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WO2018214245A1 - 一种散热结构及显示装置 - Google Patents

一种散热结构及显示装置 Download PDF

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Publication number
WO2018214245A1
WO2018214245A1 PCT/CN2017/091884 CN2017091884W WO2018214245A1 WO 2018214245 A1 WO2018214245 A1 WO 2018214245A1 CN 2017091884 W CN2017091884 W CN 2017091884W WO 2018214245 A1 WO2018214245 A1 WO 2018214245A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
heat
conductive sheet
chip
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/091884
Other languages
English (en)
French (fr)
Inventor
程加河
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Original Assignee
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HKC Co Ltd, Chongqing HKC Optoelectronics Technology Co Ltd filed Critical HKC Co Ltd
Priority to US16/338,523 priority Critical patent/US10537047B2/en
Publication of WO2018214245A1 publication Critical patent/WO2018214245A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component

Definitions

  • the present application relates to the field of display technologies, and in particular, to a heat dissipation structure and a display device.
  • Embodiments of the present application provide a heat dissipation structure and a display device, which are intended to improve the chip heat dissipation problem of a flexible circuit board of a display device.
  • a heat dissipation structure for use in a display device, the heat dissipation structure comprising:
  • circuit board disposed on the back board, the circuit board is provided with a first contact area and a second contact area connected to the first contact area, the second contact area is further in contact with the backplane;
  • a heat conducting sheet having a first end attached to a chip of the flexible circuit board of the display device, and a second end attached to the first contact area for conducting heat of the chip to the circuit board and Backboard.
  • the first contact region and the second contact region are oppositely disposed on both sides of the circuit board, and are connected by via holes.
  • the heat conducting sheet is provided with a through hole; the heat dissipation structure further includes:
  • the fixing member abuts against the back plate through the through hole and the through hole for fixing the heat conductive sheet.
  • the first end of the thermal conductive sheet is attached to the chip of the flexible circuit board by a double-sided thermal conductive adhesive; the second end of the thermal conductive sheet is bonded by a double-sided thermal conductive adhesive The first contact zone.
  • the first contact region and the second contact region are both exposed areas.
  • the heat conductive sheet includes an aluminum foil heat conductive sheet, a copper foil heat conductive sheet or a graphene heat conductive sheet.
  • a display device comprising:
  • circuit board disposed on the back board, the circuit board is provided with a first contact area and a second contact area connected to the first contact area, and the second contact area is in contact with the backplane;
  • a flexible circuit board provided with a chip for connecting the display panel and the circuit board;
  • the heat conducting sheet has a first end attached to the chip and a second end attached to the first contact area for conducting heat of the chip to the circuit board and the back board.
  • the first contact region and the second contact region are oppositely disposed on both sides of the circuit board, and are connected by via holes.
  • the heat conducting sheet is provided with a through hole;
  • the heat dissipating structure further includes:
  • the fixing member abuts against the back plate through the through hole and the through hole for fixing the heat conductive sheet.
  • the first end of the thermal conductive sheet is attached to the chip of the flexible circuit board by a double-sided thermal conductive adhesive; the second end of the thermal conductive sheet is bonded by a double-sided thermal conductive adhesive In the first contact zone.
  • the embodiment of the present application provides a heat dissipation structure and a display device, wherein the heat dissipation structure includes: a back plate, a circuit board, and a heat conductive sheet; the circuit board is disposed on the back board, and the circuit board is provided with a first contact area and a second contact region connected to the first contact region, and the second contact region is in contact with the backplane; a first end of the thermal conductive sheet attached to the chip of the flexible circuit board of the display device, The second end is attached to the first contact area for conducting heat of the chip to the circuit board and the back board.
  • the heat dissipation structure is formed by the heat conductive sheet, the circuit board and the back plate, and the heat dissipation structure serves as an auxiliary heat dissipation for the chip of the flexible circuit board, thereby reducing the temperature of the chip and thereby improving the service life thereof.
  • FIG. 1 is a schematic cross-sectional structural view of a heat dissipation structure provided by an embodiment of the present application
  • FIG. 2 is a schematic view showing a mounting structure of a heat dissipation structure according to an embodiment of the present application
  • FIG. 3 is a schematic exploded view of a heat dissipation structure according to an embodiment of the present application.
  • FIG. 4 is another schematic diagram of a mounting structure of a heat dissipation structure provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a display device according to an embodiment of the present application.
  • FIG. 1 is a cross-sectional structural diagram of a heat dissipation structure according to an embodiment of the present application.
  • the heat dissipation structure can be specifically mounted on the display device for dissipating heat from the chip of the display device.
  • the heat dissipation structure includes a back plate 11 , a circuit board 12 , and a heat conductive sheet 13 .
  • the back panel 11 is used to mount the display panel 21 of the display device and the circuit board 12, wherein the display panel 21 and the circuit board 12 are connected by at least one flexible circuit board 22.
  • a chip 220 is disposed on the flexible circuit board 22.
  • the chip 220 is a driving chip for driving the display panel 21 to operate according to a control signal on the circuit board.
  • the circuit board 12 includes a first contact region 121 and a second contact region 122.
  • the first contact region 121 is connected to the second contact region 12 for conducting signals, such as for conducting current or heat.
  • the circuit board 12 can be, for example, a printed circuit board, and the first contact area 121 and the second contact area 122 are disposed on a surface of the printed circuit board.
  • the first contact region 121 and the second contact region 122 are specifically metal contact regions, which are disposed on the surface of the printed circuit board by deposition or the like.
  • the first end of the heat conducting sheet 13 is attached to the chip 220 of the flexible circuit board 22, and the second end of the heat conducting sheet 13 is attached to the first contact area 121 of the circuit board 12.
  • the effect of the attaching is as shown in FIG. 2.
  • One end of the heat conducting sheet 13 is attached and wrapped around the chip 220 of the flexible circuit board 22, so that one end of the heat conducting sheet 13 is sufficiently in contact with the chip 220 on the flexible circuit board 22.
  • the other end of the heat conducting sheet 13 is attached to the first contact region 121 of the circuit board 12, thereby forming a heat dissipation channel structure through the heat conductive sheet 13, the first contact region 121 of the circuit board, and the second contact region 122 to the backing plate 11,
  • the heat dissipation channel structure is used to conduct heat generated when the chip 220 on the flexible circuit board 22 operates to the circuit board 12 and the back board 11, thereby accelerating the heat dissipation speed of the chip 220 on the flexible circuit board 22.
  • the flexible circuit board 22 can be, for example, COF (Chip On Flex, or, Chip On).
  • Film called a flip chip, has a chip on the flip chip, that is, a driver IC chip.
  • the driving IC chip generates a certain amount of heat when driving the display device, especially the driving IC chip of the high-end product, because of its large calculation amount, a large amount of heat is generated, and if the heat is not dissipated in time, the temperature of the driving IC chip is easily caused. Too high, affecting its working performance, in severe cases, it will burn out the driver IC chip and reduce its service life.
  • the heat dissipation structure forms a heat dissipation channel structure through the back plate 11, the circuit board 12, and the heat conductive sheet 13, and is used for dissipating heat of the chip of the flexible circuit board, thereby reducing the temperature of the chip and thereby improving the service life thereof. That is, high-end products, using high-performance chips, the heat dissipation structure can also effectively reduce the temperature of the chip to ensure its normal operation.
  • the first end portion of the heat conductive sheet 13 (ie, the end portion contacting the chip of the flexible circuit board) has a larger size than the second end portion (ie, the end portion in contact with the circuit board).
  • the size is added to increase the heat dissipation effect.
  • both ends of the thermally conductive sheet 13 may not be limited.
  • the first end of the thermal conductive sheet 13 is attached to the chip 220 of the flexible circuit board 22 by a double-sided thermal conductive adhesive; the second end of the thermal conductive sheet 13 is bonded to the first contact by a double-sided thermal conductive adhesive.
  • the double-sided thermal paste is used not only for fixed connections but also for conducting heat.
  • the attachment connection can also be made by other means. Or, attach it with other thermal adhesive.
  • the first contact region 121 and the second contact region 122 of the circuit board 12 are oppositely disposed on both sides of the circuit board 12, and the first contact region 121 and the second contact region 122 pass through the via hole. connection.
  • the first contact region 121 and the second contact region 122 of the circuit board 12 are connected by a via 120.
  • the first contact region 121 and the second contact region 122 of the circuit board 12 are all exposed copper regions, and the via holes 120 are copper holes.
  • the first contact region 121 and the second contact region 122 may also be subjected to a related process to accelerate heat conduction. For example, coating a heat conductive material, such as coating graphene, or silver plating.
  • the display panel and the circuit board 12 are oppositely disposed on opposite sides of the backboard 11, and in other embodiments, they may be disposed on the same side of the backplane 11.
  • the heat conducting sheet 13 is provided with a through hole 130.
  • one end of the heat conducting sheet 13 is provided with a through hole 130 corresponding to the through hole 120 when the heat conducting sheet 13 and the circuit board 12 are attached and mounted.
  • the heat dissipating structure further includes a fixing member 14.
  • the fixing member 14 can be, for example, a fixing screw, and the fixing screw can be a metal screw with good thermal conductivity for fixing the thermal conductive sheet 13 and transferring heat.
  • the fixing member 14 abuts the back plate 11 through the through hole 130 and the through hole 120 for fixing the heat conductive sheet 13 and conducting heat on the heat conductive sheet 13 to the back plate 11.
  • the thermal conductive sheet 13 includes, but is not limited to, an aluminum foil thermal conductive sheet, a copper foil thermal conductive sheet, or a graphene thermally conductive sheet.
  • the thickness of the heat conductive sheet is not limited.
  • FIG. 4 is a partial view of the heat dissipation structure.
  • the backboard 11 is used to mount the display panel and the circuit board 22, and the display panel can be mounted on the backboard 11 by snapping or pasting; the circuit board 22 can be mounted on the backboard 11 by screws.
  • the display panel and the circuit board 22 are connected by at least one flexible circuit board 22. Therefore, it can be understood that each of the flexible circuit boards 22 is provided with the heat dissipation structure on the chip, so that one display panel includes a plurality of heat dissipation.
  • the structure in which the heat dissipation structure shares the same back plate 11 and the circuit board 12.
  • FIG. 5 is a schematic structural diagram of a display device according to an embodiment of the present application.
  • the display device includes the heat dissipation structure in the above embodiment.
  • the display device 20 includes a back plate 11, a circuit board 12, a heat conductive sheet 13 and a flexible circuit board 22, and a display panel (not shown).
  • the display panel is disposed on the backplane 11; the circuit board 12 is also disposed on the backplane 11.
  • the display panel and the circuit board 12 are oppositely disposed on both sides of the backplane 11 to save space of the display device.
  • the flexible circuit board 22 is provided with one end portion of the back board 11 and is provided with a chip for connecting the display panel and the circuit board. Specifically, the gate line or the data line of the array substrate of the display panel is passed through the flexible circuit. A board is connected to the circuit board.
  • the chip 220 is a driving chip for driving the display panel 21 to operate according to a control signal on the circuit board.
  • the circuit board 12 includes a first contact area 121 and a second contact area 122.
  • the first contact region 121 is connected to the second contact region 12 for conducting signals, such as for conducting current or heat.
  • the circuit board 12 can be, for example, a printed circuit board, and the first contact area 121 and the second contact area 122 are disposed on a surface of the printed circuit board.
  • the first contact region 121 and the second contact region 122 are specifically metal contact regions, which are disposed on the surface of the printed circuit board by deposition or the like.
  • the first end of the heat conducting sheet 13 is attached to the chip 220 of the flexible circuit board 22, and the second end of the heat conducting sheet 13 is attached to the first contact area 121 of the circuit board 12.
  • the effect of the attaching is as shown in FIG. 2.
  • One end of the heat conducting sheet 13 is attached and wrapped around the chip 220 of the flexible circuit board 22, so that one end of the heat conducting sheet 13 is sufficiently in contact with the chip 220 on the flexible circuit board 22.
  • the other end of the heat conducting sheet 13 is attached to the first contact region 121 of the circuit board 12, thereby forming a heat dissipation channel structure through the heat conductive sheet 13, the first contact region 121 of the circuit board, and the second contact region 122 to the backing plate 11,
  • the heat dissipation channel structure is used to conduct heat generated when the chip 220 on the flexible circuit board 22 operates to the circuit board 12 and the back board 11, thereby accelerating the heat dissipation speed of the chip 220 on the flexible circuit board 22.
  • the flexible circuit board 22 can be, for example, COF (Chip On Flex, or, Chip On).
  • Film called a flip chip, has a chip on the flip chip, that is, a driver IC chip.
  • the driving IC chip generates a certain amount of heat when driving the display device, especially the driving IC chip of the high-end product, because of its large calculation amount, a large amount of heat is generated, and if the heat is not dissipated in time, the temperature of the driving IC chip is easily caused. Too high, affecting its working performance, in severe cases, it will burn out the driver IC chip and reduce its service life.
  • the heat dissipation structure forms a heat dissipation channel structure through the cooperation of the back board 11, the circuit board 12 and the heat conductive sheet 13, and is used for dissipating heat of the chip of the flexible circuit board, thereby reducing the temperature of the chip and thereby improving the service life thereof. Therefore, the display device 20 using the heat dissipation structure can use the heat dissipation structure as an auxiliary to dissipate the heat dissipation of the chip of the flexible circuit board, thereby reducing the temperature of the chip, ensuring the working performance of the chip, and thereby improving the service life thereof.
  • the first end portion of the heat conducting sheet 13 (ie, the end portion contacting the chip of the flexible circuit board 22) is larger in size than the second end portion (ie, the end contacting the circuit board 12).
  • the size of the part) to increase the heat dissipation effect may not be limited.
  • the first end of the thermal conductive sheet 13 is attached to the chip 220 of the flexible circuit board 22 by a double-sided thermal conductive adhesive; the second end of the thermal conductive sheet 13 is bonded to the first contact by a double-sided thermal conductive adhesive.
  • the double-sided thermal paste is used not only for fixed connections but also for conducting heat.
  • the attachment connection can also be made by other means. Or, attach it with other thermal adhesive.
  • the first contact region 121 and the second contact region 122 of the circuit board 12 are oppositely disposed on both sides of the circuit board 12, and the first contact region 121 and the second contact region 122 pass through the via hole. connection.
  • the first contact region 121 and the second contact region 122 of the circuit board 12 are connected by a via 120.
  • the first contact region 121 and the second contact region 122 of the circuit board 12 are all exposed copper regions, and the via holes 120 are copper holes.
  • the first contact region 121 and the second contact region 122 may also be subjected to a related process to accelerate heat conduction. For example, coating a heat conductive material, such as coating graphene, or silver plating.
  • the heat conducting sheet 13 is provided with a through hole 130.
  • one end of the heat conducting sheet 13 is provided with a through hole 130 corresponding to the through hole 120 when the heat conducting sheet 13 and the circuit board 12 are attached and mounted.
  • the heat dissipating structure further includes a fixing member 14.
  • the fixing member 14 can be, for example, a fixing screw, and the fixing screw can be a metal screw with good thermal conductivity for fixing the thermal conductive sheet 13 and transferring heat.
  • the fixing member 14 abuts the back plate 11 through the through hole 130 and the through hole 120 for fixing the heat conductive sheet 13 and conducting heat on the heat conductive sheet 13 to the back plate 11.
  • the thermal conductive sheet 13 includes, but is not limited to, an aluminum foil thermal conductive sheet, a copper foil thermal conductive sheet, a silver foil thermal conductive sheet, a gold foil thermal conductive sheet, a composite material thermal conductive sheet, a graphene thermal conductive sheet or other material thermal conductive sheet.
  • the thickness of the heat conductive sheet is not limited.
  • the display panel can be, for example, a liquid crystal display panel, an OLED display panel, a QLED display panel, or other display panel.
  • the display device 20 can be, for example, a liquid crystal display device, an OLED display device, a QLED display device, or other types of display devices.
  • the display device 20 in FIG. 5 is a computer display or a TV display. In other embodiments, the display device 20 can also be a display of other electronic devices such as a tablet or a mobile phone.
  • the shape of the display device 20 in FIG. 5 is not used to limit the specific structure of the display device in the present application.

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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热结构及显示装置，该散热结构包括背板(11)、电路板(12)和导热片(13)；电路板(12)上设有第一接触区(121)和第二接触区(122)，且第二接触区(122)与背板(11)接触；导热片(13)的第一端贴附在显示装置软性电路板(22)的芯片(220)上，第二端贴附在第一接触区(121)用于将芯片(220)的热量传导至电路板(12)和背板(11)。

Description

一种散热结构及显示装置
技术领域
本申请涉及显示技术领域，尤其涉及一种散热结构及显示装置。
背景技术
现有的液晶显示器，其显示面板和电路板是通过软性电路板（Chip On Flex，or，Chip On Film，简称为COF）连接的，其中该软性电路板上设有IC芯片（integrated circuit，集成电路），用于根据电路板的控制信息驱动显示面板。目前，显示面板中的软性电路板IC芯片均是自然向空气中进行散热。但是，高端产品因IC芯片的运算速度和运算量都比较大，因此发热较大，若无辅助散热结构，容易导致IC芯片温度过高，影响其工作性能，降低其寿命，甚至直接因温度过高导致产品失效。
发明内容
本申请的实施例提供了一种散热结构及显示装置，旨在改善显示装置的软性电路板的芯片散热问题。
一方面，提供了一种散热结构，应用于显示装置，该散热结构包括：
背板；
电路板，设置在所述背板上，该电路板上设有第一接触区和与所述第一接触区连接的第二接触区，所述第二接触区还与所述背板接触；
导热片，其第一端贴附在所述显示装置软性电路板的芯片上，第二端贴附在所述第一接触区，用于将所述芯片的热量传导至所述电路板和背板。
在本申请的散热结构中，所述第一接触区和第二接触区相对设置在所述电路板的两面，且通过过孔连接。
在本申请的散热结构中，所述导热片上设有通孔；所述散热结构还包括：
固定件，通过所述通孔、过孔与所述背板抵接，用于固定所述导热片。
在本申请的散热结构中，所述导热片的第一端通过双面导热胶贴合在所述软性电路板的芯片上；所述导热片的第二端通过双面导热胶贴合在所述第一接触区。
在本申请的散热结构中，所述第一接触区和第二接触区均为露铜区。
在本申请的散热结构中，所述导热片包括铝箔导热片、铜箔导热片或石墨烯导热片。
又一方面，还提供了一种显示装置，该显示装置包括：
背板；
显示面板，设置在所述背板上；
电路板，设置在所述背板上，该电路板设有第一接触区和与所述第一接触区连接的第二接触区，且所述第二接触区与所述背板接触；
软性电路板，设有芯片，用于连接所述显示面板和电路板；
导热片，其第一端贴附在所述芯片上，第二端贴附在所述第一接触区，用于将所述芯片的热量传导至所述电路板和背板。
在本申请的显示装置中，所述第一接触区和第二接触区相对设置在所述电路板的两面，且通过过孔连接。
在本申请的显示装置中，所述导热片上设有通孔；所述散热结构，还包括：
固定件，通过所述通孔、过孔与所述背板抵接，用于固定所述导热片。
在本申请的显示装置中，所述导热片的第一端通过双面导热胶贴合在所述显软性电路板的芯片上；所述导热片的第二端通过双面导热胶贴合在在所述第一接触区。
本申请实施例提供了一种散热结构及显示装置，其中该散热结构包括：背板、电路板和导热片；电路板设置在所述背板上，该电路板上设有第一接触区和与所述第一接触区连接的第二接触区，且所述第二接触区与所述背板接触；导热片，其第一端贴附在所述显示装置软性电路板的芯片上，第二端贴附在所述第一接触区，用于将芯片的热量传导至所述电路板和背板。因此，通过导热片、电路板和背板形成该散热结构，该散热结构作为辅助对软性电路板的芯片进行散热，可降低芯片的温度，进而提高其使用寿命。
附图说明
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图 1是本申请实施例提供的一种散热结构的剖面结构示意图；
图 2是本申请实施例提供的一种散热结构的安装结构示意图；
图 3是本申请实施例提供的一种散热结构的爆炸结构示意图；
图 4是本申请实施例提供的一种散热结构的安装结构另一示意图；
图 5是本申请实施例提供的一种显示装置的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参阅图1，图1是本申请实施例提供的一种散热结构的剖面结构示意图。该散热结构具体可安装在显示装置上，用于对该显示装置的芯片进行散热。如图1所示，该散热结构包括：背板11、电路板12和导热片13。背板11用于安装显示装置的显示面板21和电路板12，其中该显示面板21和电路板12通过至少一个软性电路板22连接。该软性电路板22上设有芯片220。该芯片220为驱动芯片，用于根据电路板上的控制信号驱动显示面板21工作。
该电路板12包括第一接触区121和第二接触区122。第一接触区121与第二接触区12连接导通，用于传导信号，比如用于传导电流或热量等。其中电路板12可例如为印刷式电路板，该第一接触区121和第二接触区122设置在该印刷式电路板的表面上。该第一接触区121和第二接触区122具体为金属接触区，通过沉积等方式设置在印刷式电路板的表面。
该导热片13的第一端贴附在软性电路板22的芯片220上，导热片13的第二端贴附在电路板12的第一接触区121。贴附后的效果如图2所示，导热片13的一端贴附并包裹住软性电路板22的芯片220上，使得该导热片13的一端充分与软性电路板22上的芯片220接触；导热片13的另一端贴附在电路板12的第一接触区121，从而形成通过导热片13、电路板的第一接触区121和第二接触区122至背板11的散热通道结构，该散热通道结构用于将软性电路板22上的芯片220工作时产生的热量传导至电路板12和背板11，进而加快了软性电路板22上的芯片220的散热速度。
需要说明的是，该软性电路板22可例如为COF（Chip On Flex，or，Chip On Film，称为覆晶薄膜），该覆晶薄膜上设有芯片，即驱动IC芯片。该驱动IC芯片在驱动显示装置工作时会产生一定热量，尤其是高端产品的驱动IC芯片，由于其较大的运算量，会产生较大的热量，如果不能及时散热，容易导致驱动IC芯片温度过高，影响其工作性能，严重时会烧坏该驱动IC芯片，降低了其使用寿命。
因此，该散热结构通过背板11、电路板12和导热片13形成散热通道结构，用于对软性电路板的芯片进行散热，可降低芯片的温度，进而提高其使用寿命。即是高端产品，使用高性能的芯片，该散热结构也可以有效地降低该芯片的温度，保证其正常工作。
需要说明的是，在本实施例中，导热片13的第一端部（即与软性电路板的芯片接触的端部）的尺寸大于第二端部（即与电路板接触的端部）的尺寸，以增加导热散热效果。在其他实施例中，也可以不对导热片13的两端部进行限定。
在本实施例中，导热片13的第一端通过双面导热胶贴合在软性电路板22的芯片220上；导热片13的第二端通过双面导热胶贴合在在第一接触区121。该双面导热胶不仅用于固定连接，还用于传导热量。在某些实施例中，也可以通过其他方式进行贴附连接。或者，通过其他导热胶进行贴附。
在本实施例中，如图3所示，电路板12的第一接触区121和第二接触区122相对设置在电路板12的两面，第一接触区121和第二接触区122通过过孔连接。电路板12的第一接触区121和第二接触区122通过过孔120连接。
需要说明的是，在本实施例中，如图3所示，该电路板12的第一接触区121和第二接触区122均为露铜区，过孔120为铜孔。在某些实施例中，还可以对第一接触区121和第二接触区122进行相关处理，以加速导热。比如涂覆一种导热材质，比如涂覆石墨烯，或者镀银等。
在本实施例中，如图3所示，所述显示面板和电路板12相对设置背板11的两面上，在其他实施例中，也可以设置在背板11同一侧。
在本实施例中，如图3所示，导热片13上设有通孔130。具体的是导热片13的一端设有通孔130，当导热片13与电路板12贴附安装时，该通孔130与过孔120相对应。该散热结构还包括固定件14，如图4所示，该固定件14可例如为固定螺丝，固定螺丝可为导热性好的金属螺丝，用于固定导热片13并传到热量。具体地，该固定件14通过通孔130、过孔120与背板11抵接，用于固定导热片13并将导热片13上的热量传导至背板11。
在本实施例中，导热片13包括但不限于铝箔导热片、铜箔导热片或石墨烯导热片。且对导热片的厚度不做限定。
在本实施例中，如图4所示，图4为该散热结构的部分图。背板11用于安装显示面板和电路板22，该显示面板可以通过卡合或者粘贴的方式安装在背板11上；电路板22可以通过螺丝固定的方式安装在背板11。其中该显示面板和电路板22通过至少一个软性电路板22连接，因此可以理解的是，每个软性电路板22的芯片上均设有该散热结构，因此一个显示面板会包括多个散热结构，其中该散热结构共用同一个背板11和电路板12。
请参阅图5，图5是本申请实施例提供的一种显示装置的结构示意图。该显示装置包括上述实施例中的散热结构。如图5所示，在结合图1至图3，该显示装置20包括：背板11、电路板12、导热片13和软性电路板22，以及显示面板（图未示）。该显示面板设置在背板11上；电路板12也设置在背板11上，具体地，该显示面板和电路板12相对设置背板11的两面，以节省显示装置的空间。软性电路板22设置背板11的一端部，其上设有芯片，用于连接该显示面板和电路板，具体地，将显示面板的阵列基板的栅极线或数据线通过该软性电路板与所述电路板连接。该芯片220为驱动芯片，用于根据电路板上的控制信号驱动显示面板21工作。
其中，该电路板12包括第一接触区121和第二接触区122。第一接触区121与第二接触区12连接导通，用于传导信号，比如用于传导电流或热量等。其中电路板12可例如为印刷式电路板，该第一接触区121和第二接触区122设置在该印刷式电路板的表面上。该第一接触区121和第二接触区122具体为金属接触区，通过沉积等方式设置在印刷式电路板的表面。
其中，该导热片13的第一端贴附在软性电路板22的芯片220上，导热片13的第二端贴附在电路板12的第一接触区121。贴附后的效果如图2所示，导热片13的一端贴附并包裹住软性电路板22的芯片220上，使得该导热片13的一端充分与软性电路板22上的芯片220接触；导热片13的另一端贴附在电路板12的第一接触区121，从而形成通过导热片13、电路板的第一接触区121和第二接触区122至背板11的散热通道结构，该散热通道结构用于将软性电路板22上的芯片220工作时产生的热量传导至电路板12和背板11，进而加快了软性电路板22上的芯片220的散热速度。
需要说明的是，该软性电路板22可例如为COF（Chip On Flex，or，Chip On Film，称为覆晶薄膜），该覆晶薄膜上设有芯片，即驱动IC芯片。该驱动IC芯片在驱动显示装置工作时会产生一定热量，尤其是高端产品的驱动IC芯片，由于其较大的运算量，会产生较大的热量，如果不能及时散热，容易导致驱动IC芯片温度过高，影响其工作性能，严重时会烧坏该驱动IC芯片，降低了其使用寿命。
因此，该散热结构通过背板11、电路板12和导热片13的配合形成散热通道结构，用于对软性电路板的芯片进行散热，可降低芯片的温度，进而提高其使用寿命。因此，对于使用该散热结构的显示装置20可以借助该散热结构作为辅助对软性电路板的芯片进行散热，可降低芯片的温度，保证了芯片的工作性能，进而提高其使用寿命。
需要说明的是，在本实施例中，导热片13的第一端部（即与软性电路板22的芯片接触的端部）的尺寸大于第二端部（即与电路板12接触的端部）的尺寸，以增加导热散热效果。在其他实施例中，也可以不对导热片13的两端部进行限定。
在本实施例中，导热片13的第一端通过双面导热胶贴合在软性电路板22的芯片220上；导热片13的第二端通过双面导热胶贴合在在第一接触区121。该双面导热胶不仅用于固定连接，还用于传导热量。在某些实施例中，也可以通过其他方式进行贴附连接。或者，通过其他导热胶进行贴附。
在本实施例中，如图3所示，电路板12的第一接触区121和第二接触区122相对设置在电路板12的两面，第一接触区121和第二接触区122通过过孔连接。电路板12的第一接触区121和第二接触区122通过过孔120连接。
需要说明的是，在本实施例中，如图3所示，该电路板12的第一接触区121和第二接触区122均为露铜区，过孔120为铜孔。在某些实施例中，还可以对第一接触区121和第二接触区122进行相关处理，以加速导热。比如涂覆一种导热材质，比如涂覆石墨烯，或者镀银等。
在本实施例中，如图3所示，导热片13上设有通孔130。具体的是导热片13的一端设有通孔130，当导热片13与电路板12贴附安装时，该通孔130与过孔120相对应。该散热结构还包括固定件14，如图4所示，该固定件14可例如为固定螺丝，固定螺丝可为导热性好的金属螺丝，用于固定导热片13并传到热量。具体地，该固定件14通过通孔130、过孔120与背板11抵接，用于固定导热片13并将导热片13上的热量传导至背板11。
在本实施例中，导热片13包括但不限于铝箔导热片、铜箔导热片、银箔导热片、金箔导热片、复合材质导热片、石墨烯导热片或其他材质导热片。且对导热片的厚度不做限定。
在某些实施例中，该显示面板可例如为：液晶显示面板、OLED显示面板、QLED显示面板或其他显示面板。
在本实施例中，该显示装置20可例如为：液晶显示装置、OLED显示装置、QLED显示装置或其他类型的显示装置。
可以理解的是，在本实施例中。图5中的显示装置20为计算机显示器或TV显示器。在其他实施例中，该显示装置20也可以为平板电脑或手机等其他电子设备的显示器，图5中的显示装置20的形状不用于限制本申请中显示装置的具体结构。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (20)

  1. 一种散热结构，应用于显示装置，包括：
    背板；
    电路板，设置在所述背板上，该电路板设有第一接触区和第二接触区，所述第一接触区和第二接触区相对设置在所述电路板的两面且通过过孔连接，所述第二接触区还与所述背板接触；
    导热片，设有通孔；
    固定件，通过所述通孔、过孔与所述背板抵接，用于固定所述导热片；
    其中，所述导热片的第一端贴附在所述软性电路板的芯片上，第二端贴附在所述第一接触区，用于将所述芯片的热量传导至所述电路板和背板。
  2. 根据权利要求1所述的散热结构，其中所述导热片的第一端的尺寸大于第二端的尺寸。
  3. 根据权利要求1所述的散热结构，其中所述导热片的第一端通过双面导热胶贴合在所述软性电路板的芯片上；所述导热片的第二端通过双面导热胶贴合在所述第一接触区。
  4. 根据权利要求1所述的散热结构，其中所述第一接触区和第二接触区均为露铜区。
  5. 根据权利要求1所述的散热结构，其中所述第一接触区和第二接触区涂覆导热材质。
  6. 根据权利要求1所述的散热结构，其中所述导热片包括铝箔导热片、铜箔导热片或石墨烯导热片。
  7. 根据权利要求1所述的散热结构，其中所述软性电路板包括覆晶薄膜。
  8. 一种散热结构，应用于显示装置，包括：
    背板；
    电路板，设置在所述背板上，该电路板设有第一接触区和与所述第一接触区连接的第二接触区，所述第二接触区还与所述背板接触；
    导热片，其第一端贴附在所述显示装置软性电路板的芯片上，第二端贴附在所述第一接触区，用于将所述芯片的热量传导至所述电路板和背板。
  9. 根据权利要求8所述的散热结构，其中所述第一接触区和第二接触区相对设置在所述电路板的两面，且通过过孔连接。
  10. 根据权利要求9所述的散热结构，其中所述导热片上设有通孔；所述散热结构，还包括：
    固定件，通过所述通孔、过孔与所述背板抵接，用于固定所述导热片。
  11. 根据权利要求8所述的散热结构，其中所述导热片的第一端通过双面导热胶贴合在所述软性电路板的芯片上；所述导热片的第二端通过双面导热胶贴合在所述第一接触区。
  12. 根据权利要求8所述的散热结构，其中所述第一接触区和第二接触区均为露铜区。
  13. 根据权利要求8所述的散热结构，其中所述导热片包括铝箔导热片、铜箔导热片或石墨烯导热片。
  14. 根据权利要求8所述的散热结构，其中所述软性电路板包括覆晶薄膜。
  15. 一种显示装置，包括：
    背板；
    显示面板，设置在所述背板上；
    电路板，设置在所述背板上，该电路板设有第一接触区和与所述第一接触区连接的第二接触区，且所述第二接触区与所述背板接触；
    软性电路板，设有芯片，用于连接所述显示面板和电路板；
    导热片，其第一端贴附在所述芯片上，第二端贴附在所述第一接触区，用于将所述芯片的热量传导至所述电路板和背板。
  16. 根据权利要求15所述的显示装置，其中所述第一接触区和第二接触区相对设置在所述电路板的两面，且通过过孔连接。
  17. 根据权利要求16所述的显示装置，其中所述导热片上设有通孔；所述散热结构，还包括：
    固定件，通过所述通孔、过孔与所述背板抵接，用于固定所述导热片。
  18. 根据权利要求15所述的显示装置，其中所述导热片的第一端通过双面导热胶贴合在所述显软性电路板的芯片上；所述导热片的第二端通过双面导热胶贴合在在所述第一接触区。
  19. 根据权利要求15所述的显示装置，其中所述第一接触区和第二接触区均为露铜区。
  20. 根据权利要求15所述的显示装置，其中所述导热片包括铝箔导热片、铜箔导热片或石墨烯导热片。
PCT/CN2017/091884 2017-05-26 2017-07-05 一种散热结构及显示装置 Ceased WO2018214245A1 (zh)

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