WO2018181525A1 - 全芳香族液晶ポリエステル樹脂、成形品、および電気電子部品 - Google Patents
全芳香族液晶ポリエステル樹脂、成形品、および電気電子部品 Download PDFInfo
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- WO2018181525A1 WO2018181525A1 PCT/JP2018/012868 JP2018012868W WO2018181525A1 WO 2018181525 A1 WO2018181525 A1 WO 2018181525A1 JP 2018012868 W JP2018012868 W JP 2018012868W WO 2018181525 A1 WO2018181525 A1 WO 2018181525A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/60—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds
- C08G63/605—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds the hydroxy and carboxylic groups being bound to aromatic rings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/06—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids
- C08G63/065—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids the hydroxy and carboxylic ester groups being bound to aromatic rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
- C08G63/181—Acids containing aromatic rings
- C08G63/183—Terephthalic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
- C08G63/181—Acids containing aromatic rings
- C08G63/185—Acids containing aromatic rings containing two or more aromatic rings
- C08G63/187—Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings
- C08G63/189—Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
- C08G63/19—Hydroxy compounds containing aromatic rings
- C08G63/191—Hydroquinones
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
- C08G63/19—Hydroxy compounds containing aromatic rings
- C08G63/193—Hydroxy compounds containing aromatic rings containing two or more aromatic rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
- B29K2067/04—Polyesters derived from hydroxycarboxylic acids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0006—Dielectric
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08J2367/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
Definitions
- the present invention relates to a wholly aromatic liquid crystal polyester resin, and more particularly, a wholly aromatic liquid crystal polyester resin having a particularly low dielectric loss tangent, a molded article containing the wholly aromatic liquid crystal polyester resin, and an electric / electronic device comprising the molded article Regarding parts.
- GHz gigahertz
- the use of signals having a band frequency is actively performed.
- a high frequency band of GHz band is used in the automobile field.
- millimeter-wave radar and quasi-millimeter-wave radar mounted for the purpose of preventing collisions of automobiles use high frequencies of 76 to 79 GHz and 24 GHz, respectively, and may become more popular in the future. is expected.
- This transmission loss is composed of a conductor loss caused by a conductor and a dielectric loss caused by an insulating resin constituting an electric / electronic component such as a substrate in an electronic device or a communication device.
- the conductor loss is 0 at the frequency used. Since the .5th power and dielectric loss are proportional to the first power of the frequency, the influence of this dielectric loss becomes very large in the high frequency band, particularly in the GHz band.
- the dielectric loss increases in proportion to the dielectric loss tangent of the resin, a resin having a low dielectric loss tangent performance is required in order to prevent deterioration of information.
- Patent Document 1 discloses a structural unit derived from p- or m-hydroxybenzoic acid and a structural unit derived from hydroxynaphthoic acid as a liquid crystalline aromatic polyester exhibiting a low dielectric loss tangent in a high frequency band. Liquid crystalline aromatic polyesters containing more than one species have been proposed.
- the resin constituting the electric / electronic component is required to have high heat resistance (film formation stability) against heating during molding, and a molded product such as a film made using the resin is provided with solder or the like. High heat resistance to the heat processing used has been required.
- the present inventor examined the performance of wholly aromatic polyester resins having various compositions in the course of developing a wholly aromatic polyester resin having an excellent balance between heat resistance and processability while having a particularly low dielectric loss tangent. .
- the polyester resin proposed in Patent Document 2 it was found that the processability to films and fibers was not sufficient.
- the melt stretchability that guarantees the processability and stretch processability during melting of the resin is not sufficient.
- the inventor of the present invention has a particularly low dielectric loss tangent by adjusting a specific structural unit and a specific composition ratio thereof in a wholly aromatic liquid crystal polyester resin.
- the present inventors have found that a wholly aromatic liquid crystal polyester resin having an excellent balance between heat resistance and processability can be obtained.
- the wholly aromatic liquid crystal polyester resin according to the present invention is the structural unit (I) derived from p-hydroxybenzoic acid, A structural unit (II) derived from 6-hydroxy-2-naphthoic acid, Structural unit (III) derived from aromatic diol compound, and structural unit (IV) derived from aromatic dicarboxylic acid
- the composition ratio (mol%) of the structural units (I) to (IV) is as follows: 2 mol% ⁇ constituent unit (I) ⁇ 9 mol% 40 mol% ⁇ constituent unit (II) ⁇ 75 mol% 9 mol% ⁇ constituent unit (III) ⁇ 24 mol% 9 mol% ⁇ constituent unit (IV) ⁇ 24 mol% It is characterized by satisfying.
- the composition ratio (mol%) of the structural units (I) to (IV) is as follows: 2 mol% ⁇ constituent unit (I) ⁇ 9 mol% 48 mol% ⁇ constituent unit (II) ⁇ 70 mol% 10 mol% ⁇ constituent unit (III) ⁇ 23 mol% 10 mol% ⁇ constituent unit (IV) ⁇ 23 mol% It is preferable to satisfy.
- the structural unit (III) is preferably represented by the following formula.
- Ar 1 is optionally selected from the group consisting of a phenyl group having a substituent, a biphenyl group, a naphthyl group, an anthryl group, and a phenanthryl group.
- the structural unit (IV) is preferably represented by the following formula.
- Ar 2 is optionally selected from the group consisting of a phenyl group having a substituent, a biphenyl group, a naphthyl group, an anthryl group and a phenanthryl group.
- the draw ratio of the melt strand extruded under the conditions of the melting point of the liquid crystal polyester resin + 20 ° C. and the shear rate of 1000 s ⁇ 1 is 10 times or more.
- the dielectric loss tangent of the wholly aromatic liquid crystal polyester resin at a measurement frequency of 10 GHz is preferably 0.85 ⁇ 10 ⁇ 3 or less.
- the dielectric loss tangent of the wholly aromatic liquid crystal polyester resin at a measurement frequency of 82 GHz is less than 3.5 ⁇ 10 ⁇ 3 .
- the dielectric loss tangent of 30 ° C. and 100 ° C. at a measurement frequency of 34 GHz of the wholly aromatic liquid crystal polyester resin is less than 2.0 ⁇ 10 ⁇ 3 and less than 4.0 ⁇ 10 ⁇ 3 , respectively. It is preferable.
- the change rate of the dielectric loss tangent from 30 ° C. to 100 ° C. at the measurement frequency measurement frequency of 34 GHz of the wholly aromatic liquid crystal polyester resin is preferably less than 3.0 ⁇ 10 ⁇ 5 / ° C.
- the melting point of the wholly aromatic liquid crystal polyester resin is preferably 290 ° C. or higher.
- the melt viscosity of the liquid crystalline polyester resin at a melting point of + 20 ° C. and a shear rate of 1000 s ⁇ 1 is preferably 20 to 150 Pa ⁇ s.
- the molded product according to the present invention is characterized by comprising the above wholly aromatic liquid crystal polyester resin.
- the molded product is preferably a film.
- the molded product is preferably fibrous.
- the molded product is preferably an injection molded product.
- An electrical / electronic component according to the present invention includes the above-described molded product.
- the unit constituting the wholly aromatic liquid crystal polyester resin is a specific structural unit and a specific composition ratio thereof, so that a balance between heat resistance and workability is achieved while having a particularly low dielectric loss tangent. Can be realized. That is, by using the wholly aromatic liquid crystal polyester resin of the present invention, the film-forming property and spinning stability can be improved, and the heat resistance of the produced molded product against heat processing can be improved. Therefore, when processing and molding and using as a product, it is possible to prevent deterioration of the quality of the output signal in electric and electronic devices and communication devices that use high frequency signals.
- the wholly aromatic polyester resin of the present invention has high spinnability and film-forming stability, and is also suitable for injection molding. Molded products produced using this are heat-processed using solder or the like. On the other hand, it has high stability.
- the wholly aromatic liquid crystalline polyester resin according to the present invention has a constitutional unit (I) derived from p-hydroxybenzoic acid, a constitutional unit (II) derived from 6-hydroxy-2-naphthoic acid, and a constitution derived from an aromatic diol compound.
- the composition ratio (mol%) of the structural units (I) to (IV) in the wholly aromatic liquid crystal polyester resin comprises the structural unit (IV) derived from the unit (III) and the aromatic dicarboxylic acid.
- the composition ratio of the structural unit (III) is substantially equivalent to the composition ratio of the structural unit (IV) (structural unit (III) ⁇ constituent unit (IV)).
- the total of the structural units (I) to (IV)) is preferably 90 mol% or more, more preferably 95 mol% with respect to the entire structural units of the wholly aromatic liquid crystal polyester resin. More preferably, it is 99 mol% or more, and the upper limit is preferably 100 mol% or less.
- the wholly aromatic liquid crystal polyester resin having the above-described configuration it is possible to impart stable processability to fibers and films by having sufficient melt stretchability.
- a wholly aromatic liquid crystal polyester resin having a particularly low dielectric loss tangent can be realized.
- it can also be set as a fully aromatic liquid crystalline polyester resin of high melting
- the melt stretchability of the liquid crystal polyester resin according to the present invention can be evaluated by measuring the stretch ratio of the melt strand.
- the melt stretchability of the liquid crystalline polyester resin according to the present invention is such that the molten strand extruded under the conditions of the melting point of the liquid crystalline polyester resin + 20 ° C. and the shear rate of 1000 s ⁇ 1 is passed through a pulley.
- the draw ratio of the molten strand when the take-up roller accelerates the take-up speed is preferably 10.
- the melt stretchability of the wholly aromatic liquid crystal polyester resin can be measured using a Toyo Seiki Seisakusho Capillograph 1D.
- the dielectric loss tangent (measurement frequency: 10 GHz) of the wholly aromatic liquid crystal polyester resin according to the present invention is preferably 0.85 ⁇ 10 ⁇ 3 or less, more preferably 0.80 ⁇ 10 ⁇ 3 or less, and still more preferably. It is 0.75 ⁇ 10 ⁇ 3 or less.
- the dielectric loss tangent (measurement frequency: 82 GHz) of the wholly aromatic liquid crystal polyester resin according to the present invention is preferably less than 3.5 ⁇ 10 ⁇ 3 , more preferably less than 3.0 ⁇ 10 ⁇ 3 , Preferably it is less than 2.5 ⁇ 10 ⁇ 3 .
- the wholly aromatic liquid crystal polyester resin according to the present invention has a dielectric loss tangent (measurement frequency: 34 GHz) at 30 ° C. and 100 ° C., preferably less than 2.0 ⁇ 10 ⁇ 3 and less than 4.0 ⁇ 10 ⁇ 3 , respectively. More preferably, it is less than 1.5 ⁇ 10 ⁇ 3 and less than 3.0 ⁇ 10 ⁇ 3 , and further preferably less than 1.0 ⁇ 10 ⁇ 3 and less than 2.0 ⁇ 10 ⁇ 3 . Furthermore, the rate of change of dielectric loss tangent from 30 ° C. to 100 ° C.
- the dielectric loss tangent of the wholly aromatic liquid crystal polyester resin at 10 GHz can be measured by a split post dielectric resonator method (SPDR method) using a network analyzer N5247A manufactured by Keysight Technology. it can. Other dielectric loss tangent measurements can be made by the cylindrical cavity resonator method. Further, unless otherwise specified, the value of dielectric loss tangent is a value measured at 23 ° C. in an air atmosphere at a humidity of 60%.
- the melting point of the wholly aromatic liquid crystal polyester resin according to the present invention is preferably 290 ° C. or higher, more preferably 295 ° C. or higher, more preferably 300 ° C. or higher, and even more preferably 310 ° C. as the lower limit.
- the upper limit is preferably 350 ° C. or lower, more preferably 345 ° C. or lower, and further preferably 340 ° C. or lower.
- the melting point of the wholly aromatic liquid crystal polyester resin conforms to the test method of ISO11357 and ASTM D3418, and uses a differential scanning calorimeter (DSC) manufactured by Hitachi High-Tech Science Co., Ltd. Can be measured.
- DSC differential scanning calorimeter
- the melt viscosity of the liquid crystal polyester resin according to the present invention is preferably 20 Pa ⁇ s or more, more preferably 30Pa It is s or more, and the upper limit is preferably 150 Pa ⁇ s or less, more preferably 125 Pa ⁇ s or less, and further preferably 100 Pa ⁇ s or less.
- the melt viscosity of the wholly aromatic liquid crystal polyester resin can be measured using a Toyo Seiki Seisakusho Capillograph 1D in accordance with JIS K7199.
- the liquid crystallinity of the wholly aromatic liquid crystal polyester resin according to the present invention is obtained by using a polarizing microscope (trade name: BH-2) manufactured by Olympus Co., Ltd. equipped with a hot stage for microscope (trade name: FP82HT) manufactured by METTLER. After the wholly aromatic liquid crystal polyester resin is heated and melted on a microscope heating stage, it can be confirmed by observing the presence or absence of optical anisotropy.
- a polarizing microscope (trade name: BH-2) manufactured by Olympus Co., Ltd. equipped with a hot stage for microscope (trade name: FP82HT) manufactured by METTLER.
- the wholly aromatic liquid crystal polyester resin contains the structural unit (I) derived from p-hydroxybenzoic acid represented by the following formula (I), and the composition ratio of the structural unit (I) in the wholly aromatic liquid crystal polyester resin ( Mol%) is 2 mol% or more and 9 mol% or less.
- the composition ratio (mol%) of the structural unit (I) is preferably 8 mol% as the upper limit. It is below, More preferably, it is 7 mol% or less, More preferably, it is 6 mol% or less.
- Examples of the monomer that provides the structural unit (I) include p-hydroxybenzoic acid (HBA, the following formula (1)), and acetylated products, ester derivatives, and acid halides thereof.
- HBA p-hydroxybenzoic acid
- the wholly aromatic liquid crystalline polyester resin includes a structural unit (II) derived from 6-hydroxy-2-naphthoic acid represented by the following formula (II), and the structural unit (II) in the wholly aromatic liquid crystalline polyester resin
- the composition ratio (mol%) is 40 mol% or more and 75 mol% or less. From the viewpoint of lowering the dielectric loss tangent of the wholly aromatic liquid crystal polyester resin, improving the melting point, and improving the workability, the composition ratio (mol%) of the structural unit (II) is preferably 48 mol% as the lower limit.
- it is 50 mol% or more, more preferably 55 mol% or more, still more preferably 57 mol% or more, and the upper limit is preferably 72 mol% or less, more Preferably it is 70 mol% or less, More preferably, it is 65 mol% or less.
- Examples of the monomer that provides the structural unit (II) include 6-hydroxy-2-naphthoic acid (HNA, the following formula (2)), and acetylated products, ester derivatives, and acid halides thereof.
- HNA 6-hydroxy-2-naphthoic acid
- the wholly aromatic liquid crystal polyester resin comprises the structural unit (III) derived from the aromatic diol compound, and the composition ratio (mol%) of the structural unit (III) in the liquid crystal polyester is 9 mol% or more. 24 mol% or less.
- the composition ratio (mol%) of the structural unit (III) is preferably 10 mol% as the lower limit. More preferably, it is 12 mol% or more, more preferably 14 mol% or more, and the upper limit is preferably 23 mol% or less, more preferably 22 mol% or less.
- the structural unit (III) is represented by the following formula (IV).
- Ar 1 is optionally selected from the group consisting of a phenyl group having a substituent, a biphenyl group, a naphthyl group, an anthryl group, and a phenanthryl group. Among these, a phenyl group and a biphenyl group are more preferable.
- the substituent include hydrogen, an alkyl group, an alkoxy group, and fluorine.
- the alkyl group has preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms. Further, it may be a linear alkyl group or a branched alkyl group.
- the number of carbon atoms of the alkoxy group is preferably 1 to 10, and more preferably 1 to 5.
- Examples of the monomer that gives the structural unit (III) include 4,4-dihydroxybiphenyl (BP, the following formula (3)), hydroquinone (HQ, the following formula (4)), and methylhydroquinone (MeHQ, the following formula (5). ) And acylated products thereof.
- the wholly aromatic liquid crystal polyester resin contains the structural unit (IV) derived from the aromatic dicarboxylic acid, and the composition ratio (mol%) of the structural unit (IV) in the liquid crystal polyester is 9 mol% or more. 24 mol% or less.
- the composition ratio (mol%) of the structural unit (IV) is preferably 10 mol% as the lower limit. More preferably, it is 12 mol% or more, more preferably 14 mol% or more, and the upper limit is preferably 23 mol% or less, more preferably 22 mol% or less.
- the structural unit (IV) is represented by the following formula (IV).
- Ar 2 is selected from the group consisting of a phenyl group having a substituent, a biphenyl group, a naphthyl group, an anthryl group, and a phenanthryl group, if desired. Among these, a phenyl group is more preferable.
- the substituent include hydrogen, an alkyl group, an alkoxy group and fluorine.
- the alkyl group has preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms. Further, it may be a linear alkyl group or a branched alkyl group.
- the number of carbon atoms of the alkoxy group is preferably 1 to 10, and more preferably 1 to 5.
- Monomers that give the structural unit (IV) include terephthalic acid (TPA, the following formula (6)), isophthalic acid (IPA, the following formula (7)), 2,6-naphthalenedicarboxylic acid (NADA, the following formula (8) ), And ester derivatives and acid halides thereof.
- the monomer giving the structural unit (IV) is preferably a single monomer, but when two or more monomers are mixed, the proportion of the main monomer is preferably 65% or more, more preferably 70%. % Or more, and more preferably 80% or more.
- the wholly aromatic liquid crystal polyester resin according to the present invention is produced by polymerizing the monomers giving the structural units (I) to (IV) by a conventionally known method such as melt polymerization, solid phase polymerization, solution polymerization, and slurry polymerization. can do.
- the wholly aromatic liquid crystal polyester resin according to the present invention can be produced only by melt polymerization. It can also be produced by two-stage polymerization in which a prepolymer is prepared by melt polymerization and further solid-phase polymerized.
- the monomers giving the structural units (I) to (IV) are combined in a predetermined blending amount to 100 mol%, and all the hydroxyl groups of the monomer are added.
- the reaction is preferably carried out under reflux of acetic acid in the presence of 1.05 to 1.15 molar equivalents of acetic anhydride.
- the prepolymer obtained by melt polymerization is cooled and solidified and then pulverized into powder or flakes, and then a known solid phase polymerization method is used.
- a method of heat-treating the prepolymer resin for 1 to 30 hours in a temperature range of 200 to 350 ° C. under an inert atmosphere such as nitrogen or under vacuum is preferably selected.
- the solid phase polymerization may be performed with stirring, or may be performed in a standing state without stirring.
- a catalyst may be used or may not be used.
- a conventionally known catalyst for polymerization of polyester can be used, and metals such as magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate, and antimony trioxide are used. Examples thereof include salt catalysts, nitrogen-containing heterocyclic compounds such as N-methylimidazole, and organic compound catalysts.
- the amount of the catalyst used is not particularly limited, but is preferably 0.0001 to 0.1 parts by weight with respect to 100 parts by weight of the total amount of monomers.
- the polymerization reaction apparatus in melt polymerization is not particularly limited, but a reaction apparatus used for reaction of a general high viscosity fluid is preferably used.
- reaction apparatuses include, for example, a stirring tank type polymerization reaction apparatus having a stirring apparatus having stirring blades of various shapes, such as a vertical type, a multistage type, a spiral band type, a helical shaft type, etc.
- a kneader, a roll mill, a Banbury mixer and the like which are generally used for resin kneading.
- the molded product according to the present invention comprises a wholly aromatic liquid crystal polyester resin, and the shape thereof is appropriately changed according to the application, and is not particularly limited.
- the molded article according to the present invention may contain a resin other than the wholly aromatic liquid crystal polyester resin as long as the effects of the present invention are not impaired.
- a resin other than the wholly aromatic liquid crystal polyester resin for example, polyester resins such as polyethylene terephthalate, polyethylene naphthalate, polyarylate and polybutylene terephthalate, polyolefin resins such as polyethylene and polypropylene, cycloolefin polymers, vinyl resins such as polyvinyl chloride, polyacrylates, polymethacrylates and polymethylmethacrylates.
- Heat of methacrylic resin such as acrylate, polyphenylene ether resin, polyacetal resin, polyamide resin, imide resin such as polyimide and polyetherimide, polystyrene resin such as polystyrene, high impact polystyrene, AS resin and ABS resin, and epoxy resin
- methacrylic resin such as acrylate, polyphenylene ether resin, polyacetal resin, polyamide resin, imide resin such as polyimide and polyetherimide
- polystyrene resin such as polystyrene, high impact polystyrene, AS resin and ABS resin
- epoxy resins include cured resins, cellulose resins, polyetheretherketone resins, fluororesins and polycarbonate resins. These may be contained alone or in combination.
- the molded article according to the present invention has other additives such as a colorant, a dispersant, a plasticizer, an antioxidant, a curing agent, a flame retardant, a heat stabilizer, and an ultraviolet absorber as long as the effects of the present invention are not impaired.
- a colorant such as a colorant, a dispersant, a plasticizer, an antioxidant, a curing agent, a flame retardant, a heat stabilizer, and an ultraviolet absorber
- An antistatic agent and a surfactant may be included.
- the molded product according to the present invention can be obtained by press molding, foam molding, injection molding, extrusion molding, or stamping molding of a mixture containing a wholly aromatic liquid crystalline polyester resin and, if desired, other resins and additives.
- the mixture can be obtained by melt-kneading a wholly aromatic liquid crystal polyester resin or the like using a Banbury mixer, a kneader, a uniaxial or biaxial extruder, or the like.
- the molded product is preferably a film.
- the film can be obtained by a conventionally known method, for example, extrusion molding such as inflation molding or melt extrusion molding, and a solution casting method.
- the film thus obtained may be a single layer film made of wholly aromatic liquid crystal polyester resin or a multilayer film with different materials.
- a film formed by melt extrusion molding or solution casting may be stretched uniaxially or biaxially.
- you may heat-process in order to remove the anisotropy of these films, or to improve heat resistance.
- the molded product is preferably fibrous.
- the fiber can be obtained by a conventionally known method such as a melt spinning method or a solution spinning method.
- the fibers may be made of a wholly aromatic liquid crystal polyester resin alone or may be mixed with other resins.
- the electrical / electronic component includes, as an electrical / electronic component comprising the molded product, for example, an antenna used for electronic devices and communication devices such as ETC, GPS, wireless LAN, and cellular phone, a connector for high-speed transmission, CPU socket, circuit board, flexible printed circuit board (FPC), laminated circuit board, millimeter wave and quasi-millimeter wave radar such as anti-collision radar, RFID tag, capacitor, inverter parts, insulation film, cable coating material, lithium ion Examples thereof include insulating materials for secondary batteries such as batteries, speaker diaphragms, and the like.
- the electrical / electronic component comprises a molded product (for example, an injection molded product or a film) containing a wholly aromatic liquid crystal polyester resin.
- Example 1 In a polymerization vessel having a stirring blade, 5 mol% of p-hydroxybenzoic acid (HBA), 48 mol% of 6-hydroxy-2-naphthoic acid (HNA), 23.5 mol% of 4,4-dihydroxybiphenyl (BP), terephthalate 23.5 mol% of acid (TPA) was added, potassium acetate and magnesium acetate were added as catalysts, and the polymerization vessel was depressurized and injected with nitrogen three times to perform nitrogen substitution, and then acetic anhydride (1. (08 molar equivalent) was further added, the temperature was raised to 150 ° C., and an acetylation reaction was carried out in a reflux state for 2 hours.
- HBA p-hydroxybenzoic acid
- HNA 6-hydroxy-2-naphthoic acid
- BP 4,4-dihydroxybiphenyl
- TPA terephthalate 23.5 mol% of acid
- the polymerization vessel in acetic acid distillation was heated at 0.5 ° C./min, and when the melt temperature in the tank reached 300 ° C., the polymer was taken out and cooled and solidified.
- the obtained polymer was pulverized and pulverized to a size passing through a sieve having an aperture of 2.0 mm to obtain a prepolymer.
- the temperature of the prepolymer obtained above was increased from room temperature to 300 ° C. over 14 hours with a heater in an oven manufactured by Yamato Scientific Co., Ltd., and then the temperature was maintained at 300 ° C. for 2 hours. Solid phase polymerization was performed. Thereafter, the mixture was naturally radiated at room temperature to obtain a wholly aromatic liquid crystal polyester resin.
- an Olympus polarizing microscope (trade name: BH-2) equipped with a METTLER microscope hot stage (trade name: FP82HT)
- a wholly aromatic liquid crystal polyester resin sample is heated on the microscope heating stage. After melting, the liquid crystallinity was confirmed from the presence or absence of optical anisotropy.
- Example 2 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to 3 mol% HBA, 54 mol% HNA, 21.5 mol% BP, and 21.5 mol% TPA. It was confirmed.
- Example 3 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to 6 mol% HBA, 54 mol% HNA, 20 mol% BP, and 20 mol% TPA, and liquid crystal properties were confirmed in the same manner as described above.
- Example 4 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to 3 mol% HBA, 55 mol% HNA, 21 mol% BP, and 21 mol% TPA, and liquid crystal properties were confirmed in the same manner as described above.
- Example 5 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to 5 mol% HBA, 55 mol% HNA, 20 mol% BP, and 20 mol% TPA, and liquid crystallinity was confirmed in the same manner as described above.
- Example 6 A liquid crystal polyester resin D was obtained in the same manner as in Example 1 except that the monomer charge was changed to 8 mol% HBA, 55 mol% HNA, 18.5 mol% BP, and 18.5 mol% TPA. The sex was confirmed.
- Example 7 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to 5 mol% HBA, 57 mol% HNA, 19 mol% BP, and 19 mol% TPA, and liquid crystallinity was confirmed in the same manner as described above.
- Example 8 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to 2 mol% HBA, 60 mol% HNA, 19 mol% BP, and 19 mol% TPA, and the liquid crystallinity was confirmed in the same manner as described above.
- Example 9 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to 3 mol% HBA, 60 mol% HNA, 18.5 mol% BP, and 18.5 mol% TPA. It was confirmed.
- Example 10 A liquid crystal polyester resin was prepared in the same manner as in Example 1 except that the monomer charge was changed to 5 mol% HBA, 60 mol% HNA, 17.5 mol% BP, and 17.5 mol% TPA, and the holding time at 300 ° C. was changed to 1 hour. The liquid crystallinity was confirmed in the same manner as described above.
- Example 11 The monomer charge was changed to 8 mol% HBA, 60 mol% HNA, 16 mol% BP, 16 mol% TPA, the final temperature of solid phase polymerization was 295 ° C., and the holding time was 1 hour. A liquid crystal polyester resin was obtained, and liquid crystallinity was confirmed in the same manner as described above.
- Example 12 A liquid crystal polyester resin was prepared in the same manner as in Example 1 except that the monomer charge was changed to 2 mol% of HBA, 65 mol% of HNA, 16.5 mol% of BP, and 16.5 mol% of TPA, and the holding time at 300 ° C. was changed to 1 hour. The liquid crystallinity was confirmed in the same manner as described above.
- Example 13 The monomer charge was changed to 2 mol% HBA, 65 mol% HNA, 14.5 mol% BP, 2 mol% methylhydroquinone (MeHQ), 16.5 mol% TPA, the final temperature of solid phase polymerization was 295 ° C, and the retention time was 1 Except for the time, a liquid crystal polyester resin was obtained in the same manner as in Example 1, and the liquid crystallinity was confirmed in the same manner as described above.
- Example 14 The monomer charge was changed to HBA 5 mol%, HNA 65 mol%, BP 15 mol%, TPA 15 mol%, and the holding time at 300 ° C. was changed to 1 hour to obtain a liquid crystal polyester resin, Liquid crystallinity was confirmed in the same manner as above.
- Example 15 The monomer charge was changed to 5 mol% HBA, 65 mol% HNA, 15 mol% BP, 13 mol% TPA, 2 mol% 2,6-naphthalenedicarboxylic acid (NADA), the final temperature of solid phase polymerization was 295 ° C, and the retention time was A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the time was 1 hour, and the liquid crystallinity was confirmed in the same manner as described above.
- Example 16 Example 1 except that the monomer charge was changed to 5 mol% HBA, 65 mol% HNA, 15 mol% BP, 14 mol% TPA, 1 mol% NADA, the final temperature of solid phase polymerization was 295 ° C., and the holding time was 1 hour. Similarly, a liquid crystal polyester resin was obtained, and liquid crystallinity was confirmed in the same manner as described above.
- Example 17 Example 1 except that the monomer charge was changed to 5 mol% HBA, 65 mol% HNA, 15 mol% BP, 10 mol% TPA, 5 mol% NADA, the final temperature of solid phase polymerization was 295 ° C, and the retention time was 1 hour. Similarly, a liquid crystal polyester resin was obtained, and liquid crystallinity was confirmed in the same manner as described above.
- Example 18 Example 1 Similarly, a liquid crystal polyester resin was obtained, and liquid crystallinity was confirmed in the same manner as described above.
- Example 19 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to 3 mol% HBA, 68 mol% HNA, 14.5 mol% BP, and 14.5 mol% TPA. It was confirmed.
- Example 20 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to 6 mol% HBA, 68 mol% HNA, 13 mol% BP, and 13 mol% TPA, and liquid crystallinity was confirmed in the same manner as described above.
- Example 21 A liquid crystal polyester resin was prepared in the same manner as in Example 1 except that the monomer charge was changed to 5 mol% HBA, 70 mol% HNA, 12.5 mol% BP, and 12.5 mol% TPA, and the holding time at 300 ° C. was changed to 1 hour. The liquid crystallinity was confirmed in the same manner as described above.
- Example 22 Example 1 except that the monomer charge was changed to 9 mol% HBA, 72 mol% HNA, 9.5 mol% BP, and 9.5 mol% TPA, the final temperature of solid-state polymerization was 280 ° C., and the holding time was 1 hour. Similarly, a liquid crystal polyester resin was obtained, and liquid crystallinity was confirmed in the same manner as described above.
- Example 2 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to 2 mol% HBA, 48 mol% HNA, 25 mol% BP, and 25 mol% TPA, and the final temperature of solid phase polymerization was 310 ° C. Then, liquid crystallinity was confirmed in the same manner as described above.
- Example 3 A liquid crystal was prepared in the same manner as in Example 1 except that the monomer charge was changed to 1 mol% of HBA, 54 mol% of HNA, 22.5 mol% of BP, and 22.5 mol% of TPA, and the final temperature of solid phase polymerization was 310 ° C. A polyester resin was obtained, and liquid crystallinity was confirmed in the same manner as described above.
- Example 4 Example 1 except that the monomer charge was changed to 1 mol% of HBA, 60 mol% of HNA, 19.5 mol% of BP, and 19.5 mol% of TPA, the final temperature of solid phase polymerization was 305 ° C., and the holding time was 1 hour. In the same manner as above, a liquid crystal polyester resin was obtained, and liquid crystallinity was confirmed in the same manner as described above.
- Example 5 (Comparative Example 5) Example 1 except that the monomer charge was changed to 10 mol% HBA, 65 mol% HNA, 12.5 mol% BP, and 12.5 mol% TPA, the final temperature of solid phase polymerization was 290 ° C., and the retention time was 1 hour. In the same manner as above, a liquid crystal polyester resin was obtained, and liquid crystallinity was confirmed in the same manner as described above.
- Example 7 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to 8 mol% HBA, 75 mol% HNA, 8.5 mol% BP, and 8.5 mol% TPA. It was confirmed.
- Example 8 A liquid crystal polyester resin was obtained in the same manner as in Example 1 except that the monomer charge was changed to HNA 60 mol%, BP 20 mol%, TPA 15 mol%, and isophthalic acid (IPA) 5 mol%. The sex was confirmed.
- Example 9 A liquid crystal polyester was obtained in the same manner as in Example 1 except that the monomer charge was changed to 73 mol% HBA and 27 mol% HNA, and the final temperature of the solid phase polymerization was changed to 270 ° C. It was confirmed.
- the take-up speed is 40 m / min as the initial speed, the take-up speed is increased at a rate of 400 m / min 2 , and the end point of measurement is the point at which the take-up speed reaches the apparatus measurement limit value of 200 m / min or the strand breaks. .
- the measurement results are summarized in Table 1.
- melt stretchability due to lack of melt stretchability, melt viscosity, or melt tension, the melt strand could not be properly set on a series of pulleys and take-up rollers, or the melt stretchability was below the measurement lower limit of the apparatus and measurement was impossible. The thing was made into "-".
- ⁇ Dielectric loss tangent measurement (82 GHz, etc.)> The wholly aromatic liquid crystalline polyester resins obtained in Example 8 and Comparative Examples 8 and 9 were heated and melted under the conditions of melting point to melting point + 30 ° C., and injection molded to produce a plate sample of 30 mm ⁇ 30 mm ⁇ 0.4 mm. Subsequently, a 13 mm square square flat plate was cut from the center of the flat plate sample to obtain a test piece. This test piece was loaded on a 100 GHz resonator at the Kogami-Shimizu laboratory at Utsunomiya University graduate School of Engineering, and the dielectric loss tangent at a frequency of 82 GHz was measured at room temperature by the cylindrical cavity resonator method.
- FIG. 1 shows dielectric loss tangents measured at various frequencies in the same procedure using cylindrical cavity resonators having different set frequencies.
- ⁇ Dielectric loss tangent measurement (temperature dependence in GHz range)>
- the wholly aromatic liquid crystalline polyester resins obtained in Example 8 and Comparative Examples 8 and 9 were heated and melted under the conditions of melting point to melting point + 30 ° C., and injection molded to produce a plate sample of 30 mm ⁇ 30 mm ⁇ 0.4 mm. Subsequently, a 13 mm square square flat plate was cut from the center of the flat plate sample to obtain a test piece. This test piece was measured at 34 GHz dielectric loss tangent while changing the measurement temperature by the cylindrical cavity resonator method using the resonator for 36 GHz in the Kogami-Shimizu Laboratory, graduate School of Engineering, Utsunomiya University.
- a specific measurement method is as follows. The resonator on which the test piece was set was placed in a thermostat, and the set temperature of the thermostat was set to 105 ° C., and then 2 hours passed. Then, the thermostat was set to 20 ° C., the temperature in the bath was naturally lowered, and the dielectric loss tangent at this time was measured at 1 ° C. intervals. The results are shown in FIG. Table 3 shows the rate of change of the dielectric loss tangent at 30 ° C. and 100 ° C. and the dielectric loss tangent from 30 ° C. to 100 ° C.
- melt viscosity (Pa ⁇ s) at the melting point + 20 ° C. of the wholly aromatic liquid crystal polyester resin obtained in Examples and Comparative Examples at a shear rate of 1000 s ⁇ 1 was measured with a capillary rheometer viscometer (Toyo Seiki Seisakusho Capillograph Co., Ltd.). 1D) and a capillary with an inner diameter of 1 mm, and measurement was performed according to JIS K7199. The measurement results are summarized in Table 1.
- Tm 1 * The value of Tm 1 is shown.
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Abstract
Description
p-ヒドロキシ安息香酸に由来する構成単位(I)、
6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(II)、
芳香族ジオール化合物に由来する構成単位(III)、および
芳香族ジカルボン酸に由来する構成単位(IV)
を含んでなり、
前記構成単位(I)~(IV)の組成比(モル%)が、下記の条件:
2モル%≦構成単位(I)≦9モル%
40モル%≦構成単位(II)≦75モル%
9モル%≦構成単位(III)≦24モル%
9モル%≦構成単位(IV)≦24モル%
を満たすことを特徴とする。
2モル%≦構成単位(I)≦9モル%
48モル%≦構成単位(II)≦70モル%
10モル%≦構成単位(III)≦23モル%
10モル%≦構成単位(IV)≦23モル%
を満たすことが好ましい。
本発明による全芳香族液晶ポリエステル樹脂は、p-ヒドロキシ安息香酸に由来する構成単位(I)、6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(II)、芳香族ジオール化合物に由来する構成単位(III)および芳香族ジカルボン酸に由来する構成単位(IV)を含んでなり、全芳香族液晶ポリエステル樹脂中における構成単位(I)~(IV)の組成比(モル%)は、下記の条件:
2モル%≦構成単位(I)≦9モル%
40モル%≦構成単位(II)≦75モル%
9モル%≦構成単位(III)≦24モル%
9モル%≦構成単位(IV)≦24モル%
を満たすものであり、さらに、下記の条件:
2モル%≦構成単位(I)≦9モル%
48モル%≦構成単位(II)≦70モル%
10モル%≦構成単位(III)≦23モル%
10モル%≦構成単位(IV)≦23モル%
を満たすことが好ましい。
また、繊維やフィルムへの加工性という観点からは、測定終点における溶融ストランドの張力(=溶融張力)は、好ましくは1mN以上であり、より好ましくは3mN以上であり、さらに好ましくは5mN以上である。
また、本発明による全芳香族液晶ポリエステル樹脂の誘電正接(測定周波数:82GHz)は、好ましくは3.5×10-3未満であり、より好ましくは3.0×10-3未満であり、さらに好ましくは2.5×10-3未満である。
また、本発明による全芳香族液晶ポリエステル樹脂は、30℃および100℃の誘電正接(測定周波数:34GHz)が、それぞれ、好ましくは2.0×10-3未満および4.0×10-3未満であり、より好ましくは1.5×10-3未満および3.0×10-3未満であり、さらに好ましくは1.0×10-3未満および2.0×10-3未満である。
さらに、測定周波数34GHzにおける30℃から100℃までの誘電正接の変化率は、好ましくは3.0×10-5/℃未満であり、より好ましくは2.2×10-5/℃未満であり、さらに好ましくは1.5×10-5/℃未満である。
なお、本明細書において、全芳香族液晶ポリエステル樹脂の10GHzにおける誘電正接は、キーサイト・テクノロジー社のネットワークアナライザーN5247A等を用いて、スプリットポスト誘電体共振器法(SPDR法)により測定することができる。それ以外の誘電正接測定は円筒空洞共振器法により測定することができる。また、特別に指定がない場合、誘電正接の値は、23℃、大気雰囲気下、湿度60%での測定値である。
全芳香族液晶ポリエステル樹脂は、下記式(I)で表されるp-ヒドロキシ安息香酸に由来する構成単位(I)を含み、全芳香族液晶ポリエステル樹脂中における構成単位(I)の組成比(モル%)は、2モル%以上9モル%以下である。全芳香族液晶ポリエステル樹脂の誘電正接の低下、融点の向上、および加工性の向上という観点からは、構成単位(I)の組成比(モル%)は、上限値としては、好ましくは8モル%以下であり、より好ましくは7モル%以下であり、さらに好ましくは6モル%以下である。
全芳香族液晶ポリエステル樹脂は、下記式(II)で表される6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(II)を含み、全芳香族液晶ポリエステル樹脂中における構成単位(II)の組成比(モル%)は、40モル%以上75モル%以下である。全芳香族液晶ポリエステル樹脂の誘電正接の低下、融点の向上、および加工性の向上という観点からは、構成単位(II)の組成比(モル%)は、下限値としては、好ましくは48モル%以上であり、より好ましくは50モル%以上であり、さらに好ましくは55モル%以上であり、さらにより好ましくは57モル%以上であり、上限値としては、好ましくは72モル%以下であり、より好ましくは70モル%以下であり、さらに好ましくは65モル%以下である。
全芳香族液晶ポリエステル樹脂は、芳香族ジオール化合物に由来する構成単位(III)を含んでなるものであり、液晶ポリエステル中における構成単位(III)の組成比(モル%)は、9モル%以上24モル%以下である。全芳香族液晶ポリエステル樹脂の誘電正接の低下、融点の向上、および加工性の向上という観点からは、構成単位(III)の組成比(モル%)は、下限値としては、好ましくは10モル%以上であり、より好ましくは12モル%以上であり、さらに好ましくは14モル%以上であり、上限値としては、好ましくは23モル%以下であり、より好ましくは22モル%以下である。
全芳香族液晶ポリエステル樹脂は、芳香族ジカルボン酸に由来する構成単位(IV)を含んでなるものであり、液晶ポリエステル中における構成単位(IV)の組成比(モル%)は、9モル%以上24モル%以下である。全芳香族液晶ポリエステル樹脂の誘電正接の低下、融点の向上、および加工性の向上という観点からは、構成単位(IV)の組成比(モル%)は、下限値としては、好ましくは10モル%以上であり、より好ましくは12モル%以上であり、さらに好ましくは14モル%以上であり、上限値としては、好ましくは23モル%以下であり、より好ましくは22モル%以下である。
本発明に係る全芳香族液晶ポリエステル樹脂は、構成単位(I)~(IV)を与えるモノマーを、溶融重合、固相重合、溶液重合およびスラリー重合等、従来公知の方法で重合することにより製造することができる。一実施態様において、本発明に係る全芳香族液晶ポリエステル樹脂は、溶融重合のみによって製造することができる。また、溶融重合によりプレポリマーを作製し、これをさらに固相重合する2段階重合によっても製造することができる。
本発明による成形品は、全芳香族液晶ポリエステル樹脂を含んでなるものであり、その形状は用途に応じ適宜変更されるものであり、特に限定されず、例えば、フィルム状、板状、繊維状等とすることができる。
本発明による電気電子部品は、上記成形品を備えてなる電気電子部品としては、例えば、ETC、GPS、無線LANおよび携帯電話等の電子機器や通信機器に使用されるアンテナ、高速伝送用コネクタ、CPUソケット、回路基板、フレキシブルプリント基板(FPC)、積層用回路基板、衝突防止用レーダーなどのミリ波および準ミリ波レーダー、RFIDタグ、コンデンサー、インバーター部品、絶縁フィルム、ケーブルの被覆材、リチウムイオン電池等の二次電池の絶縁材、スピーカー振動板等が挙げられる。一実施態様において、電気電子部品は、全芳香族液晶ポリエステル樹脂を含む成形品(例えば、射出成形品やフィルム等)を備えてなる。
(実施例1)
攪拌翼を有する重合容器にp-ヒドロキシ安息香酸(HBA)5モル%、6-ヒドロキシ-2-ナフトエ酸(HNA)48モル%、4,4-ジヒドロキシビフェニル(BP)23.5モル%、テレフタル酸(TPA)23.5モル%を加え、触媒として酢酸カリウムおよび酢酸マグネシウムを仕込み、重合容器の減圧-窒素注入を3回行って窒素置換を行った後、無水酢酸(水酸基に対して1.08モル当量)を更に添加し、150℃まで昇温し、還流状態で2時間アセチル化反応を行った。
モノマー仕込みを、HBA3モル%、HNA54モル%、BP21.5モル%、TPA21.5モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA6モル%、HNA54モル%、BP20モル%、TPA20モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA3モル%、HNA55モル%、BP21モル%、TPA21モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA5モル%、HNA55モル%、BP20モル%、TPA20モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA8モル%、HNA55モル%、BP18.5モル%、TPA18.5モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂Dを得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA5モル%、HNA57モル%、BP19モル%、TPA19モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA2モル%、HNA60モル%、BP19モル%、TPA19モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA3モル%、HNA60モル%、BP18.5モル%、TPA18.5モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA5モル%、HNA60モル%、BP17.5モル%、TPA17.5モル%に変更し、300℃の保持時間を1時間にした以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA8モル%、HNA60モル%、BP16モル%、TPA16モル%に変更し、固相重合の最終温度を295℃、保持時間を1時間にした以外は、実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA2モル%、HNA65モル%、BP16.5モル%、TPA16.5モル%に変更し、300℃の保持時間を1時間にした以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA2モル%、HNA65モル%、BP14.5モル%、メチルハイドロキノン(MeHQ)2モル%、TPA16.5モル%に変更し、固相重合の最終温度を295℃、保持時間を1時間にした以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA5モル%、HNA65モル%、BP15モル%、TPA15モル%に変更し、300℃の保持時間を1時間にした以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA5モル%、HNA65モル%、BP15モル%、TPA13モル%、2,6-ナフタレンジカルボン酸(NADA)2モル%に変更し、固相重合の最終温度を295℃、保持時間を1時間にした以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA5モル%、HNA65モル%、BP15モル%、TPA14モル%、NADA1モル%に変更し、固相重合の最終温度を295℃、保持時間を1時間にした以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA5モル%、HNA65モル%、BP15モル%、TPA10モル%、NADA5モル%に変更し、固相重合の最終温度を295℃、保持時間を1時間にした以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA8モル%、HNA65モル%、BP13.5モル%、TPA13.5モル%に変更し、固相重合の最終温度を295℃、保持時間を1時間にした以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA3モル%、HNA68モル%、BP14.5モル%、TPA14.5モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA6モル%、HNA68モル%、BP13モル%、TPA13モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA5モル%、HNA70モル%、BP12.5モル%、TPA12.5モル%に変更し、300℃の保持時間を1時間にした以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA9モル%、HNA72モル%、BP9.5モル%、TPA9.5モル%に変更し、固相重合の最終温度を280℃、保持時間を1時間にした以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA6モル%、HNA40モル%、BP27モル%、TPA27モル%に変更し、固相重合の最終温度を305℃、保持時間を1時間にした以外は、実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA2モル%、HNA48モル%、BP25モル%、TPA25モル%に変更し、固相重合の最終温度を310℃にした以外は、実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA1モル%、HNA54モル%、BP22.5モル%、TPA22.5モル%に変更し、固相重合の最終温度を310℃にした以外は、実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA1モル%、HNA60モル%、BP19.5モル%、TPA19.5モル%に変更し、固相重合の最終温度を305℃、保持時間を1時間にした以外は、実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA10モル%、HNA65モル%、BP12.5モル%、TPA12.5モル%に変更し、固相重合の最終温度を290℃、保持時間を1時間にした以外は、実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA10モル%、HNA70モル%、BP10モル%、TPA10モル%に変更し、固相重合の最終温度を290℃、保持時間を1時間にした以外は、実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA8モル%、HNA75モル%、BP8.5モル%、TPA8.5モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HNA60モル%、BP20モル%、TPA15モル%、イソフタル酸(IPA)5モル%に変更した以外は実施例1と同様にして、液晶ポリエステル樹脂を得て、上記と同様にして液晶性を確認した。
モノマー仕込みを、HBA73モル%、HNA27モル%に変更し、固相重合の最終温度を270℃に変更した以外は実施例1と同様にして、液晶ポリエステルを得て、上記と同様にして液晶性を確認した。
<溶融延伸性・溶融張力の測定>
実施例および比較例により得られた全芳香族液晶ポリエステル樹脂の溶融延伸性は、溶融ストランドの延伸比を測定することで評価した。を、(株)東洋精機製作所キャピログラフ1D(バレル内径9.55mmのレオメーター)、内径1mmキャピラリーを用いて、液晶ポリエステル樹脂の融点+20℃、プランジャー押出速度82.3mm/min(=キャピラリー通過時の樹脂かかるせん断速度1000s-1となる押出速度)、の条件で溶融した樹脂をストランドとして押し出した。押し出された溶融ストランドを、滑車を介して巻取ローラーで引取延伸比(=測定終点での引取速度(m/min)/キャピラリー通過時換算の押出速度(m/min))を測定した。引取速度は40m/minを初速度とし、400m/min2の割合で引取速度を上昇させ、引取速度が装置測定限界値の200m/minに達した、またはストランドが破断した点を測定終点とした。この測定結果を表1にまとめた。また測定終点におけるストランドの張力(=溶融張力)も合わせて表1にまとめた。なお、溶融延伸性、溶融粘度、あるいは溶融張力の不足のため、溶融ストランドを一連の滑車、巻取ローラーに適切にセットできず、または溶融延伸性が装置の測定下限未満となり測定不可であったものは、「-」とした。
実施例および比較例により得られた全芳香族液晶ポリエステル樹脂を融点~融点+30℃条件で加熱溶融、射出成形し、30mm×30mm×0.4mmの平板状試験片を作製した。この試験片の面内方向の誘電正接について、キーサイト・テクノロジー社のネットワークアナライザーN5247Aを用いて、スプリットポスト誘電体共振器法(SPDR法)により、周波数10GHzの誘電正接を測定した。測定結果を表1にまとめた。なお、融点が低く固相重合中にポリマーが融解したもの(比較例5)に関しては射出成形できなかったため測定不可とし、「-」と記載した。
実施例8ならびに比較例8および9により得られた全芳香族液晶ポリエステル樹脂を、融点~融点+30℃条件で加熱溶融、射出成形により、30mm×30mm×0.4mmの平板サンプルを作製した。続いて、この平板サンプルの中央から13mm角の正方形平板を切削して試験片とした。この試験片を、宇都宮大学大学院工学研究科 古神・清水研究室にて100GHz用共振器に装荷し、円筒空洞共振器法により、室温で周波数82GHzの誘電正接を測定した。(100GHz用の共振器を用いたが、実際の測定周波数は材料の共振特性により、82GHz付近の測定となった。)測定結果を表2にまとめた。また、設定周波数の異なる円筒空洞共振器を用いて同様の手順で、種々周波数で測定した誘電正接を図1に示した。
実施例8ならびに比較例8および9により得られた全芳香族液晶ポリエステル樹脂を、融点~融点+30℃条件で加熱溶融、射出成形により、30mm×30mm×0.4mmの平板サンプルを作製した。続いて、この平板サンプルの中央から13mm角の正方形平板を切削して試験片とした。この試験片を、宇都宮大学大学院工学研究科 古神・清水研究室にて36GHz用共振器を用いて円筒空洞共振器法により、測定温度を変化させながら34GHzの誘電正接測定を行った。(36GHz用の共振器を用いたが、実際の測定周波数は材料の共振特性により34GHzとなった。)具体的な測定方法は次のとおりである。試験片をセットした該共振器を恒温槽に配置し、恒温槽の設定温度を105℃に設定後、2時間経過させた。その後、恒温槽を20℃に設定し、槽内温度を自然降下させ、この時の誘電正接を1℃間隔で測定した。結果を図2に示した。また30℃および100℃での誘電正接と30℃から100℃までの誘電正接の変化率を表3に示した。
実施例および比較例において得られた全芳香族液晶ポリエステル樹脂の融点を、日立ハイテクサイエンス(株)製の示差走査熱量計(DSC)により測定した。このとき、昇温速度10℃/分で室温から360~380℃まで昇温してポリマーを完全に融解させた後、速度10℃/分で30℃まで降温し、更に10℃/分の速度で380℃まで昇温するときに得られる吸熱ピークの頂点を融点(Tm2)とした。ただし、再加熱時の吸熱ピークがブロードで検出困難な場合は、1周目の吸熱ピークの頂点(Tm1)を融点(℃)とした。測定結果を表1にまとめた。
実施例および比較例により得られた全芳香族液晶ポリエステル樹脂の、せん断速度1000s-1における融点+20℃での溶融粘度(Pa・s)を、キャピラリーレオメーター粘度計((株)東洋精機製作所キャピログラフ1D)と内径1mmのキャピラリーを用い、JIS K7199に準拠して測定した。測定結果を表1にまとめた。
Claims (16)
- p-ヒドロキシ安息香酸に由来する構成単位(I)、
6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(II)、
芳香族ジオール化合物に由来する構成単位(III)、および
芳香族ジカルボン酸に由来する構成単位(IV)
を含んでなり、
前記構成単位(I)~(IV)の組成比(モル%)が、下記の条件:
2モル%≦構成単位(I)≦9モル%
40モル%≦構成単位(II)≦75モル%
9モル%≦構成単位(III)≦24モル%
9モル%≦構成単位(IV)≦24モル%
を満たすことを特徴とする、全芳香族液晶ポリエステル樹脂。 - 前記構成単位(I)~(IV)の組成比(モル%)が、下記の条件:
2モル%≦構成単位(I)≦9モル%
48モル%≦構成単位(II)≦70モル%
10モル%≦構成単位(III)≦23モル%
10モル%≦構成単位(IV)≦23モル%
を満たす、請求項1に記載の全芳香族液晶ポリエステル樹脂。 - 前記液晶ポリエステル樹脂の融点+20℃、せん断速度1000s-1の条件で押し出した溶融ストランドの延伸比が、10倍以上である、請求項1~4のいずれか一項に記載の全芳香族液晶ポリエステル樹脂。
- 測定周波数10GHzにおける誘電正接が、0.85×10-3以下である、請求項1~5のいずれか一項に記載の全芳香族液晶ポリエステル樹脂。
- 測定周波数82GHzにおける誘電正接が、3.5×10-3未満である、請求項1~5のいずれか一項に記載の全芳香族液晶ポリエステル樹脂。
- 測定周波数34GHzにおける30℃および100℃の誘電正接が、それぞれ2.0×10-3未満および4.0×10-3未満である、請求項1~5のいずれか一項に記載の全芳香族液晶ポリエステル樹脂。
- 測定周波数34GHzにおける30℃から100℃までの誘電正接の変化率が、3.0×10-5/℃未満である、請求項1~5のいずれか一項に記載の全芳香族液晶ポリエステル樹脂。
- 融点が、290℃以上である、請求項1~9のいずれか一項に記載の全芳香族液晶ポリエステル樹脂。
- せん断速度1000s-1における溶融粘度が、20~150Pa・sである、請求項1~10のいずれか一項に記載の全芳香族液晶ポリエステル樹脂。
- 請求項1~11のいずれか一項に記載の全芳香族液晶ポリエステル樹脂を含んでなる、成形品。
- フィルム状である、請求項12に記載の成形品。
- 繊維状である、請求項12に記載の成形品。
- 射出成形品である、請求項12に記載の成形品。
- 請求項12~15のいずれか一項に記載の成形品を備える、電気電子部品。
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| JPWO2021145149A1 (ja) * | 2020-01-17 | 2021-07-22 | ||
| CN113767134A (zh) * | 2019-04-03 | 2021-12-07 | 宝理塑料株式会社 | 全芳香族聚酯和聚酯树脂组合物 |
| WO2022019296A1 (ja) * | 2020-07-21 | 2022-01-27 | Eneos株式会社 | 液晶ポリエステル樹脂、成形品、および電気電子部品 |
| CN114106307A (zh) * | 2021-11-17 | 2022-03-01 | 浙江大学 | 一种支化热致芳香族液晶聚酯的制备方法 |
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| JP7553001B2 (ja) * | 2020-07-21 | 2024-09-18 | 株式会社Eneosマテリアル | 液晶ポリエステル樹脂、成形品、および電気電子部品 |
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| CN112646140A (zh) * | 2020-12-09 | 2021-04-13 | 上海普利特化工新材料有限公司 | 一种适用于纤维制备且具备低介电损耗正切值的全芳香族液晶聚酯树脂及其应用 |
| KR102524571B1 (ko) * | 2020-12-29 | 2023-04-21 | 세양폴리머주식회사 | 저유전상수 및 저유전손실율을 지닌 유동성이 향상된 액정 폴리에스테르 조성물 |
| US11728559B2 (en) | 2021-02-18 | 2023-08-15 | Ticona Llc | Polymer composition for use in an antenna system |
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| CN113767134B (zh) * | 2019-04-03 | 2024-02-09 | 宝理塑料株式会社 | 全芳香族聚酯和聚酯树脂组合物 |
| JP2021075598A (ja) * | 2019-11-06 | 2021-05-20 | 上野製薬株式会社 | フィルム用ポリエチレンテレフタレート樹脂組成物 |
| JP7365861B2 (ja) | 2019-11-06 | 2023-10-20 | 上野製薬株式会社 | フィルム用ポリエチレンテレフタレート樹脂組成物 |
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| WO2021145149A1 (ja) * | 2020-01-17 | 2021-07-22 | 東レ株式会社 | 液晶ポリエステル樹脂、液晶ポリエステル樹脂組成物、成形品、積層体および液晶ポリエステル樹脂フィルムならびにその製造方法 |
| JP7040666B2 (ja) | 2020-01-17 | 2022-03-23 | 東レ株式会社 | 液晶ポリエステル樹脂、液晶ポリエステル樹脂組成物、成形品、積層体および液晶ポリエステル樹脂フィルムならびにその製造方法 |
| KR102889051B1 (ko) | 2020-01-17 | 2025-11-19 | 도레이 카부시키가이샤 | 액정 폴리에스테르 수지, 액정 폴리에스테르 수지 조성물, 성형품, 적층체 및 액정 폴리에스테르 수지 필름 및 그 제조 방법 |
| WO2022019296A1 (ja) * | 2020-07-21 | 2022-01-27 | Eneos株式会社 | 液晶ポリエステル樹脂、成形品、および電気電子部品 |
| JP2022021173A (ja) * | 2020-07-21 | 2022-02-02 | Eneos株式会社 | 液晶ポリエステル樹脂、成形品、および電気電子部品 |
| JP7458924B2 (ja) | 2020-07-21 | 2024-04-01 | Eneos株式会社 | 液晶ポリエステル樹脂、成形品、および電気電子部品 |
| CN114106307A (zh) * | 2021-11-17 | 2022-03-01 | 浙江大学 | 一种支化热致芳香族液晶聚酯的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190127766A (ko) | 2019-11-13 |
| EP3604380A1 (en) | 2020-02-05 |
| JP6530148B2 (ja) | 2019-06-12 |
| US20200040133A1 (en) | 2020-02-06 |
| US10968311B2 (en) | 2021-04-06 |
| KR102213912B1 (ko) | 2021-02-05 |
| CN110494471B (zh) | 2021-11-02 |
| EP3604380A4 (en) | 2020-11-25 |
| TW201840639A (zh) | 2018-11-16 |
| TWI735768B (zh) | 2021-08-11 |
| CN110494471A (zh) | 2019-11-22 |
| JPWO2018181525A1 (ja) | 2019-06-27 |
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