WO2018235960A1 - Electronic control unit - Google Patents
Electronic control unit Download PDFInfo
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- WO2018235960A1 WO2018235960A1 PCT/JP2018/023900 JP2018023900W WO2018235960A1 WO 2018235960 A1 WO2018235960 A1 WO 2018235960A1 JP 2018023900 W JP2018023900 W JP 2018023900W WO 2018235960 A1 WO2018235960 A1 WO 2018235960A1
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- WIPO (PCT)
- Prior art keywords
- annular
- electronic control
- control unit
- control device
- pitch
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/44—Joining a heated non plastics element to a plastics element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/022—Mechanical pre-treatments, e.g. reshaping
- B29C66/0224—Mechanical pre-treatments, e.g. reshaping with removal of material
- B29C66/02245—Abrading, e.g. grinding, sanding, sandblasting or scraping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/024—Thermal pre-treatments
- B29C66/0246—Cutting or perforating, e.g. burning away by using a laser or using hot air
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
- B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
- B29C66/242—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours
- B29C66/2424—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain
- B29C66/24243—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral
- B29C66/24244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
- B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
- B29C66/30325—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
- B29C66/322—Providing cavities in the joined article to collect the burr
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
- B29C66/7422—Aluminium or alloys of aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
Definitions
- the present invention relates to an electronic control device including a substrate on which various electronic components are mounted.
- JP-A-2016-132131 (patent document 1).
- a different kind of airtightness is formed by forming a joint having a plurality of groove portions substantially parallel to each other at the time of laser scanning processing at the interface between the dissimilar material and the metal material when joined to a dissimilar material.
- the area ratio is A dissimilar metal-bonded metal material having a relationship of A + B + C) / (W ⁇ H) ⁇ 1.00.
- Patent Document 1 there is a case where a joint having a plurality of grooves which are substantially parallel to each other is formed at the time of laser scanning processing at the interface between the dissimilar material and the metal material when joining dissimilar materials.
- a salt water resistance test such as a salt spray test.
- the present invention provides an electronic control device capable of preventing peeling of the bonding interface between the metal and the resin even in the salt water resistance test.
- the present invention is a substrate on which an electronic component is mounted, and a container for storing the substrate, and a storage portion opened as a recess for storing the substrate in a part thereof.
- An annular welding portion is formed on the side as a convex portion surrounding the periphery of the substrate accommodated in the accommodation portion and in contact with the accommodation portion, and at least the outer circumferential side of the annular welding portions is provided with a plurality of annular
- the annular welding portion is welded to the housing portion by laser light emitted from the outside of the metal body.
- peeling of the bonding interface between the metal and the resin can be prevented even in the salt water resistance test.
- FIG. 1 is a perspective view showing an entire configuration of an electronic control unit according to a first embodiment of the present invention. It is an exploded perspective view of an electronic control unit concerning Example 1 of the present invention. It is a figure of an electronic control unit concerning Example 1 of the present invention, and (A) is a bottom view of an electronic control unit, (B) is an important section expanded cross section in the XX line direction of (A).
- FIG. It is a figure for demonstrating the structure of a comparative example, Comprising: (A), (B) is a principal part expanded sectional view of a comparative example. It is a principal part expanded sectional view of the electronic control unit concerning Example 2 of the present invention.
- FIG. 1 is a perspective view showing an entire configuration of an electronic control unit according to a first embodiment of the present invention.
- the electronic control unit is used, for example, as an automobile engine control unit (ECU), and a substantially flat metal base 1 and a substantially cubic resin cover 2 are joined by an adhesive, welding or welding. It is shaped like a box.
- the metal base 1 is made of, for example, aluminum, and a plurality of radiation fins 1 a are formed on the surface of the metal base 1.
- FIG. 2 is an exploded perspective view of the electronic control unit according to the first embodiment of the present invention.
- a flat substrate 3 is disposed between the metal base 1 and the resin cover 2.
- the substrate 3 is fixed to the bottom side of the metal base 1 by a bolt or the like.
- the resin cover 2 is a container for storing the substrate 3 and is configured as a resin body having a storage portion 2a opened as a recess (space portion) for storing the substrate 3 in a part (central portion) thereof.
- An annular support portion 2 b for supporting the metal base 1 is formed on the peripheral edge of the housing portion 2 a of the resin cover 2.
- the metal base 1 covers the housing portion 2a of the resin cover 2 and is configured as a metal body supported by the support portion 2b around the housing portion 2a.
- a circuit pattern (not shown) is formed on the substrate 3 housed in the housing portion 2a, and electronic components 3a such as a CPU (Central Processing Unit), a resistor, and a capacitor are mounted. That is, an engine control unit (ECU) is configured by the various electronic components 3 a mounted on the substrate 3.
- the metal base 1 and the resin cover 2 are used to protect the substrate 3.
- the substrate 3 and the electronic component 3a may suffer from a load due to heat. In particular, when moisture intrudes into the inside of the resin cover 2, the substrate 3 gets wet and the electronic component 3a does not operate normally. Therefore, the reliability of bonding of the metal base 1 and the resin cover 2 becomes important.
- FIG. 3 is a diagram of the electronic control unit according to the first embodiment of the present invention, wherein (A) is a bottom view of the electronic control device, and (B) is in the XX direction of (A). It is a principal part expanded sectional view.
- an annular step portion 1 b is formed on the outer peripheral side of the upper portion of the metal base 1.
- An annular welding portion 1c is formed in contact with the storage portion 2a as a convex portion protruding to surround the periphery of the substrate 3 stored in the storage portion.
- a plurality of annular concavo-convex portions 1 d are formed on the outer peripheral side of the bottom surface of the welded portion 1 c (the surface facing the housing portion 2 a of the resin cover 2).
- Each concave portion of the uneven portions 1d is formed as a groove 1e, and the depth of each groove 1e is about 0.1 mm, and the width (pitch) between each groove (each concave portion) is 0.1 mm.
- the grooves 1e on the outermost side among the grooves 1e are formed on the end face on the bottom side of the metal base 1 so as to be exposed as notches.
- a groove 1e serving as a notch is formed in a region facing the peripheral edge (support portion 2b) of the storage portion 2a.
- Each groove 1 e can be formed, for example, by laser processing that emits a laser beam 4.
- each uneven portion 1 d is formed as a roughened portion roughened by the laser light 4.
- annular uneven parts 1d is also formed by 0.1 mm.
- the metal base 1 to which the substrate 3 is fixed is stored in the storage portion 2a of the resin cover 2, the metal base 1 is supported by the support portion 2b of the resin cover 2 in the step portion 1b.
- the bottom surface is in contact with the surface of the storage portion 2 a of the resin cover 2.
- the portion irradiated with the laser beam 4 is heated and a part of the resin cover 2 is melted.
- the surfaces of the welded portion 1c and the storage portion 2a are joined (welded) to each other.
- pressure is applied to the metal base 1 and the resin cover 2, and a part of the melted resin in the resin cover 2 becomes the protruding portion (burr) 5, and the supporting portion 2 b and the welded portion 1 c It is pushed out to the gap 6 between.
- a salt spray test (a test in which salt water is sprayed from the outside of the electronic control unit and salt water is attached to the side of the metal base 1) was tested. There were no cracks in the bonding interface with the resin cover 2. Specifically, for the salt spray test, no leak occurred even at 40 cycles, or a crack did not occur at the bonding interface between the metal base 1 and the resin cover 2 or inside the resin cover 2. Further, even if salt water infiltrates from the gap 6, the metal base 1 makes the portion corroded by salt water as slow as possible, or the strength higher than the stress generation due to the corrosion of the metal base 1 makes the metal base 1 and the resin cover 2 Can be extended the life for salt spray.
- the concavo-convex portion 1d including the plurality of grooves 1e in the region facing the gap 6 into which the salt water infiltrates in the metal base 1, the bonding strength of the outer peripheral side surface portion of the metal base 1 is strengthened. It becomes possible to prevent exfoliation due to corrosion of the base 1.
- the outer peripheral side of the bottom surface of the welded portion 1c of the metal base 1 into a groove structure including a plurality of grooves 1e, it is possible to suppress such a stress that peels the resin from the resin cover 2; It is considered that the life for the spray test is extended.
- FIG. 4 is a figure for demonstrating the structure of a comparative example, Comprising: (A), (B) is a principal part expanded sectional view of a comparative example.
- the comparative example is a region facing the gap 6 at the bottom surface of the welded portion 1 c, and a constant distance from the outer peripheral end surface (side surface) of the welded portion 1 c of the metal base 1.
- a flat portion 1g is formed between the outermost groove 1f and the side surface of the metal base 1.
- the cause is that the peeling force is exerted on the bonding interface between the metal base 1 and the resin cover 2 due to the corrosion of the metal base 1, so that the stresses F1 and F2 due to the corrosion occur as shown in FIG. 4 (A). That is, when the flat portion 1g exists between the groove 1f and the side surface of the metal base 1, the corrosion portion spreads on the metal base 1, and the stress F1 in the horizontal direction and the stress F2 in the vertical direction are generated as the stress in two directions. Do. When the corrosion further progresses, the volume expansion due to the progress of the corrosion of the metal base 1 also progresses, and as shown in FIG. 4B, a part of the resin cover 2 is further extruded in the peeling direction, and finally the metal base It is considered that the bonding interface between 1 and the resin cover 2 peels off.
- the bonding strength of the outer peripheral side surface of the metal base 1 is strengthened by providing the plurality of concavo-convex portions 1 d including the plurality of grooves 1 e in a region facing the gap 6 into which salt water infiltrates in the metal base 1.
- the bonding strength of the outer peripheral side surface of the metal base 1 is strengthened by providing the plurality of concavo-convex portions 1 d including the plurality of grooves 1 e in a region facing the gap 6 into which salt water infiltrates in the metal base 1.
- by making the outer peripheral side of the bottom surface of the welded portion 1c of the metal base 1 into a groove structure including a plurality of grooves 1e it is possible to suppress such a stress that peels the resin from the resin cover 2; Life can be extended. Therefore, it is resistant to general reliability tests (high temperature tests, thermal shock tests, etc.), and good reliability can be ensured even in salt spray tests.
- the same effect can be obtained also by providing a surface with unevenness on the surface of the metal base 1 by sand blasting or shot blasting.
- FIG. 5 is an enlarged sectional view of an essential part of an electronic control unit according to a second embodiment of the present invention.
- a plurality of grooves 1e are formed on the entire bottom surface of the welded portion 1c from the outer peripheral side to the inner peripheral side, and the other configuration is the same as that of the first embodiment.
- Each groove 1e is formed to have a groove depth of about 0.1 mm and a width (pitch) between the grooves of 0.1 mm.
- the grooves 1e on the outermost side among the grooves 1e are formed on the end face on the bottom side of the metal base 1 so as to be exposed as notches.
- the same effect as that of the first embodiment can be obtained, and since the concavo-convex structure is adopted for the entire welded portion, the joint strength of the entire welded portion is larger than that of the first embodiment. Life improves for salt spray tests.
- FIG. 6 is an enlarged sectional view of an essential part of an electronic control unit according to a third embodiment of the present invention.
- a plurality of grooves 1e and 1h having different pitches are formed in a plurality of groups all over the bottom surface of the welded portion 1c from the outer peripheral side to the inner peripheral side. Is the same as in the first embodiment.
- Each groove 1e belonging to the first group is formed with a groove depth of about 0.1 mm and a width (pitch) between grooves of 0.1 mm, and each groove 1h belonging to the second group has a groove depth
- the width (pitch) between the grooves is about 0.3 mm at about 0.1 mm.
- the same effect as that of the first embodiment can be obtained, and the number of grooves can be reduced more than the second embodiment. Therefore, the reliability for the salt spray test is improved, and the grooves are formed. It becomes possible to shorten time. Further, by making the pitch of the outer grooves 1e denser (shorter) than the pitch of the grooves 1h, there is an effect of suppressing corrosion by salt water from the outside. Further, by making the pitch of the groove 1h closer to the inner side wider than the pitch of the groove 1e, the bonding strength of the metal-resin interface between the metal base 1 and the resin cover 2 becomes strong, and peeling at the metal-resin interface The crack inside the resin is eliminated and the life is further improved.
- FIG. 7 is an enlarged sectional view of an essential part of an electronic control unit according to a fourth embodiment of the present invention.
- an annular protrusion 1i is formed on the inner peripheral side of the groove 1e in the bottom surface of the welded portion 1c, and the protrusion 1i is coupled to the storage portion 2a of the resin cover 2 corresponding to the protrusion 1i.
- the recess 2 c is formed, and the protrusion 1 i and the recess 2 c are coupled to each other.
- the other configuration is the same as that of the first embodiment.
- the same effect as that of the first embodiment can be obtained, and the bonding strength between the metal base 1 and the resin cover 2 is increased. Therefore, even when corrosion occurs, the bonding strength is higher than stress due to corrosion. Becomes hard to peel off. Further, by providing the projections 1i, the stress applied to the bonding portion (bonding interface) between the metal base 1 and the resin cover 2 can be further alleviated, so that the generation of the stress due to the corrosion becomes strong.
- FIG. 8 is an enlarged sectional view of an essential part of an electronic control unit according to a fifth embodiment of the present invention.
- a plurality of grooves 1j are formed substantially horizontally (in a direction perpendicular to the wall surface of the support 2b) on the outer peripheral side (the side facing the gap 6) of the weld 1c.
- the configuration is the same as that of the first embodiment.
- the same effect as that of the first embodiment can be obtained, and the bonding strength of metal and resin on the outer peripheral side surface of the welded portion 1c can be enhanced. In contrast, the life is improved.
- FIG. 9 is an enlarged sectional view of an essential part of an electronic control unit according to a sixth embodiment of the present invention.
- a plurality of grooves 1k are inclined in the direction (approximately 45 degrees with respect to the wall surface of the support portion 2b) instead of the plurality of grooves 1j on the outer peripheral side (the side facing the gap 6) of the welded portion 1c.
- the other configuration is the same as that of the fifth embodiment.
- burrs 5 are generated during laser welding, since the grooves 1k are formed in the inclined direction, the burrs 5 are more easily introduced into the grooves 1k than in the fifth embodiment.
- the same effect as that of the first embodiment can be obtained, and the bonding strength of metal and resin on the outer peripheral side surface of the welded portion 1c can be enhanced. In contrast, the life is improved.
- FIG. 10 is an enlarged sectional view of an essential part of an electronic control unit according to a seventh embodiment of the present invention.
- the ratio of the height 13 from the welding surface (bottom surface) of the metal base 1 to the laser irradiation surface (upper surface of the metal base 1) and the depth 14 of the groove 1e is optimized.
- the configuration is the same as that of the first embodiment.
- the height 13 from the welding surface (bottom surface) of the metal base 1 to the laser irradiation surface (upper surface of the metal base 1) is 2.5 mm, and the depth 14 of the groove 1 e is 0.1 mm.
- the ratio is 1:25.
- the thinner the height 13 from the welding surface to the laser irradiation surface the easier the heat can be transmitted and the easier it is to conduct heat.
- the metal base 1 it is possible to change the height 13 from the welding surface to the laser irradiation surface.
- the resin flows and the resin penetrates into each groove 1e to increase the bonding strength, but if the depth 14 of the groove 1e is made too deep, processing becomes difficult , Also expensive.
- the possibility of the resin entering into the groove 1e becoming insufficient becomes high, and thus it is expected that problems such as failure to join can occur.
- the welding surface of the metal base 1 is used in order for the heat generated by the laser beam 4 to transmit the heat necessary to melt the resin cover 2 and to facilitate the processing of each groove 1e.
- the ratio of the height 13 from (bottom surface) to the laser irradiation surface (upper surface of the metal base 1) and the depth 14 of each groove 1e is set to 1:25.
- the height (the depth of the groove) when the surface shape is roughened by general sand blasting or shot blasting is about 0.002 mm to 0.02 mm.
- the ratio of the groove depth to the height 13 from the welding surface (bottom surface) of the metal base 1 to the laser irradiation surface (upper surface of the metal base 1) is 1: 1250 to 1: 125. Since the salt spray resistance is improved by providing fine irregularities by blasting or the like on the surface of the metal base 1, the groove depth and welding of the metal base 1 are made to have a ratio of at least 1:25 or more. It is desirable to form a height 13 from the surface (bottom surface) to the laser irradiation surface (upper surface of the metal base 1).
- the present invention is not limited to the embodiments described above, but includes various modifications.
- the embodiments described above are described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to those having all the configurations described.
- part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment.
- Reference Signs List 1 metal base, 1a heat radiation fin, 1b step portion, 1c welded portion, 1d uneven portion, 1e, 1f, 1h, groove, 1i protrusion, 1j, 1k groove, 2 resin cover, 2a storage portion, 2b support portion, 3 substrate , 3a electronic parts, 4 laser light, 5 protrusion (burr), 6 gaps, 13 laser irradiated surface height, 14 groove depth
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Abstract
Description
本発明は、各種電子部品が搭載された基板を含む電子制御装置に関する。 The present invention relates to an electronic control device including a substrate on which various electronic components are mounted.
本技術分野の背景技術として、特開2016-132131号公報(特許文献1)がある。この公報には、「異種材料と接合した際に当該異種材料と金属材料との界面において、レーザースキャニング加工時に相互に略平行となる複数の溝部を有する接合部が形成された気密性を有する異種材料接合金属材料であって、前記接合部は、前記金属材料の表面に形成された前記溝部に対して垂直方向に切断した断面視において、前記溝部における溝幅をW、溝深さをH、レーザースキャニング加工時に形成される前記溝部面積をA、及び、レーザースキャニング加工時に前記溝部の両側辺の面上に形成されるバリからなる凸部面積をB、Cとした場合、面積比が、(A+B+C)/(W×H)≧1.00となる関係を有する異種材料接合金属材料。」と記載されている(要約参照)。 As background art of this technical field, there is JP-A-2016-132131 (patent document 1). In this publication, “a different kind of airtightness is formed by forming a joint having a plurality of groove portions substantially parallel to each other at the time of laser scanning processing at the interface between the dissimilar material and the metal material when joined to a dissimilar material. A material bonding metal material, wherein the bonding portion has a groove width W and a groove depth H in the groove in a cross-sectional view cut in a direction perpendicular to the groove formed on the surface of the metal material. Assuming that the groove area formed at the time of laser scanning processing is A, and the area of protrusions formed of burrs formed on the surfaces of both sides of the groove at the laser scanning processing is B and C, the area ratio is A dissimilar metal-bonded metal material having a relationship of A + B + C) / (W × H) ≧ 1.00.
前記特許文献1には、異種材料を接合する際に当該異種材料と金属材料との界面において、レーザースキャニング加工時に相互に略平行となる複数の溝部を有する接合部が形成するとあるが、屋外で使用を想定しているような電子装置において、塩害に対しても信頼性が確保できていないと、塩水噴霧試験等による塩水耐性試験においては、内部まで腐食が進んでしまう。
According to
そこで、本発明は、塩水耐性試験においても金属と樹脂との接合界面の剥離を防止することができる電子制御装置を提供する。 Therefore, the present invention provides an electronic control device capable of preventing peeling of the bonding interface between the metal and the resin even in the salt water resistance test.
上記課題を解決するために、本発明は、電子部品が搭載された基板と、前記基板を収納する容器であって、その一部に前記基板を収納するための凹部として開口された収納部を有する樹脂体と、前記樹脂体の前記収納部を覆い、前記収納部の周囲の縁に支持される金属体と、を有し、前記金属体のうち前記収納部と相対向する対向面の外周側には、前記収納部内に収納された前記基板の周囲を囲む凸部として前記収納部に接触する環状の溶着部が形成され、前記環状の溶着部のうち少なくとも外周側には、複数の環状の凹凸部が形成され、前記環状の溶着部は、前記金属体の外部から照射されるレーザ光によって前記収納部に溶着されていることを特徴とする。 In order to solve the above problems, the present invention is a substrate on which an electronic component is mounted, and a container for storing the substrate, and a storage portion opened as a recess for storing the substrate in a part thereof. An outer peripheral surface of an opposing surface of the metal body facing the storage portion, the resin body having a resin body, and a metal body covering the storage portion of the resin body and supported at an edge around the storage portion An annular welding portion is formed on the side as a convex portion surrounding the periphery of the substrate accommodated in the accommodation portion and in contact with the accommodation portion, and at least the outer circumferential side of the annular welding portions is provided with a plurality of annular The annular welding portion is welded to the housing portion by laser light emitted from the outside of the metal body.
本発明によれば、塩水耐性試験においても金属と樹脂との接合界面の剥離を防止することができる。 According to the present invention, peeling of the bonding interface between the metal and the resin can be prevented even in the salt water resistance test.
上記した以外の課題、構成及び効果は、以下の実施形態の説明により明らかにされる。 Problems, configurations, and effects other than those described above will be apparent from the description of the embodiments below.
以下、実施例1を図面を用いて説明する。
図1は、本発明の実施例1に係る電子制御装置の全体構成を示す斜視図である。図1において、電子制御装置は、例えば、自動車用エンジンコントロールユニット(ECU)として用いられ、略平板形状の金属ベース1と、略立方体形状の樹脂カバー2が接着剤や溶接や溶着により接合して、一つの箱のような形状となっている。なお、金属ベース1は、例えば、アルミニュウムで構成され、金属ベース1の表面に複数の放熱フィン1aが形成されている。
Hereinafter, Example 1 will be described using the drawings.
FIG. 1 is a perspective view showing an entire configuration of an electronic control unit according to a first embodiment of the present invention. In FIG. 1, the electronic control unit is used, for example, as an automobile engine control unit (ECU), and a substantially
図2は、本発明の実施例1に係る電子制御装置の分解斜視図である。図2において、金属ベース1と樹脂カバー2との間には、平板状の基板3が配置される。基板3は、金属ベース1の底面側に、ボルト等で固定される。樹脂カバー2は、基板3を収納する容器であって、その一部(中央部)に基板3を収納するための凹部(空間部)として開口された収納部2aを有する樹脂体として構成される。樹脂カバー2の収納部2aの周囲の縁には、金属ベース1を支持するための環状の支持部2bが形成されている。金属ベース1は、樹脂カバー2の収納部2aを覆い、収納部2aの周囲の支持部2bに支持される金属体として構成される。収納部2a内に収納される基板3には、回路パターン(図示せず)が形成されていると共に、CPU(Central Processing Unit)、抵抗、コンデンサ等の電子部品3aが実装されている。即ち、基板3に実装された各種電子部品3aによってエンジンコントロールユニット(ECU)が構成される。この際、金属ベース1と樹脂カバー2を用いて、基板3を保護するような形にしている。基板3や電子部品3aは、熱による負荷により不具合が発生することがある。特に、水分が樹脂カバー2の内部に浸入すると、基板3が濡れてしまい、電子部品3aが正常動作しなくなる。したがって、金属ベース1と樹脂カバー2の接合の信頼性が重要となってくる。
FIG. 2 is an exploded perspective view of the electronic control unit according to the first embodiment of the present invention. In FIG. 2, a flat substrate 3 is disposed between the
図3は、本発明の実施例1に係る電子制御装置の図であって、(A)は、電子制御装置の底面図であり、(B)は、(A)のX-X線方向における要部拡大断面図である。図3の(A)、(B)において、金属ベース1の上部の外周側には、環状の段差部1bが形成されている。金属ベース1の底面(基板3又は樹脂カバー2と相対向する面)の外周側(収納部2aと相対向する対向面の外周側)には、金属ベース1の中心部よりも樹脂カバー2側に突出し、収納部内に収納された基板3の周囲を囲む凸部として、収納部2aに接触する環状の溶着部1cが形成されている。この溶着部1cの底面(樹脂カバー2の収納部2aと相対向する面)の外周側には、複数の環状の凹凸部1dが形成されている。各凹凸部1dのうち各凹部は、溝1eとして形成され、各溝1eの深さが、0.1mm程度で、各溝間(各凹部間)の幅(ピッチ)が0.1mmで形成されている。この際、各溝1eのうち最外周側の溝1eは、切欠きとして露出するように、金属ベース1の底面側の端面に形成されている。すなわち、溶着部1cの底面の外周側であって、収納部2aの周囲の縁(支持部2b)と相対向する領域には、切欠きとなる溝1eが形成されている。各溝1eは、例えば、レーザ光4を照射するレーザ加工によって形成することができる。この際、各凹凸部1dは、レーザ光4によって粗面化された粗面部として形成される。なお、複数の環状の凹凸部1dのうち各溝1eで挟まれた各凸部間の幅(ピッチ)も0.1mmで形成されている。
FIG. 3 is a diagram of the electronic control unit according to the first embodiment of the present invention, wherein (A) is a bottom view of the electronic control device, and (B) is in the XX direction of (A). It is a principal part expanded sectional view. In (A) and (B) of FIG. 3, an
基板3が固定された金属ベース1が、樹脂カバー2の収納部2a内に収納されると、金属ベース1は、段差部1bが、樹脂カバー2の支持部2bで支持され、溶着部1cの底面が、樹脂カバー2の収納部2aの表面に接触する。
When the
ここで、金属ベース1の上方から金属ベース1の溶着部1cの全域に向けてレーザ光4を順次照射すると、レーザ光4が照射された部分が加熱され、樹脂カバー2の一部が溶かされて、溶着部1cと収納部2aの表面が互いに接合(溶着)する。その際に、金属ベース1と樹脂カバー2には圧力がかけられており、樹脂カバー2のうち溶けた樹脂の一部は、はみ出し部(バリ)5となり、支持部2bと溶着部1cとの間の隙間6に押し出される。
Here, when the
このような状態で塩水噴霧試験(電子制御装置の外側から塩水を噴霧し、金属ベース1の側面に塩水を付着させる試験)を行なったところ、金属ベース1の腐食の進行により、金属ベース1と樹脂カバー2との接合界面にクラックが入ることはなかった。具体的には、塩水噴霧試験に対して、40サイクル時にもリークが発生したり、金属ベース1と樹脂カバー2との接合界面や樹脂カバー2の内部にクラックが発生したりしなかった。また、隙間6から塩水が浸入しても、金属ベース1のうち、塩水により腐食する部分をなるべく遅くするもしくは、金属ベース1の腐食による応力発生よりも大きな強度により、金属ベース1と樹脂カバー2とを接合することで、塩水噴霧に対する寿命を延ばすことが出来る。即ち、金属ベース1のうち塩水が浸入する隙間6を臨む領域に、複数の溝1eを含む凹凸部1dを設けることにより、金属ベース1の外周側側面部の接合強度を強くすることで、金属ベース1の腐食による剥離を防ぐことが可能となる。また、金属ベース1の溶着部1cの底面の外周側を、複数の溝1eを含む溝構造にすることにより、樹脂カバー2から樹脂を剥離させるような応力も抑えることができるため、その結果塩水噴霧試験に対する寿命が延びたと考えられる。
Under these conditions, a salt spray test (a test in which salt water is sprayed from the outside of the electronic control unit and salt water is attached to the side of the metal base 1) was tested. There were no cracks in the bonding interface with the
図4は、比較例の構成を説明するための図であって、(A)、(B)は、比較例の要部拡大断面図である。図4の(A)、(B)において、比較例は、溶着部1cの底面に、隙間6を臨む領域であって、金属ベース1の溶着部1cの外周側端面(側面)から一定の間隔を保って、複数の溝1fを形成したものであり、最外周側の溝1fと金属ベース1の側面との間に平坦部1gが形成されている。
FIG. 4 is a figure for demonstrating the structure of a comparative example, Comprising: (A), (B) is a principal part expanded sectional view of a comparative example. In (A) and (B) of FIG. 4, the comparative example is a region facing the
このような状態で塩水噴霧試験を行なったところ、金属ベース1の腐食の進行により、金属ベース1と樹脂カバー2との接合界面にクラックが入ることを確認された。具体的には、塩水噴霧試験に対して30サイクルまではリークの発生がなかったが、40サイクル時にはリークが発生し、金属ベース1と樹脂カバー2との接合界面や樹脂カバー2の内部にクラックが入った。
When a salt spray test was performed in such a state, it was confirmed that a crack was generated in the bonding interface between the
原因としては、金属ベース1の腐食により、金属ベース1と樹脂カバー2との接合界面に剥離力が働くため、図4(A)に示すように、腐食による応力F1、F2が発生する。即ち、溝1fと金属ベース1の側面との間に平坦部1gが存在すると、金属ベース1に腐食部が広がり、2方向の応力として、水平方向の応力F1と、垂直方向の応力F2が発生する。腐食がさらに進むと、金属ベース1の腐食の進行による体積膨張も進み、図4(B)に示すように、樹脂カバー2の一部がさらに剥離方向に押し出され、最終的には、金属ベース1と樹脂カバー2との接合界面が剥離すると考えられる。
The cause is that the peeling force is exerted on the bonding interface between the
実施例1によれば、塩水噴霧試験においても、金属ベース1と樹脂カバー2との接合界面の剥離を防止することができる。具体的には、金属ベース1のうち塩水が浸入する隙間6を臨む領域に、複数の溝1eを含む複数の凹凸部1dを設けることにより、金属ベース1の外周側側面の接合強度を強くすることで、金属ベース1の腐食による剥離を防ぐことが可能となる。また、金属ベース1の溶着部1cの底面の外周側を、複数の溝1eを含む溝構造にすることにより、樹脂カバー2から樹脂を剥離させるような応力も抑えることができるため、塩水噴霧試験に対する寿命を延すことができる。従って、一般的な信頼性試験(高温試験、熱衝撃試験等)にも耐性があり、且つ、塩水噴霧試験においても良好な信頼性を確保できる。
According to Example 1, peeling of the bonding interface between the
なお、溝1eとして、0.1mm深さの溝を設けたが、サンドブラストやショットブラストにより金属ベース1の表面に凹凸を設けたものについても、同様の効果を奏することができる。
Although a groove having a depth of 0.1 mm is provided as the
図5は、本発明の実施例2に係る電子制御装置の要部拡大断面図である。実施例2は、この溶着部1cの底面全体に、その外周側から内周側に亘って、複数の溝1eを形成したものであり、他の構成は、実施例1と同様である。各溝1eは、溝の深さが、0.1mm程度で、各溝間の幅(ピッチ)が0.1mmで形成されている。この際、各溝1eのうち最外周側の溝1eは、切欠きとして露出するように、金属ベース1の底面側の端面に形成されている。
FIG. 5 is an enlarged sectional view of an essential part of an electronic control unit according to a second embodiment of the present invention. In the second embodiment, a plurality of
実施例2によれば、実施例1と同様の効果を奏することができると共に、溶着部全体に凹凸構造を採用したので、実施例1よりも、溶着部全体の接合強度が大きくなるため、より塩水噴霧試験に対して、寿命が改善する。 According to the second embodiment, the same effect as that of the first embodiment can be obtained, and since the concavo-convex structure is adopted for the entire welded portion, the joint strength of the entire welded portion is larger than that of the first embodiment. Life improves for salt spray tests.
図6は、本発明の実施例3に係る電子制御装置の要部拡大断面図である。実施例3は、この溶着部1cの底面全体に、その外周側から内周側に亘って、ピッチの異なる複数の溝1e、1hを複数のグループに分けて形成したものであり、他の構成は、実施例1と同様である。第一グループに属する各溝1eは、溝の深さが、0.1mm程度で、溝間の幅(ピッチ)が0.1mmで形成され、第二グループに属する各溝1hは、溝の深さが、0.1mm程度で、溝間の幅(ピッチ)が0.3mmで形成されている。
FIG. 6 is an enlarged sectional view of an essential part of an electronic control unit according to a third embodiment of the present invention. In the third embodiment, a plurality of
実施例3によれば、実施例1と同様の効果を奏することができると共に、実施例2よりも、溝の数を削減できるため、塩水噴霧試験に対する信頼性が向上し、且つ、溝形成による時間を短縮することが可能となる。また、外側の溝1eのピッチを溝1hのピッチよりも密(短く)にすることにより、外部からの塩水による腐食を抑制する効果がある。また内側に近いほうの溝1hのピッチを、溝1eのピッチよりも広くすることで、金属ベース1と樹脂カバー2との金属・樹脂界面の接合強度が強くなり、金属・樹脂界面での剥離を抑制し、樹脂内部のクラックがなくなり寿命がより改善される。
According to the third embodiment, the same effect as that of the first embodiment can be obtained, and the number of grooves can be reduced more than the second embodiment. Therefore, the reliability for the salt spray test is improved, and the grooves are formed. It becomes possible to shorten time. Further, by making the pitch of the
図7は、本発明の実施例4に係る電子制御装置の要部拡大断面図である。実施例4は、溶着部1cの底面のうち、溝1eよりも内周側に環状の突起1iを形成し、突起1iに対応する樹脂カバー2の収納部2aに、突起1iと結合する環状の凹部2cを形成し、突起1iと凹部2cとを結合させるようにしたものであり、他の構成は、実施例1と同様である。
FIG. 7 is an enlarged sectional view of an essential part of an electronic control unit according to a fourth embodiment of the present invention. In the fourth embodiment, an
実施例4によれば、実施例1と同様の効果を奏することができると共に、金属ベース1と樹脂カバー2の接合強度を強くしたので、腐食が発生した場合でも腐食による応力発生よりも接合強度が強くなるために剥離がしにくくなる。また、突起1iを設けることにより、金属ベース1と樹脂カバー2との接合部(接合界面)にかかる応力をさらに緩和することができるため、腐食による応力発生に対しても強くなる。
According to the fourth embodiment, the same effect as that of the first embodiment can be obtained, and the bonding strength between the
図8は、本発明の実施例5に係る電子制御装置の要部拡大断面図である。実施例5は、溶着部1cの外周側側面(隙間6を臨む側面)に、複数の溝1jを略水平方向(支持部2bの壁面に対して垂直方向)に形成したものであり、他の構成は、実施例1と同様である。
FIG. 8 is an enlarged sectional view of an essential part of an electronic control unit according to a fifth embodiment of the present invention. In the fifth embodiment, a plurality of
レーザ溶着時に、金属ベース1と樹脂カバー2とが接合するときに、樹脂カバー2の一部が溶けて、余分な樹脂が、バリ5となって発生し、バリ5が隙間6に溢れる。この際、バリ5の一部が各溝1j内に導入される。このため、溶着部1cの外周側側面に、強固な金属・樹脂接合部が形成される。
At the time of laser welding, when the
実施例5によれば、実施例1と同様の効果を奏することができると共に、溶着部1cの外周側側面における金属・樹脂の接合強度を高めることができ、実施例1よりも塩水噴霧試験に対して寿命が向上する。
According to the fifth embodiment, the same effect as that of the first embodiment can be obtained, and the bonding strength of metal and resin on the outer peripheral side surface of the welded
図9は、本発明の実施例6に係る電子制御装置の要部拡大断面図である。実施例6は、溶着部1cの外周側側面(隙間6を臨む側面)に、複数の溝1jの代わりに、複数の溝1kを傾斜した方向(支持部2bの壁面に対して略45度の角度で傾斜した方向)に形成したものであり、他の構成は、実施例5と同様である。
FIG. 9 is an enlarged sectional view of an essential part of an electronic control unit according to a sixth embodiment of the present invention. In the sixth embodiment, a plurality of
レーザ溶着時に、バリ5が発生しても、各溝1kが傾斜方向に形成されているので、実施例5よりも、バリ5が各溝1k内に容易に導入される。
Even when
実施例6によれば、実施例1と同様の効果を奏することができると共に、溶着部1cの外周側側面における金属・樹脂の接合強度を高めることができ、実施例1よりも塩水噴霧試験に対して寿命が向上する。
According to the sixth embodiment, the same effect as that of the first embodiment can be obtained, and the bonding strength of metal and resin on the outer peripheral side surface of the welded
図10は、本発明の実施例7に係る電子制御装置の要部拡大断面図である。実施例7は、金属ベース1の溶着面(底面)からレーザ照射面(金属ベース1の上面)までの高さ13と溝1eの深さ14との比を最適化したものであり、他の構成は、実施例1と同様である。
FIG. 10 is an enlarged sectional view of an essential part of an electronic control unit according to a seventh embodiment of the present invention. In the seventh embodiment, the ratio of the
図10において、金属ベース1の溶着面(底面)からレーザ照射面(金属ベース1の上面)までの高さ13は、2.5mmで、溝1eの深さ14は、0.1mmであり、両者の比は、1:25となっている。
In FIG. 10, the
レーザ光4で発生した熱が樹脂カバー2を溶かすのに必要な熱量を伝えるためには、溶着面からレーザ照射面までの高さ13が薄ければ薄いほど熱が伝わりやすく、熱伝導しやすい金属ベース1を使用することにより、この溶着面からレーザ照射面までの高さ13を変更することが可能となる。また、溝1eの深さ14についても、樹脂が流動し、各溝1eの中に樹脂が入り込むことによって接合強度が大きくなるが、溝1eの深さ14をあまり深くしようとすると加工が難しくなり、費用もかさむ。また、溝1eへの樹脂の入り込み方が不十分となる可能性が高くなり、そのために接合が出来ない等の不具合が発生することが予想される。
In order for the heat generated by the
そこで、実施例7では、レーザ光4で発生した熱が樹脂カバー2を溶かすのに必要な熱量を伝えるために、また、各溝1eの加工を容易にするために、金属ベース1の溶着面(底面)からレーザ照射面(金属ベース1の上面)までの高さ13と各溝1eの深さ14との比を1:25に設定している。
Therefore, in the seventh embodiment, the welding surface of the
なお、一般的なサンドブラストやショットブラストによる表面形状を荒らしたときの高さ(溝の深さ)は0.002mm~0.02mm程度となる。この場合、溝の深さと、金属ベース1の溶着面(底面)からレーザ照射面(金属ベース1の上面)までの高さ13との比は、1:1250~1:125となる。金属ベース1の表面にブラストなどによる微細な凹凸を設けることにより、塩水噴霧耐性が向上していることから、少なくとも1:25以上の比になるように、溝の深さと、金属ベース1の溶着面(底面)からレーザ照射面(金属ベース1の上面)までの高さ13を形成することが望ましい。
The height (the depth of the groove) when the surface shape is roughened by general sand blasting or shot blasting is about 0.002 mm to 0.02 mm. In this case, the ratio of the groove depth to the
なお、本発明は上記した実施例に限定されるものではなく、様々な変形例が含まれる。例えば、上記した実施例は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。また、ある実施例の構成の一部を他の実施例の構成に置き換えることが可能であり、また、ある実施例の構成に他の実施例の構成を加えることも可能である。また、各実施例の構成の一部について、他の構成の追加・削除・置換をすることが可能である。 The present invention is not limited to the embodiments described above, but includes various modifications. For example, the embodiments described above are described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to those having all the configurations described. Also, part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. In addition, with respect to a part of the configuration of each embodiment, it is possible to add, delete, and replace other configurations.
1 金属ベース、1a 放熱フィン、1b 段差部、1c 溶着部、1d 凹凸部、1e、1f、1h、 溝、1i 突起、1j、1k 溝、2 樹脂カバー、2a 収納部、2b 支持部、3 基板、3a 電子部品、4 レーザ光、5 はみ出し部(バリ)、6 隙間、13 レーザ照射面の高さ、14 溝の深さ
Claims (11)
前記基板を収納する容器であって、その一部に前記基板を収納するための凹部として開口された収納部を有する樹脂体と、
前記樹脂体の前記収納部を覆い、前記収納部の周囲の縁に支持される金属体と、を有し、
前記金属体のうち前記収納部と相対向する対向面の外周側には、前記収納部内に収納された前記基板の周囲を囲む凸部として前記収納部に接触する環状の溶着部が形成され、
前記環状の溶着部のうち少なくとも外周側には、複数の環状の凹凸部が形成され、
前記環状の溶着部は、前記金属体の外部から照射されるレーザ光によって前記収納部に溶着されていることを特徴とする電子制御装置。 A substrate on which electronic components are mounted,
A container for storing the substrate, the resin body having a storage portion opened as a recess for storing the substrate in a part of the container;
And a metal body which covers the storage portion of the resin body and is supported on an edge around the storage portion,
An annular welded portion is formed on the outer peripheral side of the opposing surface of the metal body facing the storage portion, the annular weld portion being a convex portion surrounding the periphery of the substrate stored in the storage portion, and being in contact with the storage portion.
A plurality of annular uneven portions are formed on at least the outer peripheral side of the annular welded portion,
The electronic control unit according to claim 1, wherein the annular welding portion is welded to the housing portion by a laser beam emitted from the outside of the metal body.
前記複数の環状の凹凸部は、
前記レーザ光で粗面化された粗面部として形成されていることを特徴とする電子制御装置。 The electronic control device according to claim 1, wherein
The plurality of annular uneven portions are
An electronic control unit characterized in that it is formed as a roughened portion roughened by the laser light.
前記環状の溶着部の外周側のうち、前記収納部の周囲の縁と相対向する領域には、前記複数の環状の凹凸部の中の一つの凹部が切欠きとして形成されていることを特徴とする電子制御装置。 The electronic control device according to claim 1 or 2, wherein
One of the plurality of annular concavo-convex parts is formed as a notch in a region facing the peripheral edge of the storage part on the outer peripheral side of the annular welded part. Electronic control unit.
前記複数の環状の凹凸部のうち、前記各凹部間のピッチは、同一の長さに設定されていることを特徴とする電子制御装置。 The electronic control device according to claim 3, wherein
An electronic control unit characterized in that among the plurality of annular concavo-convex portions, pitches between the respective concave portions are set to the same length.
前記複数の環状の凹凸部は、
前記環状の溶着部の外周側から内周側に亘って形成され、前記複数の環状の凹凸部のうち、前記各凹部間のピッチは、同一の長さに設定されていることを特徴とする電子制御装置。 The electronic control device according to claim 3, wherein
The plurality of annular uneven portions are
Among the plurality of annular concavo-convex portions, the pitch between the respective concave portions is set to the same length, and is formed from the outer peripheral side to the inner peripheral side of the annular welded portion. Electronic control unit.
前記複数の環状の凹凸部は、
前記環状の溶着部の外周側から内周側に亘って形成され、前記複数の環状の凹凸部のうち、前記各凹部間のピッチは、複数のグループに分かれて設定され、各グループのピッチは相異なる長さに設定されていることを特徴とする電子制御装置。 The electronic control device according to claim 3, wherein
The plurality of annular uneven portions are
Among the plurality of annular concavo-convex portions, the pitch between the concave portions is divided into a plurality of groups, and the pitch of each group is set. An electronic control unit characterized by being set to different lengths.
前記複数の環状の凹凸部は、
前記環状の溶着部の外周側から内周側に亘って形成され、前記複数の環状の凹凸部のうち、前記各凹部間のピッチは、外周側に存在する第一のグループと、内周側に存在する第二のグループに分かれて設定され、各グループのピッチは相異なる長さに設定され、且つ前記第一のグループのピッチが前記第二のグループのピッチよりも短く設定されていることを特徴とする電子制御装置。 The electronic control device according to claim 3, wherein
The plurality of annular uneven portions are
Of the plurality of annular concavo-convex portions, the pitch between the respective concave portions is formed from the outer circumferential side to the inner circumferential side of the annular welded portion, and the first group existing on the outer circumferential side and the inner circumferential side In the second group, the pitch of each group is set to a different length, and the pitch of the first group is set shorter than the pitch of the second group An electronic control unit characterized by
前記環状の溶着部のうち前記複数の環状の凹凸部より内周側には、環状の突起が形成され、前記収納部のうち前記環状の突起との対向面には、前記突起と結合する環状の凹部が形成されていることを特徴とする電子制御装置。 The electronic control device according to claim 3, wherein
An annular protrusion is formed on the inner peripheral side of the plurality of annular uneven portions in the annular welded portion, and an annular surface coupled to the protrusion on the surface facing the annular protrusion in the storage portion. An electronic control unit characterized in that a concave portion is formed.
前記環状の溶着部のうち、前記収納部の周囲の縁と相対向する領域には、複数の環状の溝が形成されていることを特徴とする電子制御装置。 The electronic control device according to any one of claims 1 to 8, wherein
An electronic control unit characterized in that a plurality of annular grooves are formed in a region of the annular welding portion facing the peripheral edge of the storage portion.
前記複数の環状の溝は、前記収納部の周囲の縁に対して、垂直方向又は傾斜した方向に形成されていることを特徴とする電子制御装置。 The electronic control device according to claim 9, wherein
The electronic control device according to claim 1, wherein the plurality of annular grooves are formed in a perpendicular direction or an inclined direction with respect to the peripheral edge of the storage portion.
前記複数の環状の凹凸部のうち前記各凹部の深さと、前記金属体のうち前記レーザ光が照射される照射面から前記環状の溶着部が前記収納部に溶着される溶着面までの高さとの比は、1対25以上に設定されていることを特徴とする電子制御装置。 The electronic control device according to any one of claims 1 to 10, wherein
The depth of each recess among the plurality of annular concavo-convex parts, and the height from the irradiation surface of the metal body to which the laser beam is irradiated to the welding surface where the annular welding part is welded to the housing part An electronic control unit characterized in that the ratio of is set to 1:25 or more.
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