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WO2018006571A1 - Réfrigérateur refroidi par air et son procédé de déshumidification - Google Patents

Réfrigérateur refroidi par air et son procédé de déshumidification Download PDF

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Publication number
WO2018006571A1
WO2018006571A1 PCT/CN2016/113933 CN2016113933W WO2018006571A1 WO 2018006571 A1 WO2018006571 A1 WO 2018006571A1 CN 2016113933 W CN2016113933 W CN 2016113933W WO 2018006571 A1 WO2018006571 A1 WO 2018006571A1
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WO
WIPO (PCT)
Prior art keywords
temperature
air
evaporator
cooled refrigerator
semiconductor refrigeration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/113933
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English (en)
Chinese (zh)
Inventor
聂圣源
刘建如
姬立胜
戚斐斐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Co Ltd
Original Assignee
Qingdao Haier Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Co Ltd filed Critical Qingdao Haier Co Ltd
Publication of WO2018006571A1 publication Critical patent/WO2018006571A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
    • F25D17/062—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation in household refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/04—Preventing the formation of frost or condensate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/003—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with respect to movable containers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects

Definitions

  • the invention relates to the technical field of refrigeration equipment, and in particular to an air-cooled refrigerator and a dehumidification method thereof.
  • the R&D personnel developed a cold refrigerator (ie, an air-cooled refrigerator) that placed the evaporator in a separate small space (ie, evaporation).
  • the cold air cooled by the evaporator is sent to the inner chamber of the tank by the blower to cool the chamber inside the tank. Since the cold air temperature is always lower than the compartment temperature, there is no frosting problem.
  • the surface of the evaporator will be frosted. As the amount of frost on the evaporator increases, the refrigeration efficiency of the intercooled refrigerator will decrease, affecting the stability of the temperature between the intercooled refrigerator compartments, and periodic defrost is required. .
  • the current defrosting method commonly used in cold refrigerators is to periodically melt the frost on the evaporator by means of electric heating. This kind of defrosting method stops the compressor during the defrosting process, and the temperature inside the box rises due to the heating effect of the electric heater, which affects the preservation of the food and causes the energy consumption of the intercooled refrigerator to be high.
  • Another object of the first aspect of the present invention is to provide an air-cooled refrigerator to minimize temperature fluctuations in the storage compartment due to defrosting of the evaporator.
  • an air-cooled refrigerator comprising:
  • a supply air duct configured to supply air cooled via the evaporator to the refrigerating compartment
  • a return air duct configured to deliver air from the refrigerating compartment to the evaporator for cooling
  • a semiconductor refrigeration assembly having a first temperature change end and a second temperature change end, the semiconductor refrigeration unit being configured to control the first temperature change end and the second temperature change end as temperature-reducing refrigeration ends and temperature rise, respectively The heating end, and the air before entering the return air passage first flows through the first temperature changing end, so that the moisture therein is condensed at the first temperature changing end.
  • the air-cooled refrigerator further includes:
  • a blower configured to be controlled to open to blow air cooled by the evaporator to the air supply duct;
  • the semiconductor refrigeration unit is configured to: when the blower is turned on, the first temperature changing end and the second temperature change end are respectively used as a temperature-reducing cooling end and a temperature-increased heating end; and when the blower is When the vehicle is shut down, the first temperature changing end and the second temperature changing end are respectively used as a heating end with a rising temperature and a cooling end with a lowered temperature, so that the frost condensed at the first temperature changing end is melted.
  • the first temperature changing end is disposed at a return air outlet of the return air duct.
  • the semiconductor refrigeration component comprises:
  • a semiconductor refrigeration sheet having a first temperature change surface and a second temperature change surface
  • a first heat exchanger thermally coupled to the first temperature changing surface of the semiconductor refrigeration sheet
  • a second heat exchanger thermally coupled to the second temperature changing surface of the semiconductor refrigeration sheet
  • first temperature change surface and the first heat exchanger serve as the first temperature change end;
  • second temperature change surface and the second heat exchanger serve as the second temperature change end.
  • a return air outlet of the return air duct is disposed on a rear wall of the refrigerating compartment and adjacent to a side wall of the refrigerating compartment;
  • the semiconductor refrigeration unit is disposed on the one side wall, the first heat exchanger extends directly to the front of the air return port, and a rear end of the first heat exchanger is in contact with the air return port.
  • the air-cooled refrigerator further includes: a water receiving box for collecting defrosting water dripping from the first temperature changing end, and conveying the defrosting water to a drain port of the refrigerating compartment .
  • the second heat exchanger extends to the outside of the casing of the air-cooled refrigerator to dissipate heat of the second temperature-changing surface of the semiconductor refrigerating sheet into the surrounding environment of the air-cooled refrigerator.
  • a dehumidifying method for an air-cooled refrigerator includes: a refrigerating compartment, an evaporator, and directing air of the refrigerating compartment to the evaporator a cooled return air duct, and a semiconductor refrigeration assembly having a first temperature change end and a second temperature change end, wherein the semiconductor refrigeration unit is configured such that air entering the return air passage first flows through the first temperature change end ,
  • the dehumidifying method includes: making a first temperature changing end and a second temperature changing end of the semiconductor refrigeration component as a temperature reducing cooling end and a temperature increasing heating end, respectively, so as to flow through the air in the first temperature changing end The moisture condenses at the first temperature changing end.
  • the air-cooled refrigerator further comprises a blower for blowing air cooled by the evaporator into the refrigerating compartment
  • the dehumidifying method further includes: when the blower is turned on, the first temperature changing end and the second temperature changing end are respectively used as a cooling end with a lowered temperature and a heating end with an increased temperature.
  • the dehumidifying method further includes:
  • the first temperature changing end and the second temperature changing end of the semiconductor refrigeration component are respectively used as a heating end with a rising temperature and a cooling end with a lowered temperature, so that the first temperature changing end is condensed.
  • the frost melts.
  • the air having a relatively high humidity in the refrigerating compartment flows through the first temperature-changing end of the lower temperature of the semiconductor refrigeration component before entering the return air duct, so that the moisture therein is at the first temperature-changing end. Condensation occurs so that the air is dehumidified before entering the return air passage, and thus substantially no or only a small amount of moisture condenses on the evaporator as it flows through the evaporator, greatly reducing the amount of frost on the evaporator.
  • the air-cooled refrigerator of the present invention greatly reduces the frosting amount of the evaporator by providing the semiconductor refrigeration component, thereby substantially ensuring the refrigeration efficiency of the refrigerator on the one hand, and further prolonging the defrosting heating wire on the other hand.
  • the air-cooled refrigerator of the present invention is configured such that when the blower is turned on, the first temperature-changing end and the second temperature-changing end are respectively used as a temperature-reducing cooling end and a temperature-increased heating end, respectively.
  • the first variable temperature end of the lower temperature is used to remove the moisture in the air; and when the air supply mechanism is stopped, the first variable temperature end and the second variable temperature end are respectively used as the heating end and the temperature at which the temperature rises.
  • the lowered refrigerating end is configured to melt the frost condensed at the first temperature-changing end when the cooling of the refrigerating compartment is stopped.
  • the melted water can be discharged to the outside of the refrigerator (for example, in an evaporating dish) through the drain port of the refrigerating compartment. Since the invention defrosting the first variable temperature end in time, it can ensure that the first variable temperature end can ensure the coagulation ability to moisture during the opening of the blower, and always has a good dehumidification effect.
  • the air-cooled refrigerator of the present invention can ensure that the air in the refrigerating compartment can flow through the semi-conducting before entering the return air duct by setting the first temperature-changing end at the return air outlet of the return air duct.
  • the first temperature-changing end of the body cooling assembly has a lower temperature so that moisture therein condenses on the first temperature-changing end.
  • the temperature at the return air outlet of the return air duct is relatively high, the temperature of the first variable temperature end can be slightly lower than 0 ° C to perform dehumidification, and it is not necessary to deliberately set the temperature of the first variable temperature end too low. , causing energy waste.
  • FIG. 1 is a schematic side view of an air-cooled refrigerator in accordance with one embodiment of the present invention.
  • Figure 2 is a schematic partial front cross-sectional view of the air-cooled refrigerator of Figure 1;
  • Figure 3 is a schematic cross-sectional view taken along line A-A of Figure 1;
  • FIG. 4 is a schematic flow chart of a dehumidification method of an air-cooled refrigerator according to an embodiment of the present invention.
  • the air-cooled refrigerator 100 may generally include a case 1.
  • the case 1 may include a steel plate outer case that is open at the front side, a synthetic resin inner case that is disposed in the inner space of the outer case and has a front side opening, and foaming formed by filling and foaming in a gap between the outer case and the inner liner. Polyurethane insulation material.
  • a storage compartment for storing food or the like is formed in the casing 1. Depending on the storage temperature and use, the interior of the storage compartment is divided into a refrigerating compartment 10 and at least one other compartment. The other storage compartments may be the freezing compartment 20 or the like.
  • the air-cooled refrigerator 100 may further include a door body (not shown) for opening/closing the refrigerating compartment 10 and other storage compartments.
  • the air-cooled refrigerator 100 of the embodiment of the present invention may include a compressor (not shown), an evaporator 40, and a condenser, like the existing air-cooled refrigerator. Not shown) as well as throttling elements (not shown) and the like.
  • the evaporator 40 is connected to a compressor, a condenser, and a throttle element via a refrigerant line (not shown) to constitute a refrigeration cycle, and is cooled at the start of the compressor to cool the air flowing therethrough.
  • the air cooled via the evaporator 40 is supplied to the respective chambers to maintain the temperatures in the respective chambers within the respective set temperature ranges.
  • the air-cooled refrigerator 100 may further include a blower 30, a blower duct 11, and a return air duct 12.
  • Air supply The machine 30 is configured to be controlled to open to blow the air cooled by the evaporator 40 into the air supply duct 11.
  • the air supply duct 11 is for supplying the air cooled by the evaporator 40 to the refrigerating compartment 10, and the air that has entered the air supply duct 11 flows into the refrigerating compartment 10 via the air blowing port 111.
  • the return air duct 12 is for conveying air flowing out of the refrigerating compartment 10 to the evaporator 40 for cooling.
  • the air in the refrigerating compartment 10 enters the return air duct 12 via the return air opening 121.
  • the return air port 121 of the return air duct 12 is generally disposed on the rear wall of the refrigerating compartment 10 and adjacent to a tank side wall 101 of the air-cooled refrigerator 100 (the return air opening 121 is generally adjacent to the left side wall of the air-cooled refrigerator 100) .
  • the air cooled via the evaporator 40 enters the air supply duct 11 by the blower 30, thereby supplying a cooling amount to the refrigerating compartment 10, so that the refrigerating compartment 10 is provided.
  • the temperature inside is maintained between 0 ° C and 10 ° C; while the air in the refrigerating compartment 10 flows into the return air duct 12 to flow to the evaporator 40 for re-cooling.
  • the air-cooled refrigerator 100 may further include a semiconductor refrigeration unit 50 having a first temperature-changing end and a second temperature-changing end.
  • a semiconductor refrigeration unit 50 having a first temperature-changing end and a second temperature-changing end.
  • the semiconductor refrigeration unit 50 When the semiconductor refrigeration unit 50 is energized, the temperature of the first temperature-changing end thereof is lowered, and the temperature of the second temperature-changing end is increased.
  • the semiconductor refrigeration unit 50 When the semiconductor refrigeration unit 50 is in the opposite direction, the temperature of the first temperature changing end is increased, and the temperature of the second temperature changing end is lowered.
  • the semiconductor refrigeration unit 50 is configured to control the first temperature changing end and the second temperature changing end as the cooling end of the temperature decrease and the heating end of the temperature increase, respectively, and the air before entering the return air duct 12 flows through the first a temperature change end, so that the moisture therein is condensed at the first temperature change end. That is, the semiconductor refrigeration unit 50 is disposed such that the air whose first temperature-changing end is in the refrigerating compartment 10 flows back into the flow path of the air duct 12 so that the air before entering the return air duct 12 can flow through the first A temperature change end.
  • the semiconductor refrigeration unit 50 is configured to control the first temperature-changing end as a temperature-reduced cooling end, so that the humidity-rich air in the refrigerating compartment 10 flows through the temperature of the semiconductor refrigeration unit 50 before entering the return air duct 12.
  • a lower first temperature-changing end such that moisture therein condenses at the first temperature-changing end, so that the air has been dehumidified before entering the return air duct 12, and thus there is substantially no or only a small amount when flowing through the evaporator 40.
  • the moisture condenses on the evaporator 40, greatly reducing the amount of frost formed by the evaporator 40.
  • the refrigeration efficiency of the refrigerator can be basically ensured, on the other hand, the opening interval of the defrosting heating wire can be extended more, or the opening time of the defrosting heating wire can be shortened, or the heating power of the defrosting heating wire can be reduced, or even canceled.
  • the defrosting heats the wire, thereby reducing the overall power consumption of the refrigerator.
  • the semiconductor refrigeration assembly 50 can be configured such that its first temperature-changing end acts as a cooling end, with its second temperature-changing end always acting as a heating end.
  • the semiconductor refrigerating sheet is configured to: when the blower 30 is turned on, The first temperature-changing end and the second temperature-changing end are respectively used as a temperature-reducing cooling end and a temperature-increased heating end, so that when the refrigerating compartment 10 is cooled, the moisture in the air is removed by using the first temperature-changing end having a lower temperature. And when the blower 30 is turned off, the first temperature changing end and the second temperature changing end are respectively used as a heating end with a temperature increase and a cooling end with a lowered temperature to make the first temperature change when the cooling of the refrigerating compartment 10 is stopped. The condensation of the end of the frost melts.
  • the first temperature-changing end can be defrosted in time, thereby ensuring that the first temperature-changing end can ensure the coagulation ability to moisture during the opening of the blower 30, and always has a good dehumidification effect.
  • the first temperature varying end is disposed at the return air vent 121 of the return air duct 12 . Since the temperature at the return air port 121 of the return air duct 12 is relatively high, the temperature of the first temperature change end can be slightly lower than 0 ° C to perform dehumidification without deliberately setting the temperature of the first temperature change end too low. , causing energy waste. In some embodiments, the temperature of the first temperature-varying end may be set below 0 ° C, for example, may be set within a temperature range of not lower than -30 ° C and not higher than 0 ° C.
  • the first temperature-changing end The temperature can be set below 0 ° C and close to 0 ° C, for example between -1 ° C and -5 ° C, such as -1 ° C, -2 ° C, -3.5 ° C, -5 ° C, and the like.
  • Figure 2 is a schematic partial front cross-sectional view of the air-cooled refrigerator 100 of Figure 1;
  • Figure 3 is a schematic cross-sectional view taken along line A-A of Figure 1.
  • the semiconductor refrigeration assembly 50 includes a semiconductor refrigeration sheet 51 having a first temperature change surface and a second temperature change surface.
  • the first temperature changing end and the second temperature changing end may be a first temperature changing surface and a second temperature changing surface which may be the semiconductor cooling sheet 51, respectively.
  • the semiconductor refrigeration assembly 50 further includes: a first heat exchanger 54 thermally coupled to the first temperature-changing surface of the semiconductor refrigeration sheet 51; and a second heat thermally coupled to the second temperature-changing surface of the semiconductor refrigeration sheet 51 Switch 55.
  • the first heat exchanger 54 and the first temperature changing surface serve as a first temperature changing end; the second heat exchanger 55 and the second temperature changing surface serve as a second temperature changing end.
  • the first heat exchanger 54 and the second heat exchanger 55 may be disposed directly on the first temperature changing surface and the second temperature changing surface, respectively, or may also pass through the first heat conducting block 52 and the second heat conducting block 53 and the first temperature changing surface, respectively. Connected to the second temperature changing surface.
  • the first heat exchanger 54 and the second heat exchanger 55 are connected to the first temperature changing surface and the second temperature changing surface through the first heat conducting block 52 and the second heat conducting block 53, respectively, the first heat exchanger 54,
  • the first heat conducting block 52 and the first temperature changing surface serve as a first temperature changing end;
  • the second heat exchanger 55, the second heat conducting block 53 and the second temperature changing surface serve as a second temperature changing end.
  • the first heat exchanger 54 and the second heat exchanger 55 may specifically have a structure of heat dissipating fins to increase a heat exchange area.
  • the semiconductor refrigeration unit 50 is disposed in a cabinet adjacent to the return air port 121 of the air-cooled refrigerator 100 On the side wall 101.
  • the semiconductor refrigerating sheet 51 may be disposed inside the casing side wall 101, the first heat exchanger 54 extends to the front of the return air opening 121, and the rear end of the first heat exchanger 54 is in contact with the return air opening 121.
  • the second heat exchanger 55 extends to the outside of the tank side wall 101 of the air-cooled refrigerator 100 to dissipate heat of the second temperature-changing surface of the semiconductor refrigerating sheet 51 to the surrounding environment of the air-cooled refrigerator 100.
  • the air-cooled refrigerator 100 may further include a water receiving box 60 for collecting defrosted water dripping from the first temperature changing end.
  • the water receiving box 60 can communicate with the drain port of the refrigerating compartment 10 through a pipeline to transport the defrosted water to the drain port and flow to the evaporating dish via the drain pipe of the air-cooled refrigerator 100 (Fig. Not shown in the middle).
  • the embodiment of the present invention further provides a dehumidification method of the air-cooled refrigerator 100 in any of the above embodiments.
  • the air-cooled refrigerator 100 may include: a refrigerating compartment 10, an evaporator 40, a return air duct 12 that guides air of the refrigerating compartment 10 to the evaporator 40 for cooling, and a semiconductor having a first temperature changing end and a second temperature changing end
  • the refrigeration assembly 50 wherein the semiconductor refrigeration assembly 50 is configured such that air entering the return air duct 12 first flows through the first temperature change end.
  • the dehumidification method may include: making the first temperature-changing end and the second temperature-changing end of the semiconductor refrigeration component 50 as a temperature-reducing refrigeration end and a temperature-increased heating end, respectively, so that moisture in the air flowing through the first temperature-varying end is The first temperature changing end is condensed.
  • the air-cooled refrigerator 100 further includes a blower 30 for blowing air cooled by the evaporator 40 into the refrigerating compartment 10. As shown in FIG. 4, in some preferred embodiments, the method can include steps S402 through S408.
  • step S402 the blower 30 is turned on. At this time, the compressor is normally turned on, and the temperature of the evaporator 40 is lowered to cool the air flowing therethrough.
  • the air cooled by the evaporator 40 flows to the blower duct 11 by the blower 30, flows into the refrigerating compartment 10 through the air outlet to cool the refrigerating compartment 10, and at the same time, the air in the refrigerating compartment 10 passes through the return duct.
  • 121 flows into the return air duct 12 and then flows to the evaporator 40 for cooling.
  • Step S404 when the blower 30 is turned on, the first temperature changing end and the second temperature changing end are respectively used as a cooling end with a lowered temperature and a heating end with a raised temperature.
  • the air in the refrigerating compartment 10 flows through the first temperature changing end, the moisture therein is condensed, so that the air in the refrigerating compartment 10 is dried, and then flows into the return air duct 12 to flow to the evaporation. Cooling is performed at the unit 40.
  • step S406 the blower 30 is turned off. After the refrigerating compartment 10 is completely cooled, that is, the temperature in the refrigerating compartment 10 reaches a preset temperature, the blower 30 is turned off. At this point, the compressor is normally shut down.
  • Step S408 the first temperature changing end and the second temperature changing end are respectively used as a heating end with a rising temperature and a cooling end with a lowered temperature. At this time, the frost condensed at the first temperature-changing end melts due to an increase in temperature of the first temperature-changing end.
  • the energization of the semiconductor refrigerating sheet 51 may be stopped after the frost at the first temperature changing end is completely melted.
  • the semiconductor cooling fins 51 are stopped from being energized.
  • the semiconductor refrigerating sheet 51 is energized again, so that the first temperature changing end and the second temperature changing end serve as a cooling end with a lowered temperature and a heating end with a raised temperature, respectively.
  • air-cooled refrigerator is not limited to an air-cooled refrigerator having a refrigerating compartment and a freezing compartment and storing food in a general sense, and may also have other refrigeration functions.
  • Devices such as wine coolers, refrigerated cans, etc.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
  • Defrosting Systems (AREA)

Abstract

L'invention porte également sur un réfrigérateur refroidi par air (100) et sur son procédé de déshumidification. Le réfrigérateur refroidi par air (100) comprend un corps de réfrigérateur (1) définissant un compartiment de réfrigération (10); un évaporateur (40) pour refroidir l'air s'écoulant à travers celui-ci; un canal de soufflage d'air (11) utilisé pour fournir l'air refroidi par l'évaporateur (40) au compartiment de réfrigération (10); un canal de retour d'air (12) utilisé pour transporter l'air du compartiment de réfrigération (10) à l'évaporateur (40) pour le refroidissement; et un ensemble de réfrigération à semi-conducteurs (50) ayant une première extrémité de variation de température et une seconde extrémité de variation de température. L'ensemble de réfrigération à semi-conducteurs (50) peut être commandé de telle sorte que la première extrémité à variation de température et la seconde extrémité à variation de température servent respectivement d'extrémité de réfrigération pour abaisser la température et d'extrémité de chauffage pour élever la température, et d'amener l'air à s'écouler à travers la première extrémité de variation de température avant d'entrer dans le canal de retour d'air (12), de telle sorte que l'humidité dans l'air se condense à la première extrémité de variation de température. Avant que l'air ayant une forte humidité dans le compartiment de réfrigération (10) pénètre dans le canal de retour d'air (12), son humidité est condensée à la première extrémité de variation de température, de telle sorte que l'air soit déshumidifié avant d'entrer dans le canal de retour d'air (12), ce qui réduit de manière significative l'accumulation de givre sur l'évaporateur (40).
PCT/CN2016/113933 2016-07-06 2016-12-30 Réfrigérateur refroidi par air et son procédé de déshumidification Ceased WO2018006571A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610528650.2A CN106196843A (zh) 2016-07-06 2016-07-06 风冷冰箱及其除湿方法
CN201610528650.2 2016-07-06

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Publication Number Publication Date
WO2018006571A1 true WO2018006571A1 (fr) 2018-01-11

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CN112577231A (zh) * 2019-09-29 2021-03-30 青岛海尔电冰箱有限公司 冰箱
CN113124598A (zh) * 2019-12-31 2021-07-16 青岛海尔特种电冰柜有限公司 一种冷柜及其控制方法
CN113124597A (zh) * 2019-12-31 2021-07-16 青岛海尔特种电冰柜有限公司 一种冷柜及其减霜控制方法
CN113899141A (zh) * 2021-09-30 2022-01-07 珠海格力电器股份有限公司 提前除霜的模块及其控制方法、制冷设备
CN115202420A (zh) * 2022-08-23 2022-10-18 山东大学 一种温湿度独立调控装置及系统
CN116202280A (zh) * 2023-04-12 2023-06-02 长虹美菱股份有限公司 一种回风风道结构、冰箱及预除湿控制方法
WO2023098746A1 (fr) * 2021-12-03 2023-06-08 青岛海尔电冰箱有限公司 Réfrigérateur et son ensemble tiroir

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