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WO2018220704A1 - Dispositif de montage de composant - Google Patents

Dispositif de montage de composant Download PDF

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Publication number
WO2018220704A1
WO2018220704A1 PCT/JP2017/020058 JP2017020058W WO2018220704A1 WO 2018220704 A1 WO2018220704 A1 WO 2018220704A1 JP 2017020058 W JP2017020058 W JP 2017020058W WO 2018220704 A1 WO2018220704 A1 WO 2018220704A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
imaging
mounting
unit
imaging unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/020058
Other languages
English (en)
Japanese (ja)
Inventor
和志 高間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP2019521565A priority Critical patent/JP6774568B2/ja
Priority to PCT/JP2017/020058 priority patent/WO2018220704A1/fr
Publication of WO2018220704A1 publication Critical patent/WO2018220704A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the head unit 4 is disposed above the pair of conveyors 2 and the component supply unit 3, and includes a plurality (ten) of mounting heads 42 having nozzles 41 (see FIG. 3) attached to the lower end, and a board recognition camera. 43.
  • the head unit 4 includes a Z-axis motor 44, an R-axis motor 45, and a linear motor 46, as shown in FIG.
  • the head unit 4 is provided with an imaging unit 8.
  • the horizontal position (XY direction) and the vertical direction (Z direction) of the suction position of the component 31 can be accurately acquired. . Further, based on the image at the component mounting position imaged by the imaging unit 8, the horizontal position (XY direction) position and the vertical direction (Z direction) position of the component 31 can be accurately acquired. It is.
  • the recognition correction parameter includes information for correcting the position between the lowered position of the mounting head 42 and the center position of the image of the suction / attachment position camera 81.
  • the recognition correction parameter is stored in the memory 92 in association with the imaging position.
  • the control unit 9 analyzes the image based on the image captured at the imaging position and the corresponding recognition correction parameter, and acquires the position of the component 31 in the image or the component mounting position in the image.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention concerne un dispositif de montage (100) de composant comprenant une unité de tête (4) comprenant une pluralité de têtes de montage (42) servant à monter un composant (31) sur un substrat (P), et une première unité d'imagerie (81) disposée sur l'unité de tête (4) et apte à mettre en image au moins une position d'aspiration de composant et/ou une position de placement de composant par rapport au substrat (P). La première unité d'imagerie (81) est conçue pour pouvoir se déplacer dans une direction de réseau dans laquelle les têtes de la pluralité de têtes de montage (42) sont disposées en réseau.
PCT/JP2017/020058 2017-05-30 2017-05-30 Dispositif de montage de composant Ceased WO2018220704A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019521565A JP6774568B2 (ja) 2017-05-30 2017-05-30 部品実装装置
PCT/JP2017/020058 WO2018220704A1 (fr) 2017-05-30 2017-05-30 Dispositif de montage de composant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/020058 WO2018220704A1 (fr) 2017-05-30 2017-05-30 Dispositif de montage de composant

Publications (1)

Publication Number Publication Date
WO2018220704A1 true WO2018220704A1 (fr) 2018-12-06

Family

ID=64454587

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/020058 Ceased WO2018220704A1 (fr) 2017-05-30 2017-05-30 Dispositif de montage de composant

Country Status (2)

Country Link
JP (1) JP6774568B2 (fr)
WO (1) WO2018220704A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210093041A (ko) * 2020-01-17 2021-07-27 한화정밀기계 주식회사 부품 실장 장치

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246799A (ja) * 1996-03-07 1997-09-19 Yamaha Motor Co Ltd 実装機の部品認識装置
JP2007214212A (ja) * 2006-02-07 2007-08-23 Matsushita Electric Ind Co Ltd 実装状態判定方法、実装状態判定プログラム、実装状態判定装置、実装方法
JP2009140945A (ja) * 2007-12-03 2009-06-25 Yamaha Motor Co Ltd 部品吸着装置、その吸着位置補正方法および実装機
WO2012026101A1 (fr) * 2010-08-27 2012-03-01 パナソニック株式会社 Dispositif de montage de composant, et procédé de montage de composant
JP2017044472A (ja) * 2015-08-24 2017-03-02 富士機械製造株式会社 カメラ用の測定装置および測定方法
JP2017073431A (ja) * 2015-10-06 2017-04-13 富士機械製造株式会社 画像認識装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216621A (ja) * 2013-04-30 2014-11-17 株式会社日立製作所 基板処理装置および基板処理方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246799A (ja) * 1996-03-07 1997-09-19 Yamaha Motor Co Ltd 実装機の部品認識装置
JP2007214212A (ja) * 2006-02-07 2007-08-23 Matsushita Electric Ind Co Ltd 実装状態判定方法、実装状態判定プログラム、実装状態判定装置、実装方法
JP2009140945A (ja) * 2007-12-03 2009-06-25 Yamaha Motor Co Ltd 部品吸着装置、その吸着位置補正方法および実装機
WO2012026101A1 (fr) * 2010-08-27 2012-03-01 パナソニック株式会社 Dispositif de montage de composant, et procédé de montage de composant
JP2017044472A (ja) * 2015-08-24 2017-03-02 富士機械製造株式会社 カメラ用の測定装置および測定方法
JP2017073431A (ja) * 2015-10-06 2017-04-13 富士機械製造株式会社 画像認識装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210093041A (ko) * 2020-01-17 2021-07-27 한화정밀기계 주식회사 부품 실장 장치
KR102389643B1 (ko) * 2020-01-17 2022-04-21 한화정밀기계 주식회사 부품 실장 장치

Also Published As

Publication number Publication date
JP6774568B2 (ja) 2020-10-28
JPWO2018220704A1 (ja) 2019-11-21

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