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WO2018182505A1 - Système de fabrication de micro-dispositifs - Google Patents

Système de fabrication de micro-dispositifs Download PDF

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Publication number
WO2018182505A1
WO2018182505A1 PCT/SG2017/050182 SG2017050182W WO2018182505A1 WO 2018182505 A1 WO2018182505 A1 WO 2018182505A1 SG 2017050182 W SG2017050182 W SG 2017050182W WO 2018182505 A1 WO2018182505 A1 WO 2018182505A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor manufacturing
semiconductor
processing
wafer
steps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/SG2017/050182
Other languages
English (en)
Inventor
Masataka Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neitas Pte Ltd
Original Assignee
Neitas Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neitas Pte Ltd filed Critical Neitas Pte Ltd
Priority to PCT/SG2017/050182 priority Critical patent/WO2018182505A1/fr
Publication of WO2018182505A1 publication Critical patent/WO2018182505A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Definitions

  • the present invention relates to microdevice manufacturing systems .
  • Patent Document 1 Japanese Unexamined Patent Application, Publication No. 2006-279072
  • microdevices including semiconductor components
  • only some large companies can manufacture microdevice components.
  • the present invention is made in view of such conditions and has an object to efficiently manufacture the microdevice with a small investment.
  • a microdevice manufacturing system includes:
  • n (n is an arbitrary integer value greater than or equal to one) first microdevice manufacturing devices which perform processing in predetermined one or more steps among a
  • microdevice manufacturing devices which perform, as processing in predetermined one or more steps among the plurality of steps which are different from the one or more steps of the processing performed by the n microdevice manufacturing devices, collective processing on two or more units.
  • Fig. 1 is a diagram showing an example of the
  • Fig. 2 is a plan view showing the specific configuration of the semiconductor manufacturing system in Fig. 1;
  • Fig. 3 is a cross-sectional side view of the semiconductor manufacturing system in Fig. 2;
  • Fig. 4 is a diagram showing the specific example of a wafer supply portion included in a first semiconductor
  • Fig. 5 is a block diagram showing the hardware
  • Fig. 6 is a functional block diagram showing an example of the functional configuration of the server in Fig. 5;
  • Fig. 7 is a diagram showing a specific example of the types of semiconductor components and steps for each of the types managed by the server of Fig. 5.
  • FIG. 1 is a diagram showing an example of the configuration of a semiconductor manufacturing system S according to an embodiment of a microdevice manufacturing system in the present invention.
  • the semiconductor manufacturing system S shown in Fig. 1 is configured so as to include a server 1, first semiconductor manufacturing devices 2-1 to 2-8, a second semiconductor manufacturing device 3, a transport device 4, delivery
  • the server 1, the first semiconductor manufacturing devices 2-1 to 2-8, the second semiconductor manufacturing device 3 and the transport device 4 are connected to each other through a predetermined network L such as a local area network (LAN) .
  • LAN local area network
  • first semiconductor manufacturing devices 2 when it is not necessary to distinguish the first semiconductor manufacturing devices 2-1 to 2-8 from each other, they are collectively referred to as "first semiconductor manufacturing devices 2".
  • semiconductor manufacturing devices 2 is eight in the example of Fig. 1, there is no particular limitation to the eight, and the number thereof may be n (n is an arbitrary integer value more than or equal to one) .
  • the number of second semiconductor manufacturing devices 3 is one in the example of Fig. 1, there is no particular limitation to the one, and the number thereof may be m (m is an arbitrary integer value which is different from n and which is more than or equal to one) .
  • predetermined type of semiconductor component is manufactured in units of a wafer having a predetermined size.
  • predetermined processing in each of a plurality of steps such as washing, exposure and development is sequentially performed.
  • the server 1 controls the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3, and thereby individually performs a plurality of steps so as to manufacture the predetermined type of
  • manufacturing devices 2-1 to 2-8 performs, among a plurality of steps for manufacturing a predetermined type of
  • semiconductor component having a wafer of a predetermined size as one unit, processing in predetermined one or more steps which are previously set.
  • manufacturing the semiconductor component of the type to be manufactured are limited, and thus only at least one of the first semiconductor manufacturing devices 2 can perform
  • the semiconductor manufacturing system S can be formed with the necessary minimum number of first semiconductor
  • one first semiconductor manufacturing device 2 is extremely compact and can be procured significantly
  • the second semiconductor manufacturing device 3 is a semiconductor manufacturing device which performs, as
  • the second semiconductor manufacturing device 3 performs
  • processing such as in a sputtering step, an implant step or a CVD (chemical vapor deposition) step on two or more units of the wafers at a time.
  • CVD chemical vapor deposition
  • the transport device 4 is installed according to the layout of the first semiconductor manufacturing devices 2-1 to
  • the second semiconductor manufacturing device 3 transports, based on an instruction from the server 1, the wafer from a predetermined one of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 to another.
  • a conveyer on which the wafer is loaded and which transports it in a predetermined direction is arranged on the inner circumference of the first
  • the semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 In order for the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 to be connected to the conveyer, the delivery portions 5-1 to 5-11 are respectively provided. When predetermined steps are performed in the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3, the wafers are
  • the wafers are respectively transported from the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 through the delivery portions 5-1 to 5-11 to the conveyer.
  • delivery portions 5-1 to 5-11 when it is not necessary to distinguish the delivery portions 5-1 to 5-11 from each other, they are collectively referred to as "delivery portions 5".
  • the delivery portion 5 is formed with a bar-shaped member, and has, at one end portion, a conveyer fixing portion
  • predetermined one unit of the wafer For example, when the steps for manufacturing the predetermined type of
  • semiconductor component include a process in which a first step is performed in the first semiconductor manufacturing device 2-2 and in which thereafter a separate second step is performed in the first semiconductor manufacturing device 2-3, the delivery portions 5 perform the following processing.
  • the delivery portion 5-2 receives the wafer from the first semiconductor manufacturing device 2-2 which
  • the manufacturing device 2-2 separates, on the wafer loading portion 502, the wafer sucked by a Bernoulli chuck 202 which will be described later and which is shown in Fig. 2 so as to load the wafer onto the delivery portion 5-2.
  • the delivery portion 5-2 receives the predetermined one unit of the wafer from the first semiconductor manufacturing device 2-
  • the delivery portion 5-2 loads the wafer onto the wafer loading portion 502. In this way, the wafer is moved by the conveyer and is stopped in front of the first
  • the first semiconductor manufacturing device 2-3 makes the Bernoulli chuck 202 (see Fig. 2) suck the wafer loaded on the wafer loading portion 502 so as to receive it. Then, the first semiconductor manufacturing device 2-3 performs the processing in the second step on the wafer. In this way, the delivery portions 5-1 and 5-2 deliver the predetermined one unit of the wafer from the first semiconductor manufacturing device 2-1 to the first semiconductor manufacturing device 2-2. In other words, the delivery portions 5 perform the processing
  • the clean tunnel 6 is arranged so as to cover the entire transport device 4, and shields the transport device 4 from an unclean portion outside the clean tunnel 6 so as to transport, with the transport device 4, the predetermined one unit of the wafer in a clean portion.
  • the interior of the clean tunnel 6 is completely shielded from the outside of the clean tunnel 6.
  • the interior of the clean tunnel 6 is put in an atmosphere of nitrogen or a vacuum atmosphere, and thus it is possible to maintain the clean environment.
  • the transport of the wafer from a predetermined one of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 to another is consistently performed in a state where the wafer is shielded from the unclean portion.
  • the clean tunnel 6 is used, and thus the processing in each step can be performed on the wafer without preparation of the same number of small sealed containers whose internal environment is similar to a clean room as the number of wafers while the clean state is maintained.
  • Fig. 1 performs, for example, the following operation (processing) .
  • the server 1 forms a manufacturing plan for efficiently manufacturing one or more pieces of each of the plurality of types of
  • the server 1 forms, with consideration given to the balance of the entire
  • the same step may be performed by a plurality of semiconductor manufacturing devices 2) and in which order the transport of the wafer among the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 is performed by the transport device 4.
  • the details of the processing in each of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 are not set by an individual operation on each of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 but are set, based on a manufacturing plan formed by the server 1, under
  • the server 1 Based on the formed plan, the server 1 provides, to the first semiconductor manufacturing devices 2-1 to 2-8, the second semiconductor manufacturing device 3, the transport device 4 and the delivery portions 5-1 to 5-11, instructions to perform the processing in the individual steps on the wafer to be manufactured in the predetermined order and in a sequential manner.
  • the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 perform, based on the instructions from the server 1, on the wafer to be manufactured, the processing in the
  • the transport device 4 performs, based on the instruction from the server 1, the transport of the wafer among the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3. In this way, an individual operation on each of the first semiconductor manufacturing devices 2-1 to 2-8, the second semiconductor manufacturing device 3 and the transport device 4 is not necessary. In other words, the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 can perform the predetermined
  • the transport device 4 can transport the wafer in an appropriate order.
  • the server 1 determines a combination of q (q is an arbitrary integer value which is different from n and m described above and which is more than or equal to one) steps for manufacturing the new type of semiconductor component.
  • the server 1 allocates, to each of the first semiconductor manufacturing devices 2, one or more steps among the q steps in which processing is to be performed. As described above, the server 1 can also form a plan for the manufacturing process of a new type of semiconductor component.
  • the server 1 forms, with
  • the semiconductor manufacturing system S can reduce a temporal cost and an actual cost caused when a small number of semiconductor components such as for a prototype or a customized item are manufactured.
  • semiconductor manufacturing device 3 and the transport device 4 can be reduced.
  • Fig. 2 is a plan view showing the specific configuration of the semiconductor manufacturing system S in Fig. 1.
  • the transport device 4 including the conveyer on which the wafer is loaded and which transports it in the predetermined direction is arranged.
  • the delivery portions 5-1 to 5-11 for connecting the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 to the conveyer are provided.
  • the first semiconductor manufacturing device 2-1 performs, among the individual types of steps for manufacturing the semiconductor component, a step of supplying one unit of the wafer to a manufacturing line.
  • the first semiconductor manufacturing device 2-1 includes a wafer supply portion 201 for supplying the one unit of the wafer to the manufacturing line of the semiconductor component and the Bernoulli chuck 202 for delivering the one unit of the wafer to the delivery portion 5-1.
  • a wafer cassette 700 on which a plurality of units of the wafers are loaded is connected to the wafer supply portion 201.
  • the first semiconductor manufacturing devices 2-1 to 2-8 include a processing portion for performing, on the one unit of the wafer, processing in the individual types of steps previously allocated though it is not shown in the figure.
  • the first semiconductor manufacturing devices 2-2 to 2-8 individually include the Bernoulli chuck 202 for delivering the wafer to the delivery portions 5-2 to 5-12.
  • the second semiconductor manufacturing device 3 includes a wafer tray 301 which holds a plurality of units of the wafers, an aligner 302 which transfers a pattern described on a mask to the plurality of units of wafers and a wafer transport robot 303 which
  • the semiconductor component is manufactured by the following process. For example, when steps for manufacturing one unit of a
  • semiconductor component include a manufacturing process in which in the first semiconductor manufacturing device 2-1, the one unit of the semiconductor component is supplied to a manufacturing line (processing in such a step is performed) and in which thereafter processing in separate steps is performed in the order of the first semiconductor
  • the semiconductor component is manufactured as follows .
  • the first semiconductor manufacturing device 2-1 performs the processing in the step of supplying the wafer to the manufacturing line. Specifically, the wafer supply portion 201 of the first semiconductor manufacturing device 2-1 loads, onto the wafer loading portion 502, a
  • the wafers are supplied to the manufacturing line unit by unit.
  • the first semiconductor manufacturing device 2-1 repeatedly performs the processing described above.
  • the predetermined unit of the wafer loaded on the delivery portion 5-1 is
  • the processing portion of the first semiconductor manufacturing device 2-2 performs, on the wafer, based on a manufacturing instruction from the server 1, the processing in the step to be performed by itself.
  • semiconductor manufacturing device 2-2 is loaded from the first semiconductor manufacturing device 2-2 onto the delivery portion 5-2 and is transported with the conveyer. Thereafter, in the semiconductor manufacturing devices 2-3 to 2-5,
  • the wafer is supplied to the manufacturing line with the first semiconductor manufacturing device 2-1, and in the
  • the processing in the individual types of steps is sequentially performed, with the result that the wafer is gradually brought close to the finished product of the semiconductor component to be manufactured.
  • the wafer on which the processing in the predetermined step is performed with the first semiconductor manufacturing devices 2-1 to 2-5 is transported with the conveyer to the second semiconductor manufacturing device 3.
  • the predetermined unit of the wafer which is transported to the front of the second semiconductor manufacturing device 3 is loaded onto the wafer tray 301 with the Bernoulli chuck 202 of the second semiconductor manufacturing device 3.
  • the wafer tray 301 holds a plurality of units of the wafers including the one unit of the wafer.
  • the aligner 302 transfers the pattern described on the mask to the plurality of units of the wafers loaded on the wafer tray 301.
  • the wafer transport robot 303 transports the plurality of units of the wafers held on the wafer tray 301.
  • the following processing is performed on the plurality of units of the wafers loaded on the wafer tray 301, in the second semiconductor manufacturing device 3, the following processing is performed. In this way, the semiconductor component is manufactured.
  • Fig. 3 is a cross- sectional side view of the semiconductor manufacturing system S in Fig. 2.
  • a plurality of first semiconductor manufacturing devices 2 are arranged so as to sandwich the transport device 4 from both side surfaces.
  • the delivery portions 5 for connecting the first semiconductor manufacturing devices 2 to the conveyer are provided.
  • the clean tunnel 6 is arranged so as to cover the transport device 4.
  • an FFU 611 is provided in the clean tunnel 6, an FFU 611 is provided.
  • the FFU 611 is a fan filter unit which purifies, through a filter, external air sucked by a fan and which feeds out it into the clean tunnel 6 as clean air. In this way, in order for the wafer to be transported in the clean portion, the transport portion 4 can be shielded from the external unclean portion.
  • manufacturing device 3 includes the wafer tray 301, the aligner 302 and the wafer transport robot 303.
  • the transport device 4 and the clean tunnel 6 are installed horizontally.
  • FIG. 4 is a diagram showing the specific example of the wafer supply portion 201 included in the first semiconductor manufacturing device 2-1 in the semiconductor manufacturing system S of Fig. 2.
  • Fig. 4A is a plan view showing the specific example of the wafer supply portion 201 included in the first semiconductor manufacturing device 2-1.
  • Fig. 4B is a front view showing the specific example of the wafer supply portion 201 included in the first semiconductor manufacturing device 2-1.
  • Fig. 4C is a side view showing the specific example of the wafer supply portion 201 included in the first semiconductor manufacturing device 2-1.
  • the wafer supply portion 201 includes a drive gear 601 which drives the wafer cassette 700 vertically in a state where the wafer cassette 700 is
  • the predetermined unit of the wafer is taken out from the wafer cassette and is supplied to the manufacturing line of the semiconductor component.
  • the predetermined unit of the wafer is taken out from the wafer cassette and is supplied to the manufacturing line of the semiconductor component.
  • the first semiconductor manufacturing device 2-1 performs the step of supplying the wafer to the manufacturing line.
  • the wafer supply portion 201 included in the first semiconductor manufacturing device 2-1 repeats the operation described above and thereby supplies the wafers loaded on the wafer cassette 700 every predetermined unit.
  • Fig. 5 is a block diagram showing the hardware configuration of the server 1 in Fig. 1.
  • the server 1 includes a CPU (Central Processing Unit) 11, a ROM (Read Only Memory) 12, a RAM (Random Access Memory) 13, a bus 14, an input/output interface 15, an output portion 16, an input portion 17, a storage portion 18, a communication portion 19 and a drive 20.
  • CPU Central Processing Unit
  • ROM Read Only Memory
  • RAM Random Access Memory
  • the CPU 11 performs various types of processing according to programs recorded in the ROM 12 or programs loaded from the storage portion 18 onto the RAM 13.
  • the RAM 13 data and the like which are necessary for performing various types of processing by the CPU 11 are stored as necessary.
  • the CPU 11, the ROM 12 and the RAM 13 are connected to each other through the bus 14.
  • the input/output interface 15 is also connected to the bus 14.
  • the output portion 16, the input portion 17, the storage portion 18, the communication portion 19 and the drive 20 are connected to the input/output interface 15.
  • the output portion 16 is formed with a display, a speaker and the like so as to output various types of information as images and sounds.
  • the input portion 17 is formed with a keyboard, a mouse and the like so as to input various types of information .
  • the storage portion 18 is formed with a hard disk, a DRAM (Dynamic Random Access Memory) and the like so as to store various types of data.
  • the communication portion 19 is formed with a hard disk, a DRAM (Dynamic Random Access Memory) and the like so as to store various types of data.
  • a network N including the Internet.
  • a removable medium 30 which is formed with a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory or the like is fitted to the drive 20 as necessary.
  • a program which is read by the drive 20 from the removable medium 30 is installed in the storage portion 18 as necessary.
  • the removable medium 30 can also store various types of data stored in the storage portion 18 as with the storage portion 18.
  • Fig. 6 is a functional block diagram showing an example of the functional configuration of the server 1 in Fig. 5.
  • a manufacturing target identifying portion 101 In the CPU 11 of the server 1, a manufacturing target identifying portion 101, a step acquiring portion 102, an instruction information determining portion 103, an
  • a semiconductor component DB 401 and a step DB 402 are provided.
  • the step acquiring portion 102 acquires, from information stored in the step DB 402, a combination of one or more steps for each of the types of semiconductor components that are identified by the manufacturing target identifying portion 101.
  • Fig. 7 is a diagram showing a specific example of the types of semiconductor components and steps for the types.
  • Fig. 7A shows the specific example of the steps for each of the semiconductor components which are stored and managed in the semiconductor component DB 401.
  • a type for each of the semiconductor component of a type a
  • semiconductor component ⁇ semiconductor component ⁇
  • semiconductor component ⁇ semiconductor component of a type ⁇
  • semiconductor component ⁇ semiconductor component of a type ⁇
  • semiconductor component ⁇ semiconductor component of a type ⁇
  • semiconductor component ⁇ semiconductor component ⁇
  • steps and the order thereof necessary for the manufacturing are stored and managed in the semiconductor component DB 401.
  • manufacturing target identifying portion 101 indentifies the semiconductor component a and the semiconductor component ⁇ as manufacturing targets, identifies the number of semiconductor components a to be manufactured (number of units of the wafers to be manufactured) as X and identifies the number of
  • the step acquiring portion 102 acquires, as the combination of steps for manufacturing the semiconductor component a, a combination of "step a" —» “step b" -» "step d" —> ⁇ "step e”. As shown in Fig. 7A, the step acquiring portion 102 also acquires, as the combination of steps for
  • step a ⁇ "step b” ⁇ “step c” ⁇ "step e” ⁇ “step v” .
  • the instruction information determining portion 103 determines information (hereinafter referred to as "instruction information") necessary for providing an instruction to manufacture the semiconductor component based on the types and numbers of semiconductor components identified by the manufacturing target identifying portion 101 as the manufacturing targets and the combination of the steps acquired by the step acquiring portion 102.
  • the instruction information includes the types and numbers of semiconductor components to be manufactured in the
  • X semiconductor components a and Y semiconductor components ⁇ are X semiconductor components a and Y semiconductor components ⁇ .
  • Tl + T2 T
  • Fig. 7B shows the specific example of processing times in the individual steps and the necessary numbers of first semiconductor manufacturing devices 2 and second
  • the time in which the first semiconductor manufacturing devices 2 perform the processing in step a is set to "2" minutes.
  • the time in which the first semiconductor manufacturing devices 2 perform the processing in step b is set to "4" minutes.
  • the time in which the first semiconductor manufacturing devices 2 perform the processing in step c is set to "2" minutes.
  • the time in which the first semiconductor manufacturing devices 2 perform the processing in step d is set to "2" minutes.
  • the time in which the first semiconductor manufacturing devices 2 perform the processing in step e is set to "6" minutes.
  • the time in which the first semiconductor manufacturing devices 2 perform the processing in step f is set to "2" minutes.
  • the time in which the second semiconductor manufacturing device 3 performs the processing in step v is set to "3" minutes.
  • the instruction information determining portion 103 performs the allocation of the steps to be
  • the instruction information determining portion 103 allocates the steps to be performed by the first semiconductor manufacturing devices 2-1 to 2-8 such that the processing in step a is performed by "1" device, the processing in step b is performed by “2" devices, the processing in step d is
  • the first semiconductor manufacturing devices 2 are often manufactured so as to perform only a predetermined step, in this example, for convenience of description, the first semiconductor manufacturing devices 2 are assumed to have the function of performing any of steps a to f by switching software. In this case, for example, the instruction information determining portion 103 determines that one device of the first
  • semiconductor manufacturing device 2-2 performs step a, that two devices of the first semiconductor manufacturing devices 2-3 and 2-4 perform step b, that one device of the first semiconductor manufacturing device 2-5 performs step d and that three devices of the first semiconductor manufacturing devices 2-6 to 2-8 perform step e.
  • the instruction information determining portion 103 allocates the steps to be performed by the first semiconductor manufacturing devices 2-1 to 2-8 such that the processing in step a is performed by "1" device, the processing in step b is performed by “2" devices, the processing in step c is
  • step e is
  • the instruction information determining portion 103 determines that one device of the first semiconductor manufacturing device 2-2 performs step a, that two devices of the first semiconductor manufacturing devices 2-3 and 2-4 perform step b, that one device of the first semiconductor manufacturing device 2-5 performs step c and that three devices of the first semiconductor manufacturing devices 2-6 to 2-8 perform step e.
  • the first semiconductor manufacturing device 2-5 performs the processing in step d in the manufacturing of the semiconductor component a and
  • semiconductor manufacturing device 2 can perform only a
  • the instruction information determining portion 103 determines that one device of the second semiconductor manufacturing device 3 performs step v.
  • the instructing portion 104 provides a predetermined instruction to manufacture the semiconductor component to each of the first semiconductor manufacturing devices 2, the second semiconductor manufacturing device 3 and the transport device 4. Specifically, when one unit of the wafer to be manufactured is supplied, the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 perform, based on the instruction from the instructing portion 104, processing in steps to be performed.
  • the transport device 4 each transports, based on the instruction from the instructing portion 104, the wafers to be manufactured one by one to each of the first
  • semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device 3 in an appropriate order and with appropriate timing.
  • the wafer is supplied with the first semiconductor manufacturing device 2-1 to the manufacturing line, and thus the processing in step a is performed with the first semiconductor manufacturing device
  • step b the processing in step b is performed with any one of the first semiconductor manufacturing devices
  • step d is performed with the first semiconductor manufacturing device 2- 5 for 2 minutes and then the processing in step e is performed with any one of three devices of the first semiconductor manufacturing devices 2-6 to 2-8 for six minutes.
  • the semiconductor component a is manufactured.
  • step b processing in step b on two units of the wafers with the first semiconductor manufacturing devices 2-3 and 2-4, the
  • step d on one unit of the wafer with the first semiconductor manufacturing device 2-5 and the processing in step e on three units of the wafers with the first
  • semiconductor manufacturing devices 2-6 to 2-8 are
  • the wafer is . supplied with the first semiconductor manufacturing device 2-1 to the manufacturing line, and thus the processing in step a is performed with the first
  • the processing in step b is performed with any one of the first semiconductor manufacturing devices 2-3 and 2-4 for four minutes
  • the processing in step c is performed with the first semiconductor manufacturing device 2-5 for 2 minutes
  • the processing in step e is performed with any one of three devices of the first semiconductor manufacturing devices 2-6 to 2-8 for six munutes.
  • the processing in step v is performed with the second semiconductor manufacturing device 3 for 3 minutes. In this way, the semiconductor component ⁇ is manufactured.
  • the transport route of one unit of the wafer does not need to be a route in which the wafers are supplied one by one in the order of the first semiconductor manufacturing devices 2-1 to 2-8 but can be an arbitrary route such as a route in which a few first semiconductor manufacturing devices are skipped or a route in which the wafer is moved not in the same direction but in different directions.
  • a separate transport route can be taken independently.
  • the step determining portion 105 determines a combination of q steps. Specifically, for example, when a new type ⁇ of semiconductor component (hereinafter referred to as the "semiconductor component ⁇ ") which is different from the semiconductor components that are already stored and managed in the semiconductor component DB 401 is identified as the manufacturing target, the step determining portion 105 determines a combination of one or more types of steps necessary for manufacturing the semiconductor component ⁇ .
  • the specific method for determining a combination of one or more steps for manufacturing a new type of semiconductor component is not particularly limited. For example, it is also possible to determine a combination of steps with
  • the server 1 provides a manufacturing instruction indicating it, and thus it is possible to utilize the existing manufacturing line as it is.
  • a manufacturing instruction indicating it, and thus it is possible to utilize the existing manufacturing line as it is.
  • the step allocating portion 106 allocates, to each of the first semiconductor manufacturing devices 2 and the second semiconductor manufacturing device 3, one or more steps among the q steps in which processing is to be performed.
  • the allocation is a broad concept which includes not only the allocation of an individual and specific one device of each of the first semiconductor manufacturing devices 2-1 to 2-8 and the second semiconductor manufacturing device, but also the allocation of the necessary number of first semiconductor manufacturing devices 2 to each step as in Fig. 7B.
  • Fig. 5 the hardware configuration shown in Fig. 5 is only illustrative for achieving the object of the present invention, and there is no particular limitation on it.
  • Fig. 6 The functional block diagram shown in Fig. 6 is only illustrative, and there is no particular limitation on it. In other words, as long as a function capable of performing a series of processing described above as a whole is included in an information processing device, functional blocks which are used for achieving such a function are not particularly limited to the example of Fig. 6.
  • functional block may be formed with hardware alone, may be formed with software alone or may be formed with a combination thereof .
  • the computer may be a computer which is incorporated in dedicated hardware.
  • the computer may be a computer, such as a server, a general-purpose smartphone or a general-purpose personal computer, that can perform various types of functions by the installation of various types of programs.
  • the recording medium including such programs is formed with a removable medium which is distributed separately of a device main body to each user in order to provide the programs, a recording medium which is provided to the user in a state where it is previously incorporated in the device main body or the like.
  • steps which describe the programs recorded in the recording medium include not only processing which is chronologically performed according to the order thereof, but also processing which is not necessarily chronologically performed and which is performed in parallel or separately.
  • system means an overall device which is formed by a plurality of devices, a plurality of means or the like.
  • the conveyer of the transport device 4 in an oval shape is driven clockwise, and thus the processing on the wafer is sequentially performed in the order of the first semiconductor manufacturing device 2-2, the first semiconductor manufacturing device 2-3, the first
  • the conveyer of the transport device 4 may transport the wafer
  • the clockwise conveyer and the counterclockwise conveyer may be provided together. Furthermore, a configuration may be adopted in which a plurality of conveyers that are rotated in the same direction are provided, and thus in which the wafer that is transported can pass another wafer that is transported. In the
  • the semiconductor manufacturing system S can more efficiently manufacture a plurality of semiconductor components at the same time.
  • the present invention can also be applied to a case where processing in predetermined one or more steps is performed on a predetermined unit of a substrate containing glass or the like and thus where a predetermined microdevice is manufactured.
  • the "microdevice” in the present invention includes all electronic devices of extremely small sizes such as semiconductor components, various types of sensors, MEMS (Micro Electro Mechanical Systems) , medical electronic devices and DNA computers . [0070]
  • the information processing device or the
  • microdevice manufacturing system for example, the
  • semiconductor manufacturing system S of Fig. 1) to which the present invention is applied has the following configuration and can adopt various types of embodiments. Specifically, as the information processing device to which the present invention is applied, has the following configuration and can adopt various types of embodiments. Specifically, as the information processing device to which the present invention is applied
  • an information processing device for example, the server 1 of Fig. 1 in which under an environment where n microdevice manufacturing devices (for example, the first semiconductor manufacturing device 2 of Fig. 1) perform processing in
  • predetermined one or more steps among a plurality of steps for manufacturing a predetermined type of microdevice (for example, a semiconductor component) having a substrate (for example, the wafer) of a predetermined size as one unit, a plan for manufacturing one or more pieces for each of one or more types of the microdevices is formed, includes:
  • a manufacturing target identifying means (for example, the manufacturing target identifying portion 101 of Fig. 6) which identifies one or more types of the microdevices to be
  • a step acquiring means for example, the step acquiring
  • an instruction information determining means (for example, the instruction information determining portion 103 of Fig. 6) which determines, based on a result of the identification by the manufacturing target identifying means and the combination of the one or more steps acquired by the step acquiring means for each of the one or more types, at least a type and a number of pieces to be manufactured, a manufacturing time, and a manufacturing order for each of the n microdevice
  • the microdevice manufacturing system (for example, the semiconductor manufacturing system S of Fig. 1) to which the present invention is applied, includes:
  • n is an arbitrary integer value more than or equal to one
  • the first semiconductor manufacturing device 2 of Fig. 1 perform processing in predetermined one or more steps among a plurality of steps for manufacturing a
  • predetermined type of microdevice having a substrate (for example, the wafer) of a predetermined size as one unit, a transport portion (for example, the transport device 4 of Fig. 1) which transports, in the n microdevice manufacturing devices, from a first microdevice manufacturing device that completes the performance of processing on a predetermined unit to a second microdevice manufacturing device that can perform processing in the subsequent step, the predetermined unit; and
  • a clean holding portion for example, the clean tunnel 6 of Fig. 1 which shields the transport portion from an outside unclean portion such that the predetermined unit is
  • the processing in each step can be performed in the clean portion without preparation of the same number of small sealed containers whose interior is in a clean environment similar to a clean room as the number of substrates.
  • the microdevice manufacturing system also can include: n
  • first microdevice manufacturing devices for example, the first semiconductor manufacturing devices 2-1 to 2-8 of Fig.
  • n is an arbitrary integer value which is different from n described above and which is more than or equal to one
  • second microdevice manufacturing devices for example, the second semiconductor manufacturing device 3 of Fig. 1 which perform, as processing in predetermined one or more steps among the plurality of steps which are different from the one or more steps of the processing performed by the n microdevice manufacturing devices, collective processing on two or more units .
  • an information processing device includes:
  • n is an arbitrary integer value more than or equal to one
  • predetermined type of microdevice having a substrate (for example, the wafer) of a predetermined size as one unit, a step determining means (for example, the step determining portion 105 of Fig. 6) which determines a combination of q (q is an arbitrary integer value which is different from n described above and which is more than or equal to one) steps for manufacturing a new type of microdevice; and
  • a step allocating means (for example, the step allocating portion 106 of Fig. 6) which allocates, to each of the n microdevice manufacturing devices, one or more steps among the q steps in which processing is to be performed.
  • microdevice manufactured, with consideration given to the efficiency of the operation of the entire microdevice manufacturing system, a plan for a manufacturing process corresponding to the type of microdevice to be manufactured is formed, and processing in various types of steps is performed.
  • manufacturing system can reduce a temporal cost and an actual cost caused when a small number of microdevices such as for a prototype are manufactured.
  • a temporal cost and an actual cost caused for example, when the details of processing, installation places and the like are individually set for each of the microdevice

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Cette invention a pour but de fabriquer efficacement un micro-dispositif avec un faible investissement. Huit premiers dispositifs de fabrication de micro-dispositifs (2-1 à 2-8) effectuent un traitement en une ou plusieurs étapes prédéterminées parmi une pluralité d'étapes de fabrication d'un type prédéterminé de micro-dispositif ayant un substrat d'une taille prédéterminée en tant qu'unité. Un second dispositif de fabrication de micro-dispositifs (3) effectue, en tant que traitement en une ou plusieurs étapes prédéterminées parmi la pluralité d'étapes qui sont différentes des étapes du traitement effectuées par les n dispositifs de fabrication de micro-dispositifs, un traitement collectif sur deux unités ou plus.
PCT/SG2017/050182 2017-03-31 2017-03-31 Système de fabrication de micro-dispositifs Ceased WO2018182505A1 (fr)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145021A (ja) * 1997-11-11 1999-05-28 Sony Corp 生産管理装置及びその方法
US20040107020A1 (en) * 1993-07-15 2004-06-03 Hitachi, Ltd. Fabrication system and fabrication method
US20050095774A1 (en) * 2003-09-08 2005-05-05 Yukihiro Ushiku Semiconductor device manufacturing system and method for manufacturing semiconductor devices
US20080275584A1 (en) * 2007-01-25 2008-11-06 Elpida Memory Inc, Inc. Production management method and production management system
JP2012146862A (ja) * 2011-01-13 2012-08-02 Tokyo Electron Ltd 基板処理装置
US20140358271A1 (en) * 2011-07-15 2014-12-04 Tokyo Electron Limited Processing instructing device, processing instructing method, computer program and processing device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040107020A1 (en) * 1993-07-15 2004-06-03 Hitachi, Ltd. Fabrication system and fabrication method
JPH11145021A (ja) * 1997-11-11 1999-05-28 Sony Corp 生産管理装置及びその方法
US20050095774A1 (en) * 2003-09-08 2005-05-05 Yukihiro Ushiku Semiconductor device manufacturing system and method for manufacturing semiconductor devices
US20080275584A1 (en) * 2007-01-25 2008-11-06 Elpida Memory Inc, Inc. Production management method and production management system
JP2012146862A (ja) * 2011-01-13 2012-08-02 Tokyo Electron Ltd 基板処理装置
US20140358271A1 (en) * 2011-07-15 2014-12-04 Tokyo Electron Limited Processing instructing device, processing instructing method, computer program and processing device

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