WO2017198298A1

WO2017198298A1 - Apparatus and method for transport

Info

Publication number: WO2017198298A1
Application number: PCT/EP2016/061142
Authority: WO
Inventors: Tommaso Vercesi; Oliver Heimel; Dieter Haas; Stefan Bangert
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2016-05-18
Filing date: 2016-05-18
Publication date: 2017-11-23
Anticipated expiration: 2018-11-18
Also published as: TWI635192B; CN109154062B; TWI624000B; KR20180002778A; TW201742182A; JP6585191B2; JP2018527455A; CN109154062A; KR101965370B1; TW201807220A

Abstract

An apparatus for contactless transportation of a deposition source is provided. The apparatus includes a deposition source assembly. The deposition source assembly includes the deposition source. The deposition source assembly includes a first active magnetic unit. The apparatus includes a guiding structure extending in a source transportation direction. The deposition source assembly is movable along the guiding structure. The first active magnetic unit and the guiding structure are configured for providing a first magnetic levitation force for levitating the deposition source assembly.

Description

APPARATUS AND METHOD FOR TRANSPORT

FIELD [0001] Embodiments of the present disclosure relate to apparatuses and methods for transportation of carriers or substrates, more specifically carriers or substrates for layer deposition on large area substrates.

BACKGROUND [0002] Several methods are known for depositing a material on a substrate. As an example, substrates may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process. The process can be performed in a processing chamber of a deposition apparatus, where the substrate to be coated is located. A deposition material is provided in the processing chamber. A plurality of materials, such as small molecules, metals, oxides, nitrides, and carbides may be used for deposition on a substrate. Further, other processes like etching, structuring, annealing, or the like can be conducted in processing chambers.

[0003] For example, coating processes may be considered for large area substrates, e.g. in display manufacturing technology. Coated substrates can be used in several applications and in several technical fields. For instance, an application can be organic light emitting diode (OLED) panels. Further applications include insulating panels, microelectronics, such as semiconductor devices, substrates with thin film transistors (TFTs), color filters or the like. OLEDs are solid-state devices composed of thin films of (organic) molecules that create light with the application of electricity. As an example, OLED displays can provide bright displays on electronic devices and use reduced power compared to, for example, liquid crystal displays (LCDs). In the processing chamber, the organic molecules are generated (e.g., evaporated, sputtered, or sprayed etc.) and deposited as layer on the substrates. The particles can for example pass through a mask having a boundary or a specific pattern to deposit material at desired positions on the substrate, e.g. to form an OLED pattern on the substrate. [0004] An alignment of the substrate with respect to the mask and a quality of the processed substrate, in particular of the deposited layer, can be provided. As an example, the alignment should be accurate and steady in order to achieve good process results. Systems used for alignment of substrates and masks can be susceptible to external interferences, such as vibrations. Further, systems for alignment may increase the cost of ownership. [0005] In view of the above, there is a need for apparatuses, which can provide for an improved control of the transportation of carriers or substrates during the layer deposition process.

SUMMARY [0006] According to one embodiment, a method of contactless alignment of a carrier assembly is provided. The method includes levitating the carrier assembly in a vacuum chamber; moving the carrier assembly while levitating to positioning the carrier assembly relative to a predetermined position, particularly a mask or a mask carrier; and aligning the carrier assembly relative to the mask or the mask carrier in at least one direction selected from the group consisting of: the substrate transport direction, a first direction being vertical +- 15°, and a combination thereof.

[0007] According to another embodiment, a method of processing a substrate of a carrier assembly is provided, the method includes a method of contactless alignment of the carrier assembly, wherein the mask or the mask carrier is positioned in the vacuum chamber, and processing the substrate in the vacuum chamber. The method f contactless alignment of the carrier assembly includes levitating the carrier assembly in a vacuum chamber; moving the carrier assembly while levitating to positioning the carrier assembly relative to a predetermined position, particularly a mask or a mask carrier; and aligning the carrier assembly relative to the mask or the mask carrier in at least one direction selected from the group consisting of: the substrate transport direction, a first direction being vertical +- 15°, and a combination thereof.

[0008] According to another embodiment, an apparatus for contactless alignment of a carrier assembly and a mask or a mask carrier relative to each other in a vacuum chamber of a substrate processing system is provided. The apparatus includes a guiding structure having a plurality of active magnetic units within the vacuum chamber, wherein the guiding structure is configured to levitate the carrier assembly in the vacuum chamber; a drive structure having a plurality of further active magnetic units within the vacuum chamber, wherein the drive structure is configured to drive the carrier assembly along a transport direction without mechanical contact; two or more alignment actuators to contact the mask, the substrate, or the mask and the substrate within the vacuum chamber; and a controller connected to guiding structure, the drive structure and the two or more alignment actuators and configured to control the plurality of active magnetic units and the plurality of further active magnetic units to provide a pre-alignment with the guiding structure and the drive structure and to provide mechanical alignment with the two or more alignment actuators.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

FIG. 1A shows a schematic side view of an of an apparatus to transport a carrier assembly, for example a carrier having a substrate loaded thereon, in a substrate processing system according to embodiments of the present disclosure; FIG. IB shows a top view of an apparatus according to FIG. 1A;

FIG. 1C shows another side view of an apparatus according to FIG. 1A;

FIG. 2 shows an apparatus, for example a substrate processing system including an apparatus to transport a carrier assembly according to embodiments of the present disclosure; FIGS. 3 A and 3B show a schematic side views of transporting a carrier assembly, for example a carrier having a substrate loaded thereon, according to embodiments of the present disclosure;

FIGS. 4 A and 4B show a schematic side view to illustrate methods of aligning a substrate within a substrate processing system according to embodiments of the present disclosure;

FIG. 5 shows a schematic view of a mask or a mask arrangement, which can be utilized in combination with an apparatus to transport a carrier assembly or in a substrate processing system, according to embodiments of the present disclosure;

FIG. 6 shows a schematic view of a mask or a mask arrangement, which can be utilized in combination with an apparatus to transport a carrier assembly or in a substrate processing system, according to embodiments of the present disclosure;

FIG. 7 shows a schematic view of a holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber according to embodiments described herein; FIG. 8 shows a cross-sectional view of a holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber according to embodiments described herein;

FIG. 9 shows a schematic view of a holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber according to further embodiments described herein; and

FIG. 10 shows a flowchart for illustrating a method of aligning a carrier assembly and a mask relative to each other according to embodiments of the present disclosure. DETAILED DESCRIPTION OF EMBODIMENTS

[0010] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on, or in conjunction with, other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations. [0011 ] Embodiments described herein relate to contactless levitation, transportation and/or alignment of a carrier or a substrate. The disclosure refers to a carrier assembly, which may include one or more elements of the group consisting of: a carrier supporting a substrate, a carrier without a substrate, a substrate, or a substrate supported by a support. The term "contactless" as used throughout the present disclosure can be understood in the sense that a weight of e.g. the carrier and the substrate is not held by a mechanical contact or mechanical forces, but is held by a magnetic force. Specifically, the carrier assembly is held in a levitating or floating state using magnetic forces instead of mechanical forces. As an example, the apparatus described herein may have no mechanical means, such as a mechanical rail, supporting the weight of the deposition source assembly. In some implementations, there can be no mechanical contact between the carrier assembly and the rest of the apparatus at all during levitation, and for example movement, of the carrier assembly in the system.

[0012] According to embodiments of the present disclosure, levitating or levitation refers to a state of an object, wherein the objects floats without mechanical contact or support. Further, moving an object refers to providing a driving force, e.g. a force in a direction different than a levitation force, wherein the object is moved from one position to another, different position, for example a different lateral position. For example, an object such as a carrier assembly can be levitated, i.e. by a force counteracting gravity, and can be moved in a direction different then a direction parallel to gravity while being levitated. [0013] The contactless levitation, transportation and/or alignment of the carrier assembly according to embodiments described herein is beneficial in that no particles are generated due to a mechanical contact between the deposition source assembly and sections of the apparatus, such as mechanical rails, during the transport or alignment of the carrier assembly. Accordingly, embodiments described herein provide for an improved purity and uniformity of the layers deposited on the substrate, in particular since a particle generation is minimized when using the contactless levitation, transportation and/or alignment.

[0014] A further advantage, as compared to mechanical means for guiding the carrier assembly, is that embodiments described herein do not suffer from friction affecting the linearity and/or precision of the movement of the carrier assembly. The contactless transportation of the carrier assembly allows for a frictionless movement of the carrier assembly, wherein an alignment of the carrier assembly relative to a mask can be controlled and maintained with high precision. Yet further, the levitation allows for fast acceleration or deceleration of the carrier assembly speed and/or fine adjustment of the carrier assembly speed.

[0015] Further, the material of mechanical rails typically suffers from deformations, which may be caused by evacuation of a chamber, by temperature, usage, wear, or the like. Such deformations affect the position of the carrier assembly, and hence affect the quality of the deposited layers. In contrast, embodiments described herein allow for a compensation of potential deformations present in e.g. the guiding structure described herein. In view of the contactless manner in which the carrier assembly is levitated and transported, embodiments described herein allow for a contactless alignment of the carrier assembly. Accordingly, an improved and/or more efficient alignment of the substrate relative to the mask can be provided. [0016] According to embodiments, which can be combined with other embodiments described herein, the apparatus is configured for a contactless translation of the carrier assembly along a vertical direction, e.g. the y-direction, and/or along one or more transversal directions, e.g. the x-direction.

[0017] Embodiments described herein allow for a contactless rotation of the carrier assembly with respect to at least one rotation axis for angularly aligning the carrier assembly, e.g. relative to a mask. Rotation of the deposition source assembly with respect to a rotation axis may be provided within an angle range from 0.003 degrees to 3 degrees. Embodiments described herein allow for an additional mechanical rotation of the carrier assembly, i.e. with contact, with respect to at least one rotation axis for angularly aligning the carrier assembly, e.g. relative to a mask. Mechanical rotation of the deposition source assembly with respect to a rotation axis may be provided within an angle range from 0.0001 degrees to 3 degrees.

[0018] In the present disclosure, the terminology of "substantially parallel" directions may include directions, which make a small angle of up to 10 degrees with each other, or even up to 15 degrees. Further, the terminology of "substantially perpendicular" directions may include directions which make an angle of less than 90 degrees with each other, e.g. at least 80 degrees or at least 75 degrees. Similar considerations apply to the notions of substantially parallel or perpendicular axes, planes, areas or the like.

[0019] Some embodiments described herein involve the notion of a "vertical direction". A vertical direction is considered a direction substantially parallel to the direction along which the force of gravity extends. A vertical direction may deviate from exact verticality (the latter being defined by the gravitational force) by an angle of, e.g., up to 15 degrees. For example, the y-direction described herein (indicated with "Y" in the figures) is a vertical direction. In particular, the y-direction shown in the figures defines the direction of gravity.

[0020] Embodiments described herein may further involve the notion of a "transversal direction". A transversal direction is to be understood to distinguish over a vertical direction. A transversal direction may be perpendicular or substantially perpendicular to the exact vertical direction defined by gravity. For example, the x-direction and the z-direction described herein (indicated with "X" and "Z" in the figures) are transversal directions.

[0021 ] The embodiments described herein can be utilized for coating large area substrates, e.g., for display manufacturing. The substrates or substrate receiving areas for which the apparatuses and methods described herein are provided can be large area substrates. For example, a large area substrate or carrier can be GEN 4.5, which corresponds to about 0.67 m² substrates (0.73x0.92m), GEN 5, which corresponds to about 1.4 m² substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m² substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7m² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m² substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.

[0022] The term "substrate" as used herein may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate. However, the present disclosure is not limited thereto and the term "substrate" may embrace flexible substrates such as a web or a foil. The term "substantially inflexible" is understood to distinguish over "flexible". Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.

[0023] A substrate may be made of any material suitable for material deposition. For instance, the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials, metal or any other material or combination of materials which can be coated by a deposition process.

[0024] As illustrated in FIG. 1A, according to an embodiment, an apparatus 100 for contactless transportation of a carrier assembly 110 and/or a substrate 120 is provided. The apparatus includes a carrier assembly 110. The carrier assembly 110 can include the substrate 120. The carrier assembly 110 includes a first passive magnetic unit 150. The apparatus includes a guiding structure 170 extending in a carrier assembly transportation direction. The guiding structure includes a plurality of active magnetic units 175. The carrier assembly 110 is movable along the guiding structure 170. The first passive magnetic unit 150, e.g. a bar of ferromagnetic material, and the plurality of active magnetic units of the guiding structure 170 are configured for providing a first magnetic levitation force for levitating the carrier assembly 110. The means for levitating as described herein are means for providing a contactless force to levitate e.g. a carrier assembly.

[0025] According to embodiments, which can be combined with other embodiments described herein, the apparatus 100 may be arranged in a processing chamber. The processing chamber may be a vacuum chamber or a vacuum deposition chamber. The term "vacuum", as used herein, can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. The apparatus 100 can include one or more vacuum pumps, such as turbo pumps and/or cryo-pumps, connected to the vacuum chamber for generation of the vacuum inside the vacuum chamber.

[0026] FIG. 1A shows a side view of the apparatus 100. The apparatus 100 includes a carrier assembly 110. Further, the apparatus includes a guiding structure 170. The apparatus may further include a drive structure 180. The drive structure includes a plurality of further active magnetic units. The carrier assembly can include a second passive magnetic unit 160, e.g. a bar of ferromagnetic material to interact with the further active magnetic units 185 of the drive structure 180. FIG. 1 a shows a side view of the X-Y-plane. FIG. IB shows a top view of the apparatus 100 of FIG. 1A. FIG. IB shows the X-Z-plane. From the top, the plurality of active magnetic units 175 are shown in FIG. IB. FIG. 1C shows another side view of the apparatus 100. FIG. 1C shows the set-Y-plane. In FIG. 1C, an active magnetic unit 175 of the plurality of active magnetic units is shown. The active magnetic unit 175 provides magnetic force interacting with a first passive magnetic unit 150 of the carrier assembly 110. For example, the first passive magnetic unit 150 can be a rod of a ferromagnetic material. A rod can be a portion of the carrier assembly 110 that is connected to a support structure 112. The rod or the first passive magnetic unit, respectively, may also be integrally formed with a support structure 112 for supporting the substrate 120. The carrier assembly 110 can further include a second passive magnetic unit 160, for example a further rod. The further rod can be connected to the carrier assembly 110. The rod or the second passive magnetic unit, respectively, may also be integrally formed with the support structure 112.

[0027] The terminology of a "passive" magnetic unit is used herein to distinguish from the notion of an "active" magnetic unit. A passive magnetic unit may refer to an element with magnetic properties, which are not subject to active control or adjustment, at least not during operation of the apparatus 100. For example, the magnetic properties of a passive magnetic unit, e.g. the rod or the further rod of the carrier assembly, are not subject to active control during movement of the carrier assembly through the deposition apparatus or processing apparatus in general. According to embodiments, which can be combined with other embodiments described herein, a controller of the apparatus 100 is not configured to control a passive magnetic unit of the deposition source assembly. A passive magnetic unit may be adapted for generating a magnetic field, e.g. a static magnetic field. A passive magnetic unit may not be configured for generating an adjustable magnetic field. A passive magnetic unit may be a magnetic material, such as a ferromagnetic material, a permanent magnet or may have permanent magnetic properties. [0028] As compared to a passive magnetic unit, an active magnetic unit offers more flexibility and precision in light of the adjustability and controllability of the magnetic field generated by the active magnetic unit. According to embodiments described herein, the magnetic field generated by an active magnetic unit may be controlled to provide for an alignment of the carrier assembly 110. For example, by controlling the adjustable magnetic field, a magnetic levitation force acting on the carrier assembly 110 may be controlled with high accuracy, thus allowing for a contactless alignment of the carrier assembly and, thus, a substrate, by the active magnetic unit.

[0029] According to embodiments described herein, the plurality of active magnetic units 175 provides for a magnetic force on the first passive magnetic unit 150 and, thus, the carrier assembly 110. The plurality of active magnetic units 175 levitate the carrier assembly 110. The further active magnetic units 185 drive the carrier within the processing system, for example along the X-direction, i.e. along a first direction that is substrate transport direction. Accordingly, the plurality of further active magnetic units 185 form the drive structure for moving the carrier assembly 110 while being levitated by the plurality of active magnetic units 175. The further active magnetic units 185 interact with the second passive magnetic unit 160 to provide a force along the substrate transport direction. For example, the second passive magnetic unit 160 can include a plurality of permanent magnets, which are arranged with an alternating polarity. The resulting magnetic fields of the second passive magnetic unit 160 can interact with the plurality of further active magnetic units 185 to move the carrier assembly 110 while being levitated.

[0030] In order to levitate the carrier assembly 110 with the plurality of active magnetic units 175 and/or to move the carrier assembly 110 with the plurality of further active magnetic units 185, the active magnetic units can be controlled to provide adjustable magnetic fields. The adjustable magnetic field may be a static or a dynamic magnetic field. According to embodiments, which can be combined with other embodiments described herein, an active magnetic unit is configured for generating a magnetic field for providing a magnetic levitation force extending along a vertical direction. According to other embodiments, which can be combined with further embodiments described herein, an active magnetic unit may be configured for providing a magnetic force extending along a transversal direction. An active magnetic unit, as described herein, may be or include an 5 element selected from the group consisting of: an electromagnetic device; a solenoid; a coil; a superconducting magnet; or any combination thereof.

[0031] FIG. 2 shows an apparatus 200 for processing a substrate in a vacuum chamber. The vacuum chamber 252 can for example have a chamber wall 253. The gate valve 262 can be provided in the chamber wall 253. The gate valve can be opened to load the carrier

10 assembly 110 into and out of the vacuum chamber 252. One or more guiding structures 170 are provided. The one or more guiding structures can include a plurality of active magnetic units 175. FIG. 2 shows an embodiment of an apparatus 200 having two gate valves 262 and two guiding structures 170. Accordingly, two carrier assemblies 110 can be loaded and unloaded from the vacuum chamber 252, for example, alternating or simultaneously.

15 Loading and unloading the carrier assemblies 110 alternatingly has the advantage, that a processing tool, for example a deposition source, can process a substrate of a carrier assembly while another substrate of another carrier assembly is unloaded or loaded, respectively. Accordingly, the throughput of the apparatus 200 can be increased.

[0032] As shown in FIG. 2, the apparatus 200 further includes a maintenance chamber 20 254, which may for example be a further vacuum chamber. The maintenance chamber 254 can be separated from the vacuum chamber 252 by a further gate valve 264. According to one embodiment, which can be combined with other embodiments described herein, the apparatus 200 can be a deposition apparatus. A deposition source assembly 270 can be moved along a track 272. The track 272 or a portion of the track 272 can extend into the 25 maintenance chamber 254 in order to move the deposition source assembly from the vacuum chamber 252 into the maintenance chamber 254. Moving the deposition source assembly 270 into the maintenance chamber has the advantage that the deposition source assembly can be maintained outside of the vacuum chamber 252. For example, after the further gate valve 264 has been closed, the maintenance chamber 254 can be vented to have maintenance 30 access to the deposition source assembly while the vacuum chamber 252 can stay evacuated.

According to some embodiments, a second deposition source assembly 270 can be in operation in the vacuum chamber 252 while the first deposition source assembly 270 can be maintained in the maintenance chamber 254. Additionally or alternatively, the reduced number of times at which the vacuum chamber 252 needs to be vented results in a cleaner environment in the vacuum chamber 252. [0033] According to some embodiments of the present disclosure, which can be combined with other embodiments described herein, the deposition source assembly 270 can include support 274. The support 274 can include drive units to move the deposition source assembly 270 along the track 272. The support 274 can further include magnetic units to levitate the deposition source assembly. One or more deposition sources can be included in the deposition source assembly. As exemplarily shown in FIG. 2, the support 274 supports three crucibles 276 for evaporating material to be deposited on the substrate. The evaporated material can be guided in vapor distribution elements or vapor distribution pipes 278. The vapor distribution elements or vapor distribution pipes can direct the evaporated material onto a substrate mounted on the carrier of the carrier assembly 110. [0034] FIG. 2 shows a deposition source assembly facing a substrate of the upper carrier assembly 110 of FIG. 2. The deposition source assembly can be moved along a substrate mounted on the carrier of the carrier assembly. For example, the deposition source assembly can include one or more line sources. A combination of providing a line source and a movement of the deposition source assembly allows for depositing material on a rectangular substrate, such as large area substrate for display manufacturing. According to further alternatives, distribution pipes of a deposition source assembly may include one or more point sources, which can be moved along a substrate surface.

[0035] Besides the translation of the deposition source assembly, the deposition source assembly may also rotate the deposition sources such that the deposition sources are directed towards a substrate of the lower carrier assembly 110 shown in FIG. 2. Accordingly, a carrier assembly 110 can be loaded out of and into the vacuum chamber 252 at a first position of the upper and lower position shown in FIG. 2 while the substrate of a carrier assembly on the corresponding other position of the upper and lower position shown in FIG. 2 can be processed. After processing of the corresponding other substrate, loading of a new substrate, for example on the carrier assembly 110, can be completed. After rotation of the one or more deposition sources of the deposition source assembly 270 a substrate, which has been loaded at the first position of the upper and lower position shown in FIG. 2 can be processed. Similarly, during processing (e.g. layer deposition) of a substrate in the first position, unloading and loading of another substrate in the other position can be conducted.

[0036] According to embodiments, the speed of the deposition source assembly along the source transportation direction may be controlled for controlling the deposition rate. The speed of the deposition source assembly can be adjusted in real-time under the control of a controller. The adjustment can be provided for compensating a deposition rate change. A speed profile may be defined. The speed profile may determine the speed of the deposition source assembly at different positions. The speed profile may be provided to or stored in the controller. The controller may control the drive system such that the speed of the deposition source assembly is in accordance with the speed profile. Accordingly, a real-time control and adjustment of the deposition rate can be provided, so that the layer uniformity can be further improved. A translational movement of the deposition source assembly along the source transportation direction, as considered according to embodiments described herein, allows for a high coating precision, in particular a high masking precision during the coating process, since the substrate and the mask can remain stationary during coating.

[0037] As shown in FIG. 2, a mask 212 can be provided between the deposition source assembly 270 and a substrate of a carrier assembly 110. FIG. 2 shows a first mask 212 in an upper position, i.e. in a position between the deposition source assembly and the upper carrier assembly 110 and a second mask 212 in the lower position, i.e. in a position between the deposition source assembly and the lower carrier assembly 110.

[0038] According to embodiments described herein and as described in more detail with respect to FIGS. 5 and 6, a mask can be an edge exclusion mask or can be a mask (a shadow mask for depositing a pattern on a substrate. According to embodiments described herein, the mask can be supported by a mask carrier. Accordingly, an alignment of, a levitation of, or a mechanical contact to a mask as referred to herein may also be provided with reference to the mask carrier. Embodiments of the present disclosure referred to moving levitated carrier assemblies in processing apparatus. Movement of levitated carrier assemblies allow for higher positioning precision as compared to movement of the carrier assemblies, which are mechanically supported, i.e. not supported without contact that is mechanical contact on e.g. substrate transport rollers. Particularly, levitated carrier assembly movement allows for a high position in substrate positioning in a transport direction and/or a vertical direction, for example the X-direction and the Y-direction of FIGS. 1 A to 1C. The positioning precision of carrier assemblies according to embodiments described herein allow for an improved alignment of a substrate supported by a carrier of a carrier assembly relative to the mask 212. The alignment can be improved to provide for the desired precision for some mask configurations or can be improved to allow for a reduced complexity of a separate alignment system for some other mask configurations.

[0039] The apparatuses and methods according to the present disclosure can be used for vertical substrate processing. Therein, the substrate is vertically oriented during processing of the substrate, i.e. the substrate is arranged parallel to a vertical direction as described herein, i.e. allowing possible deviations from exact verticality. A small deviation from exact verticality of the substrate orientation can be provided, for example, because a substrate support with such a deviation might result in a more stable substrate position or a reduced particle adherence on a substrate surface. An essentially vertical substrate may have a deviation of +- 15° or below from the vertical orientation. Accordingly, embodiments of the present disclosure can refer to a direction being vertical +-15°, wherein reference to a substrate orientation is made.

[0040] FIGS. 3 A and 3B show alternative embodiment of an apparatus to provide a substrate orientation being vertical, wherein a small deviation having an absolute value of 15° or smaller can be provided. According to embodiments of the present disclosure, the substrate 120 supported by the support 112 can be slightly inclined to face downwardly. This reduces particle adherence to the substrate surface during processing of the substrate. FIG. 3 A shows a carrier assembly having a first passive magnetic unit 150 and a second passive magnetic unit 160. A support 112 for supporting the substrate 120 can be provided between the first passive magnetic unit and the second passive magnetic unit. FIG. 3A further shows the guiding structure 170 and the drive structure 180. The carrier assembly is shown in FIG. 3A is inclined, i.e. has a slight deviation from the vertical orientation, by providing a further active magnetic unit 370 or a plurality of further active magnetic units 370 distributed along the length of the guiding structure 170, wherein the second passive magnetic unit 160 is attracted by the further active magnetic unit 370. Accordingly, the carrier assembly is provided in the levitated state, wherein the lower end of the carrier assembly is pulled sideward by the further active magnetic unit 370. Other elements for pulling the lower end of the carrier assembly sideward without mechanical contact can also be provided.

[0041] According to yet further embodiments, the deviation from the vertical orientation may also be provided by passive magnetic units, e.g. permanent magnets. For example, the carrier assembly may have a permanent magnet provided as the second passive magnetic unit 160 or in addition, e.g. adjacent to, the second passive magnetic unit 160. A further permanent magnet can be provided below the permanent magnet. The further permanent magnet and the permanent magnet can be provided with opposing polarity to attract each other. By the attracting force, the carrier assembly can be deflected from the vertical orientation. Further, the attracting force may provide a guiding along the transportation direction. According to yet further embodiments, which can be combined with other embodiments described herein, a yet further pair of permanent magnets may be provided to provide a guiding force at the upper side of the carrier. Accordingly, one permanent magnet of the second pair of permanent magnets can be provided in an upper region of the carrier assembly, and a corresponding permanent magnet of the second pair of permanent magnets may be provided adjacent in the region of the guiding structure. By attracting forces between the second pair of permanent magnets, a guiding along the transport direction can be provided. [0042] FIG. 3B shows another embodiment of the present disclosure having a first passive magnetic unit 150 and the second passive magnetic unit 160. In order to provide a substrate orientation of the substrate 120, which is inclined, i.e. which is slightly deviating from the vertical orientation (e.g. by an absolute value of 15° or below) the support 112 is shaped to provide a substrate inclination while the carrier assembly is vertical. [0043] According to embodiments of the present disclosure, the carrier assembly, e.g. a carrier assembly 110 is shown herein, can include one or more holding devices (not shown) configured for holding the substrate 120 at a plate or a frame. The one or more holding devices can include at least one of mechanical, electrostatic, electrodynamic (van der Waals), electromagnetic and/or magnetic means, such as mechanical and/or magnetic clamps. [0044] In some implementations, the carrier assembly includes, or is, an electrostatic chuck (E-chuck). The E-chuck can have a supporting surface, for example the support 112 shown in FIGS. 1C, 3A, and 3B, for supporting the substrate 120 thereon. In one embodiment, the E-chuck includes a dielectric body having electrodes embedded therein. The dielectric body can be fabricated from a dielectric material, preferably a high thermal conductivity dielectric material such as pyrolytic boron nitride, aluminum nitride, silicon nitride, alumina or an equivalent material. The electrodes may be coupled to a power source, which provides power to the electrode to control a chucking force. The chucking force is an electrostatic force acting on the substrate 120 to fix the substrate on the supporting surface of the support.

[0045] In some implementations, the carrier assembly 110 includes, or is, an electrodynamic chuck or Gecko chuck (G-chuck). The G-chuck can have a supporting surface for supporting the substrate thereon. The chucking force can be an electrodynamic force acting on the substrate to fix the substrate on the supporting surface. [0046] FIGS. 4 A and 4B show operational states of the apparatus 100 according to embodiments, which can be combined with other embodiments described herein. FIGS. 4A and 4B show a side view of the apparatus 100. As shown, the guiding structure 170 may extend along a transport direction of the carrier assembly, i.e. the X-direction in FIGS. 4A and 4B. The transport direction of the carrier assembly is a transversal direction as described herein. The guiding structure 170 may have a linear shape extending along the transport direction. The length of the guiding structure 170 along the source transportation direction may be from 1 to 30m.

[0047] In the embodiment illustrated in FIGS. 4A and 4B, the substrate 120 may be arranged substantially parallel to the drawing plane, e.g. with a deviation of +15°. The substrate may be provided in a substrate receiving area during the substrate processing, for example layer deposition process. The substrate receiving area has dimensions, e.g. a length and a width, which are the same or slightly (e.g. 5-20 %) larger as the corresponding dimensions of the substrate.

[0048] During operation of the apparatus 100, the carrier assembly 110 may be translatable along the guiding structure 170 in the transportation direction, e.g. the x-direction. FIGS. 4A and 4B show the carrier assembly 110 at different positions along the x-direction relative to the guiding structure 170. The horizontal arrow 485 indicates a driving force of the drive structure 180. As a result, a translation of the carrier assembly 110 from left to right along the guiding structure 170 is provided. The vertical arrows 475 indicate a levitation force acting on the carrier assembly.

[0049] The first passive magnetic unit 150 may have magnetic properties substantially along the length of first passive magnetic unit 150 in the transport direction. The magnetic field generated by the active magnetic units 175' interacts with the magnetic properties of the first passive magnetic unit 150 to provide for a first magnetic levitation force and a second magnetic levitation force. Accordingly, a contactless levitation, transportation and alignment of the carrier assembly 110 may be provided.

[0050] As shown in FIG. 4A, the carrier assembly 110 is provided at a first position. According to embodiments of the present disclosure, two or more active magnetic units 175', for example two or three active magnetic units 175', are activated by the controller 440 to generate a magnetic field for levitating the carrier assembly 110. According to embodiments of the present disclosure, the carrier assembly hangs below the guiding structure 170 without mechanical contact.

[0051] In FIG. 4A, two active magnetic units 175' provide a magnetic force, which is indicated by arrows 475. The magnetic forces contact the gravity force in order to levitate the carrier assembly. The controller 440 controls the two active magnetic units 175', in particular for individually controls the two active magnetic units, to maintain the carrier assembly in a levitating state. Further, one or more further active magnetic units 185' are controlled by the controller 440. The further active magnetic units interact with the second passive magnetic unit 160, for example a set of alternating permanent magnets, to generate a driving force indicated by arrow 485. The driving force moves the substrate, for example the substrate supported by the support of the carrier assembly, along the transport direction. As shown in FIG. 4A, the transport direction can be the X-direction. According to some embodiments of the present disclosure, which can be combined with other embodiments described herein, the number of further active magnetic units 185 ', which are simultaneously controlled to provide the driving force, is 1 to 3. According to other embodiments, the control of the further active magnetic units 185 ' may also be provided by a second controller different from the controller 440 controlling the active magnetic units 175'.

[0052] The movement of the carrier assembly moves the substrate along the transport direction, for example the X-direction. Accordingly, at a first position, the substrate is positioned below the first group of active magnetic units 175' and at a further, different position, the substrate is positioned below the further, different group of active magnetic units 175'. The controller 440 controls which active magnetic units 175' provides a levitation force for a respective position and controls the respective active magnetic units to levitate the carrier assembly. For example, the levitating force can be provided by subsequent active magnetic units 175' while the substrate is moving. According to embodiments described herein, the carrier assembly is handed over from one set of active magnetic units to another set of active magnetic unit.

[0053] FIG. 4B shows the carrier assembly in a second position. The position shown in FIG. 4B corresponds to a processing position, in which the substrate is processed. In the processing position, the carrier assembly can be moved to a desired position. The substrate is aligned relative to the mask with the contactless transport system described in the present disclosure.

[0054] In the second position, as exemplarily shown in FIG. 4B, two active magnetic units 175' provide a first magnetic force indicated by arrow 494 and a second magnetic force indicated by arrow 496. The controller 440 controls the two active magnetic units 175 'to provide for an alignment in a vertical direction, for example the Y-direction in FIG. 4B. Further, additionally or alternatively, the controller 440 controls the two active magnetic units 175' to provide for an alignment, wherein the carrier assembly is rotated in the X-Y- plane. Both alignment movements can exemplarily be seen in FIG. 4B by comparing the position of the dotted carrier assembly 410 and the position of the carrier assembly 110 drawn with solid lines.

[0055] The controller may be configured for controlling the active magnetic units 175' for translationally aligning the carrier assembly in a vertical direction. By controlling the active magnetic units, the carrier assembly 110 may be positioned into a target vertical position. The carrier assembly 110 may be maintained in the target vertical position under the control of the controller 440. According to embodiments, which can be combined with other embodiments described herein, the controller is configured for controlling the active magnetic units 175' for angularly aligning the deposition source with respect to a first rotation axis, e.g. a rotational axis perpendicular to a main substrate surface, e.g. a rotational axis extending in a Z-direction in the present disclosure.

[0056] According to embodiments of the present disclosure, an alignment of the carrier assembly, particularly a contactless alignment, in a vertical direction (Y-direction) can be provided with an alignment range from 0.1 mm to 3 mm. Further, an alignment precision, particularly a contactless alignment precision, in the vertical direction can be 50 μιη or below, for example 1 μιη to 10 μιη, such as 5 μιη. According to embodiments of the present disclosure, a rotational alignment precision, particularly a contactless alignment precision, can be 3° or below.

[0057] According to embodiments of the present disclosure, one or more further active magnetic units 185' can provide a driving force as indicated by arrow 498. The controller controls the one or more further active magnetic units 185' to provide for an alignment in transport direction, for example the X-direction in FIG. 4B. According to embodiments of the present disclosure, an alignment of the carrier assembly in a transport direction (X- direction) can be provided with an alignment range extending along the length of the guiding structure. Further, an alignment precision, particularly a contactless alignment precision, in the transport direction can be 50 μιη or below, for example 5 μιη or 30 μιη.

[0058] FIG. 5 shows one embodiment of mask alignment, which can be combined with other embodiments of the present disclosure. The mask 512 shown in FIG. 5 is an edge exclusion mask. The edge exclusion mask covers a portion of the edge of the substrate 120 by providing an edge 514 of the mask 512. For example, the width 516 of the portion of the substrate 120 can be 10 mm or below, for example 5 mm or below. An open area (or opening 518) is provided by the edge 514, i.e. is surrounded by the edge 514. The partition wall may optionally provided in the middle of the edge exclusion mask 512, such that there are two or more openings 518 surrounded by corresponding edges. Yet, the openings are not configured to define pattern features. The openings are configured to define areas of the substrate. For example, the area of the opening 518 shown in FIG. 5 is at least 80% of the area of the substrate. For embodiments having two or more openings, each opening as an area of at least 0.1% of the substrate area.

[0059] FIG. 5 shows a carrier assembly 110 having the substrate 120 supported thereon. The carrier assembly 110 and, thus, the substrate 120, can be aligned relative to the mask 512, and thus the edges 514 of the mask. The alignment of the carrier assembly and the mask is according to embodiments of the present disclosure is conducted by control of the active magnetic units, for example active magnetic units 175' of the guiding structure 170 and/or further active magnetic units 185' of the driving structure 180. According to some embodiments, particularly for masks being an edge exclusion mask, the alignment precision utilizing alignment by active magnetic units can be sufficient for the desired precision of processing the substrate. Accordingly, according to some embodiments of the present disclosure, which can be combined with other embodiments described herein, the alignment of the substrate and the mask relative to each other is provided by active magnetic units of a substrate transportation system, which levitates the substrate, e.g. a substrate transportation system without mechanical contact.

[0060] For example, display manufacturing, such as manufacturing of OLED displays, may include metallization processes, in which the conductive layer is provided over large areas on the substrate, for example areas corresponding to one or more openings 518 in FIG. 5. Metallization process can be conducted utilizing an edge exclusion mask 512. The alignment of the substrate and the mask relative to each other can be provided by active magnetic units of the guiding structure and/or active magnetic unit of the drive structure. The precision of the alignment with the active magnetic units, e.g. a precision of 50 μιη or below can be sufficient for the metallization process.

[0061] FIG. 6 shows a further embodiment of a mask alignment. FIG. 6 shows a shadow mask 612 including a plurality of small openings 614. For example, the area of the openings, i.e. the area of one feature of a pattern to be generated, can be 0.01% or below of the substrate area. FIG. 6 shows a carrier assembly 110 having the substrate 120 supported thereon. The pre-alignment can be conducted by control of active magnetic elements, for example active magnetic elements 175' of the guiding structure 170 and/or further active magnetic units 185 ' of the driving structure 180. According to some embodiments of the present disclosure, which can be combined with other embodiments described herein, a pre-alignment of the substrate and the mask relative to each other is provided by active magnetic elements of a substrate transportation system, which levitates the substrate, e.g. a substrate transportation system without mechanical contact. The pre-alignment can have a precision of 50 μιη or below. The precision of the pre-alignment allows for utilizing alignment actuators 630, for example piezoelectric actuators, such as piezoelectric alignment actuators, which reduce the complexity of an alignment unit or alignment system. According to some embodiments of the present disclosure, an alignment unit or alignment system can include two or more, for example four alignment actuators. The alignment actuators can have a reduced complexity as compared to common alignment actuators, which would be utilized without the above- mentioned precision of the pre-alignment. In light of the above, the alignment with active magnetic elements of the substrate transportation system according to embodiments of the present disclosure can reduce the cost of ownership of a processing system. The alignment unit or alignment system with reduced complexity are described with respect to FIGS. 7 to 9 below. [0062] FIGS. 7 and 8 show schematic views of a holding arrangement 700 for supporting a substrate carrier 111 of a carrier assembly 110 and a mask carrier 740 during layer deposition in a processing chamber according to embodiments described herein. FIG. 8 shows a cross-sectional view of the holding arrangement 700 for supporting the substrate carrier 111 and the mask carrier 740 during layer deposition in a processing chamber according to embodiments described herein. FIG. 9 shows a schematic view of a holding arrangement having four alignment actuators.

[0063] Alignment systems used on vertical-operated tools can work from outside of a processing chamber, i.e., from the atmospheric side. The alignment system can be connected to a substrate carrier and a mask carrier with stiff arms, e.g., extending through a wall of the processing chamber. A mechanical path between mask carrier or mask and substrate carrier or substrate is long, making the system susceptible to external interference (vibrations, heating, etc.) and tolerances.

[0064] In some embodiments, the present disclosure provides a holding arrangement with two or more alignment actuators, which provide a short connection path between the mask carrier and the substrate carrier. The holding arrangement according to the embodiments described herein is less susceptible to external interference, and a quality of the deposited layers can be improved.

[0065] The holding arrangement 700 includes two or more alignment actuators connectable to at least one of the substrate carrier 111 and the mask carrier 740, wherein the holding arrangement 700 is configured to support the substrate carrier 111 in, or parallel to, a first plane, wherein a first alignment actuator 710 of the two or more alignment actuators is configured to move the carrier assembly and the mask carrier 740 relative to each other at least in a first direction Y, wherein a second alignment actuator 720 of the two or more alignment actuators is configured to move the carrier assembly and the mask carrier 740 relative to each other at least in the first direction Y and a second direction X different from the first direction Y, and wherein the first direction Y and the second direction X are in the first plane. The two or more alignment actuators can also be referred to as "alignment blocks".

[0066] According to some embodiments described herein, which can be combined with other embodiments described herein, a mask 725 can be attached to the mask carrier 740. In some embodiments, the holding arrangement 700 is configured for supporting at least one of the substrate carrier 111 and the mask carrier 740 in a substantially vertical orientation, in particular during layer deposition.

[0067] By moving the carrier assembly and the mask carrier 740 relative to each other at least in the first direction Y and the second direction Y using the two or more alignment actuators, the substrate 120 can be aligned with respect to the mask carrier 740 or mask 725, and the quality of the deposited layers can be improved.

[0068] The two or more alignment actuators can be connectable to at least one of the carrier assembly and the mask carrier 140. As an example, the two or more alignment actuators are connectable to the carrier assembly or substrate carrier 111, wherein the two or more alignment actuators are configured to move the substrate carrier 130 relative to the mask carrier 140. The mask carrier 140 can be in a fixed or stationary position. In other examples, the two or more alignment actuators are connectable to the mask carrier 140, wherein the two or more alignment actuators are configured to move the mask carrier 140 relative to the substrate carrier 11. The substrate carrier 111 can be in a fixed or stationary position. [0069] In the holding arrangement of FIG. 9, the two or more alignment actuators include at least one of a third alignment actuator 930 and a fourth alignment actuator 940. According to some embodiments, which can be combined with other embodiments described herein, the two or more alignment actuators are configured to move or align the carrier assembly or substrate carrier 111 or mask carrier 140 in, or parallel to, a first plane (e.g., in x-direction and y-direction), and are configured to adjust or change an angular position of the substrate carrier 130 or mask carrier 140 in, or parallel to, a first plane.

[0070] In some implementations, at least one alignment actuator of the two or more alignment actuators is configured to move the substrate 120 and the mask carrier 140 relative to each other in a third direction Z, in particular wherein the third direction is substantially perpendicular to the first plane and/or a substrate surface 711. As an example, the first alignment actuator 710 and the second alignment actuator 720 are configured to move the substrate carrier 111 or mask carrier 140 in the third direction Z. In some implementations, a distance between the substrate 120 and the mask 725 can be adjusted by moving the carrier assembly or the substrate carrier 111 or the mask carrier 140 in the third direction Z. As an example, the distance between the substrate 120, or substrate carrier 111, and the mask 725 can be adjusted to be substantially constant in an area of a substrate surface 711 configured for layer deposition thereon. According to some embodiments, the distance can be less than 1 mm, specifically less than 500 micrometers, and more specifically less than 50 micrometers.

[0071 ] According to some embodiments, which can be combined with other embodiments described herein, the first alignment actuator 710 is floating with respect to the second direction X. The term "floating" may be understood as the first alignment actuator 710 allowing a movement of the substrate carrier 130 in the second direction X, e.g., driven by the second alignment actuator 720.

[0072] The substrate carrier 111 can have a first edge portion 732 and a second edge portion 734. The first edge portion and the second edge portion can be located on opposing sides of the substrate carrier 111. A substrate area of the substrate carrier, in which the substrate 120 can be positioned, can be provided between the first edge portion 732 and the second edge portion 734. As an example, the first edge portion 732 can be an upper edge portion or top edge portion of the substrate carrier. The second edge portion 734 can be a lower edge portion or bottom edge portion of the substrate carrier.

[0073] According to some embodiments, which can be combined with other embodiments described herein, the first alignment actuator 710 and the second alignment actuator 720 are provided at the first edge portion 732 or the second edge portion 734. In some implementations, the first alignment actuator 710 and the second alignment actuator 720 can be provided in corners or corner regions of the substrate carrier 111 , for example, in corners or corner regions of the first edge portion 732 or the second edge portion 734.

[0074] According to some embodiments, which can be combined with other embodiments described herein, the two or more alignment actuators can be electric or pneumatic actuators. The two or more alignment actuators can for example be linear alignment actuators. In some implementations, the two or more alignment actuators can include at least one actuator selected from the group consisting of: a stepper actuator, a brushless actuator, a DC (direct current) actuator, a voice coil actuator, and a piezoelectric actuator. The term "actuator" can refer to motors, e.g., stepper motors. The two or more alignment actuators can be configured to move or position carrier assembly or the substrate carrier 111, correspondingly the substrate, with a precision of less than about plus/minus 1 micrometer. As an example, the two or more alignment actuators can be configured to move or position the substrate carrier 111 with a precision of about plus/minus 0.5 micrometer, and specifically about 0.1 micrometer, in at least one of the first direction Y, the second direction X, and the third direction Z.

[0075] In some implementations, moving of the substrate in at least one of the first direction, the second direction and the third direction can by performed by simultaneously or sequentially driving the two or more alignment actuators. [0076] FIG. 10 shows a flowchart illustrating a method of contactless alignment of a carrier assembly according to embodiments of the present disclosure. As shown in block 902, the carrier assembly is levitated. For example, active magnetic units 175' are activated and/or controlled by the controller 440 two provide a magnetic force counteracting the gravity force. The magnetic force serves for levitating the carrier assembly. Block 904 shows moving the carrier assembly for positioning the carrier assembly relative to a mask. According to embodiments described herein, the moving or movement of the carrier assembly is conducted while the carrier assembly is levitated. Block 906 shows aligning the carrier assembly relative to the mask. Accordingly, the movement of the carrier assembly is controlled to provide for positioning with a sufficient precision, i.e. an alignment, of the carrier assembly relative to the mask.

[0077] According to some embodiments of the present disclosure, optionally, the carrier assembly and/or the mask may be mechanically contacted, for example with alignment actuator, to provide a further mechanical alignment. In such a case, the alignment shown in block 906 can be considered a pre-alignment. [0078] According to embodiments of the present disclosure, the transportation system or holding apparatus for a carrier assembly is configured for providing an alignment or, at least, a pre-alignment. Methods described herein provide a movement of the carrier assembly without mechanical contact, e.g. while being levitated, wherein a contactless transportation system allows for sufficient precision to align the substrate, for example a substrate supported by a carrier and/or being a portion of a carrier assembly, and a mask relative to each other. For example, the precision can be 100 μιη below such as 50 μιη or below.

[0079] The present disclosure have several advantages including avoiding separate alignment actuators for some applications or at least reducing the complexity of alignment actuators for many applications. An improved and/or more efficient alignment of the substrate relative to the mask can be provided. Accordingly, costs of ownership of processing systems can be reduced. Further, some embodiments of the present disclosure allow for an increased throughput. Further advantages include inter alia a reduce particle generation in processing systems, for example deposition systems for large area substrates, such as utilized for OLED display manufacturing. For example, an improved purity and uniformity of the layers deposited on the substrate may be provided.

[0080] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A method of contactless alignment of a carrier assembly, comprising:

levitating the carrier assembly in a vacuum chamber;

moving the carrier assembly while levitating to positioning the carrier assembly relative to a predetermined position, particularly a mask or a mask carrier; and

aligning the carrier assembly relative to the mask or the mask carrier in at least one direction selected from the group consisting of: a substrate transport direction, a first direction being vertical +- 15°, and a combination thereof.

2. The method according to claim 1, further comprising:

guiding the carrier assembly along the substrate transport direction, wherein the guiding is conducted while levitating and moving.

3. The method according to any of claims 1 to 2, wherein the carrier assembly is without mechanical contact during aligning.

4. The method according to any of claims 1 to 3, wherein the aligning is provided with a precision of 50 μιη or below.

5. The method according to any of claims 1 to 4, further comprising:

further aligning the carrier assembly relative to the mask or the mask carrier by rotating the carrier assembly in a plane provided by the substrate transport direction and the first direction.

6. The method according claim 5, wherein the further aligning is provided with a precision of 3° or below.

7. The method according to any of claims 1 to 6, further comprising: contacting the mask or the mask carrier, the carrier assembly, or the mask or the mask carrier and the carrier assembly with two or more alignment actuators to provide a mechanical alignment.

8. The method according to claim 7, wherein the mechanical alignment is provided with a precision of 5 μιη or below.

9. A method of processing a substrate of a carrier assembly, comprising:

the method of contactless alignment of the carrier assembly according to any of claims 1 to 7, wherein the mask or the mask carrier is positioned in the vacuum chamber; and

processing the substrate in the vacuum chamber.

10. The method according to claim 9, further comprising:

opening a gate valve of the vacuum chamber and moving the carrier assembly out of the vacuum chamber while levitating the carrier assembly.

11. The method according to any of claims 9 to 10, wherein processing the substrate in the vacuum chamber includes depositing a layer on the substrate.

12. The method according to claim 11, wherein the depositing includes moving a deposition source assembly along the substrate.

13. An apparatus (100) for contactless alignment of a carrier assembly and a mask or a mask carrier relative to each other in a vacuum chamber of a substrate processing system, comprising:

a guiding structure (170) having a plurality of active magnetic units (175) within the vacuum chamber, wherein the guiding structure is configured to levitate the carrier assembly in the vacuum chamber;

a drive structure (180) having a plurality of further active magnetic units within the vacuum chamber, wherein the drive structure is configured to drive the carrier assembly along a transport direction without mechanical contact; two or more alignment actuators to contact the mask or the mask carrier, the carrier assembly, or the mask or the mask carrier and the carrier assembly within the vacuum chamber; and

a controller connected to guiding structure, the drive structure and the two or more 5 alignment actuators and configured to control the plurality of active magnetic units and the plurality of further active magnetic units to provide a pre-alignment with the guiding structure and the drive structure and to provide mechanical alignment with the two or more alignment actuators.

10 14. The apparatus according to claim 13, wherein the two or more alignment actuators are piezoelectric actuators.

15. The apparatus according to claim 14, further comprising:

at least one further piezoelectric actuator.

15