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WO2018141621A3 - Power module - Google Patents

Power module Download PDF

Info

Publication number
WO2018141621A3
WO2018141621A3 PCT/EP2018/051816 EP2018051816W WO2018141621A3 WO 2018141621 A3 WO2018141621 A3 WO 2018141621A3 EP 2018051816 W EP2018051816 W EP 2018051816W WO 2018141621 A3 WO2018141621 A3 WO 2018141621A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact piece
power module
electric component
frame
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2018/051816
Other languages
German (de)
French (fr)
Other versions
WO2018141621A2 (en
Inventor
Michael Kaspar
Kai Kriegel
Stefan Stegmeier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2018141621A2 publication Critical patent/WO2018141621A2/en
Publication of WO2018141621A3 publication Critical patent/WO2018141621A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W40/43—
    • H10W40/47—
    • H10W70/611—
    • H10W72/0198—
    • H10W74/141—
    • H10W76/138—
    • H10W90/00—
    • H10W90/401—
    • H10W72/01315—
    • H10W72/073—
    • H10W72/07327—
    • H10W72/07331—
    • H10W72/07332—
    • H10W72/07336—
    • H10W72/07337—
    • H10W72/07352—
    • H10W72/07354—
    • H10W72/321—
    • H10W72/325—
    • H10W72/347—
    • H10W72/352—
    • H10W72/353—
    • H10W72/354—
    • H10W72/381—
    • H10W72/385—
    • H10W72/59—
    • H10W72/952—
    • H10W90/734—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a power module comprising at least one electric component (10, 90) having a contact surface (50, 95), wherein the electric component (10, 90) is electrically contacted by means of the contact surface (50, 95) on at least one contact piece (100), formed from an open-pore material, of the power module and the at least one electric component (10, 90) and the at least one contact piece (100) are fixed relative to each other at least in a positive fit, at least in directions of the flat extensions of the at least one contact surface (50, 95), in particular using a frame of the power module (70, 300) which comprises, preferably in the direction of the flat extensions, openings extending through the contact surfaces (50, 95). The frame (70) can comprise projections (80) which extend transversely, preferably perpendicularly, to the contact surfaces (50, 95) of the at least one electrical component (10, 90) and form in particular guiding means by means of which the electric component (10, 90) and/or the contact piece (100) can be guided or are guided relative to each other in any position in which the contact piece (100) and the electric component (10, 90) are fixed relative to each other. Alternatively, the frame (300) can be formed by means of frame plates which are cut out from a wafer, together with the power components (90) in the form of projecting frames which form the frame plates (300) after embedding individual power components (90) in a mould wafer (302). Said frame plates (300) are set in, for example cast, with the edge areas in lateral walls (305) of a housing of the claimed power module. Advantageously, in the claimed power module, the claimed open-pored material of the at least one contact piece (100) for guiding the coolant, in particular the cooling liquid, is particularly suitable due to its pores. In particular, the material of the at least one contact piece (100) has an open cell structure. In this way, in particular, a coolant or a cooling liquid can be guided through the contact piece (100) and thus at least one power component is efficiently heated.
PCT/EP2018/051816 2017-02-06 2018-01-25 Power module Ceased WO2018141621A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE102017201821.6 2017-02-06
DE102017201821 2017-02-06
DE102017001249 2017-02-09
DE102017001249.0 2017-02-09
DE102017203132.8 2017-02-27
DE102017203132.8A DE102017203132A1 (en) 2017-02-06 2017-02-27 power module

Publications (2)

Publication Number Publication Date
WO2018141621A2 WO2018141621A2 (en) 2018-08-09
WO2018141621A3 true WO2018141621A3 (en) 2018-10-25

Family

ID=62910198

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/051816 Ceased WO2018141621A2 (en) 2017-02-06 2018-01-25 Power module

Country Status (2)

Country Link
DE (1) DE102017203132A1 (en)
WO (1) WO2018141621A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019204847A1 (en) * 2019-04-04 2020-10-08 Siemens Aktiengesellschaft Device for cooling electrical and / or electronic components
TWI719517B (en) * 2019-06-27 2021-02-21 立昌先進科技股份有限公司 Package method for attached single small size and array type of chip semiconductor component
DE102020134563A1 (en) 2020-12-22 2022-06-23 Danfoss Silicon Power Gmbh Power module and method of manufacturing a power module
DE102021209482A1 (en) * 2021-08-30 2023-03-02 Robert Bosch Gesellschaft mit beschränkter Haftung Electronic module with at least one power semiconductor and method for its production

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1104515A (en) * 1964-08-08 1968-02-28 Siemens Ag Semiconductor devices
DE2203032A1 (en) * 1972-01-22 1973-08-02 Siemens Ag SEMI-CONDUCTOR ARRANGEMENT
DE3113850A1 (en) * 1980-04-07 1982-01-14 Hitachi, Ltd., Tokyo Semiconductor device
DE3145648A1 (en) * 1980-11-19 1982-06-03 Hitachi, Ltd., Tokyo SEMICONDUCTOR ARRANGEMENT
JPH07211731A (en) * 1994-01-27 1995-08-11 Fuji Electric Co Ltd Semiconductor device
JP2006128262A (en) * 2004-10-27 2006-05-18 Kyocera Corp Electronic component mounting substrate, electronic device, and method of manufacturing electronic component mounting substrate
US20090047754A1 (en) * 2007-08-17 2009-02-19 Chipmos Technologies (Bermuda) Ltd. Packaging method involving rearrangement of dice
EP2093792A1 (en) * 2007-11-01 2009-08-26 Hitachi Ltd. Method for power semiconductor module fabricaton, its apparatus, power semiconductor module and its junction method
WO2010086282A1 (en) * 2009-01-30 2010-08-05 Robert Bosch Gmbh Composite component and method for producing a composite component
US20110024896A1 (en) * 2008-07-07 2011-02-03 Mitsubishi Electric Corporation Power semiconductor device
US20130328200A1 (en) * 2012-06-12 2013-12-12 Electronics And Telecommunications Research Institute Direct bonded copper substrate and power semiconductor module
US20140183724A1 (en) * 2012-12-28 2014-07-03 SK Hynix Inc. Substrate for semiconductor package, semiconductor package using the same, and manufacturing method thereof
DE102014113694A1 (en) * 2013-09-24 2015-03-26 Infineon Technologies Ag SUBSTRATE, CHIP ASSEMBLY AND METHOD FOR THE PRODUCTION THEREOF
DE102013219733A1 (en) * 2013-09-30 2015-04-02 Siemens Aktiengesellschaft Process for the edge coating of a monolithically integrated semiconductor component
DE102014105957B3 (en) * 2014-04-29 2015-06-25 Infineon Technologies Ag Method for producing a solder joint
US20160351468A1 (en) * 2015-05-28 2016-12-01 Ut-Battelle, Llc Integrated packaging of multiple double sided cooling planar bond power modules
WO2016193038A1 (en) * 2015-06-01 2016-12-08 Siemens Aktiengesellschaft Method for electrically contacting a component by means of galvanic connection of an open-pored contact piece, and corresponding component module
WO2017021394A1 (en) * 2015-08-05 2017-02-09 Siemens Aktiengesellschaft Component module and power module
WO2018055148A1 (en) * 2016-09-26 2018-03-29 Siemens Aktiengesellschaft Power module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1236982A (en) 1998-01-22 1999-12-01 株式会社日立制作所 Pressure contact type semiconductor device and its converter
US20050111188A1 (en) 2003-11-26 2005-05-26 Anandaroop Bhattacharya Thermal management device for an integrated circuit
DE102006055340A1 (en) 2006-11-23 2008-05-29 Siemens Ag Explosion-proof module construction for power components, in particular power semiconductor components and its manufacture
US9373559B2 (en) 2014-03-05 2016-06-21 International Business Machines Corporation Low-stress dual underfill packaging

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1104515A (en) * 1964-08-08 1968-02-28 Siemens Ag Semiconductor devices
DE2203032A1 (en) * 1972-01-22 1973-08-02 Siemens Ag SEMI-CONDUCTOR ARRANGEMENT
DE3113850A1 (en) * 1980-04-07 1982-01-14 Hitachi, Ltd., Tokyo Semiconductor device
DE3145648A1 (en) * 1980-11-19 1982-06-03 Hitachi, Ltd., Tokyo SEMICONDUCTOR ARRANGEMENT
JPH07211731A (en) * 1994-01-27 1995-08-11 Fuji Electric Co Ltd Semiconductor device
JP2006128262A (en) * 2004-10-27 2006-05-18 Kyocera Corp Electronic component mounting substrate, electronic device, and method of manufacturing electronic component mounting substrate
US20090047754A1 (en) * 2007-08-17 2009-02-19 Chipmos Technologies (Bermuda) Ltd. Packaging method involving rearrangement of dice
EP2093792A1 (en) * 2007-11-01 2009-08-26 Hitachi Ltd. Method for power semiconductor module fabricaton, its apparatus, power semiconductor module and its junction method
US20110024896A1 (en) * 2008-07-07 2011-02-03 Mitsubishi Electric Corporation Power semiconductor device
WO2010086282A1 (en) * 2009-01-30 2010-08-05 Robert Bosch Gmbh Composite component and method for producing a composite component
US20130328200A1 (en) * 2012-06-12 2013-12-12 Electronics And Telecommunications Research Institute Direct bonded copper substrate and power semiconductor module
US20140183724A1 (en) * 2012-12-28 2014-07-03 SK Hynix Inc. Substrate for semiconductor package, semiconductor package using the same, and manufacturing method thereof
DE102014113694A1 (en) * 2013-09-24 2015-03-26 Infineon Technologies Ag SUBSTRATE, CHIP ASSEMBLY AND METHOD FOR THE PRODUCTION THEREOF
DE102013219733A1 (en) * 2013-09-30 2015-04-02 Siemens Aktiengesellschaft Process for the edge coating of a monolithically integrated semiconductor component
DE102014105957B3 (en) * 2014-04-29 2015-06-25 Infineon Technologies Ag Method for producing a solder joint
US20160351468A1 (en) * 2015-05-28 2016-12-01 Ut-Battelle, Llc Integrated packaging of multiple double sided cooling planar bond power modules
WO2016193038A1 (en) * 2015-06-01 2016-12-08 Siemens Aktiengesellschaft Method for electrically contacting a component by means of galvanic connection of an open-pored contact piece, and corresponding component module
WO2017021394A1 (en) * 2015-08-05 2017-02-09 Siemens Aktiengesellschaft Component module and power module
WO2018055148A1 (en) * 2016-09-26 2018-03-29 Siemens Aktiengesellschaft Power module

Also Published As

Publication number Publication date
DE102017203132A1 (en) 2018-08-09
WO2018141621A2 (en) 2018-08-09

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