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WO2019006600A1 - Agent de polissage, pièce en cuivre et procédé de polissage associé - Google Patents

Agent de polissage, pièce en cuivre et procédé de polissage associé Download PDF

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Publication number
WO2019006600A1
WO2019006600A1 PCT/CN2017/091534 CN2017091534W WO2019006600A1 WO 2019006600 A1 WO2019006600 A1 WO 2019006600A1 CN 2017091534 W CN2017091534 W CN 2017091534W WO 2019006600 A1 WO2019006600 A1 WO 2019006600A1
Authority
WO
WIPO (PCT)
Prior art keywords
parts
polishing agent
polishing
water
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/091534
Other languages
English (en)
Chinese (zh)
Inventor
刘国平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Hongchangfa Technology Co Ltd
Original Assignee
Shenzhen Hongchangfa Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Hongchangfa Technology Co Ltd filed Critical Shenzhen Hongchangfa Technology Co Ltd
Priority to PCT/CN2017/091534 priority Critical patent/WO2019006600A1/fr
Priority to CN201780092855.3A priority patent/CN110809615A/zh
Publication of WO2019006600A1 publication Critical patent/WO2019006600A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Definitions

  • Polishing agent copper piece and polishing treatment method thereof
  • the present invention relates to the field of iron surface treatment technology, and in particular, to a polishing agent, a copper member, and a polishing treatment method thereof.
  • the surface treatment technology of the workpiece is usually applied.
  • the surface treatment processes of copper, aluminum, iron and their alloys are well-established in a wide range of industries.
  • most workpieces require pre-treatment before surface treatment, for example, cleaning, decontamination and degreasing, and metal workpieces for certain applications need to be polished.
  • polishing agent which is safe, environmentally friendly, and easy to operate at a normal temperature, and a copper member polishing method and a copper member obtained by polishing are provided.
  • a polishing agent comprising, by weight of 200 parts by weight, of the following components: 5-20 parts of abrasive, 2-10 parts of ethylenediaminetetraacetic acid, 2-10 parts of sulfuric acid, 2-10 parts of persulfuric acid Ammonium, 2-10 parts polyethylene glycol and the balance water.
  • a copper member polishing treatment method comprising the steps of: formulating a polishing agent as described above; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to water in the polishing agent solution is 1: 1-2; The copper piece is immersed in the polishing agent solution, and after a predetermined daytime treatment, the copper piece is washed.
  • Embodiments of the present invention provide a polishing agent for surface pretreatment of copper parts, comprising 200 parts by weight, including the following parts by weight: 5-20 parts of abrasive, 2-10 parts of ethylenediaminetetraacetic acid 2-10 parts of sulfuric acid, 2-10 parts of ammonium persulfate, 2-10 parts of polyethylene glycol and the balance water.
  • the abrasive has a weight fraction of 10-20 parts.
  • the ethylenediaminetetraacetic acid is preferably 4-8 parts by weight
  • the sulfuric acid is preferably 4-8 parts by weight
  • the ammonium persulfate is preferably 4-8 parts by weight.
  • the polyethylene glycol is preferably 4-8 parts by weight, and the polishing agent is used in a ratio of 1:1 to 2:1 -2.
  • polishing agent In the above polishing agent, a better polishing effect is achieved by controlling the balance of the respective distribution ratios.
  • Abrasives with a particle size of 20 - 150 nm reduce the surface roughness of the workpiece.
  • Sulfuric acid and ammonium persulfate are the main reactive components of the polishing.
  • Polyethylene glycol and ethylenediaminetetraacetic acid allow the workpiece to be uniformly polished.
  • Embodiments of the present invention also provide a copper member polishing treatment method, comprising the steps of: formulating a polishing agent as described above; dissolving the polishing agent in water to prepare a polishing agent solution, and polishing the polishing agent in the polishing agent solution
  • the water preparation ratio is 1: 1-2; the copper piece is immersed in the polishing agent solution, and after a predetermined daytime treatment, the copper piece is washed and dried.
  • the ratio of the polishing agent to the water in the polishing agent solution is 1 : 1, and the predetermined interval is 1-10 minutes. Further, after polishing, it is passivated, then washed with water and dried. After polishing, the temperature is controlled at 20 ° C - 25 ° C, that is, polishing at room temperature. Further, pretreatment such as degreasing and degreasing is performed before polishing.
  • Embodiments of the present invention also provide a copper member which is subjected to a polishing treatment by a copper member polishing treatment method as described above to form a copper member to form a clean and bright surface.
  • Embodiment 1 [0018] The ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 5 parts of abrasive, 2 parts of ethylenediaminetetraacetic acid, 2 parts of sulfuric acid, 2 parts of ammonium persulfate, 2 parts of polyethylene glycol and the balance water.
  • Treatment method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after shaking for 10 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.
  • the ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 10 parts of abrasive, 4 parts of ethylenediaminetetraacetic acid, 4 parts of sulfuric acid, 4 parts of ammonium persulfate, 5 parts of polyethylene glycol and the balance water.
  • Treatment method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after shaking for 5 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.
  • the ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 15 parts of abrasive, 7 parts of ethylenediaminetetraacetic acid, 7 parts of sulfuric acid, 8 parts of ammonium persulfate, 6 parts of polyethylene glycol and the balance water.
  • Processing method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after shaking for 5 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.
  • the ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 20 parts of abrasive, 10 parts of ethylenediamine Tetraacetic acid, 9 parts sulfuric acid, 9 parts ammonium persulfate, 10 parts polyethylene glycol and the balance water.
  • Processing method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after being shaken for 3 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention concerne un agent de polissage, une pièce en cuivre et un procédé de polissage associé. L'agent de polissage est utilisé pour le prétraitement de surface d'une pièce en cuivre et comprend les constituants suivants, en parties en poids pour 200 parties en poids de l'agent de polissage : de 5 à 20 parties d'agent abrasif, de 2 à 10 parties d'acide éthylènediaminetétraacétique, de 2 à 10 parties d'acide sulfurique, de 2 à 10 parties de persulfate d'ammonium, de 2 à 10 parties de polyéthylène glycol et le complément étant constitué d'eau. Lorsqu'elle est traitée avec l'agent de polissage précité, la surface d'une pièce en cuivre est propre et brillante, et le procédé de polissage est simple, sûr et respectueux de l'environnement, inodore, pratique à utiliser et de faible coût.
PCT/CN2017/091534 2017-07-03 2017-07-03 Agent de polissage, pièce en cuivre et procédé de polissage associé Ceased WO2019006600A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2017/091534 WO2019006600A1 (fr) 2017-07-03 2017-07-03 Agent de polissage, pièce en cuivre et procédé de polissage associé
CN201780092855.3A CN110809615A (zh) 2017-07-03 2017-07-03 抛光剂、铜件及其抛光处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/091534 WO2019006600A1 (fr) 2017-07-03 2017-07-03 Agent de polissage, pièce en cuivre et procédé de polissage associé

Publications (1)

Publication Number Publication Date
WO2019006600A1 true WO2019006600A1 (fr) 2019-01-10

Family

ID=64950539

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/091534 Ceased WO2019006600A1 (fr) 2017-07-03 2017-07-03 Agent de polissage, pièce en cuivre et procédé de polissage associé

Country Status (2)

Country Link
CN (1) CN110809615A (fr)
WO (1) WO2019006600A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11932713B2 (en) * 2017-12-31 2024-03-19 Rohm And Haas Electronic Materials Llc Monomers, polymers and lithographic compositions comprising same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080108539A1 (en) * 2004-03-23 2008-05-08 Johnsondiversey, Inc. Cleaning and Corrosion Inhibition System and Composition for Surfaces of Aluminum or Colored Metals and Alloys Thereof Under Alkaline Conditions
CN101671527A (zh) * 2009-09-27 2010-03-17 大连三达奥克化学股份有限公司 高去除率、低损伤的铜化学机械抛光液及制备方法
CN101974297A (zh) * 2010-11-12 2011-02-16 大连三达奥克化学股份有限公司 核/壳型复合纳米磨料铜化学机械抛光液
CN102516878A (zh) * 2011-12-12 2012-06-27 上海新安纳电子科技有限公司 一种改善相变材料抛光后表面质量的抛光液
CN105885699A (zh) * 2015-02-12 2016-08-24 气体产品与化学公司 钨化学机械抛光中的凹陷减少

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551935B1 (en) * 2000-08-31 2003-04-22 Micron Technology, Inc. Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
CN106811744A (zh) * 2015-11-30 2017-06-09 侯霞 铜板表面处理工艺

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080108539A1 (en) * 2004-03-23 2008-05-08 Johnsondiversey, Inc. Cleaning and Corrosion Inhibition System and Composition for Surfaces of Aluminum or Colored Metals and Alloys Thereof Under Alkaline Conditions
CN101671527A (zh) * 2009-09-27 2010-03-17 大连三达奥克化学股份有限公司 高去除率、低损伤的铜化学机械抛光液及制备方法
CN101974297A (zh) * 2010-11-12 2011-02-16 大连三达奥克化学股份有限公司 核/壳型复合纳米磨料铜化学机械抛光液
CN102516878A (zh) * 2011-12-12 2012-06-27 上海新安纳电子科技有限公司 一种改善相变材料抛光后表面质量的抛光液
CN105885699A (zh) * 2015-02-12 2016-08-24 气体产品与化学公司 钨化学机械抛光中的凹陷减少

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11932713B2 (en) * 2017-12-31 2024-03-19 Rohm And Haas Electronic Materials Llc Monomers, polymers and lithographic compositions comprising same

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CN110809615A (zh) 2020-02-18

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