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WO2017010973A1 - Boîtier de lecteur de disque dur doté de plots thermiques - Google Patents

Boîtier de lecteur de disque dur doté de plots thermiques Download PDF

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Publication number
WO2017010973A1
WO2017010973A1 PCT/US2015/039938 US2015039938W WO2017010973A1 WO 2017010973 A1 WO2017010973 A1 WO 2017010973A1 US 2015039938 W US2015039938 W US 2015039938W WO 2017010973 A1 WO2017010973 A1 WO 2017010973A1
Authority
WO
WIPO (PCT)
Prior art keywords
hdd
cage
computing device
fan
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2015/039938
Other languages
English (en)
Inventor
Shaheen SAROOR
Chin-Chang Ho
Lan-Chin CHIOU
Daniel James BRADEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Priority to PCT/US2015/039938 priority Critical patent/WO2017010973A1/fr
Publication of WO2017010973A1 publication Critical patent/WO2017010973A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1406—Reducing the influence of the temperature
    • G11B33/1413—Reducing the influence of the temperature by fluid cooling
    • G11B33/142—Reducing the influence of the temperature by fluid cooling by air cooling
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
    • G11B33/022—Cases
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
    • G11B33/123—Mounting arrangements of constructional parts onto a chassis
    • G11B33/124—Mounting arrangements of constructional parts onto a chassis of the single recording/reproducing device, e.g. disk drive, onto a chassis

Definitions

  • Fig. 1 A is a top view of a hard disk drive (HDD) cage according to an example of the principles described herein.
  • HDD hard disk drive
  • Fig. 1 B is a cross-sectional plane view of an HDD cage according to an example of the principles described herein.
  • Fig. 2A is a top view of an HDD cage according to an example of the principles described herein.
  • Fig. 2B is a cross-sectional plane view of an HDD cage according to an example of the principles described herein.
  • Fig. 3A is a top view of an HDD cage according to an example of the principles described herein.
  • Fig. 3B is a cross-sectional plane view of an HDD cage according to an example of the principles described herein.
  • FIG. 4 is an isomeric view of an example computing device incorporating an HDD cage according to an example of the principles described herein.
  • Fig. 5 is a top view of the computing device of Fig. 4 showing a housing covering the components inside according to an example of the principles described herein.
  • heat has an incapacitating effect on the components within a computing device.
  • Most of the heat within a computing device is usually created by the central processing unit (CPU) or graphics processor unit (GPU).
  • CPU central processing unit
  • GPU graphics processor unit
  • Each of these devices consumes a relatively higher amount of energy by, for example, carrying out complicated calculations.
  • Other devices such as the hard disk drive (HDD) and power converters also create heat.
  • HDDs don't consume as much electricity as a CPU or GPU, HDDs may be relatively more sensitive to changes in temperature.
  • Smaller computing devices operating higher wattage processors can exasperate any issues associated with heat.
  • a high wattage CPU, GPU, and HDD are enclosed within a relatively smaller space than with other computing devices, heat can accumulate in stagnant air zones.
  • these smaller computing devices may implement, for example, a heat sink coupled to the CPU, hot air may still accumulate around the HDD causing failure of the HDD.
  • internal temperature sensors within the computing device may detect that a threshold temperature has been reached and shut down the HDD or the entire computing device in order to prevent any damage. Either way, user satisfaction in connection with the interaction with the computer device may be diminished.
  • a computing device may include an HDD cage surrounding an HDD and securing the HDD to a housing of the computing device.
  • a thermal pad may be coupled to the HDD cage. The thermal pad may direct heat away from the HDD and into the HDD cage causing the HDD cage to dissipate the heat over a relatively larger surface area.
  • a fan may be coupled to the HDD cage to direct heat dissipated throughout the HDD cage away from the HDD.
  • a number of vents may be defined in the housing of the computing device through which an airflow of hot air produced by the fan may be expelled from the computing device.
  • the thermal pad and fan may be coupled to the HDD cage providing a way that the heat around the HDD may be dissipated through the HDD cage and expelled away from the HDD via the fan.
  • systems for cooling a computing device may include a hard disk drive (HDD) cage housing an HDD, a thermally conductive pad coupled to the cage, and an HDD fan coupled to the cage.
  • HDD hard disk drive
  • computing devices may include a housing, a hard disk drive (HDD) cage, an HDD fan coupled to the cage between the cage and the housing; and a thermal pad coupled to the cage, wherein the thermal pad is to conduct heat produced by the HDD throughout the cage.
  • HDD hard disk drive
  • a hard disk drive (HDD) cooling systems may include a hard disk drive (HDD) cage and a thermal conductive element coupled to the HDD cage to direct heat produced by an HDD into the cage.
  • HDD hard disk drive
  • thermal conductive element is meant to be understood as a passive heat exchanger that cools a device by dissipating heat into the surrounding medium.
  • the heat sink is a thermally conductive pad or thermal pad.
  • a thermal pad may be a preformed piece of solid material that conducts heat such as silicone.
  • Figs. 1A and 1 B are diagrams of an HDD cage (105) according to an example of the principles described herein.
  • Fig. 1 A is a top view of the HDD cage (105) while
  • Fig. 1 B is a cross-sectional plane view of the HDD cage (105).
  • the HDD cage (105) may include a number of bolts or other securing devices used to both secure the HDD cage (105) to a housing of a computing device as well as secure the HDD to the interior of the HDD cage (105) itself.
  • the HDD cage (105) may be secured to a bottom chassis of a computing device housing thereby providing support to the HDD cage (105) and HDD secured within the HDD cage (105).
  • the HDD cage (105) may be made of any type of material capable of conducting heat and dissipating that heat throughout the HDD cage (105).
  • the HDD cage (105) is made of an aluminum alloy.
  • the HDD cage (105) may be made of aluminum alloy 1050A, 6061 , 6063 or other similar alloys.
  • the HDD cage (105) may be made of copper.
  • the HDD cage (105) may be made of a ceramic material.
  • the HDD cage (105) may be formed to encompass the entire HDD.
  • the HDD cage (105) may include a top surface, a bottom surface, a front surface, a back surface, and two side surfaces. This may allow the HDD to be kept cool from other heat sources within the computing device while still having heat conducted away from the HDD via, for example, the HDD cage (105).
  • a number of surfaces described above may be eliminated.
  • the top surface may not be formed in order to allow for rising heat to be expelled away from the HDD.
  • the housing for the computing device may be provided comprising a number of vents or holes defined therein through which this rising heat may escape from the computing device.
  • the HDD cage (105) may further include a heat sink such as a thermal pad (1 10) coupled to the interior surface of the HDD cage (105).
  • Fig. 1 B shows a cross section view of the HDD cage (105) and thermal pad (1 10) cut along line "A" as indicated in Fig. 1A.
  • the thermal pad (1 10) may be made of any thermally conductive material.
  • the thermal pad (1 10) may be coupled to the bottom surface of the HDD cage (105) at any location on the bottom surface.
  • thermal pad (1 10) may be coupled to a portion of the bottom surface of the HDD cage (105) directly below where the hottest portion of the HDD will be located when inserted into the HDD cage (105).
  • the thermal pad (1 10) may be of any thickness. In one example, the thickness of the thermal pad (1 10) may be sufficient to touch the HDD when the HDD is placed in and secured to the HDD cage (105). In another example, the thickness of the thermal pad (1 10) may be such that the thermal pad (1 10) may be compacted when the HDD is inserted and coupled to the HDD cage (105).
  • Figs. 2A and 2B are diagrams of an HDD cage (105) according to an example of the principles described herein. Fig.
  • FIG. 2A is a top view of the HDD cage (105) while Fig. 1 B is a cross-sectional plane view of the HDD cage (105); Fig. 2B showing a cross section view of the HDD cage (105) and an HDD fan (205) cut along line "B" as indicated in Fig. 2A. Similar to Figs. 1A and 1 B respectively, Figs. 2A and 2B both include an HDD cage (105) that is meant to secure an HDD within a computing device. In addition to the HDD cage (105) Figs. 2A and 2B show an HDD fan (205) coupled to the HDD cage (105).
  • the HDD fan (205) may be coupled to the underside of the bottom surface of the HDD cage (105).
  • the heat dissipated by the HDD cage (105) may be brought into the intake (210) portion of the HDD fan (205) and expelled out the exhaust (215).
  • the HDD fan (205) is coupled to the underside of the bottom surface of the HDD cage (105)
  • the heat from the HDD distributed throughout the HDD cage (105) may be more easily removed than if the HDD fan (205) was inside the HDD cage (105) with the HDD.
  • any stagnant heated air located at or around the HDD cage (105) and the HDD may be blown out and away from the HDD either directly via the intake (210) of the HDD fan (205) or via fluidic movement of the air.
  • the HDD fan (205) may be placed directly below the HDD via an HDD fan (205) void defined in the HDD cage (105). Placement of the HDD fan (205) void may be determined by placement of other features such as a thermal pad (1 10). In this example, the placement of HDD fan (205) void and the HDD fan (205) may be dictated by where on the bottom surface of the HDD cage (105) a thermal pad (1 10) is to be place. Any location on the bottom surface of the HDD cage (105) where the thermal pad (1 10) is not to be coupled, the HDD fan (205) void may be defined. Similar to the examples shown in Figs.
  • the HDD fan (205) may remove heat dissipated into the HDD cage (105).
  • the HDD fan (205) placed in the described HDD fan (205) void may also remove heated air directly around the HDD.
  • the HDD fan (205) may be positioned such that the exhaust (215) drives the heated air away from the HDD at a specific angle relative to a front face (220) of the HDD cage (105). In one example, the angle as indicated by the 2 in Fig. 2A may be 45 degrees.
  • the exhaust (215) of the HDD fan (205) may direct any hot air towards a rear portion of the computing device and potentially towards a fan duct associated with a CPU and CPU fan used within the computing device. As will be discussed below, this may allow the airflow produced from the HDD fan (205) exhaust (215) to supplement the airflow produced from a CPU fan as well as move stagnant air out of the computing device and away from other devices within the computing device.
  • FIGs. 3A and 3B are diagrams of an HDD cage (105) according to an example of the principles described herein.
  • Fig. 3A is a top view of the HDD cage (105) while
  • Fig. 3B is a cross-sectional plane view of the HDD cage (105);
  • Fig. 3B showing a cross section view of the HDD cage (105), thermal pad (1 10), and HDD fan (205) cut along line "C" as indicated in Fig. 3A.
  • Figs. 3A and 3B both include an HDD cage (105) that is meant to secure an HDD within a computing device.
  • a thermal pad (1 10) and HDD fan (205) are used to dissipate heat from the HDD and transport heated air away from the HDD respectively.
  • Figs. 3A and 3B show a layout of the thermal pad (1 10) and HDD fan (205) relative to the HDD cage (105), many examples exist and the present specification contemplates the use of the HDD fan (205), thermal pad (1 10), and HDD cage (105) in any number of configurations.
  • any number of HDD fan (205) voids may be defined in the HDD cage (105) such that the HDD fan (205) can remove heat directly away from the HDD as well as the HDD cage (105) dissipating the heat.
  • any number of thermal pads (1 10) may be coupled to the bottom interior surface of the HDD cage (105) to help dissipate the heat from the HDD into the HDD cage (105).
  • the computing device (400) may be any type of electronic device such as, a desktop computer, a laptop computer, mobile devices, gaming systems, and tablets, among other electronic devices.
  • the computing device (400) may include an HDD (405), an HDD cage (105), a CPU fan (410), a CPU (415), and a fan duct (420).
  • the computing device (400) of Fig. 4 does not show the HDD fan (205) or thermal pad (1 10) as described in Figs. 1A-3B.
  • the thermal pad (1 10) and HDD fan (205) are covered by the HDD (405) and HDD cage (105).
  • the CPU fan (410) may produce a flow of air over the CPU (415) in order to cool down the CPU.
  • the CPU (415) may produce heat during operation and the CPU fan (410) as well as a number of heat sinks may be used to cool off the CPU (415).
  • the air from the CPU fan (410) is pushed over the CPU (415) and heat sinks, the air may be pushed out of the computing device (400) via a fan duct (420) located towards the back of the computing device (400).
  • the fan duct (420) may be used by the CPU fan (410) as an exit to discharge hot air from the computing device (400), the fan duct (420) may also be an exit through which hot air from the HDD fan (205) may be pushed out from the computing device (400). Consequently, the HDD fan (205) and CPU fan (410) may work together to form a continuous flow of air into and out of the computing device (400). Each air flow from the HDD fan (205) and CPU fan (410) may supplement each other such that airflow out of the computing device (400) is increased.
  • the airflows associated with each of the HDD fan (205) and CPU fans (410) are shown in dashed arrows in Fig. 4.
  • the airflow associated with the HDD fan (205) may intake air from around the HDD as well as from outside the computing device (400) and expel hot air out the back end of the computing device (400) and towards the fan duct (420) as described above.
  • the airflow associated with the CPU fan (410) may intake air from outside the computing device (400) through a number of vents defined in a top housing of the computing device (400). The air may enter the CPU fan (410) and flow across the CPU (415) and out through the fan duct (420) as also indicated by the dashed arrows.
  • the computing device (400) may include a high powered CPU (415) and may be enclosed in a housing that is relatively small to accommodate the heat of the CPU (415).
  • the CPU fan (410) may be a 65 Watt CPU and the housing of the computing device (400) may include 1 liter of space or less. With these characteristics, the heat produced by the CPU (415), the HDD (405), a graphics processor unit, a power converter, and other devices in the computing device (400) may be relatively higher than with a computing device (400) developed to include additional space to accommodate for the additional heat produced.
  • the CPU fan (410) may help with the excessive heat, but eventually the computing device (400) may overheat and fail or shutdown.
  • the excessive heat may accumulate at or around the HDD (405) causing additional failures in the HDD.
  • the thermal pad (Figs. 1 A, 1 B, 3A, and 3B; 1 10) (not shown in Fig. 4) coupled to the HDD cage (105) helps to distribute any heat experienced by the HDD (405) and the HDD fan (205) may be used to evacuate the heated air from under the HDD (405) and within any unoccupied space within the computing device (400).
  • the computing device (400) is capable of operating within or under a predetermined temperature.
  • heat experienced by the HDD (405) may be absorbed into and distributed throughout the HDD cage (105).
  • any number of temperature sensors may be used to help direct the CPU fan (410) and HDD fan (205) individually to be activated. Where a temperature increase is sensed by the temperature sensor associated with the CPU (415), the CPU fan (410) may engage. In this example, the CPU (415) may direct the HDD fan (205) to engage as well when a temperature increase around the CPU (415) is sensed. This may be done to proactively prevent any accumulation of heat at or around the HDD (405) or other components of the computing device (400) as well as help cool the CPU (415). The same may occur where a temperature sensor associated with the HDD (405) senses an increase in temperature.
  • the CPU (415) may direct the CPU fan (410) to engage as well in anticipation of an increase in temperature associated with the CPU and generally within the computing device (400). Consequently, each of the fans (410, 205) can cooperate to cool the devices within the computing device (400) by causing two different and supplemental airflows to flow through the computing device (400).
  • Fig. 5 is a top view of the computing device (400) of Fig. 4 showing a housing (505) covering the components inside according to an example of the principles described herein.
  • the housing (505) may have a number of vents (510-1 , 510-2) defined therein to allow the airflows as described in connection with Fig. 4.
  • a first set of vents (510-1 ) may allow hot air from both the HDD fan (205) and CPU fan (410) to exhaust therethrough in addition to the fan duct (420) associated with the CPU (415) and CPU fan (410). Hot air may tend to rise and these vents provide an additional airflow path by which the hot air in the computing device (400) may be expelled.
  • second set of vents (510-2) may also expel hot air from the device that is not accumulated by either the HDD fan (205) or CPU fan (410).
  • the second set of vents (510-2) may be a source of relatively cooler air from which the CPU fan (410) may draw into the computing device (400).
  • other vents along a back portion of the computing device (400) may be defined therein to allow the hot air to be pushed out from within the computing device (400).
  • the specification and figures describe cooling a computing device using a thermal pad coupled to an HDD cage and an HDD fan coupled to the HDD cage.
  • a HDD cage and thermal pad drastically reduced temperatures within a computing device operating an HDD, a 65 Watt CPU with the internal area of the computing device defined by the computing device's housing of 1 liter or less.
  • the inclusion of the HDD fan as described herein also provided additional airflow of hot air around the HDD, across a number of other densely packed heat producing devices in the computing device and out a number of vents provided in the housing.
  • the inclusion of a heat sink over the HDD would add additional bulk to the computing device as well as reduce any free space within the housing. There is also a potential that heat would begin to accumulate among the devices of such a densely packed computing device.
  • the thermal pad coupled to the cage provides for a method heat exchange that sufficiently protects the HDD from damage such as warping of the disks.

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Dans un exemple, la présente invention concerne un système de refroidissement d'un dispositif informatique comprenant un boîtier de lecteur de disque dur (HDD) logeant un HDD, un plot thermoconducteur relié au boîtier et un ventilateur de HDD relié au boîtier. Dans un exemple, un dispositif informatique comprend un logement, un boîtier de lecteur de disque dur (HDD), un ventilateur de HDD relié au boîtier entre le boîtier et le logement et un plot thermique relié au boîtier, le plot thermique servant à acheminer la chaleur produite par le HDD dans tout le boîtier. Dans un exemple, un système de refroidissement de lecteur de disque dur (HDD) comprend un boîtier de lecteur de disque dur (HDD) et un élément conducteur thermique relié au boîtier de HDD pour diriger la chaleur produite par un HDD dans le boîtier.
PCT/US2015/039938 2015-07-10 2015-07-10 Boîtier de lecteur de disque dur doté de plots thermiques Ceased WO2017010973A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2015/039938 WO2017010973A1 (fr) 2015-07-10 2015-07-10 Boîtier de lecteur de disque dur doté de plots thermiques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/039938 WO2017010973A1 (fr) 2015-07-10 2015-07-10 Boîtier de lecteur de disque dur doté de plots thermiques

Publications (1)

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WO2017010973A1 true WO2017010973A1 (fr) 2017-01-19

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PCT/US2015/039938 Ceased WO2017010973A1 (fr) 2015-07-10 2015-07-10 Boîtier de lecteur de disque dur doté de plots thermiques

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6377455B1 (en) * 1997-09-16 2002-04-23 Jacob Nelik Computer component cooling assembly
US20050277308A1 (en) * 2004-06-15 2005-12-15 Keith Kirby Electrical apparatus
US20100309624A1 (en) * 2009-06-04 2010-12-09 Mei-Yin Yeh Industrial computer
US20100309623A1 (en) * 2009-06-04 2010-12-09 Mei-Yin Yeh Industrial computer
US20120002363A1 (en) * 2009-04-14 2012-01-05 Fujitsu Limited Electronic apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6377455B1 (en) * 1997-09-16 2002-04-23 Jacob Nelik Computer component cooling assembly
US20050277308A1 (en) * 2004-06-15 2005-12-15 Keith Kirby Electrical apparatus
US20120002363A1 (en) * 2009-04-14 2012-01-05 Fujitsu Limited Electronic apparatus
US20100309624A1 (en) * 2009-06-04 2010-12-09 Mei-Yin Yeh Industrial computer
US20100309623A1 (en) * 2009-06-04 2010-12-09 Mei-Yin Yeh Industrial computer

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