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WO2019003510A1 - Élément d'imagerie à semi-conducteur, dispositif d'imagerie, et procédé de contrôle d'élément d'imagerie à semi-conducteur - Google Patents

Élément d'imagerie à semi-conducteur, dispositif d'imagerie, et procédé de contrôle d'élément d'imagerie à semi-conducteur Download PDF

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Publication number
WO2019003510A1
WO2019003510A1 PCT/JP2018/009856 JP2018009856W WO2019003510A1 WO 2019003510 A1 WO2019003510 A1 WO 2019003510A1 JP 2018009856 W JP2018009856 W JP 2018009856W WO 2019003510 A1 WO2019003510 A1 WO 2019003510A1
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WIPO (PCT)
Prior art keywords
digital signal
temperature
unit
signal
control unit
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Ceased
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PCT/JP2018/009856
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English (en)
Japanese (ja)
Inventor
萩原　秀平
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Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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Filing date
Publication date
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/06—Continuously compensating for, or preventing, undesired influence of physical parameters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/12—Analogue/digital converters
    • H03M1/50—Analogue/digital converters with intermediate conversion to time interval
    • H03M1/56—Input signal compared with linear ramp
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules

Definitions

  • the present technology in an apparatus for capturing image data, it is possible to achieve an excellent effect that fluctuations in power consumption due to temperature changes can be suppressed.
  • the effect described here is not necessarily limited, and may be any effect described in the present disclosure.
  • FIG. 21 is a diagram showing an example of a schematic configuration of an IoT (Internet of Things) system 9000 to which the technology according to the present disclosure can be applied.
  • IoT Internet of Things
  • the transmitting unit 260 transmits the digital signal to the receiving unit 110 via a predetermined number of transmission paths (hereinafter referred to as “channel”).
  • the transmission path may be called a lane.
  • the parallel-serial converter 261 converts parallel data (pixel data) into serial data. Also, the parallel-serial conversion unit 261 rearranges serial data according to the number of channels, and outputs the serial data to the transmitter 262. For example, it is assumed that M serial data for one line is M and the number of channels is C (C is an integer), and one of those channels is used for transmission of transfer CLK. In this case, M pieces of serial data are divided into M / (C-1) sets of C-1 pieces of serial data and output.
  • the driver 263 differentially outputs serial data.
  • the same number of drivers 263 as the number of channels C is provided, one of which outputs the transfer CLK.
  • the remaining drivers 263 output serial data.
  • the transmitter 262 and the driver 263 transmit serial data according to, for example, the Low Voltage Differential Signaling (LVDS) standard.
  • LVDS Low Voltage Differential Signaling
  • the channel is "valid” means that the driver and receiver corresponding to the channel are supplied with power and driven.
  • that the channel is "invalid” means that the power supply to the driver and receiver corresponding to the channel is shut off to shut them down. Therefore, the power consumption of the interface decreases as the number of effective channels decreases. Also, as the number of effective channels decreases, the number of data that can be transferred simultaneously decreases, so the data rate of the interface decreases.
  • the bit depth control unit 272 controls only the bit depth without controlling the number of effective channels. May be
  • FIG. 5 is a block diagram showing a configuration example of the receiving unit 110 in the first embodiment of the present technology.
  • the receiver 110 includes a plurality of receivers 111 and a serial / parallel converter 112.
  • the serial / parallel conversion unit 112 converts serial data into parallel data in synchronization with the transfer CLK.
  • the serial / parallel conversion unit 112 supplies parallel data to the image signal processing unit 120.
  • the leak current indicates a current that leaks at a place or a path which is insulated and should not flow in a circuit (integrated circuit or the like) in the imaging device 100.
  • dark current indicates a current that flows when light is not applied when a voltage is applied to the pixel array unit 220.
  • the ADC 253 starts outputting pixel data of the light-shielded pixel 221 such as the pixel data OB1. Then, at timing t2, the ADC 253 starts output of pixel data of the effective pixel 222 such as the pixel data P1. These pixel data are output in synchronization with the horizontal synchronization signal HSYNC. Since the ADC 253 is provided for each line, pixel data for one line (that is, M pixels) is output each time the period of the horizontal synchronization signal HSYNC has elapsed.
  • the difference is calculated
  • a memory and a subtracter are further provided, the counter 255 sequentially outputs P-phase data and D-phase data, the memory holds the P-phase data, and the subtractor determines the difference between P-phase data and D-phase data May be
  • the driver 263 corresponding to each channel transmits synchronization data for synchronizing serial data. Then, at timing t16, the driver 263 corresponding to the channel CH1 transmits the pixel data OB1, and the driver 263 corresponding to the channel CH2 transmits the pixel data OB2. The driver 263 corresponding to the channel CH3 transmits pixel data OB3, and the driver 263 corresponding to the channel CH4 transmits pixel data OB4.
  • the driver 263 corresponding to each of the channels CH1, CH2, CH3 and CH4 transmits pixel data OB5, OB6, OB7 and OB8.
  • the pixel data OB1 to OB8 are pixel data of the light-shielded pixel 221, and each data size (that is, bit depth) is, for example, 12 bits.
  • the pixel data of the effective pixel 222 is transmitted after the transfer of the pixel data of the light-shielded pixel 221.
  • the driver 263 corresponding to each channel transmits synchronization data.
  • FIG. 11 is a timing chart illustrating an example of the operation of the transmission unit 260 when the temperature is higher than the temperature threshold Tth according to the first embodiment of the present technology.
  • the bit depth control unit 272 supplies a low level channel number control signal, enables the channels CH1, CH2 and CH3, and disables the channel CH4. .
  • the driver 263 corresponding to each channel transmits synchronization data. Then, at timing t22, the driver 263 corresponding to each of the channels CH1, CH2 and CH3 transmits pixel data OB1, OB2 and OB3.
  • the driver 263 corresponding to each of the channels CH1, CH2 and CH3 transmits pixel data OB4, OB5 and OB6.
  • the driver 263 corresponding to each of the channels CH1, CH2 and CH3 transmits pixel data OB7, OB8 and OB9.
  • the data size (ie, bit depth) of these pixel data OB1 to OB9 is reduced to, for example, 11 bits.
  • FIG. 12 is a flowchart illustrating an example of the operation of the solid-state imaging device 200 according to the first embodiment of the present technology.
  • the solid-state imaging device 200 determines whether or not the start timing of the cycle of the vertical synchronization signal VSYNC has passed (step S901).
  • the ADC 253 in the solid-state imaging device 200 AD (Analog to Digital) converts each of the M ⁇ N analog signals (step S902).
  • the bit depth control unit 272 obtains the measured temperature from the measured data (step S903), and determines whether the measured temperature is higher than the temperature threshold Tth (step S904).
  • the bit depth control unit 272 controls the bit depth to "11" bits (step S905), and controls the number of effective channels to "4". (Step S906).
  • step S904 when the measured temperature is equal to or lower than the temperature threshold Tth (step S904: No), the bit depth control unit 272 controls the bit depth to "12" bits (step S907), and sets the number of valid channels to "5". Control is performed (step S908).
  • step S901 If the start timing of the cycle of the vertical synchronization signal VSYNC has not passed (step S901: No), or after steps S906 and S908, the solid-state imaging device 200 repeatedly executes step S901 and subsequent steps.
  • the bit depth control unit 272 generates a digital signal of a smaller number of bits as the temperature is higher. As a result, the data size of the image data can be reduced as the temperature is higher, and fluctuations in power consumption due to temperature changes can be suppressed.
  • the bit depth control unit 272 controls the slope of the ramp signal to be steep to reduce the bit depth, but if the slope is steep, the resolution of AD conversion is degraded. As a result, the image quality of the image data may be degraded. If the bit depth is reduced by truncating the lower bits of the digital signal output from the ADC 253 without changing the slope, deterioration of the image quality can be suppressed because the lower bits have many noise components due to dark current.
  • the solid-state imaging device 200 according to the second embodiment is different from the first embodiment in that lower bits are discarded.
  • FIG. 13 is a block diagram illustrating a configuration example of a circuit subsequent to the pixel array unit 220 according to the second embodiment of the present technology.
  • the control unit 270 of the second embodiment is different from the first embodiment in that a bit depth control unit 273 is provided instead of the bit depth control unit 272.
  • the transmission unit 260 of the second embodiment is different from that of the first embodiment in that the bit depth reduction unit 264 is further provided.
  • the bit depth control unit 273 generates a bit depth control signal for controlling the number of bits to be discarded and supplies the bit depth control signal to the bit depth reduction unit 264.
  • the bit depth control unit 273 truncates the larger number of bits as the temperature is higher. For example, when the measured temperature is equal to or lower than the temperature threshold Tth, the bit depth control unit 273 does not perform truncation, and cuts off the least significant bit when the measured temperature is higher than the temperature threshold Tth.
  • the bit depth reduction unit 264 cuts off the lower bits of the digital signal (parallel data) from the ADC 253 in accordance with the bit depth control signal.
  • the bit depth reduction unit 264 supplies the parallel data after reduction to the parallel-serial conversion unit 261.
  • the bit depth reduction unit 264 is an example of the reduction unit described in the claims.
  • the bit depth control unit 273 reduces the bit depth by truncating the lower bits of the digital signal, and thus the image quality is degraded compared to the case of controlling the slope. It can be suppressed.
  • the bit depth control unit 272 controls the bit depth in two steps by one temperature threshold, but in the two steps of control, the accuracy in controlling the power consumption is insufficient There is a fear. For example, if the bit depth is controlled in three or more stages by two or more temperature thresholds, power consumption can be controlled with higher accuracy.
  • the bit depth control unit 272 of the third embodiment is different from the first embodiment in that the bit depth is controlled in three or more steps.
  • FIG. 14 is a diagram illustrating an example of the operation of the bit depth control unit 272 according to the third embodiment of the present technology.
  • temperature thresholds Tth1 and Tth2 are set.
  • the temperature threshold Tth2 is higher than the temperature threshold Tth1.
  • the bit depth control unit 272 controls the bit depth to “12” bits and controls the number of effective channels to “10”.
  • the bit depth control unit 272 controls the bit depth to "11” bits and controls the number of effective channels to “9”.
  • the bit depth control unit 272 controls the bit depth to “10” bits and controls the number of effective channels to “8”.
  • bit depth control unit 272 controls the bit depth and the number of channels in three steps by two temperature thresholds, it can also control in four or more steps by three or more temperature thresholds.
  • the bit depth control unit 272 controls the bit depth in three or more stages by two or more temperature thresholds, so that the bit depth is controlled in two stages. Power consumption can be controlled with high accuracy.
  • the bit depth is controlled based only on temperature, but accurate control of power consumption may be difficult if temperature alone is used. For example, while the leakage current increases in proportion to the temperature, while the dark current increases exponentially, it is more difficult to predict the increase in power consumption as the temperature increases.
  • the dark current can be measured from the pixel data of the light-shielded pixel 221, the power consumption can be more accurately controlled by measuring the dark current and using it for controlling the bit depth together with the temperature.
  • the solid-state imaging device 200 according to the fourth embodiment is different from that according to the first embodiment in that the bit depth is controlled based on dark current and temperature.
  • the clamp circuit 271 integrates pixel data of all the light-shielded pixels 221, and supplies the result as an OB (Optical Black) integrated value to the bit depth control unit 274.
  • This OB integrated value indicates dark current.
  • the clamp circuit 271 may obtain the average value of the pixel data of the light-shielded pixel 221 instead of the OB integrated value and supply the average value to the bit depth control unit 274.
  • the bit depth control unit 274 Based on the temperature and the OB integrated value, the bit depth control unit 274 generates a digital signal with a smaller bit depth as the temperature increases and as the OB integrated value (dark current) increases.
  • FIG. 16 is a diagram illustrating an example of the operation of the bit depth control unit 274 in the fourth embodiment of the present technology.
  • a predetermined temperature threshold Tth and a predetermined dark current threshold Bth are set.
  • the bit depth control unit 274 controls the bit depth to “12” bits, and controls the number of effective channels to “10”.
  • the bit depth control unit 274 controls the bit depth to “11” bits and controls the number of effective channels to “9”.
  • the bit depth control unit 274 controls the bit depth to "10" bits and sets the number of effective channels to "8”. Control.
  • step S904 If the measured temperature is higher than the temperature threshold Tth (step S904: Yes), the bit depth control unit 274 executes bit depth reduction processing for reducing the bit depth according to the dark current (step S910).
  • step S904 When the measured temperature is equal to or lower than the temperature threshold Tth (step S904: No), the bit depth control unit 274 controls the bit depth to "12" bits (step S907), and sets the number of valid channels to "10". Control is performed (step S909).
  • FIG. 18 is a flowchart illustrating an example of bit depth reduction processing according to the fourth embodiment of the present technology.
  • the bit depth control unit 274 acquires the OB integrated value (step S911), and determines whether the OB integrated value is larger than the dark current threshold Bth (step S912).
  • step S912 When the OB integrated value is larger than the dark current threshold Bth (step S912: Yes), the bit depth control unit 274 controls the bit depth to "10" bits (step S913), and sets the number of valid channels to "8". Control is performed (step S914).
  • step S912 when the OB integrated value is equal to or less than the dark current threshold Bth (step S912: No), the bit depth control unit 274 controls the bit depth to "11" bit (step S915), and the number of valid channels is "9". (Step S916). After step S914 or S916, the bit depth control unit 274 ends the bit depth reduction process.
  • the bit depth control unit 274 controls the bit depth in three stages by one temperature threshold and one dark current threshold, but sets one or both of the temperature threshold and the dark current threshold to two or more. It is also possible to control the bit depth in stages or more.
  • the bit depth control unit 274 controls the bit depth only by the temperature because the bit depth control unit 274 controls the bit depth to be smaller as the temperature is higher and to be smaller as the dark current is larger. Power consumption can be controlled more accurately than in the case of
  • IoT Internet of things
  • the IoT is a mechanism in which an IoT device 9100 that is an "object” is connected to another IoT device 9003, the Internet, a cloud 9005, etc., and mutually controlled by exchanging information.
  • IoT can be used in various industries such as agriculture, home, automobile, manufacturing, distribution, energy and so on.
  • FIG. 19 is a diagram showing an example of a schematic configuration of an IoT system 9000 to which the technology according to the present disclosure can be applied.
  • the IoT device 9001 includes various sensors such as a temperature sensor, a humidity sensor, an illuminance sensor, an acceleration sensor, a distance sensor, an image sensor, a gas sensor, and a human sensor.
  • the IoT device 9001 may include terminals such as a smartphone, a mobile phone, a wearable terminal, and a game device.
  • the IoT device 9001 is powered by an AC power source, a DC power source, a battery, non-contact power feeding, so-called energy harvesting or the like.
  • the IoT device 9001 can communicate by wired, wireless, proximity wireless communication, or the like.
  • 3G / LTE registered trademark
  • Wi-Fi registered trademark
  • IEEE 802.15.4 Bluetooth
  • Zigbee registered trademark
  • Z-Wave Z-Wave
  • the IoT device 9001 may switch and communicate a plurality of these communication means.
  • the IoT device 9001 may form a one-to-one, star-like, tree-like, mesh-like network.
  • the IoT device 9001 may connect to the external cloud 9005 directly or through the gateway 9002.
  • the IoT device 9001 is assigned an address by IPv4, IPv6, 6LoWPAN or the like.
  • Data collected from the IoT device 9001 is transmitted to other IoT devices 9003, servers 9004, cloud 9005 and the like.
  • the timing and frequency of transmitting data from the IoT device 9001 may be suitably adjusted, and the data may be compressed and transmitted.
  • Such data may be used as it is, or the data may be analyzed by the computer 9008 by various means such as statistical analysis, machine learning, data mining, cluster analysis, discriminant analysis, combination analysis, time series analysis and the like.
  • Such data can be used to provide various services such as control, warning, monitoring, visualization, automation, and optimization.
  • IoT devices 9001 at home include washing machines, dryers, dryers, microwave ovens, dishwashers, refrigerators, ovens, rice cookers, cookware, gas appliances, fire alarms, thermostats, air conditioners, televisions, recorders, audio, Lighting equipment, water heaters, water heaters, vacuum cleaners, fans, air purifiers, security cameras, locks, doors and shutters, sprinklers, toilets, thermometers, weight scales, blood pressure monitors, etc. are included.
  • the IoT device 9001 may include a solar cell, a fuel cell, a storage battery, a gas meter, a power meter, and a distribution board.
  • the communication method of the IoT device 9001 at home is preferably a low power consumption type communication method. Further, the IoT device 9001 may communicate by Wi-Fi indoors and 3G / LTE (registered trademark) outdoors.
  • An external server 9006 for IoT device control may be installed on the cloud 9005 to control the IoT device 9001.
  • the IoT device 9001 transmits data such as the status of home devices, temperature, humidity, power consumption, and the presence or absence of people and animals inside and outside the house. Data transmitted from the home device is accumulated in the external server 9006 through the cloud 9005. Based on such data, new services are provided.
  • Such an IoT device 9001 can be controlled by voice by using voice recognition technology.
  • various home devices can be visualized.
  • various sensors can determine the presence or absence of a resident and send data to an air conditioner, lighting, etc. to turn on / off those power supplies.
  • an advertisement can be displayed on the display provided to various home devices through the Internet.
  • the technology according to the present disclosure can be suitably applied to the IoT device 9001 among the configurations described above. Specifically, by providing the solid-state imaging device 200 illustrated in FIG. 2 in the IoT device 9001, fluctuations in power consumption of the IoT device 9001 due to temperature changes can be suppressed.
  • the processing procedure described in the above embodiment may be regarded as a method having a series of these procedures, and a program for causing a computer to execute the series of procedures or a recording medium storing the program. You may catch it.
  • a recording medium for example, a CD (Compact Disc), an MD (Mini Disc), a DVD (Digital Versatile Disc), a memory card, a Blu-ray disc (Blu-ray (registered trademark) Disc) or the like can be used.
  • the present technology can also be configured as follows. (1) a pixel array unit in which a plurality of pixels each of which outputs an analog signal are arranged; A digital signal generation unit that generates and outputs a digital signal from the analog signal for each of the analog signals; A control unit configured to control the digital signal generation unit to generate the digital signal of a smaller number of bits as the temperature is higher. (2) The solid-state imaging device according to (1), wherein the pixel array unit further includes a temperature measurement unit that measures the temperature.
  • the digital signal generation unit A ramp signal generator for generating a ramp signal having a slope; A comparator that compares the ramp signal and the analog signal and outputs a comparison result; And an analog-to-digital converter that counts a count value and outputs it as the digital signal over a period until the comparison result changes from a predetermined initial value.
  • the solid-state imaging device according to (1) or (2), wherein the control unit controls the ramp signal generation unit to generate the ramp signal having the steeper slope as the temperature is higher.
  • the digital signal generation unit An analog-to-digital converter that converts the analog signal to the digital signal; And a reduction unit that reduces the number of bits of the digital signal and outputs the reduced signal.
  • the solid-state imaging device according to (1) or (2), wherein the control unit controls the reduction unit to reduce the number of bits as the temperature increases.
  • the digital signal generation unit outputs the digital signal through a predetermined number of transmission paths.
  • the solid-state imaging device according to any one of (1) to (4), wherein the control unit compares the temperature with a predetermined threshold and controls the digital signal generation unit based on the comparison result. .
  • Reference Signs List 100 image pickup apparatus 110 reception unit 111 receiver 112 serial-parallel conversion unit 120 image signal processing unit 130 recording unit 200 solid-state imaging device 210 scanning circuit 220 pixel array unit 221 light-shielded pixel 222 effective pixel 223 temperature measurement unit 230 TG 240 column signal processing unit 251 DAC 252 column ADC 253 ADC 254 comparator 255 counter 260 transmission unit 261 parallel-serial conversion unit 262 transmitter 263 driver 264 bit depth reduction unit 270 control unit 271 clamp circuit 272, 273, 274 bit depth control unit 280 PLL 9001 IoT Device

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Theoretical Computer Science (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Analogue/Digital Conversion (AREA)

Abstract

La présente invention supprime la fluctuation de la consommation d'énergie due à un changement de température dans un dispositif qui capture des données d'image. Un élément d'imagerie à semi-conducteur comprend une unité de réseau de pixels, une unité de génération de signal numérique, et une unité de contrôle. Une pluralité de pixels émettant chacun un signal analogique est agencée en réseau dans l'unité de réseau de pixels. L'unité de génération de signal numérique génère, pour chaque signal analogique, un signal numérique à partir du signal analogique, et délivre le signal numérique généré. L'unité de contrôle gère l'unité de génération de signal numérique de sorte qu'un signal numérique soit généré avec moins de bits lorsque des températures sont élevées.
PCT/JP2018/009856 2017-06-29 2018-03-14 Élément d'imagerie à semi-conducteur, dispositif d'imagerie, et procédé de contrôle d'élément d'imagerie à semi-conducteur Ceased WO2019003510A1 (fr)

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JP2017126850A JP2019012870A (ja) 2017-06-29 2017-06-29 固体撮像素子、撮像素子、および、固体撮像素子の制御方法
JP2017-126850 2017-06-29

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022137790A1 (fr) * 2020-12-23 2022-06-30 ソニーセミコンダクタソリューションズ株式会社 Élément de capture d'image à semi-conducteurs, dispositif de détection et procédé permettant de commander un élément de capture d'image à semi-conducteurs
CN117528066A (zh) * 2024-01-05 2024-02-06 浙江双元科技股份有限公司 一种线阵相机测试系统和方法

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JP2012257059A (ja) * 2011-06-08 2012-12-27 Canon Inc 撮像装置および撮像システム
WO2013128764A1 (fr) * 2012-03-01 2013-09-06 オリンパスメディカルシステムズ株式会社 Dispositif médical
JP2015167283A (ja) * 2014-03-03 2015-09-24 キヤノン株式会社 撮像装置、固体撮像素子及び固体撮像素子の駆動方法
JP2017073687A (ja) * 2015-10-08 2017-04-13 キヤノン株式会社 撮像装置及び撮像方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012257059A (ja) * 2011-06-08 2012-12-27 Canon Inc 撮像装置および撮像システム
WO2013128764A1 (fr) * 2012-03-01 2013-09-06 オリンパスメディカルシステムズ株式会社 Dispositif médical
JP2015167283A (ja) * 2014-03-03 2015-09-24 キヤノン株式会社 撮像装置、固体撮像素子及び固体撮像素子の駆動方法
JP2017073687A (ja) * 2015-10-08 2017-04-13 キヤノン株式会社 撮像装置及び撮像方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022137790A1 (fr) * 2020-12-23 2022-06-30 ソニーセミコンダクタソリューションズ株式会社 Élément de capture d'image à semi-conducteurs, dispositif de détection et procédé permettant de commander un élément de capture d'image à semi-conducteurs
CN117528066A (zh) * 2024-01-05 2024-02-06 浙江双元科技股份有限公司 一种线阵相机测试系统和方法
CN117528066B (zh) * 2024-01-05 2024-03-22 浙江双元科技股份有限公司 一种线阵相机测试系统和方法

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