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WO2017113314A1 - 封装结构、柔性显示屏及封装结构制作方法 - Google Patents

封装结构、柔性显示屏及封装结构制作方法 Download PDF

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Publication number
WO2017113314A1
WO2017113314A1 PCT/CN2015/100162 CN2015100162W WO2017113314A1 WO 2017113314 A1 WO2017113314 A1 WO 2017113314A1 CN 2015100162 W CN2015100162 W CN 2015100162W WO 2017113314 A1 WO2017113314 A1 WO 2017113314A1
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WO
WIPO (PCT)
Prior art keywords
inorganic
package structure
layer
display panel
inorganic layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/100162
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English (en)
French (fr)
Inventor
陈一鸣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to CN201580073408.4A priority Critical patent/CN107210384B/zh
Priority to EP15911940.3A priority patent/EP3321987A4/en
Priority to KR1020187006519A priority patent/KR20180038502A/ko
Priority to JP2018518582A priority patent/JP6619514B2/ja
Priority to CA2995421A priority patent/CA2995421A1/en
Priority to PCT/CN2015/100162 priority patent/WO2017113314A1/zh
Priority to US15/747,275 priority patent/US10673021B2/en
Publication of WO2017113314A1 publication Critical patent/WO2017113314A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements
    • G02F2201/501—Blocking layers, e.g. against migration of ions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present invention relates to the field of flexible display screens, and in particular, to a package structure, a flexible display screen, and a method for fabricating a package structure.
  • the present invention provides a package structure for packaging and attaching to a display panel, wherein the package structure includes a first inorganic layer, and the first inorganic layer includes non-continuously arranged on the display panel. a first inorganic portion and a second inorganic portion connected between the first inorganic portions.
  • the present invention also provides a flexible display screen, wherein the flexible display screen comprises the above package structure, and the flexible display screen further comprises a display panel, the first inorganic layer being attached to the display panel.
  • the invention also provides a method for fabricating a package structure, wherein the method for fabricating a package structure comprises the steps of:
  • a first inorganic layer is formed, the first inorganic layer having a first inorganic portion that is discontinuously arranged on the display panel and a second inorganic portion that is connected between the first inorganic portions.
  • the package structure, the flexible display panel and the package structure manufacturing method of the present invention by laminating a first inorganic layer on the display panel, the first inorganic layer includes a first inorganic portion that is discontinuously arranged and is connected to the first inorganic portion
  • the second inorganic portion is interposed between the second inorganic portion and the first inorganic portion, and the first inorganic portion and the second inorganic portion prevent water and oxygen absorption from each other, preventing water and oxygen from diffusing, and blocking the package structure.
  • the oxygen barrier property is improved, that is, the package structure improves the package performance.
  • FIG. 1 is a schematic cross-sectional view of a package structure provided by the present invention.
  • FIG. 2 is a schematic cross-sectional view of a flexible display screen provided by the present invention.
  • FIG. 3 is a schematic flow chart of a method for fabricating a package structure provided by the present invention.
  • FIG. 4 is a schematic flow chart of a first inorganic layer forming method of the method for fabricating the package structure of FIG. 3;
  • FIG. 5 is a schematic flow chart of a first organic layer forming method of the method for fabricating the package structure of FIG. 3;
  • FIG. 6 is a schematic structural view of a first mask of the method for fabricating the package structure of FIG. 3;
  • FIG. 7 is a schematic structural view of a second mask of the method for fabricating the package structure of FIG. 3;
  • FIG. 8 is a schematic view showing the arrangement of a first inorganic layer in the method of fabricating the package structure of FIG. 3.
  • FIG. 8 is a schematic view showing the arrangement of a first inorganic layer in the method of fabricating the package structure of FIG. 3.
  • the present invention provides a package structure 100 that is attached to a display panel 101.
  • the display panel 101 includes a plurality of arrays of light emitting units 102 and is connected to two adjacent light emitting units 102.
  • the package structure 100 includes a first inorganic layer 10 including a plurality of first inorganic portions 11 and a second inorganic portion 12 connected between adjacent two first inorganic portions 11.
  • the plurality of first inorganic portions 11 are arranged in an array, the first inorganic portion 11 is pasted and covered to cover the light emitting unit 102, and the second inorganic portion 12 is attached to the covered pixel defining unit 103.
  • the display panel 101 can be an organic electroluminescent layer (OLED) or a liquid crystal display luminescent layer (LCD).
  • OLED organic electroluminescent layer
  • LCD liquid crystal display luminescent layer
  • the display panel 101 is exemplified as an electroluminescent layer.
  • the package structure 100 encapsulates the display panel 101 to prevent the display panel 101 from absorbing water and oxygen, thereby preventing the display panel The display of 101 is invalid.
  • the first inorganic layer 10 includes a plurality of first inorganic portions 11 of an array and second inorganic portions 12 connected between adjacent two first inorganic portions 11 by laminating a first inorganic layer 10 on the display panel 101.
  • the plurality of first inorganic portions 101 correspond to the plurality of light emitting units 102, and are connected between the two first inorganic portions 11 by the second inorganic portion 12, and the plurality of first inorganic portions 11 are discontinuously connected, the first inorganic portion 11 and the second inorganic portion 12 are spaced apart from each other, and the material of the first inorganic portion 11 and the material of the second inorganic portion 12 are different, and the first inorganic portion 11 and the second inorganic portion 12 block water oxygen absorption from each other, thereby preventing water and oxygen from diffusing, so that
  • the first inorganic layer 10 has improved oxygen barrier properties, that is, the package structure 100 improves package performance.
  • the plurality of first inorganic portions 11 are arranged in a rectangular array, and the plurality of first inorganic portions 11 are arranged in the lateral direction and the longitudinal direction.
  • the first inorganic portion 11 is made of an inorganic material, and the first inorganic portion 11 has good barrier properties of water and oxygen and light transmittance, and the display panel 101 can be effectively protected by the physical stability and chemical stability of the first inorganic portion 11.
  • the water oxygen erosion is isolated to prevent the display panel 101 from deteriorating.
  • Each of the first inorganic portions 11 has a rectangular sheet shape, and each of the first inorganic portions 11 exhibits a transparent property, so that each of the first inorganic portions 11 transmits light of the light-emitting unit 102, thereby not affecting the display performance of the display panel 101.
  • Each of the first inorganic portions 11 is independent of each other to improve the barrier property of water vapor.
  • the second inorganic portion 12 has a mesh shape, and the second inorganic portion 12 is formed of a metal line which is criss-crossed.
  • the second inorganic portion 12 blocks the plurality of first inorganic portions 11 and is fixedly coupled to the plurality of first inorganic portions 11.
  • the second inorganic portion 12 has metal ductility and utilizes the metal waterproof and oxidation resistance to cause the first inorganic layer 10 to block water oxygen performance.
  • the second inorganic portion 12 is stable in performance, so that the second inorganic portion 12 and the pixel defining unit 103 are structurally stable, thereby making the structure of the first inorganic layer 10 and the display panel 101 stable.
  • the second inorganic portion 12 is stacked on the pixel defining unit 103, so that the second inorganic portion 12 avoids the development of the light unit 102, and the second inorganic portion 12 does not affect the display performance of the display panel 101, that is, the package structure 100 is ensured to be well permeable. Light performance.
  • the package structure 100 further includes a first organic layer 20 that is attached to the side of the first inorganic layer 10 facing away from the display panel 101 and completely covers the first inorganic layer 10, and the first organic layer 20 is organic.
  • the first organic layer 20 is laminated on the first inorganic layer 10, so that the first inorganic layer 10 is flattened, so that the package structure is flat, thereby improving the use performance of the package structure 100, and facilitating the package structure 100 and the display panel. 101 is applied to the terminal.
  • the first inorganic layer 10 is completely covered by the first organic layer 20, that is, the first organic layer 20 completely covers the plurality of An inorganic portion 11 and a second inorganic portion 12, thereby making the structure of the package structure 100 compact, further improving the stability of the package structure 100.
  • the package structure 100 further includes a second inorganic layer 30 and a second organic layer 40 stacked on the side of the first organic layer 20 facing away from the first inorganic layer 10, and the second inorganic layer 30 includes a plurality of The third inorganic portion 31 and the fourth inorganic portion 32 connected between the adjacent two third inorganic portions 31 are disposed in an array of a plurality of third inorganic portions 31, and each of the third inorganic portions 31 covers each of the first inorganic portions 11
  • Each of the fourth inorganic portions 32 covers each of the second inorganic portions 12; the second organic layer 40 is laminated on the side of the second inorganic layer 30 facing away from the first organic layer 20 and completely covers the second inorganic layer 30.
  • the second inorganic layer 30 is disposed in the same manner as the first inorganic layer 10, that is, the material of the third inorganic portion 31 and the material of the first inorganic portion 11 may be the same, and the material of the fourth inorganic portion 32 and the second The material of the inorganic portion 12 can be set in the same manner.
  • the second inorganic layer 30 is laminated on the first organic layer 20 to further improve the packaging effect of the package structure 100 by utilizing the bending resistance and the barrier property of the second inorganic layer 30.
  • the material and the second organic layer 40 are The material of an organic layer 20 may be the same, and the second organic layer 40 planarizes the second inorganic layer 30, improves the flatness of the package structure 100, and enhances the structural stability of the package structure 100.
  • the thickness of the second inorganic layer 30 is smaller than the thickness of the first inorganic layer 10, thereby effectively reducing the thickness of the package structure 100, so that the package structure 100 can be applied to a slim terminal, thereby reducing the thickness of the terminal and improving Application performance of the package structure 100.
  • the number of the second inorganic layers 30 may be a plurality of layers
  • the number of the second organic layers 40 may be a plurality of layers
  • the plurality of second inorganic layers 30 and the plurality of second organic layers 40 are alternately laminated.
  • a second organic layer 40 is laminated on the side of each of the second inorganic layers 30 facing away from the first inorganic layer 10, thereby utilizing the plurality of second inorganic layers 30 and the plurality of second organic layers 40.
  • the alternate stacking causes the barrier oxygen channel of the package structure 100 to grow, thereby improving the package performance of the package structure 100.
  • the package structure 100 further includes a protective layer 50 attached to the side of the second organic layer 40 facing away from the second inorganic layer 30, and the protective layer 50 completely covers the first inorganic layer 10.
  • the protective layer 50 is deposited on the second organic layer 40.
  • the protective layer 50 forms protection for the first inorganic layer 10, the first organic layer 20, the second inorganic layer 30, and the second organic layer 40, has good waterproof and anti-corrosion properties, thereby increasing the service life of the package structure 100, and the protective layer 50
  • the second inorganic portion 12 can also be The fourth inorganic portion 32 and the second inorganic portion 32 are protected from oxidation or corrosion, thereby ensuring good insulation of the package structure 100 and good bending resistance.
  • the protective layer 50 may be made by thermally evaporating magnesium difluoride such that the protective layer 50 may protect the second inorganic portion 12 and the second metal portion 32.
  • the protective layer 50 may also be formed by chemical vapor deposition, physical vapor deposition, or vacuum evaporation.
  • the protective layer 50 has good anti-corrosion and waterproof properties, so that the protective layer 50 has better protection properties.
  • the material of the first inorganic portion 11 is a combination of any one or more of aluminum oxide, tin oxide, zinc oxide, titanium oxide, zirconium oxide, silicon nitride, and silicon oxynitride
  • the material of the second inorganic portion 12 may be any one of silver, copper or aluminum.
  • the second inorganic portion 11 is a metal oxide, so that the first inorganic portion 11 and the second inorganic portion 12 can be integrally formed. Thereby, the first inorganic portion 11 and the second inorganic portion 12 are structurally stable, and the first inorganic portion 11 has better flexibility in performing good light transmission properties, thereby satisfying the packaging requirements of the package structure 100.
  • the second inorganic portion 12 is made of a metal material to have better water-insulating properties, and also has good bending resistance, thereby improving the durability of the package structure 100, and the second inorganic portion 12 is made of silver, copper or aluminum.
  • the material having a high thermal conductivity enables the second inorganic portion 12 to effectively conduct heat to the display panel 101, that is, to effectively derive the heat generation amount of the light emitting unit 102, thereby improving the heat dissipation performance of the package structure 100, and further satisfying the multifunctional structure of the package structure 100. Sexual requirements.
  • the material of the first organic layer 20 is a combination of any one or more of poly(p-butylene dicarboxylate), polyimide, epoxy resin, polyethylene, and polypropylene.
  • the first organic layer 20 is made of an organic compound material, so that the first organic layer 20 is easily formed, and the structure is stable, the durability is enhanced, the first organic layer 20 protects the first inorganic layer 10, and the first inorganic portion 11 and the second portion The connection passage between the inorganic portions 12 is blocked to prevent the first inorganic portion 11 and the second inorganic portion 12 from being separated from each other, and the stability of the package structure 100 is further enhanced.
  • the first organic layer 20 effectively satisfies the slimness requirements of the package structure 100, and the package structure 100 is convenient for use in any device.
  • the present invention also provides a flexible display screen 200 including a package structure 100, a flexible back sheet 210, and a display panel 101.
  • the display panel 101 is stacked on the flexible backplane 210.
  • the display panel 101 includes a plurality of light emitting units 102 and a pixel defining unit 103 connected between two adjacent light emitting units 102.
  • the plurality of light emitting units 102 are arranged in an array, and the package structure 100 is attached.
  • the first inorganic portion 11 is attached to the cover unit 101, and the second inorganic portion 12 is attached to the cover pixel defining unit 103.
  • the flexible back plate 210 is a rectangular plate member.
  • the flexible backplane 210 may be a thin film crystal layer (TFT), and a driving electrode is disposed in the flexible backplane 210 to drive the organic electroluminescent layer (OLED) to emit light, that is, to drive the display panel 101 to emit light.
  • the flexible back plate 210 can be arbitrarily bent.
  • the flexible back plate 210 includes a first outer surface 210a and a first inner surface 210b disposed opposite to each other, and the display panel 102 is fixed on the first inner surface 210b.
  • the material of the flexible back sheet 210 is made of polyethylene naphthalate, polyethylene terephthalate or polyimide resin.
  • the display panel 102 is an OLED (Organic Light-Emitting Diode).
  • the light emitting unit 102 is composed of RGB three primary color sub-pixels, and the pixel defining unit 103 controls the three primary color sub-pixels to emit light in the light emitting unit 102, so that the light emitting unit 102 presents different colors.
  • the pixel definition unit 103 does not emit light.
  • the display panel 102 can also be a liquid crystal display layer (LCD).
  • the display panel 101 further includes an insulating film 220, a passivation layer 230, an electrode assembly 240, and a driving assembly 250; the insulating film 220 and the passivation layer 202 are sequentially stacked on the flexible backplane 210; the light emitting unit 102 and the pixel defining unit 103
  • the electrode assembly 240 is laminated on the light-emitting unit 102 and electrically connected to the pixel defining unit 103 to input an electrical signal to the light-emitting unit 102.
  • the driving component 250 is embedded in the insulating film 220, and the pixel The defining unit 103 is oppositely disposed, and electrically connects the electrode assembly 240 and the pixel defining unit 103 for driving the light emitting unit 102 to emit light.
  • the insulating film 220 provides an insulating environment for the drive assembly 250 such that the drive assembly 250 receives electrical signals.
  • the driving component 250 receives the driving electrical signal, and the driving electrode assembly 240 emits a voltage change to the light emitting unit 102, thereby driving the light emitting unit 102 to emit light.
  • the pixel definition unit 103 receives the scan electrical signal, thereby controlling the illumination of different RGB sub-pixels within the light-emitting unit 102 such that the light-emitting unit 102 exhibits a color change.
  • the electrode assembly 240 includes an anode 241 and a cathode 242.
  • the anode 241 is fixed between the light emitting unit 102 and the passivation layer 230, opposite to the light emitting unit 102, and electrically connected to the driving assembly 250.
  • the cathode 242 is fixed between the light emitting unit 102 and the package structure 100, disposed opposite to the anode 241, and connected to the driving assembly 250.
  • the driving assembly 250 includes an active wire 251, a gate 252, a source 253 and a drain 254, and an active wire 251.
  • the relative pixel defining unit 103 is disposed.
  • the source 253 is electrically connected between the active wire 251 and the anode 241, and the drain 254 is electrically connected between the cathode 242 and the active wire 251.
  • the gate 252 and the source 253 and the drain 254 are connected. Electrical connection.
  • the active wire 251 receives an electrical signal, and controls the anode 241 and the cathode 242 to apply voltage to the light emitting unit 102 via the gate 252, the source 253, and the drain 254. Variety.
  • the driving component 250 and the pixel defining unit 103 both receive an electrical signal, easily generate a large amount of heat, and neither the pixel defining unit 103 nor the driving component 250 emits light, and the second inorganic portion 12 of the package structure 100 correspondingly covers the driving component 250 and the pixel definition.
  • the unit 103 on the one hand, the good thermal conductivity of the second inorganic portion 12 can dissipate heat to the pixel defining unit 103 and the driving assembly 250, and on the other hand, the second inorganic portion 12 avoids the development of the optical unit 102 to ensure good light transmission of the package structure 100. Therefore, the flexible display 200 has a high service life and excellent performance.
  • the present invention also provides a method for fabricating a package structure.
  • the method for fabricating the package structure provided by the embodiment of the present invention will be described in detail below with reference to FIG. 3, FIG. 4 and FIG. 5. It should be noted that FIG. 3, FIG. 4 and FIG.
  • the manufacturing method of the package structure is used to prepare the structure of the embodiment shown in FIG. 1 to FIG. 2 of the present invention. For the convenience of description, only the parts related to the embodiment of the present invention are shown, and the specific technical details are not disclosed, please refer to this The embodiment shown in Figures 1 - 2 is invented.
  • the package structure manufacturing method is used to fabricate the package structure 100 on the display panel 101, including:
  • S01 forming a first inorganic layer 10, the first inorganic layer 10 having an array of a plurality of first inorganic portions 11 and a second inorganic portion 12 connected between adjacent two first inorganic portions 11, the first inorganic The portion 11 is bonded to the light emitting unit 102, and the second inorganic portion 12 is bonded to the pixel defining unit 103.
  • the first inorganic layer 10 is formed by mask deposition. Specifically include:
  • the first inorganic portion 11 is molded by using a grid-shaped first mask 310.
  • the first mask 310 includes a first cover portion 311 in a "well" shape and a first hollow portion 312 disposed between the first cover portions 311.
  • the first mask 310 is placed on the display panel 101, and the first masking portion 311 corresponds to the pixel defining unit 103.
  • the first hollow region 312 corresponds to the light emitting unit 102, and the first inorganic portion 11 is deposited by using a vacuum device.
  • the first hollow portion 312 is disposed such that the first inorganic portion 11 correspondingly covers the light emitting unit 102.
  • S102 Form a lateral first metal stripe 121 by using a stripe-shaped second mask 320.
  • the first metal stripe 121 is disposed between the two adjacent first inorganic portions 11 in the lateral direction.
  • the second mask 320 includes a plurality of laterally extending second covering portions 321 and a second hollow portion 322 disposed between the adjacent two second covering portions 321 .
  • the two cover portions 312 are arranged side by side in the longitudinal direction, and the second hollow portion 322 is a laterally extending recess.
  • the first mask 310 is removed from the display panel 101, the second masking portion 321 is correspondingly covered with a plurality of first inorganic portions 11 arranged laterally, and the second hollow region 322 corresponds to the pixel defining unit 102 extending laterally.
  • vapor deposition equipment will be the first
  • the metal stripe 121 is evaporated on the laterally extending pixel definition unit 102.
  • S103 forming a longitudinal second metal stripe 122 by using a stripe-shaped third mask (not labeled), and the second metal stripe 122 is disposed between the adjacent two first inorganic portions 11 in the longitudinal direction, and the second metal stripe 122 and the first metal strip 121 constitute the second inorganic portion 12.
  • the third mask is configured the same as the second mask 320, except that the third mask is rotated by 90° with respect to the second mask 320. Specifically, after the second mask 320 is rotated by 90°, the second covering portion 321 correspondingly covers the first inorganic portion 11 arranged in the longitudinal direction.
  • the second hollow region 322 corresponds to the second inorganic portion 12 extending longitudinally, so that the second metal stripe 122 is evaporated on the longitudinally extending second inorganic portion 12 by means of an evaporation apparatus. Thereby, the second metal stripe 122 and the first metal stripe 121 together constitute the second inorganic portion 12.
  • the first organic layer 20 is formed by vacuum evaporation or inkjet printing, and specifically includes:
  • the precursor may be a raw material of the first organic layer 20, and the precursor is laid on the first inorganic layer 10 to facilitate physical or chemical processing to form the first organic layer 20.
  • S202 The precursor is photocured or thermally cured to form the first organic layer 20.
  • the precursor is a photosensitive material or a heat sensitive material such that the first organic layer 20 is firmly bonded to the first inorganic layer 10.
  • S03 forming a second inorganic layer 30 on a side of the first organic layer 20 facing away from the first inorganic layer 10, the second inorganic layer 30 having a plurality of arrays of the third inorganic portion 31 and connecting to the adjacent two third inorganic portions
  • the fourth inorganic portion 32 between 31 and the third inorganic portion 31 correspond to the first inorganic portion 11.
  • the specific molding process of the second inorganic layer 30 and the specific molding process of the first inorganic layer 10 may be the same, and will not be described herein again, except that the thickness of the second inorganic layer 30 is smaller than the thickness of the first inorganic layer 10.
  • the second organic layer 40 is formed on the side of the second inorganic layer 30 facing away from the first organic layer 20, and the second organic layer 40 completely covers the second inorganic layer 30.
  • the second organic layer 40 is disposed in the same manner as the first organic layer 20 and will not be described herein.
  • steps S04 and S05 are repeated a plurality of times, and finally the multilayered second inorganic layer 30 and the multilayered second organic layer 40 are alternately laminated.
  • the package structure, the flexible display panel and the package structure manufacturing method of the present invention by laminating a first inorganic layer on the display panel, the first inorganic layer includes a first inorganic portion that is discontinuously arranged and is connected to the first inorganic portion
  • the second inorganic portion is separated from each other by the second inorganic portion and the first inorganic portion, and the first inorganic portion and the second inorganic portion prevent water and oxygen absorption from each other, preventing water and oxygen from diffusing, and the oxygen barrier property of the package structure is prevented.
  • the improvement is to make the package structure improve the package performance.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

一种封装结构（100）、柔性显示屏（200）及封装结构（100）制作方法，封装结构（100）用于封装贴合于显示面板（101）上，所述封装结构（100）包括第一无机层（10），第一无机层（10）包括非连续排布于所述显示面板（101）上的第一无机部（11）和连接于第一无机部（11）之间的第二无机部（12）。利用第二无机部（12）连接于非连续排布的第一无机部（11）之间，从而第一无机部（11）和第二无机部（12）相互间隔，第一无机部（11）和第二无机部（12）相互阻止水氧吸收，进而提高封装结构（100）的阻隔水氧性能，即使得封装结构（100）提升封装性能。

Description

封装结构、柔性显示屏及封装结构制作方法 技术领域
本发明涉及柔性显示屏领域，尤其涉及一种封装结构、柔性显示屏及封装结构制作方法。
背景技术
目前柔性显示屏的应用越来越广泛，大多数柔性显示屏都会利用封装结构对有机电致发光层(OLED)进行封装，以防止有机电致发光层吸收水氧而失效，然而目前封装结构存在结构单一问题，多数利用有机层和无机层交替层叠制成，从而导致目前封装结构在潮湿环境下容易吸收过多的水氧，导致封装结构的有机层和无机层相互脱离，从而影响封装结构性能。
发明内容
本发明的目的在于提供一种结构稳定的封装结构、柔性显示屏及封装结构制作方法。
为了解决上述技术问题，本发明提供了一种封装结构，用于封装贴合于显示面板上，其中，封装结构包括第一无机层，第一无机层包括非连续排布于所述显示面板上的第一无机部和连接于第一无机部之间的第二无机部。
本发明还提供一种柔性显示屏，其中，柔性显示屏包括上述的封装结构，柔性显示屏还包括显示面板，第一无机层贴合于所述显示面板上。
本发明还提供一种封装结构制作方法，其中，封装结构制作方法包括步骤：
成型一层第一无机层，第一无机层具有非连续排布于显示面板上的第一无机部和连接于第一无机部之间的第二无机部。
本发明的封装结构、柔性显示屏和封装结构制作方法，通过在显示面板上层叠一层第一无机层，第一无机层包括非连续排布的第一无机部和连接于第一无机部之间的第二无机部，利用第二无机部和第一无机部相互间隔设置进而第一无机部和第二无机部相互阻止水氧吸收，防止水氧扩散，使得封装结构的阻 氧阻水性能提高，即使得封装结构提升封装性能。
附图说明
为了更清楚地说明本发明的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明提供的的封装结构的截面示意图；
图2是本发明提供的柔性显示屏的截面示意图；
图3是本发明提供的封装结构制作方法的流程示意图；
图4是图3的封装结构制作方法的第一无机层成型方法的流程示意图；
图5是图3的封装结构制作方法的第一有机层成型方法的流程示意图；
图6是图3的封装结构制作方法的第一掩膜版的结构示意图；
图7是图3的封装结构制作方法的第二掩膜版的结构示意图；
图8是图3的封装结构制作方法的第一无机层的排布示意图。
具体实施方式
下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进行清楚、完整地描述。
请参阅图1和图2，本发明提供了一种封装结构100，封装结构贴合于显示面板101上，显示面板101包括多个阵列的发光单元102和连接于相邻两个发光单元102之间的像素定义单元103。封装结构100包括第一无机层10，第一无机层10包括多个第一无机部11和连接于相邻两个第一无机部11之间的第二无机部12。多个第一无机部11阵列设置，第一无机部11贴合并遮盖发光单元102，第二无机部12贴合并遮盖像素定义单元103。可以理解的是，显示面板101可以是有机电致发光层(OLED)，或者是液晶显示发光层(LCD)。本实施例中，显示面板101作为机电致发光层进行举例说明。封装结构100对显示面板101进行封装，防止显示面板101吸收水氧，进而防止显示面板 101的显示失效。
通过在显示面板101上层叠一层第一无机层10，第一无机层10包括阵列的多个第一无机部11和连接于相邻两个第一无机部11之间的第二无机部12，多个第一无机部101与多个发光单元102相对应，利用第二无机部12连接于两个第一无机部11之间，多个第一无机部11非连续连接，第一无机部11和第二无机部12相互间隔设置，第一无机部11的材质和第二无机部12材质不同，第一无机部11和第二无机部12相互阻止水氧吸收，防止水氧扩散，使得第一无机层10阻氧阻水性能提高，即使得封装结构100提升封装性能。
本实施方式中，多个第一无机部11呈矩形阵列设置，多个第一无机部11沿横向和纵向排列。第一无机部11采用无机材料制成，第一无机部11具有良好的阻隔水氧性能和透光性，而且利用第一无机部11的物理稳定性和化学稳定性，可以有效保护显示面板101，隔绝水氧侵蚀，防止显示面板101退化。每一第一无机部11呈矩形片状，每一第一无机部11呈现透明性能，从而每一第一无机部11透过发光单元102的光线，从而不影响显示面板101的显示性能。每一第一无机部11相互独立，提高阻隔水氧性能。
本实施方式中，第二无机部12呈网格状，第二无机部12由纵横交错的金属线构成。第二无机部12对多个第一无机部11进行阻隔，并且与多个第一无机部11固定连接。第二无机部12具有金属延展性能，并且利用金属防水防氧化性能，使得第一无机层10阻隔水氧性能提高。第二无机部12性能稳定，从而第二无机部12与像素定义单元103结构稳固，从而使得第一无机层10与显示面板101的结构稳固。第二无机部12层叠于像素定义单元103上，从而第二无机部12避开发光单元102，进而第二无机部12并不影响显示面板101的显示性能，即保证了封装结构100的良好透光性能。
进一步地，封装结构100还包括第一有机层20，第一有机层20贴合于第一无机层10背离显示面板101一侧，并完全覆盖第一无机层10，第一有机层20采用有机材料制成。本实施方式中，利用第一有机层20层叠于第一无机层10上，使得第一无机层10平整，从而使得封装结构平整，进而提高封装结构100的使用性能，方便封装结构100和显示面板101应用于终端上。并且，利用第一有机层20完全覆盖第一无机层10，即第一有机层20完全覆盖多个第 一无机部11和第二无机部12，从而使得封装结构100的结构紧凑，进一步地提高封装结构100的稳定性。
进一步地，封装结构100还包括第二无机层30和第二有机层40，第二无机层30层叠于第一有机层20背离第一无机层10一侧，第二无机层30包括多个第三无机部31和连接于相邻两个第三无机部31之间的第四无机部32，多个第三无机部31阵列设置，每一第三无机部31覆盖每一第一无机部11，每一第四无机部32覆盖每一第二无机部12；第二有机层40层叠于第二无机层30背离第一有机层20一侧，并完全覆盖第二无机层30。
本实施方式中，第二无机层30与第一无机层10相同设置，即第三无机部31的材质与第一无机部11的材质可以相同设置，第四无机部部32的材质与第二无机部12的材质可以相同设置。利用第二无机层30层叠于第一有机层20上，从而进一步利用第二无机层30的耐折弯性能和阻隔水氧性能提高封装结构100的封装效果，第二有机层40的材质与第一有机层20的材质可以相同设置，第二有机层40使得第二无机层30平整，提高封装结构100的平整性，并且增强封装结构100的结构稳固性。
进一步地，第二无机层30的厚度小于第一无机层10的厚度，从而有效减小封装结构100的厚度，从而使得封装结构100可以应用于纤薄的终端上，进而降低终端的厚度，提升封装结构100的应用性能。
进一步地，第二无机层30的数目可以是多层，第二有机层40的数目可以是多层，多层第二无机层30和多层第二有机层40交替层叠。
本实施方式中，在每一层第二无机层30背离第一无机层10一侧均会层叠有一层第二有机层40，从而利用多层第二无机层30和多层第二有机层40交替层叠，使得封装结构100的阻隔水氧通道增长，从而提高封装结构100的封装性能。
进一步地，封装结构100还包括保护层50，保护层50贴合于第二有机层40背离第二无机层30一侧，保护层50完全覆盖第一无机层10。本实施方式中，保护层50沉积于第二有机层40上。保护层50对第一无机层10、第一有机层20、第二无机层30和第二有机层40形成保护，具有良好的防水防腐蚀性能，从而增加封装结构100的使用寿命，保护层50还可以对第二无机部12 和第四无机部32形成保护，使得第二无机部12和第二无机部32不被氧化或腐蚀，进而保证封装结构100良好的隔绝水氧性能和良好的耐折弯性。保护层50可以是采用热蒸镀二氟化镁制成，从而保护层50可以保护第二无机部12和第二金属部32。保护层50还可以是采用化学气相沉积、或物理气相沉积、或真空蒸镀而成，保护层50具有良好的防腐防水性能，从而保护层50具有较好的保护性能。进一步地，第一无机部11的材质为铝氧化物、锡氧化物、锌氧化物、钛氧化物、锆氧化物、硅氮化物、硅氧氮化物的任意一种或多种的组合，第二无机部12的材质可以是银、铜或铝的任意一种金属材料，利用第二无机部11为金属氧化物的特性，使得第一无机部11可以与第二无机部12可以一体成型，从而使得第一无机部11和第二无机部12结构稳固，并且第一无机部11在表现良好透光性能下，具有较好的柔性，从而满足封装结构100的封装要求。第二无机部12采用金属材质可以具有较好的隔绝水氧性能，并且还具有较好的耐折弯性能，进而使得封装结构100的耐久性提高，第二无机部12采用银、铜或铝导热率较高的材料，使得第二无机部12可以有效对显示面板101进行导热，即有效将发光单元102的发热量导出，从而实现封装结构100的散热性能提高，进一步满足封装结构100多功能性要求。
进一步地，第一有机层20的材质为聚对笨二甲酸乙二醇脂、聚酰亚胺、环氧树脂、聚乙烯、聚丙烯的任意一种或多种的组合。第一有机层20采用有机化合物材质，使得第一有机层20容易成型，且结构稳定，耐久性增强，第一有机层20对第一无机层10保护，以及对第一无机部11和第二无机部12之间连接通道进行阻隔，防止第一无机部11和第二无机部12相互脱离，进一步地增强封装结构100的稳定性。第一有机层20有效满足封装结构100的纤薄要求，方便封装结构100应用于任何设备中。
进一步地，本发明还提供一种柔性显示屏200，柔性显示屏200包括封装结构100、柔性背板210和显示面板101。显示面板101层叠于柔性背板210上，显示面板101包括多个发光单元102和连接于相邻两个发光单元102之间的像素定义单元103，多个发光单元102阵列设置，封装结构100贴合于显示面板101上，第一无机部11贴合并覆盖发光单元102，第二无机部12贴合并覆盖像素定义单元103。
本实施方式中，柔性背板210为矩形板件。柔性背板210可以是薄膜晶体层(TFT)，柔性背板210内设置驱动电极，以驱动有机电致发光层(OLED)发光，即驱动显示面板101发光。柔性背板210可以任意弯曲，柔性背板210包括相对设置的第一外表面210a和第一内表面210b，第一内表面210b上固定显示面板102。柔性背板210的材质为聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯或聚酰亚胺树脂等材质。
本实施方式中，显示面板102为OLED(Organic Light-Emitting Diode，有机电致发光二极管)。具体的，发光单元102由RGB三原色子像素组成，像素定义单元103控制发光单元102内三原色子像素组合发光，从而发光单元102呈现出不同颜色。像素定义单元103不发光。在其他实施方式中，显示面板102还可以是液晶显示层(LCD)。
具体的，显示面板101还包括绝缘膜220、钝化层230、电极组件240和驱动组件250；绝缘膜220和钝化层202依次层叠于柔性背板210上；发光单元102和像素定义单元103均层叠于钝化层230上；电极组件240贴合于发光单元102，并电连接于像素定义单元103，以向发光单元102输入电信号；驱动组件250嵌设于绝缘膜220内，与像素定义单元103相对设置，并电连接电极组件240和像素定义单元103，用以驱动发光单元102发光。绝缘膜220为驱动组件250提供绝缘环境，使得驱动组件250接收电信号。驱动组件250接收驱动电信号，驱动电极组件240向发光单元102发出电压变化，从而驱动发光单元102发光。像素定义单元103接收扫描电信号，从而控制发光单元102内的不同RGB子像素发光，使得发光单元102呈现颜色变化。
更为具体的，电极组件240包括阳极241和阴极242，阳极241固定于发光单元102和钝化层230之间，与发光单元102相对设置，并电连接驱动组件250。阴极242固定于发光单元102和封装结构100之间，相对阳极241设置，并连接驱动组件250；驱动组件250包括有源导线251、栅极252、源极253和漏极254，有源导线251相对像素定义单元103设置，源极253电连接于有源导线251和阳极241之间，漏极254电连接于阴极242和有源导线251之间，栅极252与源极253和漏极254电连接。有源导线251接收电信号，经栅极252、源极253和漏极254控制阳极241和阴极242向发光单元102施加电压 变化。驱动组件250和像素定义单元103均接收电信号，容易产生较大热量，且像素定义单元103和驱动组件250均不发光，利用封装结构100的第二无机部12对应覆盖驱动组件250和像素定义单元103，一方面第二无机部12良好的导热性能可以对像素定义单元103和驱动组件250进行散热，另一方面第二无机部12避开发光单元102，保证封装结构100的良好透光性，从而柔性显示屏200使用寿命高，性能优异。
本发明还提供一种封装结构制作方法，下面将结合图3、图4和图5，对本发明实施例提供的封装结构制作方法进行详细介绍，需要说明的是，图3、图4和图5的封装结构制作方法，用于制备本发明图1～图2所示实施例的结构，为了便于说明，仅示出了与本发明实施例相关的部分，具体技术细节未揭示的，请参照本发明图1-图2所示的实施例。封装结构制作方法用于在显示面板101上制作封装结构100，包括：
S01：成型一层第一无机层10，第一无机层10具有阵列的多个第一无机部11和连接于相邻两个第一无机部11之间的第二无机部12，第一无机部11对应贴合于发光单元102，第二无机部12对应贴合于像素定义单元103。
本实施方式中，第一无机层10采用掩膜版蒸镀成型。具体包括：
S101：采用网格状的第一掩膜版310成型第一无机部11。
如图6和图8所示，第一掩膜版310包括呈“井”状的第一遮盖部311和设置于第一遮盖部311之间的第一镂空区312。将第一掩膜版310放置于显示面板101上，将第一遮盖部311对应遮盖像素定义单元103，第一镂空区312与发光单元102相对应，进而利用真空设备将第一无机部11沉积于第一镂空区312，从而使得第一无机部11对应覆盖发光单元102。
S102：采用条纹状的第二掩膜版320成型出横向的第一金属条纹121，第一金属条纹121设置于横向排列相邻两个第一无机部11之间。
如图7和图8所示，第二掩膜版320包括多个横向延伸的第二遮盖部321和设置于相邻两个第二遮盖部321之间的第二镂空区322，多个第二遮盖部312沿纵向并排设置，第二镂空区322为横向延伸的空槽。将第一掩膜版310从显示面板101上去掉，将第二遮盖部321对应遮盖横向排列的多个第一无机部11，第二镂空区322对应横向延伸的像素定义单元102。利用蒸镀设备将第一 金属条纹121蒸镀于横向延伸的像素定义单元102上。
S103：采用条纹状的第三掩膜版(未标示)成型出纵向的第二金属条纹122，第二金属条纹122设置于纵向排列相邻两个第一无机部11之间，第二金属条纹122和第一金属条纹121构成第二无机部12。
第三掩膜版与第二掩膜版320结构相同设置，不同的是第三掩膜版相对第二掩膜版320旋转90°。具体的，将第二掩膜版320旋转90°后，将第二遮盖部321对应遮盖纵向排列的第一无机部11。第二镂空区322对应纵向延伸的第二无机部12，从而利用蒸镀设备在纵向延伸的第二无机部12上蒸镀出第二金属条纹122。从而第二金属条纹122和第一金属条纹121共同构成第二无机部12。
S02：在第一无机层11上成型一层第一有机层20，第一有机层采用有机材料制成，第一有机层20完全覆盖第一无机层10。
第一有机层20采用真空蒸镀或喷墨印刷成型，具体包括：
S201：在第一无机层10上喷墨印刷或真空蒸镀一层前驱物(未标示)。
前驱物可以是第一有机层20的原材料，将前驱物铺设于第一无机层10上方便经物理加工或化学加工成型出第一有机层20。
S202：对前驱物进行光固化或热固化，以成型出第一有机层20。
前驱物为光敏材料或热敏材料，从而第一有机层20与第一无机层10稳固结合。
S03：在第一有机层20背离第一无机层10一侧成型出第二无机层30，第二无机层30具有多个阵列的第三无机部31和连接于相邻两个第三无机部31之间的第四无机部32，第三无机部31与第一无机部11相对应。第二无机层30具体成型工艺与第一无机层10具体成型工艺可以相同设置，在此不再赘述，不同的是，第二无机层30的厚度小于第一无机层10的厚度。
S04：在第二无机层30背离第一有机层20一侧成型出第二有机层40，第二有机层40完全覆盖第二无机层30。第二有机层40与第一有机层20相同设置，在此不再赘述。
本实施方式中，重复步骤S04和步骤S05多次，最终多层第二无机层30和多层第二有机层40交替层叠。
S05：在第二有机层40背离第二无机层30一侧成型保护层50，保护层50完全覆盖第一无机层10。
本发明的封装结构、柔性显示屏和封装结构制作方法，通过在显示面板上层叠一层第一无机层，第一无机层包括非连续排布的第一无机部和连接于第一无机部之间的第二无机部，利用第二无机部和第一无机部相互间隔设置进而第一无机部和第二无机部相互阻止水氧吸收，防止水氧扩散，使得封装结构的阻氧阻水性能提高，即使得封装结构提升封装性能。
以上是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (13)

  1. 一种封装结构，用于封装贴合于显示面板上，其特征在于，所述封装结构包括第一无机层，所述第一无机层包括非连续排布于所述显示面板上的第一无机部和连接于所述第一无机部之间的第二无机部。
  2. 根据权利要求1所述的封装结构，其特征在于，所述第一无机部为非金属材质，所述第二无机部为金属材质。
  3. 根据权利要求1或2所述的封装结构，其特征在于，所述显示面板包括阵列设置的多个发光单元和连接于相邻两个发光单元之间的像素定义单元，所述第一无机部对应遮蔽所述发光单元，所述第二无机部对应遮蔽所述像素定义单元。
  4. 根据权利要求1所述的封装结构，其特征在于，所述显示面板为有机电致发光层或液晶显示发光层。
  5. 根据权利要求1所述的封装结构，其特征在于，所述封装结构还包括第一有机层，所述第一有机层贴合于所述第一无机层背离所述显示面板一侧，并完全覆盖所述第一无机层。
  6. 根据权利要求5所述的封装结构，其特征在于，所述封装结构还包括多层第二无机层和多层第二有机层，多层所述第二无机层和多层所述第二有机层交替层叠，位于外侧的所述第二无机层贴合于所述第一有机层背离所述第一无机层一侧，并完全覆盖所述第一无机层。
  7. 根据权利要求6所述的封装结构，其特征在于，所述封装结构还包括保护层，所述保护层贴合于外侧的所述第二有机层，所述保护层完全覆盖所述第一无机层。
  8. 一种柔性显示屏，其特征在于，所述柔性显示屏包括权利要求1～7任意一项所述的封装结构，所述柔性显示屏还包括显示面板，所述第一无机层贴合于所述显示面板上。
  9. 一种封装结构制作方法，其特征在于，所述封装结构制作方法包括：
    成型一层第一无机层，所述第一无机层具有非连续排布于显示面板上的第一无机部和连接于所述第一无机部之间的第二无机部。
  10. 根据权利要求9所述的封装结构制作方法，其特征在于，所述第一无机部为非金属材质，所述第二无机部为金属材质。
  11. 根据权利要求9所述的封装结构制作方法，其特征在于，所述封装结构制作方法还包括：在所述第一无机层上成型一层第一有机层，所述第一有机层完全覆盖所述第一无机层。
  12. 根据权利要求11所述的封装结构制作方法，其特征在于，所述封装结构制作方法还包括：
    在所述第一有机层背离所述第一无机层一侧交替成型出多层第二无机层和多层第二有机层，位于外侧的所述第二无机层贴合于所述第一有机层背离所述第一无机层一侧，并完全覆盖所述第一无机层。
  13. 根据权利要求12所述的封装结构制作方法，其特征在于，所述封装结构制作方法还包括：
    在位于外侧的所述第二有机层上成型保护层，所述保护层完全覆盖所述第一无机层。
PCT/CN2015/100162 2015-12-31 2015-12-31 封装结构、柔性显示屏及封装结构制作方法 Ceased WO2017113314A1 (zh)

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