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WO2017033338A1 - Rotary tool with stress-luminescent material, manufacturing method therefor, and machine tool control system - Google Patents

Rotary tool with stress-luminescent material, manufacturing method therefor, and machine tool control system Download PDF

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Publication number
WO2017033338A1
WO2017033338A1 PCT/JP2015/074282 JP2015074282W WO2017033338A1 WO 2017033338 A1 WO2017033338 A1 WO 2017033338A1 JP 2015074282 W JP2015074282 W JP 2015074282W WO 2017033338 A1 WO2017033338 A1 WO 2017033338A1
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WIPO (PCT)
Prior art keywords
tool
stress
machine tool
rotary tool
control system
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Ceased
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PCT/JP2015/074282
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French (fr)
Japanese (ja)
Inventor
一平 河野
進 石田
明理 楢原
隆浩 北川
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Hitachi Ltd
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Hitachi Ltd
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Priority to PCT/JP2015/074282 priority Critical patent/WO2017033338A1/en
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Ceased legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/04Arrangements preventing overload of tools, e.g. restricting load
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool

Definitions

  • the present invention relates to a rotary tool having a stress light emitter, a manufacturing method thereof, and a machine tool control system.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2009-291916
  • a machine tool controls a plurality of magnetic bearings 13, 14, 15 for supporting a rotating shaft 11 in a non-contact manner.
  • Bearing control means and processing control means 30 for controlling the cutting amount and feed speed of the grindstone 2.
  • the magnetic bearing control means has processing resistance calculation means 42 for calculating cutting resistance from the control current in real time.
  • the machining control means 30 controls the feed rate so that the cutting force becomes constant "(see the summary).
  • JP 2010-186374 A states that “a numerical value for generating a tool path based on at least a machining program designating material shape information and a cutting amount and controlling a machine tool having a main shaft and a movable shaft”.
  • the current detectors 24 and 26 for detecting the load of the servo motor 19 or the spindle motor 22, the position / speed detector 25 for detecting the position of the servo motor 19, and the current detectors 24 and 26 are detected.
  • the load current value is determined to be no load
  • the load current value is determined to be no load
  • the current tool path command is read and the material shape information, the tool path command, and the servo are read.
  • Patent Document 3 discloses a “measurement method and measurement system of stress or stress distribution using a stress luminescent material”, and “the material itself is proportional to the stress. Stress is applied to a subject including a stress-stimulated luminescent material that emits light, and the stress distribution in the subject is visualized based on the luminescence intensity of the stress-stimulated luminescent material in the subject. The stress or stress distribution in the subject can be determined by comparing the measured value with the correlation data between the light emission intensity and stress of the stress-stimulated luminescent material ”(see summary).
  • Patent Document 1 describes a machine tool that calculates a cutting force from a control current of a rotating spindle and controls a feed rate so that the cutting force becomes constant.
  • Patent Document 2 describes a numerical control device for a machine tool having a function of detecting tool breakage by detecting a no-load state from a load current of a motor including a servo motor.
  • a load signal related to machining is extracted from the motor current of the rotating spindle. It is difficult. Further, it is difficult to detect the servo motor of the machine tool because the machining load of the rotating small-diameter tool is small with respect to the motor load necessary for moving the table of the machine tool and the workpiece.
  • Patent Document 3 describes a method for measuring the stress or stress distribution of a subject using a stress-stimulated luminescent material, but does not disclose the detection of breakage or processing load of a rotating tool.
  • an object of the present invention is to provide a rotary tool capable of detecting tool breakage or cutting resistance during machining even in machining where it is difficult to detect a machining load such as a small-diameter tool.
  • the present application includes a plurality of means for solving the above-described problems, if an example of the rotary tool of the present invention is given, a rotary tool for cutting or grinding a workpiece, and a stress emission on a part of the tool surface. It has a member containing a body.
  • An example of a machine tool control system is a machine that controls a machine tool having a rotary tool for cutting or grinding a workpiece, the member having a stress light emitter on a part of the tool surface.
  • a machine control system a light receiving unit for measuring the light emission intensity of the stress light emitter provided on the rotary tool, a calculation unit for calculating a feed rate command according to the light emission intensity, and a machine tool according to the calculation result
  • a machine tool control unit that transmits a signal for controlling the machine tool, and controls the machine tool so that the light emission intensity approaches a predetermined value.
  • a machine tool including a rotary tool for cutting or grinding a workpiece having a member including a stress light emitter on a part of a tool surface.
  • a machine tool control system for controlling, a light receiving unit for measuring light emission of the stress light emitter provided on the rotary tool, and a breakage of the rotary tool according to light emission of the stress light emitter measured by the light receiver. And an arithmetic unit for determination.
  • the machine tool control system which can control a machine tool according to the detected process load can be provided.
  • This example is an example of a rotary tool having a stress light emitter.
  • FIG. 1 is a diagram showing the structure of a rotary tool coated with a stress luminescent material.
  • the tool 1 has a blade part 11, a neck part 12, a taper part 13, a shank part 14, and a stress light emitter part 10.
  • the blade portion 11 is a grindstone having a cutting edge or abrasive grains, and cuts or grinds the workpiece 2.
  • the neck portion 12 is a portion that is continuous with the blade portion 11, and is a round bar portion that has substantially the same diameter as the blade portion 11 or has a diameter equal to or smaller than the blade portion 11.
  • the taper portion 13 is a portion where the diameter changes between the neck portion 12 and the shank portion 14.
  • the shank portion 14 is gripped by a collet, a holder or the like when the tool 1 is connected to the machine tool 4.
  • the tool 1 does not necessarily need to have the taper part 13, and a tool with the same diameter of the neck part 12 and the taper part 14 may be sufficient.
  • the stress-stimulated luminescent part 10 is composed of stress-stimulated luminescent particles and a binder that emit light when given tool surface strain energy.
  • the stress luminescent particles include europium-added strontium aluminate SrAl 2 O 4 : Eu.
  • the binder is a material for forming a stress-stimulated luminescent part by containing stress-luminescent particles and may be either an organic substance such as an epoxy resin or an inorganic substance such as glass, or a mixture of both. It is a concept that also includes
  • stress-stimulated luminescent particles are materials that exhibit a phenomenon in which the luminescence intensity increases in proportion to the intensity of the stimulus in response to a mechanical stimulus in the elastic region, and further emits light in response to the repeated stimulus.
  • stress-stimulated luminescent particles have a crystal structure called stuffed tridymite structure as the matrix structure, aluminate compounds (SrAl2O4: Eu2 +), silicate compounds, alumina silicate compounds, phosphate compounds, Stress emission phenomenon has been confirmed in many materials such as perovskite compounds. Further, it has been confirmed that these materials emit light at various wavelengths from ultraviolet to near infrared.
  • aluminate compounds SrAl2O4: Eu2 +
  • silicate compounds alumina silicate compounds
  • phosphate compounds phosphate compounds
  • FIG. 2 is a diagram for explaining an example of a method for manufacturing a rotary tool in which the stress-stimulated luminescent body 10 is applied to the surface of the tool 1.
  • Masking 21 is applied to the portions of the blade 1 and the neck 12 of the tool 1 where the stress luminescent material is not applied (FIG. 2B).
  • the masking material is a material that can be removed by peeling, melting, or the like, such as a fluororesin or a resist material.
  • the tool 1 is dipped to a predetermined height in a liquid 22 in which stress-luminescent particles and a binder are mixed (FIG. 2 (c)), and the tool 1 is pulled up (FIG. 2 (d)).
  • the thickness of the stress-stimulated light emitter 10 from the pulling speed and the viscosity of the liquid.
  • concentration of the stress-stimulated luminescent particles As the concentration of the stress-stimulated luminescent particles is higher, a larger luminescence intensity can be obtained.
  • the liquid becomes highly viscous and it is difficult to control the thickness, it is desirable to set the concentration to about 10,000 mPa ⁇ s.
  • the tool 1 is allowed to stand, and the applied mixed solution of the stress luminescent material and the binder is cured. Finally, the masking 21 is removed to form the stress-stimulated light emitter 10 (FIG. 2 (e)).
  • the formation method of the stress light-emitting body part 10 is not restricted to the said method, For example, you may affix the resin tape containing a stress light-emitting body on the tool 1.
  • FIG. The resin tape is obtained by applying or pasting an adhesive member to a resin member having a stress light emitter, and attaching the adhesive portion to a tool. In this case, it can be attached more easily than other configurations.
  • the adhesive portion and the resin portion do not have to be separate bodies, and the stress light emitter may be mixed with the resin member before solidification, and attached to the tool before part of the resin member solidifies. In this case, since the resin member and the adhesive member are integrated, they can be manufactured without preparing each separately, and since the adhesive member is not interposed from the tool to the stress light emitter, the stress is more easily transmitted.
  • the stress light emitter 10 may be a coating portion including the stress light emitter, a portion having a stress light emitter layer between the tool base material and the coating, or a portion where the stress light emitter is doped or mixed in the tool base material.
  • FIG. 3 is a diagram showing an example of the relationship between the thickness of the stress luminescent resin and the light emission intensity.
  • the horizontal axis represents the thickness of the stress luminescent resin, and the vertical axis represents the luminescence intensity when the same load is applied to the stress luminescent resin.
  • the light emission intensity changes according to the thickness until the thickness of the stress-stimulated luminescent resin is less than 0.2 mm, but becomes a constant value when the thickness is 0.2 mm or more. For this reason, in order to obtain sufficient light emission intensity and to improve robustness with respect to thickness variations during manufacturing, it is desirable that the thickness of the stress-stimulated luminescent part is 0.2 mm or more.
  • FIG. 4 is a diagram showing an example of the relationship between tool flank wear and cutting force.
  • the horizontal axis represents flank wear, and the vertical axis represents cutting force.
  • This is a case where pre-hardened steel (hardness HRC58) is cut with a two-blade ball end mill having a diameter of 1 mm.
  • the processing conditions are a rotation speed of 9000 rpm, a feed rate of 40 mm / min, an axial cut of 0.1 mm, and a radial cut of 0.932 mm. It is.
  • the cutting force indicates a component in a direction perpendicular to the feed direction. Cutting force increases with the development of flank wear.
  • FIG. 5 is a diagram showing an example of the result of analyzing the magnitude of strain generated in the rotary tool.
  • the magnitude of strain generated in the tool when a load of 1 N was applied to the tool tip was determined by finite element analysis. However, the tool was assumed to have a diameter of 1 mm, a neck length of 10 mm, a tool material of cemented carbide, and a Young's modulus of 570 GPa and a Poisson's ratio of 0.24.
  • the strain was maximum near the boundary between the taper and neck of the tool, which was 180 ⁇ ST. For this reason, it is desirable that the stress-stimulated illuminant portion 10 be installed in the vicinity of the boundary between the tapered portion and the neck portion.
  • FIG. 6 is a diagram showing an example of the relationship between the flank wear of the tool and the magnitude of the maximum strain generated in the tool.
  • the horizontal axis represents flank wear, and the vertical axis represents the maximum strain.
  • the maximum strain is calculated from FIG. 4 and FIG. The strain becomes 400 ⁇ ST or more and increases with increasing flank wear.
  • FIG. 7 is a diagram illustrating an example of the relationship between the magnitude of strain and the emission intensity.
  • the horizontal axis indicates the magnitude of strain, and the vertical axis indicates the emission intensity.
  • a stress illuminant sensor used here as an example, a strontium aluminate SrAl 2 O 4 : Eu as a stress illuminant material, an epoxy resin as a binder, a weight ratio of 1: 1, and a resin prepared to an elastic modulus of 2000 MP It is a sensor.
  • the emission intensity also depends on the strain rate, and this data shows the data for a strain rate of 3370 ⁇ ST / s.
  • the emission intensity increases with strain at a strain of 200 ⁇ ST or more.
  • FIG. 8 is a diagram showing an example of the relationship between the flank wear of the tool and the light emission intensity.
  • the horizontal axis represents flank wear, and the vertical axis represents emission intensity.
  • the emission intensity was calculated from FIG. 6 and FIG.
  • the emission intensity is 80 cps or more, and an issuance intensity that can be detected by a CCD or the like of a commercially available digital camera can be obtained.
  • the emission intensity increases with increasing flank wear.
  • the strain rate increases, the light emission intensity also increases, and the strain rate applied to the tool depends on the rotational speed. For example, when the rotational speed is 6000 rpm, the strain rate of the tool is 40000 ⁇ ST / s or more. For this reason, the light emission intensity stronger than FIG. 8 is actually obtained.
  • the shank part 14 is a grip part of a tool, and it is desirable not to provide the stress light emitter part 10 in the shank part 14 in order to ensure gripping force and reduce swinging.
  • the blade portion 11 is a portion for processing the workpiece 2, and light is blocked by the workpiece 2 and chips, so it is desirable that the blade portion 11 is not provided with the stress light emitter portion 10.
  • the member including the stress illuminant that emits light according to the stress is provided in the stress concentration portion of the rotary tool, the tool breakage and the cutting resistance are detected even during machining with a small diameter tool. It becomes possible.
  • FIG. 9 is an example of a configuration diagram of a machine tool control system using a rotary tool having a stress light emitter.
  • the machine tool 3 is provided with a tool 1 and a workpiece 2.
  • the machine tool control system includes a light receiving unit 41, a calculation unit 42, a machining determination unit 43, and a machine tool control unit 44.
  • the light receiving part 41 measures the light emission intensity of the stress light emitter part 10 of the tool 1.
  • the light receiving unit 41 is composed of, for example, a photodiode or a CCD.
  • the calculation unit 42 calculates a target correction value for the feed rate of the machine tool according to the light emission intensity measured by the light receiving unit 41.
  • the machining determination unit 43 determines whether the tool 1 is machining the workpiece 2. For example, the machining determination unit 43 has a function of storing a machining start time, a tool path, and a workpiece shape data before machining, a function of calculating a workpiece shape during machining, and an elapsed time from the start of machining. It has a function of determining whether or not the tool 1 is processing the workpiece 2.
  • the machining determination unit 42 for example, a function of storing workpiece shape data before machining, a function of calculating the workpiece shape during machining, a function of detecting the position of the machine tool, and the current of the machine tool It has a function of determining whether the tool 1 is processing the workpiece 2 from the position.
  • the machine tool control unit 44 transmits a control signal for controlling the machine tool 3 according to the calculation result of the calculation unit 42.
  • the control signal includes, for example, a stop or acceleration / deceleration command for some or all axes of the machine tool. Further, it may include a retreat operation command for the machine tool.
  • FIG. 10 shows an example of a flowchart of a method for controlling the feed rate of the machine tool according to the light emission intensity.
  • the light emission intensity is measured by the light receiving unit 41 (S101).
  • the feed rate at which the light emission intensity specified by the calculation unit 42 is obtained is calculated (S102).
  • the machine tool control unit 44 when the light emission intensity is lower than the target light emission intensity so as to coincide with the target light emission intensity set so as to become a target processing load, the feed rate is increased, and the light emission intensity becomes If it is higher than the target light emission intensity, a command to decrease the feed rate is transmitted and the machine tool 3 is controlled (S103).
  • it determines with the process determination part 43 not being in process you may make it not control.
  • the fast feed speed may be set or a predetermined feed speed may be set.
  • the light emission intensity is larger than a certain value, it may be determined that the tool is broken or overloaded, and the machine tool feed stop may be commanded. Further, a retreat operation may be commanded after the stop.
  • the light from the stress-stimulated illuminant unit 10 is measured by the light receiving unit 41, it is desirable to process in a dry environment without using a cutting fluid.
  • air or mist spraying may be used.
  • a cutting fluid is unavoidably used, it is desirable to use a composition that transmits the light of the stress-stimulated luminescent material, for example, a transparent water-soluble cutting fluid such as a soluble type.
  • the excitation light is preferably light having a wavelength different from the emission wavelength of the stress-stimulated illuminant, and it is desirable to install a filter that transmits the emission wavelength and attenuates or blocks the excitation light in the light receiving unit 41.
  • the machining load can be detected based on the light emitted from the stress light emitter provided on the rotary tool, and the machine tool can be controlled in accordance with the detected machining load. Then, by detecting the light emission of the stress light emitter, the machining load can be detected even with a small diameter tool.
  • the deflection of the tool is stable and can be processed with high accuracy. Furthermore, the breakage of the tool can be prevented beforehand by monitoring the load applied to the tool.
  • FIG. 11 shows an example of a flowchart of a machine tool control system for controlling the feed of the machine tool and the tool path.
  • the movement of the tool 1 is started (S111), and when the approach to the workpiece 2 is started, the light emission intensity is measured by the light receiving unit 41 (S112).
  • the stress light emitter 10 emits light, so that it is determined that the machining is started when the emission intensity exceeds the threshold value (S113).
  • the set tool path is corrected using the position determined as the machining start as a reference, and the workpiece 2 is machined (S114).
  • the correction of the tool path for example, there is a method of offsetting the difference between the set machining start position and the measured machining start position. Moreover, the method of correcting the setting value of a tool diameter or a tool length using a tool diameter correction function or a tool length correction function may be used.
  • the machining start position is detected based on the position where the light emission of the stress light emitter 10 provided on the rotary tool is started, and the tool path is corrected based on the detected machining start position. Can do.
  • the calculation unit 42 determines the breakage of the tool according to the light emission intensity measured by the light receiving unit 41. Further, the machine tool control unit 44 transmits a control signal for controlling the machine tool 3 based on the determination result of the tool breakage.
  • the control signal includes, for example, a stop or acceleration / deceleration command for some or all axes of the machine tool. Further, it may include a retreat operation command for the machine tool. Furthermore, you may include the instruction
  • FIG. 12 is a diagram illustrating an example of the relationship between the light emission intensity and the indentation depth in a three-point bending test of a resin plate including a stress light emitter.
  • the horizontal axis represents the indentation depth, and the vertical axis represents the emission intensity.
  • the stress-stimulated illuminant linearly increases the luminescence intensity as the strain increases due to deformation, but exhibits a stronger luminescence intensity when the strain associated with the fracture occurs than when deformed. For this reason, it is possible to determine whether or not it has been destroyed based on the magnitude of the emission intensity. Therefore, the first method for determining tool breakage is determined as breakage when the light emission intensity measured by the light receiving unit 41 is greater than a certain threshold value.
  • the stress light emitter 10 continues to emit light due to the processing load, but if the tool tip breaks and the tip of the tool is lost, no processing load is generated, so the stress light emitter 10 does not emit light. For this reason, even if it is determined that the processing is being performed by the processing determination unit 43, a breakage is determined when the light emission intensity measured by the light receiving unit 41 is less than or equal to a threshold value. Further, in the present method, the breakage can be detected even when the stress-stimulated luminescent part 10 is scattered together with the blade part 11 due to breakage.
  • FIG. 13 is a diagram illustrating a third method for determining tool breakage.
  • the light receiving unit 41 is an optical sensor capable of acquiring a light emission shape such as a CCD.
  • a light emission shape such as a CCD.
  • FIG. 14 shows an example of the structure of the tool 1 suitable for the third tool breakage determination method.
  • a circumferential slit 101 is provided in a part of the stress light emitter 10 so that the stress light emitter 10 is reliably broken when the tool is broken.
  • the slit 101 in the circumferential direction may be a groove that completely divides the stress light emitter 10 or may not be completely divided.
  • the thickness of the stress light emitter 10 may be partially reduced, such as a V groove. It may be a groove.
  • FIG. 15 is an example of another structure of the tool 1 suitable for the third tool breakage determination method.
  • An axial slit 102 is provided in a part of the stress light emitter 10 so that the stress light emitter 10 is easily broken when the tool is broken.
  • the present embodiment it is possible to detect breakage even when the rotary tool breaks when the processing load is small, based on the light emitted from the stress light emitter provided on the rotary tool.
  • this invention is not limited to the above-mentioned Example, Various modifications are included.
  • the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described.
  • a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment.

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  • Mechanical Engineering (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Abstract

Provided are: a rotary tool with which tool breakage and machining resistance can be detected even during machining even in machining in which the machining load is small such as with a small diameter tool; and a machine tool control system capable of controlling a machine tool according to machining load. The rotary tool is for cutting or grinding a workpiece and has a member comprising a stress-luminescent material on a portion of the tool surface. The machine tool control system comprises a light-receiving unit for measuring the emitted light intensity of the stress-luminescent material provided on the rotary tool, a calculation unit for calculating feed rate instructions according to the emitted light intensity, and a machine tool control unit for transmitting a signal to control the machine tool according to the calculation results, and controls the machine tool so that the emitted light intensity of the stress-luminescent material approaches a previously determined value.

Description

応力発光体を有する回転工具、その製造方法および工作機械制御システムRotating tool having stress light emitter, manufacturing method thereof, and machine tool control system

 本発明は、応力発光体を有する回転工具、その製造方法および工作機械制御システムに関する。 The present invention relates to a rotary tool having a stress light emitter, a manufacturing method thereof, and a machine tool control system.

 本技術分野の背景技術として、特開2009-291916号公報(特許文献1)には、「工作機械は、回転軸11を非接触支持する複数組の磁気軸受13、14、15を制御する磁気軸受制御手段と、砥石2の切込み量および送り速度を制御する加工制御手段30とを備えている。磁気軸受制御手段は、制御電流から切削抵抗をリアルタイムで算出する加工抵抗演算手段42を有している。加工制御手段30は、切削抵抗が一定になるように送り速度を制御する。」(要約参照)と記載されている。 As background art of this technical field, Japanese Unexamined Patent Application Publication No. 2009-291916 (Patent Document 1) states that “a machine tool controls a plurality of magnetic bearings 13, 14, 15 for supporting a rotating shaft 11 in a non-contact manner. Bearing control means and processing control means 30 for controlling the cutting amount and feed speed of the grindstone 2. The magnetic bearing control means has processing resistance calculation means 42 for calculating cutting resistance from the control current in real time. The machining control means 30 controls the feed rate so that the cutting force becomes constant "(see the summary).

 また、特開2010-186374号公報(特許文献2)には、「少なくとも素材形状情報および切り込み量を指定した加工プログラムに基づいて工具パスを生成し主軸および可動軸を有する工作機械を制御する数値制御装置10において、サーボモータ19またはスピンドルモータ22の負荷を検出する電流検出器24、26と、サーボモータ19の位置を検出する位置・速度検出器25と、電流検出器24、26により検出された負荷電流値が無負荷状態であるか否か判断し、負荷電流値が無負荷状態と判断されたとき、実行中の工具パス指令を読み込み、前記素材形状情報、前記工具パス指令、およびサーボモータ19の位置情報に基づき、工具位置が素材形状の内側か外側かを求め、内側であると判別された場合に工具折損と判断する工具折損検出機能を有する工作機械の数値制御装置。」(要約参照)と記載されている。 JP 2010-186374 A (Patent Document 2) states that “a numerical value for generating a tool path based on at least a machining program designating material shape information and a cutting amount and controlling a machine tool having a main shaft and a movable shaft”. In the control device 10, the current detectors 24 and 26 for detecting the load of the servo motor 19 or the spindle motor 22, the position / speed detector 25 for detecting the position of the servo motor 19, and the current detectors 24 and 26 are detected. When the load current value is determined to be no load, and when the load current value is determined to be no load, the current tool path command is read and the material shape information, the tool path command, and the servo are read. Based on the position information of the motor 19, it is determined whether the tool position is inside or outside the material shape, and if it is determined to be inside, it is determined that the tool is broken. That the numerical controller of a machine tool having a tool breakage detection. "Is described as (see Abstract).

 また、米国特許第6628375号明細書(特許文献3)には、「応力発光材料を用いた応力または応力分布の測定方法と測定システム」が開示されており、「材料自体が応力に比例して発光する応力発光材料を含む被験体に応力を加え、該被験体における応力発光材料の発光強度に基づいて該被験体における応力分布を可視化する。被験体における応力発光材料の発光強度を測定し、該測定値と前記応力発光材料の発光強度と応力との相関データとを比較することにより、該被験体における応力または応力分布を求めることができる。」(要約参照)と記載されている。 In addition, US Pat. No. 6,628,375 (Patent Document 3) discloses a “measurement method and measurement system of stress or stress distribution using a stress luminescent material”, and “the material itself is proportional to the stress. Stress is applied to a subject including a stress-stimulated luminescent material that emits light, and the stress distribution in the subject is visualized based on the luminescence intensity of the stress-stimulated luminescent material in the subject. The stress or stress distribution in the subject can be determined by comparing the measured value with the correlation data between the light emission intensity and stress of the stress-stimulated luminescent material ”(see summary).

特開2009-291916号公報JP 2009-291916 A 特開2010-186374号公報JP 2010-186374 A 米国特許第6628375号明細書US Pat. No. 6,628,375

 特許文献1には、切削抵抗を回転主軸の制御電流から算出して切削抵抗が一定になるように送り速度を制御する工作機械が記載されている。 Patent Document 1 describes a machine tool that calculates a cutting force from a control current of a rotating spindle and controls a feed rate so that the cutting force becomes constant.

 また、特許文献2には、サーボモータも含めたモータの負荷電流から無負荷状態を検出して、工具折損を検出する機能を有する工作機械の数値制御装置が記載されている。しかし、金型の仕上加工などに使用される回転小径工具、例えば直径3mm以下の工具については、回転数が大きく、加工負荷が小さいため、回転主軸のモータ電流から加工に関する負荷信号を抽出することは困難である。また、工作機械のサーボモータについても工作機械のテーブル及び被加工物の移動に必要なモータ負荷に対して回転小径工具の加工負荷は小さいため、検出することは困難である。 Further, Patent Document 2 describes a numerical control device for a machine tool having a function of detecting tool breakage by detecting a no-load state from a load current of a motor including a servo motor. However, for rotating small-diameter tools used for mold finishing and the like, for example, tools having a diameter of 3 mm or less, the rotational speed is large and the machining load is small. Therefore, a load signal related to machining is extracted from the motor current of the rotating spindle. It is difficult. Further, it is difficult to detect the servo motor of the machine tool because the machining load of the rotating small-diameter tool is small with respect to the motor load necessary for moving the table of the machine tool and the workpiece.

 特許文献3には、応力発光材料を用いた被験体の応力または応力分布の測定方法が記載されているが、回転工具の折損や加工負荷を検出することは開示されていない。 Patent Document 3 describes a method for measuring the stress or stress distribution of a subject using a stress-stimulated luminescent material, but does not disclose the detection of breakage or processing load of a rotating tool.

 そこで本発明は、小径工具などの加工負荷を検出することが困難な加工においても、加工中の工具折損や切削抵抗を検出することが可能な回転工具を提供することを目的とする。 Therefore, an object of the present invention is to provide a rotary tool capable of detecting tool breakage or cutting resistance during machining even in machining where it is difficult to detect a machining load such as a small-diameter tool.

 上記課題を解決するために、例えば請求の範囲に記載の構成を採用する。
  本願は上記課題を解決する手段を複数含んでいるが、本発明の回転工具の一例を挙げるならば、被加工物を切削または研削する回転工具であって、工具表面の一部に、応力発光体を含む部材を有するものである。
In order to solve the above problems, for example, the configuration described in the claims is adopted.
Although the present application includes a plurality of means for solving the above-described problems, if an example of the rotary tool of the present invention is given, a rotary tool for cutting or grinding a workpiece, and a stress emission on a part of the tool surface. It has a member containing a body.

 また、本発明の工作機械制御システムの一例を挙げるならば、工具表面の一部に応力発光体を含む部材を有し、被加工物を切削または研削する回転工具を備える工作機械を制御する工作機械制御システムであって、前記回転工具に設けられた前記応力発光体の発光強度を測定する受光部と、発光強度に応じて送り速度指令を演算する演算部と、演算結果に応じて工作機械を制御する信号を発信する工作機械制御部を有し、発光強度が予め定められた値に近づくように工作機械を制御するものである。 An example of a machine tool control system according to the present invention is a machine that controls a machine tool having a rotary tool for cutting or grinding a workpiece, the member having a stress light emitter on a part of the tool surface. A machine control system, a light receiving unit for measuring the light emission intensity of the stress light emitter provided on the rotary tool, a calculation unit for calculating a feed rate command according to the light emission intensity, and a machine tool according to the calculation result A machine tool control unit that transmits a signal for controlling the machine tool, and controls the machine tool so that the light emission intensity approaches a predetermined value.

 また、本発明の工作機械制御システムの他の一例を挙げるならば、工具表面の一部に、応力発光体を含む部材を有し、被加工物を切削または研削する回転工具を備える工作機械を制御する工作機械制御システムであって、前記回転工具に設けられた前記応力発光体の発光を測定する受光部と、前記受光部で測定した応力発光体の発光に応じて前記回転工具の折損を判定する演算部と、を有するものである。 In another example of the machine tool control system according to the present invention, a machine tool including a rotary tool for cutting or grinding a workpiece having a member including a stress light emitter on a part of a tool surface. A machine tool control system for controlling, a light receiving unit for measuring light emission of the stress light emitter provided on the rotary tool, and a breakage of the rotary tool according to light emission of the stress light emitter measured by the light receiver. And an arithmetic unit for determination.

 本発明によれば、小径工具などの加工負荷の検出が困難な工具においても、加工中も工具折損や切削抵抗を検出することが可能な回転工具を提供することができる。また、検出した加工負荷に応じて工作機械を制御することが可能な工作機械制御システムを提供することができる。 According to the present invention, it is possible to provide a rotary tool capable of detecting tool breakage and cutting resistance even during machining even in a tool where it is difficult to detect a machining load such as a small-diameter tool. Moreover, the machine tool control system which can control a machine tool according to the detected process load can be provided.

 上記した以外の課題、構成及び効果は、以下の実施形態の説明により明らかにされる。 Issues, configurations, and effects other than those described above will be clarified by the following description of the embodiments.

本発明の実施例1の応力発光体を塗布した回転工具を示す図である。It is a figure which shows the rotary tool which apply | coated the stress light-emitting body of Example 1 of this invention. 本発明の実施例1の応力発光体を塗布した回転工具の製造方法を示す図である。It is a figure which shows the manufacturing method of the rotary tool which apply | coated the stress light-emitting body of Example 1 of this invention. 応力発光体樹脂の厚みと発光強度の関係の一例を示す図である。It is a figure which shows an example of the relationship between the thickness of stress luminescent resin, and light emission intensity. 工具の逃げ面摩耗と切削力の関係の一例を示す図である。It is a figure which shows an example of the relationship between flank wear of a tool, and cutting force. 回転工具に生じるひずみの大きさを解析した結果の一例を示す図である。It is a figure which shows an example of the result of having analyzed the magnitude | size of the distortion which arises in a rotary tool. 工具の逃げ面摩耗と工具に生じる最大ひずみの大きさの関係の一例を示す図である。It is a figure which shows an example of the relationship between the flank wear of a tool, and the magnitude | size of the largest distortion which arises in a tool. 発光強度とひずみの大きさの関係の一例を示す図である。It is a figure which shows an example of the relationship between emitted light intensity and the magnitude | size of distortion. 工具の逃げ面摩耗と発光強度の関係の一例を示す図である。It is a figure which shows an example of the relationship between flank wear of a tool, and light emission intensity. 本発明の実施例2の応力発光体を有する回転工具を用いた工作機械制御システムの構成図である。It is a block diagram of the machine tool control system using the rotary tool which has a stress light-emitting body of Example 2 of this invention. 本発明の実施例2の発光強度に応じて工作機械の送り速度を制御する方法のフローチャートである。It is a flowchart of the method of controlling the feed rate of a machine tool according to the emitted light intensity of Example 2 of this invention. 本発明の実施例3の工作機械の送りおよび工具経路を制御するフローチャートである。It is a flowchart which controls the feed and tool path | route of the machine tool of Example 3 of this invention. 応力発光体を含む樹脂プレートの三点曲げ試験における、押し込み深さと発光強度の関係の一例を示す図である。It is a figure which shows an example of the relationship between indentation depth and emitted light intensity in the three-point bending test of the resin plate containing a stress light-emitting body. 本発明の実施例4の第三の工具折損判定方法を示す図である。It is a figure which shows the 3rd tool breakage determination method of Example 4 of this invention. 実施例4の応力発光体部に円周方向スリットを有する工具構造を示す図である。It is a figure which shows the tool structure which has the circumferential direction slit in the stress light-emitting body part of Example 4. FIG. 実施例4の応力発光体部に軸方向スリットを有する工具構造を示す図である。It is a figure which shows the tool structure which has an axial slit in the stress light-emitting body part of Example 4.

 以下、本発明の実施例を図面を用いて説明する。なお、実施例を説明するための各図において、同一の構成要素には同一の名称、符号を付して、その繰り返しの説明を省略する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings for explaining the embodiments, the same components are denoted by the same names and symbols, and the repeated explanation thereof is omitted.

 本実施例は、応力発光体を有する回転工具の実施例である。 This example is an example of a rotary tool having a stress light emitter.

 図1は、応力発光体を塗布した回転工具の構造を示す図である。工具1は刃部11、首部12、テーパ部13、シャンク部14、応力発光体部10を有する。
刃部11は、切れ刃または砥粒を有する砥石であり、被加工物2を切削または研削加工する。
首部12は、刃部11に連続する部分で、刃部11とほぼ同じ、或いは刃部11以下の直径を有する丸棒部である。
テーパ部13は、首部12とシャンク部14の間で直径が変化する部分である。
シャンク部14は、工具1を工作機械4に接続する際にコレットやホルダ等により把持される。
なお、工具1は必ずしもテーパ部13を有する必要はなく、首部12とテーパ部14の直径が等しい工具であっても良い。
FIG. 1 is a diagram showing the structure of a rotary tool coated with a stress luminescent material. The tool 1 has a blade part 11, a neck part 12, a taper part 13, a shank part 14, and a stress light emitter part 10.
The blade portion 11 is a grindstone having a cutting edge or abrasive grains, and cuts or grinds the workpiece 2.
The neck portion 12 is a portion that is continuous with the blade portion 11, and is a round bar portion that has substantially the same diameter as the blade portion 11 or has a diameter equal to or smaller than the blade portion 11.
The taper portion 13 is a portion where the diameter changes between the neck portion 12 and the shank portion 14.
The shank portion 14 is gripped by a collet, a holder or the like when the tool 1 is connected to the machine tool 4.
In addition, the tool 1 does not necessarily need to have the taper part 13, and a tool with the same diameter of the neck part 12 and the taper part 14 may be sufficient.

 応力発光体部10は、工具表面ひずみエネルギーが与えられることで発光する応力発光粒子とバインダで構成される。応力発光粒子は、例えばユウロピウム添加アルミン酸ストロンチウムSrAl:Euがある。バインダは、応力発光粒子を含有させて複合化し、応力発光体部を形成するための材料であり、エポキシ樹脂等の有機物質、ガラス等の無機物質のいずれでも良く、また、両者を混合したものも含む概念である。 The stress-stimulated luminescent part 10 is composed of stress-stimulated luminescent particles and a binder that emit light when given tool surface strain energy. Examples of the stress luminescent particles include europium-added strontium aluminate SrAl 2 O 4 : Eu. The binder is a material for forming a stress-stimulated luminescent part by containing stress-luminescent particles and may be either an organic substance such as an epoxy resin or an inorganic substance such as glass, or a mixture of both. It is a concept that also includes

 ここで、応力発光粒子とは、弾性領域で力学刺激に対して、刺激の強度に比例して発光強度が大きくなり、さらに繰り返し刺激に対してもそれに応じて発光する現象を発現する材料である。 Here, stress-stimulated luminescent particles are materials that exhibit a phenomenon in which the luminescence intensity increases in proportion to the intensity of the stimulus in response to a mechanical stimulus in the elastic region, and further emits light in response to the repeated stimulus. .

 これまでに、応力発光粒子は、スタッフド・トリジマイト構造と呼ばれる結晶構造を母体構造として持つ、アルミン酸塩化合物(SrAl2O4:Eu2+)やケイ酸塩化合物、アルミナケイ酸塩化合物、リン酸塩化合物、ペロブスカイト系化合物など多くの材料にて応力発光現象が確認されている。また、これらの材料からは紫外から近赤外までさまざまな波長で発光することが確認されている。 So far, stress-stimulated luminescent particles have a crystal structure called stuffed tridymite structure as the matrix structure, aluminate compounds (SrAl2O4: Eu2 +), silicate compounds, alumina silicate compounds, phosphate compounds, Stress emission phenomenon has been confirmed in many materials such as perovskite compounds. Further, it has been confirmed that these materials emit light at various wavelengths from ultraviolet to near infrared.

 図2は、工具1の表面に応力発光体部10を塗布する、回転工具の製造方法の一例を説明する図である。工具1の刃部11および首部12の応力発光体を塗布しない部分にマスキング21を施す(図2(b))。マスキング材は例えばフッ素樹脂やレジスト材料など、剥離、溶融などにより除去が可能な材料とする。次に、応力発光粒子とバインダを混合した液体22に工具1を所定の高さまで浸漬し(図2(c))、工具1を引き上げる(図2(d))。このとき、引き上げ速度と液体の粘度から応力発光体部10の厚みを制御することが可能である。応力発光粒子の濃度が高いほど大きな発光強度が得られるが、液体が高粘度になり厚みの制御が難しくなるため、10000mPa・s程度までとすることが望ましい。次に工具1を静置し、塗布された応力発光体とバインダの混合液を硬化させる。最後にマスキング21を除去し、応力発光体部10を形成する(図2(e))。 FIG. 2 is a diagram for explaining an example of a method for manufacturing a rotary tool in which the stress-stimulated luminescent body 10 is applied to the surface of the tool 1. Masking 21 is applied to the portions of the blade 1 and the neck 12 of the tool 1 where the stress luminescent material is not applied (FIG. 2B). The masking material is a material that can be removed by peeling, melting, or the like, such as a fluororesin or a resist material. Next, the tool 1 is dipped to a predetermined height in a liquid 22 in which stress-luminescent particles and a binder are mixed (FIG. 2 (c)), and the tool 1 is pulled up (FIG. 2 (d)). At this time, it is possible to control the thickness of the stress-stimulated light emitter 10 from the pulling speed and the viscosity of the liquid. As the concentration of the stress-stimulated luminescent particles is higher, a larger luminescence intensity can be obtained. However, since the liquid becomes highly viscous and it is difficult to control the thickness, it is desirable to set the concentration to about 10,000 mPa · s. Next, the tool 1 is allowed to stand, and the applied mixed solution of the stress luminescent material and the binder is cured. Finally, the masking 21 is removed to form the stress-stimulated light emitter 10 (FIG. 2 (e)).

 なお、応力発光体部10の形成方法は前記方法に限ったものではなく、この他にもたとえば、応力発光体を含む樹脂テープを工具1に貼っても良い。樹脂テープとは、応力発光体を有する樹脂部材に粘着部材を塗布または貼り付けたものであり、粘着部分を工具に取り付ける。この場合、他の構成よりも容易に取り付けることができる。粘着部分と樹脂部分は別体でなくともよく、固化する前の樹脂部材に応力発光体を混合し、一部が固化する前に工具に取り付けるものであってもよい。この場合は、樹脂部材と粘着部材とが一体となる構成であり、それぞれを別に用意しなくとも製造でき、工具から応力発光体まで粘着部材を介さないため、応力がより伝達しやすくなる。 In addition, the formation method of the stress light-emitting body part 10 is not restricted to the said method, For example, you may affix the resin tape containing a stress light-emitting body on the tool 1. FIG. The resin tape is obtained by applying or pasting an adhesive member to a resin member having a stress light emitter, and attaching the adhesive portion to a tool. In this case, it can be attached more easily than other configurations. The adhesive portion and the resin portion do not have to be separate bodies, and the stress light emitter may be mixed with the resin member before solidification, and attached to the tool before part of the resin member solidifies. In this case, since the resin member and the adhesive member are integrated, they can be manufactured without preparing each separately, and since the adhesive member is not interposed from the tool to the stress light emitter, the stress is more easily transmitted.

 また、応力発光体部10は、応力発光体を含むコーティング部、または工具母材とコーティングの間に応力発光体層を有する部分、工具母材に応力発光体をドープまたは混合した部分としても良い。 Further, the stress light emitter 10 may be a coating portion including the stress light emitter, a portion having a stress light emitter layer between the tool base material and the coating, or a portion where the stress light emitter is doped or mixed in the tool base material. .

 図3は、応力発光体樹脂の厚みと発光強度の関係の一例を示す図である。横軸は応力発光体樹脂の厚みを、縦軸は応力発光体樹脂に同じ荷重を負荷した場合の発光強度を示している。発光強度は、応力発光体樹脂の厚みが0.2mm未満までは厚みに応じて変化するが、0.2mm以上では一定値となる。このため、十分な発光強度を得るため、また製造時の厚みのばらつきに対するロバスト性向上のため、応力発光体部の厚みは0.2mm以上とすることが望ましい。 FIG. 3 is a diagram showing an example of the relationship between the thickness of the stress luminescent resin and the light emission intensity. The horizontal axis represents the thickness of the stress luminescent resin, and the vertical axis represents the luminescence intensity when the same load is applied to the stress luminescent resin. The light emission intensity changes according to the thickness until the thickness of the stress-stimulated luminescent resin is less than 0.2 mm, but becomes a constant value when the thickness is 0.2 mm or more. For this reason, in order to obtain sufficient light emission intensity and to improve robustness with respect to thickness variations during manufacturing, it is desirable that the thickness of the stress-stimulated luminescent part is 0.2 mm or more.

 図4は、工具の逃げ面摩耗と切削力の関係の一例を示す図である。横軸は逃げ面摩耗を、縦軸は切削力を示している。直径1mmの2枚刃ボールエンドミルでプレハードン鋼(硬さHRC58)を切削加工した場合であり、加工条件は回転数9000rpm、送り速度40mm/min、軸方向切込み0.1mm、径方向切込み0.932mmである。切削力は送り方向に対して垂直な方向の成分を示す。切削力は逃げ面摩耗の進展と共に増加する。 FIG. 4 is a diagram showing an example of the relationship between tool flank wear and cutting force. The horizontal axis represents flank wear, and the vertical axis represents cutting force. This is a case where pre-hardened steel (hardness HRC58) is cut with a two-blade ball end mill having a diameter of 1 mm. The processing conditions are a rotation speed of 9000 rpm, a feed rate of 40 mm / min, an axial cut of 0.1 mm, and a radial cut of 0.932 mm. It is. The cutting force indicates a component in a direction perpendicular to the feed direction. Cutting force increases with the development of flank wear.

 図5は、回転工具に生じるひずみの大きさを解析した結果の一例を示す図である。工具先端に1Nの荷重を負荷した場合の工具に生じるひずみの大きさを有限要素解析により求めた。ただし、工具は直径1mm、首部長さ10mm、工具材質は超硬合金を想定し、ヤング率570GPa、ポアソン比0.24とした。工具のテーパ部と首部の境界近傍でひずみが最大となり、180μSTであった。このため、応力発光体部10はテーパ部と首部の境界近傍に設置されることが望ましい。 FIG. 5 is a diagram showing an example of the result of analyzing the magnitude of strain generated in the rotary tool. The magnitude of strain generated in the tool when a load of 1 N was applied to the tool tip was determined by finite element analysis. However, the tool was assumed to have a diameter of 1 mm, a neck length of 10 mm, a tool material of cemented carbide, and a Young's modulus of 570 GPa and a Poisson's ratio of 0.24. The strain was maximum near the boundary between the taper and neck of the tool, which was 180 μST. For this reason, it is desirable that the stress-stimulated illuminant portion 10 be installed in the vicinity of the boundary between the tapered portion and the neck portion.

 図6は、工具の逃げ面摩耗と工具に生じる最大ひずみの大きさの関係の一例を示す図である。横軸は逃げ面摩耗を、縦軸は最大ひずみの大きさを示している。最大ひずみは、図4および図5から計算される。ひずみは、400μST以上になり、逃げ面摩耗の増加と共に増加する。 FIG. 6 is a diagram showing an example of the relationship between the flank wear of the tool and the magnitude of the maximum strain generated in the tool. The horizontal axis represents flank wear, and the vertical axis represents the maximum strain. The maximum strain is calculated from FIG. 4 and FIG. The strain becomes 400 μST or more and increases with increasing flank wear.

 図7は、ひずみの大きさと発光強度の関係の一例を示す図である。横軸はひずみの大きさを、縦軸は発光強度を示している。ここで例示に用いた応力発光体センサとしては、応力発光体材料としてアルミ酸ストロンチウムSrAl:Eu、バインダとしてエポキシ樹脂を使い、重量比1:1とした、弾性率2000MPに調合した樹脂センサである。発光強度はひずみ速度にも依存し、このデータはひずみ速度3370μST/sの場合のデータを示す。発光強度は、ひずみ200μST以上でひずみと共に増加していく。 FIG. 7 is a diagram illustrating an example of the relationship between the magnitude of strain and the emission intensity. The horizontal axis indicates the magnitude of strain, and the vertical axis indicates the emission intensity. As the stress illuminant sensor used here as an example, a strontium aluminate SrAl 2 O 4 : Eu as a stress illuminant material, an epoxy resin as a binder, a weight ratio of 1: 1, and a resin prepared to an elastic modulus of 2000 MP It is a sensor. The emission intensity also depends on the strain rate, and this data shows the data for a strain rate of 3370 μST / s. The emission intensity increases with strain at a strain of 200 μST or more.

 図8は、工具の逃げ面摩耗と発光強度の関係の一例を示す図である。横軸は逃げ面摩耗を、縦軸は発光強度を示している。発光強度は、図6および図7から計算した。発光強度は80cps以上となり、市販のデジタルカメラのCCD等でも検出可能な発行強度が得られる。発光強度は、逃げ面摩耗の増加と共に増加する。 FIG. 8 is a diagram showing an example of the relationship between the flank wear of the tool and the light emission intensity. The horizontal axis represents flank wear, and the vertical axis represents emission intensity. The emission intensity was calculated from FIG. 6 and FIG. The emission intensity is 80 cps or more, and an issuance intensity that can be detected by a CCD or the like of a commercially available digital camera can be obtained. The emission intensity increases with increasing flank wear.

 なお、ひずみ速度が大きくなると発光強度も大きくなり、工具に負荷されるひずみ速度は回転数に依存する。例えば回転数6000rpmの場合、工具のひずみ速度は40000μST/s以上となる。このため、実際には図8よりも強い発光強度が得られる。 Note that as the strain rate increases, the light emission intensity also increases, and the strain rate applied to the tool depends on the rotational speed. For example, when the rotational speed is 6000 rpm, the strain rate of the tool is 40000 μST / s or more. For this reason, the light emission intensity stronger than FIG. 8 is actually obtained.

 シャンク部14は工具の把持部であり、把持力の確保や振れ回りの低減のため、シャンク部14には応力発光体部10を設けないようにすることが望ましい。また、刃部11は、被加工物2を加工する部分であり、被加工物2や切り屑により光が遮られるため、刃部11には応力発光体部10を設けないことが望ましい。 The shank part 14 is a grip part of a tool, and it is desirable not to provide the stress light emitter part 10 in the shank part 14 in order to ensure gripping force and reduce swinging. Further, the blade portion 11 is a portion for processing the workpiece 2, and light is blocked by the workpiece 2 and chips, so it is desirable that the blade portion 11 is not provided with the stress light emitter portion 10.

 本実施例によれば、回転工具の応力集中部に、応力に応じて発光する応力発光体を含む部材を設けたので、小径工具による加工においても、加工中も工具折損や切削抵抗を検出することが可能となる。 According to this embodiment, since the member including the stress illuminant that emits light according to the stress is provided in the stress concentration portion of the rotary tool, the tool breakage and the cutting resistance are detected even during machining with a small diameter tool. It becomes possible.

 本実施例では、実施例1の応力発光体を有する回転工具を用いて工作機械を制御する工作機械制御システムの例を説明する。 In the present embodiment, an example of a machine tool control system for controlling a machine tool using a rotary tool having the stress light emitter of the first embodiment will be described.

 図9は、応力発光体を有する回転工具を用いた工作機械制御システムの構成図の一例である。
工作機械3には、工具1と被加工物2が設置されている。
工作機械制御システムは、受光部41、演算部42、加工判定部43、工作機械制御部44を有する。
FIG. 9 is an example of a configuration diagram of a machine tool control system using a rotary tool having a stress light emitter.
The machine tool 3 is provided with a tool 1 and a workpiece 2.
The machine tool control system includes a light receiving unit 41, a calculation unit 42, a machining determination unit 43, and a machine tool control unit 44.

 受光部41は、工具1の応力発光体部10の発光強度を測定する。受光部41は、例えばフォトダイオードやCCDで構成する。 The light receiving part 41 measures the light emission intensity of the stress light emitter part 10 of the tool 1. The light receiving unit 41 is composed of, for example, a photodiode or a CCD.

 演算部42は、受光部41で測定した発光強度に応じて、工作機械の送り速度の目標修正値を演算する。 The calculation unit 42 calculates a target correction value for the feed rate of the machine tool according to the light emission intensity measured by the light receiving unit 41.

 加工判定部43は、工具1が被加工物2を加工しているかを判定する。加工判定部43は、例えば加工開始時間と工具経路と加工前の被加工物形状データを記憶する機能と、加工中の被加工物形状を演算する機能と、加工開始からの経過時間で現時点において工具1が被加工物2を加工中か否かを判定する機能を有する。または、加工判定部42は、例えば加工前の被加工物形状データを記憶する機能と、加工中の被加工物形状を演算する機能と、工作機械の位置を検出する機能と、工作機械の現在位置から工具1が被加工物2を加工中か否かを判定する機能を有する。 The machining determination unit 43 determines whether the tool 1 is machining the workpiece 2. For example, the machining determination unit 43 has a function of storing a machining start time, a tool path, and a workpiece shape data before machining, a function of calculating a workpiece shape during machining, and an elapsed time from the start of machining. It has a function of determining whether or not the tool 1 is processing the workpiece 2. Alternatively, the machining determination unit 42, for example, a function of storing workpiece shape data before machining, a function of calculating the workpiece shape during machining, a function of detecting the position of the machine tool, and the current of the machine tool It has a function of determining whether the tool 1 is processing the workpiece 2 from the position.

 工作機械制御部44は、演算部42の演算結果に応じて工作機械3を制御する制御信号を発信する。制御信号は例えば、工作機械の一部または全ての軸の停止または加減速指令を含む。また、工作機械の退避動作指令を含んでも良い。 The machine tool control unit 44 transmits a control signal for controlling the machine tool 3 according to the calculation result of the calculation unit 42. The control signal includes, for example, a stop or acceleration / deceleration command for some or all axes of the machine tool. Further, it may include a retreat operation command for the machine tool.

 図10は、発光強度に応じて工作機械の送り速度を制御する方法のフローチャートの一例を示す。まず、受光部41で発光強度を測定する(S101)。次に、演算部42で指定された発光強度となる送り速度を算出する(S102)。次に、工作機械制御部44で、目標とする加工負荷となるように設定された目標発光強度と一致するように、発光強度が目標発光強度より低い場合は送り速度を増加し、発光強度が目標発光強度より高い場合は、送り速度を減少させる指令を発信し、工作機械3を制御する(S103)。なお、加工判定部43で加工中でないと判定された場合は、制御を行わないようにしても良い。または、加工判定をせずに発光強度がある値より小さい場合に、早送り速度に設定したり、予め定められた送り速度に設定したりしても良い。また発光強度がある値より大きい場合に、工具折損または過負荷と判断して、工作機械の送り停止を指令しても良い。さらに、停止後に退避動作を指令しても良い。 FIG. 10 shows an example of a flowchart of a method for controlling the feed rate of the machine tool according to the light emission intensity. First, the light emission intensity is measured by the light receiving unit 41 (S101). Next, the feed rate at which the light emission intensity specified by the calculation unit 42 is obtained is calculated (S102). Next, in the machine tool control unit 44, when the light emission intensity is lower than the target light emission intensity so as to coincide with the target light emission intensity set so as to become a target processing load, the feed rate is increased, and the light emission intensity becomes If it is higher than the target light emission intensity, a command to decrease the feed rate is transmitted and the machine tool 3 is controlled (S103). In addition, when it determines with the process determination part 43 not being in process, you may make it not control. Alternatively, when the light emission intensity is smaller than a certain value without making the processing determination, the fast feed speed may be set or a predetermined feed speed may be set. When the light emission intensity is larger than a certain value, it may be determined that the tool is broken or overloaded, and the machine tool feed stop may be commanded. Further, a retreat operation may be commanded after the stop.

 加工においては、応力発光体部10からの光を受光部41で測定するため、切削液は用いず、ドライ環境で加工することが望ましい。または、エアー、ミスト噴霧としても良い。やむを得ず切削液を用いる場合でも応力発光体の光を透過する組成、例えば、ソリュブル型等の透明水溶性切削液を用いることが望ましい。 In processing, since the light from the stress-stimulated illuminant unit 10 is measured by the light receiving unit 41, it is desirable to process in a dry environment without using a cutting fluid. Alternatively, air or mist spraying may be used. Even when a cutting fluid is unavoidably used, it is desirable to use a composition that transmits the light of the stress-stimulated luminescent material, for example, a transparent water-soluble cutting fluid such as a soluble type.

 応力発光体は発光し続けるとエネルギーを放出し、発光強度が減少するため、励起光を照射しながら加工することが望ましい。また、励起光は応力発光体の発光波長と異なる波長の光とし、受光部41に発光波長を透過し、励起光を減衰または遮断するフィルタを設置することが望ましい。 ¡Stressed luminescent material emits energy when it continues to emit light, and the intensity of emitted light decreases, so it is desirable to process it while irradiating it with excitation light. The excitation light is preferably light having a wavelength different from the emission wavelength of the stress-stimulated illuminant, and it is desirable to install a filter that transmits the emission wavelength and attenuates or blocks the excitation light in the light receiving unit 41.

 本実施例によれば、回転工具に設けた応力発光体の発光光に基づいて加工負荷を検出し、検出した加工負荷に応じて工作機械を制御することができる。そして、応力発光体の発光を検出することにより、小径工具でも加工負荷を検出することができる。 According to the present embodiment, the machining load can be detected based on the light emitted from the stress light emitter provided on the rotary tool, and the machine tool can be controlled in accordance with the detected machining load. Then, by detecting the light emission of the stress light emitter, the machining load can be detected even with a small diameter tool.

 また、発光量が所定の量となるように工具の回転数や送り速度等を設定することによって、工具に印加される負荷が所定量とする被加工物を加工することが実現できる。 Also, by setting the rotation speed, feed speed, etc. of the tool so that the light emission amount becomes a predetermined amount, it is possible to realize processing of a workpiece with a predetermined amount of load applied to the tool.

 また、工具のたわみも安定し、高精度に加工することができる。さらに、工具に印加される負荷の監視により、工具の折損を未然に防止することができる。 Also, the deflection of the tool is stable and can be processed with high accuracy. Furthermore, the breakage of the tool can be prevented beforehand by monitoring the load applied to the tool.

 本実施例では、応力発光体を有する回転工具を用いて工作機械の送りおよび工具経路を制御する工作機械制御システムの例を説明する。 In the present embodiment, an example of a machine tool control system for controlling the feed of a machine tool and the tool path using a rotary tool having a stress light emitter will be described.

 小径工具による加工においては、工具径のばらつき、工具の振れ回り、工具のたわみ、被加工物の位置ずれ等により、事前に設定した工具経路で加工しても所望の加工形状が得られない場合がある。このため、工具1が実際に被加工物2に接触した加工開始位置を検出し、加工開始位置を基準にして工具経路を修正することが望ましい。 When machining with a small diameter tool, the desired machining shape cannot be obtained even if machining is performed with a preset tool path due to variations in tool diameter, tool swing, tool deflection, workpiece displacement, etc. There is. For this reason, it is desirable to detect the machining start position where the tool 1 actually contacts the workpiece 2 and to correct the tool path based on the machining start position.

 図11は、工作機械の送りおよび工具経路を制御する工作機械制御システムのフローチャートの一例を示す。工具1の移動を開始し(S111)、被加工物2へのアプローチを開始する際に受光部41で発光強度を測定する(S112)。工具1が被加工物2と接触し、加工が開始されると応力発光体部10が発光するため、発光強度がしきい値を超えた場合に加工開始と判定する(S113)。加工開始と判定された位置を基準として、設定された工具経路を修正し、被加工物2を加工する(S114)。 FIG. 11 shows an example of a flowchart of a machine tool control system for controlling the feed of the machine tool and the tool path. The movement of the tool 1 is started (S111), and when the approach to the workpiece 2 is started, the light emission intensity is measured by the light receiving unit 41 (S112). When the tool 1 comes into contact with the workpiece 2 and the machining is started, the stress light emitter 10 emits light, so that it is determined that the machining is started when the emission intensity exceeds the threshold value (S113). The set tool path is corrected using the position determined as the machining start as a reference, and the workpiece 2 is machined (S114).

 工具経路の修正においては、例えば設定された加工開始位置と測定された加工開始位置との差分をオフセットする方法がある。また、工具径補正機能または工具長補正機能を用いて、工具径または工具長の設定値を修正する方法でも良い。 In the correction of the tool path, for example, there is a method of offsetting the difference between the set machining start position and the measured machining start position. Moreover, the method of correcting the setting value of a tool diameter or a tool length using a tool diameter correction function or a tool length correction function may be used.

 本実施例によれば、回転工具に設けた応力発光体部10の発光が開始された位置に基づいて、加工開始位置を検出し、検出した加工開始位置を基準にして工具経路を修正することができる。 According to the present embodiment, the machining start position is detected based on the position where the light emission of the stress light emitter 10 provided on the rotary tool is started, and the tool path is corrected based on the detected machining start position. Can do.

 本実施例では、図9の工作機械制御システムにおいて、応力発光体を有する回転工具を用いて工具折損を検出する例を説明する。 In the present embodiment, an example in which tool breakage is detected using a rotary tool having a stress light emitter in the machine tool control system of FIG. 9 will be described.

 演算部42は、受光部41で測定した発光強度に応じて、工具の折損を判定する。また、工作機械制御部44は、工具折損の判定結果に基づき、工作機械3を制御する制御信号を発信する。制御信号は例えば、工作機械の一部または全ての軸の停止または加減速指令を含む。また、工作機械の退避動作指令を含んでも良い。更に、退避後に自動工具交換装置を用いて工具1を新しい工具と交換する指令を含んでも良い。更に、工具交換後に工具経路の特定の部分から加工を再開する指令を含んでも良い。 The calculation unit 42 determines the breakage of the tool according to the light emission intensity measured by the light receiving unit 41. Further, the machine tool control unit 44 transmits a control signal for controlling the machine tool 3 based on the determination result of the tool breakage. The control signal includes, for example, a stop or acceleration / deceleration command for some or all axes of the machine tool. Further, it may include a retreat operation command for the machine tool. Furthermore, you may include the instruction | command which replaces | exchanges the tool 1 for a new tool using an automatic tool change apparatus after evacuation. Furthermore, a command for resuming machining from a specific part of the tool path after the tool change may be included.

 まず、工具折損を判定するための第一の方法について説明する。図12は、応力発光体を含む樹脂プレートの三点曲げ試験における発光強度と押し込み深さの関係の一例を示す図である。横軸は押し込み深さを、縦軸は発光強度を示している。応力発光体は変形によるひずみの増加と共に発光強度も線形に増加するが、破壊に伴うひずみの発生時には変形時よりも強い発光強度を示す。このため、発光強度の大きさにより破壊したか否かを判別することが可能である。したがって、工具折損を判定するための第一の方法は受光部41で測定した発光強度があるしきい値よりも大きくなった場合に折損と判定する。 First, the first method for determining tool breakage will be described. FIG. 12 is a diagram illustrating an example of the relationship between the light emission intensity and the indentation depth in a three-point bending test of a resin plate including a stress light emitter. The horizontal axis represents the indentation depth, and the vertical axis represents the emission intensity. The stress-stimulated illuminant linearly increases the luminescence intensity as the strain increases due to deformation, but exhibits a stronger luminescence intensity when the strain associated with the fracture occurs than when deformed. For this reason, it is possible to determine whether or not it has been destroyed based on the magnitude of the emission intensity. Therefore, the first method for determining tool breakage is determined as breakage when the light emission intensity measured by the light receiving unit 41 is greater than a certain threshold value.

 次に、工具折損を判定するための第二の方法について説明する。加工中は加工負荷により応力発光体部10は発光し続けるが、折損し工具先端が失われると加工負荷が発生しなくなるため、応力発光体部10は発光しなくなる。このため、加工判定部43で加工中と判定されたにも関わらず、受光部41で測定された発光強度があるしきい値以下であった場合に折損と判定する。また、本方法では応力発光体部10が折損により刃部11と共に飛散した場合にも折損を検出することができる。 Next, a second method for determining tool breakage will be described. During processing, the stress light emitter 10 continues to emit light due to the processing load, but if the tool tip breaks and the tip of the tool is lost, no processing load is generated, so the stress light emitter 10 does not emit light. For this reason, even if it is determined that the processing is being performed by the processing determination unit 43, a breakage is determined when the light emission intensity measured by the light receiving unit 41 is less than or equal to a threshold value. Further, in the present method, the breakage can be detected even when the stress-stimulated luminescent part 10 is scattered together with the blade part 11 due to breakage.

 図13は、工具折損を判定するための第三の方法について説明する図である。受光部41は例えばCCD等の発光形状を取得できる光センサとする。工具の折損により飛散する工具先端部分と共に応力発光体部10の少なくとも一部が飛散する場合、応力発光体部10の形状が変化する。このため、応力発光体部10の形状が変化した場合に工具折損と判定する。 FIG. 13 is a diagram illustrating a third method for determining tool breakage. The light receiving unit 41 is an optical sensor capable of acquiring a light emission shape such as a CCD. When at least a part of the stress light emitter 10 is scattered together with the tool tip portion that is scattered due to breakage of the tool, the shape of the stress light emitter 10 is changed. For this reason, it determines with a tool breakage, when the shape of the stress light-emitting body part 10 changes.

 図14は、前記第三の工具折損判定方法に適した工具1の構造の例である。応力発光体部10が工具折損時に確実に破断するように、応力発光体部10の一部に円周方向のスリット101を設ける。また、円周方向のスリット101は応力発光体部10を完全に分断した溝でも良いし、完全に分断せず、例えばV溝等の部分的に応力発光体部10の厚みを部分的に薄くした溝でも良い。 FIG. 14 shows an example of the structure of the tool 1 suitable for the third tool breakage determination method. A circumferential slit 101 is provided in a part of the stress light emitter 10 so that the stress light emitter 10 is reliably broken when the tool is broken. Further, the slit 101 in the circumferential direction may be a groove that completely divides the stress light emitter 10 or may not be completely divided. For example, the thickness of the stress light emitter 10 may be partially reduced, such as a V groove. It may be a groove.

 図15は、前記第三の工具折損判定方法に適した工具1の別の構造の例である。応力発光体部10が工具折損時に破断しやすくなるように、応力発光体部10の一部に軸方向のスリット102を設ける。 FIG. 15 is an example of another structure of the tool 1 suitable for the third tool breakage determination method. An axial slit 102 is provided in a part of the stress light emitter 10 so that the stress light emitter 10 is easily broken when the tool is broken.

 本実施例によれば、回転工具に設けた応力発光体の発光光に基づいて、加工負荷が小さい場合に回転工具が折損した際においても、折損を検出することができる。 According to the present embodiment, it is possible to detect breakage even when the rotary tool breaks when the processing load is small, based on the light emitted from the stress light emitter provided on the rotary tool.

 なお、本発明は上記した実施例に限定されるものではなく、様々な変形例が含まれる。例えば、上記した実施例は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。また、ある実施例の構成の一部を他の実施例の構成に置き換えることが可能であり、また、ある実施例の構成に他の実施例の構成を加えることも可能である。また、各実施例の構成の一部について、他の構成の追加・削除・置換をすることが可能である。 In addition, this invention is not limited to the above-mentioned Example, Various modifications are included. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described. Further, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. Further, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

1 工具
2 被加工物
3 工作機械
10 応力発光体部
11 刃部
12 首部
13 テーパ部
14 シャンク部
21 マスキング
22 応力発光粒子とバインダを混合した液体
41 受光部
42 演算部
43 加工判定部
44 工作機械制御部
101 円周方向スリット
102 軸方向スリット
DESCRIPTION OF SYMBOLS 1 Tool 2 Workpiece 3 Machine tool 10 Stress light-emitting body part 11 Blade part 12 Neck part 13 Taper part 14 Shank part 21 Masking 22 Liquid which mixed stress light-emission particle and binder 41 Light-receiving part 42 Calculation part 43 Work determination part 44 Machine tool Control unit 101 Circumferential slit 102 Axial slit

Claims (15)

 被加工物を切削または研削する回転工具であって、工具表面の一部に、応力発光体を含む部材を有することを特徴とする回転工具。 A rotary tool for cutting or grinding a workpiece, wherein the rotary tool has a member including a stress light emitter on a part of the tool surface.  請求項1に記載の回転工具において、
 刃部およびシャンク部を除く部分の表面の全体または一部に、応力発光体を含む部材を有することを特徴とする回転工具。
The rotary tool according to claim 1, wherein
A rotary tool comprising a member including a stress-stimulated luminescent material on the whole or a part of a surface excluding a blade part and a shank part.
 請求項1に記載の回転工具において、
 刃部、前記刃部に連続する首部、シャンク部、および前記首部と前記シャンク部との間で直径が変化するテーパ部を備え、
 前記応力発光体を含む部材を、前記テーパ部と前記首部の境界近傍に有することを特徴とする回転工具。
The rotary tool according to claim 1, wherein
A blade portion, a neck portion continuous to the blade portion, a shank portion, and a tapered portion whose diameter changes between the neck portion and the shank portion;
A rotary tool comprising a member including the stress light emitter in the vicinity of a boundary between the tapered portion and the neck portion.
 請求項1に記載の回転工具において、
 前記応力発光体を含む部材に円周方向のスリットが設けられていることを特徴とする回転工具。
The rotary tool according to claim 1, wherein
A rotary tool characterized in that a circumferential slit is provided in a member including the stress light emitter.
 請求項1に記載の回転工具において、
 前記応力発光体を含む部材に軸方向のスリットが設けられていることを特徴とする回転工具。
The rotary tool according to claim 1, wherein
A rotary tool characterized in that an axial slit is provided in a member including the stress light emitter.
 請求項1に記載の回転工具において、
 前記応力発光体を含む樹脂を塗布したことを特徴とする回転工具。
The rotary tool according to claim 1, wherein
A rotary tool, wherein a resin containing the stress luminescent material is applied.
 請求項1に記載の回転工具において、
 前記応力発光体を含む樹脂テープを貼り付けたことを特徴とする回転工具。
The rotary tool according to claim 1, wherein
A rotary tool comprising a resin tape including the stress-stimulated luminescent material.
 請求項1に記載の回転工具において、
 工具母材に、前記応力発光体をドープまたは混合したことを特徴とする回転工具。
The rotary tool according to claim 1, wherein
A rotary tool comprising a tool base material doped or mixed with the stress-stimulated luminescent material.
 工具表面の一部に応力発光体を含む部材を有する、被加工物を切削または研削する回転工具の製造方法であって、
 刃部および首部の応力発光体を塗布しない部分にマスキングを施すステップと、
 応力発光粒子とバインダを混合した液体に回転工具を所定の高さまで浸漬し、引き上げるステップと、
 前記マスキングを除去するステップと、
を備える回転工具の製造方法。
A method for manufacturing a rotary tool that cuts or grinds a workpiece, having a member containing a stress illuminator on a part of the tool surface,
Masking the portion of the blade and neck not coated with the stress illuminant;
Dipping the rotary tool to a predetermined height in a liquid in which the stress-stimulated luminescent particles and the binder are mixed, and pulling it up;
Removing the masking;
The manufacturing method of a rotary tool provided with.
 工具表面の一部に応力発光体を含む部材を有し、被加工物を切削または研削する回転工具を備える工作機械を制御する工作機械制御システムであって、
 前記回転工具に設けられた前記応力発光体の発光強度を測定する受光部と、発光強度に応じて送り速度指令を演算する演算部と、演算結果に応じて工作機械を制御する信号を発信する工作機械制御部を有し、
 発光強度が予め定められた値に近づくように工作機械を制御する工作機械制御システム。
A machine tool control system for controlling a machine tool having a rotary tool for cutting or grinding a workpiece, the member including a stress illuminator on a part of a tool surface,
A light receiving unit for measuring the light emission intensity of the stress light emitter provided on the rotary tool, a calculation unit for calculating a feed speed command according to the light emission intensity, and a signal for controlling the machine tool according to the calculation result are transmitted. A machine tool control unit,
A machine tool control system for controlling a machine tool so that the light emission intensity approaches a predetermined value.
 請求項10に記載の工作機械制御システムにおいて、
 前記演算部は、前記受光部で測定した応力発光体の発光強度の値により加工開始位置を判定し、
 前記工作機械制御部は、前記判定された加工開始点に応じて工具経路を修正し、
 前記判定された加工開始点と設定された加工開始点の差分を設定された工具経路にオフセットした新しい工具経路に沿って工作機械を制御する工作機械制御システム。
The machine tool control system according to claim 10,
The calculation unit determines a processing start position based on a value of light emission intensity of the stress light emitter measured by the light receiving unit,
The machine tool control unit corrects a tool path according to the determined machining start point,
A machine tool control system for controlling a machine tool along a new tool path obtained by offsetting a difference between the determined machining start point and a set machining start point to a set tool path.
 工具表面の一部に、応力発光体を含む部材を有し、被加工物を切削または研削する回転工具を備える工作機械を制御する工作機械制御システムであって、
 前記回転工具に設けられた前記応力発光体の発光を測定する受光部と、前記受光部で測定した応力発光体の発光に応じて前記回転工具の折損を判定する演算部と、
を有する工作機械制御システム。
A machine tool control system for controlling a machine tool having a rotary tool for cutting or grinding a workpiece, the member including a stress light emitter on a part of a tool surface,
A light receiving unit for measuring the light emission of the stress light emitter provided in the rotary tool, a calculation unit for determining breakage of the rotary tool according to the light emission of the stress light emitter measured by the light receiving unit,
A machine tool control system.
 請求項12に記載の工作機械制御システムにおいて、
 発光強度が予め定められた値より大きい場合に折損と判定することを特徴とする工作機械制御システム。
The machine tool control system according to claim 12,
A machine tool control system, wherein a breakage is determined when the light emission intensity is greater than a predetermined value.
 請求項12に記載の工作機械制御システムにおいて、
 更に、前記回転工具が被加工物を加工しているかを判定する加工判定部を有し、
 前記回転工具が被加工物を加工している場合であって、発光強度が予め定められた値より小さい場合に、折損と判定することを特徴とする工作機械制御システム。
The machine tool control system according to claim 12,
Furthermore, it has a processing determination unit that determines whether the rotary tool is processing a workpiece,
A machine tool control system characterized in that a breakage is determined when the rotary tool is processing a workpiece and the light emission intensity is smaller than a predetermined value.
 請求項12に記載の工作機械制御システムにおいて、
 前記受光部は、前記回転工具に設けられた前記応力発光体の発光部形状を測定し、
 前記演算部は、発光部形状が変化した場合に折損と判定することを特徴とする工作機械制御システム。
The machine tool control system according to claim 12,
The light receiving part measures a light emitting part shape of the stress light emitting body provided in the rotary tool,
The machine tool control system according to claim 1, wherein the calculation unit determines a breakage when the shape of the light emitting unit is changed.
PCT/JP2015/074282 2015-08-27 2015-08-27 Rotary tool with stress-luminescent material, manufacturing method therefor, and machine tool control system Ceased WO2017033338A1 (en)

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