WO2017115413A1 - Optical transmission module and endoscope - Google Patents
Optical transmission module and endoscope Download PDFInfo
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- WO2017115413A1 WO2017115413A1 PCT/JP2015/086502 JP2015086502W WO2017115413A1 WO 2017115413 A1 WO2017115413 A1 WO 2017115413A1 JP 2015086502 W JP2015086502 W JP 2015086502W WO 2017115413 A1 WO2017115413 A1 WO 2017115413A1
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- optical
- transmission module
- optical transmission
- holding member
- main surface
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
Definitions
- the present invention includes an optical element, a wiring board on which the optical element is mounted, and an optical fiber that transmits an optical signal in which an optical axis is disposed in parallel to the main surface of the wiring board. And an endoscope including the light transmission module.
- the endoscope has an image sensor such as a CCD at the rigid tip of the insertion portion.
- an imaging device having a high pixel number for an endoscope has been studied.
- the amount of signal transmitted from the image sensor to the signal processing device increases.
- optical signal transmission through a thin optical fiber by an optical signal using an optical transmission module is preferable in place of electric signal transmission through a metal wiring by an electric signal.
- An optical transmission module of an endoscope disclosed in Japanese Patent Application Laid-Open No. 2015-104387 includes an optical element, a wiring board, a holding member (ferrule) 40, and an optical fiber.
- the optical element, the wiring board, and the holding member are arranged in the thickness direction of the optical element.
- the diameter of the optical transmission module can be reduced by reflecting the end face of the optical fiber.
- an end face of an optical fiber embedded in a holding part is processed into a reflecting surface, and light reflected by the reflecting surface is reflected in the optical axis direction of the optical fiber.
- An optical receiver that receives light with light receiving elements arranged in parallel is disclosed.
- an optical transmission module in which the end face of the optical fiber is a reflection surface, it is necessary to accurately define the angle formed by the main surface of the optical element and the reflection surface of the optical fiber, that is, the rotation direction of the optical fiber. For example, an adjustment process is necessary in which the optical fiber is rotated while the light is actually guided to find the rotation angle with the largest amount of light, and is fixed at the rotation angle. For this reason, although the optical transmission module which used the end surface of the optical fiber as a reflective surface is thin diameter, since the complicated adjustment process was performed, there existed a possibility that manufacture might not be easy.
- Embodiments of the present invention are intended to provide an optical transmission module that is easy to manufacture, and an endoscope that includes the optical transmission module at a rigid distal end portion of an insertion portion.
- An optical transmission module includes an optical element that includes a light-emitting element or a light-receiving element, a core and a clad, a circular cross section, and a reflective surface with an inclined end surface; A holding member in which an end of the optical fiber is embedded; a first main surface; and a second main surface opposite to the first main surface, wherein the optical element is disposed on the first main surface. And a wiring board in which the holding member is bonded to the second main surface, and a through hole serving as an optical path is formed.
- the holding member is made of a transparent resin, and the holding The bottom surface of the member is in contact with the second main surface of the wiring board, and the angle of the reflection surface with respect to the main surface of the optical element is an angle at which light guided through the optical fiber is optically coupled to the optical element. It is fixed to.
- An endoscope includes an optical element that includes a light-emitting element or a light-receiving element, a core and a clad, a circular cross section, and a reflecting surface having an inclined end surface, A holding member in which an end of the optical fiber is embedded; a first main surface; and a second main surface opposite to the first main surface, wherein the optical element is disposed on the first main surface. And a wiring board in which the holding member is bonded to the second main surface, and a through hole serving as an optical path is formed.
- the holding member is made of a transparent resin, and the holding The bottom surface of the member is in contact with the second main surface of the wiring board, and the angle of the reflection surface with respect to the main surface of the optical element is an angle at which light guided through the optical fiber is optically coupled to the optical element.
- the optical transmission module fixed to the head is provided at the rigid tip of the insertion portion.
- an optical transmission module that is easy to manufacture, and an endoscope that includes the optical transmission module at a rigid distal end portion of an insertion portion.
- FIG. 2 is a cross-sectional view along the optical axis direction of the optical transmission module according to the first embodiment, that is, along the line II-II in FIG. It is sectional drawing of the optical transmission module of 1st Embodiment of the optical axis orthogonal direction. It is sectional drawing of an optical axis orthogonal direction for demonstrating the structure of the optical transmission module of the modification 1 of 1st Embodiment. It is sectional drawing of an optical axis orthogonal direction for demonstrating the structure of the optical transmission module of the modification 2 of 1st Embodiment.
- the optical transmission module 1 of this embodiment includes an optical element 10, an optical fiber 20, a cable 30, a holding member 40, and a wiring board 50.
- the optical element 10 and the cable 30 are joined to the wiring board 50, and the holding member 40 in which the end of the optical fiber 20 is embedded is adhered. Since the light emitting surface 10SA of the optical element 10 and the optical axis of the optical fiber 20 are arranged in parallel, the optical transmission module 1 has a small diameter.
- the light emitted upward from the optical element 10 enters the side surface of the optical fiber 20 through the through hole H50 of the wiring board 50, is reflected by the reflecting surface 20SA, and the optical path is bent 90 degrees, and the inside of the core 21 is reflected. It is guided backward.
- the bottom surface 40SA of the holding member 40 in which the end of the optical fiber 20 is embedded is brought into contact with the second main surface 50SB of the wiring board 50, so that the rotation angle of the optical fiber 20 is guided through the optical fiber 20. Is fixed at an angle ⁇ at which light is efficiently optically coupled with the optical element 10.
- the optical element 10 is, for example, a VCSEL (Vertical / Cavity / Surface / Emitting / LASER: vertical cavity surface emitting laser) type light-emitting element having a light-emitting unit 11 that outputs light of an optical signal to the light-emitting surface 10SA.
- the ultra-compact optical element 10 having a planar view size of 250 ⁇ m ⁇ 300 ⁇ m has a light emitting unit 11 having a diameter of 20 ⁇ m and a bonding bump 12 for supplying a driving signal to the light emitting unit 11 on the light emitting surface 10SA.
- the optical element 10 emits light in a direction perpendicular to the light emitting surface 10SA.
- the bonding bumps 12 have a height of 10 ⁇ m to 100 ⁇ m and are, for example, stud bumps, plating bumps, ball bumps, or the like made of gold or solder.
- the optical fiber 20 having a circular cross section is, for example, MMF (Multi Mode Fiber) that is easy to align.
- the core 21 that transmits light has a diameter of 50 ⁇ m
- the cladding 22 that covers the outer periphery of the core 21 has a diameter of 125 ⁇ m.
- the core 21 has a refractive index of 1.50 to 1.60, and the refractive index is 0.01 or more higher than that of the cladding 22.
- the end of the optical fiber 20 is embedded in the holding member 40.
- the holding member 40 is made of a transparent resin having the same refractive index as that of the clad 22 of the optical fiber 20.
- the transparent resin may be light-shielding at other wavelengths, for example, visible light wavelengths, as long as the transmittance at the wavelength of the optical signal is high.
- a liquid ultraviolet curable resin or a thermosetting resin is poured into a mold that is arranged so that the outer peripheral surface of the end portion of the optical fiber 20 is in contact with the bottom surface, and the optical fiber 20 is cured.
- the end portion is embedded in the holding member 40.
- the end surface of the optical fiber 20 is processed into an inclined reflecting surface 20SA.
- the inclination angle ⁇ of the reflecting surface 20SA is an angle with respect to the bottom surface 40SA of the holding member 40. As will be described later, the inclination angle ⁇ is appropriately set in the relative positional relationship with the optical element 10.
- the end portion of the optical fiber 20 on which the reflecting surface 20SA is formed in advance may be arranged on the bottom surface of the mold with the rotation angle defined, and embedded in the holding member 40 made of a curable resin.
- a holding member having a bottom surface having an angle ⁇ with respect to the reflecting surface 20SA of the optical fiber 20 is manufactured by grinding / polishing a part of the resin body in which the optical fiber 20 on which the reflecting surface 20SA is formed is embedded. Good.
- the optical path length does not increase even if the optical fiber 20 is embedded in the holding member 40.
- a reflective film may be provided on the reflective surface 20SA.
- light can be reflected more efficiently by disposing a reflective film made of gold or aluminum having a high reflectivity by sputtering.
- the wiring board 50 has a first main surface 50SA and a second main surface 50SB facing the first main surface 50SA.
- An electrode 51 bonded to the bonding bump 12 of the optical element 10 is disposed on the first main surface 50SA of the wiring board 50.
- the second main surface 50SB is provided with a bonding electrode 52 that is electrically connected to the bonding bump 12 via a through wiring (not shown) or the like.
- the cable 30 is bonded to the bonding electrode 52 of the wiring board 50 by, for example, solder 54.
- the wiring board 50 For the substrate of the wiring board 50, a resin substrate, a ceramic substrate, a glass epoxy substrate, a glass substrate, a silicon substrate, or the like is used.
- the wiring board 50 is particularly preferably an FPC (Flexible printed circuit) substrate based on polyimide or the like from the viewpoint of miniaturization and flexibility.
- An underfill material, a side fill material, or the like is injected as a sealing member 19 between the optical element 10 and the wiring board 50.
- An electronic component 59 such as a chip capacitor or an IC is mounted on the second main surface 50SB of the wiring board 50.
- the wiring board 50 has a through hole H50 serving as an optical path through which light emitted from the light emitting unit 11 passes.
- the second main surface 50SB of the wiring board 50 is bonded with an adhesive 45 made of resin, for example, with the bottom surface of the holding member 40 in contact therewith.
- the optical element 10 is mounted on the first main surface 50SA of the wiring board 50 in a state where the light emitting portion 11 is disposed at a position facing the through hole H50 of the wiring board 50.
- the light emitting surface 10SA of the optical element 10 is arranged in parallel with the first main surface 50SA and the second main surface 50SB of the wiring board 50.
- the optical transmission module 1 is easy to manufacture.
- optical coupling angle ⁇ means an angle at which the amount of light is efficiently reflected at 80% or more when the amount of light when the light is reflected most efficiently is 100%.
- the inclination angle is 45 degrees
- the light emitted from the light emitting portion 11 of the optical element 10 perpendicularly to the light emitting surface 10SA is bent 90 degrees at the reflecting surface 20SA.
- the inclination angle ⁇ is not less than 35 degrees and not more than 55 degrees, the light can be efficiently guided to the core 21 of the optical fiber 20.
- the entire optical transmission module 1 including the end of the optical fiber 20 may be covered with a light shielding resin.
- the light shielding resin prevents light leakage from the optical element 10 and improves the reflection efficiency because the inclined surface 20SA is also covered with the light shielding resin.
- the optical transmission module 1 Since the rotation direction of the optical fiber 20 with respect to the optical element 10 is automatically defined, the optical transmission module 1 does not require a complicated adjustment process and is easy to manufacture.
- optical transmission modules 1A to 1F of Modifications 1 to 6 of the first embodiment will be described. Since the optical transmission modules 1A to 1F are similar to the optical transmission module 1 and have the same effects, the same reference numerals are given to components having the same functions, and the description thereof is omitted. In the following drawings, hatching indicating the material of the constituent elements is omitted.
- the optical element 10A is a light receiving element such as a photodiode (PD).
- PD photodiode
- an optical element made of a photodiode converts light incident from the vertical direction to the light receiving surface 10SA into an electrical signal and outputs the electrical signal.
- an ultra-small light receiving element having a planar view size of 350 ⁇ m ⁇ 300 ⁇ m includes a light receiving unit 11A having a diameter of 100 ⁇ m, and a bonding bump 12 for outputting a received electric signal electrically connected to the light receiving unit 11A, On the light receiving surface 10SA.
- the optical transmission module 1 ⁇ / b> A is fixed in a state where the bottom surface 40 ⁇ / b> SA of the holding member 40 is in contact with the second main surface 50 ⁇ / b> SB of the wiring board 50 in the same manner as the optical transmission module 1, thereby
- the angle ⁇ with respect to the light receiving surface (main surface) 10SA is automatically fixed to an angle at which the light guided through the optical fiber 20 is efficiently optically coupled with the optical element 10A. For this reason, the optical transmission module 1A is easy to manufacture.
- the width L40 of the bottom surface 40SA of the holding member 40B in the longitudinal direction of the optical fiber 20, that is, the direction orthogonal to the optical axis (Y-axis direction) is Is the same.
- the optical path When the light guided through the core 21 of the optical fiber 20 is reflected by the reflecting surface 20SA, the optical path is bent in the direction of the light receiving unit 11A (downward direction: Z-axis value decreasing direction) and enters the clad 22. Since the light guided through the core 21 is reflected at the interface with the clad 22, the optical path does not spread. However, when the light is reflected by the reflecting surface 20SA and enters the clad 22 from the core 21, the optical path is widened. The size of the optical path, that is, the width L20 when observed from the optical path direction, increases or decreases depending on the numerical aperture (NA) of the optical fiber 20 or the like.
- NA numerical aperture
- the optical path size at the bottom surface 40SA is shown.
- the width L20 is 67 ⁇ m.
- the width L20 is 86 ⁇ m.
- the optical loss increases even if the width L40 of the bottom surface 40SA of the holding member 40B is the same as the outer diameter R20 of the cladding 22. Absent.
- the optical transmission module 1B can be easily reduced in diameter by reducing the width L40.
- a notch N40 is formed at the intersection of the bottom surface 40SA and the side surface 40SS of the holding member 40C, and the notch N40 is filled with the adhesive 45. .
- the adhesive 45 is filled in the cutout N40, the spread of the fillet is small. For this reason, the diameter of the optical transmission module 1C can be easily reduced.
- the optical transmission module 1D of this modification shown in FIGS. 7 and 8A has a wall surface when observed from a direction parallel to the optical axis of the optical fiber 20 on the side formed by the bottom surface 40SA of the holding member 40D and one side surface 40SS.
- a notch N40D having a curved shape is formed.
- the adhesive 45D filled in the notch N40D is transparent and has a refractive index substantially the same as that of the cladding 22.
- the holding member 40D has a cutout N40D formed on only one side surface, the shape when viewed from a direction parallel to the optical axis is “tears”.
- the optical transmission module 1D can be easily reduced in diameter. Since the refractive index of the adhesive 45D is the same as the refractive index of the clad 22, the optical loss increases even if the width L40 of the bottom surface 40SA of the holding member 40D is smaller than the width L20 of the optical path at the bottom surface 40SA. There is no.
- the holding member 40 ⁇ / b> E has a “bell shape” whose upper surface is curved along the outer shape of the optical fiber 20.
- the shape of the holding member 40E in the region that does not become the optical path of the optical fiber 20 can be changed as appropriate in order to reduce the diameter.
- the notch N40F is not formed in the portion of the side surface 40SS of the holding member 40F that faces the end surface.
- the adhesive 45 may be disposed only on a part of the side surface of the holding member.
- the in-plane positioning is automatically performed by the holding member coming into contact with the positioning member. Is called.
- an optical transmission module having the optical element 10 as a light emitting element will be described as an example, but an optical transmission module having the optical element 10A as a light receiving element has the same effect.
- the optical transmission module 1G shown in FIG. 10 has a recess T60 in which the end of the holding member 40 is inserted and fitted into the positioning member 60 disposed on the second main surface 50SB of the wiring board 50.
- the positioning member 60 is made of, for example, ceramic, Si (silicon), glass, resin, or metal.
- the recess T60 has a groove shape with an opening on the bottom surface of the positioning member 60.
- the inner dimension of the recess T60 is substantially the same as the outer dimension of the holding member 40 to be inserted.
- substantially the same means that both dimensions are substantially the same so that the outer peripheral surface of the holding member 40 and the wall surface of the recess T60 are in contact with each other.
- the inner dimension of the recess T60 is made larger than the outer dimension of the holding member 40 by 1 ⁇ m to 5 ⁇ m.
- the holding member 40 has its bottom surface 40SA in contact with the second main surface 50SB of the wiring board 50, whereby the rotation direction is automatically defined, and the end portion is fitted with the recess T60 of the positioning member 60. Positioning in the in-plane direction (XY direction) is automatically performed.
- the optical transmission module 1G is easier to manufacture than the optical transmission module 1 or the like.
- the light emitting portion 11 of the optical element 10 disposed on the first main surface 50SA of the wiring board 50 is viewed from above through the hole H60 of the positioning member 60H and the through hole H50 of the wiring board 50. I can observe.
- the optical alignment can be accurately performed by adjusting the position of the positioning member 60H to the position where the light emitting unit 11 is located at the center of the hole H60.
- the positioning member 60I has an L-shaped wall shape and has markers 65 (65A, 65B) on the upper surface.
- the marker 65 indicates the positional relationship with the light element 11 directly above the optical element 10.
- the marker 65A indicates the position of the optical fiber 20 in the optical axis direction (X direction)
- the marker 65B indicates the position of the optical fiber 20 in the optical axis orthogonal direction (Y direction).
- the intersection of the extension line of the marker 65A and the extension line of the marker 65B is directly above the light emitting unit 11 of the optical element 10.
- the optical transmission module 1I can be easily aligned by adjusting and fixing the position of the positioning member 60I with reference to the marker 65.
- the positioning member is a bump 53 (53A, 53B) disposed on the second main surface of the wiring board 50J. That is, the position in the in-plane direction is automatically defined by the end of the holding member 40 coming into contact with the bump 53 of the wiring board 50J.
- the light transmission module 1J has a small diameter because it does not have a large positioning member.
- the wiring board 50J is provided with a first bump 53A that is an optical axis direction (X direction) positioning member and a second bump 53B that is an optical axis orthogonal direction (Y direction) positioning member. Yes.
- the first bump 53A or the second bump 53B may be provided.
- the bump 53 may be constituted by a two-step bump.
- the positioning member is an electronic component 59 (59A, 59B) mounted on the second main surface 50SB of the wiring board 50K. That is, the holding member 40 has its end portion in contact with the electronic component 59 of the wiring board 50K, so that the position in the in-plane direction is automatically defined.
- the electronic component 59 (59A, 59B) is bonded to an electrode pad provided when the wiring board 50K is manufactured.
- the electronic component 59 for forming the electric circuit is a component necessary for the optical transmission module 1K, and a function of a positioning member is added to the electronic component 59.
- the electronic component 59 has a necessary and sufficient height for positioning.
- the optical transmission module 1K it is not necessary to arrange a positioning-dedicated bump on the wiring board 50K. Since the area of the second main surface 50SB of the wiring board 50K can be reduced, the optical transmission module 1K has the effect of the optical transmission module 1J and has a smaller diameter.
- the positioning member may be at least one of the bump 53 and the electronic component 59. That is, for example, positioning in the direction perpendicular to the optical axis may be performed by the bumps 53 and positioning in the optical axis direction may be performed by the electronic component 59.
- the positioning member may be a plurality of electronic components of different types.
- the holding members 40A to 40F of the first modification to the first modification of the first embodiment It goes without saying that the same effect is obtained by using the holding members having the same configuration.
- the endoscope 9 includes an insertion portion 9B in which any one of the light transmission modules 1 to 1K is disposed at the rigid distal end portion 9A, and an operation disposed at the proximal end side of the insertion portion 9B.
- a unit 9C and a universal cord 9D extending from the operation unit 9C.
- an optical signal transmitted from the optical transmission module 1 disposed in the hard tip portion 9A and guided by the optical fiber 20 inserted through the insertion portion 9B is, for example, an optical transmission disposed in the operation portion 9C. It is converted into an electrical signal by the module 1X.
- the endoscope 9 Since the endoscope 9 has the light transmission modules 1 to 1K having a small diameter, the hard tip portion 9A has a small diameter. Furthermore, the endoscope 9 is easy to manufacture because it includes the light transmission modules 1 to 1K.
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Abstract
Description
本発明は、光素子と、前記光素子が実装されている配線板と、前記配線板の主面に対して光軸が平行に配設されている光信号を伝送する光ファイバと、を具備する光伝送モジュール、および、前記光伝送モジュールを具備する内視鏡に関する。 The present invention includes an optical element, a wiring board on which the optical element is mounted, and an optical fiber that transmits an optical signal in which an optical axis is disposed in parallel to the main surface of the wiring board. And an endoscope including the light transmission module.
内視鏡は、挿入部の硬性先端部にCCD等の撮像素子を有する。近年、高画素数の撮像素子の内視鏡への使用が検討されている。高画素数の撮像素子を使用した場合には、撮像素子から信号処理装置(プロセッサ)へ伝送する信号量が増加する。 The endoscope has an image sensor such as a CCD at the rigid tip of the insertion portion. In recent years, use of an imaging device having a high pixel number for an endoscope has been studied. When an image sensor with a high number of pixels is used, the amount of signal transmitted from the image sensor to the signal processing device (processor) increases.
内視鏡の硬性先端部に配設される光伝送モジュールは、低侵襲化のため、小型化、特に細径化が重要な課題である。このため、電気信号によるメタル配線を介した電気信号伝送に替えて光伝送モジュールを用いた光信号による細い光ファイバを介した光信号伝送が好ましい。 In order to minimize the invasiveness of an optical transmission module disposed at the rigid tip of an endoscope, downsizing, in particular, reduction in diameter is an important issue. For this reason, optical signal transmission through a thin optical fiber by an optical signal using an optical transmission module is preferable in place of electric signal transmission through a metal wiring by an electric signal.
日本国特開2015-104387号公報に開示されている内視鏡の光伝送モジュールは、光素子と、配線板と、保持部材(フェルール)40と、光ファイバと、を具備する。この光伝送モジュールでは、光素子と配線板と保持部材とが、光素子の厚さ方向に配置されている。 An optical transmission module of an endoscope disclosed in Japanese Patent Application Laid-Open No. 2015-104387 includes an optical element, a wiring board, a holding member (ferrule) 40, and an optical fiber. In this optical transmission module, the optical element, the wiring board, and the holding member are arranged in the thickness direction of the optical element.
一方、光ファイバの端面を反射面することで、光伝送モジュールの細径化をはかることができる。例えば、日本国特開平10-325917号公報には、保持部品に埋め込まれた光ファイバの端面を反射面に加工し、反射面で反射された光を、受光面が光ファイバの光軸方向に平行に配置されている受光素子で受光する光受信装置が開示されている。 On the other hand, the diameter of the optical transmission module can be reduced by reflecting the end face of the optical fiber. For example, in Japanese Patent Laid-Open No. 10-325917, an end face of an optical fiber embedded in a holding part is processed into a reflecting surface, and light reflected by the reflecting surface is reflected in the optical axis direction of the optical fiber. An optical receiver that receives light with light receiving elements arranged in parallel is disclosed.
しかし、光ファイバの端面を反射面とした光伝送モジュールでは、光素子の主面と光ファイバの反射面とがなす角度、すなわち、光ファイバの回転方向を正確に規定する必要がある。例えば、実際に光ファイバに光を導光しながら、光ファイバを回転して最も光量が大きい回転角度を見出して、その回転角度で固定するという調整工程が必要であった。このため、光ファイバの端面を反射面とした光伝送モジュールは、細径であるが、繁雑な調整工程を行うため、製造が容易ではないおそれがあった。 However, in an optical transmission module in which the end face of the optical fiber is a reflection surface, it is necessary to accurately define the angle formed by the main surface of the optical element and the reflection surface of the optical fiber, that is, the rotation direction of the optical fiber. For example, an adjustment process is necessary in which the optical fiber is rotated while the light is actually guided to find the rotation angle with the largest amount of light, and is fixed at the rotation angle. For this reason, although the optical transmission module which used the end surface of the optical fiber as a reflective surface is thin diameter, since the complicated adjustment process was performed, there existed a possibility that manufacture might not be easy.
さらに、光ファイバの調整工程では回転方向だけでなく、光素子に対する面内方向の位置決め調整も必要であった。 Furthermore, in the optical fiber adjustment process, not only the rotation direction but also in-plane positioning adjustment with respect to the optical element is necessary.
本発明の実施形態は、製造が容易な光伝送モジュール、および、前記光伝送モジュールを挿入部の硬性先端部に具備する内視鏡を提供することを目的とする。 Embodiments of the present invention are intended to provide an optical transmission module that is easy to manufacture, and an endoscope that includes the optical transmission module at a rigid distal end portion of an insertion portion.
本発明の実施形態の光伝送モジュールは、発光素子または受光素子からなる光素子と、コアとクラッドとを有し、断面が円形で、端面が傾斜している反射面である光ファイバと、前記光ファイバの端部が埋め込まれている保持部材と、第1の主面と前記第1の主面と対向する第2の主面とを有し、前記第1の主面に前記光素子が実装されており、前記第2の主面に前記保持部材が接着されており、光路となる貫通孔が形成されている配線板と、を具備し、前記保持部材が透明樹脂からなり、前記保持部材の底面が前記配線板の前記第2の主面と当接し、前記反射面の前記光素子の主面に対する角度が、前記光ファイバを導光される光が前記光素子と光結合する角度に固定されている。 An optical transmission module according to an embodiment of the present invention includes an optical element that includes a light-emitting element or a light-receiving element, a core and a clad, a circular cross section, and a reflective surface with an inclined end surface; A holding member in which an end of the optical fiber is embedded; a first main surface; and a second main surface opposite to the first main surface, wherein the optical element is disposed on the first main surface. And a wiring board in which the holding member is bonded to the second main surface, and a through hole serving as an optical path is formed. The holding member is made of a transparent resin, and the holding The bottom surface of the member is in contact with the second main surface of the wiring board, and the angle of the reflection surface with respect to the main surface of the optical element is an angle at which light guided through the optical fiber is optically coupled to the optical element. It is fixed to.
また別の実施形態の内視鏡は、発光素子または受光素子からなる光素子と、コアとクラッドとを有し、断面が円形で、端面が傾斜している反射面である光ファイバと、前記光ファイバの端部が埋め込まれている保持部材と、第1の主面と前記第1の主面と対向する第2の主面とを有し、前記第1の主面に前記光素子が実装されており、前記第2の主面に前記保持部材が接着されており、光路となる貫通孔が形成されている配線板と、を具備し、前記保持部材が透明樹脂からなり、前記保持部材の底面が前記配線板の前記第2の主面と当接し、前記反射面の前記光素子の主面に対する角度が、前記光ファイバを導光される光が前記光素子と光結合する角度に固定されている光伝送モジュールを挿入部の硬性先端部に具備する。 An endoscope according to another embodiment includes an optical element that includes a light-emitting element or a light-receiving element, a core and a clad, a circular cross section, and a reflecting surface having an inclined end surface, A holding member in which an end of the optical fiber is embedded; a first main surface; and a second main surface opposite to the first main surface, wherein the optical element is disposed on the first main surface. And a wiring board in which the holding member is bonded to the second main surface, and a through hole serving as an optical path is formed. The holding member is made of a transparent resin, and the holding The bottom surface of the member is in contact with the second main surface of the wiring board, and the angle of the reflection surface with respect to the main surface of the optical element is an angle at which light guided through the optical fiber is optically coupled to the optical element. The optical transmission module fixed to the head is provided at the rigid tip of the insertion portion.
本発明の実施形態によれば、製造が容易な光伝送モジュール、および、前記光伝送モジュールを挿入部の硬性先端部に具備する内視鏡を提供できる。 According to the embodiment of the present invention, it is possible to provide an optical transmission module that is easy to manufacture, and an endoscope that includes the optical transmission module at a rigid distal end portion of an insertion portion.
<第1実施形態>
図1から図3に示すように、本実施形態の光伝送モジュール1は、光素子10と、光ファイバ20と、ケーブル30と、保持部材40と、配線板50と、を具備する。配線板50には光素子10およびケーブル30が接合されており、さらに、光ファイバ20の端部が埋め込まれた保持部材40が接着されている。光素子10の発光面10SAと光ファイバ20の光軸とは平行に配置されているため、光伝送モジュール1は細径である。
<First Embodiment>
As shown in FIGS. 1 to 3, the
なお、図面は、いずれも模式的なものであり、各部分の厚みと幅との関係、夫々の部分の厚みの比率などは現実のものとは異なることに留意すべきであり、図面の相互間においても互いの寸法の関係や比率が異なる部分が含まれている場合がある。また、一部の構成要素の図示を省略する場合がある。なお、図1等において、左側、すなわち、光ファイバ20の先端方向(X軸値増加方向)を「前」といい、光素子10に対する光ファイバ20の方向、すなわち、Z軸値増加方向を「上」という。
Note that all the drawings are schematic, and it should be noted that the relationship between the thickness and width of each part, the ratio of the thickness of each part, and the like are different from the actual ones. In some cases, there are portions in which the dimensional relationships and ratios are different. Moreover, illustration of some components may be omitted. In FIG. 1 and the like, the left side, that is, the tip direction (X-axis value increasing direction) of the
光素子10が上方に発光した光は、配線板50の貫通孔H50を介して光ファイバ20の側面に入射し、反射面20SAで反射されて光路が90度曲げられて、コア21の内部を後方に導光される。光ファイバ20の端部が埋め込まれている保持部材40の底面40SAと配線板50の第2の主面50SBとが当接することで、光ファイバ20の回転角度が、光ファイバ20を導光される光が光素子10と効率良く光結合する角度θに固定されている。
The light emitted upward from the
光素子10は、例えば、発光面10SAに光信号の光を出力する発光部11を有する、VCSEL(Vertical Cavity Surface Emitting LASER:垂直共振器面発光レーザ)型の発光素子である。例えば、平面視寸法が250μm×300μmと超小型の光素子10は、直径が20μmの発光部11と、発光部11に駆動信号を供給するための接合用バンプ12と、を発光面10SAに有する。光素子10は発光面10SAに垂直方向に光を出射する。
The
接合用バンプ12は、高さが10μmから100μmで、例えば、金または半田からなる、スタッドバンプ、めっきバンプまたはボールバンプ等である。 The bonding bumps 12 have a height of 10 μm to 100 μm and are, for example, stud bumps, plating bumps, ball bumps, or the like made of gold or solder.
断面が円形の光ファイバ20は、例えば、アライメントが容易なMMF(Multi Mode Fiber)であり、光を伝送するコア21は直径50μm、コア21の外周を覆うクラッド22は直径125μmである。例えば、コア21は屈折率1.50~1.60であり、クラッド22よりも屈折率が0.01以上大きい。
The
光ファイバ20は、端部が保持部材40に埋め込まれている。保持部材40は、光ファイバ20のクラッド22と屈折率が同じ透明樹脂からなる。なお、透明樹脂は、光信号の波長における透過率が高ければ、それ以外の波長、例えば可視光波長において遮光性であってもよい。
The end of the
例えば、光ファイバ20の端部の外周面が底面に当接するように配置された型枠に、液状の紫外線硬化型樹脂または熱硬化性樹脂が流し込まれ、硬化処理されることで、光ファイバ20は、端部が保持部材40に埋め込まれる。
For example, a liquid ultraviolet curable resin or a thermosetting resin is poured into a mold that is arranged so that the outer peripheral surface of the end portion of the
光ファイバ20の端部が保持部材40とともに斜めに切断されると、光ファイバ20の端面は傾斜している反射面20SAに加工される。反射面20SAの傾斜角度θは、保持部材40の底面40SAに対する角度である。後述するように、傾斜角度θは、光素子10との相対位置関係において適宜、設定される。
When the end of the
もちろん、予め反射面20SAが形成された光ファイバ20の端部を、回転角度を規定した状態で型枠の底面に配置して、硬化性樹脂からなる保持部材40に埋め込んでもよい。
Of course, the end portion of the
また、反射面20SAが形成された光ファイバ20が埋め込まれた樹脂体の一部を研削/研磨することで、光ファイバ20の反射面20SAに対する角度θの底面を有する保持部材を作製してもよい。
Further, even if a holding member having a bottom surface having an angle θ with respect to the reflecting surface 20SA of the
保持部材40の底面40SAにクラッド22の外周面の一部が露出していると、光ファイバ20は保持部材40に埋め込まれても光路長が増加することがない。
If a part of the outer peripheral surface of the clad 22 is exposed on the bottom surface 40SA of the holding
なお、保持部材の底面にクラッドの外周面が露出していない場合には、光路長を短くするために、研削/研磨することが好ましい。 In addition, when the outer peripheral surface of the clad is not exposed on the bottom surface of the holding member, it is preferable to perform grinding / polishing in order to shorten the optical path length.
また、反射面20SAに反射膜を配設してもよい。例えば、スパッタ法により反射率の高い、金またはアルミニウム等からなる反射膜を配設することで、より効率良く、光を反射できる。 Further, a reflective film may be provided on the reflective surface 20SA. For example, light can be reflected more efficiently by disposing a reflective film made of gold or aluminum having a high reflectivity by sputtering.
配線板50は第1の主面50SAと第1の主面50SAと対向する第2の主面50SBとを有する。配線板50の第1の主面50SAには光素子10の接合用バンプ12と接合されている電極51が配設されている。そして、第2の主面50SBには、接合用バンプ12と図示しない貫通配線等を介して電気的に接続されている接合用電極52が配設されている。ケーブル30は、配線板50の接合用電極52と例えば半田54によって接合されている。
The
配線板50の基体には、樹脂基板、セラミック基板、ガラスエポキシ基板、ガラス基板、または、シリコン基板等が使用される。なお、配線板50は、小型化およびフレキシブル性の観点から、ポリイミド等を基体とする、FPC(Flexible printed circuits)基板が特に好ましい。
For the substrate of the
なお、光素子10と配線板50との間には、アンダーフィル材やサイドフィル材等が封止部材19として注入されている。また、配線板50の第2の主面50SBには、チップコンデンサまたはIC等の電子部品59が実装されている。
An underfill material, a side fill material, or the like is injected as a sealing
配線板50には、発光部11が出射した光が通過する光路となっている貫通孔H50がある。そして、配線板50の第2の主面50SBには保持部材40の底面が当接した状態で、例えば樹脂からなる接着剤45で接着されている。一方、配線板50の第1の主面50SAには光素子10が、その発光部11が配線板50の貫通孔H50と対向する位置に配置された状態で実装されている。光素子10の発光面10SAは配線板50の第1の主面50SAおよび第2の主面50SBと平行に配置されている。
The
このため、保持部材40の底面40SAを配線板50の第2の主面50SBと当接した状態で固定すると、反射面20SAの光素子10の発光面(主面)10SAに対する角度θが、光ファイバ20を導光される光が光素子10と光結合する角度θに自動的に固定される。このため、光伝送モジュール1は製造が容易である。
For this reason, when the bottom surface 40SA of the holding
なお、光結合する角度θとは、最も効率良く反射した場合の光量を100%としたときに、光量が80%以上と効率良く反射する角度を意味する。 Note that the optical coupling angle θ means an angle at which the amount of light is efficiently reflected at 80% or more when the amount of light when the light is reflected most efficiently is 100%.
例えば、傾斜角度が45度であれば光素子10の発光部11が発光面10SAに垂直に出射した光は、反射面20SAで方向が90度曲げられる。傾斜角度θは、35度以上55度以下であれば、効率良く、光ファイバ20のコア21に導光できる。
For example, if the inclination angle is 45 degrees, the light emitted from the
なお、光伝送モジュール1は、光ファイバ20の端部を含めて全体が遮光樹脂で覆われていてもよい。遮光樹脂により、光素子10からの漏光が防止されるとともに、傾斜面20SAも遮光樹脂に覆われるため反射効率が改善する。
The entire
光伝送モジュール1は、光素子10に対する光ファイバ20の回転方向が自動的に規定されるため、繁雑な調整工程が不要であり、製造が容易である。
Since the rotation direction of the
<第1実施形態の変形例>
次に、第1実施形態の変形例1~6の光伝送モジュール1A~1Fについて説明する。光伝送モジュール1A~1Fは、光伝送モジュール1と類似し同じ効果を有するため、同じ機能の構成要素には同じ符号を付し説明は省略する。なお、以下の図では構成要素の材料を示すハッチングを省略する。
<Modification of First Embodiment>
Next,
<第1実施形態の変形例1>
図4に示す本変形例の光伝送モジュール1Aでは、光素子10Aはフォトダイオード(PD)等の受光素子である。例えば、フォトダイオードからなる光素子は、受光面10SAに対して垂直方向から入射した光を電気信号に変換して出力する。例えば、平面視寸法が350μm×300μmと超小型の受光素子は、直径が100μmの受光部11Aと、受光部11Aと電気的に接続された受信電気信号を出力するための接合用バンプ12と、を受光面10SAに有する。
<
In the
光伝送モジュール1Aは、光伝送モジュール1と同じように保持部材40の底面40SAが配線板50の第2の主面50SBと当接した状態で固定することにより、反射面20SAの光素子10Aの受光面(主面)10SAに対する角度θが、光ファイバ20を導光される光が光素子10Aと効率良く光結合する角度に自動的に固定される。このため、光伝送モジュール1Aは製造が容易である。
The
<第1実施形態の変形例2>
図5に示す本変形例の光伝送モジュール1Bは、保持部材40Bの底面40SAの光ファイバ20の長手方向、すなわち光軸に直交方向(Y軸方向)の幅L40が、クラッド22の外径R20と同じである。
<Modification 2 of the first embodiment>
In the
光ファイバ20のコア21を導光された光は、反射面20SAで反射されると、受光部11Aの方向(下方向:Z軸値減少方向)に光路が曲がり、クラッド22に進入する。コア21内を導光されている光はクラッド22との界面で反射されるため、光路が広がることはない。しかし、反射面20SAで反射されコア21からクラッド22に進入するときには、光路が広がってしまう。光路の大きさ、すなわち、光路方向から観察したときの幅L20は、光ファイバ20の開口数(NA)等により増減する。
When the light guided through the
例えば、コア21の屈折率が1.48で直径が50μm、クラッド22の屈折率が1.46で直径が125μm、NA=0.2の光ファイバ20では、底面40SAにおける光路の大きさを示す幅L20は67μmとなる。コア21の直径が62.5μmの場合には、幅L20は86μmとなる。
For example, in the
すなわち、クラッド22の外周面が底面40SAに露出している場合には、保持部材40Bの底面40SAの幅L40が、クラッド22の外径R20と同じであっても、光損失が増大することはない。光伝送モジュール1Bは、幅L40を小さくすることで、細径化が容易である。
That is, when the outer peripheral surface of the
<第1実施形態の変形例3>
図6に示す本変形例の光伝送モジュール1Cでは、保持部材40Cの底面40SAと側面40SSとの交差部に、切り欠きN40が形成されており、切り欠きN40に接着剤45が充填されている。
<
In the
接着剤45が切り欠きN40に充填されているため、フィレットの広がりが小さくなっている。このため、光伝送モジュール1Cは、細径化が容易である。
Since the adhesive 45 is filled in the cutout N40, the spread of the fillet is small. For this reason, the diameter of the
<第1実施形態の変形例4>
図7および図8Aに示す本変形例の光伝送モジュール1Dは、保持部材40Dの底面40SAと一方の側面40SSとがなす辺に、光ファイバ20の光軸に平行方向から観察したときの壁面が曲線状である切り欠きN40Dが形成されている。そして、切り欠きN40Dに充填されている接着剤45Dは、透明で、屈折率がクラッド22と略同じである。
<Modification 4 of the first embodiment>
The
図8Aに示すように、保持部材40Dは一方の側面にだけ切り欠きN40Dが形成されているため、光軸に平行方向から観察したときの形状が「涙型」である。
As shown in FIG. 8A, since the holding
光伝送モジュール1Dは、より細径化が容易である。なお、接着剤45Dの屈折率がクラッド22の屈折率と同じであるため、底面40SAにおける光路の幅L20よりも、保持部材40Dの底面40SAの幅L40が小さくても、光損失が大きくなることはない。
The
<第1実施形態の変形例5>
図8Bに示す本変形例の光伝送モジュール1Eにおいて、保持部材40Eは、上面が光ファイバ20の外形に沿った曲線状の、「釣り鐘型」である。
<Modification 5 of the first embodiment>
In the
すなわち、光ファイバ20の光路とならない領域の保持部材40Eの形状は、細径化等のために、適宜、変更が可能である。
That is, the shape of the holding
<第1実施形態の変形例6>
図9に示す本変形例の光伝送モジュール1Fは、保持部材40Fの側面40SSのうち、端面と対向している部分には切り欠きN40Fが形成されていない。
<Modification 6 of the first embodiment>
In the
このため、過剰に塗布された接着剤45が光路に浸入するおそれがない。すなわち、配線板50に保持部材40Fを固定できれば、接着剤45は、保持部材の側面の一部にだけ配設されていてもよい。
Therefore, there is no possibility that the excessively applied adhesive 45 enters the optical path. That is, as long as the holding
<第2実施形態および第2実施形態の変形例>
次に、第2実施形態の光伝送モジュール1G、および第2実施形態の変形例1~4の光伝送モジュール1H~1Kについて説明する。光伝送モジュール1G~1Kは、光伝送モジュール1、1A~1Fと類似し同じ効果を有するため、同じ機能の構成要素には同じ符号を付し説明は省略する。
<Second Embodiment and Modifications of Second Embodiment>
Next, the
効率良く光ファイバ20に導光するためには、光ファイバ20は、回転角度θだけでなく、光素子10、10Aに対する面内方向(XY面方向)の位置決めも重要である。例えば、発光部11の直上に光ファイバ20の反射面20SAの中心を配置することが好ましい。第2実施形態の光伝送モジュール1G、および第2実施形態の変形例1~4の光伝送モジュール1H~1Kは、保持部材が位置決め部材と当接することで、面内方向位置決めが自動的に行われる。
In order to guide light to the
以下、発光素子である光素子10を有する光伝送モジュールを例に説明するが、受光素子である光素子10Aを有す光伝送モジュールでも同じ効果を有する。
Hereinafter, an optical transmission module having the
<第2実施形態>
図10に示す光伝送モジュール1Gは、配線板50の第2の主面50SBに配設された位置決め部材60に、保持部材40の端部が挿入され嵌合している凹部T60がある。
Second Embodiment
The
位置決め部材60は、例えば、セラミック、Si(シリコン)、ガラス、樹脂または金属からなる。なお、凹部T60は、位置決め部材60の底面にも開口のある溝状である。凹部T60の内寸は、挿入される保持部材40の外寸と略同じである。ここで「略同じ」とは、保持部材40の外周面と凹部T60の壁面とが当接状態となるような、双方の寸法が実質的に「同じ」サイズであることを意味する。例えば、保持部材40の外寸に対して、凹部T60の内寸は1μm~5μmだけ大きく作製される。
The positioning
そして、保持部材40は、底面40SAが配線板50の第2の主面50SBと当接することで、回転方向が自動的に規定され、端部が位置決め部材60の凹部T60と嵌合することで、面内方向(XY方向)の位置決めが自動的に行われている。
The holding
このため、光伝送モジュール1Gは、光伝送モジュール1等よりも更に製造が容易である。
For this reason, the
<第2実施形態の変形例1>
図11に示すように、本変形例の光伝送モジュール1Hでは、位置決め部材60Hの凹部T60の上面に孔H60がある。孔H60は、光素子10の発光部11の直上に位置している。
<Modification Example 1 of Second Embodiment>
As shown in FIG. 11, in the
位置決め部材60Hを、光素子10が実装された配線板50に配設するときに、面内方向(XY方向)の位置決めを行う必要がある。
When positioning the
光伝送モジュール1Hでは、位置決め部材60Hの孔H60および配線板50の貫通孔H50を介して、配線板50の第1の主面50SAに配設されている光素子10の発光部11を上方から観察できる。例えば、孔H60の中央部に発光部11がある位置に位置決め部材60Hの位置を調整することにより、正確に光位置合わせを行うことができる。
In the
<第2実施形態の変形例2>
図12に示すように、本変形例の光伝送モジュール1Iでは、位置決め部材60IはL字型の壁状であり、上面にマーカー65(65A、65B)がある。マーカー65は光素子10の発光部11の直上との位置関係を示している。
<Modification 2 of the second embodiment>
As shown in FIG. 12, in the optical transmission module 1I of the present modification, the positioning member 60I has an L-shaped wall shape and has markers 65 (65A, 65B) on the upper surface. The
すなわち、マーカー65Aは、光ファイバ20の光軸方向(X方向)の位置を示しており、マーカー65Bは、光ファイバ20の光軸直交方向(Y方向)の位置を示している。マーカー65Aの延長線とマーカー65Bの延長線との交点が、光素子10の発光部11の直上である。
That is, the
光伝送モジュール1Iは、マーカー65を参考に位置決め部材60Iの位置を調整し固定することにより、容易に位置合わせを行うことができる。
The optical transmission module 1I can be easily aligned by adjusting and fixing the position of the positioning member 60I with reference to the
<第2実施形態の変形例3>
図13に示すように、本変形例の光伝送モジュール1Jでは、位置決め部材が、配線板50Jの第2の主面に配設されたバンプ53(53A、53B)である。すなわち、保持部材40の端部が配線板50Jのバンプ53と当接することで面内方向位置が自動的に規定されている。
<
As shown in FIG. 13, in the
光伝送モジュール1Jは、大きな位置決め部材を有していないので細径である。
The
なお、配線板50Jには、光軸方向(X方向)位置決め部材である第1のバンプ53Aと、光軸直交方向(Y方向)位置決め部材である第2のバンプ53Bと、が配設されている。なお、光軸方向または光軸直交方向の位置決めを行う場合には、第1のバンプ53Aまたは第2のバンプ53Bが配設されていればよい。
The
また、バンプ53の高さが低い場合にはバンプ53を2段バンプで構成してもよい。
In addition, when the height of the
<第2実施形態の変形例4>
図14に示すように、本変形例の光伝送モジュール1Kでは、位置決め部材が、配線板50Kの第2の主面50SBに実装されている電子部品59(59A、59B)である。すなわち、保持部材40は、端部が配線板50Kの電子部品59と当接することで面内方向位置が自動的に規定されている。
<Modification 4 of the second embodiment>
As shown in FIG. 14, in the
電子部品59(59A、59B)は、配線板50Kの作製時に配設された電極パッドに接合されている。電気回路形成のための電子部品59は光伝送モジュール1Kに必要な部品であり、その電子部品59に位置決め部材の機能が付加されている。なお、電子部品59は、位置決めのために必要十分な高さを有している。
The electronic component 59 (59A, 59B) is bonded to an electrode pad provided when the
光伝送モジュール1Kでは、配線板50Kに位置決め専用のバンプ等を配設する必要がない。配線板50Kの第2の主面50SBの面積を小さくできるため、光伝送モジュール1Kは、光伝送モジュール1Jの効果を有し、さらにより細径である。
In the
位置決め部材は、バンプ53および電子部品59の少なくともいずれかであればよい。すなわち、例えばバンプ53により光軸直交方向の位置決めを行い、電子部品59により光軸方向の位置決めを行ってもよい。また位置決め部材は、種類の異なる複数の電子部品であってもよい。
The positioning member may be at least one of the
なお、第2実施形態の光伝送モジュール1G、および第2実施形態の変形例1~4の光伝送モジュール1H~1Kにおいても、第1実施形態の変形例1A~1Fの保持部材40A~40Fと同じ構成の保持部材を用いることで、同じ効果を有することは言うまでも無い。
In the
<第3実施形態>
次に、第3の実施の形態の内視鏡9について説明する。
<Third Embodiment>
Next, an
図15に示すように、内視鏡9は、光伝送モジュール1~1Kのいずれかが硬性先端部9Aに配設された挿入部9Bと、挿入部9Bの基端側に配設された操作部9Cと、操作部9Cから延出するユニバーサルコード9Dと、を具備する。なお、例えば、硬性先端部9Aに配設された光伝送モジュール1から発信され、挿入部9Bを挿通する光ファイバ20が導光した光信号は、例えば、操作部9Cに配設された光伝送モジュール1Xにより電気信号に変換される。
As shown in FIG. 15, the
内視鏡9は、細径の光伝送モジュール1~1Kを有するため硬性先端部9Aが細径である。さらに、内視鏡9は、光伝送モジュール1~1Kを有するため製造が容易である。
Since the
本発明は、上述した実施形態および変形例等に限定されるものではなく、発明の趣旨を逸脱しない範囲内において種々の変更、組み合わせおよび応用が可能である。 The present invention is not limited to the above-described embodiments and modifications, and various modifications, combinations, and applications are possible without departing from the spirit of the invention.
1、1A~1K・・・光伝送モジュール
9・・・内視鏡
10・・・光素子
20・・・光ファイバ
20SA・・・反射面
30・・・ケーブル
40・・・保持部材
45・・・接着剤
50・・・配線板
59・・・電子部品
60・・・位置決め部材
65・・・マーカー
DESCRIPTION OF
Claims (13)
コアとクラッドとを有し、断面が円形で、端面が傾斜している反射面である光ファイバと、
前記光ファイバの端部が埋め込まれている保持部材と、
第1の主面と前記第1の主面と対向する第2の主面とを有し、前記第1の主面に前記光素子が実装されており、前記第2の主面に前記保持部材が接着されており、光路となる貫通孔が形成されている配線板と、を具備する光伝送モジュールであって、
前記保持部材が透明樹脂からなり、
前記保持部材の底面が前記配線板の前記第2の主面と当接し、前記反射面の前記光素子の主面に対する角度が、前記光ファイバを導光される光が前記光素子と光結合する角度に固定されていることを特徴とする光伝送モジュール。 An optical element comprising a light emitting element or a light receiving element;
An optical fiber having a core and a clad, having a circular cross section, and a reflecting surface having an inclined end surface;
A holding member in which an end of the optical fiber is embedded;
A first main surface and a second main surface opposite to the first main surface, the optical element being mounted on the first main surface, and the holding on the second main surface; An optical transmission module comprising a wiring board having a member bonded thereto and a through hole serving as an optical path;
The holding member is made of a transparent resin,
The bottom surface of the holding member is in contact with the second main surface of the wiring board, and the angle of the reflection surface with respect to the main surface of the optical element is such that light guided through the optical fiber is optically coupled to the optical element. An optical transmission module characterized by being fixed at an angle.
前記切り欠きに注入されている透明接着剤により、前記保持部材が前記配線板に固定されていることを特徴とする請求項1に記載の光伝送モジュール。 A cutout is formed in the holding member,
The optical transmission module according to claim 1, wherein the holding member is fixed to the wiring board by a transparent adhesive injected into the notch.
前記孔が、前記光素子の発光部または受光部の直上に位置していることを特徴とする請求項9に記載の光伝送モジュール。 There is a hole in the upper surface of the concave portion of the positioning member,
The optical transmission module according to claim 9, wherein the hole is located immediately above the light emitting part or the light receiving part of the optical element.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017558814A JPWO2017115413A1 (en) | 2015-12-28 | 2015-12-28 | Optical transmission module and endoscope |
| PCT/JP2015/086502 WO2017115413A1 (en) | 2015-12-28 | 2015-12-28 | Optical transmission module and endoscope |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2015/086502 WO2017115413A1 (en) | 2015-12-28 | 2015-12-28 | Optical transmission module and endoscope |
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| WO2017115413A1 true WO2017115413A1 (en) | 2017-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2015/086502 Ceased WO2017115413A1 (en) | 2015-12-28 | 2015-12-28 | Optical transmission module and endoscope |
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| JP (1) | JPWO2017115413A1 (en) |
| WO (1) | WO2017115413A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020054453A1 (en) * | 2018-09-10 | 2020-03-19 | 古河電気工業株式会社 | Optical probe |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10325917A (en) * | 1997-05-26 | 1998-12-08 | Matsushita Electric Ind Co Ltd | Optical receiving device and manufacturing method thereof |
| JP2012194401A (en) * | 2011-03-16 | 2012-10-11 | Nitto Denko Corp | Opto-electric hybrid substrate and manufacturing method of the same |
| JP2015104387A (en) * | 2013-11-28 | 2015-06-08 | オリンパス株式会社 | Endoscope |
-
2015
- 2015-12-28 JP JP2017558814A patent/JPWO2017115413A1/en active Pending
- 2015-12-28 WO PCT/JP2015/086502 patent/WO2017115413A1/en not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10325917A (en) * | 1997-05-26 | 1998-12-08 | Matsushita Electric Ind Co Ltd | Optical receiving device and manufacturing method thereof |
| JP2012194401A (en) * | 2011-03-16 | 2012-10-11 | Nitto Denko Corp | Opto-electric hybrid substrate and manufacturing method of the same |
| JP2015104387A (en) * | 2013-11-28 | 2015-06-08 | オリンパス株式会社 | Endoscope |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020054453A1 (en) * | 2018-09-10 | 2020-03-19 | 古河電気工業株式会社 | Optical probe |
| JPWO2020054453A1 (en) * | 2018-09-10 | 2021-09-24 | 古河電気工業株式会社 | Optical probe |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2017115413A1 (en) | 2018-10-25 |
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