WO2018120743A1 - Metamaterial manufacturing method - Google Patents
Metamaterial manufacturing method Download PDFInfo
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- WO2018120743A1 WO2018120743A1 PCT/CN2017/092063 CN2017092063W WO2018120743A1 WO 2018120743 A1 WO2018120743 A1 WO 2018120743A1 CN 2017092063 W CN2017092063 W CN 2017092063W WO 2018120743 A1 WO2018120743 A1 WO 2018120743A1
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- composite substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- the present invention relates to the field of metamaterial technology, and more particularly to a method of manufacturing a metamaterial.
- metamaterial processing mainly relies on lithography and other flat etching processes (such as ion beam etching, electron beam etching, X-ray etching, etc.).
- lithography and other flat etching processes such as ion beam etching, electron beam etching, X-ray etching, etc.
- screen printing, inkjet printing, etc. are prepared by solution processing to prepare metamaterials, which are compatible with the roll-to-roll process, and are potential metamaterial manufacturers.
- Metamaterials consist of a dielectric substrate and a microstructure.
- the key technology for the manufacture of metamaterials is the processing of microstructures.
- the defects of the existing manufacturing processes are as follows:
- an object of the present invention is to provide a method for producing a metamaterial having high performance, high manufacturing efficiency, and accurate microstructural structure and excellent electromagnetic corresponding characteristics.
- the OTS self-assembled single layer side of the soft template with the OTS self-assembled monolayer formed in step b is closely attached to the surface of the composite substrate after the process in step c, and maintains a certain daytime And the OT s self-assembled monolayer is transferred from the soft template to the composite substrate, and then the soft template is removed to prepare a patterned composite substrate;
- the surface of the substrate corresponding to the soft template after the surface energy treatment process is improved has higher surface energy
- the soft template is a PDMS template.
- the step b further includes the following steps:
- a formulated OTS-n-hexane solution is applied to the soft template and the solvent component is completely volatilized to form an OTS self-assembled monolayer on the soft template.
- the volume ratio of OTS to n-hexane is 0.5: 1000-2:100
- the step c further includes the following steps:
- Curing was carried out continuously for 3-7 hours at a temperature of 0 °C.
- the surface to be patterned of the composite substrate is processed by a plasma treatment technique.
- step d Preferably, in the step d,
- the step e further includes the following steps: [0028] Weigh a certain amount of gold nanoparticles, add it to acetone, make a gold nanoparticle-acetone solution, and perform ultrasonic dispersion of a certain length;
- the obtained gold nano-dispersion is applied to the surface of the composite substrate, and the solvent component is completely volatilized, thereby depositing gold nanoparticles in the non-patterned region of the patterned composite substrate.
- the gold nanoparticle-acetone solution has a mass concentration of 0.05-3 g/ml.
- the method for manufacturing a metamaterial in the present application the process for preparing a metamaterial by making a large surface energy difference between a soft template and a composite substrate, and between the OTS assembly layer and the composite substrate during the process It has strong implementability, high manufacturing efficiency, and the obtained microstructure structure is accurate in size and has excellent electromagnetic corresponding characteristics.
- FIG. 1 is a schematic view showing the structure of a pre-coupling of a metamaterial and a soft template for preparing a metamaterial, respectively, according to an embodiment of the present invention.
- FIG. 2 shows a schematic structural view of a metamaterial according to an embodiment of the present invention.
- FIG. 3 shows a schematic structural diagram of a soft template according to an embodiment of the present invention.
- metamaterial 1 soft template 2
- substrate 11 microstructure layer 12
- mouth resonance ring 131 groove 21.
- the metamaterial 1 includes a substrate 11 and a microstructure layer 12 disposed on the substrate 11.
- the microstructure layer 12 includes a metal microstructure pattern.
- the microstructure pattern includes a plurality of pattern units, and the plurality of pattern units are arranged in accordance with a predetermined rule to form a structure having a specific electromagnetic response characteristic.
- the plurality of pattern elements are respectively the mouth ring resonance ring 131.
- FIG. 4 shows a flow chart of a method of manufacturing a metamaterial according to an embodiment of the present invention. As shown in Fig. 4, the preparation process of the metamaterial 1 is as shown in steps S01-S05.
- steps S01-S05 the preparation process of the metamaterial 1 is as shown in steps S01-S05.
- Embodiment 1 is a diagrammatic representation of Embodiment 1 :
- step S01 referring to FIG. 1, a soft template 2 having a pattern opposite to the microstructure of the metamaterial 1 is prepared.
- the pattern formed on the surface of the rigid substrate is a plurality of groove-shaped recesses 21 defined by the photoresist, which are matched to the shape of the mouthpiece resonance ring 131.
- step S02 an OTS self-assembled monolayer having the same microstructure pattern as the soft template is formed on the soft template 2.
- the step further includes the following steps:
- the formulated OTS-n-hexane solution is applied, for example, to the pattern of the soft template 2, which in this embodiment is the groove 21 of the weir-removing ring shown in FIG. Other parts outside.
- the solvent component is completely volatilized to form an OTS self-assembled monolayer on the soft template 2.
- the method further includes the following steps:
- the surface to be patterned of the composite substrate 11 is processed by a plasma treatment technique to improve the surface of the composite substrate 11. Can, thereby increasing the adhesion of its surface, such as adhesion to OTS. After the treatment, the surface energy of the composite substrate 11 is greatly improved, and the surface of the soft template 2 is more distinguished.
- step S04 the OTS self-assembled single layer side of the soft template 2 having the OTS self-assembled single layer formed in step S02 is closely attached to the surface of the composite substrate 11 after the process in step S03, And maintaining for 3 minutes until the OTS self-assembled monolayer is transferred from the soft template 2 onto the composite substrate 11, and then the soft template 2 is removed to prepare a patterned composite substrate 11.
- step S05 gold nanoparticles are deposited in the non-pattern area of the patterned composite substrate 11 to form the microstructure pattern.
- the step further includes the following steps:
- the prepared gold nano-dispersion is applied to the surface of the composite substrate 11, and the solvent component is completely volatilized, thereby depositing gold nanoparticles on the surface of the composite substrate 11.
- the coating process may specifically be spin coating or dispensing.
- the gold particles spontaneously deposit in the patterned groove 21 with a patterning compound having a strong surface energy.
- Table of substrate 11 After the gold nanoparticles are deposited in the patterned grooves 21 of the patterned composite substrate 11, a microstructure layer 12 formed of a gold material as shown in FIG. 2 is formed in the deposition region.
- the pattern structure is precisely dimensioned, so that the metamaterial 1 has a superb material 1 having excellent electromagnetic corresponding characteristics.
- the microstructure pattern is specifically a plurality of mouth-resonant resonant ring 131 patterns.
- step S01 a soft template 2 having a pattern opposite to the microstructure of the metamaterial 1 is prepared.
- the soft template 2 is a PDMS template, which is made of PDMS, that is, a polydimethylsiloxane material, has good flexibility, and has a low surface energy, such that its surface pair is, for example. Materials such as octadecyltrichlorosilane (OTS) have less adhesion.
- the soft template 2 is prepared by using a photolithography method to form a pattern opposite to the microstructure on the surface of the hard substrate.
- the pattern opposite to the microstructure in this embodiment means that patterned light is disposed on the surface of the hard substrate. Engraving, wherein a portion corresponding to the microstructure is left blank, and other portions are provided as a photoresist.
- step S02 an OTS self-assembled monolayer having the same microstructure pattern as the soft template is formed on the soft template 2.
- the step further includes the following steps:
- step S03 the composite substrate 11 is prepared, and the composite substrate 11 is subjected to a process for improving surface energy.
- the method further includes the following steps: [0070] S031), in preparing the composite substrate 11 ⁇ , alternately stacking epoxy resin and glass fiber prepreg, and forming an angle of 90 degrees between the epoxy resin and the glass fiber prepreg of the adjacent layer Laying, that is, the laying of the epoxy resin and the glass fiber prepreg of the adjacent layers in a crisscross manner; placing the laid multilayer epoxy resin and the glass fiber prepreg in a vacuum environment, such as a vacuum bag, And curing at 5 ° C for 5 hours;
- the surface to be patterned of the composite substrate 11 is processed by a plasma treatment technique to increase the surface of the composite substrate 11. Can, thereby increasing the adhesion of its surface, such as adhesion to OTS. After the treatment, the surface energy of the composite substrate 11 is greatly improved, and the surface of the soft template 2 is more distinguished.
- step S04 the OTS self-assembled single layer side of the soft template 2 having the OTS self-assembled single layer formed in step S02 is closely attached to the surface of the composite substrate 11 after the process in step S03, And maintaining for 5 minutes until the OTS self-assembled monolayer is transferred from the soft template 2 onto the composite substrate 11, and then the soft template 2 is removed to prepare a patterned composite substrate 11.
- the OT S self-assembled monolayer is transferred from the soft template 2 to the composite substrate 11, and then compared. It is easy to separate from the soft template 2 so that blocking does not occur.
- step S05 gold nanoparticles are deposited in the non-pattern area of the patterned composite substrate 11 to form the microstructure pattern.
- the step further includes the following steps:
- the gold particles spontaneously deposit in the patterned groove 21 and have a strong surface energy patterning.
- a microstructure layer 12 formed of a gold material as shown in FIG. 2 is formed in the deposition region.
- the pattern structure is accurate in size.
- a metamaterial 1 having excellent electromagnetic corresponding characteristics is obtained.
- the microstructure pattern is specifically a plurality of mouth-resonant resonant ring 131 patterns.
- step S01 a soft template 2 having a pattern opposite to the microstructure of the metamaterial 1 is prepared.
- the pattern processed on the surface of the hard substrate matches the shape of the mouth resonant ring 131.
- a plurality of grooved annular grooves 21 defined by the photoresist After obtaining the hard substrate with the patterned photoresist, it was used as the original template for imprint transfer.
- the organic PDMS material is then applied to the surface of the hard substrate with the patterned photoresist and dried under vacuum.
- step S02 an OTS self-assembled monolayer having the same microstructure pattern as the soft template is formed on the soft template. Specifically, the step further includes the following steps:
- step S03 the composite substrate 11 is prepared, and the composite substrate 11 is subjected to a process of improving surface energy.
- the method further includes the following steps:
- the surface to be patterned of the composite substrate 11 is processed by a plasma treatment technique to increase the surface of the composite substrate 11. Can, thereby increasing the adhesion of its surface, such as adhesion to OTS. After the treatment, the surface energy of the composite substrate 11 is greatly improved, and the surface of the soft template 2 is more distinguished.
- the OT S self-assembled monolayer is transferred from the soft template 2 to the composite substrate 11, and then compared. It is easy to separate from the soft template 2 so that blocking does not occur.
- step S05 gold nanoparticles are deposited in the non-pattern area of the patterned composite substrate 11 to form the microstructure pattern.
- the step further includes the following steps:
- the prepared gold nano-dispersion is applied to the surface of the composite substrate 11, and the solvent component is completely volatilized, thereby depositing gold nanoparticles on the surface of the composite substrate 11.
- the coating process may specifically be spin coating or dispensing.
- the gold particles spontaneously deposit in the patterned groove 21 and have a patterning compound with strong surface energy.
- a microstructure layer 12 formed of a gold material as shown in FIG. 2 is formed in the deposition region.
- the microstructure pattern is specifically a plurality of mouth-resonant ring 131 patterns.
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Abstract
Description
发明名称:超材料制造方法 Title of Invention: Method for manufacturing supermaterials
技术领域 Technical field
[0001] 本发明涉及超材料技术领域, 更具体地, 涉及一种超材料制造方法。 [0001] The present invention relates to the field of metamaterial technology, and more particularly to a method of manufacturing a metamaterial.
背景技术 Background technique
[0002] 目前超材料加工主要依托于光刻技术以及其它平板刻蚀工艺 (如离子束刻蚀、 电子束刻蚀、 X-射线刻蚀等) 。 相比于这些技术, 丝网印刷、 喷墨打印等通过 溶液加工制备超材料, 可与 roll-to-roll工艺兼容, 是比较有潜力的超材料制造工 [0002] At present, metamaterial processing mainly relies on lithography and other flat etching processes (such as ion beam etching, electron beam etching, X-ray etching, etc.). Compared with these technologies, screen printing, inkjet printing, etc. are prepared by solution processing to prepare metamaterials, which are compatible with the roll-to-roll process, and are potential metamaterial manufacturers.
[0003] 超材料由介质基材及微结构组成, 超材料制造的关键技术是微结构的加工, 现 有制造工艺存在的缺陷如下: [0003] Metamaterials consist of a dielectric substrate and a microstructure. The key technology for the manufacture of metamaterials is the processing of microstructures. The defects of the existing manufacturing processes are as follows:
[0004] (1)光刻及平板刻蚀工艺虽然加工精度高, 但是成本很高, 并且工艺复杂。 除 此之外, 平板印刷难以实现柔性基材上超材料微结构的加工, 因而限制了超材 料在特定领域 (如曲面及特殊表面) 的应用。 [0004] (1) Photolithography and flat etching processes have high processing precision, but are costly and complicated in process. In addition, lithography is difficult to process ultra-material microstructures on flexible substrates, thus limiting the use of supermaterials in specific areas such as curved surfaces and special surfaces.
[0005] (2)丝网印刷及喷墨打印技术可实现大面积超材料制备, 但也需要成本较高的 仪器 (高精度丝网印刷机、 高精度喷墨打印机) 。 [0005] (2) Screen printing and inkjet printing technology can realize large-area super material preparation, but also requires high-cost instruments (high-precision screen printing machine, high-precision inkjet printer).
技术问题 technical problem
[0006] 综上, 现有的超材料制作工艺存在加工费用高、 可实施性差, 以及加工精度低 等缺点, 不能满足超材料技术的要求。 [0006] In summary, the existing super material manufacturing processes have disadvantages such as high processing cost, poor implementability, and low processing precision, and cannot meet the requirements of metamaterial technology.
问题的解决方案 Problem solution
技术解决方案 Technical solution
[0007] 有鉴于此, 本发明的目的在于提供可实施性强, 制造效率高, 并且获得的微结 构结构尺寸精准, 具有极好的电磁相应特性的超材料制造方法。 In view of the above, an object of the present invention is to provide a method for producing a metamaterial having high performance, high manufacturing efficiency, and accurate microstructural structure and excellent electromagnetic corresponding characteristics.
[0008] 根据本发明提供一种超材料制造方法, 包括以下步骤: [0008] According to the present invention, there is provided a method of manufacturing a metamaterial comprising the steps of:
[0009] a、 制备与超材料的微结构具有相反图案的软模板; [0009] a, preparing a soft template having an opposite pattern to the microstructure of the metamaterial;
[0010] b、 在所述软模板上形成与所述软模板具有相同微结构图案的 OTS自组装单层 [0011] c、 制备复合基板, 并对所述复合基板进行提高表面能的工艺处理; [0010] b forming an OTS self-assembled monolayer having the same microstructure pattern as the soft template on the soft template [0011] c, preparing a composite substrate, and performing a process for improving the surface energy of the composite substrate;
[0012] d、 将步骤 b中形成的具有 OTS自组装单层的软模板的 OTS自组装单层一侧紧密 贴附到步骤 c中复合基板经工艺处理后的表面上, 并保持一定吋间, 直至所述 OT s自组装单层自所述软模板转移到所述复合基板上, 然后取下所述软模板, 制备 得到图案化复合基板; [0012] d, the OTS self-assembled single layer side of the soft template with the OTS self-assembled monolayer formed in step b is closely attached to the surface of the composite substrate after the process in step c, and maintains a certain daytime And the OT s self-assembled monolayer is transferred from the soft template to the composite substrate, and then the soft template is removed to prepare a patterned composite substrate;
[0013] e、 将金纳米颗粒沉积于所述图案化复合基板的非图案区域内, 形成所述微结 构图案; 其中, [0013] e, depositing gold nanoparticles in the non-patterned region of the patterned composite substrate to form the microstructure pattern;
[0014] 经提高表面能工艺处理后的所述符合基板相对软模板的表面具有更高的表面能 [0014] the surface of the substrate corresponding to the soft template after the surface energy treatment process is improved has higher surface energy
, 使得在步骤 d中, OTS自组装单层能够自所述软模板转移到所述复合基板上。 Thus, in step d, an OTS self-assembled monolayer can be transferred from the soft template to the composite substrate.
[0015] 优选地, 所述软模板为 PDMS模板。 [0015] Preferably, the soft template is a PDMS template.
[0016] 优选地, 所述步骤 b还包括以下步骤: [0016] Preferably, the step b further includes the following steps:
[0017] 配制 OTS-正己烷溶液; [0017] preparing an OTS-n-hexane solution;
[0018] 将配制的 OTS-正己烷溶液施加到所述软模板上, 并使溶剂成分完全挥发, 从而 在所述软模板上形成 OTS自组装单层。 [0018] A formulated OTS-n-hexane solution is applied to the soft template and the solvent component is completely volatilized to form an OTS self-assembled monolayer on the soft template.
[0019] 优选地, 在配制 OTS-正己烷溶液吋, OTS与正己烷的体积比为 0.5: 1000-2:100[0019] Preferably, in the preparation of OTS-n-hexane solution, the volume ratio of OTS to n-hexane is 0.5: 1000-2:100
0。 0.
[0020] 优选地, 所述步骤 c还包括以下步骤: [0020] Preferably, the step c further includes the following steps:
[0021] 在制备所述复合基板吋, 将环氧树脂和玻璃纤维预浸料依次叠置多层, 并且相 邻层的环氧树脂和玻璃纤维预浸料之间呈 90角铺设; [0021] In preparing the composite substrate, the epoxy resin and the glass fiber prepreg are sequentially stacked in multiple layers, and the epoxy resin and the glass fiber prepreg of the adjacent layer are laid at a 90-degree angle;
[0022] 将铺设好的多层环氧树脂和玻璃纤维预浸料进行固化。 [0022] The laid multilayer epoxy resin and glass fiber prepreg are cured.
[0023] 优选地, 将铺设好的多层环氧树脂和玻璃纤维预浸料进行固化吋, 在 100°C-14 [0023] Preferably, the laid multilayer epoxy resin and the glass fiber prepreg are cured, at 100 ° C -14
0°C的温度下, 连续进行 3-7小吋的固化。 Curing was carried out continuously for 3-7 hours at a temperature of 0 °C.
[0024] 优选地, 所述步骤 c中, 在对所述复合基板进行提高表面能的工艺处理吋, 采 用等离子体处理技术对所述复合基板待图案化的表面进行处理。 [0024] Preferably, in the step c, after the surface treatment of the composite substrate is performed, the surface to be patterned of the composite substrate is processed by a plasma treatment technique.
[0025] 优选地, 所述步骤 d中, [0025] Preferably, in the step d,
[0026] 将具有 OTS自组装单层的软模板的 OTS自组装单层一侧紧密贴附到所述复合基 板经工艺处理后的表面上后, 需保持 3-5分钟的贴附吋间, 再取下所述软模板。 [0026] After attaching the OTS self-assembled single layer side of the soft template with the OTS self-assembled single layer to the surface of the composite substrate after the process, it is necessary to maintain the 3-5 minute attachment time. Then remove the soft template.
[0027] 优选地, 所述步骤 e还包括以下步骤: [0028] 称取一定量金纳米颗粒, 将其加入丙酮中, 制成金纳米颗粒 -丙酮溶液, 并进 行一定吋长的超声分散; [0027] Preferably, the step e further includes the following steps: [0028] Weigh a certain amount of gold nanoparticles, add it to acetone, make a gold nanoparticle-acetone solution, and perform ultrasonic dispersion of a certain length;
[0029] 将制得的金纳米分散液涂敷于所述复合基板表面, 并使溶剂成分完全挥发, 从 而使金纳米颗粒沉积于所述图案化复合基板的非图案区域内。 [0029] The obtained gold nano-dispersion is applied to the surface of the composite substrate, and the solvent component is completely volatilized, thereby depositing gold nanoparticles in the non-patterned region of the patterned composite substrate.
[0030] 优选地, 所述金纳米颗粒-丙酮溶液的质量浓度为 0.05-3g/ml。 [0030] Preferably, the gold nanoparticle-acetone solution has a mass concentration of 0.05-3 g/ml.
[0031] 优选地, 将制得的金纳米分散液涂敷于所述复合基板表面吋, 采用旋涂或者滴 涂方式。 [0031] Preferably, the prepared gold nano-dispersion is applied to the surface of the composite substrate by spin coating or dripping.
发明的有益效果 Advantageous effects of the invention
有益效果 Beneficial effect
[0032] 本申请中的超材料制造方法, 通过在工艺过程中, 使得软模板与复合基板之间 , 以及 OTS组装层与复合基板之间具有较大的表面能差异, 使得超材料的制备工 艺可实施性强, 制造效率高, 并且获得的微结构结构尺寸精准, 具有极好的电 磁相应特性。 [0032] The method for manufacturing a metamaterial in the present application, the process for preparing a metamaterial by making a large surface energy difference between a soft template and a composite substrate, and between the OTS assembly layer and the composite substrate during the process It has strong implementability, high manufacturing efficiency, and the obtained microstructure structure is accurate in size and has excellent electromagnetic corresponding characteristics.
对附图的简要说明 Brief description of the drawing
附图说明 DRAWINGS
[0033] 通过以下参照附图对本发明实施例的描述, 本发明的上述以及其他目的、 特征 和优点将更为清楚。 The above and other objects, features and advantages of the present invention will become apparent from
[0034] 图 1分别示出了根据本发明实施例的超材料与制备超材料的软模板预配合的结 构示意图。 1 is a schematic view showing the structure of a pre-coupling of a metamaterial and a soft template for preparing a metamaterial, respectively, according to an embodiment of the present invention.
[0035] 图 2示出了根据本发明实施例的超材料的结构示意图。 2 shows a schematic structural view of a metamaterial according to an embodiment of the present invention.
[0036] 图 3示出了根据本发明实施例的软模板的结构示意图。 3 shows a schematic structural diagram of a soft template according to an embodiment of the present invention.
[0037] 图 4示出了根据本发明实施例的超材料制造方法的流程图。 4 shows a flow chart of a method of manufacturing a metamaterial according to an embodiment of the present invention.
[0038] 图中: 超材料 1、 软模板 2、 基板 11、 微结构层 12、 幵口谐振环 131、 凹槽 21。 [0038] In the figure: metamaterial 1, soft template 2, substrate 11, microstructure layer 12, mouth resonance ring 131, groove 21.
本发明的实施方式 Embodiments of the invention
[0039] 以下将参照附图更详细地描述本发明的各种实施例。 在各个附图中, 相同的元 件采用相同或类似的附图标记来表示。 为了清楚起见, 附图中的各个部分没有 按比例绘制。 [0039] Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In the various figures, the same elements are denoted by the same or similar reference numerals. For the sake of clarity, the various parts of the drawing are not Draw proportionally.
[0040] 如图 1-3所示, 该超材料 1包括一基板 11和设于该基板 11上的微结构层 12。 所述 微结构层 12包括金属微结构图案。 所述微结构图案包括多个图案单元, 多个图 案单元按照预定规则排布, 形成具有特定电磁响应特性的结构。 在该实施例中 , 所述多个图案单元分别为幵口谐振环 131。 [0040] As shown in FIGS. 1-3, the metamaterial 1 includes a substrate 11 and a microstructure layer 12 disposed on the substrate 11. The microstructure layer 12 includes a metal microstructure pattern. The microstructure pattern includes a plurality of pattern units, and the plurality of pattern units are arranged in accordance with a predetermined rule to form a structure having a specific electromagnetic response characteristic. In this embodiment, the plurality of pattern elements are respectively the mouth ring resonance ring 131.
[0041] 图 4示出了根据本发明实施例的超材料制造方法的流程图。 如图 4所示, 超材料 1的制备工艺如步骤 S01-S05所示。 请同吋参考附图 1-3, 下面具体结合实施例 1至 实施例 3进行详细说明。 4 shows a flow chart of a method of manufacturing a metamaterial according to an embodiment of the present invention. As shown in Fig. 4, the preparation process of the metamaterial 1 is as shown in steps S01-S05. Referring to the drawings 1-3, the following detailed description will be given in detail with reference to Embodiment 1 to Embodiment 3.
[0042] 实施例 1 : Embodiment 1 :
[0043] 在步骤 S01中, 请参阅图 1, 制备具有与超材料 1的微结构相反图案的软模板 2。 [0043] In step S01, referring to FIG. 1, a soft template 2 having a pattern opposite to the microstructure of the metamaterial 1 is prepared.
[0044] 具体的, 所述软模板 2为 PDMS模板, 由 PDMS , 即聚二甲基硅氧烷材料制成, 具有较好的柔韧性, 并且具有较低的表面能, 使得其表面对例如十八烷基三氯 硅烷 (OTS)等材料具有较小的附着力。 所述软模板 2的制备可采用光刻方法在一 硬质基底表面上形成与微结构相反的图案, 本实施例的与微结构相反的图案是 指在硬质基底表面上设置图案化的光刻胶, 其中与微结构相对应的部分留空, 而其它部分设置为光刻胶。 如图 3所示, 在硬质基底表面上形成的图案为与所述 幵口谐振环 131形状尺寸相配的多个由光刻胶限定的幵口环状的凹槽 21。 获取带 有图案化光刻胶的所述硬质基底后, 将其作为压印转移的原始模板。 然后在带 有图案化光刻胶的硬质基底表面涂敷有机 PDMS材料, 经真空干燥后即可制成。 [0044] Specifically, the soft template 2 is a PDMS template, which is made of PDMS, that is, a polydimethylsiloxane material, has good flexibility, and has a low surface energy, such that its surface pair is, for example. Materials such as octadecyltrichlorosilane (OTS) have less adhesion. The soft template 2 is prepared by using a photolithography method to form a pattern opposite to the microstructure on the surface of the hard substrate. The pattern opposite to the microstructure in this embodiment means that patterned light is disposed on the surface of the hard substrate. The engraving is performed, wherein a portion corresponding to the microstructure is left blank, and the other portion is provided as a photoresist. As shown in Fig. 3, the pattern formed on the surface of the rigid substrate is a plurality of groove-shaped recesses 21 defined by the photoresist, which are matched to the shape of the mouthpiece resonance ring 131. After obtaining the hard substrate with the patterned photoresist, it was used as the original template for imprint transfer. The organic PDMS material is then applied to the surface of the rigid substrate with the patterned photoresist and dried under vacuum.
[0045] 在步骤 S02中, 在所述软模板 2上形成与所述软模板具有相同微结构图案的 OTS 自组装单层。 [0045] In step S02, an OTS self-assembled monolayer having the same microstructure pattern as the soft template is formed on the soft template 2.
[0046] 具体的, 该步骤又包括如下步骤: [0046] Specifically, the step further includes the following steps:
[0047] S021) 、 按照 OTS与正己烷的体积比为 0.5: 1000的比例配制 OTS-正己烷溶液 [0047] S021), according to the ratio of OTS to n-hexane volume ratio of 0.5: 1000 to prepare OTS-n-hexane solution
[0048] S022) 、 将配制的 OTS-正己烷溶液施加到, 例如滴注于所述软模板 2的图案上 , 在该实施例中为图 3所示的除幵口环状的凹槽 21外的其他部分。 并使溶剂成分 完全挥发, 从而在所述软模板 2上形成 OTS自组装单层。 [0221] S022), the formulated OTS-n-hexane solution is applied, for example, to the pattern of the soft template 2, which in this embodiment is the groove 21 of the weir-removing ring shown in FIG. Other parts outside. The solvent component is completely volatilized to form an OTS self-assembled monolayer on the soft template 2.
[0049] 在步骤 S03中, 制备复合基板 11, 并对所述复合基板 11进行提高表面能的工艺 处理。 [0049] In step S03, the composite substrate 11 is prepared, and the surface of the composite substrate 11 is improved. deal with.
[0050] 具体的, 又包括如下步骤: [0050] Specifically, the method further includes the following steps:
[0051] S031) 、 在制备所述复合基板 11吋, 将环氧树脂和玻璃纤维预浸料交替叠置多 层, 并且相邻层的环氧树脂和玻璃纤维预浸料之间呈 90角铺设, 即相邻层的环 氧树脂和玻璃纤维预浸料之间彼此纵横交错的铺设; 将铺设好的多层环氧树脂 和玻璃纤维预浸料置于真空环境中, 例如真空袋中, 并在 100°C的温度下, 进行 3 小吋的固化处理; [0051] S031), in preparing the composite substrate 11吋, alternately stacking epoxy resin and glass fiber prepreg, and forming an angle of 90 degrees between the epoxy resin and the glass fiber prepreg of the adjacent layer Laying, that is, the laying of the epoxy resin and the glass fiber prepreg of the adjacent layers in a crisscross manner; placing the laid multilayer epoxy resin and the glass fiber prepreg in a vacuum environment, such as a vacuum bag, And curing at a temperature of 100 ° C for 3 hours;
[0052] S032) 、 在对所述复合基板 11进行提高表面能的工艺处理吋, 采用等离子体处 理技术对所述复合基板 11待图案化的表面进行处理, 以便提高所述复合基板 11 的表面能, 从而提高其表面的附着力, 例如对 OTS的附着力。 经过处理后, 所述 复合基板 11的表面能大大提高, 相对所述软模板 2具有更的表面能区分度。 [0052] S032), after the surface treatment of the composite substrate 11 is performed, the surface to be patterned of the composite substrate 11 is processed by a plasma treatment technique to improve the surface of the composite substrate 11. Can, thereby increasing the adhesion of its surface, such as adhesion to OTS. After the treatment, the surface energy of the composite substrate 11 is greatly improved, and the surface of the soft template 2 is more distinguished.
[0053] 在步骤 S04中, 将步骤 S02中形成的具有 OTS自组装单层的软模板 2的 OTS自组 装单层一侧紧密贴附到步骤 S03中复合基板 11经工艺处理后的表面上, 并保持 3 分钟, 直至所述 OTS自组装单层自所述软模板 2转移到所述复合基板 11上, 然后 取下所述软模板 2, 制备得到图案化复合基板 11。 [0053] In step S04, the OTS self-assembled single layer side of the soft template 2 having the OTS self-assembled single layer formed in step S02 is closely attached to the surface of the composite substrate 11 after the process in step S03, And maintaining for 3 minutes until the OTS self-assembled monolayer is transferred from the soft template 2 onto the composite substrate 11, and then the soft template 2 is removed to prepare a patterned composite substrate 11.
[0054] 在该步骤中, 由于软模板 2与复合基板 11具有较大的表面能差异, 使得所述 OT S自组装单层自所述软模板 2转移到所述复合基板 11上后, 比较容易与所述软模 板 2相脱离, 从而不会发生粘连。 [0054] In this step, since the soft template 2 and the composite substrate 11 have a large difference in surface energy, the OT S self-assembled monolayer is transferred from the soft template 2 to the composite substrate 11, and then compared. It is easy to separate from the soft template 2 so that blocking does not occur.
[0055] 在步骤 S05中, 将金纳米颗粒沉积于所述图案化复合基板 11的非图案区域内, 形成所述微结构图案。 [0055] In step S05, gold nanoparticles are deposited in the non-pattern area of the patterned composite substrate 11 to form the microstructure pattern.
[0056] 具体的, 该步骤又包括如下步骤: [0056] Specifically, the step further includes the following steps:
[0057] S051) 、 称取一定量金纳米颗粒, 将其加入丙酮中, 制成质量浓度为 0.05g/ml 的金纳米颗粒 -丙酮溶液, 并进行一定吋长的超声分散; [0511] S051), weigh a certain amount of gold nanoparticles, added to acetone, to make a gold nanoparticle-acetone solution with a concentration of 0.05g / ml, and a certain length of ultrasonic dispersion;
[0058] S052) 、 将制得的金纳米分散液涂敷于所述复合基板 11表面, 并使溶剂成分完 全挥发, 从而使金纳米颗粒沉积于所述复合基板 11表面。 所述涂敷工艺具体可 为旋涂或者滴涂。 [0058] S052), the prepared gold nano-dispersion is applied to the surface of the composite substrate 11, and the solvent component is completely volatilized, thereby depositing gold nanoparticles on the surface of the composite substrate 11. The coating process may specifically be spin coating or dispensing.
[0059] 在该步骤中, 由于所述复合基板 11与 OTS自组装单层表面能的较大差异, 金颗 粒会自发沉积于图案化的凹槽 21内的具有较强表面能的图案化复合基板 11的表 面, 即将金纳米颗粒沉积于所述图案化复合基板 11的图案化凹槽 21内后, 在沉 积区内形成如图 2所示的由金材料形成的微结构层 12。 图案结构尺寸精准, 从而 使得超材料 1具有优异的电磁相应特性的超材料 1。 在该实施例中, 所述微结构 图案具体为多个幵口谐振环 131图案。 [0059] In this step, due to the large difference in the surface energy of the self-assembled monolayer of the composite substrate 11 and the OTS, the gold particles spontaneously deposit in the patterned groove 21 with a patterning compound having a strong surface energy. Table of substrate 11 After the gold nanoparticles are deposited in the patterned grooves 21 of the patterned composite substrate 11, a microstructure layer 12 formed of a gold material as shown in FIG. 2 is formed in the deposition region. The pattern structure is precisely dimensioned, so that the metamaterial 1 has a superb material 1 having excellent electromagnetic corresponding characteristics. In this embodiment, the microstructure pattern is specifically a plurality of mouth-resonant resonant ring 131 patterns.
[0060] 实施例 2: Example 2:
[0061] 在步骤 S01中, 制备具有与超材料 1的微结构相反图案的软模板 2。 [0061] In step S01, a soft template 2 having a pattern opposite to the microstructure of the metamaterial 1 is prepared.
[0062] 具体的, 所述软模板 2为 PDMS模板, 由 PDMS , 即聚二甲基硅氧烷材料制成, 具有较好的柔韧性, 并且具有较低的表面能, 使得其表面对例如十八烷基三氯 硅烷 (OTS) 等材料具有较小的附着力。 所述软模板 2的制备可采用光刻方法在 一硬质基底表面上形成与微结构相反的图案, 本实施例的与微结构相反的图案 是指在硬质基底表面上设置图案化的光刻胶, 其中与微结构相对应的部分留空 , 而其它部分设置为光刻胶在该实施例中, 在硬质基底表面上所形成的图案为 与所述幵口谐振环 131形状尺寸相配的多个由光刻胶限定的幵口环状的凹槽 21。 获取带有图案化光刻胶的所述硬质基底后, 将其作为压印转移的原始模板。 然 后在带有图案化光刻胶的硬质基底表面涂敷有机 PDMS材料, 经真空干燥后即可 制成。 [0062] Specifically, the soft template 2 is a PDMS template, which is made of PDMS, that is, a polydimethylsiloxane material, has good flexibility, and has a low surface energy, such that its surface pair is, for example. Materials such as octadecyltrichlorosilane (OTS) have less adhesion. The soft template 2 is prepared by using a photolithography method to form a pattern opposite to the microstructure on the surface of the hard substrate. The pattern opposite to the microstructure in this embodiment means that patterned light is disposed on the surface of the hard substrate. Engraving, wherein a portion corresponding to the microstructure is left blank, and other portions are provided as a photoresist. In this embodiment, a pattern formed on the surface of the hard substrate is matched with the shape and size of the mouth ring resonance ring 131. A plurality of grooved annular grooves 21 defined by the photoresist. After obtaining the hard substrate with the patterned photoresist, it was used as the original template for imprint transfer. The organic PDMS material is then applied to the surface of the rigid substrate with the patterned photoresist and dried under vacuum.
[0063] 在步骤 S02中, 在所述软模板 2上形成与所述软模板具有相同微结构图案的 OTS 自组装单层。 [0063] In step S02, an OTS self-assembled monolayer having the same microstructure pattern as the soft template is formed on the soft template 2.
[0064] 具体的, 该步骤又包括如下步骤: [0064] Specifically, the step further includes the following steps:
[0065] S021) 、 按照 OTS与正己烷的体积分数为 1 : 1000的比例配制 OTS-正己烷溶液 [0215] S021), according to the ratio of OTS and n-hexane volume fraction of 1: 1000 to prepare OTS-n-hexane solution
[0066] S022) 、 将配制的 OTS-正己烷溶液施加到, 例如滴注于所述软模板 2图案上。 [0221] S022), applying the formulated OTS-n-hexane solution to, for example, dropping onto the soft template 2 pattern.
在该实施例中为如图 3所示的除幵口环状的凹槽 21外的其他部分并使溶剂成分完 全挥发, 从而在所述软模板 2上形成 OTS自组装单层。 In this embodiment, the portion other than the annular groove 21 shown in Fig. 3 and the solvent component are completely volatilized, thereby forming an OTS self-assembled monolayer on the soft template 2.
[0067] [0067]
[0068] 在步骤 S03中, 制备复合基板 11, 并对所述复合基板 11进行提高表面能的工艺 处理。 [0068] In step S03, the composite substrate 11 is prepared, and the composite substrate 11 is subjected to a process for improving surface energy.
[0069] 具体的, 又包括如下步骤: [0070] S031) 、 在制备所述复合基板 11吋, 将环氧树脂和玻璃纤维预浸料交替叠置多 层, 并且相邻层的环氧树脂和玻璃纤维预浸料之间呈 90角铺设, 即相邻层的环 氧树脂和玻璃纤维预浸料之间彼此纵横交错的铺设; 将铺设好的多层环氧树脂 和玻璃纤维预浸料置于真空环境中, 例如真空袋中, 并在 125°C的温度下, 进行 5 小吋的固化处理; [0069] Specifically, the method further includes the following steps: [0070] S031), in preparing the composite substrate 11吋, alternately stacking epoxy resin and glass fiber prepreg, and forming an angle of 90 degrees between the epoxy resin and the glass fiber prepreg of the adjacent layer Laying, that is, the laying of the epoxy resin and the glass fiber prepreg of the adjacent layers in a crisscross manner; placing the laid multilayer epoxy resin and the glass fiber prepreg in a vacuum environment, such as a vacuum bag, And curing at 5 ° C for 5 hours;
[0071] S032) 、 在对所述复合基板 11进行提高表面能的工艺处理吋, 采用等离子体处 理技术对所述复合基板 11待图案化的表面进行处理, 以便提高所述复合基板 11 的表面能, 从而提高其表面的附着力, 例如对 OTS的附着力。 经过处理后, 所述 复合基板 11的表面能大大提高, 相对所述软模板 2具有更的表面能区分度。 [0321] S032), after the surface treatment of the composite substrate 11 is performed, the surface to be patterned of the composite substrate 11 is processed by a plasma treatment technique to increase the surface of the composite substrate 11. Can, thereby increasing the adhesion of its surface, such as adhesion to OTS. After the treatment, the surface energy of the composite substrate 11 is greatly improved, and the surface of the soft template 2 is more distinguished.
[0072] 在步骤 S04中, 将步骤 S02中形成的具有 OTS自组装单层的软模板 2的 OTS自组 装单层一侧紧密贴附到步骤 S03中复合基板 11经工艺处理后的表面上, 并保持 5 分钟, 直至所述 OTS自组装单层自所述软模板 2转移到所述复合基板 11上, 然后 取下所述软模板 2, 制备得到图案化复合基板 11。 [0072] In step S04, the OTS self-assembled single layer side of the soft template 2 having the OTS self-assembled single layer formed in step S02 is closely attached to the surface of the composite substrate 11 after the process in step S03, And maintaining for 5 minutes until the OTS self-assembled monolayer is transferred from the soft template 2 onto the composite substrate 11, and then the soft template 2 is removed to prepare a patterned composite substrate 11.
[0073] 在该步骤中, 由于软模板 2与复合基板 11具有较大的表面能差异, 使得所述 OT S自组装单层自所述软模板 2转移到所述复合基板 11上后, 比较容易与所述软模 板 2相脱离, 从而不会发生粘连。 [0073] In this step, since the soft template 2 and the composite substrate 11 have a large difference in surface energy, the OT S self-assembled monolayer is transferred from the soft template 2 to the composite substrate 11, and then compared. It is easy to separate from the soft template 2 so that blocking does not occur.
[0074] 在步骤 S05中, 将金纳米颗粒沉积于所述图案化复合基板 11的非图案区域内, 形成所述微结构图案。 [0074] In step S05, gold nanoparticles are deposited in the non-pattern area of the patterned composite substrate 11 to form the microstructure pattern.
[0075] 具体的, 该步骤又包括如下步骤: [0075] Specifically, the step further includes the following steps:
[0076] S051) 、 称取一定量金纳米颗粒, 将其加入丙酮中, 制成质量浓度为 1.5g/ml的 金纳米颗粒 -丙酮溶液, 并进行一定吋长的超声分散; [0516] S051), weigh a certain amount of gold nanoparticles, add it to acetone, to make a gold nanoparticle-acetone solution with a concentration of 1.5g / ml, and perform ultrasonic dispersion of a certain length;
[0077] S052) 、 将制得的金纳米分散液涂敷于所述复合基板 11表面, 并使溶剂成分完 全挥发, 从而使金纳米颗粒沉积于所述复合基板 11表面。 所述涂敷工艺具体可 为旋涂或者滴涂。 [0077] S052), the obtained gold nano-dispersion is applied to the surface of the composite substrate 11, and the solvent component is completely volatilized, thereby depositing gold nanoparticles on the surface of the composite substrate 11. The coating process may specifically be spin coating or dispensing.
[0078] 在该步骤中, 由于所述复合基板 11与 OTS自组装单层表面能的较大差异, 金颗 粒会自发沉积于图案化的凹槽 21区域内的具有较强表面能的图案化复合基板 11 的表面, 即将金纳米颗粒沉积于所述图案化复合基板 11的图案化凹槽 21内后, 在沉积区内形成如图 2所示的由金材料形成的微结构层 12。 图案结构尺寸精准, 从而获得具有优异的电磁相应特性的超材料 1。 在该实施例中, 所述微结构图案 具体为多个幵口谐振环 131图案。 [0078] In this step, due to the large difference in surface energy between the composite substrate 11 and the OTS self-assembled monolayer, the gold particles spontaneously deposit in the patterned groove 21 and have a strong surface energy patterning. After the surface of the composite substrate 11, that is, the gold nanoparticles are deposited in the patterned recess 21 of the patterned composite substrate 11, a microstructure layer 12 formed of a gold material as shown in FIG. 2 is formed in the deposition region. The pattern structure is accurate in size. Thus, a metamaterial 1 having excellent electromagnetic corresponding characteristics is obtained. In this embodiment, the microstructure pattern is specifically a plurality of mouth-resonant resonant ring 131 patterns.
[0079] 实施例 3: Example 3:
[0080] 在步骤 S01中, 制备具有与超材料 1的微结构相反图案的软模板 2。 [0080] In step S01, a soft template 2 having a pattern opposite to the microstructure of the metamaterial 1 is prepared.
[0081] 具体的, 所述软模板 2为 PDMS模板, 由 PDMS , 即聚二甲基硅氧烷材料制成, 具有较好的柔韧性, 并且具有较低的表面能, 使得其表面对例如十八烷基三氯 硅烷 (OTS) 等材料具有较小的附着力。 所述软模板 2的制备可采用光刻方法在 一硬质基底表面上形成与微结构相反的图案, 本实施例的与微结构相反的图案 是指在硬质基底表面上设置图案化的光刻胶, 其中与微结构相对应的部分留空 , 而其它部分设置为光刻胶如图 3所示, 在硬质基底表面上所加工的图案为与所 述幵口谐振环 131形状尺寸相配的多个由光刻胶限定的幵口环状的凹槽 21。 获取 带有图案化光刻胶的所述硬质基底后, 将其作为压印转移的原始模板。 然后在 带有图案化光刻胶的硬质基底表面涂敷有机 PDMS材料, 经真空干燥后即可制成 [0081] Specifically, the soft template 2 is a PDMS template, which is made of PDMS, that is, a polydimethylsiloxane material, has good flexibility, and has a low surface energy, such that its surface pair is, for example. Materials such as octadecyltrichlorosilane (OTS) have less adhesion. The soft template 2 is prepared by using a photolithography method to form a pattern opposite to the microstructure on the surface of the hard substrate. The pattern opposite to the microstructure in this embodiment means that patterned light is disposed on the surface of the hard substrate. Engraving, wherein the portion corresponding to the microstructure is left blank, and the other portions are provided as photoresist. As shown in FIG. 3, the pattern processed on the surface of the hard substrate matches the shape of the mouth resonant ring 131. A plurality of grooved annular grooves 21 defined by the photoresist. After obtaining the hard substrate with the patterned photoresist, it was used as the original template for imprint transfer. The organic PDMS material is then applied to the surface of the hard substrate with the patterned photoresist and dried under vacuum.
[0082] 在步骤 S02中, 在所述软模板上形成与所述软模板具有相同微结构图案的 OTS 自组装单层。 具体的, 该步骤又包括如下步骤: [0082] In step S02, an OTS self-assembled monolayer having the same microstructure pattern as the soft template is formed on the soft template. Specifically, the step further includes the following steps:
[0083] S021) 、 按照 OTS与正己烷的体积分数为 2: 1000的比例配制 OTS-正己烷溶液 [0083] S021), according to the ratio of OTS and n-hexane volume fraction of 2: 1000 to prepare OTS-n-hexane solution
[0084] S022) 、 将配制的 OTS-正己烷溶液施加到, 例如滴注于所述软模板 2的图案上 。 在该实施例中为图 3所示的除幵口环状的凹槽 21外的其他部分。 并使溶剂成分 完全挥发, 从而在所述软模板 2上形成 OTS自组装单层。 [0224] S022), applying the formulated OTS-n-hexane solution to, for example, dropping onto the pattern of the soft template 2. In this embodiment, it is the portion other than the groove-shaped recess 21 shown in Fig. 3. The solvent component is completely volatilized to form an OTS self-assembled monolayer on the soft template 2.
[0085] 在步骤 S03中, 制备复合基板 11, 并对所述复合基板 11进行提高表面能的工艺 处理。 [0085] In step S03, the composite substrate 11 is prepared, and the composite substrate 11 is subjected to a process of improving surface energy.
[0086] 具体的, 又包括如下步骤: [0086] Specifically, the method further includes the following steps:
[0087] S031) 、 在制备所述复合基板 11吋, 将环氧树脂和玻璃纤维预浸料交替叠置多 层, 并且相邻层的环氧树脂和玻璃纤维预浸料之间呈 90角铺设, 即相邻层的环 氧树脂和玻璃纤维预浸料之间彼此纵横交错的铺设; 将铺设好的多层环氧树脂 和玻璃纤维预浸料置于真空环境中, 例如真空袋中, 并在 140°C的温度下, 进行 7 小吋的固化处理; [0087] S031), in preparing the composite substrate 11 交替, alternately stacking epoxy resin and glass fiber prepreg, and having an angle of 90 degrees between the epoxy resin and the glass fiber prepreg of the adjacent layer Laying, that is, the laying of the epoxy resin and the glass fiber prepreg of the adjacent layers in a crisscross manner; placing the laid multilayer epoxy resin and the glass fiber prepreg in a vacuum environment, such as a vacuum bag, And at a temperature of 140 ° C, 7 Curing treatment of small defects;
[0088] S032) 、 在对所述复合基板 11进行提高表面能的工艺处理吋, 采用等离子体处 理技术对所述复合基板 11待图案化的表面进行处理, 以便提高所述复合基板 11 的表面能, 从而提高其表面的附着力, 例如对 OTS的附着力。 经过处理后, 所述 复合基板 11的表面能大大提高, 相对所述软模板 2具有更的表面能区分度。 [0088] S032), after the surface treatment of the composite substrate 11 is performed, the surface to be patterned of the composite substrate 11 is processed by a plasma treatment technique to increase the surface of the composite substrate 11. Can, thereby increasing the adhesion of its surface, such as adhesion to OTS. After the treatment, the surface energy of the composite substrate 11 is greatly improved, and the surface of the soft template 2 is more distinguished.
[0089] 在步骤 S04中, 将步骤 S02中形成的具有 OTS自组装单层的软模板 2的 OTS自组 装单层一侧紧密贴附到步骤 S03中复合基板 11经工艺处理后的表面上, 并保持 7 分钟, 直至所述 OTS自组装单层自所述软模板 2转移到所述复合基板 11上, 然后 取下所述软模板 2, 制备得到图案化复合基板 11。 [0089] In step S04, the OTS self-assembled single layer side of the soft template 2 having the OTS self-assembled single layer formed in step S02 is closely attached to the surface of the composite substrate 11 after the process in step S03, And maintaining for 7 minutes until the OTS self-assembled monolayer is transferred from the soft template 2 onto the composite substrate 11, and then the soft template 2 is removed to prepare a patterned composite substrate 11.
[0090] 在该步骤中, 由于软模板 2与复合基板 11具有较大的表面能差异, 使得所述 OT S自组装单层自所述软模板 2转移到所述复合基板 11上后, 比较容易与所述软模 板 2相脱离, 从而不会发生粘连。 [0090] In this step, since the soft template 2 and the composite substrate 11 have a large difference in surface energy, the OT S self-assembled monolayer is transferred from the soft template 2 to the composite substrate 11, and then compared. It is easy to separate from the soft template 2 so that blocking does not occur.
[0091] 在步骤 S05中, 将金纳米颗粒沉积于所述图案化复合基板 11的非图案区域内, 形成所述微结构图案。 [0091] In step S05, gold nanoparticles are deposited in the non-pattern area of the patterned composite substrate 11 to form the microstructure pattern.
[0092] 具体的, 该步骤又包括如下步骤: [0092] Specifically, the step further includes the following steps:
[0093] S051) 、 称取一定量金纳米颗粒, 将其加入丙酮中, 制成质量浓度为 2g/ml的 金纳米颗粒 -丙酮溶液, 并进行一定吋长的超声分散; [0093] S051), weigh a certain amount of gold nanoparticles, add it to acetone, to make a gold nanoparticle-acetone solution with a concentration of 2g / ml, and perform ultrasonic dispersion of a certain length;
[0094] S052) 、 将制得的金纳米分散液涂敷于所述复合基板 11表面, 并使溶剂成分完 全挥发, 从而使金纳米颗粒沉积于所述复合基板 11表面。 所述涂敷工艺具体可 为旋涂或者滴涂。 [0094] S052), the prepared gold nano-dispersion is applied to the surface of the composite substrate 11, and the solvent component is completely volatilized, thereby depositing gold nanoparticles on the surface of the composite substrate 11. The coating process may specifically be spin coating or dispensing.
[0095] 在该步骤中, 由于所述复合基板 11与 OTS自组装单层表面能的较大差异, 金颗 粒会自发沉积于图案化的凹槽 21内的具有较强表面能的图案化复合基板 11的表 面, 即将金纳米颗粒沉积于所述图案化复合基板 11的图案化凹槽 21内后, 沉积 区内形成如图 2所示的由金材料形成的微结构层 12。 从而获得具有优异的电磁相 应特性的超材料 1。 在该实施例中, 所述微结构图案具体为多个幵口谐振环 131 图案。 [0095] In this step, due to the large difference in the surface energy of the self-assembled monolayer of the composite substrate 11 and the OTS, the gold particles spontaneously deposit in the patterned groove 21 and have a patterning compound with strong surface energy. After the surface of the substrate 11, that is, the gold nanoparticles are deposited in the patterned recess 21 of the patterned composite substrate 11, a microstructure layer 12 formed of a gold material as shown in FIG. 2 is formed in the deposition region. Thereby, a metamaterial 1 having excellent electromagnetic corresponding characteristics is obtained. In this embodiment, the microstructure pattern is specifically a plurality of mouth-resonant ring 131 patterns.
[0096] 本申请中的超材料制造方法, 通过在工艺过程中, 使得软模板 2与复合基板 11 之间, 以及 OTS组装层与复合基板 11之间具有较大的表面能差异, 使得超材料 1 的制备工艺可实施性强, 制造效率高, 并且获得的微结构结构尺寸精准, 具有 极好的电磁相应特性。 [0096] The method for manufacturing a metamaterial in the present application, by making a large surface energy difference between the soft template 2 and the composite substrate 11 and between the OTS assembly layer and the composite substrate 11 during the process, so that the metamaterial 1 The preparation process is strong in implementation, high in manufacturing efficiency, and the obtained microstructure structure is accurate in size and has excellent electromagnetic corresponding characteristics.
[0097] 应当说明的是, 在本文中, 诸如第一和第二等之类的关系术语仅仅用来将一个 实体或者操作与另一个实体或操作区分幵来, 而不一定要求或者暗示这些实体 或操作之间存在任何这种实际的关系或者顺序。 而且, 术语"包括"、 "包含 "或者 其任何其他变体意在涵盖非排他性的包含, 从而使得包括一系列要素的过程、 方法、 物品或者设备不仅包括那些要素, 而且还包括没有明确列出的其他要素 , 或者是还包括为这种过程、 方法、 物品或者设备所固有的要素。 在没有更多 限制的情况下, 由语句 "包括一个 ...... "限定的要素, 并不排除在包括所述要素的 过程、 方法、 物品或者设备中还存在另外的相同要素。 [0097] It should be noted that, in this context, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these entities. There is any such actual relationship or order between operations. Furthermore, the terms "including", "comprising" or "comprising" or "comprising" are intended to encompass a non-exclusive inclusion, such that a process, method, article, or device that includes a plurality of elements includes not only those elements but also Other elements, or elements that are inherent to such a process, method, item, or device. In the absence of more limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or device that comprises the element.
[0098] 最后应说明的是: 显然, 上述实施例仅仅是为清楚地说明本发明所作的举例, 而并非对实施方式的限定。 对于所属领域的普通技术人员来说, 在上述说明的 基础上还可以做出其它不同形式的变化或变动。 这里无需也无法对所有的实施 方式予以穷举。 而由此所引申出的显而易见的变化或变动仍处于本发明的保护 范围之中。 。 [0098] It should be noted that the above-described embodiments are merely illustrative of the invention and are not intended to limit the embodiments. Other variations or modifications of the various forms may be made by those skilled in the art in light of the above description. There is no need and no way to exhaust all implementations. Obvious changes or variations resulting therefrom are still within the scope of the invention. .
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| CN113937243B (en) * | 2021-08-26 | 2024-01-30 | 福州大学 | Preparation method of high PPI quantum dot array based on substrate surface hydrophilic and hydrophobic treatment |
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| US20020190416A1 (en) * | 2001-06-19 | 2002-12-19 | Birch William R. | Releasing agent for embossing mold with high pattern density |
| CN1401685A (en) * | 2002-09-15 | 2003-03-12 | 中国科学院兰州化学物理研究所 | Method for mfg. patterned conductive polymer film |
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| CN104228087A (en) * | 2014-09-01 | 2014-12-24 | 机械科学研究总院先进制造技术研究中心 | Method for preparing composite material prepreg |
| CN104238264A (en) * | 2014-09-10 | 2014-12-24 | 清华大学 | Solution-assisted soft imprinting method |
| WO2016210115A1 (en) * | 2015-06-23 | 2016-12-29 | The University Of North Carolina At Chapel Hill | Method for making an epoxy resin mold from a lithography patterned microstructure master |
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| US20020190416A1 (en) * | 2001-06-19 | 2002-12-19 | Birch William R. | Releasing agent for embossing mold with high pattern density |
| CN1401685A (en) * | 2002-09-15 | 2003-03-12 | 中国科学院兰州化学物理研究所 | Method for mfg. patterned conductive polymer film |
| CN1853270A (en) * | 2003-10-09 | 2006-10-25 | 飞思卡尔半导体公司 | Amorphous carbon layer to improve photoresist adhesion |
| CN101321614A (en) * | 2005-09-30 | 2008-12-10 | 空客西班牙公司 | Method for surface treatment of composite material structure by using atmospheric plasma beam |
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