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WO2017115603A1 - Inducteur monté en surface, et procédé de fabrication de celui-ci - Google Patents

Inducteur monté en surface, et procédé de fabrication de celui-ci Download PDF

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Publication number
WO2017115603A1
WO2017115603A1 PCT/JP2016/085625 JP2016085625W WO2017115603A1 WO 2017115603 A1 WO2017115603 A1 WO 2017115603A1 JP 2016085625 W JP2016085625 W JP 2016085625W WO 2017115603 A1 WO2017115603 A1 WO 2017115603A1
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WO
WIPO (PCT)
Prior art keywords
molded body
resin molded
coil
notch
metal magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/085625
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English (en)
Japanese (ja)
Inventor
敬太 宗内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2017115603A1 publication Critical patent/WO2017115603A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings

Definitions

  • the present disclosure relates to a surface-mount inductor and a method for manufacturing the same, and more particularly to a surface-mount inductor in which at least one coil is embedded in a resin molded body containing metal magnetic powder and a method for manufacturing the same.
  • a conventional surface-mount inductor is a surface-mount inductor in which a coil formed by winding a conductive wire in a resin molded body containing metal magnetic powder is embedded, with the coiled end exposed to the end surface of the resin molded body.
  • an external terminal is formed across four surfaces adjacent to the end face and the end face of the resin molded body, and the external terminal and the coil are connected (for example, Patent Document 1).
  • the distance between the mounting substrate and its upper substrate, shield case, and the like, and the distance between other electronic components mounted adjacent to each other have become smaller.
  • the terminals formed on the upper substrate or shield case and the upper surface of the surface mount inductor come into contact with each other, short-circuit between the upper substrate or shield case, or the terminals of adjacent electronic components come into contact with each other. There is a possibility that a short circuit occurs between the two.
  • a coil 61 is formed by winding a conductive wire, and the coil 61 is formed in a molded body 62 formed of a sealing material containing magnetic powder and resin.
  • the lead-out ends 64 a and 64 b of the coil 61 are drawn out to the bottom surface of the molded body 62, and the lead-out end of the coil 61 is used as the external terminal 64, or a conductive paste is connected to the lead-out end of the coil 61.
  • the external terminal 64 is described.
  • a surface mount inductor having a structure in which the coil drawing end is drawn out to the bottom surface of the molded body has a problem that the structure of the coil drawing end is complicated.
  • the surface mount inductor having the external terminals only on the bottom surface of the resin molded body for example, the one shown in the schematic longitudinal sectional view of FIG. That is, a coil formed by winding a conducting wire is built in the resin molded body 71, and the drawn end portion of the coil is exposed on the side surface of the resin molded body.
  • a pair of external terminal electrodes 74a and 74b, so-called five-face electrodes, are formed by using a plating process or a conductive paste over the side face and four faces adjacent to the side face.
  • the resin molded body 71 on which the external terminal electrode 74 is formed is covered with an insulating resin 75 other than the bottom surface, and only the bottom surface of the external terminal electrode 74 is used as an external terminal.
  • a surface mount inductor requires an insulating resin to insulate the resin molded body on which the electrode for the external terminal is formed, and the high density mounting is limited by the thickness, and the cost is correspondingly reduced. Rises. Further, it is possible that the volume of the resin molded body is reduced by the thickness of the external terminal electrode and the insulating resin formed on the portion other than the bottom surface of the resin molded body, and the characteristics may be deteriorated.
  • an object of the present disclosure is to provide a surface-mount inductor that can be mounted on an electronic device at a high density and that can easily form an external terminal, and a manufacturing method thereof.
  • a surface-mount inductor is a resin molded body that includes a metal magnetic powder and has a quadrangular shape in a top view, and is formed at at least two corners.
  • the resin molded body having a notch, at least one coil embedded in the resin molded body, and at least two external terminals extending from the notch to the bottom surface of the resin molded body.
  • the lead-out ends of the lead-out ends at both ends of the coil are connected to the external terminals at the notches.
  • Another aspect of the present disclosure is a method for manufacturing a surface-mount inductor in which at least one coil is embedded in a resin molded body containing metal magnetic powder, and the coil is disposed in a molding die.
  • the resin molded body having a rectangular shape in a top view and having notches formed in at least two corners by filling the molding die with the material for the resin molded body and molding the material. A part of each drawing end of each of the ends of the coil forming the resin molded body exposed or close to the notch, and extending from the notch to the bottom surface. Forming an external terminal.
  • the surface-mount inductor of the present disclosure it is possible to provide a surface-mount inductor that can be mounted on an electronic device at a high density and that can easily form an external terminal.
  • FIG. 3 is a schematic transparent perspective view showing the inside of the surface-mount inductor according to the first embodiment of the present disclosure.
  • FIG. 2 is a schematic perspective view of an upper surface side of the surface mount inductor of FIG. 1.
  • FIG. 2 is a schematic perspective view of a bottom surface side of the surface mount inductor of FIG. 1.
  • FIG. 2 is a schematic top perspective view of the surface mount inductor of FIG. 1 before forming a plating layer.
  • FIG. 2 is a schematic perspective view of the bottom surface side of the surface mount inductor of FIG. 1 before forming a plating layer.
  • It is a schematic cross section which shows the manufacturing process of the external terminal of the surface mount inductor of FIG.
  • the surface-mount inductor according to the present embodiment is a resin molded body that includes a metal magnetic powder and has a quadrangular shape in a top view, and the resin molded body that has cutout portions formed in at least two corners. And at least one coil embedded in the resin molded body, and at least two external terminals extending from the notch to the bottom surface of the resin molded body, and leading end portions at both ends of the coil Each of the lead-out end portions is connected to the external terminal at the cutout portion.
  • FIG. 1 is a schematic transparent perspective view showing the inside of a surface-mount inductor A according to the present embodiment.
  • the surface-mount inductor A has a resin molded body 12 containing metal magnetic powder, and one coil 11 around which a conducting wire is wound is embedded therein.
  • the resin molded body 12 has a quadrangular shape when viewed from above. In FIG. 1, the example of the rectangular body which has the upper surface 12c and the bottom face 12d which oppose is shown. Two adjacent corners out of the four corners of the quadrilateral shape have notches 12a and 12b.
  • the coil 11 has a so-called “outer / outer winding” winding portion 11a in which a conductive wire is wound so that both ends thereof are positioned in opposite directions along the outer peripheral surface of the coil, and both ends of the winding portion 11a. It is a coil provided with a pair of drawer
  • FIG. 1 shows an example of two-stage outer and outer windings.
  • a rectangular wire having a rectangular cross section can be used as the conducting wire.
  • a shape of a coil circular shape, ellipse shape, or substantially rectangular shape can be mentioned by top view.
  • one of the drawer end portions 11b extends in the resin molded body 12 and is bent so that a part thereof is exposed at the notch portion 12a.
  • the other drawer end portion 11b is also formed of the resin molded body. 12 is bent so that a part thereof is exposed at the notch 12b.
  • rectangular shape for example, a rectangular parallelepiped and a cube, are included.
  • a rectangular flat cutout surface perpendicular to the top surface and the bottom surface can be used, but a quadrangular shape inclined at an acute angle toward the top surface or the bottom surface as necessary. Notched surfaces can also be used. Furthermore, it is preferable that the angle between the notch surface and the adjacent side surface is not less than 135 degrees and not more than 150 degrees.
  • the lead-out end portions 11b and 11b are exposed at the cutout surfaces of the cutout portions 12a and 12b, but the exposed area is not particularly limited as long as electrical connection with an external terminal is possible. Further, as will be described later, the lead-out end portion may protrude from the cutout surface to the extent that the formation of the plating layer formed thereon is not hindered.
  • the resin molded body 12 has notches 12a and 12b in which at least two of the four corners are linearly cut between the two surfaces constituting the corners when viewed from above. It is formed to have The notch 12a and the notch 12b are formed at adjacent corners. That is, it is symmetrical with respect to a center line extending in the width direction of the upper surface 12c of the resin molded body 12, that is, a center line X perpendicular to the center line Y in the length direction connecting both ends of the conducting wire. Furthermore, the notches 12a and 12b are formed from notch surfaces. It is preferable that the angle between the cut surface and the side surface of the resin molded body 12 is 135 degrees or more and 150 degrees or less.
  • the resin molded body contains metal magnetic powder, a binder resin, and additives such as a moldability improver and a release agent as necessary.
  • the metal magnetic powder include iron-based metal magnetic powders such as Fe, Fe-Si-Cr, Fe-Si-Al, Fe-Ni-Al, and Fe-Cr-Al, and metal magnetism such as amorphous. Examples thereof include body powder, metal magnetic powder whose surface is coated with an insulator such as glass, and metal magnetic powder whose surface is modified.
  • the binder resin include thermosetting resins such as epoxy resins, polyimide resins, and phenol resins, and thermoplastic resins such as polyethylene resins and polyamide resins.
  • FIG. 2A is a schematic perspective view of the top surface side of the surface mount inductor A
  • FIG. 2B is a schematic perspective view of the bottom surface side of the surface mount inductor A.
  • the surface mount inductor A has a first external terminal 14a extending from the notch 12a of the resin molded body 12 to the bottom surface 12d, and a second external terminal 14b extending from the notch 12b to the bottom surface 12d. . That is, the pair of external terminals 14a and 14b are formed in an L shape from the portion where the coil drawing end portions 11b and 11b of the cutout portions 12a and 12b of the resin molded body 12 are located toward the bottom surface 12d of the resin molded body 12.
  • the external terminal 14 is not particularly limited as long as it is a conductive material extending from the notches 12a and 12b to the bottom surface 12d.
  • plating formed on the surface of the exposed portion of the metal magnetic powder where the metal magnetic powder is exposed. It may be a layer.
  • a metal material such as Cu, Ni, or Sn can be used for the plating layer.
  • the surface mount inductor according to the present embodiment can be manufactured using, for example, the following manufacturing method. That is, a method for manufacturing a surface-mount inductor in which at least one coil is embedded in a resin molded body containing metal magnetic powder, the coil being placed in a molding die, and a resin molded body material
  • the resin molded body having a quadrangular shape in a top view and having notches formed in at least two corners by being filled in the molding die and formed at both ends of the coil Forming the resin molded body in which a part of each drawer end is exposed or close to the notch, and forming an external terminal extending from the notch to the bottom surface;
  • FIGS. 1 to 4C a description will be given with reference to FIGS. 1 to 4C.
  • a winding wire 11a shown in FIG. 1 is formed by winding a conductive wire having a rectangular cross-section with an insulating coating in a spiral shape so that both ends thereof are located on the opposite side along the outer periphery. To do. Next, both ends of the conducting wire are pulled out from the outer periphery of the winding portion to form the leading end portions 11b and 11b to form the coil 11.
  • the resin used for the insulating coating preferably has a high heat resistance temperature, and examples thereof include polyamide resins, polyester resins, and imide-modified polyurethane resins.
  • As the conducting wire a round wire or one having a polygonal cross section may be used.
  • iron-based metal magnetic powders such as Fe, Fe—Si—Cr, Fe—Si—Al, Fe—Ni—Al, Fe—Cr—Al, and amorphous metal magnetic materials
  • an epoxy resin is used as a binder resin, and these are mixed to produce a sealing material (resin molded body material).
  • the coil 11 is placed in a predetermined molding die, and a resin molding material is filled in the die and compression molded.
  • the resin molded body 12 is obtained in which the coil 11 is embedded and at least two of the four corners when viewed from above are provided with notches.
  • the lead-out end portions 11b and 11b of the coil 11 are exposed or close to the notch portions 12a and 12b of the resin molded body 12 by being exposed or close to the notch forming surface in the molding die.
  • the drawer end portions 11b and 11b at both ends can be arranged.
  • the molding method is not limited to the compression molding method, and a powder molding method can also be used.
  • FIG. 3A is a schematic perspective view of the upper surface side of the surface mount inductor of FIG. 1 before forming a plating layer.
  • FIG. 3B is a schematic perspective view of the bottom surface side of the surface mount inductor of FIG. 1 before forming a plating layer.
  • the resin component present on the surface of the portion of the resin molded body 12 where the notches 12a and 12b and the external terminals of the bottom surface 12d are formed is removed using a resin component removing means such as laser irradiation, blasting, and polishing.
  • a metal magnetic powder exposed portion 13 having a portion 13b is formed.
  • the metal magnetic powder exposed portion 13 extends from the portion where the lead-out ends 11b and 11b at both ends of the notches 12a and 12b of the resin molded body 12 are located toward the bottom surface 12d of the resin molded body 12, It is formed so as not to be exposed on any side surface of the body 12.
  • the lead-out end portions 11b and 11b at both ends of the coil 11 are also exposed by removing the insulating coating using the resin component removing means.
  • the resin molded body 12 is subjected to a plating process to form a plating layer to be bonded to the metal magnetic powder on the notches 12a and 12b and the bottom surface 12d of the resin molded body 12 as shown in FIGS. 2A and 2B.
  • the external terminal 14 including the first external terminal 14a and the second external terminal 14b is formed.
  • the external terminal 14 is connected to the leading end portions of the leading end portions 11 b and 11 b at both ends exposed on the surface of the resin molded body 12.
  • the conductive material is not particularly limited as long as it is a metal that can be plated.
  • a material containing at least one metal material selected from the group consisting of Cu, Ni, and Sn can be used.
  • FIG. 4A is, for example, a partial longitudinal sectional view of the first metal magnetic substance powder exposure portion 13a in FIG. 3B and shows a state before the metal magnetic substance powder is exposed.
  • the resin molded body contains the metal magnetic powder. Therefore, as shown in FIG. 4A, the surface is covered with the binder resin 15 and the metal magnetic powder 16 is mixed inside. It has become a state.
  • the external terminal of the molded body The metal magnetic powder 16 is exposed in the portion where the metal magnetic powder is to be formed to form the metal magnetic powder exposed portion 13a.
  • a plating layer 18 is formed in the portion where the external terminals of the resin molded body are formed. Since the metal magnetic powder 16 has metallic properties, by applying a plating process to the resin molded body, a portion of the surface of the resin molded body where the metal magnetic powder is exposed is intensively energized, so that the plated metal is A plating layer is formed on the portion where the metal magnetic powder is deposited and exposed on the surface of the resin molded body.
  • FIG. 4C shows an example in which the plating layer 18 is formed of two layers of the first plating layer 18a and the second plating layer 18b, it may be one layer or three or more layers.
  • At least two corners of the four corners when viewed from the top surface of the resin molded body are formed with notches that are notched at the corners.
  • a plating layer extending from the portion where the coil drawing end portion is located toward the bottom surface of the resin molded body and extending to the bottom surface of the resin molded body is bonded to the metal magnetic powder. Is formed.
  • the plating layer of the notch is positioned on the inner side of the side surface of the resin molded body, and the contact between the plating layer and another electronic component mounted adjacent to each other can be prevented.
  • an inductor can be mounted in an electronic device with higher density.
  • the external terminal can be easily formed. Furthermore, by removing the resin only in the portion where the plating layer is formed on the surface of the notched portion of the resin molded body, and exposing the metal magnetic body powder contained in the resin molded body only in that portion, the periphery thereof is exposed. In comparison, it is possible to easily grow the plating layer in this portion, and it is possible to maintain the insulating properties other than the portion where the plating layer is formed. Further, by performing plating on the exposed portion of the metal magnetic powder, the thickness of the external terminal, which was conventionally about 40 to 100 ⁇ m, can be reduced to 20 ⁇ m or less.
  • size of the resin molding can be enlarged correspondingly and the whole shape can be made small.
  • the conducting wire can be thickened or the coil can be enlarged.
  • the shape of the external terminal can be finely formed by using a laser.
  • the method of exposing the surface of the leading end portion of the leading end portion of the coil and performing the plating process directly on the exposed portion has been described. After applying a bonding material such as a conductive paste containing a conductor such as Cu so as to cover the drawn end of the coil, a plating process may be performed. In this case, the bonding strength of the lead-out end portion of the coil and the external terminal can be improved by this bonding material.
  • a bonding material such as a conductive paste containing a conductor such as Cu
  • the method of exposing the tip end portion of the coil drawing end portion to the cutout portion and connecting the tip end portion to the external terminal has been described.
  • the coil drawing end portion is pulled out from the cutout portion.
  • the drawn tip is bent so as to be in contact with the notch, and a bent portion is formed.
  • the insulating coating of the bent portion is removed and plating is performed.
  • External terminals can also be formed by processing.
  • an external terminal may be formed by applying a bonding material such as a conductive paste and plating the resin molded body so as to cover the bent portion.
  • the bonding area can be increased by performing the plating process on the bent portion, and the bonding strength can be improved.
  • the notch portion of the resin molded body is formed symmetrically with respect to the center line extending in the width direction of the upper surface of the resin molded body has been described, but it extends in the length direction. It may be formed symmetrically with respect to the existing center line, or may be symmetrical with respect to the center point of the upper surface of the molded body. That is, in the surface mount inductor according to the present embodiment, as shown in FIG. 1, the two notches are center lines extending in the width direction of the upper surface 12 c of the resin molded body 12, that is, both end portions of the conducting wire. It is formed symmetrically with respect to a center line X orthogonal to the center line Y in the connecting length direction.
  • the two notches are formed in line symmetry with respect to the center line extending in the length direction, that is, in line symmetry with respect to the center line Y in the length direction connecting both ends of the conducting wire. It may be formed. Also in this case, the two notches have an adjacent relationship. Further, it is formed point-symmetrically with respect to the center point on the upper surface of the molded body, that is, two notches are formed at point-symmetrical positions, that is, diagonal positions with the intersection of the center line X and the center line Y as the center of symmetry. May be formed. This case also has the same effect as the present embodiment.
  • Embodiment 2 The surface-mount inductor B according to the present embodiment has the same structure as the surface-mount inductor according to the first embodiment, except that notches are formed at the four corner front portions of the resin molded body. Although described with reference to FIG. 5, description of portions common to the surface mount inductor of the first embodiment is omitted.
  • FIG. 5 is a schematic top view of the coil exposure of the surface mount inductor B according to the present embodiment. Cutout portions 52a, 52b, 52c, and 52d are formed at four corners of the resin molded body 52, respectively.
  • the coil 51 embedded in the resin molded body 52 has a winding part 51a and lead-out end parts 51b and 51b. Each of the leading end portions 51b, 51b at both ends extends so that the tip portion is exposed or close to the notch portion.
  • the four notches can be formed by using a predetermined molding die that can be provided with the four notches.
  • Embodiment 3 The surface-mount inductor C according to the present embodiment forms notches at all four corners of the resin molded body, and 2 in the rectangular resin molded body along the length direction of the resin molded body. It has a structure in which two coils are embedded. Although description will be given with reference to FIG. 6, description of portions common to the surface mount inductor of the first embodiment will be omitted.
  • FIG. 6 is a schematic top view of the coil exposure of the surface mount inductor C according to the present embodiment.
  • Notches 53a, 53b, 53c, and 53d are formed at four corners of the resin molded body 53, respectively.
  • Two coils 51, 51 are embedded in the resin molded body 53, and the leading end portions of the drawing end portions 51b, 51b of one coil 51 located on the lower side in the drawing are notched portions 53a, 53b.
  • the leading ends of the leading ends 51b and 51b of the other coil 51 at the upper side in the drawing are exposed or close at the notches 53c and 53d. So as to extend.
  • the coil lead-out end portions are connected to the cutout portions formed at the four corner portions, so that they are mounted adjacent to each other. It is possible to prevent contact with the electronic component, and it is possible to mount the inductor on the electronic device with higher density.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'inducteur monté en surface de l'invention possède : un corps moulé en résine qui contient une poudre de corps magnétique métallique, qui présente une forme carrée selon une vue de dessus, et qui possède une partie encoche formée au niveau d'au moins deux parties angle ; au moins une bobine noyée dans ledit corps moulé en résine ; et au moins deux bornes de partie externe qui se prolongent de ladite partie encoche jusqu'à une face fond dudit corps moulé en résine. Chaque partie extrémité sortie parmi des parties extrémité sortie aux deux extrémités de ladite bobine, est connectée auxdites bornes de partie externe au niveau de ladite partie encoche. Enfin, l'invention permet de fournir un inducteur monté en surface qui peut être monté selon une grande précision sur un appareil électronique, et qui permet de former aisément des bornes de partie externe.
PCT/JP2016/085625 2015-12-28 2016-11-30 Inducteur monté en surface, et procédé de fabrication de celui-ci Ceased WO2017115603A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-256011 2015-12-28
JP2015256011 2015-12-28

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WO2017115603A1 true WO2017115603A1 (fr) 2017-07-06

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021040043A (ja) * 2019-09-03 2021-03-11 株式会社村田製作所 電子部品およびその製造方法
CN112582133A (zh) * 2019-09-30 2021-03-30 株式会社村田制作所 电子部件
WO2025192106A1 (fr) * 2024-03-15 2025-09-18 パナソニックＩｐマネジメント株式会社 Inducteur et procédé de production d'inducteur

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001052937A (ja) * 1999-08-13 2001-02-23 Murata Mfg Co Ltd インダクタ及びその製造方法
JP2007096181A (ja) * 2005-09-30 2007-04-12 Tokyo Parts Ind Co Ltd 面実装型インダクタ
JP2010186910A (ja) * 2009-02-13 2010-08-26 Toko Inc モールドコイルの製造方法
WO2012105489A1 (fr) * 2011-01-31 2012-08-09 東光株式会社 Inducteur pour montage en surface et procédé pour la production d'inducteur pour montage en surface
JP2014225590A (ja) * 2013-05-17 2014-12-04 東光株式会社 面実装インダクタの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001052937A (ja) * 1999-08-13 2001-02-23 Murata Mfg Co Ltd インダクタ及びその製造方法
JP2007096181A (ja) * 2005-09-30 2007-04-12 Tokyo Parts Ind Co Ltd 面実装型インダクタ
JP2010186910A (ja) * 2009-02-13 2010-08-26 Toko Inc モールドコイルの製造方法
WO2012105489A1 (fr) * 2011-01-31 2012-08-09 東光株式会社 Inducteur pour montage en surface et procédé pour la production d'inducteur pour montage en surface
JP2014225590A (ja) * 2013-05-17 2014-12-04 東光株式会社 面実装インダクタの製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021040043A (ja) * 2019-09-03 2021-03-11 株式会社村田製作所 電子部品およびその製造方法
JP7092099B2 (ja) 2019-09-03 2022-06-28 株式会社村田製作所 電子部品およびその製造方法
CN112582133A (zh) * 2019-09-30 2021-03-30 株式会社村田制作所 电子部件
CN112582133B (zh) * 2019-09-30 2023-02-17 株式会社村田制作所 电子部件
WO2025192106A1 (fr) * 2024-03-15 2025-09-18 パナソニックＩｐマネジメント株式会社 Inducteur et procédé de production d'inducteur

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