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WO2017175614A1 - Composition de résine ainsi que procédé de fabrication de celle-ci, pré-imprégné, feuille de résine, plaque stratifiée, plaque stratifiée recouverte d'une feuille métallique, et carte de circuit imprimé - Google Patents

Composition de résine ainsi que procédé de fabrication de celle-ci, pré-imprégné, feuille de résine, plaque stratifiée, plaque stratifiée recouverte d'une feuille métallique, et carte de circuit imprimé Download PDF

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Publication number
WO2017175614A1
WO2017175614A1 PCT/JP2017/012309 JP2017012309W WO2017175614A1 WO 2017175614 A1 WO2017175614 A1 WO 2017175614A1 JP 2017012309 W JP2017012309 W JP 2017012309W WO 2017175614 A1 WO2017175614 A1 WO 2017175614A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
group
mass
resin
reaction product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/012309
Other languages
English (en)
Japanese (ja)
Inventor
孝史 久保
展義 大西
与一 高野
環 伊藤
英祐 志賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP2018510544A priority Critical patent/JP7305349B2/ja
Priority to CN201780017274.3A priority patent/CN108779247B/zh
Priority to KR1020187022415A priority patent/KR102376567B1/ko
Publication of WO2017175614A1 publication Critical patent/WO2017175614A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
    • C08G79/08—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule a linkage containing boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/08—Anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/42—Polyamides containing atoms other than carbon, hydrogen, oxygen, and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/046—Reinforcing macromolecular compounds with loose or coherent fibrous material with synthetic macromolecular fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/175—Amines; Quaternary ammonium compounds containing COOH-groups; Esters or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
    • C08K5/28—Azides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Definitions

  • the present invention relates to a resin composition and a production method thereof, a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board.
  • One of the measures is to reduce the thermal expansion of the insulating layer used for the printed wiring board. This is a technique for suppressing warpage by bringing the thermal expansion coefficient of a printed wiring board close to the thermal expansion coefficient of a semiconductor element, and is currently being actively worked on (see, for example, Patent Documents 1 to 3).
  • methods for suppressing the warpage of the semiconductor plastic package include increasing the rigidity of the laminated board (higher rigidity) and increasing the glass transition temperature of the laminated board (high Tg). (For example, see Patent Documents 4 and 5).
  • JP 2013-216884 A Japanese Patent No. 3173332 JP 2009-035728 A JP 2013-001807 A JP2011-177892A
  • the resin composition is generated by reacting, for example, an amino-modified silicone and a thermosetting component as a low elastic component.
  • An amino-modified polymer can be included.
  • amino-modified polymers generally have the property of further polymerizing reaction between polymers or with other resin components. For this reason, it may be impossible to obtain excellent storage stability due to the fact that the amino-modified polymer further undergoes a polymerization reaction during storage or molding of the resin composition or prepreg.
  • the present invention has been made to solve the above-mentioned problems, and an object thereof is to provide a resin composition having excellent storage stability while containing an amino-modified polymer.
  • the present invention is as follows. [1] Amino-modified silicone (A); A maleimide compound (B); A reaction product (P) obtained by reacting at least one of carboxylic acid (C) and carboxylic acid anhydride (D), Resin composition. [2] The amine value of the resin composition is 2.0 mgKOH / g or less, The resin composition according to [1]. [3] The reaction product (P) is obtained by reacting at least the carboxylic acid anhydride (D), The carboxylic anhydride (D) is one or more selected from the group consisting of maleic anhydride, phthalic anhydride, succinic anhydride, and acetic anhydride. The resin composition according to [1] or [2].
  • the reaction product (P) is obtained by reacting at least the carboxylic acid (C), The resin composition according to any one of [1] to [3], wherein the carboxylic acid (C) is one or more selected from the group consisting of maleic acid, phthalic acid, succinic acid, and acetic acid. . [5] Further comprising a thermosetting component (E), [1] The resin composition according to any one of [4]. [6]
  • the thermosetting component (E) is one or more selected from the group consisting of a maleimide compound (B), an epoxy resin (F), a cyanate ester compound (G), and an alkenyl-substituted nadiimide (H).
  • the amino-modified silicone (A) in the reaction product (P) includes a compound represented by the following general formula (1).
  • a plurality of R a s each independently represent a hydrogen atom, a methyl group or a phenyl group, a plurality of R b s each independently represent a single bond, an alkylene group or an aryl group, and n is Represents an integer of 1 or more.
  • the amino group equivalent of the amino-modified silicone (A) in the reaction product (P) is from 130 to 6000, The resin composition according to any one of [1] to [7].
  • the maleimide compound (B) includes bis (4-maleimidophenyl) methane, 2,2-bis ⁇ 4- (4-maleimidophenoxy) -phenyl ⁇ propane, bis (3-ethyl-5-methyl-4-maleimidophenyl) ) Including one or more selected from the group consisting of methane, polytetramethylene oxide-bis (4-maleimidobenzoate), and a compound represented by the following general formula (2), [1] The resin composition according to any one of [8].
  • a plurality of R 5 each independently represents a hydrogen atom or a methyl group, and n 1 represents an integer of 1 or more.
  • the filler (J) includes one or more selected from the group consisting of silica, alumina, and aluminum nitride.
  • the resin composition includes 50 parts by mass or more and 300 parts by mass or less of the filler (J) with respect to 100 parts by mass of the total amount of the reaction product (P) and the thermosetting component (E). The resin composition as described in [10] or [11].
  • the substrate is one or more selected from the group consisting of E glass cloth, T glass cloth, S glass cloth, Q glass cloth, and organic fibers.
  • the support is a resin sheet or a metal foil, The resin sheet according to [15].
  • the present embodiment a mode for carrying out the present invention (hereinafter referred to as “the present embodiment”) will be described in detail.
  • the following embodiments are examples for explaining the present invention, and are not intended to limit the present invention to the following contents.
  • the present invention can be appropriately modified within the scope of the gist.
  • the resin composition of this embodiment is a reaction product obtained by reacting amino-modified silicone (A), maleimide compound (B), and at least one of carboxylic acid (C) or carboxylic acid anhydride (D).
  • Product (P) (prepolymer).
  • the reaction product (P) is a kind of the above-described amino-modified polymer.
  • the resin composition of the present embodiment has excellent storage stability.
  • This factor is inferred as follows (however, the factor is not limited to this).
  • a conventional resin composition containing an amino-modified silicone and a thermosetting component has a structure in which an amino group, which is a reactive group of a raw material amino-modified silicone, is a prepolymer structure in an amino-modified polymer contained in the resin composition. A relatively large amount thereof remains, and the amino group further reacts with the thermosetting component, so that the resin composition (including varnish) and a molded body obtained from the resin composition (for example, prepreg and In the molded body), excellent storage stability cannot be obtained.
  • the resin composition when the resin composition is stored at room temperature, due to the further progress of the reaction between the remaining amino groups and the thermosetting component, the resin composition has increased viscosity and molecular weight. Excellent storage stability cannot be obtained. Further, in the case of varnish, gelation occurs, and in the case of prepreg, moldability deteriorates due to an increase in prepreg viscosity, and excellent storage stability cannot be obtained.
  • the amino group remaining after the reaction between the amino-modified silicone (A) and the maleimide compound (B) reacts with the carboxylic acid (C) and / or the carboxylic acid anhydride (D).
  • the reaction product (P) excellent storage stability is obtained in the resin composition and a molded product obtained from the resin composition.
  • the amine value of the resin composition is an amine value as a total amount of primary amine and secondary amine.
  • the amine value is not particularly limited, but is preferably 2.0 mgKOH / g or less, more preferably 1.0 mgKOH / g or less, and further preferably 0.5 mgKOH / g or less.
  • the amine value is 2.0 mgKOH / g or less, an increase in viscosity of the resin composition, an increase in molecular weight, gelation of varnish, and an increase in prepreg viscosity tend to be suppressed.
  • the lower limit of the amine value is preferably 0 mgKOH / g.
  • the amine value is measured by a method according to JIS K 7237: 1995.
  • reaction product (P) The reaction product (P) of this embodiment is obtained by reacting an amino-modified silicone (A), a maleimide compound (B), and at least one of a carboxylic acid (C) or a carboxylic acid anhydride (D). It is done.
  • reaction product (P) one type may be used alone, or two or more types may be mixed and used.
  • the weight average molecular weight (Mw) of the reaction product (P) is not particularly limited, but is preferably 5000 or more and 20000 or less, more preferably 10,000 or more and 15000 or less.
  • Mw weight average molecular weight
  • the coefficient of thermal expansion of the prepreg tends to decrease
  • the weight average molecular weight is 20000 or less
  • the viscosity of the resin composition increases, the molecular weight increases, and the varnish gelates. There is a tendency that an increase in the prepreg viscosity can be suppressed.
  • reaction conditions such as temperature may be controlled.
  • the weight average molecular weight can be determined as a value measured by a gel permeation chromatography (GPC) method and converted using a standard polystyrene calibration curve. Specifically, it is measured by the method described in Examples described later.
  • the content of the reaction product (P) is not particularly limited, but when combined with the thermosetting component (E), the reaction product (P) in the resin composition.
  • the total amount of the thermosetting component (E) (100% by mass; as a solid content not including the solvent / solvent component and filler (J)), preferably 10% by mass to 80% by mass, More preferably, they are 15 mass% or more and 70 mass% or less, and are 20 mass% or more and 60 mass% or less.
  • the amino-modified silicone (A) used in the present embodiment is not particularly limited as long as it is a silicone having one or more amino groups in the molecule, but includes a compound represented by the following general formula (1). It is preferable.
  • a plurality of R a each independently represents a hydrogen atom, a methyl group or a phenyl group, and among them, a methyl group is preferable.
  • Rb represents a single bond, an alkylene group, or an aryl group each independently, and an alkylene group is preferable especially.
  • the number of carbon atoms of the alkylene group is preferably 1 to 4 in the main chain.
  • the specific alkylene group is not particularly limited, but is preferably a methylene group, an ethylene group, a trimethylene group, or a tetramethylene group, and more preferably a trimethylene group.
  • n represents an integer of 1 or more.
  • the amino-modified silicone (A) may be used alone or in combination of two or more.
  • the amino group equivalent of the amino-modified silicone (A) is not particularly limited, but is preferably 130 or more and 6000 or less, more preferably 500 or more and 3000 or less, and further preferably 600 or more and 2500 or less. When the amino group equivalent of the amino-modified silicone (A) is within the above range, a printed wiring board having excellent metal foil peel strength and desmear resistance can be obtained.
  • the amino group equivalent is measured by a method based on JIS K 7237: 1995.
  • the content of the amino-modified silicone (A) is not particularly limited, but the total amount of the reaction product (P) in the resin composition (100% by mass; solvent / solvent component, filler) (J) is preferably 5.0% by mass or more and 70% by mass or less, more preferably 10% by mass or more and 50% by mass or less, and further preferably 15% by mass or more. It is 45 mass% or less.
  • the content of the amino-modified silicone (A) is such that when the reaction product (P) and the thermosetting component (E) are combined, the amino-modified silicone (A) used to produce the reaction product (P).
  • the solid content not including solvent / solvent component is preferably 1.0% by mass or more and 70% by mass or less, more preferably 3.0% by mass or more and 40% by mass or less, and still more preferably. It is 5.0 mass% or more and 20 mass% or less.
  • the content of the amino-modified silicone (A) is within the above range, a printed wiring board that is excellent in metal foil peel strength and desmear resistance can be obtained.
  • the content of the amino modified silicone (A) referred to here is as a thermosetting component (E) described later. Amino-modified silicone (A) is also included.
  • the maleimide compound (B) used in the present embodiment is not particularly limited as long as it is a compound having one or more maleimide groups in the molecule. Specific examples thereof include, for example, N-phenylmaleimide, N-hydroxyphenylmaleimide, bis (4-maleimidophenyl) methane, 2,2-bis ⁇ 4- (4-maleimidophenoxy) -phenyl ⁇ propane, bis (3 , 5-dimethyl-4-maleimidophenyl) methane, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, bis (3,5-diethyl-4-maleimidophenyl) methane, polytetramethylene oxide-bis (4-maleimidobenzoate), maleimide compounds represented by the following general formula (2), prepolymers of these maleimide compounds, and prepolymers of maleimide compounds and amine compounds. These can be used alone or in admixture of two
  • maleimide compound (B) includes bis (4-maleimidophenyl) methane, 2,2-bis ⁇ 4- (4-maleimidophenoxy) -phenyl ⁇ propane, bis (3-ethyl-5-methyl-4-).
  • it contains one or more selected from the group consisting of maleimide phenyl) methane, polytetramethylene oxide-bis (4-maleimidobenzoate), and a maleimide compound represented by the following general formula (2).
  • 2-bis ⁇ 4- (4-maleimidophenoxy) -phenyl ⁇ propane is more preferable.
  • a plurality of R 5 are each independently a hydrogen atom or a methyl group, n 1 represents an integer of 1 or more.
  • R ⁇ 5 > shows a hydrogen atom or a methyl group each independently, and it is preferable to show a hydrogen atom especially.
  • n 1 represents an integer of 1 or more.
  • the upper limit value of n 1 is preferably 10, more preferably 7.
  • a maleimide compound (B) may be used individually by 1 type, and 2 or more types may be mixed and used for it.
  • the content ratio of the maleimide compound (B) to the amino-modified silicone (A) is not particularly limited, but is preferably 1.0 or more and 3.0 or less on a mass basis. More preferably, it is 1.0 or more and 2.5 or less, More preferably, it is 1.0 or more and 2.0 or less. When the content ratio is in the above range, the reaction product (P) productivity tends to be superior.
  • the content of the maleimide compound (B) is not particularly limited, but the total amount of the reaction product (P) in the resin composition (100% by mass; solvent / solvent component, filler ( J) is preferably 10% by mass or more and 90% by mass or less, more preferably 30% by mass or more and 80% by mass or less, and further preferably 45% by mass or more and 75% by mass with respect to the solid content not including J). It is as follows.
  • the content of the maleimide compound (B) is such that when the reaction product (P) and the thermosetting component (E) are combined, the maleimide compound (B) used for producing the reaction product (P) and As the total amount of maleimide compound (B) contained as thermosetting component (E), the total amount of reaction product (P) and thermosetting component (E) (100% by mass; solvent / solvent component, filler ( J) is preferably 10% by mass or more and 90% by mass or less, more preferably 20% by mass or more and 80% by mass or less, and further preferably 30% by mass or more and 70% by mass with respect to the solid content not including J). It is as follows.
  • the content of the maleimide compound (B) is within the above range, a printed wiring board excellent in moldability, thermal elastic modulus, desmear resistance, and chemical resistance tends to be obtained.
  • the content of the maleimide compound (B) referred to here includes a maleimide compound (B) as a thermosetting component (E) described later. ) Is also included.
  • the carboxylic acid (C) used in the present embodiment is not particularly limited, but is preferably one or more selected from the group consisting of maleic acid, phthalic acid, succinic acid, acetic acid, and propionic acid. More preferably, one or more selected from the group consisting of acid, phthalic acid, succinic acid, and acetic acid, and one or more selected from the group consisting of maleic acid, phthalic acid, and succinic acid More preferably.
  • carboxylic acid anhydride (D) used in the present embodiment is not particularly limited, but one or two selected from the group consisting of maleic anhydride, phthalic anhydride, succinic anhydride, acetic anhydride, and propionic anhydride. It is preferably at least one species, more preferably one or more selected from the group consisting of maleic anhydride, phthalic anhydride, succinic anhydride, and acetic anhydride, maleic anhydride, phthalic anhydride, And more preferably one or more selected from the group consisting of succinic anhydride.
  • Carboxylic acid (C) and carboxylic acid anhydride (D) are monovalent carboxylic acid and monovalent carboxylic acid anhydride, or divalent carboxylic acid and divalent carboxylic acid anhydride, respectively. It is preferable that it is a divalent carboxylic acid and a divalent carboxylic anhydride.
  • Carboxylic acid (C) and carboxylic acid anhydride (D) are a monovalent carboxylic acid and a monovalent carboxylic acid anhydride by being a divalent carboxylic acid and a divalent carboxylic acid anhydride, respectively. Compared to the case, the storage stability of the resin composition is excellent, and a decrease in insulation reliability when a printed wiring board is obtained tends to be suppressed.
  • this factor is not particularly limited, when a divalent carboxylic acid or a divalent carboxylic acid anhydride is used, compared with the case where a monovalent carboxylic acid and a monovalent carboxylic acid anhydride are used.
  • the amino group of the amino-modified silicone (A) reacts with the carboxyl group of the divalent carboxylic acid or divalent carboxylic anhydride, the carboxyl group paired with the reacted carboxyl group is a free carboxylic acid. It is inferred that it is difficult to remain in the resin composition.
  • the carboxylic acid (C) and the carboxylic acid anhydride (D) may be used alone or in combination of two or more.
  • the carboxylic acid (C) and the carboxylic acid anhydride (D) may be used alone or in combination.
  • the content ratio of the carboxylic acid (C) and the carboxylic anhydride (D) to the amino-modified silicone (A) is not particularly limited, but is preferably 0.00 on the mass basis. It is 01 or more and 0.4 or less, More preferably, it is 0.01 or more and 0.2 or less, More preferably, it is 0.02 or more and 0.1 or less. When the content ratio is within the above range, the storage stability of the reaction product (P) tends to be more excellent.
  • the content of the carboxylic acid (C) and the carboxylic acid anhydride (D) is not particularly limited, but the total amount of the reaction product (P) (100% by mass; solvent / solvent component, Preferably, it is 0.5% by mass or more and 20% by mass or less, more preferably 0.5% by mass or more and 10% by mass or less, and still more preferably with respect to the solid content not including the filler (J). It is 1.0 mass% or more and 5.0 mass% or less. Further, the content of the carboxylic acid (C) and the carboxylic acid anhydride (D) is determined when the reaction product (P) and the thermosetting component (E) are combined.
  • it is 0.05 mass% or more and 10 mass% or less with respect to the total amount (100 mass%; as a solid content amount which does not contain a solvent and a solvent component and a filler (J)) of the sex component (E).
  • they are 0.1 mass% or more and 5.0 mass% or less, More preferably, they are 0.2 mass% or more and 2.0 mass% or less.
  • thermosetting component (E) It is preferable that the resin composition of this embodiment further contains a thermosetting component (E).
  • thermosetting component (E) used in the present embodiment is not particularly limited as long as it is a component that is cured by heat. Although it does not specifically limit as a thermosetting component (E), For example, in addition to the amino modified silicone (A) mentioned above and a maleimide compound (B), the epoxy resin (F) mentioned later and a cyanate ester compound (G) And alkenyl-substituted nadiimide (H). That is, the amino-modified silicone (A) and maleimide compound (B) used as the thermosetting component (E) can be the same as the amino-modified silicone (A) and maleimide compound (B) described above. .
  • thermosetting component (E) is one or two selected from the group consisting of a maleimide compound (B), an epoxy resin (F), a cyanate ester compound (G), and an alkenyl-substituted nadiimide (H). It is preferable to include the above, and it is more preferable to include a maleimide compound (B).
  • the content of the thermosetting component (E) is not particularly limited, but when the reaction product (P) and the thermosetting component (E) are combined, the reaction product ( It is preferably 20% by mass or more and 85% by mass or less with respect to the total amount of P) and the thermosetting component (E) (100% by mass; solid content not including solvent / solvent component and filler (J)). Yes, more preferably 30% by mass to 85% by mass, and still more preferably 40% by mass to 80% by mass.
  • the content of the thermosetting component (E) is within the above range, it tends to be a printed wiring board that is excellent in moldability even when filled with a filler, and has excellent thermal modulus, desmear resistance, and chemical resistance. It is in.
  • Epoxy resin (F) By including the epoxy resin (F), the resin composition of the present embodiment tends to be more excellent in adhesiveness, moisture absorption heat resistance, flexibility, and the like.
  • the epoxy resin (F) is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule.
  • Specific examples thereof include, for example, bisphenol A type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol A novolac type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, Cresol novolak type epoxy resin, xylene novolak type epoxy resin, polyfunctional phenol type epoxy resin, naphthalene type epoxy resin, naphthalene skeleton modified novolak type epoxy resin, naphthylene ether type epoxy resin, phenol aralkyl type epoxy resin, anthracene type epoxy resin, Trifunctional phenolic epoxy resin, tetrafunctional phenolic epoxy resin, triglycidyl isocyanurate, glycidyl ester epoxy resin, alicyclic Poxy resin, dicyclopentadiene novolak type epoxy resin, biphenyl novolak type epoxy resin, phenol aralkyl novolak type epoxy resin, naphthol aralkyl novolak type epoxy resin
  • the epoxy resin (F) is preferably at least one selected from the group consisting of biphenyl aralkyl type epoxy resins, naphthylene ether type epoxy resins, polyfunctional phenol type epoxy resins, and naphthalene type epoxy resins.
  • the flame retardancy and heat resistance of the resulting cured product tend to be further improved.
  • the epoxy resin (F) may be used alone or in combination of two or more.
  • the content of the epoxy resin (F) is not particularly limited, but the total amount of the reaction product (P) and the thermosetting component (E) (100% by mass; solvent / solvent component)
  • the solid content does not include the filler (J), preferably 1.0% by mass or more and 20% by mass or less, more preferably 1.0% by mass or more and 15% by mass or less, and still more preferably. Is 2.0 mass% or more and 10 mass% or less.
  • the content of the epoxy resin (F) is within the above range, it tends to be more excellent in adhesiveness and flexibility.
  • cyanate ester compound (G) Although it does not specifically limit as cyanate ester compound (G) used for this embodiment, for example, the naphthol aralkyl type
  • the naphthol aralkyl cyanate ester compound represented by the following general formula (3), the novolak cyanate ester and the biphenyl aralkyl cyanate ester represented by the following general formula (4) are excellent in flame retardancy,
  • a naphthol aralkyl cyanate compound represented by the following general formula (3) and a novolac cyan represented by the following general formula (4) are preferable because of high curability and a low thermal expansion coefficient of the cured product.
  • One or more selected from the group consisting of acid esters are more preferred.
  • a plurality of R 6 are each independently a hydrogen atom or a methyl group, n 2 represents an integer of 1 or more.
  • R ⁇ 6 > shows a hydrogen atom or a methyl group each independently, and it is preferable to show a hydrogen atom especially.
  • n 2 represents an integer of 1 or more.
  • the upper limit value of n 2 is preferably 10, more preferably 6.
  • each of the plurality of R 7 independently represents a hydrogen atom or a methyl group
  • each of the plurality of R 8 independently represents a hydrogen atom or an alkyl group or alkenyl group having 1 to 4 carbon atoms
  • n 3 represents an integer of 1 or more.
  • R ⁇ 7 > shows a hydrogen atom or a methyl group each independently, and it is preferable to show a hydrogen atom especially.
  • a plurality of R 8 each independently represents a hydrogen atom or an alkyl group or alkenyl group having 1 to 4 carbon atoms.
  • n 3 represents an integer of 1 or more.
  • the upper limit value of n 3 is preferably 10, more preferably 7.
  • cyanate ester compounds are not particularly limited, and any existing method as a cyanate ester synthesis method may be used. Specifically, it can be obtained by reacting a naphthol aralkyl type phenol resin represented by the following general formula (5) with cyanogen halide in an inert organic solvent in the presence of a basic compound. Alternatively, a similar naphthol aralkyl type phenol resin and a salt of a basic compound may be formed in a solution containing water, and then a two-phase interface reaction with cyanogen halide may be performed for synthesis. it can.
  • a plurality of R 6 are each independently a hydrogen atom or a methyl group, n 4 represents an integer of 1 or more.
  • R ⁇ 6 > shows a hydrogen atom or a methyl group each independently, and a hydrogen atom is preferable especially.
  • n 4 represents an integer of 1 or more.
  • upper limit of n 4 is preferably 10, more preferably 6.
  • the naphthol aralkyl cyanate ester compounds include naphthols such as ⁇ -naphthol and ⁇ -naphthol, p-xylylene glycol, ⁇ , ⁇ '-dimethoxy-p-xylene, 1,4-di (2-hydroxy- It can be selected from those obtained by condensing naphthol aralkyl resin obtained by reaction with 2-propyl) benzene and cyanic acid.
  • cyanate ester compound (G) one kind may be used alone, or two or more kinds may be mixed and used.
  • the content of the cyanate ester compound (G) is not particularly limited, but the total amount of the reaction product (P) and the thermosetting component (E) (100% by mass; solvent ⁇ Preferably, it is 0.005% by mass or more and 5.0% by mass or less, and more preferably 0.005% by mass or more and 3.0% by mass with respect to the solid content not including the solvent component and filler (J). It is below, More preferably, they are 0.1 mass% or more and 1.0 mass% or less.
  • the content of the cyanate ester compound (G) is within the above range, a printed wiring board excellent in moldability, thermal elastic modulus, desmear resistance, and chemical resistance tends to be obtained.
  • alkenyl-substituted nadiimide (H) is not particularly limited as long as it is a compound having one or more alkenyl-substituted nadiimide groups in the molecule. Specific examples thereof include compounds represented by the following general formula (6).
  • R 1 s each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
  • R 2 represents an alkylene group having 1 to 6 carbon atoms, a phenylene group, a biphenylene group, or a naphthylene.
  • R 3 represents a substituent represented by a methylene group, an isopropylidene group, CO, O, S, or SO 2 .
  • a plurality of R 4 each independently represents an alkylene group having 1 to 4 carbon atoms or a cycloalkylene group having 5 to 8 carbon atoms.
  • alkenyl substituted nadiimide (F) represented by Formula (6) examples include, but are not limited to, compounds represented by the following formula (9) (BANI-M (manufactured by Maruzen Petrochemical Co., Ltd.)) and compounds represented by the following formula (10). (BANI-X (manufactured by Maruzen Petrochemical Co., Ltd.)).
  • Alkenyl-substituted nadiimide (H) may be used alone or in combination of two or more.
  • the content of the alkenyl-substituted nadiimide (H) is not particularly limited, but the total amount (100% by mass; solvent / solvent) of the reaction product (P) and the thermosetting component (E) Preferably, it is 5.0% by mass or more and 90% by mass or less, more preferably 10% by mass or more and 60% by mass or less, and still more preferably. It is 20 mass% or more and 40 mass% or less.
  • the content of the alkenyl-substituted nadiimide (H) is within the above range, a printed wiring board excellent in moldability, thermal elastic modulus, desmear resistance, and chemical resistance tends to be obtained.
  • the above-described epoxy resin (F), cyanate ester compound (G), and alkenyl-substituted nadiimide (H) may be used as raw materials for the reaction product (P).
  • thermosetting component (E) may be used individually by 1 type, and 2 or more types may be mixed and used for it.
  • thermoplastic resin By appropriately using a thermoplastic resin, properties such as metal adhesion and stress relaxation can be imparted.
  • the resin composition of this embodiment further contains a filler (J).
  • the filler (J) is not particularly limited as long as it has insulating properties. Examples thereof include silicas such as natural silica, fused silica, amorphous silica, and hollow silica; alumina, aluminum nitride, boron nitride, boehmite, and oxidation.
  • Molybdenum titanium oxide, zinc borate, zinc stannate, clay, kaolin, talc, calcined clay, calcined kaolin, calcined talc, mica, short glass fibers (glass fine powders such as E glass and D glass), hollow glass, And inorganic fillers such as spherical glass, and organic fillers such as silicone rubber and silicone composite powder. These can be used alone or in combination of two or more.
  • the filler (J) preferably contains one or more selected from the group consisting of silica from the viewpoint of low thermal expansion, alumina and aluminum nitride from the viewpoint of high thermal conductivity.
  • the content of the filler (J) in the resin composition of the present embodiment is not particularly limited, but the reaction product (P) and heat in the case where the reaction product (P) and the thermosetting component (E) are combined.
  • the total amount of the curable component (E) 100 parts by mass; as a solid content not including the solvent / solvent component and filler (J)) or the reaction product (P) when only the reaction product (P) is used.
  • silane coupling agent, wetting and dispersing agent In the resin composition of the present embodiment, a silane coupling agent and / or a wet dispersing agent can be used in combination in order to improve the dispersibility of the fine particles of the filler and the adhesive strength between the resin and the fine particles or the glass cloth. is there.
  • These silane coupling agents are not particularly limited as long as they are silane coupling agents generally used for inorganic surface treatment.
  • aminosilanes such as ⁇ -aminopropyltriethoxysilane and N- ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxysilane
  • epoxysilanes such as ⁇ -glycidoxypropyltrimethoxysilane
  • Acrylic silanes such as ⁇ -acryloxypropyltrimethoxysilane
  • cationic silanes such as N- ⁇ - (N-vinylbenzylaminoethyl) - ⁇ -aminopropyltrimethoxysilane hydrochloride
  • phenylaryls such as styrylsilane
  • Silane-based silane coupling agents can be mentioned, and one or two or more can be used in appropriate combination.
  • the wetting and dispersing agent is not particularly limited as long as it is a dispersion stabilizer used for coatings. Specific examples include wetting and dispersing agents such as DISPER-BYK110, 111, 118, 180, 161, BYK-W996, W9010, and W903 manufactured by Big Chemie Japan Co., Ltd.
  • a curing accelerator in the resin composition of this embodiment, can be used in combination as long as the desired properties are not impaired.
  • the curing accelerator is not particularly limited, and examples thereof include organic peroxides exemplified by benzoyl peroxide, lauroyl peroxide, acetyl peroxide, parachlorobenzoyl peroxide, di-tert-butyl-di-perphthalate, and the like.
  • An azo compound such as azobisnitrile; N, N-dimethylbenzylamine, N, N-dimethylaniline, N, N-dimethyltoluidine, 2-N-ethylanilinoethanol, tri-n-butylamine, pyridine, quinoline, Tertiary amines such as N-methylmorpholine, triethanolamine, triethylenediamine, tetramethylbutanediamine, N-methylpiperidine; phenols such as phenol, xylenol, cresol, resorcin, catechol; lead naphthenate, lead stearate , Naphth Organic metal salts such as zinc oxide, zinc octylate, tin oleate, dibutyltin malate, manganese naphthenate, cobalt naphthenate and acetylacetone iron; these organic metal salts are dissolved in hydroxyl group-containing compounds such as phenol and bisphenol Inorganic metal salt
  • the resin composition of the present embodiment may contain a solvent as necessary.
  • a solvent for example, when an organic solvent is used, the viscosity at the time of preparing the resin composition is lowered, the handling property is improved, and the impregnation property to the glass cloth is enhanced.
  • the kind of solvent will not be specifically limited if it can melt
  • a solvent can be used 1 type or in combination of 2 or more types.
  • various polymer compounds such as other thermosetting resins, thermoplastic resins and oligomers thereof, elastomers, etc., as long as the desired characteristics are not impaired
  • These compounds can be used in combination with additives. These are not particularly limited as long as they are generally used.
  • nitrogen-containing compounds such as melamine and benzoguanamine, and oxazine ring-containing compounds are exemplified.
  • Additives include UV absorbers, antioxidants, photopolymerization initiators, fluorescent brighteners, photosensitizers, dyes, pigments, thickeners, lubricants, antifoaming agents, surface conditioners, brighteners, polymerization Inhibitors and the like can be used in appropriate combinations as desired.
  • the method for producing the resin composition of the present embodiment is obtained by reacting amino-modified silicone (A), maleimide compound (B), and at least one of carboxylic acid (C) or carboxylic anhydride (D).
  • the obtained reaction product (P) can be obtained as a resin composition as it is.
  • the resin composition can be obtained by mixing the obtained reaction product (P) and the thermosetting component (B).
  • other optional components may be mixed as necessary.
  • the manufacturing method of the resin composition of this embodiment is not specifically limited,
  • the first reaction step (hereinafter, referred to as “primary polymer”) is obtained by reacting amino-modified silicone (A) with maleimide compound (B).
  • first reaction step a second reaction step (hereinafter simply referred to as “second reaction step”) in which the primary polymer is reacted with at least one of carboxylic acid (C) and carboxylic acid anhydride (D). It is preferable from the viewpoint of obtaining better storage stability of the reaction product (P).
  • the reaction temperature in the first reaction step is not particularly limited as long as the reaction between the amino-modified silicone (A) and the maleimide compound (B) proceeds, but is preferably 50 ° C. to 200 ° C., preferably 100 ° C. to More preferably, the temperature is 150 ° C.
  • the viscosity of the primary polymer obtained by the first reaction step used in the second reaction step is preferably 100 to 500 mPa ⁇ s from the viewpoint of obtaining better storage stability of the reaction product (P). 150 mPa ⁇ s to 400 mPa ⁇ s is more preferable.
  • the measuring method of the viscosity of a primary polymer is not specifically limited, It can measure using a general viscometer. For example, it can be measured using a cone plate viscometer (for example, ICI viscometer).
  • the reaction temperature in the second reaction step is not particularly limited, but is preferably 50 ° C to 200 ° C, and more preferably 100 ° C to 150 ° C.
  • the reaction time is not particularly limited, but is preferably 0.5 hours to 5 hours, more preferably 1.5 hours to 3.5 hours.
  • the amino-modified silicone (A), the maleimide compound (B), and at least one of the carboxylic acid (C) and the carboxylic acid anhydride (D) are reacted simultaneously. You may let them. That is, you may perform a 1st reaction process and a 2nd reaction process simultaneously.
  • the amino-modified silicone (A), the maleimide compound (B), at least one of the carboxylic acid (C) and the carboxylic acid anhydride (D), and the primary polymer have these handling properties.
  • the type of the solvent is not particularly limited, and examples thereof include ketones such as acetone, methyl ethyl ketone, and methyl cellosolve; aromatic hydrocarbons such as toluene and xylene; amides such as dimethylformamide; propylene glycol monomethyl ether and acetate thereof. Can be mentioned.
  • a solvent can be used 1 type or in combination of 2 or more types.
  • known processes for uniformly dissolving or dispersing each component can be performed.
  • the dispersibility with respect to the resin composition is enhanced by performing the stirring and dispersing treatment using a stirring tank provided with a stirrer having an appropriate stirring ability.
  • the above stirring, mixing, and kneading treatment can be appropriately performed using, for example, a known device such as a ball mill or a bead mill for mixing, or a revolving or rotating mixing device.
  • the prepreg of this embodiment has a base material and the resin composition of this embodiment impregnated or applied to the base material.
  • the manufacturing method of a prepreg can be performed according to a conventional method, and is not specifically limited. For example, after impregnating or coating the above-mentioned resin composition on a base material, it is semi-cured (B stage) by heating in a dryer at 100 to 200 ° C. for 1 to 30 minutes. The method of obtaining is mentioned.
  • the content of the resin composition (including fillers and additive components) with respect to the total amount (100% by mass) of the prepreg is not particularly limited, but is 30% by mass to 90% by mass. A range is preferable.
  • the substrate used in the prepreg of the present embodiment is not particularly limited, and known materials used for various printed wiring board materials are appropriately selected and used depending on the intended use and performance. be able to. Specific examples thereof are not particularly limited.
  • glass fibers such as E glass, D glass, S glass, Q glass, spherical glass, NE glass, and T glass
  • inorganic fibers other than glass such as quartz
  • polyparaphenylene Totally aromatic polyamides such as terephthalamide (Kevlar (registered trademark), manufactured by DuPont), copolyparaphenylene 3,4'oxydiphenylene terephthalamide (Technola (registered trademark), manufactured by Teijin Techno Products); 2, Polyesters such as 6-hydroxynaphthoic acid and parahydroxybenzoic acid (Vectran (registered trademark), manufactured by Kuraray Co., Ltd.); organic fibers such as polyparaphenylene benzoxazole (Zylon (registered trademark), manufactured by Toyobo Co.,
  • one or more selected from the group consisting of E glass cloth, T glass cloth, S glass cloth, Q glass cloth, and organic fibers is preferable.
  • a shape of a base material For example, a woven fabric, a nonwoven fabric, roving, a chopped strand mat, and a surfacing mat are mentioned.
  • the weaving method of the woven fabric is not particularly limited, and for example, plain weave, Nanako weave, and twill weave are known, and these can be appropriately selected and used depending on the intended use and performance. Moreover, the thing which spread-processed these, and the glass woven fabric surface-treated with the silane coupling agent etc. are used suitably.
  • the thickness and mass of the base material are not particularly limited, but usually about 0.01 to 0.3 mm is preferably used.
  • the base material is preferably a glass woven fabric having a thickness of 200 ⁇ m or less and a mass of 250 g / m 2 or less, and a glass woven fabric made of glass fibers such as E glass, S glass, and T glass. Is more preferable.
  • the laminate of this embodiment can be obtained by, for example, stacking and curing a plurality of the above-described prepregs.
  • the metal foil tension laminated board of this embodiment can be obtained by laminating
  • the metal foil-clad laminate of the present embodiment can be obtained, for example, by laminating at least one or more of the prepregs described above, and arranging and molding the metal foil on one or both sides thereof. More specifically, by laminating one or more of the above prepregs, and optionally placing a metal foil such as copper or aluminum on one or both sides of the prepreg, this is laminated and formed as necessary.
  • a metal foil-clad laminate can be produced.
  • the metal foil used here will not be specifically limited if it is used for printed wiring board material, Well-known copper foils, such as a rolled copper foil and an electrolytic copper foil, are preferable.
  • the thickness of the metal foil is not particularly limited, but is preferably 1.0 ⁇ m or more and 70 ⁇ m or less, and more preferably 1.5 ⁇ m or more and 35 ⁇ m or less.
  • a multi-stage press, a multi-stage vacuum press, a continuous molding machine, an autoclave molding machine, etc. can be used at the time of forming a metal foil-clad laminate.
  • the temperature is generally 100 to 300 ° C.
  • the pressure is a surface pressure of 2.0 to 100 kgf / cm 2
  • the heating time is generally 0.05 to 5 hours.
  • post-curing can be performed at a temperature of 150 to 300 ° C., if necessary.
  • a multilayer board can be formed by laminating and combining the above-described prepreg and a separately prepared wiring board for an inner layer.
  • the metal foil-clad laminate of this embodiment can be suitably used as a printed wiring board by forming a predetermined wiring pattern.
  • the metal foil-clad laminate of this embodiment has a low coefficient of thermal expansion, good formability, metal foil peel strength, and chemical resistance (particularly desmear resistance), and a semiconductor that requires such performance. It can be used particularly effectively as a printed wiring board for a package.
  • the present embodiment in addition to the above-described prepreg form, it may be in the form of an embedded sheet in which the above resin composition is applied to a metal foil or film.
  • the resin sheet of this embodiment has a support body and the resin composition of this embodiment distribute
  • the resin sheet is used as one means of thinning, for example, a thermosetting resin (including a filler) used for a prepreg directly on a support such as a metal foil or a film. It can be produced by coating and drying.
  • the support body used when manufacturing the resin sheet of this embodiment is not specifically limited, the well-known thing used for various printed wiring board materials can be used, and it is a resin sheet or metal foil. It is preferable.
  • the resin sheet and metal foil include a polyimide film, a polyamide film, a polyester film, a polyethylene terephthalate (PET) film, a polybutylene terephthalate (PBT) film, a polypropylene (PP) film, and a resin sheet such as a polyethylene (PE) film, And metal foils such as aluminum foil, copper foil, and gold foil.
  • electrolytic copper foil and PET film are preferable.
  • the resin sheet of the present embodiment is preferably one obtained by applying the above-described resin composition to a support and then semi-curing (B-stage).
  • the method for producing the resin sheet of this embodiment is preferably a method for producing a composite of a B-stage resin and a support.
  • the resin composition is coated on a support such as a copper foil, and then semi-cured by a method of heating in a dryer at 100 to 200 ° C. for 1 to 60 minutes to produce a resin sheet. The method of doing is mentioned.
  • the amount of the resin composition attached to the support is preferably in the range of 1.0 to 300 ⁇ m in terms of the resin thickness of the resin sheet.
  • the resin sheet of this embodiment can be used as a build-up material for printed wiring boards.
  • the laminate of the present embodiment can be obtained by, for example, stacking one or more of the above resin sheets and curing them.
  • the metal foil-clad laminate of the present embodiment can be obtained by, for example, laminating and curing the above-described resin sheet and metal foil.
  • the metal foil-clad laminate of the present embodiment can be obtained by, for example, using the above-described resin sheet and arranging and laminating metal foils on one side or both sides thereof. More specifically, for example, one of the above-mentioned resin sheets or a plurality of the ones from which the support is peeled off are stacked, and a metal foil such as copper or aluminum is arranged on one or both sides thereof.
  • a metal foil-clad laminate can be produced by laminating as necessary.
  • the metal foil used here will not be specifically limited if it is used for printed wiring board material, Well-known copper foils, such as a rolled copper foil and an electrolytic copper foil, are preferable.
  • the method for forming the metal foil-clad laminate and the molding conditions thereof there are no particular limitations on the method for forming the metal foil-clad laminate and the molding conditions thereof, and general methods and conditions for a laminate for a printed wiring board and a multilayer board can be applied.
  • a multi-stage press, a multi-stage vacuum press, a continuous molding machine, an autoclave molding machine, etc. can be used at the time of forming a metal foil-clad laminate.
  • the temperature is generally 100 to 300 ° C.
  • the pressure is a surface pressure of 2.0 to 100 kgf / cm 2
  • the heating time is generally 0.05 to 5 hours.
  • post-curing can be performed at a temperature of 150 to 300 ° C., if necessary.
  • the laminate of this embodiment may be a laminate provided with a plurality of resin sheets and / or prepregs, or may be a metal foil-clad laminate provided with resin sheets and / or prepregs and metal foils. These laminates are obtained by stacking and curing a resin sheet, a prepreg, and a metal foil.
  • the printed wiring board of the present embodiment includes an insulating layer containing the resin composition of the present embodiment and a conductor layer formed on the surface of the insulating layer.
  • the printed wiring board according to the present embodiment is manufactured, for example, by forming a conductive layer serving as a circuit on an insulating layer by metal foil or electroless plating.
  • the conductor layer is generally made of copper or aluminum.
  • the insulating layer for printed wiring board on which the conductor layer is formed can be suitably used for a printed wiring board by forming a predetermined wiring pattern.
  • the printed wiring board of this embodiment maintains the elastic modulus excellent also under the reflow temperature at the time of semiconductor mounting because an insulating layer contains the above-mentioned resin composition, and effectively warps a semiconductor plastic package. Since it suppresses and is excellent in metal foil peel strength and desmear resistance, it can be used particularly effectively as a printed wiring board for semiconductor packages.
  • the printed wiring board of the present embodiment can be manufactured by the following method, for example.
  • the metal foil-clad laminate such as a copper-clad laminate
  • An inner layer circuit is formed by etching the surface of the metal foil-clad laminate to produce an inner layer substrate. If necessary, surface treatment is performed on the inner layer circuit surface of the inner layer substrate to increase the adhesive strength, then the required number of the prepregs are stacked on the inner layer circuit surface, and a metal foil for the outer layer circuit is laminated on the outer side. Then, it is integrally molded by heating and pressing.
  • a multilayer laminate is produced in which an insulating layer made of a cured material of the base material and the thermosetting resin composition is formed between the inner layer circuit and the metal foil for the outer layer circuit.
  • desmear treatment is performed to remove smears, which are resin residues derived from the resin component contained in the cured product layer.
  • a plated metal film is formed on the wall surface of this hole to connect the inner layer circuit and the metal foil for the outer layer circuit, and the outer layer circuit is formed by etching the metal foil for the outer layer circuit to produce a printed wiring board. Is done.
  • the above-described prepreg base material and the above-described resin composition attached thereto
  • the above-described resin sheet the support and the above-described resin composition attached thereto
  • the resin composition layer of the metal foil-clad laminate constitutes an insulating layer containing the above-described resin composition.
  • the weight average molecular weight of the reaction product was measured by gel permeation chromatography (GPC) method using the resin compositions obtained in the following examples and comparative examples as samples, and converted using a standard polystyrene calibration curve. Calculated as Specifically, the relationship between the elution time from the column and the molecular weight is obtained in advance, and based on this, the elution time is replaced with the molecular weight. A graph showing “relation between elution time and molecular weight” used at this time is called “calibration curve” (or calibration curve).
  • n 4 represents an integer of 1 or more.
  • Example 1 25 parts by weight of a maleimide compound (maleimide group equivalent 285 g / eq, trade name “BMI-80” manufactured by Kay Kasei Co., Ltd.) is heated to 40 parts by weight of propylene glycol monomethyl ether (KH Neochem) under conditions of heating to reflux 130 ° C. 15 parts by mass of diamino-modified silicone (X-22-161B, amino group equivalent 1500 g / eq, trade name “X-22-161B” manufactured by Shin-Etsu Chemical Co., Ltd.) is dissolved in the solution dissolved below, A polymer was prepared.
  • a maleimide compound maleimide group equivalent 285 g / eq, trade name “BMI-80” manufactured by Kay Kasei Co., Ltd.
  • KH Neochem propylene glycol monomethyl ether
  • Example 2 A reaction product having a weight average molecular weight of 13200 is contained in the same manner as in Example 1 except that 1.0 part by mass of maleic anhydride is changed to 1.0 part by mass of acetic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.). A resin composition was obtained. Using a part of the obtained resin composition as a sample, the weight average molecular weight of the reaction product was measured. A part of the resin composition was stored for 7 days at 25 ° C., and the weight average molecular weight of the reaction product after storage was measured. The results are shown in Table 1.
  • Example 3 A reaction product having a weight average molecular weight of 12500 was obtained in the same manner as in Example 1 except that 1.0 part by mass of maleic anhydride was changed to 1.0 part by mass of phthalic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.). A resin composition containing was obtained. Using a part of the obtained resin composition as a sample, the weight average molecular weight of the reaction product was measured. A part of the resin composition was stored for 7 days at 25 ° C., and the weight average molecular weight of the reaction product after storage was measured. The results are shown in Table 1.
  • Example 4 A reaction product having a weight average molecular weight of 12000 is contained in the same manner as in Example 1 except that 1.0 part by mass of maleic anhydride is changed to 1.0 part by mass of maleic acid (manufactured by Tokyo Chemical Industry Co., Ltd.). A resin composition was obtained. Using a part of the obtained resin composition as a sample, the weight average molecular weight of the reaction product was measured. A part of the resin composition was stored for 7 days at 25 ° C., and the weight average molecular weight of the reaction product after storage was measured. The results are shown in Table 1.
  • Example 5 A resin composition containing a reaction product having a weight average molecular weight of 11710 was obtained in the same manner as in Example 1 except that 1.0 part by mass of maleic anhydride was changed to 0.5 part by mass of maleic anhydride. . Using a part of the obtained resin composition as a sample, the weight average molecular weight of the reaction product was measured. A part of the resin composition was stored for 7 days at 25 ° C., and the weight average molecular weight of the reaction product after storage was measured. The results are shown in Table 1.
  • Example 2 A resin composition containing a reaction product having a weight average molecular weight of 14100 was obtained in the same manner as in Example 1 except that 1.0 part by mass of maleic anhydride was not used. Using a part of the obtained resin composition as a sample, the weight average molecular weight of the reaction product was measured. A part of the resin composition was stored for 7 days at 25 ° C., and the weight average molecular weight of the reaction product after storage was measured. The results are shown in Table 1.
  • “Increase rate” is the ratio (%) of the weight average molecular weight of the resin composition after storage for 7 days to the weight average molecular weight of the resin composition before storage.
  • the “weight average molecular weight” of the resin composition before storage is not a value obtained by measurement immediately after obtaining each resin composition, but obtained by measurement on the day of obtaining each resin composition. Value. Therefore, the initial storage stability can be compared from the result of “weight average molecular weight” in Table 1.
  • Example 6 41.0 parts by mass of the resin composition obtained in Example 1, 30 parts by mass of a maleimide compound (maleimide group equivalent 186 g / eq, trade name “BMI-2300” manufactured by Daiwa Kasei Kogyo Co., Ltd.), and a biphenyl novolac type epoxy 4.5 parts by mass of resin (trade name “NC-3000FH” manufactured by Nippon Kayaku Co., Ltd.) and bisdiallyl nadiimide (alkenyl group equivalent: 286 g / eq, trade name “BANI-M” manufactured by Maruzen Petrochemical Co., Ltd.) 0.5 parts by mass of cyanate esterified product of ⁇ -naphthol aralkyl type phenol resin obtained in Synthesis Example 1 above, and 200 parts by mass of slurry silica (trade name “SC-2050MB” manufactured by Admatechs) And 5 parts by mass of an epoxy silane coupling agent (trade name “Z6040”
  • Example 6 [Amine number] About each resin composition obtained in Example 6 and Comparative Example 3, the amine value was measured. Specifically, based on JIS K 7237: 1995, the amine value was measured as the total amount of primary amine and secondary amine of the resin composition. The results are shown in Table 2.
  • Prepreg viscosity The resin content is obtained from the prepreg prepared by the above-mentioned method, and using a dynamic viscoelasticity measuring apparatus (trade name “AR2000” manufactured by TA Instruments Inc.), the angular velocity is 1 rad / s and the geometry gap is 1 mm. The viscosity (mPa ⁇ s) under the measurement condition of 120 ° C. was measured. Moreover, the prepreg mentioned above was preserve
  • [Laminated board] A 12 ⁇ m thick electrolytic copper foil (trade name “3EC-III” manufactured by Mitsui Mining & Smelting Co., Ltd.) is placed on the top and bottom of one prepreg obtained, and laminated molding at a pressure of 30 kgf / cm 2 and a temperature of 220 ° C. for 120 minutes To obtain a copper-clad laminate (molded before storage) having an insulating layer thickness of 100 ⁇ m. Further, the obtained prepreg was stored for 7 days under the condition of 25 ° C., and was laminated by the same method as described above using one prepreg after storage, and a copper-clad laminate (storage) having an insulating layer thickness of 100 ⁇ m After molding) was obtained.
  • 3EC-III manufactured by Mitsui Mining & Smelting Co., Ltd.
  • the resin composition of the present invention and a printed wiring board obtained from the resin composition can be suitably used as members of various electronic devices such as personal computers and communication devices.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention fournit une composition de résine qui contient un produit de réaction (P) obtenu par réaction d'une silicone amino-modifiée (A), d'un composé maéimide (B), et d'un ou deux éléments choisis dans un groupe constitué d'un acide carboxylique (C) et d'un anhydride d'acide carboxylique (D).
PCT/JP2017/012309 2016-04-05 2017-03-27 Composition de résine ainsi que procédé de fabrication de celle-ci, pré-imprégné, feuille de résine, plaque stratifiée, plaque stratifiée recouverte d'une feuille métallique, et carte de circuit imprimé Ceased WO2017175614A1 (fr)

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JP2018510544A JP7305349B2 (ja) 2016-04-05 2017-03-27 樹脂組成物及びその製造方法、プリプレグ、レジンシート、積層板、金属箔張積層板、並びにプリント配線板
CN201780017274.3A CN108779247B (zh) 2016-04-05 2017-03-27 树脂组合物和其制造方法、预浸料、树脂片、层叠板、覆金属箔层叠板以及印刷电路板
KR1020187022415A KR102376567B1 (ko) 2016-04-05 2017-03-27 수지 조성물 및 그 제조 방법, 프리프레그, 레진 시트, 적층판, 금속박 피복 적층판, 그리고 프린트 배선판

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CN114058267A (zh) * 2020-07-29 2022-02-18 味之素株式会社 树脂组合物
WO2023074646A1 (fr) * 2021-10-27 2023-05-04 株式会社レゾナック Feuille métallique revêtue de résine, carte de circuit imprimé et procédé de fabrication associé et boîtier de semi-conducteur
WO2025052997A1 (fr) * 2023-09-08 2025-03-13 株式会社レゾナック Préimprégné, stratifié, carte de circuit imprimé, et boîtier de semi-conducteur

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WO2023013715A1 (fr) * 2021-08-05 2023-02-09 三菱瓦斯化学株式会社 Composition durcissable, préimprégné, feuille de résine, stratifié recouvert d'une feuille métallique, et carte de circuits imprimés
JP7197047B1 (ja) 2022-05-27 2022-12-27 三菱瓦斯化学株式会社 樹脂組成物、硬化物、封止材料、接着剤、絶縁材料、塗料、プリプレグ、多層体、および、繊維強化複合材料
US20250136761A1 (en) * 2022-10-11 2025-05-01 Shengyi Technology (Suzhou) Co., Ltd Modified bismaleimide prepolymer, resin composition and application of resin composition

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WO2025052997A1 (fr) * 2023-09-08 2025-03-13 株式会社レゾナック Préimprégné, stratifié, carte de circuit imprimé, et boîtier de semi-conducteur

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CN108779247A (zh) 2018-11-09
JP2022000506A (ja) 2022-01-04
KR20180134845A (ko) 2018-12-19
KR102376567B1 (ko) 2022-03-21
TWI730075B (zh) 2021-06-11
JP2023116516A (ja) 2023-08-22
JPWO2017175614A1 (ja) 2019-02-14
CN108779247B (zh) 2021-01-15
TW201807063A (zh) 2018-03-01
JP7305349B2 (ja) 2023-07-10

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