[go: up one dir, main page]

WO2018178140A1 - Ensemble d'éclairage à tolérances d'alignement réduite - Google Patents

Ensemble d'éclairage à tolérances d'alignement réduite Download PDF

Info

Publication number
WO2018178140A1
WO2018178140A1 PCT/EP2018/057899 EP2018057899W WO2018178140A1 WO 2018178140 A1 WO2018178140 A1 WO 2018178140A1 EP 2018057899 W EP2018057899 W EP 2018057899W WO 2018178140 A1 WO2018178140 A1 WO 2018178140A1
Authority
WO
WIPO (PCT)
Prior art keywords
point
light sources
substrate
assembly
temporary holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2018/057899
Other languages
English (en)
Inventor
Michael Deckers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds Holding BV
Lumileds LLC
Original Assignee
Lumileds Holding BV
Lumileds LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumileds Holding BV, Lumileds LLC filed Critical Lumileds Holding BV
Publication of WO2018178140A1 publication Critical patent/WO2018178140A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/29111—Tin [Sn] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/83815—Reflow soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95001—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a method providing a lighting assembly with high three- dimensional positional accuracy, to a pre-assembly used in this method as a level 1 product and to a lighting assembly with high three-dimensional positional accuracy.
  • ADB adaptive driving beam
  • matrix light becomes more and more popular.
  • Common light emission assemblies comprising LEDs as point-like light sources still require a primary optics element because the distance between the light emitting areas is limited by the package (rim of sidecoat).
  • the distance between two point-like light sources should be ⁇ 100 ⁇ .
  • an adaptive driving beam with close spacing LEDs enables a direct projection without pre-collimator optic elements.
  • One technical challenge to be overcome in an array of closely spaced emitters is the post mounting position tolerances, e.g. post soldering position tolerance of surface mount assembly when using multiple single LEDs on a level 2 board.
  • the LED pixel position for the beam projection has impact on beam performance and requires low positional tolerances for the assembly process.
  • the alignment of a main optic lens can be used to compensate the position of full matrix array during module assembly, however the position of individual LEDs cannot be adjusted and LED to LED position needs to be well controlled already during assembly of the LED Array.
  • LED-to-LED tolerance after a standard surface mounted technology (SMT) assembly will be in the range of ⁇ depending on design and solder process. Additionally small single emitters like Luxeon Neo or WLP chips with two bottom solder contacts tent to rotate and tilt during reflow soldering.
  • SMT surface mounted technology
  • a method to provide a lighting assembly comprising an array of point-like light sources arranged on a substrate with high three-dimensional positional accuracy. The method comprises the steps of:
  • each of the point-like light sources having an light emitting side and contacting backside for electrically contacting the point-like light source and being reversibly mounted on a temporary holder with their emitting surfaces;
  • the substrate with a contacting surface comprising an array of electrical substrate contacts, where the electrical substrate contacts are aligned to the position of the point-like light sources on the temporary holder;
  • point-like light source denotes any light source, which has a small light emission area (or volume) and has a wide emission cone providing an essentially non- directed light emission.
  • Such point-like light sources may be LEDs or semiconductor lasers, e.g. quantum wells or dots.
  • the lighting assembly may comprise an array of point-like light sources, e.g. an LED array.
  • the array of point-like light sources may comprise multiple columns and multiple rows of point-like light sources. The number of point-like light sources arranged in the rows and/or columns depends on the particular application of the lightings assembly.
  • the backside of the point-like light sources shall be adapted to be contacted to the substrate contacts, where the backside might be structured to provide separate contact pads for electrically connecting the point-like light sources to a power source.
  • three-dimensional positioning accuracy denotes the deviation from a desired three-dimensional position with respect to the lateral position of the point-like light sources, their vertical position (perpendicular to the lateral position), the tilting of the pointlike light sources denoting an alignment of the emitting surface of the point-like light sources with respect to a lateral plane defined by an average emitting surface and a rotation of the point-like light sources relative of the desired position denoting a rotation around a rotation axis perpendicular to the emitting surface of the point-like light sources.
  • the specified tolerance denotes the deviation to the desired position, where in case of tilting or rotation the tolerance denotes the maximum deviation of the emitting surface from its intended position.
  • the substrate might be a substrate providing electrical circuits to connect the substrate contacts to other components.
  • the substrate can be made of any material suitable to carry electrical contacts and being suitable to separate the electrical contacts such as glass, plastic etc.
  • the substrate might be printed circuit boards PCB or isolated metal substrates IMS.
  • the substrate might also be used to withdraw heat from the light sources in order to cool the assembly.
  • the temporary holder might be made of any material suitable to reliably maintaining the positions of the fixed point-like light sources. Since the temporary holder is removed before operating the lighting assembly, the temporary holder does not have to fulfill any certain electrical or optical properties.
  • the present invention might be used for automotive lamps for high/low beam and
  • ADB adaptive driving beam
  • matrix beam or matrix light applications This can consist of close spacing matrix array of point-like light sources like LEDs, wide spacing matrix and customized matrix solutions.
  • the present invention might be used for multi-chip LED level 1 packages (singe addressable or not) to improve positional tolerances of light emitting positions and lower the distances between the light emitting areas (LEA).
  • LOA light emitting areas
  • the method according to the present invention provides a light emitting assembly suitable for providing an adaptive driving beam not requiring pre-collimator optical elements, where the individual point-like light sources are mounted with a better three-dimensional positioning accuracy of the emission surfaces to each other in the range of 20 ⁇ or less avoiding non acceptable miss-alignment of the individual point-like light sources. According to the state of the art where solder self alignment is leading tolerances of >50 ⁇ are typical, improvements are hardly achievable.
  • the method may be arranged in such a way that the mounting step is executed by a surface mounting technology.
  • Surface-mount technology is a method for
  • the lighting assembly applying the mounting step with SMT is smaller than its through- hole counterpart.
  • the point-like light sources may have short pins or leads of various styles, flat contacts, a matrix of solder balls, or terminations on the backside of the point-like light source.
  • LED-to-LED tolerance In case of LEDs as point-like light sources a typical LED-to-LED tolerance after a standard SMT assembly will be in the range of ⁇ depending on design and solder process. Additionally small single emitters like Luxeon Neo or WLP chips with two bottom solder contacts tent to rotate and tilt during reflow soldering. With the present invention the LED-to-LED tolerance will be defined by the accuracy of the pre-assembly carrying the point-like light sources allowing a placement tolerance down to ⁇ .
  • the method may be arranged in such a way that the mounting step comprises soldering of the contacting backsides of the point-like light sources to solder dots as the electrical substrate contacts.
  • Soldering is a process in which two or more items (here the contacts of contacting backside and the substrate contacts) are joined together by melting and putting a solder as a filler material into the joint.
  • the solder metal has a lower melting point as the involved contacts.
  • Soldering differs from welding in that soldering does not involve melting of the contacts to be solders.
  • Solder materials are available in many different alloys for differing applications. In electronics assembly, an eutectic alloy of 63% tin and 37% lead (or 60/40, which is almost identical in melting point) may be used.
  • soft-solder examples include tin-lead for general purposes, tin-zinc for joining aluminum, lead- silver for strength at higher than room, temperature, cadmium-silver for strength at high temperatures, zinc-aluminum for aluminum, and corrosion resistance, and tin-silver and tin- bismuth.
  • the soldering process utilizes SAC -based solder in a reflow-soldering process.
  • SAC -based solder denotes tin-silver-copper alloys to avoid lead containing solders.
  • Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical contacts to their counter contacts after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint. Heating may be accomplished by passing the assembly through a reflow ov en or under an infrared lamp or by soldering individual joints with a hot air pencil. In an alternative embodiment, the mounting step might be carried out by conductive gluing or sintering.
  • the method may be arranged in such a way that it further comprises the steps of providing a temporary holder with a contact surface without point-like light sources and reversibly fixing the point-like light sources with the emitting surfaces on the contact surface of the temporary holder in order to provide the pre-assembly.
  • the fixation to the temporary holder ensures that the positions within the array of point-like light sources remains constant during the mounting step of joining the point-like light sources to the electrical contacts of the substrate.
  • a reversible fixation enables to remove the temporary holder from the emitting sides of the point-like light sources without causing any damage to the point-like light sources and not to disturb any light emission properties of the point-like light sources.
  • the tolerances with respect to tilting are defined by the contacting surface of the temporary holder, which can be a very flat and smooth surface depending on the material of the temporary holder, e.g. glass.
  • the method may be arranged in such a way that the fixing step is executed using a suitable gauge instrument or via a sequentially assembly of the point-like light sources in order to control the relative distances and alignment between each of the point-like light sources with the required accuracy.
  • Gauge instruments can be provided with tolerances far below the tolerance specified in the present invention.
  • the gauge instrument enables a fixation of the point-like light sources on the temporary holder at the desired position.
  • the sequential assembly of the point-like light sources to the temporary holder might be executed by a so-called die-placer machine providing a sufficient accuracy for sequentially placing the point-like light sources sequentially onto the temporary holder.
  • the method may be arranged in such a way that the temporary holder comprises an adhesive layer providing the contact surface.
  • a suitable adhesive layer might be an adhesive Polyimide tape.
  • the adhesive layer simplifies the fixation step and provides a reversibility of the fixation, e.g. be weakening the adhesive forces.
  • the temporary holder is a heat resistant plastic film, preferably an adhesive Polyimide film, or a rigid flat substrate, preferably a metal, glass or ceramic substrate.
  • the method may be arranged in such a way that it further comprises the step of removing the reversibly mounted temporary holder from the point-like light sources after the mounting step has been finished. This can be done by peeling of the temporary holder in case of being a plastic film or dissolving the adhesive layer established as a glue layer with heat and/or solvents. A special glue losing or reducing adhesion during high temperature of reflow soldering may ease the removal of the temporary holder.
  • the method may be arranged in such a way that the array of point-like light sources comprises multiple columns and multiple rows of point-like light sources, where the numbers of rows and columns depend on the particular application.
  • the method may be arranged in such a way that the substrate is a printed circuit board.
  • a printed circuit board already provides the electrical contacts for joining it with the contacting backside and therefore can be easily used in SMT processes. This simplifies the mounting step.
  • the substrate might also be a ceramic interposer substrate.
  • a pre-assembly comprising multiple point like light sources having an emitting side and contacting backside and a temporary holder
  • the point-like light sources are reversibly fixed on the temporary holder with their emitting surfaces with suitable means providing a three-dimensional positioning accuracy having position tolerances 20 ⁇ between the point-like light sources.
  • This pre-assembly is a component used in the method according to the present invention.
  • This pre-assembly is a level 1 product which can be used by customers as a standard SMD component, supplied in tape and reel packing and can be assembled with SMT machines and reflow soldering to printed circuit boards PCB or isolated metal substrates IMS.
  • a level- 1 -product denotes the core part of the product which is mainly focused on the benefit that the product brings to the customer, while the actual product (here the lighting assembly) is a tangible product which focuses on the quality and the design of the product.
  • level 1 denotes a component without a wired substrate.
  • the pre-assembly may be arranged in such a way that the temporary holder comprises an adhesive layer as the suitable means providing a contact surface for accurate fixing of the point-like light sources.
  • the adhesive layer can be made of any suitable material to temporarily fix the point-like light sources, e.g. adhesive polyimide tape using a high precision die bonder to achieve low positional tolerance between the point-like light sources.
  • the pre-assembly may be arranged in such a way that the temporary holder is a heat resistant plastic film, preferably a Polyimide film, or a rigid flat substrate, preferably a metal, glass or ceramic substrate. These materials enable to provide the temporary holder with defined geometrical and surface properties in order to fix the point-like light sources with the desired three-dimensional accuracy. According to a third aspect a lighting assembly is provided.
  • the lighting assembly comprises a substrate with an array of electrical substrate contacts and an array of point-like light sources each having an emitting surface to emit light and a contacting backside being mounted in an electrical contact on the substrate contacts and being arranged with high positional accuracy 20 ⁇ by simultaneously mounting each of the contacting backsides of the point-like light sources to electrical substrate contacts, where the mounting of the array of point like light sources is performed in accordance to the method according to the present invention.
  • Lighting assemblies with such an accurate alignment of the array of point-like light sources can be operated without primary optics, because the point-like light sources can be placed very closely in order to allow matrix beam applications without primary optics.
  • tolerances between the point-like light sources of ⁇ can be achieved, e.g. with applying SMT assembly and reflow soldering.
  • the lighting assembly may be arranged in such a way that the array of point-like light sources comprises multiple columns and multiple rows of point-like light sources.
  • the lighting assembly may be arranged in such a way that the substrate is a printed circuit board or a ceramic interposer substrate.
  • Fig. 1 shows a principal sketch of fixing the point-like light sources to the temporary holder in accordance to the present invention with (a) before fixing and (b) after fixing.
  • Fig. 2 shows a principal sketch of mounting the point-like light sources to the substrate of the lighting assembly in accordance to the present invention with (a) before mounting and (b) after mounting.
  • Fig. 3 shows a principal sketch of removing the temporary holder from the point-like light sources in accordance to the present invention.
  • Fig. 4 shows a principal sketch of an embodiment of the method according to the present invention.
  • like numbers refer to like objects throughout. Objects in the Figs, are not necessarily drawn to scale.
  • Fig. 1 shows a principal sketch of fixing the point-like light sources to the temporary holder in accordance to the present invention with (a) before fixing and (b) after fixing.
  • the temporary holder 4 comprises an adhesive layer 42 with a contact surface 41 without point-like light sources 2.
  • a suitable gauge instrument 5 or an alternative sequential placing process provides the to-be-fixed point-like light sources 2 in order to control the relative distances DR and alignment TR between each of the point-like light sources 2 with the required accuracy (see also fig.3).
  • the point-like light sources 2 are reversibly fixed 150 with the emitting surfaces 21 on the contact surface 41 of the temporary holder 4 in order to provide the pre-assembly 1 comprising the array of point like light sources 2 reversibly fixed on the temporary holder 4 with their emitting surfaces 21 with suitable means 42 providing a three-dimensional positioning accuracy having position tolerances in the range of 20 ⁇ or less than 20 ⁇ between the point-like light sources 2.
  • the temporary holder 4 might be a heat resistant plastic film, preferably a Polyimide film, or a rigid flat substrate, preferably a metal, glass or ceramic substrate.
  • the contacting backsides 22 are provided for electrically contacting the point- like light source 2.
  • Fig. 2 shows a principal sketch of mounting the array of point-like light sources to the substrate of the later achieved lighting assembly 10 (see fig.3) in accordance to the present invention with (a) before mounting and (b) after mounting.
  • the lighting assembly 10 comprises a substrate 3 with an array of electrical substrate contacts 32 and an array of pointlike light sources 2 each having an emitting surface 21 to emit light L and a contacting backside 22 being mounted in an electrical contact on the substrate contacts 32 and being arranged with high positional accuracy in the range of 20 ⁇ or less by simultaneously mounting 130 each of the contacting backsides 22 of the point-like light sources 2 to electrical substrate contacts 32, where the mounting of the array of point like light sources 2 is performed in accordance to the method 100 as shown in fig.4.
  • the substrate 3 is a printed circuit board.
  • the array of point-like light source might be a 4x2 array.
  • Fig. 3 shows a principal sketch of removing 160 the temporary holder 4 from the point-like light sources 2 in accordance to the present invention after the mounting step 130 has been finished. This can be done by peeling of the temporary holder 4 in case of being a plastic film or dissolving the adhesive layer 42 established as a glue layer with heat and/or solvents. A special glue losing or reducing adhesion during high temperature of reflow soldering may ease the removal of the temporary holder.
  • the resulting lighting assembly 10 comprises mounted point-like light sources 2 with maintained relative distances DR and alignment TR between each of the point-like light sources 2 provided by the temporary holder 4 with the required accuracy of tolerances in the range of 20 ⁇ or less.
  • Fig. 4 shows a principal sketch of an embodiment of the method 100 according to the present invention comprising an array of point-like light sources 2 arranged on a substrate 3 with high positional accuracy comprising the steps of providing 140 a temporary holder 4 with a contact surface 41 without point- like light sources 2.
  • the temporary holder 4 may comprise an adhesive layer 42 providing the contact surface 41, the temporary holder 4 might be a heat resistant plastic film, preferably a Polyimide film, or a rigid flat substrate, preferably a metal, glass or ceramic substrate.
  • the method is continued by reversibly fixing 150 the point-like light sources 2 having an light emitting side 21 and contacting backside 22 for electrically contacting the point-like light source 2 with the emitting surfaces 21 on the contact surface 41 of the temporary holder 4 in order to provide the pre-assembly 1 of an array of point like light sources 2 with a three-dimensional positioning accuracy having position tolerances in the range of 20 ⁇ or less between the point-like light sources 2.
  • the fixing step 150 might be executed using a suitable gauge instrument 5 or a sequential assembly with a die-placer machine in order to control the relative distances DR and alignment TR between each of the point-like light sources 2 with the required accuracy.
  • the method is continued by providing 120 the substrate 3 with a contacting surface 31 comprising an array of electrical substrate contacts 32, where the electrical substrate contacts 32 are aligned to the position of the point-like light sources 2 on the temporary holder 4;
  • the mounting step 130 might be executed by a surface mounting technology SMT.
  • the mounting step 130 may comprise soldering 135 of the contacting backsides 22 of the point-like light sources 2 to solder dots 32 as the electrical substrate contacts 32 e.g. utilizing SAC -based solder in a reflow-soldering process.
  • the mounting step 130 might be carried out by conductive gluing or sintering.
  • the substrate 3 might be a printed circuit board or a ceramic interposer substrate. While the invention has been illustrated and described in detail in the drawings and the foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive.
  • substrate e.g. a printed circuit board
  • suitable means to fix the point-like light source on the temporary holder e.g. an adhesive layer
  • TR relative alignment between different point-like light source e.g. relative tilting and relative rotation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne un procédé (100) fournissant un ensemble d'éclairage (10) comprenant les étapes consistant à fournir (110) le pré-ensemble (1) d'un réseau de sources de lumière ponctuelles (2) avec une précision de positionnement tridimensionnelle dont les tolérances de position se situent dans la plage de 20 µm ou moins entre les sources de lumière ponctuelles (2), chacune des sources de lumière ponctuelles (2) ayant une face émettrice de lumière (21) et une face arrière de mise en contact (22) permettant une mise en contact électrique et étant montée de manière réversible sur un support temporaire (4) avec leurs surfaces émettrices (21), à fournir (120) le substrat (3) comprenant un réseau de contacts électriques de substrat (32) qui sont alignés sur la position des sources de lumière ponctuelles (2) sur le support temporaire (4) et à monter simultanément (130) les faces arrière de contact (22) de la source de lumière ponctuelle (2) sur les contacts électriques de substrat (32) du substrat (3) en conservant la précision de positionnement du pré-ensemble (1).
PCT/EP2018/057899 2017-03-30 2018-03-28 Ensemble d'éclairage à tolérances d'alignement réduite Ceased WO2018178140A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP17163765.5 2017-03-30
EP17163765 2017-03-30

Publications (1)

Publication Number Publication Date
WO2018178140A1 true WO2018178140A1 (fr) 2018-10-04

Family

ID=58464284

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/057899 Ceased WO2018178140A1 (fr) 2017-03-30 2018-03-28 Ensemble d'éclairage à tolérances d'alignement réduite

Country Status (2)

Country Link
TW (1) TWI742264B (fr)
WO (1) WO2018178140A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022026539A1 (fr) * 2020-07-29 2022-02-03 Lumileds Llc Alignement d'élément d'éclairage
US11497112B2 (en) 2020-12-11 2022-11-08 Toyota Motor Engineering & Manufacturing North America, Inc. Driver board assemblies and methods of forming a driver board assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170069796A1 (en) * 2015-09-04 2017-03-09 PlayNitride Inc. Light emitting device with epitaxial structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8508116B2 (en) * 2010-01-27 2013-08-13 Cree, Inc. Lighting device with multi-chip light emitters, solid state light emitter support members and lighting elements
US20120120655A1 (en) * 2010-11-11 2012-05-17 Bridgelux, Inc. Ac led array module for street light applications

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170069796A1 (en) * 2015-09-04 2017-03-09 PlayNitride Inc. Light emitting device with epitaxial structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022026539A1 (fr) * 2020-07-29 2022-02-03 Lumileds Llc Alignement d'élément d'éclairage
US12408482B2 (en) 2020-07-29 2025-09-02 Lumileds Llc Lighting element alignment
EP3958308A1 (fr) * 2020-08-19 2022-02-23 Lumileds LLC Alignement d'élément d'éclairage
US11497112B2 (en) 2020-12-11 2022-11-08 Toyota Motor Engineering & Manufacturing North America, Inc. Driver board assemblies and methods of forming a driver board assembly

Also Published As

Publication number Publication date
TWI742264B (zh) 2021-10-11
TW201903319A (zh) 2019-01-16

Similar Documents

Publication Publication Date Title
US9825194B2 (en) Self aligning soldering
US8882301B2 (en) Method for low temperature bonding of electronic components
JP2022133477A (ja) レーザダイオードモジュール、デバイスおよびサブマウントモジュール上にチップを作製する方法
CN102478168B (zh) 透镜夹持对位座及其发光二极管光板
US6284998B1 (en) Method for laser soldering a three dimensional component
CN101490464B (zh) 具有多个发射辐射的器件的发射辐射的设备以及照明设备
JP6839762B2 (ja) プリント回路基板上のｌｅｄの位置ずれに対処する方法
JP6932164B2 (ja) 電子部品を貼り付ける方法
JP6754769B2 (ja) 半導体モジュールおよびその製造方法
WO2018178140A1 (fr) Ensemble d'éclairage à tolérances d'alignement réduite
JP2019114624A (ja) 半導体発光装置及びその製造方法
US10980132B2 (en) Addressing misalignment of LEDs on a printed circuit board
JP2011146611A (ja) 発光素子パッケージ、及びこれを用いた線状発光装置、面状発光装置
CN105594003A (zh) 光电组件以及用于紧固所述光电组件的方法
KR101242653B1 (ko) 기판에 실장되는 지지 컴포넌트, 인쇄 회로 기판, 및 표면실장형 디바이스의 실장 방법
JP4754245B2 (ja) 発光素子ユニットの製造方法
JP4679268B2 (ja) 発光ダイオード複合素子
JP4679267B2 (ja) 発光ダイオード複合素子
JP2005317950A (ja) 発光ダイオード組立体の組立方法および発光ダイオード組立体
CN110574173B (zh) 用于制造照明装置的方法和照明装置
JP2013098213A (ja) 両面実装基板の製造方法
JP5011303B6 (ja) 基板に取り付けられるのに適しているコンポーネント、及び表面実装デバイスを取り付ける方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18713675

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18713675

Country of ref document: EP

Kind code of ref document: A1