WO2018184128A1 - Crystallite integrating circuit and antenna and integration method - Google Patents

Abstract

The present invention is a crystallite integrating a circuit and an antenna and an integration method. The circuit and the antenna respectively are located on the opposing front surface and rear surface of a substrate; however, both are electrically coupled to a shared ground located on the substrate. To retain the mechanical strength of the entire crystallite, some dummy metals separated from the antenna are distributed around the antenna on the rear surface of the substrate on which the antenna is located. In addition, to reduce side effects incurred by an induced current, some ground balls are provided on one or more surfaces of the substrate.

Description

Integrated circuit and antenna die and integration method Technical field

The present invention relates to an integrated circuit and an antenna die and an integrated method for forming a circuit and an antenna on a front surface and a back surface of a substrate but sharing a shared ground, in particular A method of integrating the circuit and the antenna of the integrated circuit and the antenna using the dummy metals electrically isolated from the antenna on the back surface of the substrate to maintain the overall mechanical strength.

Background technique

The development of the semiconductor industry over the years, circuits for processing and storing signals (whether active or passive, but also memory) and antennas for receiving and/or transmitting electromagnetic signals are commonly located in different integrated circuits. on. Although the dies having the circuit and the die having the antenna may be located on the same printed circuit board (PCB), or the die having the circuit is located on one side of the printed circuit board and the antenna (or The die with the antenna is located on the other side of the printed circuit board.

However, there is a continuing need to integrate circuits and antennas into the same die, as this reduces the number of die used, reduces the footprint of the printed circuit board, and reduces the need to transmit electromagnetic signals between different dies. . However, to date, if the circuit and antenna are to be integrated into the same die, at least the following technical problems will be encountered: 1) For most commercial applications, the electromagnetic wave frequency is significantly larger than the circuit area. It is not easy to match the integration of the two on the grain. 2) The antenna and the circuit interfere with each other, especially when receiving and/or transmitting electromagnetic waves at both ends of the antenna will cause strong interference to the surrounding circuits. 3) If the circuit and the antenna are to be placed on the same surface of the die, not only occupying a large area will interfere with each other. 4) If the circuit and the antenna are to be placed on the opposite surfaces of the die, how to transmit signals between the antenna and the circuit, how to maintain the mechanical strength of the die, and how to handle the potential reference of both the circuit and the antenna, etc. The problem to be solved.

There is a need to provide integrated circuits and antenna die and integration methods, especially when the frequency of electromagnetic waves for commercial applications has evolved to such an extent that the antenna size is similar to the circuit size.

Summary of the invention

The invention arranges the antenna and the circuit on different surfaces of the substrate and uses the same shared potential reference, and can arrange some virtual metal separated from the antenna on a certain surface of the substrate on which the antenna is located to maintain the mechanical strength and conformity of the entire crystal grain. Manufacturing process requirements. In addition, between the die and the printed circuit board (or between the die and the outside of the die), one or more ground balls can be used to connect to reduce the effect of induced current. There may be a silicon via caller connection circuit and an antenna in the substrate of the particle.

The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. A die for integrating a circuit and an antenna according to the present invention comprises: a substrate having a front surface and a back surface; a circuit on the front surface; an antenna on the back surface; and a shared potential reference, electrically connected To the circuit and the antenna.

The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.

The foregoing die characterized by further comprising at least one of: the shared potential reference being located on the front surface; the shared potential reference being located on a side surface of the substrate; the shared potential reference being located inside the substrate; and the shared potential reference Located inside the substrate and between the antenna and the circuit.

In the aforementioned die, the shared potential reference is a potential reference used by the circuit regardless of whether or not the antenna is present.

In the foregoing die, the position of the antenna at the back surface is elastically adjustable and does not have to be located in the middle of the back surface or overlap the circuit in a direction perpendicular to the front surface and the back surface. .

The aforementioned die, the size of the antenna is proportional to the wavelength of the electromagnetic wave that the antenna is designed to receive and emit.

In the foregoing crystal grain, the ratio of the area of the antenna to the back surface is larger as the antenna is a resonant antenna, and is not limited when the antenna is non-resonant.

The foregoing die includes a plurality of dummy metals on the back surface surrounding the antenna but separated from the antenna.

The foregoing crystal grain, the ratio of the area occupied by the antenna and the dummy metal to the back surface and the distribution on the back surface are dependent on at least the following two points: the mechanical strength of the die and the manufacturing process of the die .

In the foregoing die, the distribution limitation of the dummy metal on the back surface includes at least one of: the virtual metal is distant from the antenna near the two ends of the antenna receiving and/or emitting electromagnetic waves, and The virtual metal is closer to the antenna near other portions of the antenna; the virtual metal is sparsely distributed near the ends of the antenna receiving and/or transmitting electromagnetic waves, and the virtual portion is near the other portions of the antenna The metal is more densely distributed with each other; and the virtual metal has a smaller area near both ends of the antenna where the electromagnetic wave is received and/or emitted, and the virtual metal has a larger area near the other portions of the antenna.

In the foregoing die, the distribution limitation of the dummy metal on the back surface includes at least one of the following: a portion of the virtual metal that is closer to the antenna is sparsely distributed, and a portion farther from the antenna is disposed. The distribution of the dummy metal is relatively dense; and a portion of the dummy metal that is closer to the antenna is smaller in size, and a portion of the dummy metal that is farther from the antenna is larger in size.

In the foregoing die, the distribution limitation of the dummy metal on the back surface includes at least one of: the distance of the virtual metal from the antenna is proportional to a wavelength of an electromagnetic wave that the antenna is designed to receive and/or emit; The distance between the metal and the points in the longitudinal direction of the antenna is proportional to the wavelength of the electromagnetic wave that the antenna is designed to receive and/or emit; and the gap between the virtual metals is proportional to the antenna being designed to receive and/or emit The wavelength of the electromagnetic wave.

The foregoing die, when the antenna is designed to receive and/or emit electromagnetic waves having a frequency between 80 GHz and 650 GHz, the distribution limit of the dummy metal on the back surface includes at least one of the following: The gap between the metals is greater than 50 microns; any one of the sides of the dummy metal is greater than 150 microns; and any one of the virtual metals is quadrangular or rectangular in shape.

The foregoing die includes a plurality of ground balls, and the different ground balls are respectively connected to different portions of the dummy metal.

The foregoing crystal grain, comprising at least one of: the ground ball is uniformly distributed on the front surface; the ground ball is uniformly distributed on the back surface; the ground ball is distributed on the front surface; a ground ball is distributed on the negative surface; the ground ball is distributed on one or more side surfaces of the substrate; and the ground ball is distributed in an intensive current on the substrate when the antenna receives and/or emits electromagnetic waves The stronger part.

In the foregoing die, the ground ball is a gold bump or a solder ball.

The object of the present invention and solving the technical problems thereof are also achieved by the following technical solutions. A method for integrating a circuit and an antenna in the same die according to the present invention comprises: a. a circuit distribution disposed on a front surface of the substrate; and an antenna on the back surface of the substrate and a plurality of dummy metals and on the substrate a distribution of a plurality of grounding balls of one or more surfaces; b. simulating an electromagnetic field and current distribution on the antenna, the virtual metal and the grounding ball when the antenna receives the emitted electromagnetic waves; c. adjusting the antenna according to a simulation result The distribution of the virtual metal and the ground ball; d. repeating steps b and c until the electromagnetic field and current distribution on the antenna, the dummy metal and the ground ball meet the requirements; here, the circuit Electrically connected to the antenna to a shared potential reference; wherein the dummy metal surrounds the antenna and is separated from the antenna; wherein different ground balls are respectively connected to different one or more surfaces of the substrate section.

The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.

The foregoing method includes fixing the antenna in steps b and c and repeatedly adjusting the dummy metal and the ground ball repeatedly until the requirements are met.

The foregoing method includes fixing the antenna and the ground ball in steps b and c, and only repeatedly adjusting the virtual metal until the requirement is met.

In the foregoing method, step c includes adjusting at least one of: at least one size of the virtual metal, at least one shape of the dummy metal, at least two distances between the virtual metals, and at least one of the virtual metal and the antenna The distance, the location of the portion of the virtual metal around the antenna, and the number and location of the virtual metal.

In the foregoing method, the step c includes at least one of: making the size of the dummy metal as small as possible, making the distance between the virtual metals as small as possible, and letting the portion farther from the antenna The virtual metal is relatively large in size, such that a portion of the dummy metal that is closer to the antenna is smaller in size, and the distance between the virtual metal and the first and last ends of the antenna is as large as possible.

The aforementioned method, comprising at least one of: placing the antenna in the middle of the back surface: placing the antenna around the back surface; leaving the antenna in a direction perpendicular to the front surface and the back surface Overlap each other; the antenna is separated from the circuit in a direction perpendicular to the front surface and the back surface; and the antenna is designed to receive a size proportional to the wavelength of the emitted electromagnetic wave; and When the antenna is a resonant antenna, the antenna occupies a large proportion of the back surface.

The foregoing method, comprising at least one of the following: a potential reference used by the circuit regardless of whether the antenna is present is the shared potential reference; the shared potential reference is disposed inside the substrate and located at the antenna and the circuit The shared potential reference is placed on the front surface; the shared potential reference is placed on a side surface of the substrate; and the shared potential reference is placed inside the substrate.

The foregoing method includes setting a ratio of an area ratio of the antenna and the dummy metal occupying the back surface and a common distribution on the back surface according to the mechanical strength of the die and the manufacturing process of the die.

The foregoing method includes adjusting a distribution of the dummy metal on the back surface according to at least one of: a portion of the virtual metal near the ends of the antenna receiving and/or emitting electromagnetic waves is distant from the antenna, a portion of the virtual metal near the other portion of the antenna is closer to the antenna; a portion of the virtual metal near the ends of the antenna that receives and/or emits electromagnetic waves is sparsely distributed to each other, and the other antenna a portion of the virtual metal in the vicinity of the portion is densely distributed with each other; and a portion of the virtual metal in the vicinity of both ends of the antenna receiving and/or emitting electromagnetic waves is small, and a portion near the other portions of the antenna is The virtual metal has a larger area.

The foregoing method, comprising adjusting a distribution of the virtual metal on the back surface according to at least one of: a portion of the virtual metal that is relatively close to the antenna is sparsely distributed, at a portion farther from the antenna The virtual metal is densely distributed; and the portion of the dummy metal is smaller at a portion closer to the antenna, and the portion of the dummy metal is larger at a portion farther from the antenna.

The foregoing method, comprising adjusting a distribution of the virtual metal on the back surface according to at least one of: a gap between the virtual metals being proportional to a wavelength of an electromagnetic wave that the antenna is designed to receive and/or emit; The distance between the virtual metal and the points in the longitudinal direction of the antenna is proportional to the wavelength of the electromagnetic wave that the antenna is designed to receive and/or emit; and the virtual metal The gap between each other is proportional to the wavelength of the electromagnetic wave that the antenna is designed to receive and/or emit.

The foregoing method, comprising at least one of: distributing the ground ball evenly on the front surface of a portion where the antenna is located; allowing the ground ball to be evenly distributed on the back surface of a portion where the dummy metal is located; Having the ground ball distributed on the front surface of the portion where the antenna is located; distributing the ground ball at the back surface of the portion where the dummy metal is located; and distributing the ground ball when the antenna is received and/or Or a portion of the virtual metal that induces a relatively dense current when the electromagnetic wave is emitted.

The foregoing method includes using gold bumps or solder balls as the ground ball.

In the foregoing method, when the antenna is designed to receive and/or emit electromagnetic waves having a frequency of between 80 GHz and 650 GHz, the step b and the step c further comprise at least one of the following: a gap between the virtual metals Greater than 50 microns; let either side of the virtual metal be longer than 150 microns; and let any of the virtual metal be quadrilateral or rectangular in shape.

In general, the shared potential reference is located inside the substrate and intermediate the front and back surfaces of the substrate, but the invention does not limit the details of the shared potential reference. That is, there is no need to limit the details of changing the circuit and/or the antenna because of the details of the shared potential reference, and it is not necessary to limit how the changing circuit and/or the antenna are placed on the front surface of the substrate and/or because of the shared potential reference. Back surface.

In general, the circuitry is located on the front surface of the substrate and the antenna is located on the back surface of the antenna, and the present invention does not limit the details of the antenna distribution on the back surface. That is, the antenna may be located at the center of the back surface of the substrate or at the periphery of the back surface of the substrate, that is, the antenna or may overlap or be separated from each other in a direction perpendicular to the two surfaces from the circuit on the front surface of the substrate.

In general, the distribution of the dummy metal on the back surface of the substrate is limited to being separated from the antenna. The present invention can elastically adjust the details of the distribution of the dummy metal on the back surface of the substrate, regardless of the number, shape, area and spacing of the dummy metal. Or the relative relationship between the virtual metal and the antenna. The distribution of the virtual metal on the back surface of the substrate, in addition to the geometry of the antenna and the frequency at which the antenna is designed to receive and emit electromagnetic waves, is also related to the mechanical strength of the entire die and the requirements of the manufacturing/processing process.

In general, the grounding ball is used to direct the induced current caused by the electromagnetic waves that the antenna is to receive and/or emit on the die to the printed circuit board. The grounding ball may be evenly distributed around the antenna on the back surface of the substrate. Or may be evenly distributed around the circuit on the front surface of the substrate, or may be distributed on one or more surfaces of the substrate, or may be concentrated at a position where the intensity/number of induced current is relatively obvious, and the present invention The details of the number and distribution of grounding balls are not limited.

In general, the method of integrating the antenna and the circuit into the same die is to first set the antenna and the dummy metal on the back surface of the substrate and the distribution of the ground ball on one or more surfaces of the substrate, and then perform electromagnetic field simulation by computer simulation. Analysis of the current, and then adjust the distribution of the antenna, virtual metal and ground ball according to the simulation results, and then perform computer simulation again and then perform an electromagnetic field and current analysis. This is repeated until there is some sort of antenna, virtual metal and ground ball distribution that meets the requirements. Typically, the position and shape of the antenna on the back surface of the die is fixed, i.e., the present invention tends to focus on repeatedly adjusting both the virtual metal and the ground ball until it meets the requirements. Moreover, since the connection between the ground ball and the printed circuit board needs to consider other factors and cannot only consider the condition on the back surface of the substrate, the present invention tends to repeatedly adjust the dummy metal under a certain ground ball distribution until it meets the requirements.

The above description is only an overview of the technical solutions of the present invention, and the above-described and other objects, features and advantages of the present invention can be more clearly understood. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

1A and FIG. 1B are a basic structure and a sample structure of a die of an integrated circuit and an antenna according to the present invention.

2A and 2B schematically depict two example structures of integrated circuits using dummy metal and crystal grains of an antenna.

2C through 2E collectively show three possible variations of the die using the virtual metal and the die of the antenna.

3A and 3B are a summary view showing two exemplary structures of two types of integrated circuits using a ground ball and crystal grains of an antenna.

4A and 4B show the basic flow of the method for integrating the integrated circuit and the antenna of the antenna proposed by the present invention.

[Main component symbol description]

11: Substrate 12: Circuit

13: Antenna 14: Shared potential reference

15: TSV 16: Virtual Metal

17: Grounding ball 401: Step box

402: Step box 403: Step box

404: judgment box

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The detailed description of the present invention will be discussed by the following examples, which are not intended to limit the scope of the invention, and are applicable to other applications. The drawings disclose some details, and it must be understood that the disclosed details may differ from those disclosed, unless the features are explicitly limited.

Since the side length of a general crystal grain is often only a few millimeters, the circuit for processing and storing signals in the die (whether active circuit or passive circuit may also include storage) The problem of signal transmission and heat dissipation, etc., may not optimize the overall performance, but the wavelength of the electromagnetic wave actually used in the past is often significantly larger than a few centimeters, especially the antenna that can integrate the antenna into the die. The wavelength of electromagnetic waves is often significantly greater than a few centimeters. Therefore, if the circuit for processing and storing signals and the antenna for receiving and transmitting electromagnetic waves are integrated into the same die, basically only the die provided with the circuit and the die provided with the antenna are packaged ( Package) technology is integrated, not only does not save the die usage and die area, but also has to deal with the mutual interference and signal transmission between the circuit and the antenna.

However, with electromagnetic waves such as Terahertz-Gigahertz wave and other frequencies ranging from tens of gigahertz (GHz) to several terahertz (THz), applications such as security inspection tools, communication and communication are gradually being applied. In the field of material analysis and the like, the size of the antenna for receiving and transmitting electromagnetic waves may already be approximately equal to or even smaller than the size of the circuit for processing and storing electromagnetic waves. That is, it is possible to place the circuit and the antenna on the opposite surfaces of the same die, thereby saving the number of used crystals and reducing the die area, as long as the signal transmission between the circuit and the antenna can be effectively processed. Mutual interference and the like, as well as the need to properly maintain the mechanical strength of the entire die.

In response to such a development trend, the present invention proposes a method of integrating a circuit and an antenna die and an integration method, and the present invention will be described by way of the following embodiments and related discussion.

1A shows the basic structure of a die of an integrated circuit and an antenna proposed by the present invention. The circuit 12 is located on the front surface of the substrate 11 and the antenna 13 is located on the back surface of the substrate 11, and the circuit 12 is electrically connected to the antenna 13 to Share potential reference 14. Obviously, by forming the circuit 12 and the antenna 13 on two opposite surfaces of the same substrate 13, not only the material and thickness of the substrate 11 can be used to reduce the mutual interference between the circuit 12 and the antenna 13, especially the antenna 13. The couplers in the circuit 12 interact with each other, and since the circuit 12 and the antenna 13 can overlap each other in the direction of the vertical front surface and the back surface, the area of the integrated antenna and the die of the circuit can be reduced. In particular, when the wavelength of the electromagnetic wave to be received and emitted by the antenna 13 is such that the size of both the antenna 13 and the circuit 12 is the same or a few times greater than the difference. In addition, since the circuit 12 and the potential reference of the antenna 13 are the same, the operation of the two has a common reference, and the process of converting the electromagnetic wave received by the antenna 13 into an electromagnetic signal and transmitting it to the circuit 12 for processing and the circuit 12 is generated. The electromagnetic signal can be smoothly transmitted during transmission to the antenna 13 to emit electromagnetic waves.

Fig. 1B shows an example structure of a die of an integrated circuit and an antenna. The circuit 12 and the antenna 13 are located on opposite surfaces of the substrate 11. The through silicon via (TSV) 15 is electrically connected to the circuit 12 and the antenna 13, and the shared potential reference 14 is located inside the substrate 11 and separated from the TSV 15.

It must be emphasized that the invention does not need to limit the details of circuit 12, antenna 13 and shared potential reference 14. For example, in different embodiments, the shared potential reference 14 is either located inside the substrate 11 and between the antenna 13 and the circuit 12, or on the side surface of the substrate 11, or located The front surface of the substrate 11 is separated from the circuit 12 or is located on the back surface of the substrate 11 and is separated from the antenna 13. For example, if the present invention is considered to integrate the antenna 13 to the substrate 11 which originally has the circuit 12, the potential reference used by the circuit 12 for use regardless of the presence or absence of the antenna 13 can be used directly as the shared potential reference 14. For example, the circuit 12 can use a Complementary-Conducting-Strip Structure (CCS structure), and the shared potential reference 14 is the potential reference used for the complementary conduction band structure.

The invention also does not need to limit other details of the integrated circuit and the die of the antenna. For example, the material of the substrate 11 can be silicon or a substrate material that can be used by gallium arsenide or other semiconductor industries. For example, the substrate 11 may further include a surface (whether a front surface, a back surface or a side surface) on the substrate 11 and the electrical isolation circuit 12 and the antenna 13 are used to electrically isolate the shared potential reference and circuit 12 A dielectric layer with both antennas 13 in which any dielectric material that can be used in the semiconductor industry can be used.

In addition, the present invention limits only the two surfaces (or even different surfaces) of the circuit 12 and the antenna 13 on the opposite side of the substrate 11, and the relationship between the circuit 12 and the antenna 13 with respect to the substrate 11 is not required. More restrictions. For example, the position of the antenna 13 at the back surface may be elastically adjustable, or may be located in the middle of the back surface, or may be located around the back surface, or may be in a direction perpendicular to the front and back surfaces of the circuit 12. The above may overlap each other or may be separated from the circuit 12 in a direction perpendicular to the front surface and the back surface. For example, the size of the antenna 13 is proportional to the wavelength at which the antenna 13 is designed to receive and emit electromagnetic waves. For example, the ratio of the area of the antenna 13 to the back surface can be adjusted. When the antenna 13 is a resonant antenna, the larger the area ratio, the better, and the antenna 13 is a non-resonant antenna. This ratio is more unlimited.

In order to ensure that the antenna 13 can properly receive and emit electromagnetic waves, there is preferably no structure/material present around the antenna 13 that would affect electromagnetic wave transmission and/or interaction with the antenna 13. That is, some embodiments of the present invention allow for the presence of only the antenna 13 on the back surface of the substrate 11, at most, some of which are used to connect the substrate 11 having the circuit 12 and the antenna 13 to the printed circuit board. element.

However, it is limited by the mechanical strength requirements of the entire die or the requirements of the fab (or even the packaging factory) for the manufacturing process. If the back surface of the substrate 11 has only the antenna 13, or the integrated circuit of the final product and the die of the antenna. The mechanical strength is insufficient to be easily damaged, or the substrate 11 or the antenna 13 is damaged during the manufacturing process so that the integrated circuit and the crystal grains of the antenna cannot be properly formed. Although increasing the ratio of the antenna 13 to the back surface of the substrate 11 may enhance the mechanical strength of the die or meet the requirements of the fab (or even the packaging factory) for the manufacturing process, the size and size of the antenna 13 and the antenna 13 are to be received and/or It is related to the wavelength of the emitted electromagnetic wave. If the area of the antenna 13 is excessively increased (such as the width of the antenna 13), it may cause a loss such as an increase in leakage current or the like.

Accordingly, certain embodiments of the present invention place a plurality of dummy metals on the back surface of the substrate 11 to provide the required mechanical strength with the antenna 13 or to meet manufacturing process requirements. Therefore, the size, shape area and the like of the antenna 13 can be optimized for the electromagnetic waves to be received and emitted, and the required mechanical strength and manufacturing process requirements can be achieved by adjusting the size and shape distribution of the dummy metal and the like. . Of course, in order to minimize the possible negative effects on the antenna 13, these virtual metals are separated from the antenna 13. Moreover, in order to achieve the required mechanical strength and manufacturing process requirements, these virtual metals tend to surround the antenna 13 unless the antenna 13 is located at the edge of the back surface of the substrate 11 such that the dummy metal can only be located at other portions of the back surface of the substrate 11. In addition, any of the dummy metals and the shared potential reference 14 may be electrically isolated from each other or may be electrically isolated from each other. Here, FIGS. 2A and 2B schematically describe two example structures of the integrated circuit using the dummy metal 16 and the crystal grains of the antenna.

Obviously, since the use of the dummy metal 16 is derived from the requirements for the mechanical strength of the die and/or the requirements for the die manufacturing process, both the antenna 13 and the dummy metal 16 occupy the area ratio of the back surface and the back surface. The distribution is dependent at least on the mechanical strength of the grains and the manufacturing process of the grains. That is, the present invention can elastically adjust the ratio of the area of the antenna 13 and the dummy metal 16 on the back surface of the substrate 11 depending on the actual specifications of the die or the manufacturing process parameters such as the fab and the manufacturing process specifications and the like. With the way of distribution.

In any case, in order to reduce the mutual influence of the virtual metal 16 and the antenna 13, in particular, the antenna 13 has two end points in the longitudinal direction in which the electromagnetic wave energy is dense when receiving and transmitting electromagnetic waves (or the first and second ends of the antenna 13). The interaction between some of the virtual metal 16 and the antenna 13 in the vicinity, the distribution of the dummy metal 16 on the back surface of the substrate 11 often has some limitations. For example, in some embodiments, the virtual metal 16 is at a distance from the antenna 13 near the ends of the antenna 13 that receive and/or emit electromagnetic waves, while the dummy metal 16 and the antenna 13 are adjacent to other portions of the antenna. The distance is relatively close; in some embodiments, the distribution of the virtual metals 16 to each other near the ends of the antenna 13 that receive and/or emit electromagnetic waves is sparse, and the distribution of the virtual metals to each other near other portions of the antenna 13 is relatively small. Intensive; and in some embodiments, the virtual metal 16 has a smaller area near the ends of the antenna 13 that receives and/or emits electromagnetic waves, and the virtual metal 16 has a larger area near the other portions of the antenna 13. Of course, in other embodiments, the restriction may be further extended to a portion of the virtual metal 16 that is closer to the antenna 13 than to be sparse or smaller in size, or the restriction may be further extended to the antenna 13 . The portion of the dummy metal 16 at a relatively long distance is densely distributed or large in size, or the above various restrictions can be used in combination. In addition, except that the shapes of the dummy metals 16 may be different from each other in different embodiments, even in the same embodiment, the dummy metals 16 may be different from each other, and the present invention can elastically adjust the dummy metal according to actual needs in different embodiments. 16. For example, to simplify the manufacturing process and mechanical structure, the shape of any of the dummy metals 16 may be quadrilateral or even rectangular. shape. Here, Figures 2C through 2E show three possible variations in summary.

Further, the distance between the virtual metal 16 and the antenna 13 and the distance between the virtual metal 16 and the ends of the antenna 13 in the longitudinal direction are often proportional to the wavelength of the electromagnetic wave that the antenna 13 is designed to receive and/or emit. This is because in the vicinity of the two ends of the antenna, the range of the electromagnetic wave intensity at the time of receiving and/or transmitting electromagnetic waves is proportional to the wavelength of the electromagnetic wave that the antenna 13 is designed to receive and/or emit. Even the gap between the dummy metals 16 may be proportional to the wavelength of the electromagnetic waves that the antenna 13 is designed to receive and/or emit, thereby reducing the adverse effects of electromagnetic wave diffraction and the like. .

In addition, or in order to utilize these virtual metals 16 to enhance mechanical strength and meet manufacturing process requirements, or to reduce the effects of induced currents generated during the antenna receiving and/or transmitting electromagnetic waves, certain embodiments of the present invention It is preferable that the respective areas of the respective dummy metals 16 are as small as possible, that is, when the total performance of the virtual metal 16 used is fixed, a large number of small-area virtual metals 16 tend to be used instead of a few large ones. The area of the virtual metal 16. In addition, the spacing between the virtual metal 16 and the antenna 13 and even the spacing of the virtual metal 16 from each other can be adjusted, although the spacing is less important for enhancing the mechanical strength and meeting the manufacturing process requirements. In some embodiments of the invention, the spacing between the virtual metal 16 and the antenna 13 is as small as possible (but not less than the wavelength at which the antenna 13 is designed to process electromagnetic waves). In some embodiments of the invention, the spacing between adjacent virtual metals 16 is as small as possible.

For example, when the frequency of the electromagnetic waves that the antenna 13 is designed to receive and/or emit is between about 80 GHz and 650 GHz, the possible distribution limitations of the virtual metal 16 on the back surface of the substrate 11 include at least one of the following: The gap between the virtual metals 16 is about greater than 50 microns, and either side of any of the dummy metals 16 is greater than about 150 microns. Here, the shape of any of the dummy metals 16 may be a quadrangle, such as a rectangle or a square.

In addition to this, the use of the dummy metal 16 has an additional advantage: reducing damage caused by electromagnetic waves being conducted from the back surface of the substrate 11 to the circuit 12 located on the front surface of the substrate 11 via the inside and/or surface of the substrate 11. Is the wrong signal with extra noise). This is because the electromagnetic waves to be received and transmitted (especially to be received) by the antenna 13 do not appear only in the space near the back surface of the antenna 13 and the substrate 11, and these electromagnetic waves may always appear on the back surface of the substrate 11 instead of the antenna 13. part. Therefore, even if a dielectric similar to the shared potential reference 14 and/or used to electrically isolate the circuit 12 from the outside is used, the circuit 12 is more or less affected because the actual design is unlikely to be completely electrically isolated. For example, when the area of the circuit 12 is larger than the area of the antenna 11 and the back surface of the substrate 11 faces the direction of travel of the electromagnetic wave, it can be simply regarded that only a part of the circuit 11 is shielded by the antenna 11, that is, a part of the circuit 11 is more susceptible to the effects of electromagnetic waves being transmitted from the back surface of the substrate 11 to the circuit via the substrate 11. In any case, if the dummy metal 16 is present around the antenna 13 on the back surface of the substrate 11, the electromagnetic wave is from the portion other than the antenna 13 on the back surface of the substrate 11 due to the shielding effect of the conductive material such as metal. The probability that the sub-portions are transmitted to the circuit 12 on the front surface of the substrate 11 and the corresponding side effects can be reduced, thereby making the present invention in which the circuit 12 and the antenna 13 are respectively placed on different surfaces of the same substrate 11 to have better performance. Here, it must be emphasized that the present invention does not need to limit the number, shape and position of the dummy metal 16 on the back surface of the substrate 11, and so on, and everything can be adjusted according to actual conditions (such as the circuit 12, the antenna 13 and Depending on the relative configuration of the shared potential reference 14).

In addition, since the antenna 13 receives and/or emits electromagnetic waves, it may cause a non-negligible induced current, which may cause an effect such as affecting the operation of the circuit 12 and/or the antenna 13 or causing a discharge. Damage to the virtual metal 16 and so on. Accordingly, some embodiments of the present invention also include a plurality of grounding balls for directing induced currents present on one or more surfaces (whether front, back, or side surfaces) of the die 11 away from the integrated circuit and antenna. The die, such as a printed circuit board that directs the induced current to the integrated circuit and the die of the wire. Here, different ground balls are respectively connected to different portions of one or more surfaces of the die. In various embodiments of the present invention, the grounding balls are evenly distributed on the front surface of the substrate 11, or uniformly distributed on the back surface of the substrate 11, or distributed on the front surface of the substrate 11, or distributed on the back surface of the substrate 11, Or it is distributed in a portion where the induced current on the substrate 11 is denser and stronger when the antenna 13 receives and/or emits electromagnetic waves. Further, the distribution of these ground balls on one or more surfaces of the substrate 11 can also be used to reinforce the mechanical strength of the entire integrated circuit and the crystal grains of the antenna. The invention does not need to limit the specific details of the grounding balls, such as the ground ball is a gold bump, a solder ball or other conductive material, and the number, shape and distribution of the ground balls. and many more. Here, FIGS. 3A to 3B collectively show two kinds of example structures of the integrated circuit using the ground ball 17 and the crystal grains of the antenna.

4A and 4B show the basic flow of the method for integrating the integrated circuit and the antenna of the antenna proposed by the present invention. First, as shown in step a of step 401, the distribution of the circuitry on the front surface of the substrate and the distribution of the antenna and the plurality of dummy metals on the back surface of the substrate and the plurality of ground balls on one or more surfaces of the substrate are set. Here, the setting may be based on the configuration of the similar crystal grains in the contents of the database, or the configuration of the virtual metal and the grounding balls may be randomly arranged after the circuit and the antenna are respectively placed between the front surface and the back surface. Or set according to the content discussed above for such a die. The present invention does not need to strictly limit how to set it in step a, because the subsequent steps will modify the adjustment. Next, as shown in step b of step 402, the analog antenna receives the electromagnetic field and current distribution on the antenna, the virtual metal and the ground ball when transmitting the electromagnetic wave. In this simulation process, the grounding balls and the electromagnetic fields and currents faced by these virtual metals are specially treated, in particular, the distribution of induced currents is calculated. Then, as shown in step 403 of step 403, the distribution of the antenna, the virtual metal, and/or the ground ball is adjusted based on the simulation results. Here, the direction of adjustment is basically to adjust the distribution of these virtual metals and these grounding balls to a position that can effectively direct the induced current away from the die (or to the position where the induced current is at most the strongest). Next, step b and step c (or step block 402 and step block 403) are repeated until the antenna, These virtual metals meet the requirements of the electromagnetic field and current distribution on these grounding balls. In other words, after step block 402, it is first determined as determined by decision block 404 whether the analog result can be received, such as whether the distribution or effect of the induced current generated is within an acceptable range. If so, the simulation results of step 402 are used directly as the actual configuration for fabricating the die for such integrated circuits and antennas. If not, step 403 and step 402 are performed in sequence, and then the decision block 404 is performed again with the new simulation result, and according to the judgment result, it is determined as the actual configuration or Step block 403 and step block 402 are again performed in sequence until a result that can be received is obtained (or the steps are repeated if the result can be received). It must be noted that in this method, the circuit and the antenna are electrically connected to a shared potential reference, the dummy metal is surrounding the antenna and separated from the antenna, and the different ground balls are respectively connected to different portions of the one or more surfaces of the substrate. Also, the adjustments made in step c must be such that the distribution of these virtual metals (such as the density of the virtual metal) on the back surface of the substrate meets the mechanical strength and associated manufacturing process requirements.

In addition, since the configuration of the antenna is related to the wavelength of the electromagnetic wave designed to receive and/or emit, to the intensity of the electromagnetic wave that is expected to be received and/or transmitted, and even to how the antenna transmits electromagnetic signals to and from the circuit, The adjustment of the antenna will affect more factors. In some embodiments of the invention, in steps b and c, the antenna is fixed and only the dummy metal and the ground balls are iteratively adjusted until the requirements are met. Further, since these ground ball configurations are related to the connection between such integrated circuits and the antenna die and the printed circuit board, the adjustment of these ground balls does not only affect the distribution of the induced current. In some embodiments of the invention, in steps b and c, the antenna and the ground balls are fixed and only the dummy metals are iteratively adjusted until the requirements are met. Whether the grounding ball and the antenna need to be adjusted are selected depending on the actual situation, and the present invention is not limited.

In general, the portion that can be adjusted in step c includes, but is not limited to, the following: size of at least one virtual metal, shape of at least one virtual metal, distance between at least two virtual metals, at least between the virtual metal and the antenna The distance, the location of these virtual metals around the antenna, and the number and location of these virtual metals. In general, the adjustments that can be made in step c include, but are not limited to, the following: make the dimensions of these virtual metals as small as possible, and make the distance between these virtual metals as small as possible, so that the part farther from the antenna These dummy metals are large in size, such that portions of the virtual metal that are closer to the antenna are smaller in size, and the distance between the virtual metal and the ends of the antenna is as large as possible. In general, the adjustments that can be made in step c include, but are not limited to, the following: the gap between the virtual metals is proportional to the wavelength of the electromagnetic waves that the antenna is designed to receive and/or emit, and the virtual metal and the longitudinal direction of the antenna are The distance between the endpoints is proportional to the wavelength of the electromagnetic waves that the antenna is designed to receive and/or emit, and the gap between the virtual metals to each other is proportional to the wavelength of the electromagnetic waves that the antenna is designed to receive and/or emit.

Since the focus of this method is to first find out that the induced current is more intense (or the part with stronger electromagnetic field strength), then adjust the position and distribution of the virtual metal (even the grounding ball and/or antenna). The number or shape, etc., thereby either eliminating the generation of such induced current distribution or the induced current that would cause the problem to be guided away. Therefore, the crystals to be integrated by the method can directly use various details and possible variations of the crystals of the integrated circuit and the antenna in the above discussion.

For example, the method does not need to limit the details of both the circuit and the antenna at all. For example, the method may place the antenna in the middle of the back surface, or the antenna may be placed around the back surface, or the antenna may overlap the circuit in the direction of the vertical front surface and the back surface, or The antenna is separated from the circuit in the direction of the vertical front and back surfaces. For example, the method may be designed such that the antenna is designed to receive the size of the antenna in proportion to the wavelength of the emitted electromagnetic wave, and or the antenna may be a larger proportion of the back surface of the substrate when the antenna is a resonant antenna. . For example, the method may use a potential reference that is used by the circuit regardless of whether an antenna is present or a shared potential reference, or may place the shared potential reference inside the substrate and between the antenna and the circuit, or may share the potential The fiducial placement is on the front surface, or the shared potential reference can be placed on the side surface of the substrate, and the shared potential reference can be placed inside the substrate. For example, the method may set the ratio of the area of the back surface occupied by the antenna and the dummy metal to the common distribution on the back surface according to the mechanical strength of the die and the manufacturing process of the die.

For example, the method may be such that a portion of the virtual metal near the ends of the antenna that receives and/or emits electromagnetic waves is farther from the antenna, and a portion of the virtual metal is closer to the antenna than the other portion of the antenna. Nearly, the distribution of these virtual metals near the ends of the antenna receiving and/or transmitting electromagnetic waves may be sparse, and the portions of the virtual metal near the other parts of the antenna may be densely distributed, or the virtual metals may be The portion of the virtual metal near the ends of the antenna that receives and/or emits electromagnetic waves is small, and the portion of the dummy metal near the other portions of the antenna is larger, or may be located closer to the antenna. Some of these virtual metals are sparsely distributed, and the distribution of these virtual metals is denser at a portion farther from the antenna, or the size of the virtual metal at a portion closer to the antenna may be smaller and away from the antenna. Some of these virtual metals are larger in size.

For example, the method may evenly distribute the ground balls uniformly on the front surface of the substrate, or may distribute the ground balls evenly on the back surface of the substrate, or may distribute the ground balls on the front surface of the substrate, or may allow these The ground balls are distributed on the back surface of the substrate, or the ground balls may be distributed on one or more surfaces of the substrate (whether the front surface, the back surface or the side surface), or the ground balls may be distributed when the antenna receives and/or emits In the electromagnetic wave, the inductive current on the substrate is denser and stronger. Moreover, the method does not limit the details of these ground balls, for example gold bumps or solder balls can be used as the ground balls.

For example, when the antenna is designed to receive and/or transmit electromagnetic waves with a frequency between about 80 GHz and 650 GHz, that is, when designed to handle the popular terahertz-Girsch waves in recent years, the steps are b and the simulations and adjustments made in the step may include at least one of the following: let the gaps between the virtual metals be greater than about 50 microns, and let either side of any of the virtual metals be greater than about 150 microns, allowing any virtual The shape of the metal is a quadrangle, and the shape of any one of the virtual metals is a rectangle.

Incidentally, in general, when the frequency of the electromagnetic wave to be processed is greater than about 60 GHz, the use of the integrated circuit and antenna die and integration method proposed by the present invention begins to have significant advantages. For example, if the material used is a gallium arsenide having a dielectric constant of about 12.9, the antenna is designed to receive and/or emit electromagnetic waves having a frequency of about 100 GHz (wavelength of about 3000 microns), and the length of the antenna. It is about 417.6 mm. Considering the general commercial application, the sides of the die are about 2 mm, and the size of the antenna is between one-third and one-half of the size of the die (considering integration) Mechanical strength of the die of the circuit and the antenna, heat dissipation, electromagnetic interference and subsequent packaging manufacturing processes, etc.). It can be easily found that when the frequency of the electromagnetic wave is higher than about 60 GHz or even higher, the various advantages of the integrated circuit and the antenna of the antenna proposed by the present invention begin to become apparent.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. The skilled person can make some modifications or modifications to the equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The invention is not limited to any simple modifications, equivalent changes and modifications of the above embodiments.

Claims (29)

A die for integrating a circuit and an antenna, characterized by comprising: a substrate having a front surface and a back surface; a circuit on the front surface; An antenna located on the back surface; A potential reference is shared and electrically connected to the circuit and the antenna. The die according to claim 1 further comprising at least one of the following: The shared potential reference is located on the front surface; The shared potential reference is located on a side surface of the substrate; The shared potential reference is located inside the substrate; The shared potential reference is located inside the substrate and between the antenna and the circuit. The die of claim 1 wherein the shared potential reference is a potential reference used by the circuit regardless of the presence of the antenna. The die according to claim 1, wherein the position of the antenna at the back surface is elastically adjustable and does not have to be located in the middle of the back surface or perpendicular to the front surface of the circuit The directions of the back surfaces overlap each other. The die of claim 1 wherein the antenna is sized to be proportional to the wavelength of the electromagnetic wave that the antenna is designed to receive and emit. The die according to claim 1, wherein the ratio of the area of the antenna to the back surface is larger as the antenna is a resonant antenna and less restrictive when the antenna is non-resonant. The die of claim 1 including a plurality of dummy metals on the back surface surrounding the antenna but separated from the antenna. The die according to claim 7, wherein the ratio of the area occupied by the antenna and the dummy metal to the back surface and the distribution on the back surface are dependent on at least the following two points: Mechanical strength and manufacturing process of the grain. The die according to claim 7, wherein the distribution limitation of the dummy metal on the back surface comprises at least one of the following: The virtual metal is far from the antenna near the two ends of the antenna receiving and/or transmitting electromagnetic waves, and the virtual metal is closer to the antenna near other portions of the antenna; The virtual metals are sparsely distributed to each other near the ends of the antenna receiving and/or transmitting electromagnetic waves, and the virtual metals are densely distributed to each other near other portions of the antenna; The virtual metal has a smaller area near both ends of the antenna receiving and/or transmitting electromagnetic waves, and the virtual metal has a larger area near the other portions of the antenna. The die according to claim 7, wherein the distribution limitation of the dummy metal on the back surface comprises at least one of the following: a portion of the virtual metal that is closer to the antenna is sparsely distributed, and a portion of the virtual metal that is further away from the antenna is more densely distributed; The portion of the dummy metal that is closer to the antenna is smaller in size, and the portion of the dummy metal that is farther from the antenna is larger in size. The die according to claim 7, wherein the distribution limitation of the dummy metal on the back surface comprises at least one of the following: The distance of the virtual metal from the antenna is proportional to the wavelength of the electromagnetic wave that the antenna is designed to receive and/or emit; The distance between the virtual metal and the ends of the antenna in the longitudinal direction is proportional to the wavelength of the electromagnetic wave that the antenna is designed to receive and/or emit; The gaps between the virtual metals are proportional to the wavelength of the electromagnetic waves that the antenna is designed to receive and/or emit. The die according to claim 7, wherein when the frequency of the electromagnetic wave designed and/or emitted by the antenna is between 80 GHz and 650 GHz, the distribution of the virtual metal on the back surface is limited. At least one of the following: The gap between the virtual metals is greater than 50 microns; Either one of the sides of the virtual metal is greater than 150 microns; Any one of the virtual metal shapes is a quadrangle or a rectangle. The die according to claim 7, comprising a plurality of ground balls, the different ground balls being respectively connected to different portions of the dummy metal. The die according to claim 13 comprising at least one of the following: The ground ball is evenly distributed on the front surface; The ground ball is evenly distributed on the back surface; The ground ball is distributed on the front surface; The ground ball is distributed on the negative surface; The ground ball is distributed on one or more side surfaces of the substrate; The ground ball is distributed over a portion where the induced current on the substrate is denser and stronger when the antenna receives and/or emits electromagnetic waves. The die according to claim 13, wherein said ground ball is a gold bump or a solder ball. A method for integrating a circuit and an antenna in the same die, characterized by comprising: a. setting the circuit distribution on the front surface of the substrate and the distribution of the antenna and the plurality of dummy metals on the back surface of the substrate and the plurality of ground balls on one or more surfaces of the substrate; b. simulating an electromagnetic field and current distribution on the antenna, the dummy metal, and the ground ball when the antenna receives the emitted electromagnetic wave; c. adjusting the distribution of the antenna, the dummy metal, and the ground ball according to a simulation result; d. Repeat step b and step c until the antenna, the dummy metal and the ground The electromagnetic field and current distribution on the ball meet the demand; Here, the circuit and the antenna are electrically connected to a shared potential reference; Here, the dummy metal surrounds the antenna and is separated from the antenna; Here, different ground balls are respectively connected to different portions of one or more surfaces of the substrate. The method according to claim 16, characterized in that the antenna is fixed in steps b and c and only the dummy metal and the ground ball are repeatedly adjusted until the requirements are met. The method according to claim 16, characterized in that the antenna and the ground ball are fixed in steps b and c, and the dummy metal is repeatedly adjusted until it meets the demand. The method of claim 16 wherein step c comprises adjusting at least one of: at least one size of the virtual metal, at least one shape of the virtual metal, at least two distances between the virtual metals, at least a distance between the virtual metal and the antenna, a position of the virtual metal around the antenna, and a quantity and location of the virtual metal. The method according to claim 16, wherein the step c comprises at least one of: making the size of the dummy metal as small as possible, making the distance between the virtual metals as small as possible, leaving a portion of the virtual metal that is farther from the antenna has a larger size, a portion of the virtual metal that is closer to the antenna is smaller in size, and a distance between the virtual metal and the first and last ends of the antenna As large as possible. The method of claim 16 including at least one of the following: Place the antenna in the middle of the back surface: Placing the antenna around the back surface; Having the antenna overlap the circuit in a direction perpendicular to the front surface and the back surface; Having the antenna separate from the circuit in a direction perpendicular to the front surface and the back surface; Depending on the antenna is designed to receive the size of the antenna in proportion to the wavelength of the emitted electromagnetic wave; When the antenna is a resonant antenna, the antenna occupies a larger proportion of the back surface. The method of claim 16 including at least one of the following: The potential reference used by the circuit to use the presence or absence of the antenna is the shared potential reference; Disposing the shared potential reference inside the substrate and between the antenna and the circuit; Placing the shared potential reference on the front surface; Placing the shared potential reference on a side surface of the substrate; The shared potential reference is placed inside the substrate. The method according to claim 16, comprising: setting an area ratio of the antenna and the dummy metal to occupy the back surface according to the mechanical strength of the die and the manufacturing process of the die, and collectively The way the surface is distributed. The method of claim 16 including adjusting the distribution of said virtual metal on said back surface in accordance with at least one of: a portion of the virtual metal near the ends of the antenna that receives and/or emits electromagnetic waves is far from the antenna, and a portion of the virtual metal near the other portion of the antenna is closer to the antenna; a portion of the virtual metal near the ends of the antenna that receives and/or emits electromagnetic waves is sparsely distributed to each other, and portions of the dummy metals near the other portions of the antenna are more densely distributed to each other; A portion of the dummy metal in the vicinity of both ends of the antenna receiving and/or transmitting electromagnetic waves is small, and a portion of the dummy metal in the vicinity of other portions of the antenna is larger in area. The method of claim 16 including adjusting the distribution of said virtual metal on said back surface in accordance with at least one of: The distribution of the dummy metal is relatively sparse in a portion closer to the antenna, and the distribution of the dummy metal is denser at a portion farther from the antenna; The portion of the dummy metal that is closer to the antenna is smaller in size, and the portion of the dummy metal is larger at a portion farther from the antenna. The method of claim 16 including adjusting the distribution of said virtual metal on said back surface in accordance with at least one of: The gaps between the virtual metals are proportional to the wavelength of the electromagnetic waves that the antenna is designed to receive and/or emit; The distance between the virtual metal and the ends of the antenna in the longitudinal direction is proportional to the wavelength of the electromagnetic wave that the antenna is designed to receive and/or emit; The gaps between the virtual metals are proportional to the wavelength of the electromagnetic waves that the antenna is designed to receive and/or emit. The method of claim 16 including at least one of the following: Having the ground ball evenly distributed on the front surface of the portion where the antenna is located; Having the ground ball evenly distributed on the back surface of the portion where the virtual metal is located; Having the ground ball distributed on the front surface of the portion where the antenna is located; Having the ground ball distributed over the back surface of the portion where the virtual metal is located; The ground ball is distributed over a portion of the virtual metal that induces a relatively dense current when the antenna receives and/or emits electromagnetic waves. The method of claim 16 including using gold bumps or solder balls as said ground ball. The method according to claim 16, wherein when the antenna is designed to receive and/or emit electromagnetic waves having a frequency of between 80 GHz and 650 GHz, the step b and the step c further comprise at least one of the following: Allowing the gaps of the virtual metals to be greater than 50 microns; Let either side of the virtual metal be greater than 150 microns long; Let any one of the virtual metal shapes be a quadrangle or a rectangle.

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