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WO2017090879A1 - Composition de résine photosensible et film durci préparé à partir de cette dernière - Google Patents

Composition de résine photosensible et film durci préparé à partir de cette dernière Download PDF

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Publication number
WO2017090879A1
WO2017090879A1 PCT/KR2016/010961 KR2016010961W WO2017090879A1 WO 2017090879 A1 WO2017090879 A1 WO 2017090879A1 KR 2016010961 W KR2016010961 W KR 2016010961W WO 2017090879 A1 WO2017090879 A1 WO 2017090879A1
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Prior art keywords
meth
acrylate
photosensitive resin
resin composition
cured film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2016/010961
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English (en)
Inventor
Hyung-Tak Jeon
Seok-Bong Park
Gyung-Sik Choi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Specialty Materials Korea Ltd
Original Assignee
Rohm and Haas Electronic Materials Korea Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160125432A external-priority patent/KR102630893B1/ko
Application filed by Rohm and Haas Electronic Materials Korea Ltd filed Critical Rohm and Haas Electronic Materials Korea Ltd
Priority to US15/775,441 priority Critical patent/US10656520B2/en
Priority to JP2018521950A priority patent/JP6843133B2/ja
Priority to CN201680065344.8A priority patent/CN108351590B/zh
Publication of WO2017090879A1 publication Critical patent/WO2017090879A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F234/00—Copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain and having one or more carbon-to-carbon double bonds in a heterocyclic ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/10—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of amides or imides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds

Definitions

  • the present invention relates to a photosensitive resin composition and a cured film prepared therefrom, in particular a photosensitive resin composition, from which a cured film that has developability of a pattern with high resolution and good elasticity recovery rate may be formed, and which may be used for the formation of a cured film, particularly a spacer in a display such as a liquid crystal display and an organic electroluminescent(EL) display; and a cured film, particularly a spacer prepared therefrom.
  • a photosensitive resin composition from which a cured film that has developability of a pattern with high resolution and good elasticity recovery rate may be formed, and which may be used for the formation of a cured film, particularly a spacer in a display such as a liquid crystal display and an organic electroluminescent(EL) display; and a cured film, particularly a spacer prepared therefrom.
  • a photosensitive resin composition is widely used for a cured film of various displays such as a liquid crystal display and an organic EL display.
  • a spacer formed using a photosensitive resin composition may be employed to maintain a gap between upper and lower transparent substrates constant, and the spacer is generally formed by a method including coating a photosensitive resin composition on a substrate, followed by exposure to ultraviolet ray, etc. via a mask, and developing.
  • the spacer is applied to a small display having small pixels such as a cellular phone and a tablet PC
  • the formation of a spacer pattern with high resolution is crucial. Further, elasticity recovery rate that may sufficiently endure external impact onto a touch screen is also crucial.
  • Elasticity recovery rate is influenced by the number of crosslinking bonds in a composition that are formed through light exposure and thermal curing during performing processes. If the amount of photopolymerizable compound increases in a photosensitive resin composition, the number of crosslinking bonds may be largely increased through light exposure, thereby improving the elasticity recovery rate. However, the mere increase of the amount of the photopolymerizable compound may decrease the number of functional groups that assist the development of a polymer, or increase sensitivity to exposure intensity, thereby increasing the size of a dot pattern and negatively affecting the formation of a pattern with high resolution.
  • a photosensitive resin composition that may resolve the above-described defects in a development process, improve elasticity recovery rate, and produce a pattern with high resolution is required.
  • Korean Laid-open Patent Publization No. 10-2001-0059259 discloses a photosensitive resin composition comprising a polymer, a polyfunctional acrylate monomer, and a photopolymerization initiator; and a color filter for a liquid crystal display.
  • a photosensitive resin composition comprising a photopolymerizable compound containing hepta- or more functional groups.
  • Korean Laid-open Patent Publization No. 10-2010-0028486 discloses a photosensitive resin composition comprising (A) a resin having an acid functional group in a side chain, (B1) a hexafunctional polymerizable compound, and (B2) a heptafunctional polymerizable compound, and enduring vibration with high frequency.
  • A a resin having an acid functional group in a side chain
  • B1 a hexafunctional polymerizable compound
  • B2 a heptafunctional polymerizable compound
  • a photosensitive resin composition that may provide high resolution and good elasticity recovery rate, which are required in a cured film, particularly in a spacer of various displays such as a liquid crystal display and an organic EL device, is required.
  • an object of the present invention is to provide a photosensitive resin composition which may form a cured film that has developability of a pattern with high resolution and good elasticity recovery rate, and may be effectively used for the formation of a cured film, particularly a spacer of a display such as a liquid crystal display and an organic EL display; and also a cured film prepared therefrom.
  • a photosensitive resin composition comprising:
  • A a copolymer
  • B a photopolymerizable compound comprising a first photopolymerizable compound (B1) containing hexa- or less functional groups and a second photopolymerizable compound (B2) containing hepta- or more functional groups
  • C a photopolymerization initiator
  • a cured film prepared from the photosensitive resin composition.
  • the photosensitive resin composition of the present invention may form a cured film having developability of a pattern with high resolution and good elasticity recovery rate by including a copolymer (A) and a photopolymerizable compound (B) in specific amounts, and may be effectively used for the formation of a cured film, particularly a spacer of a display such as a liquid crystal display and an organic EL display.
  • Fig. 1 is a graph obtained by measuring elasticity recovery rate in accordance with the load of a cured film.
  • the photosensitive resin composition according to the present invention comprises (A) a copolymer; (B) a photopolymerizable compound comprising a first polymerizable compound containing hexa- or less functional groups (B1) and a second photopolymerizable compound containing hepta- or more functional groups (B2); and (C) a photopolymerization initiator, and may additionally comprise (D) a solvent; (E) an epoxy compound, and an additive such as (F) a surfactant and (G) a silane coupling agent (adhesion assisting agent).
  • (meth)acryl means “acryl” and/or “methacryl
  • (meth)acrylate means “acrylate” and/or “methacrylate”.
  • the photosensitive resin composition of the present invention may include a copolymer, which may be a random copolymer.
  • the copolymer may include (A1) a structural unit derived from an ethylenically unsaturated carboxylic acid, an ethylenically unsaturated carboxylic anhydride, or a mixture thereof, and (A2) a structural unit derived from an ethylenically unsaturated compound containing an aromatic ring, and may selectively include (A3) a structural unit derived from an ethylenically unsaturated compound different from the structural units (A1) and (A2).
  • the copolymer may correspond to an alkali-soluble resin for achieving desired developability during the development step and may function as a basic support for forming a film after coating and a structure for final patterns and a binder.
  • the structural unit (A1) is derived from an ethylenically unsaturated carboxylic acid, an ethylenically unsaturated carboxylic anhydride, or a mixture thereof.
  • the ethylenically unsaturated carboxylic acid, the ethylenically unsaturated carboxylic anhydride, or the mixture thereof is a polymerizable unsaturated monomer having at least one carboxyl group in a molecule.
  • Examples thereof include an unsaturated monocarboxylic acid such as (meth)acrylic acid, crotonic acid, alpha-chloroacrylic acid, and cinnamic acid; an unsaturated dicarboxylic acid and an anhydride thereof such as maleic acid, maleic anhydride, fumaric acid, itaconic acid, itaconic anhydride, citraconic acid, citraconic anhydride, and mesaconic acid; an unsaturated polycarboxylic acid of trivalence or more and an anhydride thereof; and a mono[(meth)acryloyloxyalkyl] ester of a polycarboxylic acid of divalence or more such as mono[2-(meth)acryloyloxyethyl] succinate, and mono[2-(meth)acryloyloxyethyl] phthalate, but are not limited thereto. In terms of developability, (meth)acrylic acid is preferred among them.
  • the amount of the structural unit (A1) derived from an ethylenically unsaturated carboxylic acid, an ethylenically unsaturated carboxylic anhydride, or a mixture thereof may be 5 to 65 mole%, preferably 10 to 50 mole% based on the total number of moles of the structural units constituting the random copolymer to maintain good developability.
  • the structural unit (A2) is derived from an ethylenically unsaturated compound containing an aromatic ring
  • examples of the ethylenically unsaturated compound containing an aromatic ring may be at least one selected from the group consisting of phenyl (meth)acrylate, benzyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, phenoxy diethylene glycol (meth)acrylate, p -nonylphenoxy polyethylene glycol (meth)acrylate, p -nonylphenoxy polypropylene glycol (meth)acrylate, tribromophenyl (meth)acrylate; styrene; styrene containing an alkyl substituent such as methylstyrene, dimethylstyrene, trimethylstyrene, ethylstyrene, diethylstyrene, triethylstyrene, prop
  • the amount of the structural unit (A2) derived from an ethylenically unsaturated compound containing an aromatic ring may be 2 to 70 mole%, preferably 5 to 60 mole% in consideration of chemical resistance, based on the total number of moles of the structural units constituting the random copolymer.
  • the copolymer of the present invention may additionally include a structural unit (A3) derived from an ethylenically unsaturated compound different from the structural units (A1) and (A2).
  • the structural unit (A3) is derived from an ethylenically unsaturated compound different from the structural units (A1) and (A2), and the ethylenically unsaturated compound different from the structural units (A1) and (A2) may be at least one selected from the group consisting of an unsaturated carboxylic acid ester such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, isobutyl (meth)acrylate, t -butyl (meth)acrylate, cyclohexyl (meth)acrylate, ethylhexyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxy-3-chloropropyl (meth)acrylate, 4-hydroxybuty
  • the structural unit derived from the ethylenically unsaturated compound containing an epoxy group and/or the unsaturated imide may be used, and the structural unit derived from glycidyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate glycidyl ether and/or N -substituted maleimide may preferably be used in consideration of copolymerization property and the strength of an insulating film.
  • the amount of the structural unit (A3) derived from an ethylenically unsaturated compound different from the structural units (A1) and (A2) may be 10 to 80 mole%, preferably 20 to 75 mole%, based on the total number of moles of the structural units constituting the copolymer. Within this amount range, the stability of a composition may be maintained when constituting a binder and the retention rate may be improved further.
  • the copolymer (A) may include a (meth)acrylic acid/styrene copolymer, a (meth)acrylic acid/benzyl (meth)acrylate copolymer, a (meth)acrylic acid/styrene/methyl (meth)acrylate copolymer, a (meth)acrylic acid/styrene/methyl (meth)acrylate/glycidyl (meth)acrylate copolymer, a (meth)acrylic acid/styrene/methyl (meth)acrylate/glycidyl (meth)acrylate/ N -phenylmaleimide copolymer, a (meth)acrylic acid/styrene/methyl (meth)acrylate/glycidyl (meth)acrylate/ N -cyclohexyl maleimide copolymer, a (meth)acrylic acid/styrene/n-butyl (meth)acrylate/g
  • the copolymer may be prepared by charging a molecular weight regulator, a radical polymerization initiator, a solvent, and respective compounds that provide the structural units (A1), (A2), and (A3), introducing nitrogen, and subjecting the mixture to polymerization with slow agitation.
  • the copolymer may be prepared as a random copolymer.
  • the molecular weight regulator may be a mercaptan compound such as butyl mercaptan and octyl mercaptan, or an ⁇ -methylstyrene dimer, but is not limited thereto.
  • the radical polymerization initiator may be at least one selected from the group consisting of an azo compound such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), benzoyl peroxide, lauryl peroxide, t -butyl peroxypivalate and 1,1-bis( t -butylperoxy)cyclohexane, but is not limited thereto.
  • an azo compound such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile
  • benzoyl peroxide lauryl peroxide
  • t -butyl peroxypivalate 1,1-bis( t -butylperoxy)cyclohe
  • the solvent may be any conventional solvent commonly used in the manufacturing of a copolymer and may include, e.g. , methyl 3-methoxypropionate or propylene glycol monomethyl ether acetate (PGMEA).
  • PGMEA propylene glycol monomethyl ether acetate
  • the copolymer (A) may be used in an amount of 25 to 35 wt%, preferably 28 to 32 wt%, based on the total weight of the photosensitive resin composition excluding solvents. Within this range, the composition would produce a patterned film having a good profile after development with improved properties such as retention rate and chemical resistance.
  • the weight average molecular weight (Mw) of the copolymer thus prepared may be in the range of 10,000 to 20,000, and preferably 15,000 to 18,000, when determined by gel permeation chromatography (GPC, using tetrahydrofuran as an eluent) referenced to polystyrene. Within this range, the composition would have desirable improvements in planarity and a good pattern profile after development.
  • the photosensitive resin composition of the present invention may include a first photopolymerizable compound (B1) containing hexa- or less functional groups and a second photopolymerizable compound (B2) containing hepta- or more functional groups.
  • the photopolymerizable compound may be polymerized by the action of a photopolymerization initiator.
  • the first photopolymerizable compound (B1) containing hexa- or less functional groups may include a monofunctional or polyfunctional ester compound of acrylic acid or methacrylic acid having at least one ethylenically unsaturated double bond; however it may preferably be a polyfunctional compound having two or more functional groups in consideration of chemical resistance.
  • the first photopolymerizable compound may be selected from the group consisting of ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, glycerin tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, and dipentaerythritol hexaacrylate.
  • dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate may be selected from the group consisting of ethylene
  • the first photopolymerizable compound may be used alone or in combination of two or more thereof.
  • the amount of the first photopolymerizable compound may be 50 to 250 parts by weight, preferably 100 to 200 parts by weight, based on 100 parts by weight of the copolymer (on the basis of the solid content). Within this range, good sensitivity and planarity may be achieved. However, if the amount deviates from the range, particularly if the amount is less than 50 parts by weight, elasticity recovery rate may be deteriorated, and if the amount is greater than 250 parts by weight, resolution may be deteriorated.
  • the second photopolymerizable compound (B2) containing hepta- or more functional groups may be a polyfunctional ester compound of acrylic acid or methacrylic acid having at least one ethylenically unsaturated group, and the hepta- or more polyfunctional compound may be preferable in consideration of chemical resistance.
  • the second photopolymerizable compound may be at least one selected from the group consisting of tripentaerythritol hepta(meth)acrylate, tripentaerythritol octa(meth)acrylate, tetrapentaerythritol nona(meth)acrylate, tetrapentaerythritol deca(meth)acrylate, pentapentaerythritol undeca(meth)acrylate and pentapentaerythritol dodeca(meth)acrylate; and may preferably be tripentaerythritol hepta(meth)acrylate, or tripentaerythritol octa(meth)acrylate to improve resolution and strength.
  • the second photopolymerizable compound may be used alone or in combination of two or more thereof and may be used in an amount of 35 to 100 parts by weight, 50 to 100 parts by weight, and preferably 35 to 90 parts by weight, based on 100 parts by weight (on the basis of the solid content) of the copolymer.
  • an amount of 35 to 100 parts by weight, 50 to 100 parts by weight, and preferably 35 to 90 parts by weight based on 100 parts by weight (on the basis of the solid content) of the copolymer.
  • good sensitivity and planarity may be achieved.
  • the amount deviates from the range, particularly if the amount is less than 35 parts by weight, resolution may be deteriorated, and if the amount is greater than 100 parts by weight, elasticity recovery rate may be deteriorated.
  • the weight ratio of the copolymer (A) and the first and second photopolymerizable compounds (B1 and B2) included in the photosensitive resin composition of the present invention satisfies the following Equation 1, and preferably, the value of Equation 1 satisfies from 2.2 to 2.4.
  • the weight ratio of the first and second photopolymerizable compounds (B1 and B2) relative to the copolymer (A), may be from 2.1 to 2.5, and preferably from 2.2 to 2.4. Within the range, good elasticity recovery rate may be obtained. However, if the weight ratio deviates from the range, particularly if the weight ratio is less than 2.1, the ratio of the photopolymerizable compound (B) is small, and thus the number of crosslinking bond formed after exposure may decrease, thereby deteriorating elasticity recovery rate. If the weight ratio is greater than 2.5, a development process may be deteriorated due to defects such as white turbidity or stain for insufficiency of the copolymer (A), i.e. , an alkali-soluble resin.
  • the weight ratio of the first photopolymerizable compound (B1) containing hexa- or less functional groups and the second photopolymerizable compound (B2) containing hepta- or more functional groups satisfies the following Equation 2.
  • the weight ratio of the second photopolymerizable compound (B2) relative to the first photopolymerizable compound (B1) is from 0.2 to 0.5, and within this range, good elasticity recovery rate may be obtained. If the weight ratio deviates from this range, particularly if the weight ratio is less than 0.2, the photosensitivity of the composition may increase, and the resolution of a pattern may be deteriorated. If the weight ratio is greater than 0.5, the photosensitivity may be relatively deteriorated, and the crosslinking degree may vary, thereby deteriorating elasticity recovery rate.
  • the photosensitive resin composition according to the present invention includes a photopolymerization initiator.
  • the photopolymerization initiator may initiate polymerization of curable monomers upon exposure to light such as visible rays, ultraviolet rays, and deep-ultraviolet radiation.
  • the photopolymerization initiator may be a radical initiator, which is not specifically limited but may be at least one selected from the group consisting of an acetophenone compound, a benzophenone compound, a benzoin compound, a benzoyl compound, a xanthone compound, an oxime compound, a triazine compound, a halomethyloxadiazole compound, and a lophine dimer compound.
  • the oxime photopolymerization initiator, the triazine photopolymerization initiator, or a combination thereof may be used.
  • photopolymerization initiator may include, but are not limited to, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), benzoyl peroxide, lauryl peroxide, t -butyl peroxypivalate, 1,1-bis( t -butyl peroxy)cyclohexane, p -dimethylamino acetophenone, 2-benzyl-2-(dimethylamino)-1-[4-(4-morpholinyl)phenyl]-1-butanone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, benzyl dimethyl ketal, benzophenone, benzoin propyl ether, diethyl thioxanthone, 2,4-bis(trichloromethyl)-6- p -methoxyphenyl- s -triazine, 2-trichloro
  • the oxime photopolymerization initiator may be an oxime ester compound.
  • Preferred for high sensitivity are one or more oxime compounds disclosed in Korean Laid-open Patent Publization Nos. 2004-0007700, 2005-0084149, 2008-0083650, 2008-0080208, 2007-0044062, 2007-0091110, 2007-0044753, 2009-0009991, 2009-0093933, 2010-0097658, 2011-0059525, 2011-0091742, 2011-0026467, and 2011-0015683, and International Publization Nos. WO 2010/102502 and WO 2010/133077.
  • photopolymerization initiators include OXE-01 (BASF Co.), OXE-02 (BASF Co.), N-1919 (ADEKA Co.), NCI-930 (ADEKA Co.), NCI-831 (ADEKA Co.), and the like.
  • the photopolymerization initiator may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the copolymer (based on the solid content).
  • the oxime photopolymerization initiator may be included in an amount of 0.01 to 5 parts by weight, and preferably 0.1 to 1 part by weight based on 100 parts by weight of the copolymer (based on the solid content)
  • the triazine photopolymerization initiator may be included in an amount of 0.01 to 5 parts by weight, and preferably 0.1 to 3 parts by weight based on 100 parts by weight of the copolymer (based on the solid content).
  • highly sensitive patterns having good pattern developability and coatability may be obtained.
  • the photosensitive resin composition of the present invention may preferably be prepared as a liquid composition by mixing the above components with a solvent.
  • Any solvent known in the art, which is compatible but not reactive with the components in the photosensitive resin composition may be used.
  • the solvent may include an organic solvent and may particularly include alcohol, ether, glycol ether, ethylene glycol alkyl ether acetate, diethylene glycol, propylene glycol monoalkyl ether, propylene glycol alkyl ether acetate, propylene glycol alkyl ether propionate, aromatic hydrocarbon, ketone, ester, and a mixture thereof.
  • the solvent include methanol, ethanol, tetrahydrofuran, dioxane, methyl cellosolve acetate, ethyl cellosolve acetate, ethyl acetoacetate, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate,
  • Preferred among these exemplary solvents are ethylene glycol alkyl ether acetate, diethylene glycol, propylene glycol mono alkyl ether, propylene glycol alkyl ether acetate, and ketone.
  • the above solvents may be used alone or in combination of two or more thereof.
  • the photosensitive resin composition of the present invention may include the solvent, particularly the organic solvent in an amount of 5 to 50 wt%, preferably 10 to 30 wt%, and more preferably 15 to 25 wt% on the basis of the total amount of the composition on the basis of the solid content.
  • the solid content means the amount of the components in the resin composition of the present invention excluding solvents.
  • the photosensitive resin composition of the present invention includes an epoxy compound as an auxiliary curing agent to increase the internal density, the mechanical strength, and the adhesiveness to a substrate of a thin film formed through a thermal curing process.
  • the epoxy compound may be a homo oligomer or a hetero oligomer of an unsaturated monomer including at least one epoxy group.
  • Examples of the unsaturated monomer including at least one epoxy group may include glycidyl (meth)acrylate, 4-hydroxybutylacrylate glycidyl ether, 3,4-epoxybutyl (meth)acrylate, 4,5-epoxypentyl (meth)acrylate, 5,6-epoxyhexyl (meth)acrylate, 6,7-epoxyheptyl (meth)acrylate, 2,3-epoxycyclopentyl (meth)acrylate, 3,4-epoxycyclohexyl (meth)acrylate, ⁇ -ethyl glycidyl acrylate, ⁇ - n -propyl glycidyl acrylate, ⁇ - n -butyl glycidyl acrylate, N -(4-(2,3-epoxypropoxy)-3,5-dimethylbenzyl)acrylamide, N -(4-2,3-epoxypropoxy)
  • the epoxy compound may be derived from a monomer represented by the following Formula 1.
  • R 1 is hydrogen or C 1-4 alkyl; n is an integer of 2 to 4; and m is an integer of 0 to 2.
  • the epoxy compound (E) may further include a structural unit derived from a monomer other than the compound of Formula 1.
  • Representative examples of the structural unit derived from the monomer other than the compound of Formula 1 may include styrene; a styrene having an alkyl substituent such as methylstyrene, dimethylstyrene, trimethylstyrene, ethylstyrene, diethylstyrene, triethylstyrene, propylstyrene, butylstyrene, hexylstyrene, heptylstyrene, and octylstyrene; a styrene having a halogen such as fluorostyrene, chlorostyrene, bromostyrene, and iodostyrene; a styrene having an alkoxy substituent such as methoxystyrene, ethoxystyrene, and propoxystyrene; p -hydroxy- ⁇ -
  • the epoxy compound is a thermally crosslinked compound and has a lower molecular weight than the copolymer (A).
  • the weight average molecular weight of the epoxy compound is in a range of 100 to 30,000, preferably 5,000 to 10,000. Within the range, improved adhesiveness to a substrate may be achieved, and a thermally cured film may have good hardness due to the formation of crosslinking bonds and have optimal viscosity range, thereby achieving appropriate flowability, good surface planarity and uniform thin film thickness.
  • the epoxy compound may be included in an amount of 1 to 10 parts by weight, preferably 3 to 7 parts by weight based on 100 parts by weight of the copolymer (on the basis of the solid content).
  • amount range elasticity recovery rate and adhesiveness to a substrate may be improved. If the amount deviates from the range, particularly, if the amount is less than 1 part by weight, the elasticity recovery rate and the adhesiveness to a substrate may be deteriorated, and if the amount is greater than 10 parts by weight, developability may be deteriorated and stain and white turbidity may be generated during a development step.
  • the photosensitive resin composition of the present invention may further include a surfactant as occasion demands to enhance its coatability and to prevent the formation of defects.
  • the surfactants are not limited, but preferred are fluorine-based surfactants, silicon-based surfactants, non-ionic surfactants, and the like.
  • BYK 307 of BYK Co. may be used in consideration of dispersibility.
  • surfactants may include fluorine- and silicon-based surfactants such as BM-1000, and BM-1100 manufactured by BM CHEMIE Co., Ltd., Megapack F142 D, F172, F173, F183, F-470, F-471, F-475, F-482, and F-489 manufactured by Dai Nippon Ink Kagaku Kogyo Co., Florad FC-135, FC-170 C, FC-430, and FC-431 manufactured by Sumitomo 3M Co., Sufron S-112, S-113, S-131, S-141, S-145, S-382, SC-101, SC-102, SC-103, SC-104, SC-105, and SC-106 manufactured by Asahi Glass Co., Eftop EF301, EF303, and EF352 manufactured by Shinakida Kasei Co., SH-28 PA, SH-190, SH-193, SZ-6032, SF-8428, DC-57, and DC-190 manufactured by Toray Silicon Co.
  • the surfactant may be contained in an amount of 0.01 to 3 parts by weight, preferably 0.1 to 1 part by weight, based on 100 parts by weight of the copolymer (on the basis of the solid content). Within the amount range, the composition can be readily coated.
  • the photosensitive resin composition of the present invention may further include a silane coupling agent having a reactive substituent selected from the group consisting of carboxyl, (meth)acryloyl, isocyanate, amino, mercapto, vinyl, epoxy, and a combination thereof to improve adhesiveness to a substrate, if desired.
  • a silane coupling agent having a reactive substituent selected from the group consisting of carboxyl, (meth)acryloyl, isocyanate, amino, mercapto, vinyl, epoxy, and a combination thereof to improve adhesiveness to a substrate, if desired.
  • the kind of the silane coupling agent is not limited, but may preferably be selected from the group consisting of trimethoxysilyl benzoic acid, ⁇ -methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, ⁇ -isocyanatopropyltriethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropyltriethoxysilane, ⁇ -(3,4-epoxycyclohexyl)ethyltrimethoxysilane, N -phenyl-3-aminopropyltrimethoxysilane, 3-aminopropylethyldimethoxysilane, 3-aminopropylmethyldiacetoxysilane, 3-aminopropylethyldi-n-propyloxysilane, and a mixture thereof.
  • ⁇ -isocyanatopropyltriethoxysilane having an isocyanate group KBE-9007 manufactured by Shin-Etsu Co.
  • KBE-9007 manufactured by Shin-Etsu Co.
  • N -phenyl-3-aminopropyl trimethoxysilane Si-AceXS1075 manufactured by JNC Co.
  • the amount of the silane coupling agent may be 0.01 to 10 parts by weight based on 100 parts by weight of the copolymer (on the basis of the solid content).
  • the silane coupling agent having the isocyanate group may be used in an amount of 0.01 to 1 part by weight, preferably 0.1 to 0.5 parts by weight
  • the silane coupling agent having the amino group may be used in an amount of 0.01 to 5 parts by weight, preferably 0.1 to 1 part by weight.
  • the photosensitive resin composition may have improved adhesiveness.
  • the photosensitive resin composition of the present invention may further include other additives such as an antioxidant, and a stabilizer as long as the properties of the composition are not adversely affected.
  • a cured film particularly a spacer may be prepared.
  • the cured film may be prepared by a conventional method well known in the art.
  • the photosensitive resin composition may be coated on a silicon substrate by a spin coating method; subjected to pre-bake at a temperature of, e.g. , 60 to 130°C for 60 to 130 seconds to remove the solvents; exposed to light using a photomask having a desired pattern; and subjected to development using a developing agent, for example, a tetramethylammonium hydroxide (TMAH) solution, to form a pattern on the coated film.
  • TMAH tetramethylammonium hydroxide
  • the light exposure may be carried out at a wavelength ranging from 200 to 450 nm at the exposure intensity of 10 to 100 mJ/cm 2.
  • the coated film thus patterned may be subjected to post-bake at a temperature of 150 to 300°C for 10 minutes to 5 hours to manufacture a desired cured film.
  • the cured film prepared from the photosensitive resin composition of the present invention may have (1) a pattern critical dimension(CD, line width) ratio of top/bottom parts of 50 to 70%, and (2) elasticity recovery rate of 70% or more.
  • the top part of the pattern refers to a part corresponding to 90% of the thickness of a final pattern
  • the bottom part of the pattern refers to a part corresponding to 10% of the thickness of the final pattern.
  • Elasticity recovery rate may be measured by the method of Test Example 1 below.
  • the weight average molecular weight is determined by gel permeation chromatography (GPC) using a polystyrene standard.
  • Photosensitive resin compositions were prepared by performing the same procedure described in Example 1 with the exception that the amounts of the components used were changed as illustrated in the following Table 1.
  • Photosensitive resin compositions were prepared by performing the same procedure described in Example 1 with the exception that the amounts of the components used were changed to a range not satisfying the above Equations 1 to 3, as indicated in Table 1 below.
  • Oxime photopolymerization initiator (trade name: OXE-02 manufactured by BASF Co.)
  • T-EB Triazine photopolymerization initiator
  • Silane coupling agent having an isocyanate group (trade name: Sila-AceXS1075 manufactured by JNC Co.)
  • G2 Silane coupling agent having an amino group (trade name: KBE-9007 manufactured by Shin-Etsu Chemical Co.)
  • Each of the photosensitive resin compositions obtained in the examples and comparative examples was coated on a glass substrate using a spin coater and pre-baked at a temperature of 80°C for 150 seconds to form a coated film in a thickness of 3.7 ⁇ m.
  • a patterned mask wherein dot patterns having a size of 6 to 20 ⁇ m were disposed at intervals of 1 ⁇ m, was applied so that the distance from the substrate was 50 ⁇ m.
  • the film was exposed to light emitted from an aligner (model: MA6) at a wavelength ranging from 200 nm to 450 nm at the exposure intensity of 66 mJ/cm 2 based on a wavelength of 365 nm.
  • the film was developed by an aqueous solution of 0.04 wt% potassium hydroxide as a developing agent, at 23°C for 70 seconds. Subsequently, the film thus developed was post-baked in an oven at 230°C for 30 minutes to produce a cured film.
  • the bottom critical dimension(CD) of the dots formed on the substrate thus formed was 10 to 12 ⁇ m based on the mask's CD 10 ⁇ m.
  • a cured film having a total thickness of 3.0 ( ⁇ 0.1) ⁇ m after post-baking and a diameter of a spacer dot pattern of 10 to 12 ⁇ m was formed.
  • Compression displacement and elasticity recovery rate were measured using an elasticity measuring device (Fischerscope® HM2000LT manufactured by Fischer Technology Co.) according to the following measurement conditions.
  • a planar Vicker's penetrator having a size of 50 ⁇ m x 50 ⁇ m and a square pendulum shape was used as a penetrator compressing patterns. Measurement was conducted by a load-unload method.
  • a load of 1.96 mN was applied to a dot pattern using the elasticity measuring device, and this state was set as an initial condition (H0) for measuring physical properties, i.e. , the compression displacement and the elasticity recovery rate. Then, a load up to 40 mN was applied with a rate of 2.5 mN/sec for each of pattern specimens and the load was kept for 5 seconds, and a distance (H1) moved by the penetrator at this point was measured. The load was kept for 5 seconds, was removed again with a rate of 2.5 mN/sec in a thickness direction, and was kept for 5 seconds when a force applied to the dot pattern by the penetrator reached 1.96 mN. A distance (H2) moved by the penetrator at this point was measured, and elasticity recovery rate was computed by Equation 3. The results are indicated in Table 2 below and Fig. 1.
  • a pre-cured film having a thickness of 3.0 ( ⁇ 0.1) ⁇ m was formed according to the above-described preparation method of a cured film, and was exposed and developed with a photo mask having a pattern size of 8, 10, 12 and 14 ⁇ m under the same conditions for the development of the above cured film.
  • the bottom CD ( ⁇ m) of the pattern of the cured film thus formed was measured, the resolution was evaluated, and the results are shown in Table 2 below. The resolution was evaluated as ⁇ if CD of the pattern measured was 13 ⁇ m or less, and the resolution was evaluated as ⁇ if CD of the pattern measured was greater than 13 ⁇ m based on the mask's 10 ⁇ m.
  • a spacer having a thickness (T) of 3.0 ( ⁇ 0.1) ⁇ m and a diameter of a dot pattern (bottom) of 10 to 12 ⁇ m was formed from a photosensitive resin composition, and top CD (a part corresponding to 90% of the thickness of a final pattern) and bottom CD (a part corresponding 10% of the thickness of a final pattern) were measured using a height difference measuring device (SIS-2000 manufactured by SNU Precision).
  • the top/bottom CD ratio of a spacer pattern was determined using the following Equation 4, and the results are shown in Table 2 below. In the case where the CD ratio is 50 to 70%, the elasticity recovery rate of the spacer may be assessed as good.
  • Top/bottom pattern CD ratio (%) (Top CD/bottom CD) x 100
  • the cured films prepared from the compositions of Comparative Examples 1 to 3 had elasticity recovery rate of less than 70% (Comparative Examples 2 and 3), had dot CD size greater than 13 ⁇ m (Comparative Example 1), or had top/bottom pattern CD ratio of less than 50% (Comparative Example 3).
  • the cured film prepared from the composition of Comparative Example 4 was not successfully developed.
  • the cured film obtained from the composition of the present invention maintains high resolution and exhibits good elasticity recovery rate, and may be effectively used for the formation of a spacer of a liquid crystal display and an organic EL device.

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Abstract

L'invention concerne une composition de résine photosensible et un film durci préparé à partir de cette dernière. En comprenant un copolymère (A) et un composé photopolymérisable (B) dans des quantités spécifiques, une composition de résine photosensible peut former un film durci ayant une capacité de développement de motif avec une résolution élevée et un taux de récupération d'élasticité correct. La composition peut être utilisée efficacement pour la formation d'un film durci, en particulier un élément d'espacement d'un dispositif d'affichage tel qu'un dispositif d'affichage à cristaux liquides et un dispositif électroluminescent organique.
PCT/KR2016/010961 2015-11-25 2016-09-30 Composition de résine photosensible et film durci préparé à partir de cette dernière Ceased WO2017090879A1 (fr)

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US15/775,441 US10656520B2 (en) 2015-11-25 2016-09-30 Photosensitive resin composition and cured film prepared therefrom
JP2018521950A JP6843133B2 (ja) 2015-11-25 2016-09-30 感光性樹脂組成物及びそれから調製された硬化フィルム
CN201680065344.8A CN108351590B (zh) 2015-11-25 2016-09-30 感光性树脂组合物和由其制备的固化膜

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KR10-2015-0165692 2015-11-25
KR1020160125432A KR102630893B1 (ko) 2015-11-25 2016-09-29 감광성 수지 조성물 및 이로부터 제조된 경화막
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Cited By (1)

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US20200064734A1 (en) * 2018-08-23 2020-02-27 Hefei Xinsheng Optoelectronics Technology Co., Ltd. Photoresist composition, pixel definition structure and manufacturing method thereof, and display panel

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JP2002212235A (ja) * 2001-01-19 2002-07-31 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JP2003029402A (ja) * 2001-07-19 2003-01-29 Goo Chemical Co Ltd 紫外線硬化性樹脂組成物及びドライフィルム
US20100143673A1 (en) * 2007-04-04 2010-06-10 Kazuyuki Mitsukura Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method
KR20100109498A (ko) * 2009-03-31 2010-10-08 후지필름 가부시키가이샤 감광성 조성물, 감광성 수지 전사 필름, 수지 패턴, 수지 패턴의 제조 방법, 액정표시장치용 기판 및 액정표시장치
US20150205203A1 (en) * 2012-07-09 2015-07-23 Toray Industries, Inc. Photosensitive resin composition, conductive wire protection film, and touch panel member

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Publication number Priority date Publication date Assignee Title
JP2002212235A (ja) * 2001-01-19 2002-07-31 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JP2003029402A (ja) * 2001-07-19 2003-01-29 Goo Chemical Co Ltd 紫外線硬化性樹脂組成物及びドライフィルム
US20100143673A1 (en) * 2007-04-04 2010-06-10 Kazuyuki Mitsukura Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method
KR20100109498A (ko) * 2009-03-31 2010-10-08 후지필름 가부시키가이샤 감광성 조성물, 감광성 수지 전사 필름, 수지 패턴, 수지 패턴의 제조 방법, 액정표시장치용 기판 및 액정표시장치
US20150205203A1 (en) * 2012-07-09 2015-07-23 Toray Industries, Inc. Photosensitive resin composition, conductive wire protection film, and touch panel member

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200064734A1 (en) * 2018-08-23 2020-02-27 Hefei Xinsheng Optoelectronics Technology Co., Ltd. Photoresist composition, pixel definition structure and manufacturing method thereof, and display panel
US11579525B2 (en) * 2018-08-23 2023-02-14 Hefei Xinsheng Optoelectronics Technology Co., Ltd. Photoresist composition, pixel definition structure and manufacturing method thereof, and display panel

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