WO2019091127A1 - Dual-contact memory connector - Google Patents

Abstract

Disclosed in embodiments of the present application is a dual-contact memory connector, for use in enhancing the connectivity between a DIMM spring and the golden finger of a memory chip, lowering the probability of poor contact between a DIMM slot and the memory chip, improving production efficiency, and reducing device production costs. The connector comprises an insulated base (301), clips (302), a contact spring assembly (303), and a fixing assembly (304). The insulated base (301) is provided with a slot (305) which is used for insertion of a memory chip. The clips (302) are located at the two ends of the insulated base (301). The contact spring assembly (303) comprises a plurality of pairs of contact spring structures (306), each contact spring structure (306) is provided with two contact points, and the contact spring structures (306) are connected to the golden finger of the memory chip by means of the two contact points. The fixing assembly (304) is located at the bottom of the insulated base (301).

Description

Double contact memory connector

This application claims the priority of a Chinese patent application submitted to the China Patent Office on November 10, 2017, with the application number of 201711106195.8, the invention name is "a memory connector", and the request to the Chinese Patent Office on December 12, 2017. Priority is claimed on Japanese Patent Application No. No. No. No. No. No. No. No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No

Technical field

The present application relates to the field of communications, and in particular, to a dual-contact memory connector.

Background technique

With the wide application of computers, people's performance requirements for computers are getting higher and higher, the memory requirements in computers are getting higher and higher, and the requirements for memory connectors for installing memory modules are getting higher and higher. Most memory connectors use plug-in wave soldering technology to connect to the motherboard of the computer. The memory connector is generally in the form of dual inline memory modules (DIMMs), and the connection between the memory module 101 and the DIMM slot. As shown in FIG. 1, the gold finger 102 on the memory stick 101 is electrically connected to the contact spring 103 of the DIMM slot.

At present, the memory module is cleaned by the automatic equipment to clean the dust and dirt of the memory before assembly, and then the dust-free control of the various processes in the production environment, and finally assembled to the SMT reflow soldering or wave plug-in soldering of the upper part, and through the double column In the DIMM slot on the printed circuit board (PCB) empty board of the dual inline-pin (DIP) plug-in, two installations are used to solve the contact failure.

When the number of DIMM slots is large, when the existing two-installation method is used for production assembly, the installer may easily miss some DIMM slots, and there is dust 104 or dirt 104 between the DIMM slots and the memory module, as shown in FIG. The display still causes poor contact between the memory module and the DIMM slot. The DIMM slot is 0.62% due to poor contact ratio, which is the highest ratio of production failure. The production cost is high.

Summary of the invention

The embodiment of the present application provides a dual-contact memory connector for enhancing connectivity between a DIMM reed and a memory stick, reducing the probability of contact failure between the DIMM slot and the memory module, and improving production efficiency. Reduce equipment production costs.

A first aspect of the present application provides a dual-contact memory connector including: an insulating base 301, a buckle 302, a contact spring assembly 303, and a fixing assembly 304; the insulating base 301 has a slot 305, The slot 305 is for inserting the memory strip; the buckle 302 is located at two ends of the insulating base 301, the buckle 302 is located at an upper portion of the insulating base 301, and the opening of the slot 305 is located at the insulation The upper portion of the base 301, the buckle 302 and the slot 305 cooperate to fix the memory strip on the insulating base 301; the contact spring assembly 303 includes a plurality of pairs of contact spring structures 306, Each of the contact spring structures 306 has two contact points, the contact spring assembly 303 is located within the slot 305, and the contact spring structure 306 passes through the two contact points with the memory module The gold finger connection; the fixing component 304 is located at the bottom of the insulating base 301, and the fixing component 304 is used for fixing the insulating base 301 and the printed circuit board.

In a possible design, in a first implementation of the first aspect of the embodiments of the present application, the contact reed structure 306 includes a first reed 3061 and a second reed 3062, the second reed 3062 is located below the first reed 3061, and the distance from the second reed 3062 to the bottom of the slot 305 is smaller than the distance from the first reed 3061 to the bottom of the slot 305; The end of the reed 3061 is in anti-contact with the memory strip, the end of the first reed 3061 is a first contact point; the end of the second reed 3062 is in anti-contact with the memory strip, the The end of the two-reed 3062 is a second contact point.

In a possible design, in a second implementation manner of the first aspect of the embodiment of the present application, the method includes: a soldering pin 307 for electrically connecting to the printed circuit board.

In a possible design, in a third implementation manner of the first aspect of the embodiment, the contact area of the first contact point and the memory module is a circular convex head, and the second contact point The contact area with the memory strip is a circular convex head.

In a possible design, in a fourth implementation manner of the first aspect of the embodiments of the present application, the first reed 3061 is a three-folded contact reed, the memory strip and the The holding force between the first reeds 3061 reaches a first preset value; the second reed 3062 is a four-folded contact reed, between the memory strip and the second reed 3062 The holding force reaches the first preset value.

In a possible design, in a fifth implementation manner of the first aspect of the embodiments of the present application, the width of the contact reed structure 306 is adapted to the length of the gold finger of the memory module.

In a possible design, in a sixth implementation manner of the first aspect of the embodiment of the present application, the thickness of the contact reed structure 306 is adapted to the width of the gold finger of the memory module.

In a possible design, in a seventh implementation manner of the first aspect of the embodiment of the present application, the slot 305 is disposed at an upper portion of the insulating base 301, and the insulating base 301 has a concave structure.

In a possible design, in an eighth implementation manner of the first aspect of the embodiments of the present application, each pair of the contact spring structures 306 are disposed on two sides of the slot 305 and parallel to the A cross section of the insulating base 301.

In a possible design, in a ninth implementation manner of the first aspect of the embodiments of the present application, the number of the first reeds 3061 is the same as the number of gold fingers of the memory module, and the second spring The number of slices 3062 is the same as the number of gold fingers of the memory stick.

In a possible design, in the tenth implementation manner of the first aspect of the embodiment of the present application, the number of the soldering pins 307 is the same as the number of gold fingers of the memory module.

In a possible design, in an eleventh implementation manner of the first aspect of the embodiment of the present application, the soldering pin 307 is a metal dome.

As can be seen from the above technical solutions, the embodiments of the present application have the following advantages:

An insulating base 301, a buckle 302, a contact spring assembly 303 and a fixing assembly 304; the insulating base 301 has a slot 305 for inserting a memory module; the buckle 302 is located at the insulating base The buckle 302 is located at an upper portion of the insulating base 301, the opening of the slot 305 is located at an upper portion of the insulating base 301, and the buckle 302 and the slot 305 cooperate with each other. The memory module is fixed on the insulating base 301; the contact spring assembly 303 includes a plurality of pairs of contact spring structures 306, each of the contact spring structures 306 having two contact points, the contact springs The component 303 is located in the slot 305, and the contact spring structure 306 is connected to the gold finger of the memory module through the two contact points; the fixing component 304 is located at the bottom of the insulating base 301, The fixing assembly 304 is for fixing the insulating base 301 and the printed circuit board. In the embodiment of the present application, the two contact points of the contact reed structure are connected with the gold finger of the memory bar to achieve double point contact, when there is dander or dirt between one of the contact points and the gold finger of the memory stick, There is another contact point to ensure electrical connection between the contact reed structure and the memory module, reducing the probability of poor contact, increasing production efficiency, and reducing equipment production costs.

DRAWINGS

1 is a schematic structural view of a memory connector in the prior art;

2 is a schematic diagram of a scene in which the contact between the memory connector and the memory is poor in the prior art;

3 is a schematic diagram of an embodiment of a dual-contact memory connector in an embodiment of the present application;

4 is a schematic cross-sectional view of a dual-contact memory connector in an embodiment of the present application;

5 is a cross-sectional view showing the double-contact memory connector inserted into the memory module in the embodiment of the present application;

6 is a schematic structural view of a pair of contact springs of a dual-contact memory connector according to an embodiment of the present application;

7 is a schematic perspective structural view of a two-contact memory connector in an embodiment of the present application;

FIG. 8 is a partially enlarged schematic view showing the memory module in contact with the contact spring structure in the embodiment of the present application; FIG.

FIG. 9 is a schematic diagram of a scene in which dust is present between the memory module and the contact reed structure in the embodiment of the present application.

Detailed ways

The embodiment of the present application provides a dual-contact memory connector for enhancing connectivity between a DIMM reed and a memory stick, reducing the probability of contact failure between the DIMM slot and the memory module, and improving production efficiency. Reduce equipment production costs.

The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

The terms "first", "second", "third", "fourth", etc. (if present) in the specification and claims of the present application and the above figures are used to distinguish similar objects without having to use To describe a specific order or order. It is to be understood that the data so used may be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than what is illustrated or described herein. In addition, the term "comprises" or "comprises" or any variations thereof, is intended to cover a non-exclusive inclusion, for example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those that are clearly listed Steps or units, but may include other steps or units not explicitly listed or inherent to such processes, methods, products or devices.

Embodiments of the present application provide a dual-contact memory connector that is mounted on a printed circuit board by surface mount technology (SMT) reflow soldering or plug-in wave soldering. The dual-contact memory connector is in the form of dual inline memory modules (DIMMs).

Referring to FIG. 3, an embodiment of the dual-contact memory connector in the embodiment of the present application includes:

An insulating base 301, a buckle 302, a contact spring assembly 303 and a fixing assembly 304; the insulating base 301 has a slot 305 for inserting a memory module;

The buckle 302 is located at two ends of the insulating base 301, the buckle 302 is located at an upper portion of the insulating base 301, and the opening of the slot 305 is located at an upper portion of the insulating base 301, and the buckle 302 Cooperating with the slot 305 for fixing the memory module on the insulating base 301;

The contact reed assembly 303 includes a plurality of pairs of contact reed structures 306, each of which has two contact points, the contact reed assembly 303 being located within the slot 305, the contact spring The sheet structure 306 is connected to the gold finger of the memory module through the two contact points;

The fixing component 304 is located at the bottom of the insulating base 301, and the fixing component 304 is used for fixing the insulating base 301 and the printed circuit board.

It should be noted that the number of the fixing components 304 can be set according to actual conditions. For example, in FIG. 3, a fixing component is respectively disposed at two ends and an intermediate portion of the insulating base 301, and a total of three fixing components 304 are used for fixing the memory. The connector and the printed circuit board can also be provided with other numbers of fixing components 304 as needed, which are not limited herein.

It can be understood that the fixing component 304 can include various structural forms, such as a snap-on type, a welded type, and the like, as long as the function of the fixing component 304 can be implemented, which is not limited herein.

It should be noted that the contact reed assembly 303 is composed of a plurality of pairs of contact reed structures 306, each pair of contact reed structures 306 are disposed on both sides of the slot 305, and the two sides of the slot 305 have two contact points. The first contact point and the second contact point; in order to make the memory bar uniform, for a pair of contact spring structures 306, the two first contact points on both sides of the slot 305 are at the same level, and the slots 305 are two The two second contact points on the side are at the same level, and the level of the second contact point is lower than the level of the first contact point.

In the embodiment of the present application, the memory module is inserted into the insulating base 301 of the dual-contact memory connector through the slot 305, and is fixed in the slot 305 through the buckle 302 located at both ends of the insulating base 301. A gold finger structure is disposed on both sides of a portion of the memory module insertion slot 305, and a contact spring assembly 303 is disposed in the slot 305 of the dual contact memory connector, and the number of contact reed structures 306 included in the contact reed assembly 303 is provided. The number of gold fingers is the same; each contact spring structure 306 has two contact points, each gold finger is abutted with two contact points of the contact spring structure 306; the fixing component 304 located at the bottom of the insulating base 301 is fixedly inserted. An insulating base 301 having a memory module and a printed circuit board. In the embodiment of the present application, the two contact points of the contact reed structure are connected with the gold finger of the memory bar to realize double-point contact, and when there is dust or dirt between one of the contact points and the gold finger of the memory stick, Another contact point ensures electrical connection between the contact reed structure and the memory module, reducing the probability of poor contact, increasing production efficiency, and reducing equipment production costs.

Referring to FIG. 3 and FIG. 4, another embodiment of the dual-contact memory connector in the embodiment of the present application includes:

An insulating base 301, a buckle 302, a contact spring assembly 303 and a fixing assembly 304; the insulating base 301 has a slot 305 for inserting a memory module;

The buckle 302 is located at two ends of the insulating base 301, the buckle 302 is located at an upper portion of the insulating base 301, and the opening of the slot 305 is located at an upper portion of the insulating base 301, and the buckle 302 Cooperating with the slot 305 for fixing the memory module on the insulating base 301;

The contact reed assembly 303 includes a plurality of pairs of contact reed structures 306, each of which has two contact points, the contact reed assembly 303 being located within the slot 305, the contact spring The sheet structure 306 is connected to the gold finger of the memory module through the two contact points;

The fixing component 304 is located at the bottom of the insulating base 301, and the fixing component 304 is used for fixing the insulating base 301 and the printed circuit board.

In a possible embodiment, the contact reed structure 306 includes a first reed 3061 and a second reed 3062, and the second reed 3062 is located below the first reed 3061. The distance from the second reed 3062 to the bottom of the slot 305 is smaller than the distance from the first reed 3061 to the bottom of the slot 305;

The end of the first reed 3061 is in anti-contact with the memory strip, and the end of the first reed 3061 is a first contact point;

The end of the second reed 3062 is in abutting contact with the memory strip, and the end of the second reed 3062 is a second contact point.

It should be noted that the shapes of the first contact point and the second contact point may be set according to actual conditions, and the contact area is increased as much as possible without affecting the insertion and removal of the memory module and the dual-contact memory connector. Reduce the probability of contact failure. For example, the first contact point and the second contact point may be configured as a circular convex head structure. The diameter of the circular convex head structure is 0.5 mm, and may be set to other values that meet the requirements, which is not limited herein.

In a possible embodiment, the dual-contact memory connector further includes:

Solder pins 307 for electrically connecting to the printed circuit board.

It should be noted that, as shown in FIG. 4, the soldering pin 307 is disposed at a lower portion of the insulating base, and the soldering pin 307 can be provided with a plurality of sets of soldering pins 307 according to actual conditions. For example, each of the contact reed structures 306 includes a first reed 3061 and a second reed 3062. When the first reed 3061 and the second reed 3062 are connected to different solder pins 307, respectively, four Solder pins 307, each contact reed structure 306 corresponds to two solder pins 307.

Specifically, as shown in FIG. 5, when the memory module 101 is inserted, the contact reed assembly 303 may include two sets of contact reed structures 306, and each set of contact reed structures 306 is correspondingly provided with two sets of soldering pins 307, each of which The set of solder pins 307 includes the same number of solder pins 307 as each set of contact reed structures 306. For each contact reed structure 306, the first reed 3061 is coupled to the first set of solder pins. The second reed 3062 is coupled to the second set of solder pins.

It can be understood that, as shown in FIG. 6, for each contact reed structure 306, the first reed 3061 and the second reed 3062 can be simultaneously connected to the same soldering pin 307, that is, the contact reed assembly 303 can include two The set of contact reed structures 306, each set of contact reed structures 306 is correspondingly provided with a set of soldering pins 307, and other settings may be made according to actual conditions, which are not limited herein.

In a possible embodiment, when inserting a memory stick, as shown in FIG. 5, FIG. 5 is a schematic cross-sectional view of the dual-contact memory connector, and the memory strip is in contact with the contact point of the contact spring structure. specific:

The contact reed structure 306 includes a first reed 3061 and a second reed 3062, the second reed 3062 being located below the first reed 3061, the second reed 3062 to the slot The distance from the bottom of the 305 is smaller than the distance from the first reed 3061 to the bottom of the slot 305;

The end of the first reed 3061 is in anti-contact with the memory strip, and the end of the first reed 3061 is a first contact point;

The end of the second reed 3062 is in abutting contact with the memory strip, and the end of the second reed 3062 is a second contact point.

In a possible embodiment, as shown in FIG. 6, the first reed 3061 is a three-folded contact reed, and the holding force between the memory strip and the first reed 3061 Reaching the first preset value;

The second reed 3062 is a contact spring that has been bent four times, and the holding force between the memory strip and the second reed 3062 reaches the first preset value.

It should be noted that the memory module has different specifications for memory modules produced by different manufacturers. For example, there are specifications such as DDR, DDR2, and DDR3. The specifications of the memory connector are compatible with the inserted memory module, and different types of memory. The corresponding memory connector has different specifications. For example, when it is a DDR DIMM, the DIMM structure has 184Pin, that is, the gold finger of the memory stick has 92Pin on each side, and the number of contact reed structures in each group is also 92. When it is DDR2DIMM or DDR3DIMM, the DIMM structure has 240pin, the gold finger of the memory stick has 120Pin on each side, and the number of contact reed structures in each group is also 120.

In a possible embodiment, the number of the first reeds 3061 is the same as the number of gold fingers of the memory stick, the number of the second reeds 3062 and the number of gold fingers of the memory stick. the same. For example, as shown in FIG. 7, each of the contact reed structures 306 includes two reeds and corresponds to a solder pin 307.

In a possible embodiment, the number of the solder pins 307 is the same as the number of gold fingers of the memory module.

In a possible embodiment, the soldering pin 307 is a metal dome.

It should be noted that the soldering pin 307 may also be in other shapes, which is not limited herein.

In a possible embodiment, as shown in FIG. 7, the slot 305 is disposed at an upper portion of the insulating base 301 such that the insulating base 301 has a concave structure.

In a possible embodiment, as shown in FIG. 7, each pair of the contact spring structures 306 are disposed on both sides of the slot 305 and parallel to the cross section of the insulating base 301.

In a possible embodiment, as shown in FIG. 7 and FIG. 8, FIG. 8 is a partially enlarged schematic view of the memory strip 101 in contact with the contact reed structure 306. The width of the contact reed structure 306 is The length of the gold finger of the memory stick is adapted.

As shown in FIG. 8, the width of the contact spring structure 306 is adapted to the length of the gold finger 102 of the memory module 101.

It should be noted that, in order to ensure that the contact area between the contact reed structure 306 and the gold finger meets the requirements, the width of the first reed 3061 and the second reed 3062 in the contact reed structure 306 may be set to 0.6 mm. Other values can be set according to the actual situation. This is not limited here.

As shown in FIG. 8, the thickness of the contact spring structure 306 is adapted to the width of the gold finger 102 of the memory module 101.

It should be noted that, in order to ensure that each contact spring structure 306 arranged in a row does not contact each other and avoid short circuit, the thickness of the contact spring structure 306 can be set to 0.3 mm, that is, the first reed 3061 and the second spring. The thickness of the sheet 3062 is set to 0.6 mm, and other values can be set according to actual conditions. This is not limited here.

In a possible embodiment, as shown in FIG. 6, the length of the first reed 3061 can be set to 110 mm, and other values can be set according to actual conditions. This is not limited here.

In a possible embodiment, as shown in FIG. 6, the length of the second reed 3062 can be set to 65 mm, and other values can be set according to actual conditions. This is not limited here.

As shown in FIG. 5 and FIG. 6, when the memory module 101 is inserted into the memory connector, the memory strips 101 are clamped by the four contact points of each pair of contact spring structures 306, and the gold fingers 102 on each side of the memory module 101. The holding force between the two contact points of a contact reed structure 306 can be set to 100N, and other values can be set according to actual conditions. This is not limited here.

As shown in FIG. 9, when there is dust between the first reed 3061 contacting the reed structure 306 and the gold finger 102 of the memory stick 101, the contact between the first reed 3061 and the gold finger 102 is poor, and the contact reed is The structure 306 can realize the electrical connection with the gold finger 102 of the memory module 101 through the second reed 3062, thereby reducing the probability of poor memory contact; due to the simple structure, the requirements on the production environment are low, and the equipment in the production process is reduced. Cost increases production efficiency.

The above embodiments are only used to explain the technical solutions of the present application, and are not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still The technical solutions described in the embodiments are modified, or the equivalents of the technical features are replaced by the equivalents. The modifications and substitutions of the embodiments do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims (12)

A dual-contact memory connector, comprising: Insulating base (301), buckle (302), contact spring assembly (303) and fixing assembly (304); The insulating base (301) has a slot (305) for inserting a memory module; The buckle (302) is located at two ends of the insulating base (301), the buckle (302) is located at an upper portion of the insulating base (301), and an opening of the slot (305) is located at the insulation An upper portion of the base (301), the buckle (302) and the slot (305) cooperate to fix the memory module on the insulating base (301); The contact spring assembly (303) includes a plurality of pairs of contact spring structures (306), each of the contact spring structures (306) having two contact points, the contact spring assembly (303) being located at the insertion In the slot (305), the contact spring structure (306) is connected to the gold finger of the memory module through the two contact points; The fixing component (304) is located at the bottom of the insulating base (301), and the fixing component (304) is used for fixing the insulating base (301) and the printed circuit board. The dual contact memory connector of claim 1 wherein: The contact reed structure (306) includes a first reed (3061) and a second reed (3062), the second reed (3062) being located below the first reed (3061), a distance from the second reed (3062) to the bottom of the slot (305) is less than a distance from the first reed (3061) to the bottom of the slot (305); The end of the first reed (3061) is in anti-contact with the memory strip, and the end of the first reed (3061) is a first contact point; The end of the second reed (3062) is in abutting contact with the memory strip, and the end of the second reed (3062) is a second contact point. The dual-contact memory connector of claim 1 comprising: A solder pin (307) for electrically connecting to the printed circuit board is soldered. The dual contact memory connector of claim 2 wherein: The contact area of the first contact point and the memory strip is a circular convex head, and the contact area of the second contact point with the memory strip is a circular convex head. The dual-contact memory connector of claim 2, comprising: The first reed (3061) is a three-folded contact reed, and the holding force between the memory strip and the first reed (3061) reaches a first preset value; The second reed (3062) is a contact spring that has been bent four times, and the holding force between the memory strip and the second reed (3062) reaches the first preset value. A two-contact memory connector according to any one of claims 1 to 5, characterized in that The width of the contact spring structure (306) is adapted to the length of the gold finger of the memory module. The dual-contact memory connector according to any one of claims 1 to 5, comprising: The thickness of the contact spring structure (306) is adapted to the width of the gold finger of the memory module. A two-contact memory connector according to any one of claims 1 to 5, characterized in that The slot (305) is disposed at an upper portion of the insulating base (301), and the insulating base (301) has a concave structure. A two-contact memory connector according to any one of claims 1 to 5, characterized in that Each pair of the contact spring structures (306) are disposed on either side of the slot (305) and parallel to the cross section of the insulating base (301). The dual-contact memory connector according to claim 2, wherein the number of the first reeds (3061) is the same as the number of gold fingers of the memory module, and the second reed (3062) The number is the same as the number of gold fingers of the memory stick. The dual contact memory connector of claim 3 wherein the number of solder pins (307) is the same as the number of gold fingers of the memory module. The dual contact memory connector of claim 11 wherein said solder pins (307) are metal domes.

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