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WO2019082618A1 - Capteur de température et son procédé de fabrication - Google Patents

Capteur de température et son procédé de fabrication

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Publication number
WO2019082618A1
WO2019082618A1 PCT/JP2018/037152 JP2018037152W WO2019082618A1 WO 2019082618 A1 WO2019082618 A1 WO 2019082618A1 JP 2018037152 W JP2018037152 W JP 2018037152W WO 2019082618 A1 WO2019082618 A1 WO 2019082618A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermistor element
sensor
tip
temperature sensor
cable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/037152
Other languages
English (en)
Japanese (ja)
Inventor
大輔 坂本
圭祐 松浦
健治 串田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tateyama Kagaku Sensor Technology Co Ltd
Original Assignee
Tateyama Kagaku Sensor Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tateyama Kagaku Sensor Technology Co Ltd filed Critical Tateyama Kagaku Sensor Technology Co Ltd
Priority to CN201880068847.XA priority Critical patent/CN111247407A/zh
Publication of WO2019082618A1 publication Critical patent/WO2019082618A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient

Definitions

  • the present invention relates to a temperature sensor in which a thermistor element is resin-molded and a method of manufacturing the same.
  • a temperature sensor inserts the sensor part which connected the thermistor element and the connection terminal (copper wire, dumet wire etc.) with a conducting wire into a metal case, and seals the opening of the case with a resin mold part formed of mold resin
  • the structure is known (see, for example, Patent Document 1 below). Since such a temperature sensor causes a break or a short circuit of the sensor unit due to the corrosion of the metal alloy due to the intrusion of water, it is extremely important to ensure the airtightness in the sensor unit.
  • a resin insulating cap is inserted into the opening of the metal case, the sensor unit is inserted into the opening of the insulating cap, and in this state, the opening of the case and the insulating cap is molded with resin and sealed.
  • a configuration is proposed. In this example, by adopting the same resin for the insulating cap and the resin mold portion, this interface is welded at the time of mold molding, thereby blocking the water permeation path.
  • Such temperature sensors generally use a thermistor element in many cases, but some thermistor surfaces are covered with a very fragile protective film.
  • the present invention has been made in view of the above circumstances, and relates to a temperature sensor in which a thermistor element is resin-molded and a method of manufacturing the same, which improve the airtightness to the thermistor element and improve the stability of the performance at the time of manufacturing and the yield. It aims at provision of a sensor and its manufacturing method.
  • the temperature sensor according to the present invention which has been made to solve the above problems, comprises a sensor unit comprising a thermistor element and a connection terminal, a cable unit connected to the connection terminal, and a coating covering the entire sensor unit and the tip of the cable unit.
  • the cover is a sensor case having an inner space tapered toward the center of the tip where the thermistor element fits, an elastic resin coating layer covering the entire surface of the thermistor element, and the inner surface of the sensor case And a filling resin layer filled between the elastic resin coating layer.
  • the temperature sensor may be provided with a primer layer covering the tip of the cable portion.
  • the elastic resin coating layer may be provided continuously on the entire surface of the thermistor element and the region from there to the tip of the cable portion.
  • the primer is generally used as an adhesion promoter or a pretreatment, and has an effect of improving the adhesion between members.
  • the method for manufacturing a temperature sensor according to the present invention made to solve the above problems comprises a sensor unit comprising a thermistor element and a connection terminal, a cable unit connected to the connection terminal, the entire sensor unit and the tip of the cable unit.
  • Method of manufacturing a temperature sensor having a covering portion covering the upper surface of the sensor portion, the step of connecting the lead wire of the cable portion to the connection terminal of the sensor portion, and coating for depositing an elastic resin coating layer on the entire surface of the thermistor element of the sensor portion.
  • the loading process of inserting the thermistor element which has passed through the process, and filling the filling resin layer between the inner surface of the sensor case and the elastic resin coating layer
  • a step Hama a solidification step of solidifying the filled resin layer.
  • the shape of the inner space of the sensor case is a shape provided with an inner space which is tapered toward the center of the tip where the thermistor element fits. Since the positioning of the sensor case in the center of the tip portion is automatically performed when contacting the tip of the inner surface of the case, the position of the thermistor element can be determined more simply and accurately. In addition, since the inner hollow portion is tapered, the amount of the filling resin present in the vicinity of the thermistor element is reduced, and the pressure accompanying the expansion of the filling resin is directed to the opening of the sensor case. Stress applied to the element is relieved.
  • the elastic resin coating layer covering the entire surface of the thermistor element, it is possible to avoid the problem that the protective film provided on the surface of the thermistor element is damaged by the pressure generated when the filling resin solidifies due to its buffer action.
  • the elastic resin coating layer is further provided continuously in the region up to the tip of the cable portion, a short circuit due to deformation of the connection terminal when the sensor portion is loaded to the coating portion is prevented. You can also do it.
  • the thickness of the filling resin present in the vicinity of the thermistor element is in agreement with the thinness.
  • the thermal responsiveness of the thermistor element loaded in the inner space can be enhanced.
  • the adhesion between the coating of the cable and the filling resin is enhanced by passing through the base forming step of depositing the primer layer on the tip of the cable portion, and the intrusion of air, moisture or oil along the surface of the cable is avoided. This enables good temperature detection over a long period of time.
  • the temperature sensor according to the present invention comprises a sensor unit A comprising a thermistor element 1 and a connection terminal 2, a cable unit B comprising a lead wire 3 connected to the connection terminal 2 and a sheath 4 for insulating and protecting each copper wire, and a sensor unit It is a temperature sensor provided with the covering part C which covers the tip part of the whole of A and the cable part B.
  • the sensor unit A includes a glass-sealed thermistor element 1 whose surface is covered with a protective film 1a made of glass, and a pair of connection terminals 2 and 2 for energizing between the thermistor element 1 and a temperature control circuit.
  • the cable portion B includes a pair of conducting wires 3 and a sheath 4 made of fluorine rubber or the like covering the side surface thereof, and the pair of conducting wires 3 and 3 are respectively welded to the pair of connection terminals 2 and 2.
  • the covering portion C has a sensor case 5 provided with an inner space portion 5a which is tapered toward the center of the tip end portion in which the thermistor element 1 is accommodated, an elastic resin coating layer 6 covering the entire surface of the thermistor element 1 and an inner surface of the sensor case 5 A filling resin layer 7 filled between the elastic resin coating layers 6 is provided.
  • the sensor case 5 is a protective case employing a synthetic resin or the like having a relatively high thermal conductivity and an insulating property, and in this example, PPS (polyphenylene sulfide) is employed.
  • the sensor case 5 of this example has a rectangular parallelepiped outer shape which is convenient for installation, and has a tapered inner space 5a at its center.
  • the inner space 5a is provided with a flat, spherical or pyramidal support surface 5b capable of holding the thermistor element 1 in a substantially fixed position at the tip of the sensor case 5, and continuously or intermittently from the support surface 5b.
  • a guide surface 5c is provided which is widened (see, for example, FIG. 6 (A) or (B)).
  • the thickness at the left and right of the tip of the sensor case 5 is increased, while the thickness in the front and rear direction of the tip can be reduced.
  • PPS which is the material of the sensor case 5
  • PPS which is the material of the sensor case 5
  • the difference in the sensitivity of the thermistor element 1 due to the directivity can be alleviated.
  • glass fibers, inorganic fillers, etc. are included to improve the thermal conductivity, or the direction in which the temperature of the tip where the thickness of the sensor case 5 can be reduced should be detected. You just have to match.
  • the elastic resin coating layer 6 in this example employs, for example, a resin material with low hardness such as silicone resin, and is formed on the entire surface of the thermistor element 1 and the tip of the cable portion B. Further, the filled resin layer 7 in this example is made of an epoxy resin, and is formed so as to fill the gap between the inner surface of the sensor case 5 and the primer layer 8.
  • the above temperature sensor is a manufacturing method of assembling each component of the temperature sensor while suppressing the positional variation of the thermistor element 1 in the molding space. , 3 by a method using laser or ultrasonic wave or soldering (see FIG. 2), and the thermistor element 1 of the sensor unit A is immersed in silicon resin and solidified to the entire surface of the thermistor element 1
  • the coating step (see FIG. 3) for depositing the elastic resin coating layer 6 and the entire surface of the thermistor element 1 and the tip portion of the cable portion B by dipping the tip portion of the cable portion B into the primer from the tip of the thermistor element 1 and drying
  • the base formation process see FIG.
  • the elasticity of the elastic resin coating layer 6 and the form of the end spread of the inner space 5 a of the sensor case 5 combine, and during the solidifying step or in use It is possible to prevent the protection film 1a made of glass from being damaged by the expansion of the filling resin under high temperature load.
  • the filling resin 7 and the cable portion B are formed during the solidifying step by passing through the base forming step of depositing the primer layer 8 on the entire surface of the thermistor element 1 and the tip of the cable portion B.
  • the affinity with the sheath 4 is enhanced, and the air tightness around the sensor unit A as well as the tip end of the sensor unit A is ensured higher air tightness than the water blocking structure in the filling process which does not go through the conventional base forming process. be able to.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Nonlinear Science (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Details Of Resistors (AREA)
  • Thermistors And Varistors (AREA)

Abstract

La présente invention concerne : un capteur de température comportant un élément thermistance moulé en résine ; et un procédé de fabrication du capteur de température. L'invention concerne un capteur de température et son procédé de fabrication, dont l'étanchéité à l'air d'un élément thermistance est améliorée et dont la stabilité et le rendement des performances pendant la fabrication sont augmentés. Le capteur de température comprend : une partie capteur (A) composée d'un élément thermistance (1) et d'une borne de connexion (2) ; une partie câble (B) connectée à la borne de connexion (2) ; et une partie revêtement (C) qui recouvre la totalité de la partie capteur (A) et la pointe de la partie câble (B). La partie revêtement (C) comprend : un boîtier de capteur (5) comportant un espace interne (5a) qui s'effile vers le centre de la pointe où l'élément thermistance (1) est stocké ; une couche de revêtement de résine élastique (6) recouvrant la totalité de la surface de l'élément thermistance (1) ; et une couche de résine de remplissage (7) qui remplit l'espace entre la surface interne du boîtier de capteur (5) et la couche de revêtement de résine élastique (6).
PCT/JP2018/037152 2017-10-28 2018-10-04 Capteur de température et son procédé de fabrication Ceased WO2019082618A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201880068847.XA CN111247407A (zh) 2017-10-28 2018-10-04 温度传感器及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-208683 2017-10-28
JP2017208683A JP6944341B2 (ja) 2017-10-28 2017-10-28 温度センサ及びその製造方法

Publications (1)

Publication Number Publication Date
WO2019082618A1 true WO2019082618A1 (fr) 2019-05-02

Family

ID=66247318

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/037152 Ceased WO2019082618A1 (fr) 2017-10-28 2018-10-04 Capteur de température et son procédé de fabrication

Country Status (3)

Country Link
JP (1) JP6944341B2 (fr)
CN (1) CN111247407A (fr)
WO (1) WO2019082618A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12085458B2 (en) 2021-05-08 2024-09-10 Therm-O-Disc, Incorporated Temperature sensor probe

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102351955B1 (ko) * 2020-02-24 2022-01-17 주식회사 한성시스코 온도센서 내장형 밸브 및 이를 이용한 자동 유량조절 온수난방 시스템
CN117501077B (zh) * 2022-01-18 2025-02-07 株式会社芝浦电子 温度传感器及温度传感器的制造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6333633A (ja) * 1986-07-28 1988-02-13 Sanyo Electric Co Ltd 温度検出器の製造方法
JPH01191026A (ja) * 1988-01-27 1989-08-01 Mitsui Mining & Smelting Co Ltd 湯中等で用いるサーミスタの耐冷熱衝撃構造
JPH0575631U (ja) * 1992-03-17 1993-10-15 ティーディーケイ株式会社 温度センサ
JPH07218349A (ja) * 1994-01-31 1995-08-18 Ooizumi Seisakusho:Kk 温水センサ
JPH0894452A (ja) * 1994-09-21 1996-04-12 Mitsubishi Materials Corp 樹脂モールドサーミスタセンサ
JP3055727U (ja) * 1998-07-10 1999-01-29 株式会社芝浦電子 耐水及び耐熱衝撃を改善したエアコン吐出管用サーミスタ温度センサ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101162301B1 (ko) * 2011-09-06 2012-07-04 주식회사 디케이쎈서 실리콘 하우징이 구비된 온도센서 및 그 제조방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6333633A (ja) * 1986-07-28 1988-02-13 Sanyo Electric Co Ltd 温度検出器の製造方法
JPH01191026A (ja) * 1988-01-27 1989-08-01 Mitsui Mining & Smelting Co Ltd 湯中等で用いるサーミスタの耐冷熱衝撃構造
JPH0575631U (ja) * 1992-03-17 1993-10-15 ティーディーケイ株式会社 温度センサ
JPH07218349A (ja) * 1994-01-31 1995-08-18 Ooizumi Seisakusho:Kk 温水センサ
JPH0894452A (ja) * 1994-09-21 1996-04-12 Mitsubishi Materials Corp 樹脂モールドサーミスタセンサ
JP3055727U (ja) * 1998-07-10 1999-01-29 株式会社芝浦電子 耐水及び耐熱衝撃を改善したエアコン吐出管用サーミスタ温度センサ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12085458B2 (en) 2021-05-08 2024-09-10 Therm-O-Disc, Incorporated Temperature sensor probe

Also Published As

Publication number Publication date
JP6944341B2 (ja) 2021-10-06
JP2019082342A (ja) 2019-05-30
CN111247407A (zh) 2020-06-05

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