WO2018059227A1 - Optical communication assembly and preparation method and communication device thereof - Google Patents

Abstract

An optical communication assembly and a preparation method and communication device thereof, relating to the technical field of communications. The optical communication assembly comprises a substrate (1), a first on-chip device (3) and a second on-chip device (4) which are provided on the substrate (1), wherein a first port of the first on-chip device (3) has a height difference with a second port of the second on-chip device (4); and further comprises: an auxiliary coupling layer (2) provided between the first on-chip device (3) and the second on-chip device (4), wherein a waveguide structure (21) communicating the first port with the second port is provided in the auxiliary coupling layer (2) in a sloping manner. Through the method of firstly fixing the two on-chip devices on the substrate, then wrapping the auxiliary coupling layer (2) between the first on-chip device (3) and the second on-chip device (4), and finally forming the waveguide structure (21) in the auxiliary coupling layer (2), the requirements for alignment accuracy of the first port of the first on-chip device (3) and the second port of the second on-chip device (4) are reduced, the optical coupling efficiency of the optical communication assembly is improved, thus the finished product yield and production efficiency of the optical communication assembly is improved.

Description

Optical communication component, preparation method thereof, and communication device

The present application claims priority to Chinese Patent Application No. 201610879122.1, entitled "An optical communication component and its preparation method, communication device", which is filed on September 30, 2016, the entire contents of which are incorporated by reference. In this application.

Technical field

The present invention relates to the field of communications technologies, and in particular, to an optical communication component, a method for fabricating the same, and a communication device.

Background technique

Modern optical communication is a way of communicating with light as a carrier of signals. It requires a variety of functional devices, such as a modulator that converts 1/0 of an electrical signal to a light intensity of 1/0, and a laser that emits light of a different wavelength. , detectors that detect optical signals, optical switches that implement point-to-point routing, and more.

Light will be lost during the transmission process, causing the optical power to drop. If the optical power falls below the receiver's receiving range, the communication will fail. Therefore, the optical amplifier is an indispensable part of optical communication.

In the specific setting, an existing solution is to integrate an optical amplifier into silicon (the optical amplifier cannot be fabricated using silicon, and is currently manufactured using an indium phosphide-based material). Specifically, an area is cut on the silicon substrate, the indium phosphide-semiconductor optical amplifier is pasted, and the input/output ports of the light are aligned; however, the alignment requirements of the optical amplifier in the above scheme are too high: SOI When the input and output ends of the upper silicon waveguide and the semiconductor optical amplifier are aligned, the position deviation 1um introduces 1dB extra loss, and 2um introduces 3dB extra loss (equivalent to 50% loss of light energy); the semiconductor optical amplifier is higher than the semiconductor silicon Higher, so paste, height alignment can only be "tested" out of a suitable manufacturing environment by repeated experiments, and a different type of semiconductor optical amplifier will have to "try" again.

Another solution is to use evanescent wave I/O, which first forms a waveguide on the device for coupling and then attaches it to the surface of the chip. This is destined to still require a high-precision alignment process.

Summary of the invention

The invention provides an optical communication component, a preparation method thereof and a communication device, which are used for improving the communication effect of the optical communication component and reducing the preparation difficulty.

The present invention also provides an optical communication assembly including a substrate, a first on-chip device disposed on the substrate, and a second on-chip device, wherein the first on-chip device has a first port, The second on-chip device has a second port, and the first port and the second port have a height difference in a direction perpendicular to the substrate; further comprising:

An auxiliary coupling layer disposed between the first on-chip device and the second on-chip device, and the auxiliary coupling layer encloses the first port and the second port, wherein the auxiliary coupling layer is obliquely disposed to be A waveguide structure in which the first port is in communication with the second port.

In the above embodiment, the first port of the first on-chip device is reduced by first forming an auxiliary coupling layer between the first on-chip device and the second on-chip device, and then by preparing a waveguide structure in the auxiliary coupling layer. And the alignment accuracy requirement of the second port of the second on-chip device improves the yield of the optical communication component during preparation, and at the same time Increased production efficiency of optical communication components.

In a specific aspect, the first on-chip device and the second on-chip device are multiple, and the plurality of first on-chip devices are in one-to-one correspondence with the plurality of second on-chip devices; the auxiliary coupling layer The inner etch has a waveguide structure corresponding to each pair of the first on-chip device and the second on-chip device. That is, the optical communication component can include a plurality of pairs of one-to-one corresponding first on-chip devices and second on-chip devices, and only one auxiliary coupling layer is needed to etch corresponding to each pair of the first on-chip device and the second on-chip device. Waveguide structure.

In a preferred embodiment, the waveguide structure is a linear waveguide structure to reduce wear.

The invention provides a method for preparing an optical communication component, the method comprising the following steps:

Fixing the first on-chip device and the second on-die device on the same surface of the substrate, wherein the first on-chip device has a first port, the second on-chip device has a second port, and the first port And the second port has a height difference in a direction perpendicular to the substrate;

Forming an auxiliary coupling layer between the first on-chip device and the second on-chip device, and the auxiliary coupling layer wraps the first port and the second port;

A waveguide structure that connects the first port and the second port is formed in the formed auxiliary coupling layer.

In the above solution, the first on-chip device and the second on-chip device are first fixed on the substrate, and then the auxiliary coupling layer is wrapped between the first on-chip device and the second on-chip device, and finally through the auxiliary coupling layer. The method for forming the waveguide structure improves the alignment accuracy requirements of the first port of the first on-chip device, the second port of the second on-chip device, and the auxiliary coupling layer, thereby improving the optical coupling efficiency of the optical communication component, thereby improving the light. The yield of the communication components and the production efficiency.

The fixing of the first on-chip device and the second on-die device on the same surface of the substrate is specifically: bonding the first on-chip device and the second on-chip device to the substrate by flip-chip bonding or bonding The same surface; or the first on-chip device and the second on-chip device are formed directly on the same surface of the substrate. That is, the first on-chip device, the second on-chip device, and the substrate may be in a split structure, and then assembled by soldering, bonding, or bonding, or the first on-chip device and the second on-chip device and substrate are One piece structure. That is, the first on-chip device and the second on-chip device are fixed on the substrate by different preparation methods.

The auxiliary coupling layer is an auxiliary coupling layer made of a polymer material. Such as: polyvinyl chloride, polyethylene, polypropylene and so on.

An auxiliary coupling layer is formed between the first on-chip device and the second on-chip device, and the auxiliary coupling layer encloses the first port of the first on-chip device and the second port of the second on-chip device are:

Filling a liquid or gel-like polymer between the first on-chip device and the second on-chip device and wrapping the first port of the first on-chip device and the second port of the second on-chip device in a liquid or gel state The polymer solidifies to form an auxiliary coupling layer. That is, the first port of the first on-chip device and the second port of the second on-chip device are wrapped by a liquid or gel-like polymer, and then the polymer is cured by different curing methods to form an auxiliary coupling layer, in specific curing. The liquid or gel polymer is cured by heating or ultraviolet irradiation to form an auxiliary coupling layer. It is of course also possible to cure the polymer to form an auxiliary coupling layer by other known curing methods.

When forming the waveguide structure, it is specifically:

Obtaining a coupling center coordinate a1 of the first port of the first on-chip device and a coupling center coordinate a2 of the second port of the second on-chip device;

A waveguide structure is formed in the auxiliary coupling layer by etching between the lines of a1 and a2. That is, by determining the coupling center coordinates of the first port of the first on-chip device and the coupling center of the second port of the second on-chip device Coordinates, then forming a waveguide structure on the line between the two coordinates, that is, connecting the two coordinates through the waveguide structure, thereby ensuring that the formed waveguide structure can connect the first port of the first on-chip device with the second on-chip device The second port is turned on.

In the specific acquisition of the coordinates of the two coupling centers, the method is specifically: after the first on-chip device and the second on-die device are fixed on the same surface of the substrate, the set position on the substrate is taken as the origin, and the measurement is performed. The coordinates of the identification point of the coupling center of the first port of the upper device: b1=(x1, y1, z1), and the coordinate of the identification point of the coupling center of the second port of the second on-chip device b2=(x2, y2 ,z2);

Acquiring the coordinates of the coupling center of the first port of the first on-chip device according to the known relative coordinate of the coupling center of the first port on the first on-chip device and the identification point of the identification point of the coupling center and the coordinate b1 of the identification point of the coupling center A1;

The coordinate a2 of the coupling center of the first port of the second on-chip device is obtained according to the known relative coordinate of the coupling center of the first port of the second on-chip device and the identification point of the coupling point of the coupling center and the coordinate b2 of the identification point of the coupling center.

That is, when the first on-chip device and the second on-die device are fixed on the substrate, first, a point which is relatively easy to measure is searched for as a coupling center point on the first on-chip device and the second on-chip device, and the coupling is measured. The distance between the center's identification point and the coupling center. After the first on-chip device and the second on-die device are mounted on or formed on the substrate, a position is selected on the substrate as an origin, and a three-dimensional coordinate system is established, and then the identification of the coupling center of the device on the first chip is measured. The coordinate b1 of the point in the coordinate system, and the coordinate b2 of the identification point of the coupling center of the device on the second chip in the coordinate system, and obtained by the measured b1 and b2 and the known coupling center and the coordinate point of the coupling center The coordinates a1 and a2 of the coupling center.

After a1 and a2 are obtained, the straight line connecting lines between a1 and a2 is the installation position of the waveguide structure, and in a specific arrangement, the waveguide structure can be formed in the auxiliary coupling layer by laser direct writing technique.

The present invention provides a communication device including a signal transmitting device, and a signal receiving device, further comprising a signal transmitting device disposed between the signal transmitting device and the signal receiving device and configured to signally connect the signal transmitting device and the An optical communication component according to any of the above-mentioned items of the signal receiving device.

In the above aspect, in the above embodiment, the auxiliary coupling layer is formed between the first on-chip device and the second on-chip device, and then the waveguide structure is prepared in the auxiliary coupling layer, thereby reducing the first on-chip The alignment accuracy requirements of the first port of the device and the second port of the second on-chip device improve the yield of the optical communication component during preparation and improve the production efficiency of the optical communication component. Thereby, the production efficiency and communication effect of the communication device are improved.

DRAWINGS

1 is a top plan view of an optical communication component according to an embodiment of the present invention;

2 is a side view of an optical communication component according to an embodiment of the present invention;

3 is a schematic structural diagram of an optical communication component according to another embodiment of the present invention;

4 is a flow chart of preparing an optical communication component according to an embodiment of the present invention;

FIG. 5 is a flowchart of preparing an optical communication component according to an embodiment of the present invention.

Reference mark:

1-substrate 2-auxiliary coupling layer 21-waveguide structure

3-first on-chip device 4-second on-chip device

detailed description

The present invention will be further described in detail with reference to the accompanying drawings, in which FIG. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

Referring to FIG. 1 and FIG. 2 together, an embodiment of the present invention further provides an optical communication component, comprising: a substrate 1, a first on-chip device 3 and a second on-chip device 4 disposed on the substrate 1; Wherein, the first on-chip device 3 has a first port, the second on-chip device 4 has a second port, and the first port and the second port have a height difference in a direction perpendicular to the substrate;

An auxiliary coupling layer 2 disposed between the first on-chip device 3 and the second on-chip device 4, and the auxiliary coupling layer 2 encloses the first port and the second port, and the auxiliary coupling layer 2 is obliquely disposed with the first port and The second port is connected to the waveguide structure 21.

In the above embodiment, the auxiliary coupling layer 2 is formed between the first on-chip device 3 and the second on-chip device 4, and then the waveguide structure 21 is prepared in the auxiliary coupling layer 2, thereby reducing the first wafer. The alignment accuracy requirements of the first port of the device and the second port of the second on-chip device improve the yield of the optical communication component at the time of preparation, and at the same time improve the production efficiency of the optical communication component.

In the optical communication component provided in this embodiment, since the waveguide structure 21 is formed in a later manner, the first port of the first on-chip device 3 and the second port of the second on-chip device 4 may be in a specific arrangement. Different heights, as shown in FIG. 2, in a specific scheme, there is a height difference between the first port of the first on-chip device 3 and the second port of the second on-chip device 4 (the height difference is as shown in FIG. 2 When the placement direction of the optical communication unit shown is the reference direction, the height difference in the vertical direction), the waveguide structure 21 etched in the auxiliary coupling layer 2 is inclined. In the above manner, the first on-chip device 3 and the second on-chip device 4 are made more flexible when disposed, and different levels of on-chip devices can be used as components for optical transmission, which increases the device selectivity of the optical communication component.

As a preferred solution, in order to reduce the loss of the optical signal during propagation, the waveguide structure employs a linear waveguide. However, it should be understood that the waveguide structure provided by the present embodiment is not limited to the above-described linear type, and other forms such as a curved form may be employed.

In a specific solution, as shown in FIG. 3, the first on-chip device 3 and the second on-chip device 4 are multiple, and the plurality of first on-chip devices 3 and the plurality of second on-chip devices 4 are in one-to-one correspondence. The auxiliary coupling layer 2 is etched with a waveguide structure 21 corresponding to each pair of the first on-chip device 3 and the second on-chip device. With continued reference to FIG. 3, in the substrate 1 provided in this embodiment, two columns of on-chip devices are disposed, one of which is the first on-chip device 3 and the other column is the second on-chip device 4, and is located on the first slice of the same row. The device 3 and the second on-chip device 4 are a pair, and the two are connected by a waveguide structure 21. In a specific arrangement, the plurality of first on-chip devices 3 and the second on-chip device 4 share an auxiliary coupling layer 2, only It is necessary to form the waveguide structure 21 for each pair of on-chip devices in the auxiliary coupling layer 2, thereby simplifying the structural composition of the optical communication device, reducing the mounting precision of the optical communication component, and improving the production efficiency of the optical communication component.

Please refer to FIG. 4. FIG. 4 is a flow chart showing the preparation of the optical communication component provided by this embodiment.

The present invention provides a method of fabricating an optical communication component for reducing an optical communication component, the method comprising the steps of:

Fixing the first on-chip device and the second on-die device on the same surface of the substrate, wherein the first on-chip device has a first port, the second on-chip device has a second port, and the first port And the second port has a height difference in a direction perpendicular to the substrate;

Forming an auxiliary coupling layer between the first on-chip device and the second on-chip device, and the auxiliary coupling layer is wrapped The first port and the second port;

A waveguide structure that connects the first port and the second port is formed in the formed auxiliary coupling layer.

In the above method, the first on-chip device and the second on-chip device are first fixed on the substrate, and then the auxiliary coupling layer is wrapped between the first on-chip device and the second on-chip device, and finally through the auxiliary coupling layer. The method of forming the waveguide structure therein improves the alignment accuracy requirements of the first port of the first on-chip device, the second port of the second on-chip device, and the auxiliary coupling layer, since the waveguide structure in the auxiliary coupling layer is installed Processing, therefore, when the first on-chip device and the second on-die device are mounted, the first port of the first on-chip device and the second port of the second on-chip device need only be substantially aligned (positional deviation may be tens On the order of micrometers, thereby reducing the accuracy of the alignment of the first on-chip device, the second on-chip device, and the auxiliary coupling layer. Improve the yield and production efficiency of optical communication components. In addition, since the waveguide structure adopts the effect of post-processing, the accuracy of the waveguide structure connecting the first on-chip device and the second on-chip device is ensured, thereby improving the communication effect of the optical communication component.

In order to facilitate the understanding of the preparation method of the optical communication component provided by the embodiment, the following detailed description will be made in conjunction with the specific drawings and embodiments.

Referring to FIG. 5, FIG. 5 illustrates a method of fabricating an optical communication component according to an embodiment of the present invention. Meanwhile, for ease of understanding, reference may be made to FIG. 1 and FIG. 2 together, wherein FIG. 1 shows a plan view of an optical communication component prepared by the method, and FIG. 2 shows a side of the optical communication component prepared by the method. view.

The mounting precision of the optical communication component provided by the embodiment of the present invention provides a method for preparing an optical communication component. As shown in FIG. 5, the preparation method includes the following steps:

Step 001: fixing the first on-chip device 3 and the second on-chip device 4 on the same surface of the substrate 1; wherein the first on-chip device 3 has a first port, and the second on-chip device 4 has a second port, and The first port and the second port have a height difference in a direction perpendicular to the substrate;

Specifically, the first on-chip device 3, the second on-chip device 4, and the substrate 1 may adopt different structural forms, such as: when the first on-chip device 3, the second on-chip device 4, and the substrate 1 have a separate structure, At the time of assembly, the first on-chip device 3 and the second on-chip device 4 are fixed on the substrate 1 by a connection method to form a stable connection, and in the specific connection, flip-chip bonding, bonding or bonding may be employed. The first on-chip device 3 and the second on-chip device 4 are fixed on the same surface of the substrate 1 in different connection manners; when the first on-chip device 3, the second on-chip device 4, and the substrate 1 are integrated structures, The upper device 3 and the second on-chip device 4 directly form the first on-chip device 3 and the second on-chip device 4 on the same surface of the substrate 1. In this manner, the substrate 1 may be a material such as a silicon substrate or glass that can propagate light. Preferably, the substrate 1 is a substrate made of a silicon material. In the specific preparation process, taking the silicon material as an example, first selecting a silicon material, and then etching or engraving the silicon material, directly etching or engraving the first on-chip device on the silicon material 3 And the second on-chip device 4, thereby integrally forming the first on-chip device 3, the second on-chip device 4, and the silicon substrate 1.

Step 002: measuring the coordinates of the identification point of the coupling center of the first port of the first on-chip device 3 with the set position on the substrate 1 as the origin: b1=(x1, y1, z1), and the second on-chip device 4, the coordinate of the identification point of the coupling center of the second port b2 = (x2, y2, z2);

Specifically, a position is selected on the substrate 1 as an origin. When the substrate 1 is a rectangular parallelepiped, the position point may be selected as a corner point on the substrate 1, a center point of one side, or on the first sheet. A point between the device 3 and the second on-chip device 4 serves as an origin, and a three-dimensional coordinate system is established according to the origin, after which the coordinate b1 of the identification point of the coupling center of the first on-chip device 3 in the coordinate system is measured, and the measurement is performed. The coordinate b2 of the coupling center of the coupling center of the second on-chip device 4 is in the coordinate system. Referring to FIG. 1 and FIG. 2 together, FIG. 1 and FIG. 2 show an optical communication component. The structure after preparation, wherein, as shown in FIG. 2, the heights of the marker points in the optical communication component are different, and therefore, the measured coordinates b1 and b2 include values in the x, y, and z directions, that is, b1=(x1) , y1, z1), b2 = (x2, y2, z2).

Step 003: Acquire a coupling center coordinate a1 of the first port of the first on-chip device 3 and a coupling center coordinate a2 of the second port of the second on-chip device 4;

Specifically, the first port of the first on-chip device 3 is obtained according to the known relative coordinate of the coupling center of the first port on the first on-chip device 3 and the identification point of the coupling center and the coordinate b1 of the identification point of the coupling center. Coordinate a1 of the coupling center; obtaining the first of the second on-chip device 4 according to the known relative coordinate of the coupling center of the first port of the second on-chip device 4 and the identification point of the coupling center and the coordinate b2 of the identification point of the coupling center The coordinate a2 of the coupling center of the port.

When the first on-chip device 3 and the second on-chip device 4 are fixed on the substrate 1, first, on the first on-chip device 3 and the second on-chip device 4, a point which is relatively easy to measure is used as a mark point of the coupling center. And measuring the relative coordinates between the identification point of the coupling center and the coupling center, specifically, using the identification point as the origin, establishing a coordinate system, measuring the coordinates of the coupling center, or establishing a coordinate system with the coupling center as a coordinate, and measuring the identification point The coordinates of the coupling center and the identification point of the coupling center are obtained; the coordinates a1 and a2 of the coupling center are obtained in combination with the measured b1 and b2.

Step 004: forming an auxiliary coupling layer 2 between the first on-chip device 3 and the second on-chip device 4, and the auxiliary coupling layer 2 encloses the first port of the first on-chip device 3 and the second on the second on-chip device 4. port;

Specifically, the auxiliary coupling layer 2 is an auxiliary coupling layer made of a polymer material. Such as: polyvinyl chloride, polyethylene, polypropylene and so on. At the time of preparation, a liquid or gel-like polymer is filled between the first on-chip device 3 and the second on-chip device 4, and wraps the first port of the first on-chip device 3 and the second on-chip device 4. The two ports solidify the liquid or gel polymer to form the auxiliary coupling layer 2. That is, the first port of the first on-chip device 3 and the second port of the second on-chip device 4 are wrapped by a liquid or gel polymer, and then the polymer is cured by different curing methods to form the auxiliary coupling layer 2, In the specific curing, the liquid or gel polymer is cured by heating or ultraviolet irradiation to form the auxiliary coupling layer 2. It is of course also possible to cure the polymer to form the auxiliary coupling layer 2 by other known curing methods.

Step 005: A waveguide structure 21 that communicates with the first port of the first on-chip device 3 and the second port of the second on-chip device 4 is formed in the formed auxiliary coupling layer 2.

In a specific setting, the coupling center coordinate a1 of the first port of the first on-chip device 3 and the coupling center coordinate a2 of the second port of the second on-chip device 4 are obtained through step 003; pass between the lines of a1 and a2 The etching forms the waveguide structure 21 in the auxiliary coupling layer 2. The formation of the waveguide means that there is a region in the auxiliary coupling layer 2, and the refractive index within it is greater than the refractive index outside it, so that the light can be bound and propagated (similar to a water pipe).

That is, by determining the coupling center coordinate a1 of the first port of the first on-chip device 3 and the coupling center coordinate a2 of the second port of the second on-chip device 4, then forming the waveguide structure 21 on the line between the two coordinates, It is thereby ensured that the formed waveguide structure 21 is capable of conducting the first port of the first on-chip device 3 and the second port of the second on-chip device 4. In a specific arrangement, the waveguide structure 21 can be formed in the auxiliary coupling layer 2 by a laser direct writing technique.

The waveguide structure 21 formed by the above means satisfies the following characteristics:

1) having a continuous region in which the refractive index is greater than the refractive index outside the region;

2) one end of the region is connected to the first port of the first on-chip device 3, and the other end is connected to the second port of the second on-chip device 4;

3) the portion of the region connected to the first port of the first on-chip device 3 is centered on a1 or contains a1;

4) the portion of the area connected to the second port of the second on-chip device 4 is centered on a2 or contains a2;

5) When the signal light is transmitted in the optical waveguide, it can be effectively restrained by the optical waveguide without generating a large loss.

It can be seen from the above description that the optical communication component provided by the embodiment is prepared by first fixing the first on-chip device 3 and the second on-chip device 4 on the substrate 1, and then on the first on-chip device 3 and The second on-chip device 4 encloses the auxiliary coupling layer 2, and finally the second port of the first on-chip device 3 and the second on-chip device 4 are improved by forming the waveguide structure 21 in the auxiliary coupling layer 2. The alignment accuracy requirements of the port and the auxiliary coupling layer 2 improve the optical coupling efficiency of the optical communication component, thereby improving the yield and production efficiency of the optical communication component.

The embodiment of the present invention further provides a communication device, including a signal transmitting device, and a signal receiving device, further comprising a signal transmitting device disposed between the signal transmitting device and the signal receiving device and configured to signal the signal transmission An optical communication component according to any of the above-mentioned items of the device and the signal receiving device.

In the above embodiment, in the above embodiment, the auxiliary coupling layer 2 is formed between the first on-chip device 3 and the second on-chip device 4, and then the waveguide structure 21 is prepared by the auxiliary coupling layer 2, thereby The alignment precision requirements of the first port of the first on-chip device and the second port of the second on-chip device are reduced, the yield of the optical communication component at the time of preparation is improved, and the production efficiency of the optical communication component is improved. Thereby, the production efficiency and communication effect of the communication device are improved.

It is apparent that those skilled in the art can make various modifications and variations to the invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention cover the modifications and modifications of the invention

Claims (12)

An optical communication assembly, comprising: a substrate, a first on-chip device disposed on the substrate; and a second on-chip device, wherein the first on-chip device has a first port, the second on-chip The device has a second port, and the first port and the second port have a height difference in a direction perpendicular to the substrate; An auxiliary coupling layer disposed between the first on-chip device and the second on-chip device, and the auxiliary coupling layer encloses the first port and the second port, wherein the auxiliary coupling layer is obliquely disposed to be A waveguide structure in which the first port is in communication with the second port. The optical communication component according to claim 1, wherein said first on-chip device and said second on-chip device are plurality, and said plurality of first on-chip devices and said plurality of second on-chip devices Corresponding to; the auxiliary coupling layer is etched with a waveguide structure corresponding to each pair of the first on-chip device and the second on-chip device. The optical communication module according to claim 1 or 2, wherein the waveguide structure is a linear waveguide structure. A method for preparing an optical communication component, comprising the steps of: Fixing the first on-chip device and the second on-die device on the same surface of the substrate, wherein the first on-chip device has a first port, the second on-chip device has a second port, and the first port And the second port has a height difference in a direction perpendicular to the substrate; Forming an auxiliary coupling layer between the first on-chip device and the second on-chip device, and the auxiliary coupling layer wraps the first port and the second port; A waveguide structure that connects the first port and the second port is formed in the formed auxiliary coupling layer. The method of fabricating an optical communication module according to claim 4, wherein the fixing the first on-chip device and the second on-chip device to the same surface of the substrate is specifically: Pasting the first on-chip device and the second on-chip device onto the same surface of the substrate by flip chip bonding or bonding; or A first on-chip device and a second on-chip device are formed directly on the same surface of the substrate. The method of fabricating an optical communication module according to claim 4, wherein the auxiliary coupling layer is an auxiliary coupling layer made of a polymer material. The method of fabricating an optical communication module according to claim 4, wherein said auxiliary coupling layer is formed between said first on-chip device and said second on-chip device, and said auxiliary coupling layer wraps said first sheet The first port of the upper device and the second port of the second on-chip device are specifically: Filling a liquid or gel-like polymer between the first on-chip device and the second on-chip device and wrapping the first port of the first on-chip device and the second port of the second on-chip device in a liquid or gel state The polymer solidifies to form an auxiliary coupling layer. The method of manufacturing an optical communication module according to claim 7, wherein the solidifying the liquid or gel polymer to form the auxiliary coupling layer is specifically: The liquid or gelatinous polymer is cured by heating or ultraviolet irradiation to form an auxiliary coupling layer. A method of manufacturing an optical communication module according to any one of claims 4 to 8, wherein The waveguide structure connecting the first port and the second port in the formed auxiliary coupling layer is specifically: Obtaining a coupling center coordinate a1 of the first port of the first on-chip device and a second port of the second on-chip device Coupling center coordinate a2; A waveguide structure is formed in the auxiliary coupling layer by etching between the lines of a1 and a2. The method of fabricating an optical communication component according to claim 9, wherein the coupling center coordinate a1 of the first port of the first on-chip device and the coupling center coordinate a2 of the second port of the second on-chip device are specific for: After the first on-chip device and the second on-die device are fixed on the same surface of the substrate, the coordinates of the identification point of the coupling center of the first port of the first on-chip device are measured with the set position on the substrate as the origin. :b1=(x1, y1, z1), and the coordinate of the identification point of the coupling center of the second port of the second on-chip device b2=(x2, y2, z2); Acquiring the coordinates of the coupling center of the first port of the first on-chip device according to the known relative coordinate of the coupling center of the first port on the first on-chip device and the identification point of the identification point of the coupling center and the coordinate b1 of the identification point of the coupling center A1; The coordinate a2 of the coupling center of the first port of the second on-chip device is obtained according to the known relative coordinate of the coupling center of the first port of the second on-chip device and the identification point of the coupling point of the coupling center and the coordinate b2 of the identification point of the coupling center. The method of fabricating an optical communication module according to claim 9, wherein said forming a waveguide structure in said auxiliary coupling layer by etching between said lines of a1 and a2 is specifically: A waveguide structure is formed in the auxiliary coupling layer by a laser direct writing technique between the lines a1 and a2. A communication device, comprising: a signal transmitting device, and a signal receiving device, further comprising: disposed between the signal transmitting device and the signal receiving device and configured to signally connect the signal transmitting device with the signal receiving The optical communication component according to any one of claims 1 to 3 of the device.

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