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WO2018109651A1 - Procédé de connexion de formations électroconductrices, structure de support correspondante et dispositif d'éclairage - Google Patents

Procédé de connexion de formations électroconductrices, structure de support correspondante et dispositif d'éclairage Download PDF

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Publication number
WO2018109651A1
WO2018109651A1 PCT/IB2017/057824 IB2017057824W WO2018109651A1 WO 2018109651 A1 WO2018109651 A1 WO 2018109651A1 IB 2017057824 W IB2017057824 W IB 2017057824W WO 2018109651 A1 WO2018109651 A1 WO 2018109651A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conductive
formation
conductive formation
substrate
connection area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2017/057824
Other languages
English (en)
Inventor
Alessio Griffoni
Lorenzo Baldo
Luigi Pezzato
Luca Volpato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Osram SpA
Original Assignee
Osram GmbH
Osram SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH, Osram SpA filed Critical Osram GmbH
Priority to EP17826290.3A priority Critical patent/EP3556186A1/fr
Publication of WO2018109651A1 publication Critical patent/WO2018109651A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Definitions

  • the present description relates to the connection of electrically conductive formations.
  • One or more embodiments may be applied e.g. to the implementation of support structures for lighting devices.
  • One or more embodiments may be applied to the implementation of lighting devices employing electrically-powered light radiation sources, e.g. solid-state light radiation sources such as LED sources.
  • electrically-powered light radiation sources e.g. solid-state light radiation sources such as LED sources.
  • electrically conductive formations such as pads and lines or tracks acting e.g. as supply bus lines, obtained by etching e.g. a copper layer, and
  • electrically conductive formations implemented via the deposition of electrically conductive inks is still a challenge as regards e.g. the reliability of the overall structure, e.g. a FPCB structure, when it is submitted to bending.
  • SS CCL Single- Side Copper Clad Laminate
  • a laminar substrate which is coated with an e.g. copper layer on a (single) side.
  • etching e.g. by chemical or laser etching
  • the electrically conductive layer it is possible to obtain e.g. bus lines, while on the opposite side an electrically conductive ink may be deposited, so as to obtain a desired circuit layout.
  • electrically conductive formations implemented on both sides may then be connected through electrically conductive "vias", which may be obtained e.g. by printing in passageways which are drilled through the substrate.
  • Another possibility involves the electrical connection between the etched (e.g. copper) formations and the printed formations (e.g. with an electrically conductive ink) implemented on the same side of a substrate, e.g. by using bridge-like connecting formations (e.g. SMD jumpers) .
  • bridge-like connecting formations e.g. SMD jumpers
  • One or more embodiments aim at overcoming the previously outlined drawbacks.
  • said object may be achieved thanks to a method having the features set forth in the claims that follow.
  • One or more embodiments may refer to a corresponding support structure (e.g. for electrical circuits) as well as to a corresponding lighting device .
  • One or more embodiments may lead to the achievement of hybrid FPCB structures (i.e. structures combining electrically conductive, e.g. copper, formations, implemented through deposition of electrically conductive inks) within rapid production processes, which may be ( re ) configured in short times, while exhibiting a high degree of adaptability to the application and usage needs ("customization") e.g. of a LED module circuit, together with robustness and reliability features.
  • hybrid FPCB structures i.e. structures combining electrically conductive, e.g. copper, formations, implemented through deposition of electrically conductive inks
  • One or more embodiments may be applied to the implementation of laminated structures (e.g. CCL structures) both of the Single-Sided (SS) and of the Double-Sided (DS) type, without employing adhesives, or optionally also with the use of an (e.g. epoxy) adhesive, wherein some electrically-conductive formations (e.g. supply bus lines of tracks) may be implemented via etching a metal material, such as copper, layer, while the rest of the circuit is implemented with electrically conductive inks.
  • laminated structures e.g. CCL structures
  • SS Single-Sided
  • DS Double-Sided
  • the latter may be deposited e.g. via screen printing or ink jet printing (or optionally with other techniques) , the possibility being offered of having short production and lead times and a high degree of adaptability (customization) as regards e.g. the features of a given circuit such as e.g. the circuit of a LED lighting device (module) .
  • the electrically conductive formations obtained by etching and the electrically conductive formations obtained by ink deposition may be implemented on the same side of a laminar structure (such as e.g. an FPCB structure) .
  • different solutions may be adopted in order to achieve a high degree of reliability and robustness at the interconnect junction between a metal material (e.g. copper, optionally with surface finishing) and electrically conductive inks.
  • a metal material e.g. copper, optionally with surface finishing
  • electrically conductive inks e.g. copper, optionally with surface finishing
  • One or more embodiments may exhibit a high robustness to bending stresses, such as the stresses which may appear in a flexible LED lighting module.
  • One or more embodiments are adapted to be implemented in a support structure for lighting devices as described in a Patent Application for Industrial Invention filed by the present Applicants on the same date .
  • Figure 1 exemplifies the application of embodiments to the implementation of a support member for lighting devices
  • Figure 2 including two portions respectively denoted as a) and b) , exemplifies the application of embodiments to the implementation of a support member for lighting devices,
  • FIG. 3 exemplifies possible bending stresses adapted to be applied to a device such as a lighting device
  • FIG. 5 is a cross-section view along line V-V of Figure 4,
  • FIG. 8 and Figure 9 show implementation procedures of embodiments
  • reference 10 generally denotes an electrical device such as e.g. a lighting module employing electrically-powered light radiation sources L such as solid-state light radiation sources, e.g. LED sources .
  • electrically-powered light radiation sources L such as solid-state light radiation sources, e.g. LED sources .
  • device 10 may include an optionally flexible laminar substrate 12, which may have an elongated (e.g. ribbon-like) shape and may be adapted to include e.g. an electrically insulating material .
  • Substrate 12 may host electrically conductive formations 14, 16, 18 adapted to enable e.g. the power supply to sources L, and optionally the transmission of control / feedback signals, e.g. in order to implement functions such as dimming or heat management.
  • At least some of such electrically conductive formations may moreover be connected to various electrical / electronic components (exemplified herein as a resistor C) adapted to be associated to the light radiation sources L.
  • various electrical / electronic components exemplified herein as a resistor C
  • the electrically conductive formations 14, 16, 18 are adapted to be implemented either on one side of substrate 12 (see e.g. formations 14 and 16 of the "Single-Side” (SS) solution, as exemplified in Figure 1), or on both sides of substrate 12 (see e.g. formations 14, 16 and 18 of the "Double-Side” (DS) solution, as exemplified in Figure 2, wherein the two portions respectively denoted as a) and b) show device 10 observed from the opposite sides of substrate 12) .
  • SS Single-Side
  • DS Double-Side
  • the electrically conductive formations 14, 16, 18 may be implemented with "hybrid” solutions, wherein among the electrically conductive formations 14, 16, 18 there are provided:
  • first electrically conductive formations e.g. lines
  • electrically conductive layer applied on substrate 12 as a continuous layer (i.e. as a cladding)
  • second electrically conductive formations e.g. lines 16 16, which are implemented by depositing, onto substrate 12 (e.g. by screen printing or ink jet printing) , electrically conductive inks of a known kind, e.g. inks embedding particles of electrically conductive materials, such as e.g. silver.
  • the electrically conductive formations such as lines 14, 18 obtained by etching on both sides of substrate 12 may be mutually connected through so- called electrically conductive "vias" 20 extending through substrate 12, so as to implement the electrical connection between the electrically conductive lines 14 and 18 provided on the opposite surfaces of substrate 12.
  • the "etched" lines 14 and 18 may e.g. perform the function of bus lines, extending lengthwise of substrate 12, so as to act as power supply lines ("hot" line VDD and ground line GND) to sources L.
  • the "printed" lines 16 may therefore be adapted to perform a sort of local distribution of electrical signals (supply and optionally control) for sources L.
  • One or more embodiments tackle the problem of implementing an electrical connection between the "first" electrically conductive formations (the etched formations) and the “second” electrically conductive formations 16 (the formations printed by ink deposition) at connecting areas such as e.g. the areas denoted as 100 in Figure 1 and in portion a) of Figure 2.
  • the electrical connection between formations 14 and 16 located on one of the sides or surfaces of substrate 12 e.g. the front or upper side, which may host the light radiation sources L
  • the presently exemplified solutions may be used on both surfaces of substrate 12.
  • One or more embodiments may favour the implementation of reliable connections also as regards the possible bending stresses which a module (such as a module 10 as exemplified in Figures 1 and 2) may be subjected to, e.g. as schematically exemplified in Figure 3 (bending moments -M and +M) .
  • the lengthwise extension dimension may be seen as corresponding to a first axis x of a Cartesian coordinate system x, y, z, the axis y corresponding to the transverse dimension of module 10 and the axis z corresponding to the direction normal to the lying plane of substrate 12, corresponding to the plane of extension of axes x and y.
  • Figures 4 to 12 show possible solutions for implementing, at a connection area 100 of substrate 12, the electrical connection between:
  • first electrically conductive formation e.g. a line
  • second electrically conductive formation obtained by depositing, onto substrate 12 (e.g. by screen printing or ink-jet printing) an electrically conductive ink (e.g. containing particles of a highly conductive material, such as e.g. silver) .
  • the first electrically conductive formation 14 may be provided (e.g. via etching) on a lateral side 140 extending away from the surface of the connection area 100 of substrate 12 towards a front (upper) surface 142 of formation 14.
  • Surface 142 may be a surface of formation 14 generally opposite the surface of substrate 12 at the connection area or region 100.
  • the surface of substrate may be coated with an adhesive material 120, such as an epoxy adhesive.
  • the electrically conductive ink of the second electrically conductive formation 16 may be deposited in such a way that the second formation 16 extends on the lateral side 140 of the first formation 14.
  • connection area 100 in the second electrically conductive formation 16 it is therefore possible to distinguish, at the connection area 100:
  • connection area 100 e.g. directly on substrate 12 or optionally on the adhesive layer 120, if present
  • the lateral side 140 of the first formation 14 may be implemented with a ramp-like shape, i.e. a shape such that the surface of side 140 facing outwardly of formation 14 encloses an angle wider than 90° with the surface plane of substrate 12.
  • the formations 14 may have, at the lateral side 140, a generally straight shape, the formation 16 being printed both on the surface of formation 14 (e.g. of a metal material such as copper and with surface finish) and on the area adjacent substrate 12, where the metal material has been removed by etching.
  • a metal material such as copper and with surface finish
  • the processes of etching and of ink deposition may be implemented in such a way as to control, beside the so-called “aspect ratio” (i.e. the ratio between height and width), also various other parameters of the implemented formations, such as e.g. the parameters shown in Figure 4, i.e.:
  • the overlap length Li of the etched metal material (e.g. copper with surface finish) and the conductive ink Li of the etched metal material (e.g. copper with surface finish) and the conductive ink
  • the extension direction of the interconnect junction with respect to e.g. the expected (main) bending direction.
  • Figure 6 exemplifies, in the portions a) and b) thereof, embodiments wherein the printed formation 16 extends along axis x (as previously defined) , while formation 14 may be seen as an electrically conductive line extending in the direction of the axis y.
  • Figure 7 exemplifies, in its portions denoted as a) and b) , possible embodiments wherein, on the contrary, formation 16 may extend along axis y, with formation 14 extending (specifically with the side 140 thereof) in the direction of axis x.
  • the (minimum) values of lengths Li and L 2 may be selected in such a way as to favour adherence on the whole non-planar surface including the etched metal material (e.g. copper) and the area where such material has been removed.
  • the etched metal material e.g. copper
  • width W may be the same as width W. In one or more embodiments, this width may be selected so as to limit the appearance of possible propagations of junction cracks when the structure (e.g. module 10) is subjected to bending, as exemplified in Figure 3.
  • the width of extension of the metal material with respect to the printed track W ex t may be selected sufficiently wide to limit stress and strain in the junction during bending, particularly at the edges.
  • the interconnect junction may be implemented so that it extends orthogonally to the expected bending direction, i.e. with the junction extending along axis x, as exemplified in Figure 6, so as to limit the stress in the junction.
  • said extension direction may not be easy to implement, e.g. for design requirements (e.g. as a function of the available space) .
  • different extensions may be selected, while still achieving satisfactory results as regards the limitation of mechanical stress and strain at the junction.
  • formations 16 may be implemented by employing conductive inks embedding particles or flakes of an electrically conductive material (e.g. silver) .
  • an electrically conductive material e.g. silver
  • One or more embodiments may favour the achievement of a better compatibility between the materials of the junction by employing, as a metal material, a metal material such as copper, treated with a surface finish of a material such as silver (e.g. via an immersion treatment) corresponding, i.e. equal or similar, to the material used as a conductive material in the ink of formation 16.
  • Figures 8 to 11 may be seen as substantially corresponding to Figures 4 to 7, and exemplify one or more embodiments wherein, instead of being straight (e.g. along axis y or along axis x, as exemplified in Figures 6 and 7), the lateral side 140 may have, at the junction area 100, a rounded shape, e.g. having (see e.g. Figure 8) a recessed channel-shaped portion.
  • this may be a recessed portion 140 having a channel shape, extending along a surface which, at least locally, may be compared to a cylindrical surface having a radius Ri .
  • the portion 140 may be channel-shaped and the lateral edges thereof may have a rounded profile, e.g. with shapes which, at least locally, may be compared to cylindrical surfaces having a radius R2.
  • the second formation 16 may be formed (printed) within recessed portion 140, e.g. with a width W smaller than the radial dimension Ri of the recessed portion.
  • the overlap length L 1 - 1 of the etched material of formation 14 e.g. copper with a surface finish
  • a lateral side 140 with a recessed profile enables increasing the effective junction width W with respect to the width W of the printed formation, because W may be seen as the arc subtended by the chord having width W.
  • Ri may play a key role in increasing the effective junction width, so as to limit possible propagations of junction cracks when substrate 12 is subjected to bending.
  • the presence of a recessed portion may limit the mechanical stress and strain caused by bending when the ink is deposited with a width W lower than 2*Ri, with the junction being adapted to be located distally of the direction of maximum stress which may appear when the lateral side 140 has a straight shape.
  • the value of radius R 2 of the edges of the recessed portion may be selected so as to improve the robustness to bending of the junction, when the width of ink W is higher than 2*Ri. As a matter of fact, in this way it is possible to reduce the mechanical stress and strain thanks to the rounded shape of the edges, as compared to a shape exhibiting a sharp transition.
  • the (minimum) values of Li-i and Li- 2 may be selected so as to favour the adherence on the whole non-planar structure, which includes the etched metal material of formation 14 and the area where said material has been removed by etching, so as to reduce the possible effects of a difference in height of both areas involved.
  • the width W ex t,i and W ex t,o of extension of the etched metal material of formation 14 (inside and outside the recessed portion) with reference to the ink width may be chosen wide enough to limit the mechanical stress and strain in the junction due to bending.
  • the orientation of the interconnect junction may be chosen so that it is normal to the bending direction, i.e., for example, with the junction extending mainly along axis x, so as to limit the amount of the mechanical stress and strain on the junction.
  • the junction may be implemented with a different orientation (e.g. parallel to the bending direction) while achieving nonetheless a limitation of the mechanical stresses.
  • Figures 10 and 11 show various selection option as regards e.g. the width of formation 16, obtained by printing an electrically conductive ink.
  • portions b) of Figure 10 and of Figure 11 exemplify that, in one or more embodiments, the printed formation 16 may exhibit a width larger than the diameter of the recessed portion 140.
  • Figure 12 exemplifies the possibility, in one or more embodiments, of modifying the thickness of the first formation 14 at the portion thereof where the second formation 16 is printed.
  • Figure 12 exemplifies possible embodiments wherein formation 16 is printed onto a portion of formation 14 adapted to be considered a "quasi-flat" surface because, in the area where formation 16 is deposited, the formation 14 of etched material is made thin, so as to exhibit a reduced exposure to mechanical stress and strain; as a matter of fact, it has been observed that such stresses, due to a possible bending of substrate 12, increase with the increase of the thickness of the material layer of formation 14.
  • the possibility, for formations such as formation 14, of conveying currents of a certain intensity depends on the net section of formation 14, with the ohmic resistance of the same decreasing as the section area increases.
  • formation 14 may include, in addition to the portion destined to host deposited formation 16, a peak portion 14a which is not affected by the deposition of formation 16 and which extends beyond surface 142.
  • a formation 14 having a staircase-like profile may be implemented in different ways.
  • a selective electro-plating or electroless-plating may be carried out with a metal material such as copper, so as to implement a "thick" portion from an initial thin layer.
  • a metal material such as copper
  • a protective layer e.g. a reserve material which protects a portion from the plating treatment, such a portion being destined to remain thin, and which may later be removed so as to enable the printing of formation 16.
  • One or more embodiments may therefore include a method of providing, at a connection area (e.g. 100) on a substrate (e.g. 12), electrical connection of:
  • first electrically conductive formation e.g.
  • a second electrically conductive formation (e.g. 16) provided by depositing electrically conductive ink, wherein the method includes:
  • connection area an etched lateral side (e.g. 140) extending away from the surface of the connection area towards a front surface (e.g. 142) of the first electrically conductive formation opposite the surface of the connection area, and
  • connection area a first portion (e.g. 16a) extending at the surface of the connection area
  • a third portion (e.g. 16c) extending on said front surface of the first electrically conductive formation .
  • the first electrically conductive formation may extend in a first direction (e.g. y, resp. x) across the connection area, and
  • the second electrically conductive formation may extend in a second direction (x resp. y) transverse to the first direction (e.g. y resp. x) .
  • One or more embodiments may include forming the recessed portion of the first electrically conductive formation with rounded lateral edges (e.g. R2) .
  • said etched lateral side may include a ramp-like surface.
  • the electrically conductive ink may include a dispersion of electrically conductive material, optionally silver,
  • the first electrically conductive formation may include metal material, optionally copper, superficially treated with treatment material corresponding (e.g. identical or similar) to the electrically conductive material dispersed in the electrically conductive ink.
  • One or more embodiments may include providing the first electrically conductive formation with a staircase-like profile including a peak extension (e.g. 14a) extending beyond said front surface (e.g. 142), by omitting depositing electrically conductive ink at said peak extension.
  • a peak extension e.g. 14a
  • a support structure for electrical circuits may include:
  • At least one first electrically conductive formation provided by etching an electrically conductive layer provided on the substrate
  • At least one second electrically conductive formation provided by depositing electrically conductive ink
  • the at least one first electrically conductive formation and the at least one second electrically conductive formation being electrically connected with each other at a connection area of the substrate with the method according to one or more embodiments.
  • a lighting device may include:
  • a support structure e.g. 12, 14, 16, 18 provided with the method according to one or more embodiments ,
  • At least one electrically-powered light radiation source e.g. L
  • the electrical conduction path including at least one first electrically conductive formation and at lest one second electrically conductive formation electrically connected to the first electrically conductive formation at at least one connection area with the method according to one or more embodiments.
  • the substrate may include an electrically insulating and/or flexible substrate (12), and/or
  • the at least one electrically-powered light radiation source may include a solid-state source, optionally a LED source.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Une première formation électroconductrice (14), obtenue par gravure d'une couche électroconductrice disposée sur le substrat (12), et une seconde formation électroconductrice (16), obtenue par dépôt d'encre électroconductrice, sont connectées électriquement au niveau d'une zone de connexion (100) sur un substrat ( 12 ) : en prévoyant dans la première formation électroconductrice (14) un côté latéral gravé (140) s'étendant à l'opposé de la surface de la zone de connexion (100) vers une surface avant (142) de la première formation électroconductrice (14) opposée à la surface de ladite zone de connexion (100), et en déposant de l'encre électroconductrice de la seconde formation électroconductrice (16) sur le côté latéral (140) de la première formation électroconductrice (14), la seconde formation électroconductrice (16) comprenant : i) une première partie (16a) s'étendant à la surface de la zone de connexion (100), ii) une deuxième partie (16b) s'étendant sur le côté latéral gravé (140) de la première formation électroconductrice (14), et iii) une troisième partie (16c) s'étendant sur ladite surface avant (142) de la première formation électroconductrice (14).
PCT/IB2017/057824 2016-12-14 2017-12-12 Procédé de connexion de formations électroconductrices, structure de support correspondante et dispositif d'éclairage Ceased WO2018109651A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP17826290.3A EP3556186A1 (fr) 2016-12-14 2017-12-12 Procédé de connexion de formations électroconductrices, structure de support correspondante et dispositif d'éclairage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT102016000126301 2016-12-14
IT201600126301 2016-12-14

Publications (1)

Publication Number Publication Date
WO2018109651A1 true WO2018109651A1 (fr) 2018-06-21

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