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WO2017038470A1 - Dispositif de séparation de feuille et procédé de séparation - Google Patents

Dispositif de séparation de feuille et procédé de séparation Download PDF

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Publication number
WO2017038470A1
WO2017038470A1 PCT/JP2016/074016 JP2016074016W WO2017038470A1 WO 2017038470 A1 WO2017038470 A1 WO 2017038470A1 JP 2016074016 W JP2016074016 W JP 2016074016W WO 2017038470 A1 WO2017038470 A1 WO 2017038470A1
Authority
WO
WIPO (PCT)
Prior art keywords
peeling
adhesive sheet
sheet
pressing
adherend
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/074016
Other languages
English (en)
Japanese (ja)
Inventor
高野　健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to CN201680033596.2A priority Critical patent/CN107615475B/zh
Priority to KR1020177037376A priority patent/KR102558075B1/ko
Publication of WO2017038470A1 publication Critical patent/WO2017038470A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H10P72/0442—
    • H10P54/00—
    • H10P72/0428—
    • H10P72/70—
    • H10P95/00—

Definitions

  • the present invention relates to a sheet peeling apparatus and a peeling method.
  • the adhesive sheet is folded back and peeled off from the adherend while pressing with the plate member.
  • the load on the kimono may increase.
  • the adhesive sheet peeled from the adherend is pressed and peeled by the first roller in the direction of the adherend.
  • An object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of reliably peeling an adhesive sheet.
  • the sheet peeling apparatus of the present invention is a sheet peeling apparatus for peeling an adhesive sheet stuck on an adherend, and a sticking means for sticking a peeling tape to the adhesive sheet; Tensile means for separating the adhesive sheet from the adherend by applying tension to the peeling tape affixed to the adhesive sheet, and the adherend is separated from the adhesive sheet by peeling the adhesive sheet with the tension means.
  • a movement restricting means for restricting movement in the peeling direction; and a pressing means for pressing the adhesive sheet peeled off from the adherend in the direction of the adherend, the movement restricting means and the pressering means, A configuration is adopted in which one adhesive sheet is peeled off selectively.
  • the movement restricting means is used for peeling only the peeling start side end portion of the adhesive sheet.
  • the said pressing means is utilized for peeling of the said adhesive sheet after peeling of the said peeling start side edge part by the said movement control means.
  • the sheet peeling method of the present invention is a sheet peeling method for peeling an adhesive sheet attached to an adherend, and a sticking step for sticking a peeling tape to the adhesive sheet;
  • a tensioning step in which tension is applied to the peeling tape to peel the adhesive sheet from the adherend, and the adherend moves in the peeling direction of the adhesive sheet by peeling the adhesive sheet in the tensioning step.
  • the movement regulating step for restricting the pressing and the pressing step for pressing the adhesive sheet peeled off from the adherend in the direction of the adherend are selectively performed to peel off the one adhesive sheet.
  • the configuration is adopted.
  • one adhesive sheet is peeled off by selectively using (selectively) the movement restricting means (movement restricting step) and the pressing means (pressing step). Therefore, the adhesive sheet can be reliably peeled off.
  • the movement restricting means is used for peeling only the end portion on the peeling start side of the adhesive sheet, it becomes easy to form a cut of the peeling of the adhesive sheet. Further, if the pressing means is used for peeling the adhesive sheet after peeling of the peeling start side end by the movement restricting means, the load applied to the adherend when peeling the adhesive sheet can be reduced.
  • the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane.
  • the X axis and the Y axis are axes in a predetermined plane
  • the Z axis is an axis that is orthogonal to the predetermined plane.
  • a sheet peeling apparatus 10 is an apparatus for peeling an adhesive sheet AS attached to a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) WF as an adherend, An affixing means 20 for affixing to the adhesive sheet AS, a tension means 30 for applying a tension to the peeling tape PT affixed to the adhesive sheet AS and separating the adhesive sheet AS from the wafer WF, and an adhesive sheet AS in the tension means 30 Restricting the movement of the wafer WF in the peeling direction of the adhesive sheet AS due to the peeling of the wafer WF, the pressing means 50 for pressing the adhesive sheet AS peeled from the wafer WF in the direction of the wafer WF, and the pressing means 50, a clamping means 60 for sandwiching the peeling tape PT with the cutting means 70, and a cutting means 70 for cutting the peeling tape PT. And pressing means 50 and selectively utilized has a structure for separating the one adhesive sheet AS.
  • the affixing means 20 sandwiches the wound peeling tape PT rotatably and the peeling tape PT supported by the tape supporting means 21 is sandwiched between the tape supporting means 21 and the peeling means PT.
  • a feeding means 22 for applying a feeding force to the tape PT, a holding means 23 for holding the lead end of the peeling tape PT, a holding auxiliary means 24 for assisting the holding means 23 to hold the peeling tape PT, And pressing means 25 for pressing and attaching the peeling tape PT held by the holding means 23 to the adhesive sheet AS.
  • the tape support means 21 is supported on the free end side of a rotating arm 21B that can rotate about a rotating shaft 21A, and feeds the rotating arm 21B and a supporting roller 21C that supports the wound peeling tape PT. And a spring 21D as an urging means for urging in the direction of the means 22.
  • the feeding means 22 includes a feeding roller 22B that is driven by a rotation motor 22A as a driving device.
  • the holding means 23 is accommodated in the accommodating means 23C supported by the output shaft 23B of the direct acting motor 23A as a driving device, and is peeled off through a suction hole 23E formed in the suction surface 23D which is the bottom surface of the accommodating means 23C.
  • Suction means 23F such as a vacuum pump or a vacuum ejector for adsorbing and holding the tape PT is provided.
  • the holding auxiliary means 24 includes an auxiliary roller 24C that is supported by an output shaft 24B of a direct acting motor 24A as a driving device and makes the peeling tape PT contact the suction surface 23D.
  • the pressing means 25 is supported by a slider 25B of a linear motor 25A as a driving device accommodated in the accommodating means 23C, and is provided with a pressing head 25C provided so as to be able to project and retract from the bottom surface of the accommodating means 23C, a coil heater, and a heat pipe. Heating means 25D on the heating side.
  • the pulling means 30 includes a moving means 31 for relatively moving the peeling tape PT and the wafer WF, and a guiding means 32 for guiding the peeling tape PT used for peeling the adhesive sheet AS to be positioned in the vicinity of the cutting means 70. It has.
  • the moving unit 31 is supported by a slider 31B of a linear motor 31A as a driving device, and includes a table 31D having a support surface 31C that can suck and hold the wafer WF by a decompression unit (not shown) such as a decompression pump or a vacuum ejector.
  • the guide means 32 includes a guide roller 32C supported by a slider 32B of a linear motor 32A as a driving device.
  • the movement restricting means 40 includes a rotation motor 42 as a drive device supported by a slider 41A of a linear motor 41 as a drive device, and a movement restriction plate 43 supported by an output shaft 42A of the rotation motor 42.
  • the adhesive sheet AS is configured to be used for peeling only at the peeling start side end.
  • the pressing means 50 includes a rotation motor 52 as a driving device supported by a slider 51A of a linear motor 51 as a driving device, and a pressing roller 53 supported by an output shaft (not shown) of the rotation motor 52.
  • a rotation motor 52 as a driving device supported by a slider 51A of a linear motor 51 as a driving device
  • a pressing roller 53 supported by an output shaft (not shown) of the rotation motor 52.
  • the sandwiching means 60 includes a pinch roller 62 that is supported by an output shaft 61A of a linear motion motor 61 as a driving device and sandwiches the peeling tape PT and the adhesive sheet AS with the pressing roller 53.
  • the cutting means 70 includes a cutting blade 72 that is supported by a slider 71A of a linear motor 71 serving as a driving device accommodated in the accommodation means 23C and is provided so as to protrude and retract from the bottom surface of the accommodation means 23C.
  • the tension means 30 uses a decompression means (not shown). Driven to start sucking and holding the wafer WF. Thereafter, the pulling means 30 drives the linear motor 31A, moves the table 31D to the left, and positions the left end portion of the adhesive sheet AS directly below the pressing head 25C, as indicated by a two-dot chain line in FIG.
  • the sticking means 20 drives the linear motion motor 24A, and after the auxiliary roller 24C is retracted from below the accommodating means 23C as shown by a two-dot chain line in FIG. 1, the rotation motor 22A and the linear motion motor 23A are driven. Then, the accommodating means 23C is lowered to a predetermined position directly above the adhesive sheet AS while feeding the peeling tape PT. Thereafter, the sticking means 20 drives the linear motor 25A, and as shown in FIG. 2A, the pressing head 25C is lowered, and the peeling tape PT is pressed and stuck to the left end portion of the adhesive sheet AS. At this time, the sticking means 20 may drive the heating means 25D to heat the peeling tape PT.
  • the sticking means 20 stops driving the suction means 23F and drives the linear motor 25A and the linear motor 23A so that the pressing head 25C and the accommodating means 23C are initialized. Return to position.
  • the pinching means 60 drives the linear motion motor 61, and the pinching roller 62 and the pressing roller 53 pinch the peeling tape PT with a predetermined pressing force, and then the pulling means 30 drives the linear motor 31A for bonding.
  • the left end portion of the sheet AS is positioned immediately below the lowermost portion of the pressing roller 53.
  • the movement restricting means 40 drives the linear motor 41 and the rotation motor 42 to hold the left end of the adhesive sheet AS with the left end of the movement restricting plate 43 through the peeling tape PT as shown in FIG. 2B. wear.
  • the pulling means 30 and the pressing means 50 drive the linear motor 31A and the rotation motor 52 to move the table 31D in the left direction and rotate the pressing roller 53 in the counterclockwise direction.
  • the adhesive sheet AS is peeled from the wafer WF while maintaining the posture of being folded back at the left end portion of the movement restricting plate 43 as indicated by a two-dot chain line in FIG. 2B.
  • the pulling means 30 drives the linear motor 32A to bring the guide roller 32C into contact with the peeling tape PT and the adhesive sheet AS fed by the pinch roller 62 and the pressing roller 53, A predetermined tension is applied to them, and the peeling tape PT and the adhesive sheet AS are guided so as to be folded in two (the same applies hereinafter).
  • the pulling means 30 and the pressing means 50 are connected to the linear motor 31A, The drive of 32A and the rotation motor 52 is stopped.
  • the movement restricting means 40 drives the linear motor 41 and the rotation motor 42 to return the movement restricting plate 43 to the initial position
  • the pressing means 50 drives the linear motor 51, as shown in FIG. 2C.
  • the bent portion of the adhesive sheet AS is pressed at the lowermost part of the pressing roller 53. Even after the pressing roller 53 moves, the pinching roller 62 and the pressing roller 53 continue to sandwich the peeling tape PT and the adhesive sheet AS with a predetermined pressing force.
  • the pulling means 30 and the pressing means 50 drive the linear motors 31A, 32A and the rotation motor 52 to move the table 31D in the left direction, and rotate the pressing roller 53 in the counterclockwise direction.
  • the adhesive sheet AS is peeled from the wafer WF while maintaining the posture in which the bent portion is pressed at the lowermost portion of the pressing roller 53.
  • the pulling means 30 and the pressing means 50 stop driving the linear motors 31A and 32A, the decompression means (not shown), and the rotation motor 52.
  • the sticking means 20 drives the linear motor 24A and the suction means 23F, and as shown in FIG. 2F, the auxiliary roller 24C is returned to the initial position, and the peeling tape PT is sucked and held by the suction face 23D.
  • the cutting means 70 drives the linear motor 71 and lowers the cutting blade 72 to cut the peeling tape PT, and a manual or unillustrated transfer means collects the adhesive sheet AS.
  • a manual means or a conveying means conveys the wafer WF on the table 31D to the next process, and then the pulling means 30 drives the linear motor 31A to move the table 31D. Return to the initial position.
  • the pulling means 30, the pressing means 50, and the sandwiching means 60 drive the linear motors 32A, 51 and the linear motion motor 61 to return the guide roller 32C, the pressing roller 53, and the pinch roller 62 to the initial positions. Similar operations are repeated.
  • the movement restricting means 40 and the pressing means 50 are selectively used to peel one adhesive sheet.
  • the sheet AS can be reliably peeled off.
  • the feeding means 22 functions as a cutting position changing means for changing the cutting position of the peeling tape PT, and the feeding roller 22B is rotated so that the peeling tape PT is taken up by the support roller 21C and peeled by the cutting means 70. Both the tape PT and the adhesive sheet AS or only the adhesive sheet AS may be cut.
  • the cutting position changing means may be a mechanical chuck, a chuck cylinder or the like instead of or in combination with the feeding means 22. You may employ
  • the affixing means 20 may be configured to affix a single sheet peeling tape against the adhesive sheet AS.
  • the tape support means 21 may support the peeling tape PT without being biased toward the feeding means 22, and in this case, the feeding means 22 is a pinch roller that sandwiches the peeling tape PT with the rotation motor 22 ⁇ / b> A. Etc. may be adopted.
  • the holding means 23 is configured to hold the peeling tape PT by chuck means such as a mechanical chuck or a chuck cylinder, coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption or the like instead of or in combination with the suction means 23F. Can be adopted.
  • the holding auxiliary means 24 can employ a configuration in which the peeling tape PT is brought into contact with the suction surface 23D by spraying a rod-like member, a plate-like member, or air instead of or in combination with the auxiliary roller 24C.
  • the holding auxiliary means 24 may be omitted as long as the peeling tape PT after peeling of the adhesive sheet AS can be held only by the holding means 23.
  • the pressing means 25 can employ a pressing member made of blade material, rubber, resin, sponge, air blowing, or the like, instead of or in combination with the pressing head 25C, and the peeling tape PT is bonded to pressure sensitive adhesive.
  • the heating means 25D may or may not be provided.
  • At least one of the pressing means 25 and the cutting means 70 may not be accommodated in the accommodating means 23C, and the linear motors 25A and 71 may be supported by a frame (not shown).
  • the biasing means may employ rubber or resin instead of or in combination with the spring 21D.
  • the pulling means 30 may peel the adhesive sheet AS only by driving the feeding means 22, or may peel the adhesive sheet AS only by driving the rotation motor 52.
  • the pulling means 30 may fix the table 31D and move the sticking means 20, the pulling means 30, the movement restricting means 40, the pressing means 50, the sandwiching means 60, and the like. May be moved.
  • the moving means 31 may be configured to support the adherend with chuck means such as a mechanical chuck or a chuck cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption, or the like.
  • the guiding means 32 may or may not guide the adhesive sheet AS so that the opposite surfaces of the adhesive surface face each other.
  • the guiding means 32 may employ a rod-shaped member, a plate-shaped member, or the like instead of or in combination with the guiding roller 32C, or may be guided so that the adhesive sheet AS is folded in half by blowing air or the like. Good.
  • the movement restricting means 40 may restrict the movement of the wafer WF by a roller member, air blowing, or the like instead of or in combination with the movement restricting plate 43.
  • the movement restricting means 40 peels the left end of the adhesive sheet AS with the movement restricting plate 43, and then moves the table 31D and rotates the pressing roller 53 without returning the movement restricting plate 43 to the initial position. The peeling may be completed.
  • the pressing roller 53 may press the adhesive sheet AS before or after peeling or before and after peeling of the left end portion, or may not be pressed before and after peeling.
  • the movement restricting means 40 may press the adhesive sheet AS at any position such as the left end portion (peeling start side end portion), the middle portion, or the right end portion (peeling end side end portion) of the adhesive sheet AS.
  • the pressing means 50 may press the adhesive sheet AS in the wafer WF direction by using a plate-like member or air blowing instead of or in combination with the pressing roller 53.
  • the pressing means 50 may press the left end with the pressing roller 53 before peeling the adhesive sheet AS left end, and peel the entire adhesive sheet AS by moving the table 31D and rotating the pressing roller 53.
  • the movement restricting plate 43 may press the adhesive sheet AS before or after the left end of the adhesive sheet AS is peeled off, or the movement restricting plate 43 may not press the adhesive sheet before and after peeling.
  • the pressing means 50 may press the adhesive sheet AS at any position such as the left end portion, the middle portion, or the right end portion of the adhesive sheet AS.
  • the pressing means 50 may press the adhesive sheet AS peeled from the wafer WF so as to contact the adhesive sheet AS attached to the wafer WF, or may press the adhesive sheet AS so as not to contact.
  • the presser means 50 may press the bent portion of the adhesive sheet AS at a position other than the lowermost portion of the presser roller 53. Any presser can be used as long as the bent portion of the adhesive sheet AS can be pressed by the presser roller 53. You may hold it in place.
  • the sandwiching means 60 may or may not sandwich the peeling tape PT with the pressing roller 53 by using a plate member or air blowing instead of or in combination with the pinch roller 62.
  • the cutting means 70 may employ other configurations such as a laser cutter, a thermal cutter, an air cutter, and a compressed water cutter instead of or in combination with the cutting blade 72.
  • the cutting means 70 cuts the peeling tape PT from the holding position of the peeling tape PT (holding position by the support roller 21C and the feeding roller 22B) to the position where the peeling tape PT is attached to the adhesive sheet AS.
  • the peeling is performed between the holding position of the peeling tape PT and the support position that supports the peeling tape PT.
  • the tape PT may be cut.
  • the other means or both means are used. You may perform peeling operation of a left end part.
  • the movement restricting means 40 and the pressing means 50 may be automatically selected, or may be manually selected. Good.
  • the material, type, shape and the like of the adhesive sheet AS, the peeling tape PT and the adherend in the present invention are not particularly limited.
  • the adhesive sheet AS and the peeling tape PT may be circular, elliptical, polygonal, such as a triangle or a quadrangle, or other shapes, or may be adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness.
  • Adhesion to the adherend in the case where a heat-sensitive adhesive type is adopted may be applied to a heating side such as an appropriate coil heater or heat pipe for heating the adhesive sheet AS or the peeling tape PT. Bonding may be performed by an appropriate method such as providing a heating means.
  • an adhesive sheet AS and a peeling tape PT are, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, and an upper surface of the base sheet. It may be a three-layer or more layer having a cover layer, or a so-called double-sided adhesive sheet that can peel the substrate sheet from the adhesive layer. It may be a layer having an intermediate layer or a single layer or a multilayer having no intermediate layer.
  • the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted.
  • the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc.
  • a functional and intended reading for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc.
  • Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.
  • the means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps.
  • the process is not limited at all.
  • the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder.
  • an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder.
  • a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

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  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

L'invention concerne un dispositif de séparation de feuille (10) équipé : d'un moyen adhésif (20) permettant de coller un ruban détachable (PT) à une feuille adhésive (AS) ; d'un moyen de traction (30) permettant de séparer la feuille adhésive (AS) d'une partie adhérée (WF) par application d'une tension sur le ruban détachable (PT) collé à la feuille adhésive (AS) ; d'un moyen de restriction de mouvement (40) permettant de restreindre le mouvement de la partie adhérée (WF) dans la direction de séparation de la feuille adhésive (AS) provoqué par la séparation de la feuille adhésive (AS) par les moyens de traction (30) ; et d'un moyen de pression (50) permettant d'exercer une pression dans la direction de la partie adhérée (WF) sur la feuille adhésive (AS) qui a été séparée de la partie adhérée (WF). Une feuille adhésive (AS) est séparée en utilisant sélectivement le moyen de restriction de mouvement (40) et le moyen de pression (50).
PCT/JP2016/074016 2015-08-31 2016-08-17 Dispositif de séparation de feuille et procédé de séparation Ceased WO2017038470A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201680033596.2A CN107615475B (zh) 2015-08-31 2016-08-17 片材剥离装置及剥离方法
KR1020177037376A KR102558075B1 (ko) 2015-08-31 2016-08-17 시트 박리 장치 및 박리 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015171467A JP6562778B2 (ja) 2015-08-31 2015-08-31 シート剥離装置および剥離方法
JP2015-171467 2015-08-31

Publications (1)

Publication Number Publication Date
WO2017038470A1 true WO2017038470A1 (fr) 2017-03-09

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PCT/JP2016/074016 Ceased WO2017038470A1 (fr) 2015-08-31 2016-08-17 Dispositif de séparation de feuille et procédé de séparation

Country Status (5)

Country Link
JP (1) JP6562778B2 (fr)
KR (1) KR102558075B1 (fr)
CN (1) CN107615475B (fr)
TW (1) TWI688999B (fr)
WO (1) WO2017038470A1 (fr)

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JP7344647B2 (ja) * 2019-02-18 2023-09-14 株式会社ディスコ テープ貼着装置
JP7454434B2 (ja) * 2020-04-14 2024-03-22 リンテック株式会社 シート剥離装置およびシート剥離方法
TWI827978B (zh) * 2021-09-16 2024-01-01 日商新川股份有限公司 安裝裝置

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