WO2018057573A1

WO2018057573A1 - Thermal solutions for use in dissipating heat from one or more heat sources within electronic devices

Info

Publication number: WO2018057573A1
Application number: PCT/US2017/052422
Authority: WO
Inventors: Jason L. Strader; Eugene Anthony PRUSS
Original assignee: Laird Technologies Inc
Current assignee: Laird Technologies Inc
Priority date: 2016-09-23
Filing date: 2017-09-20
Publication date: 2018-03-29
Anticipated expiration: 2019-03-23
Also published as: CN206963261U; CN107872943A

Abstract

A thermal solution for use in dissipating heat from one or more heat sources within an electronic device includes a layer of graphite and one or more layers of phase change material coupled to the layer of graphite. When in use, the thermal solution can be positioned between a front plate and a circuit board of the electronic device, between a back plate and a circuit board of the electronic device and/or a combination of both. The thermal solution can include one or more of a layer of thermally conductive foam, a layer of thermally conductive tape, a layer of protective material, etc. Other example thermal solutions are also disclosed.

Description

THERMAL SOLUTIONS FOR USE IN DISSIPATING HEAT FROM ONE OR MORE HEAT SOURCES WITHIN ELECTRONIC DEVICES

CROSS-REFERENCE TO RELATED APPLICATION

[0001 ] This is a PCT International application which claims the benefit of and priority to U.S. Provisional Application 62/398,877 filed September 23, 2016. The entire disclosure of the above application is incorporated herein by reference.

FIELD

[0002] The present disclosure relates to thermal solutions for use in dissipating heat from one or more heat sources within electronic devices.

BACKGROUND

[0003] This section provides background information related to the present disclosure which is not necessarily prior art.

[0004] Electrical components, such as semiconductors, integrated circuit packages, transistors, etc., typically have pre-designed temperatures at which the electrical components optimally operate. Ideally, the pre-designed temperatures approximate the temperature of the surrounding air. But the operation of electrical components generates heat. If the heat is not removed, the electrical components may then operate at temperatures significantly higher than their normal or desirable operating temperature. Such excessive temperatures may adversely affect the operating characteristics of the electrical components and the operation of the associated device.

[0005] To avoid or at least reduce the adverse operating characteristics from the heat generation, the heat should be removed, for example, by conducting the heat from the operating electrical component to a heat sink. The heat sink may then be cooled by conventional convection and/or radiation techniques. During conduction, the heat may pass from the operating electrical component to the heat sink either by direct surface contact between the electrical component and heat sink and/or by contact of the electrical component and heat sink surfaces through an intermediate medium or thermal interface material. The thermal interface material may be used to fill the gap between thermal transfer surfaces, in order to increase thermal transfer efficiency as compared to having the gap filled with air, which is a relatively poor thermal conductor.

DRAWINGS

[0006] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

[0007] Fig. 1 is a side view of a thermal solution or system positionable in a front side of an electronic device and including a graphite layer and phase change material layers according to one exemplary embodiment of the present disclosure.

[0008] Fig. 2 is a side view of a thermal solution positionable in a back side of an electronic device and including a graphite layer according to another exemplary embodiment.

[0009] Fig. 3 is a partial side view of an electronic device including the thermal solution of Fig. 1 and the thermal solution of Fig. 2 according to yet another exemplary embodiment.

[0010] Fig. 4A is an exploded side view of a thermal solution positionable in a front side of an electronic device and including a graphite layer and phase change material layers according to another exemplary embodiment.

[0011] Fig. 4B is a top view of the thermal solution of Fig. 4A.

[0012] Fig. 4C is an exploded isometric view of the thermal solution of Fig. 4A.

[0013] Fig. 5A is an exploded side view of a thermal solution positionable in a back side of an electronic device and including a graphite layer according to yet another exemplary embodiment.

[0014] Fig. 5B is a top view of the thermal solution of Fig. 5A.

[0015] Fig. 5C is a bottom view of the thermal solution of Fig. 5A.

[0016] Fig. 5D is an exploded isometric view of the thermal solution of Fig. 5A. [0017] Corresponding reference numerals indicate corresponding parts and/or features throughout the several views of the drawings.

DETAILED DESCRIPTION

[0018] Example embodiments will now be described more fully with reference to the accompanying drawings.

[0019] A thermal solution or system for use in dissipating heat from one or more heat sources within an electronic device according to one exemplary embodiment of the present disclosure is illustrated in Fig. 1 and indicated generally by reference number 100. As shown in Fig. 1 , the thermal solution 100 includes a graphite layer 102 and a protective layer 104 coupled to one side of the graphite layer 102 and another protective layer 106 coupled to another side (e.g. , an opposing surface) of the graphite layer 102.

[0020] The thermal solution 100 is positioned between a plate 114 and a printed circuit board (PCB) 116 including the heat source(s) (not shown). As a result, the thermal solution 100 may be considered in thermal communication with the plate 114 and the PCB 116, as further explained below.

[0021 ] In the particular exemplary embodiment of Fig. 1, the plate 114 is a front plate in the electronic device. For example, the front plate 114 may be a structural frame (e.g. , an inner screen plate, etc.) within a casing of the electronic device, and can be coupled to a screen (e.g. , a backside of the display) on one side and to the thermal solution 100 on the other side. The PCB 116 may be one or more system and/or auxiliary circuit boards for supporting, for example, the heat sensitive components and/or heat source(s) such as electronic components, etc.

[0022] Heat from the heat source(s) and/or the plate 114 (e.g. , from the display) may be moved to the graphite layer 102 and/or to other thermal components (further described below) where the heat can spread, dissipate, etc. For example, heat can enter the graphite layer 102 along the Z-axis and spread across the graphite layer 102 in a plane substantially parallel with the PCB 116 and/or the plate 114 due to the anisotropic thermal characteristic of the graphite in the graphite layer 102. This plane extends along the X-axis and the Y-axis of the graphite layer 102. The heat can then be absorbed, dissipated, etc. through and out of the thermal solution 100 via the other thermal components, etc.

[0023] The graphite layer 102 may include natural graphite and/or synthetic graphite. For example, in some exemplary embodiments, synthetic graphite is preferred depending on thermal performance, available space, etc. By way of example, the graphite layer 102 may include one or more graphite sheets (e.g., Tgon™ 9000 series graphite sheets, etc.) provided by Laird such as Tgon™ 9017, Tgon™ 9025, Tgon™ 9040, Tgon™ 9070 and/or Tgon™ 9100 synthetic graphite sheets. Additionally and/or alternatively, the graphite sheets may include Tgon™ 800 series electrical and thermally conductive interface pads, such as one or more of Tgon™ 805, Tgon™ 810 and/or Tgon™ 820 natural graphite sheets (sometimes called interface pads).

[0024] The protective layers 104, 106 may be used to help prevent damage to the graphite layer 102, prevent graphite from flaking away, etc. The protective layers 104, 106 can cover top and bottom surfaces of the graphite layer 102 (as shown in Fig. 1 and/or side surfaces of the graphite layer 102. In such examples, the protective layers 104, 106 can contact the top, bottom and/or side surfaces of the graphite layer 102 (via an adhesive). In some preferred exemplary embodiments, the protective layers 104, 106 can extend past the edge of the graphite layer 102 and couple together via an adhesive. In such examples, the protective layers 104, 106 do not contact the side surfaces of the graphite layer 102. Instead, the protective layers 104, 106 and the graphite layer 102 define a space therebetween and adjacent to the side surfaces of the graphite layer 102.

[0025] The protective layers 104, 106 may include any suitable material employable to protect the graphite layer 102. For example, the protective layers 104, 106 may include a polymer such as a thermoplastic polymer (e.g., polyethylene terephthalate (PET), etc.), one or more adhesives (e.g., conductive adhesive film, etc.), etc. In some preferred exemplary embodiments, each protective layer 104, 106 includes a PET layer and a thermally conductive adhesive film between the PET layer and the graphite layer 102. In such examples, the protective layers can have favorable thermal performance so that heat can pass through the layers.

[0026] As shown in Fig. 1, the thermal solution 100 includes various thermal phase change material (TPCM) layers 108. For example, the thermal solution 100 includes two TPCM layers 108a, 108b coupled between the graphite layer 102 and the front plate 114 and three TPCM layers 108c, 108d, 108e coupled between the graphite layer 102 and the PCB 1 16. In particular, the TPCM layers 108a, 108b are coupled to the graphite layer 102 (via the protective layer 104 and adhesive(s)) and the TPCM layers 108c, 108d, 108e are coupled to the graphite layer 102 (via the protective layer 106, adhesive(s) and/or other optional components). Additionally, the TPCM layers 108a, 108b are coupled on opposing sides of the graphite layer 102 adjacent the front plate 114, and the TPCM layers 108c, 108e are coupled on opposing sides of the graphite layer 102 adjacent the PCB 116. The TPCM layer 108d is coupled between the TPCM layers 108c, 108e adjacent the PCB 116.

[0027] Each of the TPCM layers 108 can absorb and release heat from the front plate 114, the PCB 116 and/or the graphite layer 102. This causes a temperature in any one of the TPCM layers 108 to change which may cause the TPCM layer to change phases (e.g. , soften, harden, etc.). For example, if the temperature in the TPCM layer 108a increases above a threshold temperature due to the absorption of heat, the TPCM layer 108a may begin to melt (e.g. , transition from a solid like phase to a liquid like phase). Conversely, if the temperature in the TPCM layer 108a decreases below a threshold temperature due to the release of heat, the TPCM layer 108a may begin to solidify (e.g., transition from a liquid like phase to a solid like phase).

[0028] Each of the TPCM layers 108 may have the same or a different melting threshold temperature. For example, the TPCM layers 108a, 108b, 108c, 108e may have a melting threshold temperature of about 50 degrees Celsius and the TPCM layer 108d may have a melting threshold temperature of about 45 degrees Celsius. Alternatively, all of the TPCM layers 108 may have a melting threshold temperature of about 40 degrees Celsius, about 45 degrees Celsius, about 50 degrees Celsius, about 55 degrees Celsius, etc. In other exemplary embodiments, some of the TPCM layers {e.g., the layers 108a, 108b) may have a melting threshold temperature of more than or less than 50 degrees Celsius, and some of the TPCM layers may have a melting threshold temperature of more than or less than 45 degrees.

[0029] The TPCM layers 108 may include any suitable phase change material depending on, for example, thermal performance, available space, etc. For example, in some preferred exemplary embodiments, one or more of the TPCM layers 108 includes a silicone-free phase change material, silicone based phase change material, etc. By way of example, any one of the TPCM layers 108 may include one or more phase change materials provided by Laird such as Tpcm™ 583, Tpcm™ 585, Tpcm™ 588, Tpcm™ 5810, Tpcm™ 5816 and/or Tpcm™ 780 phase change material.

[0030] As shown in Fig. 1, the thermal solution 100 also includes a conductive tape layer 112 coupled to the graphite layer 102 (via the protective layer 104). In particular, the conductive tape layer 112 is coupled between the graphite layer 102 and the TPCM layer 108d.

[0031 ] The conductive tape layer 112 can be electrically conductive and/or thermally conductive. As such, the conductive tape layer 112 can be in thermal communication with the heat source(s) on the PCB 116, provide shielding and/or grounding within an electronic device including the thermal solution 100, etc. In some preferred exemplary embodiments, the conductive tape layer 112 can function as a portion of an electromagnetic interference (EMI) shield. For example, the conductive tape layer 112 may be a lid for a board level shield. In such examples, the conductive tape layer 112 may be coupled to a fence surrounding one or more components on the PCB 116. As such, the TPCM layer 108d can absorb heat from one or more heat sources surrounded by the board level shield and release that heat to the graphite layer 102 via the conductive tape layer 112.

[0032] The conductive tape layer 112 may include any suitable conductive tape depending on, for example, thermal performance, available space, etc. For example, the conductive tape may include adhesive on one or both sides. In the some preferred exemplary embodiments, the conductive tape may have a thickness of about 30 micrometers, an adhesive power (180 degrees peel) of about 1,000 gf/25mm and a surface resistivity of about 0.3 ohms/square inch.

[0033] As shown in Fig. 1, the thermal solution 100 further includes a conductive foam layer 110 coupled between the graphite layer 102 and the front plate 114. The conductive foam layer 110 can be electrically conductive and/or thermally conductive. As such, the conductive foam layer 110 can be in thermal communication with the front plate 114 and/or the graphite layer 102, provide shielding and/or grounding within the electronic device including the thermal solution 100, etc.

[0034] As shown, the conductive foam layer 110 is coupled to the graphite layer 102 (via the protective layer 104 and adhesive(s)). The conductive foam layer 110 may be in contact with the front plate 114 or coupled to the front plate 114 via one or more other thermally conductive components when the front plate 114 is moved inward toward the PCB 116 and/or the PCB 116 is moved inward toward the front plate 114. In the particular exemplary embodiment of Fig. 1, the conductive foam layer 110 is coupled to the front plate 114 via one or more other thermally conductive components (not shown).

[0035] When the front plate 114 and/or the PCB 116 are moved inward, the conductive foam layer 110 may compress between the front plate 114 and the graphite layer 102. This compression can help force (e.g., bias) the TPCM layers 108c, 108d, 108e against heat sources (not shown) on the PCB 116 and/or the other thermally conductive components against the front plate 114. As a result, greater surface contact and less thermal resistance may be achieved between the conductive foam layer 110 and the graphite layer 102, and between the conductive foam layer 110 and the front plate 114 or the other thermally conductive components.

[0036] The conductive foam layer 110 may include any suitable conductive foam depending on, for example, thermal performance, available space, etc. For example, in some exemplary embodiments, the conductive foam layer 110 may include a foam (e.g., a resilient) layer and metalized fabric coupled to the foam layer via an adhesive. In some examples, the foam layer may be metallized. By way of example, the conductive foam layer 110 may include one or more conductive foams by Laird such as EcoFoam™ conductive foam (e.g., the CF-500 series, etc.), etc.

[0037] Fig. 2 illustrates another thermal solution 200 for use in dissipating heat from one or more heat sources within an electronic device. As shown, the thermal solution 200 includes a graphite layer 202, protective layers 204, 206, a TPCM layer 208, a conductive tape layer 210 and a thermally conductive grease layer 212. The graphite layer 202 is coupled between the protective layers 204, 206, the TPCM layer 208 is coupled to the protective layer 206 (via an adhesive), and the thermally conductive grease layer 212 is coupled to the protective layer 204 via the conductive tape layer 210.

[0038] As shown in Fig. 2, the thermal solution 200 is positioned between a plate 214 and a PCB 216 supporting one or more heat source(s) (not shown). As such, the thermal solution 200 may be considered in thermal communication with the plate 214 and the PCB 216.

[0039] In the particular exemplary embodiment of Fig. 2, the plate 214 is a back plate in the electronic device. For example, the back plate 214 may be a structural frame within a casing of the electronic device and adjacent to the back side of the casing. In particular, the plate 214 may be an inner structural frame of the electronic device farthest from the screen (e.g., the display). Put another way, the plate 214 may be the inner structural frame of the electronic device closest to the back side of the casing. The PCB 216 may be one or more system and/or auxiliary circuit boards for supporting, for example, the heat sensitive components and/or heat source(s) such as electronic components, etc.

[0040] The graphite layer 202 may be similar to the graphite layer 102 of Fig. 1. For example, heat from the heat source(s) may be moved to the graphite layer 202 where the heat can spread, dissipate, etc. In such exemplary embodiments, the heat can enter the graphite layer 202 along its Z-axis and spread across the graphite layer 202 in a plane (e.g., the X-axis plane and the Y-axis plane) substantially parallel with the PCB 216 and/or the plate 214 due to the anisotropic thermal characteristic of the graphite in the graphite layer 202. This ensures heat is moved away from the PCB 216 (and heat sensitive components on the PCB 216), and spread to avoid hot spots on the back plate 214 which may heat corresponding locations on the back side of the casing.

[0041 ] Similar to the graphite layer 102 of Fig. 1, the graphite layer 202 of Fig. 2 may include natural graphite and/or synthetic graphite. For example, in some exemplary embodiments, natural graphite is preferred depending on thermal performance, available space, etc. By way of example, the graphite layer 202 may include the same or different synthetic graphite sheets and/or natural graphite sheets.

[0042] Additionally, the protective layers 204, 206 may be similar to the protective layers 104, 106 of Fig. 1. For example, the protective layers 204, 206 may be used for similar purposes, include similar materials, etc. as the protective layers 104, 106 of Fig. 1.

[0043] Further, the TPCM layer 208 may be similar to any one or more of the TPCM layers 108 of Fig. 1. For example, the TPCM layer 208 may function similar to and include similar phase change material(s) as the TPCM layers 108 of Fig. 1 explained above.

[0044] The conductive tape layer 210 may be similar to the conductive tape layer 112 of Fig. 1. For example, the conductive tape layer 210 may include similar conductive tape(s) as the conductive tape layer 112 of Fig. 1.

[0045] As explained above, the thermally conductive grease layer 212 is coupled between the conductive tape layer 210 and the PCB 216. In some exemplary embodiments, the thermally conductive grease layer 212 may be in contact with the PCB 216 or coupled to the PCB 216 via one or more other thermally conductive components when the back plate 214 is moved inward toward the PCB 216 and/or the PCB 216 is moved inward toward the back plate 214. In the particular exemplary embodiment of Fig. 2, the thermally conductive grease layer 212 is coupled to the PCB 216 via one or more other thermally conductive components (not shown).

[0046] The thermally conductive grease layer 212 can provide a suitable interface between the PCB 216 (and/or other thermally conductive components coupled to the PCB 216) and the graphite layer 202. For example, the thermally conductive grease layer 212 can act as a gap filler to ensure high surface contact and low thermal resistance between the PCB 216 and the thermal solution 200.

[0047] The thermally conductive grease layer 212 may include any suitable thermally conductive grease depending on, for example, thermal performance, etc. For example, in some preferred exemplary embodiments, the thermally conductive grease layer 212 may include silicone-free thermal grease. By way of example, the thermally conductive grease layer 212 may include one or more thermally conductive greases provided by Laird such as Tgrease™ 2500 series thermal grease and/or another suitable grease including, for example, Tgrease™ 980 thermal grease, Tgrease™ 300X thermal grease, Tgrease™ 880 thermal grease, Tgrease™ 1500 thermal grease, etc.

[0048] Although Figs. 1 and 2 respectively illustrate the thermal solution 100 and the thermal solution 200 as each including particular layers in a particular arrangement, it should be apparent to one skilled in the art that the thermal solution 100 and/or the thermal solution 200 may include more or less layers, layers arranged in another suitable manner, etc. For example, although the thermal solution 100 is shown to include the graphite layer 102, the protective layers 104, 106, the TPCM layers 108, the conductive foam layer 110, and the conductive tape layer 112, any one or more of the layers may be removed. Additionally and/or alternatively, the thermal solution 100 may not include five different TPCM layers 108, the conductive foam layer 110, and/or the conductive tape layer 112. In other exemplary embodiments, the thermal solution 100 may include seven TPCM layers, three conductive foam layers, etc.

[0049] Additionally, each of the layers of the thermal solution 100 and the thermal solution 200 may represent one or more particular components. For example, the TPCM layer 208 of Fig. 2 may include two separate phase change materials adjacent to each other. Likewise, the conductive grease layer 212 of Fig. 2 may include multiple thermal grease positions each separate from the other positions.

[0050] In some exemplary embodiments, the thermal solution 100, the thermal solution 200, and/or another suitable thermal solution may be employed together in an electronic device. In such examples, the PCB 116 of Fig. 1 and the PCB 216 of Fig. 2 may be the same PCB or different PCBs in the electronic device. For example, the Fig. 3 illustrates an electronic device 300 including the thermal solution 100 of Fig. 1, the thermal solution 200 of Fig. 2, the front plate 114, the back plate 214, and a PCB 316 coupled between the thermal solutions 100, 200. The PCB 316 corresponds to the PCB 116 of Fig. 1 and the PCB 216 of Fig. 2.

[0051 ] As explained above, the thermal solution 100 is in thermal communication with the front plate 114 and the thermal solution 200 is in thermal communication with the back plate 214. For example, the thermal solution 100 may be in contact with the front plate 114, coupled to the front plate 114 via one or more other thermally conductive components, etc. Likewise, the thermal solution 200 may be in contact with the back plate 214, coupled to the back plate 214 via one or more other thermally conductive components, etc.

[0052] Similarly, the thermal solutions 100, 200 are in thermal communication with the PCB 316. For example, and as shown in Fig. 3, the thermal solutions 100, 200 are in contact with heat sources 302 arranged on the PCB 316. In particular, the TPCM layer 108c is in contact with the heat source 302a, the TPCM layer 108d is in contact with the heat source 302b, the TPCM layer 108e is in contact with the heat source 302c, and the thermally conductive grease layer 212 is in contact with the heat source 302d. In other exemplary embodiments, the thermally conductive grease layer 212 and/or any one of the TPCM layers 108 may contact the PCB 316, another component supported by the PCB 316, etc.

[0053] As explained above, the conductive tape layer 112 of the thermal solution 100 may be a portion of an EMI shield. For example, and as shown in Fig. 3, the electronic device 300 includes a board level shield 304 having a fence 306 surrounding the heat source 302b and/or other electronic components (not shown). As shown, the conductive tape layer 112 is placed over and coupled to the fence 306. As such, the conductive tape layer 112 functions as the lid of the board level shield 304.

[0054] Figs. 4A, 4B and 4C illustrate another thermal solution 400 for dissipating heat from one or more heat sources within an electronic device. The thermal solution 400 is substantially similar to the thermal solution 100 of Fig. 1. For example, the thermal solution 400 can be positioned between a PCB and a plate (e.g. , a front plate, etc.) for dissipating heat from the PCB, the plate, etc.

[0055] Similar to the thermal solution 100 of Fig. 1, the thermal solution 400 includes a graphite layer 402, protective layers 404, 406, five TPCM layers 408a, 408b, 408c, 408d, 408e, a conductive foam layer 410, and a conductive tape layer 412. Each of the layers of the thermal solution 400 may be coupled to one or more adjacent layers via adhesive and/or another suitable material. The layers in the thermal solution 400 may function similar to the corresponding layers in the thermal solution 100 of Fig. 1. For example, the graphite layer 402 may function similar to the graphite layer 102.

[0056] In the particular exemplary embodiment of Fig. 4, the graphite layer 402 includes synthetic graphite, and may be formed of one or more sheets of Tgon™ 9000 series graphite sheets (e.g., Tgon™ 9025 graphite sheets, etc.). Additionally, the TPCM layers 408a, 408b, 408c, 408e may be formed of Tpcm™ 580 series phase change material having a thickness of about 0.003 inches (e.g. , Tpcm™ 583 phase change material, etc. ), and the TPCM layer 408d may be formed of a Tpcm™ 780 series phase change material having a thickness of about 0.016 inches (e.g. , Tpcm™ 7816 phase change material, etc.). Further, the conductive foam layer 410 may be formed of EcoFoam™ conductive foam (e.g. , the CF-500 series, etc.) having a thickness of about 0.3 mm (e.g. , CF-503 conductive foam, etc.).

[0057] As shown in Fig. 4A, the protective layers 404, 406 each include a PET layer having a thickness of about 10 microns and an adhesive on a side of the PET layer adjacent the graphite layer 402. The adhesive may be, for example, a thermally conductive adhesive film and/or another suitable adhesive, as explained above.

[0058] The conductive tape layer 412 may be substantially similar to the conductive tape layer 112 of Fig. 1. For example, the conductive tape layer 412 may include a conductive tape having a thickness of about 30 micrometers, an adhesive power (180 degrees peel) of about 1,000 gf/25mm, a surface resistivity of about 0.3 ohms/square inch, etc. [0059] The particular dimensions of the layers in the thermal solution 400 (e.g., the width, length, thickness, relative angles, etc. of the layers) may be adjusted depending on, for example, thermal performance, available space, etc. For example, the TPCM layer 408a may have a length of 27 mm and a width of 16 mm in Fig. 4B. In other exemplary embodiments, the length may be smaller or larger than 27 mm and/or the width may be smaller or larger than 16 mm.

[0060] Figs. 5A, 4B, 5C and 5D illustrate another thermal solution 500 for dissipating heat from one or more heat sources within an electronic device. The thermal solution 500 is substantially similar to the thermal solution 200 of Fig. 2. For example, the thermal solution 500 can be positioned between a PCB and a plate (e.g., a back plate, etc.) for dissipating heat from the PCB, etc.

[0061 ] Similar to the thermal solution 200 of Fig. 2, the thermal solution 500 includes a graphite layer 502, protective layers 504, 506, a TPCM layer 508, a conductive tape layer 510, and a thermally conductive grease layer 512. Each of the layers of the thermal solution 500 may be coupled to one or more adjacent layers via adhesive and/or another suitable material. The layers in the thermal solution 500 may function similar to the corresponding layers in the thermal solution 200 of Fig. 2. For example, the graphite layer 502 may function similar to the graphite layer 202.

[0062] In the particular exemplary embodiment of Fig. 5, the graphite layer 502 includes natural graphite, and may be formed of one or more sheets of Tgon™ 800 series graphite sheets (e.g., Tgon™ 805 graphite sheets, etc.). The TPCM layer 508 may be formed of Tpcm™ 580 series phase change material having a thickness of about 0.008 inches (e.g., Tpcm™ 588 phase change material, etc.). Additionally, and as shown in Fig. 5A, the thermally conductive grease layer 512 may be formed of Tgrease™ 2500 series thermal grease.

[0063] The protective layers 504, 506 and the conductive tape layer 510 of Fig. 5 may be substantially similar to the protective layers 404, 406 and the conductive tape layer 412 of Fig. 4. For example, each protective layer 504, 506 may include a PET layer having a thickness of about 10 microns and an adhesive on a side of the PET layer adjacent the graphite layer 502, as shown in Fig. 5A.

[0064] As shown in Figs. 5A, 5C and 5D, the thermally conductive grease layer 512 includes seven different conductive grease portions coupled to the conductive tape layer 510. As shown best in Figs. 5C, the conductive grease portions are arranged in a particular pattern to provide a suitable interface between a substrate (e.g., a PCB, etc.) and the thermal solution 500, between one or more thermally conductive components coupled to the substrate and the thermal solution 500, etc. In other exemplary embodiments, the conductive grease portions may be arranged in another suitable pattern depending on design requirements, etc.

[0065] Additionally, although the thermally conductive grease layer 512 includes seven different conductive grease portions, it should be apparent to those skilled in the art that more or less conductive grease portions may be employed. For example, the thermally conductive grease layer 512 may be formed of one grease portion, three grease portions, nine grease portions, etc. depending on design requirements, etc.

[0066] The particular dimensions of the layers in the thermal solution 500 (e.g., the width, length, thickness, relative angles, etc. of the layers) may be adjusted depending on, for example, thermal performance, available space, etc. For example, the TPCM layer 508 may have a length of 67.5 mm in Fig. 5B. In other exemplary embodiments, the length may be smaller or larger than 67.5 mm.

[0067] The heat sources disclosed herein may be any component in an electronic device that generates heat itself, and/or that emits (e.g., radiates, etc.) heat generated by itself and/or by another adjacent component. The heat sources may include, for example, one or more processors, storage devices (e.g., hard drives, etc.), power supplies, etc.

[0068] The electronic devices disclosed herein may be any suitable device having electronic components such as one or more processors, storage devices (e.g., hard drives, etc.), etc. The electronic devices may include, for example, cell phones (e.g., smart phones, etc.), tablets, laptops, desktop computers, personal digital assistants (PDAs), gaming consoles, etc. [0069] Additionally, although the thermal solutions described above and shown in Figs. 1-5 relate to dissipating heat from heat sources on PCB(s), it should be apparent that heat can be dissipated from another suitable substrate such as a circuit board, etc.

[0070] The thermal solutions disclosed herein may serve multiple purposes. For example, and as explained above, the thermal solutions can dissipate heat in an electronic device, assist in EMI shielding, etc. In some examples, the thermal solutions can spread heat across a plane (e.g., the X-axis plane and the Y-axis plane as explained above) so that the heat can dissipate evenly.

[0071 ] Exemplary embodiments may include one or more Tgon™ 9000 series graphite sheets. Tgon™ 9000 series graphite sheets comprise synthetic graphite thermal interface materials having a carbon in-plane mono-crystal structure and that are ultra-thin, light-weight, flexible and offer excellent in-plane thermal conductivity. Tgon™ 9000 series graphite sheets are useful for a variety of heat spreading applications where in- plane thermal conductivity dominates and in limited spaces. Tgon™ 9000 series graphite sheets may have a thermal conductivity from about 500 to about 1900W/mK, may help reduce hot spots and protect sensitive areas, may enable slim device designs due to the ultra-thin sheet thickness of about 17 micrometers to 25 micrometers, may be bight weight with density from about 2.05 g/cm 3 to 2.25 g/cm 3 , may be flexible and able to withstand more than 10,000 times bending with radius of 5 millimeters. Table 1 below includes addition details about Tgon™ 9000 series graphite sheets.

[0072] Exemplary embodiments may include one or more Tgon 800 series electrical and thermally conductive interface pads. Tgon™ 800 series electrical and thermally conductive interface pads may be used where electrical isolation is not required and is ideal for where electrical contact and thermal transfer are desired. Tgon™ 800 series electrical and thermally conductive interface pads have a grain-oriented, plate-like structure that may provide a thermal conductivity of about 240 W/mK in the XY plane and about 5 W/mK through the z-axis. Tgon™ 800 series electrical and thermally conductive interface pads may comprise about 98% or more of graphite, may have a low thermal resistance, and may have a thickness of about 0.125mm, 0.13mm, 0.25 mm, 0.50 mm, 0.51 mm, etc. Table 2 below includes addition details about Tgon™ 800 series electrical and thermally conductive interface pads.

[0073] Exemplary embodiments may include one or more Tpcm 580 series phase change materials. Tpcm™ 580 series phase change materials may be inherently tacky, flexible, and exceptionally easy-to-use. Tpcm™ 580 series phase change materials may have thickness of about 0.003 inches, 0.005 inches, 0.008 inches, 0.010 inches, 0.016 inches, etc. At temperatures above its transition temperature (e.g., about 50°C (122°F), etc.), Tpcm™ 580 series phase change materials may begin to soften and flow, filling microscopic irregularities of the components it comes into contact with, thereby providing an interface with low thermal contact resistance (e.g., 0.013°C-in fW at 50 psi, etc.). The gradual change in viscosity (softening) helps to reduce migration or pump-out. Tpcm™ 580 series phase change materials may include a top tabbed liner that can be removed immediately at assembly or provide a protective cover during shipping, and can be removed at assembly. Tpcm™ 580 series phase change materials may be meet environmental requirements including RoHS.

[0074] Table 3 below includes addition details about Tpcm™ 580 series phase change materials.

[0075] Exemplary embodiments may include one or more Tpcm 780 phase change materials. Tpcm™ 780 phase change material may be inherently tacky and may be easy to rework. Tpcm™ 780 phase change material may be silicone-free, soft, and begin to soften and flow at approximately 45^HC. Tpcm™ 780 phase change material may reduce contact thermal resistance by filling microscopic irregularities of the components it contacts, and may be designed to reduce migration or pump out at CPU operating temperatures. Tpcm™ 780 phase change material may have a material formulation that softens but does not fully change phase, may be soft at room temperature such that there is less stress on the board during assembly, may be RoHS Compliant, may have 94V0 UL Flammability Rating and be naturally tacky at room temperature requiring no adhesive. Table 4 below includes addition details about Tpcm™ 780 phase change material.

[0076] Exemplary embodiments may include one or more CF-500 Series EcoFoam™ conductive foams. CF-500 Series EcoFoam™ conductive foam may be used for shielding and grounding by providing X, Y and Z-axis conductivity, thereby enhancing the shielding effectiveness, such as for low-cycling applications including input/output (I/O) shielding, other non-shear standard connectors, etc. Conductive PSA tape may be along or on one side of the CF-500 Series EcoFoam™ conductive foam. CF- 500 Series EcoFoam™ conductive foam may be RoHS com plia nt a nd halogen-free per IEC-61249-2-21 standard. CF-500 Series EcoFoam™ conductive foam may have excellent z-axis conductivity to provide effective EMI shielding and grounding and have low compression forces that allow for use of lighter materials. Table 5 below includes addition details about CF-500 Series EcoFoam™ conductive foam.

[0077] Exemplary embodiments may include one or more Tgrease 2500 series thermal greases. Tgrease™ 2500 series thermal grease may comprise a silicone-free thermal grease suitable having a thermal conductivity of about 3.8 W/mK. Tgrease™ 2500 series thermal grease may thoroughly wet out thermal surfaces to create very low thermal resistance. Tgrease™ 2500 series thermal grease eliminates the migration issues associated with silicone-based grease thereby providing superior reliability. Tgrease™ 2500 series thermal grease is ideal for situations where automatic dispensing and screen printing are required. Tgrease™ 2500 series thermal grease may is non-toxic and environmentally safe. Table 6 below includes addition details about Tgrease™ 2500 series thermal grease.

[0078] Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

[0079] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having," are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.

[0080] When an element or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. [0081 ] The term "about" when applied to values indicates that the calculation or the measurement allows some slight imprecision in the value (with some approach to exactness in the value; approximately or reasonably close to the value; nearly). If, for some reason, the imprecision provided by "about" is not otherwise understood in the art with this ordinary meaning, then "about" as used herein indicates at least variations that may arise from ordinary methods of measuring or using such parameters. For example, the terms "generally", "about", and "substantially" may be used herein to mean within manufacturing tolerances.

[0082] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

[0083] Spatially relative terms, such as "inner," "outer," "beneath," "below," "lower," "above," "upper," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0084] The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Claims

CLAIMS What is claimed:

1. A thermal solution for use in dissipating heat from one or more heat sources within an electronic device including a screen, a front plate adjacent the screen, and a circuit board, the thermal solution comprising:

a layer of graphite positionable between the front plate and the circuit board of the electronic device; and

one or more layers of phase change material coupled to the layer of graphite.

2. The thermal solution of claim 1, further comprising a layer of thermally conductive tape coupled to the layer of graphite.

3. The thermal solution of claim 2, wherein at least one of the one or more layers of phase change material is coupled to the layer of graphite via the layer of thermally conductive tape.

4. The thermal solution of claim 2 or 3, wherein the layer of thermally conductive tape is a portion of an electromagnetic interference shield positionable in the electronic device.

5. The thermal solution of any one of claims 1 to 4, wherein the layer of graphite includes synthetic graphite.

6. The thermal solution of any one of claims 1 to 5, further comprising:

a layer of thermally conductive foam coupled to the layer of graphite; and/or a layer of protective material coupled to the layer of graphite.

7. The thermal solution of any one of claims 1 to 6, wherein the one or more layers of phase change material includes five layers of phase change material.

8. A thermal solution for use in dissipating heat from one or more heat sources within an electronic device including a casing having a screen side and a back side opposing the screen side, a back plate adjacent the back side of the casing, and a circuit board, the thermal solution comprising:

a layer of graphite positionable between the back plate and the circuit board of the electronic device; and one or more layers of phase change material coupled to the layer of graphite.

9. The thermal solution of claim 8, wherein the layer of graphite includes a first surface adjacent the back plate and a second surface adjacent the circuit board and wherein the one or more layers of phase change material includes one layer of phase change material coupled to the first surface of the layer of graphite.

10. The thermal solution of claim 8 or 9, further comprising a layer of thermally conductive tape coupled to the layer of graphite.

11. The thermal solution of any one of claims 8 to 10, wherein the layer of graphite includes natural graphite.

12. The thermal solution of any one of claims 8 to 11, further comprising: a layer of protective material coupled to the layer of graphite; and/or

a layer of thermally conductive grease coupled to the layer of graphite.

13. A thermal solution for use in dissipating heat from one or more heat sources within an electronic device including a casing having a screen side and a back side opposing the screen side, a front plate adjacent the screen side of the casing, a back plate adjacent the back side of the casing, and a circuit board, the thermal solution comprising:

a first layer of graphite positionable between the front plate and the circuit board of the electronic device;

a second layer of graphite positionable between the back plate and the circuit board of the electronic device; and

a plurality of layers of phase change material, at least one of the layers of phase change material coupled to the first layer of graphite and at least another one of the layers of phase change material coupled to the second layer of graphite.

14. The thermal solution of claim 13, wherein:

the first layer of graphite includes synthetic graphite; and

the second layer of graphite includes natural graphite.

15. The thermal solution of claim 13 or 14, further comprising a layer of thermally conductive tape coupled to the first layer of graphite.

16. The thermal solution of claim 15, wherein the layer of thermally conductive tape is a portion of an electromagnetic interference shield positionable in the electronic device.

17. The thermal solution of any one of claims 13 to 16, further comprising a layer of thermally conductive foam coupled to the first layer of graphite.

18. The thermal solution of any one of claims 13 to 17, wherein:

the first layer of graphite includes a first surface and a second surface opposing the first surface;

the plurality of layers of phase change material includes one or more layers of phase change material coupled to the first surface of the first layer of graphite and one or more layers of phase change material coupled to the second surface of the first layer of graphite.

19. The thermal solution of any one of claims 13 to 18, further comprising: a layer of thermally conductive tape coupled to the second layer of graphite; and/or

a layer of thermally conductive grease coupled to the second layer of graphite.

20. The thermal solution of any one of claims 13 to 19, wherein the second layer of graphite includes a first surface adjacent the back plate and a second surface adjacent the circuit board and wherein said another one of the layers of phase change material is coupled to the first surface of the second layer of graphite.