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WO2018175192A1 - Structure d'écouteur bouton pour pilote acoustique et embout auriculaire complémentaire - Google Patents

Structure d'écouteur bouton pour pilote acoustique et embout auriculaire complémentaire Download PDF

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Publication number
WO2018175192A1
WO2018175192A1 PCT/US2018/022601 US2018022601W WO2018175192A1 WO 2018175192 A1 WO2018175192 A1 WO 2018175192A1 US 2018022601 W US2018022601 W US 2018022601W WO 2018175192 A1 WO2018175192 A1 WO 2018175192A1
Authority
WO
WIPO (PCT)
Prior art keywords
earbud
acoustic driver
ear
port
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2018/022601
Other languages
English (en)
Inventor
Martin D. Ring
Michael Andrew Zalisk
Mark Richard BERGERON
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bose Corp
Original Assignee
Bose Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bose Corp filed Critical Bose Corp
Priority to EP18716047.8A priority Critical patent/EP3603098A1/fr
Publication of WO2018175192A1 publication Critical patent/WO2018175192A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023—Screens for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1075—Mountings of transducers in earphones or headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/11—Aspects relating to vents, e.g. shape, orientation, acoustic properties in ear tips of hearing devices to prevent occlusion

Definitions

  • This disclosure relates to an earbud frame for an acoustic driver and more specifically to an acoustic driver with a frame integrated with an earbud.
  • an in-ear earphone may include an earbud.
  • the earbud may include an acoustic driver.
  • the acoustic driver may include a diaphragm and a magnetic circuit.
  • a frame of the acoustic driver may be integrated with the earbud.
  • in-ear earphone may include one of the following features, or any combination thereof.
  • the acoustic driver may be framed directly by the earbud.
  • the acoustic driver may be embedded in the earbud.
  • the acoustic driver may have no frame separate from the earbud.
  • a front cavity enclosure may form an outlet and a first port from the acoustic driver to an outside of the earbud.
  • An ear tip may surround at least the front cavity enclosure.
  • the ear tip may have a second port mated to the first port to form a pressure equalization port from the acoustic driver to an outside of the ear tip.
  • the ear tip may include a first leg and a second leg.
  • a resistive mesh may be positioned over the first port.
  • the in-ear earphone may include a microphone.
  • the frame of the acoustic driver integrated with the earbud may maximize a size of the diaphragm of the acoustic driver relative to a size of the earbud.
  • the second port of the ear tip may have a different length for a small tip ear tip than a medium tip ear tip.
  • the earbud may further include a back cavity cap.
  • an earbud may include an acoustic driver.
  • the acoustic driver may include a diaphragm and a magnetic circuit.
  • a frame of the acoustic driver may be integrated with the earbud.
  • the acoustic driver may be framed directly by the earbud.
  • the acoustic driver may be embedded in the earbud.
  • the acoustic driver may have no frame separate from the earbud.
  • a front cavity enclosure may form an outlet and a port from the acoustic driver to an outside of the earbud.
  • the earbud may include a back cavity cap.
  • the port may be a pressure equalization port from the acoustic driver to the outside of the earbud.
  • a resistive mesh may be positioned over the port.
  • the earbud may include microphone.
  • the frame of the acoustic driver integrated with the earbud may maximize a size of a diaphragm of the acoustic driver relative to a size of the earbud.
  • an ear tip for an in-ear earphone may be formed from a pliable material to surround at least a front cavity enclosure of an earbud.
  • the earbud may include an acoustic driver having a diaphragm and a magnetic circuit.
  • the frame of the acoustic driver may be integrated with the earbud.
  • ear tip may include one of the following features, or any combination thereof.
  • the ear tip may include a first leg, a second leg, and a first port positioned between the first leg and the second leg to mate with a second port of the front cavity enclosure of the earbud.
  • the first port of the ear tip may have a different length for a small tip ear tip than a medium tip ear tip.
  • the first port and the second port may mate to form a pressure equalization port from the acoustic driver to an outside of the ear tip.
  • an ear tip may include a positioning and retaining structure.
  • the positioning and retaining structure may include a second port positioned to mate with a first port of a front cavity enclosure of an earbud.
  • the first port may be multiple parallel ports.
  • the second port may be multiple parallel ports.
  • FIG. 1 shows various views of an in-ear earphone having an acoustic driver with a frame separate from an earbud, and a small ear tip.
  • FIG. 2A shows various views of an earbud having an acoustic driver with a frame separate from an earbud.
  • FIG. 2B shows various views of an earbud having an acoustic driver with a frame integrated with an earbud.
  • FIG. 3 A shows various views of an in-ear earphone having an acoustic driver with a frame integrated with an earbud, and a small ear tip.
  • FIG. 3B shows various views of an in-ear earphone having an acoustic driver with a frame integrated with an earbud, and a medium ear tip.
  • FIG. 4A shows various views of an acoustic driver with an integrated frame.
  • FIG. 4B shows various views of an acoustic driver with an integrated frame.
  • FIG. 5A shows various views of an acoustic driver having a frame integrated with an earbud.
  • FIG. 5B shows a blown up view of an in-ear earphone having an acoustic driver with a frame integrated with an earbud, and a small ear tip.
  • FIG. 6 shows various views of an in-ear earphone having an acoustic driver with a frame integrated with an earbud, and a small ear tip.
  • FIG. 7 shows various views of an in-ear earphone having an acoustic driver with a frame integrated with an earbud, and a medium ear tip.
  • a typical micro-speaker or acoustic driver for an earphone may include a basket, also called a frame, a diaphragm mounted to the frame, and a magnetic circuit (coil, magnet, etc.) that forces the diaphragm to move relative to the frame.
  • a typical earphone may include an earbud having a housing, an acoustic driver, and an ear tip. The earbud housing may enclose all or almost the entire acoustic driver frame or basket, and may leave an outlet for coupling an acoustic driver output to an ear canal. Additional ports for shaping an acoustic response may be included.
  • the frame of the acoustic driver As earbuds have decreased in size, the frame of the acoustic driver has become the largest single component of the earbud. As a result, the frame of the acoustic driver has limited the minimum size of the earbud.
  • the present disclosure describes techniques and features for using the earbud itself as the frame for the acoustic driver such that a separate frame for the acoustic driver is not needed.
  • the earbud may be designed such that the diaphragm and magnetics of the acoustic driver are built directly into the earbud enclosure.
  • the acoustic driver or micro-speaker is no longer a stand-alone component, but rather part of the earbud itself.
  • the present disclosure relates to an earbud, an ear tip, and an in-ear earphone.
  • the earbud may include an acoustic driver, which may include a diaphragm and a magnetic circuit.
  • a frame of the acoustic driver may be integrated with the earbud.
  • the acoustic driver may be framed directly by the earbud and/or embedded in the earbud.
  • the acoustic driver may have no frame separate from the earbud.
  • a front cavity enclosure may form an outlet and a port from the acoustic driver to an outside of the earbud.
  • the earbud may also include a back cavity cap.
  • the port may be a pressure equalization port from the acoustic driver to the outside of the earbud and a resistive mesh may be positioned over the port.
  • the frame of the acoustic driver integrated with the earbud may maximize a size of the diaphragm of the acoustic driver relative to a size of the earbud.
  • an earbud may have two walls because an acoustic driver of the earbud has its own frame, basket, or housing. Two separate walls of plastic may not be necessary because the acoustic device may not need its own frame, basket, or housing, as it is only holding a magnetic circuit and a diaphragm.
  • the ear bud itself may be a structure holding the magnetic circuit and diaphragm in place, eliminating the need for the acoustic driver to have a separate frame, basket, or housing.
  • Eliminating this extra packaging may allow for the earbud package to be smaller such that it can fit smaller ears and/or protrudes less from a wearer's ear.
  • the smaller earbud may enable use with smaller sized ear tips than could otherwise be used.
  • the earbud, ear tip, and in-ear earphone described in the present disclosure may allow for each of the earbud, ear tip, and in-ear earphone to be smaller in size than a typical earbud, ear tip, and/or in-ear earphone due to elimination of the need for a separate frame for an acoustic driver of the earbud.
  • a minimum earbud size for a given acoustic driver diaphragm size may be achieved.
  • the entire package of the earbud may better fit into the concha of a smaller ear than previously possible, and will protrude less from the concha of any ear size, thus improving a user's experience in wearing the earphone.
  • an orientation of an acoustic driver (having an integrated frame as described in the present disclosure) in the ear tip may be substantially parallel relative to a body of the ear tip and may thus reduce an amount that the earbud protrudes from an ear tip/concha (as shown, e.g., in FIGs. 1, 3A-3B, 5B, 6 and 7).
  • earbuds having acoustic drivers without integrated frames, or having separate frames for the acoustic driver may stick out more from the ear tip/concha because the frame of the acoustic driver may prevent the acoustic driver from being oriented substantially parallel relative to the body of the ear tip.
  • the extra size of the frame of the acoustic driver may cause the acoustic driver to be oriented at an angle relative to the body of the ear tip rather than substantially parallel to the body of the ear tip, and may thus increase a z-height of the earbud (i.e., a distance from a back cavity cap of the earbud to an outlet of a front cavity enclosure of the earbud).
  • the z-height may be minimized and allow for the acoustic driver (with integrated frame) to be oriented
  • Earphone 100 may include acoustic driver 104 inside earbud 102.
  • Acoustic driver 104 may be a 10 mm acoustic driver, though other sized drivers may be used.
  • Portion 106 of earphone 100 shown in View C shows that earbud 102 does not fit into ear tip 108, leading to a larger overall package size of the in-ear earphone 100.
  • earbud 102 with a 10 mm acoustic driver is too large to fit in ear tip 108, a problem that is exacerbated when using a relatively smaller sized ear tip (e.g., one with a smaller width that is intended to fit in a smaller sized concha).
  • earbud assembly 200A where earbud 202A
  • FIG. 2B shows earbud assembly 200B where earbud 202B houses diaphragm 206B and a magnetic circuit behind the diaphragm, not shown, but built directly into the frame of earbud 202B.
  • Earbud assembly 200B no longer comprises a separate assembly that completely encloses the acoustic driver frame. As shown in FIG.
  • Earbud assembly 200B may be significantly smaller than earbud assembly 200A because earbud assembly 200B lacks a separate earbud enclosure that surrounds the acoustic driver frame. Rather, the earbud 202B itself also functions as the frame for the acoustic driver. While FIG. 2B shows the earbud 202B as being made of several separate components or pieces, in some examples, the earbud 202B may be made of a single integral component.
  • earphone 300 A and earphone 300B are shown, respectively.
  • earbud 302 A having acoustic driver 304 A without an acoustic driver frame fits into a small-sized ear tip 308 A of earphone 300 A.
  • earbud 302B having acoustic driver 304B without an acoustic driver frame fits into a medium-sized ear tip 308B of earphone 300B.
  • Acoustic driver 304 A may sit directly in earbud 302 A without an acoustic driver frame and acoustic driver 304B may sit directly in earbud 304B without an acoustic driver frame, thus allowing earbud 302 A to be smaller in size and fit in small ear tip 308 A and earbud 302B to be smaller in size and fit in medium ear tip 308B.
  • a diameter of an earbud may be reduced by 1mm -2mm or more.
  • This reduction in size of the earbud may allow for an in-ear earphone to have a larger diaphragm (of the acoustic driver) while still fitting in a smaller ear.
  • diaphragms of up to 11.8mm or more for a medium ear tip and up to 10.2mm or more for a small ear tip may be realized as a result of eliminating the acoustic driver frame.
  • using a driver without an acoustic driver frame enables a design that protrudes less from a wearer's concha, thus improving stability of the earphone.
  • an in-ear earphone may include an earbud with an acoustic driver having a diaphragm and a magnetic circuit, and a frame of the acoustic driver may be integrated with the earbud.
  • Integrated frame 402 may hold together a diaphragm and magnetic circuit of acoustic driver 400 and may be part of the earbud itself, rather than being a separate framing structure for acoustic driver 400.
  • Integrated frame 402 may include a starting portion of a front cavity or nozzle (402A) and a hook or alignment portion (402B) to mate with an ear tip or cushion (not shown).
  • acoustic driver 400 may include diaphragm 404 and voice coil 406.
  • Voice coil 406 may be part of a magnetic circuit (not shown) of acoustic driver 400 or the magnetic circuit may be a separate component included in acoustic driver 400.
  • integrated frame 402 may be part of an earbud assembly and the earbud itself. In an implementation, surround 408 and mounting ring 410 may also be included.
  • Surround 408 may be a portion of the diaphragm that is elastic and may allow a central portion of the diaphragm to move while the outer portion is fixed to the frame, allowing for linear motion of voice coil 406 and the diaphragm, which may produce sound. Further, surround 408 may center voice coil 406 within a magnet.
  • Mounting ring 410 (which may or may not be included), may help to form diaphragm 404 and may provide a reference point or datum for various fixtures of an earbud assembly. For example, mounting ring 410 may facilitate bonding voice coil 406, may help keep various components of the earbud centered, and may anchor surround 408 to integrated frame 402. It should be noted that acoustic driver 400 may include other components such as a magnet or other circuitry which are not shown in FIG. 4B.
  • Earbud assembly 500 may include acoustic driver 502 with integrated acoustic driver frame 504.
  • acoustic driver 502 with integrated acoustic driver frame 504 may be joined with front cavity enclosure 506 and back cavity cap 508 to form earbud assembly or earbud 500.
  • Integrated acoustic driver frame 504, front cavity enclosure 506, and back cavity cap 508 may be joined using a number of fabrication techniques, including but not limited to use of adhesives, welding, snaps, and/or molding.
  • Front cavity enclosure 506 may form an outlet 516 and a port 510 from acoustic driver 502 to the outside of earbud 500.
  • the integrated frame and front cavity enclosure components may be made of a number of materials including, but not limited to, elastomers, plastics, acrylonitrile butadiene styrene (ABS), polycarbonate, metals, and wood.
  • ABS acrylonitrile butadiene styrene
  • the dimensions of these components may be variable but are generally small (e.g., 10 mm) such that the entire device may fit within a concha of the ear, with the front cavity opening directed towards an ear canal.
  • a cushion/ear tip may acoustically and/or mechanically couple the front acoustic cavity to the ear canal.
  • acoustic driver 502 may be framed directly by earbud 500 and/or its components (e.g., integrated acoustic driver frame 504, front cavity enclosure 506, and/or back cavity cap 508). In this way, acoustic driver 502 may be embedded in earbud 500 and/or have no frame separate from earbud 500.
  • one or more of integrated acoustic driver frame 504, front cavity enclosure 506, and/or back cavity cap 508 or a combination thereof, when joined to form earbud 500 may allow for maximization of the size of a diaphragm (e.g., diaphragm 404 of FIG.
  • an ear tip may surround at least the front cavity enclosure.
  • the ear tip may include a body that rests against the concha, a retaining member comprising one or more legs, an outlet that overlies an outlet of the earbud, and a second port mated to a first port of the earbud.
  • U.S. Pat. No. 9,036,853 describes ear tips and positioning and retaining structures and is incorporated here by reference in its entirety. Referring now to FIG. 5B, a blown-up view of an in-ear earphone 512 having acoustic driver 502 with a frame integrated with earbud 500, and an ear tip 514 are shown.
  • earbud 500 may be comprised of integrated acoustic driver frame 504, front cavity enclosure 506, and back cavity cap 508 which, when joined or molded together, frame acoustic driver 502 and form earbud 500.
  • Ear tip 514 may be made from a pliable material such as silicone and may be stretched to fit around earbud 500 and hold earbud 500 in place when seated in a wearer's ear to form in-ear earphone 512.
  • In-ear earphone 600 may have ear tip 602 and earbud 604.
  • Ear tip 602 may be a small-sized ear tip and may be made of a pliable material such as silicone that may stretch.
  • earbud 604 may be pushed into ear tip 602 such that earbud 604 sits in ear tip 602 as ear tip 602 stretches around earbud 604 such that earbud 604 is held in place by ear tip 602.
  • a small-sized ear tip may fit comfortably inside a small concha.
  • a small concha may have physical dimensions less than two standard deviations of mean dimensions exhibited by human conchae.
  • the concha may be roughly described as having a radius, and a small concha or ear tip may fits within a concha having a radius less than two standard deviations of the mean radius for humans.
  • a small ear tip may fit inside larger ears but may not achieve good mechanical stability or acoustic coupling to the ear because the fit may be too loose.
  • earbud 604 may have port 606.
  • Port 606 may be similar to port 510 of FIG. 5 discussed above.
  • ear tip 602 may have port 608.
  • Ports 606 and 608 may mate to form a pressure equalization port from the acoustic driver of earbud 604 to the outside of ear tip 602.
  • In-ear earphone 700 may have ear tip 702 and earbud 704.
  • Ear tip 702 may be a medium-sized ear tip and may also be made of a pliable material such as silicone that may stretch.
  • earbud 704 may be pushed into ear tip 702 such that earbud 704 sits in ear tip 702 as ear tip 702 stretches around earbud 704 such that earbud 704 is held in place by ear tip 702.
  • a medium ear tip may comfortably fit into most human conchae and may be sized approximately within plus or minus two standard deviations of the mean concha dimensions of humans.
  • a medium ear tip may fit inside a large concha but may not fit inside a small concha.
  • earbud 704 may have one or more ports 706.
  • Port 706 may be similar to port 510 of FIG. 5 discussed above.
  • ear tip 702 may have one or more ports 708.
  • Ports 706 and 708 may mate to form a pressure equalization port from the acoustic driver of earbud 704 to the outside of ear tip 702.
  • one or more of the ports described in the present disclosure may form a pressure equalization port from between the front and rear cavities rather than from the acoustic driver to the outside of the ear tip. Additional ports may be included to shape the audio response.
  • the pressure equalization (PEQ) port may reduce or prevent occlusion created when the ear tip of an in-ear earphone is positioned in an ear.
  • two notches may need to be created.
  • One notch may be created in the material of the ear tip (e.g., ear tip 602 or 702).
  • Another notch may be created in the earbud (e.g., earbud 604 or 704).
  • a notch may be created in the front cavity enclosure (e.g., front cavity enclosure 506 of FIG.
  • a hole or notch may be included as part of the molding process for the integrated acoustic driver frame or front cavity enclosure, or may be drilled or ground away from the integrated acoustic driver frame or front cavity enclosure of the earbud.
  • the hole in order for the hole to reach the outside of the ear tip and reduce the occlusion effect, the hole must extend through the ear tip (e.g., ear tip 602 or 702). This is because, in some situations, the in-ear earphone may seal or partially seal the ear canal even without going into the ear canal beyond the ear canal entrance, when worn by a person. This seal may create the occlusion effect, which may create an uncomfortable sensation of one's own voice.
  • the ear tip is made from silicone, a hole may be cut-out of the silicone, or the silicone may be formed or molded with the hole.
  • the hole in the integrated acoustic driver frame or front cavity enclosure may be mated with the hole in the silicone when the earbud is positioned in the ear tip, thus preventing the in-ear earphone from sealing the ear canal by allowing pressure to vent through the resulting PEQ port and removing or partially removing the occlusion effect.
  • the PEQ port may also release pressure resulting from movement of the in-ear ear phone while it is positioned in the ear.
  • acoustic energy generated by the acoustic driver may be released and to allow some of acoustic energy from outside the earphone to enter through the PEQ port. This may prevent, for example, in microphone-enabled in-ear earphones, a person from hearing excessive bass or low frequencies from their own voice while talking on the telephone through the microphone and wearing the in-ear earphones, due to the occlusion effect.
  • a front volume may be created between the acoustic driver and the front cavity enclosure, and a back volume may be created between the acoustic driver and the back cavity cap.
  • the front and back volumes may contain all or most of the acoustic energy created by the acoustic driver.
  • Ports 606, 608, 706, and 708 may be positioned to lower a volume stiffness which may occur at low frequencies. In such a situation, it may be desirable for a diaphragm to move as far as possible.
  • ports 606, 608, 706, and 708 may be positioned such that at low frequencies, there is an opening to the outside of the in-ear earphone. As frequency increases, the diameter and length is such that it becomes small with respect to wavelength, and it closes, acoustically. At high frequencies, it is a stiff back volume.
  • ear tip 602 of in-ear earphone 600 may include leg 610, leg 612, and port 608 positioned between legs 610 and 612. Port 608 may mate with port 606 of a front cavity enclosure of earbud 604.
  • ear tip 602 may be a small ear tip and may be formed from a pliable material to surround at least the front cavity enclosure of earbud 604.
  • ear tip 702 of in-ear earphone 700 may include leg 710, leg 712, and port 708 positioned between legs 710 and 712. Port 708 may mate with port 706 of a front cavity enclosure of earbud 704.
  • ear tip 702 may be a medium ear tip and may be formed from a pliable material to surround at least the front cavity enclosure of earbud 704.
  • Ports 606, 608, 706, and 708 are positioned as described above so that they are not covered when in-ear earphones 600 and 700, respectively, are placed in an ear.
  • port 608 of small ear tip 602 may have a different size than port 708 of medium tip ear tip 702.
  • Ports 608 and 708 may be different lengths in order to allow each port to properly mate to their respective front cavity enclosure ports (e.g., ports 606 and 706) to properly form PEQ ports from the acoustic driver to the outside of the ear tip.
  • legs 610 and 612 of ear tip 602 and legs 710 and 712 of ear tip 702 may each be part a positioning and retaining structure of ear tips 602 and 702, respectively.
  • the positioning and retaining structure may include the port (e.g., port 608 or 708) positioned to mate with the port a front cavity enclosure (e.g., ports 606 and 706) of an earbud (e.g., earbud 604 or 704).
  • a front cavity enclosure e.g., ports 606 and 706
  • earbud e.g., earbud 604 or 704
  • legs 610 and 612 of ear tip 602 and legs 710 and 712 of ear tip 702 are shown for illustrative purposes only and that other positioning and retaining structures for ear tips compatible with earbuds having acoustic drivers with integrated frames and PEQ ports are within the scope of the present disclosure.
  • the occlusion effect and amount of bass audio received by the wearer of an in-ear ear phone may be related. For example, as occlusion effect is relieved as described above, the wearer may receive less bass audio.
  • one or more of resistance, silicone area, and mesh may be adjusted with respect to the PEQ ports described above. As the acoustic driver gets smaller and smaller, the PEQ port may approach 180 degrees of the acoustic driver. This may result in undesirable balance and/or rocking with respect to the acoustic driver. In an
  • an acoustic mesh or a resistive mesh may be positioned over one or more of ports 606, 608, 706, and 708 in order to tune the desired balance in audio response and occlusion effect.
  • an in-ear earphone may include one or more microphones.
  • a microphone may be positioned inside the earbud, outside the earbud, or outside the ear tip and may measure noise in order to cancel it. For example, it may be desirable for noise measured at an inside microphone go to be cancelled to zero.
  • a 4mm microphone may be positioned on a flexible printed circuit board which may be foldable and in communication with electronic circuitry. The microphone may be positioned to prevent it from contacting earwax, sweat, or other substances which may damage the microphone.
  • the techniques and features described in the present disclosure may be implemented to save space in an earbud assembly without requiring any changes or significant changes to the design or interior components of the acoustic driver and/or diaphragm itself.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Headphones And Earphones (AREA)

Abstract

Un écouteur bouton peut comprendre un pilote acoustique. Le pilote acoustique peut comprendre une membrane et un circuit magnétique. Une structure du pilote acoustique peut être intégrée à l'écouteur bouton.
PCT/US2018/022601 2017-03-20 2018-03-15 Structure d'écouteur bouton pour pilote acoustique et embout auriculaire complémentaire Ceased WO2018175192A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP18716047.8A EP3603098A1 (fr) 2017-03-20 2018-03-15 Structure d'écouteur bouton pour pilote acoustique et embout auriculaire complémentaire

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020140456A1 (fr) * 2019-01-05 2020-07-09 深圳市韶音科技有限公司 Dispositif haut-parleur
US11166094B2 (en) 2019-01-05 2021-11-02 Shenzhen Voxtech Co., Ltd. Loudspeaker device
US11272292B2 (en) 2019-01-05 2022-03-08 Shenzhen Shokz Co., Ltd. Loudspeaker apparatus
US11303987B2 (en) 2019-01-05 2022-04-12 Shenzhen Shokz Co., Ltd. Loudspeaker apparatus

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD853360S1 (en) * 2017-07-07 2019-07-09 Onkyo Corporation Earphone
USD858488S1 (en) * 2017-08-07 2019-09-03 Shenzhen Sabbat Technology Development Co., Ltd. Pair of bluetooth headphones
USD866532S1 (en) * 2017-10-12 2019-11-12 Libratone A/S Earphone component
WO2019144338A1 (fr) * 2018-01-25 2019-08-01 易力声科技(深圳)有限公司 Écouteur bluetooth
USD870710S1 (en) * 2018-08-16 2019-12-24 Guangzhou Lanshidun Electronic Limited Company Earphone
CN112640487B (zh) * 2018-09-12 2023-04-25 歌尔股份有限公司 耳机及用于制造耳机的方法
CN209017252U (zh) * 2018-11-19 2019-06-21 深圳市蓝禾技术有限公司 耳塞
US10993009B2 (en) * 2019-01-07 2021-04-27 Bose Corporation Earphone
USD933048S1 (en) * 2019-06-11 2021-10-12 Lg Electronics Inc. Wireless earbud
USD932469S1 (en) * 2019-06-11 2021-10-05 Lg Electronics Inc. Wireless earbud
JP7419177B2 (ja) * 2020-06-30 2024-01-22 小林製薬株式会社 耳介用温熱具
USD910602S1 (en) * 2020-07-30 2021-02-16 Shenzhen Humboldt Technology Co., Ltd Earbud

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007005221A1 (fr) * 2005-07-01 2007-01-11 Plantronics, Inc. Casque avec une partie de haut-parleur rétractable
US20110051981A1 (en) * 2009-09-03 2011-03-03 Akg Acoustics Gmbh In-Ear Earphone
US20120237074A1 (en) * 2011-03-15 2012-09-20 Apple Inc. Seamless earbud structures and methods for making the same
US20140140565A1 (en) * 2012-11-21 2014-05-22 Ozaki International Co., Ltd. In-ear earphone
US9036853B2 (en) 2010-08-16 2015-05-19 Bose Corporation Earpiece positioning and retaining
US20150181341A1 (en) * 2013-12-19 2015-06-25 Apple Inc. Three part membrane speaker

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2482148A (en) 1945-09-10 1949-09-20 Beckman Carl Electrodynamic telephone handset
US4327257A (en) 1979-09-10 1982-04-27 Schwartz Leslie H Alignment device for electro-acoustical transducers
US7602933B2 (en) * 2004-09-28 2009-10-13 Westone Laboratories, Inc. Conformable ear piece and method of using and making same
KR100722687B1 (ko) * 2006-05-09 2007-05-30 주식회사 비에스이 부가적인 백 챔버를 갖는 지향성 실리콘 콘덴서 마이크로폰
US7916888B2 (en) 2006-06-30 2011-03-29 Bose Corporation In-ear headphones
US8594351B2 (en) 2006-06-30 2013-11-26 Bose Corporation Equalized earphones
US8688036B2 (en) * 2006-08-31 2014-04-01 Red Tail Hawk Corporation Wireless communications headset system employing a loop transmitter that fits around the pinna
JP2009153103A (ja) * 2007-10-02 2009-07-09 Phitek Systems Ltd ノイズ低減イヤホン用の構成部分
CN201222797Y (zh) 2008-03-27 2009-04-15 杨人翰 具有耳机功能的喇叭
US8792669B2 (en) * 2008-05-21 2014-07-29 Phonak Ag Earphone system and use of an earphone system
AU2010242811B2 (en) * 2009-04-30 2015-09-03 Harman International Industries, Inc. Earpiece system
JP5608667B2 (ja) 2010-04-14 2014-10-15 パナソニック株式会社 スピーカ、補聴器、インナーイヤーヘッドホン、携帯型情報処理装置、およびａｖ機器
US9288565B2 (en) * 2010-12-23 2016-03-15 Cardas Audio Ltd. Earphone system
WO2013114872A1 (fr) 2012-01-30 2013-08-08 パナソニック株式会社 Haut-parleur, casque d'écoute de l'oreille interne fourni avec un haut-parleur et une prothèse auditive
EP2811757B1 (fr) * 2012-01-30 2016-05-25 Panasonic Intellectual Property Management Co., Ltd. Écouteur
US8737665B2 (en) * 2012-03-30 2014-05-27 Eastern Technologies Holding Limited Negative pressure earphone
US9269342B2 (en) * 2012-05-25 2016-02-23 Bose Corporation In-ear active noise reduction earphone
US9082388B2 (en) * 2012-05-25 2015-07-14 Bose Corporation In-ear active noise reduction earphone
US8744111B2 (en) * 2012-09-04 2014-06-03 Eastern Technologies Holding Limited Earphone with tension diaphragm
US9167334B2 (en) * 2013-01-21 2015-10-20 Patrick R. Triato Adjustable mechanism for securing in-ear audio device
US9264792B2 (en) * 2013-09-06 2016-02-16 Plantronics, Inc. Ear tip with stabilizer
US9301040B2 (en) * 2014-03-14 2016-03-29 Bose Corporation Pressure equalization in earphones
US9900681B2 (en) * 2015-03-05 2018-02-20 Inca Street Sound, LLC Earbud headphone adapter
US9615158B2 (en) * 2015-03-08 2017-04-04 Bose Corporation Earpiece
CN105392080B (zh) * 2015-11-30 2018-11-20 中名(东莞)电子有限公司 一种新型自适应耳套

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007005221A1 (fr) * 2005-07-01 2007-01-11 Plantronics, Inc. Casque avec une partie de haut-parleur rétractable
US20110051981A1 (en) * 2009-09-03 2011-03-03 Akg Acoustics Gmbh In-Ear Earphone
US9036853B2 (en) 2010-08-16 2015-05-19 Bose Corporation Earpiece positioning and retaining
US20120237074A1 (en) * 2011-03-15 2012-09-20 Apple Inc. Seamless earbud structures and methods for making the same
US20140140565A1 (en) * 2012-11-21 2014-05-22 Ozaki International Co., Ltd. In-ear earphone
US20150181341A1 (en) * 2013-12-19 2015-06-25 Apple Inc. Three part membrane speaker

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020140456A1 (fr) * 2019-01-05 2020-07-09 深圳市韶音科技有限公司 Dispositif haut-parleur
US11159877B2 (en) 2019-01-05 2021-10-26 Shenzhen Voxtech Co., Ltd. Speaker device
US11166094B2 (en) 2019-01-05 2021-11-02 Shenzhen Voxtech Co., Ltd. Loudspeaker device
US11197084B2 (en) 2019-01-05 2021-12-07 Shenzhen Voxtech Co., Ltd. Loudspeaker apparatus
US11272292B2 (en) 2019-01-05 2022-03-08 Shenzhen Shokz Co., Ltd. Loudspeaker apparatus
US11303987B2 (en) 2019-01-05 2022-04-12 Shenzhen Shokz Co., Ltd. Loudspeaker apparatus
US11310582B2 (en) 2019-01-05 2022-04-19 Shenzhen Shokz Co., Ltd. Loudspeaker apparatus
US11336988B2 (en) 2019-01-05 2022-05-17 Shenzhen Shokz Co., Ltd. Loudspeaker apparatus
US11678102B2 (en) 2019-01-05 2023-06-13 Shenzhen Shokz Co., Ltd. Speaker device

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