outer end at the corner of the organic film to the outer end of the lower film of the organic film. Therefore, the penetration of water from the organic film to the lower layer film can be suppressed.

In the EL device according to Aspect 10 of the present invention, in the aspect 9, the four corners of the organic film may bulge outward beyond the side between two adjacent corners.

According to the above configuration, it is possible to secure a long distance from the outer end of the corner of the organic film to the outer end of the lower film of the organic film. This can prevent the penetration of water at the corners.

In the EL device according to aspect 11 of the present invention, in the aspect 10, the film thickness of the four corners in the organic film may be the largest, and the film thickness on the active region in the organic film may be the smallest.

According to the above configuration, by making the corner thick, it is possible to prevent the penetration of water at the corner.

The EL device according to aspect 12 of the present invention may further include a convex body provided so as to surround the active region in any of the above aspects 9 to 11.

According to the above configuration, the edge portion of the active area can be sealed.

In the EL device according to aspect 13 of the present invention, in any of the above aspects 9 to 12, the organic film is sandwiched between the first inorganic film lower than the organic film and the second inorganic film upper than the organic film. The edge of the organic film may be covered by the first inorganic film and the second inorganic film.

According to the above configuration, the edge portion of the organic film can be sealed.

[Items to be added]
The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Is also included in the technical scope of the present invention. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment.

2 EL Device 5 Light Emitting Element Layer 6 Sealing Layer 10 Base Material (Support Material)
22 1st electrode (light emitting element)
23 Organic insulating film (bank)
24 EL layer (light emitting element)
25 Second electrode (light emitting element)
26 First inorganic sealing film (lower layer film, first inorganic film)
27 Organic sealing film (organic film)
28 Second inorganic sealing film (second inorganic film)
50 Glass substrate (support material)
DESCRIPTION OF SYMBOLS 100 EL device manufacturing apparatus 101 Coating apparatus 104 Head 108 Discharge control part D0 Coating area D1 Division area (2nd division area)
D2 to D5 divisional area (second divisional area, third divisional area)
D6 to D9 Sectioned Area (First Sectioned Area)
D61, D71, D81, D91 Sectioned area (first sectioned area)
DA Active area TK convex body

Claims (13)

A head for ejecting an ink containing an organic material to a square application area on the lower layer film;
And a discharge control unit configured to control the discharge of the ink by the head.
The discharge control unit controls the discharge of the ink according to the ink application amount per unit area by the head, which is set for each of the divided areas into which the application area is divided into a plurality of areas.
The coating apparatus is characterized in that the divided areas are provided at least at four corners of the application area. The divided area is composed of a first divided area provided at four corners of the application area, and a second divided area other than the first divided area.
The coating device according to claim 1, wherein the ink application amount per unit area to the first divided area is set larger than that of the second divided area. The coating apparatus according to claim 2, wherein the second divided area includes a third divided area provided between the first divided areas of adjacent two corners of the application area. The coating device according to claim 3, wherein the first divided area protrudes outside the third divided area. The application apparatus according to any one of claims 1 to 4, wherein nine or more divided areas are provided. An application apparatus for applying an organic material to a square application area on a support common to a plurality of EL devices, comprising:
An application device, wherein the application amount of the organic material is made different between the four corners and the regions other than the four corners in the application region provided for each of the EL devices. A coating apparatus according to any one of claims 1 to 6, comprising:
The said coating apparatus forms the organic film contained in the sealing layer which seals the light emitting element layer of EL device, The EL device manufacturing apparatus characterized by the above-mentioned. With respect to the application area provided so as to surround the active area in which the light emitting element layer is formed, the coating apparatus applies the organic material so that the four corners of the application area correspond to the four corners of the active area. 8. The EL device manufacturing apparatus according to claim 7, wherein the organic film is formed to seal the light emitting element layer by coating. An active region in which a light emitting element layer including a plurality of light emitting elements is formed;
And an organic film formed by applying an organic material to a coating region so as to form a square on the light emitting device layer and to surround the active region so as to seal the light emitting device layer.
Four corners of the organic film correspond to four corners of the active region, respectively.
In the organic film, an application amount of the organic material is different between four corners and an area other than the four corners. The EL device according to claim 9, wherein the four corners of the organic film bulge outward beyond the side between two adjacent corners. 11. The EL device according to claim 10, wherein the film thickness at four corners of the organic film is the largest, and the film thickness on the active region in the organic film is the smallest. The EL device according to any one of claims 9 to 11, further comprising a convex body provided so as to surround the active region. The organic film is sandwiched between a first inorganic film lower than the organic film and a second inorganic film higher than the organic film.
The EL device according to any one of claims 9 to 12, wherein an end of the organic film is covered with the first inorganic film and the second inorganic film.

Images