[go: up one dir, main page]

WO2018216670A1 - Procédé de production d'un corps étanche - Google Patents

Procédé de production d'un corps étanche Download PDF

Info

Publication number
WO2018216670A1
WO2018216670A1 PCT/JP2018/019565 JP2018019565W WO2018216670A1 WO 2018216670 A1 WO2018216670 A1 WO 2018216670A1 JP 2018019565 W JP2018019565 W JP 2018019565W WO 2018216670 A1 WO2018216670 A1 WO 2018216670A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
thermosetting resin
organic
plate
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/019565
Other languages
English (en)
Japanese (ja)
Inventor
英治 馬場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2019520251A priority Critical patent/JP7268596B2/ja
Publication of WO2018216670A1 publication Critical patent/WO2018216670A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Definitions

  • This invention relates to the manufacturing method of the sealing body by which the organic EL element on the board
  • An organic EL (Electroluminescence) element is a light emitting element using an organic substance as a light emitting material, and has recently attracted attention.
  • the organic EL element is extremely weak against moisture, and there is a problem that the luminance is lowered by moisture.
  • the organic EL element is sealed using a sealing material having a resin composition layer.
  • thermosetting resin composition when using a thermosetting resin composition as a sealing material for an organic EL element substrate, the thermosetting resin composition is excellent in moisture resistance of the cured product, but the deterioration of the organic EL element due to the heating temperature at the time of thermosetting is reduced. Since it needs to be prevented, a thermosetting resin composition that can be cured at a relatively low temperature tends to be used (Patent Document 1, etc.).
  • a sealing method in order to suppress generation of voids in the sealing layer, for example, lamination is performed under reduced pressure using a vacuum laminator or the like, and then sealing is performed by thermosetting at a relatively low temperature (preferably a temperature of 120 ° C. or lower).
  • Patent Document 1 A method of forming a stop layer is known (Patent Document 1, etc.).
  • Patent Document 1 A method of forming a stop layer is known (Patent Document 1, etc.).
  • the sealing layer of the organic EL device be made thinner.
  • a thin sealing material having a thickness of less than 20 ⁇ m is desired in the resin composition layer of the sealing material.
  • An object of the present invention is to provide a method of suppressing the generation and enabling sealing of an organic EL element on a substrate.
  • a sealing material in which a thermosetting resin composition layer is formed on a support and an organic EL element in which an organic EL element is formed on a substrate The element substrate is laminated by pressing between two plates, and the temperature of the first plate (hereinafter sometimes referred to as “first plate”) disposed on the support side of the sealing material is set to the organic EL element. It has been found that the generation of voids can be suppressed by lowering the temperature of a second plate (hereinafter sometimes abbreviated as “second plate”) arranged on the substrate side of the substrate.
  • second plate hereinafter sometimes abbreviated as “second plate”.
  • thermosetting resin composition comprising: a sealing material having a thermosetting resin composition layer having a thickness of less than 20 ⁇ m formed on a support; and an organic EL element substrate having an organic EL element formed on the substrate.
  • a laminating step of laminating by pressing between two plates so that the layer is in contact with the organic EL element Including a laminating step of laminating by pressing between two plates so that the layer is in contact with the organic EL element, The temperature of the 1st plate arrange
  • thermosetting resin composition layer is laminated by being melted by heat of the organic EL element substrate in the laminating step.
  • the temperature of the first plate is 5 ° C. or lower than the temperature of the second plate.
  • the temperature of the second plate is 60 ° C. or higher and 100 ° C. or lower.
  • the temperature of the second plate is 65 ° C. or higher and 95 ° C. or lower.
  • thermosetting resin composition layer has a thickness of 15 ⁇ m or less.
  • first plate and the second plate are each independently a metal plate or a ceramic plate.
  • the support is a glass substrate or a moisture-proof film.
  • the sealing body is an organic EL device.
  • thermosetting step of thermosetting the thermosetting resin layer to form a sealing layer after the laminating step.
  • the organic EL element on the substrate is sealed with the sealing layer (cured material layer).
  • the sealing layer cured material layer.
  • the method of the present invention produces a sealed body in which organic EL elements on a substrate are sealed with a sealing layer (cured material layer).
  • the encapsulant is preferably an organic EL device.
  • thermosetting resin composition layer is cured by heating at the time of lamination, the followability to the substrate surface is deteriorated due to an increase in viscosity, and voids tend to be generated.
  • the temperature at the time of lamination is low, the meltability of the thermosetting resin composition layer is lowered, the followability to the substrate surface is deteriorated, and voids are easily generated.
  • the alignment accuracy between the organic EL element substrate and the sealing material is important, and the time for the lamination process tends to be relatively long for precise alignment. More susceptible to temperature effects. The present invention is based on such knowledge.
  • the sealing material and the organic EL element substrate are stacked by being pressed between the first plate and the second plate.
  • the plate used for lamination examples include a rubber plate, a metal plate, and a ceramic plate.
  • the rubber plate is excellent in the followability of the thermosetting resin composition layer to the organic EL element substrate, but is likely to be displaced between the sealing material and the organic EL element substrate at the time of lamination, and is inferior in alignment accuracy.
  • the metal plate and the ceramic plate are excellent in alignment accuracy, but are inferior in followability.
  • the metal plate and the ceramic plate can be made excellent in the followability of the thermosetting resin composition layer to the organic EL element substrate, so that the metal plate having excellent alignment accuracy and / or Alternatively, it is preferable to use a ceramic plate.
  • the first plate and the second plate are preferably each independently a metal plate or a ceramic plate.
  • the metal plate a stainless steel plate, an aluminum plate or the like is preferable.
  • a smooth surface is preferable.
  • a stainless steel plate having a mirror-finished surface is preferable.
  • the plate may include means for holding an object to be stacked such as an electrostatic chuck.
  • the sealing material and the organic EL element substrate are arranged between the two plates. Between the support of the sealing material and the first plate, and / or between the substrate of the organic EL element substrate and the second plate, a sheet for conveyance, a rubber sheet, A contamination prevention sheet or the like may be further arranged.
  • the first and second plates are arranged on the upper and lower sides of the encapsulant and the organic EL element substrate, and either one plate or both plates move in the direction of the opposing plate, and the encapsulant and the organic EL element substrate Lamination is performed by pressurizing.
  • the pressurization is preferably performed by moving one of the upper and lower plates, and more preferably by moving the lower plate.
  • the organic EL element substrate is disposed on the lower side, and the sealing material is disposed on the upper side.
  • the pressure during the lamination is preferably 1 kgf / cm 2 or more, more preferably 1.5 kgf / cm 2 or more, 2 kgf / cm 2 or more, and even more preferably 2.5 kgf / cm 2 or more.
  • the pressure is preferably 16 kgf / cm 2 or less, more preferably 13 kgf / cm 2 or less, 11 kgf / Cm 2 or less is more preferred, 9 kgf / cm 2 or less is even more preferred, and 7 kgf / cm 2 or less is even more preferred.
  • the time for pressurization with the plate is preferably 10 seconds or longer, more preferably 50 seconds or longer, further preferably 150 seconds or longer, 250 seconds or longer, from the viewpoint of followability of the thermosetting resin composition layer to the organic EL element substrate. Is even more preferable. From the viewpoint of improving productivity, the time is preferably 1000 seconds or less, more preferably 750 seconds or less, further preferably 500 seconds or less, still more preferably 400 seconds or less, even more preferably 350 seconds or less, and even more preferably 300 seconds. The following are particularly preferred:
  • the lamination is preferably performed under reduced pressure from the viewpoint of suppressing the generation of voids.
  • the degree of vacuum during lamination is preferably 0.001 kPa or more, more preferably 0.003 kPa or more, further preferably 0.005 kPa or more, and even more preferably 0.007 kPa or more from the viewpoint of efficiently performing the lamination process. 0.01 kPa or more is particularly preferable.
  • the degree of vacuum is preferably 0.40 kPa or less, more preferably 0.27 kPa or less, further preferably 0.13 kPa or less, still more preferably 0.11 kPa or less, and 080 kPa or less is particularly preferable, and 0.053 kPa or less is particularly preferable.
  • the arrival time to the predetermined degree of vacuum (hereinafter referred to as “vacuum arrival time”) is preferably 300 seconds or less, more preferably 200 seconds or less, and even more preferably 100, from the viewpoint of suppressing generation of voids. Second or less, more preferably 50 seconds or less, still more preferably 10 seconds or less, particularly preferably 5 seconds or less.
  • lamination can be performed using a vacuum laminator.
  • a vacuum laminating device planar laminating method (vacuum)
  • JE3040B-MVHN manufactured by Joyo Engineering Co., Ltd.
  • Nikko Materials vacuum laminating CVP-300, manufactured by Meiki Seisakusho Vacuum pressure laminator MVLP-500 / 600-II W etc.
  • said vacuum attainment time means the elapsed time from the time of closing a vacuum chamber in a vacuum laminator until the degree of vacuum begins to fall to the time of reaching a predetermined degree of vacuum.
  • a vacuum laminator having a positioning function such as positioning by an image processing function using a CCD camera or the like may be used.
  • a time for alignment is required in the stacking process, the influence of the temperature received by the sealing material becomes larger, and the problem of void generation tends to become more prominent.
  • the method of the present invention is characterized in that the temperature of the first plate is lower than the temperature of the second plate.
  • the temperature of the first plate is set to be 5 ° C. lower than the temperature of the second plate.
  • thermosetting resin composition layer In the lamination of the thermosetting resin composition to the adherend, the adhesiveness to the adherend is exhibited when the thermosetting resin composition layer is melted by heat.
  • the thickness of the thermosetting resin composition layer is less than 20 ⁇ m, the thinner the thickness is, the more the viscosity of the thermosetting resin composition layer increases. It is desirable to suppress an increase in the temperature of the composition layer. For this reason, at the time of lamination in the method of the present invention, the thermosetting resin composition layer is in contact with the surface of the organic EL element substrate in a state where the organic EL element substrate is heated by transferring heat from the plate, and the organic EL element It is desirable to laminate by melting by the heat of the substrate.
  • the second plate on the organic EL element substrate side is preferably set to a temperature at which the thermosetting resin composition layer melts.
  • the first plate on the sealing material side is preferably set to a temperature at which the thermosetting resin composition layer does not melt.
  • a person skilled in the art can confirm the temperature at which the thermosetting resin composition layer melts and the temperature at which the thermosetting resin composition layer does not melt by a simple test method as appropriate. For example, the melt viscosity of the thermosetting resin composition is measured at a constant temperature for 1000 seconds using a dynamic viscoelasticity measuring device such as Rheosol-G3000 manufactured by UBM Co., Ltd.
  • the temperature is specified as “temperature at which the thermosetting resin composition layer melts”, and the viscosity reduction rate is less than 1%. In some cases, the temperature can be specified as “the temperature at which the thermosetting resin composition layer does not melt” (refer to Examples below for specific measurement conditions).
  • Viscosity reduction rate (%) 100 ⁇ (initial melt viscosity (poise) ⁇ melt viscosity after 1000 seconds (poise)) / initial melt viscosity (poise)
  • the temperature of the second plate disposed on the substrate side of the organic EL element substrate is such that the viscosity reduction rate is 1% or more, preferably 2% or more, more preferably 3% or more, further preferably 5% or more, particularly preferably.
  • the temperature can be 10% or more.
  • the temperature of the second plate is preferably 60 ° C or higher, more preferably 65 ° C or higher, and 70 ° C or higher. Is more preferable.
  • the temperature of the second plate is preferably 100 ° C. or lower, more preferably 95 ° C. or lower, and further preferably 90 ° C. or lower.
  • the temperature of the first plate is preferably less than 60 ° C. in a typical embodiment.
  • the temperature of the first plate is more preferably 50 ° C. or less, further preferably 40 ° C. or less, and particularly preferably 30 ° C. or less.
  • the temperature of the first plate can be, for example, 0 ° C. or higher, preferably 5 ° C. or higher, more preferably 10 ° C. or higher.
  • thermosetting process It is preferable to perform the thermosetting process of thermosetting the laminated thermosetting resin composition layer and forming the sealing layer after the laminating process.
  • the method of thermosetting is not particularly limited, and examples thereof include a hot air circulating oven, an infrared heater, a heat gun, a high-frequency induction heating device, and heating with a heat tool.
  • the thermosetting temperature is preferably 120 ° C. or lower, and more preferably 110 ° C. or lower.
  • the temperature of thermosetting shall be 80 degreeC or more from a viewpoint of achieving sufficient hardening.
  • the time for heat curing may be set appropriately so that sufficient curing is achieved, but it is usually 10 minutes to 120 minutes, preferably 20 minutes to 40 minutes.
  • the sealing material used by this invention is not particularly limited as long as a thermosetting resin composition layer having a thickness of less than 20 ⁇ m is formed on a support.
  • the thickness of the thermosetting resin composition layer of the present invention is preferably 18 ⁇ m or less, more preferably 15 ⁇ m or less, even more preferably 13 ⁇ m or less, and even more preferably 10 ⁇ m or less, from the viewpoint of thinning the organic EL element device. Particularly preferably, it is 8 ⁇ m or less.
  • the lower limit is not particularly limited, but from the viewpoint of sealing the organic EL element, the thickness is preferably 1 ⁇ m or more, more preferably 2 ⁇ m or more, and further preferably 3 ⁇ m or more.
  • thermosetting resin composition and the support for example, those described in Patent Document 1 can be used.
  • preferable thermosetting resin compositions and supports will be described in order.
  • thermosetting resin composition constituting the sealing material in the present invention contains a thermosetting resin. Although it does not specifically limit as a thermosetting resin, An epoxy resin is used preferably.
  • the epoxy resin can be used without limitation as long as it has two or more epoxy groups per molecule on average.
  • the epoxy resin include bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, bisphenol F type epoxy resin, and phosphorus containing Epoxy resin, bisphenol S type epoxy resin, aromatic glycidylamine type epoxy resin (eg, tetraglycidyldiaminodiphenylmethane, triglycidyl-p-aminophenol, diglycidyltoluidine, diglycidylaniline, etc.), alicyclic epoxy resin, aliphatic Chain epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, bisphenol A novolac epoxy resin, epoxy resin having butadiene structure
  • the epoxy resin may be liquid or solid, and both liquid epoxy resin and solid epoxy resin may be used.
  • liquid and solid are states of the epoxy resin at normal temperature (25 ° C.). From the viewpoint of coatability, workability, and adhesiveness, it is preferable that at least 10% by mass or more of the entire epoxy resin to be used is liquid.
  • the epoxy equivalent of the epoxy resin is preferably 50 to 5,000 g / eq, more preferably 80 to 2,000 g / eq, and further preferably 100 to 1,500 g / eq.
  • the epoxy equivalent is the number of grams (g / eq) of a resin containing 1 gram equivalent of an epoxy group, and is measured according to the method defined in JIS K 7236.
  • the weight average molecular weight of an epoxy resin is less than 10,000.
  • the content of the epoxy resin in the thermosetting resin composition is preferably 10 to 80% by mass, more preferably 20 to 70% by mass, based on the entire thermosetting resin composition (nonvolatile content). More preferably, it is 30 to 65% by mass.
  • the thermosetting resin composition in the present invention preferably contains a curing agent.
  • the curing agent is not particularly limited as long as it has a function of curing the thermosetting resin composition, but from the viewpoint of suppressing thermal deterioration of a light emitting element such as an organic EL element during the curing treatment of the thermosetting resin composition. It is preferable that the epoxy resin can be cured at a temperature of 140 ° C. or lower, preferably 120 ° C. or lower.
  • the curing agent examples include a primary amine, a secondary amine, a tertiary amine-based curing agent, a polyaminoamide-based curing agent, dicyandiamide, and an organic acid dihydrazide when using an epoxy resin as a thermosetting resin.
  • amine adduct compounds (Amure PN-23, Amicure MY-24, Amicure PN-D, Amicure MY-D, Amicure PN-H, Amicure MY-H, Amicure PN-31, Amicure PN- 40, Amicure PN-40J (all manufactured by Ajinomoto Fine Techno Co., Ltd.), organic acid dihydrazide (Amicure VDH-J, Amicure UDH, Amicure LDH (all manufactured by Ajinomoto Fine Techno Co., Ltd.)) and the like are particularly preferable.
  • an ionic liquid capable of curing the epoxy resin at a temperature of 140 ° C. or lower, preferably 120 ° C. or lower that is, a salt that can melt in a temperature range of 140 ° C. or lower, preferably 120 ° C. or lower, A salt having a curing action can also be used particularly suitably as a curing agent.
  • the ionic liquid is desirably used in a state where it is uniformly dissolved in the epoxy resin, and the ionic liquid is advantageous for improving the moisture resistance of the cured resin. Works.
  • Examples of the cation constituting the ionic liquid include imidazolium ions, piperidinium ions, pyrrolidinium ions, pyrazonium ions, guanidinium ions, pyridinium ions, and other ammonium-based cations; tetraalkylphosphonium cations (for example, tetrabutylphosphonium ions, Phosphonium cations such as tributylhexyl phosphonium ion; and sulfonium cations such as triethylsulfonium ion.
  • anion constituting the ionic liquid examples include halide anions such as fluoride ion, chloride ion, bromide ion and iodide ion; alkyl sulfate anions such as methanesulfonate ion; trifluoromethanesulfonate ion, Fluorine-containing compound anions such as hexafluorophosphonate ion, trifluorotris (pentafluoroethyl) phosphonate ion, bis (trifluoromethanesulfonyl) imide ion, trifluoroacetate ion, tetrafluoroborate ion; phenol ion, 2-methoxy Phenolic anions such as phenol ion and 2,6-di-tert-butylphenol ion; acidic amino acid ions such as aspartate ion and glutamate ion; glycine ion, alan
  • R—CO— is an acyl group derived from a linear or branched fatty acid having 1 to 5 carbon atoms, or a substituted or unsubstituted benzoyl group, and X represents a side chain of an amino acid. Examples thereof include aspartic acid, glutamic acid, glycine, alanine, and phenylalanine.
  • the cation is preferably an ammonium cation or a phosphonium cation, and more preferably an imidazolium ion or a phosphonium ion. More specifically, the imidazolium ion is 1-ethyl-3-methylimidazolium ion, 1-butyl-3-methylimidazolium ion, 1-propyl-3-methylimidazolium ion or the like.
  • the anion is preferably a phenolic anion, an N-acyl amino acid ion or a carboxylic acid anion represented by the formula (1), and more preferably an N-acyl amino acid ion or a carboxylic acid anion.
  • phenolic anion examples include 2,6-di-tert-butylphenol ion.
  • carboxylate anion examples include acetate ion, decanoate ion, 2-pyrrolidone-5-carboxylate ion, formate ion, ⁇ -lipoic acid ion, lactate ion, tartrate ion, hippurate ion, N- Methyl hippurate ion and the like, among which acetate ion, 2-pyrrolidone-5-carboxylate ion, formate ion, lactate ion, tartrate ion, hippurate ion and N-methylhippurate ion are preferable, acetate ion, N -Methyl hippurate ion and formate ion are particularly preferred.
  • N-acylamino acid ion represented by the formula (1) examples include N-benzoylalanine ion, N-acetylphenylalanine ion, aspartate ion, glycine ion, N-acetylglycine ion and the like. N-benzoylalanine ion, N-acetylphenylalanine ion and N-acetylglycine ion are preferable, and N-acetylglycine ion is particularly preferable.
  • Specific ionic liquids include, for example, 1-butyl-3-methylimidazolium lactate, tetrabutylphosphonium-2-pyrrolidone-5-carboxylate, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium tri Fluoroacetate, tetrabutylphosphonium ⁇ -lipoate, tetrabutylphosphonium formate, tetrabutylphosphonium lactate, bis (tetrabutylphosphonium) tartrate, tetrabutylphosphonium hippurate, tetrabutylphosphonium N-methylhippurate, benzoyl-DL -Alanine tetrabutylphosphonium salt, N-acetylphenylalanine tetrabutylphosphonium salt, 2,6-di-tert-butylphenoltetrabutylphospho Um salt,
  • a precursor composed of a cation moiety such as an alkylimidazolium, alkylpyridinium, alkylammonium and alkylsulfonium ions and an anion moiety containing a halogen is added to NaBF 4 , NaPF 6 , CF 3 SO 3
  • the content of the curing agent in the thermosetting resin composition in the present invention is 0.1 to 50% by mass (that is, the resin composition) with respect to the total amount (nonvolatile content) of the thermosetting resin contained in the resin composition.
  • the total amount (nonvolatile content) of the thermosetting resin contained in the product is preferably 0.1 to 50 parts by mass). If the content is less than 0.1% by mass, sufficient curability may not be obtained. If the content is more than 50% by mass, the storage stability of the thermosetting resin composition may be impaired.
  • the quantity is 0.1 with respect to the total amount (nonvolatile content) of an epoxy resin from viewpoints, such as the moisture resistance of the hardened
  • 10% by mass that is, 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the epoxy resin (nonvolatile content) is preferable.
  • a polythiol compound having two or more thiol groups in the molecule together with the ionic liquid may be contained in the thermosetting resin composition. Inclusion of a polythiol compound having two or more thiol groups in the molecule can increase the curing speed.
  • polythiol compound having two or more thiol groups in the molecule include, for example, trimethylolpropane tris (thioglycolate), pentaerythritol tetrakis (thioglycolate), ethylene glycol dithioglycolate, trimethylolpropane tris ( Examples include thiol compounds obtained by esterification reaction of polyols such as ⁇ -thiopropionate), pentaerythritol tetrakis ( ⁇ -thiopropionate), dipentaerythritol poly ( ⁇ -thiopropionate) and mercapto organic acid. It is done.
  • a thiol compound is a thiol compound having two or more thiol groups in the molecule, which does not require the use of a basic substance for production.
  • polythiol compound having two or more thiol groups in the molecule examples include alkyl polythiol compounds such as 1,4-butanedithiol, 1,6-hexanedithiol, 1,10-decanedithiol; terminal thiol group-containing polyether; Examples include a terminal thiol group-containing polythioether; a thiol compound obtained by a reaction between an epoxy compound and hydrogen sulfide; a thiol compound having a terminal thiol group obtained by a reaction between a polythiol compound and an epoxy compound.
  • thiol compounds obtained by reaction of epoxy compounds and hydrogen sulfide, thiol compounds having terminal thiol groups obtained by reaction of polythiol compounds and epoxy compounds, etc. using basic substances as reaction catalysts in the production process
  • dealkalization treatment for example, the polythiol compound to be treated is dissolved in an organic solvent such as acetone or methanol, neutralized by adding an acid such as dilute hydrochloric acid or dilute sulfuric acid, and then desalted by extraction or washing.
  • a method of adsorbing using an ion exchange resin, a method of purification by distillation, and the like are not limited thereto.
  • the ratio of the blend amount of the polythiol compound / SH equivalent to the blend amount of the epoxy resin / epoxy equivalent is 0.2 to 1.2. If this ratio is less than 0.2, sufficient fast curability may not be obtained, while if it is more than 1.2, physical properties of the cured product such as heat resistance may be impaired. From the viewpoint of stabilizing the adhesiveness, this ratio is more preferably 0.5 to 1.0.
  • “SH equivalent” means “molecular weight of polythiol compound / number of SH groups”
  • epoxy equivalent” means “molecular weight of epoxy resin / number of epoxy groups”.
  • the thermosetting resin composition in the present invention may contain a curing accelerator for the purpose of adjusting the curing time.
  • the curing accelerator include organic phosphine compounds, imidazole compounds, amine adduct compounds (for example, epoxy adduct compounds in which a tertiary amine is added to an epoxy resin to stop the reaction, etc.), tertiary amine compounds, and the like.
  • organic phosphine compound include TPP, TPP-K, TPP-S, and TPTP-S (manufactured by Hokuko Chemical Co., Ltd.).
  • imidazole compound examples include Curazole 2MZ, 2E4MZ, C11Z, C11Z-CN, C11Z-CNS, C11Z-A, 2MZOK, 2MA-OK, and 2PHZ (manufactured by Shikoku Kasei Kogyo Co., Ltd.).
  • Specific examples of amine adduct compounds include Fuji Cure (Fuji Kasei Kogyo Co., Ltd.).
  • tertiary amine compound examples include DBU (1,8-diazabicyclo [5.4.0] undec-7-ene), DBU-organic acid salt such as 2-ethylhexanoate and octylate of DBU.
  • the content of the curing accelerator is usually 0.05 to 5% by mass (ie, the total amount (nonvolatile content) of the thermosetting resin contained in the resin composition (that is, The resin composition is used in the range of usually 0.05 to 5 parts by mass with respect to 100 parts by mass of the total amount (nonvolatile content) of the thermosetting resin contained in the resin composition. If it is less than 0.05% by mass, curing tends to be slow and a long thermosetting time is required, and if it exceeds 5% by mass, the storage stability of the thermosetting resin composition tends to decrease.
  • the thermosetting resin composition can contain a coupling agent from the viewpoint of improving the adhesive strength of the thermosetting resin composition.
  • a coupling agent examples include titanium coupling agents, aluminum coupling agents, silane coupling agents, and the like. Among these, a silane coupling agent is preferable.
  • a coupling agent can be used 1 type or in combination of 2 or more types.
  • silane coupling agent examples include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropyl (dimethoxy) methylsilane, and 2- (3,4-epoxycyclohexyl) ethyltrimethoxy.
  • Epoxy silane coupling agents such as silane; mercapto silane coupling agents such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane and 11-mercaptoundecyltrimethoxysilane 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropylto Amino silanes such as methoxysilane, N-methylaminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and N- (2-aminoethyl) -3-aminopropyldimethoxymethylsilane Coupling agents; Ureido silane coupling agents such as 3-
  • the content of the coupling agent in the thermosetting resin composition is preferably 0.5 to 10% by mass with respect to the entire thermosetting resin composition (nonvolatile content). More preferable is 5% by mass. When the content of the coupling agent is outside this range, it is not possible to obtain an effect of improving the adhesion due to the addition of the coupling agent.
  • thermosetting resin composition of the present invention is provided with flexibility to a sealing layer obtained by curing a thermosetting resin composition layer, and a thermosetting resin composition when preparing a sealing material.
  • a thermoplastic resin can be contained.
  • the thermoplastic resin include phenoxy resin, polyvinyl acetal resin, polyimide resin, polyamideimide resin, polyethersulfone resin, polysulfone resin, polyester resin, (meth) acrylic polymer, and the like. Any one of these thermoplastic resins may be used, or two or more thereof may be mixed and used.
  • the thermoplastic resin provides flexibility to the sealing layer obtained by curing the resin composition, coating properties (prevention of repelling) of the thermosetting resin composition varnish when preparing the sealing sheet, etc.
  • the weight average molecular weight is preferably 10,000 or more, more preferably 15,000 or more, and further preferably 20,000 or more.
  • the weight average molecular weight is preferably 1,000,000 or less, more preferably 800,000 or less. .
  • the weight average molecular weight in the present invention is measured by gel permeation chromatography (GPC) method (polystyrene conversion).
  • GPC gel permeation chromatography
  • the weight average molecular weight by the GPC method is LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device, Shodex K-800P / K-804L / K-804L manufactured by Showa Denko KK as a column, and mobile phase. It can be calculated by using a calibration curve of standard polystyrene by measuring at a column temperature of 40 ° C. using chloroform or the like.
  • thermosetting resin composition of the present invention contains a thermoplastic resin
  • the thermoplastic resin is particularly preferably a phenoxy resin among the above-described examples.
  • the phenoxy resin has good compatibility with the epoxy resin, and advantageously acts on the moisture resistance of the thermosetting resin composition.
  • Suitable phenoxy resins include one or more skeletons selected from bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, and the like. The thing which has. One or more phenoxy resins can be used.
  • the epoxy equivalent of the phenoxy resin is preferably 1,000 to 35,000 g / eq, more preferably 2,000 to 25,000 g / eq, More preferably, it is 3,000 to 15,000 g / eq, and particularly preferably 4,000 to 13,000 g / eq.
  • the epoxy equivalent is the number of grams (g / eq) of a resin containing 1 gram equivalent of an epoxy group, and is measured according to the method defined in JIS K 7236.
  • phenoxy resin for example, YX7200B35 (biphenyl skeleton-containing phenoxy resin), 1256 (bisphenol A skeleton-containing phenoxy resin), YX6954BH35 (bisphenolacetophenone skeleton-containing phenoxy resin), etc., manufactured by Mitsubishi Chemical Corporation are preferably used. it can.
  • the content of the thermoplastic resin is preferably 1 to 40% by mass, more preferably 5 to 30% by mass, based on the entire thermosetting resin composition (nonvolatile content).
  • thermosetting resin composition of the present invention contains an inorganic filler from the viewpoint of the moisture barrier property of the resin composition, the coating property (prevention of repelling) of the resin composition varnish when preparing a sealing sheet, and the like.
  • inorganic fillers include hydrotalcite, talc, silica, alumina, barium sulfate, clay, mica, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, boron nitride, and aluminum borate.
  • the particle size of the primary particles of the inorganic filler is preferably 5 ⁇ m or less, and more preferably 3 ⁇ m or less.
  • a primary particle having a particle size of 0.001 to 3 ⁇ m, more preferably 0.005 to 2 ⁇ m can be used.
  • the particle form of the inorganic filler is not particularly limited, and may be a substantially spherical shape, a rectangular parallelepiped shape, a plate shape, a linear shape such as a fiber, or a branched shape.
  • the inorganic filler is preferably hydrotalcite, talc, silica, zeolite, titanium oxide, alumina, zirconium oxide, silicate, mica, mica, magnesium hydroxide, aluminum hydroxide, and more preferably hydrotalcite and talc.
  • hydrotalcite semi-calcined hydrotalcite and calcined hydrotalcite are particularly preferable.
  • One or more inorganic fillers can be used.
  • the content is preferably 30% by mass or less, and 20% by mass or less, based on the entire thermosetting resin composition (nonvolatile content). Is more preferable.
  • the content of the inorganic filler is too large, the viscosity of the composition increases, the wettability to the adherend decreases, the adhesiveness tends to decrease, and the strength of the cured product tends to decrease and becomes brittle. Become. There is no particular limitation on the lower limit of the content of the inorganic filler.
  • the thermosetting resin composition contains an inorganic filler, the content thereof is preferably 5% by mass or more, preferably 10% by mass or more, based on the entire thermosetting resin composition (nonvolatile content). Is more preferable.
  • Hydrotalcite can be classified into unfired hydrotalcite, semi-fired hydrotalcite, and fired hydrotalcite.
  • Unfired hydrotalcite is, for example, a metal hydroxide having a layered crystal structure typified by natural hydrotalcite (Mg 6 Al 2 (OH) 16 CO 3 ⁇ 4 H 2 O), for example, And a layer [Mg 1-X Al X (OH) 2 ] X + serving as a basic skeleton and an intermediate layer [(CO 3 ) X / 2 ⁇ mH 2 O] X- .
  • the hydrotalcite in the present invention is a concept including a hydrotalcite-like compound such as synthetic hydrotalcite. Examples of the hydrotalcite-like compound include those represented by the formula (I) or the formula (II).
  • M 2+ is Mg 2+, a divalent metal ion such as Zn 2+, M 3+ represents a trivalent metal ion such as Al 3+, Fe 3+, A n- is CO 3 2-, Cl - , An NO 3- and the like, and 0 ⁇ x ⁇ 1, 0 ⁇ m ⁇ 1, and n is a positive number.
  • M 2+ is preferably Mg 2+, M 3+ is preferably Al 3+, A n-is preferably CO 3 2-.
  • M 2+ represents a divalent metal ion such as Mg 2+ or Zn 2+
  • a n ⁇ represents an n-valent anion such as CO 3 2 ⁇ , Cl ⁇ , NO 3 ⁇
  • x is 2 or more.
  • Z is a positive number of 2 or less
  • m is a positive number
  • n is a positive number.
  • M 2+ is preferably Mg 2+, A n-is preferably CO 3 2-.
  • Semi-calcined hydrotalcite refers to a metal hydroxide obtained by firing hydrotalcite and having a layered crystal structure in which the amount of interlayer water is reduced or eliminated.
  • the “interlayer water” refers to “H 2 O” described in the composition formulas of the natural hydrotalcite and the hydrotalcite-like compound described above using a composition formula.
  • calcined hydrotalcite refers to a metal oxide having an amorphous structure obtained by calcining hydrotalcite or semi-calcined hydrotalcite, and not only interlayer water but also hydroxyl groups disappeared by condensation dehydration.
  • BET specific surface area of preferably hydrotalcite used in the present invention is preferably 1 ⁇ 250m 2 / g, more preferably 5 ⁇ 200m 2 / g.
  • the BET specific surface area of hydrotalcite is calculated according to the BET method by adsorbing nitrogen gas on the sample surface using a specific surface area measuring device (Macsorb HM Model-1210 manufactured by Mountec Co., Ltd.) and using the BET multipoint method. It is obtained by doing.
  • the average particle size of the hydrotalcite preferably used in the present invention is preferably 1 to 1000 nm, more preferably 10 to 800 nm.
  • the average particle size of the semi-calcined hydrotalcite is obtained by the median diameter of the particle size distribution when the particle size distribution is prepared on a volume basis by laser diffraction scattering type particle size distribution measurement (JIS Z 8825).
  • the semi-fired hydrotalcite in the present invention include, for example, “DHT-4C” (manufactured by Kyowa Chemical Industry Co., Ltd.) (average particle size: 400 nm, BET specific surface area: 15 m 2 / g), “DHT-4A-2” (Kyowa Chemical Industry Co., Ltd.): calcined hydrotalcite (average particle size: 400 nm, BET specific surface area: 10 m 2 / g), “KW-2200” (Kyowa Chemical Industry Co., Ltd.) (average particle size: 400 nm, BET Specific surface area: 146 m 2 / g).
  • talc may be blended for improving the moisture resistance and adhesion of the thermosetting resin composition.
  • talc is blended, it is preferably 0 to 30% by mass, more preferably 0.5 to 25% by mass, and still more preferably 1 to 20% by mass based on the entire resin composition (nonvolatile content).
  • talc “FG-15” (average particle size: 1.4 ⁇ m), “D-1000” (average particle size: 1.0 ⁇ m), “D-600” (average particle size: 0.6 ⁇ m) manufactured by Nippon Talc Co., Ltd. Etc.
  • thermosetting resin composition in the present invention may further contain other additives.
  • additives include organic fillers such as rubber particles, silicone powder, nylon powder, and fluororesin powder; thickeners such as olben and benton; silicone-based, fluorine-based, and polymer-based antifoaming agents. Or a leveling agent; Adhesion imparting agents, such as a triazole compound, a thiazole compound, a triazine compound, and a porphyrin compound;
  • thermosetting resin composition of the present invention is layered on a support
  • a thermosetting resin composition in which the thermosetting resin composition is dissolved in an organic solvent It can be produced by preparing a varnish, applying the varnish on a support, and further drying the varnish applied by heating or blowing hot air to form a thermosetting resin composition layer. .
  • a varnish is prepared by further adding a solvent or the like, if necessary, using a kneading roller or a rotary mixer.
  • organic solvent examples include ketones such as acetone, methyl ethyl ketone (hereinafter abbreviated as “MEK”), cyclohexanone, and acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate.
  • ketones such as acetone, methyl ethyl ketone (hereinafter abbreviated as “MEK”), cyclohexanone, and acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate.
  • Carbitols such as cellosolve and butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone and the like.
  • Drying conditions are not particularly limited, but usually about 50 to 100 ° C. and about 3 to 15 minutes are preferable.
  • those not generally incorporated into the organic EL device include polyolefins such as polyethylene, polypropylene and polyvinyl chloride, polyethylene terephthalate (hereinafter sometimes abbreviated as “PET”), polyethylene.
  • PET polyethylene terephthalate
  • plastic films such as polyester such as naphthalate, polycarbonate, and polyimide.
  • PET is particularly preferable.
  • the support may be a metal foil such as an aluminum foil, a stainless steel foil, or a copper foil.
  • the support may be subjected to a release treatment in addition to a mat treatment and a corona treatment. Examples of the release treatment include a release treatment with a release agent such as a silicone resin release agent, an alkyd resin release agent, and a fluororesin release agent.
  • the support used for the sealing material is preferably a glass substrate or a moisture-proof film.
  • a moisture-proof layer and a circularly polarizing plate, a color filter or a touch panel on the organic EL device, a circularly polarizing plate, a color filter or a touch panel may be provided on the surface opposite to the resin composition layer.
  • a circularly polarizing plate is generally composed of a polarizing plate and a quarter-wave plate, and the quarter-wave plate of the circularly polarizing plate is disposed in the resin composition layer.
  • the generation of voids at the time of lamination becomes a more prominent problem, especially when the support is a rigid substrate such as a glass substrate, and the followability during melting of the thermosetting resin composition layer tends to decrease.
  • the moisture-proof film is preferably a film having a substrate and a barrier layer.
  • the substrate means a portion other than the barrier layer in the moisture-proof film.
  • the substrate may be a single layer film or a laminated film.
  • the base material include polyolefins such as polyethylene and polypropylene (PP), polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI), cycloolefin polymer (COP), Examples thereof include plastic films such as polyvinyl chloride. Only one type of plastic film may be used, or two or more types may be used.
  • the substrate is preferably a polyethylene terephthalate film, a cycloolefin polymer film, a polyethylene naphthalate film or a polycarbonate film, more preferably a polyethylene terephthalate film or a cycloolefin polymer film.
  • the thickness of the substrate (when the substrate is a laminated film, the total thickness) is preferably 10 to 100 ⁇ m, more preferably 12.5 to 75 ⁇ m, and even more preferably 12.5 to 50 ⁇ m.
  • the barrier layer examples include inorganic films such as metal foil (eg, aluminum foil), silica vapor deposition film, silicon nitride film, and silicon oxide film.
  • the barrier layer may be composed of a plurality of layers of a plurality of inorganic films (for example, a metal foil and a silica deposited film).
  • the barrier layer may be composed of an organic material and an inorganic material, or may be a composite multilayer of an organic layer and an inorganic film.
  • the thickness of the barrier layer is preferably 0.01 to 100 ⁇ m, more preferably 0.05 to 50 ⁇ m, still more preferably 0.05 to 30 ⁇ m.
  • an inorganic film such as silicon oxide (silica), aluminum oxide, magnesium oxide, silicon nitride, silicon nitride oxide, SiCN, amorphous silicon, or the like is formed on the substrate surface by chemical vapor deposition (for example, heat , Plasma, ultraviolet, vacuum heat, chemical vapor deposition by vacuum plasma or vacuum ultraviolet), or physical vapor deposition (eg, vacuum deposition, sputtering, ion plating, laser deposition, molecular beam epitaxy) ) And the like can be mentioned (for example, Japanese Patent Application Laid-Open No. 2016-185705, Japanese Patent No. 5719106, Japanese Patent No. 5712509, and Japanese Patent No. 5292358). (See publications).
  • the moisture-proof film manufactured by such a method becomes a film having transparency.
  • the moisture-proof film may be a film obtained by laminating a metal foil and a plastic film.
  • commercially available products of polyethylene terephthalate film with aluminum foil include “PET Tsuki AL1N30” manufactured by Tokai Toyo Aluminum Sales Co., “PET Tsuki AL3025” manufactured by Fukuda Metals.
  • the thickness of the support is not particularly limited, but is preferably 20 to 200 ⁇ m, more preferably 20 to 125 ⁇ m, from the viewpoint of handleability and the like.
  • the surface opposite to the support body side of a thermosetting resin composition layer may be protected by the protective film.
  • the protective film is peeled off from the sealing material before lamination.
  • the protective film is preferably a plastic film similar to the support. Further, the protective film may be subjected to a release treatment in addition to the mat treatment and the corona treatment.
  • the thickness of the protective film is not particularly limited, but is usually 1 to 150 ⁇ m, preferably 10 to 100 ⁇ m.
  • the organic EL element substrate is an organic EL element formed on a substrate.
  • substrate used for an organic EL element substrate is not specifically limited, A well-known thing can be used.
  • the substrate is preferably at least one selected from the group consisting of glass, polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), and cycloolefin polymer (COP).
  • the thickness of the substrate in the organic EL element substrate is preferably 0.1 to 1.0 mm, more preferably 0.1 to 0.7 mm.
  • the thickness of the organic EL element is usually 0.01 to 1 ⁇ m, preferably 0.05 to 0.5 ⁇ m.
  • the substrate of the organic EL element substrate or the support of the sealing material is transparent.
  • an opaque support for example, a plastic film having an opaque barrier layer
  • ⁇ Production Example 1 Production of Sealant A> 56 parts by mass of liquid bisphenol A type epoxy resin (“jER828EL” manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 185 g / eq), 1.2 parts by mass of silane coupling agent (“KBM403” manufactured by Shin-Etsu Chemical Co., Ltd.), talc After mixing 2 parts by mass of powder (“FG15” manufactured by Nippon Talc Co., Ltd.) and 15 parts by mass of calcined hydrotalcite (“KW2200” manufactured by Kyowa Chemical Industry Co., Ltd.), the mixture was dispersed in a three-roll mill to obtain a mixture. .
  • liquid bisphenol A type epoxy resin (“jER828EL” manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 185 g / eq)
  • KBM403 silane coupling agent manufactured by Shin-Etsu Chemical Co., Ltd.
  • talc After mixing 2 parts by mass of powder (“FG15” manufactured by Nippon Talc Co., Ltd.)
  • the ionic liquid curing agent was obtained by the following method. To 20.0 g of tetrabutylphosphonium hydroxide aqueous solution (Hokuko Chemical Co., Ltd., concentration: 41.4% by mass), 3.54 g of N-acetylglycine (Tokyo Chemical Industry Co., Ltd.) was added at 0 ° C. and stirred for 10 minutes. did. The pressure was reduced to 40-50 mmHg using an evaporator, and the mixture was concentrated at 60-80 ° C. for 2 hours and at 90 ° C. for 5 hours.
  • tetrabutylphosphonium hydroxide aqueous solution Hokuko Chemical Co., Ltd., concentration: 41.4% by mass
  • N-acetylglycine Tokyo Chemical Industry Co., Ltd.
  • thermosetting resin composition varnish was dried on a polyethylene terephthalate film (hereinafter abbreviated as “PET film”) (thickness: 38 ⁇ m) treated with an alkyd release agent.
  • PET film polyethylene terephthalate film
  • the resin composition layer was uniformly applied with a die coater so as to have a thickness of 15 ⁇ m, and dried at 80 ° C. for 5 minutes (residual solvent amount in the thermosetting resin composition layer: about 2 mass%).
  • a 38 ⁇ m-thick polyethylene terephthalate film treated with an alkyd mold release agent was wound into a roll while being bonded to the surface of the thermosetting resin composition layer.
  • the roll-shaped sealing material was slit to a width of 400 mm to obtain a sealing material A having a size of 400 ⁇ 300 mm.
  • the layer structure of the sealing material A is PET film / thermosetting resin composition layer / PET film. The same applies to the layer configurations of sealing materials B and C described later.
  • ⁇ Production Example 2 Production of Sealant B> A sealing material B was produced in the same manner as in Production Example 1 except that the thickness of the thermosetting resin composition layer after drying was 10 ⁇ m.
  • sealing materials 1 to 3 using a glass substrate as a support Smooth glass substrate (manufactured by Partec Co., Ltd., product name “test piece”, material soda glass, thickness 0.7 mm, length 100 mm, width 100 mm
  • the sealing materials 1 to 3 having a support as a support were produced as follows.
  • the glass substrate was temporarily fixed on a stainless steel (SUS) plate having a thickness of 0.8 mm.
  • the protective film is peeled off from the sealing material A, the thermosetting resin composition layer is disposed on the glass substrate side, and a pressure-type vacuum laminator (manufactured by Nichigo Morton, MODEL: V160) is used, and the lamination temperature is 80 ° C., vacuum Using an arrival time of 30 seconds (degree of vacuum of 5 Pa), pressurization pressure of 0.3 MPa, pressurization time of 30 seconds, and atmospheric pressure in the atmosphere, laminating them, peeling the stainless steel plate, A sealing material 1 (thermosetting resin composition layer having a thickness of 15 ⁇ m) having a substrate as a support was produced.
  • SUS stainless steel
  • the sealing material 2 is manufactured from the sealing material B (thermosetting resin composition layer having a thickness of 10 ⁇ m), and further the sealing material C (thermosetting resin composition layer).
  • the sealing material 3 was manufactured from a thickness of 5 ⁇ m).
  • the layer structure of these sealing materials is glass substrate / thermosetting resin composition layer / PET film.
  • the PET film serves as a protective film in the present invention
  • the glass substrate serves as a support in the present invention.
  • thermosetting resin composition layer / PET film laminate (2) Measurement of melting temperature From each of the two sealing materials C, one PET film was peeled off to obtain a thermosetting resin composition layer / PET film laminate. These two laminates (thermosetting resin composition layer / PET film) were placed on the hot plate so that the PET film was in contact with the hot plate. On a hot plate at 60 ° C., the two laminates are warmed, these thermosetting resin composition layers are bonded together, and after cooling, only one of the outer PET films is peeled off to form a thermosetting resin composition. A curable resin composition layer / PET film laminate having an increased layer thickness was obtained.
  • thermosetting resin composition is sized to enter a molding machine (cylinder having a diameter of 19 mm) and has a weight of 1 g.
  • the processed thermosetting resin composition was placed in a molding machine, and a pressure of 10 to 20 MPa was applied for 1 minute with a hydraulic pump to produce a pellet-shaped sample for melting temperature measurement (1 g).
  • the sample for melting temperature measurement prepared above was used with a parallel plate having a diameter of 1.8 mm, and a gap height of 2
  • the melt viscosity was measured for 1000 seconds under the measurement conditions of 3 mm, a constant temperature of 60 ° C., a measurement time interval of 1 second, a vibration of 1 Hz, and a strain of 1 deg.
  • the initial melt viscosity was 164309 poise, and the melt viscosity after 1000 seconds was 159985 poise (viscosity reduction rate 2.8%), so 60 ° C. was specified as the “temperature at which the thermosetting resin composition layer melts”.
  • the melt viscosity was measured in exactly the same manner as described above, using the same melt temperature measurement sample (1 g) except that the measurement temperature was 50 ° C. Since the initial viscosity was 638000 poise and the viscosity after 1000 seconds was 666000 poise (viscosity reduction rate ⁇ 4.4%), 50 ° C. was specified as “the temperature at which the thermosetting resin composition layer does not melt”.
  • Lamination on a smooth glass substrate tends to make it difficult for air bubbles to escape even when laminated under reduced pressure using a vacuum laminator, and in the lamination process, the risk of void formation due to the progress of curing of the thermosetting resin composition is easily evaluated. I think it can be done.
  • a sealing device with a glove box manufactured by Joyo Engineering Co., Ltd., plane bonding type (vacuum) type JE3040B-MVHN
  • the first plate disposed on the support (glass substrate) side of the sealing material is a metal plate (material: aluminum), and the organic EL element substrate
  • the second plate arranged on the model (glass substrate) side is a ceramic plate.
  • the first plate (metal plate) of the apparatus in which the sealing material (laminated body of glass substrate / thermosetting resin composition layer) from which the protective film (PET film) was peeled off was set to the temperatures shown in Tables 1 to 3
  • the organic EL element substrate model (glass substrate) was fixed to the second plate (ceramic plate) set to the temperatures shown in Tables 1 to 3 by static electricity.
  • the mark attached to the model of the organic EL element substrate (glass substrate) is brought close to 3 mm between the sealing material (glass substrate / thermosetting resin composition layer) and the model of the organic EL element substrate (glass substrate). While confirming with a CCD camera, the marks were aligned with the X, Y, and ⁇ adjustment jigs attached to the second plate (ceramic plate).
  • Thermosetting of the sealing material by raising the ceramic plate at a stage where the degree of vacuum is 45 Pa or less in a nitrogen atmosphere (vacuum arrival time: about 200 seconds).
  • the functional resin composition layer and an organic EL element substrate model were brought into contact with each other and pressed. After the pressing pressure reached 2.55 kgf / cm 2 , lamination was performed under the condition of holding for 300 seconds.
  • thermosetting resin layer was thermally cured on a hot plate at 110 ° C. for 30 minutes to form a sealing layer (cured product layer), and a void evaluation laminated sample was manufactured.
  • void exists between the sealing layer (cured material layer) and the model of the organic EL element substrate (glass plate) in the laminated sample for void evaluation by visual observation and an optical microscope (150 times magnification). Whether or not to do so was observed and evaluated according to the following criteria. ⁇ : Good (void cannot be confirmed with an optical microscope) ⁇ : Acceptable (Voids cannot be confirmed visually, but voids can be confirmed with an optical microscope) ⁇ : Impossible (visible voids can be confirmed visually)
  • Table 1 shows the temperatures of the first and second plates and the evaluation results of the voids when the sealing material 1 (thermosetting resin composition layer thickness: 15 ⁇ m) is used.
  • Table 2 shows the temperatures of the first and second plates and the evaluation results of the voids when the sealing material 2 (thermosetting resin composition layer thickness 10 ⁇ m) is used.
  • Table 3 shows the temperatures of the first and second plates and the evaluation results of the voids when the sealing material 3 (the thickness of the thermosetting resin composition layer is 5 ⁇ m) is used.
  • thermosetting resin composition layer is melted and laminated by the heat of the organic EL element substrate.
  • the temperature is too high at that time, the thermosetting progresses and the meltability is lowered, and bubbles tend to stick. Estimated.
  • the temperature is too low, the meltability of the thermosetting resin composition layer becomes low or does not melt, so that the risk of void generation increases.
  • the method of the present invention is useful for manufacturing an organic EL device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne un procédé de production d'un corps étanche dans lequel un élément électroluminescent (EL) organique sur un substrat est scellé au moyen d'une couche d'étanchéité. Ce procédé de production d'un corps étanche est caractérisé en ce qu'il comprend une étape de stratification pour stratifier un matériau d'étanchéité, une couche de composition de résine thermodurcissable ayant une épaisseur inférieure à 20 µm étant formée sur un corps de support, et un substrat d'élément électroluminescent organique, un élément EL organique étant formé sur un substrat, l'un sur l'autre de telle sorte que la couche de composition de résine thermodurcissable est en contact avec l'élément EL organique par application d'une pression sur le matériau d'étanchéité et sur le substrat d'élément EL organique entre deux plaques. Ce procédé de production d'un corps étanche est également caractérisé en ce que la température d'une première plaque qui est disposée sur le côté corps de support du matériau d'étanchéité est inférieure à la température d'une seconde plaque qui est disposée sur le côté substrat du substrat d'élément électroluminescent organique.
PCT/JP2018/019565 2017-05-23 2018-05-22 Procédé de production d'un corps étanche Ceased WO2018216670A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019520251A JP7268596B2 (ja) 2017-05-23 2018-05-22 封止体の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-101815 2017-05-23
JP2017101815 2017-05-23

Publications (1)

Publication Number Publication Date
WO2018216670A1 true WO2018216670A1 (fr) 2018-11-29

Family

ID=64395673

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/019565 Ceased WO2018216670A1 (fr) 2017-05-23 2018-05-22 Procédé de production d'un corps étanche

Country Status (3)

Country Link
JP (1) JP7268596B2 (fr)
TW (1) TW201901995A (fr)
WO (1) WO2018216670A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010084938A1 (fr) * 2009-01-23 2010-07-29 味の素株式会社 Composition de résine
JP2010211983A (ja) * 2009-03-09 2010-09-24 Seiko Epson Corp 有機エレクトロルミネッセンス装置、その製造方法および電子機器
JP2014154507A (ja) * 2013-02-13 2014-08-25 Mitsubishi Chemicals Corp 有機エレクトロルミネッセンス発光装置、有機ｅｌ表示装置及び有機ｅｌ照明
WO2016039237A1 (fr) * 2014-09-08 2016-03-17 コニカミノルタ株式会社 Élément fonctionnel et procédé de production d'élément fonctionnel
JP2016520138A (ja) * 2013-07-19 2016-07-11 エルジー・ケム・リミテッド 封止組成物
JP2017016957A (ja) * 2015-07-03 2017-01-19 ランテクニカルサービス株式会社 基板接合体及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010084938A1 (fr) * 2009-01-23 2010-07-29 味の素株式会社 Composition de résine
JP2010211983A (ja) * 2009-03-09 2010-09-24 Seiko Epson Corp 有機エレクトロルミネッセンス装置、その製造方法および電子機器
JP2014154507A (ja) * 2013-02-13 2014-08-25 Mitsubishi Chemicals Corp 有機エレクトロルミネッセンス発光装置、有機ｅｌ表示装置及び有機ｅｌ照明
JP2016520138A (ja) * 2013-07-19 2016-07-11 エルジー・ケム・リミテッド 封止組成物
WO2016039237A1 (fr) * 2014-09-08 2016-03-17 コニカミノルタ株式会社 Élément fonctionnel et procédé de production d'élément fonctionnel
JP2017016957A (ja) * 2015-07-03 2017-01-19 ランテクニカルサービス株式会社 基板接合体及びその製造方法

Also Published As

Publication number Publication date
JPWO2018216670A1 (ja) 2020-03-26
JP7268596B2 (ja) 2023-05-08
TW201901995A (zh) 2019-01-01

Similar Documents

Publication Publication Date Title
JP5601202B2 (ja) 樹脂組成物
KR102244167B1 (ko) 봉지용 수지 조성물 및 봉지용 시트
KR102121724B1 (ko) 필름
JP7120017B2 (ja) 封止用の樹脂組成物および封止用シート
WO2015068787A1 (fr) Composition de resine d'etancheite contenant de l'hydrotalcite et feuille d'etancheite
CN108495894B (zh) 密封用的热固性树脂组合物及密封用片材
WO2010084938A1 (fr) Composition de résine
JP6992635B2 (ja) 樹脂組成物
JP6572887B2 (ja) 封止体の製造方法
JP6428432B2 (ja) 封止用シート、その製造方法および評価方法
JP2016180036A (ja) 封止用樹脂組成物及び封止用シート
JP7268596B2 (ja) 封止体の製造方法
JP7552753B2 (ja) 被着体の接着方法
JP2025111818A (ja) 樹脂組成物および熱硬化型接着シート

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18806068

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019520251

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18806068

Country of ref document: EP

Kind code of ref document: A1