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WO2018061187A1 - Lampe à semi-conducteur - Google Patents

Lampe à semi-conducteur Download PDF

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Publication number
WO2018061187A1
WO2018061187A1 PCT/JP2016/079047 JP2016079047W WO2018061187A1 WO 2018061187 A1 WO2018061187 A1 WO 2018061187A1 JP 2016079047 W JP2016079047 W JP 2016079047W WO 2018061187 A1 WO2018061187 A1 WO 2018061187A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor
light source
lamp
light
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/079047
Other languages
English (en)
Japanese (ja)
Inventor
遼 伏江
卓生 村井
大介 松原
吉野　勇人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
Original Assignee
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Mitsubishi Electric Lighting Corp filed Critical Mitsubishi Electric Corp
Priority to JP2018541838A priority Critical patent/JP6620892B2/ja
Priority to PCT/JP2016/079047 priority patent/WO2018061187A1/fr
Publication of WO2018061187A1 publication Critical patent/WO2018061187A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section

Definitions

  • the present invention relates to a semiconductor lamp.
  • Patent Document 1 discloses a semiconductor lamp intended to be used as an alternative to a High Intensity Discharge (HID) lamp.
  • a semiconductor lamp intended to be used as an alternative to a High Intensity Discharge (HID) lamp.
  • a plurality of light source units are arranged around a lamp axis line with a back surface of a flat light source unit having a mounting substrate on which a semiconductor light source is mounted facing inward.
  • heat radiating fins On the back side of these light source units, there are provided heat radiating fins and a space through which air flows.
  • a lamp with a high luminous flux is installed in a high-temperature environment such as a ceiling, or is incorporated in a sealed device such as a street light, and thus it is difficult to suppress an increase in the temperature of the semiconductor light source.
  • the heat radiating fins are in the inner space surrounded by the plurality of light source units, heat is easily trapped in the space, and the heat dissipation from the heat radiating fins is not good.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a semiconductor lamp that is excellent in heat dissipation and can reduce luminance unevenness.
  • the semiconductor lamp of the present invention includes a heat sink, a light source substrate having at least one semiconductor light source, and illumination means.
  • the heat sink includes a plate-like base portion having a first surface facing the outside of the semiconductor lamp, a second surface opposite to the first surface, and a fin protruding from the first surface of the base portion.
  • the light source substrate is installed on the second surface of the base portion.
  • the illumination means illuminates the first surface of the base portion.
  • the semiconductor lamp of the present invention by providing the illumination means for illuminating the first surface of the base portion of the heat sink, it is excellent in heat dissipation and it is possible to reduce luminance unevenness.
  • FIG. 1 is a perspective view showing a semiconductor lamp according to Embodiment 1.
  • FIG. It is a perspective view which shows the state which removed the side cover and the reflector from the semiconductor lamp shown in FIG. It is a perspective view which shows the side cover and reflector with which the semiconductor lamp shown in FIG. 1 is provided. It is the figure which looked at the semiconductor lamp shown in FIG. 1 with the eyes
  • 2 is a cross-sectional view of the semiconductor lamp of the first embodiment.
  • FIG. It is a graph which shows typically distribution of brightness when the semiconductor lamp of a comparative example is seen from the outer peripheral side. It is a graph which shows typically distribution of brightness when the semiconductor lamp of Embodiment 1 is seen from the perimeter side.
  • FIG. 6 is a perspective view showing a semiconductor lamp according to a second embodiment.
  • FIG. 6 is a cross-sectional view showing a semiconductor lamp according to a third embodiment.
  • FIG. 6 is a perspective view showing a semiconductor lamp according to a fourth embodiment.
  • FIG. 10 is a perspective view showing a semiconductor lamp according to a fifth embodiment.
  • FIG. 10 is a perspective view showing a semiconductor lamp according to a sixth embodiment.
  • FIG. 10 is a perspective view showing a part of a semiconductor lamp according to a seventh embodiment.
  • FIG. 10 is a perspective view showing a semiconductor lamp according to an eighth embodiment. It is the figure which looked at the semiconductor lamp shown in FIG. 14 with the eyes
  • FIG. 10 is a perspective view showing a part of a semiconductor lamp according to a ninth embodiment.
  • FIG. 1 is a perspective view showing a semiconductor lamp 1 according to the first embodiment.
  • the application of the semiconductor lamp 1 of the present embodiment shown in FIG. 1 is not particularly limited.
  • the semiconductor lamp 1 of the present embodiment can be attached to an electrical socket provided in indoor and outdoor lighting fixtures (not shown) such as street lights, road lights, park lights, high ceiling lights, and the like.
  • the semiconductor lamp 1 may be used as an alternative to a conventional High Intensity Discharge (HID) lamp, such as a mercury lamp.
  • HID High Intensity Discharge
  • the semiconductor lamp 1 has a base 2.
  • the base 2 in the present embodiment is a screw-type base that can be connected to the electrical socket by screwing.
  • the semiconductor lamp 1 can be attached to the lighting fixture by screwing the cap 2 into an electric socket provided in the lighting fixture.
  • the semiconductor lamp 1 may be provided with a plug-in base instead of the screw-in base 2 as shown.
  • proximal end the end of the semiconductor lamp 1 on the base 2 side
  • distal end the end of the semiconductor lamp 1 on the side opposite to the base 2
  • the direction from the proximal end to the distal end is referred to as “distal direction”, and the direction from the distal end to the proximal end is referred to as “proximal direction”.
  • the semiconductor lamp 1 has a lamp axis AX extending from the proximal end to the distal end.
  • the lamp axis AX passes through the center of the base 2.
  • the lamp axis AX corresponds to the central axis of the semiconductor lamp 1.
  • the semiconductor lamp 1 may be used in any posture such that the base 2 is upward or diagonally upward, the base 2 is downward or diagonally downward, and the base 2 is lateral.
  • the semiconductor lamp 1 includes a plurality of light emitting units 3 arranged at intervals in the circumferential direction around the lamp axis AX. These light emitting units 3 have the same or similar configuration.
  • Each of the plurality of light emitting units 3 includes a heat sink 4 and a light source substrate 5.
  • the heat sink 4 is desirably formed of a material having high thermal conductivity, for example, a metal material.
  • circumferential direction means a circumferential direction centered on the lamp axis AX unless otherwise specified.
  • radial direction means a radial direction around the lamp axis AX unless otherwise specified.
  • the semiconductor lamp 1 includes a side cover 6.
  • the side cover 6 transmits light.
  • Side cover 6 in the present embodiment has a curved surface along a cylindrical surface with lamp axis AX as the center.
  • the semiconductor lamp 1 includes a reflector 7.
  • the reflector 7 is located between the base 2 and the plurality of light emitting units 3 with respect to the position in the direction of the lamp axis AX.
  • the shape of the reflector 7 is a circle centered on the lamp axis AX.
  • FIG. 2 is a perspective view showing a state in which the side cover 6 and the reflector 7 are removed from the semiconductor lamp 1 shown in FIG.
  • the heat sink 4 includes a plate-like base portion 8 and a plurality of fins 9.
  • the base portion 8 has a first surface 8a and a second surface 8b.
  • the first surface 8 a faces the outside of the semiconductor lamp 1.
  • the second surface 8b is a surface opposite to the first surface 8a.
  • the second surface 8 b faces the inside of the semiconductor lamp 1.
  • the fin 9 protrudes from the first surface 8a.
  • the fin 9 faces the outside of the semiconductor lamp 1.
  • the fin 9 has a plate shape. A plurality of parallel fins 9 are provided.
  • the fins 9 in the present embodiment extend in parallel with the lamp axis AX.
  • the shape of the fin 9 is not limited to a plate shape, and may be a pin shape.
  • the fin 9 may be formed integrally with the base portion 8. Since the fins 9 are provided, the surface area of the heat sink 4 can be increased, so that heat dissipation can be promoted.
  • the first surface 8a and the second surface 8b are parallel to the lamp axis AX. Not limited to such a configuration, the first surface 8a and the second surface 8b may be inclined with respect to the lamp axis AX.
  • the light source substrate 5 is installed on the second surface 8 b of the base portion 8 of the heat sink 4.
  • the light source substrate 5 has at least one semiconductor light source 5a.
  • the light source substrate 5 includes a plurality of semiconductor light sources 5a.
  • the light source substrate 5 faces the inside of the semiconductor lamp 1.
  • the semiconductor light source 5 a emits light toward the inside of the semiconductor lamp 1.
  • the semiconductor light source 5a is, for example, a light emitting diode (LED) element.
  • the semiconductor light source 5a may be, for example, any one of a surface mount LED package, a chip scale package LED, a bullet-type LED package, and an LED package with a light distribution lens.
  • the light source substrate 5 may be a chip-on-board (COB) type LED package.
  • the semiconductor light source 5a is not limited to an LED element, and may be, for example, an organic electroluminescence (EL) element or a semiconductor laser element.
  • EL organic electroluminescence
  • the semiconductor light source 5a is preferably a diffused light source having a light distribution with low directivity.
  • the light source substrate 5 in the present embodiment has a shape whose longitudinal direction is a direction parallel to the lamp axis AX.
  • a plurality of semiconductor light sources 5a are arranged along the longitudinal direction of the light source substrate 5, and a plurality of semiconductor light sources 5a are arranged along a direction perpendicular to the longitudinal direction.
  • the light source substrate 5 is not limited to the illustrated configuration, and the light source substrate 5 may have a shape whose longitudinal direction is inclined with respect to the lamp axis AX.
  • the axis along the direction in which the luminous intensity of the light emitted from the light source substrate 5 is maximized is referred to as the “optical axis” of the light source substrate 5.
  • the optical axis of the light source substrate 5 may be perpendicular to the second surface 8 b of the base portion 8.
  • the optical axis of the light source substrate 5 may be perpendicular to the lamp axis AX.
  • the optical axis of the light source substrate 5 may be inclined with respect to a plane perpendicular to the lamp axis AX.
  • the surface of the light source substrate 5 opposite to the semiconductor light source 5 a is thermally connected to the base portion 8 of the heat sink 4.
  • the base portion 8 supports the light source substrate 5 and the fins 9.
  • the heat generated in the semiconductor light source 5 a of the light source substrate 5 is thermally conducted to the base portion 8 and is conducted from the base portion 8 to the fins 9. Heat is dissipated from the surfaces of the base portion 8 and the fins 9 by convection and radiation.
  • heat conductive materials for example, heat conductive grease, a heat conductive sheet, a heat conductive adhesive, a heat conductive double-sided adhesive tape (Not shown) may be sandwiched.
  • the light source substrate 5 may be fixed to the base portion 8 by any method such as screwing or bonding. Alternatively, the metal substrate of the light source substrate 5 and the base portion 8 may be integrally formed.
  • the base portion 8 of the heat sink 4 in the present embodiment has a shape whose longitudinal direction is a direction parallel to the lamp axis AX.
  • the shape of the base portion 8 of the heat sink 4 may be a shape whose longitudinal direction is a direction inclined with respect to the lamp axis AX. Even in that case, an effect similar to that of the present embodiment can be obtained.
  • the semiconductor lamp 1 includes a support 10 and a base holder 11. Each light emitting unit 3 is supported by a support 10. A base holding part 11 is connected to the support 10 on the proximal side. The base 2 is connected to the base holding part 11 on the proximal side. The support body 10 has a plurality of arm portions 10 a that project radially toward the respective light emitting units 3. The base portion 8 of the heat sink 4 is fixed to the arm portion 10a.
  • the method of fixing the heat sink 4 to the support 10 may be any method such as screwing, fitting between a concave portion and a convex portion, insertion, sliding, adhesion, and welding.
  • the support 10 is preferably made of a material having high thermal conductivity, for example, a metal material. By conducting heat from the base portion 8 to the support 10, heat can be radiated from the surface of the support 10, and heat dissipation is further improved. At least a part of the base holding part 11 may be made of an insulating resin material.
  • the base holding part 11 is preferably composed of a resin material, a metal material, or a combination thereof excellent in heat resistance and heat dissipation.
  • the plurality of light emitting units 3 included in the semiconductor lamp 1 are arranged at equal distances from the lamp axis AX and at equal angular intervals around the lamp axis AX.
  • three light emitting units 3 are arranged at intervals of 120 °.
  • Each light emitting unit 3 is in a position where the other light emitting units 3 are rotationally moved around the lamp axis AX.
  • Each light emitting unit 3 is located at a position where the adjacent light emitting units 3 are rotated by 120 ° about the lamp axis AX.
  • FIG. 3 is a perspective view showing a side cover 6 and a reflector 7 provided in the semiconductor lamp 1 shown in FIG.
  • FIG. 4 is a view of the semiconductor lamp 1 shown in FIG. 1 as viewed along the lamp axis AX.
  • FIG. 4 is a view of the semiconductor lamp 1 as seen from the distal side.
  • the side cover 6 covers an opening between two light emitting units 3 adjacent to each other in the circumferential direction.
  • the semiconductor lamp 1 of the present embodiment includes the same number of side covers 6 as the light emitting units 3.
  • the plurality of light emitting units 3 and the side covers 6 are alternately arranged along the circumferential direction.
  • the semiconductor lamp 1 has a lamp internal space surrounded by a plurality of light emitting units 3 and a side cover 6.
  • the lamp internal space is a space inside the semiconductor lamp 1.
  • the light emitted from the light source substrate 5 to the lamp internal space passes through the side cover 6 and is emitted to the space outside the semiconductor lamp 1.
  • the space outside the semiconductor lamp 1 may be referred to as “lamp external space”.
  • the side cover 6 has a curved surface that is curved so as to protrude toward the external space of the lamp.
  • the surface area of the exit surface from which light is emitted to the lamp internal space can be increased, so that excellent illumination efficiency and light distribution characteristics can be obtained.
  • the side cover 6 desirably diffuses and transmits light.
  • the side cover 6 diffuses and transmits light, the light emitted from the side cover 6 to the lamp external space is not only emitted in the normal direction of the surface of the side cover 6 but also from the surface of the side cover 6. Radiated in all directions. As a result, the light distribution characteristic of the semiconductor lamp 1 becomes better.
  • the side cover 6 may be made of a milky white resin material in which particles serving as a light diffusing agent are dispersed in a base material.
  • the side cover 6 desirably has a high haze or haze and a high total light transmittance.
  • the base material of the side cover 6 may be, for example, a polycarbonate resin having excellent strength resistance, heat resistance, and water resistance.
  • light resistance that is, discoloration resistance
  • the base material of the side cover 6 may be another resin, such as an acrylic resin or a polystyrene resin.
  • the light diffusing agent for the side cover 6 may be, for example, silicone fine particles, acrylic fine particles, polystyrene fine particles, or the like.
  • the side cover 6 may be one in which fine irregularities such as dimple processing or embossing are formed on the surface of the transparent substrate, instead of the above configuration.
  • the side cover 6 is preferably attached so that there is no gap between the light emitting unit 3 and the side cover 6.
  • the edge of the side cover 6 contacts the fin 9.
  • the side cover 6 may be fixed to the fin 9 at the contact portion 12 between the side cover 6 and the fin 9. By doing so, the side cover 6 can be supported by the heat sink 4.
  • the first surface 8 a and the fin 9 of the base portion 8 face the outside of the semiconductor lamp 1.
  • the first surface 8a of the base portion 8 and the fins 9 face the lamp external space.
  • Hot air does not accumulate near the first surface 8 a of the base portion 8 and the fins 9.
  • the air permeability to the first surface 8a of the base portion 8 and the fins 9 can be improved.
  • the heat dissipation efficiency of the heat sink 4 by convection and radiation can be increased.
  • the temperature of the semiconductor light source 5a can be lowered, the luminous efficiency of the semiconductor light source 5a can be increased, and the life of the semiconductor light source 5a can be extended.
  • the two side covers 6 adjacent to each other in the circumferential direction are connected to each other via a connecting portion 13.
  • a cylindrical part as a whole is formed.
  • the connecting portion 13 is preferably made of the same material as the side cover 6.
  • the side cover 6 and the connecting portion 13 may be integrally formed.
  • a proximal portion of the side cover 6 is connected to the connecting portion 13.
  • the proximal ends of the plurality of side covers 6 connected via the connecting portion 13 form a circular opening.
  • the reflector 7 is disposed so as to cover the opening.
  • the proximal end of the side cover 6 may be fixed to the outer edge of the reflector 7.
  • the reflector 7 has a circular opening 7a in the central portion.
  • the base 2 projects in a proximal direction from a circular opening 7 a of the reflector 7.
  • the reflector 7 is supported by fixing the inner edge part of the circular opening 7 a to the outer peripheral part of the base holding part 11.
  • FIG. 5 is a cross-sectional view of the semiconductor lamp 1 of the first embodiment.
  • FIG. 5 is a cross-sectional view in a plane including the lamp axis AX. In FIG. 5, the side cover 6 is removed.
  • the base 2 and the light source substrate 5 are electrically connected via a wiring 14.
  • the semiconductor light source 5a is turned on.
  • the wiring 14 is accommodated in a cavity formed in the base 2, the base holding part 11, and the support 10. According to the present embodiment, the wiring 14 that supplies power to the light source substrate 5 is accommodated without being exposed to the external space, so that the wiring 14 can be reliably protected from dirt and the like.
  • the light source substrate 5 includes a connector 5 b connected to the wiring 14. Since the wiring 14 can be electrically connected to the light source substrate 5 by the connector 5b when the semiconductor lamp 1 is assembled, the assemblability can be improved.
  • the semiconductor lamp 1 has a built-in power supply circuit (not shown) that converts AC power applied to the base 2 into DC power, and feeds power from the base 2 to the light source substrate 5 via the power supply circuit. It may be configured to.
  • the surface facing the distal direction of the reflector 7 is a reflecting surface that reflects light.
  • the reflector 7 has a reflecting portion 7b that reflects light.
  • the reflection portion 7 b is disposed on one end side in the longitudinal direction of the heat sink 4 and the base portion 8, that is, on the proximal end side. There is a space between the reflecting portion 7 b and the proximal end of the base portion 8.
  • a light ray R1 in FIG. 5 is an example of light emitted from the semiconductor light source 5a of the light source substrate 5 and reaching the reflecting portion 7b.
  • the reflection unit 7b diffuses and reflects the light. Part of the light diffusely reflected by the reflecting portion 7 b is irradiated on the first surface 8 a of the base portion 8 of the heat sink 4.
  • a light ray R2 in FIG. 5 is an example of light that is reflected by the reflecting portion 7b and applied to the first surface 8a.
  • the reflecting portion 7 b reflects a part of the light emitted from the semiconductor light source 5 a of the light source substrate 5 to the first surface 8 a of the base portion 8 of the heat sink 4.
  • the reflection part 7b in this Embodiment is an example of the illumination means which illuminates the 1st surface 8a.
  • a part of the light reflected by the reflecting portion 7 b is also applied to the fins 9 of the heat sink 4. Therefore, the reflection part 7b is also an example of the illumination means which illuminates the 1st surface 8a and the fin 9.
  • the reflection part 7b may be comprised so that light may be specularly reflected.
  • a region outside the first surface 8 a of the base portion 8 when viewed with a line of sight along the lamp axis AX among the reflecting surfaces of the reflector 7 corresponds to the reflecting portion 7 b.
  • a semiconductor lamp of the comparative example is a semiconductor lamp obtained by removing the reflector 7 from the semiconductor lamp 1 of the first embodiment. That is, the semiconductor lamp of the comparative example does not include the reflecting portion 7b.
  • FIG. 6 is a graph schematically showing a luminance distribution when the semiconductor lamp of the comparative example is viewed from the outer peripheral side. The horizontal axis in FIG. 6 indicates the position in the circumferential direction. As shown in FIG. 6, the luminance distribution in the semiconductor lamp of the comparative example is as follows. Since the light is emitted from the surface of the side cover 6 at the position between the light emitting units 3, the luminance is increased.
  • FIG. 7 is a graph schematically showing a luminance distribution when the semiconductor lamp 1 of the first embodiment is viewed from the outer peripheral side.
  • the horizontal axis in FIG. 7 indicates the position in the circumferential direction.
  • the luminance distribution in the semiconductor lamp 1 of the first embodiment is as follows. Since the light is emitted from the surface of the side cover 6 at the position between the light emitting units 3, the luminance is increased. At the position of the heat sink 4, the first surface 8 a of the base portion 8 is illuminated with the light reflected by the reflecting portion 7 b, so that the luminance is higher than that of the comparative example.
  • the semiconductor lamp 1 of Embodiment 1 the brightness nonuniformity in the circumferential direction can be reduced as compared with the comparative example.
  • the material of the reflector 7 may be, for example, a resin material such as a polycarbonate resin or an acrylic resin, a metal material such as aluminum or an alloy thereof, stainless steel, or a combination of a resin material and a metal material.
  • a highly reflective white coating may be applied to the surface of the reflector 7.
  • the reflector 7 may include a metal reflective film formed by vapor deposition, for example.
  • the surface characteristics of the first surface 8a of the base portion 8 and the fins 9 are desirably light diffusive and highly reflective. For example, highly reflective white paint may be given to those surfaces. According to these configurations, the diffusion of light around the semiconductor lamp 1 can be improved, and a wider light distribution can be achieved.
  • the surface characteristics of the second surface 8b of the base portion 8, the support body 10, and the base holding portion 11 are desirably the same as described above.
  • the method of fixing the side cover 6 and the reflector 7 in the semiconductor lamp 1 is not particularly limited. For example, fitting, insertion, sliding, screwing, adhesion, welding, or two of these is possible. A combination of the above may be used.
  • the light emitted from the semiconductor light source 5a of the light source substrate 5 is reflected by the reflecting portion 7b so that the first surface 8a of the base portion 8 of the heat sink 4 can be illuminated. For this reason, there is an advantage that it is not necessary to provide a separate light source other than the light source substrate 5 installed on the second surface 8 b of the base portion 8.
  • the reflecting portion 7 b is located between the base 2 and the base portion 8 with respect to the longitudinal position of the base portion 8 of the heat sink 4. By disposing the reflection portion 7b at such a position, it is possible to prevent the reflection portion 7b from blocking the light emitted to the lamp external space.
  • the reflection portion 7b in the present embodiment is an example of an illumination portion that illuminates the first surface 8a from one end in the longitudinal direction of the base portion 8, that is, the proximal end.
  • the illuminating unit in the present invention may illuminate the first surface 8a by reflecting light emitted from another light source, like the reflecting unit 7b, or may emit the light itself to illuminate the first surface 8a. It may illuminate.
  • An example of an illumination unit that emits light itself will be described in Embodiment 8.
  • the maximum distance from the lamp axis AX to the outer edge of the reflecting portion 7b is L1
  • the maximum distance from the lamp axis AX to the end of the fin 9 is L2.
  • L1 ⁇ L2 the amount of light emitted from the reflecting portion 7b to the heat sink 4 increases, and the heat sink 4 can be illuminated more brightly.
  • L1 ⁇ L2 may be configured. In the case of L1 ⁇ L2, air can pass through the opening formed between the outer edge of the reflector 7 and the proximal end portion of the side cover 6, so that the heat dissipation becomes better and the semiconductor light source 5a The temperature can be further lowered.
  • the shortest distance between the proximal end of the base 2 and the reflector 7 is L3.
  • the dimension of L3 may be set so that the glove and the reflector 7 do not come into contact with each other.
  • the light emitting unit 3 may further include a light source cover (not shown) that covers the surface of the light source substrate 5 on the semiconductor light source 5a side. It is desirable that the light source cover transmits light normally.
  • the light source cover may be attached to the second surface 8 b of the base portion 8 so as to cover the entire light source substrate 5. That is, the light source substrate 5 may be stored in a closed space surrounded by the light source cover and the base portion 8.
  • the light source cover may be made of a resin material such as polycarbonate resin, acrylic resin, or polystyrene resin.
  • the surface of the light source cover may be subjected to a hard coat process.
  • the light source cover may be waterproof.
  • a waterproof sealing material or adhesive may be provided at the joint between the light source cover and the base portion 8.
  • the sealing material or adhesive may be made of, for example, a soft resin material, a sealing material such as silicone, or a rubber material.
  • the semiconductor lamp 1 has a shape in which the outer diameter is substantially constant along the lamp axis AX.
  • the shape of the semiconductor lamp 1 is not limited to such a shape.
  • the outer diameter of the semiconductor lamp 1 may be maximized at the central portion of the lamp axis AX, and the outer diameter of the semiconductor lamp 1 may gradually decrease from the central portion in the distal direction and the proximal direction.
  • the light that has reached the reflector 7 other than the reflection portion 7b from the semiconductor light source 5a of the light source substrate 5 is reflected toward the lamp internal space.
  • the light reflected in this way toward the lamp inner space passes through the side cover 6 and is emitted to the lamp outer space, whereby the amount of light can be increased.
  • the main part of the semiconductor lamp 1 can be assembled by combining a plurality of light emitting units 3. For this reason, the semiconductor lamp 1 is excellent in assemblability and is advantageous in reducing the manufacturing cost. Further, by changing the number of the light emitting units 3 mounted, lamps having different luminous flux classes can be easily manufactured.
  • each light emitting unit 3 may be provided with an individual translucent cover.
  • the translucent cover has a cylindrical shape having a central axis parallel to the longitudinal direction of the light emitting unit 3 and diffuses and transmits light.
  • the number of light emitting units 3 included in the semiconductor lamp 1 is three has been described.
  • the number of the light emitting units 3 provided in the semiconductor lamp of the present invention is not limited to such a configuration, and may be one, two, four or more.
  • the semiconductor lamp is provided with three or more light emitting units 3, it is particularly advantageous for reducing uneven light distribution and uneven brightness in the circumferential direction.
  • the semiconductor lamp includes only one light emitting unit 3, by providing the illumination means for illuminating the first surface 8a of the base portion 8, it is possible to reduce a decrease in luminance on the first surface 8a side of the base portion 8, and Uneven brightness can be reduced.
  • Embodiment 2 FIG. Next, the second embodiment will be described with reference to FIG. 8. The difference from the first embodiment will be mainly described, and the same or corresponding elements as those described above are denoted by the same reference numerals. Is used to simplify or omit redundant descriptions.
  • FIG. 8 is a perspective view showing the semiconductor lamp 15 according to the second embodiment.
  • the semiconductor lamp 15 further includes a reflector 16.
  • the material of the reflector 16 is the same as or similar to that of the reflector 7.
  • the reflector 16 is disposed at the distal end of the semiconductor lamp 1.
  • the shape of the reflector 16 is a circle centered on the lamp axis AX.
  • the reflector 16 covers the opening surrounded by the distal end of the side cover 6.
  • the surface of the reflector 16 that faces in the proximal direction is a reflection surface that reflects light.
  • the reflector 16 has a reflecting portion 16a that reflects light.
  • a region that is outside the first surface 8a of the base portion 8 when viewed with a line of sight along the lamp axis AX corresponds to the reflecting portion 16a.
  • the reflecting portion 16a is disposed on the other end side in the longitudinal direction of the heat sink 4 and the base portion 8, that is, on the distal end side. There is a space between the reflecting portion 16 a and the distal end of the base portion 8.
  • the reflection part 16a diffuses and reflects the light.
  • a part of the light diffusely reflected by the reflecting portion 16 a is irradiated on the first surface 8 a of the base portion 8 of the heat sink 4.
  • the reflecting portion 16 a reflects a part of the light emitted from the semiconductor light source 5 a of the light source substrate 5 to the first surface 8 a of the base portion 8 of the heat sink 4.
  • the reflection part 16a in this Embodiment is an example of the illumination means which illuminates the 1st surface 8a.
  • a part of the light reflected by the reflecting portion 16 a is also applied to the fins 9 of the heat sink 4. Therefore, the reflection part 16a is also an example of the illumination means for illuminating the first surface 8a and the fins 9.
  • the first surface 8a of the base portion 8 is illuminated from both the reflecting portion 7b and the reflecting portion 16a. For this reason, compared with Embodiment 1, the heat sink 4 can be illuminated more brightly, and the brightness nonuniformity in the circumferential direction can be further reduced.
  • the reflection portion 7b is an example of a first illumination portion that illuminates the first surface 8a from one end in the longitudinal direction of the base portion 8, that is, the proximal end.
  • the reflection part 16a of this Embodiment is an example of the 2nd illumination part which illuminates the 1st surface 8a from the other end of the longitudinal direction of the base part 8, ie, a distal end.
  • the following effects are acquired by providing the illumination part so that the 1st surface 8a may be illuminated from the longitudinal direction both ends of the base part 8.
  • FIG. It is possible to prevent the light emitted from the lamp outside space from being blocked by these illuminating units, and to illuminate the heat sink 4 more brightly.
  • the light that has reached the reflector 16 other than the reflecting portion 16a from the semiconductor light source 5a of the light source substrate 5 is reflected toward the lamp internal space.
  • the light reflected in this way toward the lamp inner space passes through the side cover 6 and is emitted to the lamp outer space, whereby the amount of light can be increased.
  • Embodiment 3 FIG. Next, the third embodiment will be described with reference to FIG. 9. The difference from the first embodiment will be mainly described, and the same or corresponding elements as those described above are denoted by the same reference numerals. Is used to simplify or omit redundant descriptions.
  • FIG. 9 is a cross-sectional view showing the semiconductor lamp 17 according to the third embodiment.
  • FIG. 9 is a cross-sectional view in a plane including the lamp axis AX.
  • the semiconductor lamp 17 is different from the semiconductor lamp 1 of the first embodiment in that a reflector 18 is provided instead of the reflector 7.
  • the shape of the reflector 18 is different from that of the reflector 7.
  • the material of the reflector 18 is the same as or similar to that of the reflector 7.
  • the reflector 18 has a reflecting portion 18a that reflects light.
  • the reflector 18 has a portion inclined with respect to a plane perpendicular to the lamp axis AX.
  • the sloped portion is sloped to transition distally radially outward.
  • the reflection part 18a exists in this inclined part.
  • the reflector 18 has an inner peripheral portion 18b that is closer to the lamp axis AX than the inclined portion.
  • the inner peripheral portion 18b surrounds the outer periphery of the base holding portion 11 in an annular shape.
  • the inner peripheral portion 18b has a plate shape perpendicular to the lamp axis AX.
  • a part of the light emitted from the semiconductor light source 5a of the light source substrate 5 reaches the reflecting portion 18a.
  • a light ray R3 in FIG. 9 is an example of light emitted from the semiconductor light source 5a of the light source substrate 5 and reaching the reflecting portion 18a.
  • the reflection unit 18a diffuses or specularly reflects the light.
  • the light reflected by the reflecting portion 18 a is applied to the first surface 8 a of the base portion 8 of the heat sink 4.
  • a light ray R4 in FIG. 9 is an example of light that is reflected by the reflecting portion 18a and applied to the first surface 8a.
  • the reflecting portion 18 a reflects a part of the light emitted from the semiconductor light source 5 a of the light source substrate 5 to the first surface 8 a of the base portion 8 of the heat sink 4.
  • the reflection part 18a in this Embodiment is an example of the illumination means which illuminates the 1st surface 8a. A part of the light reflected by the reflecting portion 18 a is also applied to the fins 9 of the heat sink 4. Therefore, the reflection portion 18a is also an example of an illumination unit that illuminates the first surface 8a and the fins 9.
  • the following effects can be obtained by making the reflector 18 in the above shape.
  • the reflection part 18a can reflect the light from the light source substrate 5 more efficiently. For this reason, the heat sink 4 can be illuminated more brightly, and luminance unevenness in the circumferential direction can be further reduced.
  • the semiconductor lamp 17 is used in a glove of a lighting fixture, the glove and the reflector 18 are difficult to contact.
  • Embodiment 4 FIG. Next, the fourth embodiment will be described with reference to FIG. 10. The difference from the above-described embodiment will be mainly described, and the same or corresponding elements as those described above are denoted by the same reference numerals. In addition, the overlapping description is simplified or omitted.
  • FIG. 10 is a perspective view showing a semiconductor lamp 20 according to the fourth embodiment.
  • the semiconductor lamp 20 shown in FIG. 10 differs from the semiconductor lamp 1 of the first embodiment in that a reflector 21 is provided instead of the reflector 7.
  • the reflector 21 has a configuration similar to the reflector 18 of the third embodiment.
  • the reflector 21 corresponds to the reflector 18 from which the inner peripheral portion 18b is removed.
  • the semiconductor lamp 20 includes an end surface cover 22 that transmits light.
  • the end surface cover 22 is disposed so as to block the removed inner peripheral portion 18b.
  • the end surface cover 22 surrounds the outer periphery of the base holding part 11 in an annular shape.
  • the end surface cover 22 has a plate shape perpendicular to the lamp axis AX.
  • the end surface cover 22 transmits light from the light source substrate 5 toward the longitudinal direction of the base portion 8.
  • the end surface cover 22 transmits light from the light source substrate 5 in the proximal direction.
  • the end surface cover 22 desirably diffuses and transmits light.
  • the material of the end surface cover 22 can be the same as or similar to that of the side surface cover 6. In the present embodiment, the end surface cover 22 is provided, so that light can be distributed well in the proximal direction.
  • the reflector 21 includes a plurality of reflecting portions 21a.
  • a reflecting portion 21 a is provided for each light emitting unit 3.
  • the configuration and function of the reflecting portion 21a are the same as those of the reflecting portion 18a in the third embodiment.
  • the reflection portion 21 a is adjacent to the end surface cover 22.
  • the reflecting portion 21 a is located radially outward with respect to the end surface cover 22. According to the present embodiment, since the reflecting portion 21a is configured to be adjacent to the end surface cover 22, the reflecting portion 21a and the end surface cover 22 can be provided in a small space.
  • the example in which the end surface cover 22 is disposed on the proximal end side of the semiconductor lamp 20 has been described. Not only such a configuration but also an end face cover may be provided on the distal end side of the semiconductor lamp 20.
  • Embodiment 5 FIG. Next, the fifth embodiment will be described with reference to FIG. 11. The difference from the above-described embodiment will be mainly described, and the same or corresponding elements as those described above are denoted by the same reference numerals. In addition, the overlapping description is simplified or omitted.
  • FIG. 11 is a perspective view showing a semiconductor lamp 23 according to the fifth embodiment.
  • the semiconductor lamp 23 differs from the semiconductor lamp 1 of the first embodiment in that a plurality of reflectors 24 are provided instead of the reflector 7.
  • Each reflector 24 is provided for each light emitting unit 3.
  • the plurality of reflectors 24 project radially from the central portion toward the plurality of light emitting units 3.
  • the plurality of reflectors 24 corresponds to a part of the reflector 18 according to the third embodiment cut out.
  • the reflector 24 includes a reflecting portion 24a.
  • the configuration and function of the reflection unit 24a are the same as those of the reflection unit 18a in the third embodiment.
  • An opening 25 is formed between two reflectors 24 adjacent in the circumferential direction.
  • the opening 25 is formed by being surrounded by the edge of the reflector 24 and the proximal end of the side cover 6. Air can pass through the opening 25 from the lamp interior space to the lamp exterior space or vice versa. Thereby, since it is possible to prevent hot air from being trapped in the lamp internal space, the temperature of the semiconductor light source 5a can be lowered, the luminous efficiency of the semiconductor light source 5a can be further increased, and the life of the semiconductor light source 5a can be extended.
  • Embodiment 6 FIG. Next, the sixth embodiment will be described with reference to FIG. 12. The difference from the first embodiment will be mainly described, and the same or corresponding elements as those described above are denoted by the same reference numerals. Is used to simplify or omit redundant descriptions.
  • FIG. 12 is a perspective view showing a semiconductor lamp 26 according to the sixth embodiment.
  • the semiconductor lamp 26 further includes reflecting portions 27 and 28 in addition to the configuration of the semiconductor lamp 1 of the first embodiment.
  • the reflecting portions 27 and 28 are formed integrally with the side cover 6.
  • the reflecting portions 27 and 28 are adjacent to the side cover 6.
  • the inner and outer surfaces of the side cover 6 are continuous with the inner and outer surfaces of the reflecting portions 27 and 28.
  • the reflection portion 27 faces the first surface 8a at the center portion of the base portion 8 in the longitudinal direction.
  • the heat sink 4 has a notch 29 in which the fin 9 is notched.
  • the notch 29 is an area where the fin 9 at a position facing the reflecting portion 27 is notched.
  • the reflector 27 diffuses or specularly reflects the light.
  • the light reflected by the reflecting portion 27 is applied to the first surface 8 a of the base portion 8 of the heat sink 4.
  • the reflection unit 27 reflects the light from the light source substrate 5 to the first surface 8 a of the base unit 8.
  • the reflection part 27 in this Embodiment is an example of the illumination means which illuminates the 1st surface 8a.
  • a part of the light reflected by the reflecting portion 27 is also applied to the fin 9. Therefore, the reflection unit 27 is also an example of an illumination unit that illuminates the first surface 8 a and the fins 9.
  • the reflection portion 27 in the present embodiment is an example of a central illumination portion that illuminates the first surface 8a from the central portion of the base portion 8 in the longitudinal direction.
  • the central illumination unit to illuminate the first surface 8a from the longitudinal central portion of the base portion 8
  • the reflection unit 27 may reflect a part of light and transmit the remaining light. That is, a part of the light that has reached the inner surface of the reflecting portion 27 from the light source substrate 5 through the notch 29 may pass through the reflecting portion 27 and be emitted to the lamp external space.
  • the distance between the proximal end of the heat sink 4 and the reflector 7 is larger than that in the first embodiment.
  • the reflector 28 is between the proximal end of the heat sink 4 and the outer edge of the reflector 7.
  • a part of the light emitted from the semiconductor light source 5 a of the light source substrate 5 reaches the inner surface of the reflecting portion 28.
  • the light from the light source substrate 5 may directly reach the inner surface of the reflection unit 28.
  • the light from the light source substrate 5 may reach the inner surface of the reflecting portion 28 after being reflected by the reflector 7.
  • the reflector 28 diffuses or specularly reflects the light.
  • the light reflected by the reflecting portion 28 is applied to the first surface 8 a of the base portion 8 of the heat sink 4.
  • the reflection unit 28 reflects the light from the light source substrate 5 to the first surface 8 a of the base unit 8.
  • the reflection part 28 in this Embodiment is an example of the illumination means to illuminate the 1st surface 8a.
  • a part of the light reflected by the reflection unit 28 is also applied to the fin 9. Therefore, the reflection part 28 is also an example of the illumination means which illuminates the 1st surface 8a and the fin 9.
  • the reflecting portion 28 is located between the base 2 and the base portion 8 with respect to the longitudinal position of the base portion 8. By disposing the reflection portion 28 at such a position, it is possible to prevent the reflection portion 28 from blocking the light emitted to the lamp external space.
  • the reflection portion 28 in the present embodiment is an example of an illumination portion that illuminates the first surface 8a from one end in the longitudinal direction of the base portion 8, that is, the proximal end.
  • the illuminating unit can be prevented from blocking light emitted to the lamp external space.
  • the reflection unit 28 may reflect part of the light and transmit the remaining light. That is, a part of the light reaching the inner surface of the reflecting portion 28 from the light source substrate 5 may pass through the reflecting portion 28 and be emitted to the lamp external space.
  • the reflecting portions 27 and 28 are formed integrally with the side cover 6, the luminance unevenness in the circumferential direction can be further reduced without increasing the number of components.
  • Embodiment 7 FIG. Next, the seventh embodiment will be described with reference to FIG. 13. The description will focus on the differences from the first embodiment described above, and the same or corresponding elements as those described above are denoted by the same reference numerals. Is used to simplify or omit redundant descriptions.
  • FIG. 13 is a perspective view showing a part of the semiconductor lamp 30 according to the seventh embodiment.
  • the light source substrate 5 of the semiconductor lamp 30 further includes at least one second semiconductor light source 5c in addition to the semiconductor light source 5a.
  • the second semiconductor light source 5c is turned on by the DC power supplied to the light source substrate 5.
  • the semiconductor light source 5a corresponds to a first semiconductor light source.
  • the optical axis direction of the semiconductor light source 5a is perpendicular to the lamp axis AX.
  • the optical axis direction of the semiconductor light source 5 a is perpendicular to the second surface 8 b of the base portion 8.
  • the optical axis direction of the second semiconductor light source 5c is different from the optical axis direction of the semiconductor light source 5a.
  • the optical axis direction of the second semiconductor light source 5c is inclined with respect to a plane perpendicular to the lamp axis AX.
  • the optical axis direction of the second semiconductor light source 5 c extends so as to approach the reflecting portion 7 b of the reflector 7.
  • the second semiconductor light source 5 c emits light toward the reflecting portion 7 b of the reflector 7.
  • the amount of light reflected by the reflecting portion 7b and applied to the first surface 8a of the base portion 8 can be increased. For this reason, compared with Embodiment 1, the heat sink 4 can be illuminated more brightly, and the brightness nonuniformity in the circumferential direction can be further reduced.
  • Embodiment 8 FIG. Next, the eighth embodiment will be described with reference to FIG. 14 to FIG. 16. The difference from the first embodiment will be mainly described, and the elements common or corresponding to the elements described above are as follows. The same reference numerals are attached, and overlapping descriptions are simplified or omitted.
  • FIG. 14 is a perspective view showing a semiconductor lamp 32 according to the eighth embodiment.
  • FIG. 15 is a view of the semiconductor lamp 32 shown in FIG. 14 as viewed along the lamp axis AX.
  • FIG. 15 is a view of the semiconductor lamp 32 as viewed from the distal side.
  • FIG. 16 is a cross-sectional view of the semiconductor lamp 32 shown in FIG. FIG. 16 is a cross-sectional view in a plane including the lamp axis AX.
  • the semiconductor lamp 32 shown in these drawings is different from the semiconductor lamp 1 of the first embodiment in that a substrate portion 33 is provided instead of the reflector 7. As shown in FIG. 14, the substrate portion 33 is installed at the proximal end of the heat sink 4.
  • the substrate unit 33 has at least one semiconductor light source 33a.
  • the semiconductor light source 33a the one described for the semiconductor light source 5a can be used.
  • the substrate portion 33 in the present embodiment has a plurality of semiconductor light sources 33a. When viewed with a line of sight along the lamp axis AX, the plurality of semiconductor light sources 33a are respectively positioned between the fins 9. At least a part of the light emitted from the semiconductor light source 33 a of the substrate unit 33 passes between the fins 9 and is applied to the first surface 8 a of the base unit 8.
  • the semiconductor light source 33a is preferably protected by being covered with a transparent cover (not shown).
  • the substrate unit 33 in the present embodiment is an example of an illumination unit that illuminates the first surface 8 a of the base unit 8. A part of the light emitted from the substrate unit 33 is also applied to the fins 9 of the heat sink 4. Therefore, the board
  • substrate part 33 is also an example of the illumination means which illuminates the 1st surface 8a and the fin 9.
  • FIG. 1 A part of the light emitted from the substrate unit 33 is also applied to the fins 9 of the heat sink 4. Therefore, the board
  • substrate part 33 is also an example of the illumination means which illuminates the 1st surface 8a and the fin 9.
  • the same or similar effect as in the first embodiment can be obtained by the light emitted from the substrate unit 33 illuminating the first surface 8a. That is, uneven brightness in the circumferential direction can be reduced.
  • the substrate portion 33 is located between the base 2 and the base portion 8 with respect to the longitudinal position of the base portion 8 of the heat sink 4. By arranging the substrate part 33 at such a position, it is possible to prevent the substrate part 33 from blocking the light emitted to the lamp external space.
  • the substrate portion 33 in the present embodiment is an example of an illumination portion that illuminates the first surface 8a from one end in the longitudinal direction of the base portion 8, that is, the proximal end.
  • the illuminating unit can be prevented from blocking light emitted to the lamp external space.
  • the light emitted from the substrate unit 33 can be directly applied to the first surface 8a of the base unit 8. For this reason, compared with Embodiment 1, the brightness
  • the wiring 14 from the base 2 is connected not only to the light source substrate 5 but also to the substrate portion 33. Both the semiconductor light source 5 a of the light source substrate 5 and the semiconductor light source 33 a of the substrate portion 33 are lit by the power applied to the base 2. In the present embodiment, power can be supplied to both the light source substrate 5 and the substrate unit 33 with a simple configuration.
  • the substrate portion 33 may be installed at the distal end of the heat sink 4.
  • Embodiment 9 FIG. Next, the ninth embodiment will be described with reference to FIG. 17. The description will focus on the differences from the first embodiment described above, and elements that are the same as or correspond to the elements described above have the same reference numerals. Is used to simplify or omit redundant descriptions.
  • FIG. 17 is a perspective view showing a part of the semiconductor lamp 34 according to the ninth embodiment.
  • the semiconductor lamp 34 includes both the reflector 24 described in the fifth embodiment and the substrate unit 33 described in the eighth embodiment.
  • the first surface 8 a of the base portion 8 can be illuminated with both the reflected light from the reflector 24 and the light directly irradiated from the substrate portion 33. For this reason, the brightness
  • the substrate section 33 can be combined with other embodiments other than the fifth embodiment.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

Selon la présente invention, une lampe à semi-conducteur (1) est pourvue : d'un dissipateur thermique (4) ; d'un substrat de source de lumière (5) ayant au moins une source de lumière à semi-conducteur (5a) ; et d'une section réfléchissante (7b), qui est un moyen d'éclairage. Le dissipateur thermique (4) est pourvu : d'une section de base de type carte (8) qui a une première surface (8a) faisant face au côté externe de la lampe à semi-conducteur (1) et une seconde surface (8b) sur le côté opposé de la première surface (8a) ; et des ailettes (9) faisant saillie à partir de la première surface (8a) de la section de base (8). Le substrat de source de lumière (5) est disposé sur la seconde surface (8b) de la section de base (8). La section réfléchissante (7b), c'est-à-dire le moyen d'éclairage, éclaire la première surface (8a) de la section de base (8).
PCT/JP2016/079047 2016-09-30 2016-09-30 Lampe à semi-conducteur Ceased WO2018061187A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018541838A JP6620892B2 (ja) 2016-09-30 2016-09-30 半導体ランプ
PCT/JP2016/079047 WO2018061187A1 (fr) 2016-09-30 2016-09-30 Lampe à semi-conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/079047 WO2018061187A1 (fr) 2016-09-30 2016-09-30 Lampe à semi-conducteur

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WO2018061187A1 true WO2018061187A1 (fr) 2018-04-05

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012530345A (ja) * 2009-06-19 2012-11-29 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ランプアセンブリ
JP2014154299A (ja) * 2013-02-07 2014-08-25 Mitsubishi Kakoki Kaisha Ltd Ｌｅｄ照明装置
JP2014165034A (ja) * 2013-02-26 2014-09-08 Hitachi Appliances Inc 電球型照明装置
JP2016051582A (ja) * 2014-08-29 2016-04-11 三菱電機株式会社 ランプ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012530345A (ja) * 2009-06-19 2012-11-29 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ランプアセンブリ
JP2014154299A (ja) * 2013-02-07 2014-08-25 Mitsubishi Kakoki Kaisha Ltd Ｌｅｄ照明装置
JP2014165034A (ja) * 2013-02-26 2014-09-08 Hitachi Appliances Inc 電球型照明装置
JP2016051582A (ja) * 2014-08-29 2016-04-11 三菱電機株式会社 ランプ

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