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WO2018131921A1 - 소자핸들러 - Google Patents

소자핸들러 Download PDF

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Publication number
WO2018131921A1
WO2018131921A1 PCT/KR2018/000593 KR2018000593W WO2018131921A1 WO 2018131921 A1 WO2018131921 A1 WO 2018131921A1 KR 2018000593 W KR2018000593 W KR 2018000593W WO 2018131921 A1 WO2018131921 A1 WO 2018131921A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
image acquisition
seating
wafer ring
acquisition unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2018/000593
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
유홍준
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JT Corp
Original Assignee
JT Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JT Corp filed Critical JT Corp
Priority to CN201880006920.0A priority Critical patent/CN110178210A/zh
Publication of WO2018131921A1 publication Critical patent/WO2018131921A1/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H10P72/3206—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H10P72/00—
    • H10P72/06—
    • H10P72/30—
    • H10P72/3208—
    • H10P72/3212—
    • H10P72/3218—
    • H10P72/3411—
    • H10P74/203—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Definitions

  • the present invention relates to an element handler, and more particularly, to an element handler for placing a good element of a wafer state in a waffle pack according to an inspection result.
  • a device is an integrated circuit composed of a semiconductor whose electrical conductivity is higher than that of a nonconductor and lower than a conductor such as a metal.
  • a chip refers to a thin plate, but is now used to refer to a semiconductor circuit.
  • the device is made by integrating various devices such as a transistor resistor capacitor on a thin silicon wafer having a width of about 1 cm.
  • the device is the basic component of modern computers and is the core of arithmetic, information storage, and control of other chips, and supports the electronics industry.
  • Such devices include a CPU, an SDRAM (memory semiconductor), and a flash RAM.
  • a display drive IC DAI
  • COG chip on glass
  • COF chip on film
  • Such devices are inspected for appearance before shipment to increase reliability, and only the good devices are shipped after the defective devices are sorted out.
  • the inspection process for the device may be performed several times during the manufacturing process of the device, and in particular, may be performed after cutting into each device in the wafer state and may be displayed on the device according to each inspection result.
  • the devices that have been inspected as described above are loaded with a sorting device, such as a waffle pack, only for good products for shipment or post-processing.
  • a sorting device such as a waffle pack
  • the production speed of the device depends on the processing speed of the inspection apparatus or the classification apparatus.
  • an object of the present invention is to significantly improve the processing speed of an apparatus for picking up an element from a loading member such as a wafer on which a plurality of elements are loaded and loading it on an unloading member such as a waffle pack.
  • the present invention provides an element handler capable of eliminating defects that may occur in an element loading process by performing an inspection process on a loading state after loading an element in an unloading member.
  • the present invention is a wafer ring loading portion 100 is loaded with a wafer ring 20 loaded with elements having a relatively long length compared to the width; ; A wafer ring movement table (200) for receiving the wafer ring (20) from the wafer ring loading unit (100) to move the wafer ring (20) on which each element is loaded to an element withdrawal position (P0); A pickup tool (500) for picking up an element from the wafer ring (20) on the wafer ring movement table (200); And a device unloading unit 400 for unloading the device by mounting the device transferred by the pickup tool 500 in the waffle pack 30 in which the plurality of mounting grooves 31 on which each device is seated.
  • the device handler is configured to acquire an image of a state of at least one device loaded in the wafer ring to perform at least one of a seating state of the device and a vision inspection on the top surface of the device withdrawal position P0. It may include a first upper image acquisition unit 330.
  • the element handler moves the first upper image acquisition unit 330 to an area other than the upper portion of the element withdrawal position P0 while the pickup tool 500 picks up an element at the element withdrawal position P0.
  • a first upper image acquisition to move the first upper image acquisition unit 330 to the device withdrawal position P0 when the pickup tool 500 is moved to the device loading position of the device unloading unit 400. It may further include a floating unit.
  • the device handler further includes a first lower image acquisition unit 320 installed at a transport path of the device by the pickup tool 500 and acquiring an image of the bottom surface of the device picked up at the device withdrawal position P0. It may include.
  • the pick-up tool 500 is a device based on the image obtained by one of the first upper image acquisition unit 330 and the first lower image acquisition unit 320 of the device unloading unit 400 It can be moved by at least one of the X-axis movement, Y-axis movement, Z-axis movement and the rotational movement with the Z-axis to be positioned in the device loading position.
  • the device handler moves the first lower image acquisition unit to move the first lower image acquisition unit 320 in the longitudinal direction of the picked-up device in the process of acquiring an image of the bottom surface of the picked-up device. It may further include wealth.
  • the device unloading part 400 includes a plurality of seating parts 410 on which a waffle pack 30 is mounted, on which the devices picked up by the pickup tool 500 are classified and seated, and the seating part 410.
  • the element handler is configured to determine the element loading position of the seating portion 410 while the pick-up tool 500 loads the element picked up from the wafer ring 20 at the element loading position of the seating portion 410.
  • the second upper image acquisition unit 340 is moved to an area other than the upper part and the second tool is moved to the device loading position of the seating part 410 when the pickup tool 500 is moved to the device withdrawal position P0.
  • the apparatus may further include a second upper image acquisition unit moving unit which moves the upper image acquisition unit 340.
  • the device handler may further include a cleaning part 310 installed on the transport path of the waffle pack 30 to remove foreign substances from the empty waffle pack 30 to be delivered to the seating part 410. .
  • the device unloading unit 400 includes a loading cassette 450 in which empty waffle packs 30 are stacked and stored; A plurality of seating parts 410 in which elements picked up by the pickup tool 500 are classified and loaded; An unloading stacker 460 in which the waffle pack 30 in which the device stacking is completed is stacked and stored in a bottom direction; The empty waffle pack 30 loaded from the loading cassette 450 is conveyed to the seating portion 410, and the unloading stacker (30) is received from the seating portion 410 by receiving the completed waffle pack 30.
  • the buffer unit 420 may be transferred to the 460.
  • the element handler according to the present invention significantly improves the processing speed of an apparatus for picking up an element from a loading member such as a wafer on which a plurality of elements are loaded and loading it on an unloading member such as a waffle pack, and at the same time loading the element on the unloading member.
  • a loading member such as a wafer on which a plurality of elements are loaded
  • an unloading member such as a waffle pack
  • FIG. 1 is a plan view illustrating a device handler according to an exemplary embodiment of the present invention.
  • FIG. 2 is a perspective view illustrating the waffle pack of FIG. 1.
  • FIG. 2 is a perspective view illustrating the waffle pack of FIG. 1.
  • FIG. 3 is a view illustrating a partial configuration of the device handler of FIG. 1 and illustrating a movement path of the pickup tool, the first upper image acquisition unit, and the second upper image acquisition unit.
  • FIG. 4A and 4B are enlarged cross-sectional views of the device handler of FIG. 1 and are enlarged cross-sectional views illustrating movement paths of a pickup tool, a first upper image acquisition unit, and a second upper image acquisition unit.
  • FIG. 5 is an enlarged view illustrating a movement path of one configuration of the element handler of FIG. 1.
  • FIG. 6 is an enlarged view illustrating a movement path of another configuration of the element handler of FIG. 1.
  • FIG. 7A is a plan view illustrating an unloading stacker of the element handler of FIG. 1, and FIG. 7B is a cross-sectional view of the unloading stacker of FIG. 7A.
  • the wafer ring loading unit 100 in which the wafer ring 20 loaded with the elements 10 having a relatively long length relative to the width is loaded.
  • a wafer ring movement table 200 which receives the wafer ring 20 from the wafer ring loading unit 100 and moves the wafer ring 20 on which each element 10 is loaded to the element withdrawal position P0;
  • Device unloading to unload the device 10 by seating the device 10 delivered by the pickup tool 500 in the waffle pack 30 is formed with a plurality of seating grooves 31 on which each device 10 is seated A portion 400 is included.
  • the wafer loading unit 100 is a configuration in which a plurality of wafers 20 to which a plurality of elements 10 are attached are loaded.
  • the device 10 may correspond to the device 10 that has completed the semiconductor process and the sawing process with the device 10 having a relatively long length compared to the width.
  • the device 10 may be a wafer level device that has completed a semiconductor process and a sawing process, as well as a device 10 that has completed a packaging process after a semiconductor process.
  • the device 10 may include an IC chip such as a display drive chip (DDI) such as a chip on glass (COG) and a chip on film (COF), an LED device 10, and the like.
  • a display drive chip such as a chip on glass (COG) and a chip on film (COF)
  • LED device 10 and the like.
  • the wafer may correspond to the device 10 that has undergone a so-called semiconductor process and cutting process (also a test process and a classification process).
  • the device 10 may be transported in a state in which the device 10 is loaded on the wafer ring 20 after the cutting process.
  • the wafer ring 20 is a configuration that is loaded with elements 10 having a relatively long length compared to the width is possible in a variety of configurations.
  • the wafer ring 20 is a component for attaching and transporting the elements 10, and various configurations are possible, and adhesive tapes having adhesiveness on a surface of each element 10 to be attached to an upper surface thereof.
  • the wafer ring 20 may be composed of an adhesive tape having an adhesive on the surface and one coupling ring to which the device 10 is attached to the upper surface.
  • the waffle pack 30 has a plurality of seating grooves 31 formed thereon to allow the device 10 to be seated, and may have various shapes such as a rectangular shape.
  • the seating groove 31 is preferably formed deeper than the height of the element 10 so as not to be damaged when the waffle pack 30 is stacked up and down.
  • the wafer ring loading unit 100 may include a cassette loading unit, a wafer ring cassette, and a wafer ring moving table 200 in which a wafer ring cassette on which a plurality of wafer rings 20 on which elements 10 are to be loaded are loaded is loaded.
  • a wafer moving tool for moving the wafer ring 20 is provided. It can be configured to include.
  • the wafer transfer tool may be configured as a clamping device and a linear driving device, or a pusher and a linear driving device for linearly moving the pusher.
  • the wafer ring cassette may be configured such that the wafer rings 20 are stacked and stacked in a configuration in which the plurality of wafer rings 20 to which the elements 10 to be extracted are attached are stacked and the stacked wafer rings 20 are sequentially stacked. It may be installed to be able to move up and down to be withdrawn.
  • the wafer ring loading unit 100 may complete the device withdrawal from the wafer ring movement table 200 before the first wafer ring 20 from which the element 10 is to be transferred is transferred to the wafer ring movement table 200.
  • the second wafer ring 20 is transferred to an empty position of the wafer ring cassette. It may further include a wafer buffer portion (not shown) for temporarily storing the two wafer rings 20.
  • the wafer buffer portion (not shown) may have any configuration as long as the wafer buffer 20 is configured to temporarily hold the wafer ring 20.
  • the wafer ring movement table 200 is configured to move the wafer ring 20 withdrawn from the wafer ring cassette 111 to a device withdrawal position P0 through which the pick-up tool 500 can withdraw the device 10.
  • XY movement or XY- ⁇ movement may be configured.
  • X-Y denotes a rectangular coordinate axis with respect to the horizontal plane of the wafer ring 20
  • ⁇ denotes a rotation about the Z axis.
  • the wafer ring movement table 200 may be moved in the vertical direction, that is, the Z-axis direction.
  • the wafer ring movement table 200 moves the wafer ring 20 to the element withdrawal position P0, the element 10 is easily picked up as shown in FIG. 4A below the element withdrawal position P0.
  • One or more needle pins 210 may be further installed to move upward to pressurize the adhesive tape of the wafer ring 20.
  • the number of the needle pins 210 may vary depending on the size of the device 10.
  • the needle pin 210 when configured to move according to the device withdrawal position Po, it is preferable that the device for moving is fixed because the manufacturing cost of the device is increased and thus the device withdrawal position Po is fixed. It is desirable to be.
  • the pickup tool 500 may be configured to pick up the element 10 from the wafer ring 20 on the wafer ring movement table 200.
  • the pick-up tool 500 may include a suction head (not shown) for picking up and picking up the element 10 by generating a vacuum pressure along with the shanghai (movement in the Z direction).
  • the pickup tool 500 may be configured in various ways such that the length thereof is variable or the entire pickup tool 500 is linearly moved.
  • the pickup tool 500 as shown in Figures 1 to 5, a rotary drive unit 510 having a horizontal axis of rotation; A plurality of rotation arms 520 coupled to the rotation shaft and disposed along the rotation direction of the rotation shaft; It may include a picker 530 coupled to each of the plurality of rotary arms 520 and picking up the device 10.
  • the rotation driving unit 510 has a horizontal axis of rotation, and rotates the rotary arm 520 coupled to the axis of rotation.
  • the rotation driving unit 510 may be configured as a rotation motor having a horizontal rotation axis in which a plurality of pickers 530 are coupled.
  • the rotary drive unit 510, the picker 530 coupled to the rotary arm 520 picks up the element 10 by the vacuum pressure bar to enable the rotary shaft to transfer the vacuum pressure to the picker 530 and pneumatic It is desirable to have a pneumatic rotary joint to deliver.
  • the rotation axis is configured to rotate the plurality of pickers 530 by rotation, and is preferably disposed to be parallel to the top surface of the wafer ring 20 or the top surface of the waffle pack 30, that is, perpendicular to the Z axis.
  • the rotation axis may be disposed perpendicular to the Z axis, that is, parallel to the X axis or the Y axis, and more preferably disposed parallel to the X axis.
  • the rotation axis may be variously rotated according to the control of the rotation direction with respect to the picker 530 in one direction or in both directions.
  • the rotary arm 520 may be any structure as long as the rotary arm 520 is coupled to the rotating shaft and supports the picker 530 as a structure capable of supporting the picker 530.
  • the rotary arm 520 is a configuration that can be selectively adopted does not correspond to an essential configuration.
  • the picker 530 is coupled to the rotating shaft and disposed in the circumferential direction of the rotating shaft, and rotated about the rotating shaft, and any configuration may be possible as long as the device can withdraw the element 10 at the device withdrawal position P0.
  • the picker 530 is coupled to the rotation axis in the radial direction and arranged in the circumferential direction of the rotation axis is configured to rotate around the rotation axis is possible in various configurations.
  • the picker 530 is coupled in a direction parallel to the axis of rotation and arranged in the circumferential direction of the axis of rotation is configured to rotate around the axis of rotation is possible in various configurations.
  • the picker 530 may be configured to pick up the element 10 from the wafer ring 20 by vacuum pressure.
  • the picker 530 may include a pneumatic connection portion that receives air pressure from the outside, and a pickup head installed at an end to pick up or release the element 10 by pneumatic pressure transmitted by the pneumatic connection portion. Can be.
  • the plurality of pickers 530 may include a rotation support member (not shown) in connection with the rotation shaft.
  • the rotation support member (not shown) may be configured in a variety of configurations in which a plurality of pickers 530 are coupled to support the plurality of pickers 530.
  • the picker 530 may be moved up and down by a vertical drive device installed in the rotary arm 520.
  • the pickers 530 may be installed in n, preferably 2n (n is a natural number of 1 or more) so as to have an equiangular center around the axis of rotation for regular performance of device pick-up and place.
  • the plurality of pickers 530 need to be installed to enable linear movement toward the upper surface of the wafer ring 20 or the upper surface of the waffle pack 30 so as to facilitate the operation of picking up and loading the device 10. have.
  • the plurality of pickers 530 may be installed to be linearly movable in a radial direction with respect to the rotation axis, and may be linearly moved in a radial direction by a radial moving part (not shown).
  • the pickup tool 500 when the axis of rotation of the picker 530 is a first axis of rotation, having a second axis of rotation perpendicular to the first axis of rotation and rotates the rotary drive unit 510 around the second axis of rotation It may include a second rotational drive.
  • the second rotary drive unit may have a second rotary shaft and be configured as a rotary motor as a configuration for rotating the second rotary shaft.
  • the second rotation driving unit may be installed to allow at least one of X-axis movement and Y-axis movement by the linear movement unit.
  • the second rotation shaft rotates the plurality of pickers 530 so as to smoothly correct an error in the ⁇ direction of the element 10 picked up by the picker 530, that is, an error in the rotation angle of which the Z axis is the rotation axis. It is desirable to cross the center.
  • the wafer ring Moving to the waffle pack 30 spaced apart from the (20) can be loaded element 10 in the loading position.
  • the device withdrawal position P0 may be disposed on the wafer ring 20 so that at least one of the seating state of the device 10 and the vision inspection of the top surface may be performed.
  • a first upper image acquisition unit 330 may be installed to acquire an image of a state of at least one loaded device 10.
  • the first upper image acquisition unit 330 is an image of the state of the stacked device 10 of the wafer ring 20 to perform at least one of the seating state of the device 10 and the vision inspection of the top surface.
  • Various configurations are possible as the configuration to obtain.
  • the first upper image acquisition unit 330 is configured to acquire an image of the device 10 loaded on the wafer ring 20, and may be configured in various ways such as a scanner and a camera.
  • the first upper image acquisition unit 330 may be used to determine the position of the element 10 to be picked up by the picker 530, and to inspect the upper surface of the element 10.
  • the first upper image acquisition unit 330 is a device withdrawal position P0 while the pickup tool 500 picks up the element 10 at the element withdrawal position P0 by the first upper image acquisition unit moving unit.
  • the pick-up tool 500 may be installed to move to the device withdrawal position P0.
  • the first upper image acquisition unit moving unit may display an image of the upper surface of the element 10 to be picked up from the element withdrawal position P0 without the first upper image acquisition unit 330 being disturbed by the pickup tool 500. To obtain, the first upper image acquisition unit 330 may be moved from the upper portion of the element withdrawal position P0 to other regions or the upper portion of the element withdrawal position P0 in an area other than the upper portion of the element withdrawal position P0.
  • the configuration may be possible with the configuration.
  • the pick-up tool 500 moves to the seating portion 410 to load the picked-up device 10 in the waffle pack 30, the wafer ring 20
  • the first upper image acquisition unit 330 can be disposed in a position closer to the wafer ring table 200 than the conventional, thereby to the wafer ring 20
  • the first upper image acquisition unit 330 is configured to acquire an image of the upper surface of the device 10 at a position close to the upper portion of the wafer ring table 200, and further includes a low angle lighting suitable for this. This is preferred.
  • a first lower image acquisition unit 320 for acquiring an image of the bottom surface of the element 10 picked up at the element withdrawal position P0 is provided in the transfer path of the element 10 by the pickup tool 500. It can be installed additionally.
  • the first lower image acquisition unit 320 is installed on the transfer path of the element 10 by the pickup tool 500 and acquires an image of the bottom surface of the element 10 picked up at the element withdrawal position P0.
  • Various configurations are possible with the configuration.
  • the first lower image acquisition unit 320 is an element that acquires an image of the bottom surface of the element 10 picked up at the element withdrawal position P0 by the picker 530 and may correspond to various components such as a scanner and a camera. Can be.
  • the first lower image acquisition unit 320 is moved in the longitudinal direction of the element 10 picked up by the first lower image acquisition unit moving part in the process of obtaining an image of the bottom surface of the picked up element 10. Can be installed.
  • the first lower image acquisition unit moving unit may be configured to move the first lower image acquisition unit 320 in the longitudinal direction of the device 10, which is the target of the bottom image acquisition.
  • the first lower image acquisition unit moving unit moves the first lower image acquisition unit 320 in the longitudinal direction (arrow direction) of the device 10 and moves the first lower image.
  • the acquirer 320 may acquire the images sequentially in the longitudinal direction with respect to the bottom surface of the one device 10.
  • the first lower image acquisition unit 320 is moved in the longitudinal direction of the element 10 to be picked up to obtain an image. It is advantageous to obtain a high resolution image of the bottom of the device 10 at a distance.
  • the pick-up tool 500, the device 10 is the device unloading unit 400 based on the image obtained by one of the first upper image acquisition unit 330 and the first lower image acquisition unit 320 In order to be located at the element loading position of the), it can be installed so as to be movable in, for example, the X-axis direction, the Y-axis direction, and the Z-axis direction based on the arrangement direction of the element extraction position PO and the loading position.
  • the pickup tool 500 may be installed to rotate based on the arrangement direction of the element withdrawal position P0 and the loading position, for example, the Z axis direction as the second rotation axis.
  • the device 10 is formed on the waffle pack 30 of the seating portion 410 by analyzing the image acquired by the first upper image acquisition unit 330 or the second lower image acquisition unit 320.
  • the pick-up tool 500 By moving the pick-up tool 500 by at least one of the XYZ movement and the horizontal rotational movement so as to be positioned at a preset loading position, the picked-up element 10 is mounted on the seating portion 410 of the waffle pack 30. Can be loaded at the loading position.
  • the device unloading unit 400 may be mounted on the pickup tool 500 in a waffle pack 30 in which a plurality of mounting grooves 31 are formed.
  • Various configurations are possible by the configuration of unloading the device 10 by seating the device 10 is transmitted by.
  • the device unloading unit 400 may include a waffle pack loading unit for loading the empty waffle pack 30 into the plurality of seating units 410; A plurality of seating portions 410 on which the waffle pack 30 on which the elements 10 picked up by the pickup tool 500 are sorted and stacked; A waffle pack unloading unit which draws out and unloads the waffle pack 30 in which device loading is completed; A buffer unit which conveys the empty waffle pack 30 loaded from the waffle pack loading unit to the seating unit 410, and receives the waffle pack 30 on which the device loading is completed from the seating unit 410, and transports it to the waffle pack unloading unit. And 420.
  • the device unloading unit 400 may include a waffle pack loading unit and a waffle pack unloading unit, and may include a pair of cassettes in which the waffle packs are stacked to supply empty waffle packs and to load filled waffle packs. have.
  • the waffle pack loading unit may include a loading cassette 450 in which empty waffle packs 30 are stacked and stored.
  • the waffle pack loading unit may draw out the empty waffle pack 30 from the loading cassette 450 and deliver the empty waffle pack 30 to the plurality of seating units 410.
  • the waffle-packing part may be installed to convey the empty tray 30 to the plurality of seating parts 410 in a rail manner.
  • the plurality of seating parts 410 may include: a first in which elements 10 classified as good products are seated on the basis of an image obtained by the first upper image acquisition unit 330 or the first lower image acquisition unit 320; The seating part 410a, the second seating part 410b, and the third mounting part 410c on which the device 10 which is not classified as a good product may be mounted.
  • the first seating portion 410a and the second seating portion 410b are waffle packs 30a and 30b which are removed from the pick-up tool 500 and are loaded when the device 10 that is subjected to the inspection process is determined to be good. It may correspond to the configuration to be seated.
  • a plurality of first and second seating portions 410a and 410b on which the seating portion 410 is loaded with the elements 10 classified as good products can be used to form a waffle pack (1).
  • the device loading process may be performed on the second seating portion 410b while the device loading is completed at 30a) and the empty waffle pack 30 is loaded from the waffle packing portion.
  • a waffle pack may be configured to perform at least one of a vision test on a seating state and an upper surface of the device 10 on the seating portion 410.
  • a second upper image acquisition unit 340 may be additionally installed to acquire an image of the state of the device 10 seated at 30.
  • the second upper image acquisition unit 340 may include an element mounted on the waffle pack 30 so as to perform at least one of a seating state of the device 10 and a vision test on the upper surface of the seating unit 410.
  • Various configurations are possible as a configuration for obtaining an image of the state of 10).
  • the second upper image acquisition unit 340 is configured to acquire an image of the state of the device 10 seated on the waffle pack 30 on the seating unit 410 and may correspond to various configurations such as a scanner and a camera. Can be.
  • the second upper image acquisition unit 340 may include a device 10 classified as a good device 10 in vision inspection through the first upper image acquisition unit 330 and the first lower image acquisition unit 320. It is preferable that the waffle packs 30a and 30b to be seated are installed above the seating parts 410a and 410b to be seated.
  • the second upper image acquisition unit 340 may perform at least one of a vision inspection on the seating state and the upper surface of the device 10 loaded at the loading position.
  • the second upper image acquisition unit 340, the device 10 of the seating unit 410 is loaded with the element 10 picked up by the pickup tool 500 from the wafer ring 20 by the second upper image acquisition unit moving unit.
  • the pick-up tool 500 is moved to the element withdrawal position P0. Can be installed.
  • the second upper image acquisition unit moving part allows the second upper image acquisition unit 340 to acquire an image of the upper surface of the device 10 loaded on the device loading position without being disturbed by the pickup tool 500.
  • the second upper image acquisition unit 340 may be moved to an area other than the upper portion of the device loading position or to an upper portion of the device loading position in a region other than the upper portion of the device loading position.
  • the second upper image acquisition unit moving unit may move the second upper image acquisition unit 340 in the horizontal direction from the upper portion of the tray 30 seated on the seating unit 410.
  • the second upper image acquisition unit 340 may sequentially acquire the top image of the plurality of devices 10 loaded in the tray 30.
  • the second upper image acquisition unit 340 is other than the device loading position of the seating portion 410 while the pick-up tool 500 loads the device 10 at the device loading position of the wafer ring table 200. Located at one side of the region of the pick-up tool 500 is moved to the upper portion of the seating portion 410 when the pick-up tool 500 moves to the device withdrawal position (P0) to withdraw the device 10 from the wafer ring 20,
  • the upper image acquisition unit 340 may be disposed in a position closer to the seating portion 410 than in the prior art, and thus the seating state and the top surface of the device 10 loaded on the waffle pack 30 of the seating portion 410. There is an advantage to obtain a higher resolution image for.
  • the waffle packs 30a and 30b of the seating parts 410a and 410b on which the devices 10 classified as good products are loaded may be drawn out and stored in the waffle pack unloading part when the device loading is completed.
  • the waffle pack unloading unit may be configured to unload the waffle pack 30, in which device loading is completed, from the plurality of seating units 410.
  • the waffle pack unloading unit may include an unloading stacker 460 in which the waffle pack 30 having the device stacked thereon is stacked and stored from the bottom to the top direction.
  • the unloading stacker 460 may be configured in a variety of configurations in which the waffle pack 30 having the device stacked thereon is stacked and stored from the bottom to the top direction.
  • the unloading stacker 460 may have the waffle packs 30 drawn from the plurality of seating parts 410 stacked in the upper direction (Z direction) from the lower side.
  • a frame 462 whose bottom is open so that it can be opened;
  • the top surface of the waffle pack 30 of the uppermost layer may include a cover portion 464 to cover the outside.
  • the present invention by stacking the waffle pack 30 from the bottom to the top and having a cover portion 464 at the top, the waffle pack 30 that can occur in the process of unloading the waffle pack 30 is completed device loading ) There is an advantage that can prevent contamination of the upper surface.
  • a buffer unit 420 may be additionally installed to receive the waffle pack 30 in which the device loading is completed from the seating unit 410 and to transport the waffle pack 30 to the unloading stacker 460.
  • the buffer unit 420 receives the empty waffle pack 30 from the loading cassette 450, exchanges the waffle pack 30 with the plurality of seating parts 410, and the plurality of seating parts 410.
  • Various configurations are possible by transferring the waffle pack 30 having the device loading received from the unloading stacker 460.
  • the buffer unit 420 may be installed to be movable up and down to replace the waffle pack 30 with the plurality of seating units 410.
  • the foreign material in the empty waffle pack 30 is installed on the transport path of the waffle pack 30 to be delivered to the seating portion 410
  • Cleaning unit 310 may be installed to remove.
  • the cleaning unit 310 is installed on the transport path of the empty waffle pack 30 to be transferred to the plurality of seating portions 410 to remove foreign substances of the empty waffle pack 30 loaded from the waffle pack loading unit.
  • Various configurations are possible with the configuration.
  • the cleaning unit 310 is installed on the transport path of the empty waffle pack 30 to be transferred to the first seating portion 410a and the second seating portion 410b on which the devices 10 classified as good products are seated. desirable.
  • One or more nozzles for receiving air from the flow path and injecting air to the upper surface of the waffle pack 30 may be installed.
  • the cleaning unit 310 may include a main body covering the upper surface of the waffle pack 30 and forming a cleaning space on the waffle pack 30.
  • the main body is formed to maintain the cleaning space in a closed state, the main body may be connected to the discharge pipe so that foreign matter is discharged to the outside from the cleaning space with the air injected through the nozzle.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/KR2018/000593 2017-01-13 2018-01-12 소자핸들러 Ceased WO2018131921A1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201880006920.0A CN110178210A (zh) 2017-01-13 2018-01-12 元件处理器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170005979A KR20180083557A (ko) 2017-01-13 2017-01-13 소자핸들러
KR10-2017-0005979 2017-01-13

Publications (1)

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WO2018131921A1 true WO2018131921A1 (ko) 2018-07-19

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KR (1) KR20180083557A (zh)
CN (1) CN110178210A (zh)
TW (1) TWI708311B (zh)
WO (1) WO2018131921A1 (zh)

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KR102699530B1 (ko) * 2018-10-02 2024-08-30 (주)테크윙 전자부품 테스트용 핸들러
CN109733836B (zh) * 2018-12-06 2020-11-17 苏州永创智能科技有限公司 烧录机用全自动i/o系统
EP3672040A1 (en) * 2018-12-17 2020-06-24 Nexperia B.V. Device for enabling a rotating and translating movement by means of a single motor; apparatus and system comprising such a device
CN114455251B (zh) * 2022-01-26 2023-07-14 横店集团东磁股份有限公司 花篮信息自动采集系统

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KR20180083557A (ko) 2018-07-23
CN110178210A (zh) 2019-08-27
TW201826434A (zh) 2018-07-16

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