WO2018158754A1 - Cooling and ventilation device, cooling hat, cooling shoe and cooling backpack - Google Patents

Abstract

A cooling and ventilation device (10), a cooling hat (20), a cooling shoe and a cooling backpack. The cooling and ventilation device (10) comprises: a housing (100), a ventilation assembly (200), a heat conduction frame (300) and a cooling assembly (400). Two ends of the housing (100) are respectively provided with an air inlet (110) and an air outlet (120). The ventilation assembly (200) is arranged at the position of the air inlet (110), and is used for bringing air into the housing (100). The heat conduction frame (300) is arranged within the housing (100). The cooling assembly (400) comprises semiconductor cooling plates (410) and heat conduction film layers (420), the semiconductor cooling plates (410) being arranged on the heat conduction frame (300), the heat conduction film layers (420) being attached to the side surfaces of the semiconductor cooling plates (410) away from the heat conduction frame (300). When the semiconductor cooling plates (410) are turned on, the sides of the semiconductor cooling plates (410) connected to the heat conduction film layers (420) are cooling ends, and heat in the air entering from the external environment can be absorbed by the heat conduction frame (300) in a rapid and timely manner. Thus, a cooling operation is performed on the air entering from the external environment in a rapid and timely manner, thereby ensuring that an airflow discharged from the air outlet (120) is a cold airflow.

Description

 Refrigeration and ventilation equipment, refrigeration hats, refrigeration shoes and refrigeration backpacks

Technical field

 The invention relates to the field of refrigeration technology, in particular to a refrigeration and ventilation device, a refrigeration hat, a cooling shoe and a refrigeration backpack. Background technique

 For example, ventilation, also known as ventilation, is to send enough fresh air into the indoor space by mechanical or natural means, and to discharge the dirty air whose indoor air does not meet the hygienic requirements, so that the indoor air meets the requirements and the production process needs. The facilities that complete the ventilation work in the building are collectively referred to as ventilation equipment. Ventilation equipment, dust removal and purification equipment, repellent fan, fire fan, centrifugal fan, water spray injector, air purifier, dust exhaust fan, electrostatic fume purifier, centrifugal fire exhaust fan, fire cabinet centrifugal fan, luxury cabinet Centrifugal fan, energy saving and environmental protection air conditioner, powerful exhaust fan, C6-48 centrifugal fan, 4-72 centrifugal fan, pulse dust collector, cyclone dust collector, purification tower, single-sided single-station water rejection.

 However, conventional ventilation equipment still has a problem of poor cooling performance.

 Another example is that the hat has the functions of sunshade, decoration, warming and protection. Therefore, there are many types, and there are also some choices. First choose the appropriate hat based on the face. Second, choose a hat according to your body. Wearing a hat and dressing, try to avoid weaknesses. The form and color of the hat must be matched with the clothing. However, the traditional hat is still difficult to solve the uncomfortable feeling of the human body caused by sweating during daily travel, that is, the heat dissipation effect is poor.

 Another example is the dress that is carried on the back when marching or going out. Diversified materials, leather, plastic, polyester, canvas, nylon, cotton and other texture bags lead the fashion trend. At the same time, in the period of more and more advertised personality, simple, retro, cartoon and other styles also cater to the needs of fashion people to promote individuality from different aspects. The style of the luggage is also extended from traditional business bags, school bags, travel bags to pencil cases, coin purses, small sachets and so on. However, the traditional backpack is still difficult to solve the uncomfortable feeling of sweating due to back heat during travel, that is, the heat dissipation effect is poor.

Another example is the creation of shoes that are inseparable from the natural environment and human wisdom. Ancient times, land high and low Not afraid, the cold and hot weather of the climate, human instinctively want to protect their feet, so there are shoes: simple bandaged hides, leaves, became the earliest shoes in human history. However, with the advancement of human society and the improvement of people's quality of life, it is inevitable that the discomfort caused by fever and sweating during walking will be poor, that is, the heat dissipation effect is poor. Summary of the invention

 In view of this, it is necessary to provide a refrigerating and ventilation device, a refrigerating hat, a cooling shoe, and a refrigerating backpack in response to the above drawbacks.

 A refrigeration and ventilation device, comprising:

 An outer casing, and two ends of the outer casing are respectively provided with an air inlet and an air outlet;

 a ventilation assembly, the ventilation assembly is disposed at the air inlet position for blowing air into the outer casing;

 a heat conducting frame, the heat conducting frame being disposed in the outer casing; and

 a refrigerating unit, the refrigerating unit includes a semiconductor refrigerating sheet and a heat conductive film layer, the semiconductor refrigerating sheet is disposed on the heat conducting frame, and the heat conducting film layer is attached to a side of the semiconductor refrigerating sheet away from the heat conducting frame on.

 In one embodiment, the refrigeration and ventilation device further includes a circuit module, and a mounting cavity is disposed between the heat conducting frame and the inner sidewall of the outer casing, and the circuit module is received in the mounting cavity. In one embodiment, the ventilation assembly includes a motor and a blade, the blade is disposed at the position of the air inlet, and the motor is coupled to the blade for driving the blade to rotate.

 In one embodiment, the refrigeration and ventilation device further includes a mounting base, and the outer casing is disposed on the mounting base.

 In one embodiment, the refrigeration and ventilation device further includes a circuit module, the circuit module is received in the mounting base, and the circuit module is respectively electrically connected to the ventilation component and the semiconductor refrigeration chip Sexual connection.

In one embodiment, the mounting base is provided with a heat dissipation channel, and the heat dissipation channel is respectively connected to the external environment and the internal space of the mounting base. In one embodiment, the heat conducting frame has a hollow triangular prism structure, and an outer surface of the heat conducting frame is provided with three mounting surfaces connected in sequence;

 The refrigerating and ventilating device is provided with a plurality of the refrigerating components, and the semiconductor refrigerating sheets of each of the refrigerating components are disposed correspondingly on one of the mounting surfaces, and each of the thermal conductive film layers is attached one by one The semiconductor refrigerating sheet is away from a side surface of the corresponding heat conducting frame.

 In one embodiment, the inner side wall of the outer casing is provided with a card rail, and the heat conducting frame is disposed at a joint of two adjacent mounting surfaces, and the card rail is slidably embedded in the card. Within the bit.

 In one embodiment, a plurality of heat conducting fins are disposed in the heat conducting frame, and each of the heat conducting fins is spaced apart.

 In one embodiment, the thermally conductive film layer is a nanographite sheet or a nanographene sheet.

 In one embodiment, the thermally conductive film layer has a thermal conductivity greater than 400 W/(nvK).

 In one embodiment, the outer casing has a cross section of a circular ring structure, and the inner diameter of the annular structure is 8 cm to 10 cm;

 The outer casing has an ellipsoidal structure, and the outer casing has a length of 10 cm to 13 cm;

 The thermally conductive film layer has a rectangular cross section, the rectangular structure has a length of 8 cm - 10 cm and a width of 5 cm ~ 8 cm;

 The semiconductor cooling sheet has a cross section of a square structure having a side length of 4 cm to 6 cm.

 In one embodiment, the area of the air inlet is larger than the area of the air outlet, and the inner side wall of the outer casing has an arc structure, and an enhanced wind is formed between the inner side wall of the outer casing and the heat conductive film layer. The air passages are respectively connected to the air inlet and the air outlet.

When the semiconductor refrigerating sheet of the refrigerating and ventilation device is energized, the side where the semiconductor refrigerating sheet is connected to the heat conducting frame is a heat generating end, and the heat conducting frame is for absorbing heat generated from the cooling unit during cooling. The side of the semiconductor refrigerating sheet connected to the thermal conductive film layer is a refrigerating end, and since the thermally conductive film layer has excellent thermal conductivity, heat in the air entering the external environment can be quickly and timely absorbed by the thermal conductive film layer, thereby entering the external environment. The air is subjected to a fast and timely cooling operation to ensure that the airflow exiting the air outlet is a cold air flow. In addition, when the positive and negative poles of the current flowing into the semiconductor refrigerating sheet are changed, the heating end and the refrigerating end of the semiconductor refrigerating sheet can be switched, and the inflowing air can be quickly and timely heated by the thermally conductive film layer. The effect of ventilation and heating.

 A refrigeration hat comprising:

 Hat body, and

 a refrigerating unit, the refrigerating unit includes a semiconductor refrigerating sheet and a heat conductive film layer, the semiconductor refrigerating sheet is disposed on an inner sidewall of the cap body, and the heat conducting film layer is attached to the semiconductor refrigerating sheet away from the cap body One side of the inner side wall.

 In one embodiment, the cap body includes a cap shell and an inner cloth layer, the semiconductor refrigerating sheet is disposed on an inner sidewall of the cap shell, and the heat conductive film layer is attached to the semiconductor refrigerating sheet away from the On one side of the inner side wall of the cap case, the cloth layer is attached to a side surface of the heat conductive film layer away from the semiconductor refrigeration sheet.

 In one embodiment, the cap is provided with a plurality of venting micropores, each of the venting micropores being in communication with an external environment and a side of the semiconductor refrigerating sheet away from the thermally conductive film layer.

 In one embodiment, the refrigerating cap further includes a solar cell assembly and a brim, the brim is stuck on the cap body, and the solar cell module is disposed on the brim, the solar cell The group is electrically connected to the semiconductor cooling sheet.

 In one embodiment, the refrigerating cap further includes a circuit module, the cap body is provided with a mounting area, the circuit module is mounted on the mounting area, and the circuit module and the semiconductor refrigeration A piece of electrical connection.

 In one embodiment, the refrigerating cap further includes a push switch, the push switch is disposed on the cap body, and the push switch is electrically connected to the circuit module and the semiconductor refrigerating sheet respectively. Controlling the communication or disconnection of the semiconductor refrigeration chip from the circuit module.

 In one embodiment, the refrigerating cap further includes a metal supporting piece, the metal supporting piece has an arc structure, the metal supporting piece is disposed on the cap body, and the surface of the metal supporting piece is provided with a nanometer. Silver coating.

 In one embodiment, the refrigerating cap further includes a micro fan disposed on the cap body for blowing air from the cap body to an external environment.

In one embodiment, the thermally conductive film layer is provided with a ventilation passage for introducing air in an external environment into the cap body. The above-mentioned refrigerating cap is based on the cooling or heating action of the semiconductor refrigerating sheet, and the rapid thermal conduction of the thermal conductive film layer enables the refrigerating hat to achieve the cooling effect, improving the comfort and the heat dissipating effect. In addition, by changing the positive and negative currents of the current flowing into the semiconductor refrigerating sheet, it is also possible to achieve a heating effect in cold weather.

 A refrigerating shoe comprising:

 Shoe body, and

 The refrigeration unit includes a semiconductor refrigerating sheet and a heat conductive film layer. The semiconductor refrigerating sheet is disposed on the shoe body, and the heat conductive film layer is attached to the semiconductor refrigerating sheet.

 The above-mentioned refrigerating shoes can provide a cooling effect, especially in the hot weather season, wearing more comfortable, and the production cost is not high.

 A refrigerating assembly, comprising the refrigerating assembly according to any of the preceding claims, further comprising a backpack body and a mounting seat, wherein the mounting seat is disposed on the backpack body, and the refrigerating assembly is disposed in the mounting seat, The air outlet of the outer casing communicates with an inner space of the backpack body.

 The above-mentioned refrigerated backpack can achieve the effect of ventilation and cooling, especially in the hot weather season, wearing more comfortable, and the production cost is not high.

DRAWINGS

 1 is a schematic structural view of a refrigeration and ventilation device according to an embodiment of the present invention;

 2 is a schematic structural view of another angle of the refrigeration and ventilation device shown in FIG. 1;

 3 is a schematic structural view of another angle of the refrigeration and ventilation device shown in FIG. 1;

 4 is a schematic structural view of a refrigeration and ventilation device according to another embodiment of the present invention;

 Figure 5 is a schematic view showing the internal structure of a refrigeration and ventilation device according to an embodiment of the present invention;

 6 is a schematic view showing the internal structure of a refrigeration and ventilation device according to another embodiment of the present invention;

 7 is a schematic view showing the internal structure of a refrigeration and ventilation device according to another embodiment of the present invention;

 8 is a schematic structural view of a heat conduction frame according to an embodiment of the present invention;

 9 is a schematic structural view of a semiconductor refrigerating sheet and a thermally conductive film layer according to an embodiment of the present invention; FIG. 10 is a schematic structural view of a refrigerating cap according to an embodiment of the present invention;

Figure 11 is a schematic view showing the internal structure of another angle of the refrigerating cap shown in Figure 10; 12 is a partial structural schematic view of a refrigerating cap according to another embodiment of the present invention;

 Figure 13 is a schematic view showing the working state of a refrigerating cap according to another embodiment of the present invention. detailed description

 In order to facilitate the understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the invention are given in the drawings. However, the invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be more fully understood.

 It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or the element can be present. When an element is considered to be "connected" to another element, it can be directly connected to the other element or. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.

 All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terms used in the description of the present invention are for the purpose of describing the specific embodiments and are not intended to limit the invention. The term "and I or" as used herein includes any and all combinations of one or more of the associated listed items.

 Referring to FIG. 1 and FIG. 7 , the refrigeration and ventilation device 10 includes a casing 100 , a ventilation assembly 200 , a heat conduction frame 300 , and a refrigeration assembly 400 . The ventilation assembly 200 , the heat conduction frame 300 , and the refrigeration assembly 400 are all housed in the casing 100 . Disposed on the heat transfer frame 300, the ventilation assembly 200 is used to blow air into the outer casing 100.

 Referring to FIG. 1 and FIG. 2 together, the two ends of the outer casing 100 are respectively provided with an air inlet 110 and an air outlet 120. The outside air enters through the air inlet 110, and the air outlet 120 is discharged. In the process, the air enters. The air in the outer casing 100 is in contact with the refrigeration unit 400 to cool the air. Thus, referring to FIG. 5 together, the temperature of the air discharged from the air outlet 120 can be made lower than the air entering from the air inlet 110. Temperature, used for cooling and ventilation.

In one embodiment, the area of the air inlet is larger than the area of the air outlet, and the inner side wall of the outer casing has an isolated structure, and an air passage is formed between the inner side wall of the outer casing and the heat conductive film layer. Place The reinforcing air passage is respectively connected to the air inlet and the air outlet, for example, the outer casing has an ellipsoidal structure, so that according to aerodynamics, air of the external environment enters the outer casing, and When the refrigeration unit is in contact, that is, when the air is suddenly cooled, the flow rate of the air entering the air inlet can be increased, the air supply intensity can be increased, and the air supply amount can be increased and the flow from the air outlet can be increased. Air flow rate.

 Referring to Figure 1, the venting assembly 200 is disposed at the position of the air inlet 110, and the venting assembly 200 is for blasting air into the outer casing 100.

 In one embodiment, please refer to FIG. 3 and FIG. 4 together, the ventilation assembly 200 includes a motor 210 and a blade 220, the blade is disposed at the position of the air inlet, and the motor is connected to the blade. The fan blade is driven to rotate, so that the fan blade is rotated by the motor, and air in the external environment can be blown into the casing through the air inlet.

 Referring to Figure 7, the heat transfer frame 300 is disposed within the outer casing 100 for absorbing heat generated by the refrigeration assembly 400 during cooling.

 Referring to FIG. 7 , the refrigeration unit 400 includes a semiconductor refrigerating sheet 410 and a heat conductive film layer 420 . The semiconductor refrigerating sheet 410 is disposed on the heat conducting frame 300 , and the heat conducting film layer 420 is attached to a side of the semiconductor refrigerating sheet 410 away from the heat conducting frame 300 . Thus, when the semiconductor refrigerating sheet 410 is energized, the side where the semiconductor refrigerating sheet 410 is connected to the heat conducting frame 300 is a heat generating end, and the heat conducting frame 300 is for absorbing heat generated from the cooling unit 400 during cooling. The side where the semiconductor refrigerating sheet 410 is connected to the thermally conductive film layer 420 is a refrigerating end, and since the thermally conductive film layer 420 has excellent thermal conductivity, when air entering from the external environment comes into contact with the thermally conductive film layer 420, that is, from the external environment. The air is blown on the side of the thermally conductive film layer 420 away from the semiconductor refrigerating sheet 410, and the heat in the air entering the external environment can be quickly and timely absorbed by the thermal conductive film layer 420, thereby rapidly and timely cooling the air entering the external environment. It is ensured that the airflow discharged from the air outlet 120 is a cold air flow, so that a better ventilation and cooling operation can be achieved, and the structure is simpler and more compact.

It should be noted that the semiconductor refrigerating sheet is not limited to realizing a cooling operation, and when the positive and negative currents of the current flowing into the semiconductor refrigerating sheet are changed, the heating end and the refrigerating end of the semiconductor refrigerating sheet can be switched, and The air flowing in from the outside is quickly and timely heated by the heat conductive film layer 420 to provide ventilation and heat generation. In one embodiment, the heat conductive film layer is a nanographite sheet or a nanographene sheet; for example, the heat conductive film layer has a thermal conductivity greater than 400 W/(nrK), so that heat transfer of the heat conductive film layer can be improved. Rate, used to improve overall cooling or heating.

 In one embodiment, referring to FIG. 7 and FIG. 8, the heat conducting frame 300 has a hollow triangular prism structure, and the outer surface of the heat conducting frame 300 is provided with three mounting faces 310 which are sequentially connected. The refrigerating and ventilating device is provided with a plurality of refrigerating units 400, and the semiconductor refrigerating sheets 410 of each of the refrigerating units 400 are disposed on a mounting surface 310, and each of the heat conducting film layers 420 is attached to a semiconductor refrigerating sheet 410. On one side of the corresponding heat conducting frame 300, the overall structure of the heat conducting frame 300 can be optimized, the air intake amount can be increased, the smoothness of cooling or heating can be improved, and the overall structure can be more compact and compact. In addition, it increases the effective surface area of the heat exchange process for improved cooling or heating.

 In one embodiment, the inner side wall of the outer casing 100 is provided with a charging rail 130. The heat conducting frame 300 is disposed at a joint of two adjacent mounting surfaces, and is provided with a card position 320. The sliding rail 130 is slidably embedded in the card position 320. It not only improves the ease of installation and disassembly, but also improves the overall structure.

 In one embodiment, a plurality of heat-dissipating fins 330 are disposed in the heat-conducting frame 300, and the heat-dissipating fins 330 are spaced apart. Thus, by providing each of the heat-dissipating fins 330, the heat-absorbing capability of the heat-conducting frame 300 can be greatly improved, for example, The thickness of the heat-conducting fins 330 is from 1 mm to 1.5 mm, which can balance the effects of light weight and structural stability, and has an excellent heat conduction effect.

 In one embodiment, the heat conducting frame is further provided with a heat dissipating extension portion, one end of the heat dissipating extending portion is located on the heat conducting frame, and the other end of the heat dissipating extending portion protrudes outside the outer casing for improving heat dissipation The effect of reducing heat accumulation on the heat conducting frame, for example, one end portion of the heat dissipation extending portion is provided with a plurality of heat conducting connecting pieces, and each of the heat conducting connecting pieces is connected to one of the heat conducting fins one by one, The other end of the heat dissipation extension portion is provided with a plurality of heat dissipation fins, and each of the heat dissipation fins is exposed outside the outer casing, so that the heat dissipation effect is better.

In one embodiment, the refrigeration and ventilation device further includes the circuit module, and a mounting cavity is disposed between the heat conducting frame and the inner sidewall of the outer casing, and the circuit module is received in the mounting cavity. The circuit module is electrically connected to the ventilation component and the semiconductor refrigeration chip respectively. For example, the circuit module includes a power source, a circuit board and other electronic components, and can only ensure that the semiconductor refrigeration chip can be powered. Just fine. Referring to FIG. 6, the refrigeration and ventilation device further includes a mounting base 500. The outer casing 100 is disposed on the mounting base 500. Thus, the mounting base 500 can be used to support and fix the outer casing 100. For example, the outer casing is rotatably coupled to the mounting base, so that it is more convenient to adjust the direction of the wind.

 In one embodiment, the refrigeration and ventilation device further includes a circuit module, wherein the circuit module is received in the mounting base, and the circuit module is electrically connected to the ventilation component and the semiconductor refrigeration chip respectively Thus, the circuit module is easier to install and fix.

 In one embodiment, the mounting base is provided with a heat dissipation channel, and the heat dissipation channel is respectively connected to the external environment and the internal space of the mounting base, so that the heat generated by the circuit module can be quickly and timely discharged to external. For example, a micro fan is disposed in the heat dissipation channel or at the opening of the heat dissipation channel for improving heat dissipation efficiency.

 In one embodiment, the outer casing has a cross section of a circular ring structure, the inner diameter of the annular structure is 8 cm to 10 cm; the outer casing has an ellipsoidal structure, and the length of the outer casing is 10 cm to 13 cm; 9, the thermally conductive film layer 420 has a rectangular cross section, the rectangular structure has a length of 8 cm to 10 cm and a width of 5 cm to 8 cm; the semiconductor refrigerating sheet 410 has a square structure cross section, and the square structure has a side length of 4cm to 6cm, in this way, the components using the above parameters as a whole can effectively improve the '] cold or heating effect.

 When the semiconductor refrigerating sheet 410 of the above-described refrigerating and ventilation device 10 is energized, the side where the semiconductor refrigerating sheet 410 is connected to the heat conducting frame 300 is a heat generating end, and the heat conducting frame 300 is for absorbing heat generated from the refrigerating unit 400 during cooling. The side of the semiconductor refrigerating sheet 410 connected to the thermally conductive film layer 420 is a refrigerating end, and since the thermally conductive film layer 420 has excellent thermal conductivity, heat in the air entering the external environment can be quickly and timely absorbed by the thermally conductive film layer 420, and further The air entering the outside environment is quickly and timely cooled to ensure that the airflow from the air outlet 120 is a cold air flow. In addition, when the positive and negative poles of the current flowing into the semiconductor refrigerating sheet are changed, the heat generating end and the refrigerating end of the semiconductor refrigerating sheet can be switched, and the inflowing air can be heated quickly and in time through the thermally conductive film layer 420. To the effect of ventilation and heating.

As shown in FIG. 10 and FIG. 11 , the refrigerating cap 20 includes a cap body 600 and a refrigerating component 700 . The refrigerating component 700 includes a semiconductor refrigerating sheet 710 and a heat conductive film layer 720 . The semiconductor refrigerating sheet 710 is disposed on the inner sidewall of the cap body 600 . The thermal conductive film layer 720 is attached to the semiconductor refrigerating sheet 710 away from the hat On one side of the inner side wall of the body 600, such that, based on the cooling or heating action of the semiconductor refrigerating sheet 710, and the rapid thermal conduction of the thermally conductive film layer 720, the refrigerating hat 20 can achieve the effect of cooling, improving comfort and heat dissipation. . Further, by changing the positive and negative currents of the current supplied to the semiconductor refrigerating sheet 710, it is also possible to achieve a heating effect in cold weather.

 In one embodiment, the cap body includes a cap shell and an inner cloth layer, the semiconductor refrigerating sheet is disposed on an inner sidewall of the cap shell, and the heat conductive film layer is attached to the semiconductor refrigerating sheet away from the cap On one side of the inner side wall of the case, the cloth layer is attached to one side of the heat conductive film layer away from the semiconductor cooling sheet, so that the semiconductor cooling sheet can be better mounted.

 In one embodiment, the cap is provided with a plurality of ventilation micropores, and each of the ventilation micropores communicates with an external environment and a side of the semiconductor refrigerating sheet away from the thermal conductive film layer, so that the ventilation holes can be quickly The heat of the hot end of the semiconductor refrigerating sheet is quickly dissipated to the outside.

 Referring to FIG. 10, the refrigerating cap further includes a solar cell assembly 800 and a brim 900, the brim is stuck on the cap body, and the solar cell module is disposed on the brim, the solar cell The group is electrically connected to the semiconductor refrigerating sheet, and thus can function to supply power to the semiconductor refrigerating sheet. Of course, the semiconductor cooling sheet can also be battery-powered, and is not limited to the solar battery module.

 In one embodiment, the refrigerating cap further includes a circuit module, the cap body is provided with a mounting area, the circuit module is mounted on the mounting area, and the circuit module and the semiconductor refrigeration chip are electrically The circuit module is configured to control the operation of the semiconductor refrigeration chip.

 Referring to FIG. 11 and FIG. 12, the refrigerating cap further includes a push switch 900a. The push switch is disposed on the cap body, and the push switch is respectively electrically connected to the circuit module and the semiconductor refrigeration chip. The connection is used to control the connection or disconnection of the semiconductor refrigerating sheet and the circuit module, so that the operation of the semiconductor refrigerating sheet is more convenient and the user experience is higher.

 In one embodiment, the refrigerating cap further includes a metal supporting piece, the metal supporting piece has an isolated structure, the metal supporting piece is disposed on the cap body, and the surface of the metal supporting piece is provided with a nano silver coating The layer, in this way, can play a supporting and fixing effect on the whole structure, and can also play a role of sterilization and bacteriostasis, and is favorable for maintaining the cleanliness of the refrigerating cap.

Referring to FIG. 13, the refrigerating cap further includes a micro fan 900b, and the micro fan is disposed at the The cap body is configured to blow air from the body of the cap to an external environment, so that the heat dissipation and cooling effect can be improved.

 In one embodiment, the heat conductive film layer is provided with a ventilation passage for introducing air in an external environment into the hat body, thereby facilitating ventilation and exhaust, and improving heat dissipation and cooling effects.

 In another example, a refrigerating shoe includes: a shoe body and a refrigerating unit, the refrigerating unit includes a semiconductor refrigerating sheet and a heat conductive film layer, the semiconductor refrigerating sheet is disposed on the shoe body, and the heat conducting film layer is attached Attached to the semiconductor refrigeration sheet. For example, the refrigeration assembly is the refrigeration assembly of any of the above embodiments.

 Still another example is a refrigerating backpack, comprising the refrigerating assembly according to any of the above embodiments, further comprising a backpack body and a mounting seat, the mounting seat is disposed on the backpack body, and the refrigerating assembly is disposed at the In the mounting seat, the air outlet of the outer casing communicates with an inner space of the backpack body. For example, the refrigeration assembly is the refrigeration assembly of any of the above embodiments.

 The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.

 The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims

Claim  1. A refrigeration and ventilation device, comprising:  An outer casing, and two ends of the outer casing are respectively provided with an air inlet and an air outlet;  a ventilation assembly, the ventilation assembly is disposed at the air inlet position for blowing air into the outer casing;  a heat conducting frame, the heat conducting frame being disposed in the outer casing; and  a refrigerating unit, the refrigerating unit includes a semiconductor refrigerating sheet and a heat conductive film layer, the semiconductor refrigerating sheet is disposed on the heat conducting frame, and the heat conducting film layer is attached to a side of the semiconductor refrigerating sheet away from the heat conducting frame on.  2. The refrigerating and ventilating apparatus according to claim 1, wherein the refrigerating and ventilating device further comprises a circuit module, and a mounting cavity is disposed between the heat conducting frame and an inner sidewall of the outer casing, and the circuit module The assembly is disposed in the mounting cavity, and the circuit module is electrically connected to the ventilation component and the semiconductor refrigeration chip, respectively.  3. The refrigerating and ventilating apparatus according to claim 1, wherein the ventilation unit comprises a motor and a blade, the blade is disposed at the position of the air inlet, and the motor is connected to the blade , for driving the fan blade to rotate.  4. The refrigerating and ventilating apparatus according to claim 1, wherein the refrigerating and ventilation device further comprises a mounting base, and the outer casing is disposed on the mounting base.  The refrigerating and ventilating device according to claim 4, wherein the refrigerating and ventilating device further comprises a circuit module, wherein the circuit module is received in the mounting base, and the circuit module is respectively The ventilation component and the semiconductor refrigeration chip are electrically connected.  The refrigerating and ventilating device according to claim 5, wherein the mounting base defines a heat dissipation channel, and the heat dissipation channel is respectively connected to an external environment and an internal space of the mounting base.  The refrigerating and ventilating device according to claim 1, wherein the heat conducting frame has a hollow triangular prism structure, and an outer surface of the heat conducting frame is provided with three mounting surfaces connected in sequence; The refrigerating and ventilating device is provided with a plurality of the refrigerating components, and the semiconductor refrigerating sheets of each of the refrigerating components are disposed correspondingly on a mounting surface, and each of the thermal conductive film layers is in one-to-one correspondence Attached to one of the semiconductor refrigerating sheets away from a side surface of the corresponding heat conducting frame. The refrigerating and ventilating device according to claim 7, wherein the inner side wall of the outer casing is provided with a card rail, and the heat conducting frame is provided with a card position at a joint of two adjacent mounting surfaces. The track rail is slidingly embedded in the card slot.  The refrigerating and ventilating device according to claim 7, wherein the heat conducting frame is provided with a plurality of heat conducting fins, and each of the heat conducting fins is spaced apart.  The refrigerating and ventilating device according to claim 1, wherein the thermally conductive film layer is a nanographite sheet or a nanographene sheet.  The refrigerating and ventilating apparatus according to claim 1, wherein the heat conductive film layer has a thermal conductivity greater than 400 W/(m'K).  The refrigerating and ventilating apparatus according to claim 1, wherein the outer casing has a cross section of a circular ring structure, and the inner diameter of the annular structure is 8 cm to 10 cm;  The outer casing has an ellipsoidal structure, and the outer casing has a length of 10 cm to 13 cm;  The thermally conductive film layer has a rectangular cross section, the rectangular structure has a length of 8 cm to 10 cm and a width of 5 cm to 8 cm;  The semiconductor cooling sheet has a cross section of a square structure having a side length of 4 cm to 6 cm.  13. The refrigerating and ventilating apparatus according to claim 1, wherein an area of the air inlet is larger than an area of the air outlet, and an inner side wall of the outer casing has an arc structure, and an inner side wall of the outer casing is An enhanced air passage is formed between the heat conductive film layers, and the enhanced air passage is respectively connected to the air inlet and the air outlet.  14. A refrigeration hat, comprising:  Hat body, and  a refrigerating unit, the refrigerating unit includes a semiconductor refrigerating sheet and a heat conductive film layer, the semiconductor refrigerating sheet is disposed on an inner sidewall of the cap body, and the heat conducting film layer is attached to the semiconductor refrigerating sheet away from the cap body One side of the inner side wall. The refrigerating hat according to claim 14, wherein the cap body comprises a cap shell and an inner cloth layer, and the semiconductor refrigerating sheet is disposed on an inner sidewall of the cap shell, and the heat conductive film layer is attached Attached to the side surface of the semiconductor refrigerating sheet away from the inner side wall of the cap, the cloth layer is attached The thermally conductive film layer is away from a side of the semiconductor refrigeration sheet.  The refrigerating cap according to claim 14, wherein the cap is provided with a plurality of ventilation micropores, and each of the ventilation micropores is away from the external environment and the semiconductor refrigerating sheet away from the thermal conductive film One side of the layer is connected.  The refrigerating hat according to claim 14, wherein the refrigerating cap further comprises a solar cell module and a brim, the brim is stuck on the cap body, and the solar cell module is disposed at the On the brim, the solar cell is electrically connected to the semiconductor refrigerating sheet.  The refrigerating hat according to claim 14, wherein the refrigerating cap further comprises a circuit module, wherein the cap body is provided with a mounting area, and the circuit module is mounted on the mounting area, The circuit module is electrically connected to the semiconductor refrigeration chip.  The refrigerating hat according to claim 18, wherein the refrigerating cap further comprises a push switch, the push switch is disposed on the cap body, and the push switch is respectively connected to the circuit module and the The semiconductor refrigeration chip is electrically connected to control communication or disconnection between the semiconductor refrigeration chip and the circuit module.  The refrigerating hat according to claim 14, wherein the refrigerating cap further comprises a metal supporting piece, the metal supporting piece has an isolated structure, and the metal supporting piece is disposed on the cap body. The surface of the metal support sheet is provided with a nano silver coating.  The refrigerating hat according to claim 14, wherein the refrigerating cap further comprises a micro fan, wherein the micro fan is disposed on the cap body for blowing air from the cap body to the outside Environment.  The refrigerating cap according to claim 21, wherein the heat conductive film layer is provided with a ventilation passage for introducing air in an external environment into the cap body.  23. A refrigerating shoe, characterized by comprising:  Shoe body, and  The refrigeration unit includes a semiconductor refrigerating sheet and a heat conductive film layer. The semiconductor refrigerating sheet is disposed on the shoe body, and the heat conductive film layer is attached to the semiconductor refrigerating sheet. A refrigerating backpack, comprising: the refrigerating assembly according to any one of claims 1 to 13, further comprising a backpack body and a mounting seat, The mounting seat is disposed on the backpack body, and the cooling component is disposed in the mounting seat, and the air outlet of the outer casing communicates with an inner space of the backpack body.